BZT03_05中文资料

合集下载

05 无油衬套

12 14
＋0.034 ＋0.040
12
18 ＋0.007 ＋0.003
12
18 ＋0.023 ＋0.019
±0.2 ±0.5
13
19
13
19
15 16 18
＋0.034 ＋0.039 ＋0.016 ＋0.011
21 22 24
＋0.021 ＋0.027 ＋0.008 ＋0.004
－0.1 －0.3
· 导向轴的表面粗糙度推荐1.6（a 63s）以下。
⨖无
油
■品质保证
衬套
关于MISUMI制无油衬套，C-VALUE产品·既有产品都实行出厂前质检，向用户提供产品目录规格值的产品。
检查内径尺寸
检查外径尺寸
全长尺寸检查
外观尺寸检查
282
ແ‫څ‬༉ϒογϡͷಛ௕
无油衬套的特长
2材质特性及容许特性 (参考值)
页码
P.287～294、P.297～299 P.295·296
类型
铜合金型
青铜型
P.300·301 干式
P.301 高精度型
P.302
树脂型 (聚缩醛树脂)
树脂型 (聚四氟乙烯树脂)
P.299 铸件型
形状
材质特性
以高强度黄铜为基青铜铸件浸透润滑油钢金属底层、青铜烧在高强度铝合金聚缩醛树脂中含有润以聚四氟乙烯树脂为以FC250为基础，镶
＜比较表＞
⨖无
规格
内径(mm)
外径(mm)
全长(mm)
容许最大负载
油衬
套
既有产品 MPBZ12－20
＋0.034 ＋0.016
＋0.018 ＋0.007

D2003-05

1.范围本标准详细描述了电镀（*1）是覆盖于零件上并起防腐、防锈和装饰作用的涂层。

注（*1）：旨在防磨损的功能电镀不包括在内。

备注：从2005年12月31日起涂层中禁止包含六价铬。

然而，根据各区域和事业部的行动计划及各自特殊情况，且假设自法规实施日起六个月以来测量得以完成，那么以上截止日期可能发生变更。

具体截止日期的确定需要相关方共同参与。

2.类型根据基/终镀层的类型及镀层厚度（级别），电镀被划分为不同类型，如附件表1所示。

电镀的图纸标注符号请参考HES A 3010(电镀标注方法)。

备注：每类电镀具体步骤的选择需经相关方共同协商确认。

3.品质电镀品质需按照第5部分（试验）的说明进行试验，并符合下列要求。

树脂零部件的电镀品质需要单独进行检查，因为这种零件产生的裂缝可能由使用中的变形而引起。

3.1外观A）电镀外观应根据5.1（外观试验）的要求进行试验，且应该符合附录表1中的相关要求。

然而，产品完成后却不能用肉眼检查的部分应该与有关方共同协商解决。

B）那些难以镀层的部分，如：角落，标高和螺纹，及未切触12毫米直径球体的表面，不必符合附录表1中的要求。

然而，这些部分如有需要可与相关方协商，通过与主样品进行比较而得到解决办法。

C）视觉检测标准参考附件表2，外观评级符合HES D 0041的要求（外观级别要求）。

3.2抗腐蚀A）根据 5.3（抗腐蚀试验）的要求进行电镀抗腐蚀性能试验。

所有需要电镀的部分需符合附件表1中的要求。

对于任何无法电镀的部分及不符合给定抗腐蚀要求的部分（*2）都需要重新接受设计工程评审，或者接受防腐和防锈处理如涂层，这都是为了迎合要求。

就一些部分而言，当由于难度太大而无法电镀时，当电镀后需额外使用防腐及防锈表面处理技术时，当需要比本标准更好的品质时，这些问题皆需经相关方共同协商确认。

注（*2）：角落，深层压痕，标高，螺纹，缎面，盲点，连接点等。

B）包含乙酸铜盐雾试验（以下简称“CASS”）及隶属于外观等级“d”的镀铬层抗腐蚀标准应该比等级标准“sa”到“c”在评级上略低一个阶。

J-STD-033B(中文版)资料

J-STD-033B(中文版)资料编辑整理：尊敬的读者朋友们：这里是精品文档编辑中心，本文档内容是由我和我的同事精心编辑整理后发布的，发布之前我们对文中内容进行仔细校对，但是难免会有疏漏的地方，但是任然希望（J-STD-033B(中文版)资料）的内容能够给您的工作和学习带来便利。

同时也真诚的希望收到您的建议和反馈，这将是我们进步的源泉，前进的动力。

本文可编辑可修改，如果觉得对您有帮助请收藏以便随时查阅，最后祝您生活愉快业绩进步，以下为J-STD-033B(中文版)资料的全部内容。

SMD温湿度敏感元件作业，运输，储存，包装标准1.前言SMD零件的出现直接带来了新的挑战,而这些挑战的重心又在于包装的品质和可靠性.本文讲述了floor life 在作业,包装，运输，的等级标准。

