1204LED灯珠-鑫光硕贴片LED-1204橙蓝色LED灯珠规格书
led3014贴片规格书
3.0mm SMD Hyper White Top LED 3.0mm 贴片超亮白色发光二极管Features 特征•Package Size：3.0(L)×1.4(W)×0.8(T)mm 封装尺寸： 3.0(长)×1.4(宽)×0.8(厚)mm •Silicone Packed 采用硅胶封装•Super long lifetime 超长寿命•Anti UV 防紫外线•White colors are available in(2200K-12000K)可供白光(2200K-12000K)•High CRI products 高显色性产品•Wide viewing angle (2θ1/2=120°)宽角度(2θ1/2=120°)Applications •产品应用•Indoor lighting:Fluorescent lamp,tube •室内照明：日光灯管、灯条•Commercial illumination and displays:•商业照明显示：广告字、广告灯箱Advertising words,light box •LCD Backlighting •LCD背光源•Decorative lighting:light strip •装饰照明：柔性灯条•Automotive interior auxiliary lighting •Other illumination and displays •其它照明和显示类O OBin Range of CRI 显色性等级代码(at I F =30mA,T a =25OC )Top View 顶视Back View 底视Bin Range of Luminous Intensity显指等级代码(T=25O C)a（Luminous flux luminous intensity for the corresponding reference以上光强对应的光通量仅供参考）F a Array=25O C)Bin Range of Luminous Intensity电压等级代码(Ta（Luminous flux luminous intensity for the corresponding reference以上光强对应的光通量仅供参考）Typical Electro-Optical Characteristics Curves 典型光-电特性曲线图PACKAGE OUTLINE 外形尺寸(Units:mm)Recommended Soldering Pattern推荐焊接模式3.00±0.081.400.50G a t e s 9-16r o w sG a t e s 1-8r o w s0.740.70±0.050.80±0.05+-P O L A R I T YP a c k a g e m a r k i n g0.74一、PRECAUTONS IN USE LED/使用LED 注意事项；LED Soldering condition/LED 焊接条件；1：烙铁焊接：烙铁最高30W 尖端温度不超过300℃；焊接时不超过3秒；焊接位至少离胶体2毫米。
1206侧面发蓝光LED贴片发光二极管规格书
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MIL-STD-202G
JEITA ED-4701 200 203
JEITA ED-4701 200 201
JEITA ED-4701 200 202
JEITA ED-4701 100 103
JEITA ED-4701 300 302
JEITA ED-4701 300 303
JEITA ED-4701 300 304
ＬＥＤ ＬＡＭＰ
深圳市拓展光电有限公司
ＳＨＥＮＺＨＥＮ ＴＵＯＺＨＡＮ ＯＰＴＯＥＬＥＣＴＲＯＮＩＣＳ ＣＯ．，ＬＴＤ
SMDLED产品规格书
产品型号 : 文件编号 : 版本编号 :
06B2HC-c TZS-15-113B V.03
产品描述:
■ １２０６ＳＭＤ侧面发光高亮度ＬＥＤ ■ 胶体颜色: 透明 ■ 发光颜色：蓝光 ■ 半功率视角：---° ■ 无卡位 ■ 晶片材质: CaAsP
ｈｔｔｐ：／／ｗｗｗ．ｔｚｌｅｄ．ｎｅｔ
外形图：
R B
备注： 1. 所有尺寸单位为mm ，如无特殊说明误差范围为±0.02mm、支架长度误差范围0.02mm 。 2. 胶体沿支架延伸不可超过0.01mm。 3. 多胶不超过0.01mm。
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产品应用:
1
指示
2 亮化
3
照明
最大限度性能参数(Ta = 25℃)
. 回流焊接
贴片LED1206规格书
SEC.A-A
A
1.75 [0.07"]
0.20 [0.01"]
5.25 [0.21"]
8.00 [0.31"]
1.05 [0.04"] 4.00 [0.16"]
A
�
Arrangement of Tape
500 hrs
0/22
Low Temperature Life Test
1000 hrs
0/22
TAIWAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD DONGGUAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD
Test circuit and handling precautions
� Test circuit
+ -
R V
LED
