TL081CDE4中文资料
TCC081E数据手册V1.1
保密等级公开Q/DX 青岛鼎信通讯股份有限公司技术文档Q/TC X.XXX.XXXXXTCC081E数据手册V1.12014- 05-13发布2014- 05 - 13实施目次1 概述 (1)2 芯片特点 (1)3 芯片框图 (2)4 引脚定义 (2)4.1 芯片引脚示意图 (2)4.2 引脚定义 (3)5 芯片电器参数 (4)5.1 工作电压范围 (4)5.2 最大绝对额定值 (TA = 25°C) (4)5.3 外部复位 (4)6 芯片封装图 (5)7 注意事项 (5)TCC081E数据手册1 概述青岛鼎信通讯股份有限公司根据目前国内载波抄表市场需求，结合电网特点研发出专门应用于电力线通信介质的载波通信系统。
其核心技术利用正交码进行数据扩展频谱传输，使用电力线过零分时段得到最利于传输的3.3ms微分时段同步传输，比单纯使用扩频方式的系统通信能力和稳定性有很大提高；内置DSP数字信号处理模块保证载波通信计算需求，使用A/D采样方式进行扩频计算，其抗干扰能力大大增加。
TCC081E芯片是鼎信电力线载波通信系统中的从节点芯片，实现了基于电力线通信网络的电子终端设备之间可靠的数据交换，具备通信中继能力，可自动实现载波节点侦听、主动上报等网络功能。
TCC081E芯片的应用主要集中在自动读表、路灯控制、智能控制等领域，为电力行业或其它公共事业部门提供了一种优秀的自动抄表、控制系统解决方案。
TCC081E芯片进行鼎信规约的电力载波信号和标准DL/T645-1997/2007协议的串口信号之间的转换，支持数据透明传输模式；串口可以连接电表节点和电量显示模块，完成物理层、数据链路层、网络层、传输层四层网络功能。
2 芯片特点采用BFSK调制的扩频通信技术，载波中心频率421kHz；微分交流电时段，选择最有利于传输的时段通信；高性能数字信号处理技术；高效的帧中继转发机制，支持16级中继级别；可编程的网络地址、地址过滤、提供有效的本地访问数据；接收信号强度权重参数指示，为中继搜索算法提供支持，提高通信系统稳定性；提供准确的节点相位信息及信道特征信息；自适应50Hz、60Hz用电环境；支持断电无过零情况下的电力线载波通讯；每相载波通信速率50bps、100bps、600bps、1200bps；支持串口通信速率1200bps、2400bps、4800bps、9600bps；支持DL/T645-1997/2007、透明传输模式；上电自动读取从节点地址；登录未知表号电能表的表号；事件快速上报功能；采用5V 电源供电；温度适用范围(工业级标准) －40℃～＋85℃。
TL084 中文版
·宽共模（向上到Vcc+）和微分电路（VOLTAGERANGE）·低输入偏置电流和偏置电流·输出短路保护·具有结型场效应管（J-FET）高输入阻抗·内部频率补偿·锁存的自由操作·高压摆率：16V/μs（典型值）14脚插件塑装14脚贴片元件塑装描述说明该TL084，TL084A和TL084B是四输入运算放大器与高速J–FET（结型场效应管）的结合良好的匹配，高电压的J-FET和双极晶体管电路在一个单片tegrated回路范围。
这些器件具有高转换率，低输入偏置和偏置电流，低失调电压温度系数。
部件号温度范围组件N P TL084M/AM/BM–55o C,+125o C··TL084I/AI/BI–40o C,+105o C··TL084C/AC/BC0o C,+70o C··例子：TL084CN，TL084CD引脚连接（顶视图）1脚：Output 1输出12脚：Inverting Input1反相输入13脚：Non-inverting Input1同相输入4脚：电源+11脚：电源-原理图（每个放大器）绝对最大额定值符号参数值单位Vcc 供电电压-（注1）±18V Vi 输入电压-（注3）±15V Vid 差分输入电压-（注2）±30V Ptot功率耗散680mW输出短路时-（注4）无限Toper开放式空气温度范围操作TL084C,AC,BC TL084I,AI,BI TL084M,AM,BM 0to 70–40to 105–55to 125oCTstg 存储温度范围–65to 150o C注释：1。
所有的电压值，除差分电压，是相对于零参考电平的电源电压（地）其中零参考电平中点之间的VCC+和VCC-。
2。
差分电压是在相对于反相输入端非反相输入端。
TL084ACNE4中文资料
IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9851501Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9851501QPA ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type 5962-9851503Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type5962-9851503QCAACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL081ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACJG OBSOLETE CDIP JG 8TBD Call TI Call TITL081ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081BCD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRG4ACTIVESOICD82500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL081CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPSRE4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPWLE OBSOLETE TSSOP PW 8TBD Call TI Call TITL081ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081IPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081MFKB OBSOLETE LCCC FK 20TBD Call TI Call TI TL081MJG OBSOLETE CDIP JG 8TBD Call TI Call TI TL081MJGB OBSOLETE CDIP JG 8TBD Call TI Call TITL082ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082ACPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACPSRE4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDE4ACTIVESOICD875Green (RoHS &CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)no Sb/Br)TL082BCDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CJG