M8_U3_Project
NVIDIA显卡架构简介
An Introduction to Modern GPU ArchitectureAshu RegeDirector of Developer TechnologyAgenda•Evolution of GPUs•Computing Revolution•Stream Processing•Architecture details of modern GPUsEvolution of GPUs(1995-1999)•1995 –NV1•1997 –Riva 128 (NV3), DX3•1998 –Riva TNT (NV4), DX5•32 bit color, 24 bit Z, 8 bit stencil •Dual texture, bilinear filtering•2 pixels per clock (ppc)•1999 –Riva TNT2 (NV5), DX6•Faster TNT•128b memory interface•32 MB memory•The chip that would not die☺Virtua Fighter (SEGA Corporation)NV150K triangles/sec 1M pixel ops/sec 1M transistors16-bit color Nearest filtering1995(Fixed Function)•GeForce 256 (NV10)•DirectX 7.0•Hardware T&L •Cubemaps•DOT3 –bump mapping •Register combiners•2x Anisotropic filtering •Trilinear filtering•DXT texture compression • 4 ppc•Term “GPU”introducedDeus Ex(Eidos/Ion Storm)NV1015M triangles/sec 480M pixel ops/sec 23M transistors32-bit color Trilinear filtering1999NV10 –Register CombinersInput RGB, AlphaRegisters Input Alpha, BlueRegistersInputMappingsInputMappingsABCDA op1BC op2DAB op3CDRGB FunctionABCDABCDAB op4CDAlphaFunctionRGBScale/BiasAlphaScale/BiasNext Combiner’sRGB RegistersNext Combiner’sAlpha RegistersRGB Portion Alpha Portion(Shader Model 1.0)•GeForce 3 (NV20)•NV2A –Xbox GPU •DirectX 8.0•Vertex and Pixel Shaders•3D Textures •Hardware Shadow Maps •8x Anisotropic filtering •Multisample AA (MSAA)• 4 ppcRagnarok Online (Atari/Gravity)NV20100M triangles/sec 1G pixel ops/sec 57M transistors Vertex/Pixel shadersMSAA2001(Shader Model 2.0)•GeForce FX Series (NV3x)•DirectX 9.0•Floating Point and “Long”Vertex and Pixel Shaders•Shader Model 2.0•256 vertex ops•32 tex+ 64 arith pixel ops •Shader Model 2.0a•256 vertex ops•Up to 512 ops •Shading Languages •HLSL, Cg, GLSLDawn Demo(NVIDIA)NV30200M triangles/sec 2G pixel ops/sec 125M transistors Shader Model 2.0a2003(Shader Model 3.0)•GeForce 6 Series (NV4x)•DirectX 9.0c•Shader Model 3.0•Dynamic Flow Control inVertex and Pixel Shaders1•Branching, Looping, Predication, …•Vertex Texture Fetch•High Dynamic Range (HDR)•64 bit render target•FP16x4 Texture Filtering and Blending 1Some flow control first introduced in SM2.0aFar Cry HDR(Ubisoft/Crytek)NV40600M triangles/sec 12.8G pixel ops/sec 220M transistors Shader Model 3.0 Rotated Grid MSAA 16x Aniso, SLI2004Far Cry –No HDR/HDR ComparisonEvolution of GPUs (Shader Model 4.0)• GeForce 8 Series (G8x) • DirectX 10.0• • • • Shader Model 4.0 Geometry Shaders No “caps bits” Unified ShadersCrysis(EA/Crytek)• New Driver Model in Vista • CUDA based GPU computing • GPUs become true computing processors measured in GFLOPSG80 Unified Shader Cores w/ Stream Processors 681M transistorsShader Model 4.0 8x MSAA, CSAA2006Crysis. Images courtesy of Crytek.As Of Today…• • • • GeForce GTX 280 (GT200) DX10 1.4 billion transistors 576 mm2 in 65nm CMOS• 240 stream processors • 933 GFLOPS peak • 1.3GHz processor clock • 1GB DRAM • 512 pin DRAM interface • 142 GB/s peakStunning Graphics RealismLush, Rich WorldsCrysis © 2006 Crytek / Electronic ArtsHellgate: London © 2005-2006 Flagship Studios, Inc. Licensed by NAMCO BANDAI Games America, Inc.Incredible Physics EffectsCore of the Definitive Gaming PlatformWhat Is Behind This Computing Revolution?• Unified Scalar Shader Architecture• Highly Data Parallel Stream Processing • Next, let’s try to understand what these terms mean…Unified Scalar Shader ArchitectureGraphics Pipelines For Last 20 YearsProcessor per functionVertex Triangle Pixel ROP MemoryT&L evolved to vertex shadingTriangle, point, line – setupFlat shading, texturing, eventually pixel shading Blending, Z-buffering, antialiasingWider and faster over the yearsShaders in Direct3D• DirectX 9: Vertex Shader, Pixel Shader • DirectX 10: Vertex Shader, Geometry Shader, Pixel Shader • DirectX 11: Vertex Shader, Hull Shader, Domain Shader, Geometry Shader, Pixel Shader, Compute Shader • Observation: All of these shaders require the same basic functionality: Texturing (or Data Loads) and Math Ops.Unified PipelineGeometry(new in DX10)Physics VertexFutureTexture + Floating Point ProcessorROP MemoryPixelCompute(CUDA, DX11 Compute, OpenCL)Why Unify?Vertex ShaderPixel ShaderIdle hardwareVertex ShaderIdle hardwareUnbalanced and inefficient utilization in nonunified architectureHeavy Geometry Workload Perf = 4Pixel Shader Heavy Pixel Workload Perf = 8Why Unify?Unified ShaderVertex WorkloadPixelOptimal utilization In unified architectureUnified ShaderPixel WorkloadVertexHeavy Geometry Workload Perf = 11Heavy Pixel Workload Perf = 11Why Scalar Instruction Shader (1)• Vector ALU – efficiency varies • • 4 MAD r2.xyzw, r0.xyzw, r1.xyzw – 100% utilization • • 3 DP3 r2.w, r0.xyz, r1.xyz – 75% • • 2 MUL r2.xy, r0.xy, r1.xy – 50% • • 1 ADD r2.w, r0.x, r1.x – 25%Why Scalar Instruction Shader (2)• Vector ALU with co-issue – better but not perfect • DP3 r2.x, r0.xyz, r1.xyz } 100% • 4 ADD r2.w, r0.w, r1.w • • 3 DP3 r2.w, r0.xyz, r1.xyz • Cannot co-issue • 1 ADD r2.w, r0.w, r2.w • Vector/VLIW architecture – More compiler work required • G8x, GT200: scalar – always 100% efficient, simple to compile • Up to 2x effective throughput advantage relative to vectorComplex Shader Performance on Scalar Arch.Procedural Perlin Noise FireProcedural Fire5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 7900GTX 8800GTXConclusion• Build a unified architecture with scalar cores where all shader operations are done on the same processorsStream ProcessingThe Supercomputing Revolution (1)The Supercomputing Revolution (2)What Accounts For This Difference?• Need to understand how CPUs and GPUs differ• Latency Intolerance versus Latency Tolerance • Task Parallelism versus Data Parallelism • Multi-threaded Cores versus SIMT (Single Instruction Multiple Thread) Cores • 10s of Threads versus 10,000s of ThreadsLatency and Throughput• “Latency is a time delay between the moment something is initiated, and the moment one of its effects begins or becomes detectable”• For example, the time delay between a request for texture reading and texture data returns• Throughput is the amount of work done in a given amount of time• For example, how many triangles processed per second• CPUs are low latency low throughput processors • GPUs are high latency high throughput processors•GPUs are designed for tasks that can tolerate latency•Example: Graphics in a game (simplified scenario):•To be efficient, GPUs must have high throughput , i.e. processing millions of pixels in a single frame CPUGenerateFrame 0Generate Frame 1Generate Frame 2GPU Idle RenderFrame 0Render Frame 1Latency between frame generation and rendering (order of milliseconds)•CPUs are designed to minimize latency•Example: Mouse or keyboard input•Caches are needed to minimize latency•CPUs are designed to maximize running operations out of cache •Instruction pre-fetch•Out-of-order execution, flow control• CPUs need a large cache, GPUs do not•GPUs can dedicate more of the transistor area to computation horsepowerCPU versus GPU Transistor Allocation•GPUs can have more ALUs for the same sized chip and therefore run many more threads of computation•Modern GPUs run 10,000s of threads concurrentlyDRAM Cache ALU Control ALUALUALUDRAM CPU GPUManaging Threads On A GPU•How do we:•Avoid synchronization issues between so many threads?•Dispatch, schedule, cache, and context switch 10,000s of threads?•Program 10,000s of threads?•Design GPUs to run specific types of threads:•Independent of each other –no synchronization issues•SIMD (Single Instruction Multiple Data) threads –minimize thread management •Reduce hardware overhead for scheduling, caching etc.•Program blocks of threads (e.g. one pixel shader per draw call, or group of pixels)•Any problems which can be solved with this type of computation?Data Parallel Problems•Plenty of problems fall into this category (luckily ☺)•Graphics, image & video processing, physics, scientific computing, …•This type of parallelism is called data parallelism•And GPUs are the perfect solution for them!•In fact the more the data, the more efficient GPUs become at these algorithms •Bonus: You can relatively easily add more processing cores to a GPU andincrease the throughputParallelism in CPUs v. GPUs•CPUs use task parallelism•Multiple tasks map to multiplethreads•Tasks run different instructions•10s of relatively heavyweight threadsrun on 10s of cores•Each thread managed and scheduledexplicitly•Each thread has to be individuallyprogrammed •GPUs use data parallelism•SIMD model (Single InstructionMultiple Data)•Same instruction on different data•10,000s of lightweight threads on 100sof cores•Threads are managed and scheduledby hardware•Programming done for batches ofthreads (e.g. one pixel shader pergroup of pixels, or draw call)Stream Processing•What we just described:•Given a (typically large) set of data (“stream”)•Run the same series of operations (“kernel”or“shader”) on all of the data (SIMD)•GPUs use various optimizations to improve throughput:•Some on-chip memory and local caches to reduce bandwidth to external memory •Batch groups of threads to minimize incoherent memory access•Bad access patterns will lead to higher latency and/or thread stalls.