MAX309EPE+中文资料

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APM3095P中文资料

APM3095P中文资料
Tj - Junction Temperature (°C)
RDS(ON)-On-Resistance (Ω)
On-Resistance vs. Drain Current
0.24
0.21
0.18 -VGS=4.5V
0.15
0.12 -VGS=10V
0.09
0.06
0.03
0.00 012345678
-VSD -Source-to-Drain Voltage (V)
Power (W)
Single Pulse Power
250
200
150
100
50
0 1E-3 0.01
0.1 1 10
Time (sec)
100 1000
Normalized Effective Transient Thermal Impedance
2.18
2.39
0.89
1.27
0.508
0.89
5.207
5.461
0.46
0.58
0.46
0.58
5.334
6.22
6.35
6.73
3.96
5.18
9.398
10.41
0.51
0.64
1.02
0.89
2.032
Copyright ANPEC Electronics Corp.
6
Rev. A.1 - Oct., 2002
Symbol PD
TJ TSTG RθjA
Parameter Maximum Power Dissipation TA=25°C
TA=100°C Maximum Junction Temperature Storage Temperature Range Thermal Resistance – Junction to Ambient

MAX1239MEEE中文资料

MAX1239MEEE中文资料

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
MAX1236–MAX1239
♦ ♦
Applications
Hand-Held Portable Applications Medical Instruments Battery-Powered Test Equipment Solar-Powered Remote Systems Received-Signal-Strength Indicators System Supervision
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at .

MAX3095ESE+中文资料

MAX3095ESE+中文资料

________________________Applications
Telecommunications Equipment Rugged RS-422/RS-485/RS-423 Bus Receiver Receivers for ESD-Sensitive Applications Level Translators
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
________________Functional Diagram
VCC
Байду номын сангаасG G A1
MAX3095 MAX3096
Y1
Pin Configuration
TOP VIEW
B1 1 A1 2 Y2 Y1 3 G 4 Y3 Y2 5 A2 6 Y4 B2 7 GND 8 16 VCC 15 B4 14 A4
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at .