OBSOLETE CDIP JG 8TBD Call TI Call TITL082CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPSRG4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPW ACTIVE TSSOP PW 8150Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWE4ACTIVE TSSOP PW 8150Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWLE OBSOLETE TSSOP PW 8TBDCall TI Call TITL082CPWR ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRE4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRG4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDG4ACTIVESOICD875Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL082IDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IJG OBSOLETE CDIP JG 8TBD Call TI Call TITL082IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082IPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082IPWR ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IPWRE4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082MFK OBSOLETE LCCC FK 20TBD Call TI Call TITL082MFKB ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg TypeTL082MJG ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type TL082MJGB ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type TL084ACD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDRG4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACN ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL084ACNE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL084ACNSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACNSRE4ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDRG4ACTIVESOICD142500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TL084BCN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084BCNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CJ OBSOLETE CDIP J14TBD Call TI Call TITL084CN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNSLE OBSOLETE SO NS14TBD Call TI Call TITL084CNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CPWLE OBSOLETE TSSOP PW14TBD Call TI Call TITL084CPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084IJ OBSOLETE CDIP J14TBD Call TI Call TITL084IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084INE4ACTIVE PDIP N1425Pb-Free CU NIPDAU N/A for Pkg Type 23-Apr-2007Orderable DeviceStatus (1)Package Type Package Drawing Pins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)(RoHS)TL084MFK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type TL084MFKB ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type TL084MJ ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL084MJB ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL084QD ACTIVE SOIC D 1450TBD CU NIPDAU Level-1-220C-UNLIM TL084QDRACTIVESOICD142500TBDCU NIPDAULevel-1-220C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight inhomogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.23-Apr-2007TAPE AND REELINFORMATION3-May-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TL081ACDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081BCDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081CDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081CPSR PS 8MLA 330168.2 6.6 2.51216Q1TL081IDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082ACDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082ACDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082ACPSR