•Eliminate unnecessary operations by exiting or killing threads•Example: Z-Culling and Early-Z to kill pixels which will not be displayedTo Summarize•GPUs use stream processing to achieve high throughput •GPUs designed to solve problems that tolerate high latencies•High latency tolerance Lower cache requirements•Less transistor area for cache More area for computing units•More computing units 10,000s of SIMD threads and high throughput•GPUs win ☺•Additionally:•Threads managed by hardware You are not required to write code for each thread and manage them yourself•Easier to increase parallelism by adding more processors•So, fundamental unit of a modern GPU is a stream processor…G80 and GT200 Streaming ProcessorArchitectureBuilding a Programmable GPU•The future of high throughput computing is programmable stream processing•So build the architecture around the unified scalar stream processing cores•GeForce 8800 GTX (G80) was the first GPU architecture built with this new paradigmG80 Replaces The Pipeline ModelHost Input Assembler Setup / Rstr / ZCull Geom Thread Issue Pixel Thread Issue128 Unified Streaming ProcessorsSP SP SP SPVtx Thread IssueSPSPSPSPSPSPSPSPSPSPSPSPTFTFTFTFTFTFTFTFL1L1L1L1L1L1L1L1L2 FB FBL2 FBL2 FBL2 FBL2 FBL2Thread ProcessorGT200 Adds More Processing PowerHost CPU System MemoryHost Interface Input Assemble Vertex Work Distribution Geometry Work Distribution Viewport / Clip / Setup / Raster / ZCull Pixel Work Distribution Compute Work DistributionGPUInterconnection Network ROP L2 ROP L2 ROP L2 ROP L2 ROP L2 ROP L2 ROP L2 ROP L2DRAMDRAMDRAMDRAMDRAMDRAMDRAMDRAM8800GTX (high-end G80)16 Stream Multiprocessors• Each one contains 8 unified streaming processors – 128 in totalGTX280 (high-end GT200)24 Stream Multiprocessors• Each one contains 8 unified streaming processors – 240 in totalInside a Stream Multiprocessor (SM)• Scalar register-based ISA • Multithreaded Instruction Unit• Up to 1024 concurrent threads • Hardware thread scheduling • In-order issueTPC I-Cache MT Issue C-CacheSP SP SP SP SP SP SP SPSFU SFU• 8 SP: Thread Processors• IEEE 754 32-bit floating point • 32-bit and 64-bit integer • 16K 32-bit registers• 2 SFU: Special Function Units• sin, cos, log, exp• Double Precision Unit• IEEE 754 64-bit floating point • Fused multiply-add DPShared Memory• 16KB Shared MemoryMultiprocessor Programming Model• Workloads are partitioned into blocks of threads among multiprocessors• a block runs to completion • a block doesn’t run until resources are available• Allocation of hardware resources• shared memory is partitioned among blocks • registers are partitioned among threads• Hardware thread scheduling• any thread not waiting for something can run • context switching is free – every cycleMemory Hierarchy of G80 and GT200• SM can directly access device memory (video memory)• Not cached • Read & write • GT200: 140 GB/s peak• SM can access device memory via texture unit• Cached • Read-only, for textures and constants • GT200: 48 GTexels/s peak• On-chip shared memory shared among threads in an SM• important for communication amongst threads • provides low-latency temporary storage • G80 & GT200: 16KB per SMPerformance Per Millimeter• For GPU, performance == throughput• Cache are limited in the memory hierarchy• Strategy: hide latency with computation, not cache• Heavy multithreading • Switch to another group of threads when the current group is waiting for memory access• Implication: need large number of threads to hide latency• Occupancy: typically 128 threads/SM minimum • Maximum 1024 threads/SM on GT200 (total 1024 * 24 = 24,576 threads)• Strategy: Single Instruction Multiple Thread (SIMT)SIMT Thread Execution• Group 32 threads (vertices, pixels or primitives) into warps• Threads in warp execute same instruction at a time • Shared instruction fetch/dispatch • Hardware automatically handles divergence (branches)TPC I-Cache MT Issue C-CacheSP SP SP SP SP SP SP SPSFU SFU• Warps are the primitive unit of scheduling• Pick 1 of 24 warps for each instruction slot• SIMT execution is an implementation choice• Shared control logic leaves more space for ALUs • Largely invisible to programmerDPShared MemoryShader Branching Performance• G8x/G9x/GT200 branch efficiency is 32 threads (1 warp) • If threads diverge, both sides of branch will execute on all 32 • More efficient compared to architecture with branch efficiency of 48 threadsG80 – 32 pixel coherence 48 pixel coherence 16 14 number of coherent 4x4 tiles 12 10 8 6 4 2 0% 20% 40% 60% 80% 100% 120% PS Branching EfficiencyConclusion:G80 and GT200 Streaming Processor Architecture• Execute in blocks can maximally exploits data parallelism• Minimize incoherent memory access • Adding more ALU yields better performance• Performs data processing in SIMT fashion• Group 32 threads into warps • Threads in warp execute same instruction at a time• Thread scheduling is automatically handled by hardware• Context switching is free (every cycle) • Transparent scalability. Easy for programming• Memory latency is covered by large number of in-flight threads• Cache is mainly used for read-only memory access (texture, constants).。
各种证书英语翻译
一、国家及校级奖项、称号国家奖学金National Scholarship国家励志奖学金National Encouragement scholarship三好学生标兵Pacemaker to Merit Student三好学生Merit Student学习优秀生Model Student of Academic Records突出才能奖Model Student of Outstanding Capacity先进个人Advanced Individual/Outstanding Student优秀工作者Excellent staff优秀学生干部Excellent Student Cadre优秀共青团员Excellent League Member优秀毕业生Outstanding Graduates优秀志愿者Outstanding Volunteer先进班集体Advanced Class优秀团干Outstanding League Cadres学生协会优秀干部Outstanding cadres of Student Association学生协会工作优秀个人Outstanding Individual of Student Association精神文明先进个人Spiritual Advanced Individual社会工作先进个人Advanced Individual of Social Work文体活动先进个人Advanced Individual of Cultural and sports activities道德风尚奖Ethic Award精神文明奖High Morality Prize最佳组织奖Prize for The Best Organization突出贡献奖Prize for The OutstandingContribution工作创新奖Prize for TheCreative Working团队建设奖Prize for The Team Contribution二、各系比赛与奖项外语系（Foreign Language Department）:话剧比赛Drama petition英语演讲比赛English Speech Contest八系辩论赛Eight Departments Invitational Debate 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Card中级涉外秘书证Intermediate Foreign Secretary Card会计证Accounting Certificate会计从业XX书:Certificate of Accounting Professional初级职务（助理会计）证书Sub-accountant Certificate Preliminary Level中级职称Intermediate Certificate管理会计师证书:Certificate in Management Accounting注册会计师证书:(CPA Certificate)Certificate of Certified Public Accountant注册金融分析师（CFA）Chartered Financial Analyst特许公认会计师（ACCA）The Association of Chartered AccountantsCAD工程师认证证书CAD Engineer Certification电工证Electrician certificate技工证书Technician Certificate教师XX Teacher Certification心理辅导教师XX书Psychological Counseling Teacher Certificate报关员XX书Clerk for the Customs Declaration报关员证书Customs Declaration Certificate人力资源从业XX书Qualification of HumanResources Practitioners驾驶证Driver’s License国家司法考试证书National Judicial Examinationcertificate（lawyer's qualification certificate）律师XX书Attorney’s certificate企业法律顾问执业XX书Enterprise CounselQualification Certificate法律顾问Legal Adviser律师助理证Assistant Lawyer Certificate会计从业XX Certificate of Accounting Professional初级会计职称Junior Level 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Sports-meeting of Huizhou University校运会男子100米Men’s 100-metre Race in theSports-meeting of Huizhou University校运会女子100米Women’s 100-metre Race in theSports-meeting of Huizhou University 校运会男子200米Men’s 200-metre Race in theSports-meeting of Huizhou University 校运会女子200米Women’s 200-metre Race in the Sports-meeting of Huizhou University 校运会男子1500米Men’s 1500-metre Race in theSports-meeting of Huizhou University校运会女子800米Women’s 800-metre Race in theSports-meeting of Huizhou University校运会男女跳高比赛Men/Women’s High Jump Matches校运会男女三级跳比赛Men/Women’s Triple Jump Matches校运会男子110米栏Men’s 110-metre Hurdle Race校运会男女铅球Men/Women’s Shot Put校运会男女标枪Men/Women’s javelin throwing五、艺术节博客大赛Blog Contest“金话筒·”主持人大赛Golden Microphone HostpetitionXX学院十大歌手Top Ten Singers of Huizhou University创意T台服装设计大赛Creative Fashion Design petitionXX学院丰湖之星Fenghu Stars of HuizhouUniversity激浪黑板报大赛Wave Blackboard Poster petition“激浪个性我创”涂鸦比赛Wave Creative Graffiti petition“墨迹杯”书画大赛Chinese Ink Cup