硅片行业术语大全(中英文对照)
硅片行业术语大全(中英文对照+A-Z)
一、硅片行业术语大全(中英文对照A-H)Acceptor - An element, such as boron, indium, and gallium used to create a free hole in a semiconductor. The acceptor atoms are required to have one less valence electron than the semiconductor.受主- 一种用来在半导体中形成空穴的元素，比如硼、铟和镓。
受主原子必须比半导体元素少一价电子Alignment Precision - Displacement of patterns that occurs during the photolithography process.套准精度- 在光刻工艺中转移图形的精度。
Anisotropic - A process of etching that has very little or no undercutting各向异性- 在蚀刻过程中，只做少量或不做侧向凹刻。
Area Contamination - Any foreign particles or material that are found on the surface of a wafer. This is viewed as discolored or smudged, and it is the result of stains, fingerprints, water spots, etc.沾污区域- 任何在晶圆片表面的外来粒子或物质。
由沾污、手印和水滴产生的污染。
Azimuth, in Ellipsometry - The angle measured between the plane of incidence and the major axis of the ellipse.椭圆方位角- 测量入射面和主晶轴之间的角度。
SMT术语中英文对照表
AI :Auto-Insertion 自动插件AQL :acceptable quality level 允收水准ATE :automatic test equipment 自动测试ATM :atmosphere 气压BGA :ball grid array 球形矩阵CCD :charge coupled device 监视连接元件(摄影机)CLCC :Ceramic leadless chip carrier 陶瓷引脚载具COB :chip-on-board 晶片直接贴附在电路板上cps :centipoises(黏度单位) 百分之一CSB :chip scale ball grid array 晶片尺寸BGACSP :chip scale package 晶片尺寸构装CTE :coefficient of thermal expansion 热膨胀系数DIP :dual in-line package 双内线包装(泛指手插元件)FPT :fine pitch technology 微间距技术FR-4 :flame-retardant substrate 玻璃纤维胶片(用来製作PCB材质) IC :integrate circuit 积体电路IR :infra-red 红外线Kpa :kilopascals(压力单位)LCC :leadless chip carrier 引脚式晶片承载器MCM :multi-chip module 多层晶片模组MELF :metal electrode face 二极体MQFP :metalized QFP 金属四方扁平封装NEPCON :National Electronic Package and Production Conference 国际电子包装及生产会议PBGA lastic ball grid array 塑胶球形矩阵PCB rinted circuit board 印刷电路板PFC olymer flip chip PLCC lastic leadless chip carrier 塑胶式有引脚晶片承载器Polyurethane 聚亚胺酯(刮刀材质)ppm arts per million 指每百万PAD(点)有多少个不良PAD(点)psi ounds/inch2 磅/英吋2PWB rinted wiring board 电路板QFP :quad flat package 四边平坦封装SIP :single in-line packageSIR :surface insulation resistance 绝缘阻抗SMC :Surface Mount Component 表面黏着元件SMD :Surface Mount Device 表面黏着元件SMEMA :Surface Mount Equipment Manufacturers Association 表面黏着设备製造协会SMT :surface mount technology 表面黏着技术SOIC :small outline integrated circuit SOJ :small out-line j-leaded packageSOP :small out-line package 小外型封装SOT :small outline transistor 电晶体SPC :statistical process control 统计过程控制SSOP :shrink small outline package 收缩型小外形封装TAB :tape automaticed bonding 带状自动结合TCE :thermal coefficient of expansion 膨胀(因热)係数Tg :glass transition temperature 玻璃转换温度THD :Through hole device 须穿过洞之元件(贯穿孔)TQFP :tape quad flat package 带状四方平坦封装UV :ultraviolet 紫外线uBGA :micro BGA 微小球型矩阵cBGA :ceramic BGA 陶瓷球型矩阵PTH :Plated Thru Hole 导通孔IA Information Appliance 资讯家电产品MESH 网目OXIDE 氧化物FLUX 助焊剂LGA (Land Grid Arry)封装技术LGA封装不需植球，适合轻薄短小产品应用。
太阳能行业英语术语
