M5 uint 2 reading - 副本
华为G5500服务器G530V2计算节点1.0.0白皮书第3版说明书

Huawei G5500 Server G530 V2 Compute Node 1.0.0White PaperIssue03Date2018-02-12Copyright © Huawei Technologies Co., Ltd. 2018. All rights reserved.No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd.Trademarks and Permissionsand other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.All other trademarks and trade names mentioned in this document are the property of their respective holders.NoticeThe purchased products, services and features are stipulated by the contract made between Huawei and the customer. All or part of the products, services and features described in this document may not be within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information, and recommendations in this document are provided "AS IS" without warranties, guarantees or representations of any kind, either express or implied.The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied.Huawei Technologies Co., Ltd.Address:Huawei Industrial BaseBantian, LonggangShenzhen 518129People's Republic of ChinaWebsite:Email:******************White Paper ContentsContents1 About This Document (1)2 About the G530 V2 and GP316 (3)2.1 Overview (3)2.2 Appearance (3)2.3 Ports (7)2.4 Indicators and Buttons (7)2.5 Physical Structure (9)2.6 Logical Structure (19)2.7 Technical Specifications (21)3 Product Features (23)4 Components (24)5 Management (30)6 Warranty (32)1 About This DocumentPurposeThis document describes the general-purpose compute module G530 V2 and heterogeneouscompute module GP316 of the Huawei FusionServer G5500 server in terms of appearances,features, performance parameters, and configurations, helping users have a deepunderstanding of a compute node consisting of a G530 V2 and a GP316.In this document, a compute node consists a G530 V2 and a GP316.Intended AudienceThis document is intended for:l Huawei presales engineersl Channel partner presales engineersl Enterprise presales engineersChange HistoryChanges between document issues are cumulative. The latest document issue contains allchanges made in previous issues.Issue 03 (2018-02-12)This is the third official release.Issue 02 (2018-01-05)This is the second official release.Issue 01 (2017-10-20)This issue is the first official release.2 About the G530 V2 and GP3162.1 Overview2.2 Appearance2.3 Ports2.4 Indicators and Buttons2.5 Physical Structure2.6 Logical Structure2.7 Technical Specifications2.1 OverviewThe G530 V2 is a half-width compute module that uses the new-generation Intel® Xeon®Scalable processors with the Purley platform to support a large memory capacity and deliverpowerful computing capabilities. The GP316 supports a maximum of 16 half-height half-length single-slot PCIe slots for installing general-purpose GPU (GPGPU) cards and is usedtogether with the G530 V2 to expand the computing capabilities.The G530 V2 and GP316 are installed in a G5500 chassis (chassis for short) and centrallymanaged by the management module. Each chassis can be installed with a maximum of twocompute nodes, and each compute node contains a G530 V2 and a GP316.2.2 AppearanceAppearances of the G530 V2 and GP316Figure 2-1 and Figure 2-2 show the appearances of the G530 V2 and GP316.Figure 2-1 Appearance of the G530 V2Figure 2-2 Appearance of the GP316Installation PositionThe G530 V2 compute modules are installed in the lower two slots of the chassis,corresponding to G530 V2-1 and G530 V2-2. The GP316 heterogeneous compute modulesused together with the G530 V2 compute modules are installed in the upper two slots of thechassis, corresponding to GP316-1 and GP316-2. See Figure 2-3.Figure 2-3 Installation positions of the G530 V2 and GP316 modulesl A maximum of two G530 V2 compute modules can be installed in a chassis, and each G530 V2combines with the GP316 in its upper slot to form a G530 V2 compute node. The two combinationsare independent of each other. When configuring only one compute node, select the combination(G530 V2-1 and GP316-1) on the left.l In each combination, the G530 V2 and GP316 must be installed and removed in the followingsequence: Install the GP316 and then the G530 V2. Remove the G530 V2 and then the GP316.l Maintaining one combination does not affect the proper operation of the other combination. Front PanelFigure 2-4 shows the front panel of the G530 V2.Figure 2-4 Front panel of the G530 V21Label plate2USB 3.0 ports3Power button/indicator4UID button/indicator5HLY indicator6Release button7M.2 module adapter8M.2 module9Ejector lever10 2.5-inch hard disk11Hard disk activity indicator12Hard disk fault indicator13Product model14M.2 module activity indicator15M.2 module fault indicator16VGA portFigure 2-5 shows the front panel of the GP316.Figure 2-5 Front panel of the GP3161Ejector release button2Ejector leverWhen a compute node is installed in the chassis, the ejector release button and ejector lever on theGP316 front panel are invisible because they are blocked by the G530 V2. After the G530 V2 isremoved, they can be seen.SNA serial number (SN) is a string that uniquely identifies a server. A SN is required when youapply for Huawei technical support.Figure 2-6 shows the SN format.Figure 2-6 SN example2.3 PortsTable 2-1 Port description2.4 Indicators and ButtonsThis section describes the indicators and buttons of the G530 V2.Table 2-2 G530 V2 indicators2.5 Physical StructureThis section describes:l Components, PCIe devices, mainboard layout, and connectors of the G530 V2l Components, PCIe devices, PCIe board layout, and connectors of the GP316 ComponentsFigure 2-7 G530 V2 components1RAID controller card2TPM (optional)3USB flash drive (optional)4VGA adapter5Supercapacitor (optional)6Heat sink7M.2 adapter (optional)8M.2 FRUs (optional)9Hard disk10Mainboard11Hard disk tray12CPUs13Mezzanine card14BIOS battery15DIMMs--Table 2-3 G530 V2 component descriptionFigure 2-8 GP316 components1Riser card trays2PCIe board3PCIe switches4Half-height half-length single-slot cards5Riser cards--Table 2-4 GP316 component descriptionPCIe SlotsTable 2-5 and Table 2-6 describe the relationships between the PCIe slots and the CPUs ofthe G530 V2 and GP316, PCIe standards, and Bus/Device/Function Number (B/D/F)information.Table 2-5 G530 V2 PCIe device descriptionThe preceding B/D/F information is the default system configuration. Table 2-6 GP316 PCIe device descriptionl The expansion slot and riser 3 slot 1 cannot be enabled at the same time. Only one of the two slots can be enabled by software programming. By default, the expansion slot is disabled.l The preceding B/D/F information is the system default configuration. If PCIe cards with the PCI bridge function are configured, the B/D/F allocation result will change.l The B/D/F allocation