SMT Profile Specification
工厂英语缩写
制造业中常用的英文缩写品质系统稽核Quality System Audit ：QSA （供应商管理）用的比较多SQE 品质制程稽核:Quality Process Audit QPA的一种常用方法MSA是评价重复性和再现性，Gauge repeatability &Reproducibility：GR&RMeasurementSystemAnalysis（MSA）使用数理统计和图表的方法对测量系统的分辨率和误并确定测量以评估测量系统的分辨率和误差对于被测量的参数来说是否合适，差进行分析，系统误差的主要成分。
品质人员名称类品质管理人员 quality control QC final quality control FQC 终点质量管理人员制程中的质量管理人员 in process quality control IPQC output quality control OQC最终出货质量管理人员进料质量管理人员incoming quality control IQC total quality control TQC 全面质量管理段检人员passage quality control PQC 质量保证人员 quality assurance QA 出货质量保证人员 output quality assurance OQA 品质工程人员quality engineering QE 品质保证类新品首件检查 first article inspection FAI 首件确认 first article assurance FAA 能力指数capability index CP 模具制程能力参数 capability process index CPK SSQA 合格供货商品质评估 standardized supplier quality audit 失效模式分析 failure model effectiveness analysis FMEA 运作类FQC AQL 运作类允收品质水准 Acceptable Quality Level 抽样检验样本大小 Sample size S/S ACC 允收 Accept 拒收 Reject REE CR 极严重的 Critical 主要的 Major MAJ Minor MIN轻微的服务/可靠度/品质 Quality/Reliability/Service Q/R/S P/N 料号 Part Number 批号 Lot Number L/N AOD 特采Accept On Deviation 特采 Use As It UAI First Piece Inspection Report FPIR 首件检查报告制程统计百万分之一 Percent Per Million PPM 品管专类统计制程管制 Statistical Process Control SPC Statistical Quality Control SQC 统计质量管理量具之再制性及重测性判断量可靠与否Gauge Reproductiveness & Repeatability GRR 尺寸Dimension DIM Diameter DIA 直径样品数其它品质术语类Number N 品质改善小组 Quality Improvement Team QIT ZD 零缺点 Zero Defect Quality Improvement QI 品质改善目标方针 Quality Policy QP TQM 全面品质管理 Total Quality Management Return Material Audit RMA 退料认可品管七大手法 7 Quality Control Tools 7QCTools 通用之件类 ) 供货商(工程变更通知 Engineering *****ge Notice ECN ECO ) 客户(工程改动要求 Engineering *****ge Order PCN 工序改动通知 Process *****ge Notice Product Management Plan PMP 生产管制计划- 制程检验标准程序制造作业规范 Standard Operation Procedure IS 成品检验规范Inspection Specification Bill Of Material BOM 物料清单包装规范 Package Specification S 规格 Specification SPEC DWG 图面 Drawing 系统文件类 Engineering Standard ES 工程标准工艺标准 International Workman Standard IWS 国际标准化组织International Standard Organization ISO 一般规格部类General Specification GS PMC 生产和物料控制 Production & Material Control Product control center PCC 生产管制中心Production Plan Control PPC 生产计划控制物料控制 Material Control MC 资料中心 Document Center DC QE ) 部(品质工程 Quality Engineering Quality Assurance QA ) 处(品质保证质量管理 Quality Control QC ) 课( 生产部 Product Department PD 实验室 Laboratory LAB IE 工业工程 Industrial Engineering Research & Design R&D 设计开发部生产类 PCs ) 块等,根(个 Pieces) 对等(双 Pairs PRS CTN 卡通箱 Carton Pallet/skid PAL 栈板采购订单 Purchasing Order PO 生产单 Manufacture Order MO D/C 生产日期码 Date Code Identification Code ID/C 识别码)供货商( 特殊工作需求 Special Work Request SWR 批号 Lot Number L/N P/N 料号 Part Number 原设备制造Original Equipment Manufacture OEM 个人计算机 Personal Computer PC CP中央处理器 Central Processing Unit As Soon As Possible A.S.A.P 尽可能快的 Electrical-Mail E-MAIL电子邮件不适用 Not Applicable N/A QTY 数量 Quantity input/output I/O 输出/输入不行 Not Good NG 不合格, 极严重不允许 Critical=0 C=0 APP 承认,认可,核准 Approve CheckCHK 确认装配 Assembly ASS'Y 组装, 真位度 True Position T/P 5WIH When, Where, Who, What, Why, How to Man, Machine, Material, Method, Measurement, Message 6M Man, Material, Money, Method, Time, How 4M1H ) 资源(时间,技术,财务,物力,人力SQA 策略品质保证 Strategy Quality Assurance Design Quality Assurance DQA 设计品质保证制造品质保证Manufacture Quality Assurance QA SSQA 销售及服务品质保证 Sales and service Quality Assurance Lot Reject Rate LRR 批退率 Video Compact Disk Digital Video DiskVCD DVD Liquid Crystal Display LCD Computer Aided Design CAD CAM Computer Aided Manufacturing Computer Aided Engineering CAE Printed Circuit Board PCB 印刷电路板改善报告 Correction Action Report CAR NG 不良 Not Good Weekly Delivery Requirement WDR 周出货要求百万分之一 Percent Per Million PPM 全面生产保养Total Production Maintenance TPM MRP 物料需计划Material Requirement Planning操作系统Operation System OS TBA 定缺,待定To Be Assured D/C Drawing *****ge Plans & Procedure P/P Electrical-Music Industry EMI Electrical Magnetic Interference 电子音乐工业电子干扰读频输入Read Frequency Input RFI MMC Maximum Material Condition Maximum Material Size Xs MMS Least Material Condition LMC LMS Least Material Size Um发光二极管lighting-emitting diode LED Quarter Business RecordQBR Continuous improvement process CIP Forecasted Goal Inventory FGI CNC Computerized numeral controller Business to customer B2C Business to business B2B AVL Approved vendor list Procedure of packaging OP End of life EOL VDCS Vender defect correcting sheet Process defect correcting sheet PDCS Goods receiving note GRN A/R Accounting receivable Accountingpayable A/P 部门名称的专有名词QS :Quality system品质系统客户服务CS: Coutomer Sevice 品质管理QC: Quality control 进料检验IQC: Incoming quality control 生产线品质控制LQC: Line Quality Control 制程检验IPQC: In process quality control 最终检验FQC: Final quality control 出货检验OQC: Outgoing quality control 品质保证QA: Quality assurance (VQA) 供应商品质保证SQA: Source(supplier) Quality Assurance 客户质量保证Customer Quality Assurance：CQA 制程品质保证PQA: Process Quality Assurance 品质工程QE: Quality engineer 零件工程CE: component engineering 设备工程EE: equipment engineering 制造工程ME: manufacturing engineeringTE: testing engineering 测试工程产品工程PPE: Product Engineer 工业工程IE:Industrial engineer 行政部Administration Department ADM: 客户退回维修RMA: 检修CSDI:生管PC: producing control 物管MC: mater control 总务部General Affairs Dept GAD: 会计Accountant /Finance Dept A/D: 实验室Laboratory LAB: 实验设计DOE: 人资HR: 企划PMC: 研发RD: 仓库W/H: 客验SI:PD: 生产部Product Department Purchasing Dept) (PUR:采购PA: 表面粘着技术SMT:Surface mount technology 制造MFG:Manufacturing 资迅管理系统MIS:Management information system DCC:document control center 文件管制中心厂内作业中的专有名词品质目标QT:Quality target 目标方针QP:Quality policy 品质改善QI:Quality improvement ）CR严重缺点（CRITICAL DEFECT:MAJOR DEFECT: ）MA主要缺点（）MI次要缺点（MINOR DEFECT: 最大值MAX: Maximum 最小值MIN: Minimum 直径DIA: DiameterDIM: Dimension 尺寸管制下限LCL: Lower control limit 管制上限UCL: Upper control limit 电磁干扰EMI: 静电防护ESD: 静电保护区域EPA:工程变更ECN: 工程改动要求（客户）ECO: Engineering change order 工程变更需求单ECR: 连续工序改善CPI: Continuous ProcessImprovement 图面DWG: Drawing 零缺点ZD: Zero defect物料清单BOM:Bill of material ) 中央处理器CPU: central processing unit( ) 集成电路IC: Integrated circuit( （记忆集成电路）Memory IC: Memory Integrated circuit （随机存取存储器）RAM: Random Access Memory （动态随机存取存储器）DRAM: Dynamic Random Access MemorySRAM: Staic Random Access Memory （静态随机存储器）（只读存储器）ROM: Read-only Memory EPROM:Electrical Programmable Read-only Memory （电可抹只读存诸器）（电可抹可编EEPROM: Electrical Erasbale Programmable Read-only Memory 程只读存储器）CMOS: Complementary Metal-Oxide-Semiconductor （互补金属氧化物半导体）（基本输入输出系统）BIOS: Basic Input Output SystemLED: 发光二极体证明,鉴别,识别identification：ID ) 试投产PILOT RUN: ( 首件检查FAI:：FPIR 首件检查报告First Piece Inspection Report 首件确认FAA: ：统计制程管制SPC （准确度）capability index CP: ) 制程能力capability index of process( CPK: 制程管理计划（生产管制计划）PMP: 制程分析MPI: 缺陷分析系统DAS:Defects Analysis System ：十亿分之一PPB ：助焊剂Flux 料号P/N:L/N 批号Lot Number：：版本Version ：数量Quantity ：有效日期Valid date 军用标准Military-Standard：MIL-STDICT: In Circuit Test () 线路测试自动测试设备Automatic Test Equipment：ATE 生产单Manafacture Order MO: ) 锡面修补T/U: Touch Up ( 手插件I/N:P/T: 初测 ) 终测-功能测试F/T: Function Test ( 组立ASY: 包装P/K:全面品质管理TQM:Total quality control (ICT) 制程不良分析MDA:manufacturing defect analysis 老化实验RUN-IN: ：高压测试HI-pot 高频测试Frequency Modulation Inspect：FMI DPPM: Defect Part Per Million (0.1% 即为) 1000PPM不良率的一种表达方式：百万分之一) 改善对策Corrective Action: (CAR ：允收ACC 拒收REJ: 抽样检验样本大小Sample size：S/SSI-SIV 特殊抽样水平等级Special I-Special IV：特采Concession / Waive：CON 国际标准化组织ISO: 工业标准体制结构Industry Standard Architecture：ISA 开箱稽核OBA: 先进先出FIFO: 管理循环PDCA: 计划，执行，检查，总结Plan do check action 在制品（半成品）WIP: ) 业务订单S/O: Sales Order ( ) 采购订单P/O: Purchase Order ( ) 请购单P/R: PurchaseRequest ( 允收品质水准AQL:acceptable quality level 最低品质水准LQL;Limiting quality level 合格供应商名册QVL:qualified vendor list (Approved Vendor List) ：认可的供货商清单AVL （品质，交期，成本）QCD: Quality cost deliveryMPM:Manufacturing project management 制造专案管理重要绩效指标KPI:Key performance indicate 制造验证试产MVT:Manufacturing Verification Test 服务/可靠度/质量Quality/Reliability/Service：Q/R/S（料到上线）STL:ship to line 误判NTF:No trouble found （产能改善计划）CIP:capacity improvement plan （物料审核小组）MRB:material review board 退货单MRB:Material reject bill （即时管理）JIT:just in time （整理，整顿，清扫，清洁，修养）5S:seiri seiton seiso seiketsu shitsuke （标准作业程序）SOP:standard operation process 制程检验规格SIP:Specification inspection process ) 测试作业流程TOP: Test Operation Process ( （作业指导书）WI: working instruction （表面粘着原件）SMD:surface mounting device故障分析报告FAR:failure aualysis report 改善报告CAR:Corrective action report (Business ProcessReengineering) 企业流程再造：BPR (Initial Sample Approval Request)- ：首批样品认可ISAR (Just In Time) ：实时管理JIT：品管圈QCC (Quality Control Circle) ) 工程部Engineering Department ( TQEM: Total Quality Environment Management ) 全面品质环境管理( ) 制造PD: Production Department ( ) 后勤支持LOG: Logistics ( ) 进出口Shipping: (：AOQ 平均出货质量Average Output Quality 平均出货质量水平Average Output Quality Level：AOQL 失效模式分析failure model effectiveness analysis：FMEA ) 工程变更会议CRB: Change Review Board (Customer Simulate Analysis：CSA 客户模拟分析供应商品质管理系统Supplier Quality Management System：SQMS 品质改善小组QIT: Quality Improvement Team 品质改善计划Quality Improvement Plan：QIP持续改善计划Continual Improvement Plan：CIP ) 来料品质回馈单M.Q.F.S: Material Quality Feedback Sheet ( ) 供货商改善对策报告SCAR: Supplier Corrective Action Report ( ) 单8D Sheet: 8 Disciplines sheet ( 8D ) 管理循环PDCA (Plan-Do-Check-Action) (：PDCA ) 物料最小包装量MPQ: Material Packing Quantity (DSCN: Delivery Schedule Change Notice () 交期变更通知) 品质工程表QAPS: Quality Assurance