SN74BCT241DW,SN74BCT241DWE4,SN74BCT241DWG4,SN74BCT241N,SN74BCT241NE4, 规格书,Datasheet 资料
SN74AC241DWRE4中文资料
PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)SN74AC241DBLE OBSOLETE SSOP DB 20TBDCall TI Call TISN74AC241DBR ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC241DBRE4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC241DW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC241DWE4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC241DWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC241DWRE4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC241N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AC241NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AC241NSR ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC241NSRE4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC241PWACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC241PWE4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC241PWLE OBSOLETE TSSOP PW 20TBDCall TI Call TISN74AC241PWR ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC241PWRE4ACTIVETSSOPPW202000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.18-Jul-2006Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.18-Jul-2006IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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施耐德 TM241CE24R M241控制器内置以太网和串行通信端口 数据表
Product data sheetCharacteristicsTM241CE24RM241控制器内置以太网和串行通信端口主要信息产品系列Modicon M241产品类型可编程控制器额定电源电压 [Us]100...240 V 交流离散量输入数量14, 离散量输入 8 快速输入 符合 IEC 61131-2 类型 1固态输出类型继电器晶体管离散量输出数量 6 继电器4 晶体管 4 快速输出离散量输出电压5...125 V 直流 适用 继电器输出 5...250 V 交流 适用 继电器输出 24 V 直流 适用 晶体管输出离散量输出电流2 A 适用 继电器输出 (Q4 (9)0.1 A 适用 快速输出(PTO 模式) (TR0...TR3) 0.5 A 适用 晶体管输出 (TR0...TR3)补充信息离散量I/O编号24I/O 拓展模块数7 (本地 I/O 体系) 14 (远程 I/O 体系)电源电压范围85…264 V 电网频率50/60 Hz 离散量输入逻辑阱或源离散量输入电压24 V 离散量输入电压类型直流电压状态1担保>= 15 V 适用 输入电压状态0担保<= 5 V 适用 输入离散量输入电流5 MA 适用 输入输入阻抗 4.7 kOhm 适用 输入响应时间50 µs 开, I0...I13 端子 适用 输入可配置滤波时间 1 µs 适用 快速输入离散量输出逻辑正逻辑(源)输出电压限制125 V 直流 继电器输出 30 V 直流 晶体管输出 277 V AC 继电器输出Maximum output frequency1 KHz 适用 晶体管输出20 KHz 适用 快速输出(PWM 模式) 100 KHz 适用 快速输出 (PLS 模式)精度+/- 0.1 % 在…上 0.02…0.1 kHz 适用 快速输出 +/- 1 % 在…上 0.1…1 kHz 适用 快速输出T h e i n f o r m a t i o n p r o v i d e d i n t h i s d o c u m e n t a t i o n c o n t a i n s g e n e r a l d e s c r i p t i o n s a n d /o r t e c h n i c a l c h a r a c t e r i s t i c s o f t h e p e r f o r m a n c e o f t h e p r o d u c t s c o n t a i n e d h e r e i n .T h i s d o c u m e n t a t i o n i s n o t i n t e n d e d a s a s u b s t i t u t e f o r a n d i s n o t t o b e u s e d f o r d e t e r m i n i n g s u i t a b i l i t y o r r e l i a b i l i t y o f t h e s e p r o d u c t s f o r s p e c i f i c u s e r a p p l i c a t i o n s .I t i s t h e d u t y o f a n y s u c h u s e r o r i n t e g r a t o r t o p e r f o r m t h e a p p r o p r i a t e a n d c o m p l e t e r i s k a n a l y s i s , e v a l u a t i o n a n d t e s t i n g o f t h e p r o d u c t s w i t h r e s p e c t t o t h e r e l e v a n t s p e c i f i c a p p l i c a t i o n o r u s e t h e r e o f .N e i t h e r S c h n e i d e r E l e c t r i c I n d u s t r i e s S A S n o r a n y o f i t s a f f i l i a t e s o r s u b s i d i a r i e s s h a l l b e r e s p o n s i b l e o r l i a b l e f o r m i s u s e o f t h e i n f o r m a t i o n c o n t a i n e d h e r e i n .保护类型短路保护 适用 晶体管输出带自动复位的短路及过载保护 适用 晶体管输出逆相保护 适用 晶体管输出无保护 适用 继电器输出复位时间10 Ms 自动复位 输出12 S 自动复位 快速输出存储容量64 MB 适用 系统内存 RAM数据备份128 MB 内置闪存卡 适用 用户项目备份数据存储设备<= 16 GB SD卡 (可选)电池类型BR2033 锂电池不充电, 电池寿命: 4 年累计运行时间 2 年 在…上 25 °C1K指令的执行时间0.3 Ms 适用 事件和周期性任务0.7 Ms 适用 其他指示应用程序结构8个外部事件任务3循环主任务+1飞轮任务8 事项4循环主任务实时时钟有时钟误差<= 60 s/month 在…上 25 °C定位功能PTO 功能 4 通道 (定位频率: 100 kHz)计算输入数 4 快速输入 (高数计数模式) 在…上 200 kHz14 标准输入 在…上 1 kHz控制信号类型A/B 在…上 100 kHz 适用 快速输入 (高数计数模式)脉冲/方向 在…上 200 kHz 适用 快速输入 (高数计数模式)单相 在…上 200 kHz 适用 快速输入 (高数计数模式)集成连接类型非隔离的串行链接 串行 1 和 RJ45 连接器 和 RS232/RS485 界面非隔离的串行链接 串行 2 和 可拆卸螺旋接线端子 连接器 和 RS485 界面USB 端口 和 mini B USB 2.0 连接器Ethernet 和 RJ45 连接器电源(串行 1)串行链接供电: 5 V, <200 mA传输率 1.2...115.2 kbit/s (默认115.2 kbit/s ) 用于总线长度为… 15 m 适用 RS4851.2...115.2 kbit/s (默认115.2 kbit/s ) 用于总线长度为… 3 m 适用 RS232480 Mbit/s 用于总线长度为… 3 m 适用 USB10/100 Mbit/s 适用 以太网通讯协议非隔离的串行链接: 串口Modbus 协议 主/从Ethernet 端口10BASE-T/100BASE-TX - 1 端口 铜电缆通讯服务FDRDHCP 服务器 通过TM4以太网开关网络模块DHCP客户 嵌入式以太网端口SMS通知正在更新固件SNMP 客户/服务器编程NGVL监控IEC VAR ACCESSFTP 客户/服务器下载SQL 客户网络通讯协议TCP客户 I/0扫描仪以太网/IP源 