result of an I/O card with two ports is used as an example. Each port corresponds to one B/D/F allocation result.Mainboard LayoutFigure 2-9 G530 V2 connectors and components1TPM connector2VGA adapter connector3RAID controller card connectors4Channel 2 mezzanine cardconnectors6BIOS battery5Channel 1 mezzanine cardconnectors7Backplane guide sleeve8Backplane signal connector9Mezzanine card tray10Backplane power connector12Hard disk backplane connector 11Virtual RAID on CPU (VROC)key connector13Hard disk tray14HLY indicator15UID button/indicator16Power button/indicator17USB 3.0 ports--Figure 2-10 GP316 connectors and components1Signal connectors of riser 42Power connector of riser 43Expansion slot4Power connector of riser 35Signal connectors of riser 36PCIe switch 27Backplane guide sleeves8Backplane power connectors9Backplane signal connectors10PCIe switch 111Signal connectors of riser 112Power connector of riser 113Power connector of riser 214Signal connectors of riser 22.6 Logical StructureFigure 2-11 shows the logical structure of the G530 V2 and GP316.The PCIe x16 ports of the two CPUs in a G530 V2 are connected to two PCIe switches in thecorresponding GP316 through the mezzanine card, each PCIe switch supports two riser cardsand one x16 I/O slot, and each riser card supports four x8 (x16 slot and x8 bandwidth) half-height half-length single-slot PCIe cards. The G530 V2 supports the following storagecapabilities:l Supports two 2.5-inch NVMe SSDs without configuring a RAID controller card. The bandwidth of each SSD is PCIe 3.0 x4. Intel VROC is supported.l Configures an LSI SAS3008 RAID controller card to support two 2.5-inch SAS/SATA hard disks and support RAID 0 and 1.The G530 V2 supports the following external ports:l Two USB 3.0 ports are provided on the panel and one USB 3.0 port is provided on the mainboard.l Two SFP+ Ethernet ports are provided by the 10GE NIC that is integrated into the PCH and connected to the management module through the chassis backplane.l One DB15 VGA port is provided on the panel by the built-in iBMC video card. This port is used for the local maintenance of the compute node.One x8 port of PCIe switch 2 is shared by the expansion slot and riser 3 slot 1 in the GP316. Only one of the two slots can be enabled by software programming. By default, the expansion slot is disabled.Figure 2-11 Logical structure of the G530 V2 and GP316G530 V2-1, GP316-1, MM-1, I/O slot 1, and I/O slot 2 are the configuration combination on the left of the chassis. G530 V2-2, GP316-2, MM-2, I/O slot 3, and I/O slot 4 are the configuration combination on the right of the chassis. The logical structures of the two configuration combinations are the same.2.7 Technical SpecificationsTable 2-7 Technical specificationsWhite Paper 3 Product Features3 Product Featuresl The G5500 chassis supports two compute nodes, providing higher integration.l The G530 V2 supports two Intel® Xeon® Scalable processors (Bronze 3100, Silver 4100, Gold 5100/6100, or Platinum 8100), each with up to 165 W TDP and a maximum of 28cores. The maximum frequency is 3.6 GHz. The two processors provide a large capacityof L3 cache and are interconnected through two UltraPath Interconnect (UPI) links at10.4 GT/s. With the two processors, the G530 V2 delivers higher processingperformance.l The GP316 supports 16 NVIDIA P4 cards, increasing the computing capabilities for the G530 V2.l The G530 V2 provides multiple flexible hard disk configuration solutions.–Two 2.5-inch NVMe SSDs–Two 2.5-inch SAS/SATA hard disks, supporting RAID 0 or 1l The GP316 PCIe slots, PCIe switches and system I/O modules can be powered onsynchronously with the G530 V2, minimizing power consumption when the G530 V2 isnot powered on or installed.4 ComponentsThis section describes the software and hardware that are supported by the G530 V2 andGP316.Use the Huawei Server Compatibility Checker to check the software and hardwaresupported by the G530 V2 and GP316.CPUThe G530 V2 supports two processors.l The G530 V2 supports Intel® Xeon® Scalable processors (Bronze 3100, Silver 4100,Gold 5100/6100, or Platinum 8100), each with the power up to 165 W and a maximumof 28 cores. Use the Huawei Server Compatibility Checker to obtain the specificprocessor modules.l Each processor integrates memory controllers for supporting six DDR4 memorychannels. Each memory channel supports two DDR4 DIMMs of 2400 or 2666 MT/s.l Each processor integrates PCIe controllers for supporting PCIe 3.0 and providing 48lanes.l The two processors are interconnected through two UltraPath Interconnect (UPI) links at10.4 GT/s.l The maximum frequency is 3.6 GHz.MemoryThe G530 V2 provides 24 slots for installing DIMMs (12 DIMMs for each processor). Atleast one DIMM must be configured.Memory Configuration RulesObserve the following rules when configuring DIMMs:1.The G530 V2 supports DIMMs of 8 GB, 16 GB, 32 GB, and 64 GB. A server fullyconfigured with DIMMs has up to 1536 GB of memory.2.The maximum number of DIMMs supported by a compute node varies depending on theCPU type, DIMM type, and number of ranks. For details, see Maximum number ofDIMMs in Table 4-1.l The DIMM slots of CPU 1 must be configured with DIMMs. If DIMMs are configured only in the DIMM slots of CPU 2, the compute node cannot be powered on. Figure 2-9 shows thepositions of CPUs 1 and 2.l Restriction of the number of ranks supported by each channel on the maximum number of DIMMs supported by each channel:Number of DIMMs supported by each channel ≤ Number of ranks supported by each memorychannel/Number of ranks supported by each DIMM3. A compute node cannot be configured with DIMMs (RDIMMs or LRDIMMs) ofdifferent types.4.All DIMMs operate at the same speed, which is the smaller value of:–Memory speed supported by a CPU–The smallest values among the maximum operating speed of specific DIMMs. See the Maximum Operating Speed in Table 4-1.Table 4-1 DIMM configuration rules for Intel® Xeon® Scalable CPUsDIMM Slot Configuration RulesThe G530 V2 provides 24 DDR4 DIMM slots. Each CPU integrates six memory channels. The memory channels for CPU 1 are 1A, 1B, 1C, 1D, 1E, and 1F, and those for CPU 2 are2A, 2B, 2C, 2D, 2E, and 2F. Table 4-2 lists channels for each CPU.Slots 1A1, 1B1, 1C1, 1D1, 1E1, 1F1, 2A1, 2B1, 2C1, 2D1, 2E1, and 2F1 are the primary slots of channels 1A, 1B, 1C, 1D, 1E, 1F, 2A, 2B, 2C, 2D, 2E, and 2F, respectively. When installing DIMMs, install the primary DIMMs first.Table 4-2 ChannelsTable 4-3 shows the DIMM installation rules. See Figure 2-9 for DIMM slot numbers.Table 4-3 DIMM configuration rulesThe unbalanced memory configurations are not recommended.GPGPU CardTable 4-4 shows the GPGPU cards supported by the GP316.Table 4-4 GPGPU cards