Calligraphyand Painting petition军训优秀通讯员Excellent Correspondent in Military Training军训先进个人Advanced Individual in Militarytraining十佳社团Top Ten Outstanding Associations体育道德风尚奖PE Morality Award优秀指导教师奖Excellent Guide Teacher Award突出贡献奖Outstanding Contribution Award工作创新奖Innovation Award团队建设奖Teamwork Award最佳台风奖Best Stage Style Award最佳人气奖Best Popularity Award优秀组织奖Outstanding Organization Award最佳创意奖Best Creativity Award优秀团体奖Excellent Group Award优秀节目奖Best Program Award十佳新秀奖Top Ten Outstanding Rising StarsAward最具潜质奖Most Potentiality Award最佳才艺奖Outstanding Talent Award最佳气质奖Outstanding Quality Award最佳口才奖Best Eloquence Award最佳演员奖Best Actor Award最佳剧本奖Best Script Award优秀会员Excellent Member优秀辩手Excellent Debater六、协会法律促进协会Law Promotion Association模拟法庭竞赛Moot Court petition英语口语协会Oral English Institute交流会Exchange Meeting —— Make Our Voice Heard书法协会Calligraphy Association“亲近中国文化，了解汉字”Get Close to the Chinese culture, Get to Learn Chinese CharactersX－GAME协会X-GAME AssociationX-GAME创新表演大赛X-GAME Innovation contests心理健康促进协会Association of Advancement of Mental Health“心灵之交”Meeting Soul-mates峥嵘乒乓球协会Association of Zhengrong Table Tennis“我最有才”峥嵘乒乓球比赛Zhengrong Cup Table Tennis Contest足球协会Football Association“新生杯”足球争霸赛之各系荣耀大战Freshmen CupFootball Match of allDepartments—Glory War毽球协会Shuttlecock Association毽球新风采”毽球大比拼New Style Shuttlecock petition篮球协会Basketball Association“三人篮球赛”Three-player Basketball Match旅游爱好者协会Travel Enthusiasts Association创意风筝节Creative Kite Festival演讲与口才协会Speech and Eloquence Association“环境保护，重在行动”演讲比赛Take Action to Protect Environment Speech Contest奕林棋协Yi-lin Chinese Chess Association“奕林棋协棋王争霸赛”Yi-lin Chinese Chess Conpetition企业与市场调研协会Business and Marketing Research Association职业经理人挑战赛Professional managersChallenge Match飞翔舞协Flying Dance Association 假面舞会Masque Ball新春柳话剧社Reborn Drama Association“我心飞扬”剧本创作大赛及公演Flying Heart Script-writing Contest摄影协会Photography Association“生活”摄影展Life Photo Exhibition 七、其他学生会Student Union团委会Youth League mittee学生社团Students’ Association体育部Sports Department文艺部Arts Department学习部Learning Department女生部Girls Department心理发展部Psychological Development Department外联部Public Relations Department宣传部Propaganda Department生活部Life Department纪检部Discipline InspectionDepartment秘书部Secretary Department组织部Organization Department编辑部Editorial Department学生会主席President of the Student Union团委会书记Secretary of the Youth League mittee团支书League Branch Secretary团支书Secretary of the Youth LeagueBranch mittee副书记Vice Secretary秘书长Secretary-general学术部干事 a member of the AcademicDepartment宿舍长Head of the dormitory优秀团员Excellent League Member班长Monitor/ Class President副班长Vice-monitor文体委员Recreation & Sports Secretary学习委员Study Secretary生活委员Life Secretary宣传委员Publicity Secretary生活委员Organization Secretary勤工俭学Work-study Program青年志愿者协会Youth Volunteers Association政治辅导员Political Tutors晚会主持人Host on the entertainment / evening party礼仪队Reception Team/ Protocol Team三下乡Volunteer Activities for theCountry People综合测评prehensive Evaluation ofStudents’Performance预备党员Probationary Party 入党积极分子Applicant for Party Membership综合素质优秀学生Excellent Student of prehensive Quality优秀青年志愿者Outstanding Young Volunteer校园十杰Ten Prominent Youth on Campus / Top Ten Youth on Campus品学兼优的学生Student of Good Character and Scholarship模拟招聘会Mock Interviews军训Military Training艺术团Art Troupe义教Voluntary Teaching迎新晚会Wele Party for the Freshmen招聘会Job Fair广播站Broadcasting Station学生处Students Affairs Department舍管houseparent社会活动social/ public activities课外活动extracurricular activities社会实践social practice学术活动academic activities籍贯native place婚姻状况marital status家庭状况family status可到职时间date of availability教育程度educational background课程curriculum职业目标career objective主修major工作目标employment objective副修minor希望职位position wanted优良学风班Class of Good Style Study团结合作Solidarity and Cooperation创新能力Creative Ability沟通能力municational Ability兼职Part-time Job促销员Sales Promoter派传单Deliver pamphlets市场调研Marketing Research乒乓球协会Table Tennis Association社团艺术节munity Festival招聘Recruitment Site党支部Party Branch家教Tutor英语培训中心English training centre成绩优异Outstanding Academic Results学业技能Academic Skills思想品行Ideological Morality文体表现Arts and Sports Performance社团艺术节munity Festival实习Internship各类奖学金一、校内奖学金国家奖学金: National Scholarship国家励志奖学金：National Scholarship for Encouragement校一等奖：The First Prize Scholarship校二等奖：The Second Prize Scholarship校三等奖：The Third Prize Scholarship单项奖学金：Individual Scholarship二、捐赠奖学金1 千金药业奖学金The Qianjin Pharmaceutical Scholarship2 奇瑞21世纪东方之子奖学金The 21st Century Chery Oriental Son Scholarship3 台骅奖学金The TaiHua Scholarship4 澳洲校友会奖学金The Australian Alumni AssociationScholarship5 松下电器育英基金奖学金The Panasonic Electronics YUYING Fund Scholarship6 陈翠娥优秀贫困医学本科生奖学金The ChenCuie Scholarshipfor excellent medical undergraduates under poverty7 姚志斌、谭笑夫妇优秀贫困医学生本科生奖学金TheScholarship of YaoZhibin and his wife TanXiao for excellent medical undergraduates under poverty8 黄金城、朱嘉梨夫妇医学奖学金The Medical Scholarship ofHuang Jincheng and his wife Zhu Jiali9 中国宋庆龄基金会宝马优秀大学生奖学金The BMW China Song Ching Ling Foundation Scholarship for OutstandingUniversity Students (The BMW Scholarship)10 许崇清奖学金The Xu Chongqing Scholarship11 商承祚奖学金The Shang Chengzuo Scholarship12 汇丰银行The HSBC Bank Scholarship13 XX可口可乐优秀学生奖学金The Zhuhai Coca-ColaScholarship for Outstanding Students14 XX加拿XX学会奖学金The Scholarship of Canadian Alumni Association in Hong Kong15 南方都市报新闻奖学金The Southern Metropolis Daily NewsScholarship16 住友商事奖学金The Sumitomo Corporation Scholarship17 三星奖学金The Samsung Scholarship18 丰田奖学金The Toyota Scholarship19 宝钢教育基金优秀学生奖学金The Baogang Scholarship20 花旗金融信息科技优秀奖学金The Citi Bank’s Financial Information TechnologyScholarship.21 中国惠普优秀学生奖学金The HP Chinese Excellent StudentScholarship22 IBM中国优秀学生奖学金The IBM Chinese Excellent Student Scholarship 23 恒生银行奖学金The Hang Seng Bank Scholarship24 LG化学奖学金The LG Chemical Scholarship25 时代地产奖学金The Times Real Estate Scholarship26 邹鲁奖学金The Zou Lu Scholarship27 李龙镳奖学金The Lee Yong-Biao Scholarship28 杜邦奖学金The Dupont Scholarship29 爱普生基金奖学金The EPSON Foundation Scholarship30 XX柯麟医学教育基金优秀学生奖学金The Guangdong KeLin Medical Education FundScholarship for Outstanding Students31 光华教育奖学金The GuangHua Educational Scholarship32 卫生部国际交流与合作中心.第一三共医药学奖学金The Medical Scholarship by Daiichi-Sankyo Corporation33 XX赛莱拉生物基因工程优秀学生奖学金Guangzhou CeleraBiology Genetic Engineering Scholarship for Outstanding Students34 XX医美东校友会优秀本科生奖学金The Scholarship ofZhongshan Medical Alumni Association of the United Statesand East for Outstanding Undergraduate35 文鹏凌夫妇医学奖学金The Wen Pengling Couple Medical Scholarship36 X焯霖神经病学奖学金The Liu Zhuolin Neurology Scholarship37 许天禄夫妇奖学金The Xu Tianlu Couple Scholarship38 周肇平骨科奖学金The Zhou Zhaoping OrthopedicScholarship39 平安励志奖学金Ping An Endeavourers Scholarship40 雷诺丽特奖学金The Renolit Scholarship41 大新银行The Dah Sing Bank Scholarship42 三井住友银行奖学金The Sumitomo Mitsui Banking Corporation (SMBC) Scholarship;43 亚洲教育慈善基金奖学金The Asia Education Charitable Fund Scholarship44 钱剑辉神经病学奖学金The Qian Jianhui NeurologyScholarship45 佐丹奴奖学金The Giordano Scholarship46 卫材（中国）药业奖学金The Eisai (China) Pharmaceutical Scholarship47 卫材（中国）药业优秀学生奖学金The Eisai (China)Pharmaceutical Scholarship for outstanding students48 卫材（中国）药业社会活动单项奖学金The Eisai (China)Pharmaceutical Individual Scholarship for social activities49 南富士杉山播种奖学金The South Fujitsu SugiyamaPlanting Scholarship三、港澳侨台奖学金The First/Second/Third Prize of Hong Kong, Macau andOverseas Chinese Scholarship四、优秀毕业生Outstanding Graduates Awards。
邮件英文用于100句
1. I am writing to confirm /enquire/inform you...我写信时要确认/询问/通知你。
2. I am writing to follow up on our earlier decision on the marketing campaign in Q2.我写信来追踪我们之前对于第二季度营销活动的决定。
3. With reference to our telephone conversation today...关于我们今天在中的谈话。
4. In my previous on October5...先前在10月5日所写的信。
5. As I mentioned earlier about...如我先前所提及关于。
6. as indicated in my previous ...如我在先前的信中所提出。
7. As we discussed on the phone...如我们上次在中的讨论。
8. from our decision at the previous meeting...如我们在上次会议中的决定。
9. as you requested/per your requirement...按照你的要求。
10.In reply to your dated April 1，we decided...回答你在4月1日写的信，我们决定。
11.This is in response to your today.这是针对你今天早上来信的回复。
12. As mentioned before, we deem this product has strong unique selling points in china.如先前所述，我们认为这个产品在中国有强有力且独一无二的销售点。
13. As a follow-up to our phone conversation yesterday, I wanted to get back to you about the pending issues of our agreement.追踪我们昨天在中所谈，我想答复你我们合约的一些待解决的议题。
1732 ArmorBlock 诊断16点I O模块系列A用户指南说明书
