SN54LS195AFK中文资料
SNJ54AC32W中文资料
PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-87614012A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-8761401CA ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type 5962-8761401DA ACTIVE CFP W 141TBD A42N /A for Pkg Type SN74AC32D ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC32DBLE OBSOLETE SSOP DB 14TBDCall TI Call TISN74AC32DBR ACTIVE SSOP DB 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC32DBRE4ACTIVE SSOP DB 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC32DE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC32DG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC32DR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC32DRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC32DRG4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC32N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AC32NE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AC32NSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC32NSRE4ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC32PW ACTIVE TSSOP PW 1490Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC32PWE4ACTIVE TSSOP PW 1490Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC32PWLE OBSOLETE TSSOP PW 14TBDCall TI Call TISN74AC32PWR ACTIVE TSSOP PW 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC32PWRE4ACTIVE TSSOP PW 142000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIMSNJ54AC32FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54AC32J ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type SNJ54AC32WACTIVECFPW141TBDA42N /A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.6-Dec-2006(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.6-Dec-2006IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityLow Power Wireless /lpw Telephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2006, Texas Instruments Incorporated。
SNJ54LS374W中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-7801102VRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC 5962-7801102VSA ACTIVE CFP W201None Call TI Level-NC-NC-NC 78011022A ACTIVE LCCC FK201None Call TI Level-NC-NC-NC 7801102RA ACTIVE CDIP J201None Call TI Level-NC-NC-NC 7801102SA ACTIVE CFP W201None Call TI Level-NC-NC-NC JM38510/32502B2A ACTIVE LCCC FK201None Call TI Level-NC-NC-NC JM38510/32502BRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC JM38510/32502BSA ACTIVE CFP W201None Call TI Level-NC-NC-NC JM38510/32502SRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC JM38510/32502SSA ACTIVE CFP W201None Call TI Level-NC-NC-NC JM38510/32503B2A ACTIVE LCCC FK201None Call TI Level-NC-NC-NC JM38510/32503BRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC JM38510/32503BSA ACTIVE CFP W201None Call TI Level-NC-NC-NC SN54LS373J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SN54LS374J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SN54S373J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SN54S374J ACTIVE CDIP J201None Call TI Level-NC-NC-NCSN74LS373DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74LS373DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74LS373N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS373N3OBSOLETE PDIP N20None Call TI Call TISN74LS373NSR ACTIVE SO NS202000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS374DBR ACTIVE SSOP DB202000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS374DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74LS374DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74LS374J OBSOLETE CDIP J20None Call TI Call TISN74LS374N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS374N3OBSOLETE PDIP N20None Call TI Call TISN74LS374NSR ACTIVE SO NS202000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74S373DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74S373DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74S373J OBSOLETE CDIP J20None Call TI Call TISN74S373N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S373N3OBSOLETE PDIP N20None Call TI Call TIOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74S374DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74S374DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74S374J OBSOLETE CDIP J20None Call TI Call TISN74S374N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S374N3OBSOLETE PDIP N20None Call TI Call TISN74S374NSR ACTIVE SO NS202000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSNJ54LS373FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54LS373J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SNJ54LS373W ACTIVE CFP W201None Call TI Level-NC-NC-NC SNJ54LS374FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54LS374J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SNJ54LS374W ACTIVE CFP W201None Call TI Level-NC-NC-NC SNJ54S373FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54S373J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SNJ54S374FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54S374J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SNJ54S374W ACTIVE CFP W201None Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-May not be currently available-please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead(Pb-Free).Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean"Pb-Free"and in addition,uses package materials that do not contain halogens, including bromine(Br)or antimony(Sb)above0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
