ANADIGICS为三星Galaxy S 4G和Galaxy SII X智能手机提供功率放大器
ANADIGICS为三星Galaxy S 4G和Galaxy SII X智能手机提供功率放大器
ANADIGICS, Inc. (Nasdaq：ANAD) 是全球首屈一指的射频 (RF) 解决方案供应商。该公
司今日宣布开始为三星电子的新型Galaxy S 4G和Galaxy SII X智能手机批量供应AWT6622
和AWT6624第四代低功耗高效率 (HELP4™) 功率放大器 (PA)。三星Galaxy S 4G智能
手机将由T-Mobile独家销售，配备一块4英寸的显示屏、500万像素摄像头，带LED闪光灯，
采用1 GHz处理器和Android 2.2 Froyo操作系统。而三星Galaxy SII X智能手机将由Telus
独家销售，配备1.5 GHz双核处理器、一块4.5英寸显示屏、800万像素摄像头，带LED闪
光灯，采用Android 2.3 Gingerbread操作系统。 ANADIGICS全球销售高级副总裁
Michael Canonico表示：“三星新型Galaxy S 4G和Galaxy SII X智能手机采用先进
的HSPA+连接技术，配备超大屏幕和强大处理器，必将给用户带来出色的多媒体体验。
ANADIGICS的HELP4功率放大器系列可以显著延长高耗电的多媒体智能手机的电池续航时间，
已然成为效率和性能方面的行业标准。我们很高兴继续与三星电子密切合作，把移动用户体
验推上新的台阶。” ANADIGICS行业领先的HELP4™产品系列采用该公司专
有的InGaP-Plus™技术，可在整个中低输出功率水平下实现最佳效率，而且其静态电
流也是业内最低。凭借业界领先的HSPA+能效表现，AWT6622和AWT6624功率放大器可以显著
延长4G手机、智能手机、平板电脑、上网本和笔记本的电池寿命。 ANADIGICS
HELP4™功率放大器系列的重要信息和特征： •世界一流的性能 o 平均
功耗比上一代功率放大器低30% o 三种模式状态，可在中低输出功率水平实现高效率
o 行业最低静态电流 o 最大输出功率下可实现同类最佳线性度 •业界领先的
集成设计 o 面积仅为3 mm × 3 mm o 集成电压调节 o 集成“
可级连”的定向射频耦合器，具有20dB定向性 ANADIGICS HELP4™功率放
大器系列的重要技术规格：
零件编号
频带
效率
静态电流
AWT6622
1850 MHz至1910 MHz
(频带2)
40% @ +28.6 dBm
34% @ +17 dBm
24% @ +8 dBm
2 mA
AWT6624
1710 MHz至1785 MHz
(频带3、4、9 & 10)
39% @ +28.3 dBm
36% @ +17 dBm
26% @ +8 dBm
2 mA
如需了解有关ANADIGICS的产品和多媒体内容的更多信息，请参阅以下资源：
•ANADIGICS LinkedIn：/company/anadigics •ANADIGICS Facebook：
/anadigics •ANADIGICS Twitter：/anadigics •ANADIGICS照片：
/anadigics •ANADIGICS视频：/anadigics
IC专业术语-通信-电子-网络专业术语(中英文对照表)-DSP常用接口中英文对照
封装形式：封装形式是指安装半导体集成电路芯片用的外壳。
它不仅起着安装、固定、密封、保护芯片及增强电热性能等方面的作用，而且还通过芯片上的接点用导线连接到封装外壳的引脚上，这些引脚又通过印刷电路板上的导线与其他器件相连接。
衡量一个芯片封装技术先进与否的重要指标是芯片面积与封装面积之比，这个比值越接近1越好。
封装大致经过了如下发展进程：结构方面：TO－>DIP－>LCC－>QFP－>BGA －>CSP；材料方面：金属、陶瓷－>陶瓷、塑料－>塑料；引脚形状：长引线直插－>短引线或无引线贴装－>球状凸点；装配方式：通孔插装－>表面组装－>直接安装。
常见英文缩写解释（按字母顺序排列）：模拟滤波器光纤通信高速信号处理和转换无线/射频光线通讯，模拟显示支持电路高频模拟和混合信号ASIC数字转换器，接口，电源管理，电池监控 DC/DC电源电压基准MAXIM前缀是“MAX”。
DALLAS则是以“DS”开头。
MAX×××或MAX××××说明：1后缀CSA、CWA 其中C表示普通级，S表示表贴，W表示宽体表贴。
2 后缀CWI表示宽体表贴，EEWI宽体工业级表贴，后缀MJA或883为军级。
3 CPA、BCPI、BCPP、CPP、CCPP、CPE、CPD、ACPA后缀均为普通双列直插。
举例MAX202CPE、CPE普通ECPE普通带抗静电保护MAX202EEPE 工业级抗静电保护（-45℃-85℃）说明 E指抗静电保护MAXIM数字排列分类1字头模拟器 2字头滤波器 3字头多路开关4字头放大器 5字头数模转换器 6字头电压基准7字头电压转换 8字头复位器 9字头比较器DALLAS命名规则例如DS1210N.S. DS1225Y-100INDN=工业级S=表贴宽体 MCG=DIP封Z=表贴宽体 MNG=DIP工业级IND=工业级 QCG=PLCC封 Q=QFP下面是MAXIM的命名规则：三字母后缀：例如：MAX358CPDC = 温度范围P = 封装类型D = 管脚数温度范围：C = 0℃至 70℃（商业级）I = -20℃至 +85℃（工业级）E = -40℃至 +85℃（扩展工业级）A = -40℃至 +85℃（航空级）M = -55℃至 +125℃（军品级）封装类型：A SSOP(缩小外型封装)B CERQUADC TO-220, TQFP(薄型四方扁平封装)D 陶瓷铜顶封装四字母后缀：例如：MAX1480ACPIA = 指标等级或附带功能C = 温度范围P = 封装类型I = 管脚数管脚数：A: 8 B: 10，64C: 12，192 D: 14E: 16 F: 22，256G: 24 H: 44I: 28 J: 32K: 5，68 L: 40M: 7，48 N: 18O: 42 P: 20Q: 2，100 R: 3，84S: 4，80 T: 6，160U: 60 V: 8（圆形）W: 10（圆形）X: 36Y: 8（圆形）Z: 10（圆形）E 四分之一大的小外型封装F 陶瓷扁平封装H 模块封装, SBGA(超级球式栅格阵列, 5x5 TQFP)J CERDIP (陶瓷双列直插)K TO-3 塑料接脚栅格阵列L LCC (无引线芯片承载封装)M MQFP (公制四方扁平封装)N 窄体塑封双列直插P 塑封双列直插Q PLCC (塑料式引线芯片承载封装)R 窄体陶瓷双列直插封装(300mil)S 小外型封装T TO5,TO-99,TO-100U TSSOP,μMAX,SOTW 宽体小外型封装（300mil）X SC-70（3脚，5脚，6脚）Y 窄体铜顶封装Z TO-92，MQUAD/D 裸片/PR 增强型塑封/W 晶圆DSP信号处理器放大器工业用器件通信电源管理移动通信视频/图像处理器等模拟A/D D/A 转换器传感器模拟器件AD产品以“AD”、“ADV”居多，也有“OP”或者“REF”、“AMP”、“SMP”、“SSM”、“TMP”、“TMS”等开头的。
ADI推出运算放大器ADA4870
Ｓ ｐ ａ ｎ ｓ ｉ ｏ ｎ 助 力打造绿 色物联 网
Ｓ ｐ ａ ｎ ｓ ｉ ｏ ｎ公 司 日前宣 布 推 出一 套 全 新 的能 量采 集 电 源 管 理集 成 电路 （ Ｐ ＭＩ Ｃ） 系列 ， 该 系列 产 品 面
向可穿戴 电子设备到无线传感器 网络节点等各类物 联网设备 ，可以消除设备对于电池的需求或延长电 池续航时间 ，从而打造更加环保 的物联 网。 （ 来自