Wiring Diagrams Pinout Guide for 1732 ArmorBlock Diagnostic 16-point I/O Modules, Series ACatalog Numbers 1732D-8X81212D, -8X81212HD,-8I8O1212D, -IB161212D, -IBDPM12MND, -8X8M12D Package ContentsYour package contains one 1732 ArmorBlock module and these wiring instructions.For complete installation instructions, refer to the Module Publication Number table and visit .Module Publication NumberModule PublicationNumber1732D-IN009 DeviceNet 1732 ArmorBlock Network-powered 8-input Auxiliary-powered8-output Module, Series A (cat. no. 1732-8X81212D)1732D-IN010 DeviceNet 1732 ArmorBlock Network-powered 8-input/8-output Module,Series A (cat. no. 1732-8I8O1212D)1732D-IN011 DeviceNet 1732 ArmorBlock Network-powered 8-input Auxiliary-powered8-output Module, Series A (cat. no. 1732-8X81212DH)1732D-IN012 DeviceNet 1732 ArmorBlock Network-powered 16-input Module, Series A(cat. no. 1732-IB161212D)1732D-IN007 DeviceNet 1732 ArmorBlock Network Powered 16-Input Module, Series A(cat. no. 1732D-IBDPM12MND)1732D-IN004 DeviceNet 1732 ArmorBlock Network-powered 8-input Auxiliary-powered8-output Module, Series A (cat. no. 1732D-8X8M12D)Publication 1732-WD003C-EN-P - July 20092 Pinout Guide for 1732 ArmorBlock Diagnostic 16-point I/O Modules, Series A Publication 1732-WD003C-EN-P - July 2009DeviceNet ConnectorsI/O Connectors1732 DeviceNet Micro-style(view into connector)Pin 1DrainPin 2V+Pin 3 V-Pin 4CAN_HPin 5CAN_L (view into connector)Pin 1DrainPin 2V+Pin 3V-Pin 4CAN_HPin 5CAN_LNetwork-in Male Connector Network-out Female Connector1732 DeviceNet Mini-styleNetwork-in Male Connector(view into connector)Pin 1 Sensor Source VoltagePin 2 Input BPin 3 ReturnPin 4 Input APin 5 PE 5-pin Female Input Micro-stylePinout Guide for 1732 ArmorBlock Diagnostic 16-point I/O Modules, Series A 3Publication 1732-WD003C-EN-P - July 2009Auxiliary Power Connector ATTENTION Two sets of mounting holes are used to mount the module directly to a panel or machine. Mounting holes accommodate #6 (M3) pan head screws. The torquespecification is 0.64 Nm (6 in-lb).ATTENTION This equipment is considered Group 1, Class A industrial equipment accordingto IEC/CISPR Publication 11. Without appropriate precautions, there may bepotential difficulties ensuring electromagnetic compatibility in otherenvironments due to conducted as well as radiated disturbance.(view into connector)Pin 1 Not UsedPin 2 Output BPin 3 ReturnPin 4 Output APin 5 PE5-pin Female Output Micro-style(view into connector)Pin 1Sensor Source VoltagePin 2 OutputPin 3 ReturnPin 4 InputPin 5 PE5-pin Female Combination Micro-style(view into connector)Pin 1Output Power+Pin 2No ConnectionPin 3No ConnectionPin 4Output Power-4-pin Mini-style4 Pinout Guide for 1732 ArmorBlock Diagnostic 16-point I/O Modules, Series A Publication 1732-WD003C-EN-P - July 2009SpecificationsEnvironmental Specifications AttributeValue Temperature, operating-20…60 °C (-4…140 °F)Ambient temperaturerating (UL)60 °C (140 °F)Operating voltage11…30V DC Output current 1732D-8I8O1212D - 0.5A per output1732D-8X81212D - 0.5A per output1732D-8X81212HD - 1.4A per output1732D-8X8M12D - 0.5A per outputEnclosure type ratingMeets IP65/66/67/69K (when marked), and NEMA 4X/6P withreceptacle dust caps or cable termination.CertificationsCertifications (whenproduct is marked)(1)(1)See the Product Certification link at for Declarations of Conformity, Certificates, and other certification details.Value c-UL-usUL Listed Industrial Control Equipment, certified for US and Canada. See UL File E322657CE European Union 2004/108/EC EMC Directive, compliant with:EN 61326-1; Meas./Control/Lab., Industrial RequirementsEN 61000-6-2; Industrial ImmunityEN 61000-6-4; Industrial EmissionsEN 61131-2; Programmable Controllers (Clause 8, Zone A & B)C-Tick Australian Radiocommunications Act,compliant with: AS/NZS CISPR 11; Industrial EmissionsDeviceNetODVA conformance tested to DeviceNet specificationsPinout Guide for 1732 ArmorBlock Diagnostic 16-point I/O Modules, Series A 5 Notes:Publication 1732-WD003C-EN-P - July 20096 Pinout Guide for 1732 ArmorBlock Diagnostic 16-point I/O Modules, Series A Notes:Publication 1732-WD003C-EN-P - July 2009Pinout Guide for 1732 ArmorBlock Diagnostic 16-point I/O Modules, Series A 7 Notes:Publication 1732-WD003C-EN-P - July 2009Publication 1732-WD003C-EN-P - July 2009PN-51088Supersedes Publication 1732-WD003B-EN-P - January 2008Copyright © 2009 Rockwell Automation, Inc. All rights reserved. Printed in Singapore.Rockwell Automation SupportRockwell Automation provides technical information on the Web to assist you in using its products. At , you can find technicalmanuals, a knowledge base of FAQs, technical and application notes, sample code and links to software service packs, and a MySupport feature that you can customize to make the best use of these tools.For an additional level of technical phone support for installation, configuration and troubleshooting, we offer TechConnect Support programs. For more information, contact your local distributor or Rockwell Automation representative, or visit .Installation AssistanceIf you experience a problem with a hardware module within the first 24 hours ofinstallation, please review the information that's contained in this manual. You can also contact a special Customer Support number for initial help in getting your module up and running:New Product Satisfaction ReturnRockwell tests all of its products to ensure that they are fully operational when shipped from the manufacturing facility. However, if your product is not functioning and needs to be returned:Allen-Bradley, Rockwell Automation, TechConnect, and ArmorBlock are trademarks of Rockwell Automation, Inc. Trademarks not belonging to Rockwell Automation are property of their respective companies.United States1.440.646.3434 Monday – Friday, 8am – 5pm EST Outside United States Please contact your local Rockwell Automation representative for any technical support issues.United States Contact your distributor. You must provide a Customer Support case number (see phone number above to obtain one) to your distributor in order to complete the return process.Outside United StatesPlease contact your local Rockwell Automation representative for returnprocedure.。
8MP ISP 新相机移植 (AN13713)说明书
AN137138MP ISP New Camera PortingRev. 0 — 24 August 2022Application note8MP ISP New Camera Porting 1Building ISP module, drivers, and librariesTo run a camera sensor on the i.MX 8MP board, build the ISP module, drivers, andlibraries (including <cam>.ko, <cam>.so, and <cam>.drv) for your sensor. In addition,get the camera calibration files (.xml), dewarp calibration files (.json), and sensor-configuration files (.cfg) ready to set correct ISP parameters and stream mode.1.If you use NXP supported sensors (such as OS08A20), get the drivers and librariesfrom "yocto imx-isp" and "yocto vvcam" after you build the whole ISP module.2.Find detailed instructions for writing code or building new drivers and libraries in"iMX8MP_CAMERA_DISPLAY_GUIDE.pdf", available at the NXP website. Togenerate sensor-calibration files, calibrate the new camera sensor in a lab and thengenerate the ".xml" files using the camera calibration tool and the ".json" files usingthe dewarp calibration tool. Sensor-configuration files can be easily created by editingNote: If you use a flat len sensor and decide not to calibrate the new dewarpconfiguration files, bypass the ISP's dewarp feature. Use the dewarp configuration files ofother sensors with the same resolution and set the "dewarp bypass" parameter to "true".Figure 1. Bypass parameter2Building the ISP moduleTo build the ISP module, get the correct versions of toolchain, linux kernel, "yocto imx-isp" and "yocto vvcam" on your local machine.8MP ISP New Camera Porting2.1Creating the i.MX Yocto SDK and installing the toolchain1.2.3.4.image-full-armv8a-imx8mp-lpddr4-evk-toolchain-5.15-kirkstone.sh" file.5.The toolchain path is "/opt/my-tool-chain-path".2.2Building the NXP kernel1.Download the correct version of the NXP kernel from https:///external/imx/linux-imx.2.Note: The build path of the Linux kernel should be the path of the "build_v8" folder.3Building the "yocto imx-isp" (details are in "build-all-isp.sh")1.folder.8MP ISP New Camera Porting 2.4Building "yocto vvcam" (details are in "build-all-vvcam.sh")1.Download the correct version of "yocto vvcam" from https:///external/imx/isp-vvcam.In Yocto, "vvcam" is in the "build-wayland-8mp/tmp/work/imx8mpevk-poky-linux/kernel-module-isp-vvcam" folder.2.Build "vvcam" using the following command (you can also use the "build-all-5Copying useful files listed below to a build-out directoryKernel:•".dtb" files (build_v8/arch/arm64/boot/dts/freescale/imx8mp-evk-*.dtb)•Image (build_v8/arch/arm64/boot/Image)•"imx-media-dev.ko" (build_v8/drivers/stagging/media/imx/imx-media-dev.ko)Imx-isp:•Libraries (isp-imx-4.2.2.18.0/appshell/build/generated/[build mode]/lib/*.so*)8MP ISP New Camera Porting •Sensor-related files (e.g. "isp-imx-4.2.2.18.0/appshell/build/generated/[build mode]/bin/OS08a20.