Process Sheet ( (Distribution Resource Planning) ：运销资源计划DRP (Decision Support System) ：决策支持系统DSS (Electronic Commerce) ：电子商务EC (Electronic Data Interchange) ：电子资料交换EDI ：主管决策系统EIS (Excutive Information System) (Enterprise Resource Planning) ：企业资源规划ＥＲＰ (Flexible Manufacture System) ：弹性制造系统FMS (Knowledge Management) ：知识管理KM (Lot-for-Lot) ：逐批订购法4L (Least Total Cost) ：最小总成本法LTC ：最小单位成本LUC (Least Unit Cost) (Manufacturing Execution System) ：制造执行系统MES (Master Production Schedule) ：主生产排程MPS (Material Requirement Planning) ：物料需求规划MRP (Manufacturing Resource Planning) Ⅱ：制造资源计划MRP (Original Equipment Manufacture) ：委托代工OEM(Original Design & Manufacture) ：委托设计与制造ODM (On-Line Analytical Processing) ：线上分析处理OLAP (On-Line Transaction Processing) ：线上交易处理OLTP (Optimized Production Technology) ：最佳生产技术OPT (Plan-Do-Check-Action) 管理循环PDCA：PDCA (Product Data Management)) ：产品数据管理系统PDM (Rough Cut Capacity Planning) ：粗略产能规划RCCP (Supply Chain Management) ：供应链管理SCM (Shop Floor Control) ：现场控制SFC (Theory of Constraints) ：限制理论TOC (Total Quality Control) ：全面品质管制TQC 仅供参考FYI/R:for your information/reference 尽快ASAP: 标准时间S/T:Standard time ：全面生产保养TPM:total production maintenance 信息技术，资讯科学IT:information technology：CEO 执行总裁Chief Executive Officer 首席业务总裁Chief Operaring Officer：COO 优势﹐弱点﹐机会﹐威胁Strength,Weakness,Opportunity,Threat：SWOT 个人发展计划Individual Development Plan：IDP 物料需求计划Material Requirement Planning：MRPMaterial：MAT'S 材料批退率Lot Rejeet Rate：LRR 知会Attention：ATIN Computer ,Communication , Consumer electronic ：3C 消费性电子When , Where , Who , What , Why , Ho ：5W1H Man , Machine , Material , Method , Measurement 5M:机器,人测量,方法,材料, Man,Material,Machine,Method,Environment 4MIE: )资源(时间,技术,财务,物力,人力, Manpower 7M1I:, Money , Management , Market Method,, Material , Machine 资金，管理，市场，, 方法材料，机器，人力，Information 资讯失效分析FA: Failure Analysis 教养,清洁,清扫,整顿,整理5S5S 六标准差6Sigma6Sigma 自动插件A/IAutoInsertion 允收水平AQLAcceptQualityLevel 过程)老化(高温热机B/IBurn-In 材料明细表BOMBillOfMaterial 接单生产BTOBuildToOrder 制造/计算机辅助设计CAD/CAMComputerAidedDesign/Manufacturing ) 仪校(仪器校验CALCalibration 改善对策报告CARCorrectiveActionResponse要求/客户抱怨CCRCustomerComplainRequirement 索取费用ChargeCharge 异常现象消失,无法复制CNDCannotDuplicate (CR>MA>MI) 严重CRCritical 客户服务CSCustomerServiceCTOConfigureToOrder 接单组装帐目通知)会计DebitNoteDebitNote( 公司稽核供货商的文件DELL'sSurveyFormDELL'sSurveyFormDELL 工程变更通知ECNEngineeringChangeNotice 工程变更要求ECREngineeringChangeRequest 电磁干扰EMIElectroMagneticInterferenceENGEngineering) 部(工程静电放电ESDElectrostaticDischarge 客诉前置处理单位FAEFieldApplicationEngineering 首件检查FAIFirstArticleInspection 工厂通知FNFactoryNotice 市场退修率FRRFieldReturnRateFRUFieldReplacementUnit 市场不良回修更换套件耐电压测试Hi-PotHi-Pot ) 生产…,出货(停止)…HoldHold(shippin g,production 电路测试)板ICTIn-CircuitTest(PCIEIndustrialEngineering 工业工程制程质量管理IPQCIn-ProcessQualityControl 进料质量管理IQCIncomingQualityControl 国际标准组织ISOInternationalOrganizationforStandardization ) 入料…,行动(实时JITJustInTime主要MAMajor 机械工程MEMechanicalEngineering ) 业(制造部MFGManufacturing 次要MIMinor 信息管理系统MISManagementInformationSystem ) 亦指制造部(量产MPMassProduction 材料异常会阅MRBMaterialReviewBoardVQA 平均失效时间MTBFMeanTimeBetweenFailure 作业指导书O/IOperationalInstruction 原始设计生产ODMOriginalDevelopingManufacturer 原始配备生产OEMOriginalEquipmentManufacturer 在制品可靠度测试ORTOn-goingReliablityTest品名P/NPartNumber (P/O->S/O->W/O) 采购下订单P/OPurchaseOrder 试作验证P/RPilot-Run 戴明循环PDCAPlanDoCheckAction ) 部(制造工程PEProductionEngineering ) 质量计算单位(百万分之一PPMPartPerMillion预加工PreformingPreforming 品质保证QAQualityAssurance 品管圈活动QCCAQualityControlCircleActivities 质量管理QCQualityControl 质量信息系统QISQualityInformationSystem 过程)老化(常温热机R/IRun-InREVRevision 版本退货品认可RMAReturnMerchandiseApproval(orAuthorization) 退回厂商RTVReturnToVendor 序号S/NSerialNumber 业务下订单S/OSalesOrder ) 安规(安全规格SafetySafety 表面黏着技术SMTSurfaceMountingTechnologySPCStatisticsProcessControl 统计制程管制规格SPECSpecification 强势弱势潜在机会威胁SWOTStrengthWeaknessesOpportunitiesThreats 测试工程TETestEngineering 全面性生产维护TPMTotalProductiveMaintenance 全面质量管理TQMTotalQualityManagement ) 安规单位(德国莱茵技术监护顾问公司TUVTUVULUnderwritersLaboratories) 安规单位(美国保险协会实验室) 雷同进料检验(供货商质量保证VenderQualityApprovalVQA 生产工单W/OWorkOrder 尚未完成的在制品WIPWorkInProcess 料号P/N ------ Part Number 给采购的release物控P/R ------ Purchase Request ( 请购单) 订单)给厂商的release采购P/O ------ Purchase Order ( 物控管理&生管PMC ------ Production & Material Control ) 包括生管物控产销(整个生产管理PM ------ Production Management ( MC ------ Material Control 物控)企划生管)企划( PC ------ Production Control 阶段Run Pilot 主要是针对大客户大订单的专门全面管理(项目管理Leader Project PL------ 及其前期工作) 量产之后的(订单管理OM ------ Order Management ) 变更﹑出货排程等ECN订单答交﹑生产进度跟踪﹑工令管理﹑管理计划书)订单(项目PMP ------ Project Management Plan 负责人)项目( PIC ------ Person In Charge COPP ------ 生产过程中的可靠度测试ORT ------ Ongoing Reliability Test 上管制线 UCL ------ Up Control Line 下管制线LCL ------ Low Control Line FAI ------ MVB. 再作PVT试生产第一阶段先作PVT ------ Process Verification Test Pilot Run 试生产之第二阶段MVB ------ Mass Verification Board Pilot Run大批量生产/量产M/P ------ Mass Production 依据销售预测进行生产BTF ------ Build To Forecast 依据订单生产BTO ------ Build To Order 客制化生产CTO ------ Configuration To Order PTD ------ Production To Departure 客户关系管理CRM ------ Customer Relationship Management 产能需求规划CRP ------ Capacity Requirements Planning 企业资源规划ERP ------ Enterprise Resource Planning 弹性制造系统 FMS ------ Flexible Manufacture System 物料清单BOM ------ Bill Of Material 主生产排程MPS ------ Master Production Scheduling 指根据业务接单或销售预测所排定一段期间之产品生产计划须指定何种产品应于何时制造 . 完成多少数量物料需求MRP ------ Material Requirement Planning MRP规划展开之零BOM之产品独立需求透过MPS之计算依照组件相依需求配合当时存货状况以求得某段期间内应投入生产 . 或执行采购之计划方针在制品WIP ------ Work In Process 产成品/制成品FG ------ Finished Goods订单(呆滞在途E&O ------ Excess & Order/Backlog ) ) 停止生产(产品寿命中止EOL ------ End Of Line辅助生管人员收集现场数据及控制制造执行系统SystemExecution MES------Manufacturing 系统模块皆会包括订MES大部分的.提高生产效益的工具现场制造流程提供企业改善制程、(Material Management System ﹑物料管理系统(Customer Order Management COM)单管理系统(Production Scheduling ﹑生产排程系统(Work In Process Tracking WIP)﹑制程控管系统MMS) (Equipment ﹑设备控管系统SPC) Control Process (Statistical ﹑质量控管系统PSS)System ERP与(PDM Integration Interface)整合接口PDM及对外部系统的Management System EMS) . 等模块(ERP Integration Interface)整合接口委托代工OEM ------ Original Equipment Manufacture 委托设计与制造ODM ------ Original Design & Manufacture 被认可的厂商名册/具备资格VL ------ Approved Vendor List A 供应链管理SCM ------ Supply Chain Management供应链管理产品由起始原料转换成完成品至最终到达顾SLM ------ Supply Line Management 客手上之流动过程中影响其执行绩效的个体组合而成之网络称为供应链供应链的组成个体而供应链管理之定义简单而;可能包括：供货商→制造→工厂→配销点→零售商→最终顾客言就是需求与供应适当的结合以达到资源﹝人﹑设备﹑物﹑资金﹞运用与分配之有效性与. 及时性工程变更/设计变更EC ------ Engineer Change 电子商务 EC ------ Electronic Commerce 工程变更通知书ECN ------ Engineer Change Notice 装货通知单 S/O ------ Shi pping Order ”先行SI出货通知比“S/A ------ Shipping Advice 发货单/正式的出货文件S/I ------ Shipping Invoice 装箱单)出货P/L ------ Packing List (提单/提货单B/L ------ Bill of Leading 净重N/W ------ Net Weight 预定开航时间)货船ETD/E.T.D/e.t.d ------ Expected Time of Departure ( 预定到达时间ETA/E.T.A/e.t.a ------ Expected Time of Auuival 零件承认组CAT ------ Component Approval Team 关键指标KPI ------ Key Part Index 财务会计.二专有名词应收帐款A/R ------ Account Receivable 应付帐款A/P ------ Account Payment 不良扣款/扣除应付帐款Deduct AP ------ ) 付款(汇转帐T/T ------ Telegraph Transfer如(天后付款30货到------ 天OA 30) 付款12/5到货则11/5 ) 付款12/30到货则11/5如(货送到后下月底付款------ 天30月结关税 ID ------ Input Duty 增值税 AT ------ Value Add Tax V 专有名词品管. 三进料质量控制 IQC ------ Incoming Quality Control 产品未完成前尚在制程中的品管工作:制程质量管理IPQC------ In-Process Quality Control . 成品未装箱前的品管工作:成品质量管理FQC ------ Finish or Final Quality Control 质量工程QE ------ Quality Engineering FAE --- AED 又称为) 范畴R&D属(终端应用工程部门EngineerApplication Final ------ Application Engineer Department. 成品应用工程FAE ------ Finished Application Engineer 客户产品规格标准要求CPSR ------ Customer Product Standard Request 品质保证QA ------ Quality Assure 出货品质保证OQA ------ Out-going Quality Assure 是否最新版产品结构是否符ECN产品外观: 范围包括对厂内生产线的产品进行检验及测试包装方法是否符合客户要求产品性能检验测试(CD-PROMENU)附属配件是否齐全ECN合进行测试项目CPUHDD种固定规格的3机种用).DIST能否正常运行与其它产品的兼容性等( . 机种按客户提供的固定程序测试项目相对较少时间较短)不良率failure rate(出货OQA 0.0 ------ 之品质保证0.0%为相同的检验及OQA开箱检查包括产品功能及兼容性测试除需进行与OOB ------ Out Of Box 测试之外还要设法取得客户信息仿真客户端系统使用状况进行产品兼容性测试对客户可能等均需进行测试测试项目较多时间较长所需的测HDDCPUFLOPPY采用的各种规格型号之要多OQA试程序和测试治具比出货质量管理OQC ------ Out-going Quality Control 全面质量管理TQM ------ Total Quality Management 全面质量管理TQC ------ Total Quality ControlQIT ------ Quality Improvement Team 质量改善小组质量改善计划QIP ------ Quality Improvement Plan质量异常修正联络单工厂内部各制造及技朮部门互相CAR ------ Correction Action Require 可发出此联络单内容广泛包括制程﹑材料﹑人为因素等造成的质量异常要求相关责任单位 . 分析并提出改进措施PE退货修正联络单”交由OQA为“CAR发出的: OQA如.改善发给厂商的联络IQC供货商质量改善联络单SCAR ------ Supplier Correction Action Require厂商针对我们提出的质量问题研究并实行改善措施厂商接到此单后即会回复改善PUSH单 . 措施制造将质量异常反: 其循环流程为循环改善措施ActionCorrection Loop Close ------ CLCA 对厂商的改善措施是否能有效解决质量异SQE 厂商回馈改善措施SCAR 发出IQCIQC应给常作进一步确认LTQ ------ Lead ship Through Quality 质量领导机制消费者可接受之最高不良率AQL ------ Acceptable Quality Level 知识管理KM ------ Knowledge Management 现场控制)生产SFC ------ Shop Floor Control( 批通率Batch Reject Rate / Lot Reject Rate 不良率 Defect Rate 国际标准组织ISO ------International Organization for Standardization Product ------ PDM 产品数据管理系统协助工程师进行数据管理让企业透Management Data 用来管理特定产品从研发到量.过标准程序管制提高整体效率并使作业程序电子化及标准化CAE程序﹑NC模型数据﹑3D图面﹑CAD各点产生的一切信息例如/产之生命周期里全程 . 测试数据﹑设计历史和相关制程文件分析结果 Technology Production Optimized ------ OPT 最佳生产技术任何企业的真正目标是现在和 . 要实现这个目标必须在增加产销率的同时减少库存和营运费用;未来都赚钱Action→Check→Do→: Plan”管理模式PDCA品管之“PDCA ------ →Study→Do→: Plan”管理模式PDSA品管之“PDSA ------ Action CLCA ------ 是由企业研究出来的一种环境塑造方案其目的5S ------ 5S ﹑清洁(SEISO)﹑清扫(SEITON)顿/﹑整(SEIRI)在藉由整理五种行为来创造清洁﹑明朗﹑活泼(SHITSUKE)及身美(SEIKETSU) 是现场/活动的对象.5S化之环境以提高效率﹑质量及顾客满意度的环境它对生产现场环境全局进行综合考虑并制订切实可行的 . 