WINTRON产品选择指南
Lattice Semiconductor 产品选择指南：FPGA、CPLD、混合信号等 - 201
PRODUCT SELECTOR GUIDE2012FPGA • CPLD • MIXED SIGNAL • INTELLECTUAL PROPERTY • DEVELOPMENT KITS • DESIGN TOOLSCONTENTS■A dvanced Packaging (4)■F PGA Products (6)■CPLD Products (8)■Power Management and Clock Management Products (8)■Intellectual Property and Reference Designs (10)■Development Kits and Evaluation Boards (14)■P rogramming Hardware (18)■FPGA and CPLD Design Software (19)■PAC-Designer® Design Software (19)Page 2Affordable InnovationLattice Semiconductor is committed to delivering value through innovative low cost, low power solutions.We’re innovating every day to drive down costs and deliver greater value. From cost sensitive consumerelectronics to leading edge communications equipment, designers are using Lattice products in a growingnumber of applications. We’ve shipped over a billion devices to customers worldwide and we understandthat we must deliver cost effective solutions and excellent service in order to succeed.Low Density and Ultra-Low Density FPGAsWe are committed to providing design engineers with the low cost and low power solutions they needto implement their designs quickly, easily and affordably. Lattice FPGA solutions offer unique features,low power, and excellent value for FPGA designs. Our low density LatticeECP3™ family is comprisedof the lowest power, SERDES-enabled FPGAs in the market today, and is ideally suited for deploymentin high volume cost- and power-sensitive wireless and wireline infrastructure, video camera and displayapplications. Our ultra-low density, low cost and low power iCE40™ and MachXO2™ FPGA familiesare ideal for applications ranging from glue logic and bridging to instant-on system control and flexibleI/O expansion. From mobile handsets to leading-edge telecommunications infrastructure, Lattice offerssolutions that minimize cost and power while maximizing value.Power Management and Clock ManagementOur Platform Manager™, Power Manager II and ispClock™ mixed signal product families feature acombination of programmable logic and programmable analog circuitry that allows system designersto reduce system cost and design time. These innovative products provide a fast and easy solution forintegrating a wide range of power and clock management functions within a single integrated circuit. Theseproducts can replace numerous discrete components, reducing cost and conserving board space, whileproviding users with additional design flexibility and time-to-market benefits.Software and Intellectual PropertyOur Lattice Diamond® development tool suite, iCEcube2™ design software, PAC-Designer software, and IPcore program allow design engineers to easily customize our devices for their unique system requirements.Lattice Diamond software tools enable users to synthesize a design, perform analysis, debug, anddownload a logic configuration to our FPGA devices, while iCEcube2 software supports our iCE40 family ofFGPAs. PAC-Designer software is used in the design of our mixed signal products.Our IP core program, LatticeCORE™, provides pre-tested, reusable functions, allowing designers to focuson their unique system architectures. These IP cores provide industry-standard functions including PCIExpress, DDR, Ethernet, CPRI, Serial RapidIO 2.1, SPI4, and embedded microprocessors. In addition, anumber of independent IP providers have teamed with Lattice to offer additional high quality, reusable IPcores. Partners are selected for their industry leadership, high development standards, and commitment tocustomer support.Page 3Page 4Organic Flip Chip BGAFine Pitch BGA1704-BallOrganic fcBGA 42.5 x 42.5 mm 3.25 mm height 1.00 mm pitch1020-BallOrganic fcBGA Revision 233 x 33 mm 3.25 mm height 1.00 mm pitch1152-Ball fpBGA 1156-Ball fpBGA 35 x 35 mm 2.60 mm height 1.00 mm pitc h900-Ball fpBGA 31 x 31 mm 2.60 mm height 1.00 mm pitch672-Ball fpBGA 27 x 27 mm 2.60 mm height 1.00 mm pitch484-Ball fpBGA 23 x 23 mm 2.60 mm height 1.00 mm pitch324-Ball ftBGA 19 x 19 mm 1.70 mm height 1.00 mm pitch256-Ball ftBGA 17 x 17 mmOption 1: 1.55 mm height Option 2: 2.10 mm height Option 3: 1.70 mm height 1.00 mm pitch 256-Ball caBGA 14 x 14 mm 1.70 mm height 0.80 mm pitch332-Ball caBGA 17 x 17 mm 2.00 mm height 0.80 mm pitch208-Ball ftBGA 17 x 17 mm 1.55 mm height 1.00 mm pitch256-Ball fpBGA 17 x 17 mm 2.10 mm height1.00 mm pitchFine Pitch BGAChip Array BGANote: Packages shown actual size. Height specification is max.Page 5208-Pin PQFP 28 x 28 mm (body)4.10 mm height 0.50 mm pitch176-Pin TQFP 24 x 24 mm (body)1.60 mm height 0.50 mm pitch144-Pin TQFP 20 x 20 mm (body)1.60 mm height 0.50 mm pitch100-Pin VQFP 14 x 14 mm (body)1.2 mm height 0.50 mm pitch100-Pin TQFP 128-Pin TQFP 14 x 14 mm (body)1.6 mm height0.50 mm pitch (100 TQFP)0.40 mm pitch (128 TQFP )44-Pin TQFP10 x 10 mm (body)1.20 mm height 1.60 mm height 0.80 mm pitch 48-Pin TQFP 7 x 7 mm (body)1.20 mm height 1.60 mm height0.50 mm pitchVQFP/TQFP/PQFP64-Pin QFNS 9 x 9 mm1.00 mm height 0.50 mm pitch 100-Ball csBGA 8 x 8 mm1.35 mm height 0.50 mm pitch132-Ball csBG A 8 x 8 mmOption 1: 1.35 mm heightOption 2: 1.00 mm height (iCE40)0.50 mm pitch 184-Ball csBG A 8 x 8 mm1.35 mm height 0.50 mm pitch284-Ball csBGA 12 x 12 mm 1.00 mm height 0.50 mm pitch 328-Ball csBGA 10 x 10 mm 1.50 mm height 0.50 mm pitch 132-Ball ucBGA 6 x 6 mm1.00 mm height 0.40 mm pitch 25-Ball WLCSP2.5 x 2.5 mm 0.62 mm height 0.40 mm pitch84-Pin QFNS 7 x 7 mm1.00 mm height 0.50 mm pitch 48-Pin QFNS 7 x 7 mm1.00 mm height 0.50 mm pitch144-Ball csBGA 7 x 7 mm1.10 mm height 0.50 mm pitch 64-Ball ucBGA 4 x 4 mm1.00 mm height 0.40 mm pitch 32-Pin QFNS 5 x 5 mm1.00 mm height 0.50 mm pitch 32-Pin QFN 5 x 5 mm0.60 mm height 0.50 mm pitch 56-Ball csBGA 6 x 6 mm1.35 mm height 0.50 mm pitch 81-Ball csBGA 5 x 5 mm1.00 mm height 0.50 mm pitch 225-Ball ucBGA 7 x 7 mm1.00 mm height 0.40 mm pitch 24-Pin QFNS 4 x 4 mm1.00 mm height 0.50 mm pitch64-Ball csBGA 5 x 5 mm1.10 mm height 0.50 mm pitch121-Ball csBGA 6 x 6 mm1.00 mm height 0.50 mm pitch 121-Ball ucBGA 5 x 5 mm1.00 mm height 0.40 mm pitch 81-Ball ucBGA 4 x 4 mm1.00 mm height 0.40 mm pitch 49-Ball ucBGA 3 x 3 mm1.00 mm height 0.40 mm pitch 36-Ball ucBGA2.5 x 2.5 mm 1.00 mm height0.40 mm pitchQFNS / QFNChip Scale BGAUltra Chip Scale BGAWafer Level Chip ScaleNote: Packages shown actual size. Height specification is max.NEWiCE40™Page 6Page 71) Pb-free only.ispClock ProductsPage 8Platform Manager and Power Manager II Device Selector Guide* ispPAC-POWR1014A OnlyPage 9LatticeCORE IP CoresThe following is a partial listing of LatticeCORE IP, for a complete listing of IP cores from Lattice and its 3rd party partners, please go to /ip.1. LatticeSCM™ MACO®-based IP cores are not included in this table.Page 10IP SuitesLattice IP Suites provide many of the functions required to develop a total solution for common FPGA applications. In addition, multipleLattice