PS9117参考手册

合集下载

中文版Photoshop7基础教程共59页文档

中文版Photoshop7基础教程共59页文档
中文版Photoshop7基础教程
11、战争满足了,或曾经满足过人的 好斗的 本能, 但它同 时还满 足了人 对掠夺 ,破坏 以及残 酷的纪 律和专 制力的 欲望。 ——查·埃利奥 特 12、不应把纪律仅仅看成教育的手段 。纪律 是教育 过程的 结果, 首先是 学生集 体表现 在一切 生活领 域—— 生产、 日常生 活、学 校、文 化等领 域中努 力的结 果。— —马卡 连柯(名 言网)
END
13、遵守纪律的风气的培养,只有领 导者本 身在这 方面以 身作则 才能收 到成效 。—— 马卡连 柯 14、劳动者的组织性、纪律性、坚毅 精神以 及同全 世界劳 动者的 团结一 致,是 取得最 后胜利 的保证 。—— 列宁 摘自名言网
15、机会是不守纪律的。——雨果
16、业余生活要有意义,不要越轨。——华盛顿 17、一个人即使已登上顶峰,也仍要自强不息。——罗素·贝克 18、最大的挑战和突破在于用人,而用人最大的突破在于信任人。——马云 19、自己活着,为读而生。——布尔沃

PhotoshopCS中文版11

PhotoshopCS中文版11

图层的功能是从Photoshop 3.0开始引入的,到了Photoshop CS,图层功能已经有 了相当的发展与完善。 在以前绘制合成效果图时,常常先将对象绘制在若干张玻璃纸上,然后再拼合, 以产生合成效果,这样制作的效果图调整起来十分方便。图层就好像一张玻璃纸, 但它的功能较玻璃纸则更为强大。它不仅可以保存图像信息,而且还可以通过运用 图层的合成模式、图层不透明度以及图层调整命令来调整图层中的对象,充分体现 了数字图像的特点。
9.3.6 多个图层的对齐与分布
可以将图层和选区对齐,也可以使两个或多个图层对齐。 (1)图层与选区的对齐。先用选择工具建立一个选区,在图层面板上选择要对齐和排列的 图层,然后选择“图层→与选区对齐”命令,在该项的子菜单中选择对齐方式: • • • • • • 顶边:图层最上端的像素与选区最上端对齐。 垂直居中:将图层的垂直中线与选区的垂直中线对齐。 底边:图层最下端的像素与选区最下端对齐。 左边:图层最左端的像素与选区最左端对齐。 水平居中:将图层的水平中线与选区的水平中线对齐。 右边:图层最右端的像素与选区最右端对齐。
9.2.3 创建调节层
调节层用来调节图层的色调和色彩。有了这一层调节图层,Photoshop将会对图像进行的色调 和色彩的设定单独存放在调节层中,对图像的修改不会破坏性地改变原始图像,当需要再一次修 改时,可以恢复原始图像,增大修改弹性。 (1)要创建调节层,首先打开一幅图像素材,如图9-11所示。 (2)单击“图层→新调整图层→色阶”命令,出现如图9-12所示的对话框。
9.2.5 创建背景层
背景层是打开时的原始图层,背景层上不能进行各种操作,要对背景层进行调整,必须先转化 为普通图层。 由背景层生成普通图层有两种方式: (1)双击图层面板上的背景层,设置好参数后,就可以将背景层转化成普通图层了。 (2)当图像没有背景层时,选择主窗体上的“图层→新建→图层背景”命令可以生成一个由 背景颜色填充的背景层。

photoshop7教案一)「转」

photoshop7教案一)「转」

photoshop7教案一)「转」photoshop 7 教案(一)「转」photoshop7独家教案【转滴】 Adoeb Photoshop7.0教案第一讲Photosop的基础知识一、Photosop是ADOBE公司推出的图形图像处理软件,功能强大,广泛应用于印刷、广告设计、封面制作、网页图像制作、照片编辑等领域。

利用Photosop可以对图像进行各种平面处理。

绘制简单的几何图形、给黑白图像上色、进行图像格式和颜色模式的转换。

二、Photosop7.0的启动与退出1、启动Photoshop的方法:单击开始/程序/Photoshop7.0即可启动.或者打开一个Photoshop文件也能够启动Photoshop. 2、退出Photoshop 的方法:单击关闭按钮或按下CTRL+Q组合键或ALT+F4组合键,都可以退出Photoshop。

三、Photoshop的窗口组成(标题栏、菜单栏、工具栏、工具箱、图像图口、控制面板、状态栏、Photoshop桌面) 1、标题栏:位于窗口最顶端。

2、菜单栏:其中包括9个菜单。

位于标题栏下方。

3、工具栏:位于菜单栏下方。

可以随着工具的改变而改变。

4、工具箱:位于工具栏的左下方。

5、图像窗口:位于工具栏的正下方。

用来显示图像的区域,用于编辑和修改图像。

6、控制面版:窗口右侧的小窗口称为控制面版。

用于改变图象的属性。

7、状态栏:位于窗口底部,提供一些当前操作的帮助信息。

8、Photoshop桌面:Photoshop窗口的灰色区域为桌面。

其中包括显示工具箱、控制面板和图像窗口。

四、图像窗口:图像窗口由(标题栏、图像显示区、控制窗口图标)1、标题栏:显示图像文件名、文件格式、显示比例大小、层名称以及颜色模式。

2、图像显示区:用于编辑图像和显示图像。

3、控制窗口图标:双击此图标可以关闭图像窗口。

单击此图标,可以打开一个菜单,选择其中的命令即可。

五、工具箱和工具栏 Photosop工具包含了40余种工具,单击图标即可选择工具或者按下工具的组合键。

photoshop基础教程(入门者使用)(免费)

photoshop基础教程(入门者使用)(免费)