J—STD-020说明了湿敏元件级别,JEP113说明了标签要求周围环境中的湿气会通过包装材料渗透到包装内部，并在不同材料的表面聚结。

在组装工艺中，SMD元件贴装在PCB上时会经历超过200℃,在焊接时,湿气的膨胀会造成一些列的焊接品质问题。

2.目的本文旨在为使用,运输,存储，包装SMD湿敏元件提供标准。

通过本文内的方法,可以避免零件受潮和零件在过IR后可靠性下降。

通过本文的各个程序，可以达到无害回焊。

热烘可以使SMD零件得到长达12个月的包装存储寿命。

3.范围3。

1 包装3.1.1 本标准适用于PCBA中无需密封SMD零件的作业，其中包括聚合分子材料和塑胶材料3.1。

2 密封包装大零件无湿气风险，不必作防潮3.2 组装制程3.2。

1本标准适用于PCBA IR，VPR等制程，不适用于波峰焊3.2.2 本标准亦适用于受潮零件的烘烤或重工3。

2.3 本标准不适用于不过回焊炉的零件3。

3 可靠性3.3。

1 内容描述中的方法可以保证PCBA的成品可靠性是可评估的（标准 J-STD-020 和JESD22—A113）3.3。

2 本文不对焊接可靠性作评述4. 涉及文件4。

通用工艺(电气)

其它分册修船通用工艺清单
ＲＺＪ０１－０１
工艺文件
文件名称：船用配电设备制作基本技术要求文件编号： G00-30-01 注册日期： 2007 年 0 5 月 16 日
编制：校对：审核：会签：批准：
舟山万邦永跃船舶修造有限公司质量技术部
船用配电设备制作基本技术要求
6.3 绝缘电阻的要求，额定电压为≤60V 的配电板、箱，用 250V 高阻计测量，额定电压为 60 伏以上的用 500V 高阻计测量，其绝缘电阻最小允许值应符合表 5 之规定。
船用配电设备制作基本技术要求
G00-30-01
表5
配电板（箱）长度（M）
≥6
＜6
绝缘电Байду номын сангаас（MΩ）
1
2
6.4 绝缘介电强度（耐压）试验，配电板（箱）按照表 6 进行耐压试验。
4.2.2.1 下料后首先将剪切好的毛料经平板机整平。
配电板箱体制作工艺
G00-30-02
共 10 页第 3页
4.2.2.2 按照图纸的要求折边。
4.2.2.3 修整并校直其接口后进行焊接。应无水渗入箱体内。适用于露天或潮湿处安装的配电
设备，如岸电箱等。
4.2.3 面板、侧板、移门及顶板的开孔。
_________________________
ＲＺＪ０１－０１
工艺文件
文件名称：配电板箱体制作工艺文件编号： G00-30-02 注册日期： 2007 年 05 月 16 日
编制：校对：审核：会签：批准：
配电板箱体制作工艺
G00-30-02
1. 适用范围本工艺适用于公司制造的各种类型船用低压配电板、开关柜等的箱体制作。

BZ-PR-03关键功能性零部件确认程序 V1.1

关键功能性零部件确认程序1目的为确保关键功能性零部件能得到充分理解、验证，从可用性、可靠性和客户体验方面确保其使用品质，特制定本程序。

2范围适用于公司功能性零部件的开发使用。

本程序只针对关键性的功能性零部件。

本程序是在《材料开发管理程序》上对零部件强调重点，对关键性的功能零部件的要求进行提升。

3 定义3.1 新材料：指新产品开发过程中所涉及到的公司以前未批量使用过的材料（包括新产品、新模的注塑件）(见《材料开发管理程序》)。

3.2 替代材料：指已经认可并已批量使用过的材料，由于工艺变更、原材料变更、厂商变更或降价等因素进行重新认可的过程。

（见《材料开发管理程序》）3.3功能性零部件：指某个零部件本身为一个组合件，能够实现一定的产品功能。

如马达，线路板，传感器，开关，电源线，过滤器，全热交换器，发热架，雾化片，负离子发生器，UV灯等。

3.4 关键的功能性零部件：指某个功能性零部件，在产品的使用性能、可靠性、客户体验等方面具有决定性的意义并且其在产品中的使用是需要充分验证的。

本程序定义的关键的功能性零部件主要包括（如下附表3.1）：马达：带线路控制或传动控制的马达，如步进马达，同步马达，外转子马达，直流无刷马达等。

（一般的罩级马达，电容启动马达，串级马达的设计和生产工艺都比较成熟，不需很多验证）。

线路板：开关电源（一般的微动开关线路板，指示灯线路板，RC阻容降压线路的设计和生产工艺都比较成熟，不需很多验证）传感器：CO2传感器，粉尘传感器，TVOC传感器，遥控器，压力传感器，WIFI模块。