FPGA families are supported with each IP Suite, so designers can develop solutions across multiple Lattice families, taking advantage of the best features of each. The following table summarizes which IP cores are included in each IP Suite, and which FPGA families are supported.Page 11Page 12Page 13Page 14Features- Power connections and power sources - ispVM™ programming support- On-board and external reference clock sources• Available on Windows and Linux platforms • Software and IP with a 60-day license (Windows or Linux)• Variety of demos • USB download cable• Comprehensive Image Processing IP Library • On-board Broadcom ® Broadreach™ PHY Enables IP over Coax• On-board FTDI Chip provides easy programming via low cost USB cable- Gigabit Ethernet MAC Demo using Mico32- DDR3 Memory Controller Demo• Available on Windows and Linux platforms • USB A to USB B (Mini) Cable for FPGA Programming via a PC• 12V AC Power Adapter and International Plug Adapters•QuickSTART GuideFeaturesFeaturesFeaturesLatticeECP3 Versa Development KitHDR-60 Video Camera Development KitLatticeECP3 PCI Express Development KitLatticeXP2 Brevia2 Development Kit• LatticeECP3 PCI Express x1/x4 Solutions Board- PCI Express x1 and x4 edge connector interfaces- On-board Boot Flash- Both Serial SPI Flash and Parallel Flash via MachXO programming bridge - Shows interoperation with a highperformance DDR2 memory component - Switches, LEDs, displays for demo purposes- Input connection for lab-power supply• FPGA-based Image Signal Processing• Fully Production-Ready HDR Camera Design • 1080p Capable @ 60 frames per second• Supports up to 16 Megapixel Sensors • Supports up to two sensors simultaneously • Full 60fps in streaming mode needs no external frame buffer• Fast Auto Exposure Instantly Adjust to Changing Light• Greater than 120 dB High Dynamic Range (HDR) Performance• Direct HDMI/DVI output from FPGA • Extremely Low-Latency• The LatticeECP3 Versa Evaluation Board:- PCI Express 1.1 x1 Edge Connector Interface- Two Gigabit Ethernet Ports (RJ45)- 4 SMA Connectors for SERDES Access - USB Mini for FPGA Programming- LatticeECP3 FPGA: LFE3-35EA-FF484- 64 Mbit Serial Flash memory - 1 Gbit DDR3 Memory- 14-segment alpha-numeric display - Switches and LEDs for demos - SERDES Eye Quality Demo - 4 PCI Express Demos• LatticeXP2 FPGA: LFXP2-5E-6TN144C • 2 Mbit SPI Flash Memory • 1 Mbit SRAM• Programmed via included mini-USB Cable • 2x20 and 2x5 Expansion Headers• Push buttons for General Purpose I/O and Reset• 4-bit DIP Switch for user-defined inputs • 8 Status LEDs for user-defined outputsDevelop PCIe-based platforms using a low-cost, low-power SERDES-basedFPGA with proprietary and Lattice provided designs.A fully production ready High Dynamic Range (HDR) camera, designed to fit into commercially available camera housings. Supports full 1080p resolution at 60 frames per second in streaming mode through the FPGA, without the need for an external frame buffer.Industry’s lowest cost platform for design-ing PCI Express and Gigabit Ethernet based systems. The kit includes free demos and reference designs.Easy-to-use, low-cost platform for evaluat-ing and designing with LatticeXP2 FPGAs.Page 15FeaturesFeaturesiCEblink40 Evaluation KitMachXO2 Pico Development KitMachXO2 Control Development Kit• Two versions:- High Performance: iCE40HX1K-VQ100 - Low Power: iCE40LP1K-QN84• Powered by USB input• 1Mbit SPI PROM (enough for two iCE40HX1K images using WarmBoot)• Four capacitive-touch buttons (requires FPGA logic)• Four user LEDs• Dual PMOD header compatible with Digilent PMOD boards (6x2 header)• MachXO2 LCMXO2-1200ZE• 4-character 16-segment LCD display • 4 capacitive touch sense buttons • 1 Mbit SPI Flash• I 2C temperature sensor• Current and voltage sensor circuits • Expansion header for JTAG, I 2C• Standard USB cable for device programming and I 2C communication• RS-232/USB & JTAG/USB interface• RoHS-compliant packaging and process• MachXO2 LCMXO2-4000HC• Power Manager II ispPAC-POWR1014A • 128Mbit LPDDR memory, 4Mbit SPI Flash • Current and voltage sensor circuits • SD memory card socket • Microphone• Audio Amplifier and Delta-Sigma ADC• Up to two DVI sources and one DVI output.• Up to two Display Inputs (7:1 LVDS) and one Display Output (7:1 LVDS)• Audio output channel• Expansion header for JTAG, SPI, I 2C and PLD I/Os.• 3.33 MHz oscillator (can be modified to support 33.33 MHz or 333 kHz)• 1.2V and 3.3V power supplies• All iCE40HX1K I/O available on headers or 0.1” through-holes• Watch battery• QuickSTART Guide• LEDs & switches• Standard USB cable for device programming • RS-232/USB & JTAG/USB interface• RoHS-compliant packaging and process • AC adapter (international plugs)• QuickSTART Guide31, 2012. Standard list price: $39.MachXO Control Development Kit FeaturesMachXO Pico Dev. Kit & MachXO Control Dev. Kit• Preloaded Control SoC Demo • MachXO LCMXO2280• Power Manager II ispPAC-POWR1014A• 2Mbit SPI Flash & 1Mbit SRAM • I 2C temperature sensor • Current and voltage sensor circuits • On-board fan • Interface to 16 x 2 LCD panel*• SD memory and Compact Flash memory card sockets*• Audio output channel• Expansion header for SPI & I 2C • LEDs & switches• Standard USB cable for device programming and I 2C communication • RS-232/USB & JTAG/USB interface • 3” x 1” prototyping area • RoHS-compliant packaging and process * LCD panel and SD/Compact Flash memory not included in the development kit MachXO Mini Development Kit Features• MachXO PLD: LCMXO2280C-4TN144C• 2 Mbit SPI Flash memory • 1 Mbit SRAM• I 2C temperature sensor • USB mini jack sockets for power, JTAG programming, and RS-232 debugging • 2X16 header for off-board expansion provides access to top and right side MachXO banks• Push-buttons for sleep mode and reset• 4-bit DIP switch to user-defined inputs • ADC/DAC circuit • Sleep circuit• 8 LEDs for user-defined outputs• RoHS-compliant packaging and process• Two USB connector cables • QuickSTART GuidePage 16FeaturesFeaturesFeaturesPower Manager II Hercules Development KitProcessorPM Development KitPlatform Manager Development Kit• The Standard Edition Hercules DevelopmentKit features the following:- Preloaded Board Digital ManagementDemo- Hercules Standard Edition eval board- Power Manager II ispPAC-POWR1220AT8 and MachXOLCMXO2280 PLD• The Advanced Edition Hercules DevelopmentKit features the following:- Preloaded Board Digital ManagementDemo- Hercules Advanced Edition evaluationboard with CompactPCI headers- Power Manager II ispPAC-POWR1220AT8 and MachXOLCMXO2280 PLD- Backplane accessory evaluation boardand power supply for live hot-swap• AC adapter (international plugs)• USB Connector Cable• RoHS-compliant packaging and process• Pre-configured Processor Support Demo• ProcessorPM-POWR605• Power Manager II POWR6AT6• 3.3V, 2.5V, and 1.8V supply rails• LEDs• Slide potentiometer• 2x14 expansion header• USB mini jack socket (program/power)• 2 Push-Buttons• Preloaded Power Management Demo• LPTM10-12107, Platform Manager, 208-ballftBGA package• 35mm slide pots to emulate supply railvariations• Pads for user I/O, LED, and switches• JTAG and I2C interface headers• USB Cable• 4-Bit DIP Switch• JTAG and I2C Header Landings• RoHS-compliant packaging and process• USB connector cable• QuickSTART Guide• AC adapter with international plugs• Programmable with ispVM System software• QuickSTART GuideVersatile, ready to use hardware platformsfor evaluating and designing with PowerManager II devices. A Standard and Ad-vanced Edition of each kit is available.Versatile, ready-to-use hardware platformfor evaluating and designing with Proces-sorPM power management devices.A versatile, ready-to-use hardware plat-form for evaluating and designing withPlatform Manager devices.Features:Breakout Board Evaluation Kits•Preprogrammed with hardware test programLCMXO2-1200ZE-1TG144C PLD (MachXO2Breakout Board), LCMXO2280C-FTN256CPLD (MachXO2280 Breakout Board),POWR1014A-02TN48I (POWR1014ABreakout Board), or LC4256ZE-TN144C CPLD(ispMACH 4256ZE Breakout Board)• LEDs•Expansion Header LandingsBreakout Board Evaluation Kits for selectMachXO2, MachXO, ispMACH 4000ZE,Power Manager II devices offer convenienthardware evaluations by providing easyhand-access to PLD I/Os.•Prototyping Area•USB Mini Jack Socket (Program/Power)•JTAG Header Landing•RoHS-compliant packaging and process•USB connector cableFeaturesispMACH 4000ZE Pico Development Kit• Pre-programmed Pico Power Demo• ispMACH 4000ZE device(LC4256ZE-5MN144C)• Power Manager II device(ispPAC-POWR6AT6-01SN32I)• LCD panel• USB mini jack socket for power, JTAGprogramming, and I2C interface• 2X15 header landing for off-board expansionprovides access to LC4256ZE GPIOs,POWR6AT6 VMON inputs, I2C, and JTAG chain• Push-button for global reset• 4-bit DIP switch to user-defined inputs• 3.3V and 2.5V supply rails• Current and voltage sensor circuits• Battery or USB power source• RoHS-compliant packaging and process• Marked for CE, China RoHS Environmental-Friendly Use Period (EFUP) and WasteElectrical and Electronic Equipment (WEEE)Directives• One USB connector cable• QuickSTART GuideBattery-powered, low-cost platform toaccelerate the evaluation of ispMACH4000ZE CPLDs.Page 17Programming HardwarePage 18PAC-Designer — Mixed-Signal Design SoftwarePage 19Technical SupportUSA & Canada: 1-800-LATTICE (528-8423)For other locations: +1-503-268-8001PLDTechnicalandSoftware:***************************MixedSignal:***********************Additionally, customers can receive technical support for Lattice’s Programmable Logic Products from our Asia based applications group, by contacting Lattice Asia applications during the hours of 8:30 a.m. to 5:30 p.m. Beijing Time (CST) +0800 UTC (Chinese and English language only).Asia: +86-21-52989090********************************Corporate HeadquartersLattice Semiconductor Corporation 5555 Northeast Moore CourtHillsboro, Oregon 97124-6421 USA Telephone: +1-503-268-8000Facsimile: +1-503-268-8347Web: Software LicensingEmail:************************Web: /licensing/index.cfmCopyright © 2012 Lattice Semiconductor Corporation. All brand names or product names are trademarks or registered trademarks of their respective holders. Lattice Semiconductor Corporation, L Lattice Semiconductor Corporation (logo), L (stylized), L (design), Lattice (design), Lattice Diamond, LSC, E 2CMOS, FlashBAK, flexiFLASH, flexiMAC, flexiPCS, FreedomChip, GAL, GDX, Generic Array Logic, HDL Explorer, iCE40, iCEblink, iCEcube2, IPexpress, ISP , ispATE, ispClock, ispDOWNLOAD, ispGAL, ispGDS, ispGDX, ispGDXV, ispGDX2, ispGENERATOR, ispJTAG, ispLeverCORE, ispLSI, ispMACH, ispPAC, ispTURBO, ispVIRTUAL MACHINE, ispVM, ispXP , ispXPGA, ispXPLD, LatticeCORE, LatticeECP3, LatticeECP2, LatticeECP2M, LatticeECP , LatticeECP-DSP , LatticeMico, LatticeMico8, LatticeMico32, LatticeSC, LatticeSCM, LatticeXP , LatticeXP2, MACH, MachXO, MachXO2, MACO, ORCA, PAC, PAC-Designer, PAL, Performance Analyst, Platform Manager, ProcessorPM, PURESPEED, Reveal, Silicon Forest, Speedlocked, Speed Locking, sysCLOCK, sysCONFIG, sysDSP , sysHSI, sysI/O, sysMEM, The Simple Machine for Complex Design, TransFR, UltraMOS, and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries. ISP is a service mark of Lattice Semiconductor Corporation.October 2012 • Order #: I0211K。
W H I T E PA P E R HID 指纹打印设备选型指南说明书
-W H I T E P A P ERHID® offers two lines of tenprint devices, each with its own distinct advantages. This white paper provides the key features and advantages for each tenprint scanner to aid in choosing the right device for your unique identity management challenges.This guide focuses on the selection criteria for tenprint, FAP (Fingerprint Acquisition Profile) 60 devices, and the following general questions should be considered when choosing any tenprint device.How to Select the RightTenprint DeviceWhen deciding what type and brand of fingerprinting device to purchase, there are some general questions to consider. It is also important to note that in some cases the initial cost of a competitive device may be low, but the total cost of ownership may be high.Additionally, we stress that it is crucial to remember the main purpose of collecting prints is to create a benchmark record to later match against. A poor benchmark record could result in an inconclusive or missed match. Quality at all levels is important given the typically critical nature of the use cases.1. What is the Mean Time Between Failures (MTBF) for the device?2. Are the resulting images high quality?• Can they be later matched against latent prints effectively?• Can they be used during court cases to prove a connection between criminal and crime?• Can forensic experts rely on the images consistently?• Do the prints provide good scores for NIST Fingerprint Image Quality (NFIQ) and other types of quality tests?3. What is the device throughput when all other things are equal?4. How many times will a slap or roll have to be repeated during the enrollment process because the device didn’t capture the right quality level on the first try?5. How many times has a vendor’s device been implemented and then removed within the first year or two due to low quality issues or frustrated users? Conversely, how many times has a customer purchased HID devices, then purchased new ones at the end of the lifecycle (typically 6 to 9 years)?6. Do the devices produce high-quality images even when the subjects’ fingers are dry, damaged, moist or tattooed?7. Can the vendor provide an entire solution or just hardware devices?8. Does the provider have a track record that can be relied on to maintain devices or service the account in the future?Key QuestionsBefore You StartHID offers two lines of tenprint devices: the Guardian™ and the Patrol.H I D G U A R D I A N 200 A N D M O D U L EThe HID