DesignSD_12052012 (1)
一种高精度柔性铺地材料自动化制样装置的设计
第30卷 第5期2023年5月仪器仪表用户INSTRUMENTATIONVol.302023 No.5一种高精度柔性铺地材料自动化制样装置的设计周 正1，顾 婷1，王建亮2（1.天津市产品质量监督检测技术研究院地毯研究中心，天津 300211；2.北京科技大学天津学院 智能制造学院，天津 301811）摘 要：针对地毯、pvc 地板等产品实际检测需要，根据地毯等铺地物相关检测标准中对样品选取及尺寸的要求，设计了一种铺地材料制样装置，使用自动化的刀具裁切试样，替代人工使用刀具剪裁制样，提高了工作效率及试样尺寸精度，改进试验制样环节的工作模式。
该装置由床身、龙门、刀杆、控制系统4部分组成，适用于地毯、pvc 地板等产品的样品批量制样处理。
关键词：自动化制样装置；柔性铺地材料；裁切中图分类号：TP29 文献标志码：ADesign of an Automatic Sample Preparation Device forHigh-Precision Flexible Paving MaterialsZhou Zheng 1，Gu Ting 1，Wang Jianliang 2（1.Carpet Research Center of Tianjin Product Quality Inspection T echnology Research Institute,Tian-jin,300211,China ；2.Tianjin College of Beijing University of Science and T echnology,Tianjin,301811,China ）Abstract：Aiming at the actual testing needs of carpets, PVC floors, and other products, and according to the requirements for sample selection and size in the relevant testing standards for carpets and other floor coverings, this paper designs a sample prepara-tion device for floor coverings, which uses automatic cutting tools to cut samples instead of manual cutting and sample preparation, improving work efficiency and sample size accuracy, and improving the working mode of the sample preparation process in the test. The device is composed of four parts: a bed, a gantry, a knife bar, and a control system. It is suitable for batch sample preparation and processing of carpets, PVC flooring, and other products.Key words：automatic sample preparation device ；flexible paving materials ；cutting收稿日期：2023-03-16基金项目：2022年度天津市市场监督管理委员会科技计划项目（2022-W20）。
BINDER FD 115 脱水和加热柜子的说明书
Model FD 115 | Drying and heating chambers with forced convectionA BINDER FD series Avantgarde.Line heating oven is always used when fast drying and sterilization is required. Thanks to its fully homogeneous temperature distribution, quick dynamics and powerful fan, this heating oven saves valuable time.BENEFITS•Best energy e ciency on the market•Excellent temporal and spatial temperature accuracy •USB connection for recording data •Temperature range up to +300 °CModel 115MAIN FEATURES•Temperature range: +10 °C above ambient temperature to +300 °C •Up to 30% lower energy consumption compared to conventional units on the market•High temperature accuracy thanks to APT.line™ technology •Forced convection •Controller with LCD display•Electromechanical control of the exhaust air flap•2 chrome-plated racks •Stackable•Class 2 integrated independent adjustable temperature safety device (DIN 12880) with visual alarm •Ergonomic handle design •USB port for recording dataORDERING INFORMATIONInterior volume [L]VoltageOption modelVersionArt.-No.230 V 1~ ph 50/60 Hz Standard FD115-230V 9010-0305116120 V 1~ ph 60 HzStandardFD115UL-120V9010-0306TECHNICAL DATADescription FD115-230V1FD115UL-120V1Article Number9010-03059010-0306Temperature variation at 150 °C [± K] 1.7 1.7Temperature fluctuation at 150 °C [± K]0.30.3Heating-up time to 150 °C [min]1818Power frequency [Hz]50/6060Nominal power [kW] 1.3 1.4Unit fuse [A] 6.312.5Phase (Nominal voltage)1~1~Net weight of the unit (empty) [kg]5757Permitted load [kg]150150Load per rack [kg]3030Wall clearance back [mm]160160Wall clearance sidewise [mm]100100Height [mm]550550Depth [mm]385385Height net [mm]735735Depth net [mm]605605Sound-pressure level [dB(A)]43431All technical data is speci ed for unloaded units with standard equipment at an ambient temperature of +22 °C ±3 °C and a power supply voltage fluctuation of ±10 %. The temperature data is determined to BINDER factory standard following DIN 12880, observing the recommended wall clearances of 10 % of the height, width, and depth of the inner chamber. Technical data refers to 100 % fan speed. All indications are average values, typical for units produced in series. We reserve the right to change technical speci cations at any time.DIMENSIONS incl. ttings and connections [mm]OPTIONSDesignationDescription*Art.