HLMP-Q102EF012中文资料

Agilent Subminiature High Performance TS AlGaAs Red LED Lamps Data SheetFeatures•Subminiature flat top package Ideal for backlighting and light piping applications•Subminiature dome package Diffused dome for wide viewing angleNon-diffused dome for high brightness•Wide range of drive currents500 µA to 50 mA •Ideal for space limited Applications •Axial leads•Available with lead configurations for surface mount and through hole PC board mountingDescriptionFlat Top PackageThe HLMP-Pxxx Series flat top lamps use an untinted, non-diffused, truncated lens toprovide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications.Dome PackagesThe HLMP-Qxxx Series dome lamps, for use as indicators, use a tinted, diffused lens to provide a wide viewing angle with high on-off contrast ratio. High brightness lamps use anuntinted, nondiffused lens to provide a high luminous inten-sity within a narrow radiation pattern.Lead ConfigurationsAll of these devices are made by encapsulating LED chips onaxial lead frames to form molded epoxy subminiature lamppackages. A variety of package configuration options isavailable. These include special surface mount lead configura-tions, gull wing, yoke lead, or Z-bend. Right angle lead bends at 2.54 mm (0.100 inch) and 5.08mm (0.200 inch) center spacing are available for through hole mounting. For more information refer to Standard SMT and Through Hole Lead BendOptions for Subminiature LED Lamps data sheet.TechnologyThese subminiature solid state lamps utilize a highly optimized LED material technology,transparent substrate aluminum gallium arsenide (TS AlGaAs).This LED technology has a very high luminous efficiency,capable of producing high light output over a wide range of drive currents (500 µA to 50mA). The color is deep red at a dominant wavelength of 644nm deep red. TS AlGaAs is a flip-chip LED technology, dieattached to the anode lead and wire bonded to the cathode lead.Available viewing angles are 75°, 35°, and 15°.HLMP-P106/P156HLMP-Q102/Q152HLMP-Q106/Q156Device Selection GuideViewing Angle Deep Red Typical Iv Typical IvPackage Description 2 q1/2R d = 644 nm I F = 500 µa I F = 20 mA Package Outline Domed, Diffused Tinted,35HLMP-Q102100BStandard CurrentDomed, Diffused Tinted,35HLMP-Q1522BLow CurrentDomed, Nondiffused15HLMP-Q106400BUntinted, Standard CurrentDomed, Nondiffused15HLMP-Q1567BUntinted, Low CurrentFlat Top, Nondiffused,75HLMP-P106130AUntinted, Standard CurrentFlat Top, Nondiffused75HLMP-P1562AUntinted, Low CurrentOrdering InformationHLMX-XXXX-X X X X XPackagingOptionColor BinSelectionMax. Iv BinMin. Iv Bin4 x 4 Prod.PartNumberFigure 1. Proper right angle mounting to a PC board to prevent protruding anode tab from shorting to cathode c onnection.Package Dimensions A) Flat Top LampsB) Diffused and Nondiffused Dome LampsNO. CATHODE DOWN.YES. ANODE DOWN.* REFER TO FIGURE 1 FOR DESIGN CONERNS.2.082.34(0.082)(0.092)2.082.34(0.082)(0.092)0.53 (0.021)2.211.96(0.087)(0.077)NOTES:1. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES).2. PROTRUDING SUPPORT TAB IS CONNECTED TO ANODE LEAD.3. LEAD POLARITY FOR THESE TS AlGaAs SUBMINIATURE LAMPS IS OPPOSITE TO THE LEAD POLARITY OF SUBMINIATURE LAMPS USING OTHER LED TECHNOLOGIES.Absolute Maximum Ratings at T A = 25°CParameters TitleDC Forward Current[1]50 mAPeak Forward Current[2]300 mAAverage Forward Current[2,3]30 mATransient Forward Current (10 µs Pulse)[4]500 mAPower Dissipation100 mWReverse Voltage 5 VJunction Temperature110°COperating Temperature-55°C to +100°CStorage Temperature-55°C to +100°CLead Soldering Temperature260°C for 5 seconds[1.6 mm (0.063 in.) from body]Reflow Soldering Temperature260°C for 20 secondsNotes:1. Derate linearly as shown in Figure 6.2. Refer to Figure 7 to establish pulsed operating conditions.3. Maximum IAVG at f = 1 kHz, DF = 10%.4. The transient peak current is the maximum non-recurring peak current the device can withstandwithout damaging the LED die and wire bonds. It is not recommended that the device beoperated at peak currents above the Absolute Maximum Peak Forward Current.Optical Characteristics at T A = 25°CLuminous Intensity Total Flux Peak Color, Dominant Viewing Angle LuminousI V (mcd)f V (mlm)Wavelength Wavelength2q1/2Efficacy Part Number@ 20 mA[1]@ 20 mA[2]l peak (nm)l d[3] (nm)Degrees[4]h v[5] HLMP-Min.Typ.Typ.Typ.Typ.Typ.