Guardian tenprint scanner represents the most advanced optical fingerprint devices in the world. They contain moisture discrimination optics (MDO), superior user guidance (Guardian 200), FlexFlat and FlexRoll technology, and a range of optional features such as Presentation Attack Detection (PAD) and a silicone membrane for excellent dry fingerprint capture.H I D P A T R O LThe HID Patrol offers an economical approach to certified tenprint acquisition without sacrificing image quality. Optional silicone membrane is available for superior dry fingerprint capture. HID Patrol is compliant with the Modular Open Source Identity Platform (MOSIP) program. MOSIP is a modular and flexible identity platform that helps Governments and other user organizations implement a digital, foundational identity system in a cost effective way. HID Tenprint Device Overview GUARDIAN 200GUARDIAN MODULE PATROLKey FeaturesM O I S T U R E D I S C R I M I N A T I O N O P T I C SAll optical-based fingerprint devices work in a similar manner where there is an illumination source, a prism, a surface where fingers are placed and a sensor. The light is directed at the fingers and is absorbed by fingerprint ridges and reflected off the air in between the ridges. This occurs because of a concept called “Total Internal Reflection,” where light is reflected when it moves from a denser medium to a less dense medium (glass to air in this case.)CBut a problem occurs when fingers are moist as the moisture “fills” the spaces between fingerprint ridges. Light reflects differently off water than air (the refractive index is different according to Snell’s Law), causing more light to be absorbed (almost like the valley is a ridge). The result can be a darker than normal print (see example, below left) and in many cases, the print can be unusable unless the user takes effort to dry their fingers.Wet print vs. normal printHID’s moisture discrimination optics (MDO) solve this problem by changing the angle ofincidence (see equations below), changing the wavelength of light for the illumination source(from green to blue) and changing the focus of the lens system along with other improvements. The result is higher quality (usable) images when a subject’s fingers are wet with sweat or humidity. The optics also allow for faster auto-capture. The Guardian 200 has received veryfavorable feedback in terms of capture speed when compared to other competitive devices.We encourage tests where a subject dips their hands in a glass of water, lightly dries them and then presents them to the Guardian scanner platen versus other platen of competitive scanners. The moisture discrimination optics are built into the Guardian line, but not the Patrol.S I L I C O N E M E M B R A N E F O R D R Y F I N G E R E N H A N C E M E N TAdults with dry or damaged skin are four (4) times more likely tofail on fingerprint verification or matching. An estimated 15% of theworld’s population suffers from hand dermatitis or skin inflammation.In a recent study, 27 out of 100 people with dermatitis failed averification test.Our silicone membrane, helps by increasing the intimate contactarea between the finger and the platen. This allows for much bettercontrast between the fingerprint ridges and valleys for both rolls andflats which results in better images faster.The silicone membrane has an additional side benefit of protectingthe glass platen from scratches which might be caused by asubject’s ring or other hard, sharp object coming into contact withthe glass platen. The membrane can be cleaned and simply replacedwhen necessary.Silicone membranes are available for Guardian 200 (shown above),Guardian Module, and Patrol. .U S E R G U I D A N C EThe HID Guardian 200 has more advanced pictograms which guide thesubject to place the right or left four fingers (commonly referred to as a“slap”), one or two thumbs, or an individual finger. The green arrows inthe middle indicate quality. Since most subjects are being printed for thefirst time, this allows for faster, more intuitive capture. Additionally, if thesubject is to perform a roll, the roll icon illuminates.F L E X F L A T, F L E X R O L L A N D O T H E R A LG O R I TH M SFlexFlat and FlexRoll are two features that enable the option for subjects to place their hands or fingers anywhere on the platen. For example, if the user is instructed to do a roll, he may place his finger on the left or right side to start, or the bottom or top of the platen. Other software without the FlexFlat or FlexRoll feature will dictate where the user places their fingers on the platen, which can take time, cause confusion or not be ergonomically comfortable for the subject.The algorithm used to capture a series of images then stitch them together for a clean roll issophisticated and advanced. The HID L Scan Essentials SDK cleans the areas around a fingerprint which helps with matching and other forensic activities. And if the platen becomes dirty, the software can instruct the user to clean the platen, or if it is just slightly dirty, it will remove some dirty pixels from the final image.These algorithms are available across all HID tenprint products.The HID Patrol has traditional LED lights that turn orange and then greento indicate when the fingerprint is accepted.NorthAmerica:+15127769000|TollFree:180****7769Europe, Middle East, Africa: +44 1440 714 850Asia Pacific: +852 3160 9800 | Latin America: +52 (55) 9171-1108For more global phone numbers click here© 2022 HID Global Corporation/ASSA ABLOY AB. All rights reserved.Part of ASSA ABLOY Choosing the Right Device for the Right Scenario 2023-05-17-eat-tenprint-device-wp-en PLT-06663The main factors to consider when choosing the right tenprint device are as follows:1. Is it important that the device is able to process a high throughput of subjects — capture and process fingerprints quickly or for a large number of people? Will there be a line of people at times, such that the goal will be to process them as quickly as possible?2. Is it important that the subjects have the best possible user experience? For example, will the enrollee be enrolled for banking scenarios where customer service is extremely important?3. How sensitive is the application use case to False Rejection or Acceptance Rates (FRR/FAR)?A higher quality of fingerprint image capture ensures better matching rate performance later.4. Will the scanner be located in very humid or very dry climates?5. Is the initial cost of the device a driving factor to solving the identity problem?If the answer to number 5 is yes, we recommend the HID Patrol scanner. Otherwise, we recommend the Guardian 200.The optical technology in the Guardian has several advantages. Because of the MDO and silicone membrane, it will capture better prints for very dry to very moist fingers. Patrol does not support MDO and may require drying of moist