HDSP-3350-FC000中文资料
HDS VSP G1000系列产品介绍

HDS VSP G1000系列产品介绍目录第1章HDS VSP G1000产品介绍 (4)1.1概述 (4)1.2VSP G1000技术的技术优势 (6)1.2.1永续运行 (6)1.2.2高度灵活的基础架构 (6)1.2.3自动、智能的架构 (11)1.2.4统一存储 (11)1.2.5无中断数据迁移 (13)1.2.6VSP G1000水平扩展的基础架构 (16)1.3VSP G1000软件包 (17)1.3.1SVOS(存储虚拟化操作系统) (17)1.3.2HITACHI COMMAND SUITE DATA MOBILITY(数据移动和灵活性) (21)1.3.3Hitachi Command Suite Analytics(高级分析和监控软件包) (22)1.3.4Hitachi Local Replication(本地数据保护) (24)1.3.5Hitachi Remote Replication(远程数据保护) (26)1.3.6File Base(统一存储) (29)1.4VSP G1000产品技术指标 (32)1.4.1VSP G1000 规格: 主机端口 (32)1.4.2VSP G1000 规格: 可用性 (32)1.4.3VSP G1000 规格: 支持的操作系统 (33)1.4.4Hitachi Virtual Storage Platform G1000 规格: 物理特性 (34)1.4.5Hitachi Virtual Storage Platform G1000 规格: 软件 (35)1.5外接存储系统兼容列表(存储虚拟化) (38)1.5.1HDS (38)1.5.2ATDX (39)1.5.3Data Direct Networks (39)1.5.4Dell (39)1.5.5EMC (39)1.5.6Fujitsu (40)1.5.7Gateway (40)1.5.8HP (41)1.5.9IBM (41)1.5.10NetApp (42)1.5.11Nexsan Technologies (42)1.5.12Pillar Data Systems (42)1.5.13SGI (43)1.5.14Sun Microsystems (43)1.5.15Xiotech (43)1.5.16X-IO (44)1.6VSP G1000 场地准备要求 (44)1.6.1VSP G1000环境要求 (44)1.6.2VSP G1000 电源要求 (45)1.6.3VSP G1000 模块装配图示 (47)1.6.4VSP G1000 控制器图示 (49)1.6.5VSP G1000 设备尺寸 (50)1.6.6机柜及服务空间 (50)第1章HDS VSP G1000产品介绍1.1概述如今,数据中心的运营耗费了大量的人力,这通常会阻碍IT团队与不断变化的业务需求保持同步发展。
海视群智2MP超低光环PTZ摄像头产品介绍说明书

DS-2DF6223-AEL2MP Ultra-low Light Smart PTZ Camera Hikvision Darkfighter series DS-2DF6223-AEL smart PTZ Dome Cameras are able to capture high quality colored images in dim light environment with its cutting-edge low illumination level down to 0.002Lux (color). Embedded with 1/1.9’’progressive scan CMOS chip makes true WDR (120dB) and2MP real-time resolution possible. With the 23X optical zoomDay/Night lens, the camera offers more details over expansive areas.The Darkfighter PTZ camera also features a wide range of smart functions, including face detection, intrusion detection, line crossing detection and audio exception, benefitting users with great improvement on security efficiency, more importantly, with key events / objects being recorded for further forensic needs. These features, combined with smart tracking, which enables the camera to detect any progressively moving object and follow it within the camera’s area of coverage without fault. Smart Defog and EIS (Electronic Image Stabilization) are further supported to improve image quality in challenging conditions. Key Features•1/1.9” HD CMOS sensor•2MP(1920*1080) Full HD•23X Optical Zoom•Ultra-low illumination•120dB True WDR•Smart Tracking•Smart Detection•EIS (Electronic Image Stabilization) •Defog•Hi-PoE / 24VAC power supplyFunction DescriptionBasic function:•High performance CMOS, up to 1920x1080 resolution •±0.1° Preset Accuracy•ONVIF(Open Network Video Interface Forum),CGI(Common Gateway Interface), PSIA(Physical Security Interoperability Alliance), to ensure greater interoperability between different platforms and compatibility•3D intelligent positioning function•3D DNR•IP66 standard•7 alarm inputs and 2 alarm outputs•Scheduled PTZ movementSmart function:•Smart tracking modes: Manual/ Panorama/ Intrusion trigger/ Line crossing trigger/ Region entrance trigger/ Region exiting trigger / Unattended baggage trigger / Object removal trigger, support smart tracking when patrol between multiple scenarios•Smart detection: support Face detection, Intrusion detection, Line crossing detection, Audio exception detection, Region entrance detection, Region exiting detection, Unattended baggage detection, Object removal detection•Smart recording: support edge recording, support dual-VCA for smart search in smart NVR•Smart image processing: support defog, HLC, EIS •Smart codec: low bit rate, ROICamera function:•Auto iris, auto focus, auto white balance, backlight compensation and auto day & night switch•Min. Illumination: 0.002Lux@(F1.5,AGC ON)(Color),0.0002Lux@(F1.5,AGC ON)(B/W)•Support privacy mask with multiple colors and mosaics on polygonal areasPTZ function:•360° endless pan range and -20°~ 90° tilt range •540°/s Pan Preset Speed and 400°/s Tilt Preset Speed •0.1°~ 300°/s Manual Pan Speed and 0.1°~ 240°/s Manual Tilt Speed•300 presets programmable; preset image freezing capability•8 patrols, up to 32 presets per patrol•4 patterns, with the recording time not less than 10 minutes per pattern•Proportional zoom