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铝合金6061材料参数

铝合金6061材料参数铝合金6061是一种常见的铝合金材料，具有优良的力学性能和耐腐蚀性能，被广泛应用于航空航天、船舶制造、汽车制造、建筑和机械加工等领域。

下面将介绍铝合金6061的主要参数。

1. 密度。

铝合金6061的密度为2.7g/cm³，相对较低，有利于减轻整体结构的重量，提高材料的强度和刚性。

2. 强度。

铝合金6061的抗拉强度为≥ 275MPa，屈服强度为≥ 240MPa。

这种优异的强度使得铝合金6061在各种工程应用中都能够承受较大的载荷，保证结构的稳定性和安全性。

3. 热处理。

铝合金6061可以通过热处理来提高其强度和硬度，常见的热处理状态包括T6状态和T651状态。

在T6状态下，铝合金6061的抗拉强度可达310MPa，屈服强度可达276MPa，硬度可达95HB。

在T651状态下，铝合金6061的抗拉强度可达310MPa，屈服强度可达276MPa，硬度可达95HB。

4. 耐蚀性。

铝合金6061具有良好的耐蚀性，能够抵抗大气、水、酸、碱等介质的腐蚀，因此在航空航天和海洋工程等领域得到广泛应用。

5. 加工性。

铝合金6061具有良好的加工性能，可以进行铣削、钻孔、车削、切割等加工工艺，适用于各种复杂结构的加工制造。

6. 焊接性。

铝合金6061具有良好的焊接性，可以通过TIG焊、MIG焊、气保焊等方法进行焊接，焊接后的接头牢固、密封性好。

7. 表面处理。

铝合金6061可以进行阳极氧化、喷砂、喷涂等表面处理，提高其耐蚀性和美观性。

综上所述，铝合金6061具有较低的密度、优异的强度、良好的热处理性能、耐蚀性、加工性、焊接性和表面处理性能，适用于各种工程领域的应用。

在实际工程中，可以根据具体的需求选择不同的热处理状态和表面处理方式，充分发挥铝合金6061的优异性能，满足工程设计的要求。

LMC6061IMX,LMC6061IM,LMC6061AIM,LMC6061AIMX, 规格书,Datasheet 资料

LMC6061LMC6061 Precision CMOS Single Micropower Operational AmplifierLiterature Number: SNOS648C芯天下--/LMC6061Precision CMOS Single Micropower Operational AmplifierGeneral DescriptionThe LMC6061is a precision single low offset voltage,mi-cropower operational amplifier,capable of precision single supply operation.Performance characteristics include ultra low input bias current,high voltage gain,rail-to-rail output swing,and an input common mode voltage range that in-cludes ground.These features,plus its low power consump-tion,make the LMC6061ideally suited for battery powered applications.Other applications using the LMC6061include precision full-wave rectifiers,integrators,references,sample-and-hold circuits,and true instrumentation amplifiers.This device is built with National’s advanced double-Poly Silicon-Gate CMOS process.For designs that require higher speed,see the LMC6081precision single operational amplifier.For a dual or quad operational amplifier with similar features,see the LMC6062or LMC6064respectively.PATENT PENDINGFeatures(Typical Unless Otherwise Noted)n Low offset voltage:100µVn Ultra low supply current:20µAn Operates from 4.5V to 15V single supply n Ultra low input bias current:10fAn Output swing within 10mV of supply rail,100k load n Input common-mode range includes V −n High voltage gain:140dB nImproved latchup immunityApplicationsn Instrumentation amplifiern Photodiode and infrared detector preamplifier n Transducer amplifiersn Hand-held analytic instruments n Medical instrumentation n D/A converternCharge amplifier for piezoelectric transducersConnection Diagram8-Pin DIP/SO01142201Top ViewDistribution of LMC6061Input Offset Voltage(T A =+25˚C)01142215April 2001LMC6061Precision CMOS Single Micropower Operational Amplifier©2001National Semiconductor Corporation Absolute Maximum Ratings(Note 1)If Military/Aerospace specified devices are required,please contact the National Semiconductor Sales Office/Distributors for availability and specifications.Differential Input Voltage ±Supply VoltageVoltage at Input/Output Pin (V +)+0.3V,(V −)−0.3VSupply Voltage (V +−V −)16V Output Short Circuit to V +(Note 10)Output Short Circuit to V −(Note 2)Lead Temperature 260˚C(Soldering,10sec.)Storage Temp.Range −65˚C to +150˚CJunction Temperature 150˚C ESD Tolerance (Note 4)2kVCurrent at Input Pin±10mACurrent at Output Pin ±30mACurrent at Power Supply Pin 40mA Power Dissipation(Note 3)Operating Ratings (Note 1)Temperature Range LMC6061AM−55˚C ≤T J ≤+125˚C LMC6061AI,LMC6082I −40˚C ≤T J ≤+85˚C Supply Voltage4.5V ≤V +≤15.5VThermal Resistance (θJA )(Note 11)N Package,8-Pin Molded DIP 115˚C/W M Package,8-Pin Surface Mount193˚C/W Power Dissipation(Note 9)DC Electrical CharacteristicsUnless otherwise specified,all limits guaranteed for T J =25˚C.Boldface limits apply at the temperature extremes.V +=5V,V −=0V,V CM =1.5V,V O =2.5V and R L >1M unless otherwise specified.TypLMC6061AMLMC6061AI LMC6061I Symbol ParameterConditions (Note 9)Limit Limit Limit Units(Note 6)(Note 6)(Note 6)V OS Input Offset Voltage 100350350800µV 12009001300Max TCV OS Input Offset Voltage 1.0µV/˚C Average Drift I B Input Bias Current 0.010pA 10044Max I OS Input Offset Current 0.005pA 10022Max R IN Input Resistance >10Tera ΩCMRR Common Mode 0V ≤V CM ≤12.0V 85757566dB Rejection Ratio V +=15V 707263Min +PSRR Positive Power Supply 5V ≤V +≤15V 85757566dB Rejection Ratio V O =2.5V 707263Min −PSRR Negative Power Supply 0V ≤V −≤−10V100848474dB Rejection Ratio 708171Min V CMInput Common-Mode V +=5V and 15V −0.4−0.1−0.1−0.1V Voltage Rangefor CMRR ≥60dB000Max V +−1.9V +−2.3V +−2.3V +−2.3V V +−2.6V +−2.5V +−2.5Min A VLarge Signal R L =100k ΩSourcing4000400400300V/mV Voltage Gain(Note 7)200300200Min Sinking300018018090V/mV 7010060Min R L =25k ΩSourcing3000400400200V/mV (Note 7)15015080Min Sinking200010010070V/mV 355035MinL M C 6061 2DC Electrical Characteristics(Continued)Unless otherwise specified,all limits guaranteed for T J=25˚C.Boldface limits apply at the temperature extremes.V+=5V,V−=0V,V CM=1.5V,V O=2.5V and R L>1M unless otherwise specified.Typ LMC6061AM LMC6061AI LMC6061ISymbol Parameter Conditions(Note9)Limit Limit Limit Units(Note6)(Note6)(Note6)V O Output Swing V+=5V 4.995 4.990 4.990 4.950VR L=100kΩto2.5V 4.970 4.980 4.925Min0.0050.0100.0100.050V0.0300.0200.075MaxV+=5V 4.990 4.975 4.975 4.950VR L=25kΩto2.5V 4.955 4.965 4.850Min0.0100.0200.0200.050V0.0450.0350.150MaxV+=15V14.99014.97514.97514.950VR L=100kΩto7.5V14.95514.96514.925Min0.0100.0250.0250.050V0.0500.0350.075MaxV+=15V14.96514.90014.90014.850VR L=25kΩto7.5V14.80014.85014.800Min0.0250.0500.0500.100V0.2000.1500.200MaxI O Output Current Sourcing,V O=0V22161613mAV+=5V8108MinSinking,V O=5V21161616mA788Min I O Output Current Sourcing,V O=0V25151515mAV+=15V91010MinSinking,V O=13V26202020mA(Note10)788Min I S Supply Current V+=+5V,V O=1.5V20242432µA353240MaxV+=+15V,V O=7.5V24303040µA403848Max AC Electrical CharacteristicsUnless otherwise specified,all limits guaranteed for T J=25˚C,Boldface limits apply at the temperature extremes.V+=5V,V−=0V,V CM=1.5V,V O=2.5V and R L>1M unless otherwise specified.Typ LMC6061AM LMC6061AI LMC6061ISymbol Parameter Conditions(Note5)Limit Limit Limit Units(Note6)(Note6)(Note6)SR Slew Rate(Note8)35202015V/ms8107Min GBW Gain-Bandwidth Product100kHz θm Phase Margin50Deg eInput-Referred Voltage Noise F=1kHz83AC Electrical Characteristics(Continued)Note 1:Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.Operating Ratings indicate conditions for which the device