半导体化学品
半导体氢氟酸.docx
半导体氢氟酸半导体氢氟酸半导体氢氟酸，也称为氟化氢，是一种无色的、刺激性气体。
它具有强烈的腐蚀性，能够与许多金属和非金属反应，并且在高浓度和高温条件下具有毒性。
半导体氢氟酸是一种广泛应用于半导体工业的化学物质，它在集成电路和其他电子器件的制造过程中发挥着重要作用。
以下是半导体氢氟酸的一些主要应用：1. 蚀刻剂：半导体氢氟酸被广泛用作金属蚀刻剂。
它可以去除铝、铜和其他金属表面的氧化层，使得半导体器件的制造更加精确和可靠。
2. 清洗剂：由于半导体氢氟酸具有强大的腐蚀性，它可以用作清洗剂，将半导体材料表面的杂质和污染物去除。
这有助于提高半导体器件的性能和可靠性。
3. 刻蚀剂：在半导体工艺中，半导体氢氟酸可以与其他化学物质结合使用，如氯气或氯化氢，以实现特定的刻蚀效果。
这种刻蚀过程用于雕刻微细结构和电路图案，以形成半导体器件的关键部分。
4. 脱硅剂：硅是许多半导体材料的基础，但在制造过程中会产生无用的硅层。
半导体氢氟酸可以迅速而高效地去除这些硅层，使得半导体器件的性能得到改善。
尽管半导体氢氟酸在半导体工业中具有广泛的应用，但由于其刺激性和腐蚀性，它需要被妥善处理和使用。
以下是一些关于安全操作的建议：1. 防护措施：在使用半导体氢氟酸时，操作人员应穿戴防护服、手套和护目镜等个人防护装备，以避免与其接触。
同时，应确保操作环境通风良好，以减少气体浓度和暴露风险。
2. 储存和处理：半导体氢氟酸应存放在密封的容器中，远离其他化学品和可燃物。
在处理过程中，应采取适当的措施，如小心搅拌、加热和转移，以避免泄漏和意外发生。
3. 废物处理：废弃的半导体氢氟酸应按照当地环境法规进行处理。
通常情况下，它需要被送往专门的处理设施进行中和和安全处置，以防止对环境和人类健康造成伤害。
总而言之，半导体氢氟酸是半导体工业中不可或缺的化学物质，但在使用过程中需要高度重视安全性和可持续性问题。
我们必须充分了解其性质和应用，并遵循正确的操作和处理方法，以确保工作场所的安全和环境保护。
半导体工厂使用的化学品清单
Chemical UseStandard Operating Procedure1.0PurposeThis document provides detailed instructions on chemical use at the wet benches at WashingtonTechnology Center.2.0Equipment and Materials2.1Equipment2.1.1Wet bench2.1.2Spin rinse dryer2.1.3Face shield2.1.4Apron2.1.5Chemical gloves2.1.6Timer2.1.7Tweezers2.1.8Teflon cassettes2.1.9Teflon cassette handles2.1.10Teflon single wafer holders2.2ChemicalsThe chemicals available in the lab are as followsName Composition Purpose Acetic acid 100% acetic acid Wafer cleanAcetone 99-100%acetone SolventAluminum etch 71-73% Phosphoric acid5-15% water9-11% nitric acid1-3% acetic acidEtch aluminumAmmonium fluoride 40% ammonium fluoride60% waterOxide etchAmmonium hydroxide 29% ammonium hydroxidewaterWafer cleanAZ300T 4% Tetramethylammonium hydroxide41% N-methylpyrrolidone, NMP, 1-methyl-2-pyrrolidinone55% Propylene glycol, 1, 2-propane-diolremove photoresistAZ 351 <10% sodium borates>90% water Developer for 1512 and 1518AZ 400K <15% Potassium borates>85% water Developer for 4620 and 9260AZ 1512 75% 1-methoxy-2-propanol acetate Thin Photoresist<25% Cresol novolak resin<10% diazonapthoquinonesulfoniestersAZ 1518 71% 1-methoxy-2-propanol acetate<30% Cresol novolak resin<10% diazonapthoquinonesulfoniestersThin (~2um) PhotoresistAZ 4620 62% 1-methoxy-2-propanol acetate<35% Cresol novolak resin<5% diazonaphthoquinonesulfoniestersThick photoresistAZ 9260 57% 1-methoxy-2-propanol acetate<40% Cresol-novolak resin<5% DiazonaphthoquinonesulfonicestersThick photoresist10:1 BOE 40% ammonium fluoride5% hydrogen fluoride55% water0.2% surfactantetch oxideChromium etch (TFD) 5-10% Ceric Sulfate5-10% Nitric Acid1-5% Sulfuric Acid75-89% WaterEtch chromiumCopper etch (Type 100/200) 30% ferric chloride3-4% hydrochloric acidwaterEtch copperEKC 830 50-60% 2-(2-Aminoethoxy) Ethanol40-50% N-Methyl PyrrolidoneRemove photoresistFuturrex 2.27% tetramethyl ammoniumhydroxidewaterNegative resist developerGold Etch (TFA) 1-10% iodine complex20-40% potassium iodide50-79% waterEtch goldHMDS 100% Hexamethyl disilazane Adhesion promoter Hydrocholoric acid 37% hydrogen chloridewaterremove metalsHydrofluoric acid 49% HFwateretch oxide, nitrideHydrogen peroxide 30% hydrogen peroxidewaterOxidizerIsopropyl alcohol 100% 2-propanol solventNanostrip 90% sulfuric acid5% peroxymonosulfuric acid<1% hydrogen proxideRemoves organics, metals Nickel etch TFB 10 to 20% nitric acid Electroless plating<1% Potassium PerfluoroalkylSulfonate80 to 90% waterNitric acid 70% nitric acid etchantP-20 20% Hexamethyl disilazane80% 1-methoxy-2-propyl acetateAdhesion promoterPad etch 1 31-35% acetic acid12-16% ammonium fluoride51-55% waterOxide etchPad etch 4 30-34% acetic acid11-15% ammonium fluoride4-8% glycol47-51% waterOxide etchPalladium Etch (TFP) 30% ferric chloride3-4% hydrogen chloride66-67% water**this is the same as copper etch 100*Etch palladiumPhosphoric acid 74-95%waterEtch nitridePolyimide Coating 30-60% n-methyl-2-pyrollidone5-10% tetraethylene