司。 （ 来自Ａ ｌ ｔ ｅ ｒ ａ ）
利用 Ｔ Ｉ 的 片上 互 联 网 可为任何 设备增添 Ｗ ｉ — Ｆ ｉ ￣功能
日前 ， 德州仪 器 （ １ １ ） 宣 布推 出其 面 向物联 网
（ １ ｏ Ｔ）应 用 的新 型 Ｓ ｉ ｍｐ ｌ ｅ Ｌ ｉ ｎ ｋ Ｍ Ｔ Ｗｉ — Ｆ ｉ ￣Ｃ Ｃ ３ １ ０ ０和 Ｃ Ｃ ３ ２ ０ ０平 台 。 在 Ｔ Ｉ 针对 Ｉ ｏ Ｔ应 用 的诸 多新 型 、 简
特 网连接安 全地 将设 备连 接至 云端 。 （ 来自
Ｍｏ ｕ ｓ ｅ ｒ ）
Ｉ Ｃ和一个 １ ６ 位Ａ Ｄ Ｃ 。这颗三合一传感器具有中断
功能 ， 支持 Ｉ ２ Ｃ总线通信接 口， 在各种汽车 、 消费和
工业应用 中能极大简化 窗口和传感器的摆放位置设 计 。（ 来 自Ｖ ｉ ｓ ｈ ａ ｙ ）
＾…
； …
…
Hale Waihona Puke ｒ ｈ 的运算放大器 Ａ Ｄ Ａ ４ ８ ７ ０ ， 可用于高 电压和高输出电 流下 的高负载驱动应用 ， 包括压电传感器 、 Ｐ Ｉ Ｎ二极 管 、激 光二 极管 、功率 Ｆ Ｅ Ｔ 、线 圈和 Ｃ Ｃ Ｄ 。４ ０ Ｖ 协议 ，联合开发并促进各种宽带无线市场可编程解 Ａ Ｄ Ａ ４ ８ ７ ０ 放大器可提供超过 １ Ａ的输 出电流 ，压摆 决方案的实现 。 按照协议 ， 双方将开发经过优化的现
Intersil公司详细简介
Intersil公司简介2000年Intersil作为一个美国半导体公司完成最大的IPO。
2001年Intersil向Fairchild出售分立电源业务。
2002年Intersil收购Elantec。
2004年Intersil收购Xicor成为纯模拟产品公司。
2008年7月，Intersil收购了专做数字输入D类音频放大器的D2Audio公司，Intersil中国区总经理陈宇介绍说，D2Audio的技术保证了公司拥有目前业界最好的D类放大器的音质，与最好的模拟放大器属于同一级别，是功能丰富的平台，使用非常方便，而且还包括从多种扬声器系统获得最佳效果所需的工具，并可做到最低的系统成本。
另外，Intersil的客户在采用D2Audio的产品时没有版权税问题的困扰，音频解决方案有助于在普通消费类产品上实现差异化和增值。
可扩展的全数字放大器和DSP系统解决方案，可提供输出电源从毫瓦到千瓦的参考设计，支持立体声2.1声道，一直到汽车音响的12/16/24声道。
2008年9月，Intersil收购了专注做新型高速模数转换器（ADC）的Kenet公司，Kenet采用标准的CMOS工艺实现一种独特、先进的工艺技术，这就是利用电荷区信号处理工艺（FemtoCharge）技术，所以在体积、质量以及成本上都可以有效地控制。
特别是能在12位的500兆采样的频率下面，能提供业界最低的功耗，是其他同类产品功耗的五分之一，这也为Intersi带来了更多的特殊应用市场的机会。
2008年12月，Intersil收购了做高效数字电源管理IC的Zilker Labs公司。
一个专注做模拟的公司，为何收购一家做数字电源的公司？其主要原因在于电源领域现在受到了很多的挑战，其中最重要的几个方面包括在高密度的应用上所面临的散热问题，芯片占位空间问题。
而且现在的工程师在设计时，会大量采用DSP、ASIC、FPGA等，这就对电源管理提出了排序要求、上升源控制要求和系统可靠性的要求等等。
可提升手机GPS功效的超低噪声放大器模块ALM-1106
可提升手机GPS功效的超低噪声放大器模块ALM-1106
佚名
【期刊名称】《电子元器件应用》
【年(卷),期】2005(007)012
【摘要】安捷伦科技有限公司（Agilent Technolocies Inc．）日前推出具有超低噪声指数（介于0．9到3．5GHz间）的单晶微波集成电路（MMIC）低噪声放
大器（LNA）模块ALM-1106，该器件的关断（shutdown）功能可提升手机GPS的功效。
安捷伦的ALM-1106放大器模块具有低噪声指数（可提高灵敏度）、袖珍尺寸、低压操作和节电等特性，因而可成为手机GPS接收器的理想选择。
【总页数】1页(P136)
【正文语种】中文
【中图分类】TN722.3
【相关文献】
1.安捷伦超低噪声放大器模块 [J],
2.适用于全双工蜂窝手机的GPS低噪声放大器 [J], Ian Piper
3.英飞凌新型LTE低噪声放大器和LNA Bank让智能手机数据速率提升高达96%,大幅改善用户体验 [J],
4.安捷伦科技推出具关断功能的超低噪声放大器模块 [J],
5.超低噪声系数放大器,有效提高GPS接收机性能 [J],
因版权原因，仅展示原文概要，查看原文内容请购买。
无处不在的ADI 音频产品及其解决方案
无处不在的ADI音频产品及其解决方案AD I 音频产品在我们的生活和工作中无处不在， 已被成功、 广泛的使用在诸如汽车娱乐系统、 家庭影院、 专业音响、 消费类设备等众多领域。
随着音效技术的升级， AD I 不断积累和开拓音频方面技术， 为用户提供更多的解决方案。
ADI 公司音频DSP 、处理器产品AD I 专门为数字音频市场设计的D SP 有SIGM A 和SH A R C 两种类型，其中SIGM A D SP 进行定点计算，使用便捷、简单，而SH A R C D SP 支持浮点运算，设计难度较高，最初为源码编程形式而后发展为图形化编程从而降低了设计难度，市场定位多为中高端应用。
SIGM A D SP 是经典且有生命力和竞争力的产品，纵观SIGM A D SP 的发展历史，其产品由远至近的演变大体为ADAU1701, ADAU1702 , ADAU1761, ADAU 1781 /85/86,ADAU 1442/45/46,ADAU 1450/51/52,ADAU 1462/66,ADAU 1463/6 7。
有些产品虽已发布将近10年但其生命力仍然旺盛，在一些典型应用中仍受用户喜爱并继续使用，比如ADAU1701/61。
而新开发的产品是为了更好的满足日益增强的需求，因此这些产品在主频、S R A M 、通道数和数据交换等方面均有很大程度的提升。
t n ol p 也缸t I b 九30切Ill .u o 上d o o s 32-bit floating卡olnt 1.2 GNAICS+r G SO o e s I s 厂I n。
I n 仄�n I s 虹忒可,� 尸•�en � Co叩虹邱y Options-Inc比如：CAIN AVB MOST150 岱SigmaSt u d i o Soft.ware Tools and Optimized Algorithms札...._,,雪“心丘匿1音频DSP 产品路线图ADAU1701/ ADAU1761是ADI早期的SIGMA DSP产品，但是此类应用中通过配备ARM或单片机由蓝牙或W i-Fi和外界网络进行连接，这使得ADAU170x成为更加有活力的产品， 为用户提供更多的增值服务和用户体验。
XPT4890音频功率放大器
XPT4890 芯片功能说明z XPT4890是适用于移动电话及便携通讯设备的音频功率放大器。
5V工作电压时，最大驱动功率为1W（8Ω BTL负载），音频范围内总谐波失真噪声小于1％（20Hz～20KHz);z XPT4890的应用电路简单，只需极少数外围器件z XPT4890输出不需要外接耦合电容或上举电容，采用MSOP、DFN封装，节约电路面积，非常适合移动电话及各种移动设备等使用低电压、低功耗应用方案上使用；z XPT4890可以通过控制进入休眠模式，从而减少功耗;z XPT4890通过创新的“开关/切换噪声”抑制技术，杜绝了上电、掉电出现的噪声；z XPT4890工作稳定，增益带宽积高达2.5MHz，并且单位增益稳定。
