D92-02 ASEMI
IR公司_大功率MOS管选型
I DContinuous Drain Current(A)70°Micro3Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPartNumberPD Max.PowerDissipation (W)N-ChannelLogic LevelIRLML2402*912570.54200.25 1.20.95230H1IRLML2803912580.54300.251.20.93230P-ChannelLogic LevelIRLML6302*912590.54-200.6-0.62-4.8230H1IRLML5103912600.54-300.6-0.61-4.8230* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°Micro6Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPartNumberPD Max.PowerDissipation (W)N-ChannelLogic LevelIRLMS1902915401.7200.10 3.2 2.675H2IRLMS1503915081.7300.103.22.675P-ChannelLogic LevelIRLMS6702*914141.7-200.20-2.3-1.975H2IRLMS5703914131.7-300.20-2.3-1.975* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°Micro8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)N-Channel Logic LevelIRF7601* 912611.820 0.035 5.7 4.6 70 H3IRF7603 912621.830 0.035 5.6 4.5 70Dual N-Channel Logic LevelIRF7501* 912651.220 0.135 2.4 1.9 100 H3IRF7503 912661.2530 0.135 2.4 1.9 100P-Channel Logic LevelIRF7604* 912631.8-20 0.09 -3.6 -2.9 70 H3IRF7606 912641.8-30 0.09 -3.6 -2.9 70Dual P-Channel Logic LevelIRF7504* 912671.25-20 0.27 -1.7 -1.4 100 H3IRF7506 912681.25-30 0.27 -1.7 -1.4 100Dual N- and P-Channel Logic LevelIRF7507* 912691.2520 0.1352.4 1.9 100 H3-20 0.27 -1.7 -1.4IRF7509 912701.2530 0.135 2.4 1.9 100-30 0.27 -1.7 -1.4* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)70°SO-8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRF7413913302.5300.011139.250H4IRF7413A 916132.5300.0135128.450IRF9410915622.5300.0375.850Dual N-ChannelIRF7311914352.0200.029 6.6 5.362.5H4IRF7313914802.0300.029 6.5 5.262.5IRF7333917002.0300.10 3.5 2.862.5917002.0300.050 4.9 3.962.5IRF9956915592.0300.103.52.862.5Dual P-ChannelIRF7314914352.0-200.058-5.3-4.362.5H4IRF7316915052.0-300.058-4.9-3.962.5IRF9953915602.0-300.25-2.3-1.862.5* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°SO-8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)RΘMax.ThermalResistance(°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)Dual N- and P-ChannelIRF7317 915682.020 0.029 6.6 5.3 62.5 H42.0-20 0.058 -5.3 -4.3 62.5IRF9952 915622.030 0.103.5 2.8 62.5915622.0-30 0.25 -2.3 -1.8 62.5IRF7319 916062.030 0.029 6.5 5.2 62.52.0-30 0.058 -4.9 -3.9 62.5* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)70°SO-8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelLogic LevelIRF7401912442.5200.0228.77.050H4IRF7201911002.5300.0307.0 5.650IRF7403912452.5300.0228.55.450Dual N-ChannelLogic LevelIRF7101908712.0200.10 3.5 2.362.5H4IRF7301912382.0200.050 5.2 4.162.5IRF7303912392.0300.050 4.9 3.962.5IRF7103910952.0500.1303.02.362.5P-ChannelLogic LevelIRF7204911032.5-200.060-5.3-4.250H4IRF7404912462.5-200.040-6.7-5.450IRF7205911042.5-300.070-4.6-3.750IRF7406912472.5-300.045-5.8-3.750IRF7416913562.5-300.02-10-7.150* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°SO-8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)Dual P-ChannelLogic LevelIRF7104910962.0-200.250-2.3-1.862.5H4IRF7304912402.0-200.090-4.3-3.462.5IRF7306912412.0-300.10-3.6-2.962.5Dual N- and P-Channe Logic LevelIRF7307912421.4200.050 4.3 3.490H4-200.090-3.6-2.9IRF7105910972.0250.1093.5 2.862.52-250.25-2.3-1.862IRF7309912432.0300.050 4.9 3.962.5-300.10-3.6-2.9* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°SOT-223Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFL4105913812.1550.045 3.7 3.060H6IRFL110908612.01000.54 1.50.9660IRFL4310913682.11000.20 1.6 1.360IRFL21090868 2.02001.50.960.660IRFL214908622.02502.00.790.560P-ChannelIRFL9110908642.0-1001.2-1.1-0.6960H6N-ChannelLogic LevelIRLL3303913792.1300.031 4.6 3.760H6IRLL014N 914992.1550.14 2.0 1.660IRLL2705913802.1550.043.83.060* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°D-PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFR33039164257300.0313321 2.2H7IRFR024N9133638550.0751610 3.3IRFR41059130248550.0452516 2.7IRFR12059131869550.0273723 1.8IRFR11090524251000.54 4.3 2.75IRFR120N 91365391000.219.1 5.8 3.2IRFR391091364521000.11159.5 2.4IRFR2109052625200 1.5 2.6 1.75IRFR22090525422000.8 4.833IRFR21490703252502 2.2 1.45IRFR2249060042250 1.1 3.8 2.43IRFR3109059725400 3.6 1.7 1.15IRFR3209059842400 1.8 3.123IRFR42090599425003 2.4 1.53IRFRC2090637426004.421.33* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°D-PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)P-ChannelIRFR55059161057-550.11-18-11 2.2H7IRFR53059140289-550.065-28-18 1.4IRFR90149065425-600.5-5.1-3.25IRFR90249065542-600.28-8.8-5.63IRFR91109051925-100 1.2-3.1-25IRFR91209052042-1000.6-5.6-3.63IRFR9120N 9150739-1000.48-6.5-4.1 3.2IRFR92109052125-2003-1.9-1.25IRFR92209052242-200 1.5-3.6-2.33IRFR92149165850-250 3.0-2.7-1.7 2.5IRFR93109166350-4007.0-1.8-1.12.5* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°D-PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelLogic LevelIRLR27039133538300.0452214 3.3H7IRLR33039131657300.0313321 2.2IRLR31039133369300.0194629 1.8IRLR024N 9136338550.0651711 3.3IRLR27059131746550.042415 2.7IRLR29059133469550.0273623 1.8IRLR120N 91541391000.18511 6.9 3.2IRLR341091607521000.10159.52.4* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°D 2PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)N-ChannelIRFZ24NS 913554555 0.07 17 12 3.3 H10IRFZ34NS 913116855 0.04 29 20 2.2IRFZ44NS 9131511055 0.022 49 35 1.4IRFZ46NS 9130512055 0.020 53 37 1.3IRFZ48NS 9140814055 0.016 64 45 1.1IRF1010NS 913723.855 0.011 84 60 40IRF3205S 9130420055 0.008 110 80 0.75IRFZ44ES 9171411060 0.023 48 34 1.4IRF1010ES 9172017060 0.012 83 59 0.90IRF2807S 9151815075 0.013 71 50 1.0IRF520NS 9134047100 0.2 9.5 6.7 3.2IRF530NS 9135263100 0.11 15 11 2.4IRF540NS 91342110100 0.052 27 19 1.6IRF1310NS 91514120100 0.036 36 25 1.3IRF3710S 91310150100 0.028 46 33 1.0IRF3315S 9161794150 0.082 21 15 1.6IRF3415S 91509150150 0.042 37 26 1.0IRFBC20S 9.101450600 4.4 2.2 1.4 2.5IRFBC30S 9101574600 2.2 3.6 2.3 1.7IRFBC40S 91016130600 1.2 6.2 3.9 1.0* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)100°D 2PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemandNumberCase Outline KeyPart NumberP D Max.PowerDissipation (W)IRFBF20S 9166554900 8.0 1.7 1.1 2.3 H10P-ChannelIRF5305S 91386110-55 0.06 -31 -22 1.4 H10IRF4905S 914783.8-55 0.02 -74 -52 40IRF9520NS 9152247-100 0.48 -6.7 -4.8 3.2IRF9530NS 9152375-100 0.20 -14 -9.9 2.0IRF9540NS 9148394-100 0.117 -19 -13 1.6IRF5210S 91405150-100 0.06 -35 -25 1.0* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)100°D 2PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)N-Channel Logic LevelIRL3302S 916925720 0.020 39 25 2.2 H10IRL3202S916756920 0.016 48 30 1.8IRL3102S 916918920 0.013 61 39 1.4IRL3402S 9169311020 0.01 85 54 1.1IRL3502S 9167614020 0.007 110 67 0.89IRL2703S 913604530 0.04 24 17 3.3IRL3303S 913236830 0.026 38 27 2.2IRL3103S 9133811030 0.014 64 45 1.4IRL2203NS 9136717030 0.007 116 82 0.90IRL3803S 9131920030 0.006 140 98 0.75IRLZ24NS 913584555 0.06 18 13 3.3IRLZ34NS 913086855 0.035 30 21 2.2IRLZ44NS 9134711055 0.022 47 33 1.4IRL3705NS 9150217055 0.01 89 63 0.90IRL2505S 9132620055 0.008 104 74 0.75IRLZ44S 