PS 8MLA 330168.2 6.6 2.51216Q1TL082BCDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082CDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082CDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082CPSR PS 8MLA 330168.2 6.6 2.51216Q1TL082CPWR PW 8MLA 330127.0 3.6 1.6812Q1TL082IDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082IDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082IPWR PW 8MLA 330127.0 3.6 1.6812Q1TL084ACDR D 14MLA 33016 6.59.0 2.1816Q1TL084ACDR D 14FMX 3300 6.59.0 2.1816Q1TL084ACNSR NS 14MLA 330168.210.5 2.51216Q1TL084BCDR D 14FMX 3300 6.59.0 2.1816Q1TL084CDR D 14FMX 3300 6.59.0 2.1816Q1TL084CNSR NS 14MLA 330168.210.5 2.51216Q1TL084CPWR PW 14MLA 330127.0 5.6 1.6812Q1TL084IDRD14FMX3306.59.02.1816Q13-May-2007TAPE AND REEL BOX INFORMATIONDevicePackagePins Site Length (mm)Width (mm)Height (mm)TL081ACDR D 8FMX 338.1340.520.64TL081BCDR D 8FMX 338.1340.520.64TL081CDR D 8FMX 338.1340.520.64TL081CPSR PS 8MLA 333.2333.228.58TL081IDR D 8FMX 338.1340.520.64TL082ACDR D 8FMX 338.1340.520.64TL082ACDR D 8MLA 338.1340.520.64TL082ACPSR PS 8MLA 333.2333.228.58TL082BCDR D 8FMX 338.1340.520.64TL082CDR D 8FMX 338.1340.520.64TL082CDR D 8MLA 338.1340.520.64TL082CPSR PS 8MLA 333.2333.228.58TL082CPWR PW 8MLA 338.1340.520.64TL082IDR D 8FMX 338.1340.520.64TL082IDR D 8MLA 338.1340.520.64TL082IPWR PW 8MLA 338.1340.520.64TL084ACDR D 14MLA 333.2333.228.58TL084ACDR D 14FMX 333.2333.228.58TL084ACNSR NS 14MLA 333.2333.228.58TL084BCDR D 14FMX 333.2333.228.58TL084CDR D 14FMX 333.2333.228.58TL084CNSR NS 14MLA 333.2333.228.58TL084CPWR PW 14MLA 338.1340.520.64TL084IDRD14FMX333.2333.228.583-May-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。
TL082D
June 2008 Rev 31/15TL081General purpose JFET single operational amplifiersFeatures■Wide common-mode (up to V CC +) and differential voltage range ■Low input bias and offset current ■Output short-circuit protection■High input impedance JFET input stage ■Internal frequency compensation ■Latch-up free operation ■High slew rate: 16V/µs (typ)DescriptionThe TL081, TL081A and TL081B are high-speed JFET input single operational amplifiersincorporating well matched, high-voltage JFET and bipolar transistors in a monolithic integrated circuit.The devices feature high slew rates, low input bias and offset currents, and low offset voltage temperature coefficient.Schematic diagram TL0812/151 Schematic diagramTL081Absolute maximum ratings3/152 Absolute maximum ratingsTable 1.Absolute maximum ratingsSymbol ParameterTL081I, AI, BITL081C, AC,BCUnit V CC Supply voltage (1)1.All voltage values, except differential voltage, are with respect to the zero reference level (ground) of thesupply voltages where the zero reference level is the midpoint between V CC + and V CC -.±18V V in Input voltage (2)2.The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 volts,whichever is less.±15V V id Differential input voltage (3)3.Differential voltages are the non-inverting input terminal with respect to the inverting input terminal.