Photosop的基本常识【1 】一.Photosop是ADOBE公司推出的图形图像处理软件,功效壮大,普遍应用于印刷.告白设计.封面制造.网页图像制造.照片编辑等范畴.利用Photosop可以对图像进行各类平面处理.绘制简略的几何图形.给诟谇图像上色.进行图像格局和色彩模式的转换.1.启动Photoshop的办法:单击开端/程序/Photoshop7.0即可启动.或者打开一个Photoshop文件也可以或许启动Photoshop.2.退出Photoshop的办法:单击封闭按钮或按下CTRL+Q组合键或ALT+F4组合键,都可以退出Photoshop.三.Photoshop的窗口构成(标题栏.菜单栏.对象栏.对象箱.图像图口.掌握面板.状况栏.Photoshop桌面)1.标题栏:位于窗口最顶端.2.菜单栏:个中包含9个菜单.位于标题栏下方.3.对象栏:位于菜单栏下方.可以跟着对象的转变而转变.4.对象箱:位于对象栏的左下方.5.图像窗口:位于对象栏的正下方.用来显示图像的区域,用于编辑和修改图像.6.掌握面版:窗口右侧的小窗口称为掌握面版.用于转变图象的属性.7.状况栏:位于窗口底部,供给一些当前操纵的帮忙信息.8.Photoshop桌面:Photoshop窗口的灰色区域为桌面.个中包含显示对象箱.掌握面板和图像窗口.四.图像窗口:图像窗口由(标题栏.图像显示区.掌握窗口图标)1.标题栏:显示图像文件名.文件格局.显示比例大小.层名称以及色彩模式.2.图像显示区:用于编辑图像和显示图像.3.掌握窗口图标:双击此图标可以封闭图像窗口.单击此图标,可以打开一个菜单,选择个中的敕令即可.五.对象箱和对象栏Photosop对象包含了40余种对象,单击图标即可选择对象或者按下对象的组合键.对象箱中并没有显示出全体的对象,只要仔细不雅察,会发明有些对象图标中有一个小三角的符号,这就暗示在该对象中还有与之相干的对象.打开这些对象的办法有两种:1.把鼠标指针移到含有三角的对象上,右击即可打开隐蔽的对象或者按鼠标左键不放在对象上开隐蔽稍等少焉也可打对象.然后选择对象即可.2.可以按下ALT键不放,再单击对象图标,多次单击可以在多个对象之间切换.六.掌握面板掌握面板可以完成各类图像处理操纵和对象参数设置,Photosop7.0中共供给了14个掌握面板.个中包含:导般器.信息.色彩.色板.图层.通道.路径.汗青记载.动作.对象预设.样式.字符.段落掌握面板和状况栏.1.导般器(Nanigator):用来显示图像上的缩略图,可用缩放显示比例,敏捷移动图像的显示内容.2.信息(Info):(F8)用于显示鼠标地位的坐标值.鼠标当前地位色彩的数值.当在图像中选择一块图像或者移动图像时,会显示出所先规模的大小.扭转角度的信息.3.色彩(Color):(F6)用来便于图形的填充.4.色板(Swatches):功效类似于色彩掌握面板.5.图层(Layers):(F7)用来掌握图层操纵.6.通道(Channels):用来记载图像的色彩数据和保管蒙板内容.7.路径(Paths):用来树立矢量式的图像路径.8.汗青记载(History):用来恢复图像或指定恢复霜一步操纵.9.动作(Actions):(F9)用来录制一边串的编辑操纵,以实现操纵主动化.10.对象预设(Tool Presets):(F5)用来设置画笔.文本等各类对象的预设参数.11.样式(Styles):用来给图形加一个样式.12.字符(Character):用来掌握文字的字符格局.13.段落(Paragraph):用来掌握文本的段落格局第二讲 Photoshop 基本操纵一.树立新图像单击File/New敕令或者按下CTRL+N组合键.也可以按住鼠标左键双击Photoshop桌面也可以新键图像.注:Preset Size(预设尺寸):1.Width(宽度).Height(高度)留意单位(cm厘米.mm毫米.pixels像素.inches英寸.point点.picas派卡和columns 列);2.Resolution(分辩率):留意分辩率的设置,分辩率越大,图像文件越大,图像越清楚,存储时占的硬盘空间越大,在网上传播的越慢.(pixels/cm像素/厘米,pixels/inch(像素/英寸)3.Mode(模式):RGB Color(RGB色彩模式).Bitmap(位图模式).Grayscale(灰度模式).CMYK Color(CMYK色彩模式).Lab Color(Lab颜色模式)4.Contents(文档布景)设定新文件的这些各项参数后,单击OK按钮或按下回车键,就可以树立一个新文件.二.保管图像1.选择文件菜单下的保管或者按CTRL+S组合键即可保管Photoshop的默认格局PSD.也就是Photoshop的默认格局.2.选择文件菜单下的保管为或者按SHIFT+CTRL+S可以保管为其它的格局文件.有:TIF.BMP.JPEG/JPG/JPE.G IF等格局.三.封闭图像1.双击图像窗口标题栏左侧的图标按钮.2.单击图像窗口标题栏右侧的封闭按钮.3.单击File/Close敕令.4.按下Ctrl+W或Ctrl+F4组合键.5.假如用户打开了多个图像窗口,并想把它们都封闭.可以单击Windows/Documents/Close All敕令.四.打开图像1.单击File/Open敕令或按Ctrl+O组合键,或者双击屏幕也可以打开图像.假如想打开多个文件,可以按下Shift键,可以选择持续的文件.如果按Ctrl键,可以选择不持续的多个文件.2.打开比来打开过的图像:在File/Open Recent敕令.就是说打开比来用过的图像.3.应用File/Browse窗口或按下Ctrl+Shift+O组合键打开图像.五.置入图像Photoshop是一个位图软件,用户可以将矢量图形软件制造的图像拔出到Photoshop中应用.(EPS.AI.PDF)等.选择须要置入的图像即可.置入进来的图像中消失了一个浮动的对象掌握符,双击即可撤消该符.六.切换屏幕显示模式个中包含了3种屏幕模式分别是:尺度屏幕模式.带有菜单栏的全屏模式和全屏模式.持续按F键即可以在这3种屏幕模式之间切换.TAB键可以显示隐蔽对象箱和各类掌握面板.SHIFT+TAB键可以显示隐蔽各类掌握面板.七.标尺和器量对象1.标尺:单击视图/标尺或按CTRL+R组合键即可显示隐蔽标尺.标尺的默认单位是厘米.2.器量对象:(I)用来测量图形随意率性两点的距离,也可以测量图形的角度.用户可以用信息面版来检讨成果.个中X.Y代表坐标;A代表角度;D代表长度;W.H代表图形的宽.高度.测量长度,直接在图形上拖动即可,按SHIFT键以程度.垂直或45度角的偏向操纵.测量角度,起首画出第一条测量线段,接着在条一条线段的终点处按ALT键拖出第二条测量的线段即可测量出角度.八.缩下班具:(Z)选择对象后,变成放大镜对象,按下ALT键可以变成缩小对象或者选择视图/放大或缩小.或按CTRL++.CTRL+-.CTRL+0全屏显示,CTRL+ALT+0现实大小第三讲根本概念包含色彩色彩.色彩模式.图像类型.图像格局.分辩率.1.亮度(Brightness):就是各类图像模式下的图形原色(如RGB图像的原色为R.G.B三种的)明暗度.亮度就是明暗度的调剂.例如:灰度模式,就是将白色到黑色间持续划分为256种色调,即由白到灰,再由灰到黑.在RGB模式中则代表各类原色的明暗度,即红.绿.蓝三原色的明暗度,例如:将红色加深就成为了深红色.2.色相(Hue):色相就是从物体反射或透过物体传播的色彩.也就是说,色相就是色彩色彩,对色相的调剂也就是在多种色彩之间的变更.在平日的应用中,色相是由色彩名称标识的.例如:光由红.橙.黄.绿.青.蓝.紫7色构成,每一种色彩代表一种色相.3.饱和度(Saturation):也可以称为彩度,是指色彩的强度或纯度.调剂饱和度也就是调剂图像彩度.将一个黑色图像下降饱和度为0时,就会变成一个灰色的图像;增长饱和度时就会增长其彩度.4.比较度(Contrast):就是指不合色彩之间的差别.比较度越大,两种色彩之间的反差就越大,反之比较度越小,两种色彩之间的反差就越小,色彩越邻近.例如:将一幅灰度的图像增长比较度后,会变得诟谇光鲜,当比较度增长到极限时,则变成了一幅诟谇两色的图像.反之,将图像比较度减到极限时,就成了灰度图像,看不出图像后果,只是一幅灰色的底图.5.色彩模式:RGB模式.CMYK模式.Bitmap(位图)模式.Grayscale(灰度)模式.Lab模式.HSB模式.Multichannel(多通道模式).Duotone(双色调)模式.lndexde Clolr(索引色)模式等(1).RGB模式RGB模式是Photoshop中最经常应用的一种色彩模式.不管是扫描输入的图像,照样绘制的图像,几乎都是以RGB 的模式存储的.这是因为在RGB模式下处理图像作较为便利,并且RGB的图像比CMYK图像文件要小得多,可以节俭内存和存储空间.在RGB模式下,用户还可以或许应用Photoshop中所有的敕令和滤镜.RGB模式:由红.绿.蓝3种原色组合而成,由这3种原色混杂产生出成千上万种色彩.在RGB模式下的图像是三通道图像,每一个像素由24位的数据暗示,个中RGB三种原色各应用了8位,每一种原色都可以表示出256种不合浓度的色调,所以三种原色混杂起来就可以生成1670万种色彩,也就是我们常说的真黑色.(2).CMYK模式CMYK模式是一种印刷的模式.它由分色印刷的4种色彩构成,在本质上与RGB模式没什么差别.但它们产生色彩的方法不合,RGB模式产生色彩的方法称为加色法,而CMYK模式产生色彩的方法称为减色法.例如显示器采取了RGB模式,这是因为显示器可以用电子光束轰击荧光屏上的磷质材料发出光明从而产生色彩,当没有光时为黑色,光线加到极限时为白色.假如我们采取了RGB色彩模式去打印一份作品,将不会产生色彩后果,因为打印油墨不会本身发光.因而只有采取一些可以或许接收特定的光波而靠反射其他光波产生色彩的油墨,也就是说当所有的油墨加在一起时是纯黑色,油墨削减时才开端消失色彩,当没有油墨时就成为了白色,如许就产生了色彩,所以这种生成色彩的方法就称为减色法.那么,CMYK模式是如何成长出来的呢?理论上,我们只要将生成CMYK模式中的三原色,即100%的洋红色(m agenta)和100%的黄色(yellow)组合在一路就可以生成黑色(black),但现实上等量的C.M.Y三原色混杂其实不克不及产生完美的黑色或灰色.是以,只有再加上一种黑色后,才会产生图像中的黑色和灰色.为了与RGB模式中的蓝色差别,黑色就以K字母暗示,如许就产生了CMYK模式.在C MYK模式下的图像是四通道图像,每一个像素由32位的数据暗示.在处理图像时,我们一般不采取CMYK模式,因为这种模式文件大,会占用更多的磁盘空间和内存.此外,在这种模式下,有很多滤镜都不克不及应用,所以编辑图像时有很多便利 ,因而平日都是在印刷时才转换成这种模式.(3).Bitmap(位图)模式Bitmap模式也称为位图模式,该模式只有黑色和白色两种色彩.它的每一个像素只包含1位数据,占用的磁盘空间起码.是以,在该模式下不克不及制造一般调丰硕的图像,只能制造一些诟谇两色的图像.当要将一幅彩图转换成诟谇图像时,必须转换成灰度模式的图像,然后再转换成只有诟谇两色的图像,即位图模式图像.(4).Grayscale(灰度)模式此模式的图像可以表示出丰硕的色调,表示出天然界物体的活泼形态和景不雅.但它始终是一幅诟谇的图像,就像我们平日看到的诟谇电视和诟谇照片一样.灰度模式中的像素是由8位的位分辩率来记载的,是以可以或许表示出256种色调.应用256种色调我们就可以使诟谇图像表示得相当完美.灰度模式的图像可以直接转换成诟谇图像和RGB的黑色图像,同样诟谇图像和黑色图像也可以直接转换成灰度图像.但须要留意的是,当一幅灰度图像转换成诟谇图像后再转换成灰度图像,将不再显示本来图像的后果.