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InspurCN8000系列INOS-CN软件基础配置指南

InspurCN8000系列INOS-CN软件基础配置指南
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第 1 章 概述
本章对 Inspur INOS-CN 软件进行概括介绍。 软件兼容性
Inspur INOS-CN 软件与运行任何 Inspur INOS-CN 软件变体的所有 Inspur 产品都兼容。Inspur INOS-CN 软件还与符合 IEEE 和 RFC 合规标准的所有网络操作系统兼容。 适用于整个数据中心的常用软件
Inspur INOS-CN 软件可以提供以下 IP DHCP) 助手 热备份路由协议 (HSRP) 网关负载均衡协议 (GLBP) 增强型对象追踪 基于策略的路由 (PBR)
IPv4 下所有协议的单播平滑重启,IPv6 下 OPSFv3 的单播平滑重启 IP 多播
Inspur INOS-CN 软件对上述协议的使用完全符合各种最新标准,并包含 4 字节自治系统编号 (ASNs) 和 增量最短路径优先 (SPF) 功能。所有单播协议均支持不间断转发平滑重启 (NSF-GR) 功能。所有协议均支持 各种类型的接口,其中包括以太网接口、VLAN 接口、子接口、Port-channel、隧道接口和环回接口等。IP 服务
Inspur INOS-CN 软件采用统一的操作系统,可以在数据中心网络内的所有区域运行,包括 LAN 和第 4 层到第 7 层网络服务。 下图显示了 Inspur INOS-CN 软件在数据中心内的部署情况。
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园区
图 1:Inspur INOS-CN 在数据中心内的部署
园区核心
Internet边缘
Inspur 嵌入式事件管理器 (EEM) 可以提供设备与系统管理功能,让您能够根据发生的网络事件对系统行 为进行自定义。
NetFlow Inspur INOS-CN NetFlow 支持第 5 版导出和第 9 版导出。Inspur INOS-CN NetFlow 还支持灵活 NetFlow 配

