thermal sensor 原理
温度计量名词术语
MV_RR_CNG_0283 温度计量名词术语规范1. 温度计量名词术语说明编号JJF1007-1987名称(中文）温度计量名词术语(英文）归口单位起草单位主要起草人凌善康(中国计量科学研究院热工处)李而明(中国计量科学研究院热工处)批准日期实施日期替代规程号适用范围主要技术要求是否分级 否检定周期（年）附录数目无出版单位中国计量出版社检定用标准物质相关技术文件备注2. 温度计量名词术语摘要一一般术语1 热平衡 (Thermal equilibrium)当物休吸收的热量等于放出的热量，物体各部分都具有相同的温度时，物体呈热平衡；或两个以及多个物体之间，通过热量交换，彼此都具有相同的温度时，物体间呈热平衡。
2 温度 (Temperature)温度是描述系统不同自由度之间能量分布状况的基本物理量。
温度是决定一系统是否与其他系统处于热平衡的宏观性质，一切互为热平衡的系统都具有相同的温度。
分子运动论以微观的角度来观察，温度是与大量分子的平均动能相联系，它标志着物体内部分子无规则运动的剧烈程度。
注：温度是七个基本物理量之一。
3 测温学 (Thermometry)研究温度测量的理论和方法。
4 温标 (Temperature scale)温度的数值表示法。
5 经验温标 (Experimental temperature scale)借助于某物质的物理参量与温度变化的关系，用实验方法或经验公式构成的温标。
例：现行的国际实用温标，曾采用过的摄氏温标和华氏温标等。
6 热力学温标 (Thermodynamic temperature scale)以热力学第二定律为基础的温标。
注：根据卡诺定理的推论可知，工作于两个恒定热源之间的一切可逆卡诺热机的效率与工作物质无关，只与两个热源的温度有关。
这样定义的温标称为热力学温标或开尔文温标。
7 热力学温度 (Thermodynamic temperature)按热力学原理所确定的温度。
怎么检测CPU温度
怎么检测CPU温度CPU温度检测方法在哪里?CPU温度检测方法在哪里?下面是店铺为大家介绍检测CPU温度的方法,欢迎大家阅读。
在这里我给大家推荐一个可以测试CPU温度的小软件Core Temp。
它是通过CPU内核中的数字温度传感器来直接记录温度,因此准确率非常高,。
检测CPU温度的方法主板检测CPU温度的问题不要总相信电脑检测的,要相信自己的感觉,你可以用手摸摸CPU风扇,如果不烫手,管他电脑检测的是多少度呢。
因为检测软件也是通过主板BIOS的信息来检测温度的。
而有些主板的温度传感器本身就有问题,所以检测的温度不准,要相信自己的感觉。
不能检测CPU温度你去下载个超级兔子试试,测试CPU的温度没问题的。
你用超级兔子或者优化大师测试下。
没问题的。
软件检测cpu温度的原理是什么以你设定的刷新时间逐条记录温度和CPU频率软件所记录的温度直接取自处理理器内核中的数字温度传感器(DTS,Digital Thermal Sensor), 因此准确率是非常高的,而且它能独立录取双核处理器中各内核的温度数据(免费软件) /down/54462.html 检测CPU温度,什么软件准确?其实都是直接调用主板温度传器的数据来显示,但是术业有专攻,软件在读取数据过程中出现错误和兼容性问题也难免,相比鲁大娘来说EVEREST要专业得多,再如楼上兄弟所言,21度的cpu可能是几年合的发展方向吧,水冷可能达到这个效果。
呵呵。
希望对你有帮助。
BIOS检测CPU温度不正常应该是你的主板读取高一级的CPU有问题,建议去微星主板的官方网站下载最新的主板BIOS刷新即可。
你新买的主板完全可以去官方网站注册,一般现在的新主板都可以在线刷新BIOS的,按照官方的说明去做,而且保修期内是应该可以免费更换的,问客服了解下吧。
谁推荐个检测CPU温度的软件啊,优化大师除外。
CPU 温度:正常情况下45-65℃或更低, 高于75-80℃则要检查CPU和风扇间的散热硅脂是否失效、更换CPU风扇或给风扇除尘,部分CPU会自我保护,温度过高会自动降频(一般为标准频率的一半)。
OMEGA 热成像传感器用户指南说明书
OSXL-A5SC-A15SC-A35SCThermal Imager Sensore-mail:**************For latest product manuals:Shop online at ®User’s GuideIt is the policy of OMEGA Engineering, Inc. to comply with all worldwide safety and EMC/EMI regulations that apply. OMEGA is constantly pursuing certification of itsproducts to the European New Approach Directives. OMEGA will add the CE mark to every appropriate device upon certification.WARRANTY/DISCLAIMEROMEGA ENGINEERING, INC. warrants this unit to be free of defects in materials and workmanship for a period of 13 months from date of purchase. OMEGA’s WARRANTY adds an additional one (1) month grace period to the normal one (1) year product warranty to cover handling and shipping time. This ensures that OMEGA’s customers receive maximum coverage on each product.If the unit malfunctions, it must be returned to the factory for evaluation. OMEGA’s Customer Service Department will issue an Authorized Return (AR) number immediately upon phone or written request. Upon examination by OMEGA, if the unit is found to be defective, it will be repaired or replaced at no charge. OMEGA’s WARRANTY does not apply to defects resulting from any action of the purchaser, including but not limited to mishandling, improper interfacing, operation outside of design limits, improper repair, or unauthorized modification. This WARRANTY is VOID if the unit shows evidence of having been tampered with or shows evidence of having been damaged as a result of excessive corrosion; or current,heat, moisture or vibration; improper specification; misapplication; misuse or other operating conditions outside of OMEGA’s ponents in which wear is not warranted, include but are not limited to contact points, fuses, and triacs.OMEGA is pleased to offer suggestions on the use of its various products. However, OMEGA neither assumes responsibility for any omissions or errors nor assumes liability for any damages that result from the use of its products in accordance with information provided by OMEGA, either verbal or written. OMEGA warrants only that the parts manufactured by the company will be as specified and free of defects. OMEGA MAKES NO OTHER WARRANTIES OR REPRESENTATIONS OF ANY KIND WHATSOEVER, EXPRESSED OR IMPLIED, EXCEPT THAT OF TITLE, AND ALL IMPLIED WARRANTIES INCLUDING ANY WARRANTY OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE HEREBY DISCLAIMED. LIMITATION OF LIABILITY : The remedies of purchaser set forth herein are exclusive, and the total liability of OMEGA with respect to this order, whether based on contract, warranty, negligence,indemnification, strict liability or otherwise, shall not exceed the purchase