这是因为灰度图像转换成诟谇图像时,Photoshop会丧掉灰度图像中的色调,因而转换后丧掉的信息将不克不及恢复.同样道理,RGB图像转换成灰度图像也会丧掉所有的色彩信息,所以当由RGB图像转换成灰度图像,再转换成RGB的黑色图像时,显示出来的图像色彩将不具有黑色.(5).Lab模式Lab模式是一种较为生疏的色彩模式.它由3种分量来暗示色彩.此模式下的图像由三通道构成,每像素有24位的分辩率.平日情形下我们不会用到此模式,但应用Photoshop编辑图像时,事实上就已经应用了这种模式,因为Lab模式是photoshop内部的色彩模式.例如,要将RGB模式的图像转换成CMYK模式的图像,Photoshop会先将RGB模式转换成Lab模式,然后由Lab模式转换成CMYK模式,只不过这一操纵是在内部进行而已.是以Lab模式是今朝所有模式中包含色彩规模最普遍的模式,它能毫无误差地在不合体系和平台之间进行交流.L:代表亮度,规模在0——100.A:是由绿到红的光谱变更,规模在-120——120之间.B:是由蓝到黄的光谱变更,规模在-120——120之间.(6).HSB模式HSB模式是一种基于人的直觉的色彩模式,应用此模式可以很轻松天然地选择各类不合通亮度的色彩.在Photos hop中不直接支撑这种模式.而只能在Color掌握面板和Color Picker对话框中界说这种色彩.HSB模式描写的色彩有3个根本特点.H:色相(Hue),用于调剂色彩,规模0度——360度.S:饱和度,即彩度,规模0%——100%,0%时为灰色,100%时为纯色.B:亮度,色彩的相对明暗程序,规模0%——100%s (7).Multichannel(多通道)模式Multichannel(多通道)模式在每个通道中应用256灰度级.多通道图像对特别的打印异常有效,例如,转换双色调(Duotone)用于以ScitexCT格局打印.可以按照以下的准则将图像转换成多通道模式:a.将一个以上通道合成的任何图像转换为多通道模式图像,原有通道将被转换为专色通道.b.将黑色图像转换为多通道时,新的灰度信息基于每个通道中像素的色彩值.c.将CMYK图像转换为多通道可创建青(cyan).洋红(magenta).黄(yellow)和黑(black)专色通道.d.将RGB图像转换为多通道可创建青(cyan).洋红(magenta)和黄(yellow)专色通道.e.从RGB.CMYK.或Lab图像中删除一个通道会主动将图像转换为多通道模式.(8).Duotone(双色调)模式Duotone(双色调)是用两种油墨打印的灰度图像:黑色油墨用于暗调部分,灰色油墨用于中央折衷高光部分.但是,在现实进程中,更多地应用黑色油墨打印图像的高光色彩部分,因为双色调应用不合的黑色油墨重现不合的灰阶.要将其他模式的图像转换成双色调模式的图像,必须先转换成灰度模式才干转换成双色调模式.转换时,我们可以选择单色版.双色版.三色版和四色版,并选择各个色版的色彩.但要留意在双色调模式中色彩只是用来暗示“色调”罢了,所以在这种模式下黑色油墨只是用来创建灰度级的,不是创建黑色的.当油墨色彩不应时,其创建的灰度级也是不合的.平日选择色彩时,都邑保存原有的灰色部分作为主色,其他参加的色彩为副色,如许才干表示较丰硕的层次感和质感.(9).Indexed Color(索引色)模式索引色模式在印刷中很少应用,但在制造多媒体或网页上却十分实用.因为这种模式的图像比RGB模式的图像小得多,精确只有RGB模式的1/3,所以可以大大削减文件所占的磁盘空间.当一个图像转换成索引色模式后,就会激活Image/Mode/Color Table敕令,以便编辑图像的“颜色表”.RGB和CMYK模式的图像可以表示出完全的各类色彩使图像完美无缺,而索引色模式则不克不及完美地表示一般彩丰硕的图像,因为它只能表现256种色彩,是以会有图像掉真的现象,这是索引色模式的缺少之处.索引色模式是依据图像中的像素统计色彩的,然后将统计后的色彩界说成一个“色彩表”.因为它只能表示256色彩,所以在转换后只选出256种应用最多的色彩放在色彩表中,色彩表以外的色彩程序会拔取已有颜色中最邻近的色彩或应用已有色彩模仿该种色彩.是以,索引色模式的图像在256色16位黑色的显示屏幕下所表示出来的后果并没有很大差别.6.图像格局:(1).BMP(*.BMP;*.RLE)BMP(Windows Bitmap)图像文件最早应用于微软公司推出的Microsoft Windows体系,是一种Windows尺度的位图式图形文件格局,它支撑RGB.索引色彩.灰度和位图色彩色彩模式,但不支撑Alpha通道.(2).TIFF(*.TIF)TIFF的英文全名是Tagged Image File Format(标识表记标帜图像文件格局).此格局便于在应用程序之间和盘算机平台之间进行图像数据交流.因此,TIFF格局应用异常普遍,可以在很多图像软件和平台之间转换,是一种灵巧的位图图像格局.TIFF格局支撑R b.IndexedColor.位图模式和灰度的色彩模式,并且在RGB.CMYK和灰度3种色彩模式中还支撑应用通道(Channels).图层(Layers)和路径(Paths)的功效,只要在Save As对话框中选中Layers.Alpha Channels.Spot Colors复选框即可.(3).PSD(*.PSD)PSD格局是应用AdobePhotoshop软件生成的图像模式,这种模式支撑Photoshop中所有的图层.通道.参考线.注释和色彩模式的格局.在保管图像时,若图像中包含有层,则一般都用Photoshop(PDS)格局保管.若要将具有图层的PSD格局图像保管成其他格局的图像,则在保管时会归并图层,即保管后的图像将不具有任何图层.PSD格局在保管时会将文件紧缩以削减占用磁盘空间,但因为PSD格局所包含图像数据信息较多(如图层.通道.剪辑路径.参考线等),因此比其他格局的图像文件要大得多.但因为PSD文件保存所有原图像数据信息(如图层),因而修改起来较为便利,这是PSD格局的优胜之处.(4). PCX(*.PCX)PCX图像格局最早是Zsoft公司的PCPaintBrush(画笔)图形软件所有支撑的图像格局.PCX格局与BMP格局一样支撑1-24位的图像,并可以用RLE的紧缩方法保管文件.PCX格局还可以支撑RGB.索引色彩.灰度和位图的色彩模式,但不担不支撑Alpha通道.(5)JPEG(*.JPE;*.JPG)JPEG的英文全称是Joint photographic Experts Group(结合图像专家组).此格局的图像通经常应用于图像预览和一些超文本文档中(HTML文方法丧掉落一些数据,因而保管后的图像与原图有所不同,没有原图像的质量好.因些印刷品最好不要用此图像格局.(6).EPS(*.EPS)辨率预览,将拔出的文件进行编辑排版,而在打印或出胶片时则以高分辩率输出,做到工作效力与图像输出质量两不误.DPS支撑Photoshop中所有的色彩模式,但不支撑Alpha通道,个中在位图模式下还可以搀扶透明.(7).GIF(*.GIF)GIF格局是CompuServe供给的一种图形格局,在通讯传输时较为经济.它也可应用LZW紧缩方法将文件紧缩方法将文件紧缩而不会太占磁盘空间,是以也是一种经由紧缩的格局.这种格局可以支撑位图.灰度和索引色彩的色彩模式.GIF格局还可以普遍应用于因特网的HTML网页文档中,但它只能支撑8位(256色)的图像文件.(8).PNG(*.PNG)PNG格局是由Netscape公司开辟出来的格局,可以用于收集图像,但它不合于GIF格局图像只能保管256色(8位),PNG格局可以保管24位(1670万色)的真黑色图像,并且支撑透明布景和清除锯齿边沿的功效,可以在不掉真的情形下紧缩保管图像.但因为PNG格局不完全支撑所有济览器,且所保管的文件也较大而影响下载速度,所以在网页中应用要比GIF格局少得多.但信任跟着收集的成长和因特网传输速度的改良,PNG格局将是将来网页中应用的一种尺度图像格局.PNG格局文件在RGB和灰度模式下支撑Alpha通道,但在索引色彩和位图模式下不支撑Alpha通道.(9).PDF(*.PDF)PDF(Portable Document Format可移植文档格局)格局是Adobe公司开辟的用于Windows.Mac OS.UNIX(R)和DOS体系的一种电子出版软件的文档格局.它以PostScript Level 2说话为基本,是以可以笼罩矢量式图像和点阵式图像,并且支撑超等链接.PDF文件是由Adobe Acrobat软件生成的文件格局,该格局文件可以存有多页信息,个中包含图形.文档的查找和导航功效.是以,应用该软件不须要排版或图像软件即可获得图文混排的版面.因为该格局支撑超文本链接,是以是收集下载经常应用的文件.PDF格局支撑RGB.索引色彩.CMYK.灰度.位图和Lab色彩模式,并且支撑通道.图层等数据信息.PDF格局还支撑JPEG和ZIP的紧缩格局(位图色彩模式不支撑ZIP紧缩格局保管).7.分辩率分辩率是指在单位长度内所含有的点(即像素)的若干.平日我们会将分辩率混杂,以为分辩率就是指图像分辩率,其实分辩率有很多种,可以分为以下几种类型.(1)图像分辩率图像分辩率就是每英寸图像含有若干个点或像素,分辩率的单位为点/英寸(英文缩写为dpi),例如300dpi就暗示该图像每英寸含有300个点或像素.在Photoshop中也可以用cm(厘米)为单位来盘算分辩率.图像分辩率的默认单位是dpi.在数字化图像中,分辩率的大小直接影响图像的品德.分辩率越高,图像越清楚,所产生的文件也就越大,在工作中所需的内存和CPU处理时光也就越多.所以在制造图像时,不合品德的图像就需设置恰当的分辩率,才干最经济有效地制造出作品,例如用于打印输出的图像的分辩率就须要高一些,假如只是在屏幕上显示的作品(如多媒体图像或网页图像),就可以低一些.别的,图像的尺寸大小.图像的分辩率和图像文件大小3者之间有着很亲密的关系.一个分辩率雷同的图像,假如尺寸不合,它的文件大小也不合,尺寸越大所保管的文件也就越大.同样,增长一个图像的分辩率,也会使图像文件变大.(2)装备分辩率装备分辩率是指每单位输出长度所代表的点数和像素.它与图像分辩率有着不合之处,图像分辩率可以更改,而装备分辩率则不成以更改.如日常平凡罕有的盘算机显示器.扫描仪和数字拍照机这些装备,各自都有一个固定的分辩率.(3)屏幕分辩率屏幕分辩率又称为屏幕频率,是指打印灰度级图像或分色所用的网屏上每英寸的点数,它是用每英寸上有若干行来测量的.(4)位分辩率位(bits)分辩率也称位深,用来权衡每个像素存储的信息位数.这个分辩率决议在图像的每个像素中存放若干色彩信息.如一个24位的RGB图像,即暗示其各原色R.G.B均值,是以每一个像素所存储的位数即为24位.(5)输出分辩率输出分辩率是指激光打印机等输出装备在输出图像的每英寸上所产生的点数.8.图像类型在盘算机中,图像是以数字方法来记载.处理和保管的,所以图像也可以说是数字化图像.图像类型大一致可以分为以下两种:矢量式图像与位图式图像.这两种类型的图像各有特点,也各有优缺点,两者各自的长处正好可以填补对方的缺点.是以在画图与图像处理的进程中,往往需将这两种类型的图像交叉应用,才干取长补短,应用户的作品更为完美.(1)矢量式图像矢量式图像以数学描写的方法来记载图像内容.它的内容以线条和色块为主,例如一条线段的数据只须要记载两个端点的坐标.线段的粗细和色彩等.是以它的文件所占的容量较小,也可以很轻易地进行放大.缩小或扭转等操纵,并且不会掉真,可用以制造3D图像.但这种图像有一个缺点,即不轻易制造色调丰硕或色彩变更太多的图像,并且绘制出来的图形不是很传神,无法像照片一样精确地描写天然界的景不雅,同时也不轻易在不合的软件间交流文件.制造矢量式图像的软件有FreeHand .Illustrator. CorelDRAW .AutoCAD等.美工插图与工程画图多半在矢量式软件长进行.(2)位图式图像。

