PCB印制电路板以及HDI生产流程详细介绍.英文版概要

Pattern imaging Etching
Laminating
Drilling
5
Process Flow Chart (3) Desmear
Cu plating Hole plugging
Belt Sanding
Cu plating
6
Process Flow Chart (4) Pattern imaging
(乾膜)
32
22. 護形層製作 (曝光)(Conformal Mask)
Artwork
(底片)
Before Exposure
Artwork (底片)
After Exposure
33
23.護形層製作 (顯像)(Conformal Mask)
34
24. 護形層製作 (蝕銅) (Conformal Mask)
28
20. 蝕刻 Etch
29
20. 去乾膜 Strip Resist
30
21.壓合 (Build-up Layer Lamination)
RCC
(Resin Coated Copper foil)
31
21. 護形層製作 (壓膜)(Conformal Mask)
Dry Film (乾膜)
Dry Film
1
AGENDA
1. Detail Manufacturing
4-65
• Process Flow (Photo)
• HDI Products
2. Technology Roadmap for PCB & HDI 66-70 • Technology Roadmap • Process Capability
壓合機之熱板
10-12層疊合
20
10. 鑽孔 (Drilling)
鋁板 墊木板
21
11. 電鍍Desmear & Copper Deposition
22
12. 塞孔(Hole Plugging) 13. 去溢膠 (Belt Sanding)
23
14. 減銅 (Copper Reduction) → Option
Drilling
Surface Finished
Cu plating
Routing
Hole plugging Pattern imaging
Lamination Laser Ablation
Electric test Visual inspection
Shipping
4
Process Flow Chart (2) Pre-engineering
35
25.護形層製作(去膜) (Conformal Mask)
36
26. 雷射鑽孔 (Laser Ablation)及機械鑽孔
37
27. 機械鑽孔 (Mechanical Drill)
Laser Microvia (Blind Via)
Mechanical Drill (P.T.H.)
38
28. 電鍍(Desmear & Copper Deposition)
2
Process Flow
(PCB&HDI)
BACK
Pre-engineering
Process Flow Chart (1)
Mechanical drilling
Pattern imaging
Cu plating
Etching
Pattern imaging
Laminating
Solder Mask
TphreinprCegore ,FR-4
Thin Core ,FR-4 prepreg
COPPER FOIL 0.5 OZ
.
疊合用之鋼板
.
.
疊合用之鋼板
CprOePpPreEgR FOIL 0.5 OZ
TphreinprCegore ,FR-4
Thin Core ,FR-4 prepreg
COPPER FOIL 0.5 OZ 疊合用之鋼板
Lamination
Laser Ablation
Mechanical drilling
Cu plating
7
Process Flow Chart (5) Pattern imaging
Solder Mask
Gold plating
Routing
8
Electrical test
Process Flow Chart (6)
Etch Photoresist (D/F)
Photo Resist
12
3. 內層線路製作ห้องสมุดไป่ตู้曝光)(Expose)
A/W
Before Expose
Artwork (底片)
Artwork (底片)
Photo Resist
13
After Expose
4. 內層線路製作(顯影)(Develop) Photo Resist
15. 去溢膠 (Belt Sanding) → Option
24
16. 外層壓膜 Dry Film Lamination (Outer layer)
Photo Resist
25
17. 外層曝光 Expose
UV光 源
26
18. After Exposed
27
19. 外層顯影 Develop
14
5. 內層線路製作(蝕刻)(Etch) Photo Resist
15
6. 內層線路製作(去膜)(Strip Resist)
16
7.黑氧化 ( Oxide Coating)
17
8. 疊板 (Lay-up)
Layer 1 Layer 2 Layer 3 Layer 4
LAYER 1 LAYER 2 LAYER 3 LAYER 4 LAYER 5 LAYER 6
Visual inspection
Hole counter Shipping
9
1.內層基板 (THIN CORE)
裁板(Panel Size)
Laminate Copper Foil
COPPER FOIL
11
Epoxy Glass
2.內層線路製作(壓膜) (Dry Film Resist Coat)
Copper Foil
Prepreg(膠片) Inner Layer Prepreg(膠片) Copper Foil
18
9. 壓合 (Lamination)
19
COMP S0LD. COMP S0LD.
典型之多層板疊板及壓合結構
壓合機之熱板
疊合用之鋼板
CprOePpPreEgR FOIL 0.5 OZ
39
29. 外層線路製作 (Pattern imaging)
壓膜(D/F Lamination)
40
曝光(Exposure) 顯像(D/F Developing)