DELL_6_SIGMA_GB_TRAINING_7
Dell Technologies Boot Optimized Storage Solution-
Dell Technologies Boot Optimized Storage Solution-S2用户指南9 2020注意、小心和警告:“注意”表示帮助您更好地使用该产品的重要信息。
:“小心”表示可能会损坏硬件或导致数据丢失，并告诉您如何避免此类问题。
:“警告”表示可能会导致财产损失、人身伤害甚至死亡。
© 2020 Dell Inc. 或其子公司。
保留所有权利。
Dell、EMC 和其他商标是 Dell Inc. 或其附属机构的商标。
其他商标可能是其各自所有者的商标。
章 1: Dell Technologies Boot Optimized Storage Solution-S2 (5)BOSS-S2 卡的功能 (5)BOSS-S2 卡的技术规格 (6)支持的 BOSS-S2 卡的 M.2 驱动器 (7)BOSS-S2 支持的 PowerEdge 系统 (8)BOSS-S2 支持的操作系统 (8)章 2: BOSS-S2 支持的应用程序 (9)统一可扩展固件接口 RAID 配置实用程序 (9)Dell OpenManage Storage Management (9)BOSS-S2 命令行界面实用程序 (9)Integrated Dell Remote Access Controller 和生命周期控制器 (10)章 3: 更新 BOSS-S2 固件版本 (11)使用 Windows 更新包更新 BOSS-S2 (11)使用 Linux 更新 BOSS-S2 (11)使用 iDRAC 更新 BOSS-S2 (12)使用生命周期控制器更新 BOSS-S2 (12)章 4: BOSS-S2 的功能 (14)热插拔 PowerEdge 系统中的 M.2 驱动器 (14)通过使用 LED 识别 M.2 驱动器 (14)控制器固件更新 (14)VD 的外部导入 (15)使用 SMART 功能检测驱动器故障 (15)自动重新构建降级的驱动器 (15)支持非 RAID 驱动器 (15)SSD 上的 TRIM 功能 (15)擦除物理磁盘数据 (15)章 5: 安装和卸下 BOSS-S2 卡 (16)安全说明 (16)拆装计算机内部组件之前 (16)拆装系统内部组件之后 (16)卸下 BOSS-S2 模块 (17)安装 BOSS-S2 模块 (22)章 6: BOSS-S2 的驱动程序支持 (27)章 7: BOSS-S2 UEFI 配置实用程序 (28)进入 BOSS-S2 UEFI 配置实用程序 (28)退出 BOSS-S2 UEFI 配置实用程序 (28)导航到 BOSS-S2 配置实用程序 (29)物理或虚拟磁盘信息 (29)目录3查看物理磁盘信息 (29)查看虚拟磁盘信息 (29)导入外部虚拟磁盘并将其设置为 BOSS-S2 本机 (29)创建虚拟磁盘 (30)删除虚拟磁盘 (30)恢复或重新构建降级的虚拟驱动器 (30)擦除物理磁盘数据 (31)查看 RAID 控制器信息 (31)清除 RAID 控制器配置数据 (31)章 8: 使用 CLI 命令管理 BOSS-S2 (32)PowerEdge 服务器上支持的 BOSS-S2 CLI 命令 (32)在运行 Windows 操作系统的 PowerEdge 服务器上运行 BOSS-S2 CLI 命令 (32)在运行 Linux 操作系统的 PowerEdge 服务器上运行 BOSS-S2 CLI 命令 (33)在运行 ESXi 操作系统的 PowerEdge 服务器上运行 BOSS-S2 CLI 命令 (33)章 9: 故障处理 (34)在 VSphere 生命周期管理器中导入 BOSS ESXi CLI 离线捆绑包可能会失败 (34)从 Dell EMC 的自定义版本 6.7.x 升级到版本 7.0 时，BOSS ESXi CLI 软件包会失败 (34)当 BOSS-S2 控制器上具有现有的适配器密钥时，在未配置的驱动器上从 iDRAC 进行 M.2 驱动器固件更新失败 (35)BOSS-S2 控制器中未配置的驱动器对于具有现有的适配器密钥的操作系统安装不可用 (35)BOSS 的 ROM 版本在 iDRAC 界面中报告为固件版本 (35)无法使用 iDRAC 或生命周期控制器更新 M.2 驱动器固件 (35)在 Linux 中 BOSS-S2 CLI 显示未找到适配器错误 (35)LC 日志显示风扇不可用错误 (35)CSIOR 处于禁用状态时，iDRAC 上的物理磁盘大小未更新 (35)CSIOR 处于禁用状态时，物理磁盘或虚拟磁盘在 iDRAC 上指示为缺失 (36)HII 中的后台活动 (BGA) 任务进度不报告实时状态 (36)在 BOSS-S2 和 OMSS 中重复生成虚拟磁盘相关事件 (36)输入虚拟驱动器名称时字符数受限 (36)VMFS 数据存储在 YX5X PowerEdge 系统（在 BOSS-S2 上已安装 VMware ESXi）上已禁用 (36)操作系统未检测到一个或多个物理磁盘 (37)操作系统未检测到虚拟磁盘 (37)BOSS-S2 配置实用程序中未列出已安装的驱动器 (37)BOSS-S2 卡未呈现给 PowerEdge 服务器 (37)无法引导到插槽 1 中安装的 M.2 驱动器 (37)BOSS-S2 CLI 与 VMware CLI 应用工具一起显示不支持的命令、选项和功能 (37)无法在 BOSS-S2 的 RAID 1 上部署 ESXi (38)章 10: 获得帮助 (39)回收或停售服务信息 (39)联系戴尔 (39)通过 SupportAssist 接收自动支持 (39)章 11: 说明文件资源 (40)4目录Dell Technologies Boot Optimized StorageSolution-S2Dell Technologies Boot Optimized Storage Solution-S2 (BOSS-S2) 是一种 RAID 解决方案卡，专用于引导服务器的操作系统，该系统支持：●80 毫米 M.2 SATA 固态设备 (SSD)●带 PCIe 2.0 x 4 主机接口的 PCIe 卡SATA 第 3 代设备接口:有关与这些设备关联的安全、法规和人机工程学信息，以及有关 Integrated Dell Remote Access Controller (iDRAC) 或生命周 (LC) 远程管理的详细信息，请参阅平台文档。
戴尔EqualLogic PS6100X, PS6110X产品安全、EMC和环境数据表说明书
MARKETING NAME*: Dell EqualLogic PS6100X, PS6110X Dell Inc. REGULATORY MODEL: E04J REGULATORY TYPE: E04J001EFFECTIVE DATE: August 18, 2011TABLE OF CONTENTS FOR PRODUCT SAFETY, EMC & ENVIRONMENTAL DATASHEETRegulatoryI. Product SafetyII. Electromagnetic CompatibilityIII. Ergonomics, Acoustics, and Hygienics IV. Power Cords and User Documentation V. Datasheet Responsible Party Name and AddressVI. Trade Import/Export Compliance Data Environmental VII. System Dimension and WeightVIII. Declarations and CertificationsIX. Performance DataX. Product Materials InformationXI. PackagingXII. BatteriesXIII. Design for EnvironmentXIV. Recycling/End-of-Life Service Information XV. Dell Corporate Environmental InformationI. PRODUCT SAFETY1The product has been certified and bears the Mark, as applicable, of the Product Safety authorities as indicated below.Country/Region Authority or MarkArgentina IRAMBelarus BELLISCanada SCCCroatia KONCAREuropean Union CEGermany TUVSUDIECEE IECEE CBIsrael SIIKazakhstan OTAN–CKTKenya KEBSKuwait KUCASMexico NYCE (NOM)Moldova INSMNigeria SONCAPNorway NEMKORussia GOSTSaudi Arabia KSA ICCPSerbia KVALITETSouth Africa NRCSTaiwan BSMIUkraine UKRTESTUnited States NRTLUzbekistan STZ* Notice: This product has been assigned a unique regulatory model and regulatory type that is imprinted on the product shipping invoice and product labeling to provide traceability to the regulatory approvals noted on this datasheet. This datasheet applies to any product that utilizes the assigned regulatory model and type including marketing names other than those listed on this datasheet. Requests for specific information on product regulatory approvals should reference the assigned product regulatory model and type.1 The above-listed Product Safety certifications may vary depending upon the location of the factory and specific product configuration. Certification marks may not be applied on products for countries outside the purchaser’s country.II. ELECTROMAGNETIC COMPATIBILITY2The product has been certified and bears the Mark, as applicable, of the EMC authorities as indicated below.Country/Region Authority or Mark Class Australia / New Zealand ACMA (C-Tick)Class ABelarus BELLIS Class ABosnia & Herzegovina, Montenegro, Serbia KVALITET Class ACanada ICES Class ACroatia KONCAR Class AEuropean Union CE Class AIsrael SII Class AJapan VCCI Class A–CKT Class AKazakhstan OTANMoldova INSM Class ANorway NEMKO Class ARussia GOST Class ASouth Africa SABS Class ASouth Korea KC Class ATaiwan BSMI Class AUkraine UKRTEST Class AUnited States FCC Class AUzbekistan STZ Class AIII. ERGONOMICS, ACOUSTICS AND HYGIENICS3The product has been certified and bears the Mark, as applicable, of the Ergonomics, Acoustics and Hygienics authorities as indicated below.Country/Region Authority or MarkGermany GSIV. POWER CORDS AND USER DOCUMENTATIONDell products are provided with the power cord and user documentation suitable for the intended country of delivery. Products that are relocated to other countries should use nationally certified power cords and plugs to ensure safe operation of the product. Contact Dell to determine if alternate power cords or user documentation in other languages is available for your market.V. DATASHEET RESPONSIBLE PARTY NAME AND ADDRESSDell Inc.Department: Global Regulations and StandardsMS: PS4-30Round Rock, Texas 78682, USA******************************2 The above-listed EMC certifications may vary depending upon the location of the factory and specific product configuration. Certification marks may not be applied on products for countries outside the purchaser’s country.3 The above-listed Ergonomics, Acoustics and Hygienics certifications may vary depending upon the location of the factory and specific product configuration. Certification marks may not be applied on products for countries outside the purchaser’s country.VI. TRADE (IMPORT/EXPORT) COMPLIANCE DATAFor any questions related to importing & exporting classification of Dell products, please obtain information from the following link: /import_export_compliance or send request to*****************************VII. SYSTEM DIMENSION AND WEIGHTDepth, mm Width,mmHeight,mmWeight, kgProductRegulatoryModel #508 446 87 23.31 E04JVIII. DECLARATIONS AND CERTIFICATIONSThis system received the following approvals and may be labeled with one or more of these marks depending on point of purchase:Dell’s Energy Star qualified products are listed on the EPA website hereInformation on Dell’s participation in various Eco-labels and Green Standards can be found here.IX. PERFORMANCE DATAEnergy Consumption4Energy efficiency benefits the environment and lowers the total cost of equipment ownership by reducing power consumption. Dell offers energy calculators that help estimate power needs, potential emissions avoidance and potential cost savings. Click here for Dell’s Client Energy Savings Calculator, Data Center Capacity Planner, and Monitor Power Savings Calculator. Information