计划与措施从而达到规范化管理专有名词计算机软硬件. 四印刷电路板 PCB ------ Printed Circuit Board 印制电路插件PCA ------ Printed Circuit Assembly 母板/主板/主机板M/B ------ Mother Board / Main Board 系统半成品又称“准系统”或称B/B ------ BareBone “裸机”由: 通常由下列部分组成客户指定其配备OEM 客户自行OEM由Case+power supply+M/B+CD ROM+HDD+FDD system. 等即成为完整的系统:CPU+RAM增添硬盘HD ------ Hard Disk 硬盘驱动器 HDD ------ Hard Disk Drive 软磁盘/软盘Floppy Disk 软磁盘机/软盘驱动器FDD ------ Floppy Disk Drive 光盘/激光唱盘CD/CDPRO ------ Compact Disc 光盘驱动器 CD-ROM/ CD-ROM drive 只读光盘 CDROM 品质人员名称类品质管理人员QC quality control终点质量管理人员FQC final quality control 制程中的质量管理人员IPQC in process quality control 最终出货质量管理人员OQC output quality control 进料质量管理人员IQC incoming quality control 全面质量管理TQC total quality control 段检人员POC passage quality control 质量保证人员QA quality assurance 出货质量保证人员OQA output quality assurance 品质工程人员QE quality engineering 品质保证类新品首件检查FAI first article inspection FAA first article assurance 首件确认模具确认报告TVR tool verification report 模具正式投产前确认3B3B 能力指数CP capability index 模具制程能力参数CPK capability index of process 合格供货商品质评估SSQA standardized supplier quality 开箱检查OOBA out of box audit 品质机能展开QFD quality function deployment 失效模式分析FMEA failure model effectiveness analysis 项回复内容8 disciplines8 最后一次稽核FA final audit CAR corrective action request 改正行动要求改正行动报告corrective action report 运作类FQC 运作类允收品质水准AQL Acceptable Quality Level 抽样检验样本大小S/S Sample size 允收ACC Accept 拒收REE Reject 极严重的CR Critical 主要的MAJ Major 轻微的MIN Minor 平均出厂品质AOQ Average Output Quality AOQL Average Output Quality Level 平均出厂品质可靠度服务/品质Q/R/S Quality/Reliability/Service 军用标准MIL-STD Military-Standard 特殊抽样水准等级S I-S IV SpecialI-Special IV 料号P/N Part Number L/N Lot Number 特采特采AOD Accept On Deviation 首件检查报告UAI Use As It 百万分之一FPIR First Piece Inspection Report 批号PPM Percent Per Million 制程统计品管专类统计制程管制SPC Statistical Process Control 统计质量管理SQC Statistical Quality Control 全距R Range 全距平均值AR Averary Range 管制上限UCL Upper Central Limit 管制下限LCL Lower Central Limit 最大值MAX Maximum 最小值MIN Minimum 量具之再制性及重测性判断量可靠与Reproducibility&Repeatability Gauge GRR 否尺寸DIM Dimension 直径DIA Diameter 频率FREQ Frequency 样品数N Number 其它品质术语类品质圈QCC Quality Control Circle 品质改善小组QIT Quality Improvement Team 计划PDCA Plan Do Check Action 总结检查执行零缺点ZD Zero Defect 品质改善QI Quality Improvement 目标方针QP Quality Policy 全面品质管理TQM Total Quality Management退货单MRB Material Reject Bill 最低品质水准LQL Limiting Quality Level 退料认可RMA Return Material Audit 品质改善活动QAN Quality Amelionrate Notice 全尺寸测量ADM Absolute Dimension Measuremat 品质目标QT Quality Target 品管七大手法7QCTools7 Quality Controll Tools 通用之件类 ) 供货商(工程变更通知ECN Engineering Change Notes ) 客户(工程改动要求ECO Engineering Change Order 工序改动通知PCN Process Change Notice 生产管制计划PMP Product Management Plan 制程检验规格SIP Specification In Process 制造作业规范SOP Standard Operation Procedure 成品检验规范IS Inspection Specification 物料清单BOM Bill Of Material 包装规范PS Package Specification 规格SPEC Specification 图面DWG Drawing 系统文件类品质系统QC Quality System 工程标准ES Engineering Standarization龙华厂文件CGOO China General PCE 休斯敦)美国H Huston ( 康伯公司)美国C Compaq ( 中国大陆C China ) 厂(组装A Assembly ) 厂(冲压S Stamping ) 厂(烤漆P Painting 英特尔公司I Intel 台湾T TAIWAN 工艺标准IWS International WorkmanStandard 国际标准化组织ISO International Standard Organization 一般规格GS General Specification 产品在龙华冲压厂制CMCS C-China M-Manufact C-Compaq S-Stamping Compaq 造作业规范产品在龙华组装厂品管作业规范CQCA Q-Quality A-Assembly Compaq 产品在龙华烤漆厂品管作业规范CQCP P-Painting Compaq 部类生产和物料控制PMC Production & Material Control 生产计划控制PPC Production Plan Control 物料控制MC Material Control 制造工程部ME Manafacture Engineering 产品工程部PE Project Engineering 会计部A/C Accountant Dept 人事行政部P/A Personal & Administration 资料中心DC Document Center ) 部(品质工程QE Quality Engineering ) 处(品质保证QA Quality Assurance ) 课(质量管理QC Quality Control 生产部PD Product Department 实验室LAB Labratry 工业工程IE Industrial Engineering 设计开发部R&D Research & Design ) 厂(烤漆P Painting ) 厂(组装A Asssembly 厂(冲压S Stamping ) 生产类 ) 块等,根(个PCS Pieces ) 对等(双PRS Pairs 卡通箱CTN Carton 栈板PAL Pallet/skid 采购订单PO Purchasing Order 生产单MO Manufacture Order生产日期码D/C Date Code 识别码)供货商ID/C Identification Code (特殊工作需求SWR Special Work Request 批号L/N Lot Number 料号P/N Part Number 其它原设备制造OEM Original Equipment Manufacture 个人计算机外设PCE Personal Computer Enclosure 个人计算机PC Personal Computer 中央处理器CPU Central Processing Unit 电解片SECC SECC` 热浸镀锌材料SGCC SGCC 中国大陆NHK North of Hongkong 中国大陆PRC People's Republic of China 美国U.S.A the United States of America 尽可能快的A.S.A.P As Soon As Possible 电子邮件E-MAIL Electrical-Mail 不适用N/A Not Applicable 数量QTY Quantity 以及VS 版本REV Revision 零库存JIT Just In Time 输出/输入I/O Input/Output 好OK Ok 不合格,不行NG Not Good 极严重不允许C=0 Critical=0 ESD Electry-static Discharge 静电排放教养,清洁,清扫,整顿,整理希腊语5S 知会ATIN Attention 副本复印相关人员CC Carbon Copy 承认,认可,核准APP Approve 确认CHK Check 上午AM Ante Meridian 下午PM Post Meridian 光盘CD Compact Disk CD-ROM Compact Disk Read-OnlyMemory 只读光盘软盘机FDD Floppy Disk Drive 碟碟机HDD Hard Disk Drive 仅供参考REF Reference 连接器CONN Connector 模穴V Cavity CA CAD Computer Aid Design 计算器辅助设计组装,装配ASS'Y Assembly 材料MAT'S Material 集成电路IC Integrated Circuit 真位度T/P True Position类型TYP Type 周出货需求WDR Weekly Delivery Requitement 制程周期C?T Cycle Time ) 生产前准备时间(前置时间L/T Lead Time 标准时间S/T Standard Time 产品市场P/M Product Market 消费性电子3C Computer,Commumcation,Consumer electronic's 5WIH When,Where,Who,What,Why,How to 5M Man,Machine,Material,Method,Measurement时间,技术,财务,物力,人力4MIH Man,Materia,Money,Method,Time ) 资源( 策略品质保证SQA Strategy Quality Assurance 设计品质保证DQA Desigh Quality Assurance 制造品质保证MQA Manufacture Quality Assurance 销售及服务品质保证SSQA Sales and service Quality Assurance 批退率LRR Lot Rejeet Rate 脑力激荡BS Brain storming 高磁测试EMI Electronic Magnetion Inspect 高频测试FMI Frequency Modulatim Inspect B/MBoar/Molding(flat cable) C/P Connector of PC A/P Assembly 电源箱SPS Switching power supply ) 机箱(卧式DT Desk Top ) 机箱(立式MT Mini-Tower DVD Digital Vedio Disk VCD Vdeio Compact Disk LCD Liquid Crystal Display CAD Computer AID Design CAM Computer AID Manufacturing CAE Computer AID Engineering 输出系统/先进的基本输入ABIOS Achanced Basic in put/output system 互补金属氧化物半导体CMOS Complemeruary Metoll Oxide Semiconductor 个人数字助理PDA Personal Digital Assistant 集成电路IC Integrated Circuit 工业标准体制结构ISA Industry Standard Architecture 微信道结构MCA Micro Channel Architecture 扩充的工业标准结构EISA Extended Industry Standard Architecture 单项导通汇流组件SIMM Single in-line memory module 双项导通汇流组件DIMM Dual in-line Memory Module发光二级管LED Light-Emitting Diode 失效模式分析FMEA Failure Mode Effectivenes 金属线绪束集组件W/H Wire Harness 排线F/C Flat Calle 印刷电路板PCB Printed Circuit Board改善报告CAR Correction Action Report 不良NG Not Good 周出货要求WPR Weekly Delivery。
SMT控制计划 中英文
PartNumber/L atest Change LevelCore TeamCustomer Engineering Approval/Dat e (If Req'd.)PartName/De scriptionSupplier/Plant Approval/DateCustomer QualityApproval/Dat e (If Req'd.)Supplier/P lantSupplier Code Other Approval/Date (If Req'd.)OtherApproval/Dat e (If Req'd.)MACHINE,PART/DEVICE,SPECIAL PROCESS JIG,TOOLS,CHAR.SAMPLENUMBER FOR MFG.NO .CLASS (流程编号）（机器/设备/工装夹具）（特殊特性）EDS3000D （ROHS 测试仪）ROHS ▽S lead-free (无铅）ROHS inspection （进行ROHS 检测）5pcsEvery Lot （每批）ROHS report from vendor IQA ROHS test report （供应商提供的ROHS 报告 & IQA ROHS 检测报告）separate the defect Lot/inform supplierCaliper （游标卡尺）PCB Dimension （PCB 的尺寸）▽Key dimension （关键尺寸):1.1.651+/-0.100mm2. 1.778+/-0.100mm3. 3.175+/-0.100mm4.0.508+/-0.050mmMeasurement Visual Inspection CPK Report fromVendor（查看供应商提供的CPK 报告）5pcsEvery Lot （每批）IQA test dataInspection criteria status CPK Report from Vendor （IQA 检测报告 & 供应商提供的CPK 报告）separate the defect Lot/inform supplierPCB material （PCB 的材质）FR-4-86material report fromvendor（查看供应提供的材质报告）onceEvery Lot （每批） PCB material report （PCB 材质报告）separate the defect Lot/inform supplierAppearance (PCB 的外观）According to IPC-A-610E inspection standard（根据IPC-A-610E 检验标准）Visual Inspection （目视检验）5pcsEvery Lot （每批）IQA inspection report （IQA 检测报告）separate the defect Lot/inform SQE disposal PCB Validity （PCB 的有效期）one year (一年）Visual Inspection （目视检验）100%Every Lot （每批）IQA inspection report （IQA 检测报告）separate the defect Lot/inform SQE disposal Appearance （外观）Visual Inspection （目视检验）5pcsEvery Lot （每批）IQA inspection report （IQA 检测报告）separate the defect Lot/inform SQE disposal Caliper (游标卡尺） Dimension （尺寸）Caliper (游标卡尺）5pcsEvery Lot （每批）IQA inspection report （IQA 检测报告）separate the defect Lot/inform SQE disposal LCR meter （LCR 测试仪）Characteristic Value （特性值）LCR meter （LCR 测试仪）5pcsEvery Lot （每批）IQA inspection report （IQA 检测报告）separate the defect Lot/inform SQE disposalCaliper (游标卡尺）Dimension （尺寸）Key dimension（关键尺寸，参考CER ）:1. 21.1+/-0.2mm2. 8.0+/-0.2mm Caliper (游标卡尺）5pcsEvery Lot （每批）IQA inspection report （IQA 检测报告）separate the defect Lot/inform SQE disposalAppearance （外观）According to IQA inspectionstandard根据IQA 的来料检验标准Visual Inspection （目视检验）5pcsEvery Lot （每批）IQA inspection report （IQA 检测报告）separate the defect Lot/inform SQE disposalStep 1Incoming Inspection （来料检验）Connector （连接器）PCB materials （PCB 物料）Electron material(Resistance ,Capacitance,Inductance ) (电子物料：电阻，电容，电感）CONTROL METHOD（控制方法）SIZE （数量）FREQ （频率）CHARACTERISTICS（特性）METHODSPart NumberReference DesignationProduct（产品特性/参考设计图纸）PROCESS NAME/（流程名称/描述）OPERATION DESCRIPTION PROCESS （过程特性）EVALUATION MEASUREMENT TECHNIQUE （评估测量的方法）REACTION PLAN （反应计划）PRODUCTPROCESS SPECIFICATIONTOLERANCE (mm)（产品&过程特性的规格要求）1.According to IQA inspection standard2.Supplier must provide COC to us by lot to make sure the autority channel.1.根据IQA 的来料检验标准2. 