PCB英文词汇
PCB中英文对照词汇
覆盖层
Cover layer
28
增强板材
Stiffener material
29
铜箔面
Copper-clad surface
30
去铜箔面
Foil removal surface
31
层压板面
Unclad laminate surface
32
基膜面
Base film surface
33
胶粘剂面
Adhesive face
26
刚性双面印制板
Flex-rigid double-sided printed board、rigid-flex double-sided printed
27
刚性多层印制板
Flex-rigidmultilayerprinted board、rigid-flex double-sided printed
Surface laminar circuit(slc)
43
埋入凸块连印制板
B2it printed board
44
多层膜基板
Mutil-layered film substrate(mfs)
45
层间全内导通多层印制板
Alivhmultiplayerprinted board
46
载芯片板
Chip on board (cob)
28
齐平印制板
Flush printed board
29
金属芯印制板
Metal core printed board
30
金属基印制板
Metal base printed board
31
多重布线印制板
Mulit-wiring printed board
PCB中英文对照词汇
PCB 中英文对照词汇一、综合词汇序号中文英文1印刷电路Printed circuit2印制线路Printed wiring3印刷板Printed board4印制板电路Printed circuit board(pcb)5印制线路板Printed wiring board(pwb)6印制元件Printed component7印制接点Printed contact8印制板装配Printed board assembly9板board10单面印制板Single-sided printed board(ssb) 11双面印制板Double-sided printed board(dsb) 12多层印制板Multilayer printed board(mlb) 13多层印制电路板Multilayer printed circuit board 14多层印制线路板Multilayer printed wiring board 15刚性印制板Rigid printed board16刚性单面印制板Rigid single-sided printed board 17刚性双面印制板Rigid double-sided printed board 18刚性多层印制板Rigid multilayer printed board 19挠性多层印制板Flexible multilayer printed board20挠性印制板Flexible printed board21挠性单面印制板Flexible single-sided printed board22挠性双面印制板Flexible double-sided printed board23挠性印制电路Flexible printed circuit(fpc)24挠性印制线路Flexible printed wiring25刚性印制线路Flex-rigid printed board 、 rigid-flexprinted board26刚性双面印制板Flex-rigid double-sided printed board、rigid-flex double-sided printed27刚性多层印制板Flex-rigid multilayer printed board、rigid-flex double-sided printed28齐平印制板Flush printed board29金属芯印制板Metal core printed board30金属基印制板Metal base printed board31多重布线印制板Mulit-wiring printed board32陶瓷印制板Ceramic substrate printed board33导电胶印制板Electroconductive paste printed board34模塑电路板Molded circuit board35模压印制板Stamped printed wiring board36顺序层压多层印制板Sequentially-laminated multilayer37散线印制板Discrete wiring board38微线印制板Micro wire board39积层印制板Build-up printed board40积层多层印板Build-up multilayer printed board (bum) 41积层挠性印制板Build-up flexible printed board42表面层合电路板Surface laminar circuit(slc)43埋入凸块连印制板B2it printed board44多层膜基板Mutil-layered film substrate(mfs) 45层间全内导通多层印Alivh multiplayer printed board制板46载芯片板Chip on board (cob)47埋电阻板Buried resistance board48母板Mother board49子板Daughter board50背板backplane51裸板Bare board52键盘板夹心板Copper-invar-copper board53动态挠性板Dynamic flex board54静态挠性板Static flex board55可断拼板Break-away planel56电缆cable57挠性扁平电缆Flexible flat cable (ffc)58薄膜开关Membrance switch59混合开关Hybrid circuit60厚膜Thick film61厚膜电路Thick film circuit62薄膜Thin film63薄膜混合电路Thin film hybrid circuit 64互连interconnection65导线Conductor trace line 66齐平导线Flush conductor 67传输线Transmission line 68跨交crossover69板边插头Edge-board contact 70增强板stiffener71基底Substrate72基板面Real estate73导线面Conductor side74元件面Component side 75焊接面Solder side76印制Printing77网格Grid78图形Pattern79导电图形Conductive pattern 80非导电图形Non-conductive pattern 81字符legend82标志mark二、基材序号中文英文1基材Base material2层压板Laminate3覆金属箔基材Metal-clad bade material4覆铜箔层压板Copper-clad laminate(ccl)5单面覆铜箔层压板Single-sided copper-clad laminate 6双面覆铜箔层压板Double-sided copper laminate 7复合层压板Composite laminate8薄层压板Thin laminate9金属芯覆铜箔层压板Metal core copper-clad laminate 10金属基覆铜层压板Metal base copper-clad laminate 11挠性覆铜箔绝缘薄膜Flexible copper-clad dielectric film 12基体材料Basis material13预浸材料Prepreg14粘结片Bonding sheet15预浸粘结片Preimpregnated bonding sheet 16环氧玻璃基板Epoxy glass substrate17加成法用层压板Laminate for additive process 18预制内层覆箔板Mass laminate panel19内层芯板Core material20催化板材Catalyzed board21涂胶催化层压板Adhesive-coated catalyzed laminate 22涂胶无催化层压板Adhesive-coated uncatalyzed laminate 23粘结层Bonding layer24粘结膜Film adhesive25涂胶粘剂绝缘薄膜Adhesive coated dielectric