� Handling precautions 1. Over-current-proof Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen). 2. Storage 2.1 It is recommended to store the products in the following conditions: Humidity: 60% R.H. Max. Temperature : 5℃~30℃(41℉~86℉) 2.2 Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜30% R.H. after the package is Opened, the products should be used within a week or they should be keeping to stored at≦20 R.H. with zip-lock sealed. 3. Baking It is recommended to baking before soldering when the pack is unsealed after 72hrs. The Conditions are as followings: 3.1 60±3℃ x(12~24hrs) and ＜5%RH, taped reel type 3.2 100±3℃ x(45min~1hr), bulk type 3.3 130±3℃ x(15~30min), bulk type
2835贴片灯珠、LED灯珠中文规格书(说明书下载)
防静电 静电和浪涌电压会损坏 LED,建议接触 LED 时必须佩戴防静电环和防静电手套。 所有设备、装置和机器必须接地，建议采取相应措施防止浪涌电压击穿 LED。
11
0.3762
40C03 0.3920
0.3888 (3900-4100K) 0.3974
0.3945
0.3879
CIE-Y 0.367 0.3542 0.3688 0.3824
CIE-Y
Rank
0.3271
60C03 0.3237
0.3428 (5700-6000K) 0.3284
公差: :±0.03V, :±2%,Ra:±2
最小
18 20 22 24 2.9 3.0 3.1 3.2 3.3
118
62
最大
20 22 24 26 3.0 3.1 3.2 3.3 3.4
123
85
单位 lm V deg -
4
中之光电
4.典型光电特性曲线
Dated : 03/01/2013 Rev: 01
Rank
60C01 (6500-7000K)
CIE-X 0.3017 0.3064 0.3146 0.3104
CIE-Y 0.4152 0.4031 0.4116 0.424
CIE-Y 0.399 0.3964 0.4057 0.4085
CIE-Y 0.3712 0.3660 0.3762 0.3818
9
中之光电
9. 回流焊
Dated : 03/01/2013 Rev: 01
参数要求 平均上升速率 (T to T ) 最低预热温度 (T ) 最高预热温度(T ) 预热时间(t to t ) T 温度段平均温度 T 温度段平均时间 峰值温度(T ) 峰值温度(±5℃)的时间(T ) 下降速率 25℃到峰值温度时间
SMD 0603红黄绿双色LED灯珠规格书
承认书SPECIFICATION FOR APPROVAL 客户Customer：客户品号Customer P/N：鑫光硕品号Xgs Model：规格Specification:XGS-PB1615UEAG-04SMD0603红黄绿双色20MA制作Prepared By：李忠审核Checked By：Customer Confirmation客户确认采购部Pur Dept By品质部QA Dept By工程部E ng Dept By深圳市鑫光硕科技有限公司SHEN ZHEN XIN GUANG SHUO TECHNOLOGY CO.,LTD 公司地址：广东省深圳市宝安区沙井万丰村前路31号8楼一厂地址：广东省深圳市龙岗区嶂背创业二路18-1号二厂地址：广东省东莞市石排镇庙边王村沙迳工业区·Customer:Technical Data SheetPN:XGS-PB1615URAG-04For:IF=20mAContents1.Features2.Applications3.Package dimensions4.Absolute maximum rating5.Electrical optical characteristics6.BIN range7.Package label8.Soldering pad dimensions9.Soldering conditions10.Package tape specifications11.Typical electro-optical characteristics curves12.Reliability test items and conditions13.Cautions14.NoteCustomer confirm Approved by Checked by Issued byPart No.XGS-PB1615UEAG-04Emitted Color Super Red Super Green Len's Color Water Clear Chip Material AlGaInP AlGaInP----◆Features:Compatible with automatic placement equipmentCompatible with reflow solder processLow power consumption and wide viewing angleThis product doesn’t contain restriction Substance,comply ROHS standard.◆Applications:Automotive and TelecommunicationFlat backlight for LCD,switch and symbol in telephone and faxGeneral use for indicators◆Package Dimensions:Electrodes:Au PlatingEncapsulating Resin:Epoxy ResinPackage:BT Resin◆Absolute Maximum Rating （Ta=25℃）Parameter Symbol Value Unit UE AG Power Dissipation P D 6060mW Pulse Forward Current I FP 100mA DCForward CurrentI F 20mA Reverse Voltage V R 5V Operating Temperature Range Topr -40℃～85℃℃Storage