-No.le 10 mm 018012-127630 mm 018012-101650 mm 018012-1020100 mm 018012-1027right 10 mm018012-126930 mm 018012-101550 mm 018012-1019100 mm 018012-1028top 10 mm 018012-126330 mm 018012-136450 mm 018012-1380Access port with silicone plug100 mm018012-1671Alarm function for overheatingSwitchable acoustic alarm, with adjustable limit value on the independent temperature safety device –8012-1636Analog output 4-20 mA for temperature values (output not adjustable)028012-1624Calibration certi cate,expandedfor temperature; for extending the measurement in center of chamber to include another test temperature –8012-1116for temperature, measurement in center of chamber at speci ed temperature–8012-1135temperature measurement incl. certi cate and 27 measuring points at speci ed temperature –8012-1594temperature measurement incl. certi cate, 15- 18 measuring points at speci ed temperature –8012-1573Calibration certi cate,temperaturetemperature measurement incl. certi cate, 9 measuring points at speci ed temperature–8012-1552Class 3.1 independent temperature safety device with visual alarm (DIN 12880)–8012-1643Clock battery-backed–8012-1641Door gasket made of FKM, silicone-free –8012-1650Door lock lockable door handle–8012-1665Ethernet interface for Multi Management So ware APT-COM™–8012-0988Gas-tight option model Incl. additional measures for the greatest possible impermeability to gas; not in conjunction with access port or interior lighting option–8012-1685for faster heating up time and improved recovery time; max. 300 °C Heating output,reinforced 120/230 V option model–8012-1057HEPA air lter On fresh air supply for unit; lter classi cation H14 (acc. to. EN 1822-1:2009, > 99.995% at 0.3 µm)–8012-1051Inert gas connection With gas inlet and outlet, Ø 10 mm, incl. additional measures for the greatest possible impermeability to gas; not in conjunction with access port or interior lighting option –8012-1691Inner chamber,reinforcedmax. total load 170 kg–8012-1054* Notes › See last pageDesignation Description*Art.-No.with 15 W light bulb120 V option model –8012-1632Interior lighting 230/240 V option model–8012-1628Measurement of air exchange rate in accordance with ASTM D5374, de nition and protocol according to ambient temperature –8012-1195Pt 100 temperature sensoradditional flexible Pt 100, interior, for displaying the temperature on the unit display –8012-1620viewing window (triple insulating glass) in door, 370 x 370 mm, and 15 W interior 120 V option model –8012-1706Viewing window and interior lighting230 V option model–8012-1704* Notes › See last pageACCESSORIESDesignationDescription*Art.-No.for simple logging and documentation requirements with up to 5 networked units.APT-COM™ 4 BASIC-Editionversion 4, BASIC edition–9053-0039for working under GLP-compliant conditions. Measured values are documented in a tamper-proof way in line with the requirements of FDA Regulation 21 CFR 11.APT-COM™ 4 GLP-Editionversion 4, GLP edition–9053-0042convenient unit and user management built on the BASIC edition. Suitable for networking up to 100 units.APT-COM™ 4PROFESSIONAL-Edition version 4, PROFESSIONAL edition–9053-0040Data Logger Kit T 350: For continuous temperature logging from 0 °C to 350 °C; kit includes 1 data logger, Pt 100 sensor with 2 m extension cable and 1 magnetic xture for mounting to the BINDER unit–8012-0714Data Logger So ware LOG ANALYZE so ware kit, con guration and evaluation so ware for all BINDER Data Logger Kits (incl. USB data cable)–8012-0821pH-neutral detergentconcentrated, for gentle remove of residual contaminants; 1 kg–1002-0016IQ/OQ documents – supporting documents for validation performed by customers, consisting of: IQ/OQ checklists incl.calibration guide and comprehensive unit documentation; parameters: temperature, CO 2, O 2, pressure, depending on unitDigital in PDF format–7057-0001Hard copy inside folder–7007-0001IQ/OQ/PQ documents – supporting documents for validation performed by customers, according to customer requirements, PQ section added to quali cation folder IQ/OQ; parameters: temperature, CO 2, O 2 – or pressure,depending on unit Digital in PDF format –7057-0005Quali cation documentsHard copy inside folder–7007-0005chrome plated –6004-0167Rack stainless steel –6004-0151Rubber pads set anti-slip feet –8012-1887Shelf, perforated Stainless steel–6004-0183Table on castorsstable cart, casters with locking brakes, dimensions: W 1,000 x D 800 x H 780 mm–9051-0018* Notes › See last pageDesignation Description*Art.