is intended to be functional,but do not guarantee specific performance limits.For guaranteed specifications and test conditions,see the Electrical Characteristics.The guaranteed specifications apply only for the test conditions listed.Note 2:Applies to both single-supply and split-supply operation.Continous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150˚C.Output currents in excess of ±30mA over long term may adversely affect reliability.Note 3:The maximum power dissipation is a function of T J(Max),θJA ,and T A .The maximum allowable power dissipation at any ambient temperature is P D =(T J(Max)−T A )/θJA .Note 4:Human body model,1.5k Ωin series with 100pF.Note 5:Typical values represent the most likely parametric norm.Note 6:All limits are guaranteed by testing or statistical analysis.Note 7:V +=15V,V CM =7.5V and R L connected to 7.5V.For Sourcing tests,7.5V ≤V O ≤11.5V.For Sinking tests,2.5V ≤V O ≤7.5V.Note 8:V +=15V.Connected as Voltage Follower with 10V step input.Number specified is the slower of the positive and negative slew rates.Note 9:For operating at elevated temperatures the device must be derated based on the thermal resistance θJA with P D =(T J –T A )/θJA .Note 10:Do not connect output to V +,when V +is greater than 13V or reliability witll be adversely affected.Note 11:All numbers apply for packages soldered directly into a PC board.Note 12:For guaranteed Military Temperature Range parameters see RETSMC6061X.L M C 6061 4Typical Performance CharacteristicsV S =±7.5V,T A =25˚C,Unless otherwise specifiedDistribution of LMC6061Input Offset Voltage(T A =+25˚C)Distribution of LMC6061Input Offset Voltage(T A =−55˚C)0114221501142216Distribution of LMC6061Input Offset Voltage(T A =+125˚C)Input Bias Current vs Temperature0114221701142218Supply Current vs Supply Voltage Input Voltage vs Output Voltage0114221901142220LMC60615Typical Performance CharacteristicsV S =±7.5V,T A =25˚C,Unless otherwisespecified (Continued)Common Mode Rejection Ratio vs FrequencyPower Supply Rejection Ratio vs Frequency0114222101142222Input Voltage Noise vs Frequency Output Characteristics Sourcing Current0114222301142224Output CharacteristicsSinking CurrentGain and Phase Responsevs Temperature (−55˚C to +125˚C)0114222501142226L M C 6061 6Typical Performance Characteristics VS=±7.5V,T A=25˚C,Unless otherwise specified(Continued)Gain and Phase Response vs Capacitive Load with R L=20kΩGain and PhaseResponse vs Capacitive Loadwith R L=500kΩ0114222701142228Open Loop Frequency ResponseInverting Small SignalPulse Response 0114222901142230Inverting Large Signal Pulse ResponseNon-Inverting SmallSignal Pulse Response0114223101142232LMC60617Typical Performance CharacteristicsV S =±7.5V,T A =25˚C,Unless otherwisespecified (Continued)Non-Inverting Large Signal Pulse ResponseStability vs Capacitive Load,R L =20k Ω0114223301142234Stability vs Capacitive Load R L =1M Ω01142235L M C 6061 8Applications HintsAMPLIFIER TOPOLOGYThe LMC6061incorporates a novel op-amp design topologythat enables it to maintain rail-to-rail output swing even whendriving a large load.Instead of relying on a push-pull unitygain output buffer stage,the output stage is taken directlyfrom the internal integrator,which provides both low outputimpedance and large gain.Special feed-forward compensa-tion design techniques are incorporated to maintain stabilityover a wider range of operating conditions than traditionalmicropower op-amps.These features make the LMC6061both easier to design with,and provide higher speed thanproducts typically found in this ultra-low power class.COMPENSATING FOR INPUT CAPACITANCEIt is quite common to use large values of feedback resis-tance for amplifiers with ultra-low input current,like theLMC6061.Although the LMC6061is highly stable over a wide range ofoperating conditions,certain precautions must be met toachieve the desired pulse response when a large feedbackresistor is rge feedback resistors and even smallvalues of input capacitance,due to transducers,photo-diodes,and circuit board parasitics,reduce phase margins.When high input impedances are demanded,guarding of theLMC6061is suggested.Guarding input lines will not onlyreduce leakage,but lowers stray input capacitance as well.(See Printed-Circuit-Board Layout for High ImpedanceWork).The effect of input capacitance can be compensated for byadding a capacitor.Place a capacitor,C f,around the feed-back resistor(as in Figure1)such that:orR1C IN≤R2C fSince it is often difficult to know the exact value of C IN,C f canbe experimentally adjusted so that the desired pulse re-sponse is achieved.Refer to the LMC660and the LMC662for a more detailed discussion on compensating for inputcapacitance.CAPACITIVE LOAD TOLERANCEAll rail-to-rail output swing operational amplifiers have volt-age gain in the output stage.A compensation capacitor isnormally included in this integrator stage.The frequencylocation of the dominate pole is affected by the resistive loadon the amplifier.Capacitive load driving capability can beoptimized by using an appropriate resistive load in parallelwith the capacitive load(see typical curves).Direct capacitive loading will reduce the phase margin ofmany op-amps.A pole in the feedback loop is created by thecombination of the op-amp’s output impedance and the ca-pacitive load.This pole induces phase lag at the unity-gaincrossover frequency of the amplifier resulting in either anoscillatory or underdamped pulse response.With a few ex-ternal components,op amps can easily indirectly drive ca-pacitive loads,as shown in Figure2.In the circuit of Figure2,R1and C1serve to counteract theloss of phase margin by feeding the high frequency compo-nent of the output signal back to the amplifier’s invertinginput,thereby preserving phase margin in the overall feed-back loop.Capacitive load driving capability is enhanced by using a pullup resistor to V+Figure3.Typically a pull up resistor con-ducting10µA or more will significantly improve capacitiveload responses.The value of the pull up resistor must bedetermined based on the current sinking capability of theamplifier with respect to the desired output swing.Open loopgain of the amplifier can also be affected by the pull upresistor(see electrical characteristics).01142205FIGURE1.Canceling the Effect of Input Capacitance01142204FIGURE2.LMC6061Noninverting Gain of10Amplifier,Compensated to Handle Capacitive Loads01142214pensating for