Inspur Yingxin Server i24 产品技术白皮书说明书

Inspur Yingxin Server i24 产品技术白皮书说明书

i24 Product Technical White PaperRevision 3.0Release date: 2020-01Dear user:© Copyright Inspur 2017No part of this document may be replicated or modified and transmitted through any form or method without the prior written consent of Inspur.Note: Commercial contracts and terms apply to purchases of goods, services, or features from Inspur. All of some of the goods, services, or features mentioned in this document may not be within your scope of purchase of use. Unless agreed otherwise, Inspur will not indicate or imply any declarations or guarantees on the contents of this manual. Due to product upgrades or added details, the contents of this manual will be regularly updated. Unless agreed otherwise, this document shall only serve as a user manual. All descriptions, information, and suggestions shall not form any explicit or implicit guarantees.Inspur and "浪潮" are registered trademarks of Inspur Electronic Information Industry Co., Ltd.Windows is a registered trademark of Microsoft Corporation.Intel and Xeon are registered trademarks of Intel Corporation.Other trademarks belong to their respective registered companies.4008600011Technical servicenumber:Address: 1036 Langchao Rd., Jinan,Shandong, ChinaInspur Electronic InformationIndustry Co., Ltd.Postal code: 250101Contents1Product Overview (4)2Product features (5)3Logical architecture (7)4Product Introduction (8)4.1Internal View of Server Chassis (8)4.2Motherboard components (8)4.3Front panel (9)4.3.112*3.5 Front Panel Components (9)4.3.2Front Panel Controller (10)4.3.324*2.5 Front Panel Components (10)4.3.4Hard Drive (11)4.4Rear Panel (11)4.4.1Chassis and power supply (11)4.4.2Chassis components (12)4.5Hard drive backplanes (12)4.6PCIe adapter cards (13)4.7OCT/PHY cards (14)5System specifications (15)6Components and compatibility (18)6.1Processor (18)6.2Memory (19)6.3Storage (Realizing SAS/SATA mixing) (21)6.3.1SAS/SATA hard drive model (21)6.3.2 2.5” SSD hard drive (21)6.3.3U.2 NVMe SSD hard drives (21)6.3.4PCIe NVME SSD (22)6.3.5M.2 SSD (22)6.4RAID/SAS card (22)6.5Network Card (23)6.6HCA Card (23)6.7FC HCA Card (24)6.8Power Supply (24)6.9Operating system (24)7Configuration Options (25)8System management (26)9Certifications (29)10Support and services (30)11Description of New Technologies (31)11.1Intel scalable architecture (31)11.2Intel VROC technology (31)11.3QAT technology (31)11.4OCP Mezzanine Card (31)12Further Information (32)13Trademark (33)1 Product OverviewInspur Yingxin i24 is a next-generation, 2U4-node, and high-density server optimized for multiple applications. The 2U chassis supports 4* dual-path NS5162M5 nodes. Each node is connected to the chassis via a side card, and the nodes share a common power supply and cooling system. Equipped with a CMC+BMC dual management system, the i24 is able to support 2.5″ and 3.5″ hard drives and realize an all-flash configuration.The i24 perfectly features high-density, high-efficiency, high-reliability, and high-intelligence within its smaller footprint. It also has a higher compute density, sufficient storage space, and offers desirable scalability and management characteristics. As a result, it realizes energy conservation by means of spatial resources, energy efficiency, and deployment costs, which makes it the optimum solution for customers to reduce their total cost of ownership (TCO) of their data center.The i24 provides configuration solutions that cater more specifically to the requirements for computing, storage, and scaling in high-performance computing; cloud computing; super-integration; and distributed storage applications. It is suitable for infrastructure platform virtualization, high-performance computing, establishment of cloud platforms and industries based on high-performance computing (HPC) and hyper-converged infrastructure (HCI).Figure 1-1 i24 server overview2 Product featuresThe design concept of the i24 is based on increasing the server's compute density while maintaining sufficient storage space and product scalability performance. In so doing, it provides compute density optimization for high-performance computing and other applications. In addition, it also provides large capacity hard drive deployments while achieving storage optimization based on all-flash configurations for distributed storage applications. Therefore, the i24 is the optimum choice for high-performance computing, cloud computing, distributed architecture, and super-integrated architecture platforms applications.High density deployment, high performance, and high efficiency●The i24 deploys 4* dual-path nodes within a 2U space. This realizes a four-fold highercompute density than other 2U dual-path rackmount servers, thus enhancing the spatial usage efficiency of server rooms.●Each node supports 2* Intel® Xeon® scalable processors and supports up to TDP165W.●The entire server supports up to 24*2.5″ SAS/SATA/NVMe hard drives or 12*3.5″SAS/SATA hard drives, thus offering a large storage capacity. Each node contains 2*SATA M.2 hard drives for installing the operating system.●3*PCIe x16 slots can be configured in each node, allowing users to utilize more networkcard configuration solutions.High reliability, effortless management●As the modular nodes can be pulled out, the i24 achieves rapid deployment, increasesthe operation efficiency during node replacement and upgrading, and reduces room deployment time by more than 50%.● A unified power supply and cooling system is shared between each node, thus enhancingthe utilization efficiency of the power supply and fans. A configuration of 1+1 redundancy power supply and N+1 redundancy fans ensure the stable operation of the system and reduce the possible loss caused by server room or component malfunction.●The firmware is secured with encryption and digital signatures to prevent illegal write-ins.●The embedded hardware is equipped with encryption chips, which allows users toflexibly select their algorithm according to requirements.