film26无支撑胶粘剂膜Unsupported adhesive film27覆盖层Cover layer28增强板材Stiffener material29铜箔面Copper-clad surface30去铜箔面Foil removal surface31层压板面Unclad laminate surface32基膜面Base film surface33胶粘剂面Adhesive face34原始光洁面Plate finish35粗面Matt finish36纵向Length wise direction37横向Cross wise direction38剪切板Cut to size panel39酚醛纸质覆铜箔板Phenolic cellulose paper copper-cladlaminates(phenolic paper ccl)40环氧纸质覆铜箔板Epoxide cellulose paper copper-cladlaminates(epoxy paper ccl)41环氧玻璃布基覆铜箔Epoxide woven glass fabric copper-clad 板laminate42环氧玻璃布纸复合覆Epoxide cellulose paper core glass cloth 铜箔板surfaces copper-clad laminate43环氧玻璃布玻璃纤维Epoxide non woven glass reinforced 复合覆铜箔板copper-clad laminate44聚酯玻璃布覆铜箔板Polyester wovenglass fabric copper-clad laminate45聚酰亚胺玻璃布覆铜Polyimide woven glass fabric copper-clad箔板laminate46双马来酰亚胺三嗪环Bismaleimide triazine epoxide woven 氧玻璃布覆铜板glass fabric copper-clad laminate47环氧合成纤维布覆铜Epoxide synthetic fiber copper-clad箔板laminates48聚四乙烯玻璃纤维覆Teflon fiber glass copper-clad laminate铜箔板49超薄型层压板Ultra thin laminate50陶瓷基覆铜箔板Ceramincs base copper-clad laminate 51紫外线阻挡型覆铜箔Uv blocking copper-clad laminates板三、基材的材料序号中文英文1 a 阶树脂a-stage resin2 b 阶树脂b-stage resin3 c 阶树脂c-stage resin4环氧树脂Epoxy resin5酚醛树脂Phenolic resin6聚酯树脂Polyester resin7聚酰亚胺树脂Polyimide resin8双马来酰亚胺三嗪树Bismaleimide-triazine resin脂9丙烯酸树脂Acrylic resin10三聚氰胺甲醛树脂Melamine formaldehyde resin 11多功能环氧树脂Polyfunctional epoxy resin 12溴化环氧树脂Brominated epoxy resin 13环氧酚醛Epoxy novolac14氟树脂fluroresin15硅树脂Silicone resin16硅烷silane17聚合物polymer18无定形聚合物Amorphous polymer19结晶现象Crystalline polamer20双晶现象dimorphism21共聚物copolymer22合成树脂synthetic23热固性树脂Thermosetting resin24热塑性树脂Thermoplastic resin25感光性树脂Photosensitive resin26环氧当量Weight per epoxy equipvalent(wpe) 27环氧值Epoxy value28双氰胺dicyandiamide29粘结剂binder30固化剂Curing agent31胶粘剂adesive32阻燃剂Flame retardant33遮光剂opaquer34增塑剂plasticizers35不饱和聚酯Unsatuiated polyster36聚酯薄膜polyester37聚酰亚胺薄膜Polyimide film(pi)38聚四氟乙烯Polytetrafluoetylene(ptfe)39聚四氟乙烯丙烯薄膜Perfluorinated ethylene-propylenecopolymer film(fep)40增强材料Reinforcing material41玻璃纤维Glass fiber42 E 玻璃纤维e-glass fiber43 D 玻璃纤维d-glass fiber44S 玻璃纤维s-glass fiber45玻璃布Glass fabric46非织布Non-woven fabric 47玻璃纤维垫Glass mats48纱线yarn49单丝filament50胶股strand51纬纱Weft yarn52经纱Warp yarn53但尼尔denier54经向Warp-wise55纬向Weft-wise 、 filling-wise 56织物经纬密度Thread count57织物组织Weave structure58平纹组织Plain structure59坏布Grey fabric60稀松织物Woven scrim61弓纬Bow of weave62断经End missing63缺纬Mis-picks64纬斜bias65折痕crease66云织waviness67鱼眼Fish eye68毛圈长Feather length69厚薄段mark70裂缝spilt71捻度Twist of yarn72浸润剂含量Size content73浸润剂残留量Size residue74处理剂含量Finish leval75浸润剂size76偶联剂Couplint agent77处理织物Finished fabric78聚酰胺纤维Polyarmide fiber79聚酯纤维非织布Non-woven polyester fabric 80浸渍绝缘纵纸Impregenating insulation paper 81聚芳酰胺纤维纸Aromatic polyamide paper 82断裂长Breaking length83吸水高度Height of capillary rise84湿强度保留率Wet strength retention85白度whitenness86陶瓷ceramics87导电箔Conductive foil88铜箔Copper foil89电解铜箔Electrodeposited copper foil (ed copperfoil)90压延铜箔Rolled copper foil91退火铜箔Annealed copper foil92压延退火铜箔Rolled annealed copper foil (ra copperfoil)93薄铜箔Thin copper foil94涂胶铜箔Adhesive coated foil95涂胶脂铜箔Resin coated copper foil(rcc)96复合金属箔Composite metallic material97载体搏Carrier foil98殷瓦invar99箔（剖面）轮廓Foil profile100光面Shiny side101粗糙面Matte side102处理面Treated side103防锈处理Stain proofing104双面处理铜箔Double treated foil四、设计序号中文英文1原理图Shematic diagram2逻辑图Logic diagram3印制线路布设Printed wire layout4布设总图Master drawing5可制造性设计Design-for-manufacturability6计算机辅助设计Computer-aided design(cad)7计算机辅助制造Computer-aided manufacturability(cim) 8计算机集成制造Computer integrat manufacturing 9计算机辅助工程Computer-aided engineering(cae) 10计算机辅助测试Computer-aided test (cat)11电子设计自动化Electric design automaton(eda) 12工程设计自动化Engineering design automaton(eda2) 13组装设计自动化Assemnly aided architecturaldesign(aaad) 14计算机辅助制图Computer aided drawing15计算机控制显示Computer controlled