-No.Unit commissioning check, brief operating instructions. (excl.: unpacking, setup, controller instructions, programming,installation work)05DL10-0100Unit instructions Instruction regarding operating principle and basic functions of the unit, operation of the controlelectronics including programming05DL10-0500BRONZE 3-year maintenance contract check of control response, 20% discount on spare parts05DL20-0710GOLD 3-year maintenance contract Maintenance service as contractually agreed, visual inspection of mechanical and electrical components,check of control response, 20% discount on spare parts, testing of all key functions, replacement ofwear parts, calibration of one test temperature speci ed by the user in the center of the usable space,including certi cate05DL20-0910Maintenance One-o maintenance service in accordance with maintenance schedule. Visual inspection of mechanicaland electrical components, testing of all key functions. Calibration of a test temperature speci ed by theuser in center of usable space without certi cate05DL20-0200SILVER 3-year maintenance contract Maintenance service as contractually agreed, visual inspection of mechanical and electrical components,check of control response, 20% discount on spare parts, testing of all key functions, calibration of onetest temperature speci ed by the user in the center of the usable space, without certi cate05DL20-0810Calibration of one (1) test temperature speci ed by the user in center of chamber, including certi cate05DL30-0101Calibration certi cate, temperatureExtension of calibration of one (1) additional test temperature speci ed by the user in the center of theusable space, including certi cate 03, 04,05DL30-0102Measurement of air exchange rate including certi cate (in accordance with ASTM D5374)03, 04,05DL33-0000Temperature measurement, 18 measuring points Temperature measurement with 18 measuring points with a set value speci ed by the user, includingcerti cate03, 04,05DL30-0118Temperature measurement, 27 measuring points Temperature measurement with 27 measuring points with a set value speci ed by the user, includingcerti cate03, 04,05DL30-0127Temperature measurement, 9 measuring points Temperature measurement with 9 measuring points with a set value speci ed by the user, includingcerti cate03, 04,05DL30-0109Execution of IQ/OQ/PQ Execution of IQ/OQ/PQ in accordance with quali cation folder05DL44-0500–* Notes › See last page01Condensation may occur in the area around the access port. Access ports may be placed in custom locations for an additional charge.02UL mark is not granted when this option is used.03Sensor calibration is performed in an accredited calibration laboratory.04Calibration is performed according to the BINDER factory standard.05Quoted prices do not include travel costs. Please refer to the chapter on BINDER Service for travel costs for your region. Quoted prices for services performed in Switzerland do not include a country-speci c added fee (available on request).BINDER GmbH Tuttlingen, Germany TEL +49 7462 2005 0 FAX +49 7462 2005 100 ********************* BINDER Asia Paci c (Hong Kong) Ltd.Kowloon, Hong Kong, P.R. ChinaTEL +852 ********FAX +852 *****************************Representative O ce for CISMoscow, RussiaTEL +7 495 988 15 16FAX +7 495 988 15 17***********************BINDER Environmental TestingEquipment (Shanghai) Co., Ltd.Shanghai, P.R. ChinaTEL +86 21 685 808 25FAX +86 21 685 808 29**********************BINDER Inc.Bohemia, NY, USATEL +1 631 224 4340FAX +1 631 224 4354********************。
D1201中文资料
Typ.
Max. Unit
V 1 1 7 mA µA V S dB % — 60 40 4 pF pF pF
VGS(th) Gate Threshold Voltage*
VSWR Load Mismatch Tolerance
* Pulse Test:
Pulse Duration = 300 µs , Duty Cycle ≤ 2%
元器件交易网
TetraFET
D1201UK
METAL GATE RF SILICON FET
MECHANICAL DATA
C N (typ) B 3 D (2 pls)
2 1 A
F (2 pls) H J
GOLD METALLISED MULTI-PURPOSE SILICON DMOS RF FET 10W – 12.5V – 500MHz SINGLE ENDED
Tol. 0.010 0.005 5° 0.005 0.003 0.005 0.005 0.003 0.005 0.005 0.001 0.020 0.005
• LOW NOISE • HIGH GAIN – 10 dB MINIMUM
APPLICATIONS
• HF/VHF/UHF COMMUNICATIONS from 1 MHz to 1 GHz
HAZARDOUS MATERIAL WARNING
The ceramic portion of the device between leads and metal flange is beryllium oxide. Beryllium oxide dust is highly toxic and care must be taken during handling and mounting to avoid damage to this area. THESE DEVICES MUST NEVER BE THROWN AWAY WITH GENERAL INDUSTRIAL OR DOMESTIC WASTE.
