硅片行业术语大全中英文对照I-Z
IC制程专业词汇
1.•Vt could drops or c limbs as gate length shrinks à Short Channel Effect or Reverse Short Channel Effect.2•Vt could drops or climbs as AA width shrinks àNarrow width Effect or Reverse Narrow Width Effect.3•Channel profile determines SCE and RSCE.4•Isolation structure and channel profile determines NWE and RNWE.ASIC: 专用集成电路application specific ICW/S:width/spaceSTI: shallow slot isolationSlurry泥浆, 浆Pad 衬垫RTI 实时检测SC specially characteristic 关键属性Numerical Aperture（N.A.）數值孔徑LDD: low dose drain 轻掺杂漏极: to supperess the SCEATPG:auto test pattern generatorADI: After Developing InspectionDIBL (Drain Induced Barrier Lowering)GIDL(gate induced drain leakage)PSM phase-shift mask 相移掩膜技术SC1 standard clean 1SC2 standard clean 2FEOL front-end of lineBEOL back-end of lineDIBL: drain induced barrier lowerGIDL: drain induced drain leakageSCE: short channel effectSAC oxide: sacrifice oxideDARC: dielectric anti-reflective coating 无机物; barc & tarc bottom and top 有机物SDE:source/drain-extensionRCA : SC1 + SC2Caro:3号液：PRRM: PhotoResist ReMoveEKC : EKC 270T (solvent name)APM，SPM，HPM的主要成分，除何种杂质；HF的作用。
硅片行业术语大全(中英文对照+A-Z)
一、硅片行业术语大全(中英文对照A-H)Acceptor - An element, such as boron, indium, and gallium used to create a free hole in a semiconductor. The acceptor atoms are required to have one less valence electron than the semiconductor.受主- 一种用来在半导体中形成空穴的元素，比如硼、铟和镓。
受主原子必须比半导体元素少一价电子Alignment Precision - Displacement of patterns that occurs during the photolithography process.套准精度- 在光刻工艺中转移图形的精度。
Anisotropic - A process of etching that has very little or no undercutting各向异性- 在蚀刻过程中，只做少量或不做侧向凹刻。
Area Contamination - Any foreign particles or material that are found on the surface of a wafer. This is viewed as discolored or smudged, and it is the result of stains, fingerprints, water spots, etc.沾污区域- 任何在晶圆片表面的外来粒子或物质。
由沾污、手印和水滴产生的污染。
Azimuth, in Ellipsometry - The angle measured between the plane of incidence and the major axis of the ellipse.椭圆方位角- 测量入射面和主晶轴之间的角度。
硅片行业术语大全中英文对照I-Z
硅片行业术语大全(中英文对照 I—Z）Ingot — A cylindrical solid made of polycrystalline or single crystal silicon from which wafer s are cut。
晶锭—由多晶或单晶形成的圆柱体，晶圆片由此切割而成.Laser Light—Scattering Event — A signal pulse that locates surface imperfections on a wafer。
激光散射 - 由晶圆片表面缺陷引起的脉冲信号。
Lay — The main direction of surface texture on a wafer。
层—晶圆片表面结构的主要方向。
Light Point Defect (LPD）（Not preferred； see localized light-scatterer) 光点缺陷（LPD）（不推荐使用，参见“局部光散射"）Lithography — The process used to transfer patterns onto wafer s.光刻—从掩膜到圆片转移的过程。
Localized Light—Scatterer —One feature on the surface of a wafer， such as a pit or a scratch that scatters light. It is also called a light point defect。
局部光散射—晶圆片表面特征,例如小坑或擦伤导致光线散射，也称为光点缺陷。