LargeCapacitive Loads with a Pull Up ResistorLMC60619Applications Hints(Continued)PRINTED-CIRCUIT-BOARD LAYOUT FOR HIGH-IMPEDANCE WORKIt is generally recognized that any circuit which must operate with less than 1000pA of leakage current requires special layout of the PC board.When one wishes to take advantage of the ultra-low bias current of the LMC6061,typically less than 10fA,it is essential to have an excellent layout.Fortu-nately,the techniques of obtaining low leakages are quite simple.First,the user must not ignore the surface leakage of the PC board,even though it may sometimes appear accept-ably low,because under conditions of high humidity or dust or contamination,the surface leakage will be appreciable.To minimize the effect of any surface leakage,lay out a ring of foil completely surrounding the LMC6061’s inputs and theterminals of capacitors,diodes,conductors,resistors,relay terminals etc.connected to the op-amp’s inputs,as in Figure 4.To have a significant effect,guard rings should be placed on both the top and bottom of the PC board.This PC foil must then be connected to a voltage which is at the same voltage as the amplifier inputs,since no leakage current can flow between two points at the same potential.For example,a PC board trace-to-pad resistance of 1012Ω,which is nor-mally considered a very large resistance,could leak 5pA if the trace were a 5V bus adjacent to the pad of the input.This would cause a 100times degradation from the LMC6061’s actual performance.However,if a guard ring is held within 5mV of the inputs,then even a resistance of 1011Ωwould cause only 0.05pA of leakage current.See Figure 5for typical connections of guard rings for standard op-amp configurations.01142206FIGURE 4.Example of Guard Ring in P .C.Board LayoutL M C 6061 10Applications Hints(Continued)The designer should be aware that when it is inappropriate to lay out a PC board for the sake of just a few circuits,there is another technique which is even better than a guard ring on a PC board:Don’t insert the amplifier’s input pin into the board at all,but bend it up in the air and use only air as an insulator.Air is an excellent insulator.In this case you may have to forego some of the advantages of PC board con-struction,but the advantages are sometimes well worth the effort of using point-to-point up-in-the-air wiring.See Figure tchupCMOS devices tend to be susceptible to latchup due to their internal parasitic SCR effects.The(I/O)input and output pins look similar to the gate of the SCR.There is a minimum current required to trigger the SCR gate lead.The LMC6061 and LMC6081are designed to withstand100mA surge current on the I/O pins.Some resistive method should be used to isolate any capacitance from supplying excess cur-rent to the I/O pins.In addition,like an SCR,there is a minimum holding current for any latchup mode.Limiting current to the supply pins will also inhibit latchup suscepti-bility.Typical Single-SupplyApplications(V+=5.0VDC)The extremely high input impedance,and low power con-sumption,of the LMC6061make it ideal for applications that require battery-powered instrumentation amplifiers.Ex-amples of these types of applications are hand-held pH probes,analytic medical instruments,magnetic field detec-tors,gas detectors,and silicon based pressure transducers. Figure7shows an instrumentation amplifier that features high differential and common mode input resistance (>1014Ω),0.01%gain accuracy at A V=100,excellent CMRR with1kΩimbalance in bridge source resistance. Input current is less than100fA and offset drift is less than 2.5µV/˚C.R2provides a simple means of adjusting gain over a wide range without degrading CMRR.R7is an initial trim used to maximize CMRR without using super precision matched resistors.For good CMRR over temperature,low drift resistors should be used.01142207Inverting Amplifier01142208 Non-Inverting Amplifier01142209FollowerFIGURE5.Typical Connections of Guard Rings01142210 (Input pins are lifted out of PC board and soldered directly to components.All other pins connected to PC board).FIGURE6.Air WiringLMC606111Typical Single-Supply Applications (V +=5.0V DC )(Continued)01142211If R 1=R 5,R 3=R 6,and R 4=R 7;then∴A V ≈100for circuit shown (R 2=9.822k).FIGURE 7.Instrumentation Amplifier01142212FIGURE 8.Low-Leakage Sample and HoldL M C 6061 12Typical Single-Supply Applications (V +=5.0V DC )(Continued)Ordering InformationPackageTemperature Range NSC DrawingTransport MediaMilitary Industrial −55˚C to +125˚C−40˚C to +85˚C 8-Pin LMC6061AIN N08ERailMolded DIP LMC6061IN 8-Pin LMC6061AIM,LMC606AIMX M08ARail Small Outline LMC6061IM,LMC6061IMXTape and Reel8-Pin LMC6061AMJ/883J08A RailCeramic DIP01142213FIGURE 9.1Hz Square Wave OscillatorLMC606113Physical Dimensionsinches (millimeters)unless otherwise noted8-Pin Ceramic Dual-In-Line Package Order Number LMC6061AMJ/883NS Package Number J08AL M C 6061 14Physical Dimensionsinches (millimeters)unless otherwise noted (Continued)8-Pin Small Outline PackageOrder Number LMC6061AIM,LMC6061AIMX,LMC6061IM or LMC6061IMXNS Package Number M08A8-Pin Molded Dual-In-Line Package Order Number LMC6061AIN or LMC6061INNS Package Number N08ELMC606115NotesLIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION.As used herein:1.Life support devices or systems are devices or systems which,(a)are intended for surgical implant into the body,or (b)support or sustain life,and whose failure to perform when properly used in accordance with instructions for use provided in the labeling,can be reasonably expected to result in a significant injury to the user.2.A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system,or to affect its safety or effectiveness.National Semiconductor Corporation AmericasTel:1-800-272-9959Fax:1-800-737-7018Email:support@National Semiconductor EuropeFax:+49(0)180-5308586Email:europe.support@Deutsch Tel:+49(0)6995086208English Tel:+44(0)8702402171Français Tel:+33(0)141918790National Semiconductor Asia Pacific Customer Response Group Tel:65-2544466Fax:65-2504466Email:ap.support@National Semiconductor Japan Ltd.Tel:81-3-5639-7560Fax:81-3-5639-7507L M C 6061P r e c i s i o n C M O S S i n g l e M i c r o p o w e r O p e r a t i o n a l A m p l i f i e rNational does not assume any responsibility for use of any circuitry described,no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this 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6061铝合金性能及介绍