on Energy Efficiency is available hereX. PRODUCT MATERIALS INFORMATION5Dell has implemented process controls and corrective actions throughout its organization and supply chain to ensure that its chemicals management objectives are met — and that the targeted restricted materials arereplaced and alternative materials are developed for future product generations. Process controls that Dellimplemented include piece-part supplier declarations and Dell factory and supplier material testing audits.To review Dell’s Restricted Material Guidance document click here.Information on Dell’s material use is available here.4 This document is informational only and reflects laboratory performance. Your product may perform differently, depending on the software, components and peripherals you ordered. Accordingly, the customer should not rely upon this information in making decisions about electrical tolerances or otherwise. No warranty as to accuracy or completeness is expressed or implied.5Waste Handling. Local regulations should be observed when disposing of this product due to the presence of the materials and substances as listed above.Restricted SubstancesThrough internal design controls and supply chain declarations, this system has been verified to comply with the EU RoHS Directive. For more details, see /rohsinfo.All Dell products shipping directly into China which are manufactured on or after March 1st, 2007, will be China RoHS compliant. For more details, see /chinarohs.All Dell products shipping to South Korea are compliant with South Korea RoHS requirements, declarations here. Information on Japan RoHS (J-MOSS) chemical disclosures is available here.REACH (Registration, Evaluation, Authorization and Restriction of Chemicals, 1907/2006) is the European Union’s (EU) chemical substances regulatory framework. Dell complies with the REACH directive. For more details, see /REACHThis Dell product does NOT contain any of the following substances (in concentrations exceeding legal threshold limits):∙ Asbestos∙Azo dyes/colorants in components that come into direct contact with human skin∙Cadmium and its compounds (except for use in applications exempted by the EU RoHS Directive)∙Ozone Depleting Substances; Class I and Class II CFCs (chlorofluorocarbons) and HCFCs (hydrofluorocarbons)∙Chloroparaffins, short chained (10-13 carbon chain)∙Chromium VI and its compounds (except for use in applications exempted by the EU RoHS Directive)∙Halogenated dioxins or furans (i.e. polychlorinated dibenzodioxines, polychlorinated dibenzofurans)∙Lead and its compounds (except for use in applications exempted by the EU RoHS Directive)∙Mercury (except for use in applications exempted by the EU RoHS Directive)∙Nickel and its compounds in components that are likely to result in prolonged skin exposure(polychlorobiphenyls)∙ PCBs(polychloroterphenyls)∙ PCTs(polybromobiphenyls)∙ PBBs∙PBDEs (polybrominated diphenylethers)∙BFR (brominated flame retardants) and PVC (polyvinyl chloride) in plastic parts greater than 25 grams ∙Polychlorinated naphthalenes (PCNs)∙Tributyl tin (TBT)∙Triphenyl tin (TPT)Additional Materials Information∙External and/or Internal cables may use PVC as an insulating material to ensure product safety∙The case material is, >PC+ABS <∙Product may contain post-industrial recycled content (plastics, metal, glass)∙This product contains 0% post-consumer recycled plastic∙Materials that may require special handling, please see WEEE Product End-of-Life Instructions here∙Marking of plastic parts greater than 25 grams are done in accordance with ISO 11469 (see below) Flame Retardants Used in MotherboardRetardantPart FlameMotherboard TBBPAFlame Retardants Used in Mechanical Plastic Parts > 25 gramsResin MaterialName Marking perISO11469:2000,11469:1996Flame RetardantMarking per ISO1043-4 (i.e. FR(16),FR(40), etc.)Flame Retardant(i.e. TBBPA, triarylphosphate ester,etc.)List applicableR-Phrase(s) orHazardStatement(s) perEU Directive67/548/EEG or1272/2008PC+ABS >PC+ABSFR(40)<FR(40)TPP(Triphenyl phosphate)N/AXI. PACKAGINGInformation on Dell’s sustainable packaging effort available here.No CFCs (chlorofluorocarbons), HCFCs (hydrofluorocarbons) or other ozone depleting substances are used in packaging material. Chromium, lead, mercury, cadmium are not intentionally added to packaging materials and are not present in a cumulative concentration greater than 100 ppm as incidental impurities. No halogenated plastics or polymers are used for packaging material. Dell complies with the EU Directive 94/62/EEC. Plastics packaging materials marked according to SPI (Society of Plastics Industry) Coding System.Additional materials restricted in Packaging as per Dell’s Restricted Material Guidance document found here.Packaging Materials for ModelE04J Total Weightof eachMaterialtype, (kg)% of Post-Consumer Recycled Content (PCR)APJ region DAO region EMEA regionCorrugated Fiberboard 5.80EPE 1.20Printed user documentation is bleached in a chlorine-free process.XII. BATTERIESBelow is a listing of batteries that could be present in the product:Battery Description – Internal Batteries Battery Type Battery Weight (kg) CR-2032 coin (button) cell Lithium Metal 0.003 ∙Batteries used in this product are in compliance with EU Battery Directive 2006/66/EC.∙Batteries in this product are not based on mercury, lead or cadmium technologies.∙Information about takeback and the recycling of batteries can be found in the in the Recyclability section below.∙The product documentation includes instructional information on the proper removal and disposal of the batteries used in this product.∙Dell MSDS sheets available here.XIII. DESIGN FOR ENVIRONMENTandUpgradingLongevityDell systems are, when applicable, designed for easy assembly, disassembly, and servicing. Connections are easy to find and accessible with commonly available tools. To extend the life of your system, you can install or upgrade certain system components (e.g., microprocessor, memory, expansion cards, optical drives, and storage devices). Spare parts (such as batteries, power supplies, keyboard parts) are available after the end of production for up to five years, or otherwise through the warranty period.RecyclabilityInformation for recycling is available here.For recyclability, this system incorporates the following design guidelines:∙EU WEEE mark is applied to products sold in Europe, EU recycling information can be found at /recycling∙WEEE Product End-of-Life Instructions are available here∙Plastic parts heavier than 25g have material codes according to ISO 11469:2000.∙Minimal use of composite structure materials.∙Minimal use of non-separable connections, such as gluing and welding between different materials∙Painting/coating of plastics <100 grams is compatible with recycling or reuse∙Mechanical plastic parts greater than 100 grams consist of one material or of easily separable materials.XIV. RECYCLING/ END-OF-LIFE SERVICE INFORMATIONTake back and recycling services are offered for this product in certain countries. If you want to dispose of system components, contact Dell for instructions by emailing *********************** or visit/recyclingworldwide and select the relevant country.XV. DELL CORPORATE ENVIRONMENTAL INFORMATIONInformation on Dell’s Environmental initiatives, policies, programs and goals can be found at/environment.Dell’s Corporate Responsibility Policies are available here.Product Safety, EMC and Environmental Datasheets for Dell products are located at:/regulatory_compliance_datasheetsDell is a member of the Electronic Industry Citizenship Coalition ()Dell’s commitment to accountability and assurance is further demonstrated in leveraging the Global Reporting Initiatives (GRI) G3 Guidelines in the preparation of our annual summary report and Web site. We are self-reporting at a B level and have submitted our self-report to GRI to check it against the criteria for GRI Application Level B. To view GRI Index 2009 click here.Dell holds International Organization for Standardization (ISO) and Occupational Health & Safety Assessment Series (OHSAS) certifications/registrations in a number of important areas including global product development and recycling/take-*back programs, quality, safety, and health and environment. You can view or download copies of certificates here.Information related to Supplier Responsibility is available here.。