glycol diacrylate30-60% photosensitive polimide resin1-5% proprietary ingredientsPlanarization “oxide”Polyimide Developer (HD Microsystems) >60% cyclohexanone30-40% 4-butyrolactoneDeveloperPolyimide Rinse 10-30% cyclohexanone>60% butyl acetaterinsePotassium hydroxide 45% potassium hydroxidewater Etch silicon with nitride maskQZ3501 polyimide developer 60-80% dihydrofuranone20-40% butyl acetatedeveloperR19180 polyimide developer 10-30% cyclohexanone>60% butyl acetatedeveloperRD6 Negative Resist Developer 97-98% water2-3% tetramethyl ammoniumhydroxidedeveloperSilver Etch (TFS) 3-10% iodine complex18-42% potassium iodide48-79% waterEtch silverSPR 220 30-52% Ethyl lactate15-25% anisole1-10% diazo photoactive compound14-40% Cresol Novolak Resin1-5% 2-Methyl Butyl Acetate2-7% n-amyl acetateThick resistSTR 1075 48-53% Ethyl lactate1-5% n-butyl acetate1-10% diazo photoactive compound30-40% Cresol Novolak Resin1-5% xylene<1% organic siloxane surfactantThick resistSU8 developer 100% methoxy-2propyl acetate developerSulfuric acid 98% sulfuric acid remove organics, metalsSylgard silicone elastomer curing agent 59% Dimethyl, methyl hydrogensiloxane13% Dimethyl vinylated andtrimethylated silicaCuring agentXP SU-8 10 40-45% Gamma butyrolactone55-60% Mixed triarylsulfonium/hexafluoroantimonate saltNegative photoresistXP SU-8 developer 98-100% 1-methoxy-2-propyl acetate DeveloperTMAH 25% tetramethylammonium hydroxide75% waterAnisotropic etch3.0SafetyA buddy system applies to the use of chemicals after normal working hours: anotherknowledgeable user should be in the clean room, aware of your situation, and closeenough to be of assistance if you have an accident.3.1 Heat3.1.1 Hot plates used for heating chemicals must be attended. You must be in the cleanroom and near the hot plate when it is on.3.1.2Check that each container you use on a hotplate is approved for hotplate use.3.1.3 The wafer baking hot plates are not to be used with chemicals.3.2 Chemical Vapor3.2.1 When working with chemicals, always use the vented chemical hoods.3.2.2 Wear appropriate personal protective equipment.3.2.3 Keep your head above the Plexiglas especially when mixing, pouring, andheating.3.2.4 Pour only approved chemical mixtures.3.2.5 If you can smell chemicals while you are processing wafers, find out why. Youmay have chemicals on your lab coat or gloves. Fresh gloves are available on topof the resist cabinet. Fresh lab coats are available in the gowning room. Theremay also be contaminated trash in the unvented waste basket. Be sure to worktoward the back of the fume hood. Clean the outside of bottles thoroughly, beforeputting them back in the chemical cabinet.3.3 Fire3.3.1 When working with chemicals, always use the vented chemical hoods.3.3.2 Check chemical flashpoints before heating. Do not heat chemicals to temperaturesnear their flashpoints. Do not heat solvents above 120 degrees C.3.3.3 Chemicals on hotplates must be attended.3.3.4 Be particularly careful with solvents like acetone around heat sources or oxidizers(peroxide or nitric acid).3.4 Contact burns3.4.1 Wear appropriate personal protective equipment.3.4.2 Keep work area clean and dry.3.4.3 Add acid to water. Do not add water to acid.3.4.4 Add peroxide to sulphuric, when pouring pirahna.3.4.5 Pour only approved chemical mixtures.3.5 Reproductive effectsUsers who are pregnant should discuss laboratory use with the lab manager assoon as possible. This need not severely restrict laboratory use but shouldnonetheless be discussed (see MSDS of photoresist). Be aware that there aremany different names for the same photoresist solvents4.0Supplies4.1Personal Protective EquipmentAprons, orange chemical resistant gloves, and face shields are available for use at thechemical hoods. Select an appropriate size orange glove. Check gloves for holes before each use; discard