Achieving higher levels of electronic integration through system-on-chip

Key Words: System-on-Chip, Multi-Chip Modules, Field Programmable Gate Arrays
1. INTRODUCTION
There are several methods of implementing systemon-chip, depending on how much money and time is available for the project. The ideal solution is a fullcustom system-on-chip with all its inherent advantages, but with significant disadvantages of longer time to market. Mixed signal systems can be implemented on a single chip with high-speed operation, low power and improved reliability. Fullcustom system-on-chip devices are not rad-hard and some form of shielding may be necessary, depending on the application, possibly using RADPAKTMor RAD-COATTMto mitigate the effects. Full-custom system-on-chip is the preferred option for a new design but the non-recurring engineering costs for these devices are very high and rising rapidly. A full custom system-on-chip may soon be too expensive to develop at around $450,000for a 0.18~ mask set giving a total for non-recurring engineering costs of $750,000, for all but the highest volume products.
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An alternative approach to system-on-chip is to use multi-chip modules [l] where very high levels of system integration can be achieved at a relatively low non-recurring engineering cost. Multi-chip modules are particularly appropriate for upgrading existing systems where pre-designed application specific integrated circuits or field programmable gate arrays can be used, in bare die form, to improve functional density. Multi-chip modules have similar advantages to full custom system-on-chip but with shorter time to market. Mama Marconi Space has
Abstract. All aerospace vehicles have the common constraint of limited space for the electronic systems. The challenge has always been how to pack effective electronic systems into the space available. Higher levels of electronic integration can give a competitive advantage, for example by providing extra channels in a communications satellite thereby increasing revenue to the operator. Today's deep sub-micron manufacturing processes for integrated electronics offer an opportunity for a step change for electronic functionality that can packaged in a given space. This technology makes possible, for the first time, a true System-on-Chip approach to electronic systems, which is already being exploited by the commercial sector in products such as the mobile telephone.
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creation of multi-chip modules design guidelines for future projects; evaluation of the project team structure and operation; identification and documentation of “lessons learned” from the mosaic earth sensor multichip module project.
Achieving Higher Levels of Electronic Integration Through System-onChip
DONALD J. DENTV
'Faculty of Science, Technology & Design, University of Luton, Luton, United Kingdom, LUl 3JU, Don.Dent@
2. CASESTUDY
The opportunity to undertake this case study [2] was given by the United Kingdom Department of Trade and Industry who sponsored the author on a senior academic in industry scheme at Matra Marconi Space’s Stevenage plant. The purpose of the SAIS scheme was to help Matra Marconi Space introduce new, state-of-the-art technology, in this case multichip modules [ I ] and field programmable gate arrays, to the industry. Case studies are a useful form of research in that they provide real results that can be analysed. Problems highlighted in such studies provide an opportunity to give guidance for future projects. In addition, the case study can be viewed as an experiment carried out under actual working conditions. The case study discussed here was used to assess and evaluate new electronic technologies, in particular multi-chip modules and field programmable gate arrays for the next generation of communication satellites. The author was part the multi-chip module project team consisting of the following personnel: project manager; 0 systems engineer, 0 application specific integrated circuit design engineer; multi-chip module design engineer; 0 test equipment engineer; commissioning and evaluation engineer. The author undertook the role of commissioning and evaluation engineer and was responsible for the following tasks: 0 commissioning of the test equipment printed circuit board; identification and correction of design faults in the test equipment printed circuit board; evaluation of test procedures for multi-chip modules; creation of guidelines for test procedures to be used on future multi-chip modules; commissioning of the mosaic earth sensor multi-chip module ; identification and correction of design faults in the mosaic earth sensor multi-chip module ;