Dell PowerEdge 6 Gbps SAS HBA 和內接式磁帶 配接器 使用者指南说明书
Dell PowerEdge 6 Gbps SASHBA 和內接式磁帶配接器使用者指南註、警示與警告註: 「註」表示可以幫助您更有效地使用電腦的重要資訊。
警示: 「警示」表示若沒有遵從指示，可能導致硬體損壞或資料遺失。
警告：「警告」表示有可能會導致財產損失、人身傷害甚至死亡。
________________________________________本出版品中的資訊如有變更，恕不另行通知。
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本文中使用的商標：Dell™、DELL 徽標、PowerEdge™ 和 OpenManage™ 是 Dell Inc. 的商標；Microsoft®、Windows®和 Windows Server®是 Microsoft Corporation 在美國及/或其他國家/地區的商標或註冊商標；SUSE®是 Novell Inc. 在美國及其他國家/地區的註冊商標；Red Hat®和 Red Hat Enterprise Linux®是 Red Hat, Inc. 在美國和其他國家/地區的註冊商標。
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UCS-71、UCS-70 和 UCSM-702012 年 02 月 Rev. A00目錄1概觀 (5)硬體架構 (6)作業系統支援 (7)相關說明文件 (7)與 Dell 聯絡 (7)2PowerEdge 6 Gbps SAS HBA和內接式磁帶配接器功能 (9)LED 連接埠活動功能僅適用於 6 Gbps SAS HBA (11)3硬體安裝 (13)安裝 6 Gbps SAS HBA 和內接式磁帶配接卡 (13)4驅動程式安裝 (17)安裝 Windows 驅動程式 (17)建立驅動程式媒體 (17)預安裝要求 (18)在安裝 Windows Server 2003作業系統時安裝驅動程式 (19)在安裝 Windows Server 2008 或 WindowsServer 2008 R2 時安裝驅動程式 (20)為新的控制器安裝 Windows Server 2003、Windows Server 2008 或 Windows Server 2008R2 驅動程式 (20)目錄3更新 Windows 驅動程式 (21)安裝 Linux 驅動程式 (22)安裝支援 DKMS 的 RPM 套裝軟體 (22)升級核心 (23)5 6 Gbps SAS HBA BIOS (25)POST 訊息 (25)BIOS 錯誤代碼訊息 (25)組態公用程式 (26)使用組態公用程式 (26)組態公用程式功能 (26)結束螢幕 (26)6故障排除 (27)一般問題 (27)組態公用程式錯誤訊息 (27)BIOS 錯誤訊息 (28)7更新韌體 (33)韌體套件更新公用程式 (33)4目錄概觀Dell PowerEdge 6 Gbps SAS HBA 和內接式磁帶配接卡為 Dell 序列連接 SCSI (SAS) 控制器解決方案的一部份。
戴尔EMC Data Domain 硬件功能和规格指南 6.2说明书
Dell EMC Data Domain Hardware Features and Specifications Guide版本 6.2302-004-902修订版 02版权所有© 2018 Dell Inc. 或其子公司。
保留所有权利。
发布日期: 2018年 12 月戴尔确信本出版物在发布之日内容准确无误。
本出版物中的信息可随时更改而不另行通知。
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使用、复制或分发本出版物所描述的任何戴尔软件都要有相应的软件许可证。
Dell、EMC 和其他商标为 Dell Inc. 或其子公司的商标。
其他商标可能是其各自所有者的资产。
中国印刷。
易安信电脑系统（中国）有限公司中国北京朝阳区霄云路 38 号现代汽车大厦 15 层邮编：100027电话：（8610）8438 6000 传真：（8610）8453 8174 售前服务热线：400 650 6006/zh-cn/index.htm2Data Domain Hardware Features and Specifications Guide6.2913DD220017DD2200 系统功能 (18)DD2200 系统规格 (18)DD2200 存储容量.......................................................................................19前面板........................................................................................................20磁盘驱动器....................................................................................20前端 LED 指示灯............................................................................20后面板.........................................................................................................21电源单元........................................................................................21板载接口和 LED.. (22)I/O 模块和插槽分配 (24)FC I/O 模块选项............................................................................24以太网 I/O 模块选项......................................................................24内部系统组件..............................................................................................24冷却风扇. (25)DIMM 模块 (25)DD250027DD2500 系统功能 (28)DD2500 系统规格 (28)DD2500 存储容量.......................................................................................29前面板........................................................................................................30磁盘驱动器....................................................................................30前端 LED 指示灯............................................................................30后面板.........................................................................................................31电源单元........................................................................................31板载接口和 LED.. (32)I/O 模块和插槽分配 (33)FC I/O 模块选项............................................................................33以太网 I/O 模块选项......................................................................33内部系统组件..............................................................................................33冷却风扇. (34)DIMM 模块 (34)DD330035DD3300 系统功能 (36)DD3300 系统规格 (36)DD3300 存储容量.......................................................................................38前面板........................................................................................................38左侧控制面板.................................................................................39右侧控制面板.................................................................................41正面磁盘........................................................................................43服务标签. (43)图表第1章第2章第3章目录Data Domain Hardware Features and Specifications Guide 6.2 3后面板...........................................................................................44后面板........................................................................................................49产品序列号标签 (PSNT)................................................................51后端 SSD. (51)NIC 指示灯....................................................................................52电源指示灯 (52)DD420055DD4200 系统功能 (56)DD4200 系统规格 (57)DD4200 存储容量.......................................................................................58前面板........................................................................................................58电源单元........................................................................................59交流电源扩展模块.........................................................................59冷却风扇........................................................................................60固态驱动器....................................................................................60前端 LED 指示灯............................................................................60后面板.. (63)I/O 模块 LED.................................................................................63管理模块和接口.. (63)I/O 模块和插槽分配...................................................................................65插槽添加规则................................................................................65内部系统组件. (67)DIMM 模块 (67)DD450069DD4500 系统功能 (70)DD4500 系统规格 (71)DD4500 存储容量.......................................................................................72前面板........................................................................................................72电源单元........................................................................................73交流电源扩展模块..........................................................................73冷却风扇........................................................................................74固态驱动器....................................................................................74前端 LED 指示灯............................................................................74后面板 (77)I/O 模块 LED.................................................................................77管理模块和接口.. (77)I/O 模块和插槽分配....................................................................................79插槽添加规则.................................................................................79内部系统组件. (81)DIMM 模块 (81)DD630083DD6300 系统功能 (84)DD6300 系统规格 (84)DD6300 存储容量 (85)DD6300 前面板..........................................................................................86前端 LED 指示灯............................................................................87后面板.. (88)DD6300 后端固态驱动器...............................................................88背面 LED 指示灯. (88)I/O 模块 (91)第4章第5章第6章目录4Data Domain