MAX2605-MAX2609中文资料

MAX2605-MAX2609中文资料

General DescriptionThe MAX2605–MAX2609 evaluation kits (EV kits) simplify evaluation of this family of voltage-controlled oscillators (VCOs). These kits enable testing of the devices’ per-formance and require no additional support circuitry.Both signal outputs use SMA connectors to facilitate connection to RF test equipment.These EV kits are fully assembled and tested. Their oscil-lation frequencies are set to approximately the midrange of the respective VCOs.Featureso Easy Evaluationo Complete, Tunable VCO Test Board with Tank Circuit o Low Phase Noiseo Fully Assembled and TestedEvaluate: MAX2605–MAX2609MAX2605–MAX2609 Evaluation Kits19-1673 Rev 0; 9/00Ordering InformationComponent SuppliersFor free samples and the latest literature, visit or phone 1-800-998-8800.For small orders, phone 1-800-835-8769.MAX2606 Component ListMAX2605 Component ListE v a l u a t e : M A X 2605–M A X 2609MAX2605–MAX2609 Evaluation Kits 2_______________________________________________________________________________________Quick StartThe MAX2605–MAX2609 evaluation kits are fully assembled and factory tested. Follow the instructions in the Connections a nd Setup section for proper device evaluation.Test Equipment Required•Low-noise power supplies (these are recommended for oscillator noise measurement). Noise or ripple will frequency-modulate the oscillator and cause spectral spreading. Batteries can be used in place of power supplies, if necessary.– Use a DC power supply capable of supplying +2.7V to +5.5V. Alternatively, use two or three 1.5V batteries.– Use a DC power supply capable of supplying +0.4V to +2.4V, continuously variable, for TUNE.Alternatively, use two 1.5V batteries with a resistive voltage divider or potentiometer.•An RF spectrum analyzer that covers the operating frequency range of the MAX2605–MAX2609• A 50Ωcoaxial cable with SMA connectors •An ammeter (optional)Connections and Setup1)Connect a DC supply (preset to +3V) to the V CC and GND terminals (through an ammeter, if desired) on the EV kit.2)Turn on the DC supply. If used, the ammeter readingMAX2607 Component ListMAX2608 Component ListEvaluate: MAX2605–MAX2609MAX2605–MAX2609 Evaluation Kits_______________________________________________________________________________________3approximates the typical operating current specified in the MAX2605–MAX2609 data sheet.3)Connect the VCO output (OUT+ or OUT-) to a spec-trum analyzer with a 50Ωcoaxial cable.4)Apply a positive variable DC voltage between 0.4V and 2.4V to TUNE.5)Check the tuning bandwidth on the spectrum analyz-er by varying the tuning voltage (+0.4V to +2.4V).Layout ConsiderationsThe EV kit PC board can serve as a guide for laying out a board using the MAX2605–MAX2609. Generally, the VCC pin on the PC board should have a decoupling capacitor placed close to the IC. This minimizes noisecoupling from the supply. Also, place the VCO as far away as possible from the noisy section of a larger sys-tem, such as a switching regulator or digital circuits.The VCO ’s performance is strongly dependent on the availability of the external tuning inductor. For best per-formance, use high-Q components and choose their val-ues carefully. To minimize the effects of parasitic ele-ments, which degrade circuit performance, place the tuning inductor and C BYP close to the VCO. For higher-frequency versions, include the parasitic PC board inductance and capacitance when calculating the oscillation frequency. In addition, remove the ground plane around and under the tuning inductor to minimize the effect of parasitic capacitance.Noise on TUNE translates into FM noise on the outputs;therefore, keep the trace between TUNE and the control circuitry as short as possible. If necessary, use an RC filter to further suppress noise, as done on the EV kits.E v a l u a t e : M A X 2605–M A X 2609MAX2605–MAX2609 Evaluation Kits 4_______________________________________________________________________________________Figure 2. MAX2608/MAX2609 EV Kits SchematicFigure 1. MAX2605/MAX2606/MAX2607 EV Kits SchematicEvaluate: MAX2605–MAX2609MAX2605–MAX2609 Evaluation Kits_______________________________________________________________________________________5Figure 3. MAX2605/MAX2606/MAX2607 EV Kits ComponentPlacement Guide—Top Silk ScreenFigure 4. MAX2608/MAX2609 EV Kits Component PlacementGuide—Top Silk ScreenFigure 5. MAX2605/MAX2606/MAX2607 EV Kits PC BoardLayout—Component SideFigure 6. MAX2608/MAX2609 EV Kits PC Board Layout—Component SideMa xim ca nnot a ssume responsibility for use of a ny circuitry other tha n circuitry entirely embodied in a Ma xim product. No circuit pa tent licenses a re implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.6_____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2000 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.E v a l u a t e : M A X 2605–M A X 2609MAX2605–MAX2609 Evaluation Kits Figure 7. MAX2605/MAX2606/MAX2607/MAX2608/MAX2609EV Kits PC Board Layout—Ground Plane。

PGA309资料

PGA309资料

proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could1s/divV REF =4.096VMeasured After Bandpass Filter 0.1Hz Second−Order High−Pass 10Hz Fourth−Order Low−Pass1s/divG =1152Coarse Offset =−59mVMeasured After Bandpass Filter 0.1Hz Second−Order High−Pass 10Hz Fourth−Order Low−PassV IN =+61mVCLK_CFG=00(default)Gain=1152Time(10µs/div)SMALL−SIGNAL STEP RESPONSEGain=256Time(10µs/div)OVERVOLTAGE RECOVERYV OUTUnit1 Unit2Code(LSB)70000100002000030000400006000050000vs CODEPACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)PGA309AIPWR ACTIVE TSSOP PW 162500Green (RoHS &no Sb/Br)CU SNPB Level-1-260C-UNLIM PGA309AIPWTACTIVETSSOPPW16250Green (RoHS &no Sb/Br)CU SNPBLevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -May not be currently available -please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead (Pb-Free).Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate informationbut may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM9-Dec-2004Addendum-Page 1元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2004, Texas Instruments Incorporated。