*" and "isp-imx-4.2.2.18.0/appshell/build/generated/[build mode]/bin/os08a20.*")•"isp_media_server" (isp-imx-4.2.2.18.0/appshell/build/generated/[build mode]/bin/isp_media_server)•Test files (isp-imx-4.2.2.18.0/appshell/build/generated/[build mode]/bin/test_*)•Sensor-configuration files (isp-imx-4.2.2.18.0/appshell/build/generated/[build mode]/bin/Sensor*_Entry.cfg)•"vvext" (isp-imx-4.2.2.18.0/appshell/build/generated/[build mode]/bin/vvext)•Dewarp configurations (isp-imx-4.2.2.18.0/dewarp/dewarp_config/*)•Scripts to run the ISP ("isp-imx-4.2.2.18.0/imx/start_isp.sh" and "isp-imx-4.2.2.18.0/imx/run.sh")Vvcam:•Sensor driver (isp-vvcam/vvcam/v4l2/sensor/os08a20/os08a20.ko)•"vvcam-dwe" (isp-vvcam/vvcam/v4l2/video/vvcam-dwe.ko)•"vvcam-isp" (isp-vvcam/vvcam/v4l2/video/vvcam-isp.ko)•"vvcam-video" (isp-vvcam/vvcam/v4l2/video/vvcam-video.ko)Note: When building the ISP SDK, keep the Linux and SDK versions the same as theYocto release.6Using SCP to remotely send the files in the build-out directory to EVKNote: "libtinyxml2.so" is required for the build. However, it may not be included inall SDK configurations. You can build this package separately if you have the Yoctoenvironment or download pre-built package from a package distribution repository (suchas ; choose "arm64" with the correct version).7Setting the environment when bootingAfter generating and copying the necessary files into a folder, the ISP folder can look likeFigure 2.8MP ISP New Camera PortingFigure 2. ISP folder8Running ISP and sensor (e.g. OS08A20) on 8MP EVK1.2.3.4.5.6.Reference: "build-all-isp.sh", "build-all-vvcam.sh"9Porting a new camera to the tuning tool1.Download the tuning server and client released by NXP.8MP ISP New Camera Porting2.To enable other sensor tuning, you do not have to rebuild "isp-imx" and "vvcam".After porting your sensor according to the porting guide and building it, you can getthe related sensor files in the "build_output_release" directory. Just push the sensor-3.10Revision history8MP ISP New Camera Porting 11Legal information11.1 DefinitionsDraft — A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may resultin modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information.11.2 DisclaimersLimited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors.In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or defaultin the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applicationsand the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer.In no event shall NXP Semiconductors, its affiliates or their suppliersbe liable to customer for any special, indirect, consequential, punitiveor incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages.Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors,its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose.Translations — A non-English (translated) version of a document, including the legal information in that document, is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.Security — Customer understands that all NXP products may be subject to unidentified vulnerabilities or may support established security standards or specifications with known limitations. Customer is responsible for the design and operation of its applications and products throughout their lifecyclesto reduce the effect of these vulnerabilities on customer’s applicationsand products. Customer’s responsibility also extends to other open and/or proprietary technologies supported by NXP products for use in customer’s applications. NXP accepts no liability for any vulnerability. Customer should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsiblefor compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP.NXP has a Product Security Incident Response Team (PSIRT) (reachableat *************) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products.11.3 TrademarksNotice: All referenced brands, product names, service names, and trademarks are the property of their respective owners.NXP — wordmark and logo are trademarks of NXP B.V.8MP ISP New Camera PortingContents1Building ISP module, drivers, and libraries (2)2Building the ISP module (2)2.1Creating the i.MX Yocto SDK and installingthe toolchain (3)2.2Building the NXP kernel (3)3Building the "yocto imx-isp" (details are in"build-all-isp.sh") (3)4Building "yocto vvcam" (details are in"build-all-vvcam.sh") (4)5Copying useful files listed below to abuild-out directory (4)6Using SCP to remotely send the files inthe build-out directory to EVK (5)7Setting the environment when booting (5)8Running ISP and sensor (e.g. OS08A20)on 8MP EVK (6)9Porting a new camera to the tuning tool (6)10Revision history (7)11Legal information (8)Please be aware that important notices concerning this document and the product(s)described herein, have been included in section 'Legal information'.。
ArmorPOINT RTD 和热电枪输入模块目录号 1738-IR2M12、1738-IT2IM1
Installation InstructionsArmorPOINT RTD and Thermocouple Input ModulesCatalog numbers 1738-IR2M12, 1738-IT2IM12, Series A Table of ContentsTopic Page Important User Information2 Environment and Enclosure3 Preventing Electrostatic Discharge3About the Module4Mount the I/O Base5Install the Module6 Remove the Module from the Mounting Base6Wire the Module7 Communicate with the Module8 Interpret Status Indicators10 Specifications122 ArmorPOINT RTD and Thermocouple Input ModulesImportant User InformationSolid-state equipment has operational characteristics differing from those of electromechanical equipment. Safety Guidelines for the Application, Installation and Maintenance of Solid State Controls (Publication SGI-1.1 available from your local Rockwell Automation sales office or online at/literature/) describes some important differences betweensolid-state equipment and hard-wired electromechanical devices. Because of this difference, and also because of the wide variety of uses for solid-state equipment, all persons responsible for applying this equipment must satisfy themselves that each intended application of this equipment is acceptable.In no event will Rockwell Automation, Inc. be responsible or liable for indirect or consequential damages resulting from the use or application of this equipment.The examples and diagrams in this manual are included solely for illustrative purposes. Because of the many variables and requirements associated with any particular installation, Rockwell Automation, Inc. cannot assume responsibility or liability for actual use based on the examples and diagrams.No patent liability is assumed by Rockwell Automation, Inc. with respect to use of information, circuits, equipment, or software described in this manual.Reproduction of the contents of this manual, in whole or in part, without written permission of Rockwell Automation, Inc., is prohibited.Throughout this manual, when necessary, we use notes to make you aware of safety considerations.Publication 1738-IN005B-EN-E - January 2013ArmorPOINT RTD and Thermocouple Input Modules 3Publication 1738-IN005B-EN-E - January 2013Environment and EnclosurePreventing Electrostatic DischargeATTENTION: This equipment is intended for use in overvoltage Category II applications (as defined in IEC 60664-1), at altitudes up to 2000 m (6562 ft) without derating.This equipment is considered Group 1, Class A industrial equipment according to IEC/CISPR 11. Without appropriate precautions, there may be difficulties with electromagnetic compatibility in residential and other environments due to conducted and radiated disturbances.This equipment is supplied as enclosed equipment. It should not require additional system enclosure when used in locations consistent with theenclosure type ratings stated in the Specifications section of this publication. Subsequent sections of this publication may contain additional information regarding specific enclosure type ratings, beyond what this product provides, that are required to comply with certain product safety certifications.In addition to this publication, see:•Industrial Automation Wiring and Grounding Guidelines, RockwellAutomation publication 1770-4.1, for additional installation requirements.•NEMA Standard 250 and IEC 60529, as applicable, for explanations of thedegrees of protection provided by different types of enclosure.ATTENTION: This equipment is sensitive to electrostatic discharge, which can cause internal damage and affect normal operation. Follow these guidelines when you handle this equipment:•Touch a grounded object to discharge potential static.•Wear an approved grounding wriststrap.•Do not touch connectors or pins on component boards.•Do not touch circuit components inside the equipment.•Use a static-safe workstation, if available.