price of the component upon which liability is based. In no event shall OMEGA be liable for consequential, incidental or special damages.CONDITIONS: Equipment sold by OMEGA is not intended to be used, nor shall it be used: (1) as a “Basic Component” under 10 CFR 21 (NRC),used in or with any nuclear installation or activity; or (2) in medical applications or used on humans. Should any Product(s) be used in or with any nuclear installation or activity, medical application, used on humans, or misused in any way, OMEGA assumes no responsibility as set forth in our basic WARRANTY/ DISCLAIMER language, and, additionally, purchaser will indemnify OMEGA and hold OMEGA harmless from any liability or damage whatsoever arising out of the use of the Product(s) in such a manner.Servicing North America:U.S.A.:Omega Engineering, Inc., One Omega Drive, P .O. Box 4047ISO 9001 CertifiedStamford, CT 06907-0047Toll-Free: 1-800-826-6342Tel: (203) 359-1660FAX: (203) 359-7700e-mail:**************Canada:976 BergarLaval (Quebec), H7L 5A1, Canada Toll-Free: 1-800-826-6342TEL: (514) 856-6928FAX: (514) 856-6886e-mail:*************For immediate technical or application assistance:U.S.A. and Canada:Sales Service: 1-800-826-6342/1-800-TC-OMEGA Customer Service: 1-800-622-2378/1-800-622-BESTEngineering Service: 1-800-872-9436/1-800-USA-WHEN Mexico/TEL: 001 (203) 359-1660FAX: 001 (203) 359-7700Latin America e-mail:*****************Servicing Asia:China:1698 Yi Shan Road, Unit 102Min Hang DistrictShanghai, China 201103 P .R.C.Hotline: 800 819 0559/400619 0559e-mail:*************.comServicing Europe:Benelux:Toll-Free: 0800 099 3344TEL: +31 20 347 21 21FAX: +31 20 643 46 43e-mail:*****************Czech Republic:Frystatska 184733 01 Karviná, Czech Republic TEL: +420-59-6311899FAX: +420-59-6311114 *****************France:Toll-Free: 0805 541 038TEL: 01 57 32 48 17FAX: 01 57 32 48 18e-mail:***************Germany/Daimlerstrasse 26,Austria:D-75392 Deckenpfronn, Germany Toll-Free************TEL: +49 (0) 7056 9398-0FAX: +49 (0) 7056 9398-29e-mail:*************United Kingdom:OMEGA Engineering Ltd.ISO 9001 CertifiedOne Omega Drive,River Bend Technology Centre Northbank IrlamManchester M44 5BD United Kingdom Toll-Free: 0800-488-488TEL: +44 (0) 161 777-6611FAX: +44 (0) 161 777-6622e-mail:**************.ukRETURN REQUESTS /INQUIRIESDirect all warranty and repair requests/inquiries to the OMEGA Customer Service Department. BEFORE RETURNING ANY PRODUCT(S) TO OMEGA, PURCHASER MUST OBTAIN AN AUTHORIZED RETURN (AR) NUMBER FROM OMEGA’S CUSTOMER SERVICE DEPARTMENT (IN ORDER TO AVOID PROCESSING DELAYS). The assigned AR number should then be marked on the outside of the return package and on any correspondence.The purchaser is responsible for shipping charges, freight, insurance and proper packaging to prevent breakage in transit.FOR WARRANTY RETURNS, please have the following information available BEFORE contacting OMEGA:1.Purchase Order number under which the product was PURCHASED,2.Model and serial number of the product under warranty, and3.Repair instructions and/or specific problems relative to the product.FOR NON-WARRANTY REPAIRS,consult OMEGA for current repair charges. Have the following information available BEFORE contacting OMEGA:1. Purchase Order number to cover the COST of the repair,2.Model and serial number of the product, and3.Repair instructions and/or specific problems relative to the product.OMEGA’s policy is to make running changes, not model changes, whenever an improvement is possible. This affords our customers the latest in technology and engineering. OMEGA is a registered trademark of OMEGA ENGINEERING, INC.© Copyright 2012 OMEGA ENGINEERING, INC. All rights reserved. This document may not be copied, photocopied, reproduced, translated, or reduced to any electronic medium or machine-readable form, in whole or in part, without the prior written consent of OMEGA ENGINEERING, INC.FLIR Ax/Ax5 seriesThe new standard in thermal machine vision camerasThe FLIR Ax/Ax5 series cameras have features and The FLIR Ax/Ax5 series cameras have features and functions that make them the natural choice for anyone who uses PC software to solve problems. Available resolutions include 80 × 64, 160 × 128, and 320 × 256 pixels.Among their main features are GigE Vision and GenICam compliance, which makes them plug-and-play when used with software packages such as IMAQ Vision and Halcon.Key features:Very affordable• Compact (40 × 43 × 106 mm/1.57 × 1.69 × 4.17 in.)• GigE Vision and GenICam compliant • GigE Vision lockable connector • PoE (power over Ethernet)• 8-bit monochrome image streaming • 14-bit radiometric image streaming • High frame rates (60 Hz)• Synchronization between cameras possible • 1x+1x GPIO• Compliant with any software that supports GenICam, • including National Instruments IMAQ Vision, Stem-mers Common Vision Blox, and COGNEX Vision Pro Lenses: 5°, 9°, 13°, 19°, and 25° (model-dependent)• Typical applications:Automation, thermal machine vision • Entry-level “high-speed” R&D • http://www.fl http://support.flP /N : T 559792-A。