supported by the GP316Hard DiskThe G530 V2 can be configured with up to two 2.5-inch HDDs or SSDs. Each hard disk canbe independently installed and removed and is hot-swappable. The G530 V2 supports an LSISAS3008 RAID controller card. The RAID controller card provides two SAS or SATA portsthat connect to two 2.5-inch SAS or SATA hard disks. RAID 0 and RAID 1 are supported.After the OS is installed on a hard disk, do not move the hard disk to another compute node; otherwise, avirtual flash drive or CD/DVD-ROM may fail to be mounted on the KVM screen.Table 4-5 lists the performance of different RAID levels, the minimum number of disksrequired, and disk usage.Table 4-5 RAID level comparisonI/O ExpansionThe G530 V2 supports the following I/O extension options:l One mezzanine card that connects to the PCIe switch of the GP316 through the chassis backplane and one I/O module that supports a maximum of two half-height half-lengthsingle-slot PCIe 3.0 x16 cardsl One LAN On Motherboard (LOM) NIC that provides two SFP+ Ethernet ports through the management modulePSUThe G530 V2 and GP316 are powered by PSUs in the G5500 chassis and do not requireindependent power supply.PeripheralThe G530 V2 supports peripherals, such as a USB DVD-ROM drive.OS and SoftwareUse the Huawei Server Compatibility Checker to check OSs and virtualization softwaresupported by the G530 V2.5 Management The compute node uses Huawei's proprietary intelligent baseboard management controller (iBMC) for remote server management. The iBMC complies with Intelligent Platform Management Interface (IPMI) 2.0 and provides highly reliable hardware monitoring and management. It seamlessly communicates with the management module in a chassis and manages the compute nodes in the chassis through the chassis management module.The iBMC supports the following features and protocols:l KVM and text console redirectionl Remote virtual medial IPMI V2.0l Common information model (CIM)l Login using a web browserTable 5-1 describes the features of the iBMC.Table 5-1 iBMC featuresWhite Paper 6 Warranty6 WarrantyAccording to the Huawei Warranty Policy for Servers & Storage Products (Warranty Policyfor short), Huawei provides a three-year warranty for the server, a one-year warranty forDVD-ROM drives and iBBUs, and a three-month warranty for software media.The Warranty Policy stipulates warranty terms and conditions, including the availableservices, response time, terms of service, and disclaimer.The warranty terms and conditions may vary by country, and some services and/or parts maynot be available in all countries. For more information about warranty services in yourcountry, contact Huawei technical support or the local Huawei representative office.。
远程终端单元通信单元560CMR01说明书

Communication Unit 560CMR01RTU560 product line Remote Terminal Units - Data sheetRTU560 product lineCommunication module for RTU560 with 32 bitCPU•2x serial communication interface (RS-232 or RS-485) for remote communication •2x Ethernet interface (10/100BaseT)•1x USB port•1x serial peripheral bus•Battery buffered real time clockApplicationThe 560CMR01 communication unit is one of the CMU modules of the RTU560 product line.The essential tasks are:•Managing and controlling of the I/O modules via theinterface to the serial I/O bus.•Reading Process events from the input modules.•Send commands to the output modules.•Communicating with control systems and local HMIsystems via the serial interfaces (RS232) and the Ethernet 10/100BaseT interfaces.•Communication with Sub-RTU’s, IED’s or multimeterdevices via the interfaces (RS485) and the Ethernet interfaces.•Managing the time base for the RTU560 product linestation and synchronizing the I/O modules.•Handling the dialog between RTU560 product line andWeb-Browser via the LAN interfaces.Within the RTU560 racks the board occupies . Thecommunication unit is able to handle Ethernet- and UART-character based communication protocols.The unit has a battery buffered real time clock (RTC).The unit is available in 2 versions:•R0001: with standard cyber security functions•R0002: with security chip for advanced cyber securityfunctionsFigure 1: Block diagram 560CMR01CharacteristicsOn the applied ARM cortex A8 controller AM3352 a real-time operating system is implemented. The 560CMR01is responsible for the interface management, the event handling, the time base and the internal data base. The controller acts as master for the SPB I/O bus (serial peripheral bus). RTU560 synchronizes itself to the timereferences supplied by 560RTC0x. The time information of the 560RTC0x is provided to the 560CMR01 on the backplane of the sub-rack.System relevant configuration files are stored in the non-volatile flash memory card (removable SD-card™) in order to guarantee a valid system configuration after Power on Reset (PoR).A battery buffered RTC is used to keep an exact time during power off state.The communication unit provides the following interfaces:•Communication Port 1 and 2 (CP1 & CP2): serial interfaces according RS232C or RS485 with RJ45connectors. The communication ports can beconfigured independant as SPB I/O bus interface tothe front.•Ethernet interface 1 and 2 (E1 & E2): 10/100BaseT with RJ45 connector.•USB 2.0 device interface for diagnosis andmaintenance purposes.•The SPB I/O bus is directly connected to the backplane connector.Technical dataIn addition to the RTU500 series general technical data, the following applies:Main Processing Unit MPUCPU ARM cortex A8, AM3352 @800 MHzRAM128 MByteBoot Flash8 MByteSD cardConnector SD card slot (push push) Type SD 2.0, class 2Capacity 4 GByteReal time clock RTC (Backup)Battery Lithium 3 V DC, CR2032 Time resolution 1 sec, 1ms with timesync Battery lifetime> 10 yearsFree running± 50 ppmSerial interfaces CP1 and CP2Connector RJ45Type RS232C or RS485RS232C:Bit rate200 bit/s - 38.4 kbit/sSignal lines GNDTxDRxDRTSCTSDTRDCD E2/102 D1/103 D2/104 S2/105 M2/106 S1.2/108 M5/109Level typical: ± 6VRS485:Bit rate200 bit/s - 38.4 kbit/s Level typical: ± 6VEthernet interface E1 and E2Connector RJ45Type IEEE 802.3, 10/100BaseTUSB interfaceConnector micro USB Type AB(female)Type USB 2.0 device, low, fulland high speed (max. 480MBit/s)Cable type to PC USB Type A <-> micro USBType B Current consumption for power supplied via RTU560 backplane5 V DC500 mA24 V DC 3 mASignaling by LEDsERR (red)ON: RTU in error stateFlashing: RTU in warningstateFor more details seeRTU500 series FunctionDescriptionRUN (green)Communication module inoperationT Transmit data on serialcommunication ports CPR Receive data on serialcommunication ports CPS Ethernet communicationspeed:ON: 100 Mbit/sOFF: 10 Mbit/sL Link up (ON) / Activity(Flashing) on Ethernetinterface EMechanical layoutDimensions160 mm x 100 mm, 3HEeuro card format4R (20 mm) front panel Housing type Printed circuit board Mounting for mounting in RTU560racksWeight0.14 kgConnection typeRTU560 backplaneconnector48 pole type F DIN 41612Immunity testElectrostatic dischargeIEC 61000-4-28 kV air / 6 kV contact (level3)Performance criteria A Radiated Radio-FrequencyElectromagnetic FieldIEC 61000-4-310 V/m (level 3)Performance criteria A Electrical Fast Transient /BurstIEC 61000-4-44 kV (level X)Performance criteria A SurgeIEC 61000-4-52 kV (level 3)Performance criteria A Conducted Disturbances,induced by Radio-Frequency FieldsIEC 61000-4-610 V (level 3)Performance criteria AImmunity testDamped oscillatory wave IEC 61000-4-182.5 / 1 kV (level 3) Performance criteria AEnvironmental conditions - climatic Operating temperatureEN 60068-2-14-25 °C ... 