Hardware Features and Specifications Guide 6.2I/O 模块填充规则..........................................................................92内部系统组件.............................................................................................94DIMM 概述....................................................................................94DD680097DD6800 系统功能.......................................................................................98DD6800 系统规格.......................................................................................99DD6800 存储容量.......................................................................................99DD6800 前面板.........................................................................................100前端 LED 指示灯..........................................................................100后面板.......................................................................................................102背面 LED 指示灯..........................................................................102I/O 模块....................................................................................................105I/O 模块填充规则.........................................................................106内部系统组件............................................................................................108DIMM 概述...................................................................................108DD7200111DD7200 系统功能......................................................................................112DD7200 系统规格......................................................................................113DD7200 存储容量......................................................................................114前面板.......................................................................................................114电源单元.......................................................................................115交流电源扩展模块.........................................................................115冷却风扇.......................................................................................116固态驱动器...................................................................................116前端 LED 指示灯...........................................................................116后面板.......................................................................................................119I/O 模块 LED................................................................................119管理模块和接口............................................................................119I/O 模块和插槽分配...................................................................................121插槽添加规则................................................................................121内部系统组件............................................................................................123DIMM 模块...................................................................................123DD9300125DD9300 系统功能.....................................................................................126DD9300 系统规格......................................................................................127DD9300 存储容量......................................................................................127DD9300 前面板.........................................................................................128前端 LED 指示灯..........................................................................128后面板.......................................................................................................130背面 LED 指示灯..........................................................................130I/O 模块....................................................................................................133I/O 模块填充规则.........................................................................134内部系统组件............................................................................................136DIMM 概述...................................................................................136DD9500139系统功能 (140)系统规格....................................................................................................141DD9500 存储容量. (142)前面板.......................................................................................................144第7章第8章第9章第10章目录Data Domain Hardware Features and Specifications Guide 6.2 5前端 LED 指示灯...........................................................................144固态驱动器...................................................................................147后面板.......................................................................................................148电源单元......................................................................................148管理模块......................................................................................149背面 LED 指示灯..........................................................................150可用 I/O 模块................................................................................151以太网 I/O 模块选项....................................................................152光纤通道 I/O 模块........................................................................152SAS I/O 模块...............................................................................152I/O 模块插槽分配......................................................................................152插槽添加规则...............................................................................154内部系统组件.. (155)DIMM 模块...................................................................................157冷却风扇.. (157)DD9800159DD9800 系统功能.....................................................................................160DD9800 系统规格......................................................................................161DD9800 存储容量.....................................................................................162DD9800 前面板.........................................................................................164前端 LED 指示灯..........................................................................164固态驱动器...................................................................................167后面板.......................................................................................................168电源单元......................................................................................168管理模块......................................................................................169背面 LED 指示灯...........................................................................170可用 I/O 模块................................................................................171以太网 I/O 模块选项.....................................................................172光纤通道 I/O 模块 (172)SAS I/O 模块................................................................................172I/O 模块插槽分配......................................................................................172插槽添加规则...............................................................................174内部系统组件.. (175)DIMM 模块...................................................................................177冷却风扇 (177)ES30179ES30 概述.................................................................................................180ES30 现场要求..........................................................................................180ES30 硬件规格..........................................................................................181前面板.......................................................................................................181后面板.......................................................................................................183端口. (185)DS60187DS60 概述.................................................................................................188DS60 现场要求..........................................................................................188DS60 