display(ccd) 16布局placement17布线routing18布图设计layout19重布rerouting20模拟simulation21逻辑模拟Logic simulation22电路模拟Circit simulate23时序模拟Timing simulation24模块化modularization25布线完成率Layout effeciency26机器描述格式Machine descriptionm format(mdf) 27机器描述格式数据库Mdf database28设计数据库Design database29设计原点Design origin30优化（设计）Optimization(design)31供设计优化坐标轴Predominant axis32表格原点Table origin33镜像Mirroring34驱动文件Drive file35中间文件Intermediate file36制造文件Manufacturing documentation 37队列支撑数据库Queue support database38元件安置component positioning 39图形显示Graphics display40比例因子Scaling factor41扫描填充Scan filling42矩形填充Rectangle filling43填充域Region filling44实体设计Physical design45逻辑设计Logic design46逻辑电路Logic design47层次设计Hierarchical design48自顶向下设计Top-down design49自顶向上设计Bottom-up design50线网net51数字化digitzing52设计规则检查Design rule checking53走（布）线路Router(cad)54网络表Net list55计算机辅助电路分析Computer-aided circuit analysis 56子线网Subnet57目标函数Objective function58设计后处理Post design processing(pdp) 59交互式制图设计Interactive drawing design 60费用矩阵Cost metrix61工程图Engineering drawing62方块框图Block diagram63迷宫Moze64元件密度Component density65巡回售货员问题Traveling salesman problem 66自由度Degrees freedom67入度Out going degree68出度Incoming degree69曼哈顿距离Manhatton distance70欧几里德距离Euclidean distance71网络Network72阵列Array73段Segment74逻辑Logic75逻辑设计自动化Logic design automation 76分线Separated time77分层Separated layer78定顺序Definite sequence79对准度registration80孔环Annular ring81公差Tolerance82同心Concentricity83样片coupon84变色discolorations85污点Stains86试样Specimen 87钻孔Drilling88剪裁Shearing 89切外型Routing90刮线Scoring91倒角Chamfering 92切空Blanking 93适应性suitability 94板弯Bow95板扭Twist96应力Stress97防焊膜Solder mask 98阻焊膜Solder resist 99文字标记Legend 100版本代字Revision letter 101料号Part No 102跳漏Skipping 103浮空Soda strawing 104流动Flow 105整平Leveling 106FPR First pass yield ‘。
pcb工厂常用单词
pcb工厂常用单词
在PCB工厂中，一些常用的英文单词包括：
1.circuit board：电路板
2.printed circuit board：印刷电路板
3.PCBA：PCBA，是Printed Circuit Board Assembly的缩写，意思是印
刷电路板组装件
4.trace：迹线，表示电路板上的线路
5.trace width：迹线宽度，表示电路板上线条的粗细
6.trace spacing：迹线间距，表示电路板上两条线路之间的距离
yer：层，表示电路板上的不同导体层
8.dielectric：介质，表示电路板上的绝缘材料
9.via：导通孔，表示电路板上连接不同层导体的孔洞
10.drill hole：钻孔，表示电路板上用于安装元器件的孔洞
ponent：元器件，表示电路板上所安装的电子元件
12.resistor：电阻器
13.capacitor：电容器
14.inductor：电感器
15.transistor：晶体管
16.diode：二极管
17.LED：发光二极管
18.connector：连接器，表示电路板上连接不同部分之间的插座或插
头
19.jumper：跳线，表示用于连接不同部分的短导线
20.tooling hole：工具孔，表示电路板上用于安装治具的孔洞
21.mounting hole：安装孔，表示电路板上用于安装元器件的孔洞
以上仅是部分常用词汇，实际工作中还会涉及到更多专业术语和词汇。
PCB专业术语中英文翻译
PCB专业术语中英文翻译很多PCB的书上使用的是英文，但是大多数的人又看不懂英文，这时候怎么办呢，我们需要翻译，但是如果每看到一个不会的词儿就去翻译，那么就太耗费时间了，所以我们捷多邦总结了一些常用的专业术语的中英文对照，希望能对大家有用。
1.印制电路：printed circuit2.印制线路：printed wiring3.印制板：printed board4.印制板电路：printed circuit board (pcb)5.印制线路板：printed wiring board(pwb)6.印制元件：printed component7.印制接点：printed contact8.印制板装配：printed board assembly9.板：board 110.表面层合电路板：surface laminar circuit (slc)11.埋入凸块连印制板：b2it printed board12.多层膜基板：multi-layered film substrate(mfs)13.层间全内导通多层印制板：alivh multilayer printed board14.载芯片板：chip on board (cob)15.埋电阻板：buried resistance board16.母板：mother board17.单面印制板：single-sided printed board(ssb)18.双面印制板：double-sided printed board(dsb)19.多层印制板：mulitlayer printed board(mlb)20.多层印制电路板：mulitlayer printed circuit board21.多层印制线路板：mulitlayer prited wiring board22.刚性印制板：rigid printed board23.刚性单面印制板：rigid single-sided printed borad24.刚性双面印制板：rigid double-sided printed borad25.刚性多层印制板：rigid multilayer printed board26.子板：daughter board27.背板：backplane28.裸板：bare board29.键盘板夹心板：copper-invar-copper board30.动态挠性板：dynamic flex board31.静态挠性板：static flex board32.可断拼板：break-away planel33.电缆：cable34.挠性扁平电缆：flexible flat cable (ffc)35.薄膜开关：membrane switch36.混合电路：hybrid circuit37.厚膜：thick film38.厚膜电路：thick film circuit39.薄膜：thin film40.挠性多层印制板：flexible multilayer printed board41.挠性印制板：flexible printed board42.挠性单面印制板：flexible single-sided printed board43.挠性双面印制板：flexible double-sided printed board44.