70 °CStart upEN 60068-2-1-40 °CMax. operating temperature,max. 96hEN 60068-2-2+85 °CRelative humidity EN 60068-2-305 ... 95 % (non condensing)Ordering information560CMR01 R00011KGT036200R0001 560CMR01 R00021KGT036200R0002ABB Power Grids Germany AG P.O. Box 10 03 5168128 Mannheim, Germany /rtu We reserve the right to make technicalchanges or modify the contents of thisdocument without prior notice. With regardto purchase orders, the agreed particularsshall prevail. Hitachi ABB Power Grids doesnot accept any responsibility whatsoeverfor potential errors or possible lack ofinformation in this document.We reserve all rights in this document and in thesubject matter and illustrations contained therein.Any reproduction, disclosure to third parties orutilization of its contents – in whole or in parts – isforbidden without prior written consent of HitachiABB Power Grids.© 2020 Hitachi Power GridsAll rights reservedABB is a registered trademark of ABBAsea Brown Boveri Ltd. Manufactured by/for a Hitachi Power Grids company.1KGT15915V71。
UHF读写器用户手册说明书

UHF Reader User Manual2E-26562E-2657Contents1. Model Parameter: (3)2. Model Package: (3)3. Wiring Diagram: (4)3.1 Example with Anson Controller (5)3.2 Connect to Ground: (5)4. Installation: (5)4.1 Installation 1 example: (6)4.2 Mounting reader and height adjustment (6)4.3 Reader Installation Angle Adjustment (7)4.4 Installation Example-Parking Lot (7)4.5 Tag position in vehicle (8)5. Application: (9)6. Quick Start for Software (9)6.1 Connect reader With PC (9)6.1.1 RS232 Communication (10)6.1.2 TCP/IP Communication (10)6.2 Basic Settings: (12)6.2.1 Wiegand Parameter Input Zone: (12)6.2.2 Basic Parameters Input Zone: (12)6.2.3 Freq Parameters Input Zone: (14)6.2.4 Senior Parameter Input Zone: (14)6.2.5 Active Encrypt Function (14)6.2.6 . Get Parameter (17)6.2.7 Set Parameter (17)6.2.8 Default All (17)6.2.9 Net Initialize (17)6.3.10 WIFI Initialize (17)6.3 Senior Settings (17)6.4 EPC Read and Write (18)6.5 ISO1800-6B Read and Write (19)7. Notice (20)1. Model Parameter:2. Model Package:In the package include one reader, 1 RS232 Serial port , 12V adapter and the antenna bearer. When you open the box, please check the spare parts, if with any question, please contact distributor or sales department.See below picture for the inside package and separate products picture(2E -2656).RS232/485 RS232/4851-15mDescription PictureDeviceRS232 Serial PortCable12V AdapterAntenna Bearer3. Wiring Diagram:Description Model Wire No. Color Function1 Red DC9-15Positive 2E-2656/57V2 Black GND Negative 2E-2656/573.1 Example with Anson Controller3.2 Connect to Ground:In case you use the external power supply for the UHF reader, then you must have acommon ground with controller, or will cause unknown problems.4. Installation:In general there are two installation ways of UHF reader, see blow picture 1 and 2.7 2E-2656/572E-2656/57PIN58 Grey Trigger/ 2E-2656/57 9 Orange 485+ / 2E-2656/57 10 Purple 485-/ 2E-2656/57TCP/IP UHF reader without Grey, orange and purple cable. 4 Green Data0 Wiegand D0 5 Yellow TXD RS232 PIN26BrownRXDRS232 PIN32E-2656/577 Blue GND RS232 GND 3 White Data1 Wiegand D12E-2656/572E-2656/57(1) (2)Installation 1 will be easy for installation, but distance will be less than installation 2, installation 2 will be more difficult for installation.4.1 Installation 1 example:4.2 Mounting reader and height adjustmentFor installation 1, the mounting pole diameter should be 50-60mm, height should be 2.2m, we suggest to use the stainless steel material(thickness greater than 1.2mm), use the bearer inside the reader box to fix into pole top, and adjust the height from reader center position to road according to vehicle type, in general the height is 1.8-2.2m.For installation 2,the L type mounting pole diameter should be 60-80mm, the cross beam diameter should be 50-60mmmm, and we suggest to use the stainless steel material(thickness should be 1.2mm-2mm).Use the bearer inside the reader box to fix into pole top and adjust the height from reader center position to road according to vehicle type, in general the height is 3.5-4m.4.3 Reader Installation Angle AdjustmentSee below picture 3 and 4 for reference adjust angle for reader.3 44.4 Installation Example-Parking LotPrincipal to install the reader:(1)Reader and barrier gate linear distance no go across 1m.(2)Between reader and tag, no items covered.(3)Distance between reader and control panel or PC distance we suggest as closer as possible and install shielded communication cable.(4)For detailed installation please according to real situation.Reader close to barrier, and make sure the sensing area can cover the ground sensor,See below picture.4.5 Tag position in vehicleIn general, the parking devices are installed in the left side of the lane, then the tag should be stick in the position of below picture showed.For small vehicle, we suggest A, B and C position, for big truck or big bus, we suggest D, E and F position. The principal of the tagposition is not cover the eyesight of driver.Suggest Position: If reader install in left side, then suggest A and E position. If reader install in the top, then suggest B and F, if reader install in right side, then we suggest C and D position.Tag installation when vehicle windshield with metal UV film:(1) Original UV film: According to European standard, Position B willreserve2E-2656 is 1-6m, 2E-2657 is 1-15m. And the vehicle speed should less than 15km/h.120m*70mm space(no contain metal) for RFID stickers. When install the tag, just install in the B position.(2)Self-stick UV film: Cut a space 120*70mmm special for RFID stickers.We suggest B,D or E position.(3) Use anti-metal tags, install in the car license plate.