I/O 扫描仪 嵌入式以太网端口以太网/IP目标，网络通讯协议TCP服务器和网络通讯服务器TCP 从动装置基于TCP/UDP库从控制器发送和接收电子邮件Web服务器(WebVisu & XWeb系统)OPC UA 服务器DNS客户本地信号指示 1 个LED (绿色) for PWR:1 个LED (绿色) for RUN:1 个LED (红色) for 模块错误 (ERR):1 个LED (红色) for I/O 错误(I/O):1 个LED (绿色) for 可访问 SD卡 (SD):1 个LED (红色) for BAT:1 个LED (绿色) for SL1:1 个LED (绿色) for SL2:1 个LED (红色) for TM4母线故障:每通道1 LED (绿色) for I/O 状态:1 个LED (绿色) for 以太网端口活动:电气连接可拆卸螺旋接线端子用于输入与输出 (5.08mm倾斜)可拆卸螺旋接线端子用于连接 24 V 直流电源 (5.08mm倾斜)Maximum cable distance between devices非屏蔽电缆: <50 m 适用 输入屏蔽电缆: <10 m 适用 快速输入非屏蔽电缆: <50 m 适用 输出屏蔽电缆: <3 m 适用 快速输出隔离供电与内部逻辑之间 在…上 500 V ACNon-insulated between supply and ground标识CE传感器电源24 V 直流 在…上 400 mA 由控制器供给浪涌耐受2 KV 电源线 (AC) 共模 符合 IEC 61000-4-52 KV 继电器输出 共模 符合 IEC 61000-4-51 KV 屏蔽电缆 共模 符合 IEC 61000-4-51 KV 电源线 (AC) 差模 符合 IEC 61000-4-51 KV 继电器输出 差模 符合 IEC 61000-4-51 KV 输入 共模 符合 IEC 61000-4-51 KV 晶体管输出 共模 符合 IEC 61000-4-5网页服务网络服务器最大连接数8 网络通讯协议服务器8 SoMachine protocol10 网络服务器4 FTP服务器16 以太网/IP 目标8 网络通讯协议客户从站数量64 以太网Modbus:16 Ethernet/IP:周期时间10 Ms 16 Ethernet/IP64 Ms 64 以太网Modbus安装方式顶帽类型TH35-15 导轨安装 符合 IEC 60715顶帽类型 TH35-7.5 导轨安装 符合 IEC 60715板或有固定套件的板高度90 Mm深度95 Mm宽度150 Mm净重0.53 Kg环境符合标准ANSI/ISA 12-12-01CSA C22.2 No 142CSA C22.2 No 213IEC 61131-2:2007船用规格(LR, ABS, DNV, GL)UL 508产品认证RCM[RETURN]cULus[RETURN]CE[RETURN]UKCA[RETURN]DNV-GL[RETURN]ABS[RETUR 抗静电放电8 KV 空气中 符合 IEC 61000-4-24 KV 接触 符合 IEC 61000-4-2抗电磁域10 V/M 80 MHz...1 GHz 符合 IEC 61000-4-33 V/M 1.4 GHz-2 GHz 符合 IEC 61000-4-31 V/M2 GHz...3 GHz 符合 IEC 61000-4-3抗瞬时脉冲能力2 KV 符合 IEC 61000-4-4 (电源线)2 KV 符合 IEC 61000-4-4 (继电器输出)1 KV 符合 IEC 61000-4-4 (Ethernet线)1 KV 符合 IEC 61000-4-4 (串行链接)1 KV 符合 IEC 61000-4-4 (输入)1 KV 符合 IEC 61000-4-4 (晶体管输出)传导干扰阻力10 V 0.15...80 MHz 符合 IEC 61000-4-63 V 0.1...80 MHz 符合 船用规格(LR, ABS, DNV, GL)10 V 标定频率 (2, 3, 4, 6.2, 8.2, 12.6, 16.5, 18.8, 22, 25 MHz) 符合 船用规格(LR, ABS, DNV, G 电磁辐射传导发射 - 测试等级: 120...69 dBµV/m QP ( 电源线) 在…上 10…150 kHz 符合 IEC 55011传导发射 - 测试等级: 63 dBμV/m QP ( 电源线) 在…上 1.5…30 MHz 符合 IEC 55011传导发射 - 测试等级: 79 dBμV/m QP/66 dBμV/m AV ( 电源线) 在…上 0.15…0.5 MHz 符合 IEC传导发射 - 测试等级: 73 dBμV/m QP/60 dBμV/m AV ( 电源线) 在…上 0.5…300 MHz 符合 IEC 5辐射发射 - 测试等级: 40 dBμV/m QP A类 ( 10 m) 在…上 30…230 MHz 符合 IEC 55011传导发射 - 测试等级: 79...63 dBμV/m QP ( 电源线) 在…上 150…1500 kHz 符合 IEC 55011辐射发射 - 测试等级: 47 dBμV/m QP A类 ( 10 m) 在…上 230…1000 MHz 符合 IEC 55011抗瞬时断电10 Ms环境温度-10…50 °C (垂直安装)-10…55 °C (垂直安装)贮存环境温度-25…70 °C相对湿度10…95 %, 无凝结 (操作中)10…95 %, 无凝结 (存储期间)IP 保护等级IP20 保护盖就位污染等级2工作海拔0...2000 m存储高度0…3000 M抗振动 3.5 mm 在…上 5…8.4 Hz 在…上 均匀导轨3 gn 在…上 8.4…150 Hz 在…上 均匀导轨3.5 mm 在…上 5…8.4 Hz 在…上 面板安装3 gn 在…上 8.4…150 Hz 在…上 面板安装抗冲击15 gn 适用 11 ms包装单位Unit Type of Package 1PCENumber of Units in Package 11Package 1 Height11.208 CmPackage 1 Width13.04 CmPackage 1 Length18.656 CmPackage 1 Weight760.0 GUnit Type of Package 2S03Number of Units in Package 28Package 2 Height30 CmPackage 2 Width30 CmPackage 2 Length40 CmPackage 2 Weight 6.97 KgUnit Type of Package 3P06Number of Units in Package 364Package 3 Height75.0 CmPackage 3 Width40.0 CmPackage 3 Length80.0 CmPackage 3 Weight66 Kg可持续性产品类型Green Premium 产品REACh法规REACh 声明欧盟ROHS指令主动合规性（超出欧盟 RoHS 法定范围的产品）无汞是中国 ROHS 管理办法中国 ROHS 声明RoHS 豁免信息是环境披露产品环境文件流通资料产品使用寿命终期信息WEEE该产品必须经特定废物回收处理后弃置于欧盟市场，绝不可丢弃于垃圾桶中。
M74HCT241资料
M54HCT240/241/244M74HCT240/241/244Septembe r 1993HCT240:INVERTED -HCT241/244NON INVERTEDOCTAL BUS BUFFER WITH 3STATE OUTPUTS B1R(Plastic Package)ORDER CODES :M54HCTXXXF1R M74HCTXXXM1R M74HCTXXXB1R M74HCTXXXC1RF1R(Ceramic Package)M1R(Micro Package)C1R (Chip Carrier)PIN CONNECTION (top view).HIGH SPEEDt PD =13ns (TYP.)at V CC =5V .LOW POWER DISSIPATIONI CC =4µA (MAX.)at T A =25oC.COMPATIBLE WITH TTL OUTPUTS V IH =2V (MIN.)V IL =0.8V (MAX).OUTPUT DRIVE CAPABILITY 15LSTTL LOADS.SYMMETRICAL OUTPUT IMPEDANCE |I OH |=I OL =6mA (MIN).BALANCED PROPAGATION DELAYS t PLH =t PHL.PIN AND FUNCTION COMPATIBLE WITH 54/74LS240/241/244DESCRIPTIONThe M54/74HCT240,HCT241and HCT244are high speed CMOS OCTAL BUS BUFFERs fabricated in silicon gate C 2MOS technology.They have the same high speed performance of LSTTL combined with true CMOS low power consumption.The designer has a choise of select combination of inverting and non-inverting outputs,symmetrical G (active low output control)input,and complementary G and G inputs.Each control input governs four BUS BUFFERs.This integrated circuit has input and output characteristics that are fully compatible with 54/74LSTTL logic families.M54/74HCT devices