太阳能产业行业术语光伏产业链PV industry chain多晶硅原料-----单晶硅棒----单晶硅片----晶体硅电池----电池封装----系统集成----工程安装polycrystalline silicon raw material ---mono-crystalline silicon ingot---mono-crystalline silicon wafer---crystalline silicon cell—cells encapsulation---system integration---construction installation单词：1.单晶硅片mono-crystalline silicon wafer多晶硅片polycrystalline silicon wafer晶向orientation少数载流子寿命lifetime导电类型conductivity type位错密度dislocation硅单晶片厚度thickness硅单晶片的弯曲度surface camber准方单晶硅片: quasi-square mono-crystalline silicon wafer2.太阳电池solar cell3.薄膜太阳电池film solar cell4.光电转换photo-electricity conversion5.太阳电池组件solar module多晶硅太阳电池组件polycrystalline solar module单晶硅太阳电池组件mono-crystalline solar module6.太阳能户用系统solar home system（分为：太阳能直流户用系统；太阳能交流户用系统；太阳能交直流户用系统）7.太阳能电站solar power station（分为：离网型太阳能电站off-grid solar power station ；并网型太阳能电站grid-connected solar power station ）8.太阳能热水器solar water heater9.太阳能热水系统：solar heating system10.太阳能直流式热水系统: solar direct heating system11.太阳能强迫循环热水系统solar compelling cycle heating system12.太阳能自然循环热水系统solar spontaneously cycle heating system13.真空管太阳能集热器vacuum tube solar centralized heating system14.平板型太阳能集热器flat type solar centralized heating system15.全玻璃真空太阳能集热器full-glass vacuum solar centralizedheating system16.热管式真空管太阳集热器heat-tube vacuum solar centralizedheating system17.采光面积: lighting area18.太阳能幅照度solar radiant intensity19.太阳能控制器：solar controller20.太阳能逆变器：solar inverter21.太阳能通讯基站solar telecommunication power systems22.石油和天然气管道太阳能阴极保护电站：solar power stations forcathode protection of the oil and gas feeding pipes23.太阳能电池方阵solar array24.太阳能通讯电源solar communication power station25.太阳能自动跟踪装置solar automatic tracker26.太阳能移动电源车（站）solar mobile electrical vehicle (station)27.光伏水泵solar pump28.太阳能杨水系统solar pumping system29.光—网---柴互补系统complementary system for solar –grid-dieseloil30.风---光互补系统complementary system for solar - wind31.太阳能交通信号灯solar traffic signal light32.太阳能交通警示标志solar traffic warning symbol33.太阳能道钉solar road mark34.太阳能庭院灯solar garden light35.太阳能路灯solar street light36.太阳能草坪灯solar lawn light37.太阳能广告牌solar billboard38.太阳能电话亭solar telephone booth短语：太阳能扬水和照明综合应用系统：the comprehensive utilization system of solar pumping and lighting变频调速交流异步电机：high-efficient frequency conversion alternating asynchronous motors（这个产品不是太阳能产品）送电到乡: Power Supply to Township丝绸之路光明工程：Silk Road Brightness Project太阳能亮化工程solar brightness project太阳能与建筑一体化integrate solar energy with building。
硅片行业术语大全
使节光伏产业链各环节主要制造商和分布一览太阳能产业示意图太阳能产业示意图中国高纯多晶硅材料生产和投资现状一览表中国高纯多晶硅材料生产和投资现状一览表（含已有产能和在建、拟建项目）中国高纯多晶硅材料生产和投资现状一览表国外硅片供应商大全国外硅片供应商大全(转载)/sites/start/start.htm /default.asphttp://www.rasa.co.jp硅片行业术语大全Acceptor - An element, such as boron, indium, and gallium used to create a free hole in a semiconductor. The acceptor atoms are required to have one less valence electron than the semiconductor.受主- 一种用来在半导体中形成空穴的元素，比如硼、铟和镓。
受主原子必须比半导体元素少一价电子Alignment Precision - Displacement of patterns that occurs during the photolithography process. 套准精度- 在光刻工艺中转移图形的精度。
Anisotropic - A process of etching that has very little or no undercutting各向异性- 在蚀刻过程中，只做少量或不做侧向凹刻。
Area Contamination - Any foreign particles or material that are found on the surface of a wafer. This is viewed as discolored or smudged, and it is the result of stains, fingerprints, water spots, etc. 沾污区域- 任何在晶圆片表面的外来粒子或物质。
硅片行业术语大全
EdgeProfile-Theedgesoftwobondedwafersthathavebeenshapedeitherchemicallyorme chanically. 光伏材料设备网 边缘轮廓-通过化学或机械方法连接起来的两个晶圆片边缘。 pv001·net
沾污颗粒-晶圆片表面上的颗粒。 光伏网