供应商必须提供COC 文件给到Ryder ，保证正规的供货渠道PartNumber/L atest Change LevelCore TeamCustomer Engineering Approval/Dat e (If Req'd.)PartName/De scriptionSupplier/Plant Approval/DateCustomer QualityApproval/Dat e (If Req'd.)Supplier/P lantSupplier Code Other Approval/Date (If Req'd.)OtherApproval/Dat e (If Req'd.)MACHINE,PART/DEVICE,SPECIAL PROCESS JIG,TOOLS,CHAR.SAMPLENUMBER FOR MFG.NO .CLASS (流程编号）（机器/设备/工装夹具）（特殊特性）CONTROL METHOD（控制方法）SIZE （数量）FREQ （频率）CHARACTERISTICS（特性）METHODSPart NumberReference DesignationProduct（产品特性/参考设计图纸）PROCESS NAME/（流程名称/描述）OPERATION DESCRIPTION PROCESS （过程特性）EVALUATION MEASUREMENT TECHNIQUE （评估测量的方法）REACTION PLAN （反应计划）PRODUCTPROCESS SPECIFICATIONTOLERANCE (mm)（产品&过程特性的规格要求）aph（温湿度计）(存储）（环境监督）PartNumber/L atest Change LevelCore TeamCustomer Engineering Approval/Dat e (If Req'd.)PartName/De scriptionSupplier/Plant Approval/DateCustomer QualityApproval/Dat e (If Req'd.)Supplier/P lantSupplier Code Other Approval/Date (If Req'd.)OtherApproval/Dat e (If Req'd.)MACHINE,PART/DEVICE,SPECIAL PROCESS JIG,TOOLS,CHAR.SAMPLENUMBER FOR MFG.NO .CLASS (流程编号）（机器/设备/工装夹具）（特殊特性）CONTROL METHOD（控制方法）SIZE （数量）FREQ （频率）CHARACTERISTICS（特性）METHODSPart NumberReference DesignationProduct（产品特性/参考设计图纸）PROCESS NAME/（流程名称/描述）OPERATION DESCRIPTION PROCESS （过程特性）EVALUATION MEASUREMENT TECHNIQUE （评估测量的方法）REACTION PLAN （反应计划）PRODUCTPROCESS SPECIFICATIONTOLERANCE (mm)（产品&过程特性的规格要求）PartNumber/L atest Change LevelCore TeamCustomer Engineering Approval/Dat e (If Req'd.)PartName/De scriptionSupplier/Plant Approval/DateCustomer QualityApproval/Dat e (If Req'd.)Supplier/P lantSupplier Code Other Approval/Date (If Req'd.)OtherApproval/Dat e (If Req'd.)MACHINE,PART/DEVICE,SPECIAL PROCESS JIG,TOOLS,CHAR.SAMPLENUMBER FOR MFG.NO .CLASS (流程编号）（机器/设备/工装夹具）（特殊特性）CONTROL METHOD（控制方法）SIZE （数量）FREQ （频率）CHARACTERISTICS（特性）METHODSPart NumberReference DesignationProduct（产品特性/参考设计图纸）PROCESS NAME/（流程名称/描述）OPERATION DESCRIPTION PROCESS （过程特性）EVALUATION MEASUREMENT TECHNIQUE （评估测量的方法）REACTION PLAN （反应计划）PRODUCTPROCESS SPECIFICATIONTOLERANCE (mm)（产品&过程特性的规格要求）（存储）Loading （上板架）PartNumber/L atest Change LevelCore TeamCustomer Engineering Approval/Dat e (If Req'd.)PartName/De scriptionSupplier/Plant Approval/DateCustomer QualityApproval/Dat e (If Req'd.)Supplier/P lantSupplier Code Other Approval/Date (If Req'd.)OtherApproval/Dat e (If Req'd.)MACHINE,PART/DEVICE,SPECIAL PROCESS JIG,TOOLS,CHAR.SAMPLENUMBER FOR MFG.NO .CLASS (流程编号）（机器/设备/工装夹具）（特殊特性）CONTROL METHOD（控制方法）SIZE （数量）FREQ （频率）CHARACTERISTICS（特性）METHODSPart NumberReference DesignationProduct（产品特性/参考设计图纸）PROCESS NAME/（流程名称/描述）OPERATION DESCRIPTION PROCESS （过程特性）EVALUATION MEASUREMENT TECHNIQUE （评估测量的方法）REACTION PLAN （反应计划）PRODUCTPROCESS SPECIFICATIONTOLERANCE (mm)（产品&过程特性的规格要求）PartNumber/L atest Change LevelCore TeamCustomer Engineering Approval/Dat e (If Req'd.)PartName/De scriptionSupplier/Plant Approval/DateCustomer QualityApproval/Dat e (If Req'd.)Supplier/P lantSupplier Code Other Approval/Date (If Req'd.)OtherApproval/Dat e (If Req'd.)MACHINE,PART/DEVICE,SPECIAL PROCESS JIG,TOOLS,CHAR.SAMPLENUMBER FOR MFG.NO .CLASS (流程编号）（机器/设备/工装夹具）（特殊特性）CONTROL METHOD（控制方法）SIZE （数量）FREQ （频率）CHARACTERISTICS（特性）METHODSPart NumberReference DesignationProduct（产品特性/参考设计图纸）PROCESS NAME/（流程名称/描述）OPERATION DESCRIPTION PROCESS （过程特性）EVALUATION MEASUREMENT TECHNIQUE （评估测量的方法）REACTION PLAN （反应计划）PRODUCTPROCESS SPECIFICATIONTOLERANCE (mm)（产品&过程特性的规格要求）（印刷BOT 面，Line2)PartNumber/L atest Change LevelCore TeamCustomer Engineering Approval/Dat e (If Req'd.)PartName/De scriptionSupplier/Plant Approval/DateCustomer QualityApproval/Dat e (If Req'd.)Supplier/P lantSupplier Code Other Approval/Date (If Req'd.)OtherApproval/Dat e (If Req'd.)MACHINE,PART/DEVICE,SPECIAL PROCESS JIG,TOOLS,CHAR.SAMPLENUMBER FOR MFG.NO .CLASS (流程编号）（机器/设备/工装夹具）（特殊特性）CONTROL METHOD（控制方法）SIZE （数量）FREQ （频率）CHARACTERISTICS（特性）METHODSPart NumberReference DesignationProduct（产品特性/参考设计图纸）PROCESS NAME/（流程名称/描述）OPERATION DESCRIPTION PROCESS （过程特性）EVALUATION MEASUREMENT TECHNIQUE （评估测量的方法）REACTION PLAN （反应计划）PRODUCTPROCESS SPECIFICATIONTOLERANCE (mm)（产品&过程特性的规格要求）Step 6Print(BOT)Line2PartNumber/L atest Change LevelCore TeamCustomer Engineering Approval/Dat e (If Req'd.)PartName/De scriptionSupplier/Plant Approval/DateCustomer QualityApproval/Dat e (If Req'd.)Supplier/P lantSupplier Code Other Approval/Date (If Req'd.)OtherApproval/Dat e (If Req'd.)MACHINE,PART/DEVICE,SPECIAL PROCESS JIG,TOOLS,CHAR.SAMPLENUMBER FOR MFG.NO .CLASS (流程编号）（机器/设备/工装夹具）（特殊特性）CONTROL METHOD（控制方法）SIZE （数量）FREQ （频率）CHARACTERISTICS（特性）METHODSPart NumberReference DesignationProduct（产品特性/参考设计图纸）PROCESS NAME/（流程名称/描述）OPERATION DESCRIPTION PROCESS （过程特性）EVALUATION MEASUREMENT TECHNIQUE （评估测量的方法）REACTION PLAN （反应计划）PRODUCTPROCESS SPECIFICATIONTOLERANCE (mm)（产品&过程特性的规格要求）面，Line4）PartNumber/L atest Change LevelCore TeamCustomer Engineering Approval/Dat e (If Req'd.)PartName/De scriptionSupplier/Plant Approval/DateCustomer QualityApproval/Dat e (If Req'd.)Supplier/P lantSupplier Code Other Approval/Date (If Req'd.)OtherApproval/Dat e (If Req'd.)MACHINE,PART/DEVICE,SPECIAL PROCESS JIG,TOOLS,CHAR.SAMPLENUMBER FOR MFG.NO .CLASS (流程编号）（机器/设备/工装夹具）（特殊特性）CONTROL METHOD（控制方法）SIZE （数量）FREQ （频率）CHARACTERISTICS（特性）METHODSPart NumberReference DesignationProduct（产品特性/参考设计图纸）PROCESS NAME/（流程名称/描述）OPERATION DESCRIPTION PROCESS （过程特性）EVALUATION MEASUREMENT TECHNIQUE （评估测量的方法）REACTION PLAN （反应计划）PRODUCTPROCESS SPECIFICATIONTOLERANCE (mm)（产品&过程特性的规格要求）Step8Print(TOP)Line4（印刷TOPPartNumber/L atest Change LevelCore TeamCustomer Engineering Approval/Dat e (If Req'd.)PartName/De scriptionSupplier/Plant Approval/DateCustomer QualityApproval/Dat e (If Req'd.)Supplier/P lantSupplier Code Other Approval/Date (If Req'd.)OtherApproval/Dat e (If Req'd.)MACHINE,PART/DEVICE,SPECIAL PROCESS JIG,TOOLS,CHAR.SAMPLENUMBER FOR MFG.NO .CLASS (流程编号）（机器/设备/工装夹具）（特殊特性）CONTROL METHOD（控制方法）SIZE （数量）FREQ （频率）CHARACTERISTICS（特性）METHODSPart NumberReference DesignationProduct（产品特性/参考设计图纸）PROCESS NAME/（流程名称/描述）OPERATION DESCRIPTION PROCESS （过程特性）EVALUATION MEASUREMENT TECHNIQUE （评估测量的方法）REACTION PLAN （反应计划）PRODUCTPROCESS SPECIFICATIONTOLERANCE (mm)（产品&过程特性的规格要求）reflow （回流炉之前检验）PartNumber/L atest Change LevelCore TeamCustomer Engineering Approval/Dat e (If Req'd.)PartName/De scriptionSupplier/Plant Approval/DateCustomer QualityApproval/Dat e (If Req'd.)Supplier/P lantSupplier Code Other Approval/Date (If Req'd.)OtherApproval/Dat e (If Req'd.)MACHINE,PART/DEVICE,SPECIAL PROCESS JIG,TOOLS,CHAR.SAMPLENUMBER FOR MFG.NO .CLASS (流程编号）（机器/设备/工装夹具）（特殊特性）CONTROL METHOD（控制方法）SIZE （数量）FREQ （频率）CHARACTERISTICS（特性）METHODSPart NumberReference DesignationProduct（产品特性/参考设计图纸）PROCESS NAME/（流程名称/描述）OPERATION DESCRIPTION PROCESS （过程特性）EVALUATION MEASUREMENT TECHNIQUE （评估测量的方法）REACTION PLAN （反应计划）PRODUCTPROCESS SPECIFICATIONTOLERANCE (mm)（产品&过程特性的规格要求）beforePartNumber/L atest Change LevelCore TeamCustomer Engineering Approval/Dat e (If Req'd.)PartName/De scriptionSupplier/Plant Approval/DateCustomer QualityApproval/Dat e (If Req'd.)Supplier/P lantSupplier Code Other Approval/Date (If Req'd.)OtherApproval/Dat e (If Req'd.)MACHINE,PART/DEVICE,SPECIAL PROCESS JIG,TOOLS,CHAR.SAMPLENUMBER FOR MFG.NO .CLASS (流程编号）（机器/设备/工装夹具）（特殊特性）CONTROL METHOD（控制方法）SIZE （数量）FREQ （频率）CHARACTERISTICS（特性）METHODSPart NumberReference DesignationProduct（产品特性/参考设计图纸）PROCESS NAME/（流程名称/描述）OPERATION DESCRIPTION PROCESS （过程特性）EVALUATION MEASUREMENT TECHNIQUE （评估测量的方法）REACTION PLAN （反应计划）PRODUCTPROCESS SPECIFICATIONTOLERANCE (mm)（产品&过程特性的规格要求）PartNumber/L atest Change LevelCore TeamCustomer Engineering Approval/Dat e (If Req'd.)PartName/De scriptionSupplier/Plant Approval/DateCustomer QualityApproval/Dat e (If Req'd.)Supplier/P lantSupplier Code Other Approval/Date (If Req'd.)OtherApproval/Dat e (If Req'd.)MACHINE,PART/DEVICE,SPECIAL PROCESS JIG,TOOLS,CHAR.SAMPLENUMBER FOR MFG.NO .CLASS (流程编号）（机器/设备/工装夹具）（特殊特性）CONTROL METHOD（控制方法）SIZE （数量）FREQ （频率）CHARACTERISTICS（特性）METHODSPart NumberReference DesignationProduct（产品特性/参考设计图纸）PROCESS NAME/（流程名称/描述）OPERATION DESCRIPTION PROCESS （过程特性）EVALUATION MEASUREMENT TECHNIQUE （评估测量的方法）REACTION PLAN （反应计划）PRODUCTPROCESS SPECIFICATIONTOLERANCE (mm)（产品&过程特性的规格要求）PartNumber/L atest Change LevelCore TeamCustomer Engineering Approval/Dat e (If Req'd.)PartName/De scriptionSupplier/Plant Approval/DateCustomer QualityApproval/Dat e (If Req'd.)Supplier/P lantSupplier Code Other Approval/Date (If Req'd.)OtherApproval/Dat e (If Req'd.)MACHINE,PART/DEVICE,SPECIAL PROCESS JIG,TOOLS,CHAR.SAMPLENUMBER FOR MFG.NO .CLASS (流程编号）（机器/设备/工装夹具）（特殊特性）CONTROL METHOD（控制方法）SIZE （数量）FREQ （频率）CHARACTERISTICS（特性）METHODSPart NumberReference DesignationProduct（产品特性/参考设计图纸）PROCESS NAME/（流程名称/描述）OPERATION DESCRIPTION PROCESS （过程特性）EVALUATION MEASUREMENT TECHNIQUE （评估测量的方法）REACTION PLAN （反应计划）PRODUCTPROCESS SPECIFICATIONTOLERANCE (mm)（产品&过程特性的规格要求）PartNumber/L atest Change LevelCore TeamCustomer Engineering Approval/Dat e (If Req'd.)PartName/De scriptionSupplier/Plant Approval/DateCustomer QualityApproval/Dat e (If Req'd.)Supplier/P lantSupplier Code Other Approval/Date (If Req'd.)OtherApproval/Dat e (If Req'd.)MACHINE,PART/DEVICE,SPECIAL PROCESS JIG,TOOLS,CHAR.SAMPLENUMBER FOR MFG.NO .CLASS (流程编号）（机器/设备/工装夹具）（特殊特性）CONTROL METHOD（控制方法）SIZE （数量）FREQ （频率）CHARACTERISTICS（特性）METHODSPart NumberReference DesignationProduct（产品特性/参考设计图纸）PROCESS NAME/（流程名称/描述）OPERATION DESCRIPTION PROCESS （过程特性）EVALUATION MEASUREMENT TECHNIQUE （评估测量的方法）REACTION PLAN （反应计划）PRODUCTPROCESS SPECIFICATIONTOLERANCE (mm)（产品&过程特性的规格要求）。