±30V P totPower dissipation680mWOutput short-circuit duration (4)4.The output may be shorted to ground or to either supply. Temperature and/or supply voltages must belimited to ensure that the dissipation rating is not exceeded.Infinite T stgStorage temperature range -65 to +150°CR thjaThermal resistance junction to ambient (5) (6)SO-8DIP85.Short-circuits can cause excessive heating and destructive dissipation.6.Rth are typical values.12585°C/WR thjcThermal resistance junction to case (5)(6)SO-8DIP84041°C/W ESDHBM: human body model (7)7.Human body model: 100pF discharged through a 1.5k Ω resistor between two pins of the device, done forall couples of pin combinations with other pins floating. 500V MM: machine model (8)8.Machine model: a 200pF cap is charged to the specified voltage, then discharged directly between twopins of the device with no external series resistor (internal resistor < 5Ω), done for all couples of pin combinations with other pins floating.200V CDM: charged device model (9)9.Charged device model: all pins plus package are charged together to the specified voltage and thendischarged directly to the ground.1.5kVTable 2.Operating conditionsSymbol ParameterTL081I, AI, BITL081C, AC, BC Unit V CC Supply voltage range6 to 36V T operOperating free-air temperature range-40 to +1050 to +70°C3 ElectricalcharacteristicsTable 3.V CC = ±15V, T amb = +25°C (unless otherwise specified)Symbol Parameter TL081I, AC, AI, BC,BITL081CUnit Min.Typ.Max.Min.Typ.Max.V io Input offset voltage (R s= 50Ω)T amb = +25°C TL081TL081ATL081BT min≤ T amb≤ T max TL081TL081ATL081B3311063137531013mVDV io Input offset voltage drift1010µV/°CI io Input offset current (1)T amb = +25°CT min≤ T amb≤ T max51004510010pAnAI ib Input bias current (1)T amb = +25°CT min≤ T amb≤ T max20200202040020nAA vd Large signal voltage gain (R L = 2kΩ, V o = ±10V)T amb = +25°CT min≤ T amb≤ T max50252002515200V/mVSVR Supply voltage rejection ratio (R S= 50Ω)T amb = +25°CT min≤ T amb≤ T max808086707086dBI CC Supply current, no loadT amb = +25°CT min≤ T amb≤ T max1.42.52.51.42.52.5mAV icm Input common mode voltage range±11+15-12±11+15-12VCMR Common mode rejection ratio (R S= 50Ω)T amb = +25°CT min≤ T amb≤ T max808086707086dBI os Output short-circuit currentT amb = +25°CT min≤ T amb≤ T max10104060601010406060mA±V opp Output voltage swingT amb = +25°C R L = 2kΩR L = 10kΩT min≤ T amb≤ T max R L = 2kΩR L = 10kΩ101210121213.5101210121213.5VSR Slew rate (T amb = +25°C)V in = 10V, R L = 2kΩ, C L = 100pF, unity gain816816V/µs4/155/15t r Rise time (T amb = +25°C)V in = 20mV , R L = 2k Ω, C L = 100pF , unity gain 0.10.1µs K ov Overshoot (T amb = +25°C)V in = 20mV , R L = 2k Ω, C L = 100pF , unity gain 1010%GBP Gain bandwidth product (T amb = +25°C)V in = 10mV , R L = 2k Ω, C L = 100pF , F= 100kHz 2.54 2.54MHz R i Input resistance10121012ΩTHDTotal harmonic distortion (T amb = +25°C), F= 1kHz, R L = 2k Ω,C L = 100pF , A v = 20dB,V o = 2V pp 0.010.01%e n Equivalent input noise voltage R S = 100Ω, F= 1kHz 1515∅mPhase margin4545degrees1.The input bias currents are junction leakage currents which approximately double for every 10°C increase in the junctiontemperature.Table 3.V CC = ±15V, T amb = +25°C (unless otherwise specified) (continued)SymbolParameterTL081I, AC, AI, BC,BI TL081CUnitMin.Typ.Max.Min.Typ.Max.nV Hz-----------Figure 3.Maximum peak-to-peak outputFigure 