NETZSCH Roadshow 2011-Application-part2
RTAX-S SL DSP FPGA编程指南说明书
September 2011 1© 2011 Microsemi Corporation RTAX-S/SL/DSP Programming GuideIntroductionProgramming of RTAX-S/SL/DSP FPGAs requires utmost attention in various areas. Without a proper hardware and software setup, customers may experience higher than expected failure rate which will incur additional cost to them.This document contains information about programming Microsemi SoC RTAX-S/SL/DSP FPGAs using Silicon Sculptor II and III programmers. The document also contains programming and programming failure troubleshooting guidelines to ensure proper programming and help customers achieve the highest possible programming yield of the RTAX-S/SL/DSP FPGAs.Hardware SetupRTAX-S/SL/DSP FPGAs are programmed with Silicon Sculptor II and III programmers. Before programming each FPGA you need to make sure the programmers are within calibration. The verification of calibration (/soc/documents/SiliSculptProgCali_UG.pdf ) and Self-Test (also known as programming diagnostics) with the required programming adapter module must be performed before programming each FPGA. The verification of calibration requires a special adapter module (Microsemi SoC Part Number: SM48DB, BPM Microsystems Part number: SM48D). You must buy this adapter module during the purchase of any Microsemi SoC or BPM Microsystems programmers. The Self-Test needs to be performed with the required adapter module installed, but without an FPGA inserted. Performing a Self-Test with a FPGA inserted can damage the FPGA.You should also keep a redundant programming set-up (a programmer and adapter module) in case a problem is diagnosed with the first set-up. Having this redundant set-up will be helpful if there is a project deadline constraint. The Silicon Sculptor programmer needs FPGA and package specific adapter modules. A complete list of the adapter modules is available online at: /soc/products/hardware/program_debug/ss/modules.aspx#ax_rtaxs .Alternatively, the programming software (SculptW or BPWin) can be checked to get the part number of the required adapter module. Refer to the FAQ# 5 in the Antifuse Programming FAQ document for details.You need to monitor the insertion limit of the adapter module. The insertion limit of Standard Pitch Socket Modules (i.e. for CQFP packages) is 10,000 cycles. The insertion limit of the Module base is 50,000. Insertion limit can be checked from the Silicon Sculptor software using Tools > Socket Module Counter .You should carefully insert and remove the module from the programmer to avoid damage to the DIN connectors. Typical insertion cycles can be prolonged if the module base and socket modules are properly cleaned and maintained. Handling and cleaning practices can affect the number of insertions achieved.Power Supply RequirementsIn addition, consideration must be made to ensure quality of the power supplies used to power the Silicon Sculptor programmer. The programming time for RTAX2000S/SL/D FPGAs is of the order of 2 hours, and the programming time for RTAX4000S/SL/D FPGAs is of the order of 4 hours. Therefore, any brown-outs, voltage spikes, or other anomalies on the power supply that could adversely affect programming are more likely to affect programming