●The i24 also supports the BMC+CMC dual-management model, thus allowing users toeffortlessly achieve the unified management of the server's power supply and fans.Furthermore, users can check the regulatory information of each node through the remote management module.Advanced design, ultimate performance●The advanced fan cooling system of the i24 realizes an optimum operation environment.The comprehensive and optimized cooling system also achieves partitioned speed adjustment and proportional–integral–derivative (PID) smart speed adjustment and smart CPU frequency adjustment, so as to ensure a stable system operation.●The i24 supports multiple AEP storage configurations, enhances storage capacities,and the non-volatility of memory and data. In so doing, it enhances the data processing speeds and meets various application requirements.●Within an all-flash mode, the 24*NVMe hard drives can be configured in the entireserver. This offers users more input/output operations per second (IOPS), as well as faster caches and lower latencies.●The i24 also supports PHY/OCP/standard PCIe network cards, providing multiplenetwork connector options for users and offers more flexible network structure configuration solutions for users.3 Logical architectureEach NS5162M5 node features dual Intel® Xeon® Scalable processors and supports up to 16* DDR4 DIMMs.Processors are connected with two UPI interconnection links with transmission speeds of up to 10.4 GT/s.Each NS5162M5 node provides 3* PCIe x16 slots.CPU0 is connected with 2* PCIe riser cards through the PCIe bus and supports 2* PCIe slot expansion cards through the two PCIe riser cards.CPU0 and PCH are interconnected and enable the installation of a standard OCP card or a PHY card.Figure 3-1 NS5162M5 node logical architecture4 Product Introduction4.1 Internal View of Server ChassisFigure 4-1 i24M5 server chassis internal structure4.2 Motherboard componentsFigure 4-2 NS5162M5 motherboard components4.3 Front panel4.3.1 12*3.5 Front Panel ComponentsFigure 4-3 i24 server components*Please refer to 4.2.1 Rear view for the exact locations of nodes A, B, C, and D.4.3.2 Front Panel ControllerFigure 4-4 Front panel controller components4.3.3 24*2.5 Front Panel ComponentsFigure 4-5 i24 server front panel components4.3.4 Hard DriveFigure 4-6 Hard drive LED description4.4 Rear Panel4.4.1 Chassis and power supplyFigure 4-7 i24M5 server rear panel (1) structure4.4.2 Chassis componentsFigure 4-8 i24M5 server rear panel (2) structure4.5 Hard drive backplanesTable 4-5-1 3.5*12 backplane configurationNote:Since 3.5”*12 is a directly connected backplane, a RAID/SAS card is required when configuring a SAS hard drive in order to connect it with the onboard SATA controller.Table 4-5-2 2.5*24 backplane configurationTable 4-5-3 2.5*24 backplane configurationNote:Only supports 2.5”*24 NVME drives, does not support SATA/SAS4.6 PCIe adapter cardsFigure 4-9 X16 PCIe riser (left and right)Figure 4-10 X16 PCIe riser (left)Figure 4-11 X16 PCIe riser (left)4.7 OCT/PHY cardsFigure 4-11 OCP cardNote: Supports OCP A+B and OCP A+C; supports 10 G and 25 G OCP network cards.Figure 4-12 PHY cardNote: Supports 1G and 10G PHY cards.5 System specifications Table 5-1 System specificationsNote:1. Not all configurations support an operating temperature range of 5°C~35°C. A technicalreview is required for AEP DIMM support and 205W CPU support.2. Standard operating temperature●10°C~35°C at sea level (50°F~95°F). For every altitude increment of 305 m above sea level, thetemperature drops by 1.0°C (a 1.8°F drop per 1000 ft). The maximum operating altitude is 3050 m (10000 ft). Please keep away from direct sunlight. Maximum rate of change = 20°C/hr (36°F/hr). The operating altitude and maximum rate of change varies according to system configurations.●In the event of fan malfunction or operations above 30°C (86°F), the performance of the system maybe decreased.3. Operating temperature at scaled environments●With regard to certain approved configurations, the supported system entry range at sea level can be scaledto 5°C~10°C (41°F~50°F) and 35°C~45°C (95°F~104°F). At an elevation of 900~3050 m (2953~10000 ft), the temperature drops by 1.0°C for every altitude increment of 175 m (1.8°F per 574 ft).●With regard to certain approved configurations, the supported system entry range at sea level canbe scaled to 35°C~45°C (104°F~113°F). At an elevation of 900~3050 m (2953 ft~10000 ft), the temperature drops by 1.0°C for every altitude increment of 125 m (1.8°F per 410 ft).●The system performance may decrease when the system is operating in the scaling range or in theevent of fan malfunction.4. This text lists the weighted sound power level (LWAd) and the weighted sound pressure level(LpAm) of the product at an operating temperature of 23°C. The values were reported accordingto the ISO7779 (ECMA 74) noise measurement standards and ISO 9296 (ECMA 109). The listedsound levels can be used for general shipping configurations while other options may increase thevolume. Please contact your sales representative for more information.5. The sound levels shown here were measured according to specific test configurations. Thesound level will vary depending on system configuration. Values are subjected to changewithout notice and are for reference only.6. The sample (model) test assessments meet product specifications. This product or productseries are eligible to have appropriate compliance labels and declarations.7. All sound levels listed are for standard shipping configurations while other systemconfigurations may increase the volume.Table 5-2 Industry Standard Compliance6 Components and compatibilityUpdated on August 2019. Please consult with our technical support team for the latest compatibility configurations and product components not listed in this manual.6.1 ProcessorTable 6-1 Each node supports 2* Intel Xeon scalable processors6.2 MemoryThe i24 supports 8 DIMMs per CPU, and up to 16 DIMMs for dual CPUs. It also supports LRDIMM, RDIMM, and Intel®Optane™ DC continuous memory, as well as the following memory modes:●ECC (Error Correcting Code)●Memory mirroring●Memory rank sparing●SDDC (Single Device Data Correction)●ADDDC (Adaptive Double- Device Data Correction)●PPR (Power up-Post Package Repair)The same node does not support mixed memories from different memory types (RDIMM, LDRIMM) and different specifications (capacity, bit width, rank, and depth).Memory capacity can be maximized by installing two processors. When a single processor is used, the maximum memory capacity is halved.The DIMM slot layout and installation procedure is shown in the following figure:i24M5 can be configured to support up to 16* AEP memories, with 4* AEPs per node.The AEP memory sequence is as follows:Method 1 - CPU0 -C2D0, C5D0CPU1 - C2D0, C5D0Method 2 - CPU0 –C0D1, C3D1CPU1-C0D1, C3D1The following symmetrical sequences can be introduced into the bill of materials (BOM); a technical review is required for asymmetrical sequences and other specific sequences.1. 