Temperature RangeTstg-40℃～100℃℃I FP condition:pulse width ≤1ms ,duty cycle ≤1/10◆Electrical Optical Characteristics （Ta=25℃）Notes:1.Tolerance of Luminous Intensity ±10%2.Tolerance of Dominant Wavelength ±2nm3.Tolerance of Forward Voltage ±0.05V4.Luminous Intensity is measured by xgs’s equipment on bare chipsParameter Symbol Min Typ.Max.Unit Test Condition Luminous Intensity I V Red 60100--mcd I F =20mA Green 2035--Forward Voltage VF Red 1.8-- 2.4V I F =20mA Green 1.8-- 2.4Reverse Current IR Red ----10uA V R =5V Green ----10Dominant Wavelength λd Red 616--628nm I F =20mA Green 566--576Viewing Angle2θ1/2Red --140--Deg.I F =20mAGreen --140--◆BIN rangeLuminous intensity(tolerance is±10%@If=20mA/chip):BIN CODE Min.(mcd)Max.(mcd)UE K6080 L80100 M100130 N130160AG F2027 G2735 H3545 J4560Dominant Wavelength(tolerance is±2nm@If=20mA/chip):BIN CODE Min.(nm)Max.(nm)UE D616619 E619622 F622625 G625628AG H566568 J568570 K570572 L572574 M574576Forward voltage(tolerance is±0.05V@If=20mA/chip):BIN CODE Min.(V)Max.(V)UE AG F 1.8 1.9G 1.9 2.0H 2.0 2.1 J 2.1 2.2 K 2.2 2.3 L 2.3 2.40.92.63℃/sec.260℃Max.10sec.Max.210℃Pre-heating 120~160℃3℃/sec.-4℃/sec.60~120sec.120se .c.Max.◆Soldering Pad Dimensions:◆Soldering Conditions(Maximum allowable soldering conditions)Reflow soldering profile <Pb-free solder>Time•Reflow soldering should not be done more than two times.•Do not stress its resin while soldering.•After soldering,do not warp the circuit board.T e m p e r a t u r e1.50.5◆Package Tape Specifications:(3000pcs/Reel)◆Typical Electro-Optical Characteristics Curves：◆Reliability(1)Test Items and ConditionsNO Test Item Test Conditions Sample Ac/ Re1Temperature Cycle -40±5℃→25±5℃→100±5℃→25±5℃(30min，5min，30min，5min)100Cycles200/12High Temperature Storage Ta：100±5℃Test time=1000HRS(-24HRS,+72HRS)200/13High Temperature AndHigh Humidity WorkingTa：85±5℃，R H:85±5%，IF=20Test time=500HRS(-24HRS,+72HRS)200/14Low Temperature Storage Ta：-40±5℃Test time=1000HRS(-24HRS,+72HRS)200/15Operating Life Test Connect with a power IF=20mATa=Under room temperatureTest time=1000HRS(-24HRS,+72HRS)200/16Thermal Shock -40±5℃→100±5℃(15min，15min)100Cycles200/17IR-Reflow Pb-Free Process①80℃②100℃③120℃④160℃⑤170℃⑥235℃⑦270℃⑧255℃，60cm/min，2times200/1(2)Criteria of judging the damageItem Symbol Test condition Criteria for judgement Min.Max.Forward voltage VF IF=Test Current/U.S.L*1.1 Reverse current IR VR=5V/15uA LuminousintensityIV IF=Test Current L.S.L*0.7/ Wave lengthλD/λP IF=Test Current/U.S.L±2nm Appearance/View check No mechanical damage *U.S.L:Upper standard level L.S.L:Lower standard level◆Storage and application notices1.Storage1.Calculated shelf life in sealed bag:12months at＜30℃and＜90%relative humidity(RH)2.1TOP LED:After