开关：点烟器，触摸开关（一般的扭子开关，船型开关，翘板开关，琴键开关的设计和生产工艺都比较成熟，不需很多验证）备注：电源线和插头，过滤器，全热交换器，发热架，冬菇头发热体，微动开关等的设计和生产工艺都比较成熟不在关键性功能零部件列中。

表3.13.5 FMEA:指用来确定潜在失效模式及其原因的分析方法。

3.6 MSDS：化学品安全技术说明书。

PIT-W2003中文操作手册

4
参考文献
附图
图 1:传输 PIT 测试仪主机数据………………………………………………………………….8 图 2:下载 PIT 测试仪主机数据………………………………………………………………….10 图 3:PIT 软件主屏显示………………………………………………………………………….12 图 4:工程/桩管理窗口………………………………………………………………………….13 图 6:输出页面…………………………………………………………………………………..24 图 7:单个速度-时间（桩长）曲线图………………………………………………………….25 图 8:典型的频谱图……………………………………………………………………………..29 图 9:频率域分析中特有的输入参数…………………………………………………………..29 图 10:搜索峰值结果…………………………………………………………………………….30 图 11:无阻抗变化的均匀桩身，土阻力对速度曲线影响的示意图………………………….35 图 12:阻抗减小的非均匀桩身，土阻力对速度曲线影响的示意图………………………….36 图 13:侧剖面分析主屏幕……………………………………………………………………….39 图 14:用文本和箭头帮助解释的图形窗口…………………………………………………….40 图 15:侧剖面分析中特有的输入/调整窗口…………………………………………………..40 图 16:当选择了“Adjust Pulse Length…”时的图形（使用文字和箭头对图形作说明）.43 图 17:手动调整参考线………………………………………………………………………….45 图 18:β 和 α 关系曲线图……………………………………………………………………..47 图 19：行波示意图：a)两个加速度传感器的速度-时间曲线；b)两个加速度传感器的位置及应力波传播示意图……………………………………………………………………………….50 图 20:a)应力波在承台下带有缺陷的桩身中传播路径（未列出所有可能情况的反射）;b)A1 处的速度-时间曲线（只显示上行波）图……………………………………………………..52 图 21:双速度分析输入窗口…………………………………………………………………….54 图 22:带桩身侧剖面显示的双速度曲线图…………………………………………………….54 图 23:同时显示上行速度和互相关曲线的双速度曲线图…………………………………….55 图 24:使用“Shift 2nd Vel. to the Same Toe”检查波速图…………………………….56 图 25:使用互相关曲线 Cross Correlation 确定波速图…………………………………….56 图 26:上行应力波实例—试桩和应力波传播（桩身阻抗变化被忽略）…………………….57 图 27:上行应力波实例—A1 处实测速度曲线图……………………………………………….58 图 28:上行应力波实例—A1 和 A2 处实测速度曲线及 A1 处计算的上行波速度曲线图…….59