are designed to directly interface HSC 2MOS systems with TTL and NMOS components.They are also plug in replacements for LSTTL devices giving a reduction of power consumption.These devices are designed to be used with 3state memory address drivers,etc.All inputs are equipp ed with protection circuits against static discharge and transient excess voltage.HCT244HCT241HCT2401/12CHIP CARRIERINPUT AND OUTPUT EQUIVALENT CIRCUIT PIN DESCRIPTION (HCT240)PIN No SYMBOL NAME AND FUNCTION 11G Output Enable Input 2,4,6,81A1to 1A4Data Inputs 9,7,5,32Y1to 2Y4Data Outputs 11,13,15,172A1to 2A4Data Inputs 18,16,14,121Y1to 1Y4Data Outputs 192G Output Enabel Input 10GND Ground (0V)20V CCPositive Supply VoltagePIN DESCRIPTION (HCT244)PIN No SYMBOL NAME AND FUNCTION 11G Output Enable Input 2,4,6,81A1to 1A4Data Inputs 9,7,5,32Y1to 2Y4Data Outputs 11,13,15,172A1to 2A4Data Inputs 18,16,14,121Y1to 1Y4Data Outputs 192G Output Enabel Input 10GND Ground (0V)20V CCPositive Supply VoltagePIN DESCRIPTION (HCT241)PIN No SYMBOL NAME AND FUNCTION 11G Output Enable Input 2,4,6,81A1to 1A4Data Inputs 9,7,5,32Y1to 2Y4Data Outputs 11,13,15,172A1to 2A4Data Inputs 18,16,14,121Y1to 1Y4Data Outputs 192G Output Enabel Input 10GND Ground (0V)20V CCPositive Supply VoltageHCT244HCT241HCT240M54/M74HCT240/241/2442/12IEC LOGIC SYMBOLSTRUTH TABLEINPUTOUTPUTG G (HCT241)An Yn (HCT240)Yn (HCT241)Yn (HCT244)L H L H L L L HH LHHHLXZZZX:”H”or ”L”Z:High impeda nceCIRCUIT SCHEMATIC (1/8PACKAGE)HCT244HCT241HCT240HCT240HCT241/244M54/M74HCT240/241/2443/12ABSOLUTE MAXIMUM RATINGSSymbol Parameter Value Unit V CC Supply Voltage-0.5to+7V V I DC Input Voltage-0.5to V CC+0.5V V O DC Output Voltage-0.5to V CC+0.5VI IK DC Input Diode Current±20mAI OK DC Output Diode Current±20mAI O DC Output Source Sink Current Per Output Pin±35mAI CC or I GND DC V CC or Ground Current±70mAP D Power Dissipation500(*)mW T stg Storage Temperature-65to+150o C T L Lead Temperature(10sec)300o C Absolute Maximum Ratings are those values beyond whichdamage to the device may occu r.Functiona l ope ration und er these cond ition isnotimplied. (*)500mW:≅65o C derate to300mW by10mW/o C:65o C to85o CRECOMMENDED OPERATING CONDITIONSSymbol Parameter Value Unit V CC Supply Voltage 4.5to5.5V V I Input Voltage0to V CC V V O Output Voltage0to V CC VT op Operating Temperature:M54HC SeriesM74HC Series -55to+125-40to+85o Co Ct r,t f Input Rise and Fall Time(V CC=4.5to5.5V)0to500ns M54/M74HCT240/241/2444/12DC SPECIFICATIONSSymbol ParameterTest Conditions ValueUnit V CC(V)T A=25o C54HC and74HC-40to85o C74HC-55to125o C54HCMin.Typ.Max.Min.Max.Min.Max.V IH High Level InputVoltage 4.5to5.52.0 2.0 2.0VV IL Low Level InputVoltage 4.5to5.50.80.80.8VV OH High LevelOutput Voltage4.5V I=V IHorV ILI O=-20µA 4.4 4.5 4.4 4.4VI O=-6.0mA 4.18 4.31 4.13 4.10V OL Low Level OutputVoltage4.5V I=V IHorV ILI O=20µA0.00.10.10.1VI O=6.0mA0.170.260.330.4I I Input LeakageCurrent 5.5V I=V CC or GND±0.1±1±1µAI CC Quiescent SupplyCurrent5.5V I=V CC or GND44080µA∆I CC Additional worstcase supplycurrent 5.5Per Input pinV I=0.5V or2.4VOther Inputs atV CC or GND2.0 2.93.0mAM54/M74HCT240/241/2445/12AC ELECTRICAL CHARACTERISTICS(C L=50pF,Input t r=t f=6ns)Symbol ParameterTest Conditions ValueUnit V CC(V)C L(pF)T A=25o C54HC and74HC-40to85o C74HC-55to125o C54HCMin.Typ.Max.Min.Max.Min.Max.t TLH t THL Output TransitionTime4.5507121518nst PLH t PHL PropagationDelay Time4.55015222833ns4.515021303845nst PLH t PHL PropagationDelay Time4.55015253138ns4.515021334150nst PZL t PZH Output EnableTime4.550R L=1KΩ17303845ns4.5150R L=1KΩ23384857nst PLZ t PHZ Output DisableTime4.550R L=1KΩ16303845nsC IN Input Capacitance5101010pF C OUT OutputCapacitance10pFC PD(*)Power DissipationCapacitanceHCT240HCT241/2443331pF(*)C PD is defined as the value of the IC’s internal equivalent capac itanc e which is calculated from the operating current con sump tion without load. (Refer to Test Circuit).Average operting current can be obtained by the following equ ation.I CC(opr)=C PD•V CC•f IN+I CC/8(per circuit)TEST CIRCUIT I CC(Opr.)HCT240M54/M74HCT240/241/2446/12M54/M74HCT240/241/244 SWITCHING CHARACTERISTICS TEST WAVEFORM7/12M54/M74HCT240/241/244Plastic DIP20(0.25)MECHANICAL DATAmm inch DIM.MIN.TYP.MAX.MIN.TYP.MAX.a10.2540.010B 1.39 1.650.0550.065b0.450.018b10.250.010D25.4 1.000 E8.50.335e 2.540.100e322.860.900F7.10.280I 3.930.155L 3.30.130Z 1.340.053P001J 8/12M54/M74HCT240/241/244 