yield when the FPGAs being programmed are RTAX2000S/SL/D or RTAX4000S/SL/D owing to the time required to program.Application Note AC378RTAX-S/SL/DSP Programming Guide2 Microsemi SoC strongly recommends that a filtered, genuine sine-wave, Uninterruptible Power Supply with sufficient battery back-up to allow for the entire programming time plus a safety margin of 20% be used with both the Silicon Sculptor II or Silicon Sculptor3 programmer and with the computer attached to the programming hardware that is running the programming software. Such supplies are relatively inexpensive these days and are orders of magnitude less than the cost of programming failures. It should be remembered that a power failure during programming will irrevocably damage the silicon and a new FPGA will be required.Software SetupMicrosemi SoC strongly recommends using the latest Designer software version to generate the*.afm file as well as the latest Silicon Sculptor programming software version to program theFPGAs. The Silicon Sculptor software is frequently updated in order to accommodate yieldenhancements in FPGA manufacturing. These updates ensure maximum programming yield andminimum programming times.Before programming, always check that the version of the Silicon Sculptor programming softwareyou are using is the most recent:/soc/download/program_debug/ss/default.aspx.You should run the programming software as “Novice Mode” in order to avoid unintentionalinterruption. If the programming is interrupted by accidental click on the “Stop” button the FPGA willno longer be programmable. Refer to the FAQ#80 in Antifuse Programming FAQ document fordetails.FPGA HandlingRTAX-S/SL/DSP FPGAs are based on CMOS and require proper grounding and ESD handlingprocedures. Although all Microsemi SoC parts have static discharge protection built in, you shouldalways follow ESD handling procedures when handling these FPGAs. Handle FPGAs by thecorners to avoid touching the leads. Always keep the FPGAs in their insulative carrying cases untilthey are used, and keep the surrounding environment clean and free of dust and debris.Periodically check the Adapter Module sockets to verify that they are free of dirt or other debris thatwould prevent good electrical pin connections between the FPGA and socket. You should alwayswear grounded wrist straps at an ESD workstation when handling RTAX-S/SL/DSP FPGAs. Acalibrated ionizer should be on and functioning properly at the workstation. An ionizer air streamshould be directed over the parts at all times.Inserting the FPGA in the Adapter ModuleWhen loading the FPGAs in the Adapter Module socket, be sure that the orientation is correct.Damage can occur if the FPGA is loaded incorrectly. CQ packages should be loaded in the socketwith face down while CG/LG packages should be face up.For details on handling CG packages, refer to the Ceramic Column Grid Array application note. Troubleshooting Programming FailureIf any RTAX-S/SL/DSP FPGA fails to program, record the error message printed in the log file(c:\BP\DATALOG\BlackBox.log) and perform following actions:1. For a possible solution, refer to the troubleshooting chapter of Silicon Sculptor User Guide:/soc/documents/silisculptII_sculpt3_ug.pdf.2. If the solution for specific