CrystalDefect-Partsofthecrystalthatcontainvacanciesanddislocationsthatcanha veanimpactonacircuit’selectricalperformance. pv001·net 晶体缺陷-部分晶体包含的、会影响电路性能的空隙和层错。 pv001
硅片行业术语大全（中英对照）
2010-11-1516:19:00 来源：互联网
Acceptor-Anelement,suchasboron,indium,andgalliumusedtocreateafreeholeinasem iconductor.Theacceptoratomsarerequiredtohaveonelessvalenceelectronthanthese miconductor. 光伏网 受主-一种用来在半导体中形成空穴的元素，比如硼、铟和镓。受主原子必须比半导体 元素少一价电子
Bipolar-Transistorsthatareabletousebothholesandelectronsaschargecarriers. ww
SMT常用术语SMT名词中英文对照
AI :Auto-Insertion 自动插件AQL :acceptable quality level 允收水准ATE :automatic test equipment 自动测试ATM :atmosphere 气压BGA :ball grid array 球形矩阵CCD charge coupled device 监视连接元件〔摄影机〕CLCC :Ceramic leadless chip carrier 陶瓷引脚载具COB :chip-on-board晶片直接贴附在电路板上cps :centipoises〔黏度单位〕百分之——CSB :chip scale ball grid array 晶片尺寸BGACSP :chip scale package 晶片尺寸构装CTE :coefficient of thermal expansion 热膨胀系数DIP :dual in-line package双内线包装〔泛指手插元件〕FPT :fine pitch technology 微间距技术FR-4 :flame-retardant substrate玻璃纤维胶片〔用来制作PCB材质〕IC :integrate circuit 积体电路IR :infra-red 红外线Kpa :kilopascals〔压力单位〕LCC :leadless chip carrier引脚式晶片承载器MCM :multi-chip module多层晶片模组MELF :metal electrode face 二极体MQFP :metalized QFP 金属四方扁平封装NEPCON :National Electronic Package andProduction Conference国际电子包装及生产会议PBGA:plastic ball grid array 塑胶球形矩阵PCB:printed circuit board 刷电路板PFC :polymer flip chipPLCC:plastic leadless chip carrier塑胶式有引脚晶片承载器Polyurethane聚亚胺酯〔刮刀材质〕ppm:parts per million 指每百万PAD〔点〕有多少个不良PAD〔点〕psi :pounds/inch2 磅/英口寸 2PWB :printed wiring board 电路板QFP :quad flat package 四边平坦封装SIP :single in-line packageSIR :surface insulation resistance 绝缘阻抗SMC :Surface Mount Component 外表黏着元件SMD :Surface Mount Device 外表黏着元件SMEMA :Surface Mount EquipmentManufacturers Association外表黏着设备制造协会SMT :surface mount technology 外表黏着技术SOIC :small outline integrated circuitSOJ :small out-line j-leaded packageSOP :small out-line package 小外型封装SOT :small outline transistor 电晶体SPC :statistical process control 统计过程限制SSOP :shrink small outline package 收缩型小外形封装TAB :tape automaticed bonding 带状自动结合TCE :thermal coefficient of expansion 膨胀〔因热〕系数Tg :glass transition temperature 玻璃转换温度THD :Through hole device 须穿过洞之元件〔贯穿孔〕TQFP :tape quad flat package带状四方平坦封装UV :ultraviolet 紫外线uBGA :micro BGA 微小球型矩阵cBGA :ceramic BGA 陶瓷球型矩阵PTH :Plated Thru Hole 导通孔IA Information Appliance 资讯家电产品MESH网目OXIDE氧化物FLUX助焊剂应用. LGA 〔Land Grid Arry〕封装技术LGA封装不需植球,适合轻薄短小产品TCP 〔Tape Carrier Package〕ACF Anisotropic Conductive Film异方性导电胶膜制程Solder mask 防焊漆Soldering Iron 烙铁Solder balls 锡球Solder Splash 锡渣Solder Skips 漏焊Through hole 贯穿孔Touch up 补焊Briding襦接〔短路〕Solder Wires 焊锡线Solder Bars 锡棒Green Strength未固化强度〔红胶〕Transter Pressure 转印压力〔E[1刷〕Screen Printing刮刀式印刷Solder Powder 锡颗粒Wetteng ability 润湿水平Viscosity 黏度Solderability 焊锡性Applicability 使用性Flip chip 覆晶Depaneling Machine 组装电路板切割机Solder Recovery System 锡料回收再使用系统Wire Welder主机板补线机X-Ray Multi-layer Inspection System X-Ray 孔偏检查机BGA Open/Short X-Ray Inspection Machine BGA X-Ray 检测机Prepreg Copper Foil Sheeter P.P.