质量流量计介绍MFC Principle
A basic course
By Phil Tan IPQE AESZ
What’s MFC? MFC是什么？ 是什么？ 是什么
Mass Flow Controllers (MFCs) are used wherever accurate measurement and control of a mass flow of gas is required independent of flow pressure change and temperature change in a given range. 质量流量控制器可以在指定范围内准确的 测量和控制气体的质量流量，其性能不受气体 压力和温度变化的影响。
Control Principles 控制原理
The PCB compares the signal to the desire set point, the difference is used to drive the control valve, which will proportional open or close until the signal is equal to the set point. PCB板将会比较传感器的测量信号和用户 输入的设定信号，其差值将产生信号驱动比例 控制阀，直到传感器信号和设定信号相等为止。
Sensor Structure 传感器的构造
Resistance 电阻丝 Capillary Tube 毛细管
The resistance of upstream and downstream must be equal and well-proportioned. It’s critical to the sensor performance. 上游和下游两段电阻的阻值必须尽量相等并且呈现均 匀的分布，这是传感器性能的关键所在。
达华DH-TPC-BF5421-T热成像网络弹簧相机说明书
Thermal | DH-TPC-BF5421-T*Thermal Camera•400 x 300 VOx Uncooled Thermal Sensor Technology•Athermalized Lens, Focus-free•13 mm Fixed Thermal Lens•≤ 40 mK Thermal SensitivityVisible-light Camera•1/2.8-in. 2MP Progressive-scan CMOS Sensor•8 mm Fixed Lens•Maximum IR Distance 35 m (114 t)System Features•Active Alarm•Support ROI, Motion Detection, and Color Palettes•Enhanced Power and Data Transmission Distances(ePoE)•IP67 Ingress ProtectionSystem OverviewThe Hybrid Thermal Network camera combines an uncooled VOx400 x 300 thermal imager with a 2MP visible-light sensor forcost-effective, long-range security in a rugged all-in-one package. The thermal imager coupled with an athermalized, focus-free lens produces crisp images in total darkness and sees through rain, fog, and snow. The visible imager with an IR illuminator delivers superior video in any lighting condition.FunctionsUncooled Vanadium Oxide (VOx) TechnologyDahua thermal cameras use an uncooled Vanadium Oxide (VOx) sensor that delivers higher thermal sensitivity in a more compact and cost-effective package. Vanadium Oxide cameras are also more reliable, as compared to other thermal imaging technologies, due to less moving parts.Athermalized LensThe athermalized lens used in Dahua thermal cameras maintains the focus position passively and without power over a wide temperature range.High Thermal SensitivityThe VOx detector offers high thermal sensitivity (≤ 50 mK) that allows Dahua thermal cameras to distinguish objects in a scene with minimal temperature differences. The camera captures detailed images wherethermal contrast between object and background is minimal.Active AlarmThe camera is equipped with a white-light illuminator and an external speaker that can be triggered when the camera detects an abnormal event either via the thermal or the visible-light sensor. The camera also takes a snapshot of the scene and can record the snapshot.Enhanced Power over Ethernet (ePoE) TechnologyDahua's innovative ePoE technology offers a plug-and-play solution to transmit power and data over long distances via Ethernet or coaxial cables, reducing installation time and saving money. ePoE technologyis a viable, cost-effective solution for extending transmission distances and for converting existing, coax-based analog systems into IP systems. For video security and security installers, ePoE technology saves time and money by reducing overall cabling requirements, allowing for existing coax cable to be used, and minimizing the number of peripheral devices needed. For new installations, ePoE offers the ability to design long-distance applications without the need for additional repeaters. Thermal Color PalettesDahua thermal cameras provide a choice of color palettes onboard the camera that help to distinguish thermal variations and patterns in an image. The color tones correspond to the apparent surface temperatures of the