9090615060 0.028 50 36 1.0IRL530NS 9134963100 0.1 15 11 2.4IRL2910S 91376150100 0.026 48 34 1.0* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)100°SOT-227Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous DrainCurrent 25°C(A)RΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelFully Isolated Low ChargeFA38SA50LC 916155005000.1338240.25H21FA57SA50LC916506255000.0857360.20* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°I-PakThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFU33039164257300.0313321 2.2H8IRFU024N 9133638550.0751610 3.3IRFU41059130248550.0452519 2.7IRFU12059131869550.0273723 1.8IRFU11090524251000.54 4.3 2.7 5.0IRFU120N 91365391000.219.1 5.8 3.2IRFU391091364521000.11159.5 2.4IRFU2109052625200 1.5 2.6 1.7 5.0IRFU22090525422000.80 4.8 3.0 3.0IRFU2149070325250 2.0 2.2 1.4 5.0IRFU2249060042250 1.1 3.8 2.4 3.0IRFU3109059725400 3.6 1.7 1.1 5.0IRFU3209059842400 1.8 3.1 2.0 3.0IRFU4209059942500 3.0 2.4 1.5 3.0IRFUC2090637426004.42.01.33.0I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°I-PakThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)P-ChannelIRFU55059161057-550.11-18-11 2.2H8IRFU53059140289-550.065-28-18 1.4IRFU90149065425-600.50-5.1-3.2 5.0IRFU90249065542-600.28-8.8-5.6 3.0IRFU91109051925-100 1.2-3.1-2.0 5.0IRFU91209052042-1000.60-5.6-3.6 3.0IRFU9120N 9150739-1000.48-6.5-4.1 3.2IRFU92109052125-200 3.0-1.9-1.2 5.0IRFU92209052242-200 1.5-3.6-2.3 3.0IRFU92149165850-2503.0-2.7-1.7 2.5IRFU93109166350-4007.0-1.8-1.12.5N-ChannelLogic LevelIRLU27039133538300.0452214 3.3H8IRLU33039131657300.0313321 2.2IRLU31039133369300.0194629 1.8IRLU024N 9136338550.0651711 3.3IRLU27059131746550.04241715IRLU29059133469550.0273623 1.8IRLU120N 91541391000.18511 6.9 3.2IRLU341091607521000.10159.52.4I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°HEXDIPThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFD014907001.3600.2 1.7 1.2120H9IRFD024906991.3600.1 2.5 1.8120IRFD110903281.31000.54 1.00.71120IRFD120903851.31000.27 1.30.94120IRFD210903861.3200 1.50.60.38120IRFD220904171.32000.80.80.50120IRFD214912711.3250 2.00.570.32120IRFD224912721.3250 1.10.760.43120IRFD310912251.3400 3.60.420.23120IRFD320912261.3400 1.80.600.33120IRFD420912271.3500 3.00.460.26120IRFDC20912281.36004.40.320.21120I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI D Continuous Drain Current (A)100°TO-220Qg TotalGate Charge(nC)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C (A)R ΘMax.Thermal Resistance(°C/W)1Faxon Demand Number Case OutlineKeyPart Number P D Max.Power Dissipation (W)N-ChannelLow ChargeIRF737LC91314743000.75 6.1** 1.7 3.9H11IRF740LC 910681254000.5510** 1.039IRF840LC 910691255000.858.0** 1.039IRFBC40LC910701256001.26.2**1.039I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220ABThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFZ24N 9135445550.071712 3.3H12IRFZ34N9127656550.042618 2.7IRFZ44N 9130383550.0244129 1.8IRFZ46N 9127788550.024633 1.7IRFZ48N 9140694550.0165337 1.6IRF1010N 91278130550.0127251 1.2IRF320591279150550.0089869 1.0IRFZ34E 9167268600.0422820 2.2IRFZ44E 91671110600.0234834 1.4IRF1010E 91670170600.01281570.90IRF280791517150750.0137150 1.0IRF520N 91339471000.209.5 6.79.5IRF530N 91351601000.111511 2.4IRF540N 91341941000.0522719 1.6IRF1310N 916111201000.0363625 1.3IRF3710913091501000.0284633 1.0IRF331591623941500.0822115 1.6IRF3415914771501500.0423726 1.0IRFBC209062350600 4.4 2.2 1.4 2.5IRFBC309048274600 2.2 3.6 2.3 1.7IRFBC4090506125600 1.2 6.2 3.9 1.0IRFBE2090610548006.51.81.22.3I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220ABThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)IRFBE3090613125800 3.0 4.1 2.6 2.0H12IRFBF3090616125900 3.7 3.6 2.3 1.0IRFBG209060454100011 1.40.86 2.3IRFBG309062012510005.03.12.01.0P-ChannelIRF9Z24N 9148445-550.175-12-8.53.3H12IRF9Z34N 9148556-550.10-17-12 2.7IRF530591385110-550.06-31-22 1.4IRF490591280150-550.02-64-45 1.0IRF9530N 9148275-1000.20-13-9.2 2.0IRF9540N 9143794-1000.117-19-13 1.6IRF521091434150-1000.06-35-25 1.0IRF62159147983-1500.29-11-7.81.8I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220ABThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)N-Channel Logic LevelIRL3302 916965720 0.020 39 25 2.2 H12IRL3202 916956920 0.016 48 30 1.8IRL3102 916948920 0.013 61 39 1.4IRL3402 9169711020 0.01 85 54 1.1IRL3502 9169814020 0.007 110 67 0.89IRL2703 913594530 0.04 24 17 3.3IRL3303 913225630 0.026 34 24 2.7IRL3103 913378330 0.014 56 40 1.8IRL2203N 9136613030 0.007 100 71 1.230 0.007 61 43 3.2IRL3803 9130115030 0.006 120 83 1.0IRLZ24N 913574555 0.06 18 13 3.3IRLZ34N 913075655 0.035 27 19 2.7IRLZ44N 913468355 0.022 41 29 1.8IRL3705N 9137013055 0.01 77 54 1.2IRL2505 9132520055 0.008 104 74 0.75IRL520N 9149447100 0.18 10 7.1 3.2IRL530N 9134863100 0.10 15 11 2.4IRL540N 9149594100 0.044 30 21 1.6IRL2910 91375150100 0.026 48 34 1.0I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI D Continuous Drain Current (A)100°TO-220 FullPak (Fully Isolated)Qg TotalGate Charge(nC)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous DrainCurrent 25°C(A)R ΘMax.Thermal Resistance (°C/W)1Fax on Demand Number Case OutlineKeyPart Number P D Max.Power Dissipation (W)N-ChannelLow ChargeIRFI740GLC91209404000.55 6.0** 3.139H13IRFI840GLC 91208405000.85 4.8** 3.139IRFIBC40GLC91211406001.24.0**3.139I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220 FullPak (Fully Isolated)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFIZ24N 9150126550.07139.2 5.8H14IRFIZ34N9148931550.041913 4.8IRFIZ44N 9140338550.02428200.024IRFIZ46N 9130640550.023122 3.8IRFIZ48N 9140742550.0163625 3.6IRFI1010N 9137347550.0124431 3.2IRFI32059137448550.0085640 3.1IRFIZ24E 9167329600.071149.6 5.2IRFIZ34E 9167437600.0422115 4.1IRFI510G 90829271000.54 4.5 3.2 5.5IRFI520N 91362271000.207.2 5.1 5.5IRFI530N 91353331000.11117.8 4.5IRFI540N 91361421000.0521813 3.6IRFI1310N 91611451000.0362216 3.3IRFI371091387481000.0252820 3.1IRFI620G 90832302000.8 4.1 2.6 4.1IRFI630G 90652322000.4 5.9 3.7 3.6IRFI640G 90649402000.189.8 6.2 3.1IRFI614G 9083123250 2.0 2.1 1.3 5.5IRFI624G 9083330250 1.1 3.4 2.2 4.1IRFI634G 90738322500.45 5.6 3.5 3.6IRFI644G 90739402500.287.953.1I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220 FullPak (Fully Isolated)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)IRFI720G 9083430400 1.8 2.6 1.7 4.1H14IRFI730G 9065032400 1.0 3.7 2.3 3.6IRFI740G 90651404000.55 5.4 3.4 3.1IRFI734G 9100135450 1.2 3.4 2.1 3.6IRFI744G 91002404500.63 4.9 3.1 3.1IRFI820G 9064130500 3.0 2.1 1.3 4.1IRFI830G 9064632500 1.5 3.12 3.6IRFI840G 90642405000.85 4.6 2.9 3.1IRFIBC20G 90850306004.41.71.1 4.1IRFIBC30G 90851356002.2 2.5 1.63.6IRFIBC40G 9085240600 1.2 3.5 2.2 3.1IRFIBE20G 9085330800 6.5 1.4.86 4.1IRFIBE30G 9085435800 3.0 2.1 1.4 3.6IRFIBF20G 90855309008.0 1.2.79 4.1IRFIBF30G90856359003.71.91.23.6P-ChannelIRFI9Z24N 9152929-550.175-9.5-6.7 5.2H14IRFI9Z34N 9153037-550.10-14-10 4.1IRFI49059152663-550.02-41-29 2.4IRFI9540G 9083742-1000.117-13-9.2 3.6IRFI9540N 9148742-1000.117-13-9.2 3.6IRFI52109140448-1000.06-20-14 3.1IRFI9634G 