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肿瘤的形态学

肿瘤的形态学

肿瘤的形态学M99890/1 骨髓增生异常综合征NOS (D46.9)M99840/1 顽固性贫血伴有转化中的胚细胞过多(D46.3) M99830/1 顽固性贫血伴有胚细胞过多(D46.2)M99820/1 顽固性贫血伴有铁粒幼细胞(D46.1)M99810/1 顽固性贫血不伴有铁粒幼细胞(D46.0)M99800/1 顽固性贫血NOS (D46.4)M99700/1 淋巴组织增生病NOS (D47.9)M99620/1 特发性血小板增多症(D47.3)M99610/1 骨髓硬化伴有骨髓化生(D47.1)M99600/1 慢性骨髓增生病(D47.1)M99500/1 真性红细胞增多症(D45)M99410/3 白血病性网状内皮细胞增殖(C91.4)M99400/3 多毛细胞性白血病(C91.4)M99320/3 急性骨髓纤维化(C94.5)M99310/3 急性全骨髓增殖症(C94.4)M99300/3 髓样肉瘤(C92.3)M99100/3 急性原巨核细胞白血病(C94.2)(FAB:M7)M99000/3 肥大细胞白血病(C94.3)M98940/3 非白血性单核细胞白血病(C93.7)M98930/3 慢性单核细胞白血病(C93.1)M98920/3 亚急性单核细胞白血病(C93.3)M98910/3 急性单核细胞白血病(C93.0)(FAB:M5)M98900/3 单核细胞性白血病NOS (C93.9)M98800/3 嗜酸细胞白血病(C92.-)M98700/3 嗜碱细胞白血病(C92.-)M98680/3 慢性粒-单核细胞白血病(C92.7)M98670/3 急性粒-单核细胞白血病(C92.5)(FAB:M4)M98660/3 急性早幼粒细胞白血病(C92.4)(FAB:M3)M98640/3 非白血性髓样(粒细胞性)白血病(C92.7)M98630/3 慢性髓样(粒细胞性)白血病(C92.1) M98620/3 亚急性髓样(粒细胞性)白血病(C92.2)M98610/3急性髓样(粒细胞性)白血病(C92.0)(FAB:M1未分化型,M2部分分化型)M98600/3 髓样(粒细胞性)白血病NOS (C92.9)M98500/3 淋巴肉瘤细胞白血病(C94.7)M98420/3 慢性红细胞增多症(C94.1)M98410/3 急性红细胞增多症(C94.0)M98400/3 红白血病(C94.0)(按法、美、英分类FAB:M6)M98300/3 浆细胞白血病(C90.1)M98270/3 成人T-细胞白血病/淋巴瘤(C91.5)M98260/3 伯基特细胞白血病(C91.7)M98250/3 幼淋巴细胞白血病(C91.3)M98240/3 非白血性淋巴样白血病(C91.7)M98230/3 慢性淋巴细胞白血病(C91.1)M98220/3 亚急性淋巴样白血病(C91.2)M98210/3 急性淋巴细胞白血病NOS (C91.0)M98200/3 淋巴样白血病NOS (C91.9)M98040/3 非白血性白血病NOS (C95.7)M98030/3 慢性白血病NOS (C95.1)M98020/3 亚急性白血病NOS (C95.2)M98010/3 急性白血病NOS (C95.0)M98010/3 未分化细胞白血病(C95.0)M98000/3 白血病NOS (C95.9)M97680/1 T-γ淋巴组织增生性疾病(D47.7)M97670/1 血管成免疫细胞性淋巴腺病(D47.7)M97660/1 血管中心性免疫增生性损害(D47.7)M97650/1 单克隆丙球蛋白病(D47.2)M97640/3 免疫增生性小肠病(C88.3)M97630/3 γ重链病(C88.2)M97620/3 α重链病(C88.1)M97610/3 沃尔丹斯特伦巨球蛋白血症(C88.0)M97600/3 免疫增生性疾病NOS (C88.9)M97410/3 恶性肥大细胞增多症(C96.2)M97400/3 肥大细胞肉瘤(C96.2)M97400/1 肥大细胞瘤NOS (D47.0)M97320/3 多发性骨髓瘤(C90.0)M97310/3 浆细胞瘤NOS (C90.2)M97310/3 髓外(孤立性)浆细胞瘤(C90.2)M97230/3 真性组织细胞淋巴瘤(C96.3)M97220/3 非脂肪性网状细胞增多(C96.0)M97220/3 急性婴儿网状内皮细胞增多症(C96.0) M97220/3 急性婴儿网状内皮细胞增殖(C96.0)M97220/3 莱特尔-西维氏病[累-塞氏病(网状细胞增多症)] (C96.0)M97200/3 恶性组织细胞增多病(C96.1)M97200/3 髓性组织细胞性网状细胞增多(C96.3) M97140/3 大细胞(Ki-1+)淋巴瘤(C85.7)M97130/3 血管中心性T-细胞淋巴瘤(C85.7) M97120/3 血管内皮瘤病(C85.7)M97110/3 单核细胞样B-细胞淋巴瘤(C85.7) M97090/3 皮肤淋巴瘤(C84.5)M97070/3 多型性中等细胞和大细胞外周T-细胞淋巴瘤(C84.4)M97060/3 多型性小细胞外周T-细胞淋巴瘤(C84.4)M97050/3 AILD[血管成免疫细胞性淋巴腺病伴血蛋白异常]外周T-细胞淋巴瘤(C84.4)M97040/3 淋巴上皮样淋巴瘤(C84.3)M97030/3 T-区淋巴瘤(C84.2)M97020/3 外周T-细胞淋巴瘤NOS (C84.4)M97010/3 塞扎瑞氏病(塞乍里病)(C84.1)M97000/3 蕈样肉芽肿(C84.0)M97000/3 蕈样真菌病(C84.0)M96980/3 大细胞滤泡性恶性淋巴瘤(C82.2)M96970/3 中心母细胞性滤泡性恶性淋巴瘤(C82.7) M96960/3 淋巴细胞性低分化的结节性恶性淋巴瘤(C82.7)M96950/3 小核裂细胞滤泡性恶性淋巴瘤(C82.0)M96940/3 淋巴细胞性中分化的结节性恶性淋巴瘤(C82.7)M96930/3 淋巴细胞性高分化的结节性恶性淋巴瘤(C82.7)M96920/3 中心母细胞-中心细胞性滤泡性恶性淋巴瘤(C82.7) M96910/3 小核裂和大细胞混合性滤泡性恶性淋巴瘤(C82.1)M96900/3 滤泡性恶性淋巴瘤NOS (C82.9)M96870/3 伯基特淋巴瘤NOS (C83.7)M96860/3 小细胞无核裂弥漫性恶性淋巴瘤(C83.0,C83.6)M96850/3 原淋巴细胞性恶性淋巴瘤(C83.5)M96840/3 免疫母细胞性恶性淋巴瘤NOS (C83.4)M96830/3 中心母细胞性弥漫性恶性淋巴瘤(C83.8)M96820/3 大细胞无核裂弥漫性恶性淋巴瘤(C83.3)M96810/3 大细胞核裂弥漫性恶性淋巴瘤(C83.3)M96800/3 大细胞弥漫性恶性淋巴瘤NOS (C83.3)M96770/3 恶性淋巴瘤性息肉病(C83.8)M96760/3 中心母细胞-中心细胞性弥漫性恶性淋巴瘤(C83.8)M96750/3 小细胞和大细胞混合性弥漫性恶性淋巴瘤(C83.2)M96740/3 中心细胞性恶性淋巴瘤(C83.8)M96730/3 淋巴细胞性中分化的弥漫性恶性淋巴瘤(C83.8)M96720/3 小核裂细胞性弥漫性恶性淋巴瘤(C83.1)M96710/3 淋巴浆细胞性恶性淋巴瘤(C83.8)M96700/3 小淋巴细胞性恶性淋巴瘤NOS (C83.0)M96670/3 结节硬化型淋巴细胞减少性霍奇[何杰]金氏病(C81.1) M96660/3 结节硬化型混合细胞性霍奇[何杰]金氏病(C81.1)M96650/3 结节硬化型淋巴细胞为主的霍奇[何杰]金氏病(C81.1) M96640/3 结节硬化型富细胞相霍奇[何杰]金氏病(C81.1)M96630/3 结节硬化型霍奇[何杰]金氏病NOS (C81.1)M96620/3 霍奇[何杰]金氏肉瘤(C81.7)M96610/3 霍奇[何杰]金氏肉芽肿(C81.7)M96600/3 霍奇[何杰]金氏副肉芽肿NOS (C81.7)M96590/3 淋巴细胞为主型结节性霍奇[何杰]金氏病M96580/3 淋巴细胞为主型弥漫性霍奇[何杰]金氏病(C81.0)M96570/3 淋巴细胞为主型霍奇[何杰]金氏病NOS (C81.0)M96550/3 淋巴细胞减少型网织性霍奇[何杰]金氏病(C81.3)M96540/3 淋巴细胞减少型弥漫纤维化霍奇[何杰]金氏病(C81.3) M96530/3 淋巴细胞减少型霍奇[何杰]金氏病NOS (C81.3)M96520/3 混合细胞型霍奇[何杰]金氏病NOS (C81.2)M96500/3 霍奇[何杰]金氏病NOS (C81.9)M95950/3 弥漫性恶性淋巴瘤NOS (C83.9)M95940/3 小神经胶质细胞瘤(C85.7)M95930/3 网状细胞肉瘤NOS (C83.3,C83.9)M95920/3 淋巴肉瘤NOS (C85.0)M95910/3 非霍奇[何杰]金氏型恶性淋巴瘤(C85.9)M95900/3 恶性淋巴瘤NOS (C84.5,C85.9)M95810/3 软组织腺泡状肉瘤M95800/3 恶性颗粒细胞瘤M95800/0 颗粒细胞瘤NOSM95700/0 神经瘤NOSM95620/0 神经鞘粘液瘤M95610/3 恶性特里同瘤M95600/3 恶性神经鞘瘤M95600/1 神经鞘膜瘤病NOSM95600/0 神经鞘瘤NOSM95500/0 丛状神经纤维瘤M95410/0 黑变病的神经纤维瘤M95400/3 神经纤维肉瘤M95400/1 多发性神经纤维瘤M95400/0 神经纤维瘤NOSM95390/3 脑(脊)膜肉瘤病(C70.