Standard MEMS sensor technologies for harsh environment
mems工程师需要的资格证书

mems工程师需要的资格证书(原创版)目录1.MEMS 工程师的职业定义和重要性2.MEMS 工程师所需的资格证书3.如何获得这些证书4.总结正文MEMS 工程师,即微机电系统工程师,是一种专注于设计和制造微小机器和设备的工程师。
这些微小的机器和设备通常由电子和机械组件构成,被广泛应用于各种领域,如医疗、工业和消费类电子产品。
因此,MEMS 工程师对于现代科技社会的发展起着至关重要的作用。
作为一名 MEMS 工程师,需要具备一定的技术和知识,因此需要获得一些资格证书来证明自己的能力和专业知识。
这些证书可以提高工程师的专业水平,使他们在职业生涯中更具竞争力。
首先,MEMS 工程师需要具备基本的工程教育背景,通常要求至少拥有一个工程学学位,如机械工程、电子工程或材料工程等。
此外,他们还需要掌握相关的技术知识,如计算机辅助设计(CAD)和计算机辅助制造(CAM)等。
其次,MEMS 工程师还需要获得一些专业证书,以证明他们在微机电系统领域的专业能力。
例如,美国微机电系统学会(MEMS Innovation Group)提供的 MEMS 设计师证书,以及国际微电子及组装技术协会(International Society for Microelectronics and Packaging)提供的微电子组装技术证书等。
那么,如何获得这些证书呢?通常,获得这些证书需要参加相关的培训课程和考试。
这些课程和考试通常由专业的机构或学会提供,旨在帮助MEMS 工程师提高专业技能和知识。
总的来说,作为一名 MEMS 工程师,获得相关的资格证书是非常重要的。
这些证书不仅可以提高工程师的专业水平,还可以增加他们在职业生涯中的竞争力。
Sensata Technologies 压力传感器产品简介说明书

Temperature FunctionWORLD CLASSPERFORMANCESensata Technologiesoffers a wide range ofsensing solutions forpressure applications ofevery kind. By focusingour unparalleledengineering and manu-facturing expertise onyour needs, we willmeet the highestexpectations of all -your own.Sensata Technologiesis the world’s leadingsupplier of sensors andcontrols across a broadrange of markets andapplications.WORLD CLASS PERFORMANCE The CP Series’ pressure transducers with their proven ceramiccapacitive technology have been on the market for many years.Our large portfolio with a variety of mechanical and electrical connec-tions creates a broad range of combination possibilities.50.5 (2)73.8 max (2.9)57.9 max (2.3)35.6 max (1.8)ø 24.3 (0.96)8.2 (0.3)3.6 (0.14)40.2 (1.6)30.4 (1.2)Sensata Technologies is the world’s leading supplier of sensors and controls across a broad range of markets and applications.WORLD CLASS 65.0 (2.56)45.6 (1.8)23.9 (0.94)Pressure outputGroundSupply voltageThermistor outputFeatures and benefits• Hermetic pressure sensors with multiple Input/Output options • High accuracy and repeatability • Multiple standard and custom ports • Outstanding EMC performance and high dielectric strengthTypical applications• Air conditioning• Alternative energy management • Compressors and pumps • Hydraulics and pneumatics• Processing control and automation • Vending machinesWORLD CLASS PERFORMANCE The CH Series’ pressure transducers are ideally suited for the most demanding industrial applications. This innovative product is hermetic but not oil-filled and boasts case isolation up to 1800 V.Ground57.2 (2.25)Aø 31.8 (1.25)Power terminalAOuput terminalø 27.4 (1.08)Sensata Technologies is the world’s leading supplier of sensors and controls across a broad range of markets and