9148835-2501.0-4.1-2.63.6I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220 FullPak (Fully Isolated)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelLogic LevelIRLI2203N 9137847300.0076143 3.2H14IRLI38039132048300.0066747 3.1IRLIZ24N 9134426550.06149.9 5.8IRLIZ34N 9132931550.0352014 4.8IRLIZ44N 9149838550.0222820 4.0IRLI3705N 9136947550.014733 3.2IRLI25059132763550.00858412.4IRLI520N 91496271000.187.7 5.4 5.5IRLI530N 91350331000.10117.8 4.5IRLI540N 91497421000.04420143.6IRLI291091384481000.02627193.1P-ChannelLogic LevelIRFI9520G 9083537-1000.6-5.2-3.6 4.1H14IRFI9530G 9083638-1000.03-7.7-5.4 3.6IRFI9620G 9087430-200 1.5-3.0-1.9 4.1IRFI9630G 9083840-2000.8-4.3-2.7 3.6IRFI9640G9083940-2000.5-6.1-3.93.1I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI D Continuous Drain Current (A)100°TO-247Qg TotalGate Charge(nC)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C (A)R ΘMax.Thermal Resistance (°C/W)1Fax on Demand Number Case OutlineKeyPart Number P D Max.Power Dissipation (W)1N-ChannelLow ChargeIRFP350LC912291904000.3018**0.6570H16IRFP360LC 912302804000.2023**0.4598IRFP450LC 912311905000.4016**0.6570IRFP460LC 912322805000.2720**0.4598IRFPC50LC 912331906000.6013**0.6570IRFPC60LC912342806000.4016**0.4598I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not rated。
ASM AD9212作业指导书
关键词：定期点检预防保养特殊特性：无1. 目的：通过对设备全面检查和维护，全面了解设备的性能和状态，使设备的使用寿命得到有效的管控，确保设备的状态与性能的完好，延长设备的有效使用寿命。
2．适用范围：本作业指导书适用于ASM AD9212装片机的定期点检、周期性预防保养。
3.周期：3.1设备定期点检周期为12个月。
3.2设备保养周期见《ASM AD9212保养作业方法及判定内容表》。
4.职责:设备的预防保养、定期点检由本工序设备担当人员实施，产品品质由MC人员确认。
5.注意事项：5.1实施人员必须依照文件来点检和保养设备，并如实填写“点检成绩书。
5.2特别要注意：在可能有制品通过的位置进行保养、点检时，要注意备件的紧固、油量的控制等细节问题，不能留有潜在的危险和隐患。
ASM AD9212装片机定期点检判定内容表表1：ASM AD9212定期点检成绩书ASM AD9212保养作业方法及判定内容表表2：ASM AD9212保养成绩书机号：设备编号：设备类型：计划保养日期：表格编号：FCDB13-016A表3：ASM AD9212月保养成绩书机号：设备编号：设备类型：表格编号：FCDB13-017A工作台--------模组绝缘1）进入菜单setup→workholder→off 关闭马达2）进入菜单setup→workholder→MA1（or）MA2→vacuum附录：清理润滑位置和方法1. 清洁光敏传感器（每季）步骤：1）按照之前提示使工作台绝缘2）定位所有光敏传感器3）用真空吸尘器清洁光敏传感器4）通过遮挡与不遮挡传感器检查 service→motion diagnostic→workholder→motor（select target channel）→motor test菜单下的传感器状态2润滑LM导轨（每半年）步骤：1）按照之前提示使工作台绝缘2）手推动工作台，用无尘布擦去LM导轨上所有旧的润滑油3）将LM滑块的注油嘴或滑块定位于适当位置，如下图4）用带适当注油嘴的注油枪对LM导轨滑块注油孔施加适当的THK AFB润滑脂5）手动使工作台从一端移动到另一端4-5次使润滑脂均匀分布在导轨上6）用无尘布擦除LM导轨上多余的润滑脂名称FC ASM AD9212 PM 作业指导书3 清洁砧座（每日）步骤：1）按照之前提示使工作台绝缘2）用无尘布沾酒精擦除砧座表面的污染物名称FC ASM AD9212 PM 作业指导书4 清洁线性马达及磁石板（按需要）步骤：1）按照之前提示使工作台绝缘2）将各功能组件移到一侧3）若线性马达磁表面有障碍物存在，应利用胶布清楚，若有油污存在应用无尘布清洁4）重复步骤2-3清洁线性马达另一侧5 清洁线性编码器（每季）步骤：1）按照之前提示使工作台绝缘2）定位线性马达编码器位置3）拆除编码器，用沾有异丙烷或正庚烷的无尘布清洁光尺与读取头（切勿使用丙酮进行清洗）4）完成清洁后装回编码器并调节位置使整个行程一直亮绿灯及回到参考标识位置时红灯闪烁名称FC ASM AD9212 PM 作业指导书6.润滑LM导轨和引导丝杆与圆锥齿轮及蝸轮蜗杆（每半年）步骤：1）按照之前提示使工作台绝缘2）旋转传动轴使工作台移至适当位置3）用无尘布擦去LM导轨和引导丝杆与圆锥齿轮及蝸轮蜗杆上所有旧的润滑脂4）用注油枪手动对LM导轨滑块注油孔施加适量的THK AFB润滑脂；用加油匙手动对引导丝杆施加适当的NSK PS2润滑脂；用加油匙手动对圆锥齿轮表面施加适量的NSK PS2润滑脂；用加油匙手动对蜗轮蜗杆表面施加适当的NSK PS2润滑脂5）旋转传动轴使LM导轨和引导丝杆从一端移到另一端4-5次/使圆锥齿轮转4-5圈使油脂均匀分布在LM导轨和引导四缸与圆锥齿轮及窝轮蜗杆上6）用无尘布擦除LM导轨和引导丝杠与圆锥齿轮及蜗轮蜗杆上多余的润滑脂名称FC ASM AD9212 PM 作业指导书7 润滑LM导轨和凸轮（每半年）步骤：1）按照之前提示使工作台绝缘2）旋转传动轴使凸轮和LM导轨滑块移至适当位置3）用无尘布擦去LM导轨和凸轮上所有旧的润滑脂4）用注油手枪对LM导轨滑块注油孔施加适量的THK AFB润滑脂；用加油匙手动对凸轮表面施加适当的NSK PS2润滑脂5）旋转传动轴使LM导轨从一端移到另一端4-5次，使润滑脂均匀分布在LM导轨和凸轮上6）用无尘布擦除LM导轨和凸轮上多余的润滑脂名称FC ASM AD9212 PM 作业指导书8 检查皮带步骤：1）按照之前提示使工作台绝缘2）定位工作台上的皮带，如图1和图23）手动旋转皮带目视检查皮带的位置与状态4）用张力计检查皮带频率是否位于数值范围内。
中星9号接收机各厂家芯片资料大全和升级接口针脚定义 - NEC等专区 - 卫星技术专版
中星9号接收机各厂家芯片资料大全和升级接口针脚定义品牌产品型号芯片配置海尔2晶10芯IC:HI2023E+1108+5812海尔高清OST-666 2晶6芯IC:M88VS2000+241674K.1+M88TS2020海尔高清OST-666 3晶12芯IC:High032E+His121+M88TS2020海尔 3晶10芯 (9针接口) IC:HI2023E+1108+5812+ESMTM12L64164A-GNR1T80AB海尔高清OST-666 2晶6芯IC:Hi2023E+3160+TS2020欧视达ABS-209B 3晶10芯IC:GX3001+GX1121+LW37欧视达ABS-209B 3晶11芯IC:GX3001+5037+8211欧视达ABS-309B 3晶11芯IC:GX3001+GX1121+MGCE5037欧视达AS-900S 1晶11芯IC:GX6121+25L80+LW37城市之宝BEX868 Y32S-93A T 2晶10芯IC:HTV903F+A VL1108+TS2020通达Y35S-8BA T/Y35S-8CA T 2晶10芯IC:HTV903+A VL1108+5812通达Y30S-01BT 2晶12芯IC:HTV903+A VL1108+2020皇朝HSR-268 10芯IC:Hi2023+A VL1108+5812小霸王TDX-668E ABS-S1 1晶6芯IC:Hi2023+Hi3102+FT8211+HT1117天地星小霸王TDX-328B 1晶10芯IC:ALi M3328F+5810天地星小霸王TDX-668A(9针接口) IC:HI2023+1108+夏普头天地星小霸王TDX-668B 2晶振IC:HTV903+A VL1108EGA+RDA5812+25L8005天地星小霸王(三星数码王)TDX-668B 单晶6芯.针脚定义①-TXD ②-RXD ③VCC ④-GND ⑤-BLIC:Hi2023E+RDA5812+A VL1108E+MXT8211a+25L8005天地星（原大盒中星九号）3晶IC:Hi2023+1108+5037天地星TDX-668B 2晶10芯IC:Hi2023+A VL1108+5812天地星小霸王TDX-668C 2晶6芯IC:HTV903+A VL1108EGA+RDK5812+25F80小霸王TDX-328B 1晶10芯IC:ALi M3328F+5810小霸王TDX-668B 6芯IC:Hi2023+RDA5812+A VL1108E小霸王TDX-668B 2晶6芯IC:HTV903+1108+5812小霸王TDX-668E 1晶6芯IC:Hi2023EC+Hi3121+5812小霸王TDX-668E 2晶6芯IC:HTV903+1108+5812小霰王XC-B298 1晶12芯IC:HTV903-RDA5812-A VL1108小霸王ABS-1388 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023EC+Hi3121+A V2020小霸王ABS-1688 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023EC+Hi3122E+5812小霸王GF902 IC:A VL1118a+A V2020+EN25F80索尼高清ABS-S 258 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023EC+Hi3122E+5812索尼高清ABS-S 258 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi3102E+Hi2023EC+A V2020太阳红TYH-279ABS/289ABS/299ABS 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023EC+Hi3121+A V2020松下科技星TDX-668B1/松下科技星-668E IC:Hi3102E+Hi2023EC+5812松下科技星TDX-668B 2晶6芯IC:HTV903FH42+A VL1108EGA+RGK5812松下科技星668B 2晶6芯Hi2023(E0908)+EVl1108EG2+5812松下科技星-668C 2晶6芯针脚定义①-RX .②-TX .③-GND .④VCC. ⑤-BL IC:A VL1108EG+HTV903F+5812松下科技星668E 2晶6芯IC:HV903+A VL1108E+5812松下科技星/海尔数码/海信数码单双晶6芯IC:Hi2023E+Hi3102(Hi3121)+5812松下科技星TDX-668B 2晶6芯针脚定义①-RXD .②-TXD .③-GND .④VCC. ⑤-BL IC:Hi2023+A VL1108+5812+25L8005松下高清SX168 3晶6芯IC:HTV903F+A VL1108+A V2020松下数码王P-269A 2晶6芯IC:Hi2023E+Hi3122+A V2020松下高清OST168 2晶10芯IC:Hi2023E+Hi3121+A V2020松下科技PS-228 11芯IC:Hi2023+Hi3122+5812松下科技PS-228 2晶6芯IC:M88VS2000+M88TS2020+ES261474K松下科技PS-228 1晶12芯N88VS2000+ES261344K+M88TS2020高频头+T25P80+S163816STS松下科技PS-228 2晶IC:HTV903+1108+2020松下科技PS-228 2晶10芯IC:GX3001+GX1211+5812松下数码王OST-266 10芯(4针)针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023E+Hi3106+2020松下数码王OST-266 2晶6芯IC:M88VS2000+M88TS2020+261414k+25F80松下数码王OST-266 2晶6芯IC:Hi2023E+Hi3102E+ M88TS2020+MXT8211松下高清OST-466 2晶10芯IC:Hi2023e+Hi3121+MBBTS2020+MBDA80CG松下科技星3晶6芯IC:Hi2023+A VL1108+WGCE5037松下科技星.海尔数码.海信数码单双晶+6芯IC:Hi2023E+Hi3102(3121)+5812中星科技单晶14芯IC:Hi2023E+1108+5812+25L8单晶14芯中星科技ZG-N02 12芯IC:GX3001+A V2020中星科技2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023EC+Hi3102E+5812+M12L64164A中兴科技ABS-S323 2晶 10芯IC:Hi2023EC+HI3102E+5812+M12L64164A村村通ABS-S323- 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023EC+Hi3122E+5812村村通 2晶6芯IC:HN4+0001+5812村村通ZL5188 1晶13芯IC:HTV903+1108+SHARP高频头村村通ZL-5188A 2晶11芯IC:HTV903+A VL1108+RDK5812村村通ZL-5188B 2晶13芯IC:HTV903+A VL1108+RDK5812村村通ZL-5188B 2晶10芯IC:HTV903+A VL1108EGA+5812村村通ZL5188B 1晶13芯IC:HTV903+A V1108+SHARP6306村村通ZJ-11 IC:HTV903+1108+夏普头S7ZH6306村村通wx-666 3晶10芯IC:GX3001+GX1121+RDK5812村村通ZL-6188 2晶10芯IC:HTV903+A VL1108EGA+5812村村通ZL-6188C 10芯IC:GX3001+GX1121+RDK5812村村通DTH(铁壳) 3晶12芯IC:A VL1108EG+HTV903F+A V2020村村通001 3晶10芯IC:GX3001+GX1121+RDK5812村村通ABS-S GD-1008 3晶10芯IC:Hi2023E+A VL1108E+ZL10037+F16-100HIP村村通ABS-S888A IC:Hi2023EC+Hi3121+ET8211+RDA5812+25X80视美人ABS-S PS-1288 2晶10芯IC:Hi3102E+Hi2023EC+A V2020视美人PS-1288 ICM88VS2000+ES256454K+M88TS2020视美人2晶10芯IC:Hi2023+3106+A V2020太平鸟HJ321 3晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCC IC:GX3001+GX1121+TS2020太平鸟HJ321 3晶11芯IC:GX3001+GX1121+5812焦点yj5888 2晶10芯IC:HTV903+A VL1108+RDA5812幸运之星YJ5988 2晶10芯IC:HTV903F+A VL1108EGa+A V2020克莱尔HT701 1晶10芯IC:A VL1108EG+HTV903F+M88TS2000中电电子J-6288 ABS-S 3晶12芯IC:GX3001+GX1121+5812小福星 3晶11芯针脚定义①-GND .