硬件规格..........................................................................................189DS60 前面板 ............................................................................................190后面板.......................................................................................................191磁盘存储模块内部 .....................................................................................191扩展盘架缆线.. (195)第11章第12章第13章目录6Data Domain Hardware Features and Specifications Guide 6.2端口 (196)FS15197FS15 SSD 驱动器概述...............................................................................198现场要求...................................................................................................198FS15 硬件规格...........................................................................................199FS15 前面板.............................................................................................200后面板.......................................................................................................201状态 LED.. (204)第14章目录Data Domain Hardware Features and Specifications Guide 6.27目录8Data Domain Hardware Features and Specifications Guide6.2前面板组件.................................................................................................................20磁盘 LED 和系统 LED.................................................................................................20显示亮起的系统电源 LED 的挡板................................................................................21机箱背面的功能部件...................................................................................................21电源单元 LED.............................................................................................................22板载接口和 LED..........................................................................................................22SP 模块系统俯视图....................................................................................................25已卸下空气导管的 SP 模块的俯视图..........................................................................25前面板组件.................................................................................................................30磁盘 LED 和系统 LED.................................................................................................30显示亮起的系统电源 LED 的挡板................................................................................31机箱背面的功能部件...................................................................................................31电源单元 LED.............................................................................................................32板载接口和 LED..........................................................................................................32SP 模块系统俯视图.....................................................................................................34已卸下空气导管的 SP 模块的俯视图...........................................................................34前面板........................................................................................................................39左侧控制面板.............................................................................................................40右侧控制面板..............................................................................................................42磁盘 LED 指示灯.........................................................................................................43服务标签.....................................................................................................................44后面板........................................................................................................................442 个 10 GbE 模块........................................................................................................454 个 16 Gbps FC 模块..................................................................................................46PSNT 位置..................................................................................................................46磁盘 LED 指示灯.........................................................................................................47NIC 指示灯..................................................................................................................47电源 LED 指示灯.........................................................................................................48后面板........................................................................................................................492 个 10 GbE 模块........................................................................................................504 个 16 Gbps FC 模块.................................................................................................50PSNT 位置..................................................................................................................51磁盘 LED 指示灯.........................................................................................................51NIC 指示灯.................................................................................................................52电源 LED 指示灯.........................................................................................................53前面板组件.................................................................................................................59系统 LED 指示灯.........................................................................................................60系统 LED 图例标签......................................................................................................61电源 LED.....................................................................................................................61风扇和 SSD LED.........................................................................................................62机箱背面的功能部件...................................................................................................63管理模块上的接口......................................................................................................64已卸下 SP 盖板的 SP 模块的俯视图...........................................................................67前面板组件.................................................................................................................73系统 LED 指示灯.........................................................................................................74系统 LED 图例标签.....................................................................................................75电源 LED....................................................................................................................75风扇和 SSD LED.........................................................................................................76机箱背面的功能部件...................................................................................................77管理模块上的接口.......................................................................................................78已卸下 SP 盖板的 SP 模块的俯视图............................................................................81前端 LED 指示灯.........................................................................................................87背面 LED 指示灯 (88)1234567891011121314151617181920212223242526272829303132333435363738394041424344454647484950515253图Data Domain Hardware Features and Specifications Guide 6.2 9I/O 模块电源/服务 LED 位置......................................................................................90板载网络端口 LED.......................................................................................................91I/O 模块插槽编号........................................................................................................91CPU 和内存的位置.....................................................................................................94前端 LED 