applications.Technical specificationsWORLD CLASS PERFORMANCE The PP Series’ pressure transducers allow for the best control in an industrial system. A piezo-resistive technology has been selected, whereby the strain gauges are glass fused onto a metal membrane and hermetically sealed.Small Form Factor 30.1 (1.19)ø 13 (0.51)31.7 (1.25)30 m a x (1.18)40 max (1.58)28 (1.10) 26.8 max (1.06)ø 6 (0.24)Sensata Technologies is the world’s leading supplier of sensors and controls across a broad range of markets and applications.WORLD CLASS PERFORMANCE The most accurate technologies for a true Differential Pressure Sensor are Micro-Electro-Mechanical-Systems (MEMS). Our patented MEMSproducts offer the best-value solutions for differential pressure applications.23 (0.9)ø 6 (0.24)23 (0.9)ø 8 (0.32)20 (0.8)71 (2.8)12.6 (0.5)Supply Voltage GroundOutput signal6 (0.24)Sensata Technologies is the world’s leading supplier of sensors and controls across a broad range of markets and applications.Seal material compatibility guideSeal material Media compatibility (please contact Sensata for more information)Maximum seal temperature range*petroleum oils, lubricants, detergent solutionssteam soaps, polar solvents, brake fluid, acetone Skydrol TM chlorinated solvents, oils, fuels, air Pressure connections(please contact Sensata for other connections)27.6 (1.09)Packard Metri-PackAMP MQS - 3 pins 1/4” - 18 NPTF male1/8” - 27 NPTF male1/4” SAE female flare with deflator (7/6” - 20 UNF - 2B)ø 17 (0.67)Electrical connections(please contact Sensata for other connections)16.4 (0.65)23.5 (0.95)34.4 (1.35)DIN 7258519.6 (0.77)ø 23.6 (0.93)12.9 (0.51)26.4 (1.04)34.1 (1.34)3/8” - 24 UNF male1/4” - 19 BSPT male25.1 (0.99)20 (0.79)10.9 (0.43)7 (0.28)14.5 (0.57)24.3 (0.96)9.8 (0.39)14.5 (0.57)8.9 (0.35)VDA13.8 (0.54)27.1 (1.07)7/16” - 20 UNF maleHex 17.5 (0.69)14.6 (0.58)Hex 17.5 (0.69)11.4 (0.45)Hex 15.7 (0.62)9.5 (0.38)M12 x 1 maleM12 x 1.5 maleM14 x 1.5 male13.7 (0.54)16.2 (1.48)11.3 (0.45)10.3 (0.41)9.8 (0.39)M10 x 1.25 female M18 x 1.5 male 10 (0.39)Hex 14 (0.55)12.7 (0.5)14 (0.55)12 (0.47)12 (0.47)6.9 (0.27)13.2 (0.84)12 (0.47)15.5 (0.6)18 (0.71)19.3 (0.76)19.9 (0.78)14.3 (0.56)11.1 (0.44)17.5 (0.69)6.4 (0.25)Hex 15.9 (0.63)12.7 (0.5)9.2 (0.36)Note: Dimensions are shown in mm (inches)Note: Dimensions are shown in mm (inches)10.6 (0.42)12.7 (0.5)15.3 (0.6)10.3 (0.41)Yazaki10.4 (0.41)21.8 (0.96)RD22.3 (0.88)70.1 (2.76)Sensata Technologies Holland B.V. Kolthofsingel 87602 EM ALMELOThe NetherlandsPhone: +31 546 879555Fax:+31 546 870535 Important Notice: Sensata Technologies (Sensata) reserves the right to make changes to or discontinue