②-(空) .③-RXD .④-TXD (）IC:GX3001+GX1121+5812东仕DIS-2000K 单晶10芯IC:HTV903F+A VL1108E+A V2020Souy Ericsson英文机2晶10芯IC:GX3001+GX1121+A V2020高斯贝尔/歌德威尔ABS-208F 3晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:A VL1108EG+Hi2023+5812高斯贝尔ABS-208 1晶14芯(5针).针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:A VL1108EG+Hi2023+5812歌德威尔ABS-208H/高斯贝尔208P 3晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCC IC:M3330E+A VL1108EG+A V2020+M12L64164高斯贝尔ABS-208P/歌德威尔208H 1晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:A VL1108EGi+Hi2023+5812高斯贝尔ABS-208P/歌德威尔208H 1晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCC IC:M3330E+A VL1108EG+A V2020+M12L64164A高斯贝尔ABS—208F IC:Hi2023+A VL1108EGA+M88TS2020高斯贝尔ABS—208 2晶14芯IC:HTV903+1108+5812吉祥ABS-208C IC:Hi2023+A VL1108EGa+GST GAIM-18R ABS-STUNER吉祥ABS-2009B 3晶14芯IC:GX3001+GX1121+RDK5812吉祥ABS-2009大铁壳 2晶IC:GX3001+GX1121+夏普高频头ABS-2009 2晶12芯IC:HTV903+1108+GAIM-18R歌德威尔ABS-208 3晶6芯IC61216GJ+1108+5812歌德威尔ABS-208 3晶14芯 (9针接口) IC:M3330+1108+5812高斯贝尔ABS-208 3晶 (9针母串口) IC:A VL1108+Hi2023+GAIM-18RIC61216GJ100+A VL1108EG+S29AL016D70TF102+ISSI高斯贝尔ABS-208N 铁壳(9针母串口) IC42s16400F高斯贝尔ABS-208 IC61216GJ+A V1108+29AL016D+5812高斯贝尔ABS-208S 1晶IC:NEC D61216GJ+A VL1108EGa+高频头高斯贝尔ABS-208Q 1晶14芯IC:A VL1108EGA+M3330E+M12L64164A+A V2020ABS-S LX-3688A 1晶12芯IC:GX3001+GX1121+5812现代V4、V5 3晶9芯IC:GX3001+GX1121+5812+EN25D80+HY57V641620ETP-6集信科技V6铁壳(海尔机芯) 3晶9芯针脚定义①VCC .②-TXD .③-RXD .④-GND IC:1108EG(Hi3121)+Hi2023+5812.集信科技V4.V6(铁壳) 2晶9芯 ( B型)针脚定义①VCC .②-RXD .③-TXD .④-GND IC:0001(GX3001)+HN4F74+5812集信科技V4 .V6(铁壳) 2晶10芯针脚定义①VCC. ②-RXD .③-TXD .④-GND IC:00001(GX3001)+HN4LSW+S6416AHTA+5812集信科技V4.V6(铁壳) IC:HN4LSW+S6416AHTA-6BZH+EN25F80-1000CP+5812集信科技V4.V6(铁壳) IC:0002P1M43700ta06+5812+EN25F80+TM8211+POL4558集信科技V4.V5 1晶10芯 (A型)针脚定义①VCC .②-RXD .③-TXD .④-GND IC:0002(GX6121)+5812+M12L64164A艾雷特 2晶10芯IC:M88VS2000+ES256454K+M88TS2020艾雷特V5 IC:HN4F910931M2EE+0001G1K729-1TA060932+5812艾雷特ALT5812 IC:GX3001+GX1121+5812艾雷特ALT600A 2晶11芯IC:M3330E+A VL108的+夏普高频头艾雷特ALT600A/吉祥ABS-2009 2晶IC:GX3001+GX1121-ES29L160FB+SHARP高频头艾雷特ALT600G IC:HTV903+A VL1108+25L160+ST2020(Y32S-8BA T 081113)艾雷特ALT6812 1晶10芯IC:GX6121+RDA5812+ZB-1A艾雷特ALT6815 1晶10芯IC:GX6121-RDA5812-2B-1A艾雷特ALT7815 3晶 10芯IC:GX3001+1121+TS2020艾雷特1000 黑珍珠V4.V5 1晶10芯IC:0002(GX6121)+EEPLDA+5812+M12L64164A 艾雷特alt 7812 3晶10芯IC:GX3001+GX1121+5812艾雷特ALT7812 3晶11芯针脚定义①VCC .②-RXD .③-TXD .④-GND IC:GX3001+GX1121+5812艾雷特ALT600c 2晶10芯IC:GX3001+GX1121+5812艾雷特ALT600c 2晶11芯IC:GX3001+GX1121+5812艾雷特ALT600c 1晶11芯IC:CH216H+A VL1108+C6XS-8CA深圳亿通DVB-V5 10芯IC:HN4N46+EN25F80+G1N540-1TA06+IS42S16400-7T+5812亿通电子WS-3688ZL 1晶10芯IC:Hi2023EC+Hi3102E+A V2020中大WS-3688ZJ (铁壳) 1晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCC IC:Hi2023EC+Hi3102E+A V2020中大WS-3688ZJ (铁壳) 2晶10芯IC:Hi2023+A VL1108EG+夏普高频头皇视HSR-208A 2晶10芯IC:Hi2023E+A VL1108EG+A V2020皇视HSR-208B 2晶10芯IC:Hi2023+1108+2020皇视HSR-208B 单晶10芯IC:3330+1108+2020皇视HSR-208B 单晶10芯针脚定义①-GND ②-TXD ③-RXD ④-VCC IC:Hi2023EC+Hi3102+A V2020皇视HSR-2090 2晶11芯IC:Hi2023+1108EGa+夏普头++EN29LV160皇视HSR-210A单晶6芯IC:Hi2023ec+Hi3122e+A V2020皇视HSR-260A铁盒2晶10芯IC:Hi+1108+SHARP夏普头皇视HRS-268 3晶10芯IC:Hi2023EC+Hi3102E+A V2020皇视HRS-268 2晶10芯IC:Hi2023EC+Hi3121+5812皇视HSR-268 单晶10线IC:HTV903+A VL1108+5812皇视HSR-268 单晶10线IC:Hi2023+Hi3121+A V2020皇视HRS-268 3晶10芯IC:Hi2023EC+A VL1108+5812皇视HSR-260B 3晶10芯IC:Hi2023+1108+2020皇视HSR-260B/索尼高清258 1晶10芯IC:2023E+3121+A V2020皇视HSR-260B 3晶10芯IC:HI2023+1108+5812皇朝HSR-268 10芯IC:Hi2023+A VL1108+5812凯恩斯KES-2066S 6芯针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi3122E+Hi2023ECE+N25F80 凯恩斯KES-2077Z 1晶6芯针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi2023EC+3122E+5812凯恩斯2077ABS 2晶10芯IC:M3330+A VL1108+5812凯恩斯2077ABS 2晶10芯IC:Hi2023+1108E+5812+25L800凯恩斯KES-2088S 2晶6芯IC:Hi2023EC+HI3102E+RDA5812凯恩斯KES-2088S 2晶10芯IC:Hi2023EC+HI3102E+RDA5812凯恩斯KES-2088S 2晶6芯针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi2023EC+HI3122E+RDA5812 凯恩斯KES-2088Z (5针).针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi2023EC+HI3102E+RDA5812 凯恩斯KES-2099S 2晶6芯IC:Hi2023EC+Hi3102E+5812+25L80凯恩斯KES-2188T 3晶10芯IC:Hi2023+1108+5812凯恩斯KES-2188T 3晶12芯IC:Hi2023+1108E+5037凯恩斯KES-2288S 3晶10芯IC:M3330E+A VL1108+RDA5812+M12L64164A凯恩斯KES-2688b 2晶10芯IC:Hi2023e+1108e+5812凯恩斯KES-2688S 2晶10芯IC:Hi2023e+1108e+5812凯恩斯KES-2788S 3晶10芯IC:Hi2023E+A VL1108EGa+5812凯恩斯KES-2788S 2晶6芯IC:Hi2023EC+Hi3122E+5812凯恩斯KES-5188 11芯IC:HTV903+A VL1108EGA+A V2020凯恩斯KES-5188A铁盒 2晶10芯IC:HTV903F+A VL1108+RDK5812+F80+PT8211凯恩斯KES-5188B 2晶13芯IC:HTV903+RDA5812+A VL1108+8211+F80美路3晶13芯IC:Hi2023E+1108+2119美路2晶12芯IC:GX3003+GX1121+5812美路MR-1809 IC:Hi2023E+A VL1108E+高频头MAX2119C美路MR-5598铁壳 3晶12芯IC:GX3003+GX1121+5812美路MR-5598 3晶12芯针脚定义①VCC. ②-RXD .③-TXD .④-GND IC:Hi2023E+1108+2119C美路-5798 IC:Hi2023E+1108+2119C美路-5598 IC:Hi2023+1108+GAIM-18R+29lv160ZY 5518A 2晶10芯IC:Hi2023E+3102E+5812万利达ZY-5518A 1晶6芯((5针)) IC:Hi2023E+Hi3102E+5812万利达ZY-5518A 2晶10芯IC:CX3001+GX1121+5812万利达ZY-5518A 3晶10芯 (9针接口) IC:Hi2023+1108+5812长虹新一代 3晶10芯IC:HI2023E+1108E+FL016ALF长虹新一代，海尔数码、海信数码单双晶体 6芯IC:HI2023E+3102(3121)+5812长虹数码CH930 3晶12芯IC:HTV903F+1108+A V2020+M80长虹精品TC-6688ABS 2晶10芯IC:HTV903+A VL1108EG+5812长虹精工YJ5978 1晶10芯IC:HTV903F+1108EGa+2000+F80-100+8211长虹KES-2099S 2晶5芯IC:Hi2023+Hi3102E+5812长虹KES 2晶6芯IC:Hi2023+Hi3102+5812长虹CH920 3晶6芯IC:HTV903F+1108EGa+A V2020+25L80航天天信WTD198J 2晶12芯(9针接口) IC:GX3001+GX1121+5812+ES29LV160FB-70TG 航天珠江WTD-198J 2晶12芯IC:GX3001+GX1121+5812航天珠江ABS-209B IC:GX3001+GX1121++WGSE5037航天数码ABS-3809 2晶12芯IC:GX3001+GX1121+5812航天直播HT-168 3晶12芯IC:Hi2023+1108+夏普头航天高清王-HS-166 2晶12芯IC:Hi2023EC+Hi3102E+RDA5812航天高清王HS-169 2晶12芯针脚定义①-GND .②-TX .③-RX .④-VCC IC:Hi2023EC+3122+5812天诚TCD-219 2晶10芯IC:Hi2023EC+Hi3121+5812天诚TCD-219ABS 2晶10芯IC:M3330E+A VL1108EGA+5812天诚TCD-299Z 2晶10芯IC:Hi2023+3206+5812天诚TD-299Z 2晶5芯IC:Hi2023+3206+5812天诚TD-2992 2晶6芯IC:Hi3122E+Hi2023E+5812+F80+MXT8211天诚539 2晶10芯IC:HTV903+A V1108+5812天诚519型2晶10芯IC:HTV903+1108E+5812天诚TCD-239ABS 3晶10芯IC:M3330+1108+5812天诚TCD-239ABS 2晶10芯IC:Hi2023+1108E+5812天诚TCD-239 2晶10芯IC:M3330E+1108E+5812天诚TCD-279 2晶10芯IC:Hi2023EC+Hi3102E+5812天诚TCD-299ABS 2晶10芯IC:Hi2023EC+Hi3121+5812天诚TCD-319ABS 3晶10芯IC:Hi2023E0914+A VL1108EGa+RDA5812天诚TCD-319ABS 3晶12芯IC:Hi2302+A VL1108+5037天诚TCD-369ABS 3晶10芯IC:Hi2023+1108+5812天诚TCD-369ABS 3晶10芯IC:M3330E+1108+5812天诚TCD-369ABS 3晶5芯IC:Hi2023+1108+WCGE5037天诚TCD-509ABS 3晶10芯IC:M3330E-A VL1108EGa-5812天诚TCD-509ABS 10芯 (5针) IC:Hi2023+A VL1108+5812+M12L6416A天诚TCD-539ABS 2晶10芯 (5针)针脚定义①-RX .②-TX .③VCC .④-GND .⑤-BL IC:M3330E+A VL1108+25L80+5812天诚TCD-579ABS 2晶10芯IC:Hi2023+Hi1108+5812天诚TCD-579ABS 3晶10芯IC:HiM3330+A VL1108EGa+RDA5812天诚TCD-589ABS 3晶10芯IC:Hi2023+1108+5812天诚TCD-689ABS铁壳机2晶12芯(9针接口) IC:Hi2023+A VL1108+夏普头天诚TC-ABS1108A11芯IC:Hi2023EC+A VL1108+5812TCD--239ABS 2晶10芯IC:M3330E+A VL1108E+5812TCD-339ABS 3晶10芯 (9针接口) IC:Hi2023+1108+5812TCD-509ABS 3晶10芯IC:Hi2023E0915+A VL1108EGa+RDA5812TCD-509ABS 2晶10芯 (5针) IC:Hi2023EC+HI3121+5812TCD-519ABS 2晶10芯IC:Hi2023+A VL1108+5812TCD-599 2晶10芯IC:M3330+A VL1008+5812TCD-219ABS 2晶振10芯针脚定义①-TXD .