指示灯........................................................................................................101背面 LED 指示灯.......................................................................................................102I/O 模块电源/服务 LED 位置....................................................................................104板载网络端口 LED.....................................................................................................105I/O 模块插槽编号......................................................................................................105CPU 和内存的位置....................................................................................................108前面板组件................................................................................................................115系统 LED 指示灯........................................................................................................116系统 LED 图例标签.....................................................................................................117电源 LED....................................................................................................................117风扇和 SSD LED........................................................................................................118机箱背面的功能部件..................................................................................................119管理模块上的接口.....................................................................................................120已卸下 SP 盖板的 SP 模块的俯视图..........................................................................123前端 LED 指示灯.......................................................................................................129背面 LED 指示灯.......................................................................................................130I/O 模块电源/服务 LED 位置.....................................................................................132板载网络端口 LED.....................................................................................................133I/O 模块插槽编号......................................................................................................133CPU 和内存的位置....................................................................................................136前面板组件................................................................................................................144服务 LED...................................................................................................................145电源按钮...................................................................................................................146前端 LED...................................................................................................................146SSD 驱动器...............................................................................................................147机箱背面的功能部件.................................................................................................148序列号标签位置.........................................................................................................148四个电源...................................................................................................................149管理模块...................................................................................................................1491000BaseT 以太网端口.............................................................................................150后端 LED 指示灯.......................................................................................................150电源 LED....................................................................................................................151NVRAM 和 I/O 模块的位置.......................................................................................153SP 模块 ....................................................................................................................156释放内存扩展板 ........................................................................................................156打开风扇托架............................................................................................................157前面板组件................................................................................................................164服务 LED...................................................................................................................165电源按钮...................................................................................................................166前端 LED...................................................................................................................166SSD 驱动器...............................................................................................................167机箱背面的功能部件.................................................................................................168序列号标签位置.........................................................................................................168四个电源...................................................................................................................169管理模块...................................................................................................................1691000BaseT 以太网端口..............................................................................................170后端 LED 指示灯.......................................................................................................170电源 LED....................................................................................................................171NVRAM 和 I/O 模块的位置........................................................................................173SP 模块 ....................................................................................................................176释放内存扩展板 ........................................................................................................176打开风扇托架. (17754555657585960616263646566676869707172737475767778798081828384858687888990919293949596979899100101102103104105106107108109)图10Data Domain Hardware Features and Specifications Guide 6.2。
Dell Optimizer 用户指南说明书
Dell Optimizer 1.2 版用户指南注意、小心和警告:“注意”表示帮助您更好地使用该产品的重要信息。
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章 1: 概览 (4)Supported operating system (4)章 2: 安装、卸载和升级 Dell Optimizer 戴尔智能调优软件 (5)Install Dell Optimizer using Dell Update Package (5)卸载 Dell Optimizer (5)使用戴尔安装程序升级 Dell Optimizer 戴尔智能调优软件 (5)使用“Dell Command | Update”升级 Dell Optimizer 戴尔智能调优软件 (6)章 3: Dell Optimizer 使用入门 (7)分析 (7)工作量分析 (7)系统分析 (8)系统诊断 (8)应用程序 (9)优化应用程序 (9)音频 (9)优化音频 (9)电源 (10)优化电源 (10)接近传感器 (11)配置接近传感器 (11)性能馈送 (11)首选项 (11)章 4: 管理 (12)使用命令提示符安装 Dell Optimizer (12)安装模式 (12)使用命令提示符卸载 Dell Optimizer (13)使用 System Center Configuration Manager 更新功能升级 Dell Optimizer 戴尔智能调优软件 (13)创建日志文件 (13)用于 Dell Optimizer 的命令行界面 (13)WMI 提供程序 (16)章 5: 反馈 (18)章 6: 常见问题 (19)应用程序优化常见问题 (19)应用程序消息常见问题 (19)安装常见问题 (19)章 7: 联系戴尔 (21)目录3概览Dell Optimizer 戴尔智能调优软件是一个软件应用程序，通过使用人工智能和机器学习来智能地优化系统性能。
DELL6SIGMAGBTRAINING7-2
• You can be positive!
• Read comments posted on your problem statement
• Revisit your problem statement • Modify to address suggestions
As is:
? ?
Desired state:
? !
Copyright © 2002 Dell Computer Corporation
8
Revision 052802
COPIS
•Information flow from customers •Product flow from suppliers
6
Revision 052802
Class Exercise: Problem Statement
• On a flip chart paper, write your:
• Name • Project title • As-is and desired-state problem statement for your BPI Project
• Brief (1or 2 sentences long)
Copyright © 2002 Dell Computer Corporation
5
Revision 052802
As-Is and Desired State Problem Statements
• As-is problem statement PTT, Definition
Pull
六西格玛绿带训练
团队纲领要项 绘制过程图 分析工具介绍 提出改善方案 发展管制方法
5
6σ简介
5 DMAIC简介
4
6σ 专案选3择
3
6σ 展开及角色
2
6σ背景及应用
1
什么是6σ
6
什么是6σ
5 DMAIC简介
4
6σ 专案选3择
3
6σ 展开及角色
2
6σ背景及应用
1
什么是6σ
7
什么是6σ?