any product or service identified in this publication without notice. Sensata advises its customers to obtain the latest version of the relevant information to verify, before placing any orders, that the information being relied upon is current. Sensata assumes no responsibility for infringement of assistance or product specifications since Sensata does not possess full access concerning the use or application of customers' products. Sensata also assumes no responsibil-ity for customers' product design.。
传感器技术论文中英文对照资料外文翻译文献

传感器技术论文中英文对照资料外文翻译文献Development of New Sensor TechnologiesSensors are devices that can convert physical。
chemical。
logical quantities。
etc。
into electrical signals。
The output signals can take different forms。
such as voltage。
current。
frequency。
pulse。
etc。
and can meet the requirements of n n。
processing。
recording。
display。
and control。
They are indispensable components in automatic n systems and automatic control systems。
If computers are compared to brains。
then sensors are like the five senses。
Sensors can correctly sense the measured quantity and convert it into a corresponding output。
playing a decisive role in the quality of the system。
The higher the degree of n。
the higher the requirements for sensors。
In today's n age。
the n industry includes three parts: sensing technology。
n technology。
and computer technology。
MEMS陀螺仪的简要介绍(性能参数和使用)

MEMS陀螺仪的简要介绍(性能参数和使用)MEMS传感器市场浪潮可以从最早的汽车电子到近些年来的消费电子,和即将来到的物联网时代。
如今单一的传感器已不能满足人们对功能、智能的需要,像包括MEMS惯性传感器、MEMS环境传感器、MEMS光学传感器、甚至生物传感器等多种传感器数据融合将成为新时代传感器应用的趋势。
工欲善其事,必先利其器,这里就先以MEMS陀螺仪开始,简要介绍一下MEMS陀螺仪、主要性能参数和使用。
传统机械陀螺仪主要利用角动量守恒原理,即:对旋转的物体,它的转轴指向不会随着承载它的支架的旋转而变化。
MEMS陀螺仪主要利用科里奥利力(旋转物体在有径向运动时所受到的切向力)原理,公开的微机械陀螺仪均采用振动物体传感角速度的概念,利用振动来诱导和探测科里奥利力。
MEMS陀螺仪的核心是一个微加工机械单元,在设计上按照一个音叉机制共振运动,通过科里奥利力原理把角速率转换成一个特定感测结构的位移。
以一个单轴偏移(偏航,YAW)陀螺仪为例,通过图利探讨最简单的工作原理。
两个相同的质量块以方向相反的做水平震荡,如水平方向箭头所示。
当外部施加一个角速率,就会出现一个科氏力,力的方向垂直于质量运动方向,如垂直方向箭头所示。
产生的科氏力使感测质量发生位移,位移大小与所施加的角速率大小成正比。
因为感测器感测部分的动电极(转子)位于固定电极(定子)的侧边,上面的位移将会在定子和转子之间引起电容变化,因此,在陀螺仪输入部分施加的角速率被转化成一个专用电路可以检测的电子参数---电容量。
下图是一种MEMS陀螺仪的系统架构,,陀螺仪的讯号调节电路可以分为马达驱动和加速度计感测电路两个部分。
其中,马达驱动部分是透过静电引动方法,使驱动电路前后振动,为机械元件提供激励;而感测部分透过测量电容变化来测量科氏力在感测质量上产生的位移。
当然,MEMS陀螺仪还具有其它功能模块,比如自检功能电路,低功耗以及运动唤醒电路等等。
下面主要介绍MEMS陀螺仪的主要性能参数。
mems微机电系统名词解释

mems微机电系统名词解释MEMS(Micro-Electro-Mechanical Systems,微机电系统)是一种集成微型机械、电子与传感器功能于一身的微型设备。
它结合了传统的机械制造技术、半导体工艺和微纳米技术,将微型机械部件、传感器、电子电路以及微纳加工技术集成在一个晶圆上,以实现微型化、多功能化和集成化的目标。
以下是一些与MEMS相关的名词解释:1. 传感器(Sensor):一种能够感知并转换外部物理量、化学量或生物量的设备,可以将感应到的物理量转化为电信号。
2. 执行器(Actuator):一种能够接收电信号并将其转化为相应的机械运动的设备,用来实现对外界的控制或作用。
3. 微型机械(Micro-Mechanical):指尺寸在微米或纳米级别的机械部件,由微细加工技术制造而成,具有微小、精确和高效的特点。