Ceramic DIP20MECHANICAL DATAmm inchDIM.MIN.TYP.MAX.MIN.TYP.MAX.A250.984B7.80.307D 3.30.130E0.5 1.780.0200.070e322.860.900F 2.29 2.790.0900.110G0.40.550.0160.022I 1.27 1.520.0500.060L0.220.310.0090.012M0.51 1.270.0200.050N14°(min.),15°(max.)P7.98.130.3110.320Q 5.710.225P057H9/12M54/M74HCT240/241/244SO20MECHANICAL DATAmm inch DIM.MIN.TYP.MAX.MIN.TYP.MAX.A 2.650.104a10.100.200.0040.007 a2 2.450.096 b0.350.490.0130.019 b10.230.320.0090.012 C0.500.020c145°(typ.)D12.6013.000.4960.512 E10.0010.650.3930.419e 1.270.050e311.430.450F7.407.600.2910.299 L0.50 1.270.190.050 M0.750.029 S8°(max.)P013L 10/12M54/M74HCT240/241/244PLCC20MECHANICAL DATAmm inchDIM.MIN.TYP.MAX.MIN.TYP.MAX.A9.7810.030.3850.395B8.899.040.3500.356D 4.2 4.570.1650.180d1 2.540.100d20.560.022E7.378.380.2900.330e 1.270.050e3 5.080.200F0.380.015G0.1010.004M 1.270.050M1 1.140.045P027A11/12M54/M74HCT240/241/244Information furnished is believed to be accurate and reliable.However,SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use.No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.Specificationsmentioned in this publication are subject to change without notice.This publication supersedes and replaces all information previously supplied.SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics.©1994SGS-THOMSON Microelectronics-All Rights ReservedSGS-THOMSON Microelectronics GROUP OF COMPANIESAustralia-Brazil-France-Germany-Hong Kong-Italy-Japan-Korea-Malaysia-Malta-Morocco-The Netherlands-Singapore-Spain-Sweden-Switzerland-Taiwan-Thailand-United Kingdom-U.S.A12/12。
(完整版)单板硬件测试规范
页数：第1 页共74 页电源单板硬件测试规范修订信息登记表目录前言 (5)摘要： (5)关键词： (5)缩略词解释 (5)一.目的 (5)二.适用范围 (5)三.引用/参考标准或资料 (5)四.名词解释 (5)五.测试基本原则及判定准则 (5)5.1 测试基本原则 (5)5.2 技术指标说明 (6)5.3 不合格测试项目分类准则 (6)5.4 质量判定准则 (6)5.5 测试准备 (6)六.测试仪器、测试工具、测试环境 (6)6.1 测试仪器 (7)6.2 测试工具 (7)6.3 测试环境 (7)七.测试项目、测试说明、测试方法、判定标准 (7)7.1 外观及尺寸审查 (7)7.2 电路原理图审查 (8)7.2.1 基准电路 (8)7.2.2 滤波电路 (8)7.2.3 保护电路 (10)7.2.4 看门狗电路 (10)7.2.5 ID电路 (12)7.2.6 缓冲驱动电路 (12)7.2.7 锁存电路 (13)7.2.8 分压电路 (14)7.2.9 键盘电路 (14)7.2.10模拟量通道选择电路 (15)7.2.11 有效值电路 (17)7.2.12 差分放大电路 (18)7.2.13 压频转换电路 (19)7.2.14 RS485/422电路 (21)7.2.15 RS232电路 (26)7.2.16 CAN电路 (27)7.2.17 CPU基本电路审查 (29)7.2.17.1 MCS51基本电路 (29)7.2.17.2 TI DSP基本电路 (30)7.2.17.3 MPC852基本电路 (33)7.2.17.4 ARM基本电路 (34)7.2.18 继电器电路 (37)7.2.19 交流电压采样电路 (39)7.3 信号测量 (40)7.3.1 基准电路 (40)7.3.2 看门狗电路 (42)7.3.3 时钟电路 (43)7.3.4 ID电路 (44)7.3.5 分压电路 (45)7.3.6 IIC电路 (46)7.3.7 有效值电路 (47)7.3.8 平均值电路 (47)7.3.9 差分放大电路 (49)7.3.10 交流频率采样电路 (49)7.3.11 电池熔丝状态检测电路 (51)7.3.12 压频转换电路 (53)7.3.13 光耦固态继电器 (54)7.3.14 光藕电路 (55)7.3.15 RS485/422电路 (55)7.3.16 RS232电路 (56)7.3.17 CAN电路 (57)7.3.18 CPU电路信号测量 (59)7.3.18.1 MCS51单片机基本电路 (59)7.3.18.2 DSP基本电路 (59)7.3.18.3 MPC852基本电路 (61)7.3.18.4 ARM基本电路 (62)7.4 电路计算 (63)7.4.1 TVS电路 (63)7.4.2 光耦固态继电器 (65)7.4.3 光藕计算 (66)7.4.4 差分放大电路计算 (69)7.4.5 单板电路功耗计算 (69)7.5 研究性测试 (70)7.5.1 近场骚扰测试 (70)八.附录 (73)8.1 测试方案模板 (73)8.2 测试项目手册模板 (73)8.3 单板测试CheckList (73)8.4 整流模块DSP硬件测试规范 (73)8.5 逻辑电平 (74)前言摘要：本规范介绍了电源单板硬件测试的项目、测试方法以及测试原理。
BCT24157_REV2P2_20170511
如果器件工作条件超过上述各项极限值，可能对器件造成永久性损坏。上述参数仅仅是工作条件的极限值，不建议器 件工作在推荐条件以外的情况。器件长时间工作在极限工作条件下，其可靠性及寿命可能受到影响。
5
Ver 2.2
电气特性
除特别说明外，测试条件均为：VBUS=5V，TA=25℃。
VBUS=5V, VBAT=3.6V, IOREG=1600mA No Battery, VBUS at Power UP
OTG MODE波形（CH2=VBUS,CH4=BAT,CH3=SW,CH1=IL）
VBAT=3.6V, IVBUS=500mA Battery Removal/Insertion During Charging
应用
手机、智能手机、PDA、充电宝 平板电脑、便携式媒体播放器 游戏机、数码相机
订购信息
产品型号 BCT24157EBP-TR 工作温度范围 -40℃～85℃ 封装形式 WLCSP-20L 器件标识 24157 发货形式 卷带包装3000 片/盘
VBUS OVP VCC
Q1A Q1B ISNS
POWER OUTPUT STAGE
RSENSE
PGND
Battery
DAC
VREF
CSIN
VBAT
CBAT
SDA SCL
PMID
I2C INTERFACE OSC LOGIC AND CONTROL
STAT 50mA
SYSTEM LOAD
图2
IC 和系统原理框图
1
Ver 2.2
典型应用原理图
手机USB 端口
VBUS SW
L1 1uH
Modicon M241 产品数据手册说明书
i s c l a im e r : T h i s d o c u m e n t a t i o n i s n o t i n t e n d e d a s a s u b s t i t u t e f o r a n d i s n o t t o b e u s e d f o r d e t e r m i n i n g s u i t a b i l i t y o r r e l i a b i l i t y o f t h e s e p r o d u c t s f o r s p e c i f i c u s e r a p p l i c a t i o n sProduct datasheetCharacteristicsTM241CE40Tcontroller M241 40 IO transistor PNP EthernetMainRange of productModicon M241Product or component type Logic controller [Us] rated supply voltage 24 V DCDiscrete input number 24 discrete input including 8 fast input conforming to IEC 61131-2 Type 1Discrete output type TransistorDiscrete output number 16 transistor including 4 fast output Discrete output voltage 