them if they have holes. Wear gloves to open cabinets, sign the log.Wash gloves when they become contaminated. Do not touch door knobs, notebooks,phone or microscope with gloves on. Wash and dry gloves when you are done; hangthem up on the rack. Wipe off aprons as needed and return them to the rack.4.2LabwareClean glassware and plastic ware are available for lab users. To prevent crosscontamination, many dishes are labeled. When you are done with your glassware, please empty it into the appropriate container, clean it, rinse three times, dry it and leave itupside down on the glassware shelf. Do not store WTC supplies on your own shelf.You may bring in your own labware labeled with your name; glassware not labeled with anyone’s name belongs to WTC.4.3ChemicalsThe lab stocks and supplies the chemicals commonly required for processing in thefacility. As we have limited storage, please get staff approval to store custom solutions.Mix only enough to use each day. In most cases, the shelf life of these chemicals is very short anyway. All special chemicals and solutions must be labeled with the arrival dateand the owner's name and phone number. Expired chemicals or chemicals older than 1year will be periodically disposed of.The exception is with photoresist, where each group may have a few private smallbottles of resist; these are kept in several small plastic boxes in the yellow vented cabinet next to the spinners. Before you decide to use your own bottles, consider that positiveresist has a very limited life at room temperature. Those people using the WTC bottlesare getting much fresher resist than those who use their own bottles to store a six-month supply. Please clean the outside of all resist bottles thoroughly after each use tominimize solvent odor in the resist cabinet.Working stocks of chemicals are kept in the chemical cabinets near each chemical area.Extra stock is kept in several chemical bunkers outside the lab. When a chemical hasbeen used up, write it on the white board in the gowning room, so staff can replenish the clean room stock from the bunker.4.4Emergency Response Equipment4.4.1Phone systemPhones are located at the entrance to the laboratory, as well as severalplaces within the laboratory. These are part of the university phonesystem. In an emergency, dial 9-911. You may request help for largechemical spills, accidents, medical emergencies, injuries, etc. For minoremergencies, staff contact information is available next to each phone.4.4.2Chemical spill cartSpill control pads are available on the spill cart for absorbing liquidchemical spills. Bottles of neutralization liquid are available for use onacid spills. Gloves, full protective coveralls, a squeegee, scoop pan,calcium gluconate gel and other useful items are located in or near thechemical spill cart. It is located in the grey area. A vacuum cleaner is alsoavailable for cleaning up powdered residue from neutralized chemicalspills.4.4.3Emergency showersEmergency showers and eye washes are located in each room of thelaboratory. Most chemical burns, particularly in the eyes, should bewashed for 15 minutes before seeking further medical attention.4.4.4First aid kitA first aid kit is available on the wall of the gowning room. Tubes ofcalcium gluconate gel are available at the HF wet bench and on thechemical spill cart for application to HF burns. This should be appliedpromptly, but is not a substitute for medical attention.5.0Operating Procedures5.1 Set up5.1.1 Get approval for any new chemicalIf your exact chemical is not currently in use in the lab, you must get approvalfrom the lab manager before bringing the chemical into the lab. You will beexpected to supply the appropriate MSDS, a reason why this chemical should beused in the lab, and an explanation of how it is compatible with lab usage.5.1.2 Read the MSDS for