LB11948T-TLM-E;中文规格书,Datasheet资料
LB1909M-TE-L-E;中文规格书,Datasheet资料
L B 1909MOverviewThe LB1909M is a 2-channel low saturation voltage forward/reverse motor driver that can operate on a wide supplyvoltage range (2.5V to 16V). The IC is ideal for use in 2-phase excitation drive of general-purpose 2-phase bipolar stepping motors including dampers for refrigerators.Features• Wide supply voltage range : 2.5V to 16V• Low saturation voltage : V O (sat) = 0.25V typ at I O = 200mA. • Built-in shoot-through current protection circuit. • No standby current consumption (or zero). • Built-in thermal shutdown circuit. • Small package : MFP10S (225mil)SpecificationsAbsolute Maximum Ratings at Ta = 25°CParameter SymbolConditionsRatingsUnit Maximum power source voltage V CC max -0.3 to +20V Applied output voltage V OUT max -0.3 to +20V Applied input voltage V IN max -0.3 to +18V GND pin outflow current I GND800mA Independent IC350mW Allowable power consumptionPd maxMounted on the specified board *870mW Operating temperature Topr -30 to +85°C Storage temperatureTstg-40 to +150°C* Specified board: 114.3mm × 76.1mm × 1.6mm, glass epoxy board.Monolithic Digital ICStepping Motor Driver ICAllowable Operating Range at Ta = 25°CParameter SymbolConditionsRatings UnitSupply voltage V CC2.5 to 16V Input high level voltage V IH 1.8 to 10V Input low level voltageV ILPins ENA, IN1, IN2-0.3 to +0.7VElectrical Characteristics at Ta = 25°C, V CC = 12VRatingsParameter SymbolConditionsmin typ maxUnitI CC 0 ENA = L 0.1 10µA Power source currentI CC 1ENA = H25 35mA V OUT 1 IOUT = 200mA 0.25 0.35V Output saturation voltageV OUT 2 I OUT = 400mA 0.50 0.75V Input currentI IN V IN = 5V 120160µA Thermal protection block *1Thermal shutdown operation temperatureTtsdDesign guarantee *2180°C Temperature hysteresis width ∆Ttsd 60 °C Spark killer diodeReverse current I S (leak) 30µA orward voltageV SFI OUT = 400mA1.7V*1 The thermal protection function is a feature to prevent the product from smoking and firing under unusual conditions. It is not intended to guarantee operation of the product under an ambient temperature exceeding the operating temperature range. *2 Design guarantee is not tested in individual units.Package Dimensionsunit : mm (typ) 3086BAmbient temperature, Ta -- °CA l l o w a b l e p o w e r d i s s i p a t i o n , P d m a x -- WPin AssignmentV CC ENA IN1IN2NC OUT3OUT4GNDOUT1OUT2Top viewTruth tableInput OutputENA IN1 IN2 OUT1 OUT2 OUT3 OUT4 RemarksL×× OFF OFF OFF OFF Standby modeL H LForwardH L HChannel 1ReverseL H L ForwardHH L H Channel 2ReverseBlock DiagramV CCENA IN1IN1Timing Chart (2 phase excitation drive)ENAIN1IN2Channel 1 outputChannel 2 output StandbyReverseForwardForward ReverseReverse Forward Reverse ForwardForward ReverseStandbyThis catalog provides information as of October, 2008. Specifications and information herein are subject to change without notice.分销商库存信息: ONSEMILB1909M-TE-L-E。
TPCP8901(TE85L,F);中文规格书,Datasheet资料
0.28
+0.1 -0.11
2.4±0.1 2.8±0.1
Absolute Maximum Ratings (Ta = 25°C)
1.12+-00..1132
Characteristics
Symbol
Collector-base voltage Collector-emitter voltage
Emitter-base voltage
TPCP8901
TOSHIBA Transistor Silicon NPN / PNP Epitaxial Type (PCT Process)
TPCP8901
Portable Equipment Applications Switching Applications
0.33±0.05
0.05 M A
See Figure 4 circuit diagram VCC ∼− 30 V, RL = 100 Ω IB1 = −IB2 = 10 mA
Min Typ. Max Unit
⎯
⎯ −100 nA
⎯
⎯ −100 nA
−50 ⎯
⎯
V
200
⎯
500
125 ⎯
⎯
⎯
⎯ −0.20 V
⎯
⎯ −1.10 V
⎯
8
Collector power dissipation (t = 10s) Single-device
PC (Note 2)
W
value at ingle-device operation
0.83
Collector power dissipation (DC)
Single-device
LB1848M-TLM-E;中文规格书,Datasheet资料
• Standby current: zero • Thermal shutdown circuit • Miniature package: MFP-10S (6.5 × 5.1 mm2) • Through-current prevention circuit (LB1848M only) • “Soft off” function that reduces power supply line noise
Both of these IC products can directly control a motor from signals from a microcontroller. The LB1846M is optimal for 1-2 phase excitation drive for 2-phase stepping motors using 4-input logic (IN1, IN2, IN3, and IN4) and the LB1848M is optimal for 2-phase excitation drive for 2-phase stepping motors using 3-input logic (ENA, IN1, and IN2).
Notes on Wiring and Lines Since large currents flow in the VCC and ground lines, oscillations may occur on these lines. The following points should be observed if such oscillations occur. (1) Lower the line impedances by making them shorter and thicker. (2) Attach capacitors close to the IC. (3) If the controller (CPU) is mounted on a separate printed circuit board, insert series resistors (of about 10 kΩ) between the controller outputs and this IC.