铜箔裁切机Flex Circuit Connections 软性排线焊接机LCD Rework Station 液晶显示器修护机Battery Electro Welder电池电极焊接机PCMCIA Card Welder PCMCIA 卡连接器焊接Laser Diode半导体雷射Ion Lasers离子雷射Nd: YAG Laser石榴石雷射DPSS Lasers半导体激发固态雷射Ultrafast Laser System 超快雷射系统MLCC Equipment积层元件生产设备Green Tape Caster, Coater 薄带成型机ISO Static Laminator积层元件均压机Green Tape Cutter元件切割机Chip Terminator积层元件端银机MLCC Tester积层电容测试机Components Vision Inspection System 晶片元件外观检查机高压恒温恒湿寿命测试机High Voltage Burn-In Life Tester电容漏电流寿命测试机Capacitor Life Test with Leakage Current晶片打带包装机Taping Machine元件外表黏着设备Surface Mounting Equipment 电阻银电极沾附机Silver Electrode Coating Machine TFT-LCD〔薄膜电晶体液晶显示器〕笔记型用STN-LCD〔中小尺寸超扭转向液晶显示器行动用PDA〔个人数位助理器〕CMP〔化学机械研磨〕制程研磨液〔Slurry〕,Compact Flash Memory Card 〔简称CF 记忆卡〕MP3、PDA、数位相机Dataplay Disk〔微光碟〕.交换式电源供给器〔SPS〕专业电子制造效劳〔EMS〕,PCB高密度连结板〔HDI board , 指线宽/线距小于4/4 mil 〕微小孔板〔Micro-via board 〕,孔彳至5-6mil以下水沟效应〔Puddle Effect〕:早期大面积松宽线路之蚀刻银贯孔〔STH〕铜贯孔〔CTH〕组装电路板切割机Depaneling MachineNONCFC =无氟氯碳化合物.Support pin =支撑柱F.M尸光学点ENTEK裸铜板上涂一层化学药剂使PCB的pad比拟不会生锈QFD:品质机能展开PMT:产品成熟度测试ORT:持续性寿命测试FMEA :失效模式与效应分析TFT-LCD〔薄膜电晶体液晶显示器〕〔Liquid-Crystal Displays Addressed by Thin-FilmTransistors)导线架(Lead Frame):单体导线架(Discrete Lead Frame)及积体线路导线架(IC Lead Frame) 二种ISP的全名是Internet Service Provider ,指的是网际网路效劳提供ADSL即为非对称数位用户回路数据机SOP: Standard Operation Procedure (标准操作手册)DOE: Design Of Experiment(实验方案法)打线接合(Wire Bonding )卷带式自动接合(Tape Automated Bonding, TAB )覆晶接合(Flip Chip )品质标准：JIS日本工业标准ISO国际认证M.S.D.S国际物质平安资料FLUX SIR 加湿绝缘阻抗值1. RMA (Return Material Authorization) 维修作业意指产品售出后经由客户反响发生问题的不良品维修及分析.Automatic optical inspection (AOI自动光学检查)DIP 封装(DualIn-linePackage )也叫双列直插式封装技术, 指采用双列直插形式封装的集成电路芯片,绝大多数中小规模集成电路均采用这种封装形式,其引脚数一般不超过100.DIP封装的CPU芯片有两排引脚,需要插入到具有DIP结构的芯片插座上.外表贴装技术SMT外表安装技术,英文称之为"SurfaceMountTechnology简称SMT ,它是将外表贴装元器件贴、焊到印制电路板外表规定位置上的电路装联技术,所用的负责制电路板无无原那么钻孔.具体地说,就是首先在印制板电路盘上涂布焊锡膏,再将外表贴装元器件准确地放到涂有焊锡膏的焊盘上,通过加热印制电路板直至焊锡膏熔化,冷却后便实现了元器与印制板之间的互联.20世纪80年代,SMT生产技术日趋完善,用于外表安装技术的元器件大量生产, 价格大幅度下降,各种技术性能好,价格低的设备纷纷面世,用SMT组装的电子产品具有体积小,性能好、功能全、价位低的优势,故SMT作为新一代电子装联技术,被广泛地应用于航空、航天、通信、计算机、医疗电子、汽车、办公自动化、家用电器等各个领域的电子产品装联中.SMD 外表贴装器件(SurfaceMountedDevices)在电子线路板生产的初级阶段,过孔装配完全由人工来完成.首批自动化机器推出后,它们可放置一些简单的引脚元件,但是复杂的元件仍需要手工放置方可进行波峰焊.外表贴装元件在大约二十年前推出,并就此开创了一个新纪元. 从无源元件到有源元件和集成电路,最终都变成了外表贴装器件(SMD)并可通过拾放设备进行装配.在很长一段时间内人们都认为所有的引脚元件最终都可采用SMD封装.。
硅片 英语词汇
硅片英语词汇Silicon Wafer - An Introduction to the Essential Building Block of Modern ElectronicsIntroduction:Silicon wafers, commonly known as silicon chips or simply wafers, are the fundamental building blocks of modern electronics. These thin, round discs are made from high-purity silicon and serve as the base for the fabrication of various electronic components. This article aims to provide an in-depth understanding of silicon wafers, their production process, and their significance in the electronics industry.1. What are Silicon Wafers?Silicon wafers are thin, circular discs made from silicon, a chemical element widely used in the electronics industry. Silicon is chosen for its unique properties, including its semi-conductive nature, abundance, and compatibility with various manufacturing processes. Silicon wafers act as the foundation for the production of microchips, integrated circuits, and other electronic components.2. Production Process of Silicon Wafers:The production process of silicon wafers involves several steps, each of which contributes to the final product's quality and performance. Let's take a closer look at these steps:a. Silicon