fingers. However, other competitive devices may require preconditioning of a subject’s fingers, which translates to more time spent moistening or drying the fingers, potentially more attempts at making a quality image capture and thus negatively impacting the user experience and overall throughput.Both the Guardian and Patrol scanners have strong, durable glass platen and have proven highly reliable. For example, a version of the Guardian is installed at all airports of entry and land borders to the United States. They have been in use 24 hours a day for over 10 years with very few issues.In conclusion, HID provides tenprint devices designed for ease of use and image accuracy as well as for the use cases across different markets. No “one-size fits all” scenario exists, so multiple offerings are needed to best fit your requirements.Learn more about HID’s tenprint readers >>Explore HID’s biometric technologies >>Tenprint Collection NeedsGuardian 200Patrol High Subject Volume Throughput/ProcessingX X Handles Range of Finger ConditionsX X Moisture Discrimination OpticsX Rolled Finger CollectionX X On-Device Pictogram Workflow IndicatorsX Fixed Mount/Cabinet or DesktopX X Portability / JumpkitX X MOSIP Compliant X。
NI+DAQ+产品选型指南_EON
EON Tronix DAQ Products & Technology意昂DAQ产品与技术DAQ产品线经理张锐About NI了解一个产品要先了解他的理念The Software is the Instrument.图形化编程方式支持多种计算模型大量内置函数&开放的构架便捷的交互调试紧密的硬件集成LabVIEW专业的界面设计虚拟仪器技术PXI(直流供电型)无线数据采集CompactRIO嵌入式系统基于USB的数据采集NI产品介绍•产品介绍–PXI -机箱与控制器–DAQ -数据采集–BUS -总线通讯–RIO -FPGA设备–cRIO–嵌入式控制和采集系统•技术介绍–同步技术–互联技术PXI 控制器•PXI控制器只能对接PXI机箱•注意操作系统支持（RT？）•特殊状况下可更换SSD•以太网口的数量产品PXI-8110操作系统/ 对象WindowsLabVIEW RT支持是控制器控制器类型嵌入式处理器内核四核CPU时钟频率 2.26 GHz系统的最大吞吐量132 MB/s插槽的最大吞吐量132 MB/s标准内存 2 GB最大内存 4 GB看门狗/触发SMB是24/7操作是插槽要求 4移动硬盘是工作温度范围扩展的硬盘是硬盘Memory120 GB以太网端口类型100BaseT , 1000BaseT , 10BaseT ExpressCard/34槽 1GPIB (IEEE 488.2) Interface 1串口(RS232) 1并口 1USB端口 4PXI机箱•机箱槽位与价格相关性大，仔细斟酌！•PXI机箱配合PXI控制器，选择PXI板卡•PXIE机箱配合PXIE控制器，选择PXI或者PXIE板卡，一定确认槽位和板卡•即使混合机箱也不是所有的PXI板卡都可以插入•注意机箱的功耗和板卡的功耗总和•注意：电源线是选配件•机箱上的标号代表的意思相关附件•NI PMA-1115集成了便携式显示器、键盘和触控板附件，适用于NI 8槽PXI和PXIExpress机箱。
泰克数字存储示波器选购指南说明书
选择基础示波器的10个因素安泰测试分享数字存储示波器示波器是设计、制造或维修电子设备的任何人使用的基础工具。
数字存储示波器(在本指南中简写为DSO)采集和存储波形。
波形显示信号的电压和频率，而不管信号是否失真，不管信号之间的定时，也不管信号中有多少噪声，等等。
数字存储示波器：简介带宽自动测量和分析采样率操作简便足够的输入通道及适当的输入通道连接能力兼容的探头串行总线解码触发支持：第11个因素记录长度联系办法2416618820102212241425目录……………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………系统带宽决定着示波器’测量模拟信号的能力。
具体地讲，它决定着仪器可以准确测量于2%，输入应低于20 MHz。
■探头和示波器构成了拥有整体带宽的测量系统。
使用低带宽探头会降低整体带宽，所以一定要使用与示波器配套的探头。
在选择带宽时，可以使用“五倍法则”。
示波器带宽 ≥ 5 x 关心的最大频率如果带宽太低，示波器将不能分辨高频变化。
幅度将会失真，边沿会降慢，细节会丢失。
考虑使用性能更高的示波器示波器的采样率与摄像机的帧速率类似，决定着示波器可以捕获多少波形细节。
TRINAMIC驱动芯片选型手册2019版
选型手册 2019集成电路我们将数字信号转化为物理运动关于我们拥有数以十年构筑高可靠性嵌入式构架的行业经验Trinamic 是一家在嵌入式电机运动控制领域的全球领导企业。
我们的芯片和微控制系统将数字信号和现实物理世界联系在一起。
我们的工程师是解决现实世界问题的专家, 他们几十年的经验体现在我们的每一个产品中。
Trinamic代表了精密、可靠和高效。
2 Trinamic 选型手册电动机是日常生活中必不可少的一部分，近年来，这些设备的使用量持续上升。
中产阶级的不断壮大，加上家庭自动化程度的提高，以及家庭周围电动马达驱动的产品数量的增加，是经济增长的主要动力”使用TRINAMIC技术来提升您的产品品质人类生活环境对自动化不断增加的需求趋势导致了控制运动系统的爆炸式增长。
产品开发人员必须处理日益复杂的系统，而且很难成为所有领域的专家。
Trinamic通过一种基于API的方法解决了这一问题，帮住用户缩短其产品上市时间，节约了成本，并最终提高产品性能。
Trinamic产品服务于多个市场，包括实验室自动化，工厂自动化，半导体设备，纺织设备，机器人，金融设备......等对可靠性要求比较高的场合。
Bryan Turnbough, IHS分析师。
我们最新的产品为高速增长的新兴市场，如3D打印，医疗泵和自动化移液提升了新的性能标准。
为什么世界上最具前瞻性的公司一再选择Trinamic？诚然, 有些人选择我们是因为我们的产品性能优越。
然而，我们的大多数客户选择我们，是因为我们对运动控制的专注 为用户提供了深入的应用知识，并使我们的客户能够在他们的特定领域更快地创新。
Trinamic 选型手册 3Trinamic带来的创新TRINAMIC是一家具有20多年运动控制芯片、模块和机电驱动设计和营销经验的创新型公司。
在其历史上，TRINAMIC工程师获得了许多专利，包括无传感器电机负载检测和自动混合衰减步进电机无传感器力矩测量。
艾索莱特产品选择指南说明书
THE GOOD, BETTER, BEST LIST Isolite’s Product Selection Guide*Click the Product You Wish to View on EXITS & COMBOSRLReliance Series ThermoplasticLED Exit SignCMBThermoplastic LED Exit Sign &Emergency ComboRLC-LEDThermoplastic Exit & EmergencyComboNo Remote Capacity Remote Capacity, Lamps Removable Remote Capacity, Lamps Removable Thermoplastic Thermoplastic ThermoplasticFrom 32°F to 122°F From 32°F to 104°F From 50°F to 104°F• UL 924• CEC Title 20 Compliant• UL 924• UL Listed for Damp Location• UL 924• UL Listed for Damp LocationEDCEconomical Die-Cast LED Exit SignLPDCDie-Cast Aluminum LED Exit SignTL2.0Thin Line Die-Cast LED Exit Sign CEC Die-Cast Aluminum Die-Cast Aluminum Die-Cast AluminumFrom 32°F to 122°F From 32°F to 102°F From 50°F to 104°F• UL 924• UL Listed for Damp Location• UL 924• UL Listed for Damp Location• UL 924• CEC Title 20 CompliantEUGUniversal Surface MountEdge-Lit LED Exit SignUELUniversal Recessed Edge-Lit LEDExit SignELT2Edge-Lit LED Exit SignExtruded Aluminum & Acrylic Lens Extruded Aluminum with Steel RecessedBackbox & Acrylic LensPrecision die-cast aluminum housing witha flawless, laser-formed acrylic legendFrom 50°F to 104°F From 50°F to 104°F From 32°F to 102°F• UL924• UL Listed for Damp Location• UL924• UL Listed for Damp Location• UL 924• CEC Title 20 CompliantRWLWet Location ThermoplasticLED Exit SignMAXWet Location Die-Cast LED Exit SignHLXNEMA 4X LED Exit SignUV Stabilized Polycarbonate Housing withStainless Steel Captive Screws to SecureLens Cover to HousingHeavy-Duty 0.420” Cast Aluminum withImpact Resistant Polycarbonate ShieldCorrosion Resistant ABS ThermoplasticHousing & Fully Gasketed with Hot BondedSiliconeFrom -4°F to 122°F• EM: 32ºF – 113ºF• EM (With H1/H2): -4ºF – 113ºF• AC: -20ºF – 113ºF• Without Internal Heater: From 50°F to 104°F• With Internal Heater: From -4°F to 104°FTHE GOOD, BETTER, BEST LIST Isolite’s Product Selection Guide*Click the Product You Wish to View on EXITS & COMBOSCONTINUEDRWL-CWet Location Thermoplastic LEDExit SignMAX-CWet Location Die-Cast Exit &Emergency ComboHLX-CNEMA 4X Exit & Emergency ComboUV Resistant Polycarbonate Faceplate withHigh Impact Corrosion ResistantThermoplasticHeavy-Duty 0.420” Cast Aluminum LampHousing Constructed of VandalResistant PolycarbonateCorrosion Resistant, ABS Thermoplastic,Fully Gasketed with Hot Bonded SiliconeFrom 32°F to 122°F From 50°F to 104°F• Without Internal Heater: From 50°F to 104°F• With Internal Heater: From -4°F to 104°F• UL 924PHLThermoplastic PhotoluminescentExit SignPHAluminum Frame PhotoluminescentExit SignPH100Photoluminescent Exit SignThermoplastic Frame with Strontium OxideAluminate Photoluminescent PigmentMolded Into a Rigid Fire/Flame-ResistantPVC SheetExtruded Aluminum Frame With StrontiumOxide Aluminate Photoluminescent PigmentMolded Into a Rigid Flame/Fire-Resistant PVCSheetDurable ABS Background Panel Available inRed, Green, or Black, with PhotoluminescentLettersNon-Electrical Non-Electrical Non-ElectricalSLX-60ABS Plastic Frame Self-LuminousExit Sign2040-01Aluminum Frame Self-LuminousExit Sign880Thinline Aluminum Self-LuminousExit SignFlame Retardant, UV Stabilized, InjectionMolded ABS FrameExtruded Aluminum Frame with PaintedExtruded Aluminum StencilExtruded Aluminum Frame with PaintedExtruded Aluminum StencilFrom -67°F to 176°F From -67°F to 176°F From -67°F to 176°F• UL Listed to standard UL924 & CAN/• ULC-S572• UL