CD4013BMT,CD4013BMT,CD4013BNSR,CD4013BE,CD4013BM,CD4013BM96E4, 规格书,Datasheet 材料
Data sheet acquired from Harris Semiconductor SCHS023D − Revised April 2005The CD4013B types are supplied in 14-lead hermetic dual-in-line ceramic packa es (F3A suffix), 14-lead dual-in-line plastic packag es (E suffix), 14-lead small-outline packag es (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).*15105Copyright © 2005, Texas Instruments IncorporatedAddendum-Page 1PACKAGING INFORMATIONOrderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball Finish MSL Peak Temp (3)Samples (Requires Login)89267AKB3T OBSOLETE CFP WR 14TBDCall TICall TICD4013BE ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type CD4013BEE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg TypeCD4013BF ACTIVE CDIP J 141TBD A42N / A for Pkg Type CD4013BF3A ACTIVE CDIP J 141TBD A42N / A for Pkg Type CD4013BF3AS2534OBSOLETE CDIP J 14TBD Call TI Call TI CD4013BK3OBSOLETE CFP WR 14TBDCall TICall TICD4013BM ACTIVE SOIC D 1450Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD4013BM96ACTIVE SOIC D 142500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD4013BM96E4ACTIVE SOIC D 142500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD4013BM96G4ACTIVE SOIC D 142500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD4013BME4ACTIVE SOIC D 1450Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD4013BMG4ACTIVE SOIC D 1450Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD4013BMT ACTIVE SOIC D 14250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD4013BMTE4ACTIVE SOIC D 14250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD4013BMTG4ACTIVE SOIC D 14250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD4013BNSR ACTIVE SO NS 142000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD4013BNSRE4ACTIVE SO NS 142000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD4013BNSRG4ACTIVE SO NS 142000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD4013BPWACTIVETSSOPPW1490Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM芯天下--/Addendum-Page 2Orderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball FinishMSL Peak Temp(3)Samples (Requires Login)CD4013BPWE4ACTIVE TSSOP PW 1490Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD4013BPWG4ACTIVE TSSOP PW 1490Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD4013BPWR ACTIVE TSSOP PW 142000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD4013BPWRE4ACTIVE TSSOP PW 142000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD4013BPWRG4ACTIVE TSSOP PW 142000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIMJM38510/05151BCA ACTIVE CDIP J 141TBD A42N / A for Pkg Type M38510/05151BCAACTIVECDIPJ141TBDA42N / A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3)MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.芯天下--/OTHER QUALIFIED VERSIONS OF CD4013B, CD4013B-MIL :•Catalog: CD4013B•Military: CD4013B-MILNOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense ApplicationsAddendum-Page 3芯天下--/TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant CD4013BM96SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1CD4013BM96G4SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1CD4013BMT SOIC D 14250330.016.4 6.59.0 2.18.016.0Q1CD4013BNSR SO NS 142000330.016.48.210.5 2.512.016.0Q1CD4013BPWRTSSOPPW142000330.012.46.95.61.68.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) CD4013BM96SOIC D142500367.0367.038.0 CD4013BM96G4SOIC D142500367.0367.038.0 CD4013BMT SOIC D1*******.0367.038.0 CD4013BNSR SO NS142000367.0367.038.0CD4013BPWR TSSOP PW142000367.0367.035.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. 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TL431datasheet