挠性印制电路：flexible printed circuit (fpc)45.挠性印制线路：flexible printed wiring46.刚性印制板：flex-rigid printed board, rigid-flex printedboard47.刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed48.刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board49.齐平印制板：flush printed board50.金属芯印制板：metal core printed board51.金属基印制板：metal base printed board52.多重布线印制板：mulit-wiring printed board53.陶瓷印制板：ceramic substrate printed board54.导电胶印制板：electroconductive paste printed board55.模塑电路板：molded circuit board56.模压印制板：stamped printed wiring board57.顺序层压多层印制板：sequentially-laminated mulitlayer58.散线印制板：discrete wiring board59.微线印制板：micro wire board60.积层印制板：buile-up printed board61.积层多层印制板：build-up mulitlayer printed board (bum)62.积层挠印制板：build-up flexible pr上面是一些比较常见的专业用语，有一些不是特别常用的有时候我们也会遇到，所以我们捷多邦也总结了一些不怎么常用的中英文对照，希望对你来说是有用的：1.Absorption 吸收、吸入2.Accelerated Test（Aging）加速试验、加速老化3.Accelerator 加速剂、速化剂4.Accept/Acceptance 允收5.Acceptable Quality Level（AQL）允收品质水准6.Accuracy 准确度ACF：7.Adhesive copper foil 有胶铜箔8.Activator 活化剂、添加剂比称为9.Activator Active parts（Devices）主动零件，指积体电路或电晶体10.Addition Agent 添加剂11.Additive Process 加成法、分全加成、半加成及部份加成12.Back Light（Back Lighting）背光法13.Back-UP 垫板14.Backpanels/ Backplanes 背板、支持板，厚度较厚，15.Ball Grid Array（BGA）球脚车列（封装）16.Barrel 孔壁17.Base Material 基材18.Batch 批（同时间发料某一数量的板子）19.Bevelling 切斜边20.Binder 黏结剂21.Capacitance 电容22.Carbide 碳化物、碳化钨钻头23.CAR: Corrective Action Report 改善报告24.Carbon Treatment 活性碳处理25.Card 卡板26.Carrier 载体27.Cartridge 滤芯28.Cathode 阴极L: Copper Clad Laminates 铜箔基板30.Ceramics 陶瓷31.Certificate 证明书32.CFC 氟氯碳化物33.Chloro-Fluoro-Carbon Chamfer 倒角、去掉直角34.Characteristic Impedance 特性阻抗35.Cheek list 检察清单36.Chip 晶粒、晶片37.Chip On Board 晶片黏著板38.Clean Room 无尘室(Class 100)39.Cleanliness 清洁度40.Clearance 余隙、余环41.COB（Chip on Board）晶片在板上直接组装42.COC（Certificate of Compliance）出货合格书。
PCB专业英译术语
PCB专业英译术语PCB（Printed Circuit Board，印刷电路板）是现代电子产品中最常用的一种重要的电路载体，其设计、生产和维修需要大量的技术术语支持。
本文将重点介绍PCB专业英译术语。
一、PCB基础术语1. PCB（Printed Circuit Board）：印刷电路板2. SMT（Surface Mount Technology）：表面贴装技术3. Through-hole Technology：通孔技术4. PTH（Plated Through Hole）：贯穿电解孔5. FR4：一种常用的印刷电路板基材材料，即玻璃纤维材料，通常由环氧树脂和玻璃纤维材料构成6. Pad：焊盘7. Trace：线路8. Via：垂直插孔9. Gerber file：Gerber文件格式，一种电路板设计文件格式10. BOM（Bill of Materials）：物料清单11. NC（Numerical Control）：数控12. DFM（Design for Manufacturability）：可制造性设计二、PCB制造过程相关术语1. CAM（Computer Aided Manufacturing）：计算机辅助制造2. Etch：蚀刻3. Silkscreen：丝网印刷4. Solder mask：焊盘油墨5. Plating：电镀6. HASL（Hot Air Solder Leveling）：热风焊盘处理7. OSP（Organic Solderability Preservatives）：有机可焊保护剂8. Gold Fingers：金手指，指电子产品中可进行插拔操作的特殊金属触点9. DIP（Dual In-line Package）：双列直插封装10. SOP（Small Outline Package）：小封装11. QFN（Quad Flat Package）：四角平封12. BGA（Ball Grid Array）：球网阵列13. PCBA（Printed Circuit Board Assembly）：印刷电路板装配三、PCB测试和维修相关术语1. AOI（Automated Optical Inspection）：自动光学检测2. X-ray Inspection：X光检测3. ICT（In-Circuit Test）：在线测试4. FCT（Functional Circuit Test）：功能测试5. Test point：测试点6. Defect：缺陷7. Repair：修复8. Rework：返工9. Troubleshooting：故障排除四、PCB设计相关术语1. EDA（Electronic Design Automation）：电子设计自动化2. Netlist：网表3. DRC（Design Rule Check）：设计规则检查4. DFM（Design for Manufacturing）：可制造性设计5. Gerber data：Gerber数据6. Simulation：仿真7. Library：元件库8. Footprint：封装9. Copper pour：铜质填充10. Via tenting：垂直插孔塞堵11. Blind vias：盲孔12. Buried vias：穿过孔五、总结本文介绍了PCB专业英译术语中的基础术语、PCB制造过程相关术语、PCB测试和维修相关术语以及PCB设计相关术语。
PCB工程部专业英语词汇
PCB 工程部专业英文词汇词汇1.板料: material2.最低限度: minimum 或者min.3.最大限度：maximum 或者max。
4.基准点(零点) datum point5.周期Date code6.V—cut余厚V-cut remain thickness7.抢电铜皮（假铜）dummy copper8.实物板actual board9.外形及尺寸错误dimension error10.异常情形error data file11.焊锡面与零件面对位偏差misregistration12.孔塞plug hole13.要求requirement14.缺少miss15.偏公差uneven tolerance16.补偿compensation17.表面处理surface treatment18.无铅喷锡Lead free HAL19.金手指斜边bevel of G/F20.制程能力process capability21.建议，暗示suggest22.确保ensure23.满足,达到meet24.为了in order to25.交货期delivery date26.绿油桥solder mask bridge 或者solder mask dam27.根据according to28.单边3mil per side 3 mil29.直径diameter30.半径radius 31.小于3mil less than 3mil32.高于3mil more than 3 mil33.压合结构stacking structure 或者stack_up34.附件：attached file35.样品：sample36.文档：Document37.答复：answer; reply38.规格：spec39.与.。