通过配置外围电阻可以调整放大器的电压增益，方便应用。
芯片功能主要特性z高电源电压抑制比（PSRR），在217Hz及1KHz时，达到70dBz噪声及谐波失真（THD＋N），小于1％（5V，8Ω，1W时）z输出功率高（THD＋N<1%)： 5V－1W（8Ω），3.3V －600mW（4Ω），3.3V－400mW（8Ω）z掉电模式漏电流小，小于0.1uAz上电、掉电噪声抑制z宽工作电压范围2.0V—5.5Vz不需驱动输出耦合电容z单位增益稳定z MSOP8\DFN8(3X3)(2X2)\SOP8 封装实物图：芯片的基本应用·移动电话（手机等）·个人移动终端PDA·移动电子设备·消费类电子产品(如MP3/MP4/DFP/Protable DVD)等XPT4890 原理框图芯片定购信息芯片型号封装类型包装类型最小包装数量（PCS）备注XPT4890MS MSOP8 编带 3000XPT4890DF3 DFN3X3 编带 3000XPT4890DF2 DFN2X2 编带 3000XPT4890SO SOP8 管装 100 XPT4890 原理框图典型应用电路引脚分部图XPT4890MSOP8/SOP8 DFN81、MSOP82、DFN3X34、SOP8。
安霸 芯片
安霸芯片安霸芯片（Ambarella chip）是一种专门用于高清视频和图像处理的芯片。
安霸公司是一家总部位于美国的半导体公司，致力于为安防、电动车和无人机等领域提供高性能的视频处理解决方案。
安霸芯片在这些领域中得到广泛应用，其高画质和低功耗的特性成为其成功的关键。
首先，安霸芯片通过先进的图像处理技术，能够实现高清视频的捕捉和压缩。
芯片采用现代化的图像处理算法，可以提取出更为细致和真实的画面细节，使得用户能够获得更清晰、更精确的图像和视频。
此外，芯片还支持实时压缩技术，能够将高清视频压缩为较小的文件大小，方便存储和传输。
其次，安霸芯片具备强大的图像稳定化功能。
在拍摄高清视频时，由于手震或运动导致画面模糊的问题经常出现。
然而，通过安霸的图像稳定化技术，芯片可以对图像进行实时分析和纠正，从而消除图像的抖动和模糊，使得最终的视频更加平稳和清晰。
此外，安霸芯片还具备低功耗和高性能的优点。
芯片采用先进的制程工艺和优化的能耗管理策略，能够在提供高性能的同时降低功耗。
这使得芯片适用于电池供电的设备，如无人机和移动监控系统，能够延长设备的使用时间，提高其续航能力。
另外，安霸芯片还具备较高的安全性和可靠性。
芯片采用多层次的安全措施，包括硬件加密和数字签名等技术，可以有效防止数据泄露和安全漏洞。
此外，芯片还采用了高质量和可靠性的元件和材料，确保芯片的长时间工作稳定性和可靠性。
最后，安霸芯片还支持多种接口和通讯协议，方便与其他设备进行连接和互联。
芯片可与各种传感器、摄像头和显示器等设备进行通信，并且支持常见的视频和音频格式。
这使得芯片在各种应用场景中具备良好的兼容性和可扩展性。
总的来说，安霸芯片是一种功能强大、性能卓越的专用芯片，广泛应用于高清视频和图像处理领域。
其高画质、低功耗、图像稳定化和安全可靠等特点，使得安霸芯片成为众多安防、电动车和无人机等领域的首选解决方案。
NS4150B 超低EMI,无滤波器3W单声道D类音频功率放大器
9.1 原理框图...........................................................................................................................................................10 9.2 工作原理...........................................................................................................................................................10 9.3 无需输出滤波器...............................................................................................................................................10 9.4 上电 ,掉电噪声抑制.........................................................................................................................................10 9.5 EMI 增强技术...................................................................................................................................................11 9.6 CTRL 引脚设置................................................................................................................................................11 9.7 效率...................................................................................................................................................................11 9.8 保护电路...........................................................................................................................................................11 9.9 应用信息...........................................................................................................................................................12
SiGe半导体推出第二代WiMAX功率放大器SE7271T
ｈｔ Ｉ ｔｐ： ｗｗｗ． ｉｍａ ． ｏ ｌ ｃ ｃ ｇ ｃ ｍ
个共 同研究 的 课题 和研 究人 员互 访及 学生 交 流 的
发中心 ， 纳米技术实验室 、 微系统信息 网研发 中心 、
源科 学 与技术 研究 室 、 宽带无 线 移动 通信 研究 室 ； 六个 与地方 共建 的 中心 ： 上海微 小 卫星 工程 中心 、 上 工程 中心 、中国科学 院无 锡 高新 微纳传 感 网工 程技 术研发 中心 、 中国科 学 院 南 京宽 带 无线 移 动通 信 研 充中心 、中科 院杭 州射 频识 别技 术研 发 中心 。上 海 教系统 所拥 有 硅 ＭＥ ＭＳ加 工 和封 装 、 合 物半 导 体 化 ｌ料 ＭＢ 才 Ｅ生 长和半 导体 器件 研 制 、 系统 网络设计 微 阳测 试 等技 术 平 台 、 以及 微 系统 、 结 构 器件 、 导 微 半
材 料