1.6061铝合金基本情况6061铝合金属热处理可强化合金，具有良好的可成型性、可焊接性、可机加工性能，同时具有中等强度，在退火后仍能维持较好的强度。

6061铝合金的主要合金元素是镁与硅，并形成Mg2Si相。

若含有一定量的锰与铬，可以中和铁的坏作用；有时还添加少量的铜或锌，以提高合金的强度，而又不使其抗蚀性有明显降低；导电材料中还有少量的铜，以抵销钛及铁对导电性的不良影响；锆或钛能细化晶粒与控制再结晶组织；为了改善可切削性能，可加入铅与铋。

6061铝合金的熔化温度在582~652℃，老牌号为LD30。

2.典型用途一、板带的应用广泛应用于装饰、包装、建筑、运输、电子、航空、航天、兵器等各行各业。

二、航空航天用铝材用于制作飞机蒙皮、机身框架、大梁、旋翼、螺旋桨、油箱、壁板和起落架支柱，以及火箭锻环、宇宙飞船壁板等。

三、交通运输用铝材用于汽车、地铁车辆、铁路客车、高速客车的车体结构件材料，车门窗、货架、汽车发动机零件、空调器、散热器、车身板、轮毂及舰艇用材。

四、包装用铝材全铝易拉罐制罐料主要以薄板与箔材的形式作为金属包装材料,制成罐、盖、瓶、桶、包装箔。

广泛用于饮料、食品、化妆品、药品、香烟、工业产品等包装。

五、印刷用铝材主要用于制作PS版，铝基PS版是印刷业的一种新型材料，用于自动化制版和印刷。

六、建筑装饰用铝材铝合金因其良好的抗蚀性、足够的强度、优良的工艺性能和焊接性能，主要广泛用于建筑物构架、门窗、吊顶、装饰面等。

如各种建筑门窗、幕墙用铝型材、铝幕墙板、压型板、花纹板、彩色涂层铝板等。

七、电子家电用铝材主要用于各种母线、架线、导体、电气元件、冰箱、空调、电缆等领域。

3.热处理工艺1）快速退火：加热温度350～410℃，随材料有效厚度的不同，保温时间在30～120min之间，空气或水冷。

2）高温退火：加热温度350～500℃，成品厚度≥6mm时，保温时间为10～30min、<6mm时，热透为止，空气冷。

6061铝合金参数

6061铝合金参数1.化学组成：
-铝（Al）：余量
-铜（Cu）：0.15-0.40%
-硅（Si）：0.4-0.8%
-镁（Mg）：0.8-1.2%
-锰（Mn）：0.04-0.08%
-铬（Cr）：0.04-0.35%
-锌（Zn）：0.25%
-钛（Ti）：0.15%
-铁（Fe）：0.7%
2.力学性能：
- 抗拉强度（Tensile Strength）：≥280 MPa - 屈服强度（Yield Strength）：≥240 MPa
- 延伸率（Elongation）：≥8%
- 硬度（Hardness）：≥95 HB
3.热处理：
-T6处理：通过固溶处理和人工时效处理实现。