each chemical you plan to use.PPEappropriate5.1.3 SelectSafety glasses should be worn at all times in the laboratory. When pouringchemicals, wear face shield, orange gloves, acid apron. When moving wafersfrom acids to dump rinsers, operators should wear orange gloves and acid apron.stationappropriate5.1.4 SelectAcids are used at wet bench #3. Bases and acids are used at wet benches #4Solvents may only be used at the solvent station (bench #12) and resist coatingstations, never at the acid station. Log in to workbench as necessary.5.1.5 Decide whether it is necessary for you to pour your own chemicals, or whetheryou can safely use chemicals maintained by staff for lab users. In general, it issafer to use lab solutions than to pour your own. If you are concerned about theage of the solution or potential cross-contamination, you may be able to scheduleyour work, so that you use the lab chemicals immediately after they are poured(every two weeks). If you see obvious contamination in the chemical, notify labstaff, so that fresh chemicals can be poured.5.1.6 Select appropriate containerSelect a dish labeled with the specific chemical name you will be using. Do notput chemicals in a dish that is labeled with another chemical name. If there is nodish for your chemical, use an unlabeled, compatible dish. To conserve onchemicals, select the smallest dish that is appropriate for the job. Do not pour HFinto glass or metal dishes. Dishes for heated solutions must be hotplate-compatible.5.1.7 Label containerLabel dish with a Sharpie (your name, chemical name, concentration, date, andphone number)5.1.8Select chemical bottleWhen selecting a bottle to pour, finish any open bottles before opening new ones.Be sure the concentration of the chemical is correct.5.1.9Pour solutionPour solutions in a vented hood. Add acid to water. Wipe residue from outside ofbottle. Replace chemical bottles in the appropriate place in the cabinet. Coverany chemical not immediately in use.5.1.10 Wash bottles that you have emptied.Cross out the label on any chemical bottle you have emptied, rinse three times,and write “rinsed” with a Sharpie at the top of the bottle. Place rinsed bottles onthe bottom shelf of the waste chemical cabinet.5.1.11 Prepare hotplateHot plate controllers are located above the Plexiglass shield. Set temperature. Putchemical solution on the hotplate. Use an appropriate thermometer to monitor thetemperature. Do not leave the lab when the hotplate is on.5.2 Dip—Acid or Base5.2.1 Select appropriate sample holderParts to be dipped in chemicals should be in a holder. When immersing wafers inchemicals, 3” and 4” Teflon cassettes are available. Attach a Teflon handle to thecassettes. Single wafer Teflon carriers can also be used. For parts that are notwhole wafers, there are perforated Teflon ladles, as well as a small Teflon rack for tiny parts. Tweezers may be sufficient for immersing single wafers in a smallamount of developer, but are not appropriate for use in acids.5.2.2 Ensure proper PPEWhen moving wafers from acids to dump rinsers, operators should wear safetyglasses, orange gloves and an apron.5.2.3 Determine appropriate dip timeYou can determine proper time by checking in reference material, checkingprevious entries in the log book, or doing an etch rate check. To do an etch ratecheck, use a silicon wafer with the same film you are trying to etch. Measure film thickness with the Nanospec. Etch the wafer for a specified time (say, 1 minute).Then re-measure the wafer on the Nanospec. You can then calculate etch rate inAngstroms/minute. Calculate etch time by dividing film thickness on yoursample by etch rate.5.2.4 Dip sampleSet timer for the proper time, then start timer as you lower sample into thesolution. Do not sit down at the hood while processing wafers, as this positiondoes not protect your face from