电子厂常见的英文缩写大全
电子厂里常见的英文缩写-??浏览次数：1591次悬赏分：10|解决时间：2009-6-28 20:57 |提问者：Smile2008com比如ECN是指工程变更-AOI是光学检测-QE是品质工程....那FIFO是指什么呢???OEM....ODM--又是指什么呢..??这些都要谁来执行完成呢??这些是我们要学的?但是我要在学之前把它弄懂一些--万分谢谢--!!!!最佳答案ISO 国际标准化组织（ISO,International Organization for Stan-dardization缩写）。
OEM是英文Original Equipment Manufacturer的缩写，意思是原设备制造商R&D (research&design) 研发ODM，即Original design manufacture(原始设计商)的缩写。
IQC incoming quality controlRD research development centerIPQC in process quality controlRD HQ research development center head quarterFQC final quality controlQA quality assuranceBOM bill of materialPVT product verification testOQC outgoing quality controlPRP phase review processQE quality engineeringPM project managementDCC document center controlPJE project engineerECN engineering change noticePE product engineerECR engineering change requestNPI new product introductionMRB material review bomMP mass productionCAR corrective action requestMFG manufacturingFPC flexible printed circuit boardME mechanical engineerNCR non conforming reportKBD keyboardOBE out of box evaluationIFR instant failure rateIQA internal quality auditIFIR instant failure incident ratePCR process change requestHW hardwareIPO internal purchase officeN/A No ActionIE industrial engineeringESD electrostatic dischargeQPA quality process auditEOL end of lifeQSA quality system auditEN engineering noticeATE automatic test equipmentEMI electromagnetic interferenceAOI automatic optical inspectionEMC electromagnetic compatibilityPCBA print circuit board assemblyEE electronic engineer(ing)TTL technology transfer listEDC electronic data centerSQA supplier quality assuranceECO engineering change orderORT ongoing reliability testingDVT design verification testQM quality manualDOA dead on arrivalSW softwareCAD/ID computer aided design /industrial designSOW standard of workBIOS basic input /output systemSCSI small computer system interfaceAP application programSA software applicationAFR annual failure rateSO sales orderNTF no trouble foundMRP material requirement planningCND can not duplicateAVL approved vendor listDPPM defect parts per millionFAI first article inspectionFMEA failure mode effect analysisCLCA closed loop corrective actionLRR line reject rate measured by DPPMMQR monthly quality reviewMTQ manufacturing ,test and qualityRCA root cause analysisPFMEA process failure mode effect analysisSFIS Shop Floor Information SystemQEM Quality engineering measurementBGA Ball Grid ArrayIC Integrated CircuitQFP Quad Flat PackEOS Elwctrical Over StressTNB terminal notebook businessSMT Surface Mount Technology品质人员名称类QC quality control 品质管理人员FQC final quality control 终点品质管制人员IPQC in process quality control 制程中的品质管制人员OQC output quality control 最终出货品质管制人员IQC incoming quality control 进料品质管制人员TQC total quality control 全面质量管理POC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员QE quality engineering 品质工程人员品质保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认CP capability index 能力指数CPK capability process index 模具制程能力参数SSQA standardized supplier quality audit 合格供应商品质评估FMEA failure model effectiveness analysis 失效模式分析FQC运作类AQL Acceptable Quality Level 运作类允收品质水准S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的Q/R/S Quality/Reliability/Service 品质/可靠度/服务P/N Part Number 料号L/N Lot Number 批号AOD Accept On Deviation 特采UAI Use As It 特采FPIR First Piece Inspection Report 首件检查报告PPM Percent Per Million 百万分之一制程统计品管专类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计品质管制GRR Gauge Reproductiveness & Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸DIA Diameter 直径N Number 样品数其它品质术语类QIT Quality Improvement Team 品质改善小组ZD Zero Defect 零缺点QI Quality Improvement 品质改善QP Quality Policy 目标方针TQM Total Quality Management 全面品质管理RMA Return Material Audit 退料认可7QCTools 7 Quality Control Tools 品管七大手法通用之件类ECN Engineering Change Notice 工程变更通知(供应商)ECO Engineering Change Order 工程改动要求(客户)PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Standard Inspection Procedure 制程检验标准程序SOP Standard Operation Procedure 制造作业规范IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification 包装规范SPEC Specification 规格DWG Drawing 图面系统文件类ES Engineering Standard 工程标准CGOO China General PCE龙华厂文件IWS International Workman Standard 工艺标准ISO International Standard Organization 国际标准化组织GS General Specification 一般规格部类PMC Production & Material Control 生产和物料控制PCC Product control center 生产管制中心PPC Production Plan Control 生产计划控制MC Material Control 物料控制DC Document Center 资料中心QE Quality Engineering 品质工程(部)QA Quality Assurance 品质保证(处)QC Quality Control 品质管制(课)PD Product Department 生产部LAB Laboratory 实验室IE Industrial Engineering 工业工程R&D Research & Design 设计开发部生产类PCs Pieces 个(根,块等)PRS Pairs 双(对等)CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单MO Manufacture Order 生产单D/C Date Code 生产日期码ID/C Identification Code (供应商)识别码SWR Special Work Request 特殊工作需求L/N Lot Number 批号P/N Part Number 料号OEM Original Equipment Manufacture 原设备制造PC Personal Computer 个人电脑CPU Central Processing Unit 中央处理器A.S.A.P As Soon As Possible 尽可能快的E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用QTY Quantity 数量I/O input/output 输入/输出NG Not Good 不行,不合格C=0 Critical=0 极严重不允许APP Approve 核准,认可,承认CHK Check 确认ASS'Y Assembly 装配,组装T/P True Position 真位度5WIH When, Where, Who, What, Why, How to6M Man, Machine, Material, Method, Measurement, Message4MTH Man, Material, Money, Method, Time, How 人力,物力,财务,技术,时间(资源) SQA Strategy Quality Assurance 策略品质保证DQA Design Quality Assurance 设计品质保证MQA Manufacture Quality Assurance 制造品质保证SSQA Sales and service Quality Assurance 销售及服务品质保证LRR Lot Reject Rate 批退率SPS Switching power supply 电源箱DT Desk Top 卧式(机箱)MT Mini-Tower 立式(机箱)DVD Digital Video DiskVCD Video Compact DiskLCD Liquid Crystal DisplayCAD Computer Aided DesignCAM Computer Aided ManufacturingCAE Computer Aided EngineeringPCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告NG Not Good 不良WDR Weekly Delivery Requirement 周出货要求PPM Percent Per Million 百万分之一TPM Total Production Maintenance 全面生产保养MRP Material Requirement Planning 物料需计划OS Operation System 作业系统TBA To Be Assured 待定。
电子厂常用英语
一、常用术语PDCA Plan Do Check Action 计划执行检查总结面SMT Surface mounting technology表面贴装技术SMD Surface mounting device 表面贴装设备SMC Surface mounting components 表贴装元件MIMA manual insert 手工插件machine assembly 机器组装Screen printer 电子印刷机Reflow 回流焊Pilot run 试生产Oven 烤箱，烤炉Solder 焊接Solder wetting 焊剂润湿Profile 剖面外形轮廓Chain 链条Chain conveyor 链条传送Solder iron 烙铁Flux 助焊剂3CComputer 电脑类产品Consumer electronics 消费性电子产品Communication 通讯类产品FOUR CONTROL SYSTEM 四大管制系统Engineering control system 工程管制系统Quality control system 品质管制系统Manufacturing control system 生产管制系统Management control system 经营管制系统7SClassification 整理（sorting, organization）-seiriRegulation 整顿（arrangement, tidiness）-seitonCleanliness 清扫（sweeping, purity）-seisoConservation 清洁（cleaning, cleanliness）-seiktsuCulture 教养（discipline）-shitsukeSafety 安全二、英文缩写品质人员名称类QC quality control 品质管理人员FQC final quality control 终点品质管制人员IPQC in process quality control 制程中的品质管制人员OQC output quality control 最终出货品质管制人员IQC incoming quality control 进料品质管制人员TQC total quality control 全面质量管理QA quality assurance 质量保证人员OQA output quality control 出货质量保证人员QE quality engineering品质工程人员品质保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认SSQA standardized supplier quality audit 合格供应商品质评估FQC运作类AQL Acceptable Quality Level 允收品质水准ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的P/N Part Number 料号L/N Lot Number 批号UAI Use As It 特采FPIR First Piece Inspection Report 首件检查报告DPPM Defective Percent Per Million 百万分之缺陷制程统计品管类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计品质管制DIM Dimension 尺寸DIA Diameter 直径其它品质术语类ZD Zero Defect 零缺陷QP Quality Policy 品质方针TQM Total Quality Management 全面品质管理RMA Return Material Audit 退货认可7QCTools 7 Quality Control Tools 品管七大手法ECN Engineering Change Notice 工程变更通知（供应商）ECO Engineering Change Order 工程改动要求（客户）PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Standard Inspection Procedure 制程检验标准程序SOP Standard Operation Procedure 制造作业规范BOM Bill of Material 物料清单SPEC Specification 规格DWG Drawing 图面系统文件类ISO International Standard Organization 国际标准化组织部类QE Quality Engineering 品质工程QA Quality Assurance 品质保证LAB Laboratory 实验室IE Industrial Engineering 工业工程R&D Research&Design 设计开发部生产类PCs Pieces 个（根、块等）CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单M OＭａｎｕｆａｃｔｕｒｅＯｒｄｅｒ生产单D/C Date Code 生产日期码ID/C Identification Order（供应商）识别码L/N Lot Number 批号P/N Part Number 料号OEM Original Equipment Manufacture 原设备制造QTY Quantity 数量NG Not Good 不行，不合格C=0 Critical=0 极严重不允许APP Approve 核准，认可，承认CHK Check 确认ASSY Assembly 装配，组装LRR Lot Reject Rate 批退率PCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告TBA To Be Assured 待定，定缺A VL Approved Vendor List 许可供应商清单EOL End of Life三、专业词汇组装类Assembly line 组装线Layout 布置图Conveyor 流水线运输带Screw driver 起子Electric screw driver 电动起子Automation 自动化Conveying belt 输送带。
SMT换线指导文件：Profiling guideline in line changeover
But there’s no abnormal defect was found in first PCBA and other PCBA which has been processed, don’t need stop line, and then PE will continue to monitor the process performance and set the profile to specification when production is stop for normal break. But if there’s abnormal defects are found, refer to item 4.7.2.