在固溶处理过程中，
铝合金的晶体结构发生变化，溶解处的Cu、Mg和Si等元素溶解。

然后，
通过人工时效处理使合金中形成均匀细小的弥散相，从而提高强度和硬度。

-T651处理：类似于T6处理，但在人工时效处理中，铝合金经过高
温均匀回火处理，以减小内部残余应力和提高材料的抗拉和抗压强度。

4.加工性能：
-优异的切削性：具有较低的切削力和良好的切削刃口，适合通过切
削加工方法进行精密加工。

-良好的焊接性能：适合气焊、电阻焊、摩擦搅拌焊和激光焊接等各
种焊接方法。

-易于成型和变形：6061铝合金具有良好的塑性和可锻性，可通过热
锻和冷锻等方法进行形状加工和变形加工。

-耐蚀性好：6061铝合金在大多数工业环境中具有良好的耐腐蚀性能，但在酸性环境中易于受腐蚀。

总结：。

6061铝板重量计算

6061铝板重量计算6061铝板是一种常用的铝合金材料，其主要成分为铝、镁和硅。

根据不同的厚度和尺寸，6061铝板的重量也会不同。

下面将详细介绍6061铝板重量的计算方法。

首先，要计算6061铝板的重量，需要知道其厚度、宽度和长度。

对于不同尺寸的铝板，其重量的计算方式是不同的。

在这里，我们假设铝板的厚度为t，宽度为w，长度为l。

其次，我们需要知道6061铝板的密度。

根据相关参考资料，6061铝板的密度约为2.7g/cm^3。

密度是指单位体积内的质量，因此我们可以使用密度来计算6061铝板的重量。

计算公式为：重量=面积×密度首先计算面积，面积的计算公式为：面积=宽度×长度，单位为平方厘米（cm^2）。

然后，将面积乘以厚度，就可以得到6061铝板的体积。

体积的计算公式为：体积=面积×厚度，单位为立方厘米（cm^3）。

最后，将体积乘以密度，就可以得到6061铝板的重量。

重量的计算公式为：重量=体积×密度，单位为克（g）。

可以看出，6061铝板的重量与其厚度、宽度和长度密切相关。

通常情况下，模具行业更关注6061铝板的重量，因为重量的增加会增加模具的成本和影响模具的可靠性。

而工程行业更关注6061铝板的材料性能及力学性能，因为这些对工程项目的成功与否具有重要意义。

需要注意的是，上述计算公式适用于普通形状的6061铝板，如矩形、正方形等。

对于复杂形状的铝板，可以将其拆分为多个普通形状的部分进行计算，然后将各个部分的重量相加即可得到总重量。

在实际应用中，我们还需要注意单位的换算。

如果需要将重量换算为其他单位，可以根据需求进行换算，常用的换算单位有千克（kg）和吨（t）。

总结起来，6061铝板的重量计算方法是根据其厚度、宽度和长度来计算面积，进而计算体积，最后根据密度计算重量。

根据不同的形状和尺寸，可以使用相应的计算公式来得到准确的结果。

6061成分及性能

进口6061 阳极氧化铝合金线棒排板材日本优质环保 6061铝合金铝排西南铝南非铝 6061 T651态板带棒材6061 合金铝简介属热处理可强化合金，具有良好的可成型性、可焊接性、可机加工性和，同时具有中等强度，在退火后仍能维持较好的操作性.6061典型用途航空固定装置，卡车，塔式建筑，船，管道及其他需要有强度、可焊性和抗腐蚀性能的建筑上的应用的领域。

6061的一般特点：优良的接口特征、容易涂层、强度高、可使用性好，抗腐蚀性强。

材料名称：铝及铝合金挤压棒材(≤150mm,H112、T6态)牌号：6061标准：GB/T 3191-19986061特性及适用范围：属于Al-Mg-Si系合金,使用范围广泛,特别是建筑业离不开此合金，是最有前途的合金。

耐蚀性好，焊接性优良，冷加工性较好，并具有中等强度。

6061化学成分：注：单个:≤0.05;合计:≤0.15一些铝合金可以采用热处理获得良好的机械性能，物理性能和抗腐蚀性能铸造铝合金按化学成分可分为铝硅合金，铝铜合金，铝镁合金，铝锌合金和铝稀土合金，其中铝硅合金又有简单铝硅合金（不能热处理强化，力学性能较低，铸造性能好），特殊铝硅合金（可热处理强化，力学性能较高，铸造性能良好）铝合金的用途：主要用于制造航空器材、日常生活用品、建筑用门窗等主要经营铝合金经营美国“ALCOA”优质铝板、铝棒范围:6061-T6 7075-T651 A5052-H32 7075-T6 6061-T651 5052-H112 5086-H325083-H111 5083-H1121100 1050 10606063 5083 5086 2011 2017 20243003 7022 7050 7072 6060 6061 7075 5052 等合金铝板/棒/管材等经营国产优质铝板、铝棒范围:6061-T6 7075-T651 A5052-H32 7075-T6 6061-T651 5083-H111 1050 10606061 7075 5052 6063 5083 5086 6062 6082-T6 6262 5154 5754 53563000 491 LY12 7009等合金铝板/棒/管材等合金铝板／棒（棒材：6-220长2200/4000）整板规格为:1000mm*2000mm 1220 mm *2440 mm 1200 mm *2500 mm 1200mm*4000 mm铝板厚度如下：6061：2 mm～235 mm 7075：2 mm～280 mm 5083：8 mm～ 260 mm 6063：2mm～170mm 6082：2mm～260mm T6061-T6：2mm～250mmA5052-H32：0.5mm～200mm T7075-651：3mm～180mm等等铝板牌号：7075/7050/7055/7475/6061/6082/5052/5083/3003/2024/2014/2017/1100/1070/1060/1050/无缝铝管：6061/6063/2024/5056/5052/NC5/7075铝排/六角铝棒牌号:6061/6063/6262/6201/6020/6082/7075/7005/7003/2011/ 2024/2017/2014/5052/5056/5083/1100/1060/1070/1050/1435/NC0/NC1/NC2/NC5/NC6进口铝板1100、2024、5052(韩铝)、6061、7075（美铝）、7050（美铝）、7475（美铝）、7005 7055 6082厚度：2-500mm进口铝棒2011、2017、2024、5052、6061T6511、7075T651（美铝）直径25~400mm国产优质合金铝板7075-T6/T651 6061-T6/T651 5083-H112东北轻6082-T6512017-T4 5052广州板3003-H14 1100 H14 1050H24 1060H28厚度：0.3~500 mm国产优质合金铝棒2017-T3/T8 2011-T3/T82024-T46061-T651 6063-T6 7075-T6517005 1100H14直径：3 -500 mm特殊牌号材料：板（棒）5005 5154 5056 6351 6060 6262 6082 7003 7005 7475直径：3-160 mm优质铝管6061、6063、7075、5083 2024 5056 5052 7005壁厚0.8300 mm无缝铝管5052 6061 6063 5056 2024 7075壁厚390 mm铝棒规格:最大直径:500mm (进口铝棒现货)其他规格可为客户开料订做。