•Store the equipment in appropriate static-safe packaging when not in use.4 ArmorPOINT RTD and Thermocouple Input ModulesPublication 1738-IN005B-EN-E - January 2013About the ModuleThe ArmorPOINT™ I/O family consists of modular I/O modules. The sealed IP67 housing of these modules requires no enclosure. Note that environmental requirements other than IP67 may require an additional appropriate housing. I/O connectors are sealed M12 (micro) style. The mounting base ships with the module. The 1738-IR2M12 module is shown here.ArmorPOINT RTD and Thermocouple Input ModuleDescriptionDescription1Connector M12-A 3LED indicators2Connector M12-B3ArmorPOINT RTD and Thermocouple Input Modules 5Publication 1738-IN005B-EN-E - January 2013Mount the I/O BaseMount the I/O base on a wall or panel, using the screw holes provided in the base.Mounting Diagram for ArmorPOINT Base with AdapterFollow the instructions to install the mounting base.y out the required points as shown above in the drilling dimension diagram.2.Drill the necessary holes for M4 (#8) machine or self-tapping screws.3.Mount the base using M4 (#8) screws.4.Ground the system using the ground lug connection. The ground lug connectionis also a mounting hole.Mounting BaseIMPORTANTThe module must be mounted on a grounded metal mounting plate or otherconductive surface.KeyswitchGround lug connectionLatching mechanism6 ArmorPOINT RTD and Thermocouple Input ModulesInstall the ModuleFollow the instructions to install the ArmorPOINT input module.ing a bladed screwdriver, rotate the keyswitch on the mounting base clockwiseuntil the number 6 aligns with the notch in the base.2.Position the module vertically above the mounting base. The module bridgestwo bases.3.Push the module down until it engages the latching mechanism. Y ou hear aclicking sound when the module is properly engaged. The locking mechanismlocks the module to the base.Remove the Module from the Mounting BaseFollow the instructions to remove the module from the mounting base.1.Insert a flat blade screwdriver into the slot of the orange latching mechanism.2.Push the screwdriver toward the I/O module to disengage the latch. The modulelifts up off the base.3.Pull the module off the base.Publication 1738-IN005B-EN-E - January 2013ArmorPOINT RTD and Thermocouple Input Modules 7Publication 1738-IN005B-EN-E - January 2013Wire the ModuleFollow the wiring instructions for the ArmorPOINT input modules.1738-IR2M121738-IT2IM12IMPORTANTAnalog modules have earth grounded metal rings. This should be considered when choosing shielded cables and grounding techniques.ATTENTION: Make sure all connectors and caps are securely tightened to properly seal the connections against leaks and maintain IP67 requirements.(View into connector) Pin 1 No connectPin 2 Input 0A (M12-A)Input 1A (M12-B) Pin 3 Input 0C (M12-A)Input 1C (M12-B) Pin 4 Input 0B (M12-A)Input 1B (M12-B) Pin 5 No connect(View into connector) Pin 1 CJC +Pin 2 TC 0 + (M12-A)TC 1 + (M12-B) Pin 3 CJC -Pin 4 TC 0 - (M12-A)TC 1 - (M12-B) Pin 5 No connect8 ArmorPOINT RTD and Thermocouple Input ModulesPublication 1738-IN005B-EN-E - January 2013Communicate with the ModuleI/O messages are sent to (consumed) and received from (produced) the ArmorPOINT I/O modules. These messages are mapped onto the processor’s memory. TheArmorPOINT RTD I/O input module produces 6 Bytes of input data (scanner Rx – status) and fault status data. The ArmorPOINT thermocouple I/O input module produces 8 Bytes of input data (scanner Rx – status) and fault status data. They do not consume I/O data (scanner Tx).Default Data Map – 1738-IR2M12Message size: 6 Bytes15141312111009080706050403020100Produces (scanner Rx)Input channel 0 high byte Input channel 0 low byte Input channel 1 high byteInput channel 1 low byte Status byte for channel 1Status byte for channel 0ORURHHA LLA HA LACM CFORURHHA LLA HA LACM CFConsumes (scanner Tx)No consumed data Where:OR = Overrange; 0 = No error, 1 = Fault UR = Underrange; 0 = No error, 1 = FaultHHA = High/High Alarm; 0 = No error, 1 = Fault LLA = Low/Low Alarm; 0 = No error, 1 = Fault HA = High Alarm; 0 = No error, 1 = Fault LA = Low Alarm; 0 = No error, 1 = FaultCM = Calibration Mode; 0 = Normal, 1 = Calibration mode CF = Channel Fault Status; 0 = No error, 1 = FaultArmorPOINT RTD and Thermocouple Input Modules 9Publication 1738-IN005B-EN-E - January 2013Default Data Map – 1738-IT2IM12Message size: 6 Bytes15141312111009080706050403020100Produces (scanner Rx)Input channel 0 high byte Input channel 0 low byte Input channel 1 high byteInput channel 1 low byte Status byte for channel 1Status byte for channel 0OR UR HHA LLA HA LACM CFORURHHA LLA HA LACM CFORURCold junction temperature(Selectable channel 0, channel 1, or average of both channels 0 and 1)Consumes (scanner Tx)No consumed data Where:OR = Overrange; 0 = No error, 1 = Fault UR = Underrange; 0 = No error, 1 = FaultHHA = High/High Alarm; 0 = No error, 1 = Fault LLA = Low/Low Alarm; 0 = No error, 1 = Fault HA = High Alarm; 0 = No error, 1 = Fault LA = Low Alarm; 0 = No error, 1 = FaultCM = Calibration Mode; 0 = Normal, 1 = Calibration mode CF = Channel Fault Status; 0 = No error, 1 = Fault10 ArmorPOINT RTD and Thermocouple Input ModulesPublication 1738-IN005B-EN-E - January 2013Interpret Status IndicatorsThis module has the following indicators:•Adapter, DeviceNet and POINTBus status indicators •System and Adapter power indicators•Individual I/O status indicators for inputs and outputsIndicator Status for ModulesStatusDescriptionModule statusOff No power applied to device.Green Device operating normally.Flashing green Device needs commissioning due to missing, incomplete, or incorrect configuration.Flashing red Recoverable fault.RedUnrecoverable fault – may require device replacement.Flashing red/green Device is in self-test.I/O status indicatorNetwork status indicatorModule status indicator 1738-IR2M12ArmorPOINT RTD and Thermocouple Input Modules 11Publication 1738-IN005B-EN-E - January 2013Network status OffDevice is not online:- Device has not completed dup_MAC-id test.- Device not powered – check module status indicator.Flashing green Device is online but has no connections in the established state.Green Device is online and has connections in the established state.Flashing red One or more I/O connections are in timed-out state.RedCritical link failure – failed communication device. Device detected error that prevents it from communicating on the network. Possible duplicate MAC ID or baud rate mismatch.Flashing red/green Communication faulted device – the device has detected anetwork access error and is in communication faulted state. Device has received and accepted an Identity Communication Faulted Request – long protocol message.I/O statusOff Module in CAL mode.Solid green Normal (channel scanning inputs).Flashing green Channel being calibrated.Solid red Major channel fault.Flashing redChannel at end of range (over or under).Indicator Status for ModulesStatusDescription12 ArmorPOINT RTD and Thermocouple Input ModulesPublication 1738-IN005B-EN-E - January 2013SpecificationsArmorPOINT RTD and Thermocouple Input Modules – 1738-IR2M12, 1738-IT2IM12AttributeValueInputs per module 1738-IR2M12 – 2 single-ended, nonisolated1738-IT2IM12 – 2 differential, individually isolatedResolution1738-IR2M12 – 16 bits, 9.5 mV/cnt, 0.03 °C/cnt (Pt385 @ 25 °) 1738-IT2IM12 – 15 bits plus sign, 2.5 mV/cnt Thermocouple type (and resolution average over span)1738-IT2IM12 only Sensor Range Resolution (average over span)Type B 30…1820 °C 3 counts/°C Type C 0…2315 °C 6 counts/°C Type E -270…1000 °C 24 counts/°C Type J -210…1200 °C 21 counts/°C Type K -270…1372 °C 13 counts/°C Type N -270…1300 °C 11 counts/°C Type R -50…1768.1 °C 4 counts/°C Type S -50…1768.1 °C 4 counts/°C Type T-270…400 °C15 counts/°CRTD sensors supported1738-IR2M12 only100 Ω Pt α = 0.00385 Euro (-200…870 °C) 200 Ω Pt α = 0.00385 Euro (-200…630 °C) 100 Ω Pt α = 0.003916 U.S. (-200…630 °C) 200 Ω Pt α = 0.003916 U.S. (-200…630 °C) 10 Ω Cu α = 0.00427 (-200…260 °C) 100 Ω Ni α = 0.00618 (-60…250 °C) 120 Ω Ni α = 0.00672 (-60…250 °C) 120 Ω Ni α = 0.00618 (-60…250 °C)Cold junctioncompensation range 1738-IT2IM12 – 0…70 °C Input range 1738-IR2M12 – 0…600 Ω 1738-IT2IM12 – ±75 mV Absolute accuracy (1)0.1% full scale @ 25 °C Accuracy drift w/temp30 ppm/°CArmorPOINT RTD and Thermocouple Input Modules 13Publication 1738-IN005B-EN-E - January 2013Input update rate (per module)1738-IR2M1240 ms @ Notch = 50 Hz33 ms @ Notch = 60 Hz (default) 20 ms @ Notch = 100 Hz 17 ms @ Notch = 120 Hz 10 ms @ Notch = 200 Hz 8 ms @ Notch = 240 Hz 7 ms @ Notch = 300 Hz 5 ms @ Notch = 400 Hz 4 ms @ Notch = 480 Hz 1738-IT2IM1220 ms @ Notch = 50 Hz17 ms @ Notch = 60 Hz (default) 10 ms @ Notch = 100 Hz 8 ms @ Notch = 120 Hz 5 ms @ Notch = 200 Hz 4 ms @ Notch = 240 Hz 3 ms @ Notch = 300 Hz 3 ms @ Notch = 400 Hz 2 ms @ Notch = 480 HzStep response (per channel)60 ms @ Notch = 50 Hz 50 ms @ Notch = 60 Hz 30 ms @ Notch = 100 Hz 25 ms @ Notch = 120 Hz 15 ms @ Notch = 200 Hz 13 ms @ Notch = 240 Hz 10 ms @ Notch = 300 Hz 8 ms @ Notch = 400 Hz 6 ms @ Notch = 480 Hz Input resistance 1738-IT2IM12 only – 1 M ΩInput impedance 1738-IT2IM12 only – 100 K ΩConversion typeDelta Sigma Common mode rejection ratio 120 dBNormal mode rejection ratio100 dB -3 dbNotch filter13.1 Hz @ Notch = 50 Hz 15.7 Hz @ Notch = 60 Hz 26.2 Hz @ Notch = 100 Hz 31.4 Hz @ Notch = 120 Hz 52.4 Hz @ Notch = 200 Hz 62.9 Hz @ Notch = 240 Hz 78.6 Hz @ Notch = 300 Hz 104.8 Hz @ Notch = 400 Hz 125.7 Hz @ Notch = 380 Hz Data format Signed integerMaximum overload1738-IR2M12 – No input protection1738-IT2IM12 – Input not overvoltage protected(1)Includes offset, gain, non-linearity and repeatability error termsArmorPOINT RTD and Thermocouple Input Modules – 1738-IR2M12, 1738-IT2IM12AttributeValue14 ArmorPOINT RTD and Thermocouple Input Modules Publication 1738-IN005B-EN-E - January 2013General SpecificationsAttributeValueMounting base screw torque M4 (#8) screw,0.85 Nm (7.5 lb-in.) in aluminum, 1.8 Nm (16 lb-in.) in steel Calibration Factory-calibratedPOINTBus current 1738-IR2 – 220 mA @ 5V DC 1738-IT2I – 175 mA @ 5V DC Power dissipation, max 1.0 W Thermal dissipation, max 3.3 BTU/hrIsolation voltage Tested at 50V rms (1738-IT2I has isolation between individual channels)Dielectric test 1000V rms flash for 1s External DC power No external power requiredLED indicators1 green/red – module status indicator, logic side 1 green/red – network status indicator, logic side2 green/red – input status indicators, logic side Dimensions, HxWxD 31.75 x 66.80 x 107.95 mm (1.25 x 2.63 x 4.25 in.)Weight0.289 kg (0.637 lb)Enclosure type rating Meets IP65/66/67 (when marked)Wiring category (1) 1 – on signal ports Keyswitch position6(1)Use this Conductor Category information for planning conductor routing. Refer to Industrial Automation Wiring and Grounding Guidelines, publication 1770-4.1.Environmental SpecificationsAttributeValueTemperature, operatingIEC 60068-2-1 (Test Ad, Operating Cold), IEC 60068-2-2 (Test Bd, Operating Dry Heat),IEC 60068-2-14 (Test Nb, Operating Thermal Shock): -20…60 °C (-4…140 °F)Temperature, storageIEC 60068-2-1 (Test Ab, Unpackaged Nonoperating Cold), IEC 60068-2-2 (Test Bb, Unpackaged Nonoperating Dry Heat), -40…85 °C (-40…185 °F)Relative humidityIEC 60068-2-30 (Test Db, Unpackaged Nonoperating Damp Heat): 5…95% noncondensingArmorPOINT RTD and Thermocouple Input Modules 15Publication 1738-IN005B-EN-E - January 2013Vibration IEC60068-2-6 (Test Fc, Operating): 5 g @ 10…500 HzShock, operating IEC60068-2-27 (Test Ea, Unpackaged Shock): 30 gShock, nonoperating IEC60068-2-27 (Test Ea, Unpackaged Shock): 50 gEmissions Emissions CSPR 11: Group 1, Class A ESD immunityIEC 61000-4-2:6 kV contact discharges 8 kV air dischargesRadiated RF immunityIEC 61000-4-3:10V/m with 1 kHz sine-wave 80% AM @ 30 MHz…1000 MHz 10V/m with 200 Hz 50% pulse 100% AM @ 900 Mhz EFT/B immunity IEC 61000-4-4:±3 kV @ 5 kHz on signal ports Surge transient immunity IEC 61000-4-5:±2 kV line-earth(CM) on shielded portsConducted RF immunityIEC 61000-4-6:10Vrms with 1kHz sine-wave 80% AM @ 150 kHz…80 MHzCertificationsCertification (when product is marked)(1)Valuec-UL-us UL-listed Industrial Control Equipment, certified for US and Canada CEEuropean Union 89/336/EEC EMC Directive, compliant with: EN 61000-6-4; Industrial Emissions EN 50082-2; Industrial ImmunityEN 61326; Meas./Control/Lab., Industrial Requirements EN 61000-6-2; Industrial Immunity C-TickAustralian Radiocommunications Act, compliant with: AS/NZS CISPR 11; Industrial Emissions(1)See the Product Certification link at for Declaration of Conformity, Certificates, and other certification details.Environmental SpecificationsAttributeValueRockwell Automation SupportRockwell Automation provides technical information on the Web to assist you in using its products. At /support/, you can find technical manuals, a knowledge base of FAQs, technical and application notes, sample code and links to software service packs, and a MySupport feature that you can customize to make the best use of these tools.For an additional level of technical phone support for installation, configuration and troubleshooting, we offer TechConnect support programs. For more information, contact your local distributor or Rockwell Automation representative, or visit /support/.Installation AssistanceIf you experience a problem within the first 24 hours of installation, please review the information that's contained in this manual. You can also contact a special Customer Support number for initial help in getting your product up and running.New Product Satisfaction ReturnRockwell Automation tests all of its products to ensure that they are fully operational when shipped from the manufacturing facility. However, if your product is not functioning and needs to be returned, follow these procedures.Documentation FeedbackYour comments will help us serve your documentation needs better. If you have any suggestions on how to improve this document, complete this form, publication RA-DU002, available at /literature/.United States or Canada 1.440.646.3434Outside United States or CanadaUse the Worldwide Locator at/support/americas/phone_en.html , or contact your local Rockwell Automation representative.United StatesContact your distributor. You must provide a Customer Support case number (call the phone number above to obtain one) to your distributor to complete the return process.Outside United StatesPlease contact your local Rockwell Automation representative for the return procedure.Publication 1738-IN005B-EN-E - January 2013Supersedes Publication 1738-IN005A-EN-E - June 2004Copyright © 2013 Rockwell Automation, Inc. All rights reserved.Allen-Bradley, Rockwell Automation, ArmorPOINT, and T echConnect are trademarks of Rockwell Automation, Inc.Trademarks not belonging to Rockwell Automation are property of their respective companies.。
DAGE XD7800NT Ruby XL X-ray Inspection System 说明书
B G A w i t h O p e n J o i n t sXD7800NT Ruby XL X-ray Inspection SystemAdvantagesD AGE NT500 Maintenance-Free, Sealed-Transmissive X-ray Tube< 0.5 μm Feature Recognition160 kV Tube with Up to 10 W Target Power - Always Retains Sub-Micron AbilityD AGE 3 Mpixel @ 25fps Long Lifetime CMOS Flat Panel Detector with Real Time Image Enhancements G eometric Magnification 1,800 X, System 7,800 X for Total 23,400 X with Digital ZoomDAGE, the only x-ray company whose focus is on x-ray electronics inspection, offers the DAGE XD7800NT Ruby XL x-ray inspection system as the DAGE NT maintenance-free, sealed-transmissive x-ray tube, providing 0.5 μm feature The Solution for Large Board Applicationsall controlled through simple, joystick-free, ‘point and click’ operation, provides the safe, collision-free and high magnification inspection required for production applications. All these tasks can be simply 33” x 24.2” (840 x 615mm) Tray Size47” x 26.4” (1205 x 672 mm) Maximum Board Size with reduced Magnification70° Oblique Views without Loss of Magnification T wo 24” TFT LCD MonitorsAXiS - Active X-ray Image StabilizationNo Programming Skills Required for Automated Inspection TasksO ptions: X-Plane®; Joysticks For more information, speak with your Nordson representative or contact your Nordson regional officeAmericas+ 1 760 930 3307*********************Europe+44 1296 317800***************************China+86 512 6665 2008************************Germany+49 89 2000 338 270************************Japan+81 120 537 555************************Korea+82 31 462 9642***********************South East Asia+65 6552 7533************************Taiwan+886 2 2902 1860***************************United Kingdom+44 1296 317800***************************XD7800NT Ruby XL X-ray Inspection System Specifications• DAGE NT500 sealed-transmissive, filament-free x-ray tube:– < 0.5 μm feature recognition 30 - 160 kV for < 4 W target power– < 0.95 μm feature recognition when above 4 W target power– 10 W max. target power above 110 kV– automated tube stabilisation• 1,800 X geometric magnification (7,800 X system magnification)• 23,400 X total magnification including digital zoom• Easy, collision-free, high magnification inspection:– even at oblique angle views– joystick-free, ‘point and click’ operation• Tray size: 33” x 24.2” (840 x 615mm)• Maximum board size: 47” x 26.4” (1205 x 672 mm) with reduced magnification *Please