function•Park action: auto call up of PTZ movement, after a defined time of inactivity•Power-off memory: restore PTZ & Lens status after reboot Network function:•H.264/MJPEG/MPEG4 video compression• H.264 encoding with Baseline/Main/High profile•ROI(Region of Interest) encoding(support 24 areas with adjustable levels)•Built-in Web server•Onboard storage, up to 128GB•Support up to 8 NAS storage; Edge recording(transmit the videos from SD card to the NAS after network resumed) •HTTPS encryption and IEEE 802.1X port-based network access control•Support trip-streams•Multiple network protocols supported: IPv4/Ipv6, HTTP, HTTPS, 802.1X, QoS, FTP, SMTP, UPnP, SNMP, DNS, DDNS, NTP, RTSP, RTP, TCP, UDP, IGMP, ICMP, DHCP, PPPoE•1 audio input and 1 audio outputModel DS-2DF6223-AELCamera ModuleImage Sensor 1/1.9’’ Progressive Scan CMOSMin. Illumination F1.5, AGC On: Color: 0.002 lux, B/W: 0.0002 luxMax. Image Resolution 1920×1080Focal Length 5.9-135.7mm, 23xDigital Zoom 16XZoom Speed Approx.4.4s(Optical Wide-Tele)Angle of View 59.8-3.0 degree (Wide-Tele)Min. Working Distance 10-1500mm(Wide-Tele)Aperture Range F1.5~F3.4Focus Mode Auto / Semiautomatic / ManualWDR 120dBS / N Ratio ≥ 55dBShutter Time 50Hz: 1~1/30,000s; 60Hz: 1~1/30,000sAGC Auto / ManualWhite Balance Auto / Manual /ATW/Indoor/Outdoor/Daylight lamp/Sodium lamp Day & Night IR Cut FilterPrivacy Mask 24 privacy masks programmable; optional multiple colors and mosaics Enhancement 3D DNR, EIS, Defog, HLC/BLC, SVCPan and TiltRange Pan:360° endless; Tilt: -20°~90°(Auto Flip)Speed Pan Manual Speed: 0.1°~300°/s, Pan Preset Speed: 540°/s Tilt Manual Speed: 0.1°~240°/s, Tilt Preset Speed: 400°/sNumber of Preset 300Patrol 8 patrols, up to 32 presets per patrolPattern 4 patterns, with the recording time not less than 10 minutes per patternPark Action Preset / Patrol / Pattern / Auto scan / Tilt scan / Random scan / Frame scan / Panorama scanScheduled Task Preset / Patrol / Pattern / Auto scan / Tilt scan / Random scan / Frame scan / Panorama scan/Dome reboot/Dome adjust/Aux outputSmart FeaturesSmart tracking Manual/ Panorama/ Intrusion trigger/ Line crossing trigger/ Region entrance trigger/ Region exiting trigger / Unattended baggage trigger / Object removal triggerSmart tracking when patrol between multiple scenariosSmart detection Face detection, Intrusion detection, Line crossing detection, Audio exception detection, Region entrance detection, Region exiting detection, Unattended baggage detection, Object removal detectionROI encoding Support 24 areas with adjustable levels AlarmAlarm I/O 7/2Alarm Trigger Face detection, Intrusion detection, Line crossing detection, Region entrance, Region exiting, Audio exception detection, Unattended baggage detection, Object removal detection, Motion detection, Dynamic analysis, Tampering alarm, Network disconnect, IP address conflict, Storage exceptionAlarm Action Preset, Patrol, Pattern, Micro SD/SDHC card recording, Relay output, Notification on Client Input/OutputMonitor Output 1.0V[p-p] / 75Ω, NTSC (or PAL) composite, BNCAudio Input 1 Mic in/Line in interface, line input: 2-2.4V[p-p]; output impedance: 1KΩ, ±10%Audio Output 1 Audio output interface, line level, impedance: 600ΩNetworkEthernet 10Base-T / 100Base-TX, RJ45 connectorMain Stream 50Hz: 25fps(1920×1080, 1280×960, 1280×720); 60Hz: 30fps(1920×1080, 1280×960, 1280×720) Sub Stream 50Hz: 25fps(704×576, 352×288, 176×144); 60Hz: 30fps(704×480, 352×240, 176×120)Third Stream 50Hz: 25fps(1920×1080, 1280×960, 1280×720, 704×576, 352×288, 176×144) 60Hz: 30fps(1920×1080, 1280×960, 1280×720, 704×480, 352×240, 176×120)Image Compression H.264/MJPEG/MPEG4, H.264 encoding with Baseline/Main/High profileAccessoriesDS-1602ZJWall MountDS-1602ZJ-ConnerConner MountDS-1602ZJ-PolePole MountDS-1602ZJ-BoxBox Mount DimensionsAudio Compression G.711ulaw/G.711alaw/G.726/MP2L2/G.722/PCMProtocols IPv4/IPv6, HTTP, HTTPS, 802.1X, QoS, FTP, SMTP, UPnP, SNMP, DNS, DDNS, NTP, RTSP, RTP, TCP, UDP, IGMP, ICMP, DHCP, PPPoESimultaneous Live View Up to 20 usersMini SD Memory Card Support up to 128GB Micro SD/SDHC/SDXC card. Support Edge recordingUser/Host Level Up to 32 users,3 Levels: Administrator, Operator and UserSecurity Measures User authentication (ID and PW); Host authentication (MAC address); IP address filteringSystem