普洛麦格(北京)生物技术有限公司CTM692产品说明书

普洛麦格(北京)生物技术有限公司CTM692产品说明书

2022版 CTM692原英文技术手册TM692中 文 说 明 书适用产品目录号:GA1330和GA1332FcγRI ADCP BioassayEffector Cells, Propagation Model普洛麦格(北京)生物技术有限公司Promega (Beijing) Biotech Co., Ltd 地址:北京市东城区北三环东路36号环球贸易中心B 座907-909电话:************网址: 技术支持电话:400 810 8133技术支持邮箱:*************************CTM 6922022制作1所有技术文献的英文原版均可在/ protocols 获得。

请访问该网址以确定您使用的说明书是否为最新版本。

如果您在使用该试剂盒时有任何问题,请与Promega 北京技术服务部联系。

电子邮箱:*************************1. 描述 ....................................................................................................................................................................................22. 产品组分和储存条件............................................................................................................................................................43. 开始实验前 ..........................................................................................................................................................................54. 制备Fc γRI ADCP 效应细胞 ................................................................................................................................................6 4. A. 细胞解冻和初始细胞培养 .......................................................................................................................................... 6 4. B. Fc γRI ADCP 效应细胞的细胞维持和增殖 ..................................................................................................................7 4. C. Fc γRI ADCP 效应细胞冷冻和储存 .............................................................................................................................75. 检测方案 .............................................................................................................................................................................8 5. A. Bio-Glo™试剂、检测缓冲液和测试及对照样品的制备...............................................................................................9 5. B. 孔板布局设计 ...........................................................................................................................................................10 5. C. 检测前一天制备和铺板贴壁靶细胞 ...........................................................................................................................10 5. D. 检测当天制备悬浮靶细胞 .........................................................................................................................................11 5. E. 制备抗体系列稀释液 ................................................................................................................................................12 5. F. 制备Fc γRI 效应细胞 ................................................................................................................................................12 5. G. 铺板悬浮靶细胞、抗体和Fc γRI 效应细胞 ................................................................................................................13 5. H. 将抗体和Fc γRI 效应细胞加至预先铺板的贴壁靶细胞中 ...........................................................................................13 5. I. 加入Bio-Glo™试剂 ..................................................................................................................................................14 5. J. 数据分析...................................................................................................................................................................146. 疑难解答 ...........................................................................................................................................................................157. 参考文献 ...........................................................................................................................................................................168. 代表性检测结果.. (17)FcγRI ADCP Bioassay Effector Cells, Propagation Model普洛麦格(北京)生物技术有限公司Promega (Beijing) Biotech Co., Ltd 地址:北京市东城区北三环东路36号环球贸易中心B座907-909电话:************网址:技术支持电话:400 810 8133技术支持邮箱:*************************CTM 6922022制作21. 描述抗体依赖性细胞介导的吞噬作用(ADCP)是治疗性抗体识别和介导消除病毒性感染细胞或病变(如肿瘤)细胞的重要作用机制。