refer to Dage for clarification for larger boards• Maximum inspection area: 33” x 24.2” (840 x 615mm)• 70° oblique angle views (over 30” x 24”, 762 x 610 mm):– for 360° around a point of interest– isocentric manipulator configuration keeps features in field of view • Long Lifetime CMOS digital detector with 1940 x 1530 pixels (3 Mpixels)– 25 fps full-frame ‘real time’ image acquisition– real time image enhancements• 16-bit digital image processing• AXiS - Active X-ray Image Stabilisation - anti-vibration control• Two off 24” TFT LCD operator display monitors• DAGE Image Wizard operating software including:– automated and manual component fault analysis including BGA & QFN– simple to create and use robust automated inspection routines– plated through hole (PTH) fill percentage calculation– accurate measurement functions– automated and manual die attach / area void calculation– patented1 X-ray navigation map for easy fault location– simple to use, no complicated joysticks required• Fully lead-shielded system safety cabinet– providing < 1 μSv/hr x-ray leakage– meets all international standards• 1 years system warrantyOptions• P atented X-Plane® 2• J oystick control (X,Y or X,Y & Z)• B arcode reader• 2nd Year warranty System• A pproximate Size: 94.5” x 98.5” x 81.5” (w x d x h)• A pproximate Size: 2400 x 2500 x 2070 mm (w x d x h)• A pproximate System Weight: 3000 kg (6600 lbs)• M aximum Sample Weight: 10 kg (22 lbs)• P ower: Single Phase 200 - 230Vac, 16A• M ax. P ower Consumption: 1000 W Max.• A ir: 4-6 bar of clean dry air for anti-vibration• O perating Temp. Range: 10 - 30ºC• H umidity: < 85% (non-condensing)1 EP 20632612 US 9129427 DS-RXL-110821。
mide007
mide007IntroductionThe mide007 is a revolutionary device that combines advanced technology and innovative features, making it the perfect companion for tech-savvy individuals. This document aims to provide a comprehensive overview of the mide007, including its design, key features, functionality, and benefits. By the end of this document, you will have a clear understanding of why the mide007 is the ultimate gadget you need in your life.DesignThe mide007 boasts a sleek and modern design that is both aesthetically pleasing and functional. It features a slim profile and lightweight construction, making it easy to carry around and comfortable to use for extended periods. The device is available in a range of stylish colors, allowing users to choose one that matches their personal style.Key Features1. High-resolution display: The mide007 comes with a vibrant and crystal-clear display, delivering sharp images and vibrant colors. Whether you're watching videos, playing games, or browsing the web, the high-resolution screen ensures a truly immersive experience.2. Powerful processor: Equipped with a state-of-the-art processor, the mide007 offers lightning-fast performance and seamless multitasking. Users can enjoy smooth navigation and quick access to their favorite apps without any lag or delays.3. Advanced camera system: Capture stunning photos and videos with the mide007's advanced camera system. With high-quality lenses and image stabilization technology, users can expect sharp and vivid images, even in low-light conditions.4. Enhanced security: The mide007 takes your security seriously. With built-in facial recognition technology and fingerprint sensors, your data and personal information stay safe and protected.Functionality1. Communication: The mide007 allows users to stay connected with their friends, family, and colleagues. With its seamless integration of social media apps, email clients, and messaging platforms, users can easily communicate and stay updated.2. Entertainment: The mide007 is a versatile device that offersa wide range of entertainment options. Whether you enjoy gaming, streaming movies, or listening to music, this device provides a high-quality and immersive experience.3. Productivity: With a range of productivity apps, including document editors, note-taking apps, and cloud storage integration, the mide007 is the perfect tool for busy professionals. Stay organized, manage your tasks, and boost your productivity with ease.Benefits1. Portability: The mide007's compact size and lightweight design make it extremely portable. Whether you're traveling, commuting, or simply on the go, this device fits seamlessly into your lifestyle.2. Versatility: With its wide range of features and functions, the mide007 eliminates the need for multiple devices. Enjoy the convenience of having all your essential tools in one compact device.3. Performance: The mide007's powerful processor ensures smooth and efficient performance, even when running multiple apps simultaneously. Say goodbye to lagging and freezing, and enjoy a seamless user experience.4. Security: The mide007 prioritizes your security, ensuring that your personal information and data remain protected at all times. Rest easy knowing that your device is equipped with advanced security features.ConclusionIn conclusion, the mide007 is a game-changer in the world of gadgets. Its sleek design, key features, functionality, and benefits make it a must-have for tech enthusiasts. Whether you're a professional looking for a powerful productivity tool or an entertainment lover craving a device that offersimmersive experiences, the mide007 has it all. Invest in this revolutionary gadget and unlock a world of possibilities.。
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Type
Things needed rubbish rubbish pictures ________(includ e) plastic, aluminums, cloth and paper; strong paper card; glue rubbish a tin can or old prints pieces of cloths; paint; card
Way to make
put the rubbish on a card _______ the rubbish onto the card ______ the different sections with paint
______ one end of a tin can into paint ________ the painted rubbish on a card to make different shapes
This may sound _______(disgust) to some, but it is really quite clean and fun. One end of a tin can tube can be dipped into used paint and _____(use) to make circles on a piece have of card. so why not _____(have) a look at some of the ideas above and then try out some ideas of ______your own. Have fun!
Way to make
think about the pattern make a face ______ the foods on a pizza take a photo of it
Type
Things needed string card; thin pictures string; ______; crayon or pencil feather and seashell pictures feathers; seashells; card; glue
How many unusual ways to create pictures are mentioned in the passage?
What are they?
Read the passage carefully and fill in the following chart:
Type
Things ______( need) pizza faces a ________ (vary)of foods; camera;
Part B rk in groups to discuss the following questions
1. Which idea do you think is the most interesting? 2. What other things could you make unusual pictures from? 3. How would you use them to make unusual pictures?
Pizza faces Put your apron on and get ready to make a pizza. Now you can be a chef and 1___artist. You an can use a variety of different foods to help you make a face. Here are a few ideas about______ to use the different foods. how and Cut some small slices of carrot as hair 3____ arrange it in the style that you want. Cut up some tomatoes for eyes, peaches for ears, 4_____ for and a mushroom _______a nose. Next, you need to think about the mouth. You could use half a tomato slice or make a smile from a slice of bacon.
Have you heard of other ways to create unusual pictures?
There are also many other ways to create unusual pictures.
Read the article about unusual pictures. Skim the text and answer the following questions:
Unit 3
Making a book about unusual pictures
Have you heard of pictures drawn by means of sand?
Welcome and enjoy a video on how to make pictures by means of sand.
Other _____ foods you could use to make a pizza
faces include eggplant, ham and sugar cubes. Most of these foods are available at your local grocery. When you have made the face, you can unusual take a photo of it, so that you can then keep your If ＿＿＿(usual) picture forever.____ you have taken the photo, you can then cook and eat the pizza face. An artist in the USA once made pizza faces from fruit and vegetables. ______
Way to make draw the ____ on the card _____ the glue on the card put the string on the glue paint the string think about the pattern ___ all the pieces out on the card stick them down
disgusting
where Next, put the glue _________ you want to put the string. _______(make) string pictures, you need some To make card, thin string and glue. Choose small shells so they will not be very heavy are stuck (stick )onto the card. You can when they ________ before lay all the pieces out on the card ______you stick them down.