Hale Waihona Puke 【】 集 成 电 路 ｌ国
Ｃ ｈｉ ｎａ ｎｔ Ｉ ｅｇ ｒ ｅｄ ｉｃｕ ｉ ａｔ Ｃ ｒ ｔ
哑
常常说 的一 句话 。他总 想 提醒大 家 ，中国跟 世界 顶 尖水 平 还 有 差距 —— 实 现零 的 突破 只 是第 一 步 ， 世 界顶 级才 是应 该 瞄准 的理想 境界 。 ２０ ０ ７年 １ ， 曦 出任 中科 院上 海微 系统 所 党 月 王 委书记 ， 新傲 公 司董 事长 ， 的主要 精力 也 转到 了 兼 他 研究 所 的未来 发展 上 。 曦对 记 者说 ： 我们 研究 所 王 “ 面向国家 战略需 求 ， 向世 界科学 前沿 ， 是要 培植 面 就 出更 多像新 傲 这样 的高 技术公 司 ！” 目前全 所共 有 ６个研 究 室 ：传感技 术 联合 国家 重点 实 验室 ， 系统技 术 国家级 重点 实 验室 、信 息 微 功能材 料 国家 重 点 实验 室 、 导 体 功能 薄 膜 工 程研 半
Skyworks Solutions, Inc. SKY66292-11 高效4W功率放大器说明书
DATA SHEETSKY66292-11: 2300 to 2400 MHz High-Efficiency 4 W Power AmplifierApplications∙ FDD and TDD 2G/3G/4G LTE systems∙ 3GPP band 30 and 40 small cell base stations∙ Driver amplifier for micro-base and macro-base stations ∙ Active antenna array and massive MIMOFeatures∙ High efficiency: PAE = 36.5% @ +28 dBm∙ High linearity: +28 dBm with < -50 dBc linearized ACLR (20 MHz LTE, 8.5 dB PAR signal) ∙ High gain: 35.5 dB∙ Excellent input and output return loss: to 50 Ω system∙ Integrated active bias: performance compensated over temp ∙ Integrated enable On/Off function: PAEN = 1.7 to 2.5 V ∙ Single supply voltage: 5.0 V∙ Pin-to-pin compatible PA family supporting all 3GPP bands ∙ Compact (16-pin, 5 ⨯ 5 ⨯ 1.3 mm) package (MSL3, 260 ︒C per JEDEC J-STD-020)S kywork s G reen TM product s are compliant with all applicable legi s lation and are halogen-free.For additional information, refer to Skyworks Definition of Green TM , document number SQ04–0074.Figure 1. SKY66292-11 Block DiagramDescriptionThe SKY66292-11 is a high-efficiency fully input/output matched power amplifier (PA) with high gain and linearity. The compact 5 ⨯ 5 mm PA is designed for FDD and TDD 2G/3G/4G LTE small cell base stations operating from 2300 to 2400 MHz. The active biasing circuitry is integrated to compensate PA performance over temperature, voltage, and process variation.The SKY66292-11 is part of high efficiency, pin-to-pin compatible PA family supporting all 3GPP bands.A block diagram of the SKY66292-11 is shown in Figure 1. The device package and pinout are shown in Figure 2. Table 1 lists the pin-to-pin compatible parts in the PA family. Signal pin assignments and functional pin descriptions are described in Table 2.Table 1. Pin-to-Pin Compatible PA FamilyPart Number Frequency (MHz) 3GPP BandSKY66296-11 700 to 800 Bands 12, 13, 14, 17, 29, and 44 SKY66289-11 791 to 821 Band 20SKY66295-11 800 to 900 Bands 5, 18, 19, 26 and 27 SKY66298-11 900 to 990 Band 8 SKY66291-11 1805 to 1880 Bands 3 and 9SKY66299-11 1900 to 2000 Bands 2, 25, 33, 36, and 37 SKY66294-11 2000 to 2300 Bands 1, 4, 10, and 23 SKY66292-11 2300 to 2400 Bands 30, 40 SKY66297-11 2490 to 2690 Bands 7, 38, and 41SKY66293-21 3400 to 3800 CBRS, Bands 22, 42, 43, and 48 SKY66288-115150 to 5925Band 46DATA SHEET • SKY66292-11: 2300 TO 2400 MHz HIGH EFFICIENCY 4 W POWER AMPLIFIER123456789101112G ND RFIN G ND G NDV B I A SP A E NG N DG N DRFOUTG ND G ND V CC 3G N DV C C 2G N DV C C 1203282C -00216151413Figure 2. SKY66292-11 Pinout(Top View)Table 2. SKY66292-11 Signal Descriptions 1PinNameDescriptionPinNameDescription1 GND Ground 9 R F OUT R F output port2RFINRF input port10GNDGround3 GND Ground 11 GND Ground 4GNDGround12VCC3Stage 3 collector voltage 5 VBIAS Bias voltage 13 GND Ground 6 PAENPA enable14 VCC2Stage 2 collector voltage7 GND Ground 