②-RXD .③-VCC .④-GND .⑤-BL IC:Hi2023EC+Hi3121+5812爱普思DVB-2568 3晶10芯IC:HTV903+1121+2020卓异5518A 3晶10芯IC:Hi2023E+1108+5812卓异5518A(铁壳)3晶11芯IC:Hi2023E+1108+5812卓异5518A(铁壳)2晶11芯(9针接口) IC:Hi2023+1108+夏普独立高频头卓异5518A G 1晶10芯爱百信针脚定义①-GND .②-TXD .③-RXD .④VCC IC:HTV903+A VL1108+5812卓异ZY-5518A G 驰骋天下针脚定义①-GND .②-RXD .③-TXD .④VCC IC:HTV903+A VL1108+5812+F80卓异5518AG 2晶11芯针脚定义①-GND .②-RXD .③-TXD .④VCC ⑤-BL IC:Hi2023E+1108+5812卓异ZY-5518A H 春 1晶6芯针脚定义①-GND .②-TXD .③-RXD .④VCC IC:GX3001+5812+25L8005卓异ZY-5518A H 春 2晶10芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:Hi2023E+HI3121+5812+F25L008A卓异ZY-5518A H 秋针脚定义①-GND .②-RXD .③-TXD .④VCC 升级接口在内部PCB上IC:GX6121+5812+F80卓异ZY-5518A H 秋 1晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCC ⑤-BL IC:Hi2023EC+Hi3102E+5812+F80-100卓异ZY-5518A H至尊王牌2晶10芯针脚定义①-GND .②-TXD .③-RXD .④VCC IC:GX3001+GX1121+5812+25L8005卓异ZY-5518A H 财富 2晶6 芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:芯片掩磨+5812+80L100绿达PS-1288 3晶12芯IC:Hi2023E+ABS090520+M88TS2020绿达PS-1288 2晶12芯IC:Hi2023+Hi3021+A V2020绿达视美人\卓异 1晶10芯IC:Hi2023EC+Hi3121+2020绿达金统帅 3晶10芯IC:M3330+1108+5812三星DQ88/DQ66 IC:HTV903F+A VL1108+A V2020三星高清王2晶12芯IC:GX3001+GX1121+5812三星高清DQ88 3晶12芯IC:HTV903F+A VL1108+A V2020三星数码王TDX668B 2晶6芯针脚定义①-RXD .②-TXD .③-GND .④VCC. ⑤-BL IC:Hi2023+1108+5812三星数码王TDX668B 2晶6芯IC:HTV903F+A VL1108E+5812三星数码王668C 2晶6芯IC:HTV903F+A VL1108E+5812三星数码王TDX668E 1晶6芯IC:Hi2023EC+3102C+5812三星HSR-208C 1晶10芯IC:Hi2023E+Hi3102+MXT8211+A V2020+F25L08pA三星小霸王ABS-S 2009 2晶10芯IC:CX3001+CX1121+5812三星小霸王2900 (9针接口) IC:Hi2023E+A VL1108+MAX2119三星王国-KL6350 1晶11芯IC:HTV903+A VL1108EGa+EDA5812开门红KSP638 2晶10芯IC:HTV903F+A VL1108E+A V2020开门红KSP638 1晶10芯IC:CT216H+A VL1108EGa+A V2020日立创新TDX-668B 2晶6芯针脚定义①-RXD .②-TXD .③-GND .④VCC. ⑤-BL IC:Hi2023+A VL1108+5812志高之星HS166 2晶12芯IC:Hi3102+Hi2023+5812志高之星HS169 2晶12芯IC:Hi2023EC+Hi3012E+RDA5812A+EM638165TS-6G金牛ABS-1108 3晶10芯IC:Hi2023+1108+5812小灵通 2晶6线IC:Hi2023+1108+5812福临门ABS-S 3晶9线IC:GX1121+GX3001+5812C60S-93A T 单晶10芯IC:CT216H+A VL1108EGa+A V2020ABS-2301 单晶10芯针脚定义①-GND.②-TXD.③-RX .④VCC IC:Hi2023EC+Hi3211E+5812+25L8005其乐达CT216 2晶10芯IC:CT216+1108+A V2020科海6228 1晶11芯IC:HTV903+A VL1108EGa+RDa5812+25X16A VSIG科海6228-CT216H 1晶11芯IC:CT216H+1108EGa+M88TS2020科海C623S-91A T 单晶10芯IC:CT210H+A VL1108+2020科海炫彩6888 IC:HTV903+A VL1108EGa+RDa5812科海2888（小天使）2晶10芯IC:HTV903+A VL1108EGa+RDa5812大旗920 3晶12芯IC:HTV903+A VL1108+A V2020大旗DQ920 3晶12芯IC:GX3001+GX1121+5812+25X16大旗930 3晶12芯IC:HTV903+A VL1108+A V2020众昌电子ABS--2088 2晶10芯IC:Hi2023+A VL1108+5812众昌电子ABS-2087 2晶10芯IC:M3330+A VL1108+5812创维S600 3晶IC:M3330E+A VL1108E+5812创维新一代3晶10芯IC:Hi2023E+1108+5037+FL016A中广通XC-B188 3晶12芯IC:GX3001+GX1121+5812深圳知音ABSTAR KT-2309 3晶10芯IC:Hi2023+A VL1108E+5812知音科技ABSTAR KT1028H 2晶振10芯IC:Hi2023+A VL1108+GST GAIM-18R铁壳ABS-2009 2晶11芯IC:Hi2023+1108+夏普头王牌数码OST-366 2晶6芯针脚定义①-GND ②-RXD .③-TXD .④VCC IC:Hi3102+Hi2023EC+A V2020王牌数码王GM-ABS1108A 2晶10芯针脚定义①-GND .②-TXD .③-RXD .④VCC IC:GX3001+GX1121+5812+25L8005王牌数码王GM-ABS1108A 10芯IC:Hi2023+A VL1108+5812JIXIANG ABS-208 2晶14芯 (9针接口) IC:Hi2023+1108+GST GAIM-18R ABS TUNER 夏普头JIXIANG-ABS208 2晶IC:D6121+1108+GST高频头East Star 2晶10芯IC:M3330-1108-GST GAIM-18R高频头小福星abs 2008 3晶12芯IC:GX3001+GX1211+5812通达C60S-93A T/C62S-91A T 1晶10芯IC:CT216H+A VL1108E+2020威特斯ZL-5188A 2晶 13芯IC:HTV903+A VL1108+RDK5812威特斯ZL-5188B 2晶 11芯IC:GX3001+GX1121+5812迷你星 3晶13芯IC:GX3001+GX1121+5812+F16-100HIP高星HS-312 3晶 12芯IC:GX3001+GX1121+5812北大高科 3晶 9芯IC:GX3001+GX1211+5812思达科ABS-S 801型2晶 10芯IC:GX3001+GX1121+5810思达科ABS-S 802G 2晶10芯IC:GX3001+GX1211+5812思达科ABS-S 803A 1晶10芯IC:A VL1118+A V2020+25D80V思达科ABS-S 803G IC:GX3001+GX1211+5812思达科ABS-S 806H IC:GX3001+GX1211+5812思达科ABS-S 806H IC:A VL1118+A V2020+DSD4M16G思达科ABS-S 806H IC:HN4J7G+G2A954+5812+25X80思达科ABS-S807 1晶5芯IC:A VL1118a+A V2020+806H金霸王JBW-6688 2晶11芯IC:HTV903F+A VL1108EGa+A V2020+8211金霸王JBW-6688 IC:GX3001+GX1211+5812阿德尔ADE-168 IC:HY903+A VL1108EG+A V2020阿德尔ADE131金刚IC:HTV903F+A VL1108E+M88TS2020海西小霸王TD299Z 2晶6芯IC:Hi2023E+Hi3122+5812同洲CY-668S 1晶12芯IC:HM1512+1108+5812喜旺ABS5398 IC:Hi2023+1108E+MAX2119C喜旺ABS-5798 12芯IC:GX3001+GX1211+5812喜旺ABS-3809 2晶12芯IC:GX3001+GX1121+RDA5812希旺598 2晶12芯 (9针接口) IC:Hi2023+1108+SHRP高频头彩虹视霸CY84 1晶10芯IC:HTV903F+A VL1108+M88TS2020彩虹视霸A10S-9AA T 1晶10芯IC:A VL1118+SM42S16400B1-7+F80九洲村村通DVS-398F IC:CT216H+ALV1108+SHRP高频头金星ABS-208 1晶14芯IC:Hi2023+A VL1108+铁壳高频头威克 2晶6芯 (5针) IC:HTV903+1108+5812华尔HR731A1 3晶12芯IC:CX3001+CX1121+SHARP高频头爱普斯 3晶9芯IC:HTV903+A V2020+A VL1108EG爱普斯2568 3晶10芯IC:HTV903+A V2020+A VL1108EG爱普斯IC:GX3001+GX1211+A V2020+2J10X未来视佳ADEI88 3晶9芯IC:HTV903F+A V2020+A VL1108EG黑金刚TRT006 1晶10芯IC:A VL1118+A V2020+4558+F80-100DX-668 2晶10芯针脚定义①-RXD .②-TXD .③VCC .④-GND .⑤-BL IC:Hi2023EC_Hi3102E+5812+F80-100傲天海-吉祥2晶12芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:GX3001+GX1121+RDA5812高频头+P8075火星漫步LJ6008 1晶10芯IC:HTV903F+A VL1108+M88TS2020+F80-100王牌新一代TD-299Z针脚定义①- . ②-TXD .③-RXD .④-GND ⑤- IC:Hi2023E+Hi3122+5812王牌HJ360 3晶10芯IC:GX1120+GX3001+TS2020TVWALKER ABS-2008 1晶6芯IC:D61216GJ+1108E+SHARP头吉祥988 (ZJ-111) 1晶11芯IC:HTV903 +1108+高频头北京北电科林 3晶12芯IC:Hi2023+A VL1108EGa+SHARP高频头家家福BEX811 1晶10芯IC:24645K2+M88VS2000+M88TS2020家家福ADE158 IC:HTV903+A VL1108+M88TS2020华星科技2晶IC:Hi2023+A VL1108+5812亚视达ABR-S(H11) 2晶10芯IC:HTV903+1108E+A V2020HSTAR 3晶10芯IC:Hi2023+A VL1108EGa+M88IS2020长江电讯ABS-2008型铁壳 (9针接口) IC:D61216GJ+A VL1108EG+夏普头全家福 3晶IC:Hi2023E+A VL1108EG+M88TS2020畅想BEX818 1晶10芯IC:HTV903+A VL1108+A V2020必佳GF-901 2晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCC IC:HTV903+1108+A V2020KSP600G 飓风(华亚) 2晶10芯针脚定义①-GND ②-TXD ③-RXD ④VCC IC:HTV903+1108+M88TS2020+25D80万家乐TB002 (5针) IC:Hi2023EC+Hi3102E+M88TS2020+25X80A V万家乐2晶6芯IC:M3330+ALi1108+5812+F80-75奥伟科技ABS-800 3晶 (9针接口) IC:GX3001+GX1121+5812奥伟科技ABS-900E 2晶12芯IC:CT216+A VL1108+独立高频头GAIR-08R天眼HSTER3晶10芯IC:Hi2023E+A VL1108+5812飞翔ADE351 2晶10芯IC:HTV903F+A VL1108EG+M88TS2000星视通XC-B268 1晶10芯IC:HTV903+A VL1108+5812星视通XC-C268 1晶11芯IC:HTV903 A VL1108 5812奥维科技ABS-600 3晶12芯IC:GX3001+GX1121+A V2020GM-210825A 3晶10芯IC:Hi2023+A V1108+5812GM-210825A 2晶10芯IC:GX3001+GX1121+5812中国结TRT005 1晶10芯IC:M88VS2000+256454K+M88TS2020万视达118S 3晶10芯IC:Hi2023EC+Hi3121E+5812足球王国ADE266 1晶10芯IC:HTV903F+A VL1108Ga+M88T52000摩托罗拉IC:HM1521+A VL1108+5812现代数码TDX-668B 2晶6芯IC:A VL1108EG+HI2023EC+5812国科广电GKA800 ( 9孔串口) IC:GX3001+A VL1108+EN29LV160AB+夏普头心语BEX838 10芯IC:HTV903F+A VL1108+5812心语BEX838 2晶10芯IC:HTV903F+A VL1108+m88ts2020+GH8211美万嘉MJ-518S 3晶10芯IC:GX3001+GX1121+RDK5812SV A CH-6788 2晶IC:M88VS2000+ES255624K+M88TS2020+EN25F80+AMS1117数码新一代HT702 2晶10芯IC:HTV903F+1108+M88TS2020飓风KSP600G 2晶10芯IC:HTV903+A VL1108+2020板号CH-ABS-S-VS2000-V1.1 2晶6芯IC:2000+2020+255624K斯威特ZL-5188A 1晶13芯IC:2HTV903+A VL1108EGA+夏普高频头中国星2晶6芯IC:ALI3330+ALi1108+5812+F80-75Ji Xiang 208版号ABS-A005B.M 3晶6芯IC:D61216GJ100+A VL1108+S29AL016070TF102+MAXIM2119C欧士达209B 10芯IC:GX1121+GX3001+5037。
ESAD92M-03RR中文资料
UNITS V μA μs ℃/W
3.3 MECHANICAL CHARACTERISTICS Mounting torque Approximate mass Recommended torque 0.4～0.6 6 N･m g
Fuji Electric Device Technology Co.,Ltd.