PHILIPS BZT03 series 数据手册

DATA SHEETProduct speciﬁcationSupersedes data of April 19921996Jun 11BZT03 seriesVoltage regulator diodeshandbook, 2 columnsM3D116查询BZT03供应商Voltage regulator diodes BZT03 seriesFEATURES•Glass passivated•High maximum operating temperature•Low leakage current •Excellent stability•Zener working voltage range: 7.5to270V for 38 types •Transient suppressor stand-off voltage range:6.2to430V for 45 types •Available in ammo-pack.DESCRIPTIONRugged glass SOD57 package, usinga high temperature alloyedconstruction. This package ishermetically sealed and fatigue freeas coefficients of expansion of allused parts are matched.Fig.1 Simplified outline (SOD57) and symbol.2/3 page (Datasheet)MAM204k aLIMITING VALUESIn accordance with the Absolute Maximum Rating System (IEC134).SYMBOL PARAMETER CONDITIONS MIN.MAX.UNIT P tot total power dissipation T tp=25°C; lead length 10mm; see Fig.2− 3.25WT amb=45°C; see Fig.2;PCB mounted (see Fig.6)− 1.30WP ZRM repetitive peak reverse powerdissipation−10WP ZSM non-repetitive peak reversepower dissipation t p=100µs; square pulse;T j=25°C prior to surge; see Fig.3−600WP RSM non-repetitive peak reversepower dissipation 10/1000µs exponential pulse (see Fig.4);T j=25°C prior to surge−300WT stg storage temperature−65+175°C T j junction temperature−65+175°CVoltage regulator diodesBZT03 seriesELECTRICAL CHARACTERISTICS Total seriesT j =25°C unless otherwise specified.Per type when used as voltage regulator diodes T j =25°C unless otherwise specified.SYMBOL PARAMETERCONDITIONSMAX.UNITV Fforward voltageI F =0.5A; see Fig.51.2VTYPE No.SUFFIX(1)WORKING VOLTAGEDIFFERENTIAL RESISTANCE TEMPERATURE COEFFICIENT TEST CURRENT REVERSE CURRENTat REVERSE VOLTAGE V Z (V)at I Zr dif (Ω)at I Z S Z (%/K)at I Z I Z (mA)I R (µA)V R (V)MIN.NOM.MAX.TYP .MAX.MIN.MAX.MAX.C7V57.07.57.9120.000.07100750 5.6C8V27.78.28.7120.030.08100600 6.2C9V18.59.19.6240.030.085020 6.8C109.41010.6240.050.0950107.5C1110.41111.6470.050.105048.2C1211.41212.7470.050.105039.1C1312.41314.15100.050.1050210C1513.81515.65100.050.1050111C1615.31617.16150.060.1125112C1816.81819.16150.060.1125113C2018.82021.26150.060.1125115C2220.82223.36150.060.1125116C2422.82425.67150.060.1125118C2725.12728.97150.060.1125120C302830328150.060.1125122C333133358150.060.1125124C3634363821400.060.1110127C3937394121400.060.1110130C4340434624450.070.1210133C4744475024450.070.1210136C5148515425600.070.1210139C5652566025600.070.1210143C6258626625800.080.1310147C6864687225800.080.1310151C75707579301000.080.1310156C82778287301000.080.1310162C91859196602000.090.135168Voltage regulator diodesBZT03 seriesNote1.To complete the type number the suffix is added to the basic type number, e.g. BZT03-C100.C10094100106602000.090.135175C110104110116802500.090.135182C120114120127802500.090.135191C1301241301411103000.090.1351100C1501381501561303000.090.1351110C1601531601711503500.090.1351120C1801681801911804000.090.1351130C2001882002122005000.090.1351150C2202082202333507500.090.1321160C2402282402564008500.090.1321180C27025127028945010000.090.1321200TYPE No.SUFFIX(1)WORKING VOLTAGEDIFFERENTIAL RESISTANCE TEMPERATURE COEFFICIENT TEST CURRENT REVERSE CURRENTat REVERSE VOLTAGE V Z (V)at I Zr dif (Ω)at I ZS Z (%/K)at I Z I Z (mA)I R (µA)V R (V)MIN.NOM.MAX.TYP .MAX.MIN.MAX.MAX.Voltage regulator diodes BZT03 seriesPer type when used as transient suppressor diodesT j=25°C unless otherwise specified.TYPE NUMBERREVERSEBREAKDOWNVOLTAGETEMPERATURECOEFFICIENTTESTCURRENTCLAMPINGVOLTAGEREVERSECURRENT atSTAND-OFFVOLTAGE V(BR)R (V)at I testS Z(%/K)at I test Itest(mA)V(CL)R (V)at I RSM(A)note1I R(µA)at VR(V) MIN.MIN.MAX.MAX.MAX.BZT03-C7V57.00.000.0710011.326.51500 6.2 