同样的：the same as40.前版本：previous version（old version）41.生产：production42.确认：confirm43.再次确认:confirm again44.工程问题：engineering query（EQ）45.尽快：as soon as possible46.生产文件：production Gerber47.联系某人：contact somebody48.提交样板：submit sample49.交货期：delivery date50.电测成本：ET(electrical test）cost51.通断测试：Open and short testing52.参考：refer to53.IPC标准：IPC standard54.IPC二级：IPC class 255.可接受的：acceptable56.允许：permit57.制造:manufacture 或者fabricate58.修改：revision59.公差：tolerance60.忽略：ignore61.工具孔：tooling hole62.安装孔:mounting hole63.元件孔：component hole64.槽孔：slot hole65.邮票孔:snap off hole 或者stamp hole66.导通孔：via hole67.盲孔：blind via hole68.埋孔:buried via hole69.金属化孔：PTH(plated through hole)70.非金属化孔：NPTH（no plated through hole）71.孔位:hole location72.避免：avoid73.原设计:original design74.修改：modify75.按原设计：follow up original design76.附边：waste tab，waste area 或者breakaway tab77.铜条：copper strip78.拼板：panel drawing79.板厚：board thickness80.删除：remove(delete)81.削铜：shave the copper82.露铜：copper exposure 或者exposed copper83.光标点：fiducial mark84.不同:be different from（differ from）85.内弧:inside radius86.焊环：annular ring87.单板尺寸：single size88.拼板尺寸：panel size89.铣,锣：routing90.铣刀:router 或者Routing bit91.楔形掏槽V—cut 或者V scoring92.哑光：matt93.光亮的：glossy94.锡珠：solder ball（solder plugs）95.阻焊：solder mask(solder resist)96.阻焊开窗：solder mask opening 97.单面开窗：single side mask opening98.补油：touch up solder mask99.补线:track welds100.毛刺：burrs101.去毛刺：deburr102.镀层厚度：plating thickness103.清洁度：cleanliness104.离子污染:ionic contamination105.阻燃性等级:flammability retardant rating 106.黑化：black oxidation107.棕化：brown oxidation108.红化：red oxidation109.可焊性不良：poor solderability110.焊料:solder111.包装:packaging112.角标：corner mark113.特性阻抗:characteristic impedance 114.正像：positive115.负片：negative116.镜像：mirror117.线宽:line width 或者trace width118.线距：line spacing 或者trace spacing 119.做样：build sample120.按照：according to121.成品:finished122.做变更：make the change123.相类似：similar to124.规格：specification125.下移：shift down126.垂直地：vertically127.水平的:horizontally128.增大：increase129.缩小：decrease130.表面处理：Surface Finishing131.波峰焊：wave solder132.钻孔数据：drilling data133.标记：Logo134.Ul 标记：UL logo,或者Ul Marking135.蚀刻标记：etched marking136.周期：date code137.翘曲：bow and twist138.外层:outer layer 或者external layer139.内层：inner layer 或者internal layer140.顶层:top layer141.底层:bottom layer142.元件面:component side143.焊接面:solder side144.阻焊层：solder mask layer145.字符层：legend layer (silkscreen layer or over layer) 146.兰胶层：peelable SM layer147.贴片层：paste mask layer148.碳油层：carbon layer149.外形层：outline layer（profile layer）150.白油：white ink151.绿油：green ink152.喷锡：hot air leveling (HAL)153.电金,水金：flash gold154.插头镀金：plated gold edge-board contacts155.金手指：Gold-finger156.防氧化：Entek （OSP）157.沉金：Immersion gold （chem. Gold）158.沉锡:Immersion Tin(chem.Tin）159.沉银：Immersion Silver （chem。
线路板PCB专业英语词汇(制造、测试、缺陷名等)
热固性
Clad
覆箔
Layup
叠层
laminating
层压
Postcure
后固化
Curing time
固化时间
Resinflow
树脂流动度
Resin content
树脂含量
PCB英语词汇（二）
3 设计
3.1 通用术语
Computer-aided design (CAD)
计算机辅助设计
导线宽度/ቤተ መጻሕፍቲ ባይዱ距
Conductor layer
导线层
Component hole
元件孔
Mountinghole
安装孔
Supported hole
支撑孔
Unsupported hole
非支撑孔
Via
导通孔
Plated through hole
镀通孔
Blind via (hole)
盲孔
Buried via (hole)
消泡剂
resolution
分辨率
definition
逼真度
ghost image
重影
halation
晕环
air inclusion
夹杂气泡
tackiness
粘着性
post cure
后固化
shelf life
保存期
pot life/ working life
适用期
dip coating
浸涂法
roller coating
网版印刷
Silk screen
丝印网版
Stencil
网版
Screenability
PCB综合词汇