© Motorola, Inc. 1998
Rev 6
1
Symbol
Reference (R)
Cathode (K)
Anode (A)
TL431, A, B Series
Representative Schematic Diagram Component values are nominal
Cathode (K)
Symbol RθJA RθJC
D, LP Suffix Package
178 83
P Suffix Package
114 41
DM Suffix Package
240 –
Unit V mA
Unit °C/W °C/W
2
MOTOROLA ANALOG IC DEVICE DATA
TL431, A, B Series
Storage Temperature Range
Total Power Dissipation @ TA = 25°C Derate above 25°C Ambient Temperature D, LP Suffix Plastic Package P Suffix Plastic Package DM Suffix Plastic Package
Reference Input Voltage Deviation Over Temperature Range (Figure 1, Notes 1, 2) VKA= Vref, IK = 10 mA
Ratio of Change in Reference Input Voltage to Change in Cathode to Anode Voltage IK = 10 mA (Figure 2), ∆VKA = 10 V to Vref ∆VKA = 36 V to 10 V
无刷电机解决方案
Level Shift
OUT1 (NC) (NC) VCC
5 6 7 8
Current Limitter
Duty Controller
12 11 10
High Side Regulator
RD FG PWM
OSC Lock Detection
PWM
RGH
9
TSD
订购及封装信息
ONPN Description LV8861VH-TLM-H FAN MOTOR DRIVER (7.6mmx9.75mmx1.3mm) Pkg HSSOP16
ON Semiconductor Target
19
LB1975/76
三相风扇电机驱动器
独特特性 • 3-Phase Bipolar Drive VMmax46V,Iomax2.5A VMmax60V,Iomax2.5A • Direct PWM Drive • DIP28H Package 优势 应用数据 • High voltage,current 1chip • LB1975 VREG • LB1976 VCC • High Efficiency Reg VCC • Large Power dissipation
＋
S/S
F/R
FG1 FG2
LVSD
TSD VM
＋
Hys.Amp
VM
• • • •
其它特性 Built-in high side kickback absorbing diodes Built-in current limiter Built-in FG output PWM duty can be controlled by IC input
控制器
品番种类
英文名称中文名称G X00 50JN1300 T0.5*W295(深)非合金涂塑钢带/0.5*S*C G X00 50JN1300 T0.5*W303(深)非合金涂塑钢带/0.5*S*C G X00 50JN1300 T0.5*W75(深)非合金涂塑钢带/0.5*S*C G X00 50JN700 T0.5*W303电磁钢带/0.5*S*C(50H700) G X00 50JNE470*A1 T0.5*W303电磁钢带/0.5*S*C(50H470) G X00 BALL B轴承G X00 BAND绑扎带G X00 BB PAINT轴承托架G X00 BM轴套G X00 BRIDGE DRIVER M81736FP驱动元件G X00 CAPACITOR电容/非片式单层塑料电介质G X00 CERAMIC CAPACITOR电容/片式多层瓷电介质G X00 CHIP RESISTOR电阻/片式G X00 COMPARATOR IC NJM2403V比较器G X00 CONTRACTION TUBE F2(Z)D1.0 BLACK套管G X00 CONTRACTION TUBE F2(Z)D1.0 BLUE套管G X00 CONTRACTION TUBE F2(Z)D1.0 RED套管G X00 CONTRACTION TUBE F2(Z)D4.0套管G X00 DIODE二极管G X00 DRIVER IC LB11820M-TLM-E驱动元件G X00 DRIVER IC(BD62012FS)集成电路G X00 DRIVER IC(TC78B600FNG)集成电路G X00 EZKTUX1*JDT0.8XW57电镀锌钢带/0.8*S*CG X00 EZKTUX1*JDT0.8XW62电镀锌钢带/0.8*S*CG X00 EZKTUX1*JDT0.8XW73电镀锌钢带/0.8*S*CG X00 EZKTUX1*JDT0.8XW97电镀锌钢带/0.8*S*CG X00 EZKTUX1*JDT1.2XW114电镀锌钢带/1.2*S*CG X00 FERRITE CORE磁环G X00 FERRITIC CORE磁环G X00 FET晶体管G X00 FET 2SK3842(TE24L Q)晶体管G X00 FET ARRAY驱动元件G X00 FET RJU002N06 T106晶体管（功率小于1瓦）G X00 FUSE温度继电器G X00 HALL ELEMENT HG-302C半导体器件G X00 HALL ELEMENT HW-102A-FT半导体器件G X00 HALL IC EW-612B半导体器件G X00 HEADER接插件零件G X00 HEMP STRING#100麻线G X00 LED发光二极管G X00 LED二极管G X00 LOGIC IC CD4018BM96半导体元件G X00 LOGIC IC MC14053BDTR2半导体元件G X00 LOGIC IC TC4053BFT(EL N)半导体元件G X00 LOGIC IC TC74VHC74FT(EL K)半导体元件G X00 LOGIC IC TC74VHCT86AFT(EL)半导体元件G X00 LOGIC IC TC7WH08FU(TE12L F)半导体元件G X00 LOGIC IC TC7WH74FU(TE12L F)半导体元件G X00 MAGNET磁铁G X00 MAGNET (6-43L)磁铁G X00 MAGNET (9-34L)磁铁G X00 MAGNET (9-37L)磁铁G X00 MAGNET CUTTING转动轮G X00 MAGNET RESIN HM-1220KD3塑磁材料G X00 MAGNET RESIN TP-A26FS塑磁材料G X00 MAGNET RESIN TP-A27E(T)塑磁材料G X00 MOS FET RCD060N25晶体管G X00 MOTOR DRIVE IC LB11620T-TLM-E驱动元件G X00 NTC THERMISTOR热敏电阻G X00 OP AMP半导体元件G X00 OP AMP IC BA2904SFV集成电路/用做放大器G X00 O-RING(A)挡圈/非用于民用航空器维护和修理G X00 O-RING(B)挡圈/非用于民用航空器维护和修理G X00 PBT(3015-209S)PBT塑胶粒G X00 PCB电路印刷板G X00 PHOTO COUPLER光电耦合器G X00 POWER IC (BM6201FS)集成电路G X00 POWER IC ECN30107SP驱动元件G X00 POWER IC ECN30107SPR驱动元件G X00 POWER IC ECN30206SP驱动元件G X00 POWER IC ECN30603SP驱动元件G X00 POWER IC LB1976驱动元件G X00 POWER IC NTP1101A驱动元件G X00 POWER IC NTP1102A驱动元件G X00 POWER IC NTP5001驱动元件G X00 POWER