fume exposure.5.2.5 Remove sample from solution5.2.6 Place sample still in its container into dump rinser or cascade rinserControllers are located in the control panel above the Plexiglass. Set dump rinser for at least three cycles by pushing “cycle count” until the display reads thenumber of cycles you want (at least 3). Push “start.” When wafers are doneprocessing, push “stop,” and remove the wafers.Cascade rinser can be started by pushing “run.” When carrying wafers from onebench to another, put the wafer container in a tub to avoid dripping. If wafers areespecially fragile, you can manually rinse them in tubs of water. Use at least fivechanges of water.5.2.7 Dry sample in spin rinse dryer or under nitrogen gun.After a complete rinse, whole wafers can be put in the spin rinse dryer. Do notput unrinsed wafers in the spin rinse dryer. Substrates other than whole waferscan be dried with a nitrogen gun. Check the pressure coming out of the nitrogengun before using it on your substrate, as some have a gentle flow, and others areforceful. Fragile wafers can be dried in the vacuum oven located under theBranson barrel asher.5.3 Dip—solvent5.3.1 Use heated EKC830 and AZ 300T to strip positive photoresist. Temperatureshould be set at 75 degrees for the EKC and 90 degrees for the AZ300T.5.3.2 Allowed materials in this tank are silicon, quartz, aluminum, and positivephotoresist. Materials not allowed in this tank are water, negative photoresist andother polymers like polyimide. Water will form hydroxyls that will pit aluminum,creating a problem for some users.5.3.3 Typical strip times are 10 minutes in EKC, and 10 minutes in AZ300T.5.3.4 If you would like to use EKC, but your wafer has a material not allowed, you maypour up your own batch in a separate container, but you may not use the generaltank.5.3.5 Be sure to use Teflon cassettes.5.3.6 Bring a tub of plain water over to the station to use to carry your wafers to thedump rinser.5.4 Clean up5.4.1 Squirt wet deck with DI water, and wipe down with squeegee, then towel5.4.2 Dispose of solutionPlease dispose of chemicals as soon as you are finished. Chemicals left in thehood for more than 24 hours are subject to disposal. Hot or reacting mixtures maybe left a reasonable amount of time to settle down.5.4.2.1 Aspirate acids and basesAspirator is located in the Microvision wet bench. Put the aspirator tubein the solution, and step on the pedal on the floor. Aspirator will suck upchemical into the acid neutralization system. Do NOT aspirate solvents,as they are an explosion hazard in the acid neutralization system.5.4.2.2 Put solvents in designated carboysPut the carboy in the dishwashing sink, or the vented chemical cabinet topour. Use a funnel. Wipe sides of container. Return it to the properstorage area. The acetone/IPA waste is located on the bottom shelf of theyellow, ventilated cabinet next to the spinners.5.4.2.3 Put other chemicals into labeled containers in waste chemical storage.5.4.2.3.1.1Using the bottle labeled for your chemical.Carry the waste bottle to the appropriate sink, and use afunnel to transfer your waste. Leave two inches at the topfor thermal expansion, and put the cap on. Do not put solidcaps on any bottle containing hydrogen peroxide (H2O2). Itcontinues to decompose for months and must be stored in avented container. Wash any residue from the outside of thecontainer. Return waste container to the waste cabinet. Ifyou have filled the existing waste bottle, make a new one.5.4.2.3.1.2Making a new waste chemical bottle.If there is no bottle with the proper chemical name, get aclean, dry bottle from the bottom shelf of the chemical wastecabinet, get an EH&S label, and label the bottle properly. Besure that the bottle type is compatible with the chemical youare disposing; if in doubt, ask! Chemicals left withoutproperly labeling