15 GND Ground 8GNDGround16VCC1Stage 1 collector voltage1 The center ground pad must have a low inductance and low thermal resistance connection to the application’s printed circuit board ground plane.Technical DescriptionThe matching circuits are contained within the device. An on-chipactive bias circuit is included within the device for both input and output stages, which provides excellent gain tracking over temperature and voltage variations.The SKY66292-11 is internally matched for maximum output power and efficiency. The input and output stages areindependently supplied using the VCC1, VCC2, and VCC3 supply lines (pins 16, 14, and 12, respectively). The DC control voltage that sets the bias is supplied by the VCBIAS signal (pin 5).Electrical and Mechanical SpecificationsThe absolute maximum ratings of the SKY66292-11 are provided in Table 3. Recommended operating conditions are specified in Table 4 and electrical specifications are provided in Table 5. Typical performance characteristics are shown in Figures 3 through 16.DATA SHEET • SKY66292-11: 2300 TO 2400 MHz HIGH EFFICIENCY 4 W POWER AMPLIFIERTable 3. SKY66292-11 Absolute Maximum Ratings1Parameter Symbol Minimum Maximum Units RF input power (CW, 50 Ω load) P IN8dBm Supply voltage (VCC1, VCC2, VCC3, VBIAS) V CC 5.5V PA enable V EN 3V Operating temperature T C-40 +100 ︒CStorage temperature T ST-55 +125 ︒CJunction temperature T J+150︒C Power dissipation @ +28 dBm output power P D 1.4W Device thermal resistance @ +28 dBm output power θJC14︒C/W Electrostatic discharge:Charged Device Model (CDM) Human Body Model (HBM) 5001000VV1 Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters setat or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.ESD HANDLING: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device.This device must be protected at all times from ESD when handling or transporting. Static charges may easily producepotentials of several kilovolts on the human body or equipment, which can discharge without detection.Industry-standard ESD handling precautions should be used at all times.Table 4. SKY66292-11 Recommended Operating ConditionsParameter Symbol Minimum Typical Maximum Units Supply voltage (VCC1, VCC2, VCC3, VBIAS) V CC1,V CC2,V CC3,V BIAS 4.75 5 5.25 VPA enable: ON O F F PAEN1.72.02.50.5VVPA enable current I ENABLE 112μA Operating frequency f 2300 2400 MHz Operating temperature T C-40 +25 +85 ︒CRF turn-on/turn-off time1 1.8 μs1 RF turn-on time is measured from the time the PA enable reaches 50% of PA enable "on" level to the time at which the RF output power achieves 90% of the average steady-state “on” level. RF turn-off time is measured from the time the PA enable reaches 50% of PA enable "on" level to the time at which the RF output power decreases to 10% of the average steady-state “on” level.DATA SHEET • SKY66292-11: 2300 TO 2400 MHz HIGH EFFICIENCY 4 W POWER AMPLIFIERTable 5. SKY66292-11 Electrical Specifications1(V CC1 =V CC2 =V CC3 =V BIAS = 5 V, PAEN = 2.0 V, f = 2350 MHz, T C = +25 ︒C, Input/Output Load = 50 Ω, Unless Otherwise Noted) Parameter Symbol Test Condition Min Typical Max Units requency f 23002400MHz Small signal gain |S21| P IN = -30 dBm 34 35.5 dBGain @ +28 dBm |S21|@ +28 dBm P OUT = +28 dBm 34 35.5 dBInput return loss |S11| P IN = -20 