IC TPD4121K集成电路G X00 POWER IC TPD4131K集成电路G X00 POWER IC(NTP1101)驱动元件G X00 POWER IC(NTP1102)驱动元件G X00 PTC THERMISTOR热敏电阻G X00 REGULATOR晶体管（功率小于1瓦）G X00 RESET IC半导体器件G X00 RUST VETO HEAVY防锈油G X00 SECC*JD T1.2*W110电镀锌钢带/T=0.23-3.0MMG X00 SECC*JD T1.2*W82电镀锌钢带/T=0.23-3.0MMG X00 SECC-TN 20/20 T0.8XW71电镀锌钢带/0.8*S*CG X00 SECC-TN T1.0*W135电镀锌钢带/T=0.23-3.0MMG X00 SECC-TN T1.0*W163电镀锌钢带/T=0.23-3.0MMG X00 SECC-TN T1.2XW112电镀锌钢带/T=0.23-3.0MMG X00 SECC-TN T1.2XW122电镀锌钢带/1.2*S*CG X00 SECC-TN T1.2XW73电镀锌钢带/T=0.23-3.0MMG X00 SECC-TN T1.2XW88电镀锌钢带/T=0.23-3.0MMG X00 SECC-TN T1.2XW91电镀锌钢带/T=0.23-3.0MMG X00 SECC-TNA T1.0*W78电镀锌钢带/T=0.23-3.0MMG X00 SECC-TNA T1.0*W80电镀锌钢带/T=0.23-3.0MMG X00 SECC-TNA T1.2*W106电镀锌钢带/T=0.23-3.0MMG X00 SECC-TNA T1.2XW110电镀锌钢带/T=0.23-3.0MMG X00 SECC-TNA T1.2XW198电镀锌钢带/T=0.23-3.0MMG X00 SECC-TNA T1.2XW82电镀锌钢带/T=0.23-3.0MMG X00 SECC-TNA T1.2XW90电镀锌钢带/T=0.23-3.0MMG X00 SECC-TNA T1.6*W174电镀锌钢带/T=0.23-3.0MMG X00 SILICON S-295C粘合剂G X00 SIN WAVE IC TB6584FNG集成电路G X00 SINGLE GATE LOGIC MC74HC1G08DTT1G半导体元件G X00 SINGLE GATE LOGIC MC74HC1G86DTT1G半导体元件G X00 SOLDER M33HT无铅焊锡条G X00 SPLICE接插件零件G X00 SWITCH开关G X00 TACK HARD CS-70硅酮密封胶G X00 TCUD-FN 1.2*W132镀锌钢带/T=0.1-3.2MMG X00 TCUD-FN T1.2XW198镀锌钢带/T=0.1-3.2MMG X00 T-DIODE二极管G X00 TERMINAL接插件零件G X00 THERMAL SENSOR IC BDE1000G-TR集成电路G X00 TRANSISTOR晶体管（功率小于1瓦）G X00 TRANSISTOR晶体管G X00 YPF SCREW螺钉/杆径小于等于6毫米G X00 YXA CAPACITOR电容/片式多层瓷电介质G X00 ZENER DIODE二极管G X01 BM轴套G X01 BRIDGE DRIVER ECN33500FP驱动元件G X01 CERAMIC CAPACITOR电容/片式多层瓷电介质G X01 CHIP RESISTOR电阻/贴片式G X01 COMPARATOR IC LM2903DR2比较器G X01 CONNECTOR接插件零件G X01 DIODE二极管G X01 DRIVER IC LB11823M-TLM-E驱动元件G X01 DRIVER IC TB6586集成电路G X01 EMI BEAD CORE滚珠芯G X01 FAN风叶G X01 FERRITE CORE磁环G X01 FET ARRAY MP6622(LBRNDS-S Q)晶体管G X01 FLANGE NUT螺帽G X01 FUSE熔断器G X01 HALL ELEMENT HW-107T-FT(Pb###)半导体器件G X01 HALL IC半导体器件G X01 IC NJM2624AM半导体器件G X01 INSULATING TAPE绝缘胶带G X01 LEAD ASSY组合电线G X01 MAGNET转动轮G X01 MAGNET ASSY转动轮G X01 MAGNET CUTTING转动轮G X01 MOTOR DRIVE IC LB1696-E驱动元件G X01 OIL SEAL密封垫G X01 O-RINGS挡圈/非用于民用航空器维护和修理G X01 OUTSIDE TIE绑扎带G X01 PACKINGS密封垫G X01 PCB电路印刷板G X01 POWER IC ECN30204SP驱动元件G X01 POWER IC ECN30605SP驱动元件G X01 POWER IC NTP3001集成电路G X01 POWER IC SX68003驱动元件G X01 PROCESSING OF WASHER垫圈/非用于民用航空器维护和修理G X01 REGULATOR IC TA58L15S(Q)集成电路G X01 REGULATOR IC TA7805AF(TE16L1 NQ)调节元件G X01 RUBBER橡胶圈G X01 SHAFT转子轴G X01 SIN WAVE IC集成电路G X01 SPONGE RING密封圈G X01 SPRING螺旋弹簧G X01 SPRING PIN弹簧针G X01 SPRING PIN接插件零件G X01 SWITCH开关G X01 TANTALUM CAPACITOR电容/片式多层钽电介质G X01 TAPPING SCREW螺钉/杆径小于等于6毫米G X01 T-DIODE二极管G X01 TRANSISTOR晶体管（功率小于1瓦）G X01 TRANSISTOR晶体管G X01 U RING挡圈/非用于民用航空器维护和修理G X01 WAVE W垫圈/非用于民用航空器维护和修理G X02 DRIVER IC TB6586AFG(O EL DRY)集成电路G X02 4 HIGH-LOW SCREW螺钉/杆径小于等于6毫米G X02 BB轴承托架G X02 BB PAINT轴承托架G X02 BM轴套G X02 BUSHING(B4)导线固定器G X02 CAPACITOR电容/非片式单层铝电介质G X02 CERAMIC CAPACITOR电容/片式多层瓷电介质G X02 CHIP RESISTOR电阻/贴片式G X02 CHIP RESISTOR电阻/片式G X02 CMOS IC MC14013BFELG半导体元件G X02 COILEND COVER(A)外盖G X02 COILEND COVER(B)外盖G X02 CONDENSER电容/片式多层瓷电介质G X02 CONNECTOR接插件零件G X02 COVER外盖G X02 DRIVER IC TB6586FG(O EL DRY)集成电路G X02 EMI CORE滚珠芯G X02 EW-512(HALL IC)半导体器件G X02 FERRITE CORE磁环G X02 FET 2SK3130(Q)晶体管G X02 FET 2SK3326-AZ晶体管G X02 FET 2SK3947(Q)晶体管G X02 FET ARRAY SMA5127驱动元件G X02 FET ARRAY STA513A LF-405晶体管G X02 FET TK12A50D5晶体管G X02 HALL ELEMENT HW-300B-08半导体器件G X02 HALL ELEMENT HW-300B-15半导体器件G X02 HALL IC EW-502-PR半导体器件G X02 HALL IC EW-632-T3半导体器件G X02 HOLDER塑料支架G X02 INSERT BB轴承托架G X02 JUMPER RESISTOR电阻/贴片式G X02 LEAD ASSY组合电线G X02 M3 SCREW WITH WASHER螺钉/杆径小于等于6毫米G X02 MAGMATE TERMINAL接插件零件G X02 MAGNET磁铁G X02 MAGNET (6-19.3L)磁铁G X02 MAGNET (6-47L)磁铁G X02 MAGNET (9-34L)磁铁G X02 MAGNET ASSY转动轮G X02 