SCM6061-GL-DN中文资料

Technical SpecificationforOptical Transceiver ModuleSCM6061Sumitomo Electric reserves the right to make changes in this specification without prior notice.3R )#Safety PrecautionSymbols This specification uses various picture symbols to prevent possible injury to operator or otherpersons or damage to properties for appropriate use of the product. The symbols and definitions are as shown below. Be sure to be familiar with these symbols before reading this specification.Warning Wrong operation without following this instruction may lead to human death or serious injury.CautionWrong operation without following this instruction may lead to human injury or property damage.Example of picture symbolsindicates prohibition of actions. Action details are explained thereafter.( 2 X 10 )Applicable Part Numbers : SCM6061-GL-ZN, SCM6061-GL-CN, SCM6061-GL-DNSCM6061-GL-ZW,SCM6061-GL-CW,SCM6061-GL-DW1. GeneralFeatures of SCM6061 are listed below.* SDH STM-1 L-1.2 / SONET OC-3 LR-2 Compliant * Power Supply Voltage Single +3.3V * Compact Package Size 49 X 13.59 X 9.8 mm (max.)* Electrical Interface LVPECL for DATA and LVTTL for Signal Detect and Laser Disable * Fiber Coupled Power 0 ~ -5dBm (Typ. -3dBm) for SMF * Input Power Range -10 ~ -34dBm (Typ. Sensitivity -37dBm)* Optical Reflectance -25dB(max.)* Monitor Functions Laser Bias Monitor, Rear Facet Monitor * Laser Disable Function* Signal Detect (SD) Function * Connector Interface LC Duplex Receptacle2. Block DiagramDo not disassemble this product. Otherwise, failure, electrical shock, overheating or fire may occur.Tdis(Laser Bias Monitor)TD TDb(Rear Facet Monitor)Figure 1. Block Diagram (Transmitter)Figure 2. Block Diagram (Receiver)RDRDb SD3. Package DimensionAll dimensions are in mm.Figure 3. Outline Dimensions (SCM6061-GL-ZN)(Conductive Area)Figure 5. Outline Dimensions (SCM6061-GL-CN)Type-C EMI finger is an option for transceivers to be used on the card-edge with the receptacle protruding through a panel opening. It has fingers on three sides to makeelectrical contact with the sides of the bezel opening for grounding purpose.EMI finger (Type-C)(Conductive Area)All dimensions are in mm.Figure 7. Outline Dimensions (SCM6061-GL-DN)Type-D EMI finger is an option for transceivers to be used on the card-edge with the receptacle protruding through a panel opening. It has fingers on four sides to make electrical contact with the sides of the bezel opening for grounding purpose.EMI finger (Type-D)All dimensions are in mm.Figure 8. Bottom Side (SCM6061-GL-DN)(Conductive Area)Figure 9. Recommended Footprint10.16±0.1013.97±0.10Top of PCBSECTION A-A [Type-C finger]13.25Max 11.82Min 15.9MaxSECTION A-A [Type-D finger]4. Pin Assignment5. Absolute Maximum RatingsUse the product with the rated voltage described in the specification. If the voltage exceeds the maximum rating, overheating or fire Figure 11. Bottom Viewsing Lead P IN P O U T* Mounting Studs are provided for mechanical support to the circuit board.It is recommended that the holes in the circuitboard be connected to frame ground.* Housing Leads are internally connected to VeeR and VeeT.* Stand-Offs provide gap between the circuitboard and the module to help escape residual water after aqueous wash.1. I/O/P stand f or signal input, signal output, and DC power/bias supply , respectiv ely.2. Ref er t o f igure 13 f or det ails of Bmon and Pmon outputs.1. No condensation allowed.2. SCM6061-GL-#N3. SCM6061-GL-#W4. TD, TDb, Tdis5. Measured on lead pin at 2mm (0.079in.) off the package bottom6. Electrical Interface( Unless otherwise specified, Vcc = 3.135 to 3.465 V and all operating temperature shall apply. )6-1. Transmitter side6-2. Receiver sideFigure 13. Bmon and Pmon Interfacein 20m o n +P in17B m o n P in 18B m o n P in 19m o n -Figure 12. Internal Bias of Input Terminal R 1R 2R 1+R 2= 1.3k Ω ( typ.)R 2R 1+R 22.03.3=1. Input current is not included.2. 50% duty cycle data.3. 155.52Mbps, PRBS2^23-1, NRZ.4. SCM6061-GL-#N5. SCM6061-GL-#W6. Vcc=+3.3V7. Tc=25°C8. Input Terminal is biased internally, as shown in the figure10.9. 20-80%.10. LVTTL input.Refer to Section 8, "Relation between Disable Input Voltage and Optiical Output Power", for detail.11. The Laser Bias Monitor Current and Rear Facet Monitor Current are calculated as ratios between the corresponding voltages and currentsensing resistors, 10Ω and 200Ω, as shown in the figure 13. High impedance (>1M Ω) device is required to measure this voltage.1. Output current is not included. 155.52Mbps, PRBS2^23-1, NRZ.2. SCM6061-GL-#N3. SCM6061-GL-#W4. Vcc=3.3V, Tc=25°C. Output load resistance Rl=50Ω to Vcc-2V for RD, RDb.7-2. Receiver side8. Relation between Disable Input Voltage and Optical Output Power7. Optical Interface( Unless otherwise specified, Vcc = 3.135 to 3.465 V and all operating temperature shall apply. )7-1. Transmitter sideDo not look at the laser beam projection area (e.g. end of optical connector) with naked eyes or through optical equipment while the power is supplied to this product. Otherwise, your eyes may be injured.0.150.350.650.850.001.201.000.800.500.200.00-0.201.00N o r m a l i z e d A m p l i tu d eRelation between Input SignalFigure 14. Optical Pulse Mask with Fourth OrderBessel-Thomson Filter Specified in ITU-T G.9571. BER=10^-102. Measured at the bit rate of 155.52Mbps, PRBS 2^23-1, NRZ1. Measured at 155.52Mbps PRBS2^23-19. Recommended Interface CircuitFigure 15. Recommended Interface CircuitN ot es :(1) C o m p o ne n ts o n R D /R D b lin es ,240 Ωa n d 0.47u F ,s h o uld b e p lac e d a s c lo s e as p os s ib le to m od u le p in s.(2) 0.1u F c a p a c it o rs o n V c c R /V c c T lin es s h ou ld b e a s c lo s e a s p os s ib le to m o du le p in s.(3) 50Ωlin e p at te rn a nd c o m po n en t p lac e m en ts o n R D /R D b a nd T D /T D b line s s h o u ld b e s y m m e tric a l f or be t te r im p e d an c e m at c hin g.(4) H L is in te rn ally c o n n ec t ed t o V ee R a n d Ve e T.V c c R (+3.3V V p d(+3.3V T (+3.3V )u ra ta )(M ura ta )10. Reliability Test Program11. Laser SafetyThis product uses a semiconductor laser system and is a laser class 1product acceptable FDA, complies with 21CFR 1040. 10 and 1040.11. Alsothis product is a laser class 1 product acceptable IEC 60825.If this product is used under conditions not recommended in the specification or this product is used with unauthorized revision,classfication for laser product safety standard is invalid. Classify the product again at your responsibility and take appropriateC : Maximum number of failure allowed to pass the test.Be sure to turn the power off when you touch this product connected to the printed circuit boards. Otherwise, electric shock may occur.Dispose this product or equipment including this product properly as an industrial waste according to the regulations.Be sure to carry out correct soldering for connection to peripheral circuits in order to prevent contact failure or short-circuit. Other-wise, a strong laser beam may cause eye injury, overheating or fire.Do not put this product or components of this product into your mouth. This product contaions material harmful to health.12. Other PrecautionUnder such a strong vibration environment as in automobile, the performance and reliability are not guaranteed.The governmental approval is required to export this product to other countries. To dispose of these components,the appropriate procedure should be taken to prevent illegal exportation.This module must be handled, used and disposed of according to your company's safe working practice.13. Ordering Information13-1. Ordering Number13-2. Part Number on LabelD uplex Receptacle, Metallized )O perating Case Temperature N :Tc=-5~70W :Tc=-40~85EMI Shield Finger O ption Z:W ithout FingerC :W ith Type-C FingerD :W ith Type-D Finger°C °C Part N um ber on Label O pera ting T em peratureSC M6061 - G L SC M6061 - G L - WT c=-5~70°C T c=-40~85°C14. For More InformationU.S.A.ExceLight Communications, 4021 Stirrup Creek Drive, Suite 200 Durham, NC 27703Tel. +1-919-361-1600 / Fax. +1-919-361-1619E-mail: info@EuropeSumitomo Electric Europe Ltd., 220, Centennial Park, Elstree, Herts, WD6 3SL, United Kingdom Tel. +44-208-953-8681Fax. +44-208-207-5950E-mail: photonics@JapanSumitomo Electric Industries, Ltd. ( Business Development ), 1, Taya-cho, Sakae-ku Yokohama, 244-8588Tel. +81-45-853-7154 / Fax. +81-45-851-1932E-mail: p roduct-info@ppd.sei.co.jphttp://www.sei.co.jp/Electro-optic/index_e.html。