EIAJ ED4701/401 method 1
5
2
Terminal Strength (Bending)
Load force : 10N Number of times : 2times(90deg./time)
EIAJ ED4701/401 method 3 EIAJ ED4701/402 method 2 EIAJ ED4701/403 test code D
Reference Test No. 1
T h i s m a t er i a l an d t he i n fo r m a t i on h e r e in i s t he pr o p er t y o f Fuji Electric D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d pa r t y n o r u s e d f or the m an uf ac t ur in g pur po se s w it hou t the express written consent of Fuji Electri c Device Technology Co .,Ltd.
FM7222DS-3W LED功率射灯驱动IC 可替换BP9022A
产品概述FM7222DS是高精度原边反馈的LED恒流驱动芯片。
芯片工作在电感电流断续模式，适用于85Vac~265Vac全范围输入电压、反激式隔离LED恒流电源。
FM7222DS芯片内部集成650V功率开关，采用原边反馈模式，无需次级反馈电路，也无需补偿电路，只需要极少的外围元件即可实现恒流。
采用专利的驱动和电流检测方式，芯片的工作电流极低，无需变压器辅助绕组检测和供电，进一步减少外围元器件，极大的节约了系统成本和体积。
FM7222DS芯片内带有高精度的电流取样电路，使得LED输出电流精度达到±5%以内。
芯片采用了特有的恒流控制方式，可以达到优异的线性调整率。
FM7222DS具有多重保护功能，包括LED开路/短路保护，欠压保护，芯片过温保护等。
特性➢内部集成650V功率管；➢原边反馈恒流控制，无需次级反馈电路；➢无需变压器辅助绕组检测和供电；➢芯片超低工作电流；➢宽输入电压；➢±5% LED 输出电流精度；➢LED短路/开路保护；➢芯片供电欠压保护；➢过温保护；➢封装形式：SOP-8 。
应用范围➢LED射灯；➢LED 球泡灯；➢其它LED照明。
内部框图流和交流电参数规范。
对于未给定上下限值的参数，该规范不予保证其精度，但其典型值合理反映了器件性能。
注2：温度升高最大功耗一定会减小，这也是由TJMAX, θJA,和环境温度TA所决定的。
最大允许功耗为PDMAX (TJMAX - TA)/ θJA或是极限范围给出的数字中比较低的那个值。
推荐工作范围电气特性应用信息FM7222DS是一款专用于LED照明的恒流驱动芯片，采用专有的恒流架构和控制方法，芯片内部集成650V功率开关，只需要极少的外围组件就可以达到优异的恒流特性。
采用了原边反馈技术，FM7222DS无需光耦及TL431反馈，也无需辅助绕组供电和检测，系统成本极低。
启动系统上电后，母线电压通过启动电阻对V CC电容充电，当V CC电压达到芯片开启阈值时，芯片内部控制电路开始工作。
海康威视 HPM 系列产品维护指南说明书
Lifecycle Solutions & ServicesPreventive Maintenance Tips: Power Systems 1It Doesn’t Run Without Power—Proper Maintenance of Power SystemsMaintaining the power system is critical for any of your systems and that is definitely true when dealing with the PM/APM/HPM (xPM) family. Depending on your configuration and process, the failure of proper maintenance practices and ignoring alarms from the power system could lead to failures that have the potential to bring a process or plant to a standstill. This includes loss of view, loss of control, or even loss of the process.How Proper Power System Maintenance Can Help You• Reassurance that your power system and battery back-ups are running properly • Reduced risk of downtime due to power system issues • Allows you to be proactive in your maintenance approach • Simplified ordering for maintenance items available in a kit versus individual components • Lower cost of replacement to mitigate costly unplanned system downtime• Current version of Power Supply has multiple improved characteristicsProper maintenance of the power system includes addressing the power supplies, battery backup and the CMOS memory backup batteries. The expected lifespan of each of these components is different and the lifespan of each is also affected by the environment in which they are used. Benchmarks for changing out each component are every 10 years for the power supply, every five years for the battery backup (and possibly every three), and every two years for the CMOS batteries. Honeywell now offers an upgrade kit, MC-ZPSUG2, which provides all of these components packaged together. The power supply provided is the current version with improved characteristics.Any failures of these power system components should be changed immediately.DescriptionLifeExpectancyReplacement Part #Power Supply 10 years 51198651-100 48V Battery Backup 3 to 5 years 51303948-100 Size “AA” Ni-Cad CMOS Battery 2 years 51190422-100 Size “C” Ni-Cad CMOS Battery2 years51192060-100CMOS Memory Battery BackupThe xPM power systems are designed to provide battery backup to all the CMOS memory. The CMOS battery backup prevents the loss of the data base during a power outage after the battery backup has been depleted or if no battery backup module is present. There are two different power system chassis out in the field with CMOS batteries. The older style power system introduced with PM/APM requires three specific “AA” size Ni-Cad batteries. For the current back panel introduced for HPM the CMOS memory requires three specific “C” size Ni-Cad batteries. The size “C” batteries are required if the full 50 hours of CMOS memory backup is desired for HPM due to the larger memory available in HPM. In either scenario, the incorrect usage of other batteries than what have been tested and qualified by Honeywell may result in the battery overheating and could possibly cause the battery to rupture.The batteries in the standard power system are periodically tested by the charging circuit. If the voltage falls below the allowed limit, a battery failure alarm will be generated and the batteries should be replaced. Regardless of alarms, Honeywell recommends that new batteries be installed every two years. All three batteries should be replaced at one time.DescriptionReplacement Part #Size “AA” Ni-Cad CMOS Battery51190422-100 Size “C” Ni-Cad CMOS Battery 51192060-100Preventive Maintenance Tips: Power Systems 2 48 Volt Battery BackupThe battery backup is designed to maintain a fully loaded xPM fora minimum of 20 minutes. It will shutdown when the voltage reaches38 volts to prevent the power supply from going out of regulation and an alarm will be generated. Rechargeable batteries will lose their full charging capabilities over time and will need to be tested and replaced when they fall below 60 percent of their original capacity.The battery backup has been designed to operate in standby (float) service for approximately five years. The five years is based on the battery being kept at 20C (68F) and the float charge voltage being maintained between 2.25 and 2.30 volts per cell. This includes the battery being fully discharged once every three months. No battery should be left in service over five years, and if no maintenance is done it should be replaced every three years.The service life is directly affected by the number of discharges, the depth of discharge, ambient temperature, and the charging voltage. The expected service life can be shorted by 20% for each 10C that the ambient is above 20C.The batteries should never be left in a discharged state. This allows sulfating to occur which will increase the internal resistance of the battery and lower its capacity. The self-discharge rate is about 3% per month at an ambient of 20C. The self discharge rate doubles for each 10C in ambient above 20C. The discharged voltage of the battery should never go below 1.30 volts to maintain the best battery life.With this in mind it is recommended to periodically load test the batteries to ensure they have sufficient capacity to maintain the system during a power outage. Tests should be done on an annual basis and more frequently as they become older and begin to lose capacity. The load test is recommended off-process if possible as there will be no battery backup available while performing the test and recharging of the battery pack can take up to 16 hours. Having a spare available to swap, especially if doing on process, is a wise option leading to minimal time without battery backup and allowing the tested battery to be recharged on a bench outside the system for future swap with the next test.If regular maintenance is not performed the recommendation is to change at least every three years rather than every five.Power SuppliesThe power supply is the heart of the xPM power system and the recommendation is for a redundant power supply configuration having each power supply fed by its own dedicated power source. Honeywell has introduced the next generation power supply for this family which increases the robustness of the power system. Even with redundant power supplies, one must be careful when changing out a failed power supply. This is to minimize disturbance of the environment and to reduce the introduction of particles into the area around and near the power supplies. Those particles can be pulled through the airflow of the working power supply and result in the second power supply failing.For this reason, Honeywell does not recommend replacing a working power supply on-process (other than the black-colored version). However, power supplies do not last forever and you should consider upgrading older power supplies, or prepare to do so, when the opportunities arise.The recommendation for changing out the power supplies is every ten years and this replacement should be included during a scheduled down time if possible. The power supply replacement procedure