error code that you got is given please apply it and program anotherFPGA after running verification of calibration and self test with the adapter module. If there isno solution available, please contact Tech Support (***************************).If the second FPGA fails to program STOP programming, fill out the Programming FA checklist andsend it to *************************** along with the log file.List of Changes3List of ChangesThe following table lists critical changes that were made in each revision of the document. Revision* Changes Page Revision 1 (September 2011) In the Hardware Setup section, the referenced document for verification of calibration was corrected to SiliSculptProgCali_UG.pdf (SAR 34019). Previously it was given as PCN0705_SS_Cali.pdf. 1Note: *The revision number is located in the part number after the hyphen. The part number is displayed at thebottom of the last page of the document. The digits following the slash indicate the month and year of publication.Microsemi Corporate Headquarters One Enterprise Drive, Aliso Viejo CA 92656 Within the USA: (800) 713-4113 Outside the USA: (949) 221-7100 Fax: (949) 756-0308 · 。
TPS2554 and TPS2555 Evaluation Module User's Guide
User's GuideSLVU462–June2011TPS2554and TPS2555Evaluation Module This user’s guide describes the evaluation module(EVM)for the TPS2554and TPS2555.TPS2554and TPS2555are precision-adjustable,current-limited,power-distribution switches.The document contains an operational description of the EVM,schematic,board layout,and bill of materials.Contents1Description (2)1.1Features (2)1.2Applications (2)2Schematic (3)3General Configuration and Description (4)3.1Physical Access (4)3.2Current-Limit Setpoint (4)3.3Test Setup (4)4EVM Assembly Drawings and Layout Guidelines (5)4.1Layout Guidelines (5)4.2PCB Drawings (5)5Bill of Materials (8)List of Figures1TPS2554/5EVM Schematic (3)2Typical TPS2554/5EVM Test Setup (5)3Top-Side Placement and Routing (6)4Layer-Two Routing (6)5Layer-Three Routing (7)6Bottom-Side Placement and Routing (7)List of Tables1User Interface (4)2Test Points (4)3EVM Bill of Materials (8)1 SLVU462–June2011TPS2554and TPS2555Evaluation Module Submit Documentation FeedbackCopyright©2011,Texas Instruments IncorporatedDescription 1DescriptionThe TPS2554EVM-010evaluation module allows reference circuit evaluation of the Texas Instruments TPS2554and TPS2555power-distribution switches.1.1Features•Precision adjustable,current-limited,power-distribution switch•Fast overcurrent response–1µs typical•80-mΩ,high-side MOSFET•Operating range:4.5V to5.5V1.2Applications•USB ports/hubs•Notebook personal computers(PC)2TPS2554and TPS2555Evaluation Module SLVU462–June2011Submit Documentation FeedbackCopyright©2011,Texas Instruments IncorporatedGeneral Configuration and Description 3General Configuration and Description3.1Physical AccessTable1lists the TPS2554/5EVM connector functionality,and Table2describes the test point availability.er InterfaceConnector Label DescriptionJ1VIN Input connectorJ2VOUT Output connectorJ3J3Input voltage jumper.Shunt can be removed to measure input current.J4J4Output voltage jumper.Shunt can be removed to measure output current.J5EN Enable jumper.Leave open to enable TPS2554and install shunt to enable TPS2555.J6ILIM_SEL