Lot —Wafer s of similar sizes and characteristics placed together in a shipment。
批次—具有相似尺寸和特性的晶圆片一并放置在一个载片器内.Majority Carrier - A carrier, either a hole or an electron that is dominant in a specific region, such as electrons in an N—Type area。
硅片行业术语大全
使节光伏产业链各环节主要制造商和分布一览太阳能产业示意图太阳能产业示意图中国高纯多晶硅材料生产和投资现状一览表中国高纯多晶硅材料生产和投资现状一览表（含已有产能和在建、拟建项目）中国高纯多晶硅材料生产和投资现状一览表国外硅片供应商大全国外硅片供应商大全(转载)/sites/start/start.htm /default.asphttp://www.rasa.co.jp硅片行业术语大全Acceptor - An element, such as boron, indium, and gallium used to create a free hole in a semiconductor. The acceptor atoms are required to have one less valence electron than the semiconductor.受主- 一种用来在半导体中形成空穴的元素，比如硼、铟和镓。
受主原子必须比半导体元素少一价电子Alignment Precision - Displacement of patterns that occurs during the photolithography process. 套准精度- 在光刻工艺中转移图形的精度。
Anisotropic - A process of etching that has very little or no undercutting各向异性- 在蚀刻过程中，只做少量或不做侧向凹刻。
Area Contamination - Any foreign particles or material that are found on the surface of a wafer. This is viewed as discolored or smudged, and it is the result of stains, fingerprints, water spots, etc. 沾污区域- 任何在晶圆片表面的外来粒子或物质。
硅片行业术语大全
EdgeProfile-Theedgesoftwobondedwafersthathavebeenshapedeitherchemicallyorme chanically. 光伏材料设备网 边缘轮廓-通过化学或机械方法连接起来的两个晶圆片边缘。 pv001·net
沾污颗粒-晶圆片表面上的颗粒。 光伏网
CrystalDefect-Partsofthecrystalthatcontainvacanciesanddislocationsthatcanha veanimpactonacircuit’selectricalperformance. pv001·net 晶体缺陷-部分晶体包含的、会影响电路性能的空隙和层错。 pv001
硅片行业术语大全（中英对照）
2010-11-1516:19:00 来源：互联网
Acceptor-Anelement,suchasboron,indium,andgalliumusedtocreateafreeholeinasem iconductor.Theacceptoratomsarerequiredtohaveonelessvalenceelectronthanthese miconductor. 光伏网 受主-一种用来在半导体中形成空穴的元素，比如硼、铟和镓。受主原子必须比半导体 元素少一价电子
Bipolar-Transistorsthatareabletousebothholesandelectronsaschargecarriers. ww
硅片硅片大全（中英文对照I-Z）
分享举报| 硅片行业术语大全(中英文对照 I-Z)热9徐静文 2009-12-31 15:03硅片行业术语大全(中英文对照 I-Z)硅片行业术语大全(中英文对照 I-Z)In got - A cy lindr icalsolid made of p olycr ystal lineor si nglecryst al si licon from whic h waf ers a re cu t.晶锭 - 由多晶或单晶形成的圆柱体，晶圆片由此切割而成。
L aserLight-Scat terin g Eve nt -A sig nal p ulsethatlocat es su rface impe rfect ionson awafer.激光散射 -由晶圆片表面缺陷引起的脉冲信号。
La y - T he ma in di recti on of surf ace t extur e ona waf er. 层 - 晶圆片表面结构的主要方向。
L ightPoint Defe ct (L PD) (Not p refer red;see l ocali zed l ight-scatt erer)光点缺陷(LPD) （不推荐使用，参见“局部光散射”）Lith ograp hy -The p roces s use d totrans fer p atter ns on to wa fers.光刻- 从掩膜到圆片转移的过程。
Loca lized Ligh t-Sca ttere r - O ne fe ature on t he su rface of a wafe r, su ch as a pi t orascr atchthatscatt ers l ight. It i s als o cal led a ligh t poi nt de fect.局部光散射 -晶圆片表面特征，例如小坑或擦伤导致光线散射，也称为光点缺陷。
silicon profile翻译
silicon profile翻译硅材料简介硅是一种广泛使用的半导体材料，其化学符号为Si。
它是地壳中第二丰富的元素，占地壳总质量的约27%。
硅具有很高的热导率和电导率，因此被广泛用于制造电子器件和太阳能电池等应用中。