-)M95380/1 乳头状脑(脊)膜瘤(D42.-)M95370/0 移行细胞性脑(脊)膜瘤) (D32.-)M95360/0 血管外(周)皮细胞性脑(脊)膜瘤(D32.-)M95350/0 成血管(母)细胞性脑(脊)膜瘤(D32.-) M95340/0 血管瘤性脑(脊)膜瘤(D32.-)M95330/0 沙粒体性脑(脊)膜瘤(D32.-)M95320/0 纤维性脑(脊)膜瘤(D32.-)M95310/0 脑膜瘤样脑(脊)膜瘤(D32.-)M95300/3 恶性脑(脊)膜瘤(C70.-)M95300/1 脑(脊)膜瘤病NOS (D42.-)M95300/0 脑(脊)膜瘤NOS (D32.-)M95230/3 感觉神经上皮瘤(C30.0)M95220/3 成感觉神经细胞瘤(C30.0)M95210/3 感觉神经细胞瘤(C30.0)M95200/3 嗅神经源性瘤M95120/3 未分化的成视网膜(母)细胞瘤(C69.2)M95110/3 已分化的成视网膜(母)细胞瘤(C69.2)M95100/3 成视网膜(母)细胞瘤NOS (C69.2)M95070/0 帕西尼氏瘤[环层小体病]M95060/0 神经细胞瘤M95050/1 神经节神经胶质瘤M95040/3 海绵状成神经(母)细胞瘤M95030/3 神经上皮瘤NOSM95020/3 畸胎样髓上皮瘤M95010/3 髓上皮瘤NOSM95000/6 转移性神经母细胞瘤M95000/3 成神经(母)细胞瘤NOSM94910/0 神经节瘤病M94900/3 神经节成神经(母)细胞瘤M94900/0 神经节瘤M94810/3 畸形细胞性肉瘤(C71.-)M94800/3 小脑肉瘤NOS (C71.6)M94730/3 原始性神经外胚瘤(C71.-)M94720/3 成髓样肌(母)细胞瘤(C71.6)M94710/3 促结缔组织增生性成神经管细胞瘤(C71.6) M94700/3 成神经管细胞瘤NOS (C71.6)M94600/3 成少突神经胶质细胞瘤(C71.-)M94510/3 间变型少突神经胶质(母)细胞瘤(C71.-) M94500/3 少突神经胶质细胞瘤NOS (C71.-)M94430/3 原始极性成胶质(母)细胞瘤(C71.-)M94420/3 神经胶质(母)细胞肉瘤(C71.-)M94410/3 巨细胞成(神经)胶质(母)细胞瘤(C71.-) M94400/3 成(神经)胶质(母)细胞瘤NOS (C71.-) M94300/3 成星形(母)细胞瘤(C71.-)M94240/3 多形性黄色星形细胞瘤(C71.-)M94230/3 极性成胶质细胞瘤(C71.-)M94220/3 成胶质细胞瘤NOS (C71.-)M94210/3 毛细胞性星形细胞瘤(C71.-)M94200/3 纤维性星形细胞瘤(C71.-)M94110/3 大圆细胞性星形细胞瘤(C71.-)M94100/3 原浆性星形细胞瘤(C71.-)M94010/3 间变的星形细胞瘤(C71.-)M94000/3 星形细胞瘤NOS (C71.-)M93940/1 粘液乳头状室管膜瘤(D43.-)M93930/1 乳头状室管膜瘤(D43.-)M93920/3 成室管膜细胞瘤(C71.-)M93920/3 间变的室管膜瘤(C71.-)M93910/3 室管膜瘤NOS (C71.-)M93900/3 恶性脉络丛乳头状瘤(C71.5)M93900/0 脉络丛乳头状瘤NOS (D33.0)M93840/1 室管膜下巨细胞星形细胞瘤(D43.-)M93830/1 室管膜下神经胶质细胞瘤(D43.-)M93820/3 混合性神经胶质细胞瘤(C71.-)M93810/3 大脑神经胶质细胞瘤病(C71.-)M93800/3 恶性神经胶质细胞瘤(C71.-)M93700/3 脊索瘤M93640/3 周围性神经外胚瘤M93630/0 黑变病神经外胚瘤M93620/3 成松果体(母)细胞瘤(C75.3)M93610/1 松果体细胞瘤(D44.5)M93600/1 松果体瘤(D44.5)M93500/1 颅咽管瘤(D44.3,D44.4)M93400/0 钙化上皮性牙源性瘤(D16.4,D16.5)M93300/3 成釉(母)细胞纤维肉瘤(C41.0,C41.1)M93300/0 成釉细胞纤维瘤(D16.4,D16.5)M93220/0 周围牙(齿)源性纤维瘤(D16.4,D16.5)M93210/0 中心牙(齿)源性纤维瘤(D16.4,D16.5)M93200/0 牙(齿)源性粘液瘤(D16.4,D16.5)M93120/0 鳞状牙(齿)源性瘤(D16.4,D16.5)M93110/0 牙(齿)成釉细胞瘤(D16.4,D16.5)M93100/3 恶性成釉细胞瘤(C41.0,C41.1)M93100/0 成釉细胞瘤NOS (D16.4,D16.5)M93020/0 牙源性形骸细胞瘤(D16.4,D16.5)M93010/0 钙化性牙(齿)源性囊肿(D16.4,D16.5)M93000/0 腺瘤样牙(齿)源性瘤(D16.4,D16.5)M92900/3 成釉(母)细胞牙(齿)肉瘤(C41.0,C41.1)M92900/0 成釉(母)细胞纤维牙(齿)瘤M92820/0 复合性牙(齿)瘤(D16.4,D16.5)M92810/0 混合性牙(齿)瘤(D16.4,D16.5)M92800/0 牙瘤NOS (D16.4,D16.5)M92750/0 巨形牙(齿)骨骨质瘤(D16.4,D16.5)M92740/0 牙(齿)骨质化性纤维瘤(D16.4,D16.5)M92730/0 良性成牙(齿)骨质(母)细胞瘤(D16.4,D16.5) M92720/0 牙(齿)骨质瘤NOS (D16.4,D16.5)M92710/0 牙本质瘤(D16.4,D16.5)M92700/3 恶性牙(齿)源性瘤(C41.0,C41.1)M92700/1 牙(齿)源性瘤NOS (D48.0)M92700/0 良性牙(齿)源性瘤(D16.4,D16.5)M92620/0 骨化性纤维瘤(D16.-)M92610/3 长骨成釉质瘤(C40.-)M92600/3 尤因肉瘤或尤因瘤(C40.-,C41.-)M92510/3 软组织恶性巨细胞瘤M92510/1 软组织巨细胞瘤NOSM92500/3 恶性骨巨细胞瘤(C40.-,C41.-)M92500/1 骨巨细胞瘤NOS (D48.0)M92410/0 软骨粘液样纤维瘤(D16.-)M92400/3 间质软骨肉瘤M92310/3 粘液样软骨肉瘤M92300/3 恶性成软骨(母)细胞瘤(C40.-,C41.-)M92300/0 成软骨(母)细胞瘤NOS (D16.-)M92210/3 近皮质软骨肉瘤(C40.-,C41.-)M92210/0 近皮质软骨瘤(D16.-)M92200/3 软骨肉瘤NOS (C40.-,C41.-)M92200/3 软骨粘液肉瘤M92200/1 软骨瘤病NOSM92200/0 软骨瘤NOS (D16.-)M92100/1 骨软骨瘤病NOS (D48.0)M92100/0 骨软骨瘤(D16.-)M92000/1 侵袭性成骨细胞瘤(D48.0)M92000/0 成骨(母)细胞瘤(D16.-)M91910/0 骨样骨瘤(D16.-)M91900/3 近皮质骨肉瘤(C40.-,C41.-)M91850/3 小细胞骨肉瘤(C40.-,C41.-)M91840/3 骨佩吉特氏病内的骨肉瘤(C40.-,C41.-) M91830/3 毛细血管扩张性骨肉瘤(C40.-,C41.-) M91820/3 成纤维(母)细胞性骨肉瘤(C40.-,C41.-) M91810/3 成软骨(母)细胞性骨肉瘤(C40.-,C41.-) M91800/3 成骨细胞肉瘤(C40.-,C41.-)M91800/3 骨肉瘤NOS (C40.-,C41.-)M91800/3 骨软骨肉瘤(C40.-,C41.-)M91800/3 骨软骨粘液肉瘤(C40.-,C41.