MEMORY存储芯片MAX490CPA+中文规格书

MEMORY存储芯片MAX490CPA+中文规格书

±15kV ESD-Protected, Slew-Rate-Limited, Low-Power, RS-485/RS-422 TransceiversThe major difference between tests done using the Human Body Model and IEC1000-4-2 is higher peak current in IEC1000-4-2, because series resistance is lower in the IEC1000-4-2 model. Hence, the ESD with-stand voltage measured to IEC1000-4-2 is generally lower than that measured using the Human Body Model. Figure 7 shows the current waveform for the 8kV IEC1000-4-2 ESD contact-discharge test.The air-gap test involves approaching the device with a charged probe. The contact-discharge method connects the probe to the device before the probe is energized.Machine Model The Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resis-tance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. Of course, all pins require this protec-tion during manufacturing—not just inputs and outputs. Therefore,after PC board assembly,the Machine Model is less relevant to I/O ports.MAX487E/MAX1487E:128 Transceivers on the Bus The 48kΩ, 1/4-unit-load receiver input impedance of the MAX487E and MAX1487E allows up to 128 transceivers on a bus, compared to the 1-unit load (12kΩinput impedance) of standard RS-485 drivers (32 transceivers maximum). Any combination of MAX487E/MAX1487E and other RS-485 transceivers with a total of 32 unit loads or less can be put on the bus. The MAX481E, MAX483E, MAX485E, and MAX488E–MAX491E have standard 12kΩreceiver input impedance.MAX483E/MAX487E/MAX488E/MAX489E:Reduced EMI and Reflections The MAX483E and MAX487E–MAX489E are slew-rate limited, minimizing EMI and reducing reflections caused by improperly terminated cables. F igure 16 shows the driver output waveform and its Fourier analy-sis of a 150kHz signal transmitted by a MAX481E, MAX485E, MAX490E, MAX491E, or MAX1487E. High-frequency harmonics with large amplitudes are evident.F igure 17 shows the same information displayed for a MAX483E, MAX487E, MAX488E, or MAX489E transmit-ting under the same conditions. F igure 17’s high-fre-quency harmonics have much lower amplitudes, and the potential for EMI is significantly reduced.Low-Power Shutdown Mode(MAX481E/MAX483E/MAX487E) A low-power shutdown mode is initiated by bringing both RE high and DE low. The devices will not shut down unless both the driver and receiver are disabled. In shutdown, the devices typically draw only 0.5µA of supply current.RE and DE may be driven simultaneously; the parts are guaranteed not to enter shutdown if RE is high and DE is low for less than 50ns. If the inputs are in this state for at least 600ns, the parts are guaranteed to enter shutdown.F or the MAX481E, MAX483E, and MAX487E, the t ZH and t ZL enable times assume the part was not in the low-power shutdown state (the MAX485E, MAX488E–MAX491E, and MAX1487E can not be shut down). The t ZH(SHDN)and t ZL(SHDN)enable times assume the parts were shut down (see Electrical Characteristics).Figure 16. Driver Output Waveform and FFT Plot of MAX485E/MAX490E/MAX491E/MAX1487E Transmitting a 150kHz SignalFigure 17. Driver Output Waveform and FFT Plot ofMAX483E/MAX487E–MAX489E Transmitting a 150kHz SignalMAX481E/MAX483E/MAX485E/ MAX487E–MAX491E/MAX1487E 12±15kV ESD-Protected, Slew-Rate-Limited, Low-Power, RS-485/RS-422 TransceiversOrdering Information (continued)Selector GuideChip InformationTRANSISTOR COUNT: 295MAX481E/MAX483E/MAX485E/MAX487E–MAX491E/MAX1487E。