O-RINGS挡圈/非用于民用航空器维护和修理G X02 PACKINGS密封垫G X02 PC BOARD电路印刷板G X02 PCB电路印刷板G X02 PCB HOLDER塑料支架G X02 POWER IC ECN30601SP-A驱动元件G X02 POWER IC SX68001驱动元件G X02 POWER IC SX68002驱动元件G X02 POWER IC TPD4122K集成电路G X02 PTC THERMISTOR热敏电阻G X02 ROLL BUSH接插件零件G X02 RUBBER橡胶圈G X02 SHAFT转子轴G X02 SIN WAVE IC TB6551FAG集成电路G X02 SIN WAVE IC TB6556FG集成电路G X02 SLINGER橡胶圈G X02 SOLID TANTALUM CAPACITORS电容/非片式多层钽电介质G X02 SPINDLE转子轴G X02 SPRING PIN弹簧针G X02 T-DIODE二极管G X02 TOOTH LOCK W(B)垫圈/非用于民用航空器维护和修理G X02 TP熔断器G X02 TP PUSHING RUBBER橡胶块G X02 TRANSISTOR晶体管（功率小于1瓦）G X02 TRANSISTOR晶体管G X02 TURBO FAN ASSY风叶G X02 TVS二极管G X02 WASHER垫圈/非用于民用航空器维护和修理G X02 WASHER黄铜垫圈/非用于民用航空器维护和修理G X02 WAVE W垫圈/非用于民用航空器维护和修理G X02 ZENER DIODE二极管G X03 4 HIGH-LOW SCREW螺钉/杆径小于等于6毫米G X03 ASSEMBLY SCREW螺钉/杆径小于等于6毫米G X03 BB PAINT轴承托架G X03 BRIDGE DRIVER M81706AFP驱动元件G X03 BUSHING导线固定器G X03 CERAMIC CAPACITOR电容/片式多层瓷电介质G X03 CERAMIC RESONATOR共振件(陶瓷振荡子)G X03 CHIP RESISTOR电阻/片式G X03 CLAMP ME接插件零件G X03 CMOS LOGIC IC MC74HC74ADR2半导体元件G X03 CMOS LOGIC IC MC74HC86ADR2半导体元件G X03 CONED DISC SPRING垫圈/非用于民用航空器维护和修理G X03 DIODE二极管G X03 E RING挡圈/非用于民用航空器维护和修理G X03 FET 2SK3313(Q,T)晶体管G X03 FUSE熔断器G X03 HOLDER塑料支架G X03 LEAD ASSY组合电线G X03 M3 S SCREW螺钉/杆径小于等于6毫米G X03 M3-TAP TITE螺钉/杆径小于等于6毫米G X03 M4 SCREW螺钉/杆径小于等于6毫米G X03 M4 SCREW WITH WASHER螺钉/杆径小于等于6毫米G X03 MAGNET磁铁G X03 MAGNET (6-21.3L)磁铁G X03 MAGNET (6-37L)磁铁G X03 MAGNET ASSY转动轮G X03 O-RING挡圈/非用于民用航空器维护和修理G X03 PCB电路印刷板G X03 POLYGON TUBE套管/个G X03 POWER IC SMA6823M(LF2451)驱动元件G X03 POWER IC TPD4146K驱动元件G X03 PUSH NUT螺帽G X03 RUBBER橡胶圈G X03 SCERW螺钉/杆径小于等于6毫米G X03 SHAFT转子轴G X03 SIN WAVE IC TB6551FG集成电路G X03 SPRING LOCK WASHER垫圈/非用于民用航空器维护和修理G X03 T-DIODE二极管G X03 TP温度继电器G X03 TP(22 SERIES)熔断器G X03 TRANSISTOR晶体管（功率小于1瓦）G X03 TRANSISTOR ARRAY晶体管G X03 WASHER纸质垫圈/非用于民用航空器维护和修理G X03 WASHER垫圈/非用于民用航空器维护和修理G X03 YXA CAPACITOR(250)电容/非片式单层铝电介质G X04 4 HIGH-LOW SCREW螺钉/杆径小于等于6毫米G X04 BASE固定板G X04 BB轴承托架G X04 BB PAINT轴承托架G X04 BEARING METAL轴承托架G X04 C RING挡圈/非用于民用航空器维护和修理G X04 CERAMIC CAPACITOR电容/片式多层瓷电介质G X04 CHIP RESISTOR电阻/片式G X04 DIODE二极管G X04 DRIVER IC 2STB116PM-T驱动元件G X04 DRIVER IC 2STB127PM-T驱动元件G X04 EARTH WIRE ASSY导线G X04 E-RING挡圈/非用于民用航空器维护和修理G X04 FET 2SK3868晶体管G X04 GROUND ASSY导线G X04 H NUT螺帽G X04 IMPELLER叶轮G X04 IMPELLER ASSY风叶G X04 M3 YPF SCREW螺钉/杆径小于等于6毫米G X04 MAGNET磁铁G X04 MAGNET (6-19.3L)磁铁G X04 MAGNET (6-34L)磁铁G X04 MAGNET (9-34L)磁铁G X04 MAGNET ASSY转动轮G X04 PARTITION PLATE固定板G X04 POWER IC SMA6821M(LF2451)驱动元件G X04 POWER IC SMA6822M(LF2451)驱动元件G X04 ROTOR MAGNET磁铁G X04 SHAFT转子轴G X04 SLINGER橡胶圈G X04 T-DIODE二极管G X04 TP温度继电器G X04 TP (L-F SERIES)熔断器G X04 TP HOLDER钢铁支架G X04 TP(V-F SERIES)熔断器G X04 WASHER垫圈/非用于民用航空器维护和修理G X04 WAVE WASHER垫圈/非用于民用航空器维护和修理G X04 YPF SCREW螺钉/杆径小于等于6毫米G X05 BACK YOKE环框G X05 BB轴承托架G X05 BB PAINT轴承托架G X05 BUSHING(A)导线固定器G X05 CASING (B)外壳G X05 CASING A外壳G X05 CONNECTOR接插件零件G X05 CONTACT(SVH-21T-P1.1)接插件零件G X05 COVER外盖G X05 DIODE二极管G X05 FAN风叶G X05 HALL ELEMENT HW-101A-FT半导体器件G X05 IMPELLER ASSY叶轮G X05 LEAD ASSY组合电线G X05 MAGNET磁铁G X05 MECHANICAL SEALS机械密封塞G X05 O-RING挡圈/非用于民用航空器维护和修理G X05 SHAFT转子轴G X05 SIN IC R5F21246SN080FP集成电路G X05 TP(12 SERIES)熔断器G X06 BB轴承托架G X06 BUSH橡胶圈G X06 CERAMIC CAPACITOR电容/片式多层瓷电介质G X06 CHIP RESISTOR电阻/片式G X06 CONNECTOR(VHR-5N)接插件零件G X06 E RING挡圈/非用于民用航空器维护和修理G X06 MAGNET (6-37L)磁铁G X06 O-RING挡圈/非用于民用航空器维护和修理G X06 OUTER COVER外盖G X06 PCB电路印刷板G X06 POWER IC TPD4102AK(LBR Q)驱动元件G X06 POWER IC TPD4102AK(LBRNDSS Q)驱动元件G X06 PTC THERMISTOR热敏电阻G X06 RIVET铆钉G X06 SEFUSE熔断器G X06 T-DIODE二极管G X06 TRANSISTOR晶体管（功率小于1瓦）G X06 WIRE CLAMP导线夹G X07 BB轴承托架G X07 HALL IC半导体器件G X07 HALL IC EW-432-PR半导体器件G X07 MECHANICAL SEALS机械密封塞G X07 PIN BLOCK接插件零件G X07 T-DIODE二极管G X07 TP温度继电器G X08 BM轴套G X08 