IntegrationApplication programming Open-ended API, support ONVIF, PSIA , CGI and GenetecWeb Browser IE 7+, Chrome 18 +, Firefox 5.0 +, Safari 5.02 +, support multi-languageRS-485 Protocols HIKVISION, Pelco-P, Pelco-D, self-adaptivePower Hi-PoE&24 VAC, Max.60WWorking Temperature-40°C ~ 65°C (-40°F ~ 149°F)Humidity90% or lessProtection Level IP66, IK10, TVS 4,000V lightning protection, surge protection and voltage transient protectionCertification FCC, CE, UL, RoHS, IEC/EN 61000, IEC/EN 55022, IEC/EN 55024, IEC /EN60950-1Dimensions Φ178.3(mm)×331.0(mm) (Φ7.02”×13.03”)Weight (approx.)8kg (approx.)Mount OptionLong-arm wall mount: DS-1602ZJ; Corner mount: DS-1602ZJ-corner;Pole Mount: DS-1602ZJ-pole; Power box mount:DS-1602ZJ-box; Swan-neck mount: DS-1619ZJUnit:mmDS-1619ZJSwan-neck MountDS-1662ZJPendant mountDS-1661ZJPendant mountDS-1663ZJCelling mountDS-1005KIUSB Joy-stickDS-1100KINetwork Keyboard。
HDS-高端USP-VM磁盘存储产品介绍

1.1 HDS 高端USP VM磁盘存储产品介绍1.1.1 HDS USP VM磁盘存储产品硬件介绍Hitachi TagmaStore™网络存储控制器USP VM是HDS2007年最新推出的机架式设备,符合企业的成本要求。
它采用了Hitachi Universal Star Network™交换架构,提供由业内领先的Hitachi TagmaStore通用存储平台带来的,经过验证的企业级功能:外部存储虚拟化、逻辑资源分区和通用复制。
HDS TagmaStore USP VM为HDS公司的第四代全光纤交换式企业级磁盘存储系统,内部仍然延续了HDS的CrossBar的交换式结构(通过Cache Switch,实现前端主机接口控制器、后端磁盘通道接口控制器数据到Cache的数据快速交换),采用了Hitachi自主研发Hi-Star III交换芯片,具有更高的数据交换能力,因此可以提供更高的内部带宽。
正是因为这样的传承,USP VM为用户带来了前所未有的性能、可用性和可靠性,以及先进的存储管理和数据复制功能。
用户可以把各种异构存储系统整合为一个虚拟池,通过一个中央控制台,使用一套通用的工具进行管理,从而简化存储环境,最大限度地利用现有资源,降低总体拥有成本。
一个新的存储类型根据IDC的研究,通用存储平台代表了一种新型存储技术,能够“潜在影响”存储解决方案市场变化的产品。
USP VM是这种类型的入门级产品,可以提供:•基于控制器的虚拟化管理,最多可管理96PB内部和外接存储•8个逻辑分区、专用高速缓存、端口以及内部和外部容量,以保证应用服务质量(QoS)•在异构存储系统之间实现通用复制,保证业务连续性•HDS TagmaStore USP VM提供虚拟化技术HDS TagmaStore USP VM HDS提供存储虚拟化的技术,可以实现将不同厂商的存储系统集合到同一个存储池中。
HDS TagmaStore USP VM内部的磁盘为内部存储资源,与之相连的其它存储设备上的资源是外部资源(可外连的磁盘存储设备包括Lightning Storage 9900V, 9900, 7700E、Thunder Storage 9500V&9200、IBM Shark、EMC Symmetrix&DMX、EMC CX系列等)。
HDSP-0883-00300中文资料

DevicesPart Number HDSP-ColorDescriptionFront View0781High-Efficiency Red Numeric, Right Hand DP A 0782Low Power Numeric, Left Hand DP B 0783Over Range ±1C 0784HexadecimalD 0791High-Efficiency Red Numeric, Right Hand DP A 0792High Brightness Numeric, Left Hand DP B 0793Over Range ±1C 0794HexadecimalD 0881YellowNumeric, Right Hand DP A 0882Numeric, Left Hand DP B 0883Over Range ±1C 0884HexadecimalD 0981High-Performance GreenNumeric, Right Hand DP A 0982Numeric, Left Hand DP B 0983Over Range ±1C 0984HexadecimalDHDSP-078x HDSP-079x HDSP-088x HDSP-098xFeatures• Three Character Options Numeric, Hexadecimal, Over Range• Three ColorsHigh Efficiency Red, Yellow,High Performance Green• 4x 7 Dot Matrix Character • High Efficiency Red, Yellow and High Performance Green • Two High Efficiency Red OptionsLow Power, High Brightness • Performance Guaranteed Over Temperature• High Temperature Stabilized • Memory Latch/Decoder/DriverTTL Compatible• Categorized for Luminous IntensityDescriptionThese standard solid state displays have a 7.4 mm (0.29 inch) dot matrix character and an on-board IC with data memory latch/decoder and LED drivers in a glass/ceramic package.The hermetic HDSP-078x,-079x/-088x displays utilize a solder glass frit seal. The HDSP-098X displays utilize an epoxy glass-to-ceramic seal.The numeric devices decode posi-tive BCD logic into characters “0-9,” a “–” sign, decimal point,and a test pattern. Thehexadecimal devices decodeGlass/Ceramic Numeric and Hexadecimal Displays for Industrial Applications Technical Datapositive BCD logic into 16characters, “0-9, A-F.” An input is provided on the hexadecimal devices to blank the display (all LEDS off) without losing the contents of the memory.The over range device displays “±1” and right hand decimal point and is typically driven via external switching transistors.COUNTRY CODEPackage DimensionsAbsolute Maximum RatingsNotes:1. The nominal thermal resistance of a display mounted in a socket that is soldered onto a printed circuit board isRθJA=50°C/W/device. The device package thermal resistance is RθJ-PIN = 15°C/W/device. The thermal resistance device pin-to-ambient through the PC board should not exceed 35°C/W/device for operation up to T A = +100°C.2. Voltage values are with respect to device ground, pin 6.3. These displays are categorized for luminous intensity with the intensity category designated by a