MAX3095中文资料

MAX3095中文资料

MAX3095/MAX3096
_______________Ordering Information
PART MAX3095CPE MAX3095CSE MAX3095CEE MAX3095EPE MAX3095ESE MAX3095EEE MAX3096CPE MAX3096CSE MAX3096CEE MAX3096EPE MAX3096ESE MAX3096EEE TEMP. RANGE 0°C to +70°C 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C -40°C to +85°C 0°C to +70°C 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C -40°C to +85°C PIN-PACKAGE 16 Plastic DIP 16 Narrow SO 16 QSOP 16 Plastic DIP 16 Narrow SO 16 QSOP 16 Plastic DIP 16 Narrow SO 16 QSOP 16 Plastic DIP 16 Narrow SO 16 QSOP
±15kV ESD-Protected, 10Mbps, 3V/5V, Quad RS-422/RS-485 Receivers MAX3095/MAX3096
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VCC) ...............................................................7V Control Input Voltage (G, G).......................-0.3V to (VCC + 0.3V) Receiver Input Voltage (A_, B_)...........................................±25V Receiver Output Voltage (Y_).....................-0.3V to (VCC + 0.3V) Continuous Power Dissipation (TA = +70°C) Plastic DIP (derate 10.5mW/°C above +70°C) ............762mW SO (derate 8.7mW/°C above +70°C) ...........................696mW QSOP (derate 8.3mW/°C above +70°C) ......................667mW Operating Temperature Ranges MAX309_C_ _ .....................................................0°C to +70°C MAX309_E_ _...................................................-40°C to +85°C Storage Temperature Range .............................-65°C to +160°C Lead Temperature (soldering, 10sec) .............................+300°C
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_______________General DescriptionThe MAX308/MAX309 precision, monolithic, CMOS ana-log multiplexers (muxes) offer low on-resistance (less than 100Ω), which is matched to within 5Ωbetween channels and remains flat over the specified analog sig-nal range (7Ωmax). They also offer low leakage over temperature (NO-off leakage current less than 5nA at +85°C) and fast switching speeds (transition time less than 250ns). The MAX308 is a single-ended 1-of-8device, and the MAX309 is a differential 2-of-4 device.The MAX308/MAX309 are fabricated with Maxim’s improved 44V silicon-gate process. Design improve-ments yield extremely low charge injection (less than 10pC) and guarantee electrostatic discharge protection greater than 2000V.These muxes operate with a single +5V to +30V supply or bipolar ±5V to ±20V supplies, while retaining TTL/CMOS-logic input compatibility and fast switching.CMOS inputs provide reduced input loading. These improved parts are plug-in upgrades for the industry-standard DG408, DG409, DG508A, and DG509A.________________________ApplicationsSample-and-Hold Circuits Automatic Test Equipment Heads-Up DisplaysGuidance and Control Systems Military RadiosCommunications Systems Battery-Operated Systems PBX, PABXAudio Signal Routing____________________________Featureso Guaranteed On-Resistance Match Between Channels, <5ΩMaxo Low On-Resistance, <100ΩMaxo Guaranteed Flat On-Resistance over Specified Signal Range, 7ΩMaxo Guarateed Low Charge Injection, <10pC o NO-Off Leakage Current <5nA at +85°C o COM-Off Leakage Current <20nA at +85°C o ESD Protection >2000Vo Plug-In Upgrade for Industry-Standard DG408/DG409/DG508A/DG509Ao Single-Supply Operation (+5V to +30V)Bipolar-Supply Operation (±5V to ±20V)o Low Power Consumption, <300µW o Rail-to-Rail Signal Handling o TTL/CMOS-Logic Compatible______________Ordering InformationMAX308/MAX309Precision, 8-Channel/Dual 4-Channel,High-Performance, CMOS Analog Multiplexers________________________________________________________________Maxim Integrated Products 1_____________________Pin Configurations/Functional Diagrams/Truth TablesFor pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .19-0271; Rev 2; 8/02Ordering Information continued at end of data sheet.*Contact factory for dice specifications.**Contact factory for availability.M A X 308/M A X 309Precision, 8-Channel/Dual 4-Channel,High-Performance, CMOS Analog Multiplexers 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS —Dual Supplies(V+ = +15V, V- = -15V, GND = 0V, V AH = +2.4V, V AL = +0.8V, T A = T MIN to T MAX , unless otherwise noted.