2*AEPs for a single CPU.2. 4*AEPs for dual CPUs.Note: AEP 128 GB is currently supported6.3 Storage (Realizing SAS/SATA mixing)The 124M5 supports the equal distribution of four nodes across the front hard drive and realizes the mixing of SAS/SATA hard drives in the entire server and in each node.6.3.1 SAS/SATA hard drive model6.3.2 2.5” SSD hard drive6.3.3 U.2 NVMe SSD hard drivesNote:The 3.5” hard drive model does not support NVME hard drives.6.3.4 PCIe NVME SSD6.3.5 M.2 SSDConcurrently supports software RAID and hardware RAID.Note: Software RAID achieves the RAID function through system software. Hardware RAID achieves the RAID function through RAID cards.6.4 RAID/SAS cardSupports one RAID or SAS card6.5 Network CardSupports one PHY /OCP card and two PCIe network cards (no restrictions).6.6 HCA CardSupports up to two cards (no restrictions)6.7 FC HCA CardSupports up to two cards (no restrictions)6.8 Power SupplyNote: Please adhere to the actual configurations and in accordance with the power input value specified on the label found on the host.6.9 Operating system7 Configuration Options●The 12* 3.5” hard drive chassis does not support NVME configuration.●The 24* NVME hard drive chassis does not support SAS/SATA configuration.●Please note the configuration requirements for the NS5162M5 node and the i24 chassis:The use of 5, 7, 9, 10, and 11 DIMMs for a single CPU (10, 14, 18, 20, 22 DIMMs for dual CPUs) is not recommended.8 System managementThe i24 integrates a next-generation BMC intelligent management system (ICM). This system is wholly developed by Inspur and complies with IPM2.0 standards, providing highly reliable and intelligent hardware monitoring and management functions. The Inspur BMC intelligent management system includes the following features:●Supports Intelligent Platform Management Interface (IPMI)●Supports keyboard, mouse, video, and text console redirection●Supports remote virtualization media●Supports Redfish protocol●Supports Simple Network Management Protocol (SNMP)●Supports BMC login through web browsers●The main specifications of the intelligent management system are as follows.Table 8-1 BMC intelligent management system specificationsTable 8-2 CMC intelligent management system specifications9 Certifications※Please contact our technical support for information on our latest certification. As of October 2019, the i24M5 has received the following certifications:DiscretionaryDiscretionaryMandatoryMandatoryDiscretionaryDiscretionaryMandatoryMandatoryMandatoryMandatory10 Support and services Global service hotline:●1-844-860-0011 (free)●1-646-517-4966 (DDI)●Service e-mail: ************************ Information required:●Name●Telephone no●e-mail●Product model●Product serial number●Problem description11 Description of New Technologies11.1 Intel scalable architectureIntel's next generation Xeon processor is based on Skylake architecture. The all-new on-chip interconnect mesh architecture topology replaces traditional interconnect ring architecture to improve CPU access delays and support higher memory bandwidth requirements. In addition, it offers lower power consumption, which allows it to operate at lower clock rates and at relatively lower voltages, thereby enhancing performance and energy efficiency. The overall performance of the Intel Xeon scalable processor is up to 1.65 times better than that of previous generation products, while its OLTP base load is up to 5 times more than that of current systems.11.2 Intel VROC technologyIntel VROC technology represents Virtual RAID on CPU, which provides enterprise RAID solutions based on NVME SSD. Its greatest advantage is that it is able to directly connect to the PCIe channels on Intel scalable processors, reducing the need for customized RAID HBA.11.3 QAT technologyIntel® QuickAssist technology (Intel® QAT) speeds up compute-intensive applications and the operations of applications. It provides a software-based foundation for security, authentication, and compression purposes, thus significantly increasing the performances and efficiencies of standard platform solutions. These features are detailed as follows: QAT enhances the throughput of applications in cloud computing, and adds hardware acceleration for network security, routing, storage, and big data applications, thereby maximizing CPU utilization.In terms of network, Intel® QAT speeds up SSL/TLS, thereby allowing encrypted communications with higher performances and higher platform application efficiencies in a secure network.In terms of big data, data blocks in the compressed file system supports faster analysis and achieves faster Hadoop operation time for big data operations. In so doing, QAT reduces processor requirements, completes tasks in a low-latency manner, and enhances the overall performance.11.4 OCP Mezzanine CardThe Open Compute Project (OCP) is an open-source server project designed for data centers, with the aim of sharing server and data center designs with higher efficiencies. As a member of the OCP, Inspur has designed a series of OCP Mezzanine cards that complies with OCP standards.12 Further InformationFor more information, please refer to the following websites:Our website provides troubleshooting resources and support for customers, as well as further information on our products, such as user manuals, drivers, and firmware.13 TrademarkInspur and the Inspur logo are registered trademarks of Inspur Electronic Information Industry Co., Ltd. All other trademarks and products mentioned in this document are properties of their respective owners.。