listed in the Honeywell xPM Service manual should be followed at all times.Recommend Change of Original Black Power SuppliesIn October of 1996 Honeywell issued a customer priority notification (PN #1986) about a possible over-voltage issue with the black-colored (51109456-200) power supplies that were sold from 1988 through 1994. The Honeywell recommendation was to change out those black power supplies with the new silver version. Honeywell still recommends and strongly suggest that these black power supplies be replaced with the current power supply under part number 51198651-100 regardless of when they were put into service.Silver Power SuppliesThere have been three part number versions of the silver power supplies. The first (51109684-100/300) was sold from 1993 through 1997. The second (51198947-100) sold from 1997 through today. The next generation power supply was released in early 2009 and was introduced initially through the power system maintenance upgrade kit. If a site is running the original silver version they have now been in service for over 10 years and sites should consider the need to replace before they are forced to do so by failure of the power supply. Note that there is always risk involved when powering down equipment and possible issues when the equipment is powered back up. As stated previously, it is recommended to change these out off-process if possible. Replacements on- process should be done only when a power supply fails and replacement is then required immediately.Description Replacement Part #48V Battery Backup51303948-100Preventive Maintenance Tips: Power Systems 3Power Supply IssuesThe xPM power supplies have proven to be a reliable and robust power source. However, as with any electrical component they do not last forever and there is the potential for failure modes. Issues such as foreign particles introduced have already been discussed. In addition, even clean environments are susceptible to whiskers which have the potential to short out active circuits. Whiskers are a real issue and further details may be found in the Customer Resource Manual (CRM) in the Process Manager section PD22_G97(G).The new power supply available through the power system maintenance kit includes design improvements specifically done to address some of these possible failure modes to make a robust power supply even better.Remember that the power supply is a critical component to your system and regular maintenance as well as having spares available is highly recommended to keep your site running without problems. Monitor the power system alarms and take action when they do occur.DescriptionReplacement Part #Power Supply51198651-100Preventive Maintenance Tips: Power Systems 4Importance of Power System AlarmsAlways ensure that all power supply alarm contacts are properly implemented, working, and are being monitored. Failure to monitor these alarms and take appropriate action in a timely manner can lead to failures of the power system that could have otherwise been prevented. There are DC Out, Battery, Fan/Temp, AC In, and Charging LED indicators for each Power Supply module. If the Power system is fully functional, all five of the indicators are illuminated. In addition, each of these conditions, plus a CMOS/Memory is available as a digital input for each supply.DC Out IndicatorIf a DC Out LED is off, AC line power has been lost (check the AC In LED) or the Power Supply Module has failed. If the Power System is non-redundant, or if both DC Out LEDs are off, the HPM has lost 24 VDC. The CMOS backup system maintains power to the CMOS memory, so subsystem programs are not lost. See the Battery LED description below. The annunciator contact illustrated in the following figure will open when these conditions occur.Battery IndicatorIf the Battery LED is off and the Charging LED is on, the 48 Volt Battery switch is in the off position or the 48 V Battery Backup system has failed. The annunciator contact illustrated in the following Figure will open when these conditions occur. If the Power System does not have the battery pack option, the Battery LED will normally be on, and the Charging LED will normally be on.Fan/Temp IndicatorIf the Fan/Temp LED is off, the fan in the Power Supply Module has failed or the temperature of the supply has exceeded a safe value. The annunciator contact, discussed below, is activated.AC In IndicatorIf the AC In LED is off, AC power to the HPM has been lost or the switch on the Power Supply Module is off. Backup systems, if operating, are maintaining the unit. Check the DC Out and Battery indicators to determine the state of the system. Many installations may have the Power Supply Modules connected to separate AC power sources to minimize outage caused by a power loss. The Annunciator contact signifying power loss from either supply, are opened independently.Charging IndicatorWhen the Charging LED is off, the charging circuit that maintains the optional 48 V Battery Backup system has failed. Check the batteries, their corresponding connections, and the charging circuits in the Power Supply Module(s). The annunciator contact output is opened by this condition.For More InformationLearn more about how Honeywell’s Preventive Maintenance Tips can limit downtime and assure system power supplies and battery backups are working properly visit our website or contact your Honeywell account manager. Honeywell Process Solutions Honeywell1250 West Sam Houston Parkway South Houston, TX 77042Honeywell House, Arlington Business Park Bracknell, Berkshire, England RG12 1EB Shanghai City Centre, 100 Junyi Road Shanghai, China 20051 AlarmsThe primary Power Supply Module alarm and secondary Power Supply Module alarm contacts monitor five functions within each Power Supply Module. The appropriate contact will open when any of the following occur:• The DC output voltage is not within normal limits. • AC input power to the supply has failed.• The Power Supply Module electronics have overheated or the Power Supply Module fan has failed. • The 48 V backup-battery system has failed because the batteries have discharged or they have been disconnected. • The battery charger in the Power Supply Module has failed.Servicing the Power SystemThe power system is critical to your process. Loss of the power system may lead to loss of control, loss of view, or loss of process. Honeywell strongly recommends regular maintenance to the power system and service checks with regular component replacements performed by Honeywell trained service technicians. • Options for Power System Upgrade/Maintenance • Order the power system upgrade kit• Order replacement parts for immediate installation. • Order spares to have in stock as needed.• Add power system components to a parts contract.Preventive Maintenance Tips: Power Systems 5Orderable Power System Components• CMOS Batteries • 48V Battery Backup • Power Supply• Power System Chassis AssemblyBenefits of New Power Supply• Improved airflow handling• Conformal coating of all metallic components • Enhanced mechanical design • Extended temperature range • Added thermal shutdown capability • More reliable power switch design • More consistent alarm handlingAdditional Power System InformationAdditional details on proper maintenance procedures such as load testing and specifics on the power supplies and batteries may be found in the Honeywell Customer Resource Manual. This is located in the Process Manager section of the CRM under TAB 22. As always, you may also contact your local Honeywell account manager or service technician for further details.SV-12-37-ENG May 2012© 2012 Honeywell International Inc.。
中九机顶盒各种机型机芯IC大全供大家分享刷机必备
中九机顶盒各机型所用芯片大全注:山寨机机型比较杂即使是同型号的机型,而用的芯片及晶体数量.面板芯数等都不同,注意区分。
建议刷机时最好打开机盖看一下芯片核对后再刷机.勉得刷成砖.此资料的收集只做为参考。