非常齐全用于IGBT驱动和IPM Drivers的光耦型号推荐

非常齐全用于IGBT驱动和IPM Drivers的光耦型号推荐

非常齐全用于IGBT驱动和IPM Drivers的光耦型号推荐IC输出高速1Mbps器件有:PS9613 PS8501 PS8502 PS9513 8-pin DIP封装PS8101、PS9113 PS9213(蠕动5.5mm) 5-pin SOP (SO-5) 封装PS8802-1/-2 PS8821-1/-2 8-pin Small SOP(SO-8) 封装超高速10Mbps器件有:PS9617 PS9587 8-pin DIP封装PS9115、PS9117A、PS9121、PS9214(蠕动5.5mm) 5-pin SOP(SO-5) 封装PS9817A-1/-2 PS9821-1/-2 8-pin Small SOP(SO-8) 封装超高速15Mbps (CMOS)器件有:PS9151 5-pin SOP(SO-5) 封装PS9851-1/-2 8-pin Small SOP(SO-8) 封装隔离放大器类模拟输出器件有:PS8551 8-pin DIP封装隔离放大器类数码输出器件有:PS9551 8-pin DIP封装B、晶体管输出通用型单级器件有:PS2501series PS2501Aseries PS2513 series PS2561 series 4-pin DIP封装PS2561Aseries PS2561Bseries PS2581 series PS2581Aseries 4-pin DIP封装PS270x series PS2701A series PS2761B series SOP封装PS2801 series PS2801C series PS2841 series PS2861 series Small SOP封装PS291x series 超小型扁平引脚封装通用型达林顿器件有:PS25x2 series 4-pin DIP封装PS2702-1 SOP封装PS2802-1/-4 Small SOP封装AC输入单级器件有:PS25x5 series 4-pin DIP封装PS2705A-1 SOP封装PS28x5 series PS2805C series Small SOP封装PS2915-1 超小型扁平引脚封装AC输入达林顿器件有:PS25x6 series 4-pin DIP封装低电流驱动器件有:PS2503 series 4-pin DIP封装PS271x series SOP封装PS281x series Small SOP封装PS291x series 超小型扁平引脚封装高集电极耐压器件有:PS253x series 4-pin DIP封装PS2733-1 SOP封装PS283x series Small SOP 封装PS2933-1 超小型扁平引脚高集电极耐压DC输入器件有:PS2521 series 4-pin DIP封装高集电极耐压AC输入器件有:PS2525 series 4-pin DIP封装C、电机驱动电机驱动用(变频器用)器件有:PS9613 PS9513 8-pin DIP封装PS9113 PS9213(蠕动5.5mm) 5-pin SOP(SO-5) 封装IGBT驱动用器件有:PS9552 8-pin DIP封装2、东芝A、光电耦合器 (晶体管输出)用于For Switching Supplies and DC/DC Converters的型号有:TLP281、TLP283 SOP4封装TLP181 MFSOP6封装TLP421、TLP421F、TLP781、TLP781F DIP4封装用于For Home Appliances (HAs)的型号有:TLP280 SOP4封装TLP180 MFSOP6封装TLP620、TLP620F DIP4封装用于For Programmable Logic Controllers (PLCs)的型号有:TLP280-4、TLP281-4、TLP283-4 SOP16封装用于For Telecommunications的型号有:TLP320、TLP628、TLP629 DIP4封装TLP330 DIP6封装用于Low Input Type的型号有:TLP124、TLP126、TLP137 MFSOP6封装TLP624、TLP626 DIP4封装TLP331、TLP332 DIP6封装用于1-Channel Type的型号有:TLP130、TLP131 MFSOP6封装TLP521-1、TLP621、TLP621F DIP4封装TLP531、TLP532、TLP630、TLP631、TLP632、TLP731 DIP6封装TLP732、TLP733、TLP733F、TLP734、TLP734F DIP6封装用于2-Channel Type的型号有:TLP504A、TLP521-2、TLP621-2、TLP624-2、TLP628-2、TLP629-2 DIP8封装用于2-Channel Type with AC Input的型号有:TLP320-2、TLP620-2、TLP626-2 DIP8封装用于4-Channel Type的型号有:TLP521-4、TLP621-4、TLP624-4、TLP628-4、TLP629-4 DIP16封装用于4-Channel Type with AC Input的型号有:TLP320-4、TLP620-4、TLP626-4 DIP16封装B、光电耦合器(达林顿晶体管输出)用于General-purpose的型号有:TLP570、TLP571、TLP572 DIP6封装TLP523 DIP4封装用于High V CEO的型号有:TLP127 MFSOP6封装TLP371、TLP372、TLP373 DIP6封装TLP627、TLP627A DIP4封装用于2-Channel Type的型号有:TLP523-2、TLP627-2 DIP8封装用于4-Channel Type的型号有:TLP523-4、TLP627-4 DIP16封装C、光电耦合器(三端双向可控硅输出)用于Multi-channel Type的型号有:TLP525G DIP4封装TLP525G-2 DIP8封装TLP525G-4 DIP16封装D、光电耦合器(IC输出)用于For IPM Drivers的型号有:TLP102 MFSOP6封装TLP559(IGM) DIP8封装用于For IGBT/MOSFET/Giant Transistor Gate Drive的型号有:TLP700、TLP701、TLP701F、TLP702、TLP702F SDIP6封装TLP705、TLP705F、TLP706、TLP706F SDIP6封装TLP250、TLP250F、TLP250(INV)、TLP250F(INV)、TLP251 DIP8封装TLP251F、TLP350、TLP350F、TLP351、TLP351F、TLP557 DIP8封装用于1-Channel Type的型号有:TLP112、TLP112A、TLP113、TLP114A、TLP115、TLP115A MFSOP6封装TLP716、TLP716F、TLP719、TLP719F SDIP6封装TLP512、TLP513 DIP6封装TLP550、TLP551、TLP552、TLP553、TLP554、TLP555 DIP8封装TLP558、TLP559、TLP651、TLP750、TLP750F、TLP751 DIP8封装TLP751F、TLP759、TLP759F、TLP2200、TLP2601 DIP8封装用于2-Channel Type的型号有:TLP2530、TLP2531、TLP2630、TLP2631 DIP8封装用于JEDEC Type的型号有:6N135、6N136、6N137、6N138、6N139 JEDEC封装。