target.CybersecurityDahua network cameras are equipped with a series of key cybersecurity technologies including: security authentication and authorization, access control, trusted protection, encrypted transmission, and encrypted storage. These technologies improve the camera’s ability to prevent malicious access and to protect data.EnvironmentalWith a temperature range of 10° C to +35° C (50° F to +95° F), the camera is suitable for many internal applications. Subjected to rigorous dust and water immersion tests and certified to the IP67 Ingress Protection rating makes it suitable for applications were water and dust are present.ProtectionThe camera allows for ±20% input voltage tolerance, suitable for the most unstable conditions for outdoor applications. Its 6 KV lightning rating provides effective protection for both the camera and its structure against lightningRev 001.008© 2021 Dahua Technology USA. All rights reserved. Design and specifications are subject to change without notice.PFA121Junction BoxPFA152-E Pole MountPFA151Corner Mount DH-PFM320D-US 12 VDC, 2 A Power Adapter DH-PFM321D-US 12 VDC, 1 A Power AdapterDH-PFB120C Ceiling Mount BracketDH-PFB129W Wall/Ceiling MountBracket。
T60主板电路原理图
8~14
DMI x4
Intel ICH7-M
USB 2.0 (2+2+2+2) LAN Connect I/F (LCI) AC97 2.3/Azalia Interface
Ultra ATA/100/66/33 Serial ATA 150MB/s
ACPI 2.0 LPC I/F PCI Rev 2.3 PCI Express INT. RTC
TMDS
TI PCI4512
Cardbus + IEEE1394
45,46
Power Switch TPS2211A R5538 48
PCMCIA I/F
56
PCMCIA SLOT + USB-based NEW Card
47
USB 2.0 CH2 PCI Express
Mini-PCI SIM Card 54
10
9
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4
3
2
1
Nev 15 '05
H
Keyboard Light
Clock Generator CK-410M 19
Intel Yonah NV/LV/ULV Processor 3,4,5
Thermal Sensor LM26 5
AGTL+ FSB
533/667MHz
RP-1 Block Diagram
Serial ATA I/F
67
SATA CONN
Port 0
E
34
HP OUT
OP AMP
MAX9750
42,43
Int. MIC
上海谷田自动化仪表 热电偶 热电阻 一体化温度变送器 说明书
概述General是一家专业制造温度传感器和变送器的工厂，是中国工业温度检测仪表的主要供应商之一，我们拥有完整的机械加工和电子产品生产设备，它已经成为了工业温度测量领域的领跑者之一。
我们的温度仪表精度高，可靠性好且价格经济，同时我们根据客户的需要提供非标准件产品的定制服务和所有需要的附件。
我们设立了I级检定标准的温度校验室，拥有行业内最高端的检测设备，且通过了国家计量院和上海计量院权威部门的检定认证。
在上海工厂成立了自己的研发中心，与高校、科研所建立了技术合作伙伴关系，聘请多位著名专家指导监督生产，针对任何特殊的测量需要，各种机械结构的传感器、热套管、外壳能够确保仪表即使在恶劣的环境中（如防爆场合、化工厂、发电厂）也能保持最好的性能，从单个的测量点到数百个乃至1000个测量点的大型工厂，都能为客户提供最快速，最优化的解决方案，将用我们在这一领域的丰富经验为您提供最优质的服务。
GTAM始终做品质最好，为客户提供最高质量水准的国际级产品。
GTAM is a company specializing in producing temperature sensors and transmitters and one of the important suppliers of China industrial temperature instruments. With the complete equipment of machining and electronics production, the company has become one of the leaders in the realm of industrial temperature measurement. The company’s temperature measuring instruments are precise, reliable and economical. Moreover, the company can provide ordering service of nonstandard products and all necessary accessories according to different demand of users. .The company established a temperature calibration laboratory of grade I calibration standard and has the most high-end measuring equipment in this line, which has passed the calibration certification of such authorities as National Measurement Institute and Shanghai Measurement Institute.We have set up the temperature check office of Class I inspection standard and possesses top detection equipment among the trade and have passed the inspection and attestation of the authorities like National Measurement Institute and Shanghai Measurement Institute.The company set up a R&D Center in Shanghai, established technical cooperative partnership with universities and research institutes and invited many famous experts to direct and supervise production. Aimed at special measurement requirements, the sensors, thermal sleeves and casings of various machineries are provided to ensure instruments keep the top performance even in severe environment (such as the environment of anti-explosion requirement, chemical plants and generating plants). The company can provide fast and optimized solution for the factories that have single measuring point or hundreds of even thousands of measuring points. The company will provide you with the high-quality service by the rich experience in this line.GATM always manufacture the best products and provide users with international -level products of top quality.GTAM Expert™装配式热电偶Assembly Thermocouple工业用装配式热电偶作为测量温度的传感器，通常和显示仪表、记录仪表、调节器、PLC和DCS系统配套使用。
Digital+thermal+sensor