CERAMIC CAPACITOR电容/片式多层瓷电介质G X08 YOKE MOLD风叶G X09 CERAMIC CAPACITOR电容/片式多层瓷电介质G X09 CHIP RESISTOR电阻/片式G X09 CHIP RESISTOR电阻/贴片式G X09 DISH W垫圈/非用于民用航空器维护和修理G X09 DRAIN CAP排水管盖G X09 M3.SCREW WITH WASHER螺钉/杆径小于等于6毫米G X09 PCB电路印刷板G X09 TP温度继电器G X09 TP HOLDER钢铁支架G X10 BALL B轴承G X10 CONDENSER电容/非片式单层塑料电介质G X11 CASING (A)外壳G X11 CERAMIC CAPACITOR电容/片式多层瓷电介质G X11 O-RING挡圈/非用于民用航空器维护和修理G X11 PCB ASSY电路板组件G X11 SCREW WITH WASHER螺钉/杆径小于等于6毫米G X12 BALL B轴承G X12 BAND导线夹G X12 BASE固定板G X12 CERAMIC CAPACITOR电容/片式多层瓷电介质G X12 CONDENSER电容/非片式单层塑料电介质G X12 IMPELLER叶轮G X12 MG SHROUD磁环G X12 SHAFT转子轴G X14 TP温度继电器G X15 BB轴承托架G X15 WASHER垫圈/非用于民用航空器维护和修理G X17 BALL B轴承G X17 WAVE W垫圈/非用于民用航空器维护和修理G X18 BALL B轴承G X19 BALL B轴承G X20 TP温度继电器G X22 BALL B轴承G X23 PCB ASSY电路板组件G X35 PCB ASSY电路板组件X00 50JN1300 T0.5*W151(深)非合金涂塑钢带/0.5*S*CX00 50JN1300 T0.5*W80.5(深)非合金涂塑钢带/0.5*S*CX00 50NCF(HR3104) T0.5*W87(深)非合金涂塑钢带/0.5*S*CX00 50NCF(HR3104) T0.5*W93(深)非合金涂塑钢带/0.5*S*CX00 50NC-FM T0.5*W100(深)非合金涂塑钢带/0.5*S*CX00 50NC-FM T0.5*W360(深)非合金涂塑钢带/0.5*S*CX00 50NC-FM T0.5*W60(深)非合金涂塑钢带/0.5*S*CX00 50NC-FM T0.5*W63(深)非合金涂塑钢带/0.5*S*CX00 50NC-FM T0.5*W83(深)非合金涂塑钢带/0.5*S*CX00 50NC-FM T0.5*W86(深)非合金涂塑钢带/0.5*S*CX00 50NC-FM T0.5*W98(深)非合金涂塑钢带/0.5*S*CX00 ALUMINIUM ALLOYS(D1V)铝锭X00 ALUMINIUM ALLOYS(RD23)铝锭X00 ALUMINUM SOLDER T-235焊锡棒X00 BALL B轴承X00 CAPACITOR电容/片式多层瓷电介质X00 CAPACITOR电容/非片式多层塑料电介质X00 CAPACITOR电容/非片式单层铝电介质X00 CERAMIC CAPACITOR电容/非片式多层瓷电介质X00 CONNECTOR接插件零件X00 DIODE二极管X00 ELECTRODE WT20 D1.6*150电极棒X00 FELT-TIP PEN K-199记号笔X00 FLUX EC-19S-8助焊剂X00 GFN3L-701改性聚苯醚胶粒X00 GREASE G747润滑油X00 GREASE UHI 64-2403润滑油X00 HALL IC EW-732半导体器件X00 HEMP STRING 16/6(8/3)麻线X00 IC SMA6010驱动元件X00 KNITTED TAPE NO341H胶带X00 LEAD ASSY组合电线X00 LOCKTITE 4211接着剂X00 M5 SCREW螺钉/杆径小于等于6毫米X00 MAGNET ASSY转动轮X00 MAGNET RESIN HM-1220KD塑磁材料X00 MAGNET RESIN TP-A27E(P2A)塑磁材料X00 MOLD RESIN 551HS聚对苯二甲酸丁二酯X00 OPERATIONAL AMPLIFIER半导体元件X00 PAINT涂料X00 PBT 3105A PBT塑胶粒X00 PBT(G15)PBT塑胶粒X00 PC BOARD电路印刷板X00 PCB电路印刷板X00 PHOTO COUPLER光电耦合器X00 POWER IC驱动元件X00 POWER IC ECN30105SP驱动元件X00 POWER IC ECN30601SP驱动元件X00 POWER IC TPD4103AK(LBR Q)驱动元件X00 PRAPASE凡士林X00 PTC THERMISTOR热敏电阻X00 PUSH MOUNT TIE导线夹X00 PVC AWG#18 1D(BLACK)套管X00 RADIATION SHEET散热片X00 RESISTOR(1.2K OHM)晶体管X00 ROTOR ASSY转动轮X00 RUBBER BAND NO.14橡皮筋X00 SARCON CASE护套X00 SC COIL线圈X00 SECC-TNA T1.2*W72电镀锌钢带/T=0.23-3.0MMX00 SILICON硅酮密封胶/克X00 SILICON GLASS TUBE D4.0套管X00 SILICON SE9186L RTV粘合剂X00 SILICON SE9187L粘合剂X00 SILICON TUBE HG-600E D3.5套管X00 SILICON TUBE HG-600E D4.0套管X00 T-DIODE二极管X00 TF FLUX助焊剂/克X00 TP温度继电器X00 TRANSISTOR晶体管（功率小于1瓦）X00 VASELINE (WHITE)凡士林X01 BAND导线夹X01 BUSHING导线固定器X01 CAPACITOR电容/非片式单层金属电介质X01 CAPACITOR电容/非片式单层铝电介质X01 CERAMIC CAPACITOR电容/片式多层瓷电介质X01 CERAMIC CAPACITOR电容/非片式多层瓷电介质X01 CERAMIC CHIP CAPACITOR电容/片式多层瓷电介质X01 CONNECTOR接插件零件X01 DIODE二极管X01 DIODE BRIDGE GBPC104L-6740二极管X01 EMI BEAD CORE滚珠芯X01 FET 2SJ360(TE12L F)晶体管（功率小于1瓦）X01 FET 2SK3342(Q)晶体管X01 H NUT螺帽X01 HALL IC DN8897半导体器件X01 M4 SCREW螺钉/杆径小于等于6毫米X01 MAGNET ASSY转动轮X01 MH5CAPACITOR(50)电容/非片式单层铝电介质X01 PCB电路印刷板X01 POST WITH BASE接插件零件X01 POWER ARRAY SMA5130(LF-1055)驱动元件X01 POWER IC驱动元件X01 ROTOR ASSEMBLY转动轮X01 ROTOR ASSY转子组件X01 RT ASSY转动轮X01 RT MOLD转子组件X01 THERMISTOR热敏电阻X01 TRANSISTOR晶体管（功率小于1瓦）X01 YXF CAPACITOR(50)电容/非片式多层铝电介质X01 YXF CAPACITOR(50)电容/非片式单层铝电介质X02 BUSHING导线固定器X02 CERAMIC CAPACITOR电容/片式多层瓷电介质X02 COVER外盖X02 EMI BEAD CORE滚珠芯X02 LEAD ASSY组合电线X02 LEAD JUMPER组合电线X02 MAGNET ASSY转动轮X02 Nd MAGNET磁铁X02 PC BOARD电路印刷板X02 PCB电路印刷板X02 POWER IC ECN30102SP-ver.2驱动元件X02 SPRING CATCHER接插件零件X02 TRANSISTOR晶体管（功率小于1瓦）X03 CAPACITOR电容/非片式单层铝电介质X03 HALL IC EW-412-PR半导体器件X03 HOLDER钢铁支架X03 MAGNET ASSY转动轮X03 PHOTO COUPLER光电耦合器X03 POST WITH BASE接插件零件X03 POWER IC ECN3018SP screening驱动元件X03 ROTOR ASSEMBLY转动轮X03 SPRING螺旋弹簧X03 TP温度继电器X05 MECHANICAL SEALS机械密封塞X07 CONDENSER电容/非片式单层塑料电介质X07 CONDENSER电容/非片式多层塑料电介质X07 BALL B轴承X08 CERAMIC CAPACITOR电容/片式多层瓷电介质X12 MAGNET ASSY转动轮X17 RESISTANCE电阻/柱式X17 RESISTOR电阻/片式。