海尔 2晶10芯IC:HI2023E+1108+5812海尔高清OST-666 2晶6芯IC:Hi2023E+3160+TS2020欧视达ABS-209B 3晶10芯IC:GX3001+GX1121+LW37欧视达209B 3晶11芯IC:GX3001+5037+8211欧视达AS-900S 1晶11芯IC:GX6121+25L80+LW37城市之宝BEX868 Y32S-93AT 2晶10芯IC:HTV903F+AVL1108+TS2020通达Y35S-8BAT/Y35S-8CAT 2晶10芯IC:HTV903+AVL1108+5812通达Y30S-01BT 2晶12芯IC:HTV903+AVL1108+2020皇朝HSR-268 10芯IC:Hi2023+AVL1108+5812IC:Hi2023+AVL1108+5812小霸王TDX-328B 单晶10芯IC:ALi3328F+5810小霸王TDX-668B 2晶 6芯IC:HTV903+1108+5812现代数码TDX-668B 2晶 6芯IC:AVL1108EG+HI2023EC+5812小霸王ABS-1388 2晶10芯IC:Hi2023EC+Hi3121+AV2020小霸王ABS-1688 2晶10芯IC:Hi2023EC+Hi3122E+5812索尼高清ABS-S 258 2晶10芯IC:Hi2023EC+Hi3122E+5812索尼高清ABS-S 258 2晶10芯IC:HI3102E+HI2023EC+AV2020太阳红TYH-279ABS/TYH-289ABS/TYH-299ABS 2晶10芯 IC:Hi2023EC+Hi3121+AV2020松下科技星TDX-668B1/松下科技星-668EIC:HI3102E+HI2023EC+5812松下科技星TDX-668B 2晶6芯IC:HTV903FH42+AVL1108EGA+RGK5812IC:Hi2023EC+3121+5812松下科技星-668C 2晶 6芯IC:AVL1108EG+HTV903F+5812松下数码王OST-266 10芯IC:HI2023E+HI3106+2020松下数码王OST-266 2晶 6芯IC:HI2023E+HI3102E+ M88TS2020+MXT8211松下科技星 3晶 6芯IC:Hi2023+AVL1108+WGCE5037松下科技星.海尔数码.海信数码单双晶+6芯 IC:Hi2023E+Hi3102(3121)+5812中星科技单晶14芯IC:Hi2023E+1108+5812+25L8单晶14芯中星科技ZG-N02 12芯IC:GX3001+AV2020中星科技 2晶 10芯IC:Hi2023EC+Hi3102E+5812+M12L64164A村村通ABS-S323- 2晶10芯IC:Hi2023EC+Hi3122E+5812村村通 2晶6芯IC:HN4+0001+5812IC:HTV903+AVL1108+RDK5812村村通ZL-5188B 2晶13芯IC:HTV903+AVL1108+RDK5812村村通ZL-5188B 2晶10芯IC:HTV903+AVL1108EGA+5812村村通ZL5188B 1晶13芯IC:HTV903+AV1108+SHARP6306村村通ZJ-11IC:HTV903+1108+夏普头S7ZH6306村村通wx-666 3晶10芯IC:GX3001+GX1121+RDK5812村村通ZL-6188C 10芯IC:GX3001+GX1121+RDK5812村村通DTH(铁壳) 3晶12芯IC:AVL1108EG+HTV903F+AV2020村村通001 3晶10芯C:GX3001+GX1121+RDK5812视美人ABS-S PS-1288 2晶10芯 IC:HI3102E+HI2023EC+AV2020太平鸟HJ321 3晶10芯IC:GX3001+GX1121+TS2020太平鸟HJ321 3晶11芯IC:GX3001+GX1121+5812焦点yj5888 2晶10芯IC:HTV903+AVL1108+RDA5812_幸运之星YJ5988 2晶 10芯IC:HTV903F+AVL1108EGa+AV2020克莱尔HT701 1晶10芯IC:AVL1108EG+HTV903F+M88TS2000---------------------------------------------------------------------------------- 作者：adok-- 发布时间：2010-2-18 13:25:45--中电电子J-6288 ABS-S 3晶12芯IC:GX3001+GX1121+5812小福星 3晶 11芯IC:GX3001+GX1121+5812东仕DIS-2000K 单晶10芯IC:HTV903F+AVL1108E+AV2020Souy Ericsson英文机 2晶10芯IC:GX3001+GX1121+AV2020高斯贝尔/歌德威尔ABS-208F 3晶 14芯 5针IC:AVL1108EG(Hi3121)+HI2023+5812高斯贝尔ABS-208 单晶 14芯 5针IC:AVL1108EG(Hi3121)+HI2023+5812歌德威尔ABS-208H/高斯贝尔ABS-208P 3晶 14芯 4针 IC:M3330E+AVL1108EG+AV2020+M12L64164A高斯贝尔ABS-208P/歌德威尔ABS-208H 1晶 14芯 5针 IC:AVL1108EG(Hi3121)+HI2023+5812高斯贝尔ABS-208P/歌德威尔ABS-208H 1晶 14芯 4针 IC:M3330E+AVL1108EG+AV2020+M12L64164A吉祥2009 3晶 14芯IC:GX3001＋GX1121＋RDK5812ABS-S LX-3688A 单晶12芯IC:GX3001+GX1121+5812集信科技V6 3晶9芯IC:1108EG(Hi3121)+HI2023+5812集信科技 V4.V6 2晶9芯 B型IC:0001+HN4F74+5812集信科技 V4.V6 A型HN4LSW+S6416AHTA-6BZH+EN25F80-1000CP+5812集信科技 V4.V6IC:0002P1M43700ta06+5812+EN25F80+TM8211+POL4558集信科技 V5 单晶10芯IC:0002(6121)+5812+M12L64164A艾雷特V5IC:HN4F910931M2EE+0001G1K729-1TA060932+5812艾雷特 alt 7812 3晶10芯IC:GX3001+GX1121+5812艾雷特ALT7812 3晶11芯IC:GX3001+GX1121+5812艾雷特ALT600c 2晶10芯IC:GX3001+GX1121+5812艾雷特ALT600c 2晶11芯IC:GX3001+GX1121+5812艾雷特ALT600c 1晶IC:CH216H+AVL1108+C6XS-8CA中大WS-3688ZJ (铁壳) 10芯单晶IC:Hi2023EC+Hi3102E+AV2020皇视HRS-268 3晶10芯IC:Hi2023EC+Hi3102E+AV2020皇视HSR-208B 2晶10芯IC:Hi2023+1108+2020皇视 208B 单晶10芯IC:3330+1108+2020皇视 210A 单晶6芯IC:Hi2023ec+Hi3122e+AV2020IC:Hi+1108+SHARP夏普头皇视HSR-268 单晶10线IC:HTV903+AVL1108+5812皇视HRS-268 3晶10芯IC:Hi2023EC+AVL1108+5812皇视260B 3晶10芯IC:Hi2023+1108+2020皇视260B 3晶10芯IC:HI2023+1108+5812天地星小霸王TDX-328B 1晶10芯IC:ALi M3328F+5810天地星小霸王 TDX-668B 2晶振IC:HTV903+AVL1108EGA+RDA5812+25L8005天地星小霸王 TDX-668B 单晶 6芯IC:Hi2023E+RDA5812+AVL1108E+MXT8211a+25L8005凯恩斯KES-2088S 2晶6芯IC:HI2023EC+HI3102E+RDA5812凯恩斯2077Z 单晶 6芯IC:2023EC+3122E+5812凯恩斯KES-2788S 3晶 10芯HC:HI2023E+AVL1108EGa+5812IC:HI2023EC+HI3102E+RDA5812凯恩斯KES-2088S 2晶 6芯IC:HI2023EC+HI3122E+RDA5812凯恩斯KES-2688b 2晶 10芯IC:Hi2023e+1108e+5812美路 3晶13芯IC:2023E+1108+2119美路 2晶12芯IC:GX3003+GX1121+F80+5812美路5598IC:Hi2023+1108+GAIM-18R+29lv160ZY 5518A 2晶10芯IC:Hi2023E+3102E+5812万利达ZY-5518A 2晶10芯IC:CX3001+GX1121+5812长虹新一代 3晶10芯IC:HI2023E+1108E+FL016ALF长虹数码CH930 3晶12芯IC:HTV903F+1108+AV2020+M80长虹精品TC-6688ABS 2晶10芯IC:HTV903+AVL1108EG+5812长虹KES-2099S 2晶5芯IC:Hi2023+Hi3102E+5812航天天信WTD198J 2晶12芯IC:GX3001+GX1121+5812+ES29LV160FB-70TG航天珠江 WTD-198J 2晶12芯IC:GX3001+GX1121+5812航天数码ABS-3809 2晶12芯IC:GX3001+GX1121+5812航天直播HT-168 3晶12芯IC:Hi2023+1108+夏普头天成TCD-2192晶 10芯IC:Hi2023EC+Hi3121+5812天成TCD-299Z 2晶10芯IC:Hi2023+3206+5812天成TD-299Z 2晶5芯IC:Hi2023+3206+5812天诚539 2晶10芯IC:HTV903+AV1108+5812天诚519型 2晶10芯IC:HTV903+1108E+5812天诚TCD-239ABS 3晶10芯IC:M3330+1108+5812天诚TCD-239ABS 2晶10芯IC:Hi2023+1108E+5812天诚TCD-239 2晶10芯IC:M3330E+1108E+5812天诚TCD-279 2晶10芯IC:Hi2023EC+Hi3102E+5812天诚TCD-369ABS 3晶10芯IC:Hi2023+1108+5812天成TCD-539ABS 2晶10芯IC:M3330E+AVL1108+25L80+5812TCD--239ABS 2晶10芯IC:M3330E+AVL1108E+5812TCD-519ABS 2晶10芯IC:Hi2023+AVL1108+5812TCD-599 2晶10芯IC:M3330+AVL1008+5812TCD-219ABS 2晶振 10芯IC:HI2023EC+HI3121+5812爱普思DVB-2568 3晶10芯IC:HTV903+1121+2020卓异5518A 3晶10芯IC:Hi2023E+1108+5812卓异5518A(铁壳)3晶11芯IC:Hi2023E+1108+5812卓异5518AG 2晶11芯IC:Hi2023E+1108+5812绿达视美人\\卓异 1晶10芯 IC:Hi2023EC+3121+2020绿达金统帅 3晶10芯IC:M3330+1108+5812三星高清王 2晶12芯IC:GX3001+GX1121+5812三星数码王TDX668B 2晶6芯 IC:Hi2023+1108+5812三星数码王TDX668B 2晶6芯 IC:HTV903F+AVL1108E+5812三星数码王TDX668E 1晶6芯 IC:Hi2023EC+3102C+5812开门红KSP638 单晶10芯IC:HTV903F+AVL1108E+AV2020日立创新TDX-668B 2晶6芯 IC:Hi2023+AVL1108+5812志高之星HS166 2晶12芯IC:Hi3102+Hi2023+5812金牛ABS-1108 3晶10芯IC:Hi2023+1108+5812小灵通 2晶6线IC:Hi2023+1108+5812福临门ABS-S 3晶9线IC:112i+3001+5812C60S-93AT 单晶10芯IC:CT216H+AVL1108EGa+AV2020其乐达CT216 2晶10芯IC:CT216+1108+AV2020科海单晶11芯IC:HTV903+AVL1108EGa+RDa5812+25X16AVSIG大旗920 3晶12芯IC:HTV903+AVL1108+AV2020大旗DQ920 3晶12芯IC:GX3001+GX1121+5812+25X16大旗930 3晶12芯IC:HTV903+AVL1108+AV2020众昌电子ABS--2088 2晶10芯IC: Hi2023+1108+5812众昌电子ABS-2087 2晶10芯IC:M3330+1108+5812创维S600 3晶IC:M3330E+1108E+5812创维新一代 3晶10芯IC:Hi2023E+1108+5037+FL016A中广通XC-B188 3晶12芯IC:GX3001+GX1121+5812深圳知音ABSTAR KT-2309 3晶10芯 IC:Hi2023+AVL1108E+5812铁壳ABS-2009 2晶11芯IC:Hi2023+1108+夏普头王牌数码OST-366 2晶6芯IC:Hi3102+Hi2023EC+AV2020。
AD9952 Evaluation Board Datasheet说明书
功能框图图1.DC/PHASE CORRECTION DC/PHASE CORRECTIONC SS C L KS D I OSERIAL PORT INTERFACE15141323892325262838VPOS_3P3DECL1TO DECL4211119303136273340101VPOS_5VLDO VCOLDO 2.5VRFIN0RFIN12922POLYPHASE FILTERLOIN–REFINLOIN+I+I–Q–Q+QUAD DIVIDERPLL343935547611990-001Rev. ADocument FeedbackInformation furnished by Analog Devices is believed to be accurate and reliable. However , no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Speci cations subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. T rademarks and registered trademarks are the property of their respective owners.One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2013–2014 Analog Devices, Inc. All rights reserved. Technical Support 695 MHz 至2700 MHz 正交解调器，集成小数N 分频PLL 和VCOADRF6820产品特性集成小数N 分频PLL 的I/Q 解调器RF 输入频率范围：695 MHz 至2700 MHz 内部LO 频率范围：356.25 MHz 至2850 MHz 输入P1dB ：14.5 dBm (1900 MHz RF) 输入IP3：35 dBm (1900 MHz RF) 可编程HD3/IP3调整单刀双掷(SPDT) RF 输入开关RF 数字步进衰减范围：0 dB 至15 dB集成式RF 可调谐巴伦，支持单端50 Ω输入 多核集成式VCO解调1 dB 带宽：600 MHz 4个可选基带增益和带宽模式数字可编程LO 相位失调和直流零点可通过三线式串行端口接口(SPI)进行编程 40引脚、6 mm x 6 mm LFCSP 封装应用蜂窝W-CDMA/GSM/LTE 数字预失真(DPD)接收器 微波点对点无线电概述ADRF6820是一款高度集成的解调器和频率合成器，非常适合用于下一代通信系统中。
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修订内容
Page3
B 2
4.±02 11 .0
A
2 .0 ±02 3 .0 ±02
24 .0 .±02
54 .5
12 .0 .±02
注意事项： 1.XXXX代表日期码，第一码表示公元年的最后一码，第二码表示生产时当月码 （A,B,C⋯.为一月，二月，三月⋯),第三，四码表示大量生产时批次码。 例如:2009年第一月生产的，D/C为9AXX。 2.包装及出货:ROHS,30PCS/管,0.6K/BOX,1.8K(1.8K BOXEX)/CARTON, BOXEX及 CARTON。
Features
◆ Low VF ◆ High Temperature Glass Passivated Junction ◆ Low Forward Voltage ◆ Low Leakage Current ◆ Reverse Voltage to 200 Volts ◆ Pb−Free Packages are Available ● High speed power switching
Rating Symbol D92-02
200 10 20 100 –40 to +150
Unit
V A A ℃
Peak Repetitive Reverse Voltage VRRM Working Peak Reverse Voltage VRWM DC Blocking Voltage VR Average Rectified Forward Current IF(AV) Total Device, (Rated VR), TC = 110℃ Nonrepetitive Peak Surge Current (Surge applied at IFSM rated load conditions halfwave , single phase, 50 Hz) Operating Junction Temperature and Storage Temperature TJ, Tstg
THERMAL CHARACTERISTICS（Per Diode Leg)
Maximum Thermal Resistance, Junction to Case Rθ JC 1.5 ℃/W
ELECTRICAL CHARACTERISTICS(Per Diode Leg)
Maximum Instantaneous Forward Voltage (1) (IF = 10 Amps, TC = 25°C) Maximum Instantaneous Reverse Current (1) (Rated dc Voltage, TJ = 150°C) (Rated dc Voltage, TJ = 25°C) Maximum Reverse Recovery Time (IF = 0.5 A, IR = 1.0 A, IREC = 0.25 A) (1) Pulse Test: Pulse Width = 300μ s, Duty Cycle≤2.0%. VF 0.94 V
LOW LOSS SUPER HIGH SPEED RECTIFIER
◆ Ultrafast 35 Nanosecond Recovery Time ◆ 175°C Operating Junction Temperature ◆ Popular TO-247 Package
D92 - 02
Typical Reference Data
IR
800 10
800 10 35
800 10
μ A
Trr
ns
Page1
D92-02
Page2
D92 - 02
TO-247
5 .5 ±01
顶杆孔深01±01 .5 .5
1.5 57
2 .0 ±01
C D
59 .8
E 35 . 36 . F G 06 .0 .±01
2.5 .5 49±01
2.5 .5 04±01 B 1
VRRM= 200V IF(AV)= 20A
APPLICATIONS
● Plating Power Supply ● Converter & Chopper ● Inversion Welder ● PFC ● Ultrasonic Cleaner and Welder
MAXIMUM RATINGS