西门子PS7用户说明1

西门子PS7用户说明1

sSIMATICModifying the System during Operation via CiRManualEdition 03/2006A5E00744781-01Safety GuidelinesThis manual contains notices you have to observe in order to ensure your personal safety, as well as toprevent damage to property. The notices referring to your personal safety are highlighted in the manualby a safety alert symbol, notices referring to property damage only have no safety alert symbol. Thenotices shown below are graded according to the degree of danger.Dangerindicates that death or severe personal injury will result if proper precautions are not taken.Warningindicates that death or severe personal injury may result if proper precautions are not taken.Cautionwith a safety alert symbol indicates that minor personal injury can result if proper precautions are nottaken.Cautionwithout a safety alert symbol indicates that property damage can result if proper precautions are nottaken.Noticeindicates that an unintended result or situation can occur if the corresponding notice is not taken intoaccount.If more than one degree of danger is present, the warning notice representing the highest degree ofdanger will be used. A notice warning of injury to persons with a safety alert symbol may also include awarning relating to property damage.Qualified PersonnelThe device/system may only be set up and used in conjunction with this documentation. Commissioningand operation of a device/system may only be performed by qualified personnel. Within the context ofthe safety notices in this documentation qualified persons are defined as persons who are authorized tocommission, ground and label devices, systems and circuits in accordance with established safetypractices and standards.Prescribed UsageNote the following:WarningThis device and its components may only be used for the applications described in the catalog or thetechnical description, and only in connection with devices or components from other manufacturerswhich have been approved or recommended by Siemens.Correct, reliable operation of the product requires proper transport, storage, positioning and assemblyas well as careful operation and maintenance.TrademarksAll names identified by ® are registered trademarks of the Siemens AG.The remaining trademarks in this publication may be trademarks whose use by third parties for theirown purposes could violate the rights of the owner.Disclaimer of LiabilityWe have reviewed the contents of this publication to ensure consistency with the hardware andsoftware described. Since variance cannot be precluded entirely, we cannot guarantee full consistency.However, the information in this publication is reviewed regularly and any necessary corrections areincluded in subsequent editions.Siemens AG Automation and Drives Postfach 484890437 NÜRNBERG GERMANY A5E00744781-0103/2006Copyright © Siemens AG 2006Technical data subject to changePrefacePurpose of the ManualThis manual gives you a complete overview about modifications to plants during anoperation via CiR. It conveys the required background knowledge as well as theoperating procedure in HW Config.It is intended for persons working in the configuration, commissioning andautomation system service field.Basic Knowledge RequiredIn order to understand this manual, general knowledge of automation technology isrequired.Prequisite is experience in using S7-400 systems connected to a PROFIBUS-DPI/O.Since Modifying the System During Operation via CiR is based on the STEP 7software, you should also know how to operate it, especially HW Config. This isprovided in the manual "Programming with STEP 7 V5.4".Scope of the ManualThis manual is valid for release 5.4 of the STEP 7 programming software package.The hardware requirements are described in chapter 1 "Requirements andOverview"You can find the latest information on the service packs:• in the "readme.wri" file• in the updated STEP 7 online help.The topic "What's new?" in the online help offers an excellent introduction andoverview of the newest STEP 7 innovations.Modifying the System during Operation via CiRPrefaceModifying the System during Operation via CiRSTEP 7 Documentation PackagesThis manual is part of the documentation package "STEP 7 Basic Information.“ The following table displays an overview of the STEP 7 documentation:Documentation Purpose Order Number STEP 7 Basic Information with • Working with STEP 7,Getting Started Manual • Programming with STEP 7 •Configuring Hardware and Communication Connections, STEP 7• From S5 to S7, Converter Manual Basic information for technical personnel describing the methods of implementing control tasks with STEP 7 and the S7-300/400 programmable controllers.6ES7810-4CA08-8BW0STEP 7 Reference with•Ladder Logic (LAD)/Function Block Diagram (FBD)/Statement List (STL) for S7-300/400 manuals•Standard and System Functions for S7-300/400Volume 1 and Volume 2Provides reference information and describes the programming languages LAD, FBD, and STL, and standard and systemfunctions extending the scope of the STEP 7 basic information.6ES7810-4CA08-8BW1Online Helps PurposeOrder NumberHelp on STEP 7Basic information on programming and configuring hardware with STEP 7 in the form of an online help.Part of the STEP 7 Standard software. Reference helps on STL/LAD/FBD Reference help on SFBs/SFCsReference help on Organization BlocksContext-sensitive reference information.Part of the STEP 7 Standard software.PrefaceOnline HelpThe manual is complemented by an online help which is integrated in the software.This online help is intended to provide you with detailed support when using thesoftware.The help system is integrated in the software via a number of interfaces:• There are several menu commands which you can select in the Help menu: The Contents command opens the index for the Help on STEP 7.• Using Help provides detailed instructions on using the online help.• The context-sensitive help offers information on the current context, forexample, an open dialog box or an active window. You can open the context-sensitive help by clicking the "Help" button or by pressing F1.• The status bar offers another form of context-sensitive help. It displays a short explanation for each menu command when the mouse pointer is positioned onthe menu command.• A brief explanation is also displayed for each icon in the toolbar when the mouse pointer is positioned on the icon for a short time.If you prefer to read the information from the online help in printed format, you canprint out individual help topics, books, or the entire online help.This manual, as well as the manual "Programming with STEP 7" is an extract fromthe HTML-based Help on STEP 7. For detailed procedures please refer to theSTEP 7 help. As the manuals and the online help share an almost identicalstructure, it is easy to switch between the manuals and the online help.You can find the electronic manuals after installing STEP 7 via the Windows Startmenu: Start > SIMATIC > Documentation.Further SupportIf you have any technical questions, please get in touch with your Siemensrepresentative or responsible agent.You will find your contact person at:You will find a guide to the technical documentation offered for the individualSIMATIC Products and Systems here at:The online catalog and order system is found under:Training CentersSiemens offers a number of training courses to familiarize you with theSIMATIC S7 automation system. Please contact your regional training center orour central training center in D 90327 Nuremberg, Germany for details:Telephone: +49 (911) 895-3200.Internet:Modifying the System during Operation via CiRPrefaceTechnical SupportYou can reach the Technical Support for all A&D products•• Phone: + 49 180 5050 222• Fax: + 49 180 5050 223Service & Support on the InternetIn addition to our documentation, we offer our Know-how online on the internet at:where you will find the following:• The newsletter, which constantly provides you with up-to-date information on your products.• The right documents via our Search function in Service & Support.• A forum, where users and experts from all over the world exchange their experiences.• Your local representative for Automation & Drives.• Information on field service, repairs, spare parts and more under "Services".Modifying the System during Operation via CiRContents1Requirements and Overview.........................................................................................1-1 2CiR Objects and CiR Modules......................................................................................2-12.1Basics...............................................................................................................2-12.2Types of CiR Elements.....................................................................................2-22.3CiR Elements and I/O Address Areas..............................................................2-3 3User Interface.................................................................................................................3-13.1Basic Procedures in STOP Mode.....................................................................3-13.1.1Overview...........................................................................................................3-13.1.2Defining CiR Elements......................................................................................3-33.1.3Deleting CiR Elements......................................................................................3-63.2Basic Procedure in RUN Mode.........................................................................3-73.2.1Overview...........................................................................................................3-73.2.2Using CiR Elements in RUN Mode.................................................................3-103.2.3Undoing Previous Changes............................................................................3-14 4Reconfiguration of Existing Modules in ET 200M/ET 200iSP Stations.....................4-14.1Requirements for Reconfiguration....................................................................4-14.2CPU Response During a Reconfiguration........................................................4-24.3Reconfiguration Procedure...............................................................................4-44.3.1Using a Previously Unused Channel................................................................4-44.3.2Reconfiguring a Previously Used Channel.......................................................4-44.3.3Removing A Previously Used Channel.............................................................4-6 5Notes on Reconfiguration in RUN Mode Depending on the I/O................................5-15.1DP or PA-Slaves...............................................................................................5-15.2Modules in ET 200M Modular Slaves...............................................................5-55.3Modules in ET 200iSP Modular Slaves............................................................5-6 6How a Reconfiguration in RUN Mode Affects the Process........................................6-16.1CPU Response to Configuration Downloads in RUN Mode.............................6-16.2Effects on Operating System Functions During theCiR Synchronization Time................................................................................6-6 A Appendix.........................................................................................................................A-1A.1Compatibility.....................................................................................................A-1A.2Terminology......................................................................................................A-2 Glossary.......................................................................................................................Glossary-1 Index ..................................................................................................................................Index-1Modifying the System during Operation via CiRContentsModifying the System during Operation via CiROverviewand1 RequirementsIntroductionSome plants may not be switched off when they are in operation. This may be due toa complex automation processes or high restart costs, for example. A removalreconfiguration might still be required.Hot change via CiR lets you perform certain modifications of your configuration inRUN mode. This operation will interrupt processing for a small period of time. Theupper limit for this time period is preset at a default value of 1 second, but you canchange this value if necessary. During this interrupt, the hardware outputs will retaintheir last value.NoteThe term "CiR" stands for "Configuration in RUN". In this documentation it is used todescribe a method used for changing the system configuration in RUN mode.Prerequisite for this operation are the conditions listed below.Modifying the System during Operation via CiRRequirements and OverviewModifying the System during Operation via CiRRange of ValidityYou can change the configuration of a system which contains distributed I/O during runtime. The configuration shown in the figure below is prerequisite for suchprocesses. In order to provide a clear view of the procedure, we shall base our topics only on a single DP master system and a single PA master system. This restriction does not apply to the real process.MPI/DP interface for a CPU 41x or DP interface for a CPU 41x-2 or Interface module IF 964-DP orexternal DP interface module CP 443-5 ext.DP MasterPROFIBUS: DP Master SystemModular DP Slave ET 200M,ET 200S or ET 200iSCompact DP SlaveIM 157 +DP/PA-Coupler DP/PA LinkSUBNET: PA Master SystemPA Slave(Field device)PA Slave()Field deviceRequirements and OverviewHardware RequirementsYou require the following hardware configuration in order to be able to modify theconfiguration of a system in RUN mode via CiR:•Implementation of an S7-400 standard-CPU (CPU 412, CPU 414, CPU 416 or CPU 417) as of Firmware V3.1.0 or an S7-400-H CPU (CPU 414-4H orCPU 417-4H) in stand-alone mode as of Firmware V3.1.0•If you want to make modifications to the system during operation with an external DP master (CP 443-5 extended), your configuration must operate at least withFirmware V5.0.