letter code located on the back ofthe display package. Case temperature of the device immediately prior to the light measurement is equal to 25°C.Electrical/Optical Characteristics T A = –55°C to +100°CNotes:4. The luminous intensity at a specific operating ambienttemperature, I v(T A), may be approximated from the following exponential equation: I v(T A)=I v(25°C) e[k(T-25°C)].Device KHDSP-078 Series–0.0131/°CHDSP-079x SeriesHDSP-088x Series–0.0112/°CHDSP-098x Series–0.0104/°C 5. The dominant wavelength, λd, is derived from the CIE chroma-ticity diagram and represents the single wavelength whichdefines the color of the device.6. The HDSP-088X and HDSP-098X series devices are categor-ized as to dominant wavelength with the category designated by a number on the back of the display package.7. All typical values at V CC = 5.0 V and T A = 25°C.Operational ConsiderationsElectricalThese devices use a modified4x7 dot matrix of light emitting diodes to display decimal/ hexadecimal numeric informa-tion. The high efficiency red and yellow displays use GaAsP/GaP LEDs and the high performance green displays use GaP/GaP LEDs. The LEDs are driven by constant current drivers, BCD information is accepted by the display memory when the enable line is at logic low and the data islatched when the enable is atlogic high. Using the enable pulsewidth and data setup and holdtimes listed in the RecommendedOperating Conditions allows datato be clocked into an array ofdisplays at a 6.7MHz rate.The decimal point input is activelow true and this data is latchedinto the display memory in thesame fashion as the BCD data.The decimal point LED is drivenby the on-board IC.The blanking control input on thehexadecimal displays blanks(turns off) the displayedinformation without disturbingthe contents of display memory.The display is blanked at aminimum threshold level of 2.0volts. When blanked, the displaystandby power is nominally 250mW at T A = 25°C.The ESD susceptibility of the ICdevices is Class A of MIL-STD-883 or Class 2 of DOD-STD-1686and DOD-HDBK-263.AMechanicalThese displays are hermetically sealed for use in environments that require a high reliability device. These displays are designed and tested to meet a helium leak rate of5x10-8cc/sec.These displays may be mounted by soldering directly to a printed circuit board or insertion into a socket. The lead-to-lead pin spacing is 2.54 mm (0.100 inch) and the lead row spacing is 15.24 mm (0.600 inch). These displays may be end stacked with 2.54 mm (0.100 inch) spacing between outside pins of adjacent displays. Sockets such as Augat 324-AG2D (3 digits) or Augat 508-AG8D (one digit, right anglemounting) may be used.The primary thermal path forpower dissipation is through thedevice leads. Therefore, to insurereliable operation up to anambient temperature of +100°C,it is important to maintain abase-to-ambient thermalresistance of less than35°C watt/device as measured ontop of display pin 3.For further information onsoldering and post soldercleaning, see Application Note1027, Soldering LEDComponents.PreconditioningThese displays are 100% pre-conditioned by 24 hour storage at125°C, at 100°C for the HDSP-098x Series.Contrast EnhancementThese display devices aredesigned to provide an optimumON/OFF contrast when placedbehind an appropriate contrastenhancement filter. For furtherinformation on contrastenhancement, see ApplicationNote 1015, ContrastEnhancement for LEDDisplays.Over Range DisplayThe over range devices display“±1” and decimal point. Thecharacter height and packageconfiguration are the same as thenumeric and hexadecimaldevices. Character selection isobtained via external switchingtransistors and current limitingresistors.Absolute Maximum RatingsDescription Symbol Min Max Unit Storage Temperature, Ambient T S–65+125°C Operating Temperature, Ambient T A–55+100°C Forward Current, Each LED I F10mA Reverse Voltage, Each LED V R5VPackage DimensionsLuminous Intensity per LED(Digit Average) at T= 25°C Figure 3. Typical Driving Circuit.Notes:0: Line switching transistor in Figure 7 cutoff.1: Line switching transistor in Figure 7 saturated.X: ‘don’t care.’Electrical Characteristics T A = –55°C to +100°CColor Bin Limits (Dominant Wavelength)Note:Bin categories are established for classification of products. Productsmay not be available in all bin categories. Please consult your localAgilent Technologies representative./semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only)Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand,Philippines, Indonesia: (+65) 6755 2044Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc.Obsoletes 5964-6390EJuly 14, 20045988-2261EN。