PCB综合词汇中英文对照：一、线路板名词二、材料（主要原材料）三、设备四、流程五、品质六、其他一、线路板名词印制电路板：printed circuit board (PCB)印制线路板：printed wiring board(PWB)单面印制电路板：single-sided printed circuit board双面印制电路板：double-sided printed circuit board多层印制电路板：multilayer printed circuit board刚性印制电路板：rigid printed circuit board刚性多层印制电路板：rigid multilayer printed circuit board挠性印制电路：flexible printed circuit (FPC)挠性多层印制电路板：flexible multilayer printed circuit board刚挠性印制电路板：rigid-flex printed circuit board刚挠性多层印制电路板： rigid-flex multilayer printed circuit board 高密度互连：High Density Interconnection (HDI)背板：backplane埋电阻板：buried resistance board二、材料（主要原材料）基底：substrate基材：base material层压板：laminate覆铜箔层压板：copper-clad laminate (CCL)双面覆铜箔层压板：double-sided copper-clad laminate复合层压板：composite laminate薄层压板：thin laminate预浸材料（PP片）：prepreg干膜：dry film湿膜：solder mask环氧玻璃基板：epoxy glass substrate覆盖层：cover layer (cover lay)增强板材：stiffener material导电箔：conductive foil铜箔：copper foil电解铜箔：electrodeposited copper foil (ed copper foil)压延铜箔：rolled copper foil薄铜箔：thin copper foil玻纤布 glass fiber酚醛树脂 Phenolic Resin环氧树脂 Epoxy Resin探针 Probe铝 aluminum铣刀 milling cutter销钉 pin钻咀 bit三、设备plotter 光绘机developer 显影机layer laminator 层压机exposure machine 曝光机developer etch stripper DES线(显影、蚀刻、褪膜）punch 冲床AOI Automatic Optical Inspection 自动光学检测dryer oven 烘箱black oxide line 黑化线vacuum dryer oven 真空干燥机press hot 热压press cold 冷压plating line 电镀线brushing machine 刷板机beveling machine 斜边机x-ray driller x-ray钻孔机drilling machine 钻孔机routing machine 捞机v-cut machine v-cut机brushing machine with high pressure 高压清洗机plasma etch machine 等离子蚀刻机PTH plating PTH电镀copper plating 镀铜solder exposure machine 防焊曝光机dryer oven 烘箱solder development machine 防焊显影机chemical clean HAL 化学清洗HALhot air leveling machine (HAL) 热风整平机cleaner after HAL HAL后清洗机silver horizontal line 水平沉银线electrical test 电测electrical test probe 电测探针physics lab 物理实验室titrator 滴定器reliability lab 稳定性测试实验室microscope 显微镜GENESIS SYSTEM GENESIS系统四、流程流程简介：开料－－钻孔－－干膜制程－－压合－－减铜－－电镀－－塞孔－－防焊(绿漆/绿油)－－镀金－－喷锡－－成型－－开短路测试－－终检－－雷射钻孔A. 开料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size)B. 钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)C. 干膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)c-10 显影(Developing )c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating)f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低于1 mil ( Less than 1 mil Thickness )f-4 高于1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(绿漆/绿油): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester)l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘( Warpage Remove)m-2 X-OUT 印刷(X-Out Marking)m-3 包装及出货(Packing & shipping)m-4 目检( Visual Inspection)m-5 清洗及烘烤( Final Clean & Baking)m-6 护铜剂(ENTEK Cu-106A)(OSP)m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test) m-8 冷热冲击试验(Thermal cycling Testing)m-9 焊锡性试验( Solderability Testing )N. 雷射钻孔(Laser Ablation)N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)N-2 雷射曝光对位孔(Laser Ablation Registration Hole)N-3 雷射Mask制作(Laser Mask)N-4 雷射钻孔(Laser Ablation)N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching)N-7 除胶渣(Desmear)N-8 微蚀(Microetching )五、品质Open Circuit 开路Short Circuit 短路PCB Damaed 板损坏Lead Broken 线路折断Lead Peel-off 甩线Conductor Width Out By +/_20% 导体宽度超出+/_20%Spacing Under Requirment 间距低于要求Circuit Void 线路穿孔Nick 线路崩缺Plating Void 电镀穿孔PTH V oid 金属孔壁穿孔Discolouration 镀层变色Non PTH Becomes PTH 孔壁金圈Smear 渗镀Nickel Exposed 露镍Dull Colour 哑色Two Tones Colour 板面阴阳色Rough Plating 电镀层粗糙Burn 电镀烧板Rough Hole Wall 孔壁粗糙V oid in PTH 孔内露基材Copper Expose 露铜Solder Mask Bleed on Pad 阻焊剂上焊盘Solder Mask V oid/Lack 阻焊剂穿孔/不足Foreign Matter on Board/Under S/M 板面有外物/绿油下杂物I.C Barrier Broken IC栏断裂Circuit Exposed 露线S/M Residue 绿油冲不净S/M In Hole 孔内有绿油S/M Peel-off 甩绿油S/M Shift 绿油印歪I.C Barrier Shift IC偏位Hole Shift / Cavity Shift 偏孔/镗孔偏位Extra Hole / Missing Hole 多孔/漏孔Oval Hole 椭圆形孔Damage Hole 孔损坏Incomplete Drilling 未钻穿Block Hole 塞孔Hole Undersign 孔小Mispunching / Misrouting 啤坏/锣坏Burrs 披锋/毛刺Damage Caused By Milling 镗坑过度Punching/Routing Particles on Board 板面有粉/碎末Under Etching 蚀板不足Over Etching 蚀板过度Conlamination / Board Dirty 污染/板污Microcrack 轻微裂纹Scratches 擦花Dents /Pin Holes 压凹/针孔Pitting 砂孔Warp and Twist 板曲Texture Exposure/White Spot 织纹/纤维显露/白点Gum on Board / Pen Mark 板面胶/笔渍Poor Rework 修理不良Links 绒毛"X"Board 前工序打记号报废Rough Solder 锡面粗糙Exessive Solder 锡高Tamish Solder 锡面灰Solder on Circuit 线路上锡Solder on G/F 金手指上锡Solder Ball 锡珠Tamish Solder in Hole 灰孔Black Hole 黑孔Rough Solder on Pad 焊盘起砂Solder Chip 锡渣Solder Bleeding 锡拉尖Solder Discoloration 锡面颜色不良NPTH Become PTH and solder in hole 非沉铜孔有铜及铅锡六、其他1、Batch 批指在同时间发料某一数量的板子，是以整体方式在制程中及品检中进行作业，称为"生产批"或"检验批"。