(4) Manual hold the RFID card to read.Correct Hold Card Wrong Hold Card5. Application:(1) Transport Control:(2) Vehicle Management(3) Parking Management(4) Access Control Management(5) Product Anti-fake Detection(6) Anti-thief Management6. Quick Start for SoftwareThe UHF reader with software to read and write the tags and cards, as well to adjust the basic parameter of the reader.6.1 Connect reader With PCThere are two mode of reader, one is TCP/IP and RS232 communication, the other is RS232 communication only.6.1.1 RS232 CommunicationThere are two client in software package, on is RFIDDemo3203.exe other is Netconfig.exe. For RS232 communication device, just open RFIDDemo3203.exe client.See below.Please ensure serial port of reader connect with PC, and select correct port in PC, then select baud rate, then click connect.6.1.2 TCP/IP CommunicationFor TCP/IP communication, you need open two client, Netconfig.exe and RFIDDemo3203.exe. Netconfig.exe to get the IP address and port of connected UHF reader. You can open it by click broadcast.1.See blow procedure 1, click broadcast to get the IP of uhf reader.2.And input the detected IP, but make sure that your pc and the address at the same LAN, be simple, you can ping the IP, see procedure 2.3.Then click “Connect” to connect the reader.4. If communication OK, see below6.2 Basic Settings:6.2.1 Wiegand Parameter Input Zone:It is mainly related to Wiegand output interface. Only communication mode is Wiegand26 or Wiegand34 available.Byte Offset:The byte of card number to be offset, there is a initial position when read card number. To change the initial position, for example Wiegand 26,output 3 byte, but 18600-6B card number (E0 01 02 03 04 05 06 07) i s 8 byte, the parameter is this 3 byte, when the value is 0, it is (E0 01 02), when the value is 1, It is (01 02 03)... More details, please refer to Wiegand protocol.Output Period: It is frequency of Wiegand port. More details, please refer to Wiegand protocol. Pulse Width: It is the time length of Wiegand signal.Pulse Period: It is interval time that from first low pulse to next low pulse sending. For details, please refer to Wiegand protocol.Note: In general, user only need set byte offset, other setup is default.6.2.2 Basic Parameters Input Zone:Work Mode:It includes 3 items:Active , Passive and Response modeActive: Reader keep reading card, and transmit each of card number by communication port (apply to active upload data).Passive: Reader keep reading card, and each of card number store in reader, but do not upload card number,the max. storage is 100pcs (apply to passive upload). 3. Response: Reader do not read card, reader response according difference commands. For example, PC send a recognize card command, reader will read a time and reply card number to PC (apply to short distance read and write card, test).Output Mode:It includes RS232, TCPIP, CANBUS, Wiegand26 and Wiegand34.RS232: Serial port communication mode, It connects with PC serial port directly and point to point mode.TCPIP:Network communication mode, it communicate with PC by LAN or WAN. CANBUS:BUS communication mode, it is point to multiple mode.Wiegand26:It is standard reader communication mode, one-way communication mode. Wiegand34 :It is standard reader communication mode, one-way communication mode.Read Interval:The speed of reading card.Note: read card interval must more than 10ms. If read card interval is too short, it will short lift of the reader.Power Size: The max. value is 30.Trigger:1. Close: Close trigger mode to read card.2. Low Trigger: When trigger lead (gray wire) connect with low power (OV), reader power on, when trigger lead (gray wire) connect with high power (12V), reader power off.Note: When Trigger mode is Close, trigger lead must connect with high power or low power and can not be dangling.Same ID Interval:When reader read a same card continuously, reader only upload one data. The read interval can be set at here, and if the read time is over set interval, reader will upload continuously. Buzzer: When reader read card, the buzzer beep or not.Buzzer:It includes disable and enable, disable mean turn off the buzzer, when read card, no beep, enable mean turn on the buzzer, when read card, with beep.Card Type:1. ISO18000-6B:Only read ISO18000-6B protocol tag.;2. EPC (GEN 2 )Single – Tag :Only read EPC(GEN 2)protocol tag, read one tag one time. Reader hard to or not read multiple tags when put them in the effective range.3. EPC (GEN 2 )Multi – Tag:Only reader EPC (GEN 2 )protocol tag, multi-tag can be read.4. EPC (GEN2 )Multi –Data:Only read EPC (GEN 2 )protocol tag,except read default EPC area 12 bytes data, other area data can be read. (Select this type and set to read the length of other area data in senior parameter, the max. Is 12 bytes)5. ISO18000-6B + EPC (GEN 2 ): ISO18000-6B and EPC (GEN 2 )protocol tag can be read.Freq Parameters Input Zone It refer to 18000-6b and EPC card, normally hopping need be selected.6.2.3 Freq Parameters Input Zone:It refer to 18000-6b and EPC card, normally hopping need be selected.6.2.4 Senior Parameter Input Zone:It is used for multiple channel reader (split reader), integrative reader default is antenna 6.2.5 Active Encrypt FunctionFor this version software, the encrypt function is hided, to enable the encrypt function, please see below procedure.1) Press”F8” 5 Time s2) Choose then “Enabled”, and set password, then set Parameters [Set Para].3) Now, put the tag on the reader, the reader is not beep;4) Presses “Encrypt Tag”, until the reader beep, then enc rypt succeed;Note: when the encrypt tag, you can move the tag to accelerate the process of encryption;6.2.6 . Get ParameterClick “Get Para” button, parameter of the reader can be acquired. Acquire parameter succeed if display green in status bar; Acquire parameter failure if display red in status bar.(Do not read card when acquire parameter)6.2.7 Set ParameterWhen change parameter in demonstration area, click “Set Para” button, updated data will be set in currently reader. Setup succeed if display green in status bar; Setup failure if display red in status bar.6.2.8 Default AllClick “ Default All” button, basic parameter and senior parameter will recover to default. (Need to click “parameter setup”, updated parameter will be set in reader).6.2.9 Net InitializeNull6.3.10 WIFI InitializeNull6.3 Senior SettingsSenior settings is mainly setup the TCP/IP reader parameter, such as IP address, Syris config and time config etc.TCP/IP config: User can modify the TCP/IP uhf readerSYRIS Config: It is to set Syris SN and Syris ID.Time Config: It is to set reader time.Soft Config: In general can ignore the function, soft reset, is reset the device by software.6.4 EPC Read and WriteThe module is used to read and write the EPC card number. when you click the module, will show below picture interface.Identify:When click, the