Temperature measurement in the Intel® Core TM DuoProcessorEfraim Rotem – Mobile Platform Group, Intel corporationJim Hermerding – Mobile platform Group, Intel corporationCohen Aviad - Microprocessor Technology Lab, Intel corporationCain Harel - Microprocessor Technology Lab, Intel corporationAbstractModern CPUs with increasing core frequency and power are rapidly reaching a point where the CPU frequency and performance are limited by the amount of heat that can be extracted by the cooling technology. In mobile environment, this issue is becoming more apparent, as form factors become thinner and lighter. Often, mobile platforms trade CPU performance in order to reduce power and manage thermals. This enables the delivery of high performance computing together with improved ergonomics by lowering skin temperature and reducing fan acoustic noise.Most of available high performance CPUs provide thermal sensor on the die to allow thermal management, typically in the form of analog thermal diode. Operating system algorithms and platform embedded controllers read the temperature and control the processor power. Improved thermal sensors directly translate into better system performance, reliability and ergonomics.In this paper we will introduce the new Intel® Core TM Duo processor temperature sensing capability and present performance benefits measurements and results.IntroductionToday’s high performance processors contain over a hundred million transistors, running in a frequency of several gigahertz. The power and thermal characteristics of these processors are becoming more challenging than ever before, and are likely to continue to grow with Moor’s low. Improvements in the cooling technology however, are relatively slow and do not follow Moor’s low. All computing segments face power and thermal challenges. In the server domain, the cost of electricity and air conditioning is one of the biggest expense items of a data center, and drives the need for low power high efficiency systems. In the mobile computing market, power and thermal management are the key limiter for delivering higher computational performance. Thin and light industrial designs are limited by the heat that can be extracted from the box. Ergonomic characteristics are also highly impacted by thermal considerations. The cooling fan is the major source of acoustic noise in the mobile system and external skin hot spots should be avoided for ergonomic reasons as well.The increasing demand for compute density brings the need for efficient thermal management schemes. Several such schemes have been proposed, for example DVS (dynamic frequency voltage scaling [1]). These mechanisms were implemented in CPUs such as the Intel® Centrino® Processor [2]. Most operating systems on the market support ACPI [3]. This is an industry standard infrastructure that enables thermal management of computer platforms. Thermal management is done by the use of active cooling devices, such as fans, or passive cooling actions such as DVS. Thermal management schemes accept user preferences for setting management policy. A computer user can select between high performance, energy conservation and improved ergonomics parameters.The basic feedback for most of the power and thermal management schemes is temperature measurement. Both Intel® processors [4] and others [5], incorporate temperature sensor on the die to allow thermal measurement, typically in the form of analog thermal diode. The voltage on a diode junction is a function of the junction temperature. The diode is routed to external pins and an A/D chip on the platform converts the voltage into temperature reading. The Intel® Centrino processor [2] introduced a fixed thermal sensor, tuned to the max specified junction temperature. In case of abnormal conditions, such as cooling system malfunction, the circuitasserts a signal that activates a programmable self management power saving action that protects the CPU from operating out of its specified thermal range. It is apparent that the accuracy of the thermal measurements directly impacts the performance of the thermal management system and the performance of the CPU. In mobile computers, 1.5o C accuracy in temperature measurement is equivalent to 1 Watt of CPU power. In desk-top computers the impact is even higher due to the lower thermal resistance and 1o C accuracy translates into 2 Watt of CPU power.There are several causes for temperature