Inspur Express 3.2 BCP设置指南

Inspur Express 3.2 BCP设置指南

1. 安装准备1.1 系统环境本双机运行在VMware workstation上的2台VM,VMware Workstation版本为11.0.0 build-2305329,两台VM的信息如下:硬件环境图1:VM硬件信息1.2 网络配置IP 规划设置好的公网I P和私网IP信息如下:图2:公网和私网IP地址信息1.主机HA02 网络配置设置好的公网I P和私网IP信息如下:图3:公网和私网IP地址信息1.3 硬盘配置1.除了系统盘外,需要创建另外2种分区盘:镜像磁盘数据分区和c luster数据分区。

需要说明的是:镜像磁盘数据分区为NTFS分区或者FAT分区,cluster 数据分区需要是裸磁盘分区RAW格式。

分区如下:E 盘为数据分区.磁盘大小为10G,裸磁盘分区为30M。

镜像磁盘用于保证两台服务器数据同步,cluster数据分区用于双机通信。

现在重点演示cluster分区创建办法。

2.cluster分区方法:第一步,在磁盘2上单击右键,选择新建磁盘,如图4图4第二步,接着点击下一步,如图5,图5第三步,输入容量27M,点击下一步,如图6,图6第四步,指派盘符Q,点击一下步,如图7,图7第五步,接下来的步骤中,选择“不要格式化这个卷”选项,点击下一步,如图8所示,图8 第六步,选择完成,如图9图9 磁盘格式设置完成后的磁盘状况如图9显示图10由于H A01 和H A02 使用的是镜像磁盘,所以HA01 上磁盘划分好之后,在H A02 上进行相同配。

这样两台主机安装C luster 前的准备工作已全部完成,可以开始安装c luster。

2. BCP Express3.2安装和基础配置2.0 BCP Express3.2安装请分别在HA01服务器和HA02服务器上执行Inspur BCP Express 3.2的安装。

以下安装是以服务器HA01作为示范。

图11选择BCP-Express文件夹menu可执行文件双击安装图12单击选择BCP Windows版本13 单击BCP Windows版本开始安装图14点击下一步图15保持默认目录,选择下一步16点击安装图17保持默认端口图18镜像群集不需要设置过滤,保持默认,选择下一步图19 选择是,不进行过滤,单击下一步图20 选择登陆进行license授权图21 可以选择两种授权方式,我们选择第一种图22 选择复制类型即镜像型图23输入浪潮提供的信息进行授权图24 完成后选择[参照/删除],可看到所选L ICENSE 信息,或者点结束完成安装图25 点击完成重启电脑2.2 BCP Express3.2基础配置以下配置在客户端进行操作图26 输入IP,打开配置页面图27 启动配置向导图28确认启动配置向导图29群集命名图30 添加群集服务器图31 输入加入群集服务器ip图32 已经加入第二台服务器图33 设置镜像磁盘通信信息和公网私网ip信息图34 设置NP解决图35 添加组一般同一个应用服务为一个组,比如MS SQL,如果还需添加ORACLE,请另外添加一个组。

Inspur KDB_v1.0_SP1_Installation Guide_v2.1.4_cn

Inspur KDB_v1.0_SP1_Installation Guide_v2.1.4_cn
Restricted Rights Legend AllInspur K-DB®documents areprotected bycopyright laws and theProtection Act of Computer Programs, and international convention. Inspur K-DB® documents are made available under the terms of the K-DB License Agreement andmayonlybeused or copiedinaccordance withthetermsof thisagreement. Nopartofthis document may be transmitted, copied, deployed, or reproduced in any form or by any means, electronic, mechanical, or optical, without the prior written consent of Inspur Information Co., Ltd. 本软件(Inspur K-DB®) 使用说明书内容受版权、计算机程序保护法及国际条约的保护。说明书内容只在与 Inspur K-DB®签署许可协议下才可以使用和复制。事先若未经 Inspur 公司书面同意,不得对本文件及其中部分内容以任何 形式,例如影印、记 录、信息保存与搜索系统 的任何电子媒介形式或可 读形式进行传送、复制 、发布或修改编制 等行为。
Open Source Software Notice This product includes open source software developed and/or licensed by "OpenSSL," "RSA Data Security, Inc.," "Apache Foundation," "Jean-loup Gailly and Mark Adler," and "Paul Heieh's hash". Information about the afore mentioned and the related open source software can be found in the "${INSTALL_PATH}/license/oss_licenses" directory. 本产品里包含着由“OpenSSL”、“RSA Data Security, Inc.”、“Apache Foundation”、 “Jean-loup Gailly 和 Mark Adler” 以及“Paul Heieh's hash”所开发或者许可的开放源码和软件。有关详细信息,请参看产品目录“${INSTALL_PATH}/li cense/oss_licenses”里的说明内容。