BZT03-C8V27.70.030.0810012.324.41200 6.8 BZT03-C9V18.50.030.085013.322.71007.5 BZT03-C109.40.050.095014.820.3208.2 BZT03-C1110.40.050.105015.719.159.1 BZT03-C1211.40.050.105017.017.7510 BZT03-C1312.40.050.105018.915.9511 BZT03-C1513.80.050.105020.914.4512 BZT03-C1615.30.060.112522.913.1513 BZT03-C1816.80.060.112525.611.7515 BZT03-C2018.80.060.112528.410.6516 BZT03-C2220.80.060.112531.09.7518 BZT03-C2422.80.060.112533.88.9520 BZT03-C2725.10.060.112538.17.9522 BZT03-C30280.060.112542.27.1524 BZT03-C33310.060.112546.2 6.5527 BZT03-C36340.060.111050.1 6.0530 BZT03-C39370.060.111054.1 5.5533 BZT03-C43400.070.121060.7 4.9536 BZT03-C47440.070.121065.5 4.6539 BZT03-C51480.070.121070.8 4.2543 BZT03-C56520.070.121078.6 3.8547 BZT03-C62580.080.131086.5 3.5551 BZT03-C68640.080.131094.4 3.2556 BZT03-C75700.080.1310103.5 2.9562 BZT03-C82770.080.1310114.0 2.6568 BZT03-C91850.090.135126 2.4575 BZT03-C100940.090.135139 2.2582 BZT03-C1101040.090.135152 2.0591 BZT03-C1201140.090.135167 1.85100 BZT03-C1301240.090.135185 1.65110 BZT03-C1501380.090.135204 1.55120 BZT03-C1601530.090.135224 1.35130Voltage regulator diodes BZT03 seriesNote1.Non-repetitive peak reverse current in accordance with “IEC 60-1, Section 8” (10/1000µs pulse); see Fig.4.THERMAL CHARACTERISTICS Note1.Device mounted on an epoxy-glass printed-circuit board, 1.5mm thick; thickness of Cu-layer ≥40µm, see Fig.6.For more information please refer to the “General Part of associated Handbook”.BZT03-C1801680.090.135249 1.25150BZT03-C2001880.090.135276 1.15160BZT03-C2202080.090.132305 1.05180BZT03-C2402280.090.1323360.95200BZT03-C2702510.090.1323800.85220BZT03-C3002800.090.1324190.725240BZT03-C3303100.090.1324590.655270BZT03-C3603400.090.1324980.605300BZT03-C3903700.090.1325370.565330BZT03-C4304000.090.1326030.505360BZT03-C4704400.090.1326550.455390BZT03-C5104800.090.1327070.425430SYMBOL PARAMETERCONDITIONS VALUE UNIT R th j-tp thermal resistance from junction to tie-point lead length =10mm 46K/W R th j-a thermal resistance from junction to ambientnote 1100K/WTYPE NUMBERREVERSE BREAKDOWN VOLTAGE TEMPERATURE COEFFICIENT TEST CURRENT CLAMPING VOLTAGEREVERSE CURRENT at STAND-OFF VOLTAGE V (BR)R (V)at I testS Z (%/K)at I test I test (mA)V (CL)R (V)at I RSM (A)note 1I R (µA)at V R (V)MIN.MIN.MAX.MAX.MAX.Voltage regulator diodesBZT03 seriesGRAPHICAL DATAFig.2Maximum total power dissipation as a function of temperature.Solid line: tie-point temperature; lead length =10mm.Dotted line: ambient temperature; PCB mounted as shown in Fig 6.handbook, halfpage02004312100T (°C)P tot (W)MBH534T j =25°C prior to surge.Fig.3Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse).handbook, halfpage10−21010210310410−11t p (ms)P ZSM (W)10MBH535Fig.4Non-repetitive peak reverse current pulse definition.In accordance with “IEC 60-1, Section 8”.t 1=10µs.t 2=1000µs.handbook, halfpageMGD521I RSM (%)100905010t 1t 2tT j =25°C.Fig.5Forward current as a function of forward voltage; typical values.handbook, halfpage02312MBH536I F(A)1V F (V)Voltage regulator diodes BZT03 seriesFig.6 Device mounted on a printed-circuit board.Dimensions in mm.handbook, halfpageMGA200327502550Voltage regulator diodesBZT03 seriesPACKAGE OUTLINEDEFINITIONS LIFE SUPPORT APPLICATIONSThese products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.Data sheet status Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.Limiting valuesLimiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.Application informationWhere application information is given, it is advisory and does not form part of the speciﬁcation.Dimensions in mm.The marking band indicates the cathode.Fig.7 SOD57.handbook, full pagewidth3.81maxMBC880ka28 min28 min4.57max0.81max。