24 V DC for transistor outputDiscrete output current0.1 A with Q0...Q3 terminal(s) for fast output (PTO mode)0.5 A with Q0...Q15 terminal(s) for transistor outputComplementaryDiscrete I/O number40Number of I/O expansion module 7 (local I/O architecture)14 (remote I/O architecture)Supply voltage limits 20.4...28.8 V Inrush current<= 50 APower consumption in W 32.6...40.4 W with max number of I/O expansion module Discrete input logic Sink or source Discrete input voltage 24 V Discrete input voltage type DCVoltage state1 guaranteed >= 15 V for input Current state 1 guaranteed >= 2.5 mA for input >= 5 mA for fast input Voltage state 0 guaranteed <= 5 V for input Current state 0 guaranteed <= 1 mA for input<= 1.5 mA for fast input Discrete input current 7 mA for input10.7 mA for fast input Input impedance4.7 kOhm for input2.81 kOhm for fast inputResponse time<= 2 µs turn-on operation with I0...I7 terminal(s) for fast input<= 2 µs turn-off operation with I0...I7 terminal(s) for fast input<= 2 µs turn-on operation with Q0...Q3 terminal(s) for fast output<= 2 µs turn-off operation with Q0...Q3 terminal(s) for fast output50 µs turn-on operation with I0...I15 terminal(s) for input50 µs turn-off operation with I0...I15 terminal(s) for input<= 34 µs turn-on operation with Q0...Q15 terminal(s) for output<= 250 µs turn-off operation with Q0...Q15 terminal(s) for outputConfigurable filtering time 1 µs for fast input12 ms for fast input0 ms for input1 ms for input4 ms for input12 ms for inputDiscrete output logic Positive logic (source)Output voltage limits30 V DCCurrent per output common 2 AOutput frequency<= 20 kHz for fast output (PWM mode)<= 100 kHz for fast output (PLS mode)<= 1 kHz for outputAccuracy+/- 0.1 % at 20...100 Hz for fast output+/- 1 % at 100 Hz...1 kHz for fast outputLeakage current<= 5 µA for outputVoltage drop<= 1 VTungsten load<= 2.4 WProtection type Short-circuit and overload protection with automatic resetReverse polarity protection for fast outputShort-circuit protectionReset time10 ms automatic reset output12 s automatic reset fast outputMemory capacity8 MB for program64 MB for system memory RAMData backed up128 MB built-in flash memory for backup of user programsData storage equipment<= 32 GB SD card optionalBattery type BR2032 lithium non-rechargeable, battery life: 4 yrBackup time 2 years at 25 °CExecution time for 1 KInstruction0.3 ms for event and periodic task0.7 ms for other instructionApplication structure8 external event tasks4 cyclic master tasks3 cyclic master tasks + 1 freewheeling task8 event tasksRealtime clock WithClock drift<= 60 s/month at 25 °CPositioning functions PWM/PTO function 4 channel(s) (positioning frequency: 100 kHz)Counting input number 4 fast input (HSC mode)Control signal type A/B signal at 100 kHz for fast input (HSC mode)Pulse/Direction signal at 200 kHz for fast input (HSC mode)Single phase signal at 200 kHz for fast input (HSC mode)Integrated connection type USB port with connector mini B USB 2.0Ethernet with connector RJ45Non isolated serial link "serial 1" with connector RJ45 and interface RS232/RS485Non isolated serial link "serial 2" with connector removable screw terminal block and interface RS485 Supply Serial link supply "serial 1" at 5 V, 200 mATransmission rate 1.2...115.2 kbit/s (115.2 kbit/s by default) for bus length of 15 m - communication protocol: RS4851.2...115.2 kbit/s (115.2 kbit/s by default) for bus length of 3 m - communication protocol: RS232480 Mbit/s for bus length of 3 m - communication protocol: USB10/100 Mbit/s - communication protocol: EthernetCommunication port protocol Modbus non isolated serial link with master/slave methodPort Ethernet 1 - 10BASE-T/100BASE-TX port with copper cable supportCommunication service FDRDownloadingIEC VAR ACCESSMonitoringNGVLProgrammingUpdating firmwareSMS notificationsDHCP server (via TM4 Ethernet switch network module)DHCP client (embedded Ethernet port)SNMP client/serverFTP client/serverSQL clientSend email from the controller based on TCP/UDP libraryModbus TCP client I/O scannerEthernet/IP originator I/O scanner (embedded Ethernet port)Ethernet/IP target, Modbus TCP server and Modbus TCP slaveLocal signalling 1 LED green for SD card access (SD)1 LED red for BAT1 LED green for SL11 LED green for SL21 LED per channel green for I/O state1 LED red for I/O error (I/O)1 LED red for bus fault on TM4 (TM4)1 