measurement inaccuracy:1.Parameter variance: The thermal diode is not idealand during the manufacturing process, there are variations in the diode parameters that translate into reading variations. An offset value is programmed into the Intel® Core™ Duo, to be used by the A/D to generate accurate readings.2.A/D accuracy: Some errors are associated with theanalog to digital conversion due to design and technology limitations as well as quantization errors.The best temperature A/Ds available on the market today provide +/- ½o C accuracy.3.Proximity to the hot spot: CPU performance andreliability is limited by the temperature of the hottest location on the die. Thermal diode placement is limited by routing and I/O considerations and usually cannot be placed at the hottest spot on the die. Furthermore, the hot spot tends to shift around as a function of the workload of the CPU. It is not rare to find temperature difference as high as 10o C between a diode and the hot spot.4.Manufacturing temperature control: Parts are testedfor functionality and reliability at the max temperature specifications. Variations in test temperature drive a need for additional guard-band in the temperature control set points.The speed of response to temperature changes also impacts thermal management performance. The Intel®Core TM Duo processor has implemented a new digital temperature reading capability to address the accuracy and response time limitations of existing solutions. The rest of the paper will describe the implementation of the digital sensor and the measured results of it’s performance. The Intel® Core ™ Duo digital sensor (DTS) The general structure of the digital thermometer of the Intel® Core™ Duo [7] is described in Figure 1. In addition to the analog thermal diode, multiple sensing devices are distributed on the die in all the hot spots. An internal A/D circuit converts each sensor into a 7 bit digital reading. The temperature reading is calculated as an offset from the maximum specified Tj, e.g. 0 indicated that the CPU is at it’s maximum allowable Tj, 1 indicated 1o C below etc. All temperature readings are combined together into a single value, indicating the temperature of the hottest spot on die. The Intel®Core TM Duo is a dual core CPU. The DTS offers the ability to read temperature for each core independently and to read the maximum temperature for the entire package. To achieve measurement accuracy, each sensor is calibrated at test time. Calibration is done for the Maximum Tj and the linearity of the readout slope. The temperature reading is post processed for filtering out random noise and generating the H/W activated thermal protection functions. The DTS implementation on the Intel® Core TM Duo processor supports the legacy Intel Centrino® thermal sensor and fixed function thresholds PROCHOT and THERMTRIP [2].Figure 1: Digital Thermometer Block Diagram PROCHOT is a fixed temperature threshold calibrated to trip at the max specified junction temperature. Upon crossing this threshold, a H/W power reduction action is initiated, reducing the frequency and voltage, keeping the CPU within functionality and reliability limits. A properly designed cooling system with thermal management shouldnot activate the H/W protection mechanisms. Some aggressive platform designs however, may need occasional H/W initiated action due to long response time. On most operating systems, interrupt latency is not guaranteed and therefore, S/W based control may respond too slow. Other actions have inherent long delays. The time extending from activation of a fan and until its maximum speed is reached may be too long. Aggressive thermal design, together with a slow cooling response may cause thermal excursions that may compromise reliability and functionality. It is possible to design a system with enough margins to avoid such cases, but this comes at a cost of performance or compromised ergonomic characteristics. H/W based protection enables better user experience without compromising the device reliability and performance.THERMTRIP is a catastrophic shut down event, both on the CPU and for the platform. It identifies thermal runaway in case of cooling system malfunction and turns off the CPU and platform voltages, preventing meltdown and permanent damage.A new functionality of the DTS on the Intel® Core TM Duo is out of spec indication. It is possible for the CPU to operate