X86服务器存储-Inspur 2008 Raid卡报错firmware error导致死机重启问题

X86服务器存储-Inspur 2008 Raid卡报错firmware error导致死机重启问题

Inspur 2008 Raid卡报错firmware error导致死机重启问题故障现象系统运行中死机或重启,Raid卡日志中报错Fatal firmware error,类似如下:EVT#04215-08/13/14 1:45:02: 15=Fatal firmware error: Line 1480 in ../../raid/1078dma.cEVT#04216-08/13/14 1:45:02: 15=Fatal firmware error: Line 1480 in ../../raid/1078dma.c且报错时间和系统宕机时间相符故障原因研发分析与PCIE节能有关,导致2008imr Raid卡读取内存时发生错误。

在故障发生时刻,PCIE产生pciErrorInit,如下:pciErrorInt: iopIntStatus 2480【这是故障发生时刻的第一条打印】pciErrorInt: pciIntStatus = 00000000, blackEagleIntStatus 00002000In MonTask; Seconds from powerup = 0x000033da_MonTask: Online Controller Disabled00[0]: fp=c04467e0, lr=c085ea30- _MonTask+1a0[1]: fp=c0446920, lr=c0906b30- pciErrorInt+7c[2]: fp=c0446938, lr=c048ba18- dispatchIsrs+8c[3]: fp=c0446968, lr=c048bae0- external_IRQ+34[4]: fp=c0446980, lr=c048b074- wrapper__External_IRQ+74[5]: fp=c04469d0, lr=c04b7a24- TtyIdle+cc[6]: fp=c04471c8, lr=c04a8364- set_state+90[7]: fp=c0447208, lr=c04a8a7c- raid_task_idle_loop+20[8]: fp=c0447218, lr=c087bea4- raid_task+de4[9]: fp=c0447fd0, lr=c0908c7c- _main+18d8[10]: fp=c0447ff8, lr=c0801c0c- __start+bb4MonTask: line 621 in file ../../raid/1078main.cUIC_ER=9f200:c00031b, UIC_MSR=4000:8000002, MSR=21000, sp=c04467e0解决办法1、对于Windows 2008R2系统,修改电源选项--> 高级电源设置– >PCIE Express链接状态电源管理--> 改为关闭!或者升级OS到Windows 2008 R2 SP12、对于Linux系统,编辑/etc/grub.conf文件,在kernel一行最后添加pcie_aspm=off ,重启生效。

业务连续保护软件BCP-Inspur

业务连续保护软件BCP-Inspur
业务连续保护软件BCP
浪潮业务连续性软件BCP(Business Continuous Protection,简称 BCP),可以保证在系统单机出现故障,系统维护需要停机,火灾、地震 等自然灾害发生时,解决业务系统中各种软硬件的故障恢复问题,从应用 层面保护用户业务系统的正常运行。浪潮BCP产品已经在政府、教育、卫 生、金融、企业等客户部署应用,为其关键应用提供了重要保护,保障用 户的核心业务7×24小时持续稳定运行。 BCP-Express产品为浪潮业务连续性保护软件的全新升级版本,具有强大 的优势特性,全面应对用户业务连续运行面临的挑战。
客户价值: 1.多节点共享磁盘阵列,最多可支持32节点,保障客户投资不过时。 2.随发展业务按需添加节点,充分满足客户业务发展需要,保护客户投资的有效性。 3.支持IP-SAN,FC-SAN存储,灵活的部署环境。 4.多活跃模式,多节点可同时进行工作,充分利用资源,实现硬件资源的最大化利用。
多节点镜像方案
卓越的扩展性和广泛的兼容性
从而为用户的关键业务系统提供了更深层次的保护。
数Hale Waihona Puke 支持网络心跳、共享磁盘上的特定分区、Ping第三

共享模式最多可支持32节点,镜像模式最大可支持9
方服务器和COM口通信等多种心跳检测方式,有效

节点,具备良好的系统扩展性。
防止脑裂,并可根据用户系统的实际情况任意组合

支持目前国内主流的Windows和Linux操作系统平台, 以满足对可用性的不同需求。
同应用的部署要求均可提供解决方案。 支持远程容灾,发生故障时首先进行本地的高可用 切换,如果本站点出问题,则切换到异地容灾站点,
务的常规级别的监视外(所谓常规监视即进程死活级 别的监视), BCP还提供了一系列监视选件,如数据 库深层监视、应用深层监视,可对BCP上运行的数