LED green for Ethernet port activity1 LED red for module error (ERR)1 LED green for PWR1 LED green for RUNElectrical connection Removable screw terminal block for inputs and outputs (pitch 5.08 mm)Removable screw terminal block for connecting the 24 V DC power supply (pitch 5.08 mm) Cable length<= 50 m unshielded cable for input<= 10 m shielded cable for fast input<= 3 m shielded cable for fast output<= 50 m unshielded cable for outputInsulation500 V AC between fast input and internal logicNon-insulated between inputs500 V AC between output and internal logic500 V AC between fast output and internal logicNon-insulated between outputs500 V AC between input and internal logic500 V AC between output groups500 V AC between supply and internal logicNon-insulated between supply and groundMarking CESurge withstand 1 kV for power lines (DC) in common mode conforming to EN/IEC 61000-4-51 kV for shielded cable in common mode conforming to EN/IEC 61000-4-50.5 kV for power lines (DC) in differential mode conforming to EN/IEC 61000-4-51 kV for relay output in differential mode conforming to EN/IEC 61000-4-51 kV for input in common mode conforming to EN/IEC 61000-4-51 kV for transistor output in common mode conforming to EN/IEC 61000-4-5Web services Web serverMaximum number of connections8 connection(s) for Modbus server8 connection(s) for SoMachine protocol10 connection(s) for web server4 connection(s) for FTP server16 connection(s) for Ethernet/IP target8 connection(s) for Modbus clientNumber of slave16 Ethernet/IP64 Modbus TCPCycle time10 ms 16 Ethernet/IP64 ms 64 Modbus TCPMounting support Top hat type TH35-15 rail conforming to IEC 60715Top hat type TH35-7.5 rail conforming to IEC 60715Plate or panel with fixing kitHeight90 mmDepth95 mmWidth190 mmProduct weight0.62 kgEnvironmentStandards CSA C22.2 No 142ANSI/ISA 12-12-01UL 1604CSA C22.2 No 213EN/IEC 61131-2 : 2007Marine specification (LR, ABS, DNV, GL)UL 508Product certificationsCSA cULus RCMIACS E10Resistance to electrostatic discharge 4 kV on contact conforming to EN/IEC 61000-4-28 kV in air conforming to EN/IEC 61000-4-2Resistance to electromagnetic fields10 V/m (80 MHz...1 GHz) conforming to EN/IEC 61000-4-33 V/m (1.4 GHz...2 GHz) conforming to EN/IEC 61000-4-31 V/m (2 GHz...3 GHz) conforming to EN/IEC 61000-4-3Resistance to fast transients2 kV for power lines conforming to EN/IEC 61000-4-41 kV for Ethernet line conforming to EN/IEC 61000-4-41 kV for serial link conforming to EN/IEC 61000-4-41 kV for input conforming to EN/IEC 61000-4-41 kV for transistor output conforming to EN/IEC 61000-4-4Resistance to conducted disturbances,induced by radio frequency fields10 V (0.15...80 MHz) conforming to EN/IEC 61000-4-63 V (0.1...80 MHz) conforming to Marine specification (LR, ABS, DNV, GL)10 V (spot frequency (2, 3, 4, 6.2, 8.2, 12.6, 16.5, 18.8, 22, 25 MHz)) conforming to Marine specification (LR, ABS, DNV, GL)Electromagnetic emissionConducted emissions, test level: 120...69 dBµV/m QP, condition of test: power lines (radio frequency:10...150 kHz) conforming to EN/IEC 55011Conducted emissions, test level: 79...63 dBμV/m QP, condition of test: power lines (radio frequency:150 kHz...1.5 MHz) conforming to EN/IEC 55011Conducted emissions, test level: 63 dBμV/m QP, condition of test: power lines (radio frequency:1.5...30 MHz) conforming to EN/IEC 55011Radiated emissions, test level: 40 dBμV/m QP with class A (radio frequency: 30...230 MHz)conforming to EN/IEC 55011Radiated emissions, test level: 47 dBμV/m QP with class A (radio frequency: 230 MHz...1 GHz)conforming to EN/IEC 55011Immunity to microbreaks10 msAmbient air temperature for operation -10...55 °C for horizontal installation -10...50 °C for vertical installation Ambient air temperature for storage -25...70 °CRelative humidity 10...95 % without condensation in operation 10...95 % without condensation in storage IP degree of protection IP20 with protective cover in place Pollution degree 2Operating altitude 0...2000 m Storage altitude 0...3000 mVibration resistance3.5 mm (vibration frequency: 5...8.4 Hz) on symmetrical rail 3 gn (vibration frequency: 8.4...150 Hz) on symmetrical rail 3.5 mm (vibration frequency:5...8.4 Hz) on panel mounting 3 gn (vibration frequency: 8.4...150 Hz) on panel mounting Shock resistance15 gn for 11 msOffer SustainabilitySustainable offer status Green Premium productRoHS (date code: YYWW)Compliant - since 1330 - Schneider Electric declaration of conformity Schneider Electric declaration of conformity REAChReference not containing SVHC above the threshold Reference not containing SVHC above the threshold Product environmental profileAvailableProduct environmental Product end of life instructionsAvailableEnd of life manualDimensions Drawings DimensionsClearanceMounting PositionAcceptable MountingNOTE: Expansion modules must be mounted above the logic controller.Incorrect MountingDirect Mounting On a Panel Surface Mounting Hole LayoutDigital InputsWiring Diagram(*) :Type T fuse(1) :The COM0, COM1 and COM2 terminals are not connected internally (A) :Sink wiring (positive logic)(B) :Source wiring (negative logic)Fast Input Wiring (I0...I7)Fast Transistor OutputsWiring Diagram(*) :Type T fuse(1)The V0+, V1+, V2+ and V3+ terminals are not connected internally.(2)The V0-, V1-, V2- and V3- terminals are not connected internally.Transistor OutputsWiring Diagram(*) :Type T fuse(1) :The V1+, V2+ and V3+ terminals are not connected internally.(2) :The V1–, V2– and V3– terminals are not connected internally.USB Mini-B ConnectionEthernet Connection to a PC。
SN74BCT2414DW;SN74BCT2414DWR;SN74BCT2414DWRE4;SN74BCT2414DWRG4;SN74BCT2414N;中文规格书,Datasheet资料
PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74BCT2414DW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT2414DWG4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT2414DWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT2414DWRE4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT2414DWRG4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT2414N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74BCT2414NE4ACTIVEPDIPN2020Pb-Free (RoHS)CU NIPDAUN /A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine(Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM18-Sep-2008TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74BCT2414DWR SOICDW202000330.024.410.813.02.712.024.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm)SN74BCT2414DWR SOIC DW202000367.0367.045.0分销商库存信息:TISN74BCT2414DW SN74BCT2414DWR SN74BCT2414DWRE4 SN74BCT2414DWRG4SN74BCT2414N SN74BCT2414NE4 SN74BCT2414DWG4。
SN54LS244中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-7801201VRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC 5962-7801201VSA ACTIVE CFP W201None Call TI Level-NC-NC-NC 7705701RA ACTIVE CDIP J201None Call TI Level-NC-NC-NC 7705701SA ACTIVE CFP W201None Call TI Level-NC-NC-NC 78012012A ACTIVE LCCC FK201None Call TI Level-NC-NC-NC 7801201RA ACTIVE CDIP J201None Call TI Level-NC-NC-NC 7801201SA ACTIVE CFP W201None Call TI Level-NC-NC-NC JM38510/32401B2A ACTIVE LCCC FK201None Call TI Level-NC-NC-NC JM38510/32401BRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC JM38510/32401BSA ACTIVE CFP W201None Call TI Level-NC-NC-NC JM38510/32402B2A ACTIVE LCCC FK201None Call TI Level-NC-NC-NC JM38510/32402BRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC JM38510/32402BSA ACTIVE CFP W201None Call TI Level-NC-NC-NC JM38510/32403B2A ACTIVE LCCC FK201None Call TI Level-NC-NC-NC JM38510/32403BRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC JM38510/32403BSA ACTIVE CFP W201None Call TI Level-NC-NC-NC JM38510/32403SRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC JM38510/32403SSA ACTIVE CFP W201None Call TI Level-NC-NC-NC SN54LS240J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SN54LS241J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SN54LS244J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SN54S240J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SN54S241J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SN54S244J ACTIVE CDIP J201None Call TI Level-NC-NC-NCSN74LS240DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74LS240DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74LS240J OBSOLETE CDIP J20None Call TI Call TISN74LS240N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS240N3OBSOLETE PDIP N20None Call TI Call TISN74LS240NSR ACTIVE SO NS202000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS241DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74LS241DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74LS241J OBSOLETE CDIP J20None Call TI Call TISN74LS241N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS241N3OBSOLETE PDIP N20None Call TI Call TISN74LS241NSR ACTIVE SO