Ingot Production:The first step involves growing a silicon ingot, which is a cylindrical piece of high-purity silicon. This is achieved through a process called the Czochralski method, in which a seed crystal is dipped into molten silicon and slowly pulled out, allowing the silicon to solidify around the seed crystal. The resulting ingot is then sliced into thin wafers.b. Wafer Slicing:The silicon ingot is sliced into ultra-thin wafers using a diamond saw. The thickness of these wafers can vary, with common thicknesses ranging from 200 to 300 micrometers. These sliced wafers undergo further refining processes to remove any imperfections.c. Wafer Polishing:After slicing, the wafers undergo a polishing process to create a smooth and mirror-like surface. This is essential for ensuring uniformity and preventing any defects that may affect the performance of electronic devices.d. Wafer Cleaning:To ensure the wafers are free from contaminants, they undergo a rigorous cleaning process. This involves various chemical treatments and rinsing steps to remove any particles, residues, or impurities that could interfere with subsequent manufacturing processes.3. Importance of Silicon Wafers:Silicon wafers play a crucial role in the electronics industry due to their unique properties and applications. Here are a few key reasons why silicon wafers are of utmost importance:a. Semiconductor Manufacturing:Silicon wafers serve as the foundation for the production of semiconductors. These semiconductors are the heart of various electronic devices, including computers, smartphones, televisions, and automotive electronics. Silicon wafers, with their intrinsic properties, enable the creation of transistors, diodes, and other components that form the basis of electronic circuits.b. Integrated Circuits:Integrated circuits, commonly known as microchips, are composed of multiple electronic components integrated onto a single silicon wafer. These microchips areresponsible for the functioning of complex electronic systems. They can store, process, and transmit data, making them essential for modern technology.c. Research and Development:Silicon wafers are extensively used in research and development activities. They provide a platform for testing and prototyping new electronic devices and materials. Researchers can modify the properties of silicon wafers by introducing dopants or other materials, allowing them to explore new possibilities in electronic technology.4. Challenges and Future Trends:Although silicon wafers have been the backbone of the electronics industry for decades, there are challenges and emerging trends that shape the future of this technology:a. Miniaturization:With the increasing demand for smaller, faster, and more efficient electronic devices, the industry faces the challenge of miniaturization. Manufacturers strive to produce wafers with thinner dimensions to accommodate the shrinking size requirements of electronic components.b. Alternative Materials:Researchers are exploring alternative materials to silicon, such as gallium arsenide and silicon carbide, which offer unique properties for specific applications. These