IRLML6401TRPBF;中文规格书,Datasheet资料
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
100.0
2.0
-I D , Drain-to-Source Current (Α )
T J = 25°C
10.0
RDS(on) , Drain-to-Source On Resistance (Normalized)
0.1
20µs PULSE WIDTH Tj = 25°C
0.01 0.1 1 10 100
20µs PULSE WIDTH Tj = 150°C
0.01 0.1 1 10 100
-V DS , Drain-to-Source Voltage (V)
-VDS, Drain-to-Source Voltage (V)
1200 VGS = 0V, f = 1 MHZ Ciss = C gs + Cgd, C ds SHORTED Crss = C gd
10
ID = -4.3A VDS =-10V
1000
-VGS , Gate-to-Source Voltage (V)
C, Capacitance(pF)
800
Ciss
Min. Typ. Max. Units ––– ––– ––– ––– ––– ––– ––– ––– 22 8.0 -1.3 A -34 -1.2 33 12 V ns nC
Conditions MOSFET symbol showing the G integral reverse p-n junction diode. TJ = 25°C, IS = -1.3A, VGS = 0V TJ = 25°C, IF = -1.3A di/dt = -100A/µs
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LB11948TOverviewThe LB11948T is a low saturation voltage output PWM current control bipolar drive stepping motor driver. It is optimal for use as the driver for the miniature low-voltage stepping motors used in portable electronic equipment such as portable thermal printers.Features• PWM current control (external excitation)• Simultaneous on state prevention function (through current prevention) • Thermal shutdown circuit • Noise canceller function • Low-power mode control pinSpecificationsAbsolute Maximum Ratings at Ta = 25°CParameter SymbolConditionsRatings UnitVS supply voltageVS-0.3 to +18V Logic system supply voltage V CC-0.3 to +18VPeak output current I O peak tW ≤ 20μS 0.5 A Continuous output current I O max 0.4 A Emitter output voltage VE 1.0V Input voltageV IN-0.3 to V CCV Allowable power dissipation Pd max Mounted on the specified PCB* 1.2W Operating temperature Topg -20 to +85°C Storage temperatureTstg-40 to +150°CNote * : Specified PCB : 114.3×76.1×1.6mmMonolithic Digital ICPWM Constant Current Control 1-2 Phase Excitation Stepping Motor DriverRecommended Operating Conditions at Ta = 25°CUnit Parameter Symbol Conditions RatingsVS supply voltage VS 3.0 to 15VV CC supply voltage V CC 3.0 to 15VReference voltage VREFV CC≤ 4V 0.0 to 1.0VV CC> 4V 0.0 to 1.5VElectrical Characteristics Ta = 25°C, VS = V CC = 5V, VREF = 0.3VRatingsUnit Parameter Symbol Conditionsmin typ max[Output Block]VS system supply currentI VS OFF PH1 = PH2 = 0V, EN1 = EN2 = 3.0V, ST = 3.0V 5μAI VS ON PH1 = PH2 = EN1 = EN2 = 0V, ST = 3.0V 28 40 52mAI VS wt PH1 = PH2 = EN1 = EN2 = ST = 0V 1μAOutput saturation voltage 1 V O (sat) 1 I O = +0.2A (source) 0.2 0.4VOutput saturation voltage 2 V O (sat) 2 I O = +0.4A (source) 0.3 0.5VOutput saturation voltage 3 V O (sat) 3 I O = -0.2A (sink) 0.2 0.4VOutput saturation voltage 4 V O (sat) 4 I O = -0.4A (sink) 0.3 0.5VOutput leakage currentI O1 (leak) V O = V BB (sink) 50μAI O2 (leak) V O = 0V (source) -50 μAUpper and lower side output diodesForward voltage 1 (upper side) VF1 I = 400mA 0.9 1.1 1.3VForward voltage 2 (lower side) VF2 I = 400mA 0.9 1.1 1.3V[Logic Block]V CC system supply currentI CC OFF PH1 = PH2 = 0V, EN1 = EN2 = 3.0V, ST = 3.0V 6.5 10 13.5mAI CC ON PH1 = PH2 = EN1 = EN2 = 0V, ST = 3.0V 7 11 15mAI CC wt PH1 = PH2 = EN1 = EN2 = ST = 0V 1μAInput voltageV I on 2.0 VV I off 0.8VInput current I IN V IN = 5V 70 100 130μAReference voltage : 1V V1V I O = 1mA 0.95 1 1.05VCurrent setting reactive current IE -22 -17 -10.5mAReference current IREF VREF = 0.3V, VE = 0.3V -1 μACR pin current 1 ICR1 CR = 0.5V -2 μACR pin current 2 ICR2 CR = 3V 