4.Maximum peak-to-peak outputFigure 6.Maximum peak-to-peak outputFigure 7.Maximum peak-to-peak output Figure 8.Maximum peak-to-peak output6/157/15Figure 9.Input bias current versus free airFigure rge signal differential voltageFigure rge signal differential voltageamplification and phase shiftFigure 12.Total power dissipation versus freeair temperatureFigure 13.Supply current per amplifier versus Figure 14.Supply current per amplifier versusFigure mon mode rejection ratioFigure 16.Equivalent input noise voltageFigure 19.Voltage follower large signal pulse8/15TL081Parameter measurement information9/154 Parameter measurement informationTypical applications TL08110/155 Typical applicationsTL081Package information11/156 Package informationIn order to meet environmental requirements, ST offers these devices in ECOPACK®packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: .Package information TL08112/156.1 DIP 8 package informationTable 4.DIP8 package mechanical dataRef.DimensionsMillimetersInches Min.Typ.Max.Min.Typ.Max.A 5.330.210A10.380.015A2 2.92 3.30 4.950.1150.1300.195b 0.360.460.560.0140.0180.022b2 1.14 1.52 1.780.0450.0600.070c 0.200.250.360.0080.0100.014D 9.029.2710.160.3550.3650.400E 7.627.878.260.3000.3100.325E1 6.106.357.110.2400.2500.280e 2.540.100eA 7.620.300eB 10.920.430L2.923.303.810.1150.1300.150TL081Package information13/156.2 SO-8 package informationTable 5.SO-8 package mechanical dataRef.DimensionsMillimetersInches Min.Typ.Max.Min.Typ.Max.A 1.750.069A10.100.250.0040.010A2 1.250.049b 0.280.480.0110.019c 0.170.230.0070.010D 4.80 4.90 5.000.1890.1930.197E 5.80 6.00 6.200.2280.2360.244E1 3.803.904.000.1500.1540.157e 1.270.050h 0.250.500.0100.020L 0.40 1.270.0160.050k 1°8°1°8°ccc0.100.004Ordering information TL08114/157 Ordering information8 Revision historyTable 6.Order codesOrder code TemperaturerangePackagePackingMarking TL081IN TL081AIN TL081BIN -40°C, +105°C DIP8T ubeTL081IN TL081AIN TL081BIN TL081ID/IDT TL081AID/AIDT TL081BID/BIDT SO-8T ube or tape & reel 081I 081AI 081BI TL081IYD/DT (1)TL081AIYD/DT (1)TL081BIYD/DT (1)1.Qualification and characterization according to AEC Q100 and Q003 or equivalent, advanced screeningaccording to AEC Q001 & Q 002 or equivalent are on-going.SO-8(Automotive grade)T ube or tape & reel081IY 081AIY 081BIY TL081CN TL081ACN TL081BCN 0°C, +70°CDIP8T ubeTL081CN TL081ACN TL081BCN TL081CD/CDT TL081ACD/ACDT TL081BCD/BCDTSO-8T ube or tape & reel081C 081AC 081BCTable 7.Document revision historyDate RevisionChanges30-Apr-20011Initial release.27-Jul-20072Added values for R thja and R thjc in Table 1: Absolute maximumratings .Added T able 2: Operating conditions .Added automotive grade part numbers in T able 6: Order codes .Format update.27-Jun-20083Removed information concerning military temperature range (TL081Mx, TL081AMx, TL081BMx).Added missing order codes for automotive grade products and updated footnote in T able 6: Order codes .TL081Please Read Carefully:Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.All ST products are sold pursuant to ST’s terms and conditions of sale.Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.ST and the ST logo are trademarks or registered trademarks of ST in various countries.Information in this document supersedes and replaces all information previously supplied.The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.© 2008 STMicroelectronics - All rights reservedSTMicroelectronics group of companiesAustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America15/15。