BZT52-B系列单极性电阻芯片在SOD123包装中的稳压电器数据手册说明书

BZT52-B seriesSingle Zener diodes in a SOD123 packageRev. 1 — 20 December 2017Product data sheet1 1 Product profile1.1General descriptionGeneral-purpose Zener diodes in a SOD123 small Surface-Mounted Device (SMD)plastic package.1.2Features and benefits•Total power dissipation: ≤ 590 mW•Wide working voltage range: nominal 2.4 V to 75 V (E24 range)•Small plastic package suitable for surface-mounted design •Low differential resistance •B selection•AEC-Q101 qualified1.3Applications•General regulation functions1.4Quick reference data[1]Pulse test: t p ≤ 300 μs; δ ≤ 0.02.[2]Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.[3]Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm 2.Single Zener diodes in a SOD123 package 2Pinning information[1]The marking bar indicates the cathode.3Ordering information[1]The series consists of 37 types with nominal working voltages from 2.4 V to 75 V.4MarkingSingle Zener diodes in a SOD123 package 5Limiting valuesTable 5. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).[1]t p = 100 μs; square wave; T j = 25 °C prior to surge.[2]Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[3]Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.6Thermal characteristics[1]Device mounted on an FR4 Printed-Circuit Board (PCB),single-sided copper, tin-plated and standard footprint.[2]Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.[3]Soldering point of cathode tab.7CharacteristicsTable 7. CharacteristicsT = 25 °C unless otherwise specified.[1]Pulse test: t p ≤ 300 μs; δ ≤ 0.02.Single Zener diodes in a SOD123 package Table 8. Characteristics per type; BZT52-B2V4 to BZT52-B24= 25 °C unless otherwise specified.T[1] f = 1 MHz; V R = 0 V[2]t p = 100 μs; T amb = 25 °CSingle Zener diodes in a SOD123 packageTable 9. Characteristics per type; BZT52-B27 to BZT52-B51T= 25 °C unless otherwise specified.[1] f = 1 MHz; V R = 0 V[2]t p = 100 μs; T amb = 25 °CTable 10. Characteristics per type; BZT52-B56 to BZT52-B75T = 25 °C unless otherwise specified.[1] f = 1 MHz; V R = 0 V[2]t p = 100 μs; T amb = 25 °CSingle Zener diodes in a SOD123 package8Test information8.1Quality informationThis product has been qualified in accordance with the Automotive Electronics Council(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and issuitable for use in automotive applications.Single Zener diodes in a SOD123 package 9Package outline10SolderingSingle Zener diodes in a SOD123 package 11Revision historySingle Zener diodes in a SOD123 package 12Legal information12.1 Data sheet status[1]Please consult the most recently issued document before initiating or completing a design.[2]The term 'short data sheet' is explained in section "Definitions".[3]The product status of device(s) described in this document may have changed since this document was published and may differ in case of multipledevices. The latest product status information is available on the Internet at URL .12.2 DefinitionsDraft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Nexperia does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Nexperia sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between Nexperia and its customer, unless Nexperia and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the Nexperia product is deemed to offer functions and qualities beyond those described in the Product data sheet.12.3 DisclaimersLimited warranty and liability — Information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties, expressed or implied, as to the accuracyor completeness of such information and shall have no liability for the consequences of use of such information. Nexperia takes no responsibility for the content in this document if provided by an information source outside of Nexperia. In no event shall Nexperia be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, Nexperia's aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of Nexperia.Right to make changes — Nexperia reserves the right to make changesto information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.Applications — Applications that are described herein for any of these products are for illustrative purposes only. Nexperia makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using Nexperia products, and Nexperia accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the Nexperia product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Nexperia does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using Nexperia products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). Nexperia does not accept any liability in this respect.Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.Terms and conditions of commercial sale — Nexperia products aresold subject to the general terms and conditions of commercial sale, as published at /profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. Nexperia hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of Nexperia products by customer.No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance orthe grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.Suitability for use in automotive applications — This Nexperia product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted tobe suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an Nexperia product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Nexperia and its suppliers accept no liability for inclusion and/or use of Nexperia products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk.Single Zener diodes in a SOD123 packageQuick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.12.4 TrademarksNotice: All referenced brands, product names, service names and trademarks are the property of their respective owners.Nexperia BZT52-B series Single Zener diodes in a SOD123 packagePlease be aware that important notices concerning this document and the product(s)described herein, have been included in section 'Legal information'.© Nexperia B.V. 2017.All rights reserved.For more information, please visit: Forsalesofficeaddresses,pleasesendanemailto:***************************Date of release: 20 December 2017Document identifier: BZT52-B_SERContents1 1 Product profile .................................................11.1General description ............................................11.2Features and benefits ........................................11.3Applications ........................................................11.4Quick reference data .........................................12Pinning information ............................................23Ordering information ..........................................24Marking .................................................................25Limiting values ....................................................36Thermal characteristics ......................................37Characteristics ....................................................38Test information ..................................................68.1Quality information .............................................69Package outline ...................................................710Soldering ..............................................................711Revision history ..................................................812Legal information (9)Mouser ElectronicsAuthorized DistributorClick to View Pricing, Inventory, Delivery & Lifecycle Information:N experia:BZT52-B11J BZT52-B39X BZT52-B4V7X BZT52-B75J BZT52-B75X BZT52-B7V5X BZT52-B68X BZT52-B6V2X BZT52-B8V2J BZT52-B13J BZT52-B27J BZT52-B3V6J BZT52-B4V3X BZT52-B5V6J BZT52-B9V1J BZT52-B16X BZT52-B18X BZT52-B36X BZT52-B3V3J BZT52-B5V1J BZT52-B7V5J BZT52-B12J BZT52-B2V4J BZT52-B33X BZT52-B47X BZT52-B6V8X BZT52-B10J BZT52-B20X BZT52-B24X BZT52-B3V0X BZT52-B51J BZT52-B56J BZT52-B43J BZT52-B43X BZT52-B68J BZT52-B11X BZT52-B3V3X BZT52-B8V2X BZT52-B6V8J BZT52-B9V1X BZT52-B13X BZT52-B15X BZT52-B2V7J BZT52-B3V9J BZT52-B12X BZT52-B18J BZT52-B27X BZT52-B3V6X BZT52-B4V7J BZT52-B6V2J BZT52-B5V1X BZT52-B2V7X BZT52-B30X BZT52-B3V9X BZT52-B47J BZT52-B62J BZT52-B20J BZT52-B2V4X BZT52-B33J BZT52-B36J BZT52-B4V3J BZT52-B56X BZT52-B22J BZT52-B22X BZT52-B24J BZT52-B39J BZT52-B3V0J BZT52-B51X BZT52-B15J BZT52-B16J BZT52-B30J BZT52-B5V6X BZT52-B62X BZT52-B10X。