Listed to standard UL924 & CAN/• ULC-S572• UL Listed to standard UL924 & CAN/• ULC-S572SLX-60 (VR)ABS Plastic Frame Self-LuminousExit Sign2040-95Vandal Resistant Self-LuminousExit Sign2040-70Vandal Proof Institutional Self-Luminous Exit SignFlame Retardant, UV Stabilized, InjectionMolded ABS Frame with VR ShieldExtruded Aluminum Frame Mounted inMolded ABS Protective Enclosure withPainted Aluminum StencilCast Aluminum Frame, 0.187” Thick,Extends from Faceplate At 45° Angle fromthe WallFrom -67°F to 176°F From -67°F to 176°F From -67°F to 176°F• UL Listed to standard UL924 & CAN/• UL Listed to standard UL924 & CAN/• UL Listed to standard UL924 & CAN/THE GOOD, BETTER, BEST LIST Isolite’s Product Selection Guide*Click the Product You Wish to View on EXITS & COMBOSCONTINUEDCLPChicago Approved LED Exit SignPGChicago Approved LED Edge-LitExit SignDurable 20-Gauge Steel Precision, Die-Cast Aluminum Housing withLaser Formed Acrylic LegendFrom 32°F to 122°F From 50°F to 104°F• City of Chicago Approved• CEC Title 20 Compliant• City of Chicago Approved• UL 924EDC-NYCNYC Approved EconomicalDie-Cast LED Exit SignELT2 with R8Edge-Lit LED Exit SignPremium-Grade, Aluminum Housing Precision Die-Cast Aluminum Housing with aFlawless, Laser-Formed Acrylic LegendFrom 32°F to 122°F From 32°F to 102°F• New York City Approved• UL Listed for Damp Location• UL 924• CEC Title 20 CompliantLP-CTMASteel Connecticut & MassachusettsCompliant LED Mobility Exit SignLPX-CTMAConnecticut & MassachusettsAluminum LED Mobility Exit SignECTMAConnecticut & MassachusettsCompliant Recessed Mobility Exit Sign Durable 20-Gauge Steel Durable, Extruded Aluminum Durable 20-Gauge Steel with White-BakedPowder Coat Finish & High Clarity AcrylicFrom 50°F to 113°F From 50°F to 113°F From 50°F to 113°F• CSA-US listed• Meets or exceeds UL 924 standards• CSA-US listed• UL 924• CSA-US listed• Meets or Exceeds UL 924 StandardsEU-CTMAConnecticut & MassachusettsCompliant Indoor Mobility Exit SignDurable 20-Gauge Steel with White-BakedPowder Coat Finish & High Clarity AcrylicFrom 50°F to 113°F• CSA-US listed• Meets or Exceeds UL 924 StandardsTHE GOOD, BETTER, BEST LIST Isolite’s Product Selection Guide*Click the Product You Wish to View on EXITS & COMBOSCONTINUEDHZEClass 1 Div 2 LED Exit SignHZCClass 1 Div 2 Exit & EmergencyComboEXPExplosion Proof Edge-Lit LEDExit SignDurable, Corrosion Resistant, GrayFiberglass & Fully Gasketed for Harsh &Hazardous Locations. High Clarity, ScratchResistant, Clear Polycarbonate FaceFully Gasketed, Die-Cast AluminumHousing with Impact ResistantPolycarbonate Lens Stainless Steel MountingFeet & Hardware Industrial Gray ColorStandardPrecision Die-Cast Aluminum Housing WithA Flawless, Laser-Formed Acrylic LegendFrom 50°F to 104°F From 50°F to 104°F From 50°F to 104°FLPDCCGDie-Cast Aluminum CustomGraphics SignTLCG2Thin Line Die-Cast Custom GraphicsLED Exit SignHeavy-Duty, Two Piece, Die-Cast AluminumAlloy Walls & Removable, Front Stencil Facewith Overlapping Light SealHeavy Duty, Two Piece Walls Constructed fromDie Cast Aluminum Alloy & Removable FrontStencil Face with Overlapping Light SealFrom 32°F to 102°F From 50°F to 104°F• UL 924• UL 924RL2LEDReliance Series Compact LEDEmergency LightEL16MR16 Emergency LightBUGHigh Performance LED EmergencyLightUV Stabilized, UL94V-O Flame Retardant,ABS Injection-Molded Thermoplastic5VA Flame Resistant, High-Impact Resistant,Thermoplastic in White or Black Finish5VA Flame Rated, Injection Molded AbsThermoplastic HousingFrom 50°F to 104°F From 68°F to 104°F From 50°F to 104°F125 Lumens per Lamp Lamp Option Dependent300-650 Lumens per LampTHE GOOD, BETTER, BEST LIST Isolite’s Product Selection Guide*Click the Product You Wish to View on EMERGENCY LIGHTINGCONTINUEDGNSDGenie MR16 Fully RecessedEmergency LightLMIGN2LED Compact Fully RecessedEmergency LightMIGN22nd Mini-Genie Fully RecessedCompact LED Emergency LightTextured White Powder, Coated Die-CastZinc Frame & DoorTextured, White Powder Coated, Die-CastZinc Frame & DoorTextured, White Powder Coated, Die-CastZinc Frame & DoorLamp Option Dependent561 Lumens407 Lumens per Lamp• LC: From 45°F to 85°F• NC: From 32°F to 102°FFrom 32°F to 102°F From 10°C to 40°CELS27-140 Watt Emergency LightELH120-360 Watt Emergency LightInjection Molded ABS Housing20-Gauge Steel Cabinet with Durable WhitePowder-Coat Finish20-Gauge Steel Cabinet with Durable WhitePowder-Coat Finish20-20-2With Internal Heater: 16°F to 104°F From 50°F to 113°F From 50°F to 113°FELL12-60 Watt Emergency Light20-Gauge Steel Cabinet with Durable WhitePowder-Coat Finish0-2From 50°F to 113°FTHE GOOD, BETTER, BEST LIST Isolite’s Product Selection Guide*Click the Product You Wish to View on EMERGENCY LIGHTINGCONTINUEDELEDArchitectural Outdoor LED LightOWLOutdoor Wet Location EmergencyLightDie-Cast Housing with Polycarbonate Lens &Mirror ReflectorQuality Pressure Die-Cast Aluminum HousingFinished in Durable Polyester Powder Coat1050 Lumens / 4000K CCT• AC Mode: 1530 Lumens• EM Mode: 600 Lumens• 3000K CCTHZLHazardous Location EmergencyLightFully Gasketed NEMA 4X Rated Fiberglass withHousing Durable Gray Powder-Coat FinishFully Gasketed, Die-Cast Aluminum HousingWith Impact Resistant Polycarbonate Lens0-20-2• Without Internal Heater: From 50°F to 104°F• With Internal Heater: From -4°F to 104°FFrom 50°F to 104°FRL2LED with LWReliance Series Compact LEDEmergency LightHZNNEMA 4X/IP66 Emergency LightHZZHazardous Location EmergencyLightUv Stabilized, UL94V-O Flame Retardant,ABS Injection-Molded ThermoplasticFully Gasketed, Die-Cast Aluminum Housingwith Impact Resistant Polycarbonate LensFully Gasketed, Die-Cast Aluminum Housingwith Impact Resistant Polycarbonate Lens125 Lumens per Lamp Lamp Option Dependent Lamp Option DependentFrom 50°F to 104°F• Without Internal Heater: From 50°F to 104°F• With Internal Heater: From -4°F to 104°FFrom 50°F to 104°F。
微芯片产品选择指南说明书