-)M91800/3 骨源性肉瘤(C40.-,C41.-) M91800/0 骨瘤NOS (D16.-)M91750/0 血管淋巴管瘤(D18.1)M91740/1 淋巴管肌瘤病M91740/0 淋巴管肌瘤(D18.1)M91730/0 囊性淋巴管瘤(D18.1)M91720/0 海绵状淋巴管瘤(D18.1)M91710/0 毛细淋巴管瘤(D18.1)M91700/3 淋巴管肉瘤M91700/0 淋巴管瘤NOS (D18.1)M91610/1 成血管(母)细胞瘤[血管网状细胞瘤] M91600/0 血管纤维瘤NOSM91500/3 恶性血管外皮细胞瘤M91500/3 血管外皮肉瘤M91500/1 血管外皮细胞瘤NOSM91500/0 良性血管外皮细胞瘤M91420/0 疣性角化性血管瘤(D18.0)M91410/0 血管角质瘤M91400/3 卡波西氏肉瘤(C46.-)M91340/1 血管内支气管肺泡瘤(D38.1)M91330/3 恶性上皮样血管内皮瘤M91330/1 上皮样血管内皮瘤NOSM91320/0 肌内血管瘤(D18.0)M91310/0 从状血管瘤(D18.0)M91310/0 毛细血管血管瘤(D18.0)M91300/3 恶性血管内皮细胞瘤M91300/1 血管内皮细胞瘤NOSM91300/0 良性血管内皮瘤M91260/0 组织细胞样血管瘤(D18.0)M91250/0 上皮样血管瘤(D18.0)M91240/3 枯否氏细胞肉瘤(C22.3)M91230/0 葡萄状(蔓状)血管瘤(D18.0)M91220/0 静脉性血管瘤(D18.0)M91210/0 海绵状血管瘤(D18.0)M91200/3 血管肉瘤M91200/0 血管瘤NOS (D18.0)M91100/3 恶性中肾瘤M91100/1 中肾性肿瘤M91100/0 良性中肾瘤M91040/1 胎盘部位滋养层的肿瘤(D39.2) M91030/0 部分性葡萄胎(O01.1)M91020/3 滋养层的恶性畸胎瘤M91010/3 绒毛膜癌伴有畸胎瘤M91010/3 绒毛膜癌伴有其他生殖细胞成份M91000/6 转移性绒毛膜上皮癌M91000/3 绒毛膜上皮癌(滋养细胞癌) NOS M91000/1 恶性葡萄胎(D39.2)M91000/1 侵袭性葡萄胎(D39.2)M91000/0 葡萄胎NOS (O01.9)M90910/1 甲状腺肿性类癌(D39.1)M90900/3 恶性卵巢甲状腺肿(C56)M90900/0 卵巢甲状腺肿NOS (D27)M90850/3 混合性生殖细胞瘤M90840/3 畸胎瘤伴有恶性变M90840/3 皮样囊肿伴有恶性变(C56)M90840/0 皮样囊肿NOSM90830/3 中分化的恶性畸胎瘤M90820/3 未分化的恶性畸胎瘤M90810/3 畸胎癌M90800/3 恶性畸胎瘤NOSM90800/1 畸胎瘤NOSM90800/0 良性畸胎瘤M90730/1 性腺胚(母)细胞瘤M90720/3 多胚瘤M90710/3 内胚窦瘤M90700/3 胚胎性癌NOSM90640/3 生殖细胞瘤M90630/3 精母细胞性精原细胞瘤(C62.-)M90620/3 间变的精原细胞瘤(C62.-)M90610/3 精原细胞瘤NOS (C62.-)M90600/3 无性细胞瘤M90550/1 囊性间皮瘤M90540/0 腺瘤样瘤NOS (D19.-)M90530/3 双相分化型恶性间皮瘤(C45.-)M90530/0 双相分化型良性间皮瘤(D19.-)M90520/3 恶性上皮样间皮瘤(C45.-)M90520/0 良性上皮样间皮瘤(D19)M90510/3 恶性纤维间皮瘤(C45.-)M90510/0 良性纤维间皮瘤(D19.-)M90500/3 恶性间皮细胞瘤(C45.-)M90500/0 良性间皮细胞瘤(D19.-)M90440/3 明细胞肉瘤(除外肾的明细胞肉瘤M8964/3) M90430/3 双相分化型滑膜肉瘤M90420/3 上皮样细胞型滑膜肉瘤M90410/3 梭形细胞型滑膜肉瘤M90400/3 滑膜肉瘤NOSM90400/0 良性滑膜瘤M90300/0 幼年性纤维腺瘤(D24)M90200/3 恶性叶状瘤(C50.-)M90200/3 恶性叶状囊肉瘤(C50.-)M90200/1 叶状瘤NOS (D48.6)M90200/0 良性叶状瘤(D24)M90160/0 巨大纤维腺瘤(D24)M90150/0 粘液性腺纤维瘤(D27)M90140/0 浆液性腺纤维瘤(D27)M90130/0 腺纤维瘤(D27)M90120/0 小管周围的纤维腺瘤(D24)M90110/0 小管内的纤维腺瘤(D24)M90100/0 纤维腺瘤NOS (D24)M90000/3 恶性布伦纳瘤(C56)M90000/1 交界恶性布伦纳瘤(D39.1)M90000/1 增生性布伦纳瘤M90000/0 布伦纳瘤NOS (D27)M89910/3 胚胎性肉瘤M89900/3 恶性间叶瘤M89900/1 间叶瘤NOSM89900/0 良性间叶瘤M89820/0 肌上皮瘤M89810/3 胚胎性癌肉瘤M89800/3 癌肉瘤NOSM89720/3 肺胚细胞瘤(C34.-)M89710/3 胰胚细胞瘤(C25.-)M89700/3 肝胚(母)细胞瘤(C22.0)M89640/3 肾的明细胞肉瘤(C64)M89630/3 杆状肉瘤M89600/3 肾胚(母)细胞瘤NOS (C64)M89600/1 中胚层性肾瘤M89510/3 中胚层混合瘤M89500/3 苗勒氏混合瘤(C54.-)M89410/3 多形性腺瘤内的癌(C07,C08.-) M89400/3 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乳头状囊性瘤(D37.7)M84510/3 交界恶性乳头状囊腺瘤(C56)M84500/3 乳头状囊腺癌NOS (C56)M84500/0 乳头状囊腺瘤NOS (D27)M84420/3 交界恶性浆液性囊腺瘤(C56)M84410/3 浆液性囊腺癌NOS (C56)M84410/0 浆液性囊腺瘤NOS (D27)M84400/3 囊腺癌NOSM84400/0 囊腺瘤NOSM84300/3 粘液表皮样癌M84300/1 粘液表皮样瘤M84200/3 耵聍腺癌(C44.2)M84200/0 耵聍腺瘤(D23.2)M84100/3 皮脂腺癌(C44.-)M84100/0 皮脂腺腺瘤(D23.-)M84080/0 外分泌性乳头状腺瘤(D23.-)M84070/0 汗管瘤NOS (D23.-)M84060/0 乳头状汗管腺瘤(D23.-)M84050/0 乳头状汗腺腺瘤(D23.-)M84040/0 汗腺囊瘤(D23.-)M84030/0 外分泌性汗腺腺瘤(D23.-)M84020/0 外分泌性肢端汗腺瘤(小汗腺瘤) (D23.-) M84010/3 顶泌性腺癌M84010/0 顶泌性腺瘤M84000/3 汗腺腺癌(C44.-)M84000/1 汗腺瘤NOS (D48.5)M84000/0 汗腺腺瘤(D23.-)M83900/3 皮肤附属器癌(C44.-)M83900/0 皮肤附属器腺瘤(D23.-)M83810/3 恶性子宫内膜样腺纤维瘤(C56)M83810/1 交界恶性子宫内膜样腺纤维瘤(D39.1) M83810/0 子宫内膜样腺纤维瘤NOS (D27)M83800/3 子宫内膜样腺癌(C56)M83800/1 交界恶性子宫内膜样腺瘤(D39.1)M83800/0 子宫内膜样腺瘤NOS (D27)M83750/0 混合细胞肾上腺皮质腺瘤(D35.0)M83740/0 小球细胞肾上腺皮质腺瘤(D35.0)M83730/0 明细胞肾上腺皮脂腺瘤(D35.0)M83720/0 富色素变异肾上腺皮质腺瘤(D35.0) M83710/0 致密细胞肾上腺皮质腺瘤(D35.0)M83700/3 肾上腺皮质细胞癌(C74.0)M83700/0 肾上腺皮质腺瘤NOS (D35.0)M83610/1 球旁细胞瘤(D41.0)M83600/1 多发性内分泌性腺瘤M83500/3 无包膜硬化性癌(非包围性) (C73)M83400/3 滤泡性变异乳头状癌M83340/0 胶样腺瘤M83340/0 巨滤泡性腺瘤(D34)M83330/0 微滤泡性腺瘤(D34)M83320/3 小梁型滤泡性腺癌(C73)M83310/3 高分化型滤泡性腺癌(C73)M83300/3 滤泡性腺癌NOS (C73)M83300/0 滤泡性腺瘤(D34)M83240/0 脂肪腺瘤M83230/3 混合细胞腺癌M83230/0 混合细胞腺瘤M83220/3 水样(透)明细胞腺癌(C75.0)M83220/0 水样(透)明细胞腺瘤(D35.1)M83210/0 主细胞腺瘤(D35.1)M83200/3 颗粒细胞癌M83150/3 