4. 纳米技术(Nanotechnology):一种研究和应用物质在纳米尺度下的特性、制备和操作的技术,常用于MEMS器件的加工制造。
5. 惯性传感器(Inertial Sensor):一种基于测量物体运动状态和变化的MEMS传感器,如加速度计和陀螺仪。
6. 压力传感器(Pressure Sensor):一种可以测量气体或液体压力的MEMS传感器,常用于汽车、医疗、工业等领域。
7. 加速度计(Accelerometer):一种测量物体在空间中加速度的MEMS传感器,常用于移动设备、运动检测等应用。
8. 微镜(Micro-Mirror):一种利用MEMS技术制造的微型反射镜,通常用于显示、成像和光学通信等应用。
9. 微流体器件(Microfluidic Device):一种用于实现微小流体控制的MEMS器件,常用于生化分析、药物传递和微生物学研究等领域。
10. 无线传感器网络(Wireless Sensor Network):一种由多个分布式的MEMS传感器节点组成的网络系统,可以实现对环境信息的实时采集、处理和通信。
IEEE Std 2700-2014 MEMS

Abstract: A common framework for sensor performance specification terminology, units, conditions and limits is provided. Specifically, the accelerometer, magnetometer, gyrometer/gyroscope, barometer/pressure sensors, hygrometer/humidity sensors, temperature sensors, ambient light sensors, and proximity sensors are discussed. Keywords: ambient light, accelerometer, gyroscope, humidity, IEEE 2700™, magnetometer, MEMS, microelectromechanical proximity, sensors systems, pressure, temperature, terminology
IEEE Standard for Sensor Performance Parameter Definitions
SponsorMicro源自lectromechanical Systems Standards Development Committee
of the
IEEE Electron Devices Society
•
The Institute of Electrical and Electronics Engineers, Inc. 3 Park Avenue, New York, NY 10016-5997, USA Copyright © 2014 by The Institute of Electrical and Electronics Engineers, Inc. All rights reserved. Published 20 August 2014. Printed in the United States of America. IEEE is a registered trademark in the U.S. Patent & Trademark Office, owned by The Institute of Electrical and Electronics Engineers, Incorporated. PDF: Print: ISBN 978-0-7381-9252-9 ISBN 978-0-7381-9253-6 STD98747 STDPD98747
什么是3D MEMS?三维微电子机械系统

什么是3D MEMS?三维微电子机械系统
微机电(MEMS)技术在电子产品中的地位愈来愈重要,不论是在汽车、工业、医疗或军事上需要用到此类精密的元器件,在信息、通讯和消费性电
子等大众的市场,也可以看到快速增长的MEMS应用。
MEMS本质上是一种把微型机械组件(如传感器、制动器等)与电子电
路集成在同一颗芯片上的半导体技术。
一般芯片只是利用了硅半导体的电气
特性,而MEMS 则利用了芯片的电气和机械两种特性。
三维微电子机械系统(3D-MEMS),是将硅加工成三维结构,其封装和触点便于安装和装配,用这种技术制作的传感器具有极好的精度、极小的尺寸
和极低的功耗。
这种传感器仅由一小片硅就能制作出来,并能测量三个互相
垂直方向的加速度。
例如为承受强烈震动的加速度传感器和高分辨率的高度
计提供合适的机械阻尼。
这类传感器的功率消耗非常低,这使它们在电池驱
动设备中具有不可比拟的优越性。
在MEMS 传感器芯片内,三轴(X、Y、Z)上的运动或倾斜会引起活动。
测控技术与仪器专业英语unit

全句译为:然而,供应电压从5V衰减到3.3V甚至更低, 以及系统中多种电压形式的出现,并不只是对最智能的传 感器提出的考验。
Separate integrated circuits (ICs) are available to handle the variety of voltages and resolve the problem, but they add to system and sensor complexity. 译为:单独的集成电路(ICs)可用来处理各种不同的电压 并解决问题,但它们增加了系统和传感器的复杂性。
译为:该转换器将测量的物理量进行转换。观察员对系 统进行修正以使结果接近理想值。典型的测量系统的组成 框图如图3.1所示。
Figure 3.1 General sensing system
6
Unit3 Smart Sensors
Many home thermostats(恒温(调节)器), tire pressure gauges(轮胎气压表), and factory flow meters still operate in the same manner.