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BZT03-SeriesDocument Number 85599Rev. 1.4, 13-Jul-05Vishay Semiconductors1949539Zener Diodes with Surge Current SpecificationFeatures•Glass passivated junction •Hermetically sealed package•Clamping time in picoseconds •Lead (Pb)-free component•Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/ECApplicationsMedium power voltage regulators and medium power transient suppression circuitsMechanical DataCase: SOD-57 Sintered glass case Weight: approx. 369 mg Packaging Codes/Options:TAP / 5 k Ammopack (52 mm tape) / 25 k/box TR / 5 k 10" reelAbsolute Maximum RatingsT amb = 25°C, unless otherwise specifiedThermal CharacteristicsT amb = 25°C, unless otherwise specifiedElectrical CharacteristicsT amb = 25°C, unless otherwise specifiedParameterTest conditionSymbol Value Unit Power dissipationl = 10 mm, T L = 25°C P V 3.25W T amb = 25°CP V 1.3W Repetitive peak reverse power dissipationP ZRM 10W Non repetitive peak surge power dissipationt p = 100 µs, T j = 25°C P ZSM 600W Junction temperature T j 175°C Storage temperature rangeT stg- 65 to + 175°CParameter T est conditionSymbol Value Unit Junction ambientl = 10 mm, T L = constant R thJA 46K/W on PC board with spacing 25 mmR thJA100K/WParameterT est conditionSymbol MinT yp.Max Unit Forward voltageI F = 0.5 AV F1.2V 2Document Number 85599Rev. 1.4, 13-Jul-05BZT03-SeriesVishay Semiconductors Electrical CharacteristicsBZT03C...1) 10/1000 exp. falling pulse tp = 1000 µs down to 50 %2)Stand-off voltage = recommended suplly voltagePartnumberZener Voltage RangeDynamic Resistance T est Curre nt T emperature Coefficient of Zener Voltage Reverse Leakage Current ClampingStand-offV Z @ I ZTr zj and TK VZ @I ZI ZT TC VZ @ I ZTI R @ V R V (CL)R 1) @ I RMS I R @ V R 2)VΩmA%/KµA VV AµA Vmintyp max typ max min max max max max BZT03C6V2 5.8 6.2 6.61210000.071500 4.79.334.03000 5.1BZT03C6V8 6.4 6.87.21210000.071000 5.110.231.02000 5.6BZT03C7V577.57.91210000.07750 5.611.326.51500 6.2BZT03C8V27.78.28.7121000.030.08600 6.212.324.41200 6.8BZT03C9V18.59.19.624500.030.0820 6.813.322.7507.5BZT03C109.41010.624500.050.09107.514.820.3208.2BZT03C1110.41111.647500.050.148.215.719.159.1BZT03C1211.41212.747500.050.139.117.017.7510BZT03C1312.41314.1510500.050.121018.915.9511BZT03C1513.81515.6510500.050.111120.914.4512BZT03C1615.31617.1615250.060.1111222.913.1513BZT03C1816.81819.1615250.060.1111325.611.7515BZT03C2018.82021.2615250.060.1111528.410.6516BZT03C2220.82223.3615250.060.1111631.09.7518BZT03C2422.82425.6715250.060.1111833.88.9520BZT03C2725.12728.9715250.060.1112038.17.9522BZT03C30283032815250.060.1112242.27.1524BZT03C33313335815250.060.1112446.2 6.5527BZT03C363436382140100.060.1112750.1 6.0530BZT03C393739412140100.060.1113054.1 5.5533BZT03C434043462445100.070.1213360.7 4.9536BZT03C474447502445100.070.1213665.5 4.6539BZT03C514851542560100.070.1213970.8 4.2543BZT03C565256602560100.070.1214378.6 3.8547BZT03C625862662580100.080.1314786.5 3.5551BZT03C686468722580100.080.1315194.4 3.2556BZT03C7570757930100100.080.13156103.5 2.9562BZT03C8277828730100100.080.13162114 2.6568BZT03C918591966020050.090.13168126 2.4575BZT03C100941001066020050.090.13175139 2.2582BZT03C1101041101168025050.090.13182152 2.0591BZT03C1201141201278025050.090.13191167 1.85100BZT03C13012413014111030050.090.131100185 1.65110BZT03C15013815015613030050.090.131110204 1.55120BZT03C16015316017115035050.090.131120224 1.35130BZT03C18016818019118040050.090.131130249 1.25150BZT03C20018820021220050050.090.131150276 1.15160BZT03C22020822023335075020.090.131160305 1.05180BZT03C24022824025640085020.090.1311803360.95200BZT03C270251270289450100020.090.1312003800.85220BZT03C300280300320450100020.090.1312204190.725240BZT03-SeriesDocument Number 85599Rev. 1.4, 13-Jul-05Vishay Semiconductors3Electrical CharacteristicsBZT03D...1) 10/1000 exp. falling pulse tp = 1000 µs