SDC1205资料
1. Appearance : No significant abnormality 2. Inductance change : Within ±20%
Preheating 260°C Dipping
Natural
cooling
Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 260±5°C Flux for lead free : rosin Dip Time : 10±0.5sec.
IDC (A) Max. 8.00 7.00 6.00 5.00 4.40 4.20 4.00 3.50 3.30 3.00 2.80 2.30 2.10 2.00 1.80 1.70 1.50 1.40 1.30 1.10 1.00 0.90 0.80 0.75 0.68 0.65 0.58 0.54 0.48 0.43 0.40
元器件交易网
SMD POWER INDUCTORS
7. SOLDERIND AND MOUNTING : 7-1. Recommended PC Board Pattern
12.6 7.0
SDC1205 SERIES
7-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 7-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 7-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs.
KMB+K Precision程序可编程直流电源说明书
B+K Precision ®models 9120A,9121A,9122A,9123A and 9124are laboratory grade Programmable DC Power Supplies providing great performance and features not found in other supplies in this price category.The 9120series are designed to meet the needs of today’s applications in R&D design verification,production testing or university labs that require clean and reliable power,high resolution and accuracy and fast transient response time.IExcellent display resolution I Low ripple and low noiseI Outstanding temperature stabilityI Fast transient response time (<150µs)I SCPI compatibleI Front and Rear Output T erminals I Closed case calibrationI Compact size for bench use or rack mountable (2U x 1/2U size)I List mode operation for increased throughput.Download and execute command sequences from non-volatile memory91244mm sheathed safety banana jacksOutput ON/OFF switchEncoder knob for quick analog style controlNumeric keys for direct entry of voltage and current valuesHigh resolution displayFront Panel OperationThe numeric keys and rotary knob provide a convenient interface for setting output levels quickly and precisely.Voltage and Current can be set to a maximum resolution of 0.5mV (2mV for 9124)and 0.1mA respectively.Up to 50parameters can be stored and recalled from internal memory.Data sheetTechnical data subject to change ©B&K Precision Corp.2008v031609Single Output Programmable DC Power SuppliesModels 9120A, 9121A, 9122A, 9123A & 9124DVM and m ΩmeterUser accessible fuseT emperature controlled cooling fan Serial interface connector for RS232 or USB communication.(USB communication cable is optional).Model 9123A also supports control via GPIB interface.Remote Sense and digital port functionalityThe 9120 series uses 4mm sheathed banana jacks that accept sheathed or shrouded banana plugs and meet the latest international safety standards.Extra FeaturesThe 9120 series’ digital port offers a variety of configurations. The port can operate in Digital I/O,external Trigger and DFI/RI (Discrete FaultIndicator/Remote Inhibit) mode. The RI feature can be used for turning several power supplies On/Off simultaneously. External triggering can be used in combination with List mode.The included Application Software supports front panel emulation and allows users to generate simple test sequences without the need to write source code.Additionally, the power supply comes with a built-in 51/2 digit DVM and high resolution milliohm meter supporting 4 wire measurements.Remote InterfaceThe power supplies can be remotely controlled from any PC with USB or RS232 interface, allowing the user to program and monitor all parameters through easy to use SCPI commands.The power supplies come with a RS232 to TTL serial converter cable. A USB to serial converter cable is available as option. Additionally, model 9123A can be controlled via GPIB interface and includes a GPIB to TTL conversion adapter cable.2Single Output Programmable DC Power Supplies Models 9120A, 9121A, 9122A, 9123A & 9124。
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System Drivers Chapter
Cross-TWG
• • • • CTSG: node timing pull-in, A-factor updates for FinFET, vertical devices How will FinFET, UTBB SOI timing change PPA projections? Renewal of the PIDS HP, LP roadmaps (compact modeling interaction) 3D effort with other TWGs
Updated Consumer SOC and MPU Drivers