4.6PE必须在产品转换完成后的1到2个小时内进行对炉子的实际温度进行检验,并打印出温度曲线图.
4.7If it’s found that the profile is out of specification after PE verifies the profile, PE will act as below guideline:
4.4MBU检查设备参数是否与WI一致,并根据相关文件做好记录.如果不一致时,立刻通知PE. PE必须根据WI的规格进行更改它。
DF11系列双行2mm密度接线器说明书
DF11-12DS-2C DF11-2428SCA DF11-6DS-2C DF11-4DS-2C DF11CZ-10DP-2V(27)B2202mm Double-Row Connector (Product Compliant to UL/CSA Standard)DF11 Series■Features1. Space-saving on Board RealizedDouble rows of 2mm pitch contact has been condensed within the 5mm width.The multiple number of signals can be secured in the same space as the conventional 2mm single-row contact.2. Broad VariationThe insulation displacement and crimping methods are prepared for connection. Thus, board to cable, in-line,board to board connectors are provided in order to widen a board design variation.In addition, "Gold" or "Tin" can be selected for the plating according application, while the SMT products line up.3. Applicable Wire Covers Wide RangeAccording to the double rows of 2mm pitch compact design, the applicable wire can cover AWG22 to 30.4. The ID Type Connector Achieves Connection Work.Using the full automatic insulation displacement machine,the complicated multi-harness can be easily connected,reducing the man-hour and eliminating the manual work process.■ApplicationsBusiness equipments such as copy machine, printer and so on.Rib to prevent contact mis-insertion as well asdisimilar contact mis-insertion4 wall box styleO c t .1.2018 C o p y r i g h t 2018 H I R O S E E L E C T R I C C O ., L T D . A l l R i g h t s R e s e r v e d .B221DF11 Series ●2mm Double-Row Connector (Product Compliant to UL/CSA Standard)■Product Specifications■UL ·CSA Safety Standard File No.UL :E52653CSA :LR95109Note 1: Current rating of header is 2A.Note 2: Includes temperature rise caused by current flow.Note 3: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range andHumidity range covers non conducting condition of installed connectors in storage, shipment or during transportation.Note 4: Information contained in this catalog represents general requirements for this Series. Contact us for the drawings and specifications fora specific part number shown.■Features of DF11 Insulation Displacement Machine(Single Core Punching Full Automatic ID Machine AM700/DF11)● 5 Major Features of ID Machine AM700/DF111. Perform the multi-harness.2. The setup time has been widely reduced. (10 minutes maximum)3. Space saving design.(About half space compared with the conventional machine)4. Minimize initial cost with low cost.5. The harness data can be saved in the floppy disk and easily changed.■PointsSince the DF11 insulation displacemention allows double rows ID with a single part, the harness service is completed with machine connection only.Data storageLow cost Multi-harness Half spaceSetup i n 10 mi n utesO c t .1.2018 C o p y r i g h t 2018 H I R O S E E L E C T R I C C O ., L T D . A l l R i g h t s R e s e r v e d .B222DF11 Series ●2mm Double-Row Connector (Product Compliant to UL/CSA Standard)■MaterialDF11- *DS - 2Cqewr tq Series Name : DF11w Number of Contacts : 4to 32e Connector TypeDS : Double Row socket DP : Double Row pin header DEP: Double Row in-line plug r Contact Pitch: 2mm t Connection Form/Contact Style C: Crimping socketR26: Insulation Displacemented socket for AWG26DSA: Straight through hole DS : Right angle through hole V : Straight SMT A: Adaptor■Ordering Information●ConnectorDF11 - EP2428PCFAqrewq Contact Type Blank : For socket EP : For in-line plug w Applicable Wire Size 22: AWG222428: AWG24to 2830: AWG30e Contact Type/Packaging Type SCF : Socket contact, Embossed tape SC : Socket contact, BagPCF : Plug contact, Embossed tape PC : Plug contact, Bag r Plating TypeBlank : Tin plated A: Gold plated●ContactO c t .1.2018 C o p y r i g h t 2018 H I R O S E E L E C T R I C C O ., L T D . A l l R i g h t s R e s e r v e d .B223DF11 Series ●2mm Double-Row Connector (Product Compliant to UL/CSA Standard)[Specific No.]–* *, (* *)(05):Tin plated, 100 pcs. per bag (25):Tin plated, Tube packagingPhoto: Cable connection status■ID SocketNote1: The specific No. (05) item is delivered per bag unit (100 pcs.). Please order products per bag unit.Note2: To use the full automatic insulation displacement machine to punch the DF11 single contact, the (25) tube packaging specificationshould be applied.Note3: Please order the tube packaging products by multiplying the packaging quantity ( pcs.).■Applicable CableNote1: Port 1-piece indicates odd number row,and port 2- pcs. indicate even number row.Note2: Use the dip type header as follows.· Straight angle type : DF11-*DP-2DSA (08)· Angle type : DF11-*DP-2DS (24)O c t .1.2018 C o p y r i g h t 2018 H I R O S E E L E C T R I C C O ., L T D . A l l R i g h t s R e s e r v e d .B224DF11 Series ●2mm Double-Row Connector (Product Compliant to UL/CSA Standard)■Crimping Socket■Receptacle (DIP)Photo: Contact insertion status●Board Through-hole Diameter: Ø0.80+0.1●Kink Prefixed Effective Diameter: Ø0.80+0.05[Specific No.] –* *, (* *)(05) :Tin plated 100 pcs. per pack (06) :Gold plated 100 pcs. per pac k[Specific No.] –* *, (* *)Blank :100 pcs. per packO c t .1.2018 C o p y r i g h t 2018 H I R O S E E L E C T R I C C O ., L T D . A l l R i g h t s R e s e r v e d .B225DF11 Series ●2mm Double-Row Connector (Product Compliant to UL/CSA Standard)■Receptacle (SMT)Note2: The 40 contacts connector is marchandized only in combination with the SMT product.Note3: Embossed packaging products have the reel wrapped in polyethylene and include a desiccant.B PCB mounting patternNote:If the pattern is included in the shaded area andnot treated with resist, it could touch the connector contact .O c t .1.2018 C o p y r i g h t 2018 H I R O S E E L E C T R I C C O ., L T D . A l l R i g h t s R e s e r v e d .B226DF11 Series ●2mm Double-Row Connector (Product Compliant to UL/CSA Standard)●Board Through-hole Diameter: Ø0.80+0.1Note2: Please order the tube packaging products, by mutiplying a tube quantity( pcs.).●Board Through-hole Diameter: Ø0.80+0.1[Specific No.] –* *, (* *)(01): Gold plated (08): Tin plated (24): Tin plated tube package product[Specific No.] –* *, (* *)(24): Tin plated tube packaging product (52): Gold plated tube packaging product■Straight Pin Header■Right Angle Pin HeaderO c t .1.2018 C o p y r i g h t 2018 H I R O S E E L E C T R I C C O ., L T D . A l l R i g h t s R e s e r v e d .B227DF11 Series ●2mm Double-Row Connector (Product Compliant to UL/CSA Standard)Note2: The 40 contacts connector is merchandized in combination with the SMT product.Note3: Embossed packaging products have the reel wrapped in polyethylene and include a desiccant.B PCB mounting pattern[Specific No.] –* *, (* *)(27):Tin plated embossed tape packaging (57):Gold plated embossed tape packagingNote:If the pattern is included in the shaded area andnot treated with resist, it could contact to the connector contact .■Straight Pin Header (SMT)2P=20.65B 1.52.257.26.21.51.5No.2No.1AAØ0.521.5O c t .1.2018 C o p y r i g h t 2018 H I R O S E E L E C T R I C C O ., L T D . A l l R i g h t s R e s e r v e d .B228DF11 Series ●2mm Double-Row Connector (Product Compliant to UL/CSA Standard)■In-line PlugBIn-line Plug Panel CutoutsNote1: Please use the non-radius side for the panel hooking area.Note2: Applicable panel thicknessing is 1.6 to 1.0mm (A slight deviation will occur for the thickness except for 1.6 and 1.2mm.)Photo: Contact insertion statusNote1: Delivered per bag unit (100 pcs.). Please order products per bag unit.O c t .1.2018 C o p y r i g h t 2018 H I R O S E E L E C T R I C C O ., L T D . A l l R i g h t s R e s e r v e d .B229DF11 Series ●2mm Double-Row Connector (Product Compliant to UL/CSA Standard)■In-line AdaptorBIn-line Adaptor Panel CutoutsNote1: Please use the non-radius surface in the panel hooking area.Note2: Applicable panel thickness is 1.6 to 1.0mm (A slight backlash will occur in the thickness other than 1.6 and 1.2mm.)Note1: Delivered per bag unit (100 pcs.). Please order products per bag unit.O c t .1.2018 C o p y r i g h t 2018 H I R O S E E L E C T R I C C O ., L T D . A l l R i g h t s R e s e r v e d .B230DF11 Series ●2mm Double-Row Connector (Product Compliant to UL/CSA Standard)■Crimping Contact for Socket●Applicable Wire (Tin Plated Annealed Copper Wire)■●Recommended WireUL1061, UL1007 (Note 2.)no respoisibility for any trouble.B Applicable Crimping ToolO c t .1.2018 C o p y r i g h t 2018 H I R O S E E L E C T R I C C O ., L T D . A l l R i g h t s R e s e r v e d .B231DF11 Series ●2mm Double-Row Connector (Product Compliant to UL/CSA Standard)B Application PatternDF11-πDS-2R**(05)DF11-πDS-2R**(05)DF11-πDS-2R**(05)DF11-πDS-2R**(05)DF11#Z-πDP-2VDF11#Z-πDP-2VDF11-πDS-2DSA(05)DF11-πDS-2DSA(05)DF11-πDS-2DSA(05)DF11Z-πDS-2VDF11Z-πDS-2VDF11#Z-*DS-2V DF11#Z-πDP-2VO c t .1.2018 C o p y r i g h t 2018 H I R O S E E L E C T R I C C O ., L T D . A l l R i g h t s R e s e r v e d .B232DF11 Series ●2mm Double-Row Connector (Product