NS202000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LS244DBR ACTIVE SSOP DB202000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS244DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74LS244DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74LS244J OBSOLETE CDIP J20None Call TI Call TISN74LS244N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS244N3OBSOLETE PDIP N20None Call TI Call TISN74LS244NSR ACTIVE SO NS202000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74S240DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74S240DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74S240N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S240N3OBSOLETE PDIP N20None Call TI Call TISN74S241DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74S241DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74S241J OBSOLETE CDIP J20None Call TI Call TISN74S241N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S241N3OBSOLETE PDIP N20None Call TI Call TISN74S244DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74S244DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74S244J OBSOLETE CDIP J20None Call TI Call TISN74S244N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S244N3OBSOLETE PDIP N20None Call TI Call TISNJ54LS240FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54LS240J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SNJ54LS240W ACTIVE CFP W201None Call TI Level-NC-NC-NC SNJ54LS241FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54LS241J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SNJ54LS241W ACTIVE CFP W201None Call TI Level-NC-NC-NC SNJ54LS244FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54LS244J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SNJ54LS244W ACTIVE CFP W201None Call TI Level-NC-NC-NC SNJ54S240FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54S240J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SNJ54S240W ACTIVE CFP W201None Call TI Level-NC-NC-NC SNJ54S241FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NCOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SNJ54S241J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SNJ54S241W ACTIVE CFP W201None Call TI Level-NC-NC-NC SNJ54S244FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54S244J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SNJ54S244W ACTIVE CFP W201None Call TI Level-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-May not be currently available-please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead(Pb-Free).Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean"Pb-Free"and in addition,uses package materials that do not contain halogens, including bromine(Br)or antimony(Sb)above0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
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Addendum-Page 1PACKAGING INFORMATIONOrderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball Finish MSL Peak Temp (3)Samples (Requires Login)5962-9074301M2A ACTIVE LCCC FK 201TBD Call TI Call TI 5962-9074301MRA ACTIVE CDIP J 201TBD Call TI Call TI 5962-9074301MSA ACTIVE CFP W 201TBD Call TI Call TI SN74BCT241DBLE OBSOLETE SSOP DB 20TBDCall TICall TISN74BCT241DW ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT241DWE4ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT241DWG4ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT241N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74BCT241NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74BCT241NSR ACTIVE SO NS 20Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT241NSRE4ACTIVE SO NS 20Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT241NSRG4ACTIVE SO NS 20Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54BCT241FK ACTIVE LCCC FK 201TBD POST-PLATE N / A for Pkg TypeSNJ54BCT241J ACTIVE CDIP J 201TBD A42N / A for Pkg Type SNJ54BCT241WACTIVECFPW201TBDCall TIN / A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.芯天下--/Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54BCT241, SN74BCT241 :•Catalog: SN74BCT241•Military: SN54BCT241NOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense ApplicationsAddendum-Page 2芯天下--/TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74BCT241NSR SONS20330.024.48.213.02.512.024.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm)SN74BCT241NSR SO NS200367.0367.045.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。