card in the reader Hex number will display here.Read: When click read, the related address and length Hex number will display, for example the card number is 01-02-03-04-05-06-08-09-10-11-12,Address 2, length 2: 01-02, length is 3, then 01-02-03Address 3., length 2:03-04Address 4, length 2: 05-06...Write: When click write, will write the related Hex to related address.For example the card number is 01-02-03-04-05-06-07-08-09-12-10Address is 2 and length is 2, and write 02-01 to the address, then the card no. Become 02-01-03-04-05-06-07-08-09-10-11-12If write to address 3 and the length is 2.Then card number become 01-02-02-01-05-06-08-09-10-11-126.5 ISO1800-6B Read and WriteFor this module is to read and write 1800-6B card number.Identify:When click, the card in the reader Hex number will display here.Read: When click read, the related address and length Hex number will display, for example the card number is E0-04-00-00-3F-0B-22-07-00-00-00-00,Address 0, length 2: E0-04, length is 3, then E0-04-00Address 1., length 2:04-00Address 2, length 2: 00-00...Write: When click write, will write the related Hex to related address.For example the card number is E0-04-00-00-3F-0B-22-07-00-00-00-00,Address is 0 and length is 2, and write 01-02 to the address, then the card no. Become 01-02-00-00-3F-0B-22-07-00-00-00-00,If write to address 1 and the length is 2.Then card number become E0-01-02-00-3F-0B-22-07-00-00-00-007. Notice1. When reader is working, the operator should away from reader 30cm to satisfy the FCC RF requirement.2. Reader must away from the high he strong magnetic field3. When reader use external power supply, must connect the common ground with the controller or the device you connect with.4. For the reader, we suggest 9-15v power supply, you’d better use the power supply we supply or appropriate voltage power supply.5. Mount the reader on a round pole or flat surface when you do installation.6. Connect all the wire as wiring diagram suggest.。
Ubiquiti NanoStation M5用户手册说明书

M5M51008DVP中文资料

Regarding the change of names mentioned in the document, such as Mitsubishi Electric and Mitsubishi XX, to Renesas Technology Corp.The semiconductor operations of Hitachi and Mitsubishi Electric were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.) Accordingly, although Mitsubishi Electric, Mitsubishi Electric Corporation, Mitsubishi Semiconductors, and other Mitsubishi brand names are mentioned in the document, these names have in fact all been changed to Renesas Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself.Note : Mitsubishi Electric will continue the business operations of high frequency & optical devices and power devices.Renesas Technology Corp.Customer Support Dept.April 1, 2003To all our customers元器件交易网1048576-BIT(131072-WORD BY8-BIT)CMOS STATIC RAMDESCRIPTIONFEATURESThe M5M51008DP,FP,VP,RV,KV are a 1048576-bit CMOS static RAM organized as 131072 word by 8-bit which are fabricated using high-performance quadruple-polysilicon and double metal CMOS technology. The use of thin film transistor (TFT) load cells and CMOS periphery result in a high density and low power static RAM.They are low standby current and low operation current and ideal for the battery back-up application.The M5M51008DVP,RV,KV are packaged in a 32-pin thin small outline package which is a high reliability and high density surface mount device(SMD). Two types of devices are available. M5M51008DVP(normal lead bend type package),M5M51008DRV(reverse lead bend type package).Using both types of devices, it becomes very easy to design a printed circuit board.PackageAPPLICATIONSmall capacity memory unitsDirectly TTL compatible : All inputs and outputsEasy memory expansion and power down by S1,S2Data hold on +2V power supplyCommon data I/O1048576-BIT(131072-WORD BY 8-BIT)CMOS STATIC RAMFUNCTIONThe operation mode of the M5M51008D series are determined by a combination of the device control inputs S 1,S 2,W and OE.Each mode is summarized in the function table.A write cycle is executed whenever the low level W overlaps with the low level S 1and the high level S 2. The address must be set up before the write cycle and must be stable during the entire cycle.The data is latched into a cell on the trailing edge of W,S 1or S 2,whichever occurs first,requiring the set-up and hold time relative to these edge to be maintained. The output enable input OE directly controls the output stage. Setting the OE at a high level,the output stage is in a high-impedance state, and the data bus contention problem in the write cycle is eliminated.A read cycle is executed by setting W at a high level and OE at a low level while S 1and S 2are in an active state(S 1=L,S 2=H).When setting S 1at a high level or S 2at a low level, the chip are in a non-selectable mode in which both reading and writing are disabled. In this mode, the output stage is in a high- impedance state, allowing OR-tie with other chips and memory expansion by S 1and S 2. The power supply current is reduced as low as the stand-by current which is specified as I CC3or I CC4, and the memory data can be held at +2V power supply, enabling battery back-up operation during power failure or power-down operation in the non-selected mode.FUNCTION TABLENote 1: "H" and "L" in this table mean VIH and VIL, respectively.2: "X" in this table should be "H" or "L".1048576-BIT(131072-WORD BY 8-BIT)CMOS STATIC RAMABSOLUTE MAXIMUM RATINGSCAPACITANCE Symbol ParameterTest conditionspF pFUnit Max 10TypMinLimits Input capacitance Output capacitanceC I C OParameterSupply voltage Input voltage Output voltage Power dissipationOperating temperature Storage temperatureUnit V V V mW °C °CConditionsWith respect to GND Ta=25°C7000~70– 65~150Ratings Symbol V cc V I V O P d T opr T stgDC ELECTRICAL CHARACTERISTICS (Ta=0~70°C, Vcc=5V±10%, unless otherwise noted)Symbol ParameterV V V MaxTypLimits Min Test conditionsUnit V µA – 0.3*~7– 0.3*~Vcc + 0.3(Ta=0~70°C, Vcc=5V±10% unless otherwise noted)0~Vcc * –3.0V in case of AC ( Pulse width ≤ 50ns )Note 3: Direction for current flowing into an IC is positive (no mark).4: Typical value is Vcc = 5V, Ta = 25°CmA* –3.0V in case of AC ( Pulse width ≤ 50ns )µAµAmAVVcc + 0.30.82.2–0.3*2.43Stand-by current0.4±1Active supply current (AC, MOS level)Active supply current (AC, TTL level)Vcc – 0.5±180V IH V IL V OH V OL I I I OI CC1I CC2I CC3I CC4High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage Input currentOutput current in off-state Stand-by current I OH = –1.0mA I OH = –0.1mA I OL =2mA V I =0~VccS 1=V IH or S 2=V IL or OE=V IH V I/O =0~V CCS 1=V IL ,S 2=V IH ,other inputs=V IH or V IL Output-open(duty 100%)1) S 2≤ 0.2V,other inputs=0~V CC 2) S 1≥ V CC –0.2V,S 2 ≥ V CC –0.2V,other