TLC081中文资料
Copyright 2000−2004 Texas Instruments Incorporated
1
元器件交易网
SLOS254D − JUNE 1999 − REVISED FEBRUARY 2004
TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDEĆBANDWIDTH HIGHĆOUTPUTĆDRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS
−40°C to 125°C
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLC084CDR).
2
SLOS254D − JUNE 1999 − REVISED FEBRUARY 2004
D Wide Bandwidth . . . 10 MHz D High Output Drive D D D D D D D
常用运放芯片实物和引脚功能图_TL081-082-084运放引脚功能及贴片封装形式
常用运放芯片实物和引脚功能图_TL081/082/084运放引脚功能及贴片封装形式（1）运放芯片的3种型号序列（部分器件有此序列）如TL081、TL082、TL084，分别为8引脚单运放；8引脚双运放；14引脚四运放集成器件。
封装型式一般为塑封双列直插和贴片双列，环列封装形式比较少见。
图1 TL081/082/084运放引脚功能及贴片封装形式而常见常用，仅为下述两种器件。
世界上有几个人？有两个人，男人和女人，不失为一个智慧的回答。
常用运放芯片有几片，只有两片，8脚和14脚的双运放和四运放集成器件（8脚封装单运放器件和环列式封装器件应用较少），把此两种芯片引脚功能记住，检修中就不需要随时去查资料了。
图2 常用运放芯片实物和引脚功能图如上图。
其封装一般为塑封双列直插DIP8/DIP14和塑封贴片工艺封装SO8/SO14两种形式，随着电子线路板小型化精密化要求的提高，贴片元件的应用占据主流，直插式器件逐渐淡出人们的视野。
但无论何种封装模式，其引脚功能、次序都是一样的，所以仅需记准8脚（双运放）和14脚（四运放）两种运放的引脚功能就够了。
（2）运放芯片的3种温度序列任何一种集成IC器件，按应用温度范围不同，都可细分为3种器件，如LM358，实际上有LM158、LM258、LM358三种型号的产品，其引脚功能、内部结构、工作原理、供电电压等等都无差别，仅仅是应用温度范围差异甚大。
LM158 适应工作温度-50℃~125℃，军工用品（1类）；LM258 适应工作温度-25℃~85℃，工业用品（2类）；LM358 适应工作温度0℃~70℃，农用品（3类）。
单看参数，似乎LM258适用于山东地区，若用于东北地区，其参数有些不足。
而LM358仅能适用于江南地区。
而事实上并非如此，如低于2类品规格参数被淘汰到3类品的器件，可能是-24℃~84℃温度范围以内的产品，仅次于2类品，比3类品的温度指标实际上要高许多的。
在家电元件市场能购到的多为3类品。
protel_dxp 2004 原件英文对照表要点
protel 元件库中英文对照表（5）CD4553 三位BCD计数器CD4555 双二进制四选一译码器/分离器CD4556 双二进制四选一译码器/分离器CD4558 BCD八段译码器CD4560 "N"BCD加法器CD4561 "9"求补器CD4573 四可编程运算放大器CD4574 四可编程电压比较器CD4575 双可编程运放/比较器CD4583 双施密特触发器CD4584 六施密特触发器CD4585 4位数值比较器CD4599 8位可寻址锁存器CD40110 十进制加/减,计数,锁存,译码驱动STCD40147 10-4线编码器NSC\\MOTCD40160 可预置BCD加计数器NSC\\MOTCD40161 可预置4位二进制加计数器NSC\\MOTCD40162 BCD加法计数器NSC\\MOTCD40163 4位二进制同步计数器NSC\\MOTCD40174 六锁存D型触发器NSC\\TI\\MOTCD40175 四D型触发器NSC\\TI\\MOTCD40181 4位算术逻辑单元/函数发生器CD40182 超前位发生器CD40192 可预置BCD加/减计数器(双时钟) NSC\\TI CD40193 可预置4位二进制加/减计数器NSC\\TICD40194 4位并入/串入-并出/串出移位寄存NSC\\MOT CD40195 4位并入/串入-并出/串出移位寄存NSC\\MOT CD40208 4×4多端口寄存器型号器件名称厂牌备注CD4501 4输入端双与门及2输入端或非门CD4502 可选通三态输出六反相/缓冲器CD4503 六同相三态缓冲器CD4504 六电压转换器CD4506 双二组2输入可扩展或非门CD4508 双4位锁存D型触发器CD4510 可预置BCD码加/减计数器CD4511 BCD锁存,7段译码,驱动器CD4512 八路数据选择器CD4513 BCD锁存,7段译码,驱动器(消隐)CD4514 4位锁存,4线-16线译码器CD4515 4位锁存,4线-16线译码器CD4516 可预置4位二进制加/减计数器CD4517 双64位静态移位寄存器CD4518 双BCD同步加计数器CD4519 四位与或选择器CD4520 双4位二进制同步加计数器CD4521 24级分频器CD4522 可预置BCD同步1/N计数器CD4526 可预置4位二进制同步1/N计数器CD4527 BCD比例乘法器CD4528 双单稳态触发器注：同型号的74系列、74HC系列、74LS系列芯片，逻辑功能上是一样的。
TL082C资料
查询TL082C供应商
捷多邦，专业PCB打样工厂，24小时加急出货 Order this document by TL081C/D
JFET Input Operational
Amplifiers
These low–cost JFET input operational amplifiers combine two state–of– the–art linear technologies on a single monolithic integrated circuit. Each internally compensated operational amplifier has well matched high voltage JFET input devices for low input offset voltage. The BIFET technology provides wide bandwidths and fast slew rates with low input bias currents, input offset currents, and supply currents.