HDSPE106资料

Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven Segment DisplaysTechnical Data HDSP-335X SeriesHDSP-555X SeriesHDSP-751X SeriesHDSP-A10X Series HDSP-A80X Series HDSP-A90X Series HDSP-E10X Series HDSP-F10X Series HDSP-G10X Series HDSP-H10X Series HDSP-K12X, K70X SeriesHDSP-N10X SeriesPackage DimensionsDevicesAlGaAs HERYellow Green Package HDSP-HDSP-HDSP-HDSP-DescriptionDrawingA1017511A801A9017.6 mm Common Anode Right Hand Decimal A A1037513A803A9037.6 mm Common Cathode Right Hand Decimal B A1077517A807A9077.6 mm Common Anode ±1. Overflow C A1087518A808A9087.6 mm Common Cathode ±1. Overflow D F10110 mm Common Anode Right Hand Decimal E F10310 mm Common Cathode Right Hand Decimal F F10710 mm Common Anode ±1. Overflow G F10810 mm Common Cathode ±1. OverflowH G10110 mm Two Digit Common Anode Right Hand Decimal X G10310 mm Two Digit Common Cathode Right Hand Decimal Y E100335010.9 mm Common Anode Left Hand Decimal I E101335110.9 mm Common Anode Right Hand Decimal J E103335310.9 mm Common Cathode Right Hand Decimal K E106335610.9 mm Universal ±1. Overflow [1]L H101555114.2 mm Common Anode Right Hand Decimal M H103555314.2 mm Common Cathode Right Hand Decimal N H107555714.2 mm Common Anode ±1. Overflow O H108555814.2 mm Common Cathode ±1. OverflowP K121K70114.2 mm Two Digit Common Anode Right Hand Decimal R K123K70314.2 mm Two Digit Common Cathode Right Hand Decimal S N10020 mm Common Anode Left Hand Decimal Q N10120 mm Common Anode Right Hand Decimal T N10320 mm Common Cathode Right Hand Decimal U N10520 mm Common Cathode Left Hand Decimal V N10620 mm Universal ±1. Overflow [1]WNote:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Package Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)元器件交易网7 Package Dimensions (cont.)Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red HERHDSP-A10X/E10X/HDSP-751X/Yellow GreenH10X/K12X/N10X/335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPLead Solder Temperature for 3Seconds (1.60 mm [0.063 in.] below 260°C seating plane)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.元器件交易网10Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10X3600I F = 5 mA330650I F = 1 mA F10X, G10X3900I F = 5 mA390650I F = 1 mA E10X Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mA H10X, K12X4200I F = 5 mA270590I F = 1 mA N10X3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA PkAll Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 mATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10X255F10X, G10X320E10X340Thermal Resistance LED RθJ-PIN°C/W/SegH10X, K12X Junction-to-Pin400N10X430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751X1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335X, 555X,K70X270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 mATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751X200335X Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555X, K70X345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80X2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 mATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90X2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 mATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.Data subject to change.Copyright © 1999 Agilent Technologies, Inc.5091-8365E (11/99)。
HDSP-0884-F0300中文资料

DevicesPart Number HDSP-ColorDescriptionFront View0781High-Efficiency Red Numeric, Right Hand DP A 0782Low Power Numeric, Left Hand DP B 0783Over Range ±1C 0784HexadecimalD 0791High-Efficiency Red Numeric, Right Hand DP A 0792High Brightness Numeric, Left Hand DP B 0793Over Range ±1C 0794HexadecimalD 0881YellowNumeric, Right Hand DP A 0882Numeric, Left Hand DP B 0883Over Range ±1C 0884HexadecimalD 0981High-Performance GreenNumeric, Right Hand DP A 0982Numeric, Left Hand DP B 0983Over Range ±1C 0984HexadecimalDHDSP-078x HDSP-079x HDSP-088x HDSP-098xFeatures• Three Character Options Numeric, Hexadecimal, Over Range• Three ColorsHigh Efficiency