❖ 6σ是一种大幅度提高顾客满意和股东持股 价值的工具，它透过减少我们业务中各方面 的变异来实现目标。
26
过程主角色 (Process Owner)
.日常管理或负责相应BB/GB项目过程绩效者 .改善前后数据真实性的确认,改善阶段组织执 行及日常维持改善措施,管制阶段日常维持改 善措施
27
专案选择
5 DMAIC简介
4
6σ 专案选3择
3
6σ 展开及角色
2
6σ背景及应用
1
什么是6σ
28
Y=f(x)关系
14
6σ背景
6σ实施的公司举例 •联合信号Honeywell •美国快递 •Sun Microsystems •Dell •杜邦 •诺基亚
•花旗银行 •福特汽车 •Sony •Toshiba •柯达 .....
15
6σ适用于
销售
客户经验
设计
财务
6σ
工程
培训
服务/支援
制造
…Everyone﹗
16
6σ为什么不一样
8
6σ的目标与路径循环
增加净收入 与股东价值
顾客满意
减少缺点
提高满意度
戴尔易安信部署和配置指南 戴尔易安信 AMD EPYC (Naples) 处理器的 NUMA 配置说
Dell EMC NUMA Configuration for AMD EPYC (Naples) ProcessorsDell EngineeringFebruary 2018RevisionsThe information in this publication is provided “as is.” Dell Inc. makes no representations or warranties of any kind with respect to the inform ation in this publication, and specifically disclaims implied warranties of merchantability or fitness for a particular purpose.Use, copying, and distribution of any software described in this publication requires an applicable software license.Copyright © 2018 Dell Inc. or its subsidiaries. All Rights Reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be the property of their respective owners. Published in the USA [4/16/2018] [Deployment and Configuration Guide]Dell believes the information in this document is accurate as of its publication date. The information is subject to change without notice.2 Dell EMC NUMA Configuration for AMD EPYC (Naples) Processors | version 1.0Table of contents Revisions (2)Executive summary (4)1AMD EPYC Architecture (5)1.1Zeppelin Die Layout (5)1.2Memory Interleaving (6)1.2.1Memory Interleaving Rules (6)1.2.2NUMA Domains per Memory Interleave Option (6)2Performance Tuning (8)2.1Memory DIMM Population Guidelines (8)2.2PCIe Configuration Guidelines (9)3BIOS Setup (10)4Platform Specific NUMA/Die Domain Details (11)5Technical support and resources (13)5.1Dell (13)5.2AMD (13)Executive summaryWith the introduction of AMD’s EPYC (Naples) x86 Server CPUs featuring four Zeppelin dies per packagethere is a need to clarify how AMD’s new silicon design establishes Non-Uniform Memory Access (NUMA)domains across dies and sockets.The goal of this Dell EMC Deployment and Configuration Guide is demonstrate how Dell EMC Serversleverages AMD’s EPYC CPUs to configured NUMA domains for optimal performance by using Dell EMCBIOS Settings.4 Dell EMC NUMA Configuration for AMD EPYC (Naples) Processors | version 1.01AMD EPYC Architecture1.1Zeppelin Die LayoutAMD EPYC is a Multi-Chip Module (MCM) processor and per silicon package there are four ZeppelinSOCs/dies leveraged from AMD Ryzen. Each of the four dies have direct Infinity Fabric connections to each of the other dies as well as a possible socket-to-socket interconnect. This design allows, at most, four NUMA nodes per socket or eight NUMA nodes in a dual sockets systemAMD EPYC processor’s four dies each have two Unified Memory Controllers (UMC), that each control one DDR channel with two DIMMs per channel, along with one controller for IO, as shown in Figure 1 below:Channel 0Channel 1Channel 4Channel 5Channel 2Channel 3Channel 6Channel 7IOIOIO IOFigure 1 Zeppelin Die Layout1.2 Memory InterleavingThe Memory Interleave feature for AMD EPYC processors is what controls how may NUMA domains aregenerated. AMD EPYC processors support 4 memory interleaving options. Each option becomes availablebased on system configuration.∙Socket Interleaving (2 processor configurations)∙Die Interleaving∙Channel Interleaving∙Memory Interleaving disabled1.2.1 Memory Interleaving RulesThe following are the rules for each memory interleave option:∙The system can socket interleave, but only if all channels in the entire system have the same amount of memory. Die interleaving must be enabled as well.∙The system can die interleave, but only if all channels on the socket have the same amount of memory. Channel interleaving must be enabled as well.∙The system can channel interleave as long as both channels have at least one DIMM. The channels do not have to be symmetrical. This is the default configuration.∙No interleave at all, where each channel is stacked on top of the previous channel. However, it should be noted that probe filter performance may be affected if there is one UMC with less memory than theother UMC on the same die.1.2.2 NUMA Domains per Memory Interleave OptionAMD’s new silicon architecture adds nuances on how to configure platforms for NUMA. The focus of AMDsscheme to NUMA lies within its quad-die layout and its potential to have four NUMA domains.Socket Interleaving is the only memory interleave option meant for inter-socket memory interleaving, and isonly available with 2-processor configurations. In this configuration memory across both sockets will be seenas a single memory domain producing a non-NUMA configuration.Die Interleaving is the intra-socket memory interleave option that creates one NUMA domain for all the fourdies on a socket. In a 2-processor configuration this will produce two NUMA domains, one domain pertainingto each socket providing customers with the first option for NUMA configuration. In a 1-processorconfiguration die interleaving will be the maximum option for memory interleaving, and will produce onememory domain thus producing a non-NUMA configuration.Channel Interleaving is the intra-die memory interleave option and is the default setting for Dell EMCplatforms. With channel interleaving the memory behind each UMC will be interleaved and seen as 1 NUMAdomain per die. This will generate four NUMA domains per socket.Memory Interleave disabled - When memory interleave is disable 4 NUMA nodes will be seen as in the case for channel interleaving but the memory will not be interleaved yet stacked next to one another.6 Dell EMC NUMA Configuration for AMD EPYC (Naples) Processors | version 1.0NUMA