硅材料的用途广泛，以下是一些常见的应用和中英文对照例句：1. 电子器件制造：硅是制造集成电路和晶体管等电子器件的基本材料。
- Silicon wafers are used as substrates for manufacturing microchips. (硅晶圆用作微芯片的基片。
)- Silicon-based transistors revolutionized the field of electronics. (基于硅的晶体管彻底改变了电子领域。
)2. 太阳能电池：硅材料是太阳能电池的主要组成部分，用于将太阳能转化为电能。
- Silicon solar cells are widely used in renewable energy systems. (硅太阳能电池广泛应用于可再生能源系统中。
)- The efficiency of silicon-based solar panels has greatly improved in recent years. (基于硅的太阳能电池板的效率近年来有了很大提升。
)3. 光学材料：硅具有良好的透明性和光学特性，被用于制造光学器件和光纤等。
- Silicon lenses are used in cameras and optical instruments. (硅透镜用于相机和光学仪器中。
)- Silicon-based optical fibers are widely used for high-speed data transmission. (基于硅的光纤广泛用于高速数据传输。
)4. 化工行业：硅材料可以制备许多化学品和合成材料。
多晶硅英文术语
多晶硅技术英语词汇（原创）
English-Chinese Glossary List for PCS Technology
多晶硅技术涉及冶金、半导体材料、化工、机械、热能、电子等各个专业的交叉，在国外多晶硅行业对其中的许多专有词汇有专门的说法，国内目前还没有多晶硅专业词汇出版，以致国内的业界人士在进行多晶硅项目国际合作时使用了很多Chinese English，造成沟通上的误解。
博主通过近几年和国外同行大量的交流，将多晶硅行业专用的英语词汇进行了整理，供业内的朋友参考使用。
由于时间关系，本词汇先粗略发布，日后会不断地充实完善。
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硅片行业术语大全(中英文对照I-Z)Ingot - A of polycrystalline or single crystalsilicon from are cut.晶锭 - 由多晶或单晶形成的圆柱体，晶圆片由此切割而成。
- A signal pulse that locates surfaceimperfections on激光散射 -由晶圆片表面缺陷引起的脉冲信号。
Lay - The main direction of surface texture on a层 - 晶圆片表面结构的主要方向。
Light Point Defect (LPD) (Not preferred; see localized light- scatterer)光点缺陷(LPD)（不推荐使用，参见“局部光散射”）Lithography - The process used to transfer patterns onto wafer s.光刻 - 从掩膜到圆片转移的过程。
Localized Light-Scatterer - One feature on the surface of asuch as a pit or a scratch that scatters light. It is also called a light point defect.局部光散射-晶圆片表面特征，例如小坑或擦伤导致光线散射，也称为光点缺陷。
of similar sizes and characteristics placed together in a shipment.批次 - 具有相似尺寸和特性的晶圆片一并放置在一个载片器内。
Majority Carrier- A carrier,either a hole or an electron that is dominant in a specific region, such as electrons in an N-Type area. 多数载流子-一种载流子，在半导体材料中起支配作用的空穴或电子，例如在N 型中是电子。
Mechanical Test Wafer - A silicon wafer used for testing purposes.机械测试晶圆片-用于测试的晶圆片。
Microroughness- Surface roughness with spacing between theimpurities with a measurement of less than 100 μm.微粗糙 - 小于100微米的表面粗糙部分。
Miller Indices,of a Crystallographic Plane - A system that utilizes three numbers to identify plan orientation in a crystal.Miller索指数-三个整数，用于确定某个并行面。
这些整数是来自相同系统的基本向量。
Minimal Conditions or Dimensions- The allowable conditions for determining whether or not a wafer is considered acceptable.最小条件或方向-确定晶圆片是否合格的允许条件。
Minority Carrier- A carrier,either a hole or an electron that is not dominant in a specific region, such as electrons in a P-Type area.少数载流子-在半导体材料中不起支配作用的移动电荷，在P型中是电子，在N型中是空穴。
Mound - A raised defect on the surface of a wafer measuring more than 0.25 mm.堆垛 - 晶圆片表面超过0.25毫米的缺陷。