(lm/w) Q106-R00xx1004002806546441585Q102-N00xx25100-6546443585P106-Q00xx631302806546447585Optical Characteristics at T A = 25°CLuminous Intensity Total Flux Peak Color, Dominant Viewing Angle Luminous Part Number I V (mcd)f V (mlm)Wavelength Wavelength2f1/2Efficacy (Low Current)@ 0.5 mA[1]@ 0.5 mA[2]l peak (nm)l d[3] (nm)Degrees[4]h v[5] HLMP-Min.Typ.Typ.Typ.Typ.Typ.(lm/w) Q156-H00xx 2.5710.56546441585Q152-G00xx 1.62-6546443585P156-EG0xx0.63210.56546447585 Notes:1. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not bealigned with this axis.2. f v is the total luminous flux output as measured with an integrating sphere.3. The dominant wavelength, l d, is derived from the CIE Chromaticity Diagram and represents the color of the device.4. q1/2 is the off-axis angle where the liminous intensity is 1/2 the peak intensity.5. Radiant intensity, I v, in watts/steradian, may be calculated from the equation I v = I v/h v, where I v is the luminous intensity in candelas and h v is theluminous efficacy in lumens/watt.Electrical Characteristics at T A = 25°CCapacitanceSpeed of Response Forward Voltage Reverse Breakdown C (pF)t s (ns)Part V F (Volts)V R (Volts)V F = 0,Thermal Time Constant Number @ I F = 20 mA @ I R = 100 µA f = 1 MHz Resistance e -t/t s HL MP-Typ. M ax.Min. Typ.Typ.R q J-PIN (°C/W)Typ.Q106 1.9 2.45202017045Q102 1.9 2.45202017045P1061.92.45202017045Electrical Characteristics at T A = 25°C Part CapacitanceSpeed of Response Number Forward Voltage Reverse Breakdown C (pF)t s (ns)(Low V F (Volts)V R (Volts)V F = 0,Thermal Time Constant Current)@ I F = 0.5 mA @ I R = 100 µA f = 1 MHz Resistance e -t/t s HL M P-Typ. M ax.M in. Typ.Typ.R q J-PIN (°C/W)Typ.Q156 1.6 1.95202017045Q152 1.6 1.95202017045P1561.61.95202017045Figure 5. Relative efficiency vs. peak forward current.Figure 7. Maximum average current vs. peak forward current.Figure 6. Maximum forward DC current vs.ambient temperature. Derating based on T J MAX = 110°C.ηV – R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D A T 20 m A )53000.0I PEAK – PEAK FORWARD CURRENT – mA 102050100212000.10.20.30.40.50.60.70.80.91.01.11.2Figure2. Relative intensity vs. wavelength.Figure 4. Relative luminous intensity vs. DC forward current.Figure 3. Forward current vs. forward voltage.R E L A T I V E I N T E N S I T Y 600100010-3WAVELENGTH – nm70050010-210-11.0R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )20.50.01I F – DC FORWARD CURRENT – mA51020502.42.01.00.20.10.0510.5I F – F O R W A R D C U R R E N T – m A1.03.5300201V F – FORWARD VOLTAGE – V1.52.02.53.02001005010520.5I A V G = A V E R A G E F O R W A R D C U R R E N T – m AI PEAK – PEAK FORWARD CURRENT – mAI F – F O R W A R D C U R R E N T – m AT A – AMBIENT TEMPERATURE – °CN O R M A L I Z E D I N T E N S I T Y1.00ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2100°90°0.10.30.480°70°60°50°40°20°10°0°30°10°20°30°40°50°60°70°80°90°100°0.9Figure 8. HLMP-Q106/-Q156.N O R M A L I Z E D I N T E N S I T Y1.00ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2100°90°0.10.30.480°70°60°50°40°20°10°0°30°10°20°30°40°50°60°70°80°90°100°0.9Figure 9. HLMP-Q102/-Q152N O R M A L I Z E D I N T E N S I T Y1.00ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2100°90°0.10.30.480°70°60°50°40°20°10°0°30°10°20°30°40°50°60°70°80°90°100°0.9Figure 10. HLMP-P106/-P156.Intensity Bin LimitsBin Min.Max.E0.63 1.25F 1.00 2.00G 1.60 3.20H 2.50 5.00J 4.008.00K 6.3012.50L10.0020.00M16.0032.00N25.0050.00P40.0080.00Q63.00125.00R100.00200.00S160.00320.00T250.00500.00U400.00800.00V630.001250.00W1000.002000.00X1600.003200.00Y2500.005000.00Color Bin LimitsPackage Bin Min.Max.Red0Full DistributionMechanical Option00Straight Leads, Bulk Packaging, Quantity of 500 Parts11Gull Wing Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel 12Gull Wing Lead, Bulk Packaging, Quantity of 500 Parts14Gull Wing Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel 21Yoke Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel22Yoke Leads, Bulk Packaging, Quantity of 500 Parts24Yoke Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel31Z-Bend Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel32Z-Bend Leads, Bulk Packaging, Quantity of 500 Parts34Z-Bend Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel Note:All Categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information./semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2005 Agilent Technologies, Inc. Obsoletes 5930-2437EJanuary 18, 20055989-1711EN。