Domain Count per Memory Interleave Option2 Performance TuningFor best performance from AMD EPYC processors, it is recommended that each die have one DIMMpopulated on each channel. This allows all IO behind each die to access memory, with optimal latency.2.1 Memory DIMM Population Guidelines∙Populate empty channels, with the same type/capacity of DIMMs, before populating 2 DIMMs on a given channel∙Recommendations for best performance:o 1 DIMM per channel dedicates full memory bandwidtho Populating 2 DIMMs per channel will increase capacity but will lower the clock speed,resulting in lower memory bandwidth. There is a dependency between memory speed andthe bandwidth of the Infinity FabricMemory Bus Speed to Infinity Fabric Bud Speed∙Minimum recommended:o At least 1 DIMM is per die in the system for a total of 4 DIMM per CPU∙On Dell EMC platforms populate DIMM 1 first. (white slots in Figure 4, below)∙ A 2 socket system (2 CPUs are populated) will need equivalent memory configurations on both CPUs for optimal performance.8 Dell EMC NUMA Configuration for AMD EPYC (Naples) Processors | version 1.0DIMM Layout2.2 PCIe Configuration Guidelines∙When PCIe cards are populated into particular slots with NUMA-unaware application/software, make sure to have memory DIMMs populated in the corresponding NUMA-node mapping as local memory.Mappings can be found in Section 4 Platform Specific NUMA/Die Domain Details∙Considering also pinning the interrupts to local CPUs to get maximum performance. For instructions on how to tune network cards for better performance on AMD EPYC processors, go to the followinglinks and download provided documentation:o https:///TechDocs/56224.pdfo https:///resources/epyc-resources/epyc-white-papers/3 BIOS SetupThe “Memory Interleaving” setting controls whether the system is configured for Socket, Die, Channelinterleaving. In System Setup (F2 prompt during system boot), enter System BIOS > Memory Settings andnavigate to “Memory Interleaving” to choo se the memory interleave for desired configuration. This option isalso available in system management consoles such as RACADM.10 Dell EMC NUMA Configuration for AMD EPYC (Naples) Processors | version 1.04 Platform Specific NUMA/Die Domain DetailsThe following matrices shows how CPU die, memory and PCIe slots are physically grouped to each NUMAdomain for Dell EMC EPYC based platforms, PowerEdge R6415, R7415, and R7425.12 Dell EMC NUMA Configuration for AMD EPYC (Naples) Processors | version 1.05 Technical support and resources5.1 Dell/support is focused on meeting customer needs with proven services and support.Dell TechCenter is an online technical community where IT professionals have access to numerous resources for Dell EMC software, hardware and services.Storage Solutions Technical Documents on Dell TechCenter provide expertise that helps to ensure customersuccess on Dell EMC Storage platforms.5.2 AMDhttps:///community/server-gurus EPYC Server Community Forumhttps:///resources/epyc-resources/epyc-tuning-guides/ Linux Network Tuning Guide forAMD EPYC Processor Based Servers。
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Area
Green Belt Skills Assessment (when available) BPI Training Instruction
BPI Continuing Education
BPI Project Work or Mentoring
198
BPI Level I - Report
Define Project Management Planning
• How does this project affect The Customer Experience? • Has the financial opportunity been calculated? • What is the impact on other key business metrics? • Does the project include?
▪ As-Is ▪ Desired State
▪ How Measured ▪ Focus Areas / Drill Down ▪ Initial Learnings (If Any) ▪ Next Steps
Global BPI
Copyright © 2002 Dell Computer Corporation Revision 052802
Global BPI
Copyright © 2002 Dell Computer Corporation Revision 052802
193
BPI Level I - Report
GB Certification Requirements
▪ Purpose: Certify that the Green Belt individual can truly drive DMAICR at a Green Belt project level
CEU Value
Minimum Achieved
Pass = 4 CEUs (Pass Test Only Once)
4 CEUs
1 CEU per Contact Hour
1 CEUs per Approved Class Hour* (No Class Repeats)
6 CEUs per Completed GB as Project Lead or Mentor (3 CEUs for YB)
and project attachments
Copyright © 2002 Dell Computer Corporation Revision 052802
197
BPI Level I - Report
Friday Presentations
▪ First Status Report
▪ Why Selected ▪ Problem Statement
Global BPI
Copyright © 2002 Dell Computer Corporation Revision 052802
194
BPI Level I - Report
GB Recertification
▪ Must recertify within two year period of getting Green Belt certification ▪ Recertified by Area BPI Champion
BPI Level I Green Belt
DELL_6_SIGMA_GB_TRAINING_7
Global BPI
BPI Level I - Report
Module Objectives: Report
▪ Certification and training paths ▪ Friday presentation ▪ What’s next?
▪ Cost estimate template
▪ Process map Yes
No
2. Measure
Check Frequency
Sheet
Tables
3. Analyze
▪ Tool chest templates as attachments
Histogram
S
Summary Statistics
▪ Complete Green Belt course ▪ Document project in PTT ▪ Lead a completed GB BPI project ▪ Demonstrate knowledge and skills with GB level tools and
methodologies ▪ Validate annualized savings greater than $50,000 ▪ Prepare and deliver final presentation
BPI Level I - Report
Recommended Training Paths
Yellow Belt
1
Green Belt
4
Black Belt
JMP
2
Statistics
Together, weeks 1-4 equal the ASQ CSSBB Body of Knowledge
4 CEUs 8 CEUs
9 CEUs
▪ Approved continuing education classes per Global BPI list: Introduction Copyright © 2002 Dell Computer Corporation 195
Global BPI
Revision 052802
Process Capability
Global BPI
4. Improve ▪ Statistical validation JMP output ▪ Financial validation template
$
5. Control
6. Report ▪ BPI success story
.ppt
3
Advanced methods
Global BPI
Copyright © 2002 Dell Computer Corporation Revision 052802
196
BPI Level I - Report
Project Documentation
✓ 1. Defineect contract