+ 10 3– 9
Inputs 3
8 Output 3
TL084 (Top View)
© Motorola, Inc. 1997
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9851501Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9851501QPA ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type 5962-9851503Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type5962-9851503QCAACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL081ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACJG OBSOLETE CDIP JG 8TBD Call TI Call TITL081ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081BCD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRG4ACTIVESOICD82500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL081CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPSRE4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPWLE OBSOLETE TSSOP PW 8TBD Call TI Call TITL081ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081IPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081MFKB OBSOLETE LCCC FK 20TBD Call TI Call TI TL081MJG OBSOLETE CDIP JG 8TBD Call TI Call TI TL081MJGB OBSOLETE CDIP JG 8TBD Call TI Call TITL082ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082ACPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACPSRE4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDE4ACTIVESOICD875Green (RoHS &CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)no Sb/Br)TL082BCDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CJG OBSOLETE CDIP JG 8TBD Call TI Call TITL082CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPSRG4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPW ACTIVE TSSOP PW 8150Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWE4ACTIVE TSSOP PW 8150Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWLE OBSOLETE TSSOP PW 8TBDCall TI Call TITL082CPWR ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRE4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRG4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDG4ACTIVESOICD875Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL082IDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IJG OBSOLETE CDIP JG 8TBD Call TI Call TITL082IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082IPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082IPWR ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IPWRE4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082MFK OBSOLETE LCCC FK 20TBD Call TI Call TITL082MFKB ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg TypeTL082MJG ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type TL082MJGB ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type TL084ACD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDRG4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACN ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL084ACNE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL084ACNSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACNSRE4ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDRG4ACTIVESOICD142500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TL084BCN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084BCNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CJ OBSOLETE CDIP J14TBD Call TI Call TITL084CN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNSLE OBSOLETE SO NS14TBD Call TI Call TITL084CNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CPWLE OBSOLETE TSSOP PW14TBD Call TI Call TITL084CPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084IJ OBSOLETE CDIP J14TBD Call TI Call TITL084IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084INE4ACTIVE PDIP N1425Pb-Free CU NIPDAU N/A for Pkg Type 23-Apr-2007Orderable DeviceStatus (1)Package Type Package Drawing Pins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)(RoHS)TL084MFK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type TL084MFKB ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type TL084MJ ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL084MJB ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL084QD ACTIVE SOIC D 1450TBD CU NIPDAU Level-1-220C-UNLIM TL084QDRACTIVESOICD142500TBDCU NIPDAULevel-1-220C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight inhomogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.23-Apr-2007TAPE AND REELINFORMATION3-May-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TL081ACDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081BCDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081CDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081CPSR PS 8MLA 330168.2 6.6 2.51216Q1TL081IDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082ACDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082ACDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082ACPSR PS 8MLA 330168.2 6.6 2.51216Q1TL082BCDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082CDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082CDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082CPSR PS 8MLA 330168.2 6.6 2.51216Q1TL082CPWR PW 8MLA 330127.0 3.6 1.6812Q1TL082IDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082IDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082IPWR PW 8MLA 330127.0 3.6 1.6812Q1TL084ACDR D 14MLA 33016 6.59.0 2.1816Q1TL084ACDR D 14FMX 3300 6.59.0 2.1816Q1TL084ACNSR NS 14MLA 330168.210.5 2.51216Q1TL084BCDR D 14FMX 3300 6.59.0 2.1816Q1TL084CDR D 14FMX 3300 6.59.0 2.1816Q1TL084CNSR NS 14MLA 330168.210.5 2.51216Q1TL084CPWR PW 14MLA 330127.0 5.6 1.6812Q1TL084IDRD14FMX3306.59.02.1816Q13-May-2007TAPE AND REEL BOX INFORMATIONDevicePackagePins Site Length (mm)Width (mm)Height (mm)TL081ACDR D 8FMX 338.1340.520.64TL081BCDR D 8FMX 338.1340.520.64TL081CDR D 8FMX 338.1340.520.64TL081CPSR PS 8MLA 333.2333.228.58TL081IDR D 8FMX 338.1340.520.64TL082ACDR D 8FMX 338.1340.520.64TL082ACDR D 8MLA 338.1340.520.64TL082ACPSR PS 8MLA 333.2333.228.58TL082BCDR D 8FMX 338.1340.520.64TL082CDR D 8FMX 338.1340.520.64TL082CDR D 8MLA 338.1340.520.64TL082CPSR PS 8MLA 333.2333.228.58TL082CPWR PW 8MLA 338.1340.520.64TL082IDR D 8FMX 338.1340.520.64TL082IDR D 8MLA 338.1340.520.64TL082IPWR PW 8MLA 338.1340.520.64TL084ACDR D 14MLA 333.2333.228.58TL084ACDR D 14FMX 333.2333.228.58TL084ACNSR NS 14MLA 333.2333.228.58TL084BCDR D 14FMX 333.2333.228.58TL084CDR D 14FMX 333.2333.228.58TL084CNSR NS 14MLA 333.2333.228.58TL084CPWR PW 14MLA 338.1340.520.64TL084IDRD14FMX333.2333.228.583-May-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。