Unit3 Smart Sensors
1
Unit3 Smart Sensors
Introduction
Just about everything today in the technology area is a candidate(申请求职者,候选人;报考者)for having the prefix (前缀)smart added to it. The term smart sensor was coined in the mid-1980s, and since then several devices have been called smart sensors.
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4 Concrete examples of sensors improvements 3 Products development for harsh environment
Harsh environment requirements have initially been f ul fi ll ed Few con c rete examples will be discussed hereatler to illus tr ate the harsh e nvironment cap abil ity of standard Colibrys
mechanical products (i.e. quartz vibrating structures). Size, weight
specifications
Figure 1: North American market perspectives (2001 to 2008)
93
the e xpec te d business by automotive, is growing from 190 m io. sensors (ASP 7$) in 200 I to 640 m i o. sensors (ASP 4.5$) i n 2008. In term of n umbe r of sensors,
to
20'000g with minimum impac t on specification Very robust MEMS and +180°C MEMS sensors in harsh environment are a lr ead y supplied with high volume opportunities
few
and current limitations when u sing MEMS sensors in harsh conjunction of material a nd SiC or SOl), advanced tech nol ogies
examples
with
many
other
environments (temperature, shock, vi br ation, environment, security). The (stand ard Si, micromachining
l o oki n g
applications. When
carefully
at
the
technol o gy. Further on, they im pos e themselves in a growing number of applicati ons thanks to their ability to perform in very aggressive en vi r onments. "Harsh environment" is the recogni zed acronym to describe the markets and ap p lications that behave under extreme conditions in term of temperature, shock, vibration, at mos phere (ESD, radiati on, chemistry .. . ) securit y .
or
of this family of products.
பைடு நூலகம்
2 Harsh environment market characteristic
There is not one precision r equi red. Typical examples of a pp lic ations are: Down hole drilling where accelerometers must behave in
Organised by the Institution of Engineering and Technology Measurement, Sensors, Instrumentation & NDT and Microsystems and Nanotechnology Networks
""--
Nowadays, standard MEMS techno logi es give access to a broad range of unexpected ne w applications op port unities by always p ushing the pr oducts at their limits, mainly in term of environmental constraints. Great pote nti als
evolution, largel y driven
probabl y not applicable at the sensor l e vel and certain ly lar ge l y
related
to
se curit y
or
jam ming
prote ct i on
of
communication.
market implantation, it is very
interesting to see that benefits of this technology go well beyo nd the obvious size ad van tage. Size and weight but also performance, power consumption, parall el man ufacturing capab ility and cost or reliability are common arguments in favour
and advanced assem bl y technique s are the k ey to
p r ovid e robust sensors. Within a large portfoli o of examples, the fol lowing applicatio ns will be presented and developed in more details: Accelerometers surviving shock levels up
technologies. The figure
sensors
used between
-120°C
1
shows the North A meri can MEMS senso rs
market trend specific to harsh environment products.
a reality and
applications can be
classified in
the following
domains:
aerospace &
de fenc e, energy (oil
& gaz)
and industrial
t echni ques
markets. Automotive is certainly also a very demanding market for rob ust sensors. It is interestin g to see how standard MEMS accelerometers, that present i ntrinsic good harsh environme nt capabilities, have facilitated the emergence of these new applications, which were simply difficult to get to with standard
The obj ective of this presenta tion is to review actual results
accelerometers and gyro) m ust survive ext reme gun hard shock with a minimum im pa ct on specification or extreme shock monitoring for industrial or military applications (> lO'OOOg)... These
Standard MEM§ §(pJJl1l§(Q)Jr Technologie§ if(Q)Jr lliI<alJr§1hl EnviJron.m(pJJmlc
Jean-Michel Stauffer Colibrys, Switzerland
© The Institute of Engineering and Technology
have been
unique and
specific market that fit with harsh in difficult environments are
environments but many examples can be found where measurements
demonstrated and have engendered development alliance to i mprove the performances of the products in so called harsh en vironmen t s : Imagine the utilization of an acc eleromet er in
Printed and published by the Institution of Engineering and Technology, Michael Faraday House, Six Hills Way, Stevenage, Herts SG12AY, UK