will be assayed by Environmental Healthand Safety, and your budget number will be billed.5.4.2.4 Do not pour anything except rinse water and AZ developer down thedrain.5.4.3 Wash and dry lab ware and return it to the proper shelf5.4.4 Final checkRemove beakers, towels, chemical and liquid residue from the wet decks. Thework surface should be clean and dry when you leave.5.5 Accidents5.5.1 Spills5.5.1.1 You are primarily responsible for cleaning up any minor chemical spillyou cause, using safe and approved procedures. Do not dispose ofcontaminated rags and broken chemically laden glass in the normal wastebaskets. You should rinse the waste articles and bag them. Bags arelocated in the gowning room in the large cabinet. Label the bags, leavethem in a ventilated area and seek assistance from a staff member onfurther disposal.5.5.1.2 Request assistance from staff for any significant spill. We will assist you,using the materials on the chemical spill cart located in the grey area nextto the tool box, which has supplies like tape to block off spill area, spillcontrol pads, and neutralizers.5.5.2.3 For major chemical spills and for any unanticipated chemical reaction,evacuate the area, and call the staff. You must remain available to provideinformation. Any user may call for an evacuation of the laboratory at anytime. These "requests" must be honored by all users until such time as thesituation is evaluated. Alternatively, you may evacuate the laboratoryusing the fire alarm in justified instances. You must first exit thelaboratory to find an alarm pull box next to the building exits.5.5.3.4 Significant events must be reported in writing, so that corrective actioncan be taken to prevent future problems, on a time scale appropriate to theseverity of the event.5.5.2 Chemical Exposure5.5.2.1 Flush affected area immediately with large quantities of water for at leastfifteen minutes. Use the sink, the safety shower, or the eyewash station asappropriate.5.5.2.2 Remove any contaminated clothing immediately.5.5.2.3 For HF exposures only, after flushing the area for a couple of minutes withwater, spread affected area liberally with calcium gluconate gel, located atthe HF wet bench and on the chemical spill cart. Wear clean gloves whenapplying the gel to prevent secondary HF burns to the hands.All HFburns, no matter how seemingly trivial, should be considered serious andproper medical treatment sought. Note: BOE is a dilute solution of HF.5.5.2.4 Minor medical treatment is available from Hall Health occupational healthand safety staff. Major medical treatment is available from HarborviewMedical Center. If you go for medical treatment, take the MSDS of therelevant chemicals from the gowning room to the medical staff to aid inprompt, appropriate medical treatment. Paramedic services are availableby dialing 9-911 from the lab phone.5.5.2.5 Notify lab staff immediately about any chemical exposures, and providewritten documentation as necessary, so that proper follow up can be done.6.0 Chemical Mixtures Approved for Lab UseDo not mix solvents with acids (potentially flammable). Do not mix organicswith peroxides (potentially explosive). You may not arbitrarily mix chemicalstogether. Only specifically approved solutions can be made. Solutions not on thischart should be checked with the lab manager.Name CompositionTemperature(°C)Removes Silicon etch 6parts acetic acid19 parts nitric acid1 part hydrofluoricacidRoom temperature siliconPiranha 4 part sulphuric acid1 parts hydrogenperoxide Reaction isexothermic will raisetemp to 110-140°organicsSC1 1 part ammoniumhydroxide1 parts hydrogenperoxide5 parts DI water 70 particles,organics(Makes surfacehydrophilic)SC2 1 part hydrochloricacid1 part Hydrogenperoxide5 parts DI water70 metallicsAqua regia 3.896 parts HCl(37%)1 part nitric acid(70%) etchesgold,platinumTitanium etch 20 parts DI water1 part H2O21 part HFRoom Temp Etches titanium7.0 Processes Approved for Lab Use7.0.1Prefurnace clean: Nanostrip (5 min), BOE (10 sec), SCI (5 min) and SC2 (5 min)8.0RevisionsRevision Initials Date PurposeA ACT 8/28/2003 format, waste chemical procedure, chemical contents,mixtures, revisionsB ACT 1/20/2004 Add wet strip criteriaC MEH 8/31/2005 Updated chemical list。