bag is opened,devices that will be subjected to reflow solder or other high temperature process must be：a)Mounted within:168hours of factory conditions≤30℃/60%RH,orb)Stored at ambient of＜20%RH2.2CHIP LED:After bag is opened,devices that will be subjected to reflow solder or other high temperature process must be：a)Mounted within:one year of factory conditions≤30℃/60%RH,orb)Stored at ambient of＜20%RH3.Device require bake,before mounting,if:a)Humidity indicator Card reads＞10%when read at25±5℃b)Above conditions are not metBaking condition:24hours at60±3℃and＜5%RH4.The internal and esterand boxes can not be contacted with ground to prevent absorption of moisture; 5．No acid,alkali,salt,corrosive and explosive gas;away from sunlight and keep the environment clean; 2.Application1．Do not use any unknown chemical liquid to clean LED,it will damage the LED resin surface;use the alcohol under the room temperature if necessary but less than1min,or use the ultrasonic cleaning with proper characters,such as correct power,frequency,etc;2．Do not touch the epoxy resin area when carrying LEDs by tweezers(as the following pictures), especially after the soldering process,the epoxy resin will turn to soft,the internal instruction will be damaged by the tweezers which cause the electric character’s failure;nozzle is recommended by using SMT mounting.Correct Incorrect3．Soldering iron:double-side soldering iron with power of less than25W;soldering temperature:less than 300℃;soldering time:less than3sec.;1time completed is recommended,if the2nd soldering process is requested,3mins must be left to ensure the high temperature status can return to room temperature;◆Cautions1、PackageWhen moisture is absorbed into the package it may vaporize and expand during soldering.There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. So the moisture proof package is used to keep moisture to a minimum in the package.2、StorageBefore opening the package:The LEDs should be kept at5~30°C and60%RH or less.The LEDs should be used within a year.After opening the package:The LED must be used within24hours,else should be kept at5~30℃and30%RH or less.The LEDs should be used within7days after opening the package.If unused LEDs remain,they should be stored in moisture proof packages,recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again.If the LEDs have exceeded the storage time,baking treatment should be performed more than 24hours at60±5°C.3、Soldering IronEach terminal is to the tip of soldering iron temperature less than300℃for3seconds within once inless than the soldering iron capacity25W.Leave two seconds and more internals,and do soldering of each terminal.Be careful because the damage of the product