materials may eventually replace silicon wafers in certain electronic devices, especially those that require high-frequency operations or higher temperature tolerance.c. 3D Integration:The concept of 3D integration involves stacking multiple layers of integrated circuits on a single silicon wafer. This approach allows for increased functionality and reduced device footprint, leading to advancements in areas such as memory storage and signal processing.Conclusion:Silicon wafers are the fundamental building blocks of modern electronics. Their unique properties, coupled with their versatile manufacturing process, make them indispensable in the production of semiconductors, microchips, and various electronic components. As technology continues to advance, silicon wafers face challenges and opportunities in the form of miniaturization, alternative materials, and 3D integration. Nevertheless, silicon wafers remain a vital element in driving the innovation and development of the electronics industry.。
硅行业术语
Contamination Partic*不良词语*ate - Particles found on the surface of a silicon wafer.
沾污颗粒 - 晶圆片表面上的颗粒。
Crystal Defect - Parts of the crystal that contain vacancies and dislocations that can have an impact on a circuit’s electrical performance.
名义上边缘排除(EE) - 质量保证区和晶圆片外围之间的距离。
Edge Profile - The edges of two bonded wafers that have been shaped either chemically or mechanically.
边缘轮廓 - 通过化学或机械方法连接起来的两个晶圆片边缘。
化学-机械抛光(CMP) - 平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
Chuck Mark - A mark found on either surface of a wafer, caused by either a robotic end effector, a chuck, or a wand.
Bipolar - Transistors that are able to use both holes and electrons as charge carriers.
双极晶体管 - 能够采用空穴和电子传导电荷的晶体管。
Bonded Wafers - Two silicon wafers that have been bonded together by silicon dioxide, which acts as an ins*不良词语*ating layer.
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Acceptor - An element, such as boron, indium, and gallium used to create a free hole in a semiconductor. The acceptor atoms are required to have one less valence electron than the semiconductor.受主- 一种用来在半导体中形成空穴的元素，比如硼、铟和镓。
受主原子必须比半导体元素少一价电子Alignment Precision - Displacement of patterns that occurs during the photolithography process.套准精度- 在光刻工艺中转移图形的精度。
Anisotropic - A process of etching that has very little or no undercutting各向异性- 在蚀刻过程中，只做少量或不做侧向凹刻。
Area Contamination - Any foreign particles or material that are found on the surface of a wafer. This is viewed as discolored or smudged, and it is the result of stains, fingerprints, water spots, etc.沾污区域- 任何在晶圆片表面的外来粒子或物质。
由沾污、手印和水滴产生的污染。
Azimuth, in Ellipsometry - The angle measured between the plane of incidence and the major axis of the ellipse.椭圆方位角- 测量入射面和主晶轴之间的角度。
Backside - The bottom surface of a silicon wafer. (Note: This term is not preferred; instead, use …back surface‟.)背面- 晶圆片的底部表面。
（注：不推荐该术语，建议使用“背部表面”）Base Silicon Layer - The silicon wafer that is located underneath the insulator layer, which supports the silicon film on top of the wafer.底部硅层- 在绝缘层下部的晶圆片，是顶部硅层的基础。
Bipolar - Transistors that are able to use both holes and electrons as charge carriers.双极晶体管- 能够采用空穴和电子传导电荷的晶体管。