•If you want to add modules to ET 200M: Implementation of an IM 153-2 as of MLFB 6ES7 153-2BA00-0XB0 or IM 153-2FO as ofMLFB 6ES7 153-2BB00-0XB0. You must furthermore install the ET 200M withactive bus elements and provide sufficient space for the planned expansion. Youmay not implement the ET 200M as DPV0 slave (via GSD file).•If you want to add electronic modules for the ET 200iSP, install the ET 200iSP with reserve modules. The reserve modules can then be replace with electronicmodules in the future.•If you want to add complete stations: Provide corresponding bus connectors, repeaters etc.•If you want to add PA slaves (Field devices): Implementation of IM 157 as of MLFB 6ES7 157-0AA82-0XA00 in the corresponding DP/PA-Link.•Rack CR2 may not be used.•The use of one or more of the following modules is not allowed in a station in which you want to make modifications to the system during operation via CiR:CP 444, IM 467.• No multicomputingNoteYou can combine any components which are either capable or not capable ofsystem modification via CiR during runtime. However, you can change systemsettings only for components which are capable of CiR.Requirements and OverviewConfiguration RequirementsConstant bus cycle time must not be activated in DP master systems, in which youwant to execute modifications in RUN via CiR.If you want to add PA slaves (field devices), you have to operate the DP master inDPV1 mode. The IM 157 may not be used as DPV0 slave in this case.You have to select storage on the CPU for all modules within the station, regardlessof whether or not you are given the option of saving the configuration data on themodule itself or on the CPU.Software RequirementsTo enable CiR, the user program must meet the following requirements: Theprogram may not include elements that switch the CPU into STOP mode in theevent, for example, of a station failure or module error.The following OBs have to be on your CPU:•Hardware interrupt OBs (OB 40 to OB 47)•Timeout OB (OB 80)•Diagnostics interrupt OB (OB 82)•Removal/Insertion OB (OB 83)•Program runtime error OB (OB 85)•Module rack error OB (OB 86)•I/O access error OB (OB 122)NotePCS7 always meets these requirements.Overview of Permitted Configuration ChangesThe process introduced here supports the following modifications of your PLC:•Adding modules with modular ET 200M DP slave, provided you have not implemented it as DPV0 slave (via GSD file)•Reconfiguration of ET 200M modules, e.g. selection of other interrupt limits or the utilization of previously unused channels•Replacement of reserve modules with future electronic modules of the ET 200iSP•Reconfiguration of ET 200iSP modules•Adding DP slaves to an existing DP master system•Adding PA slaves (field devices) to an existing PA master system•Adding DP/PA couplers downstream of IM 157•Adding DP/PA links (including PA master systems) to an existing DP master systemRequirements and Overview•Assignment of expansion modules to a process image partition•Assignment of existing modules or compact slaves to process image partitions•Modifying the assignment of the process image partition for existing modules or compact slaves•Assigning new parameters to the modules installed in ET 200M stations(standard modules and fault-tolerant signal modules in standard operation).•Undoing changes: Added modules, interfaces, DP slaves and PA slaves (Field devices) can be removed again.NoteYou can only add or remove slaves / modules, or modify existing assignments in aprocess image partition for a maximum of four DP master systems.All system changes in RUN mode other than explicitly permitted (see above) are notallowed and will not be treated further in this documentation. Such actions are, forexample,•Modification of CPU properties•Modification of the properties of modules inserted in the CPU rack•Adding and removing DP master systems•Modification of the properties of existing DP master systems, including bus parameters.•Reconfiguration of fail-safe signal modules in safety mode.•Modification of the following DP slave parameters: Bus address, assignment to the DP master, parameter assignment data, diagnostics address•The removal of any modules from a modular DP slave, see Undo Changes.•The removal of any DP slaves from an existing DP master system, compare Undo Changes.•Reconfiguration of an I slave interface.•Changing the sync/freeze group assignment of a slaveRecommendations for changing systems in RUN mode by means of CiR Here are some tips for changing the system configuration in RUN mode.•After changing your settings, be sure to make a backup copy of your current system configuration. This is the only way to guarantee further editing of theproject without losing CiR functionality.•When ever possible, carry out your re-configuration in several steps, and make only a few changes during each step. This method will help you keep a clearoverview of the situation.•To keep the CiR synchronization time (see CPU Response to Configuration Downloads in RUN Mode) as short as possible, we recommend that you makechanges on only one DP master system during each re-configuration step.Requirements and Overview2 CiR Objects and CiR Modules2.1 BasicsOverviewA system modification during runtime is based on the provisions you have made inyour initial configuration for an expansion of your PLC hardware. Define suitable CiRcompatible elements that you can later replace step-by-step in RUN mode with realobjects (slaves and/or modules). You can then download such a modifiedconfiguration to the CPU during runtime.ProcedureThe table below shows the procedures required for modification of the program andof the configuration, as well as the corresponding system phase.Step Action CPU mode System status1 Configuration of your current (real) systemconfiguration STOP Offlineconfiguration2 Defining CiR elements STOP Offlineconfiguration3 Configurationdownload STOP Commissioning4 Conversion of CiR elements to real objectswhere required.System modifications are only possible onmaster systems which contain a CiR objector on ET 200M stations which are equippedwith a CiR module. RUN ContinuousoperationIf required, execute several passes of the CiR sequence (step 4 of the table above). You merely have to provide a sufficient number of slaves or adequate I/O volume for all of your system expansions before you switch to continuous operation.CiR Objects and CiR Modules2.2 Types of CiR ElementsOverviewThe following CiR elements are available:Component CiR ElementExisting DP master system CiR objectYou can edit the number of additional DP slaves thisobject contains.Existing PA master system CiR objectYou can edit the number of additional DP slaves thisobject contains.Modular DP slave of the type ET 200M / ET 200iSP CiR moduleYou can edit the additional I/O volume this object contains.NoteWhen STEP 7 identifies the bus parameters, it takes the configured slaves as well asthe CiR elements into account. When it converts CiR elements to real slaves and /ormodules in CPU RUN mode, the bus parameter will therefore remain unchanged.You can add CiR elements either automatically or individually (see Defining CiRElements).CiR ObjectsSpecify the following properties for a CiR object:•The number of slaves that can definitely be added (Default: 15 per DP master system, 6 per PA master system)•Volume of the I/O bytes for future use (Default: 1220 per DP master system, 80 per PA master system). These specifications refer to future user data addresses.You can configure diagnostics addresses regardless of these settings.CiR ModulesUse a CiR module to define additional I/O volume for the modular ET 200M /ET 200iSP distributed I/O device by specifying the number of additional I/O bytes inSUM. These specifications refer to future user data addresses. You can configurediagnostics addresses regardless of these settings.There is never any need to fully utilize user data volume. However, the currentlyexisting user data volume may never be exceeded. STEP 7 ensures this.CiR Objects and CiR Modules 2.3 CiR Elements and I/O Address AreasCiR ObjectsThe following rule applies to the DP master system: The total configured number ofreal slaves and of the guaranteed number of slaves of a CiR object may not exceedthe volume of dynamic project data in the corresponding DP master.HW Config monitors compliance with this rule when you define the CiR objects.I/O Volume for Future Use with CiR Objects and CiR ModulesFor all DP masters, the following rules apply to future utilization of the I/O bytes:1I/O RuleInputs The total number of physical configured user addresses for inputs and forthe input bytes that can be utilized in the future may not exceed the volumeof dynamic project data in the corresponding DP master.Outputs The total number of physical configured user addresses for outputs and forthe output bytes that can be utilized in the future may not exceed the volumeof dynamic project data in the corresponding DP master.HW Config monitors compliance with these rules immediately when you define CiRelements for a DP master system.In order to provide an optimal flexibility for the use of CiR elements, however, thefollowing applies to the CPU:1I/O RuleInputs The total number of physical configured inputs and of input bytes that can beutilized in the future may not exceed the volume of dynamic project data inthe CPU.Outputs The total number of physical configured inputs and of input bytes that can beutilized in the future may not exceed the volume of dynamic project data inthe CPU.HW Config performs a check to verify that the CPU is equipped with sufficientaddress space resources for handling the number of added slaves and/or modulesonly after the CiR elements have been put into use.CiR Objects and CiR ModulesInterface3 User3.1 Basic Procedures in STOP Mode3.1.1 OverviewNoteSave your current configuration after every download of the station configurationfrom HW Config (independent of CPU operating mode). This is the only way you canbe sure that you will be able to continue to work on the saved project without losingCiR functionality if an error occurs (data loss).Defining CiR ElementsYou can define CiR objects for configured DP and PA master systems, and CiRmodules for modular ET 200M / ET 200iSP DP slaves. For details on the procedurerefer to Defining CiR Elements.For the DP master systems you are also offered the function "Enable CiRcompatibility". Select this function to generate a CiR object for the selected DPmaster system and for every sublevel PA master system that is CiR compatible. Atthe selected DP master system, a CiR module is inserted at every modularET 200M / ET 200iSP slave.NoteThe function "Enable CiR compatibility" is only available for DP master systems forwhich a CiR object has not yet been defined.Deleting CiR ElementsIn STOP mode, you can delete previously defined CiR objects at DP and PA mastersystems or CiR modules at modular ET 200M / ET 200iSP DP slaves.You can easily delete all CiR elements in a DP master system via the function"Disable CiR compatibility".NoteThe function "Disable CiR compatibility" is only available for DP master systems forwhich a CiR object has been defined.User InterfaceConfiguration DownloadAfter you have defined new CiR elements or redefined existing ones, download theconfiguration to the CPU in STOP mode.A variety of modules can be used in an S7-400 automation system. In order toascertain whether the modules you are using interfere with a future CiR function, youhave to follow this procedure: When you download the configuration to the CPU inoperating mode STOP, immediately reload the configuration to the CPU in operatingmode RUN. STEP 7 and the CPU then check CiR functionality. This is not possibleoffline for older modules or with modules not produced by Siemens.。