Compliant to UL/CSA Standard)EØ1.5+0.1 016±0.12±0.14±0.11.75±0.1C ±0.1B ±0.1A ±0.30.4±0.16.6±0.38.4±0.3E-E Unreeling directionContact NO.1EAA( 5.5 )Ø21±0.8(Ø80)Ø370±2Ø1.5 Lead hole depth(D+6) MAXD +2 02±0.5Ø13±0.2Reel Dimensions( 5)1.5+0.1 01.7+0.15 0R 0.75E-EUnit: mmB Embossed Carrier tape Dimensions●Receptacle (SMT)●Header (SMT)O c t .1.2018 C o p y r i g h t 2018 H I R O S E E L E C T R I C C O ., L T D . A l l R i g h t s R e s e r v e d .B233DF11 Series ●2mm Double-Row Connector (Product Compliant to UL/CSA Standard)B Precautions1. Recommended Temperature Profile (SMT )2. Recommended Manual Soldering Condition (SMT )3. Recommended Screen Thickness (SMT )4. Board Warp age (SMT )5. Recommended Soldering Condition (Through hole)6. Cleaning Condition7. Connection ConditionNote1: UP to 2 cycles of Reflow soldering are possible under the same conditions, provided thatthere is a return to normal temperature between the first and second cycleNote2: The temperature profile indicates the board surface temperature at the point of contactswith the connector terminals.Note3: This reflow profile is for the connectors packaged in embossed tape(reel), with desiccant inthe package.Note4: Reflow temperature for SMT connectors in another package is 240ç, 10 sec.max.Soldering iron temperature: 290±10ç, Soldering time: Within 2 seconds 0.15 to 0.2mm Based on the both connector edges, 0.03mm max. is allowed in the connector center area.Flow: 250ç for 10 secondsManual soldering: 290ç for 2 secondsRefer to the "Nylon Connector Use Hand book".Refer to the "Nylon Connector Use Hand book".180±10100150200250230Time (S)Temperature (ç)60s max10s max100 to 120s165±5100150200240230Time (S)Temperature (ç)60s max10s max90 to 120sO c t .1.2018 C o p y r i g h t 2018 H I R O S E E L E C T R I C C O ., L T D . A l l R i g h t s R e s e r v e d .DF11-12DS-2DSA( 05)DF11-16DS-2DSA(05)DF11-24DP-2DSA(24)DF11-24DS-2C DF11-24DS-2DSA(05)DF11-6DP-2DSA(2 4)DF11CZ-26DP-2V( 27)DF11-12DS-2C DF11-2428SCA DF11-6DS-2C DF11-4DS-2C DF11CZ-10DP-2V(27)。
PCB电路板术语
PCB Jargon (PCB专业术语) AAbsorption 吸收、吸入Accelerated Test（Aging）加速试验、加速老化Accelerator 加速剂、速化剂Accept/Acceptance 允收Acceptable Quality Level（AQL）允收品质水准Accuracy 准确度ACF：Adhesive copper foil 有胶铜箔Activator 活化剂、添加剂比称为ActivatorActive parts（Devices）主动零件，指积体电路或电晶体Addition Agent 添加剂Additive Process 加成法、分全加成、半加成及部份加成Adhesion 附著力Adhesive 胶类或接著剂Aging 老化Air Knife 风刀Ambient Temperature 环境温度Ampere 安培Amp-Hour 安培小时Annular Ring 孔环Anode 阳极Anode Bag 阳极带ANSI: American National Standard Institute 美国标准协会Anti-Forming Agent 消泡剂AOI: Automatic Optical Inspection 自动光学检验Aperture 开口APQP: Advanced Product Quality PlanArray 排列、阵列Artwork 底片ASIC: Application Specific Integrated Circuit 特定用途的积体电路器Aspect Ratio 纵横比、板厚与孔径之比值Assembly 装配、组装ATE: Automatic Testing Equipment 自动电测设备AVL: Approved Vender List 合格供应商BBack Light（Back Lighting）背光法Back-UP 垫板Backpanels/ Backplanes 背板、支持板，厚度较厚，Ball Grid Array（BGA）球脚车列（封装）Barrel 孔壁Base Material 基材Batch 批（同时间发料某一数量的板子）Bevelling 切斜边Binder 黏结剂Black oxide 黑氧化层，另有棕氧化（Brown Oxide）Blind Via Hole 盲导孔Blister 局部性分层或起泡Blockout 封网，网板之空网处以水溶胶涂满Blow Hole 吹孔，PTH孔壁有破洞（void）所造成Boiler (Water Tube Boiler/ Fire Tube Boiler)BOM: Bill of Material 用料表Bond Strength 结合强度Bonding Sheet(Layer) 接合片、接著层，指PP Bonding Wire 结合线，IC之晶片与PCB之引线Bow 板弯Break-away Panel 可断开板或者说Break Away Tab Break Point 出像点、影像点Break-Out 破出（钻孔破出开成断环情形）Bridging 搭桥、桥接Brightener 光泽剂Brush Plating 刷镀BTU/British Thermal Unit 英制热量单位Bump 突块Buried Via Hole 埋导孔Burn-in 高温加速老化试验Burning 烧焦Burr 毛头Buy-off 认可CCAD: Computer Aided Design 电脑辅助设计CAM: Computer Aided Manufacturing 电脑辅助制造CAT: Computer Aided Testing 电脑辅助测试Capacitance 电容Carbide 碳化物、碳化钨钻头CAR: Corrective Action Report 改善报告Carbon Treatment 活性碳处理Card 卡板Carrier 载体Cartridge 滤芯Cathode 阴极CCL: Copper Clad Laminates 铜箔基板Ceramics 陶瓷Certificate 证明书CFC 氟氯碳化物Chloro-Fluoro-CarbonChamfer 倒角、去掉直角Characteristic Impedance 特性阻抗Cheek list 检察清单Chip 晶粒、晶片Chip On Board 晶片黏著板Clean Room 无尘室(Class 100)Cleanliness 清洁度Clearance 余隙、余环COB（Chip on Board）晶片在板上直接组装COC（Certificate of Compliance）出货合格书COF（Chip on Flexible PCB）COG（Chip glass）Coefficient of Thermal Expansion 热膨胀系数（CTE）Cold Solder Joint 冷焊点Component Hole 零件孔Component Side 组件面、零件面Conditioning 整孔Conductivity 导电度Connector 连接器Continuity Test 连通性试验Copper Foil 铜箔、铜皮Copper Ball 铜球Corner Crack 镀通孔转角断角Cp: Capability of Process 制程能力指数Crack 裂痕Crazing 白斑（基板外观上的缺点）Crosstalk 杂讯、串讯Cure/Curing 硬化、热化Current Density （C.D.）电流密度（1 ASD=9.1 ASF）Curtain Coating 液涂法DDatum 基准点Deburring 去毛头Defect 不良缺点Degreasing 脱脂Delamination 分层、爆板Dent 凹陷、缓和均匀的下陷Desmearing 除胶渣Developer 显像液Deviation 偏差Device 电子元件Dewetting 缩锡DFM: Design for Manufacturing/Dirty foreign Materials 异物、杂质Die 冲模Dielectric 介质Dielectric Constant 介质常数Dimensional Stability 尺度安定性DIP（Dual Inline Package）双排脚封装体Direct Plating 直接电镀DI Water 纯水(De-Ionize Water)DOE/Design of Experiment 实验计划法DPPM（Defect Parts Per Million）Drilling 钻孔Drill Bit 钻针Dry Film 干膜Dummy 假镀EECN: Engineering Change Notice 工程变更通知Elongation 延伸性EMI 电磁干扰Electromagnetic InterferenceENIG: Electroless Nickel Immersion Gold 化镍浸金Entek 有机护铜处理Entry Material 盖板E.T/Electric Test 电测、电气测试Epoxy Resin 环氧树脂ESD: Electro-Static Discharge 静电流量Etching 蚀刻Etchback 加蚀Etch Factor 蚀刻函数Etching Resist 抗蚀阻剂Expose Copper 漏铜Exposure 曝光Eyelet 铆钉RivetFFAAR（First Article Approval Report）Failure 故障、损坏Fault 缺陷、瑕疵FCC/Federal Communication Commission 美国联邦通讯委员会Fiber Exposure 玻织显露Fiducial Mark 基准记号、光学点Film 底片Filter 过滤器Fine Line 细线Finger 手指Finishing 制成品在外观上的最后处理First Article 试产的首件或首批小量产品First Pass-Yield 初检良品率Fixture 夹具、治具(Rig and Fixture)Flame Resistant 耐燃性（分HB、VO、V1及V2等四级）Flux 助焊剂Foil Burr 铜箔毛边Foot Pint（Land Pattern）脚垫Foreign Material 外来物、异物FR4/Flame Resistant Laminates 耐燃性积层板材Frequency 频率GGauge 量规Gel Time 胶化时间Gerber Data/Gerber File 格搏档案Glass Fiber 玻璃纤维Glass Fiber Protrusion 玻纤突出Glass Transition Temperature/Tg 玻璃态转化温度Golden Board 测试用标准板Grid 标准格Ground Plane 接地层Guide Pin 导针HHaloing 白圈、白边（在钻孔、开槽等机械动作一旦过猛时将造成内部树脂之破碎或微小分层裂开的现象）Hardener 硬化剂Hardness 硬度Heat Dissipation 散热Hertz（Hz）赫芝HEPA/High Efficiency Particulate Air Filter 高效空气尘粒过滤机Hipot Test 高压电测High Potential Test Hit 擎Holding Time 停区时间Hole Block 孔塞Hole Breakout 孔位破出，简称BreakoutHole counter 数孔机Hole Density 孔数密度Hole Pull Strength 孔壁强度Hole Void 破洞Hot Air Levelling 喷锡HASL/HALTHE(High Temperature Elongation) 高温延伸性II.C.Socket 积体电路插座Image Transfer 影像转移IMC: Inter-metallic compound 介面合金共化物Immersion Plating 浸镀Impedance 阻抗In-Circuit Testing 组装板电测，ICTIndexing Hole 基准孔Infrared(IR) 红外线Ink 油墨Inner Layer 内层Input/Output 输入、输出Insert/Insertion 插接、插装Insulation Resistance 绝缘电阻Integrated Circuit (IC) 积体电路器Interconnection互连Intermatallic Compound(IMC) 介面合金共化物Internal Stress 内应力Ion Cleanliness 离子清洁度Ionic Contamination 离子污染IPC: The Institute for Interconnecting and Packaging Electronic Circuits 美国印刷电路板协会ISO: International Organization for Standardization 国际标准组织Isolation 隔离性JJPCA/Japan Print Circuit Association 日本印刷电路工业会Just-In-Time(JIT) 适时供应KKeyboard 键盘Kraft Paper 牛皮纸LLaminate(s) 基板、积层板Laminator 压膜机Land 孔环焊垫、独立点Landless Hole 无环通孔Laser Direct Imaging/LDI 雷射直接成像Laser Photoplotter 雷射曝光机、绘图机Lay Out 布线、布局(configuration, general arrangement)Lay Up 叠合Lead Frame 脚架Lead 引脚、接脚Legend 文字标记Levelling 整平Light Intensity 光强度LMW: License Manufacturing Warehouse 保税厂Lot Size 批量LRR(Lot Reject Rate)MMajor Defect 严重缺点、主要缺点Marking 标记Mask 阻剂Mass Lamination 大型压板MCM/Multi-Chip Module 多晶片模组Measling 白点Membrane Switch 薄膜开关Microctching 微蚀Microsectioning 微切片法Migration迁移Mil 英丝0.001 inmisregistration 对不准、对不准度MLB/Multi-Layer Board 多层板Modem 调变及解调器、数据机Modification 修改、改变Module 模组Mother Board 主机板NNail Head 钉头N.C.数值控制（Numerical Control）Negative 负片Negative etch-back 反回蚀Nick 缺口Node 节点Nodule 瘤Non-Conformance 不合格品Non-flammable 非燃性Non-wetting 不沾锡Normal Distribution 常态分配NPI：New project introduction)NRE Charge-Non-Recurring Engineering Charge 不会重收的工程费用OOhm 欧姆Omega Meter 离子污染检测仪Open Circuits 断线Optical Density 光密度Optical Inspection 光学检验Organic Solderability Preservatives(OSP) 有机保焊剂Outgassing 出气、吹气Output 产出、输出Overflow 溢流Oxidation氧化Ozone Depletion 臭氧层耗损PPackaging 封装、购装Packing 包装Pad 配圈、孔环焊垫Panel Plating 全板镀铜Passive Parts 被动零件，如电阻、电容Past 膏（锡膏Solder Paste）Pattern Plating 线路电镀PCB/Printed Circuit Board 印刷电路板Peel Strength 抗撕强度Peripheral 周边附属设备Phototool 底片（一般指偶氮棕片Diazo Film）Pin Grid Array(PGA) 矩阵式针脚封装Pinhole 针孔Pin 接脚、插梢、插针Pink Ring 粉红圈Pits 凹点（小面积下陷）Pitch 脚距、垫距、线距Plasma 电浆Plated through Hole/PTH 镀通孔Plug 插脚、塞孔Polarization 分极、极化Polyimide(PI) 聚亚酸胺Popcorn Effect 爆米花效应Post Cure 疏孔度试验Power Plane 后续硬化、后烤Power Supply 电源层PPM/Parts Per Million 百万分之几Preheat 预热Prepreg 胶片、树脂片Press Plate 压合钢板Press-Fit Contact 挤入式接触Printing 印刷Probe 探针Profile 轮廓、部面图、升温曲线图积线Punch 横切、冲床QQIT(Quality improvement Team) 品质改善小组Qualified Products List 合格产品（供应者）名单RRadiometer 辐射计、光度计Radius 尺角、半径Reference Dimension 参考尺度、参考尺寸Reflow Soldering 重熔焊接、熔焊Registration 对准度Reject 剔退、拒收Reliability 可靠度、信赖度Repair 修理Resin Content 胶含量、树脂含量Resin Flow 胶流量、树脂流量Resist 阻剂、阻膜Resistor 电阻器、电阻Resolution 解像、解像度、解析度Resolving Power 解析力、解像力（分辨力）Rework(ing) 重工、再加工Ring 套环Roller Cutter 混切机（俗称锯板机）Roller Coating 滚动涂布法Routing 切外型、捞外型RRM: Revolutions per Minute 转速（每分钟）Run-out 偏转、绕转、累积距差SSCAR(Supplier CA Request) 