富糖原癌M83140/3 富脂质癌M83130/0 明细胞腺纤维瘤M83120/3 肾细胞癌(C64)M83110/1 肾上腺样瘤M83100/3 明细胞腺癌NOSM83100/3 中肾样型透明细胞癌M83100/0 明细胞腺瘤M83000/3 嗜碱细胞癌(C75.1)M83000/3 嗜碱性癌M83000/0 嗜碱细胞腺瘤(D35.2)M82900/3 嗜酸性腺癌M82900/3 许特尔细胞癌,腺癌(C73)M82900/0 嗜酸性腺瘤M82900/0 许特尔细胞瘤,腺瘤(D34)M82810/3 混合性嗜酸细胞-嗜碱细胞癌(C75.1) M82810/0 混合性嗜酸细胞-嗜碱细胞腺瘤(D35.2) M82800/3 嗜酸细胞癌(C75.1)M82800/0 嗜酸细胞腺瘤(D35.2)M82710/0 催乳素瘤(D35.2)M82700/3 嫌色细胞癌(C75.1)M82700/0 嫌色细胞腺瘤[尼尔逊] (D35.2)M82630/3 管状绒毛状腺瘤内的腺瘤M82630/2 管状绒毛状腺瘤内的原位腺癌M82630/0 管状绒毛腺瘤NOSM82620/3 绒毛状腺癌M82610/3 绒毛状腺瘤内的腺癌M82610/2 绒毛状腺瘤内的原位腺癌M82610/1 绒毛状腺瘤NOSM82600/6 转移性乳头状腺癌M82600/3 乳头状腺癌NOSM82600/0 乳头状腺瘤NOSM82510/3 肺泡腺癌(C34.-)M82510/0 肺泡腺瘤(D14.3)M82500/3 肺泡细胞癌(C34.-)M82500/3 细支气管-肺泡腺癌(C34.-)M82500/1 肺腺瘤病(D38.1)M82480/1 APUD瘤M82470/3 梅克尔细胞癌(C44.-)M82460/3 神经内分泌癌M82450/3 腺类癌瘤M82440/3 复合性类癌M82430/3 杯形细胞类癌(C18.1)M82410/3 恶性嗜银性类癌瘤M82410/1 嗜银性类癌瘤NOSM82400/3 恶性类癌瘤(除外阑尾的M8240/1) NOSM82400/1 阑尾的类癌瘤NOS (D37.3)M82310/3 单纯癌M82300/3 实体癌NOSM82210/3 多发性腺瘤样息肉内的腺癌M82210/0 多发性腺瘤样息肉M82200/3 结肠腺瘤样息肉病内的腺癌(C18.-)M82200/0 家族性息肉病[家族性腺瘤病或遗传性息肉病] (D12.6) M82200/0 结肠腺瘤样息肉病(D12.-)M82200/0 腺瘤病M82110/3 管状腺癌M82110/0 管状腺瘤NOSM82100/3 腺瘤样息肉内的腺癌M82100/2 腺瘤样息肉内的原位腺癌M82100/0 腺瘤样息肉NOSM82020/0 微小囊性腺瘤(D13.7)M82010/3 筛状癌M82000/3 恶性圆柱瘤M82000/3 腺样囊性癌M82000/0 外分泌性皮肤圆柱瘤(D23.-)M81910/0 胚胎性腺瘤M81900/3 小梁性腺癌M81900/0 小梁性腺瘤M81800/3 联合性肝细胞癌和胆管癌(C22.0)M81800/0 肝细胞胆管瘤M81710/3 纤维板状肝细胞癌(C22.0)M81700/3 肝细胞癌(C22.0)M81700/0 肝细胞腺瘤(D13.4)M81700/0 良性肝细胞瘤(D13.4)M81620/3 克拉特斯金瘤(C22.1)M81610/3 胆管囊腺癌M81610/0 胆管囊腺瘤M81600/3 胆管癌(C22.1)M81600/0 胆管腺瘤(D13.4,D13.5)M81550/3 胰腺瘤M81540/3 混合性胰岛细胞和外分泌腺癌(C25.-) M81530/3 恶性胃泌素瘤M81530/1 胃泌素瘤NOSM81520/3 恶性高血糖素瘤(C25.4)M81520/0 高血糖素瘤NOS (D13.7)M81510/3 恶性胰岛素瘤(C25.4)M81510/0 胰岛素瘤NOS (D13.7)M81500/3 胰岛细胞癌(C25.4)M81500/3 胰岛细胞腺癌(C25.4)M81500/0 胰岛细胞腺瘤(D13.7) M81470/3 基底细胞腺癌(C07.-,C08.-)M81470/0 基底细胞腺瘤(D11.-)M81460/0 单形性腺瘤M81450/3 弥漫型癌(C16.-)M81440/3 肠型腺癌(C16.-)M81430/3 表浅扩散性腺癌M81420/3 皮革状胃(硬变性胃炎) (C16.-)M81410/3 硬腺癌M81400/6 转移性腺癌NOSM81400/3 腺癌NOSM81400/2 原位腺癌NOSM81400/1 支气管腺瘤NOS (D38.1)M81400/0 腺瘤NOSM81300/3 乳头状移行细胞癌M81240/3 泄殖腔(孔)源性癌(C21.2)M81230/3 基底细胞样癌(C21.1)M81220/3 梭形细胞移行细胞癌M81210/3 施奈德氏癌M81210/1 内翻性移行细胞乳头状瘤M81210/0 施奈德乳头状瘤M81200/3 移行细胞癌NOSM81200/2 移行细胞原位癌M81200/1 膀胱上皮乳头状瘤(软性乳头状瘤) M81200/1 膀胱息肉(D41.4)M81200/0 移行细胞乳头状瘤NOSM81100/3 毛基质癌(C44.-)M81100/0 钙化[马勒布]上皮瘤M81100/0 毛发基质瘤NOS (D23.-)M81100/0 毛基(母)质瘤M81020/0 毛发神经膜瘤(D23.-)M81010/0 毛发毛囊瘤(D23.-)M81000/0 毛发上皮瘤(D23.-)M80960/0 雅达逊表皮内上皮瘤(D23.-)M80950/3 异型癌(C44.-)M80940/3 混合型基底鳞状细胞癌M80940/3 基底鳞状细胞癌(C44.-)M80930/3 纤维上皮性基底细胞癌(C44.-)M80920/3 硬斑性基底细胞癌(C44.-)M80910/3 多中心基底细胞癌(C44.-)M80900/3 基底细胞癌NOS (C44.-)M80900/3 色素性基底细胞癌M80900/1 基底细胞瘤(D48.5)M80820/3 淋巴上皮癌M80820/3 施明克氏癌(鼻咽癌)M80810/2 鲍恩病(癌前皮炎、搏温氏病) (D04.9)M80810/2 表皮内鳞状细胞原位癌M80800/2 凯拉氏增殖性红斑(龟头原位癌) (D07.4)M80770/2 宫颈、外阴和阴道的上皮内肿瘤(重度发育不良Ⅲ级) M80760/3 显微镜下侵袭性鳞状细胞癌(C53.-)M80760/2 鳞状细胞原位癌伴有可疑间质侵袭(D06.-)M80750/3 假腺性鳞状细胞癌M80750/3 腺样鳞状细胞癌M80740/3 梭形细胞鳞状细胞癌M80730/3 非角化的小细胞鳞状细胞癌M80720/3 非角化的大细胞鳞状细胞癌M80710/3 角化的鳞状细胞癌M80700/6 转移性鳞状细胞癌M80700/3 表皮样癌M80700/3 棘细胞癌M80700/3 鳞状细胞癌M80700/2 鳞状细胞原位癌M80600/0 乳头状瘤病NOSM80530/0 内翻性乳头状瘤M80520/3 表皮样乳头状癌M80520/3 乳头状鳞状细胞癌M80520/0 鳞状细胞乳头状瘤M80510/3 疣状癌NOSM80510/0 疣状乳头状瘤M80500/6 转移性乳头状癌M80500/3 乳头状癌NOSM80500/2 乳头状原位癌M80500/0 乳头状瘤(除外膀胱乳头状瘤M8120/1) NOS M80450/3 大细胞癌-小细胞(C34.-)M80440/3 中间细胞型小细胞癌(C34.-)M80430/3 梭形细胞型小细胞癌(C34.-)M80420/3 燕麦细胞癌(C34.-)M80410/3 小细胞癌NOSM80400/1 微小瘤M80340/3 多角细胞癌M80330/3 假肉瘤性癌M80320/3 棱形细胞癌M80310/3 巨细胞癌M80300/3 巨细胞和梭形细胞癌M80220/3 多形性癌M80210/3 间变的癌(间变型癌) NOSM80200/3 未分化型癌NOSM80120/3 大细胞癌NOSM80110/3 恶性上皮瘤M80110/0 良性上皮瘤M80100/6 癌病(C80)M80100/6 转移性癌NOSM80100/3 癌NOSM80100/3 恶性上皮细胞瘤M80100/3 球形细胞癌M80100/2 原位癌NOSM80100/0 良性上皮肿瘤M80040/3 恶性梭形细胞型肿瘤M80030/3 恶性巨细胞型肿瘤(D48.0) M80020/3 恶性小细胞型肿瘤M80010/3 恶性瘤细胞M80010/1 良性或恶性未肯定瘤细胞M80010/0 良性瘤细胞M80000/6 转移性肿瘤M80000/3 恶性肿瘤M80000/3 溃疡癌变M80000/3 息肉恶性变M80000/1 多房囊肿(D39.1)M80000/1 良性或恶性未肯定肿瘤M80000/0 良性肿瘤。