inputs=0~V CC S 1=V IH or S 2=V IL ,other inputs=0~V CC~25°C ~40°C ~70°C-H2620mA151MHz S 1≤ 0.2V, S 2≥ VCC–0.2Vother inputs ≤ 0.2V or ≥ VCC–0.2V Output-open(duty 100%)851570ns 55ns 70701MHz 70ns 55ns V O =GND,V O =25mVrms, f=1MHzFP,VP,RV,KVFP,VP,RV,KV V I =GND, V I =25mVrms, f=1MHz 845343739421048576-BIT(131072-WORD BY 8-BIT)CMOS STATIC RAM(2)READ CYCLE(3)WRITE CYCLESymbol Parametert CR Read cycle timeAddress access timeUnit ns ns ns ns ns ns ns ns ns ns ns nsSymbol ParameterUnit ns ns ns ns ns ns ns ns ns ns ns ns nsLimitst a(S1)t a(S2)t a(OE)t dis(S1)t dis(S2)t dis(OE)t en(S1)t en(S2)t en(OE)t V(A)t a(A)LimitsAC ELECTRICAL CHARACTERISTICS (Ta=0~70°C, 5V±10% unless otherwise noted ) (1)MEASUREMENT CONDITIONSChip select 1 access time Chip select 2 access time Output enable access time Output disable time after S 1high Output disable time after S 2low Output disable time after OE high Output enable time after S 1low Output enable time after S 2high Output enable time after OE low Data valid time after address70707035252525701010510Write cycle time Write pulse width Address setup timeAddress setup time with respect to W Chip select 1 setup time Chip select 2 setup time Data setup time Data hold timeWrite recovery timeOutput disable time from W low Output disable time from OE high Output enable time from W high Output enable time from OE low252570500555555300055Input pulse level V IH =2.4V,V IL =0.6V (-70H)V IH =3.0V,V IL =0.0V (-55H) Input rise and fall time 5ns Reference level V OH =V OL =1.5VOutput loads Fig.1, C L =100pF (-70H)C L =30pF (-55H)C L =5pF (for t en ,t dis )Transition is measured ± 500mV from steady state voltage. (for t en ,t dis )..........................................................Fig.1 Output loadMin Max -70HMax Min t CW t w(W)t su(A)t su(A-WH)t su(S1)t su(S2)t su(D)t h(D)t rec(W)t dis(W)t dis(OE)t en(W)t en(OE)-70H L ( Including scopeand JIG )1.8k ΩV CCDQ202055450505050250055Max Min -55H 55555530202020555555Min Max -55H1048576-BIT(131072-WORD BY 8-BIT)CMOS STATIC RAMRead cycleWrite (W (4)TIMINGDIAGRAMS DQ 1~8S 1S 2OEWA 0~16DQ 1~8S 1S 2OEA 0~161048576-BIT(131072-WORD BY 8-BIT)CMOS STATIC RAMWrite cycle (S 1control mode)Write cycle (S 2control mode)DQ 1~8S 1S 2WA 0~16DQ 1~8S 1S 2WA 0~16Note 5: Hatching indicates the state is "don't care".6: Writing is executed while S 2high overlaps S 1and W low.7: When the falling edge of W is simultaneously or prior to the falling edge of S 1or rising edge of S 2, the outputs are maintained in the high impedance state.8: Don't apply inverted phase signal externally when DQ pin is output mode.1048576-BIT(131072-WORD BY 8-BIT)CMOS STATIC RAMV CC = 3V1) S 2 ≤ 0.2V, other inputs = 0~3V 2) S 1 ≥ V CC –0.2V,S 2 ≥ V CC –0.2V other inputs = 0~3V(Ta=0~70°C, unless otherwise noted)S 2≤ 0.2V(3)POWER DOWN CHARACTERISTICS S 1control modeS 2control modePOWER DOWN CHARACTERISTICS(1)ELECTRICAL CHARACTERISTICS Power down set up time Power down recovery time(2)TIMING REQUIREMENTS (Ta=0~70°C, unless otherwise noted )t su (PD)t rec (PD)Symbol Parameterns MaxTypLimits Min Test conditionsUnit 05msV CCS 1V CCS 2Symbol ParameterV VMaxTypLimits Min Test conditionsUnit µA0.2V CC (PD)V I (S1)V I (S2)I CC (PD)Power down supply voltage Chip select input S 1Chip select input S 2Power down supply current2.2~25°C ~40°C~70°C-H 1310V0.8Vcc(PD)4.5V ≤Vcc(PD)Vcc(PD)<4.5V 2.2V ≤Vcc(PD) 2.02V ≤Vcc(PD)≤2.2V Note 9: On the power down mode by controlling S 1,the input level of S 2 must be S 2 ≥Vcc - 0.2V orS 2 ≤ 0.2V. The other pins(Address,I/O,WE,OE) can be in high impedance state.Keep safety first in your circuit designs!Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.Notes regarding these materialsThese materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party.Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein.The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page ().When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein.Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials.If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination.Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein.。
FusionModule500 微型智能微模块数据中心 用户手册 (ECC800e)说明书

FusionModule500 微型智能微模块数据中心用户手册(ECC800e)文档版本08发布日期2020-03-16版权所有© 华为技术有限公司2020。
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华为技术有限公司地址:深圳市龙岗区坂田华为总部办公楼邮编:518129网址:https://前言概述●本文档介绍了FusionModule500微型智能微模块数据中心(本文简称为智能微模块)产品的安装、调测、运行和维护过程。
●本手册中的界面对应软件版本号V100R002C00。
读者对象本文档主要适用于以下人员:●行销工程师●技术支持工程师●系统工程师●硬件安装工程师●调测工程师●数据配置工程师●维护工程师符号约定在本文中可能出现下列标志,它们所代表的含义如下。
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文档版本08 (2020-03-16)优化“准备和登录Web”章节。
文档版本07 (2019-12-20)更新安全注意事项。
文档版本06 (2019-11-22)刷新密码修改说明。
文档版本05 (2019-03-10)刷新手册名称等。
文档版本04 (2019-03-06)刷新摄像机和VCN调测内容。
文档版本03 (2018-10-31)新增VCN540安装方案。
Skyworks Si53159 EVALUATION BOARD 用户指南说明书

Si53159-EVB Si53159 E VALUATION B OARD U SER’S G UIDEDescriptionThe Si53159 is a nine port PCIe clock buffer compliant to the PCIe Gen1, Gen2 and Gen3 standards. The Si53159 is a 48-pin QFN device that operates on a 3.3V power supply and can be controlled using SMBus signals along with hardware control input pins. The device is spread aware and accepts frequency spread differential clock frequency range from 100 to 210MHz. The connections are described in this document.EVB FeaturesThis document is intended to be used in conjunction with the Si53159 device and data sheet for the following tests:⏹PCIe Gen1, Gen2, Gen3 compliancy⏹Power consumption test⏹Jitter performance⏹Testing out I2C code for signal tuning⏹In-system validation where SMA connectors arepresent2SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•1. Front PanelFigure 1.Evaluation Module Front PanelTable 1. Input Jumper SettingsJumper LabelTypeDescriptionOE0I OE0, 3.3V Input for Enabling DIFF0 Clock Output .1 = DIFF0 enabled, 0 = DIFF0 disabled.OE1I OE1, 3.3V Input for Enabling DIFF1 Clock Output .1 = DIFF1 enabled, 0 = DIFF1 disabled.OE2I OE2, 3.3V Input for Enabling DIFF2 Clock Output .1 = DIFF2 enabled, 0 = DIFF2 disabled.OE3I OE3, 3.3V Input for Enabling DIFF3 Clock Output .1 = DIFF3 enabled, 0 = DIFF3 disabled.OE4/5I OE4/5, 3.3V Input for Enabling DIFF4 and DIFF5 Clock Outputs.1 = DIFF4 & DIFF5 enabled, 0 = DIFF4 & DIFF5 disabled.OE6/8I OE6/8, 3.3V Input for Enabling DIFF6, DIFF7 and DIFF8 Clock Outputs.1 = DIFF6, DIFF7 & DIFF8 enabled, 0 = DIFF6, DIFF7 & DIFF8 disabled.CLKPWGD/PDI3.3V LVTTL Input.After CLKPWGD (active high) assertion, this pin becomes a real-time input for asserting power down (active low).SDATA I/O SMBus-Compatible SDATA .SCLKISMBus-Compatible SCLOCK .SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************• 31.1. Generating DIFF Outputs from the Si53159Upon power-on of the device if the differential input is applied and input pins are left floating, by default all DIFF outputs DIFF[0:8] are ON. The input pin headers have clear indication of jumper settings for setting logic low (0)and high (1) as shown in the figure below, the jumper placed on the middle and left pin will set input OE0 to low;and jumper placed on the middle and right pin will set input OE0 to high.The output enable pins can be changed on the fly to observe outputs stopped cleanly. Input functionality is explained in detail below. 