Current limit select.Install shunt to select ILIM0(2.4A nominal),and remove shunt toselect ILIM1(1.2A nominal).D1(RED)FLT Fault LEDTable2.Test PointsTest Point Color Label DescriptionTP3RED IN Power switch input(IC side of J3shunt)TP4BLK GND Power switch input groundTP1WHT FLT Fault pin outputTP2RED VOUT Power switch outputTP5BLK GND Power switch output groundTP6WHT EN Enable pin input3.2Current-Limit SetpointR4and R5configure the current-limit setpoint for ILIM0and ILIM1,respectively(see J6in Table1).ILIM0or ILIM1setpoint can be adjusted using the following example by substituting R4or R5for RILIMx .In thisexample IOS=2A.The following example is an approximation only and does not take into account the resistor tolerance or the variation of ILIM.For exact variation of ILIM,see the TPS2554/TPS2555data sheet,SLVSAM0.IOS=48000/RILIMx=2ARILIMx=48000/IOS=48000/2=24000ΩChoose RILIMx=23.7kΩIOS=48000/23700=2.03A3.3Test SetupFigure2shows a typical test setup for TPS2554/5EVM.4TPS2554and TPS2555Evaluation Module SLVU462–June2011Submit Documentation FeedbackCopyright©2011,Texas Instruments IncorporatedV INOscilloscope EVM Assembly Drawings and Layout GuidelinesFigure2.Typical TPS2554/5EVM Test Setup4EVM Assembly Drawings and Layout Guidelines4.1Layout Guidelines•TPS2554/55placement:Place the TPS2554/55near the USB output connector and the150-µF OUT pin filter capacitor.Connect the exposed pad to the GND pin and the system ground plane using a viaarray.•IN pin bypass capacitance:Place the100-nF bypass capacitor near the IN and GND pins,and make the connection using a low-inductance trace.•ILIM0and ILIM1pin connections:Current-limit accuracy can be compromised by stray current leakage from a higher voltage source to the ILIM0or ILIM1pins.Ensure that adequate spacing existsbetween IN pin copper/trace and ILIM0pin trace to prevent contaminate buildup during the PCBassembly process.If a low-current-limit setpoint is required(RILIMx >200kΩ),use ILIM1for this case,as it is further away from the IN pin.4.2PCB DrawingsThe Figure3through Figure6show component placement and layout of the EVM.5 SLVU462–June2011TPS2554and TPS2555Evaluation Module Submit Documentation FeedbackCopyright©2011,Texas Instruments IncorporatedEVM Assembly Drawings and Layout Guidelines Figure 3.Top-Side Placement and RoutingFigure yer-Two Routing6TPS2554and TPS2555Evaluation ModuleSLVU462–June 2011Submit Documentation FeedbackCopyright ©2011,Texas Instruments Incorporated EVM Assembly Drawings and Layout Guidelinesyer-Three RoutingFigure6.Bottom-Side Placement and Routing7 SLVU462–June2011TPS2554and TPS2555Evaluation Module Submit Documentation FeedbackCopyright©2011,Texas Instruments IncorporatedEvaluation Board/Kit Important NoticeTexas Instruments(TI)provides the enclosed product(s)under the following conditions:This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT,DEMONSTRATION,OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use.Persons handling the product(s)must have electronics training and observe good engineering practice standards.As such,the goods being provided are not intended to be complete in terms of required design-,marketing-,and/or manufacturing-related protective considerations, including product safety and environmental