Bonded Wafers - Two silicon wafers that have been bonded together by silicon dioxide, which acts as an insulating layer.绑定晶圆片- 两个晶圆片通过二氧化硅层结合到一起，作为绝缘层。
Bonding Interface - The area where the bonding of two wafers occurs.绑定面- 两个晶圆片结合的接触区。
Buried Layer - A path of low resistance for a current moving in a device. Many of these dopants are antimony and arsenic.埋层- 为了电路电流流动而形成的低电阻路径，搀杂剂是锑和砷。
Buried Oxide Layer (BOX) - The layer that insulates between the two wafers.氧化埋层(BOX) - 在两个晶圆片间的绝缘层。
Carrier - Valence holes and conduction electrons that are capable of carrying a charge through a solid surface in a silicon wafer.载流子- 晶圆片中用来传导电流的空穴或电子。
Chemical-Mechanical Polish (CMP) - A process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.化学-机械抛光(CMP) - 平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。
此工艺在前道工艺中使用。
Chuck Mark - A mark found on either surface of a wafer, caused by either a robotic end effector, a chuck, or a wand.卡盘痕迹- 在晶圆片任意表面发现的由机械手、卡盘或托盘造成的痕迹。
Cleavage Plane - A fracture plane that is preferred.解理面- 破裂面Crack - A mark found on a wafer that is greater than 0.25 mm in length.裂纹- 长度大于0.25毫米的晶圆片表面微痕。
Crater - Visible under diffused illumination, a surface imperfection on a wafer that can be distinguished individually.微坑- 在扩散照明下可见的，晶圆片表面可区分的缺陷。
Conductivity (electrical) - A measurement of how easily charge carriers can flow throughout a material.传导性（电学方面）- 一种关于载流子通过物质难易度的测量指标。
Conductivity Type - The type of charge carriers in a wafer, such as “N-type” and “P-type”.导电类型- 晶圆片中载流子的类型，N型和P型。
Contaminant, Particulate (see light point defect)污染微粒（参见光点缺陷）Contamination Area - An area that contains particles that can negatively affect the characteristics of a silicon wafer.沾污区域- 部分晶圆片区域被颗粒沾污，造成不利特性影响。
Contamination Particulate - Particles found on the surface of a silicon wafer. 沾污颗粒- 晶圆片表面上的颗粒。
Crystal Defect - Parts of the crystal that contain vacancies and dislocations that can have an impact on a circuit‟s electrical performance.晶体缺陷- 部分晶体包含的、会影响电路性能的空隙和层错。
Crystal Indices (see Miller indices)晶体指数（参见米勒指数）Depletion Layer - A region on a wafer that contains an electrical field that sweeps out charge carriers.耗尽层- 晶圆片上的电场区域，此区域排除载流子。
Dimple - A concave depression found on the surface of a wafer that is visible to the eye under the correct lighting conditions.表面起伏- 在合适的光线下通过肉眼可以发现的晶圆片表面凹陷。
Donor - A contaminate that has donated extra “free” electrons, thus makin g a wafer “N-Type”.施主- 可提供“自由”电子的搀杂物，使晶圆片呈现为N型。
Dopant - An element that contributes an electron or a hole to the conduction process, thus altering the conductivity. Dopants for silicon wafers are found in Groups III and V of the Periodic Table of the Elements.搀杂剂- 可以为传导过程提供电子或空穴的元素，此元素可以改变传导特性。
晶圆片搀杂剂可以在元素周期表的III 和V族元素中发现。
Doping - The process of the donation of an electron or hole to the conduction process by a dopant.掺杂- 把搀杂剂掺入半导体，通常通过扩散或离子注入工艺实现。
Edge Chip and Indent - An edge imperfection that is greater than 0.25 mm. 芯片边缘和缩进- 晶片中不完整的边缘部分超过0.25毫米。
Edge Exclusion Area - The area located between the fixed quality area and the periphery of a wafer. (This varies according to the dimensions of the wafer.)边缘排除区域- 位于质量保证区和晶圆片外围之间的区域。