within specifications while at maximum Tj. Out of spec indication is a notification to the operating system that a malfunction occurred, junction temperature is rising and a graceful shut down is required while functionality is still guaranteed and user data can be saved.In order to perform S/W and ACPI thermal control functions, the DTS offers interrupt generation capability, in addition to the temperature reading. Two S/W programmable thresholds are loaded by S/W and a thermal interrupt is generated upon threshold crossing. This thermal event generates an interrupt to single or both cores simultaneously according to the APIC settings.The digital thermometer is the basis for software thermal control such as the ACPI. In the ACPI infrastructure, thermal management is done by assigning a set of policies or actions to temperature thresholds. A policy can be active, such as activating fan in various speeds (_ACx), or passive (_PSV), by reducing the CPU frequency. Interrupt thresholds are defined to indicate upper and lower temperatures thresholds. An example of digital thermometer usage is given in Figure 2._TMP=60Figure 2: Digital thermometer and ACPIIn the above example the current die temperature is at 60o C. The thresholds set to 5o C above and below the current temperature. If the temperature rises above 65o C, an interrupt is generated, notifying the S/W of a significant change in temperature. The control software reads the temperature and identifies the new temperature and initiates action if needed. In the above example, 65o C requires activating a fan at a low speed. The activation thresholds and policies are defined at system configuration and communicated to the ACPI. Upon interrupt servicing, new thresholds are written around the new temperature to further track temperature changes. Small hysteresis values are applied to prevent frequent interrupts around a threshold point.Measurements and resultsIn previous Pentium™ - M systems, a single analog thermal diode was used to measure die temperature. Thermal diode cannot be located at the hottest spot of the die due to design limitations. To perform thermal management activities, some fixed offset was applied to the measured temperature, to keep the CPU within specifications. With the increasing performance and power density of the Intel® Core TM Duo, the performance implications of guard bands increase. Figure 3 shown measured die temperature of different workloads. It can be seen that the hot spot of the die moves to different locations depending on the nature of the workload.Die Hot-SpotCore #2Core #1CacheFigure 3: Die hot spots at different workloadsFigure 3 demonstrates a shift of the hot spot in a dual core workload. A workload that stresses the floating point unit which is a high power operation, will generate hot spot near the floating point while other workloads will stress different locations on the die. Figure 4 shows the thermal impact of single core applications.Figure 4: Thermal behavior of a single core applicationIt can be noted that a single diode cannot capture themaximal die temperature. Placing a diode between the cores, results in non optimal location as this is a relatively cold area of the die in single thread workloads. Workloads can be migrated by the operating system scheduler from one core to the another on the same die and therefore a symmetrical sensor placement is required.In order to evaluate the DTS temperature reading, we performed a study to identify the impact of different workloads on the difference between diode and the hot spot, as measured by the DTS. A set of workloads including all SPEC-2K components and other popular benchmarks and applications, at single thread and multi-thread were executed on the CPU. Several iterations were done to reach a thermal steady state and then the diode and DTS temperatures were measured. Before taking the measurement, a calibration process has been performed, leaving only the temperature offset. As described earlier, both external A/D and internal DTS have some inaccuracies. Calibration procedure is needed to equalize DTS and diode temperature readings and measure temperature offsets only. Figure 5 shows the offset between the analog diode and the hot spot, as measured by the DTS. The horizontal axis represents the hot spot temperature as a percentage of the max temperature. The vertical axis shows the temperature