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A aA.O.I(Automatic Optical Inspection)自动光学检查Acceptable quality level (AQL)可接受质量水平Accuracy精确度Activating活化Active carbon treatment活性碳处理After Pressed Thickness压板后之厚度Alignment校直，结盟Annular ring锡圈Anti-Static Bag静电胶袋Apparatus设备，仪器Area面积Artwork菲林Artwork Drawing菲林图形Artwork Film原装菲林Artwork Modification菲林修改Artwork No.菲林编号Assembly组装，装配Axis轴B bBackplane背板Back-up垫板Baking 烘板Ball Grid Array (BGA)球栅阵列Bare board裸板Base Copper底铜Base material基材Bevelling斜边Black Oxide黑氧化Blind via hole盲孔Blistering起泡/水泡Board Cutting开料Board Thickness板厚Bottom side底层Breakaway tab打断点Brushing磨刷Build-up积层Bullet pad子弹盘Buried hole埋孔C cC/M(Component Marking)元件字符Carbon ink碳油Carrier带板Ceramic substrate陶瓷Certificate of Compliance合格证书Chamfer倒角Chemical cleaning化学清洗Chemical corrosion化学腐蚀Chip Scale Package (CSP)晶片比例包装Circuit线路Clearance间距/间隙Color颜色Component Side(C/S)元件面Composite layers复合层Computer Aided Design (CAD)电脑辅助设计Computer Aided Manufacturing (CAM)电脑辅助制作Computer Numerial Control (CNC)数控Conductor导体Conductor width/space导体线宽/线隙Contact接点Copper area铜面积Copper clad铜箔Copper foil铜箔Copper plating0电镀铜Corner角线Corner mark板角记号Corner REG.Hole角位对位孔Cracking裂缝Creasing皱折Criteria规格,标准Crossection area切面Cu/Sn Plating镀铜锡Current efficiency电流效率Customer客户Customer Drilling File客户钻孔资料Customer P/N客户产品编号D dD/F Registration Hole干菲林对位孔D/F(Dry Film)干膜Date Code日期代号Datum hole基准参考孔Daughter board子板Deburring去毛刺Defect缺陷Definition定义Delamination分层Delay耽搁Delivery交货Densitomefer透光度计Density密度Department部门Description说明Design origin设计原点Desmear去钻污,除胶Dessicant防潮珠Developer显影液,显影机Diamond钻石Diazo film重氮片Dielectric breakdown介电击穿Dielectric constant介电常数Dielectric Thickness介电层厚度Dielectric Voltage Test绝缘测试Dimension尺寸Dimensional stability尺寸稳定性Direct/indirect直接/间接Distribution发放Document type文件种类Documentation Control文件控制Double sided board双面板Drill bit钻咀Drilling钻孔Drilling Roughness钻孔粗糙度Dry Film 干菲林Dry Film-Pattern干膜线路Dynamic动态okE eECN(Engineering Change Notification)工程更改通知Effective date有效期Electrical Test Fixture电测试 针床Electro migration漏电Electroconductive paste导电胶Electroless无电沉Electroless copper无电沉铜Electroless Ni无电沉镍Electroless Gold/Au无电沉金Engineering drawing工程图纸Entek有机涂覆Epoxy glass substrate环氧玻璃基板Epoxy resin环氧基树脂Etch蚀刻Etchback凹蚀Etching蚀刻E-Test Marking电测试标记E-Test(Electrical Test)电测试Exposure曝光External layer外层F fFiducial mark基准点Filling填充Film Fabrication菲林制作Final QC最终检查Finish Overall Board Thickness成品总板厚度Fixture夹具Flammability可燃性Flash Gold薄金Flexible易曲的,能变形的Flux助焊剂G gGeneral information一般资料Ghost image重影Glass transition temperature玻璃化湿度Gold Finger(G/F)金手指Golden board金板Grid网格Ground plane地线层H hHAL(Hot Air Leveling)热风整平Hand Rout手锣Hardness硬度Heat Sealed热密封Heat Shrink-warp热收缩Holding time停留时间Hole孔Hole breakout破环Hole density孔的密度Hole Diameter孔径Hole location孔位Hole Location Chart孔位坐标表Hole Position Tolerance孔位误差Hole size孔尺寸Hot Air Leveling(HAL)热风整平Humidity湿度IIdentification标识,指标Image影像Imaging transfer图形转移Impedance阻抗Impedance Test阻抗测试Inner copper foil 内层铜箔Inspection检验Insulation resistance Test绝缘测试Inter Plane Separation内层分离Interleave Paper隔纸Internal layer内层Internal stress内应力Ionic cleanliness离子清洁度Isolation孤立Isolation Resistance绝缘电阻Item项目K kKEY board按键盘Key slot槽孔Kraft paper牛皮纸L lLaminate板材Laminate Thickness材料厚度Lamination void 层间空洞Landless hole破孔Laser plotter激光绘图机Laser plotting激光绘图Laser via hole激光穿孔Layup层压配本Lay-up Instruction压板指示Legend字符Legend Width字符宽度Length长度Lifted Lands残铜Line Width线宽Liquid液体Location位置Logic diagram逻辑图形Logo唛头,标记Lot size批卡M mMark标记Master drawing菲林图形Material Thickness材料厚度Material Type材料类型Max. X-out坏板上限Max.Board Thickness After Plating电镀后总板厚度之上限Measling白斑Mech Drawing No.