ES3A THRU ES3J SMB

UNITS VOLTS VOLTS VOLTS
Amps
Amps
Volts µA ns pF C/W C
MDD ELECTRONIC
AVERAGE FORWARD RECTIFIED CURRENT, AMPERES
INSTANTANEOUS FORWARD CURRENT,AMPERES
RATINGS AND CHARACTERISTIC CURVES ES3A THRU ES3J
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
FIG. 2-MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT
100
80
60
40
20
8.3ms SINGLE HALF SINE-WAVE
(JEDEC Method)
0
1
10
100
NUMBER OF CYCLES AT 60 Hz
FIG. 4-TYPICAL REVERU ES3J
DO-214AA/SMB
0.087 (2.20) 0.071 (1.80)
0.096(2.44) 0.084(2.13)
0.180(4.57) 0.160(4.06)
SURFACE MOUNT SUPER FAST RECTIFIER
Reverse Voltage - 50 to 600 Volts Forward Current - 3.0 Amperes
MDD Catalog Number
SYMBOLS ES3A ES3B ES3C ES3D ES3E ES3G ES3J
Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL=75 C Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage at 3.0A Maximum DC reverse current TA=25 C at rated DC blocking voltage TA=100 C Maximum reverse recovery time (NOTE 1) Typical junction capacitance (NOTE 2) Typical thermal resistance (NOTE 3) Operating junction and storage temperature range
VRRM VRMS VDC
I(AV)
50 100 150 200 300 400 600 35 70 105 140 210 280 420 50 100 150 200 300 400 600
3.0
IFSM
VF
IR trr CJ RθJA TJ,TSTG
100.0
0.95
1.25
1.7
5.0 100.0
1,000
100
10 TJ=100 C
1
TJ=25 C 0.1
0.01 0
20
40
60
80
100
PERCENTAGE OF PEAK REVERSE VOLTAGE,%
FIG. 6-TYPICAL TRANSIENT THERMAL IMPEDANCE
100
10
1
0.1
0.01
0.1
1
10
100
t,PULSE DURATION,sec.
200
100
10
TJ=25 C
1
0.1
1.0
10
100
REVERSE VOLTAGE,VOLTS
TRANSIENT THERMAL IMPEDANCE, C/W
INSTANTANEOUS REVERSE CURRENT, MICROAMPERES
PEAK FORWARD SURGE CURRENT, AMPERES
0.155(3.94) 0.130(3.30)
0.012(0.305) 0.006(0.152)
FEATURES
The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 For surface mounted applications Low reverse leakage Built-in strain relief,ideal for automated placement High forward surge current capability High temperature soldering guaranteed: 250 C/10 seconds at terminals Glass passivated chip junction
MECHANICAL DATA
0.060(1.52) 0.030(0.76)
0.008(0.203)MAX.
0.220(5.59) 0.205(5.21)
Dimensions in inches and (millimeters)
Case: JEDEC DO-214AA molded plastic body Terminals: leads solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight:0.003 ounce, 0.093 grams
JUNCTION CAPACITANCE, pF
MDD ELECTRONIC
FIG. 1- FORWARD CURRENT DERATING CURVE
3.0
2.4
1.8
1.2
Single Phase
Half Wave 60Hz
Resistive or
inductive Load
0.6
0
0
25
50
75
100 125 150
175
AMBIENT TEMPERATURE, C
FIG. 3-TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS
35
45.0 47.0
-50 to +150
Note:1.Reverse recovery condition IF=0.5A,IR=1.0A,Irr=0.25A 2.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
3.P.C.B. mounted with 0.2x0.2”(5.0x5.0mm) copper pad areas
20
10
TJ=25 C PULSE WIDTH=300 µs
1%DUTY CYCLE
1
0.1
0.01 0
0.4
0.8
ES3A-ES3D ES3E-ES3G ES3J
1.2
1.6 1.8
INSTANTANEOUS FORWARD VOLTAGE, VOLTS
FIG. 5-TYPICAL JUNCTION CAPACITANCE