1.65 2.2 2.75mASense voltage 1 VSEN1 VREF = 0.5V 0.475 0.5 0.525VThermal shutdown temperature * TS * 170 °CNote * : Design guarantee valueTruth TableChannel 1 Channel 2InputInput Output Input OutputENABLE2 OUT2- OUT2 ST PHASE1ENABLE1 OUT1- OUT1 PHASE2H L L H L L L H LH H L L H H L L HH * H OFFOFFOFF * H OFFOFF L * * OFFOFF * * OFFNote * : Levels shown as an asterisk (*) can be set to be either high or low.Package Dimensionsunit : mm (typ) 3259Pin AssignmentTop viewAmbient temperature, Ta –°CA l l o w a b l e p o w e r d i s s i p a t i o n , P d m a x –WPin FunctionsPin No. Pin Name Description1 OUT1- Output2 OUT1 Output3 NC Unused4 NC Unused5 D-GND Lower side internal diode anode connection6 E1 Constant current control sensingThe motor current is set by the value of the sensing resistor Re connected between the E1 pin and ground.The current is set according to the following equation : I O = VREF/Re (A)powersupply7 VS1 VS8 NC Unused9 V CC V CC power supplyconnectionoscillator10 CR RC11 VREF1 Current setting system reference voltage inputVREF1 voltage range : 0 to 0.5V12 NC Unused13 ENABLE1 Output is turned on when ENABLE1 is low, and the output is turned off (operating state) when ENABLE1 is high.14 PHASE1 Logic level input : phase switchingWhen PHASE1 = high : Output pin states : OUT1 : high, OUT1- : low.When PHASE1 = low : Output pin states : OUT1 : low, OUT1- : high.15 ST Standby mode settingWhen ST = high : the IC operates in normal operating mode.When ST = low : the IC operates in standby mode. The VS and V CC current drain levels are under 1μA in this mode.16 NC Unused17 1VREG 1V regulator circuit outputThe LB11948 includes an internal 1V regulator circuit, and this pin is the output from that circuit. The VREF1 and VREF2reference voltages can be set by voltage dividing the 1V regulator output.18 PHASE2 Logic level input : phase switchingWhen PHASE2 = high : Output pin states : OUT2 : high, OUT2- : low.When PHASE2 = low : Output pin states : OUT2 : low, OUT2- : high.19 ENABLE2 Output is turned on when ENABLE2 is low, and the output is turned off (operating state) when ENABLE2 is high.20 VREF2 Current setting reference voltage inputVREF2 voltage range : 0 to 0.5V21 GND Ground (small signal circuit system ground)22 PGND Power system ground (high current circuit system ground)23 NC Unusedsupply24 VS2 VSpower25 E2 Constant current control sensingThe motor current is set by the value of the sensing resistor Re connected between the E2 pin and ground.The current is set according to the following equation : I O = VREF/Re (A)26 D-GND2 Lower side internal diode anode connection27 NC Unused28 NC Unused29 OUT2 Output30 OUT2- OutputBlock DiagramSample Application CircuitLogic level inputPHASE2200 HzPHASE1 90 degDrive Sequence Table2 Phase Excitation Drive SequenceTable 1 Clockwise driveENABLE1 OUT1 OUT1- PHASE2 ENABLE2 OUT2 OUT2-No. PHASE10 0 0 0 1 0 0 0 11 1 0 1 0 0 0 0 12 1 0 1 0 1 0 1 03 0 0 0 1 1 0 1 0Table 2 Counterclockwise driveENABLE1 OUT1 OUT1- PHASE2 ENABLE2 OUT2 OUT2-No. PHASE10 0 0 0 1 1 0 1 01 1 0 1 0 1 0 1 02 1 0 1 0 0 0 0 13 0 0 0 1 0 0 0 1 1-2 Phase Excitation Drive SequenceTable 3 Clockwise driveNo. PHASE1ENABLE1 OUT1 OUT1- PHASE2 ENABLE2 OUT2 OUT2-OFF0 0 0 0 1 0 1 OFF1 0 0 0 1 0 0 0 1OFF 0 0 0 12 1 1 OFF3 1 0 1 0 0 0 0 1OFF4 1 0 1 0 1 1 OFF5 1 0 1 0 1 0 1 0OFF 1 0 1 06 0 1 OFF7 0 0 0 1 1 0 1 0Table 4 Counterclockwise driveNo. PHASE1ENABLE1 OUT1 OUT1- PHASE2 ENABLE2 OUT2 OUT2-OFF0 0 0 0 1 1 1 OFF1 0 0 0 1 1 0 1 0OFF 1 0 1 02 1 1 OFF3 1 0 1 0 1 0 1 0OFF4 1 0 1 0 0 1 OFF5 1 0 1 0 0 0 0 1OFF 0 0 0 16 0 1 OFF7 0 0 0 1 0 0 0 1Switching Operation Timing Chart分销商库存信息: ONSEMILB11948T-TLM-E。