is often started at the time of the hand solder.4、RepairingRepairing should not be done after the LEDs have been soldered.When repairing is unavoidable,a double-head soldering iron should be used(as below figure).It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.5、The LED electrode sections are comprised of a gold plated.The gold surface may be affected by environments which contain corrosive gases and so on.Please avoid conditions which may cause the LED to corrode or discolor.This corrosion or discoloration may cause difficulty during soldering operations.It is recommended that the User use the LEDs as soon as possible.6、Please avoid rapid transitions in ambient temperature,especially in high humidity environments where condensation can occur.◆Notes:1、Above specification may be changed without notice.We will reserve authority on material change for above specification.2、When using this product,please observe the absolute maximum ratings and the instructions for the specification sheets.We assume no responsibility for any damage resulting from use of the product which does not comply with the instructions included in the specification sheets.。
led灯珠尺寸规格以及使用范围
led灯珠尺寸规格以及使用范围LED灯珠尺寸规格以及使用范围LED灯珠作为一种新型的照明光源，具有节能、环保、寿命长等优点，已经逐渐在照明行业中得到广泛应用。
LED灯珠的尺寸规格和使用范围是选择LED灯珠时需要考虑的重要因素之一。
一、LED灯珠尺寸规格LED灯珠的尺寸规格通常由其外观尺寸和芯片尺寸两部分组成。
1. 外观尺寸：LED灯珠的外观尺寸是指灯珠的长、宽、高等尺寸参数。
常见的外观尺寸有：2.0mm×1.6mm、3.0mm×3.0mm、5.0mm×5.0mm等。
不同尺寸的外观尺寸适用于不同的应用场景，如小尺寸LED灯珠适用于手机、手表、电子产品等小型照明设备，大尺寸LED灯珠适用于室内照明、显示屏等大面积照明装置。
2. 芯片尺寸：芯片尺寸是指LED灯珠内部的发光芯片的尺寸。
常见的芯片尺寸有：3528、5050、2835等。
芯片尺寸的不同决定了LED 灯珠的功率、亮度、发光效果等特性。
一般来说，芯片尺寸越大，灯珠的功率和亮度越高，适用于需要较高照明要求的场景。
二、LED灯珠的使用范围LED灯珠具有广泛的使用范围，涉及到室内照明、室外照明、汽车照明、舞台照明等多个领域。
1. 室内照明：在室内照明方面，LED灯珠可以应用于家庭照明、商业照明、办公照明等场所。
LED灯珠具有节能高效的特点，可以替代传统的白炽灯和荧光灯，提供更加舒适的照明效果。
2. 室外照明：在室外照明方面，LED灯珠的耐用性和防水性能使其成为理想的选择。
LED灯珠可以应用于道路照明、景观照明、广告照明等场所，提供高亮度、高效能的照明效果，并且具有较长的使用寿命。
3. 汽车照明：汽车照明是LED灯珠的另一个重要应用领域。
LED灯珠可以应用于汽车头灯、尾灯、转向灯等部位，具有高亮度、低能耗、快速响应等优点，提供汽车行驶时所需的照明效果。
4. 舞台照明：在舞台照明方面，LED灯珠的高亮度、高色彩还原度等特点使其成为主要的照明光源。
1206侧面发红光LED贴片灯珠规格书
试验条件
-40℃～25℃～100℃～25℃ 30分钟 5分钟 30分钟 5分钟
-40℃～100℃ 15分钟 15分钟
30℃～65℃ RH=90% 24小时/1回合
持续时间 取样数
循环100回 合
100
循环300回 合
100
循环50回合 100
接收 水准 0/100
1000小时
100
Ta=-30℃
IF=20mA(R,G,Y)/15mA(W,B)
1000小时
100
Tsol=260℃±5℃,10秒 离胶体3mm距离
焊接一次
20
Tsol=235℃±5℃,5秒 使用助焊剂
焊接一次
20
人体放电模式1000V
正反向各3 次
10
20G 20-2000HZ 4分钟 每个方向循
预热时间 = 100s 最大
预热时间 = 100s 最大.
温度下降斜率为 6ºC/s 最大
温度下降斜率为 6ºC/s 最大
峰值温度 = 230ºC 最大
峰值温度 = 250ºC 最大
在峰值温度±5℃时间不能超过10s 在峰值温度±5℃时间不能超过10s
超过183℃的温度的时间不能超过80s.超过 217℃的温度的时间不能超过80s.220-230℃之间不超过３０ｓ，２３０－２４０℃不超过２０ｓ．
6) 色座标X、Y的测量公差为±0.015。 7) 可靠性试验标准，请参阅“可靠性测试”。 8) 对于如何安全使用“ 拓展光电”的产品，请参阅“使用说明”。 9) 包装：1000PCS/包，普通包装 10)我们一直在不断努力，以改善LED产品的性能，规格如有变更，恕不另行通知。
白色贴片式发光二极管产品名称为1204-T1.0的产品承认书说明书