Dreamweaver CC第11章 Photoshop CC 2017基础

Dreamweaver CC第11章 Photoshop CC 2017基础

11.1 认识Photoshop CC 2017
11.1.4 存储文件
在Photoshop CC 2017中,文件的存 储主要通过选择菜单命令【文件】/ 【存储】和【文件】/【存储为】进行。 当新建的图像文件第一次存储时,这 两个菜单命令功能相同,都是将当前 图像文件命名后存储,并且都会弹出 如图11-10所示的【另存为】对话框。 在对话框中,可以设置文件名称、保 存类型和存储选项。如果勾选【作为 副本】复选框,可另存一个文件副本, 副本文件与原有文件保存在同一位置。 选中【注释】、【Alpha通道】、【专 色】和【图层】复选框,可以存储注 释、Alpha通道、专色和图层。
11.1 认识Photoshop CC 2017
11.1.2 首选项
选择菜单命令【编辑】/【首选项】/【工作区】,在打开的对话框中勾选【自动显示 隐藏面板】选项,如图11-6所示,可以让隐藏的面板暂时显示,方法是将指针移动到 应用程序窗口边缘(Windows系统)。
11.1 认识Photoshop CC 2017
11.2 查看图像
11.2.1 导航器
【导航器】面板不仅可以方便地对图像文件在窗口中的显示比例进行调整,而且还 可以对图像文件的显示区域进行移动选择。选择菜单命令【文件】/【导航器】,打开 【导航器】面板。
11.2 查看图像
11.2.2 缩放工具
使用缩放工具可放大或缩小图像。使用缩放工具时,每单击一次都会将图像放大或 缩小到下一个预设百分比。当图像到达最大放大级别3200%或最小尺寸 2017
11.1.1 工作界面 工具栏默认位于窗口左侧,包含用于创建和编辑图像、图稿、页面元素等的工具,
工具按类别进行分组,如图11-3所示。
11.1 认识Photoshop CC 2017

PS指导手册-V1.0

PS指导手册-V1.0

PS用户手册PS处理流程如下图:图1 PS处理流程软件提供了一系列流程化工具来完成PS处理,包括:1、连接图生成2、定义感兴趣区域(可选)3、干涉工作流3.1 配准3.2 干涉生成和去平3.2 平均强度图省工程和振幅离差指数生成(MuSigma)4、第一次反演4.1相干性、速率和地形残差估算5、第二次反演5.1 大气相位去除5.2 相干性、速率和地形残差估算5.3 形变估算6、地理编码6.1 速率和精度估算6.2 形变结果地理编码研究区和数据说明本文档对PS处理进行详细的说明,用户可以参考本文档进行自己的数据处理。

文中大多数截图都是来自两组数据,软件版本是SARscape5.1+ENVI5.2,有一些特殊的情况,为了提高显示速度,用到了ENVI Classic。

研究区是日本莆安市,在离东京不远的千叶市,用到了两组数据集:ENVISAT-ASAR和ALOS-PALSAR,时间空间覆盖相似,便于对比结果,还有GPS测量数据,用来验证PS的结果。

ASAR数据集包含34景降轨数据,IS2模式,VV极化,时间从2006年8月26日到2010年10月22日。

PALSAR数据集包含23景降轨数据,单极化或双极化(FBS-FBD)模式,HH极化方式,时间从2006年9月4日到2010年8月9日。

两组数据是同一个区域的,不同波长、不同传感器、不同入射角,得到的结果很相近,那么说明结果是很接近真实情况的。

本文在处理的时候,两个数据集同时处理的,在实际工作中,建议一次性处理一个数据集。

图2 ASAR数据集区域(红色)和PALSAR数据集区域(蓝色)两个数据集的时相如下表所示:每个数据都包含三个数据文件:.hdr (ENVI头文件).sml (SARscape头文件).kml (Google Earth文件).在本研究区内,有一些地表的沉降或抬升是在预期内的,是油气开采和地下水回填造成的。

PS工作流说明开始之前的准备工作在PS工作流开始之前,需要设置ENVI的系统参数和SARscape的系统参数,根据所处理的数据来设置,用一套系统推荐的默认参数。

  1. 1、下载文档前请自行甄别文档内容的完整性,平台不提供额外的编辑、内容补充、找答案等附加服务。
  2. 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
  3. 3、如文档侵犯您的权益,请联系客服反馈,我们会尽快为您处理(人工客服工作时间:9:00-18:30)。