measures typically found in end products that incorporate such semiconductor components or circuit boards.This evaluation board/kit does not fall within the scope of the European Union directives regarding electromagnetic compatibility,restricted substances(RoHS),recycling(WEEE),FCC,CE or UL,and therefore may not meet the technical requirements of these directives or other related directives.Should this evaluation board/kit not meet the specifications indicated in the User’s Guide,the board/kit may be returned within30 days from the date of delivery for a full refund.THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES,EXPRESSED,IMPLIED,OR STATUTORY,INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.The user assumes all responsibility and liability for proper and safe handling of the goods.Further,the user indemnifies TI from all claims arising from the handling or use of the goods.Due to the open construction of the product,it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic discharge.EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE,NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT,SPECIAL,INCIDENTAL,OR CONSEQUENTIAL DAMAGES.TI currently deals with a variety of customers for products,and therefore our arrangement with the user is not exclusive.TI assumes no liability for applications assistance,customer product design,software performance,or infringement of patents or services described herein.Please read the User’s Guide and,specifically,the Warnings and Restrictions notice in the User’s Guide prior to handling the product.This notice contains important safety information about temperatures and voltages.For additional information on TI’s environmental and/or safety programs,please contact the TI application engineer or visit /esh.No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine,process,or combination in which such TI products or services might be or are used.FCC WarningThis evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT,DEMONSTRATION,OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use.It generates,uses,and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part15 of FCC rules,which are designed to provide reasonable protection against radio frequency interference.Operation of this equipment in other environments may cause interference with radio communications,in which case the user at his own expense will be required to take whatever measures may be required to correct this interference.EVM Warnings and RestrictionsIt is important to operate this EVM within the input voltage range of0V to5.5V and the output voltage range of0V to5.5V. Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM.If there are questions concerning the input range,please contact a TI field representative prior to connecting the input power.Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.Please consult the EVM User's Guide prior to connecting any load to the EVM output.If there is uncertainty as to the load specification,please contact a TI field representative.During normal operation,some circuit components may have case temperatures greater than85°C.The EVM is designed to operate properly with certain components above85°C as long as the input and output ranges are maintained.These components include but are not limited to linear regulators,switching transistors,pass transistors,and current sense resistors.These types of devices can be identified using the EVM schematic located in the EVM User's Guide.When placing measurement probes near these devices during operation,please be aware that these devices may be very warm to the touch.Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2011,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAudio /audio Communications and Telecom /communicationsAmplifiers Computers and Peripherals /computersData Converters Consumer Electronics /consumer-appsDLP®Products Energy and Lighting /energyDSP Industrial /industrialClocks and Timers /clocks Medical /medicalInterface Security /securityLogic Space,Avionics and Defense /space-avionics-defense Power Mgmt Transportation and /automotiveAutomotiveMicrocontrollers Video and Imaging /videoRFID Wireless /wireless-appsRF/IF and ZigBee®Solutions /lprfTI E2E Community Home Page Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2011,Texas Instruments Incorporated。
测速系统技术方案-大华
测速抓拍系统设计方案浙江大华技术股份有限公司2010年1月目录一、概述 (4)1.1前言 (4)1.2设计依据 (4)二、系统组成 (5)2.1 系统构成 (5)2.2 前端采集系统 (5)2.2.1摄像单元 (6)2.2.2 雷达单元 (6)2.2.3 显示单元 (6)2.2.4 照明单元 (6)2.3 网络传输系统 (7)2.4 中心管理系统 (7)三、系统功能 (7)3.1系统采用工业化设计 (7)3.2车辆图像抓拍功能 (7)3.3系统自动调节相机曝光功能 (8)3.4违法车辆数据的保存 (8)3.5系统抓拍范围 (8)3.6多种人机交互接口 (8)3.7大、小车型设置及报警功能 (8)3.8本地存储功能 (8)3.9违法数据统计检索功能 (8)3.10日志查询功能 (8)3.11自动维护功能 (9)3.12软件升级功能 (9)3.13USB备份功能 (9)3.14数据传输和远程维护功能 (9)3.15用户管理功能 (9)四、系统特点及性能指标 (9)4.1 系统技术特点 (9)4.1.1全嵌入式结构，无需工控机，系统更稳定 (9)4.1.2内置专用工业级图像存储器 (11)4.1.3高清2幅图像连拍记录 (11)4.1.4窄波束雷达，捕获率高，测速精准 (11)4.1.5 超低功耗，内置锂电池，适合太阳能供电 (12)4.1.6 一体化设计，便携、固定式转换方便 (13)4.1.7 模块化设计、故障自检和自动恢复功能 (13)4.1.8 图片防篡改 (13)4.2 系统技术指标 (14)4.2.1 嵌入式抓拍主机 (14)4.2.2 窄波平板雷达 (15)4.2.3 频闪闪光灯 (15)五、系统安装方式 (16)5.1 固定式安装方式 (16)5.2 便携式安装方式 (16)5.3 固定便携相互转换 (17)六、实拍效果图 (18)一、概述1.1前言近年来，随着城市机动车数量的不断增长，在带来诸多便利的同时，也存在着一些问题。
草谷公司NAB2011发布多项新技术
尼 Ｈ Ｃ ５０ Ｄ １ ８ Ｒ高清摄像 机 ；切换 台采用 了索尼 高清多格式 Ｍ Ｓ 集 团军 、云南 电视台 、德宏 州电视 台等 电视传 媒机构 所使 用的索 Ｖ 一 ６０ ０ ０切换台 ，并 配备 了卫 星面板 用以多版 本节 目输出的 制作 ；信 尼 广 电摄 录设 备进行 抢修 、维护 和保 障 ，同 时赠送 了一批 电视摄
整 车系统 由车体 、空调 、动力 以及转 播系 统组 成。转播 系统 由视 频制作 、音 频制作 、同步 、慢 动作制 作 、信 号调 度 、分 配处
一
索尼广电设备盈江震灾紧急技术服务 队服务灾 区
３月 １ ０日云南盈 江地震发生 后 ，索尼 中国专业 系统集团在 第 日 间 内协 同云南 当地 索尼技术 服务 和销售 合作 伙伴 ，迅 速成立 寸
讯道高清电视转播车
３月 １ ６日 ， 上 海 广
艾崧 公司神经 元信号分 配处理系统 。全车使用 了 ２套 ＥＶＳ公 司的 制作 系统 ，以满足节目制作的 要求。另外 ，全车采用全索尼系列 的 技 术监看监视器 和广播级 高清专业液 晶显示器 以及 Ｅ ｅ ｔ ｖ ｒｚ公司的
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“ 索尼广 电设备盈江震 灾紧急 技术服务 队” ，列盈江 以及在当地进
理 、信 号连 接和传 输 、通 话 、监 看等 分系 统组成 ，采用 了 一系列
全世 界广 电行业最 为认 可的设 备 。核 心设备 中摄 像机 采用 ８套索
博士视频管理系统中文操作手册说明书
操作手册
Bosch Sicherheitssysteme GmbH
显示报警图像窗口 启动手动录像 启动预配置的摄像机序列 启动自动摄像机序列 使用单通道音频模式 使用多通道音频模式 使用数字变焦 保存单个图像 打印单个图像 切换到全屏模式 显示或隐藏图像窗格栏 显示摄像机信息 启用视频内容分析(VCA) 显示视频内容分析(VCA)规则 启动即时回放 为监视器分配摄像机 使用音频模式 使用内部对讲功能 锁定 PTZ 摄像机的控制 更新参考图像 显示模拟监视器组 控制监视器墙 选择用于显示的实况数据流 通过低带宽来显示视频 使用 TCP 进行可靠的连接 连接到无人管理的站点 显示Video Analytics报警 使用地图和 PTZ 摄像机 显示地图 控制 PTZ 摄像机 使用摄像机的窗内控制 使用 ROI 功能 使用Intelligent Tracking 使用收藏夹和书签 在收藏夹树中添加项目 创建/编辑视图 添加书签 编辑书签。 加载书签 导出书签 管理录像 选择时区 播放录像 使用时间链 更改回放速度 限制视频 保护视频 删除视频数据 验证视频数据的真实性
Bosch Sicherheitssysteme GmbH
Bosch Video Management System
14.2 14.3 15 15.1 15.2
回放控制 图像窗口控制 故障排除 更新旧的BVMS Archive Player版本 重新连接 Bosch IntuiKey 键盘 词汇 索引