铝合金6061的成分

铝合金6061的成分、性能与典型用途中国铝业网发布日期：2007-12-20 点击次数：6061合金中的主要合金元素为镁与硅，具有中等强度、良好的抗腐蚀性、可焊接性，氧化效果较好。

广泛应用于要求有一定强度和抗蚀性高的各种工业结构件，如制造卡车、塔式建筑、船舶、电车、铁道车辆、家具等。

化学成分(Chemical Composition Limits wt%)Cu Si Fe Mn Mg Zn Cr TiPb.BiAl0.15-0.40.4-0.8 0.7 0.150.8-1.20.250.04-0.350.15 / 余量典型机械和物理性能(Typical Mechanical & Physical Properties)焊接性切削性耐蚀性电导率20℃(68℉)(%IACS)密度(20℃)(g/cm3)很好一般较好40-50 2.70抗拉强度(25°C MPa)屈服强度(25°CMPa)硬度500kg力10mm球延伸率1.6mm(1/16in)厚度最大剪应力MPa310 276 95 12 205 6061-T6，抗拉强度〉290MPa，屈服强度〉240MPa，伸长率>=6-10%.6061-T5，抗拉强度〉262MPa，屈服强度〉241MPa，伸长率〉8%，硬度50-73HRB。

根据GBT16865查询Hardness, Brinell 95布氏硬度95Tensile Yield Strength 276 MPa抗拉强度276 MPaElongation at Break 12.0 % -17%伸长率 12.0 % -17%6061T6，我们公司现在这样做：535℃淬火，水温30～40℃，180℃时效。