PS9117NEC's HIGH CMR, 10MbpsOPEN COLLECTOR OUTPUT TYPE5-PIN SOP OPTOCOUPLERCalifornia Eastern Laboratories• PULSE WIDTH DISTORTION: |t PHL - t PLH | = 35 ns MAX.• HIGH COMMON MODE TRANSIENT IMMUNITY:CM H , CM L = ±15 kV/μs MIN.• SMALL PACKAGE:5-Pin SOP • HIGH SPEED: 10 Mbps• HIGH ISOLATION VOLTAGE: BV = 2 500 V r.m.s.• OPEN COLLECTOR OUTPUT• ORDERING NUMBER OF TAPING PRODUCT: PS9117-F3, F4: 2 500 pcs/reel • Pb-Free Product• SAFETY STANDARDS:UL approved: File No. E72422DIN EN60747-5-2 (VDE0884 Part2) approved No. 40008902 (option)FEATURESDATA SHEETNEC's PS9117 is an optically coupled high-speed, active low type isolator containing a GaAlAs LED on the input side and a photodiode and a signal process-ing circuit on the output side on one chip.The PS9117 is designed specifically for high common mode transient immunity (CMR) and low pulse width distortion. The PS9117 is suitable for high density ap-plication.DESCRIPTION• Measurement Equipment • PDP • FA NetworkAPPLICATIONTRUTH TABLELED OUTPUTON L OFFHPS9117PACKAGE DIMENSIONS (UNIT: mm)MARKING EXAMPLEPS9117ORDERING INFORMATION*1 For the application of the Safety Standard, following part number should be used.*2 With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact yournearby sales office.PART NUMBERORDER NUMBERSOLDER PLATING SPECIFICATION PACKING STYLESAFETY STANDARDS APPROVAL APPLICATION PART NUMBER *1PS9117PS9117-A Pb-Free *2Magazine case 100 pcs UL approvedPS9117PS9117-F3PS9117-F3-A Embossed Tape 2 500 pcs/reel PS9117-F4PS9117-F4-A PS9117-V PS9117-V-A Magazine case 100 pcs DIN EN60747-5-2 (VDE0884 Part2) Approved (Option)PS9117-V-F3PS9117-V-F3-A Embossed Tape 2 500 pcs/reelPS9117-V-F4PS9117-V-F4-AABSOLUTE MAXIMUM RATINGS (T A = 25ºC, unless otherwise Specified)PARAMETERSYMBOLRATINGSUNIT DiodeForward Current *1I F 30mA Reverse Voltage V R 5V DetectorSupply Voltage V CC 7V Output Voltage V O 7V Output Current I O 25mA Power Dissipation *2P C 40mW Isolation Voltage *3BV 2 500Vr.m.s.Operating Ambient Temperature T A −40 to +85°C Storage TemperatureT stg−55 to +125°C*1 Reduced to 0.3 mA/°C at T A = 25°C or more.*2 Applies to output pin V O (collector pin). Reduced to 1.5 mW/°C at T A = 65°C or more.*3 AC voltage for 1 minute at T A = 25°C, RH = 60% between input and output.PS9117RECOMMENDED OPERATING CONDITIONSPARAMETER SYMBOL MIN.TYP.MAX.UNITLow Level Input Voltage V FL00.8VHigh Level Input Current I FH 6.31012.5mASupply Voltage V CC 4.5 5.0 5.5VTTL (R L = 1 kΩ, loads)N5Pull-up Resistor R L330 4 kΩELECTRICAL CHARACTERISTICS (T A = -40 to 85ºC, unless otherwise specified)PARAMETER SYMBOL CONDITIONS MIN.TYP.*1MAX.UNIT Diode Forward Voltage V F I F = 10 mA, T A = 25°C 1.4 1.65 1.8V Reverse Current I R V R = 3 V, T A = 25°C10μATerminal Capacitance C t V = 0 V, f = 1 MHz, T A = 25°C30pF Detector High Level Output Current I OH V CC = V O = 5.5 V, V F = 0.8 V1100μA Low Level Output Voltage*2V OL V CC = 5.5 V, I F = 5 mA, I OL = 13 mA0.20.6VHigh Level Supply Current I CCH V CC = 5.5 V, I F = 0 mA58mALow Level Supply Current I CCL V CC = 5.5 V, I F = 10 mA911 Coupled Threshold Input Current(H → L)I FHL V CC = 5 V, V O = 0.8 V, R L = 350 Ω25Isolation Resistance R I-O V I-O = 1 kV DC, RH = 40 to 60%,T A = 25°C1011ΩIsolation Capacitance C I-O V = 0 V, f = 1 MHz, T A = 25°C0.6pFPropagation Delay Time (H → L)*3t PHL T A = 25°C3575ns V CC = 5 V, R L = 350 Ω, I F = 7.5 mA100Propagation Delay Time (L → H)*3t PLH T A = 25°C4075 V CC = 5 V, R L = 350 Ω, I F = 7.5 mA100Rise Time t r V CC = 5 V, R L = 350 Ω, I F = 7.5 mA20Fall Time t f5Pulse Width Distortion (PWD)*3|t PHL-t PLH|535 Propagation Delay Skew t PSK40Common Mode Transient Immunity at High Level Output*4CM H V CC = 5 V, R L = 350 Ω, T A = 25°C,I F = 0 mA, V O> 2 V, V CM = 1 kV1520kV/μsCommon ModeTransient Immunity at Low Level Output*4CM L V CC = 5 V, R L = 350 Ω, T A = 25°C,I F = 7.5 mA, V O< 0.8 V, V CM = 1 kV1520kV/μsPS9117*1 Typical values at T A = 25°C*2 Because V OL of 2 V or more may be output when LED current input and when output supply of V CC = 2.6 V or less, it isimportant to confirm the characteristics (operation with the power supply on and off) during design, before using this device.*3 Test circuit for propagation delay timeOLO (monitor)CC = 5 VInputRemark C L includes probe and stray wiring capacitance.*4 Test circuit for common mode transient immunity1 kV 0 VV OH 2 V 0.8 V V OL V CM V O (I F V O(I FO (monitor)CC = 5 V Remark C L includes probe and stray wiring capacitance.USAGE CAUTIONS1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricitywhen handling.2. By-pass capacitor of 0.1 μF is used between V CC and GND near device. Also, ensure that the distance between the leads ofthe photocoupler and capacitor is no more than 10 mm.PS9117Remark The graphs indicate nominal characteristics.TYPICAL CHARACTERISTICS (T A = 25ºC, unless otherwise specified)085102030408502010305040Ambient Temperature T A (ºC)M a x i m u m F o r w a r d C u r r e n t I F (m A )MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATUREAmbient Temperature T A (ºC)D e t e c t o r P o w e r D i s s i p a t i o n P C (m W )DETECTOR POWER DISSIPATION vs. AMBIENT TEMPERATUREForward Voltage V F (V)F o r w a r d C u r r e n t I F (m A )FORWARD CURRENT vs. FORWARD VOLTAGEH i g h L e v e l S u p p l y C u r r e n t I C C H (m A )L o w L e v e l S u p p l y C u r r e n t I C C L (m A )SUPPLY CURRENT vs. AMBIENT TEMPERATUREInput Current I F (mA)O u t p u t V o l t a g e V O (V )OUTPUT VOLTAGE vs. INPUT CURRENTAmbient Temperature T A (ºC)L o w L e v e l O u t p u t V o l t a g e V O L (V )PS9117T h r e s h o l d I n p u t C u r r e n t I F H L (m A )THRESHOLD INPUT CURRENT vs. AMBIENT TEMPERATUREPROPAGATION DELAY TIME vs. AMBIENT TEMPERATUREAmbient Temperature T A (ºC)P u l s e W i d t h D i s t o r t i o n t P H L ñt P L H (n s )Ambient Temperature T A (ºC)Input Current I F (mA)P r o p a g a t i o n D e l a y T i m e t P H L , t P L H (n s )PROPAGATION DELAY TIME vs. INPUT CURRENT6050403020100PS9117TAPING SPECIFICATIONS (UNIT:mm)PS9117NOTES ON HANDLING1. Recommended soldering conditions(1) Infrared reflow soldering • Peak reflow temperature 260°C or below (package surface temperature)• Time of peak reflow temperature 10 seconds or less • Time of temperature higher than 220°C 60 seconds or less • Time to preheat temperature from 120 to 180°C120±30 s • Number of reflows Three• FluxRosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)(2) Wave soldering • Temperature 260°C or below (molten solder temperature)• Time10 seconds or less• Preheating conditions 120°C or below (package surface temperature)• Number of times One (Allowed to be dipped in solder including plastic mold portion.)• FluxRosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)(3) Soldering by Soldering Iron• Peak Temperature (lead part temperature) 350°C or below • Time (each pins)3 seconds or less• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (b) Please be sure that the temperature of the package would not be heated over 100°CP a c k a g e S u r f a c e T e m p e r a t u r e T (ºC )Time (s)Recommended Temperature Profile of Infrared ReflowPS9117Life Support ApplicationsThese NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk andagree to fully indemnify CEL for all damages resulting from such improper use or sale.A Business Partner of NEC Compound Semiconductor Devices, Ltd.04/04/2005(4) Cautions • FluxesAvoid removing the residual flux with freon-based and chlorine-based cleaning solvent.2. Cautions regarding noiseBe aware that when voltage is applied suddenly between the photocoupler’s input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings.USAGE CAUTIONS1. Protect against static electricity when handling.2. Avoid storage at a high temperature and high humidity.。

相关文档
最新文档