芯海科技 ARM M M0-based MCU 输出手册说明书

芯海科技 ARM M M0-based MCU 输出手册说明书

输出手册版本历史版本号说明日期1.0 初版2019-6-171.1 1. LRC频率:min(30->27),max(50->62)2. ADC特性更新: fADC-40℃≤ Trange ≤ 85℃,fADC≤14MHz,支持电压范围2.65≤ VDDA ≤5.5V;-40℃≤ Trange ≤ 105℃,fADC≤14MHz,支持电压范围2.7≤ VDDA ≤5.5V;-40℃≤ Trange ≤ 105℃,fADC≤12MHz,支持电压范围2.4≤ VDDA ≤5.5V;进入校准模式,fADC≤12MHz。

进入正常转换模式,fADC≤14MHz。

支持:-40℃≤ Trange ≤ 105℃和电压范围2.4≤ VDDA ≤5.5V;3. ADC特性更新:VDDA=2.4V时,Offset和ERR Gain更新2020-6-31.2 1.增加G6U6版本相关信息2020-6-191.3 1.更新温度传感器线性度参数,区分不同温度范围2020-8-262/56文件编号:CS-QR-YF-054A02目录输出手册版本历史 (2)目录 (3)1介绍 (5)2功能 (6)3器件一览 (8)4引脚描述 (10)4.1LQFP48 (10)4.2LQFP32 (10)4.3QFN28L (11)4.4TSSOP20 (11)4.5引脚描述 (12)5I/O 复用 (15)5.1PA口复用功能 (15)5.2PB口复用功能 (16)6存储器 (17)7功能描述 (21)7.1ARM®C ORTEX®-M0内核 (21)7.2存储器 (21)7.3时钟 (21)7.4工作环境 (23)7.4.1工作电压 (23)7.5启动模式 (23)7.6电源管理 (23)7.6.1低功耗模式 (23)7.6.2RTC和备用寄存器的电源电压VBAT (23)7.6.3上电复位/掉电复位(POR/PDR) (23)7.6.4低电压复位模块(LVD) (24)7.7通用输入输出端口(I/O) (24)7.8模数转换器(ADC) (24)7.8.1温度传感器(TS) (24)7.8.2内部参考电压 (24)7.8.3VBAT监测 (25)7.9定时器 (25)7.9.1高级定时器 (TIM1) (25)7.9.2通用定时器 (TIM3, 14, 15,16, 17) (25)7.9.3基本定时器(TIM6) (26)7.9.4独立看门狗定时器(FWDT) (26)7.9.5窗看门狗定时器(WWDT) (26)7.9.6滴答定时器(SysTick) (26)7.10直接内存存取(DMA) (26)3/56文件编号:CS-QR-YF-054A027.11中断和事件 (26)7.12实时时钟(RTC)和备用寄存器 (26)7.13串行外设总线(SPI)/集成电路内置音频总线(I2S) (27)7.14通用同步异步收发器(USART) (27)7.15内置集成电路接口(I2C) (29)7.16循环冗余校验 (29)7.17串行调试端口(SWD-DP) (29)8电气特性 (30)8.1说明 (30)8.2绝对最大额定值 (31)8.3工作条件 (31)8.4I/O端口特性 (32)8.5低功耗模式唤醒时间 (33)8.6RC振荡特性 (33)8.7晶振特性 (34)8.8外部时钟特性 (36)8.9PLL特性 (36)8.10功耗 (37)8.11内部参考电压特性 (38)8.12ADC特性 (38)8.13温度传感器特性 (39)8.14VBAT监测器特性 (39)8.15F LASH 特性 (39)8.16定时器特性 (40)8.17SPI/I2S特性 (40)8.18I2C特性 (44)8.19ESD特性 (44)9封装信息 (46)9.1LQFP48 (46)9.2LQFP32 (48)9.3QFN28L (49)9.4TSSOP20 (51)10订货信息 (52)11勘误表 (53)12缩略语 (54)13销售和服务 (56)4/56文件编号:CS-QR-YF-054A021介绍CS32F030系列微控制器采用高性能的32位ARM® Cortex®-M0 内核,嵌入高达64Kbytes flash和8Kbytes SRAM,最高工作频率48MHz。

IBM v5000存储调试手册

IBM v5000存储调试手册

2.1.3
主菜单界面 ............................................................................................................11
2.1.4
功能菜单详细选项 .................................................................................................11
2.2.4
创建卷 .................................................................................................................. 21

创建主机 .............................................................................................................. 23
2 磁阵始化操作 ..................................................................................................................... 1 2.1 基本设置 ................................................................................................................... 1
2.2.6
将卷映射到主机 ................................................................................................... 26