你们的固溶处理工艺有问题呢.6061合金的固溶处理温度应该是530度.560度是6061合金的均匀化温度,是用来处理铸锭的,你们用这么高的温度来处理加工材,当然会过烧啰.不信你仔细看一看,型材的断口上是不是呈很细小的颗粒状!过烧的金属其硬度和强度当然很低啰!6063的T6规范：520~540℃固溶~~~~分钟（依壁厚而定），如果是热加工出来的，热加工终了温度大于510℃的，可不需要保温；冷却到室温后，在24小时内，放入时效炉内，175℃保温6~8小时；出炉，风冷。

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D ROW SPACING
1
04
1
GT
PLATING G = Gold Flash overall T = 100u" Tin overall TAIL LENGTH 1 = Standard Lengh 2 = Special Lengh, customer specified as tail length/ total length
16 18 20 24 28 20 22 24 28 32 24 28 32 36 40 42 48 50 52 50 52
B .200 [5.08] .300 [7.62] .400 [10.16] .600 [15.24] .700 [17.78] .800 [20.32] .900 [22.86] 1.10 [27.94] 1.30 [33.02] .900 [22.86] 1.00 [25.40] 1.10 [27.94] 1.30 [33.02] 1.50 [38.10] 1.10 [27.94] 1.30 [33.02] 1.50 [38.10] 1.70 [43.18] 1.90 [48.26] 1.90 [48.26] 2.30 [58.42] 2.40 [60.96] 2.50 [63.50] 2.40 [60.96] 2.50 [63.50]
®
ORDERING INFORMATION OPEN FRAME SCREW MACHINE SOCKETS & TERMINALS ICM
SERIES INDICATOR ICM = Screw Machine IC Socket TMC = Screw Machine DIP Terminals
RoHS
COMPLIANT
PLATING GT = Gold plated inner contact Tin plated outer sleeve TT = Tin plated inner contact TAIL LENGTH Tin plated 1 = Standard Lengh outer sleeve
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SCREW MACHINE SOCKETS & TERMINAL STRIPS
ICM SERIES
INTRODUCTION: Adam Tech ICM Series Machine Pin Sockets and Terminal Strips offer a full range of exceptional quality, high reliability DIP and SIP package Sockets and Terminal Strips. Our sockets feature solid, precision turned sleeves with a closed bottom design to eliminate flux intrusion and solder wicking during soldering. Adam Tech’s stamped spring copper insert provides an excellent connection and allows repeated insertion and withdrawals. Plating options include choice of gold, tin or selective gold plating. Our insulators are molded of UL94V-0 thermoplastic and both Sockets and Terminal Strips are XY stackable. FEATURES: High Pressure Contacts Precision Stamped Internal Spring Contact Anti-Solder Wicking design Machine Insertable Single or Dual Row Low Profile MATING COMPONENTS: Any industry standard components with SIP or DIP leads SPECIFICATIONS: Material: Standard insulator: PBT, Glass reinforced, rated UL94V-0 Optional Hi-Temp insulator: Nylon 6T, rated UL94V-0 Insulator Color: Black Contacts: Phosphor Bronze Contact Plating: Gold over Nickel underplate and Tin over copper underplate Electrical: Operating voltage: 250V AC max. Current rating: 1 Amp max. Contact resistance: 30 mΩ max. initial Insulation resistance: 1000 MΩ min. Dielectric withstanding voltage: 500V AC for 1 minute Mechanical: Insertion force: 400 grams initial max with .025 dia. leads Withdrawal force: 90 grams initial min with .025 dia. leads Temperature Rating: Operating temperature: -55°C to +105°C Soldering process temperature: Standard insulator: 235°C Hi-Temp insulator: 260plastic tubes APPROVALS AND CERTIFICATIONS: UL Recognized File No. E224053 CSA Certified File No. LR1578596 UL
.118 [3.00]
ø .052 [1.32]
ø.020 [0.50]
TMC SERIES
DUAL ROW TERMINALS
A B
D C ø.017 [0.44] .118 [3.00] .118 [3.00] .162 [4.13] ø.017 [0.44] .118 [3.00] .470 [11.96]
HI-TEMP
INSULATOR
AVA I L A B L E
SMC
SERIES INDICATOR 1SMC = .039 (1.00mm) Screw machine contact socket HSMC = .050 (1.27mm) Screw machine contact socket 2SMC = .078 (2.00mm) Screw machine contact socket SMC = .100 (2.54mm) Screw machine contact socket
SEE PHOTOS & DRAWINGS PGS.184-185
TAIL LENGTH 1 = Standard DIP Length 2 = Wire wrap tails
ORDERING INFORMATION SCREW MACHINE SOCKETS 1 04
POSITIONS Single Row: 01 thru 40 Dual Row: 02 thru 80
1
GT
Pb
®
®
E DCOMPLIANT
2002 / 95 / EC
RoHS V
OPTIONS: (MCT series on pg. 183) Add designator(s) to end of part number SMT = Surface mount leads Dual Row SMT-A = Surface mount leads Type A SMT-B = Surface mount leads Type B HT = Hi-Temp insulator for Hi-Temp soldering processes up to 260°C
元器件交易网
Adam Technologies, Inc.
ICM SERIES
DUAL ROW SOCKET
A B
SCREW MACHINE SOCKETS & TERMINAL STRIPS
ICM SERIES
D
C
ICM-624-1-GT
.178 [4.52]
.292 [7.43] .114 [2.91] .100 [2.54]
6
28
POSITIONS 06 Thru 52
1
GT
PLATING GT = Gold plated inner contact Tin plated outer sleeve TT = Tin plated inner contact Tin plated outer sleeve
ROW SPACING 3 = .300" Row Spacing Positions: 06, 08, 10, 14, 16, 18, 20, 24, 28 4 = .400" Row Spacing Positions: 20, 22, 24, 28, 32, 6 = .600" Row Spacing Positions: 20, 22, 24, 28, 32, 36, 40, 42, 48, 50, 52 9 = .900" Row Spacing Positions: 50 & 52
BODY STYLE 1 = Single Row Straight 1R = Single Row Right Angle 2 = Dual Row Straight 2R = Dual Row Right Angle