供应商改善报告SCM: Supply chain Management 供应商管理系统Scratch 刮痕Screen Printing 网版印刷Scrubber 磨刷机、磨刷器Selective Plating 选择性电镀SEM/Scanning Electron Microscope 扫瞄式电子显微镜Semi-Conductor 半导体Shearing 剪、裁切Short 短路SIR(Surface Insulation Resistance) 表面绝缘电阻Side Wall 侧壁Sigma(Standard Deviation) 标准差Signal 讯号Silicon 矽Silk Screen 网版印刷、丝网印刷Skin Effect 集肤效应Skip Printing 漏印Slot 槽孔Smear 胶渣SMT/Surface Mount Technology 表面黏装技术Solder 焊锡Solderability 焊锡性Solder Ball 锡球Solder Bridging 锡桥Solder Bump 焊锡凸块Solder Dam 锡堤（IC脚间的防焊）Solder Levelling 喷锡、热风整平Solder Mask(S/M) 绿漆、防焊膜Solder Paste 锡膏Solder Plug 锡塞、锡柱Solder Pot 锡炉Solder Side 焊锡面Soldering Fluid/Soldering Oil 助焊液、护焊汕Solid Content 固体含量SOP(Standard Operation Procedure) 标准作业程序Spacing 间距SPC/Statistical Process Control 统计制程管制Specific Gravity SG比重Specification(Spec) 规范、规格Specimen 样品、试样Spindle 钻轴Spray Coating 喷著涂装Stencil 版膜、网版Storage condition 储存条件Stress Relief 消除应力Substrate 底材Surface Insulation Resistance(SIR) 表面绝缘电阻Surface Tenting 表面张力Surface-Mount Device 表面黏装零件Swelling Agents/Sweller 膨胀剂SWR(Special Working Request) 试产前之“特殊工作要求”TTab 接点、金手指Tape 撕胶带试验Teflon 铁氟龙Temperature Profile 温度曲线Template 模板Tensile Strength 抗拉强度Tenting 盖孔法Terminal 端子Thermal Stress 热应力Thermal Shock 热冲击Thin Copper Foil 薄铜箔Then film Technology 薄膜技术Throwing Power 分布力Tolerance 公差Touch Up 检修（简单的工具在手操作下即可进行的小规范的检修，称之T ouch Up或Rewok 有些类似）Trace 线路、导线Traceability 追溯性、可溯性Transistor 电晶体Transmission Line 传输线Twist 板翘、板扭UUL 保险业试验Underwriters Laboratories/INCUltra Violet Curing(UV Curing) 紫外线硬化Ultrasonic Cleaning 超音波清洗Undercut/Undercutting 侧蚀Universal Tester 万用型电测机VVacuum Lamination 真空压合Vacuum Packing 真空包装Viscosity 黏滞度、黏度Vision Systems 视觉系统Visual Examination(Inspection) 目视检查Voltage 电压WWafer 晶圆Warp/Warpage 板弯Warp and Twist 板弯翘Washer 垫圈Waste Treatment 废弃处理Water Absorption 吸水性Water Break 水膜破散、水破Watermark 水印Wave Soldering 波焊Weave Exposure 织纹显露Weave Texture 织纹隐现Welding 熔接Wet Process 湿式制程Wetting Balance 沾锡、沾湿White Spot 白点Wicking effect 灯芯效应Wire Bonding 打线结合WIP(Working Piece in Process) 在制品XX Axis X轴X-Ray X光YY-Axis Y轴Yield 良品率、良率、产率ZZ-Axis X轴OtherHDI-High Density inter-connect 高密度内连接SWOT Strengths Weaknesses Opportunities ThreatsCD: Compact DiscCPU: Central Process UnitDLD: Direct Laser Drilling (CO2 Laser, YAG Laser)DVD: Digital Versatile DiscEEPROM: Electrically Erasable Programmable Read Only MemoryEMS: Electronics Manufacturing ServiceGPS: Global Positioning ServiceHDD: Hard Disk DriveHDTV: High Density TVLCD: Liquid Crystal DisplayLED: Light Emitting DiodeVCD: Video Compact DiskQuality System Requirements QS-9000(質量體系要求)Advanced Product Quality Planning and Control Plan APQP (產品質量先期策劃和控制計劃) Measurement Systems Analysis MSA(測量系統分析)Potential Failure Mode and Effects Analysis FMEA(潜在失效模式與後果分析)Production Part Approval Process PPAP (生產件批准程序)Statistical Process Control SPC (統計過程控制)IPC-A-600Classification 分级Acceptance Criteria 允收规格Applicable Documents 参考资料Dimensions And Tolerances 尺度与公差Terms And Definitions 术语及定义Workmanship 工艺水准Externally Observable Characteristics 外观特性Board Edges 板边Burrs 看头、毛刺Nonmetallic Burrs 非金属性毛头Metallic Burrs 金属毛头Nicks 缺口Haloing 白边Base Material 基材Weave Exposure 织纹显露Weave Texture 织纹隐现Exposed/Disrupted Fibers 玻织曝露/扰乱Pits and Voids 凹点与凹坑Base Material Subsurface 基材次表面Measling白点Crazing白斑Delamination/Blister分层/起泡Foreign Inclusions外来夹杂物Solder Coatings and Fused Tin Lead喷锡板或熔锡板Nonwetting拒锡（不沾锡）Dewetting缩锡Holes-Plated-Through-General镀通孔概要Nodules/Burrs镀瘤/毛头Pink Ring粉红圈Voids-Copper Plating镀铜层破洞Voids-Finished Coating完工皮膜之镀层破洞Lifted Lands-(Visual)孔环浮离（目检）Holes-Unsupported未镀孔Haloing白圈Printed Contacts板边接触金手指Surface Plating-General表面镀层通则Surface Plating-Wire Bond Pads打线承垫之表面Burrs on Edge-Board Contacts板边接点之毛头Adhesion of Overplate表面镀层之附着力Marking标记Etched Marking蚀刻标记Screened or Ink Stamped Marking纲印或盖印之标记Solder Resist(Solder Mask)防焊绿漆Coverage Over Conductors (Skip Coverage) 边线表面之覆盖性（覆盖不全、跳印）Registration to Holes (All Finishes) 对孔之套准度（各种表处理层）Registration to Other Conductive Patterns 其他防焊的对准性Ball Grid Array (Solder Resist-Defined Lands) 球脚格列体之焊垫（绿漆设限之焊垫）Ball Grid Array (Copper-Defined Lands) 球脚格列体（铜面设限之焊垫）Ball Grid Array (Solder Dam) 球脚格列体（防焊堤）Blisters/Delamination起泡/分层Adhesion(Flaking or Peeling)附著力（破片或剥落）Waves/Wrinkles/Ripples起浪/起皱/纹路Tenting(Via Holes)盖孔（导通孔、过孔）Pattern Definition-Dimensional圆形尺度特性Conductor Width and Spacing线宽与间距Conductor Width线宽Conductor Spacing导线间距External Annular Ring-Measurement孔环测量External Annular Ring-Supported Holes有孔壁支援的外孔环External Annular Ring-Unsupported Holes无孔壁支援的外孔环Flatness平坦度Internally Observable Characteristics可观察到的内在特性Dielectric Materials介质材料Laminate Voids(Outside Thermal Zone)压板空洞（或热区之外）Registration/Conductors to Holes导体与通孔之间的对准度Clearance Hole/Unsupported/to Power/Ground Planes 针对电源层或接地层具隔环之非镀通孔Delamination/Blister分层/起泡Etchback回蚀Negative Etchback反回蚀Smear Removal除胶渣Dielectric Material/Clearance/Metal Plane for Supported Holes 金属层与通孔壁之介质隔距Layer-to-Layer Spacing层与层之间距Resin Recession树脂缩陷Conductive Patterns-General导线概论Etching Characteristics蚀刻特性Print and Etch印后即蚀刻（指正片法）Surface Conductor Thickness(Foil Plus Plating)表导体厚度（铜箔加电镀铜）Foil Thickness-Internal Layers内层箔厚Plated-Through Holes-General镀通孔概论Annular Ring-Internal Layers各内层之孔环Lifted Lands-(Cross-Sections)焊环浮起（切片上所见）Foil Crack-(Internal Foil)“C”Crack内层铜箔之裂纹Foil Crack-(External Foil)镀层破裂Plating Crack-(Barrel)“E”Crack孔壁镀层破裂Plating Crack-(Corner)“F”Crack孔角镀层破裂Plating Nodules镀层长瘤Copper Plating Thickness-Hole Wall孔壁镀铜厚度Plating Voids镀层破洞Solder Coating Thickness (Only When Specified) 焊锡皮膜厚度（当已规定检查者）Solder Resist Thickness绿漆厚度Wicking灯芯效应（指玻织束渗入化学铜）Wicking/Clearance Holes隔离孔之渗铜Innerlayer Separation-Vertical (Axial) Microsection 内层（环）分离-垂直（纵断面）微切片Innerlayer Separation-Horizontal (Transverse) Microsection 内层（环）分离-水平（横断面）微切片Material Fill of Blind and Buried Vias盲孔与埋孔之填充材料钻孔式镀通孔Plated-Through Holes-Drilled钻孔式镀通孔Burrs毛头Nailheading钉头Plated-Through Holes-Punched冲孔式镀通孔Roughness and Nodules粗糙与镀瘤Flare喇叭口Miscellaneous其他离顶Flexible And Rigid-Flex Printed Wiring软性及软硬合板Metal Core Printed Boards金属平心电路板Type Classifications型式分类Spacing Laminated Type间距压合板Insulation Thickness/Insulated Metal Substrate已绝缘金属底材之绝缘厚度Insulation Material Fill/Laminated Type Metal Core压合型金属平心之绝缘填料Cracks in Insulation Material Fill/Laminated Type压合型绝缘填充料之裂纹Core Bond to Plated-Through Hole Wall平心层与镀通孔之间的固著Flush Printed Boards表面全平板Flushness of Surface Conductor表面导线之平坦性Cleanliness Testing清洁度试验Solderability Testing焊锡性试验Plated-Through Holes镀通孔Electrical Integrity电性之完整平行光曝光机：Collimated ExposureCollimated Exposure二次元测量仪two dimension measuring instrument,镀层厚度测试仪Plating Thickness Tester电导率测试仪：Conductometer剥离强度测试仪peel strength TesterROHS检测仪ROHS TesterLCR测试仪LCR Tester喷砂机：sandblasting machine磨板机：Scrubbing立式圆角机Corner rounding Machine开短路测试机short circuit tester碱性蚀刻机：alkalineetchingmachine剪板机: steel plate shearer高温烤箱high-temperature oven飞针测试机：Flying Probe E-Test Machine铣边机edge milling machine超声波清洗机ultrasonic cleanersDES水平线DES level自私，让我们只看见自己却容不下别人。
工厂中SMT制程段生产中常用英文(整理版)
8
二.部門組織類
• PD (Product Department) • Logistical Dept • Purchasing Dept • Cost Management Dept • Material Control Dept • Personnel Dept • Engineering Standard Dept • Quality Assurance Dept • R&D (Research & Design)
深圳根颗电子培训教材
1
一.系統文件類 二.部門組織類 三.生產工站類 四.零件認識類 五.品質管理類
2
一.系統文件類
• ISO (International Standard Organization) 國際標準化組織 • ES (Engineering Standard) 工程標準 • IWS (International Workman Standard)
生產管制計劃
• CAR (Correction Action Report) 改善報告
• TPM (Total Production Maintenance) 全面生產保養
• MRP (Material Requirement Planning) 物料需計劃
• OS (Operation System)
• POP (packing operation procedure) 包裝操作規范
• BOM (Bill Of Material)
物料清單
• PS (Package Specification) 包裝規範
6SMT生产常用英文
GS (General Specification)
一般规格
SIP (Standard Inspection Procedure) 标准检验规范
SOP (Standard Operation Procedure) 制造作业规范
IS (Inspection Specification)
成品检验规范
POP (packing operation procedure) 包装操作规范
功能测试
FCT (Function check Test)
功能测试
SMD (Surface Mounting Device) 贴装设备
BGA Rework Station
BGA维修站
四、零件认识类
MSD (moisture sensitive device) 湿度敏感组件
SMC (Surface Mount Component) 表面贴装组件
互补型金属氧化物半导体
Core
铁芯
CPU: (Central Processing Unit)
中央处理器
DMA: (Direct Memory Access)
直接内存存取
IC: (Integrated Circuit)
集成电路
SPS (Switching power supply) AGP (Accelerated Graphic Port) FDD (Floppy Disk Drive) HDD (Hard Disk Drive) North Bridge South Bridge
6M
Man, Machine, Material, Method,
Measurement, Message
4MTH (Man, Material, Money, Method, Time, How) 人力,物力,财务,技术,时间(资源)
OSP PCB 测试验报告
PCB evaluation
试验Profile设置:
试验板PROFILE（SMT段）
峰值温度： 1------264℃ 2------264.5℃ 150-200 ℃时间： 1------111.5s 2------110.5s 220℃以上时间： 1------73.5s 2------74.5s 说明： 首先用实际生产过程中的PCBA按无铅标准设定炉温， 再用试验PCB在此炉温下测量其炉温曲线.
A面积---回流前的面积 B面积---回流后的面积
1 2 A区 3 1 2 D区 3
清洗 200 0 1 -200 -400 -600 -800 2 A区 3 1 2 D区 3
水洗 30min
水洗 2h
异丙醇清洗 30min 异丙醇清洗 2h
说明： 水和异丙醇清洗后的PCB，两者的裸露时间对回流焊接的润湿扩展性没有
试验板PROFILE（波峰焊 段）
峰值温度： 上表面 1------148.5℃ 2------153℃ 下表面 1------228.5℃ 2------243℃ 锡炉温度： 270℃
PCB evaluation
试验数据采集点：
如下图位置所示:
注： A区 ---- 1mm网板开孔 D区 ---- 第6个圆开孔 其他采集点统称为 “其他图形”
UTStarcom OSP PCB Process Control
MFG-BB
PCB evaluation
目的
了解OSP板特性，并通过试验制定OSP板的控制规程
术语及定义
OSP: Organic Solderability Preservatives 或者 Organic Surface Protectant，中文意思为有机保护剂