dBm 11 18 dBOutput return loss |S22| P IN = -20 dBm 10 15 dBReverse isolation2 |S12| P IN = -30 dBm 55 dBACLR @ +28 dBm ACLR P OUT = +28 dBm (20 MHz LTE, 8.5 dB PAR signal) -34 -30.5 dBcSaturated output power P SAT CW,P IN = +8 dBm +35.2 +36.5 dBmOutput power at 3dB gain compression P3dB CW, reference to small signal gain+35.2 +36.1 dBm2nd harmonic 2f O CW,P OUT = +28 dBm -48 -40 dBc 3rd harmonic 3f O CW,P OUT = +28 dBm -52 -45 dBc Power-added efficiency PAE CW, P OUT = +28 dBm 32 36.5 % Quiescent current I CCQ No RF signal 70 100 mA1 Performance is guaranteed only under the conditions listed in this table.2 Not tested in production. Verified by characterization.DATA SHEET • SKY66292-11: 2300 TO 2400 MHz HIGH EFFICIENCY 4 W POWER AMPLIFIERTypical Performance Characteristics(V CC 1 = V CC 2 = V CC 3 = V BIAS = 5 V, PAEN = 2.0 V, f = 2350 MHz, T C = +25 ︒C, Input/Output Load = 50 Ω, Unless Otherwise Noted)1012141618202224262830P OUT (dBm)Figure 3. PAE vs P OUT Across Frequency P OUT (dBm)2627282930A C L R (dB c )Figure 5. ACLR vs. Pout Across FrequencyP OUT (dBm)101214161820222426283032343638Figure 7. Gain vs P OUT Across Frequency P A E (%)P OUT (dBm)1012141618202224262830Figure 4. PAE vs P OUT Across TemperatureP OUT (dBm)A C L R (dB c )-41-39-37-35-33-31-292627282930Figure 6. ACLR vs P OUT Across TemperatureP OUT (dBm)101214161820222426283032343638Figure 8. Gain vs P OUT Across TemperatureDATA SHEET • SKY66292-11: 2300 TO 2400 MHz HIGH EFFICIENCY 4 W POWER AMPLIFIERP OUT (dBm)101214161820222426283032343638I O P (m A)Figure 9. Operating Current vs P OUT Across Frequency -55-53-51-49-47-45230023252350237524002n d H a r m o n i c s (d B c )Frequency (MHz)Figure 11. 2nd Harmonic vs Frequency Across Temperature@ P OUT = +28 dBm (CW) Frequency (MHz)32.533.033.534.034.535.035.536.036.537.037.5230023202340236023802400S 21 (d B )Figure 13. Small Signal Gain vs Frequency Across Temperature(P IN = −30 dBm) P OUT (dBm)I O P (m A )4710131619222528313437Figure 10. Operating Current vs P OUT Across Temperature23002325235023752400Frequency (MHz)-58-56-54-52-50-483r d H a r m o n i c s (d B c )Figure 12. 3rd Harmonic vs Frequency Across Temperature@ P OUT = +28 dBm(CW)203282C -014Frequency (MHz)S 21 (d B )-20.0-10.00.010.020.030.040.01000150020002500300035004000Figure 14. Wide Band Small Signal Gain vs Frequency(P IN = –30 dBm)DATA SHEET • SKY66292-11: 2300 TO 2400 MHz HIGH EFFICIENCY 4 W POWER AMPLIFIERFrequency (MHz)-30.00-25.00-20.00-15.00-10.00S 11 (d B )230023202340236023802400Figure 15. Input Return Loss vs Frequency Across Temperature(Small Signal, P IN = −20 dBm) Frequency (MHz)-18.00-17.00-16.00-15.00-14.00-13.00-12.00-11.00-10.00230023202340236023802400S 22 (d B )Figure 16. Output Return Loss vs Frequency Across Temperature(Small Signal, P IN = −20 dBm)Evaluation Board DescriptionThe SKY66292-11 Evaluation Board is used to test the performance of the SKY66292-11 PA. An Evaluation Board schematic is provided in Figure 17. Table 6 provides the Bill of Materials (BOM) list for Evaluation Board components. An assembly drawing for the Evaluation Board is shown in Figure 18. Layer details are shown in Figure 19. Layer details physical characteristics are noted in Figure 20. Circuit Design ConsiderationsThe following design considerations are general in nature and must be followed regardless of final use or configuration: ∙ Paths to ground should be made as short as possible.