20181228半导体电子级高纯试剂知识普及
Quill.Ding 2018年12月28日
酸碱类产品目录
酸类产品： 硝酸、盐酸、硫酸、氢氟酸、磷酸、过氧化氢、
冰乙酸等
碱类产品： 氢氧化铵、氟化铵、氢氧化钾溶液、氢氧化 钠溶液、胆碱等
腐蚀剂产品目录
腐蚀剂产品： 氟化铵腐蚀液（BOE)、铝腐蚀液（PES)、硅 腐蚀液（MAE)、混合酸（3F)、混合酸（4F)、 铬腐蚀液、钼腐蚀液、镍银腐蚀液、 钛腐蚀液、酸性剥离液等。
≤1
≤0.1 ≤0.01
≤50
控制粒径，µm
≥1.0 ≥0.5
0.5
0.2
*
≥0.5
颗粒，个/ml
≤2应范围 适用于 适用于 适用于 适用于 适用于 适用于
>1.2µm 0.8～1.2µm 0.2～0.6µm 0.09～0.2µm <0.09µm 0.8～1.2µm
IC制作 IC制作 IC制作 IC制作 IC制作 IC制作
国内外化学试剂产品等级划分
国内化学试剂等级划分
纯度远高于优级纯的试剂叫做高纯试剂。高纯试剂是在通用试剂基础上 发起的，它是为了专门的使用目的而用特殊方法生产的纯度最高的试剂。它 的杂质含量要比优级纯试剂低2个、3个、4个或更多个数量级。
因此，高纯试剂特别适用于一些痕量分析，在名称上有高纯、特纯、超 纯、光谱纯等不同叫法。
我公司化学试剂等级划分
我公司专业生产高纯试剂，其等级划分为：
电子级1级（EL-Ⅰ）其金属杂质含量为100--1000 PPb，与市场供应的电子级 （EL）相当，达到SEMI C1 C2标准。
电子级2级（EL-Ⅱ）其金属杂质含量为10--100 PPb,与市场供应的摩斯级 （MOS）相当，达到SEMI C7标准。
半导体氢氟酸
半导体氢氟酸半导体氢氟酸是一种常用的化学品，在半导体工业和其他领域中有着广泛的应用。
它是由氢氟酸和水混合而成，化学式为HF。
半导体氢氟酸具有强腐蚀性和挥发性，因此在使用时需要特别注意安全。
半导体氢氟酸在半导体工业中的应用非常重要，它被用于刻蚀硅片表面，以便制造集成电路和其他微电子器件。
刻蚀是一种将材料表面物质去除的过程，半导体氢氟酸能够有效地去除硅片表面的氧化层，使得后续的工艺步骤能够顺利进行。
此外，半导体氢氟酸还可以用于清洗硅片和其他半导体材料，以去除表面的污染物和杂质。
除了在半导体工业中的应用，半导体氢氟酸还被广泛应用于其他领域。
例如，在玻璃制造业中，它被用于蚀刻玻璃表面，以实现一些特殊的效果，如丝印、磨砂和图案蚀刻。
另外，半导体氢氟酸还可以用于金属表面的清洗和腐蚀，以改善金属的表面性能和精确度。
尽管半导体氢氟酸在工业应用中具有重要地位，但它也存在一定的安全风险。
由于其强腐蚀性，接触到皮肤或眼睛可能引起严重的化学灼伤。
因此，在使用半导体氢氟酸时，必须采取严格的安全措施，如佩戴防护眼镜、手套和防护服，并确保操作在通风良好的环境下进行。
在处理半导体氢氟酸废液时，也需要特别小心。
这些废液含有高浓度的氢氟酸，对环境和人体健康都具有潜在的危害。
因此，必须采取适当的措施进行处理和处置，以确保不会对环境造成污染。
半导体氢氟酸作为一种常用的化学品，在半导体工业和其他领域中发挥着重要作用。
它具有强腐蚀性和挥发性，需要在使用过程中注意安全。
同时，在处理废液时也需要采取适当的措施。
通过正确的使用和处理，半导体氢氟酸能够为各行各业的生产提供帮助，推动科技进步和工业发展。
巴斯夫 半导体化学品
巴斯夫半导体化学品
巴斯夫是一家全球知名的化工公司，也是半导体化学品领域的
重要供应商之一。
在半导体化学品方面，巴斯夫提供多种产品和解
决方案，包括用于制造半导体材料的化学品和材料，以及用于半导
体制造过程的化学品。
首先，巴斯夫在半导体化学品领域提供的产品包括各种高纯度
化学品，如气相和液相前体，用于制造半导体材料，例如硅片和光
刻胶。
这些化学品对半导体材料的质量和性能起着至关重要的作用，因此巴斯夫在确保其产品高纯度和稳定性方面投入了大量的研发和
生产资源。
其次，巴斯夫还提供用于半导体制造过程的化学品和材料，例
如用于清洗和去除残留物的化学品，以及用于表面处理和涂覆的材料。
这些产品在半导体制造过程中起着关键作用，可以帮助确保芯
片的质量和性能。
此外，巴斯夫还致力于为半导体行业提供定制化的解决方案，
以满足不断变化的市场需求和技术挑战。
通过与客户紧密合作，巴
斯夫可以根据客户的特定要求定制化学品和材料，帮助客户提高生
产效率和产品质量。
总的来说，巴斯夫作为半导体化学品领域的重要供应商，通过其广泛的产品和解决方案，以及与客户的紧密合作，为半导体行业的发展和创新提供了重要支持。
巴斯夫在半导体化学品领域的持续投入和创新努力，将有助于推动半导体行业的持续发展和进步。
半导体制程用化学品应用
電子產品 系統產品
資訊產品 消費性產品 通訊產品
其他
Basic Structure of a Production Process
Deposition (Oxidation, CVD,
PVD)
Photolithograpy
Doping (Implantation, Diffusion)
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微影技術用化學品
光刻膠稀釋液
光刻膠乃是經由旋轉塗佈程序而在晶片上形成薄膜，然若其黏度溫過高經常會在晶片邊緣形成珠 狀殘餘物（Edge Bead）．若加入光刻膠稀釋液則可有效控制此現象之發生．
目前工業上較常使用之光刻膠稀釋液包括乙醇鹽類如Propylene Glycol Monomethyl Ether (PGME)及Propylene Glycol Monomethyl Ether Acetate (PGMEA)混合物；乳酸鹽類如Ethyl Lactate及 酮類如Methyl Ethyl Ketone等．
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晶背蝕刻
隨著半導體元件走向更高精密度及「輕薄短小」之趨勢，晶背 蝕刻（Backside Etching）已逐漸取代傳統機械式晶背研磨 （Grinding）製程，除了能降低矽晶片應力（Stress）減少缺陷 （Defect）外，並能有效清除晶背不純物，避免污染到正面之 製程。
由於晶背表層常包含了各類材料如二氧化矽、多晶矽、有機物、 金屬、氮化矽、多晶矽等，因此濕式晶背蝕刻液也含蓋了多種 無機酸類之組成，包括H3PO4、HNO3、H2SO4及HF等，如此 才能有效去除複雜之晶背表層結構。
Si + 4HNO3 SiO2 + 6HF
SiO2 + 2H2O + 4NO2 H2SiF6 + 2H2O
半导体制程用化学品应用
濕式蝕刻技術與化學品
濕式蝕刻技術是屬於化學品（液相）與薄膜（固相）之表面反應，此技術之優點在於其 製程簡且產量速度快，而由於化學反應並無方向性乃是屬於一種等方向性蝕刻．一般而 言，濕式蝕刻在半導體製程可用於下列幾個方面：
二氧化矽層之圖案蝕刻（Pattern）或去除 氮化矽（Nitride）層之圖案蝕刻或去除 金屬層(如Al)之圖案蝕刻或去除 多晶矽（Polycrystalline Si）層之圖案蝕刻或去除 非等向性矽層蝕刻 減低矽晶圓蝕刻 矽晶圖表層拋光 矽晶圖表層粗糙化 矽晶圓回收（Wafer Reclaim）
主要應用在微粒子之清除。利用NH4OH之弱鹼性來活化Si晶圓表層，將附著於表面之微粒子去除， 此外NH4OH具強化合力，也可同時去除部份金屬離子。一般是以NH4OH:H2O2:H2O = 1:1:5之體積 比例混合液在70oC溫度下進行5-10分鐘之浸泡清洗。
RCA Standard Clean 2 (SC-2，又稱HPM) HCl/H2O2/H2O
Post Plasma Etch Polymer removers Passivation of metal layers Pad passivation Hydroxyamine Ethanoldiamine Alkyl diol
Cleaning
Post CMP cleaning Particle removal
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微影技術用化學品