图纸编号Mechanical cleaning机械清洗Metal金属Method方法MI(Manufacturing Instruction)生产制作指示Microstrip微条线Min Conductor Copper Thickness最小线路铜厚Min Hole Wall Copper Thickness最小孔壁铜厚Min. Gold Plating Thickness最小金厚Min. Nickel Thickness最小镍厚Min. Tin-Lead Thickness (After HAL)（喷锡后）最小锡厚Min.Annular Ring最小环宽Min.Spacing between Line to Line线与线之间的最小距离Min.Spacing between Line to Pad线与焊盘之间的最小距离Min.Spacing between Pad to Pad焊盘与焊盘之间的最小距离Minimum 最小Mirroring镜像Missing 缺少Model No.产品名称Molded模塑Mother board主板Moulding模房Mounting hole安装孔Multilayer多层板Multi-layer Laminate多层板材料N nNegative反面的Net list网络表Network网络Nick缺口No. of holes孔数No.of Array/Panel每个拼板套板数No.of Panel per Stack每叠板数No.of Panel/Sheet每张大料拼板数No.of Pcs Per Bag每包数量No.of Unit/Array每套单元数Normal value标准值O oOblong椭圆形的Offset 偏移Open/short开路/短路Optimization(design)最佳化(设计)Organic Solerability Peservatives(OSP)有机保护剂Originator原作者Outer copper foil外层铜箔Outline外形P pPacking包装Packing包装Pad焊盘Panel Area拼板面积Panel Plated Crack板镀缺口Panel plating整板电镀Panel Size拼板尺寸Panel Size After Outerlayer Cutting外层切板后拼板尺寸Panel Utilization拼板利用率Pass rate通过率Passivation钝化Pattern线路Pattern Inspection线路检查Pattern plating图形电镀PCB(Printed Circuit Board)印制线路板Peck drilling啄钻Peel strength 剥离强度Peelable可剥性Peelable 剥离强度Peelable Mask可脱油Peeling剥离Permanent永久性PH value PH值Photo plotting图形输出Photo via hole菲林过孔Photographers照片靶标Photoplotler光绘机Physical物理的Pin hole销定孔Pink ring粉红环Pinning hole钻孔管位Pitch间距Placement放置Plated Though Hole(PTH)沉铜Plating电镀Plating Crack电镀裂缝Plating line电镀线Plating rack电镀架Plating Void电镀针孔Plug Hole塞孔Polymer聚合体Porosity孔隙率Positive绝对的Power plane电源层Prepreg半固化片Primary side首面Print印刷Probe point针床测点Process工序Process flow工序流程Product Planning Dept.生产计划部Production生产板Profile外形Profiling 外形加工Profiling Process外形加工Project No.产品编号PTH Thermal Stress Test PTH热冲击测试PTH(Plating Through Hole)沉铜Pull away拉离Punch啤模Punching冲切Punching Mould Drawing啤模图形Q qQA Audit品质审计QA(Quanlity Assurance)品质部Quad Palt Pack (QFP)四边扁平林整器件Quality质量Quantity数量R rRaw Material Utilization原材料利用率Recall回收Rectifier整流器Register mark对位点Registration重合点Remark备注Resin树脂Resin Recession流胶Resist抗蚀剂Resolution分辨率Rigid精密的Roller coating涂覆Roughening粗化Round pad圆盘Routing外形加工,铣板S sS/M Material绿油物料S/M(Solder Mask)阻焊Sales 销售Sample样板Sampling inspection抽样检验Scaling factor缩放比例因素Scope范围Scoring刻槽Scratch划痕Secondary side第二面Section Code组别代号Section Code Change组别代号更改Segment部分,片段Separated分离Sequence顺序Sets套Sheet Size大料尺寸Shematic diagram原理图Shiny有光泽的,发光的Silk screen丝印Silver film银盐片Single/double单层/双面Slot 槽,坑Smear污点Solder Mask阻焊Solder mask on bare copper (smobc)裸铜覆盖阻焊膜Solder side焊接面Solder Side C/M阻焊面字符Solder Side Cir.焊接面线路Solder Side Circuit焊接面Solder Side S/M焊接面阻焊Solderability可焊性Solvent Test可溶性测试Spacing线距Special requirement 特殊要求Specification详细说明，规范Spindle主轴Split裂片Square pad方块Standard标准值Static静态Stencial网版Step drilling分布钻Step scale光梯尺Store货仓Supplier供应商Supported hole支撑点Surface表面Surface mount technology表面组装技术Swimming滑移T tTack堆起Tape Programming铬带制作Tape Test胶带测试Target Hole目标孔Teardrop 泪珠Template天平Tenting封孔Test测试Test coupon图样Test Parameter测试参数Test Pattern测试孔Testing Voltage电压Thermal shock热冲击Thermal stress热应力Thickness厚度Tin Content锡含量Tin/Lead Stripping退铅锡Tin-lead plating电镀铅锡Tolerance公差Top side板面Touch up修理(执漏) Training训练Transmission传输线Transmittance传送Trim line修剪U uUltrasonic cleaning超声波清洗Undercut侧蚀Unit Arrangement单元排版Unit Layout Per Panel单元拼板图Uv-blocking 阻挡紫外线V vVacunm Pack真空包装Vacuum lamination真空压制V-Cut V- 坑View From…观察方向由…Visual & Warpage可视性和翘曲度Visual inspection目检Voltage 电压W wW/F(Wet Film)湿膜Warp & Twist翘曲和弯曲Wet Film湿模Width宽度Wiring线路。