Focus Product Selector Guide2nd Quarter 2010Featuring:8-, 16- and 32-bit PIC® Microcontrollers dsPIC® Digital Signal Controllers Analog & Interface ProductsSerial EEPROMs, Serial SRAMs and RF ProductsMicrochip: A Partner in Your Success8-bit PIC® MicrocontrollersBased on a powerful RISC core, the PIC microcontroller architecture provides users with an easy migration pathfrom 6 to 100 pins among all families, with little or no code change required. Advanced features include sophisticated timing peripherals, integrated analog-to-digital converters and communications peripherals (Ethernet/I2C™/SPI/USB/CAN ports and LIN USARTs). For more information visit:/8bit16-bit PIC® MicrocontrollersThe 16-bit PIC24 Family is comprised of two sub-families. The PIC24F offers a cost-effective low power step up in performance, memory and peripherals for many applications that are pushing the envelope of 8-bit microcontroller capabilities. For more demanding applications, the PIC24H offers 40 MIPS performance, more memory and additional peripherals, such as CAN communication modules. For more information visit: /16bit32-bit PIC® MicrocontrollersThe PIC32 family adds more performance and more memory while maintaining pin, peripheral and software compatibility with Microchip’s 16-bit MCU/DSC families. The PIC32 family operates at up to 80 MHz and offers ample code and data space capabilities with up to 512 KB Flash and 128 KB RAM. For more information visit: /32bitdsPIC® Digital Signal ControllersThe dsPIC family of Digital Signal Controllers (DSCs) features a fully implemented digital signal processor (DSP) engine, with up to 40 MIPS non-pipelined performance, C compiler friendly design, and a familiar microcontroller architecture and design environment. The dsPIC 16-bit Flash DSCs provide the industry’s highest performance, and have features supporting motor control, digital power conversion, speech and audio, intelligent sensing and general purpose embedded control applications. For more information visit:/dsPIC Analog & Interface ProductsMicrochip’s integrated analog technology, peripherals and features are engineered to meet today’s demanding design requirements. Our broad spectrum of analog products addresses thermal management, power management, battery management, mixed-signal, linear, interfaceand safety & security solutions. Our broad portfolio ofstand-alone analog and interface devices offers highly integrated solutions that combine various analog functions in space-saving packages and support a variety of bus interfaces. Many of these devices support functionalitythat enhances the analog features currently available on PIC® microcontrollers. For more information visit:/analogWireless ProductsMicrochip offers radio-frequency products for adding wireless connectivity to embedded PIC microcontroller and dsPIC DSC-based designs for the following technologies:– IEEE 802.15.4/ZigBee®– Sub-GHz RF– IEEE 802.11/Wi-FiFor more information visit: /wireless Serial Memory ProductsMicrochip offers the broadest range of Serial EEPROM devices (from 128 bits to 1 Mbit) over the widest operating voltage (1.7 to 5.5V) and temperature ranges (Up to 150ºC). Microchip Serial EEPROMs are compatible with the I2C, SPI, Microwire and UNI/O® bus. Innovative low-power designs and extensive testing ensure industry leading endurance and best-in-class quality at low costs.SPI-compatible Serial SRAM devices provide additional external serial RAM with high-speed performance and are available in standard 8-pin packages. For more information visit: /memoryMicrochip is a leading provider of microcontroller and analog semiconductors, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Offering outstanding technical support along with dependable delivery and quality, Microchip serves over 63,000 customers in more than 65 countries who are designing high-volume embedded control applications in the consumer, automotive, office-automation, communications and industrial-control markets worldwide. Table of Contents8-bit PIC Microcontrollers (3)16-bit PIC Microcontrollers (9)32-bit PIC Microcontrollers (12)dsPIC33 DSC General Purpose Family (13)dsPIC33 DSC Motor Control andPower Conversion Family (14)dsPIC33 DSC SMPS and Digital PowerConversion Family (15)dsPIC30F DSC Families ................................................16Analog and Interface ProductsThermal Management (17)Power Management (17)Linear (19)Mixed Signal (19)Interface (20)Safety & Security (20)Serial Memory Products (21)RF Products (23)Terms and Defi nitions (23)2 Corporate Product Selector GuideInformation subject to change. The Microchip name and logo, the Microchip logo, MPLAB and PIC are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ICSP, In-Circuit Serial Programming and mTouch are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are property of their respective companies. © 2010, Microchip Technology Incorporated. All Rights Reserved. Printed in the U.S.A. 4/10DS01308B*DS01308B*Microchip Technology Inc.2355 W. Chandler Blvd.Chandler, AZ 85224-6199 SupportMicrochip is committed to supporting its customers in developing products faster and more efficiently. We maintain a worldwide network of field applications engineers and technical support ready to provide product and system assistance. In addition, the following service areas are available at :■Support link provides a way to get questionsanswered fast:■Sample link offers evaluation samples of anyMicrochip device:■Forum link provides access to knowledge base and peer help:■Buy link provides locations of Microchip Sales ChannelPartners:/salesAMERICASAtlantaTel: 678-957-9614 BostonTel: 774-760-0087 ChicagoTel: 630-285-0071 ClevelandTel: 216-447-0464 DallasTel: 972-818-7423 DetroitTel: 248-538-2250 KokomoTel: 765-864-8360 Los AngelesTel: 949-462-9523 Santa ClaraTel: 408-961-6444 Toronto Mississauga, Ontario Tel: 905-673-0699EUROPEAustria - WelsTel: 43-7242-2244-39Denmark - CopenhagenTel: 45-4450-2828France - ParisTel: 33-1-69-53-63-20Germany - MunichTel: 49-89-627-144-0Italy - MilanTel: 39-0331-742611Netherlands - DrunenTel: 31-416-690399Spain - MadridTel: 34-91-708-08-90UK - WokinghamTel: 44-118-921-5869ASIA/PACIFICAustralia - SydneyTel: 61-2-9868-6733China - BeijingTel: 86-10-8528-2100China - ChengduTel: 86-28-8665-5511China - Hong Kong SARTel: 852-2401-1200China - NanjingTel: 86-25-8473-2460China - QingdaoTel: 86-532-8502-7355China - ShanghaiTel: 86-21-5407-5533China - ShenyangTel: 86-24-2334-2829China - ShenzhenTel: 86-755-8203-2660China - WuhanTel: 86-27-5980-5300China - XiamenTel: 86-592-2388138China - XianTel: 86-29-8833-7252China - ZhuhaiTel: 86-756-3210040ASIA/PACIFICIndia - BangaloreTel: 91-80-3090-4444India - New DelhiTel: 91-11-4160-8631India - PuneTel: 91-20-2566-1512Japan - YokohamaTel: 81-45-471- 6166Korea - DaeguTel: 82-53-744-4301Korea - SeoulTel: 82-2-554-7200Malaysia - Kuala LumpurTel: 60-3-6201-9857Malaysia - PenangTel: 60-4-227-8870Philippines - ManilaTel: 63-2-634-9065SingaporeTel: 65-6334-8870Taiwan - Hsin ChuTel: 886-3-572-9526Taiwan - KaohsiungTel: 886-7-536-4818Taiwan - TaipeiTel: 886-2-2500-6610Thailand - BangkokTel: 66-2-694-13511/26/09Sales Office Listing TrainingIf additional training interests you, then Microchip can help. We continue to expand our technical training options, offering a growing list of courses and in-depth curriculum locally, as well as significant online resources – whenever you want to use them.■Regional Training Centers:/rtc■MASTERs Conferences:/masters■Worldwide Seminars:/seminars■eLearning:/webseminars■Resources from our Distribution and Third Party Partners /training。
布隆科特（Bronco）选择指南：4个步骤为您的户外爱好定制您的布隆科特说明书
10-speed automatic transmission with Trail Control™
Advanced 4x4 with Automatic On Demand Engagement
AVAILABLE POWERTRAIN
MAKE IT YOURS IN 4 STEPS
STEP 1 STEP 2
Select your model based on the type of outdoor pursuits and interests you prefer.
