手机摄像头模组生产工艺的SMT流程及SMT应用分析

手机摄像头模组生产工艺的SMT流程及SMT应用分析摘要随着通信技术的不断扩延，手机已成为人们生活、工作、学习、娱乐不可或缺的工具。

而手机摄像头模组是手机中非常重要的组件之一，其品质的好坏直接影响手机整体品质的高低。

因此在手机摄像头模组生产的过程中每一步都是要严格把关的，不能有丝毫的懈怠。

在手机摄像头模组中，FPC软电路板是决定手机照相生成图片的关键组件之一，因此它的生产工艺及质量好坏显得尤为重要。

基于此，首先简单介绍了手机摄像头模组原理以及SMT技术在手机摄像头模组生产工艺中的应用,着重阐述了手机摄像头模组FPC软电路板的改良设计和SMT生产工艺流程及产品质量分析。

根据手机摄像头模组FPC软电路板的具体要求，合理进行SMT技术指标优化，分析研究了手机摄像头模组再流焊SMT焊接温度分布曲线。

针对FPC软电路板产品设置了AIO （automatic optical inspection）检测及ICT在线测试方法。

关键字：手机摄像头模组 SMT AIO检测 ICT在线测试Mobile phone camera module production technology of SMT processesand SMT applicationABSTRACTSummary as communication technologies continues expansion, mobile phone has become the people's life, work, learn, play an indispensable tool. Mobile phone camera module is one of the very important components in the mobile phone, its quality directly affect the overall level of quality phones. In the mobile phone camera module production at every step in the process is to strictly, there can be no slack. Mobile phone camera module in the FPC flexible circuit board is to determine the key components of the camera phone picture, therefore its production process and the quality is particularly important. Based on this, the first simply introduced the mobile phone camera module principle and SMT technology and its application in mobile phone camera module production, focusing on mobile phone camera module is described FPC flexible circuit board design and analysis of SMT production process and product quality. According to mobile phone camera module FPC flexible circuit board requirements, reasonable SMT technical specifications, analysis of mobile phone camera module for reflow SMT soldering temperature distribution flexible circuit board set AIO products (automatic optical inspection) test online test methods and ICT.Keyword: mobile phone camera module;SMT;AIO ICT;on-line test目录摘要.................................................................... ABSTRACT ................................................................. 第一章引言............................................................手机摄像头模组简介 ...................................................原理..............................................................DSP芯片..........................................................连接方式 ...........................................................PCB板.............................................................SMT技术在手机摄像头模组生产工艺中的应用...........................FPC软电路板（PCB）的功能 ......................................SMT技术应用..................................................... 第二章手机摄像头模组改良设计......................................FPC/PCB布局设计.....................................................FPC/PCB线路设计.....................................................FPC/PCB工艺材质..................................................... 第三章手机摄像头模组FPC软电路板的SMT生产工艺流程 .........来料检测...............................................................锡膏印刷...............................................................主要技术指标 ................................... 错误!未定义书签。

印刷焊膏的原理..................................................锡膏检测 ...........................................................贴片...................................................................贴片机 ...........................................................贴片机的主要技术指标 ...........................................自动贴片机的贴装过程 ...........................................连续贴装生产时应注意的问题.....................................再流焊（Reflow soldring）..........................................再流焊炉的基本结构[7]............................................再流焊炉的主要技术指标.........................................再流焊工作过程分析..............................................再流焊工艺特点（与波峰焊技术相比） ...........................第四章手机摄像头模组FPC软电路板的SMT应用分析...............焊接及装配质量的检测..................................................AIO（automatic optical inspection）检测概述.................AOI检测步骤.....................................................ICT在线测试 ........................................................慨述............................................. 错误!未指定书签。

ICT在线测试步骤.................................................. 结束语.................................................................... 参考文献 ................................................................. 致谢.......................................................................第一章引言手机摄像头模组简介原理手机摄像头模组结构如图1-1所示：图1-1 手机摄像头模组的基本组成手机摄像头模组主要由镜头（lens），传感器（sensor），图像处理芯片（Backend IC），软电路板（FPC）四个部分组成。

其工作原理为：通过镜头拍摄景物，光学图像生成后投射到传感器上，再把光学图像被转换成电信号，模拟电信号经过模数转换变为数字信号，经过DSP加工处理，送到手机处理器中进行处理后转换成手机屏幕上能够看到的图像[1]。