offset between the diode and the hot spot. Each point on the chart represents a single application.It can be seen that large temperature gradients exist on the die. It also can be noted that some workloads display high temperature gradients while other have no offset. Thermal control algorithms need to prevent the hot spot from exceeding the max temperature specification. It is possible to mitigate the temperature difference by applying a fixed offset to the diode reading. This obviously is a non optimal solution as the workloads with low offset will be panelized by the unnecessary temperature offset. The use of digital thermometer provides improved temperature reading, enables higher CPU performance within thermal limitations and improves reliability.Figure 5: Diode to DTS Temp. differencePrevious studies [6] have shown that temperature reduction directly translates into performance degradation. The above chart represents 3%-7% reduction in performance due to temperature measurement offset. Building a thermal management system around a thermal diode, with the characteristics shown in Figure 5 requires temperature guard-band. This guard band can be applied to the control set point, and as a result, the workloads that generate high offset temperatures result in lost performance. A different approach can set the Tj threshold assuming that the diode represents the correct die temperature. Some of the workloads will run at high max Tj and therefore risk functional issues or reliability degradation.The DTS also reduces the other temperature readings errors, which are not shown in this paper. The DTS is calibrated at manufacturing conditions and the reference point is set to this test temperature. Functionality, electrical specifications and reliability commitments are guaranteed at maximum Tj as measured by the DTS. Any test inaccuracy or parameters variance are already accounted for in the DTS set point.Summary and conclusionsWith the increasing demand for computational density and the increase in CPU transistors and frequency, power and thermal are the key limiters for providing computing performance. In recent years, thermal management has become a fundamental function of computer platform. The input to every thermal management scheme is a thermal sensor. We have shown that thermal sensor accuracy translates into power, which in turn translates into better CPU performance. Legacy analog thermal sensors incur inaccuracies due to parameter distribution and temperature offset from the hot spot. In this paper we introduced the new digital thermal sensor (DTS) of the Intel® Core® Duo processor. We showed that multiple sense point on various hot spots of the die, together with on die A/D converter provide improved temperature reading. The better accuracy translates either into 3%-7% higher performance or into improved ergonomics. The introduction of dual core References[1] D. Brooks, M. Martonosi, ”Dynamic Thermal Management for High-Performance Microprocessors” Proceedings of the HPCA-07, January 2001[2] Intel® Pentium® M processor product specifications /design/mobile/datashts/302189 08.pdf[3] Advanced Configuration and Power Interface./ acpi/.[4] Intel SpeedStep Technology,/support/processors/mobile/pentiu miii/ss.htm[5] D. Pham1, S. Asano, et. al., “The design and implementation of a first-generation CELL processor”, Proceedings of ISSCC 2005.[6] E. Rotem, A. Naveh, et al., “Analysis of Thermal Monitor features of the Intel Pentium M Processor”, Proceedings of TACS-01, ISCA-31, 2004.[7]A. Naveh, E. Rotem, et al.,”Power and Thermal Management in the Intel® Core™ Duo” , Intel Technology Journal Vol. 10 #2, 2006. ITJ MY。
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thermal sensor 原理
Thermal Sensor原理详解
Thermal Sensor，即热敏传感器，是一种能够测量物体表面温度的传
感器。
Thermal Sensor常常被应用于医疗、工业、家电、汽车等领域。
那么，Thermal Sensor的工作原理是什么呢？
一、基本原理
Thermal Sensor的基本原理是通过物体表面温度对其进行测量。
这里
需要用到热电偶、热电阻、热敏电阻、热像仪等多种传感器进行测量。
二、热电偶原理
热电偶是由两种不同材料制成的电极，两个电极的接口处叫做热偶头。
当热偶头受到温度变化后，两个电极之间就会产生电压变化。
通过测
量电压变化就可以测量出物体表面温度。
三、热电阻原理
热电阻是由一种材料制成的电极，如果热电阻发生温度变化，电阻器
的电阻就会产生相应的变化。
通过测量电阻值的变化就可以测量出物
体表面温度。
四、热敏电阻原理
热敏电阻是一种根据电阻随温度变化的规律制成的传感器，它的电阻
值会随着环境温度变化而变化。
通过测量电阻值的变化就可以测量出
物体表面温度。
五、热像仪原理
热像仪通过检测物体表面的热红外线辐射来测量物体表面温度。
热像仪将热红外线辐射转化成电信号，再利用图像处理技术得到物体表面的温度分布图像。
综上所述，Thermal Sensor的原理可以用热电偶、热电阻、热敏电阻和热像仪等多种传感器进行测量，通过测量物体的表面温度可以得到有用的信息。
与其它传统传感器相比，Thermal Sensor测量的是温度信息，具有非接触性、高灵敏度、高精度、快速反应速度等特点，在实际应用中广泛运用。