产品承认书产品名称：1204-T1.0白色贴片式发光二极管产品型号：XL-3210UWC客户名称：客户料号：承认日期：深圳市成兴光电子科技有限公司制定审核核准客户承认栏确认审核核准一、产品描述：●外观尺寸(L/W/H): 3.2x1.5x1.0mm●颜色:高亮度白色●胶体:黄色胶体●EIA规范标准包装●环保产品，符合ROHS要求●适用于自动贴片机●适用于红外线回流焊制程二、外形尺寸及建议焊盘尺寸：备注：1.2.单位公差:毫米（mm）：如无特别标注则为±0.10mmA node建议焊盘尺寸C athode三、建议焊接温度曲线：有铅制程无铅制程四、最大绝对额定值（Ta=25℃）：参数符号最大额定值单位消耗功率Pd80mW最大脉冲电流(1/10占空比,0.1ms脉宽)I FP100mA正向直流工作电流I F25mA 反向电压V R5V 工作环境温度Topr-30°C~+85°C存储环境温度Tstg-40°C~+90°C焊接条件Tsol 回流焊:260°C,10s 手动焊:300°C,3s五、光电参数（Ta=25℃）：参数符号最小值代表值最大值单位测试条件光强IV 160---331mcd IF =5mA 半光强视角2θ1/2---120---deg IF =5mA 正向电压VF 2.6--- 3.0V IF =5mA 反向电流IR------1uAVR=5V亮度分档：代码最小值最大值单位测试条件Q1160192mcdIF=5mAQ2192230Q3230276Q4276331电压分档：代码最小值最大值单位测试条件F7 2.7 2.9VIF=5mAF8 2.9 3.1F93.13.3波长分档:代码最小值最大值单位测试条件2W389349901nmIF=5mA2W51028812152六、光电参数代表值特征曲线：注:如无另外注明，测试环境温度为25+3 Cφ6七、标签标识：CAT：光强（mcd）HUE：波长（nm）REF：电压（V）误差范围a.Luminous Intensity:±15%b.HUE:±0.003c.Forward Voltage:±0.1V八、包装载带与圆盘尺寸：φ13.0AA A-A剖面图U ser Feed D irection备注:1.尺寸单位为毫米(mm)；2.尺寸公差如无标注，为±0.15mm；九、圆盘及载带卷出方向及空穴规格：尾端空壳载带的组合开始端空壳载带的组合盖带与空壳载带的组合十、内包装及外包装：内标签圆盘干燥剂防潮防静电袋5cartons/box外标签抽真空、热封10bags/carton 至少160mm盖带和装有零件部分至少160mm盖带和至少160mm独立盖带或十一、信赖性实验：测试项目测试条件测试次数参考标准失效判定标准失效LED 数量（PCS ）防潮等级1.回流焊最高温度=260℃,10秒，2次回流焊；2.回流焊之前存储条件：30℃，相对湿度=70%，168H；-JEITAED-4701300.301﹟10/22焊接信赖性（无铅回流焊）回流焊最高温度=245±5℃，5秒（无铅回流焊）-JEITAED-4701303303A ﹟20/22冷热循环-40℃30分钟~25℃5分钟~100℃30分钟~25℃5分钟300个循环JESD22-A104﹟10/22冷热冲击-35℃15分钟转换时间3分钟85℃15分钟300个循环JESD22-A106﹟10/22高温存储Ta=100℃1000小时JESD22-A103﹟10/22低温存储Ta=-40℃1000小时JESD22-A119﹟10/22常温老化Ta=25℃IF=20mA1000小时JESD22-A108﹟10/22（2）失效标准★U.S.L :规格上限L.S.L :规格下限标准﹟项目测试条件失效标准﹟1正向电压(V F )I F =20mA ＞U.S.L*1.1光强（IV ）I F =20mA ＜L.S.L*0.7反向电流(I R )V R =5V ＞U.S.L*2.0﹟2焊接可靠性/锡膏覆盖焊盘比例小于95%十二、使用注意事项：◆使用：1.过高的温度会影响LED的亮度以及其他性能，所以为使LED有较好的性能表现，应将LED远离热源。
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Min.
Max.
/
U.S.L*1.1
/
15uA
L.S.L*0.7
/
/
U.S.L±2nm
No mechanical damage
* U.S.L: Upper standard level
L.S.L: Lower standard level
Page 7 of 9
◆ Cautions
1、Package When moisture is absorbed into the package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. So the moisture proof package is used to keep moisture to a minimum in the package. 2、Storage
20
0/1
①80℃②100℃③120℃④160℃⑤170
7 IR-Reflow Pb-Free Process ℃⑥235℃⑦270℃⑧255℃，
20
0/1
60cm/min，2 times
(2)Criteria of judging the damage
Item
Forward voltage Reverse current
Luminous intensity
Wave length
Appearance
Symbol VF IR IV
λD/λP /
Test condition IF=Test Current
VR=5V IF=Test Current
IF=Test Current View check
Criteria for judgement
◆ Features:
Compatible with automatic placement equipment Compatible with reflow solder process Low power consumption and wide viewing angle This product doesn’t contain restriction Substance, comply ROHS standard.