目录 | zh-CHS 7
127 127 128 128 128 129 133
Bosch Sicherheitssysteme GmbH
操作手册
2018.08 | V 1 | Operator Client
Netra ct Server Start Here Installation Overview a
Title
Netra ct Server Product Notes
Description
Provides late-breaking information about the system
Netra ct Server Safety and Compliance Manual
Provides safety and compliance information for the system
Title
Netra ct Server Product Notes
Description
Provides late-breaking information about the system
Netra ct Server Safety and Compliance Manual
锐影Vision2011配置清单
L12－5 超宽频带线阵 (小器官，肌骨，乳腺,血管) C8-4V 腔内探头
Quicktext Automatic Annotation Quicksave User Defined Presets Supports full range of scanhead technologies and clinical applications Ability to embed imagings into reports Chinese Localization Voltage/Video Configuration: 220v / 50Hz ~ PAL TISSUE SPECIFIC IMAGING CLINICAL PACKAGES Shared Service Clinical Option Package Operations Manual (one operations manual include in core price) Service Manual SCANHEAD OPTIONS
相控阵探头 S4-2 心脏探头, 优异的二维成像 (成人心脏)
CURVED ARRAY SCANHEADS C5-2 Broadband Curved Array (Abdominal,OB, GYN/Fertility) LINEAR ARRAY SCANHEADS L12-3Broadband Linear Array (Small Parts, Musculoskeletal, Breast， Vascular )
选配件
凸阵探头 C5－2 超宽频带凸阵 (腹部，产科，妇科) 线阵探头 L12－3 超宽频带线阵 (小器官，肌骨，乳腺,血管)
L12-5Broadband Linear Array (Small Parts, Musculoskeletal, Breast， Vascular ) C8-4V Broadband Linear Array
今日电子 2011.08
编辑视点
王丽英
E-mail: mary@
多位相变存储器能加速 PCM 的商用吗？
相变存储器（ P C M ）是一种很有发展前景的存 久，中国科学院上海微系统与信息技术研究所宣布， 研制成功了中国第一款具有自主知识产权的相变存储 器(PCM),该产品存储容量为8Mb,在8英寸硅片上的每 一块存储芯片,存储单元成品率达99%以上，经语音演 示 , 已证实该 芯片 可实 现读、写、 擦 的存储器 全部功 能。 同现有的存储技术相比，相变存储器（P C M）兼 经过几 十年 的发展，相变存储技术 得 到 快速发 展，产品性能也得到大幅提升，但在商用的道路上， 除了三星手机上的应用外，其他鲜有商用报道。笔者 以为，目前阶段，性能和成本让相变存储器还难以寻 找 到合适 的应用，一 定程 度上 制 约 了 P C M 的 商 用发 展。 前不久，I B M 的科学家演示了一种新型的多位相 变存储器，其每个存储格都能长时间可靠地存储多个 字节的数据。该 P C M 测试芯片 拥 有 20 万个存储器 单 元，数据保存实验进行了5 个月，这意味着多位P C M 能达到适合实际使用的可靠性。I B M研究院苏黎世研 究中心的内存和探测器技术主管表示：“迄今为止， 科学家们只在单字节P C M上证实了可靠的数据存储， 这是首次在多位P C M上证实可靠而长久的数据存储， 其首次达到了企业应用所要求的可靠性，我们很快能 研制出由多位PCM制造的实用的存储设备。” 诚如I B M的专家所言，多位相变存储器技术让人 们朝成本更低、速度更快、更耐用的存储技术前进了 一大步。这种新技术是否能加快P C M的商用发展呢？ 让我们拭目以待。
Outlook技术前沿不需要电池的无 Nhomakorabea通信技术
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0 0.0 20.0 40.0 60.0 80.0 Temperature /°C 100.0 120.0 140.0
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黑色曲线: 160°C 下固化 10 分钟。 红色曲线: 130°C 下固化 10 分钟。
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Monotropy
Tfus = 166癈 Tfus = 190癈
β α
0
Gibbs free energy / kJ mol-1
III
-2 -4 -6 -8 -10 -12 -14
Gibbs free energy / kJ mol
-1 -3 -5 -7 -9 -11 -13 -15 0 25 50 75 100 125 150 175 200 Δf us H > Δf us H
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使用 DSC 测量结果进行相图绘制
DSC /(mW/mg) 134 .8° C 2.5
exo
对胺基苯甲酸 (Para-aminobenzoic acid)
2.0
185 .0° C
非那西汀
1.5
(Phenacetin)
1.0 178 .1 J/g 0.5 166 .2 J/g
雌二醇半水合物
脱水峰
熔融峰
Estradiol （雌二醇，一种激素）半水合物, 使用 DSC 方法进行脱水与熔融过程的测试, 样 品称重 1.42 mg（密闭坩埚）, 1.41 mg （坩埚加扎孔盖）; 熔融温度已进行热阻修正。
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药物熔点的传统测量方法
晶体粉末
油浴
光学方法检测在样品熔融过程中光学 属性 (由不透明到透明) 的变化
加热器
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药物熔点的 DSC 测量
DSC 方法熔融过程检测。 时间 t2-t1 与升温速率和样品质量有 关。
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卡马西平（Carbamazepine）的多晶型研究
5H-Dibenz[b,f]azepine-5-carboxamide CAS-No.: 化学式: Mr .