Red, Yellow,High Performance Green• 4x 7 Dot Matrix Character • High Efficiency Red, Yellow and High Performance Green • Two High Efficiency Red OptionsLow Power, High Brightness • Performance Guaranteed Over Temperature• High Temperature Stabilized • Memory Latch/Decoder/DriverTTL Compatible• Categorized for Luminous IntensityDescriptionThese standard solid state displays have a 7.4 mm (0.29 inch) dot matrix character and an on-board IC with data memory latch/decoder and LED drivers in a glass/ceramic package.The hermetic HDSP-078x,-079x/-088x displays utilize a solder glass frit seal. The HDSP-098X displays utilize an epoxy glass-to-ceramic seal.The numeric devices decode posi-tive BCD logic into characters “0-9,” a “–” sign, decimal point,and a test pattern. Thehexadecimal devices decodeGlass/Ceramic Numeric and Hexadecimal Displays for Industrial Applications Technical Datapositive BCD logic into 16characters, “0-9, A-F.” An input is provided on the hexadecimal devices to blank the display (all LEDS off) without losing the contents of the memory.The over range device displays “±1” and right hand decimal point and is typically driven via external switching transistors.COUNTRY CODEPackage DimensionsAbsolute Maximum RatingsNotes:1. The nominal thermal resistance of a display mounted in a socket that is soldered onto a printed circuit board isRθJA=50°C/W/device. The device package thermal resistance is RθJ-PIN = 15°C/W/device. The thermal resistance device pin-to-ambient through the PC board should not exceed 35°C/W/device for operation up to T A = +100°C.2. Voltage values are with respect to device ground, pin 6.3. These displays are categorized for luminous intensity with the intensity category designated by a letter code located on the back ofthe display package. Case temperature of the device immediately prior to the light measurement is equal to 25°C.Electrical/Optical Characteristics T A = –55°C to +100°CNotes:4. The luminous intensity at a specific operating ambienttemperature, I v(T A), may be approximated from the following exponential equation: I v(T A)=I v(25°C) e[k(T-25°C)].Device KHDSP-078 Series–0.0131/°CHDSP-079x SeriesHDSP-088x Series–0.0112/°CHDSP-098x Series–0.0104/°C 5. The dominant wavelength, λd, is derived from the CIE chroma-ticity diagram and represents the single wavelength whichdefines the color of the device.6. The HDSP-088X and HDSP-098X series devices are categor-ized as to dominant wavelength with the category designated by a number on the back of the display package.7. All typical values at V CC = 5.0 V and T A = 25°C.Operational ConsiderationsElectricalThese devices use a modified4x7 dot matrix of light emitting diodes to display decimal/ hexadecimal numeric informa-tion. The high efficiency red and yellow displays use GaAsP/GaP LEDs and the high performance green displays use GaP/GaP LEDs. The LEDs are driven by constant current drivers, BCD information is accepted by the display memory when the enable line is at logic low and the data islatched when the enable is atlogic high. Using the enable pulsewidth and data setup and holdtimes listed in the RecommendedOperating Conditions allows datato be clocked into an array ofdisplays at a 6.7MHz rate.The decimal point input is activelow true and this data is latchedinto the display memory in thesame fashion as the BCD data.The decimal point LED is drivenby the on-board IC.The blanking control input on thehexadecimal displays blanks(turns off) the displayedinformation without disturbingthe contents of display memory.The display is blanked at aminimum threshold level of 2.0volts. When blanked, the displaystandby power is nominally 250mW at T A = 25°C.The ESD susceptibility of the ICdevices is Class A of MIL-STD-883 or Class 2 of DOD-STD-1686and DOD-HDBK-263.AMechanicalThese displays are hermetically sealed for use in environments that require a high reliability device. These displays are designed and tested to meet a helium leak rate of5x10-8cc/sec.These displays may be mounted by soldering directly to a printed circuit board or insertion into a socket. The lead-to-lead pin spacing is 2.54 mm (0.100 inch) and the lead row spacing is 15.24 mm (0.600 inch). These displays may be end stacked with 2.54 mm (0.100 inch) spacing between outside pins of adjacent displays. Sockets