Notch - An indent on the edge of a wafer used for orientation purposes.凹槽 - 晶圆片边缘上用于晶向定位的小凹槽。
Orange Peel-A roughened surface that is visible to the unaided eye.桔皮 - 可以用肉眼看到的粗糙表面Orthogonal Misorientation -直角定向误差-Particle - A small piece of material found on a wafer that is not connected with it.颗粒 -Particle Counting -used to test tools for particle contamination.颗粒计算 -用来测试晶圆片颗粒污染的测试工具。
Contamination - Particles found on the surface of abright points when a collineated light isshined on the颗粒污染 -晶圆片表面的颗粒。
Pit - A non-removable imperfection found on the surface of a深坑 - 一种晶圆片表面无法消除的缺陷。
Point Defect-A crystal defect that is an impurity,such as alattice vacancy or an interstitial atom.点缺陷 - 不纯净的晶缺陷，例如格子空缺或原子空隙。
Preferential Etch -优先蚀刻 -Premium Wafer - A wafer that can be used for particle counting, measuring pattern resolution in the photolithography process, andmetal contamination monitoring. This wafer has very stricta specific usage, but looser specifications thanthe prime测试晶圆片-影印过程中用于颗粒计算、测量溶解度和检测金属污染的晶圆片。
PrimaryOrientation Flat - The longest flat found on the wafer. -晶圆片上最长的定位边。
Process Test Wafer - A wafer that can be used for processes as wellas area cleanliness.加工测试晶圆片-用于区域清洁过程中的晶圆片。
Profilometer-A tool that is used for measuring surface topography.表面形貌剂-一种用来测量晶圆片表面形貌的工具。
Resistivity(Electrical) - The amount of difficulty that chargedcarriers have in moving throughout material.电阻率（电学方面） - 材料反抗或对抗电荷在其中通过的一种物理特性。
Required -The minimum specifications needed by the customer when ordering wafer s.必需 - 订购晶圆片时客户必须达到的最小规格。
Roughness - The texture found on the surface of the wafer that is spaced very closely together.粗糙度 - 晶圆片表面间隙很小的纹理。
Saw Marks-Surface irregularities锯痕 - 表面不规则。
Scan Direction-In the flatness calculation, the direction of the subsites.扫描方向 -平整度测量中，局部平面的方向。
Scanner Site Flatness -局部平整度扫描仪-Scratch - A mark that is found on the wafer surface.擦伤 - 晶圆片表面的痕迹。
Secondary Flat-A flat that is smaller than the primary orientationwafer is,and also the orientation of the第二定位边-比主定位边小的定位边，它的位置决定了晶圆片的类型和晶向。
Shape -形状 -Site - An area on the front surface of the wafer that has sides parallel and perpendicular to the primary orientation flat. (This area is rectangular in shape)局部表面 -晶圆片前面上平行或垂直于主定位边方向的区域。
Site Array-a neighboring set of sites局部表面系列-一系列的相关局部表面。
Site Flatness-局部平整 -pattern of small ridges found on the surface of the划伤 - 晶圆片表面上的小皱造成的缺陷。
Smudge - A defect or contamination found on the wafer caused by fingerprints.污迹 - 晶圆片上指纹造成的缺陷或污染。
Sori -Striation-Defects or contaminations found in the shape of a helix. 条痕 - 螺纹上的缺陷或污染。
Subsite, of a Site - An area found within the site, also rectangular. The center of the subsite must be located within the original site.局部子表面-局部表面内的区域，也是矩形的。
子站中心必须位于原始站点内部。