高通MSM8909核心板XY8901_硬件设计手册_V1.1

高通MSM8909核心板XY8901_硬件设计手册_V1.1
3.4.1. 电源接口 ............................................................... 26 3.4.2. 减少电压跌落 ........................................................... 26 3.4.3. 供电参考电路 ........................................................... 27 3.5. 开关机 ...................................................................... 28 3.5.1. 模块开机 ............................................................... 28 3.5.2. 模块关机 ............................................................... 30 3.6. VRTC 接口 .....................................................................30 3.7. 电源输出......................................................................31 3.8. 充电和电池管理................................................................32 3.9. USB 接口 .....................................................................33 3.10. UART 接口 ....................................................................35 3.11. USIM 卡接口 ................................................................ 36 3.12. SDIO 接口.....................................................................38 3.13. GPIO 接口.....................................................................40 3.14. I2C 接口 ................................................................... 42 3.15. ADC 接口 ................................................................... 42 3.16. 马达驱动接口 ................................................................43 3.17. LCM 接口 ....................................................................43 3.18. 触摸屏接口...................................................................46 3.19. 摄像头接口...................................................................46 3.19.1.后摄像头 ................................................................47 3.19.2.前摄像头 .............................................................. 48 3.19.3.设计注意事项 ...........................................................49 3.20. Sensor 设计.................................................................. 51 3.21. 音频接口.....................................................................51 3.21.1.麦克风接口参考.......................................................... 52

OV5 Homogenizer R20900010 指导手册说明书

OV5 Homogenizer R20900010 指导手册说明书

Instruction ManualManuale di istruzioniManu el d’instructionsManual de instruccionesBedienungsanleitung指导手册OV5 HomogenizerR20900010General Information / Informazioni Generali / Informations Générales / Información General / Allgemeine Hinweise / 一般信息Before using the unit, please read the following instruction manual carefully.Prima dell’utilizzo dello strumento si raccomanda di leggere attentamente il seguente manuale operativo.Avant d’utiliser l’instrument, il est recommandé de lire atte ntivement le présent manuel d’instructions.Antes de utilizar el instrumento, le recomendamos que lea con atención el siguiente manual de funcionamiento.Bitte lesen Sie vor Inbetriebnahme des Geräts diese Bedienungsanleitung sorgfältig durch在使用本装置之前,请仔细阅读以下使用说明书。

Do not dispose of this equipment as urban waste, in accordance with EEC directive 2002/96/CE.Non smaltire l’apparecchiatura come rifiuto urbano, secondo quanto previsto dalla Direttiva 2002/96/CE.N e pas recycler l’appareil comme déchet solide urbain, conformément à la Directive 2002/96/CE.No tirar el aparato en los desechos urbanos, como exige la Directiva 2002/96/CE.Dieses Gerät unterliegt der Richtlinie 2002/96/EG und darf nicht mit dem normalen Hausmüll entsorgt werden.根据EEC指令2002/96/CE,请不要将本设备作为城市垃圾处理。

BS操作说明书

BS操作说明书

Network Digital Signage SystemNAS950用户手册 2010-10 声明 版权所有,禁止非法复制 版本更新列表 日期版本号描述更新内容编写人2010/10 1.0 第一次发行目录目录 (3)1.序言 (5)2.系统安装 (6)2.1系统要求 (6)2.2安装 (6)2.3运行 (6)2.4注册 (7)3. 终端管理 (8)3.1终端设置 (8)3.1.1.终端设置 (8)3.1.2.完成 (9)3.2终端管理 (9)3.2.1.终端操作 (9)3.2.2.终端分组 (12)3.3终端监控 (13)3.3.1终端监控操作 (13)3.3.2错误信息 (14)3.3.3播放信息 (14)3.3.4终端设置信息 (14)4.媒体 (15)4.1媒体 (15)4.1.1视频 (15)4.1.2图片 (18)4.1.3消息 (18)4.1.4上滚字幕 (20)4.1.5实时消息 (20)4.1.6背景 (21)4.1.7Flash (21)4.2审核 (22)5. 编排 (23)5.1.模版 (23)5.1.1.添加背景 (24)5.1.2.添加视频 (24)5.1.3.添加图片 (25)5.1.4.添加消息 (26)5.2.节目单 (26)5.2.1.添加节目 (27)5.2.2.竖屏效果 (30)5.3.播放计划 (32)6. 发布 (35)6.1标准发布 (35)6.1.1发布到终端 (35)6.1.2发布到分组 (36)6.2快速发布 (36)6.3紧急发布 (37)6.4传输进度 (38)7.统计 (40)7.1发布历史 (40)8. 用户 (41)8.1修改密码 (41)8.2分组授权 (43)9. 系统 (44)9.1企业管理 (44)10. 附录 (46)10.1终端设置说明 (46)10.1.1基本设置 (46)10.1.2网络设置 (47)10.1.3视频输出设置 (48)10.2控制指令 (49)10.3媒体文件参数设置说明 (54)10.4时区表 (57)1.序言 本系统是一款网络多媒体信息发布系统,它可以使用户通过网络,远程控制多媒体播放终端的媒体播放,系统框图如图1-1。

爱国者平板电脑使用说明书

爱国者平板电脑使用说明书

4
外围设备导致爱国者标准部件损坏或产生故障的 � 非正常原因(包括不良的电源环境、异物进入设备、运输、移动、磕碰等)造成的设 备不能正常工作或部件损坏及故障 � 不可抗力:所有地震、火灾等自然灾害或意外事故(被盗、丢失等)等不可抗力因素引 起的设备不能正常工作或部件损坏及故障 � 因使用自编或第三方软件导致产品不能正常工作 � 计算机病毒感染导致产品不能正常工作 � 下述违章操作造成的产品故障: ---带电插拔主机电源或其它附属设备 ---自行拆卸、修理、安装 ---自行性能升级 ---使用指定之外的零件、附属品、消耗品
阳光服务
郑重承诺: 爱国者电子科技有限公司 爱国者电子科技有限公司郑重承诺: � 本产品的三包服务承诺期限自购买之日起生效,日期以正式购机发票日期为准,您接 受服务的凭证为正式购机发票和信息填写完整并经爱国者电子科技或经销商盖章的有 效三包凭证。 � 产品的三包服务期限:“爱国者”平板电脑产品实行十五天保换,一年保修。服务期 限如有变更恕不另行通知,以所购买产品自带的三包凭证和说明书内容为准。 � 所购产品在三包服务期限内正常使用和维护情况下,由于本机元器件所引发之故障, 经爱国者电子科技技术人员检测确定后,可以享受免费服务。 � 七日内免费退货:自产品三包服务承诺生效之日起七日内(含),如果产品出现故障, 您可以选择维修,更换或退货。 “爱国者阳光服务承诺 ”的情况: 不能享受 不能享受“ 爱国者阳光服务承诺” 由下列原因导致的产品故障,爱国者恕不提供本承诺中的阳光服务: � 非爱国者产品及部件 � 超过保修期的 � 使用了未经爱国者认可(以随机附赠的《用户使用手册》装箱单为准)的扩展部件或准。 Nhomakorabea2
环保说明
根据电子产品污染防治管理办法及相关标准( SJ/T11363-2006SJ/T11363-2006)进行表述