such as Augat 324-AG2D (3 digits) or Augat 508-AG8D (one digit, right anglemounting) may be used.The primary thermal path forpower dissipation is through thedevice leads. Therefore, to insurereliable operation up to anambient temperature of +100°C,it is important to maintain abase-to-ambient thermalresistance of less than35°C watt/device as measured ontop of display pin 3.For further information onsoldering and post soldercleaning, see Application Note1027, Soldering LEDComponents.PreconditioningThese displays are 100% pre-conditioned by 24 hour storage at125°C, at 100°C for the HDSP-098x Series.Contrast EnhancementThese display devices aredesigned to provide an optimumON/OFF contrast when placedbehind an appropriate contrastenhancement filter. For furtherinformation on contrastenhancement, see ApplicationNote 1015, ContrastEnhancement for LEDDisplays.Over Range DisplayThe over range devices display“±1” and decimal point. Thecharacter height and packageconfiguration are the same as thenumeric and hexadecimaldevices. Character selection isobtained via external switchingtransistors and current limitingresistors.Absolute Maximum RatingsDescription Symbol Min Max Unit Storage Temperature, Ambient T S–65+125°C Operating Temperature, Ambient T A–55+100°C Forward Current, Each LED I F10mA Reverse Voltage, Each LED V R5VPackage DimensionsLuminous Intensity per LED(Digit Average) at T= 25°C Figure 3. Typical Driving Circuit.Notes:0: Line switching transistor in Figure 7 cutoff.1: Line switching transistor in Figure 7 saturated.X: ‘don’t care.’Electrical Characteristics T A = –55°C to +100°CColor Bin Limits (Dominant Wavelength)Note:Bin categories are established for classification of products. Productsmay not be available in all bin categories. Please consult your localAgilent Technologies representative./semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only)Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand,Philippines, Indonesia: (+65) 6755 2044Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc.Obsoletes 5964-6390EJuly 14, 20045988-2261EN。
HDS NAS介绍

价格
Essential NAS
2000 2000近线性
用于文件服务器、整合、 文件共享和备份的标准 解决方案
3100
1100c
1300c
1500c
性能
5
3200
价格
Essential NAS Platform 设备型号
• 现场升级能力 • 可从以前的产品升级
所有的指标基于双节点集群:
Accounts
IP Network LAN
Exchange Server
DB Server
NAS
SAN
FC Backup
IP FC
3
减少或消除部门内部的服务器和 存储设备
SW Development
减少或消除部门内部的服务器和 存储设备
Engineering
减少或消除部门内部的服务器和 存储设备
Sales
25
ProtecTIER 设备架构概述
“它是一个磁 带库,同时也 是一个磁带驱 动器”
Virtual Tape Library Appliance
集成的服务器和 磁盘存储系统
光纤通道
备份服务器
ProtecTIER 应用程序
• 模拟磁带库单元,包括驱动器、磁带盒和机械臂 • 使用光纤通道 ( FC) 连接的磁盘存储系统作为备份介质
• 中等级别业务, 远程办公室,大型 企业
• 为文件共享,备份和整合提供方案
• 适用于对性能和扩展能力 NAS Platform • 企业及产品,具有高级功能
• 企业级大型环境, 对性能要求高的场 合
• 为整合, 高性能的企业应用提供解决 方案
• 适用于对性能和扩展能力要求非常高 的场合
HDS-2000实施手册

HDS-2000实施手册
一、面板设计
前面板设计:
后面板设计:
二、接口定义
根据后面板接口的序号定义每个接口的用途。
Ypbpr(带接口转换辫子,1路DB15接口转为2路3BNC的分量接口)
备注一:远程模式下,远程图像将作为现场默认信号,全景或刑事被告人摄像机信号将作为给远程的默认图像。
备注二:第3、4路输出(备用采集)一般情况下不接,采用VGA分割采集。
VGA接口(DB15)
备注一:需要配备VGA分配器,将书记员电脑信号同时输出给书记员显示器和CDS9000机备注二:法庭上可能配备多个法官显示器,可以增加VGA分配器扩展输出。
备注三:若法庭空间较大,需要配备两个或多个大屏,可以增加VGA分配器扩展输出。
备注四:分别支持实物展台分量和VGA信号接入,实际应用中二选一即可。
(需要软件设置)。
备注五:如果配置了证据手写留痕功能,需要使用第6路输入和第6路输出。
音频接口(凤凰头接口)
备注:根据机器的后面板图,音频具有两种接入方式:混合立体声(+G+)、线性平衡(+G-)。
控制端口
其他
高清分割板卡采用PCI插槽,从机器的背部插入。
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Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven SegmentDisplays Technical Data HDSP-335x SeriesHDSP-555x SeriesHDSP-751x SeriesHDSP-A10x Series HDSP-A80x Series HDSP-A90x Series HDSP-E10x Series HDSP-F10x Series HDSP-G10x Series HDSP-H10x Series HDSP-K12x, K70x Series HDSP-N10x SeriesHDSP-N40x SeriesDevicesAlGaAs HER Yellow Green Package HDSP-HDSP-HDSP-HDSP-Description Drawing A1017511A801A9017.6 mm Common Anode Right Hand Decimal A A1037513A803A9037.6 mm Common Cathode Right Hand Decimal B A1077517A807A9077.6 mm Common Anode ±1. Overflow C A1087518A808A9087.6 mm Common Cathode ±1. Overflow D F10110 mm Common Anode Right Hand Decimal E F10310 mm Common Cathode Right Hand Decimal F F10710 mm Common Anode ±1. Overflow G F10810 mm Common Cathode ±1. Overflow H G10110 mm Two Digit Common Anode Right Hand Decimal X G10310 mm Two Digit Common Cathode Right Hand Decimal Y E100335010.9 mm Common Anode Left Hand Decimal I E101335110.9 mm Common Anode Right Hand Decimal J E103335310.9 mm