∙ The ground pad of the SKY66292-11 has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Because the circuit board acts as the heat sink, it must shunt as much heat as possible from the device.Therefore, design the connection to the ground pad to dissipate the maximum wattage produced by the circuit board. Multiple vias to the grounding layer are required.NOTE: A poor connection between the ground pad and ground increases junction temperature (T J ), which reduces the life of the device.Evaluation Board Test ProcedureTurn-On Sequence1. Connect 50 Ω test equipment or load to the input andoutput RF ports of the Evaluation Board. 2. Connect the DC ground.3. Connect all VCCs and VBIAS lines to a +5 V supply.Connect PAEN to a 2.0 V supply.4. Without applying RF, turn on the 5 V supply, then turn onthe 2 V PAEN.5. Apply RF signal data at –30 dBm and observe that the gainof the device complies with the values in Table 5. Begin measurements.Turn-Off Sequence1. Turn off the RF input to the device.2. Turn off PAEN (set to 0 V).3. Turn off all VCCs and VBIAS.NOTE: It is important to adjust the VCC voltage sources so that +5 V is measured at the board. High collector currents drop the collector voltage significantly if long leads are used. Adjust the bias voltage to compensate.DATA SHEET • SKY66292-11: 2300 TO 2400 MHz HIGH EFFICIENCY 4 W POWER AMPLIFIER203282C -0178 HeaderV CC 3Figure 17. SKY66292-11 Evaluation Board SchematicDATA SHEET • SKY66292-11: 2300 TO 2400 MHz HIGH EFFICIENCY 4 W POWER AMPLIFIERTable. 6. SKY66292-11 Evaluation Board Bill of Materials (BOM)Component Description SizeΩ, 0.063 W 0402C1 Resistor,C3 Ceramic capacitor, 1 μF, 16 V, ±10% 0402 C4, C7, C9, C11 Ceramic capacitor, 3300 pF, ±10%, 50 V 0402 C6 Ceramic capacitor, 100 pF 0402 C8, C10, C12 Ceramic capacitor, 10 μF, 16 V, ±10% 1206 L1 DNI 0402Board – TW21-D690-011 Evaluation203282C-018Notes:1. Evaluation Board Gerber files are available on request.2. The C1 component shown in this assembly is a 0 Ω resistor.3. The L1 component shown in this assembly is DNI.Figure 18. Evaluation Board Assembly DrawingDATA SHEET • SKY66292-11: 2300 TO 2400 MHz HIGH EFFICIENCY 4 W POWER AMPLIFIER203282C -019Layer 1Layer 2Layer 3Layer 4Figure 19. Evaluation Board Layer DetailsC ro ss S ection NameThickne ss (mm)Material sTMa s k L1Dielectric L2Dielectric L3Dielectric L4BMa s k0.0100.0350.2500.0350.3500.0350.2500.0350.010S older Re s i s t C u, 1 oz.R04350C u, 1 oz.FR4C u, 1 oz.FR4C u, 1 oz.S older Re s i s t50 OhmW = 0.500 mm203282C -020Figure 20. Layer Detail Physical CharacteristicsApplication Circuit NotesCenter Ground. It is extremely important to sufficiently ground the bottom ground pad of the device for both thermal and stability reasons. Multiple small vias are acceptable and work well under the device if solder migration is an issue.GND (pins 1, 3, 4, 7, 8, 10, 11, 13, and 15). Attach all ground pins to the RF ground plane with the largest diameter and lowest inductance via that the layout allows. Multiple small vias are acceptable and will work well under the device if solder migration is an issue.VBIAS (pin 5). The bias supply voltage for each stage, nominally