EP01专业版

EP01专业版

HOLTEK:HT24C01; HT24LC01; HT24C02; HT24LC02; HT24C04; HT24LC04; HT24C08; HT24LC08; HT24C16; HT24LC16; HT24C32; HT24LC32; HT24C64; HT24LC64; HT24C128; HT24LC128;
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支持芯片列表
*************************滚动码芯片***************************
MICROCHIP:HCS101; HCS200; HCS201; HCS300; HCS301;
ST:ST24C01; ST24C02; ST24C04; ST24C08; ST24C16; ST24C32; ST24C64;
XICOR:ST24C01; ST24C02; ST24C04; ST24C08; ST24C16;
*************************25 EEPROM***************************
MICROCHIP:24AA00; 24LC00; 24FC00; 24AA01; 24LC01; 24FC01; 24AA02; 24LC02; 24FC02; 24AA04; 24LC04; 24FC04; 24AA08; 24LC08; 24FC08; 24AA16; 24LC16; 24FC16; 24AA32;
版版权权所所有有 © 2010-2012 © 2010-2012 保保留留全全部部权权利利..
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1/37October 2004M95040M95020, M950104Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROMWith High Speed ClockFEATURES SUMMARY■Compatible with SPI Bus Serial Interface (Positive Clock SPI Modes)■Single Supply Voltage:– 4.5 to 5.5V for M950x0– 2.5 to 5.5V for M950x0-W – 1.8 to 5.5V for M950x0-R ■High Speed–10MHz Clock Rate, 5ms Write Time ■Status Register■BYTE and PAGE WRITE (up to 16 Bytes)■Self-Timed Programming Cycle■Adjustable Size Read-Only EEPROM Area ■Enhanced ESD Protection■More than 1 Million Erase/Write Cycles ■More than 40-Year Data RetentionTable 1. Product ListReferencePart NumberM95040M95040M95040-W M95040-R M95020M95020M95020-W M95020-R M95010M95010M95010-W M95010-RM95040, M95020, M95010TABLE OF CONTENTSFEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1Table 1.Product List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Figure 1.Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1SUMMARY DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5Figure 2.Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Figure 3.DIP, SO and TSSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Table 2.Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5SIGNAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Serial Data Output (Q). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Serial Data Input (D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Serial Clock (C). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Chip Select (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Hold (HOLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Write Protect (W). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6CONNECTING TO THE SPI BUS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7Figure 4.Bus Master and Memory Devices on the SPI Bus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 SPI Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Figure 5.SPI Modes Supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8OPERATING FEATURES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9Power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Power-down. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Active Power and Standby Power Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Hold Condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Figure 6.Hold Condition Activation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 WIP bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 BP1, BP0 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Table 3.Status Register Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Data Protection and Protocol Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Table 4.Write-Protected Block Size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10MEMORY ORGANIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Figure 7.Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12Table 5.Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Write Enable (WREN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Figure 8.Write Enable (WREN) Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .132/37M95040, M95020, M95010Write Disable (WRDI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Figure 9.Write Disable (WRDI) Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Read Status Register (RDSR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 WIP bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 BP1, BP0 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Figure 10.Read Status Register (RDSR) Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Write Status Register (WRSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Figure 11.Write Status Register (WRSR) Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Read from Memory Array (READ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Table 6.Address Range Bits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Figure 12.Read from Memory Array (READ) Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Write to Memory Array (WRITE). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Figure 13.Byte Write (WRITE) Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Figure 14.Page Write (WRITE) Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18POWER-UP AND DELIVERY STATE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19Power-up State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Initial Delivery State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Table 7.Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21Table 8.Operating Conditions (M950x0). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Table 9.Operating Conditions (M950x0-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Table 10.Operating Conditions (M950x0-R). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Table 11.AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Figure 15.AC Measurement I/O Waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Table 12.Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Table 13.DC Characteristics (M950x0, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Table 14.DC Characteristics (M950x0, Device Grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 Table 15.DC Characteristics (M950x0-W, Device Grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 Table 16.DC Characteristics (M950x0-W, Device Grade 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Table 17.DC Characteristics (M950x0-R). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Table 18.AC Characteristics (M950x0, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 Table 19.AC Characteristics (M950x0, Device Grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 Table 20.AC Characteristics (M950x0-W, Device Grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 Table 21.AC Characteristics (M950x0-W, Device Grade 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 Table 22.AC Characteristics (M950x0-R). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 Figure 16.Serial Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Figure 17.Hold Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Figure 18.Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Figure 19.PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline . . . . . . . . . . . . . . . . .323/37M95040, M95020, M950104/37Table 23.PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data. . . . . . . . . .32 Figure 20.SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline . . . .33 Table 24.SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data 33Figure 21.TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline . . . . . . . . . . . . . . . . . . .34 Table 25.TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data. . . . . . . . . . . .34PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35Table 26.Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Table 27.How to Identify Present and Previous Products by the Process Identification Letter . . .35REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Table 28.Document Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36M95040, M95020, M95010 SUMMARY DESCRIPTIONThe M95040 is a 4 Kbit (512 x 8) electrically eras-able programmable memory (EEPROM), access-ed by a high speed SPI-compatible bus. The other members of the family (M95020 and M95010) are identical, though proportionally smaller (2 and 1 Kbit, respectively).Each device is accessed by a simple serial inter-face that is SPI-compatible. The bus signals are C, D and Q, as shown in Table 2. and Figure 2..en Low. Communications with the device can be interrupted using Hold (HOLD). WRITE instruc-tions are disabled by Write Protect (W).sions, and how to identify pin-1.Table 2. Signal NamesC SerialClockD Serial Data InputQ Serial Data OutputS Chip SelectW WriteProtectHOLD HoldV CC Supply VoltageV SS Ground5/37M95040, M95020, M950106/37SIGNAL DESCRIPTIONDuring all operations, V CC must be held stable and within the specified valid range: V CC (min) to V CC (max).All of the input and output signals can be held High or Low (according to voltages of V IH , V OH , V IL or V OL , as specified in Table 13. to Table 17.). These signals are described next.Serial Data Output (Q).This output signal is used to transfer data serially out of the device.Data is shifted out on the falling edge of Serial Clock (C).Serial Data Input (D).This input signal is used to transfer data serially into the device. It receives in-structions, addresses, and the data to be written.Values are latched on the rising edge of Serial Clock (C).Serial Clock (C).This input signal provides the timing of the serial interface. Instructions, address-es, or data present at Serial Data Input (D) are latched on the rising edge of Serial Clock (C). Data on Serial Data Output (Q) changes after the falling edge of Serial Clock (C).When this input signal is High,the device is deselected and Serial Data Output (Q) is at high impedance. Unless an internal Write cycle is in progress, the device will be in the Stand-by Power mode. Driving Chip Select (S) Low se-lects the device, placing it in the Active Power mode.After Power-up, a falling edge on Chip Select (S)is required prior to the start of any instruction. pause any serial communications with the device without deselecting the device.During the Hold condition, the Serial Data Output (Q) is high impedance, and Serial Data Input (D)and Serial Clock (C) are Don’t Care.To start the Hold condition, the device must be se-This input signal is used to control whether the memory is write protected.memory are disabled, but other operations remain enabled. Write Protect (W) must either be driven High or Low, but must not be left floating.M95040, M95020, M95010 CONNECTING TO THE SPI BUSThese devices are fully compatible with the SPI protocol.All instructions, addresses and input data bytes are shifted in to the device, most significant bit first. The Serial Data Input (D) is sampled on the first rising edge of the Serial Clock (C) after Chip Select (S) goes Low.All output data bytes are shifted out of the device, most significant bit first. The Serial Data Output (Q) is latched on the first falling edge of the Serial Clock (C) after the instruction (such as the Read from Memory Array and Read Status Register in-structions) have been clocked into the device. Figure 4. shows three devices, connected to an MCU, on a SPI bus. Only one device is selected at a time, so only one device drives the Serial Data Output (Q) line at a time, all the others being high impedance.7/37M95040, M95020, M950108/37SPI ModesThese devices can be driven by a microcontroller with its