Common Cathode Right Hand Decimal K E106335610.9 mm Universal ±1. Overflow[1]L H101555114.2 mm Common Anode Right Hand Decimal M H103555314.2 mm Common Cathode Right Hand Decimal N H107555714.2 mm Common Anode ±1. Overflow O H108555814.2 mm Common Cathode ±1. Overflow P K121K70114.2 mm Two Digit Common Anode Right Hand Decimal R K123K70314.2 mm Two Digit Common Cathode Right Hand Decimal S N10020 mm Common Anode Left Hand Decimal Q N101N40120 mm Common Anode Right Hand Decimal T N103N40320 mm Common Cathode Right Hand Decimal U N10520 mm Common Cathode Left Hand Decimal V N106N40620 mm Universal ±1. Overflow[1]W Note:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Part Numbering System5082-x xx x-x x x xxHDSP-x xx x-x x x xxMechanical Options[1]00: No mechanical optionColor Bin Options[1,2]0: No color bin limitationMaximum Intensity Bin[1,2]0: No maximum intensity bin limitationMinimum Intensity Bin[1,2]0: No minimum intensity bin limitationDevice Configuration/Color[1]G: GreenDevice Specific Configuration[1]Refer to respective datasheetPackage[1]Refer to Respective datasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative fordetails.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins are typically restricted to 1 bin per tube (excep-tions may apply). Please refer to respective datasheet for specific bin limit information.Package DimensionsPackage Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)Package Dimensions (cont.)Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red - HDSP-HERA10X/E10X/H10X HDSP-751X/Yellow GreenK12X/N10X/N40X335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPWave Soldering Temperature for 3Seconds (1.60 mm [0.063 in.] below 250°C seating body)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10x3600I F = 5 mA330650I F = 1 mAF10x, G10x3900I F = 5 mA390650I F = 1 mA E10x Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mAH10x, K12x4200I F = 5 mA270590I F = 1 mAN10x, N40x3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA PkAll Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10x255F10x, G10x320E10x340Thermal Resistance LED RθJ-PIN°C/W/SegH10x, K12x Junction-to-Pin400N10x, N40x430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751x1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335x, 555x,K70x270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751x200335x Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555x, K70x345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.AlGaAs RedIntensity Bin Limits (mcd)AlGaAs RedHDSP-A10xIV Bin Category Min.Max.E0.3150.520F0.4280.759G0.621 1.16H0.945 1.71I 1.40 2.56J 2.10 3.84K 3.14 5.75L 4.708.55HDSP-E10x/F10x/G10xIV Bin Category Min.Max.D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-H10x/K12xIV Bin Category Min.Max.C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50HDSP-N10xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued HERHDSP-751xIV Bin Category Min.Max.B0.1600.240C0.2000.300D0.2500.385E0.3150.520F0.4280.759G0.621 1.16HDSP-751xIV Bin Category Min.Max.B0.2400.366C0.3000.477D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-555x/K70xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued YellowHDSP-A80xIV Bin Category Min.Max.D0.2500.385E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60GreenHDSP-A90xIV Bin Category Min.Max.E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60Electrical/OpticalFor more information on electrical/optical characteristics, please see Application Note 1005.Contrast Enhancement For information on contrast enhancement, please see Application Note 1015.Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.Note:All categories are established for classification of products. Productsmay not be available in all categories. Please contact your localAgilent representatives for further clarification/information.Color Categories/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788 6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6271 2451India, Australia, New Zealand: (+65) 6271 2394Japan: (+81 3) 3335-8152(Domestic/International), or0120-61-1280(Domestic Only)Korea: (+65) 6271 2194Malaysia, Singapore: (+65) 6271 2054Taiwan: (+65) 6271 2654Data subject to change.Copyright © 2005 Agilent Technologies, Inc.Obsoletes 5988-8412ENJanuary 19, 20055989-0080EN。