54LS154中文资料
Original Creation Date: 04/13/98Last Update Date: 06/16/98Last Major Revision Date: 04/13/98MNDM54LS154-X REV 0A0MICROCIRCUIT DATA SHEET4-LINE to 16-LINEDECODERS/DEMULTIPLEXERSGeneral DescriptionEach of these 4-line to 16-line decoders utilizes TTL circuitry to decode four binary -coded inputs into one of sixteen mutually exclusive outputs when both the strobe inputs,G1 and G2 are LOW. The demultiplexing function is performed by using the four input lines to address the output line, passing data from one of the strobe inputs with the other strobe input LOW. When either strobe input is HIGH, all outputs are HIGH. Thesedemultiplexers are ideally suited for implementing high-performance memory decoders. All inputs are buffered and input clamping diodes are provided to minimize transmission- line effects and thereby simplify system design.NS Part NumbersDM54LS154J/883Industry Part Number54LS154Prime DieR154Controlling Document8301701JAProcessingMIL-STD-883, Method 5004Quality Conformance InspectionMIL-STD-883, Method 5005Subgrp Description Temp ( C)o 1Static tests at +252Static tests at +1253Static tests at -554Dynamic tests at +255Dynamic tests at +1256Dynamic tests at -557Functional tests at +258A Functional tests at +1258B Functional tests at -559Switching tests at +2510Switching tests at +12511Switching tests at-55MICROCIRCUIT DATA SHEET MNDM54LS154-X REV 0A0FeaturesMICROCIRCUIT DATA SHEET MNDM54LS154-X REV 0A0(Absolute Maximum Ratings)(Note 1)Storage Temperature-65 C to +150 CAmbient Temperature under Bias-55 C to +125 CInput Voltage-0.5V to +7.0VVCC Pin Potential to Ground Pin-0.5V to +7.0VJunction Temperature under Bias-55C to +175CCurrent Applied to Output in LOW state (Max)twice the rated Iol (ma)Note 1:Absolute Maximum ratings are those values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is notimplied.Recommended Operating ConditionsFree Air Ambient TemperatureMilitary-55 C to +125 CSupply VoltageMilitary+4.5V to +5.5VMNDM54LS154-X REV 0A0MICROCIRCUIT DATA SHEETElectrical CharacteristicsDC PARAMETER(The following conditions apply to all the following parameters, unless otherwise specified.)DC:VCC 4.5V to 5.5V, Temp range: -55C to 125CSYMBOL PARAMETER CONDITIONS NOTES PIN-NAME MIN MAX UNITSUB-GROUPSIIH Input HighCurrent VCC=5.5V, VM=2.7V, VINL=0.0V,VINH=4.5V1, 3INPUTS20.0uA1, 2,3IBVI Input HighCurrent VCC=5.5V, VM=7.0V, VINH=4.5V,VINL=0.0V1, 3INPUTS100uA1, 2,3IIL Input LOW Current VCC=5.5V, VM=0.4V, VINL=0.0V,VINH=4.5V 1, 3D1, D2-0.4mA1, 2,3VOL Output LOWVoltage VCC=4.5V, VIH=2.0V, IOL=4.0mA,VINH=4.5V, VIL=0.7V1, 3OUTPUTS0.4V1, 2,3VOH High Level OutputVoltage VCC=4.5V, VIH=2.0V, IOH=-0.4mA,VIL=0.7V, VINH=4.5V1, 3OUTPUTS 2.5V1, 2,3IOS Short CircuitOutput Current VCC=5.5V, VINH=4.5V, VOUT=0.0V,VINL=0.0V1, 3OUTPUT-20.0-100mA1, 2,3VCD Input Clamp DiodeVoltage VCC=4.5V, IM=-18mA, VINH=4.5V1, 3INPUTS-1.5V1, 2,3ICC Supply Current VCC=5.5V, VINL=0.0V1, 3VCC14.0mA1, 2,3AC PARAMETER - 50pF(The following conditions apply to all the following parameters, unless otherwise specified.)AC:CL=50pF, RL=2k ohms Temp range: -55C to +125CtpLH (1)Propagation Delay VCC=5.0V2,4, 5Data toOx35.0ns92, 4, 5Data toOx44.0ns10, 11tpHL (1)Propagation Delay VCC=5.0V2,4, 5Data toOx35.0ns92, 4, 5Data toOx44.0ns10, 11tpLH (2)Propagation Delay VCC=5.0V2,4, 5Gx toOx25.0ns92, 4, 5Gx toOx31.5ns10, 11tpHL (2)Propagation Delay VCC=5.0V2,4, 5Gx toOx35.0ns92, 4, 5Gx toOx44.0ns10, 11Note 1:Screen tested 100% on each device at -55C, +25C & +125C temperature, subgroups A1, 2, 3, 7 & 8.Note 2:Screen tested 100% on each device at +25C temperature only, subgroup A9.Note 3:Sample tested (Method 5005, Table 1) on each MFG. lot at +25C, +125C & -55C temperature, subgroups A1, 2, 3, 7 & 8.Note 4:Sample tested (Method 5005, Table 1) on each MFG. lot at +25C, subgroup A9.Note 5:Guaranteed, not tested at +125C & -55C.MICROCIRCUIT DATA SHEET MNDM54LS154-X REV 0A0Revision HistoryRev ECN #Rel Date Originator Changes0A0M000289606/16/98Linda Collins Initial MDS Release: MNDM54LS154-X Rev. 0A0.。
54LS47 74LS47 中文数据手册Data Sheet
4． 当灭灯输入/脉动灭灯输出（BI/RBO）开路或保持“高”，且将“低”加到试灯输入时，所有段的输
出都得打开。
●BI/RBO 是用作灭灯输入（BI）与/或脉动灭灯输出（RBO）的线与逻辑。
符号
参数名称
规范表
Vcc 电源电压
54
74
VO(off) 关态输出电压
IO(on) 开态输出电流
54 74
IOH 输出高电平电流
BI/RBO 等效电路见附图 10；除 BI/RBO 外，其他输入的等效电路见附图 1。LT 和 RBI：Req=20kΩ, A、B、 C 和 D：Req=25kΩ a～g 典型输出线路见附图 17。 注：测ICC时，所有的输出端开路，输入端接 4.5V。、