晶型 (文献 1,2) Tfus / °C fusH / kJ mol-1
N CON H2
298-46-4 C15H12N2O 236.26
热分析方法与应用 Part II
耐驰科学仪器商贸（上海）有限公司
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树脂、涂料与粘合剂
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粉末涂料 - 热处理工艺的影响
E' /MPa Peak: 84.2 °C 3000 Onset: 70.0 °C 2500 1.000 2000 Onset: 58.3 °C Peak: 91.1 °C 1.200 tan d
Phenolphthalein
261 - 263
263.0 - 264.0
263.3
99.45
+ 0.3
* DSC 曲线已经过热阻修正. ** 高纯度物质的标准偏差为 0.05 mol-% 文献熔点与使用毛细管／DSC两种方法测得的实验熔点的比较
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1 T ΔGs,i Δ fus Hi Tfus,i
Stability regions of Carbamazepine form I and form III
Tfus,III =176 癈 Tfus,I =190 癈
晶态 I 和 III 的Gibbs 自由能曲线（一阶近似）
蓝色曲线的体系反应活性较高，在30℃下紫外固化完成较快。 测试仪器：DEA 231
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医药
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T f us
Ph
170 160 150 140 130 120
ln x i
fus Hi R
1 1 T fus,i T
T eut 110 1 0,9 0,8 0,7 0.4 0.5 0.6 0.7 0.8 0.9 0 0.1 0.2 0.3 0,6 0,5 0,4 0,3 0,2 0,1 01 mol-fraction p-aminobenzoic acid
环氧树脂固化的 TM-DSC 测量
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环氧树脂固化的 TM-DSC 测量
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阳离子环氧胶粘剂的紫外固化
紫外照射时间：60 s。研究了不同测试温度对固化过程的影响
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丙烯酸酯粘合剂的紫外固化
测试温度：35, 45, 55°C；照射时间: 10 x 1 s
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环氧树脂固化过程测试
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使用 DSC 测量结果进行相图绘制
Schröder – van Laar 方程
fus Hi ln x i R
1 1 T fus,i T
xi = 混合物中 i 组分的摩尔含量, 其中 i = 1, 2, 为组分 1 或组分 2. 各组分摩尔分数符合如下关系 x1 + x2 = 1 使用熔融热焓 ΔfusHi 与熔融温度 Tfus,i , 通过 Schröder – van Laar 方程 即得到了相图所需的方程.
130
140
150 160 Temperature /° C
170
180
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使用 DSC 测量结果进行相图绘制
Phase Diagram Phenacetin - p-ABA 190 T f us 180
p-ABA
Temperature/癈
Tfus °C Vanillin Ribavirin Sulfadimidine Saccharin 81 - 83 166 - 168 197 - 200 227 - 230
Tonsetcap Tendcap °C 81.2 - 83.4 168.1 - 169.8 198.6 - 199.8 229.0 - 229.5
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齿科材料的紫外固化
E' /MPa
1200
Dental Material A: later start of curing Dental Material B: more reactive, faster curing
1000
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Onset: 3.5 min
III --> I
160.2 ° C 85.7 J/g 10.9 J/g 97.0 J/g 1st heating 2nd heating 189.8 ° C
exo
N CON H2
191.8 ° C
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吉布斯自由能: 卡马西平
I 190 26
AII 185 -
BII 187 22
III 176 31
IV 173 -
抗惊厥药, 安定药
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卡马西平的晶型转变
DSC /(mW/mg) 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 130 140 150 160 170 180 Temperature /° C 190 200
2,0 1,5
-1 G / kJII = 118癈 0,0 -0,5 -1,0 -1,5 0 20 40 60 80 100 120 140 160 180 200
Temperature/癈
‘驱动力’: 晶型 I 与晶型 III 的吉布斯自由能之差 ΔΔG = ΔGs,I – ΔGs,III
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熔融范围的测定
药物 文献熔点 [1] 毛细管法测得 的熔融范围 DSC 方法 测得的熔点 * TfusDSC °C 81.4 168.0 198.0 228.1 mol-% 99.99 99.99 99.99 99.89 °C + 0.2 - 0.1 - 0.6 - 0.9 共晶纯度 ** ΔT = TfusDSC Tonsetcap
Onset: 4.2 min
823.042/04
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两种阳离子环氧体系的快速紫外固化比较
Ion visc. /Ohm*cm 5 2 109 5 2 108 5 2 107 5 2 106 5 0 2.7 s, 0.0085E+08 Ohm*cm 3.1 s, 0.0057E+08 Ohm*cm 20 40 60 Time /s 80 100 120 60.0 s, 11E+08 Ohm*cm 60.0 s, 33E+08 Ohm*cm 11.2 s 8.8 s