down to 50 %2)Stand-off voltage = recommended suplly voltagePartnumberZener Voltage RangeDynamic Resistance Test Curre nt Temperature Coefficient of Zener Voltage Reverse Leakage Current ClampingStand-offV Z @ I ZTr zj and TK VZ @I ZI ZT TC VZ @ I ZTI R @ V R V (CL)R 1) @ I RMS I R @ V R 2)VΩmA%/KµA VV AµA Vmintyp max typ max min max max max max BZT03D6V2 5.6 6.2 6.81210000.071500 4.49.534.03000 4.8BZT03D6V8 6.1 6.87.51210000.071000 4.810.531.02000 5.3BZT03D7V5 6.757.58.251210000.07750 5.311.626.51500 5.9BZT03D8V27.48.29121000.030.08600 5.912.624.41200 6.5BZT03D9V18.29.11024500.030.0820 6.513.722.7507.1BZT03D109101124500.050.09107.115.220.3207.9BZT03D119.91112.147500.050.147.916.219.158.6BZT03D1210.81213.247500.050.138.617.517.759.3BZT03D1311.71314.3510500.050.129.319.115.9510.6BZT03D1513.51516.5510500.050.1110.621.814.4511.6BZT03D1614.41617.6615250.060.11111.623.413.1512.6BZT03D1816.21819.8615250.060.11112.626.311.7514.4BZT03D20182022615250.060.11114.429.210.6515.8BZT03D2229.82224.2615250.060.11115.831.99.7517.2BZT03D2421.62426.4715250.060.11117.234.68.9519.4BZT03D2724.32729.7715250.060.11119.4397.9521.5BZT03D30273033815250.060.11121.543.57.1523.5BZT03D3329.73336.3815250.060.11123.547.5 6.5525.8BZT03D3632.43639.62140100.060.11125.851.5 6.0528BZT03D3935.13942.92140100.060.1112856 5.5531BZT03D4338.74347.32445100.070.1213162 4.9533.5BZT03D4742.34751.72445100.070.12133.567.5 4.6536.5BZT03D5145.95156.12560100.070.12136.573 4.2540BZT03D5650.45661.62560100.070.1214081 3.8544.5BZT03D6255.86268.22580100.080.13144.589 3.5549BZT03D6861.26874.82580100.080.1314997 3.2554BZT03D7567.57582.530100100.080.13154107 2.9559BZT03D8273.88290.230100100.080.13159117 2.6565BZT03D9181.9911006020050.090.13165130 2.4571BZT03D100901001106020050.090.13171143 2.2579BZT03D110991101218025050.090.13179157 2.0586BZT03D1201081201328025050.090.13186172 1.8593BZT03D13011713014311030050.090.13193187 1.65106BZT03D15013515016513030050.090.131106213 1.55116BZT03D16014416017615035050.090.131116229 1.35126BZT03D18016218019818040050.090.131126256 1.25144BZT03D20018020022020050050.090.131144284 1.15158BZT03D22019822024235075020.090.131158314 1.05172BZT03D24021624026440085020.090.1311723640.95194BZT03D270243270297450100020.090.1311943880.85215 4Document Number 85599Rev. 1.4, 13-Jul-05BZT03-SeriesVishay SemiconductorsTypical Characteristics (Tamb = 25 °C unless otherwise specified)Package Dimensions in mm (Inches)Figure 1. Epoxy Glass Hard Tissue, Board Thickness 1.5 mm,R thJA ≤100 K/WFigure 2. Total Power Dissipation vs. Ambient Temperature012349495844080120160P –T o t a l P o w e r D i s s i p a t i o n (W )t o t T amb –Ambient T emperature (°C )200Figure 3. Forward Current vs. Forward VoltageFigure 4. Non Repetitive Surge Power Dissipation vs. PulseLength00.5 1.0 1.502.0949585I –F o r w a r d C u r r e n t (A )F V F –Forward Voltage (V )0.010.1110P –N o n -R e p e t i t i v e S u r g e P o w e r Z S M t p –Pulse Length (ms )100949586D i s s ip a t i o n (W )BZT03-SeriesDocument Number 85599Rev. 1.4, 13-Jul-05Vishay Semiconductors5Ozone Depleting Substances Policy StatementIt is the policy of Vishay Semiconductor GmbH to1.Meet all present and future national and international statutory requirements.2.Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.1.Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively2.Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA3.Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.We reserve the right to make changes to improve technical designand may do so without further notice.Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personaldamage, injury or death associated with such unintended or unauthorized use.Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, GermanyDocument Number: 91000Revision: 18-Jul-081DisclaimerLegal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网。