BDTIC Semiconductor
/Semiconductor
LS47 有自动前、后沿灭零控制（RBI 和 RBO）。试灯（LT）可在 BI/RBO 端处于高电平 的任何时刻去进行，该电路还含有一个灭灯输入（BI），它用来控制灯的亮度或禁止输出。
LS47 这种七段译码器在应用中可以驱动共阳极的发光二极管或直接驱动白炽灯指示器。
功能表
十进制 或功能
输 LT RBI
入
BT/RBO
输
出
注
DCBA
●
a
b
c
d
e
fg
0
H
H
LLLL
H
开 开 开 开 开 开关
1
H
x
LLLH
H
关 开 开 关 关 关关
2
H
x
LLHL
H
开 开 关 开 开 关开
3
H
x
LLHH
SN54AHCT541中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9685801Q2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 5962-9685801QRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC 5962-9685801QSA ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SN74AHCT541DBLE OBSOLETE SSOP DB20TBD Call TI Call TISN74AHCT541DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74AHCT541NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74AHCT541NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PW ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PWE4ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHCT541PWLE OBSOLETE TSSOP PW20TBD Call TI Call TISN74AHCT541PWR ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PWRE4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PWRG4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54AHCT541FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54AHCT541J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54AHCT541W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54ABT162540中文资料
元器件交易网IMPORTANT NOTICETexas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductorproduct or service without notice, and advises its customers to obtain the latest version of relevant informationto verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable atthe time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques areutilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of eachdevice is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of death, personal injury, orsevere property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTEDTO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS.Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TIproducts in such applications requires the written approval of an appropriate TI officer. Questions concerningpotential risk applications should be directed to TI through a local SC sales office.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, orinfringement of patents or services described herein. Nor does TI warrant or represent that any license, eitherexpress or implied, is granted under any patent right, copyright, mask work right, or other intellectual propertyright of TI covering or relating to any combination, machine, or process in which such semiconductor productsor services might be or are used.Copyright © 1996, Texas Instruments Incorporated。
SNJ54LS14FK中文资料
InputV T OutputPACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9665801Q2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 5962-9665801QCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC 5962-9665801QDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC 5962-9665801VCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC 5962-9665801VDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC JM38510/31302BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN5414J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54LS14J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSN7414D ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7414DE4ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7414DR ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7414DRE4ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7414N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN7414N3OBSOLETE PDIP N14TBD Call TI Call TISN7414NSR ACTIVE SO NS142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7414NSRE4ACTIVE SO NS142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS14D ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS14DBR ACTIVE SSOP DB142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS14DBRE4ACTIVE SSOP DB142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS14DR ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS14N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS14N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS14NE4ACTIVE PDIP N1425TBD Call TI Call TISN74LS14NSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ5414J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ5414W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS14FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS14J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS14W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54LVC157A中文资料
元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
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IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright © 1998, Texas Instruments Incorporated。