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Voltage Referenced to V-V+............................................................................-0.3V, 44V GND.........................................................................-0.3V, 25V Digital Inputs, NO, COM (Note 1)...........(V- - 2V) to (V+ + 2V) or30mA, (whichever occurs first)Continuous Current (any terminal)......................................30mA Peak Current, NO or COM(pulsed at 1ms, 10% duty cycle max)..........................100mAContinuous Power Dissipation (T A = +70°C)Plastic DIP (derate 10.53mW/°C above +70°C)..........842mW Narrow SO (derate 8.70mW/°C above +70°C)............696mW CERDIP (derate 10.00mW/°C above +70°C)...............800mW TSSOP (derate 6.7mW/°C above +70°C)....................457mW Operating Temperature RangesMAX30_C_ _.......................................................0°C to +70°C MAX30_E_ _.....................................................-40°C to +85°C MAX30_MJE ..................................................-55°C to +125°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10sec).............................+300°CNote 1:Signals on NO, COM, EN, A0, A1, or A2 exceeding V+ or V- are clamped by internal diodes. Limit forward current to maximum current ratings.MAX308/MAX309Precision, 8-Channel/Dual 4-Channel,High-Performance, CMOS Analog Multiplexers_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS —Dual Supplies (continued)(V+ = +15V, V- = -15V, GND = 0V, V AH = +2.4V, V AL = +0.8V, T A = T MIN to T MAX , unless otherwise noted.)M A X 308/M A X 309Precision, 8-Channel/Dual 4-Channel,High-Performance, CMOS Analog Multiplexers 4_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS —Single Supply(V+ = +12V, V- = 0V, GND = 0V, V AH = +2.4V, V AL = +0.8V, T A = T MIN to T MAX , unless otherwise noted.)Note 2:The algebraic convention where the most negative value is a minimum and the most positive value a maximum is used inthis data sheet.Note 3:Guaranteed by design.Note 4:∆R ON = R ON(MAX)- R ON(MIN).On-resistance match between channels and flatness are guaranteed only with specifiedvoltages. Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured at the extremes of the specified analog signal range.Note 5:Leakage parameters are 100% tested at the maximum rated hot temperature and guaranteed by correlation at +25°C.Note 6:Off isolation = 20log V COM /V NO , where V COM = output and V NO = input to off switch.MAX308/MAX309Precision, 8-Channel/Dual 4-Channel,High-Performance, CMOS Analog Multiplexers_______________________________________________________________________________________5120140160ON-RESISTANCE vs. V COM(DUAL SUPPLIES)1000204060-2020-1515-1010-5580V COM (V)R O N (Ω)120ON-RESISTANCE vs. V COM ANDTEMPERATURE (DUAL SUPPLIES)100M A X 308/9 T O C -02204060-1515-1010-55080V COM (V)R O N (Ω)280320360400ON-RESISTANCE vs. V COM(SINGLE SUPPLY)24040801201601520105200V COM (V)R O N (Ω)120140160ON-RESISTANCE vs. V COM AND TEMPERATURE (SINGLE SUPPLY)100020*********80V COM (V)R O N (Ω)30CHARGE INJECTION vs. V COM20-30-20-100-1515-1010-55010V COM (V)Q j (p C )100.0001-55125OFF LEAKAGE vs. TEMPERATURE1TEMPERATURE (°C)O F F L E A K A G E (n A )250.010.001-35-15650.1100100045851055100.0001-55125ON LEAKAGE vs. TEMPERATURE1TEMPERATURE (°C)O N L E A K A G E (n A )250.010.001-35-15650.11001000458510551000.001-55125SUPPLY CURRENT vs. TEMPERATURE10TEMPERATURE (°C)I +, I - (µA )250.10.01-35-1565145851055__________________________________________Typical Operating Characteristics(T A = +25°C, unless otherwise noted.)