PN: XGS-PB3010AMUB-04
For: IF=20mA
Contents 1.Features 2.Applications 3.Package dimensions 4.Absolute maximum rating 5.Electrical optical characteristics 6.BIN range 7.Package label 8.Soldering pad dimensions 9.Soldering conditions 10. Package tape specifications 11.Typical electro-optical characteristics curves 12.Reliability test items and conditions 13.Cautions 14.Note
Customer confirm Approved by Checked by
Issued by
Part No. Emitted Color Chip Material
Amber AlGaInP
XGS-PB3010AMUB-04
Blue
Len's Color Water Clear
InGan
--
--
李忠
Customer Confirmation 客户确认
采购部Pur Dept By 品质部QA Dept By 工程部Eng Dept By
深圳市鑫光硕科技有限公司
SHEN ZHEN XIN GUANG SHUO TECHNOLOGY CO.,LTD
公司地址：广东省深圳市宝安区沙井万丰村前路31号8楼
承认书
SPECIFICATION FOR APPROVAL
客户 Customer：
客户品号 Customer P/N：
鑫光硕品号 Xgs Model：
规格 Specification :
XGS-PB3010AMUB-04 SMD 1204橙蓝双色 20MA
制作 Prepared By：
审核 Checked By：
3℃/sec.
210℃ Pre-heating 120~160℃
3℃/sec.
260℃ Max. 10sec.Max.
60~120sec.
-4℃/sec.
120se.c.Max.
Time
• Reflow soldering should not be done more than two times. • Do not stress its resin while soldering. • After soldering,do not warp the circuit board.
Page 2 of 9
◆ Soldering Pad Dimensions:
◆ Soldering Conditions (Maximum allowable soldering conditions)
Reflow soldering profile <Pb-free solder>
Temperature
20
0/1
Connect with a power IF=20mA
5
Operating Life Test
Ta=Under room temperature
20
0/1
Test time=1000HRS(-24HRS,+72HRS)
6
Thermal Shock
-40±5℃→100±5℃ (15min，15min) 100 Cycles
If the LEDs have exceeded the storage time, baking treatment should be performed more than 24hours at 60±5°C. 3、Soldering Iron Each terminal is to the tip of soldering iron temperature less than 300℃ for 3 seconds within once in less than the soldering iron capacity 25 W.Leave two seconds and more internals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 4、Repairing
Symbol
Test Min Typ. Max. Unit
Condition
Amber 55 IV
Blue 60
130 -135 --
mcd IF =5mA
Amber 1.7
--
2.5
VF
V
IF =5mA
Blue 2.7
--
3.0
Amber --
--
10
IR
uA
VR=5V
Blue --
--
10
Amber 600 605 610
Page 4 of 9
◆ Typical Electro-Optical Characteristics Curves：
Page 5 of 9
◆ Typical Electro-Optical Characteristics Curves：
Page 6 of 9
◆ Reliability
(1) Test Items and Conditions
NO
Test Item
Test Conditions
Ac/ Sample
Re
-40±5℃→25±5℃→100±5℃→25±5℃
1
Temperature Cycle
(30min，5min，30min，5min) 100 Cycles
20
0/1
2
High Temperature Storage
Ta：100±5℃ Test time=1000HRS(-24HRS,+72HRS)
一厂地址：广东省深圳市龙岗区嶂背创业二路18-1号
二厂地址：广东省东莞市石排镇庙边王村沙迳工业区
Tel: 13798585378
QQ:2373888283
Website ：
E-mail:xz@
· Customer:
Technical Data Sheet
◆ Package Tape Specifications: (4000 pcs/Reel)
Feeding,Direction
Dimensions of Reel (Unit:mm)ຫໍສະໝຸດ Feeding Direction
Page 3 of 9
A
4
2
3
1
A
Dimensions of Tape (Unit:mm) Arrangement of Tape(Unit:mm)
-40℃～100℃
℃
IFP condition: pulse width ≤1ms ,duty cycle ≤1/10