Updated Drivers (MPU, SoC,…)
Upgraded RF+AMS section
Upgraded DFM, SL, verification sections Power design technology roadmap
System Drivers Chapter
Cross-TWG
• • • • CTSG: node timing pull-in, A-factor updates for FinFET, vertical devices How will FinFET, UTBB SOI timing change PPA projections? Renewal of the PIDS HP, LP roadmaps (compact modeling interaction) 3D effort with other TWGs
Design + System Drivers Update
Design ITWG
ITRS Public Conference Hsinchu, 5 Dec 2012
1
ITRS Design ITWG 2012
Past Trajectory (2004-2011)
1. Increasingly quantitative roadmap 2. Increasingly complete driver set 2008 3. Increasing MTM content
ITRS Design ITWG 2012
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“Dark Silicon” Analysis in 2001 ITRS
• Power management gap •
% o f a re a d e v o te d to lo g ic
amount of (switched) logic content in an SOC goes to zero Challenge: keeping the chip value above zero
ITRS Design ITWG 2012
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Work Toward 2013 and Beyond
Design Chapter
• • • • • • • • • • Version 2 of the Power-Aware Design Technology roadmap Version 2 of the 3D IC design technology roadmap Design technology for More Than Moore fabrics (SW, AMS/RF, MEMS) Updates of LCP, DFT, Design Verification, Design for Resilience Design of on-chip memory hits the wall at 16nm HP Rethinking the MPU Driver: Core + LLC + “uncore”; microserver class Revising the SOC-Consumer Portable Driver Elimination of SOC-Networking, SOC-Consumer Stationary drivers ? Update of Embedded Memory Continue development of AMS/RF “sub-driver” of SOC-CP Driver
Consumer Updated Stationary, Consumer Stationary, Portable, Consumer Portable, Networking Stationary, and Drivers Consumer Portable,
Updated Consumer Stationary, Portable architecture, and Networking Drivers
ITRS Design ITWG 2012
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Design Power Roadmap
ITRS Design ITWG 2012
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Low-Power Design Technology Roadmap
NEW: approximate computing, adaptivity, power gating replacement, dark silicon, extreme heterogeneity, …
Year
ITRS Design ITWG 2012
9ห้องสมุดไป่ตู้
NEW in Low-Power Design Tech Roadmap
Approximate Computing • Variable-accuracy computing (e.g., flexibly from 64b 16b) • 4D computing: reconfiguration on the fly • AVS ? (e.g., part of DVFS) Margin reduction? Adaptivity • Recapture overdesign from wearout, variation margins Power Gating Replacement • HVT device as power switch hits headroom, area wall ? Dark Silicon • “normally-off computing” = “extreme power gating” Extreme Heterogeneity • “coprocessor-dominated architectures”
ITRS Design ITWG 2012
4
Design Cost Roadmap
System Design Automation Software Virtual Prototype
Reusable Platform Block AMP Parallel Processing Many Core Devel. Tools Intelligent Testbench Executable Specification Silicon Virtual Prototype Concurrent Memory
2
Work Toward 2013 and Beyond
Design Chapter
• • • • • • • • • • Version 2 of the Power-Aware Design Technology roadmap Version 2 of the 3D IC design technology roadmap Design technology for More Than Moore fabrics (SW, AMS/RF, MEMS) Updates of LCP, DFT, Design Verification, Design for Resilience Design of on-chip memory hits the wall at 16nm HP Rethinking the MPU Driver: Core + LLC + “uncore”; microserver class Revising the SOC-Consumer Portable Driver Elimination of SOC-Networking, SOC-Consumer Stationary drivers ? Update of Embedded Memory Continue development of AMS/RF “sub-driver” of SOC-CP Driver
50
C o n sta n t P o w e r (9 0 W ) C o n sta n t P o w e r D e n sity (9 0 W /1 .5 7 cm )
2
40
30
Today: turn on only 2-6% of logic on SOC !
20
10 C o n sta n t a re a re g io n 1 9 9 9 -2 0 0 4 0 1998 2000 2002 2004 2006 2008 2010 2012 2014
ITRS 2011 Cost Chart
$100.0 $80.0
$60.0
$40.0 $20.0 $2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026
Total HW Engineering Costs + EDA Tool Costs Total HW Engineering Costs + EDA Tool Costs (smoothed) Total SW Engineering Costs + ESDA Tool Costs Total SW Engineering Costs + ESDA Tool Costs (smoothed)