__________Applications InformationOperation withSupply Voltages Other than 15VUsing supply voltages less than ±15V will reduce the analog signal range. The MAX308/MAX309 switches operate with ±5V to ±20V bipolar supplies or with a +5V to +30V single supply. Connect V- to GND when operating with a single supply. Both device types can also operate with unbalanced supplies, such as +24V and -5V. The Typical Operating Characteristics graphs show typical on-resistance with 20V, 15V, 10V, and 5V supplies. (Switching times increase by a factor of two or more for operation at 5V.)Overvoltage ProtectionProper power-supply sequencing is recommended for all CMOS devices. Do not exceed the absolute maxi-mum ratings, because stresses beyond the listed rat-ings may cause permanent damage to the devices.Always sequence V+ on first, then V-, followed by the logic inputs, NO, or COM. If power-supply sequencing is not possible, add two small signal diodes in series with supply pins for overvoltage protection (Figure 1).Adding diodes reduces the analog signal range to 1V below V+ and 1V above V-, but does not affect the devices’ low switch resistance and low leakage charac-teristics. Device operation is unchanged, and the differ-ence between V+ and V- should not exceed +44V.M A X 308/M A X 309Precision, 8-Channel/Dual 4-Channel,High-Performance, CMOS Analog Multiplexers 6_____________________________________________________________________________________________________________________________________________________Pin DescriptionFigure 1. Overvoltage Protection Using External Blocking DiodesPINMAX308MAX309NAME FUNCTION1, 15, 16A0, A2, A1Address Inputs ——A0, A1Address Inputs 22EN Enable Input33V-Negative Supply Voltage Input 4–7—NO1–NO4Analog Inputs—Bidirectional —4–7NO1A–NO4AAnalog Inputs—Bidirectional 8—COM Analog Output—Bidirectional —8, 9COMA, COMB Analog Outputs—Bidirectional 9–12—NO8–NO5Analog Inputs—Bidirectional —10–13NO4B–NO1BAnalog Inputs—Bidirectional 1314V+Positive Supply Voltage Input 1415GNDGround1, 16MAX308/MAX309Precision, 8-Channel/Dual 4-Channel,High-Performance, CMOS Analog Multiplexers_______________________________________________________________________________________7______________________________________________Test Circuits/Timing DiagramsFigure 2. Transition TimeM A X 308/M A X 309Precision, 8-Channel/Dual 4-Channel,High-Performance, CMOS Analog Multiplexers 8________________________________________________________________________________________________________________________Test Circuits/Timing Diagrams (continued)Figure 5. Charge InjectionMAX308/MAX309Precision, 8-Channel/Dual 4-Channel,High-Performance, CMOS Analog Multiplexers_______________________________________________________________________________________9_________________________________Test Circuits/Timing Diagrams (continued)Figure 6. Off Isolation Figure 7. CrosstalkFigure 8. NO/COM CapacitanceM A X 308/M A X 309Precision, 8-Channel/Dual 4-Channel,High-Performance, CMOS Analog Multiplexers 10______________________________________________________________________________________________Pin Configurations/Functional Diagrams/Truth Tables (continued)MAX308/MAX309Precision, 8-Channel/Dual 4-Channel,High-Performance, CMOS Analog Multiplexers______________________________________________________________________________________11_Ordering Information (continued)*Contact factory for dice specifications.**Contact factory for availability.Package InformationFor the latest package outline information, go to /packages .Ma xim ca nnot a ssume responsibility for use of a ny circuitry other tha n circuitry entirely embodied in a Ma xim product. No circuit pa tent licenses a re implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.12__________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600©2002 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.M A X 308/M A X 309Precision, 8-Channel/Dual 4-Channel,High-Performance, CMOS Analog Multiplexers __________________________________________________________Chip TopographiesNO40.080"(2.03mm)COM NO8NO7NO4A 0.080"(2.03mm)COMA COMB NO4BTRANSISTOR COUNT: 122SUBSTRATE CONNECTED TO V+TRANSISTOR COUNT: 122SUBSTRATE CONNECTED TO V+MAX308MAX309N.C. = NO INTERNAL CONNECTION。

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