Select your drivetrain.
STEP 3 STEP 4
Marine grade vinyl interior Rock rails
WILDTRAK™
Styled and made for high-speed off-roading.
2.7L twin-turbocharged V6 engine
10-speed automatic transmission
We’re trying something new with Bronco vehicles to make sure you can build the Bronco that is right for you. Instead of the usual good, better, best approach, we want you to build toward your outdoor pursuits. Follow these 4 steps and choose from a wide selection of available factory options and Ford accessories. Then, when it’s time to turn your reservation into an order, you’ll have already created a Bronco that’s perfect for you.
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2
SELECTION GUIDE
Product Selection Guide:
●SPXO………………WCO Series Clock Crystal Oscillators:
Product Series WCO-2520A WCO-1409A WCO-1409B
WINTR●N
INNOVATION BEYOND IMAGINATION
SMD(7.0X5.0X1.8) 0.2MHz to 220MHz ±5.0ppm to ±50ppm HCMOS,TTL
SMD(7.7X5.2X2.29) 53MHz to 700MHz ±5.0ppm to ±50ppm PECL,LVPECL,LVDS
SMD(5.0X 3.2X 1.1) 0.2MHz to 220MHz ±5.0ppm to ±50ppm HCMOS,TTL
SMD(3.2x2.5x0.6) 10.0MHz to 45MHz ±5.0ppm to ±50ppm
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WCO-1409C
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Dimension(mm) Frequency Range Frequency Stability Output Wave
SMD(2.5X 2.0X 0.8) 1.0MHz to 80MHz ±5.0ppm to ±50ppm HCMOS,TTL
SMD(14.4X9.5X5.5) 0.2MHz to 400MHz ±5.0ppm to ±50ppm HCMOS,TTL
SMD(7.0X5.0X2.0) 53.0MHz to 700MHz ±5.0ppm to ±50ppm PECL,LVPECL,LVDS
SMD(5.0X3.2X1.4) 1.5MHz to 160MHz ±5.0ppm to ±50ppm HCMOS,TTL
SMD(3.2X2.5X1.1) 6.75MHz to 90MHz ±5.0ppm to ±50ppm HCMOS
DIP(20.32x12.7x7.9) 50.0MHz to 700MHz ±5.0ppm to ±50ppm PECL,LVPECL
DIP(20.8X13.2X7.9) 0.2MHz to 400MHz ±5.0ppm to ±50ppm Sinewave, 50Ω
DIP(12.6X12.6X6.05) 1.0MHz to 125MHz ±5.0ppm to ±50ppm HCMOS,TTL
SMD(14.4X9.5X5.5) 50MHz to 700MHz ±5.0ppm to ±50ppm PECL,LVPECL
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● SPXO………………WCO Series Clock Crystal Oscillators:
Product Series WCO-14A WCO-14B WCO-14C WCO-08A
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Dimension(mm) Frequency Range Frequency Stability Output Wave
DIP(20.8x13.2x5.08) 0.2MHz to 400MHz ±5.0ppm to ±50ppm HCMOS,TTL
DIP(20.32x12.62x7.9) 50.0MHz to 700MHz ±5.0ppm to ±50ppm PECL,LVPECL
DIP(20.8x13.2x7.9) 0.2MHz to 400MHz ±5.0ppm to ±50ppm Sinewave,50Ω
Product Series
WVC-705A
WVC-705B
WVC-503A
WVC-302A
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Dimension(mm) Frequency Range Frequency Stability Output Wave
SMD(7.0X5.0X2.0) 1.5MHz to 160MHz ±5.0ppm to ±50ppm HCMOS,TTL
SMD(4.1x1.5x0.75) 20KHz to 310KHz ±5.0ppm to ±50ppm
SMD(3.2x1.5x0.7) 20KHz to 310KHz ±5.0ppm to ±50ppm
SMD(2.0x1.2x0.6) 20KHz to 310KHz ±5.0ppm to ±50ppm
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SELECTION GUIDE
Product Selection Guide:
● CRYSTAL UNITS………………WCU Series Crystal Units:
Product Series WCU-2520A WCU-2016A WCU-WS2
WINTR●N
INNOVATION BEYOND IMAGINATION
WCU-701B
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Dimension(mm) Frequency Range Frequency Stability
SMD(2.5x2.0x0.5) 12MHz to 80MHz ±5.0ppm to ±50ppm
SMD(2.0x1.6x0.45) 18MHz to 80MHz ±5.0ppm to ±50ppm
SELECTION GUIDE
Product Selection Guide:
● CRYSTAL UNITS………………WCU Series Crystal Units:
Product Series WCU-49U WCU-45U WCU-49S
WINTR●N
INNOVATION BEYOND IMAGINATION
SMD(14.4X9.5X5.5) 50MHz to 700MHz ±5.0ppm to ±50ppm PECL,LVPECL,LVDS
SMD(14.0 X8.6X4.9) 0.2MHz to 400MHz ±5.0ppm to ±50ppm Sinewave, 50Ω
● VCXO………………WVC Series Voltage Controlled Crystal Oscillators:
Φ2.1X6.2 4.0MHz to 70MHz ±5.0ppm to ±50ppm WCU-49S-SMD
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Dimension(mm) Frequency Range Frequency Stability Product Series
Φ2.1X6.2 20KHz to 310KHz ±5.0ppm to ±50ppm WCU-49S-SMDB
Product Series WVC-14A WVC-14B WVC-14C WVC-08A
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Dimension(mm) Frequency Range Frequency Stability Output Wave
DIP(20.32X12.8X5.08) 1.54MHz to 400MHz ±5.0ppm to ±50ppm HCMOS,TTL
SMD(3.2X 2.5X 1.1) 1.5MHz to 50MHz ±5.0ppm to ±50ppm HCMOS,TTL
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Φ3X8 3.2MHz to 70MHz ±5.0ppm to ±50ppm WCU-705A
Φ3X8 20KHz to 310KHz ±5.0ppm to ±50ppm WCU-603A
SMD(11.2X4.83X3.2) 3.2MHz to 70MHz ±5.0ppm to ±50ppm WCU-603BProduct S来自riesWVC-1409A
WVC-1409B
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Dimension(mm) Frequency Range Frequency Stability Output Wave
SMD(14.4X9.5X5.5) 1.54MHz to 400MHz ±5.0ppm to ±50ppm HCMOS,TTL
SMD(6.0x3.5x1.1) 10.0MHz to 200MHz ±5.0ppm to ±50ppm WCU-302A
SMD(6.0x3.5x1.2) 10.0MHz to 200MHz ±5.0ppm to ±50ppm WCU-302B
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Dimension(mm) Frequency Range Frequency Stability
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Dimension(mm) Frequency Range Frequency Stability Product Series
SMD(13.15X5.1X5.0) 3.2MHz to 70MHz ±5.0ppm to ±50ppm WCU-503A
SMD(7.0X5.0X1.2) 6.0MHz to 100MHz ±5.0ppm to ±50ppm WCU-503B
SMD(11.8x5.5x2.0) 3.2MHz to 70MHz ±5.0ppm to ±50ppm
SMD(6.9x1.4x1.3) 10KHz to 2000KHz ±5.0ppm to ±50ppm
Product Series
WCU-402B
WCU-3215B
WCU-2012B
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Dimension(mm) Frequency Range Frequency Stability