机架式服务器上架安装指南-Inspur

机架式服务器上架安装指南-Inspur

4. Pull the latch upward and remove the keyhole from standoff. 扳起锁匙孔弹片,将内轨卸除。
Inn
er
r
white
Pull
Front bracket

Click!
Rear bracket


Push Click!
2
➊ Install the inner rail onto the chassis 安装内轨至机箱上
➊ Key Hole ①-⑤ ➋ Screw Hole ⓐ
M4x4L





Warnings! 请注意!
The rack, chassis or guide rails may cause scratches, please be careful. 机柜或者服务器机箱、导轨可能造成划伤! When installing new servers into the rack in use, please be aware of electric shock. 在正在使用的机柜中安装新服务器时,请谨防触电!
Please keep this document for checking in the future. 请保留本文档,以便于日后查阅。
Rack-mounted Server Installation Guide 机架式服务器上架安装指南 V1.0
Identifying the Rail Kit Contents 服务器上架所需部件
Rear bracket

Removing Rails 卸除导轨
1. Remove the screws from the left and right handles on the chassis and ➋ pull out chassis. 卸除服务器如 所示左右把手的螺丝螺丝并按 照 ➋ 箭头方向将服务器拉出。

inspur

inspur
AS500N2-M1 VM200 AS300N AS500G AS1000N
虚拟磁带库
物理带库
自有品牌光纤交换机
FS5800
VM100
浪潮云海In-Cloud在京隆重发布
会场全景
8月19日 北京 精彩再现
发布会现场座无虚席
浪潮与山东计算中心云计算项目签约
1. 2. 3.
浪潮集团简介
云计算时代下DC解决方案
具备了高端服务器芯片体 系结构与芯片级系统设计 验证能力
LEVEL5
集成层
Inspur group 2011-5-12
LEVEL6
“向外扩张”战略---国际化扩张
★ Japan ★ Arabia Saudi Libya ★ ★★ ★Hongkong Paskistan ★ Bengal Sudan ★ ★Singapore Nigerra
• 超高亮度LED外延片性能国内领先水平 • LD管芯产量和市场占有率居国内第一位
软件产业
浪潮烟草:市场占有率保持70%以上,处于国内垄断 ECGAP:市场占有率超过 30%,居市场第一 • 连续六年市场占有率第一
• 技术和产品竞争力遥遥领先
整体实力位居独立软件企业第一位 浪潮潮ERP国内高端市场占有率第一 浪潮烟草行业市场占有率第一 质检行业整体解决方案能力处于领先地位 电信网管及运营支撑系统市场占有率第二 软件外包业务进入全球外包服务100强
税控机
“向上游走”战略——提升核心技术竞争力
硬件产品能力模型
核心模块层 CPU、HD、DRAM
LEVEL1
系统芯片层 CHIPSET及SAS等各种芯片
LEVEL2
板卡层 主板、RAID、光线网卡等各种HBA卡
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小i的需求
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• 方案设计: -资源池化 -灵活运转 -设施配套全面
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协同内部专网分中心来自业务流程建模 业务数据建模 GIS建模 办公 信息发布 …
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具备了高端服务器芯片体 系结构与芯片级系统设计 验证能力
LEVEL5
集成层
Inspur group 2011-5-12
LEVEL6
“向外扩张”战略---国际化扩张
★ Japan ★ Arabia Saudi Libya ★ ★★ ★Hongkong Paskistan ★ Bengal Sudan ★ ★Singapore Nigerra
Inspur在TOKYO
备受国家领导关怀的浪潮集团
•“听取了浪潮的发言很高兴,你们作为国内最大的服务器与软件企业,在 金融危机的形势下有这么好的业绩值得肯定。” ——中共中央政治局常委、国务院总理温家宝,2009年7月
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高效的云 计算平台 • 开放标准的8 路以上高端服 务器 •开放标准的海 量存储系统
海量 存储 系统 F C SAT A
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浪潮集团产业布局
---稳健发展 构建软硬一体优势
计算机产业
• 国内最大的服务器专业研发生产基地 • 浪潮服务器连续十四年蝉联国有品牌销量第一 • 存储产业连续六年国有品牌销量第一
浪潮服务器:15年国有品牌销量第一 浪潮存储: 半导体照明 7年国有品牌销量第一 • 国内同行业唯一同时具有高亮度发光 浪潮ERP:8年增长率第一 二极管(LED)激光二极管(LD) 外延材料制备、管芯生产、器件封装 Inspur 浪潮税控机:8年销量第一 及应用产品一条龙生产技术的企业
AS500N2-M1 VM200 AS300N AS500G AS1000N
虚拟磁带库
物理带库
自有品牌光纤交换机
FS5800
VM100
浪潮云海In-Cloud在京隆重发布
会场全景
8月19日 北京 精彩再现
发布会现场座无虚席
浪潮与山东计算中心云计算项目签约
1. 2. 3.
浪潮集团简介
云计算时代下DC解决方案
LAN Switch
邮件服务器
文件服务器
Web/DNS
“我有一个梦想”——结婚买房子 了
• 小i的需求 -买房子了,一室一厅, 稳定可靠的收入还房贷 -人生规划
• 方案设计: -高性能服务器 -双机高可用 -备份系统
“我有一个梦想”——有孩子啦
• 小i的需求 -灵活的住房 -高效
• 方案设计: -高性能服务器 -高效 -统一管理
权归当地政府所有
分期付款最长2年付完。
付款,交付后,每年支付
浪潮运维费用
2011-5-12
32
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Burundi
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Inspur在Seattle 海外业务已经拓展至19个国家和地区。新增加尼日利亚、利比 亚、巴基斯坦和沙特,在美国、日本、香港、委内瑞拉分公司。
Inspur在委内瑞拉
高端服务器成功出口沙特 实现了我国高端服务器出口零的突破!
承担“高端容错计算机”研发项目
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牵头“海量存储标准工作委员会”,承担“国家海量存储系统研发”项目
—浪潮牵头制定中国第一个存储产业行业标准 —国家有史以来对存储技术的最大科研立项,总投入2.14亿,国家支持9066万 —研制具备国际先进水平的高性能海量网络存储系统,
面向核心计算、管理模块的浪潮8-32路服务器 清晰的云计算高端服务器技术路线
2011
64路
• Mainframe
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32路 16路
2010
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未来分梯次小型机/大型机产品布局
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弹性成长的云管理平台
• • • • 同构与异构并存 对异构系统统一分类,统一标识,与同构系统加以区分 同构系统资源池来满足高级功能-实时迁移,动态负载均衡,容灾 异构系统资源池,可以实现基础功能-静态迁移,静态负载均衡
弹性成长的 云管理平台
开源定制的云管 理平台软件 •支持异构虚拟化
浪潮“云海”云管理平台(OS)
使用服务 提交需求 资源动态释放 部署服务 虚拟资源
安全设施
资源按需申请 动态组合
数据中心 物理资源
计算
存储
网络
浪潮云海实现内容
浪潮云计算IaaS层核心硬件装备-集装箱数据中心
集装箱模块设计