set to +5 V.RFOUT (pin 9). Amplifier RF output pin (Z O = 50 Ω). The module includes an onboard internal DC blocking capacitor. All impedance matching is provided internal to the module.VCC1, VCC2, and VCC3 (pin 16, 14, and 12, respectively). Supply voltage for each stage collector bias is nominally set to 5 V. Bypass and decoupling capacitors C6 through C12 should be placed in the approximate location shown on the evaluation board assembly drawing, although exact placement is not critical. RFIN (pin 2). Amplifier RF input pin (Z O = 50 Ω). The module includes an onboard internal DC blocking capacitor. All impedance matching is provided internal to the module. Package DimensionsTypical part marking for the SKY66292-11 is shown in Figure 21. The PCB layout footprint for the SKY66292-11 is shown in Figure 22. Package dimensions are shown in Figure 23, and tape and reel dimensions are provided in Figure 24.Package and Handling InformationSince the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly.The SKY66292-11 is rated to Moisture Sensitivity Level 3 (MSL3) at 250 ︒C. It can be used for lead or lead-free soldering. For additional information, refer to Skyworks Application Note, PCB Design and SMT Assembly/Rework Guidelines for MCM-L Packages, document number 101752.Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format.IndicatorS kywork sPart NumberLot C odeC ode:C alendar YearCC = C ountry C ode Figure 21. Typical Part Marking for the SKY66292-11S tencil Aperture Top ViewS tencil aperture s ize for center ground pad 80% to 100% (by area) of the s older ma s0.6Thermal via array on 0.6Metallization Top ViewS older Ma s k OpeningTop ViewOpening s ize of 6of expo s Notes:1. Thermal vias should be resin filled and capped in accordance with IPC–4761 type VII vias.2. Recommended Cu thickness is 30 to 35 μm.203282C -022Figure 22. SKY66292-11 PCB Layout FootprintPin 1 IndicatorTop Views k Edgeolder Ma s k Edge sPadS cale: 2X8X thi s rotationDetail APadS cale: 2X4X thi s rotation4X rotated 180°4X rotated 90° C W4X rotated 90° CC WS ide ViewDetail CPadS cale: 2X1X thi s rotationS older Ma sCBottom View203282C-023 Notes:1. Dimensions are in millimeters (unless otherwise specified).2. Dimensions and tolerances are in accordance with ASME Y14.5M–1994.Figure 23. SKY66292-11 Package DimensionsØ1.Notes:1. C arrier tapes must meet all requirements of Skyworks GP01-D232 procurement spec for tape and reel shipping.2. C arrier tape shall be black conductive polycarbonate.3. C over tape shall be transparent conductive material.4. E SD-surface resistivity shall be ≤ 1 × 1010 Ω/square per EJA, JEDEC TNR specification.5. A ll measurements are in millimeters.203282C-024Figure 24. SKY66292-11 Tape and Reel DimensionsOrdering InformationModel Name Manufacturing Part Number Evaluation Board Part Number SKY66292-11: 2300 to 2400 MHz High Efficiency 4 W Power Amplifier SKY66292-11 SKY66292-11-EVBCopyright © 2014-2017 Skyworks Solutions, Inc. All Rights Reserved.Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale.THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale.Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.Skyworks and the Skyworks symbol are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at , are incorporated by reference.。