光刻膠稀釋液
光刻膠乃是經由旋轉塗佈程序而在晶片上形成薄膜，然若其黏度溫過高經常會在晶片邊緣形成珠 狀殘餘物（Edge Bead）．若加入光刻膠稀釋液則可有效控制此現象之發生．
目前工業上較常使用之光刻膠稀釋液包括乙醇鹽類如Propylene Glycol Monomethyl Ether (PGME)及Propylene Glycol Monomethyl Ether Acetate (PGMEA)混合物；乳酸鹽類如Ethyl Lactate及 酮類如Methyl Ethyl Ketone等．
半导体光电产业用蚀刻制程化学品
顯影液
產品用途 (PURPOSE) 本產品的配方特別設計在用於彩色濾光片(CF) RGB/LED等相關電子產業光阻之顯 影，主要針對在解決RGB光阻顯影後快速將被顯影液lift off之光阻分解並且降低泡 沫，使其不會因藥液循環而導致回沾至玻璃表面因而產生殘留現象。
產品特性 (CHARACTER) eSolv DS-310 series 為AB型濃縮經濟配方，可依使用情形的不同，調配AB藥液比 例，用量節省，可大量降低成本，適用於平面顯示器製程 。 eSolv DS-305 series 為單一配方，只需以DIW稀釋即可應用至CF顯影製程上 eSolv DS-310 and DS-305顯影時線寬穩定性高，適當自動添加可使Life Time 增加 eSolv DS-310 A型成分主要為高濃度之KOH及各項親水配方
產品特性 (CHARACTER) ITO(氧化銦錫)薄膜玻璃是驅動液晶顯示器,有機發光二極體(OLED)等相關產業不可或 缺的零組件,eSolv EG-418 series產品對其蝕刻線路成形效果優良，與ITO化學反應 速度快且不傷害光阻pattern ，能避免蝕刻所造成undercut過大之情形發生，目前此 系列產品有3種， ㄧ、 EG-418 系列，此系列以王水為主，二、EG-422系列，此系 列為氯化鐵base，三、 EG-420 系列，此產品為草酸系列，兩者接可輕易完成ITO所 需蝕刻要求，除此之外，並能依據客戶需求研發針對客戶所需之ITO蝕刻液。
Al Metal Etchant
產品用途 (PURPOSE) 光電產業用導電金屬蝕刻製程化學品，適用於蝕刻鋁金屬層，利用特定鋁金屬蝕 刻液溶液(eSolv EA-855)與鋁金屬薄膜間所進行的氧化還原化學反應，去除未被 光阻覆蓋的鋁金屬，以達到鋁金屬線路成形之目的。
半导体行业化学品项目管道施工方案
半导体行业化学品项目管道施工方案一、前言在半导体行业的化学品项目中，管道施工是一个至关重要的环节。
良好的管道施工方案可以确保化学品在生产过程中的顺畅输送，保障生产效率与质量。
因此，本文将针对半导体行业化学品项目的管道施工方案进行探讨。
二、管道设计在管道施工之前，首先需要进行管道设计。
设计阶段的重点在于确定管道的布局、材质、直径等参数，保证管道的稳定性和耐用性。
此外，还需要考虑管道的绝缘、保温等措施，以确保输送过程中的安全性。
三、管道选材在半导体行业的化学品项目中，管道选材尤为关键。
需要选用耐腐蚀性强、耐高温、耐压力的材料，以应对化学品的特殊性质。
常用的管道材料包括不锈钢、聚乙烯、聚丙烯等，选材时需根据化学品性质和输送环境来选择合适的材料。
四、施工流程1. 施工准备在进行管道施工之前，需要进行充分的施工准备工作。
包括清理施工区域、检查管道设计图纸、准备所需材料和工具等。
2. 管道安装根据设计要求，进行管道的安装工作。
需要确保管道的连接牢固、密封性良好，避免漏液现象的发生。
3. 管道测试安装完成后，需要进行管道的测试工作。
通常包括压力测试、泄漏测试等，以确保管道的正常运行。
4. 管道保护完成管道测试后，需要对管道进行保护措施。
包括加装支架、绝缘、保温等，以延长管道的使用寿命。
五、施工注意事项1. 安全第一在管道施工过程中，安全是首要考虑的因素。
需要严格遵守相关的安全操作规程，避免发生事故。
2. 技术要求管道施工需要严格按照设计要求进行，确保施工质量。
对于特殊工艺的施工，需要专业技术人员操作。
3. 环境保护在管道施工过程中，需要注意保护环境。
避免污染环境、破坏植被等行为的发生。
结语在半导体行业的化学品项目中，管道施工是贯穿始终的重要环节。
通过科学的管道设计、合理的选材和严谨的施工流程，可以保障管道的安全稳定运行，为项目的顺利进行提供保障。
希望本文对相关行业工作者有所帮助，为管道施工提供参考指导。
以上就是本文关于半导体行业化学品项目管道施工方案的相关论述，希朥能对业务工作者提供一些启示和指导。
半导体级氢氟酸回收
半导体级氢氟酸回收1. 引言1.1 概述概述半导体级氢氟酸是一种重要的化工原料，广泛应用于半导体材料的制备过程中。
在半导体行业中，氢氟酸被用于蚀刻硅片、清洗表面以及刻蚀金属等重要工艺步骤中。
然而，由于氢氟酸具有强烈的腐蚀性和毒性，对环境和人体健康造成潜在威胁。
为了减少对环境的污染，并有效回收和重复利用氢氟酸，氢氟酸回收技术受到了广泛关注。
氢氟酸回收是指将半导体制造过程中产生的含氢氟酸废液进行处理和纯化，以获得高纯度的氢氟酸，以便再次用于生产。
通过氢氟酸回收，不仅可以节约资源，降低成本，还可以减少对环境的影响，提高生产效率，是半导体行业可持续发展的重要措施。
本文将首先介绍半导体级氢氟酸的应用领域，包括其在半导体材料制备过程中的重要作用。
然后，重点阐述氢氟酸回收的重要性，包括对资源的节约和环境的保护意义。
最后，总结本文的主要内容，并展望氢氟酸回收技术在未来的发展前景。
通过本文的阐述，读者将更深入地了解半导体级氢氟酸回收技术的重要性和应用前景，促进半导体行业在可持续发展方面的探索和实践。
文章结构部分的内容可以围绕以下几个方面展开论述：1. 分析文章的整体结构：介绍文章的大纲和目录，说明文章的组织架构和主要章节。
2. 阐述每个章节的内容概要：对每个章节进行简要描述，包括重点讨论的主题和内容范围，以及该章节与整体主题之间的关系。
3. 强调章节之间的逻辑连接：指出各章节之间的逻辑关系，如前后衔接的论证逻辑、因果关系或对比对照等。
说明各章节的排列顺序是否按照逻辑顺序进行组织。
4. 提供读者导向：建议读者在阅读文章时应注意哪些重点内容，如需要重点关注的论证、实证数据、案例分析等。
具体可参考如下所示：文章结构：本文按照以下结构进行组织和论述：引言、正文和结论。
1. 引言1.1 概述引言部分将对半导体级氢氟酸回收的背景和重要性进行概括性介绍，引发读者的兴趣。
1.2 文章结构本文总共分为引言、正文和结论三个部分，每个部分的内容和主题如下所述。
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半导体化学品
半导体化学品是一类在半导体制造过程中广泛应用的化学物质。
作为半导体行业的重要组成部分，半导体化学品不仅在半导体芯片的制造中起到关键作用，同时也在光电子、光伏、电子封装等领域发挥着重要的作用。
半导体化学品的种类繁多，包括了溶剂、清洗剂、蚀刻剂、涂覆剂等。
这些化学品在半导体制造过程中扮演着不同的角色。
首先，溶剂在半导体制造过程中用于溶解和稀释其他化学物质，以调节反应体系的浓度和比例。
其次，清洗剂用于清洗半导体表面，去除污染物和不良杂质，以保证半导体材料的纯净度和质量。
蚀刻剂则用于半导体材料的蚀刻和刻蚀，以形成所需的结构和形状。
而涂覆剂则用于在半导体表面形成保护膜或光刻胶层，以便进行后续的加工和制造。
半导体化学品的研发和生产需要高度精密的实验条件和严格的质量控制。
首先，半导体化学品的纯度要求非常高，通常需要达到99.999%以上。
这是因为半导体材料的纯净度直接关系到半导体器件的性能和可靠性。
其次，半导体化学品的稳定性和可控性也非常重要，以确保反应的准确性和可重复性。
此外，半导体化学品的环境友好性也是一个重要考虑因素，要求尽量减少对环境的污染和对人体的危害。
在半导体行业的发展过程中，半导体化学品的需求也在不断增加。
随着半导体技术的不断进步，对半导体化学品的要求也在不断提高。
例如，随着集成电路的密度不断增加，对半导体材料的纯净度要求也越来越高。
此外，随着新一代半导体材料的开发和应用，对新型半导体化学品的需求也在逐渐增加。
然而，半导体化学品的研发和生产仍然面临一些挑战。
首先，半导体化学品的研发周期长、成本高。
由于半导体制造过程的复杂性和高度精密性，研发一种新型的半导体化学品需要耗费大量的时间和资源。
其次，半导体化学品的生产过程中存在风险和安全隐患。
由于半导体化学品的特殊性，一旦发生泄漏或事故，可能对环境和人体造成严重影响。
因此，严格的安全管理和控制措施是必不可少的。
半导体化学品作为半导体行业的重要组成部分，在半导体制造过程中起到了不可或缺的作用。
随着半导体技术的不断发展和进步，对半导体化学品的要求也在不断提高。
因此，半导体化学品的研发和生产需要加强科研力量和技术创新，以满足半导体行业的发展需求。
同时，也需要加强安全管理和环境保护，以确保半导体化学品的安全性和可持续性发展。