1.1.1. OE [0:8] InputsThe output enable pins can change on the fly when the device is on. Deasserting (valid low) results in corresponding DIFF output to be stopped after their next transition with final state low/low. Asserting (valid high)results in corresponding output that was stopped are to resume normal operation in a glitch-free manner. Each of the hardware OE [0:8] pins are mapped via I 2C to control bit in Control register. The hardware pin and the Register Control Bit both need to be high to enable the output. Both of these form an “AND” function to disable or enable the DIFF output. The DIFF outputs and their corresponding I 2C control bits and hardware pins are listed in Table 2.Table 2. Output Enable ControlI2C Control BitOutput Hardware Control InputByte1 [bit 4]DIFF0OE0 Byte1 [bit 2]DIFF1OE1 Byte2 [bit 1]DIFF2OE2 Byte2 [bit 0]DIFF3OE3 Byte1 [bit 7]DIFF4OE4/5Byte1 [bit 6]DIFF5OE4/5Byte2 [bit 5]DIFF6OE6/8Byte2 [bit 4]DIFF7OE6/8Byte2 [bit 3]DIFF8OE6/82. SchematicsFigure4.Clock and Control Signals Figure5.Differential Clock Signals SCLK/SDATASkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•5Copyright © 2021 Skyworks Solutions, Inc. All Rights Reserved.Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks’ Terms and Conditions of Sale.THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. 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数据库运维形考任务5

数据库运维形考任务5在当今数字化的世界中,数据库已经成为企业、政府和学术界等各个领域的重要信息存储和管理工具。
为了确保数据库的稳定、安全和高效运行,数据库运维工作显得至关重要。
本文将探讨数据库运维形考任务5的相关内容。
一、任务描述本次形考任务的目标是完成一个数据库的运维工作。
具体包括数据库的安装、配置、备份与恢复、优化以及安全防护等方面。
通过本次任务,旨在加深对数据库运维工作的理解和掌握,提高实际操作能力。
二、任务步骤1、安装数据库服务器首先,需要选择合适的数据库服务器,并按照操作指南完成安装过程。
在安装过程中,需要注意服务器的硬件配置、操作系统版本以及数据库版本等因素。
2、配置数据库服务器完成安装后,需要对数据库服务器进行配置。
这包括设置数据库服务器的网络连接、优化数据库性能、配置安全参数等。
在配置过程中,需要确保服务器的正常运行,并做好相应的维护工作。
3、创建与管理数据库在服务器上创建数据库,并管理数据库对象,如表、视图、存储过程等。
同时,需要制定备份与恢复策略,确保数据的安全性和完整性。
4、优化数据库性能通过监控和分析数据库的性能指标,采取相应的优化措施,提高数据库的处理速度和响应时间。
常见的优化方法包括调整数据库参数、优化数据库查询语句、增加硬件资源等。
5、安全防护为防止未经授权的访问和恶意攻击,需要采取安全防护措施。
这包括设置防火墙、定期更新补丁和安全软件、限制用户访问权限等。
同时,需要对重要数据进行加密处理,以保障数据的安全性。
三、任务总结通过本次形考任务,我们深入了解了数据库运维工作的主要内容和流程。
在实际操作过程中,我们不仅提高了对数据库管理的技能和经验,还意识到数据库运维工作的重要性。
为了更好地完成这项任务,我们需要不断学习和掌握更多的技术和工具,以便更好地应对不断变化的业务需求和技术环境。
四、参考文献1、王珊,萨师煊.数据库系统概论(第5版)[M].北京:高等教育社, 2014.2、李劲. SQL Server 2012数据库管理与开发[M].北京:清华大学社, 2014.3、张蒲生.数据库安全技术[M].北京:国防工业社, 2014.数据库运维形考实验5一、引言在信息时代,数据库已经成为企业、机构和组织运作的重要支柱。
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Unit 2 Reading
--- The economy or the environment ---must we choose? Part One:
Read paragraph 1 and answer the following question.
Q1: What is the question of the debate?
Q2: Who are the two speakers and what society does each of them belong to?
Part Two:
Part Three:
Read Qian Liwei’s speech and finish the following questions.
Firstly read the first paragraph of Qian Liwei’s speech and answ er the questions below.
Q1: In Qian Liwei’s opinion, what do people often think of when it comes to
Q2: In Qian Liwei’s opinion, what do people find the busine ssmen?
(no more than 1 word)
Q3: In Qian Liwei’s opinion, what belief do people often have?
Secondly read the rest paragraphs and judge the following sentences True (T) or False (F) according to the text.
1. Although factories and industries are not concerned about the environment, they don’t control the pollution. ( F)
2. Qian Liwei also agrees to reduce production in order to save the environment. ( F)
3. In Qian Liwei’s opinion, we need better laws to preserve the environment. ( T)
4. People are concerned about the environment, but they are not willing to pay a higher price for environmentally friendly goods. ( F)
5. Those factories which pollute the environment should have to pay high taxes. ( T)
6. In Qian Liwei’s opinion, we should use more recycled materials than raw materials in production. ( T)
At last choose the best answer of the question below according to he whole text. What below do Lin Shuiqing and Qian Liwei both mention in their speech?
A. chemical waste and laws
B. population and production
C. recycling waste and production
D. water pollution and taxes
课文中的难句分析:
1.First I am talking to you about the way vast areas of the world are damaged
by chemical waste.
2.Other types of waste flow into our water, killing river and sea life.
3.This will result in a smaller amount of fish left for us to eat in the future.
4.While we damage our environment, we keep producing more and more
people who need more land to live on and more food to eat.
5.It is out duty to cut back on production and reduce the amount of things we
make and buy.
6.It would be good to increase the amount of things we recycle, and teach
people ways of living that do not harm the environment.
7.It is clear that you are very concerned about the present situation of our
environment.
8.When people think of factories, they think of clouds of dirty smokes or of
pipes pouring chemical waste into rivers. They think of greedy businessmen hiding from their responsibilities and only worrying about money.
9.People often have this belief that development is bad for the environment,
but this does not have to be true.
10.What I’m here to say is that having wor ked with many environmental
consultants, I know that a healthy environment and development should be possible at the same time.
11.There are many factories and industries which control the amount of
pollution they produce, and are very careful to spend money repairing any damage they cause.
12.The people operating these factories are deeply concerned about the
environment.
13.Ms Lin suggested we should cut back on the quantity of things we produce
in order to save the environment.
14.However, I do agree that we should produce more things from materials that
have been recycled, and less from raw materials, the supply of which is growing smaller and smaller.
15.What we need are better laws to preserve the environment and still allow
out country to grow.
16.This includes controls on how many trees are cut down and how many fish
are caught.
17.This might make wood and seafood more expensive, but paying a higher
price for some things is not always bad.
18. Asking around, I find many people willing to pay a little higher price of things that are friendly to the environment.。