BCST GB Team8 -- SprayFlux

Team Members
Champion Process Owner Member Member Member Member Member : : : : : : : James Tien Kelvin Kuo (Process Engineering) T.H. Lay (Production) Jones Chiang (Automation Engineering) Thomas Kao (Process Engineering) K.K. Hu (Quality Engineering) Christine Chang ( Financial )
Opportunity Statement
We are going to phase in mainboard automatic function test and it requires low false rejection. Now we are using foaming flux system with high solid content flux. This application will cause high false rejection rate(10-20%). It also caused test pin conta Total cost saving : 201K for three years
Testability
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Team Member
T.H Lay
K.K Hu Kelvin Kuo Thomas Kao Jones Chiang
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Phase in Spray Flux to Support the Auto-Testing Project
BCST 6-Sigma Green Belt Team # 8 D M A I C
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Define --What is important ?
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I VOC to CTQ & VOB to CTP C
VOC Could not catch up the schedule Retest many times Customer issue Test result could be validate in one time CCR's Finish schedule by normal working time CTP Reduce false rejection rate <4%;Defect Cause by Wave(Skip+Bridge) <1% CBR's Reduce non productivity operation Reduce process cycle time Business Issue Reduce cost VOB Make more profit CTQ Reduce false rejection rate and reduce defect
Process Indicator Conveyor speed Preheat temperature solder tank temperature spray pressure Dip angle of the spray nozzle PCB surface temp.
Output Indicator Touch-up PPM ICT PPY ICT retest rate Functional PPY Functional retest rate
Project Scope
Process : Apply flux, Apply solder, Manual operation,ICT test , Functional test Start Point : Apply flux End Point : Functional test
Project Plan
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Measurement -- How are we doing ?
•Measurement Plan
•Current Retest Rate
•Current Quality Level
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Indicator Measure
Operational Definition
Input
Acid degree of the flux Flux consumption Actually Thinner consumption
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Measurement Plan
Data Source and Location Sample size Who will Collect the Data When will Data be Collected How will Data be Collected Other Data that should be Collected at the same time The beginning of 1 time per every shift shift weekly weekly 100% record Weekly output 100% record Weekly output Random sampling one piece Random sampling one piece Random sampling five pieces
Goes into the Wave Oven Inputs:
P.C Boards Components Solder Flux
Transer to Final Line Customers;
ICT & Function Test Station
Input Indicator Acid degree of the flux Flux consumption Solvent consumption Specific gravity
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SIPOC
SIPOC
End Boundary Output:
Solder P.C B Wave Solder Process --------->
Start Boundary Suppliers:
Flux mfger Inseration line Smt line Solder mfger
Member Thomas Kao
•Air Hood Modification •Training & Test for new process implement •ICT Retest Rate Data Collection & Analysis •Functional Retest Rate Data Collection & Analysis
•Flux and Profile Measurement SOP •Control Chart •ICT Defect Data Collection & Analysis •Touch-up Defect Data Collection & Analysis
Member T.H Lai
•TPM & Daily Check List •Defect Analysis •Nozzle Modification •Retest Rate Improvement
Apply Solder
Manual Operation
eliminate
To Final Line
Air-Sucking
Touch-Up ICT1 Test F G Inspection F Analyze & Rework G
Air-Sucking Y Adjust Fixture
N Fixture Problem G ICT1 Retest F ICT2 Test F Functional Test G Plug Connector
Goal Statement
The target below of this team plan to be finished by 12/20 1. Decrease the false rejection rate down to ~4% 2. Control the wave soldering quality: less than 1% ICT defect caused by wave soldering process (for DCT2000 model)
Project : Phase in Spray Flux to Support the Auto-Testing Project Business Case
This project support the auto testing project which could reduce 48 main board line labor head counts for 3 lines / 2 shift
Adjust Fixture
Production PRE AE
Apply Flux Pre Heat Chip Wave Lambda Wave