• •
供电、管理、散热模块化
两倍以上于传统服务器的高密度 在20尺码的集装箱内可支持640个计算节 点 集中管理、快速部署和实施 供电区 IT设备区
• 超高亮度LED外延片性能国内领先水平 • LD管芯产量和市场占有率居国内第一位
软件产业
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• 技术和产品竞争力遥遥领先
整体实力位居独立软件企业第一位 浪潮潮ERP国内高端市场占有率第一 浪潮烟草行业市场占有率第一 质检行业整体解决方案能力处于领先地位 电信网管及运营支撑系统市场占有率第二 软件外包业务进入全球外包服务100强
云时代下数据中心解决方案
浪潮集团 行业总监
丁新海 18901055067 Dingxh@
1. 2.
3.
浪潮集团简介
云计算时代下DC解决方案
林业云落地思考
单位:亿RMB
305亿
272
232
上市公司
2008 2009 2010 浪潮软件(600756) 沪市 浪潮信息(000977) 深市 浪潮国际(596.HK) 香港
林业云落地思考
“我有一个梦想”——小i住房需求
业务单机 单身小i 双机备份 结婚买房了 小i的大家庭
浪潮为您统一规划,全程伴您成功!
虚拟化群集 数据中心 云计算 数据中心
有孩子喽
“我有一个梦想”——单身时期
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从2010年,推出自主设计8路服务器,32路高端服务器 从2011年,开始研发浪潮64路大型机 形成分梯次、全系列的多路高端产品布局
8路
• Enterprise
高效的云计算平台
2005.8~2010.8 第一个五年计划
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税控机
“向上游走”战略——提升核心技术竞争力
硬件产品能力模型
核心模块层 CPU、HD、DRAM
LEVEL1
系统芯片层 CHIPSET及SAS等各种芯片
LEVEL2
板卡层 主板、RAID、光线网卡等各种HBA卡
LEVEL3
辅助模块层 各种背板、电源、转接卡、风扇等
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浪潮云计算产品线 5年路线图
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架构 参考 •统一规划、分阶 段部署,实现平 滑升级与过渡 •浪潮云计算方案 咨询服务 •浪潮云计算解决 方案测试评估中 心
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测试环境
技术白皮书 网上/现场培训 共建示范项目
数据中心评估
安全可控
浪潮高效能服务器和存储技术国家重点实验室 国家863成果转化基地 国家服务器产业化示范工程
浪潮投资建设,集软件
、设备、运营维护服务 项目所投金额由使用方 分M年支付相应服务费 服务期满后,软硬件产
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