SPI peripheral running in either of the two following modes:–CPOL=0, CPHA=0–CPOL=1, CPHA=1For these two modes, input data is latched in on the rising edge of Serial Clock (C), and output data is available from the falling edge of Serial Clock (C).The difference between the two modes, as shown in Figure 5., is the clock polarity when the bus master is in Stand-by mode and not transferring data:– C remains at 0 for (CPOL=0, CPHA=0)– C remains at 1 for (CPOL=1, CPHA=1)M95040, M95020, M95010 OPERATING FEATURESPower-upWhen the power supply is turned on, V CC rises from V SS to V CC.During this time, the Chip Select (S) must be al-lowed to follow the V CC voltage. It must not be al-lowed to float, but should be connected to V CC via a suitable pull-up resistor.sensitive as well as level sensitive. After Power-up, the device does not become selected until a falling edge has first been detected on Chip Select been High, prior to going Low to start the first op-eration.Power-downAt Power-down, the device must be deselected. Chip Select (S) should be allowed to follow the voltage applied on V CC.Active Power and Standby Power Modes When Chip Select (S) is Low, the device is select-ed, and in the Active Power mode. The device consumes I CC, as specified in Table 13. to Table 17..When Chip Select (S) is High, the device is dese-lected. If an Erase/Write cycle is not currently in progress, the device then goes in to the Standby Power mode, and the device consumption drops to I CC1.Hold ConditionThe Hold (HOLD) signal is used to pause any se-rial communications with the device without reset-ting the clocking sequence.During the Hold condition, the Serial Data Output (Q) is high impedance, and Serial Data Input (D) and Serial Clock (C) are Don’t Care.To enter the Hold condition, the device must be selected, with Chip Select (S) Low.Normally, the device is kept selected, for the whole duration of the Hold condition. Deselecting the de-vice while it is in the Hold condition, has the effect of resetting the state of the device, and this mech-anism can be used if it is required to reset any pro-cesses that had been in progress.The Hold condition starts when the Hold (HOLD) signal is driven Low at the same time as Serial Clock (C) already being Low (as shown in Figure 6.).signal is driven High at the same time as Serial Clock (C) already being Low.Figure 6. also shows what happens if the rising and falling edges are not timed to coincide with Serial Clock (C) being Low.9/37M95040, M95020, M9501010/37Status RegisterFigure 7. shows the position of the Status Register in the control logic of the device. This register con-tains a number of control bits and status bits, as shown in Table 3..Bits b7, b6, b5 and b4 are always read as 1.WIP bit.The Write In Progress bit is a volatile read-only bit that is automatically set and reset by the internal logic of the device. When set to a 1, it indicates that the memory is busy with a Write cy-cle.WEL bit.The Write Enable Latch bit is a volatile read-only bit that is set and reset by specific in-structions. When reset to 0, no WRITE or WRSR instructions are accepted by the device.BP1, BP0 bits.The Block Protect bits are non-volatile read-write bits. These bits define the area of memory that is protected against the execution of Write cycles, as summarized in Table 4..Table 3. Status Register FormatData Protection and Protocol ControlTo help protect the device from data corruption in noisy or poorly controlled environments, a number of safety features have been built in to the device.The main security measures can be summarized as follows:–The WEL bit is reset at power-up.–Chip Select (S) must rise after the eighth clockcount (or multiple thereof) in order to start a non-volatile Write cycle (in the memory array or in the Status Register).–Accesses to the memory array are ignoredduring the non-volatile programming cycle, and the programming cycle continues unaffected.–transitions are ignored.For any instruction to be accepted and executed,Chip Select (S) must be driven High after the rising edge of Serial Clock (C) that latches the last bit of the instruction, and before the next rising edge of Serial Clock (C).For this, “the last bit of the instruction” can be the eighth bit of the instruction code, or the eighth bit of a data byte, depending on the instruction (ex-cept in the case of RDSR and READ instructions).Moreover, the "next rising edge of CLOCK" might (or might not) be the next bus transaction for some other device on the bus.When a Write cycle is in progress, the device pro-tects it against external interruption by ignoring any subsequent READ, WRITE or WRSR instruc-tion until the present cycle is complete.Table 4. Write-Protected Block Sizeb7 b01111 BP1 BP0 WEL WIPBlock Protect Bits Write Enable Latch BitWrite In Progress BitStatus Register BitsProtected BlockArray Addresses ProtectedBP1 BP0 M95040 M95020M950100 0 nonenone none none 0 1 Upper quarter 180h - 1FFh C0h - FFh 60h - 7Fh 1 0 Upper half 100h - 1FFh 80h - FFh 40h - 7Fh 11Whole memory000h - 1FFh00h - FFh00h - 7FhMEMORY ORGANIZATIONThe memory is organized as shown in Figure 7..11/3712/37INSTRUCTIONSEach instruction starts with a single-byte code, as summarized in Table 5..If an invalid instruction is sent (one not contained in Table 5.), the device automatically deselects it-self.Table 5. Instruction SetNote: 1.A8 = 1 for the upper half of the memory array of theM95040, and 0 for the lower half, and is Don’t Care for other devices.2.X = Don’t Care.Instruc tion DescriptionInstruction Format WREN Write Enable 0000 X110WRDI Write Disable 0000 X100RDSR Read Status Register 0000 X101WRSR Write Status Register 0000 X001READRead from Memory Array0000 A 8011WRITE Write to Memory Array0000 A 8010Write Enable (WREN)The Write Enable Latch (WEL) bit must be set pri-or to each WRITE and WRSR instruction. The only way to do this is to send a Write Enable instruction to the device.As shown in Figure 8., to send this instruction to the device, Chip Select (S) is driven Low, and the bits of the instruction byte are shifted in, on Serial Data Input (D). The device then enters a wait state. It waits for a the device to be deselected, by Chip Select (S) being driven High.One way of resetting the Write Enable Latch (WEL) bit is to send a Write Disable instruction to the device.As shown in Figure 9., to send this instruction to the device, Chip Select (S) is driven Low, and the bits of the instruction byte are shifted in, on Serial Data Input (D).The device then enters a wait state. It waits for a the device to be deselected, by Chip Select (S) be-ing driven High.The Write Enable Latch (WEL) bit, in fact, be-comes reset by any of the following events:–Power-up–WRDI instruction execution–WRSR instruction completion–WRITE instruction completion–Write Protect (W) line being held Low.13/37Read Status Register (RDSR)One of the major uses of this instruction is to allow the MCU to poll the state of the Write In Progress (WIP) bit. This is needed because the device will not accept further WRITE or WRSR instructions when the previous Write cycle is not yet finished. As shown in Figure 10., to send this instruction to bits of the instruction byte are then shifted in, on Serial Data Input (D). The current state of the bits in the Status Register is shifted out, on Serial Data Out (Q). The Read Cycle is terminated by driving Chip Select (S) High.The Status Register may be read at any time, even during a Write cycle (whether it be to the memory area or to the Status Register). All bits of the Sta-tus Register remain valid, and can be read using the RDSR instruction. However, during the current Write cycle, the values of the non-volatile bits (BP0, BP1) become frozen at a constant value. The updated value of these bits becomes avail-able when a new RDSR instruction is executed, af-ter completion of the Write cycle. On the other hand, the two read-only bits (Write Enable Latch (WEL), Write In Progress (WIP)) are dynamically updated during the on-going Write cycle.The status and control bits of the Status Register are as follows:WIP bit.The Write In Progress (WIP) bit indicates whether the memory is busy with a Write or Write Status Register cycle. When set to 1, such a cycle is in progress, when reset to 0 no such cycle is in progress.WEL bit.The Write Enable Latch (WEL) bit indi-cates the status of the internal Write Enable Latch. When set to 1 the internal Write Enable Latch is set, when set to 0 the internal Write Enable Latch is reset and no Write or Write Status Register in-struction is accepted.BP1, BP0 bits.The Block Protect (BP1, BP0) bits are non-volatile. They define the size of the area to be software protected against Write instructions. These bits are written with the Write Status Regis-ter (WRSR) instruction. When one or both of the Block Protect (BP1, BP0) bits is set to 1, the rele-vant memory area (as defined in Table 4.) be-comes protected against Write (WRITE) instructions. The Block Protect (BP1, BP0) bits can be written provided that the Hardware Protect-ed mode has not been set.14/37Write Status Register (WRSR)This instruction has no effect on bits b7, b6, b5, b4, b1 and b0 of the Status Register.As shown in Figure 11., to send this instruction to bits of the instruction byte and data byte are then shifted in on Serial Data Input (D).The instruction is terminated by driving Chip Se-after the rising edge of Serial Clock (C) that latch-es the eighth bit of the data byte, and before the the next rising edge of Serial Clock (C). If this con-dition is not met, the Write Status Register (WRSR) instruction is not executed. The self-timed Write Cycle starts, and continues for a peri-od t W (as specified in Table 18. to Table 22.), at the end of which the Write in Progress (WIP) bit is reset to 0.The instruction is not accepted, and is not execut-ed, under the following conditions:–if the Write Enable Latch (WEL) bit has not been set to 1 (by executing a Write Enableinstruction just before)–if a Write Cycle is already in progress–if the device has not been deselected, by Chipbit, b0, of the data byte has been latched in –if Write Protect (W) is Low.15/3716/37Read from Memory Array (READ)As shown in Figure 12., to send this instruction to bits of the instruction byte and address byte are then shifted in, on Serial Data Input (D). For the M95040, the most significant address bit, A8, is in-corporated as bit b3 of the instruction byte, as shown in Table 5.. The address is loaded into an internal address register, and the byte of data at that address is shifted out, on Serial Data Output (Q).If Chip Select (S) continues to be driven Low, an internal bit-pointer is automatically incremented at each clock cycle, and the corresponding data bit is shifted out.When the highest address is reached, the address counter rolls over to zero, allowing the Read cycleto be continued indefinitely. The whole memory can, therefore, be read with a single READ instruc-tion.The Read cycle is terminated by driving Chip Se-lect (S) High. The rising edge of the Chip Select (S) signal can occur at any time during the cycle.The first byte addressed can be any byte within any page.The instruction is not accepted, and is not execut-ed, if a Write cycle is currently in progress.Table 6. Address Range BitsDevice M95040 M95020M95010Address BitsA8-A0A7-A0A6-A0。

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