2SA1201_07中文资料
MJ120-07A型使用手册

MJ120-07A型多业务数字交叉连接设备使用手册POSTEL南京普天通信股份有限公司有线系统部前言本手册介绍了本公司研制、生产的MJ120-07A型多业务数字交叉连接设备的基本结构、安装、使用和维护方法。
本手册主要供工程施工人员及维护人员参考使用,应仔细阅读各章节。
使用本手册请注意下列事项:1.禁止复制或转载本手册的任何部分;2.本手册保留升级更新之权利,恕不另行通知;3.错误之处,在所难免,欢迎对本手册提出任何修正意见。
安全使用要则1.不得用手触摸印制板上的元器件、布线及插头座中的金属导体。
维修盘必须触及时,应采取静电防护措施。
2.和数据业务接口的插头座在和用户终端设备连接时,不允许带电插拔。
3.强功率激光对人体特别对眼睛有危害,不得将发送器的尾纤端面或其上面的活动连接器的端面对着眼睛。
4.注意不得将光纤产生折弯,必须弯曲光纤时,曲率半径不得小于。
5.设备中的光纤活动连接器不得随意打开,维修设备必须打开时,需采取保护措施,以免连接器的端面被污染。
6.数据业务接口的用户电缆不得在室外传输,光纤通信设备须注意对强电和雷电的防护,尤其应注意光缆在设备终端时,必须采取有效措施,以免将强电或雷电引入设备,损坏接口电路和用户终端设备。
7.设备安装时,应可靠保护接地。
8.网络管理用的计算机是专用设备,不得挪作它用。
特别不得使用来历不明的软盘,以免病毒的侵害。
9.在安装和设置前,仔细阅读本手册。
目录第一章产品综述.................................................. 错误!未定义书签。
1 ........................................................................... 产品概述错误!未定义书2 ........................................................................... 系统说明错误!未定义书2.1 ........................................................................ 设备配置错误!未定义书2.2 ........................................................................ 系统功能错误!未定义书2.2.1 ..................................................................... 系统组成错误!未定义书2.2.2 ................................................................. 系统功能框图错误!未定义书2.2.3 ..................................................................... 系统配置错误!未定义书3 ........................................................................... 系统特点错误!未定义书4 ........................................................................... 技术指标错误!未定义书环境要求......................................................... 错误!未定义书签。
2SA2004中文资料

Collector-emitter cutoff current (Base open) Forward current transfer ratio
vi
si
VCE = −2V, IC = − 0.1 A VCE = −2 V, IC = −5 V IC = −5 A, IB = − 0.25 A IC = −5 A, IB = − 0.25 A IC = −4 A
at io n.
Max −100 −100 230 −1.2 −1.7 0.5 0.15 1.0
Unit V µA µA V V µs µs µs
Publication date: January 2003
SJD00009CED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
• High forward current transfer ratio hFE • Satisfactory linearity of forward current transfer ratio hFE • Dielectric breakdown voltage of the package: > 5 kV • High−speed switching
at io n.
Request for your special attention and precautions in using the technical information and semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
FOSAN富信电子 三级管 2SA1201-产品规格书

安徽富信半导体科技有限公司ANHUI FOSAN SEMICONDUCTOR TECHNOLOGY CO.,LTD.2SA1201SOT-89Bipolar Transistor双极型三极管▉Features特点PNP High Voltage高压▉Absolute Maximum Ratings最大额定值Characteristic特性参数Symbol符号Rat额定值Unit单位Collector-Base Voltage集电极基极电压V CBO-120V Collector-Emitter Voltage集电极发射极电压V CEO-120V Emitter-Base Voltage发射极基极电压V EBO-5V Collector Current集电极电流I C-800mA Power dissipation耗散功率P C(T a=25℃)500mW Thermal Resistance Junction-Ambient热阻RΘJA250℃/WJunction and Storage TemperatureT J,T stg-55to+150℃结温和储藏温度■Device Marking产品打标H FE80-160(O)120-240(Y)Mark DO DYANHUI FOSAN SEMICONDUCTOR TECHNOLOGY CO.,LTD.2SA1201■ElectricalCharacteristics 电特性(T A =25℃unless otherwise noted 如无特殊说明,温度为25℃)Characteristic 特性参数Symbol 符号Min 最小值Type 典型值Max 最大值Unit 单位Collector-Base Breakdown V oltage集电极基极击穿电压(I C =-1mA ,I E =0)BV CBO -120——V Collector-Emitter Breakdown Voltage集电极发射极击穿电压(I C =-10mA ,I B =0)BV CEO -120——V Emitter-Base Breakdown V oltage发射极基极击穿电压(I E =-1mA ,I C =0)BV EBO -5——V Collector-Base Leakage Current集电极基极漏电流(V CB =-120V ,I E =0)I CBO ——-100nA Emitter-Base Leakage Current发射极基极漏电流(V EB =-5V ,I C =0)I EBO ——-100nADC Current Gain直流电流增益(V CE =-5V ,I C =-100mA)H FE80—240Collector-Emitter Saturation Voltage 集电极发射极饱和压降(I C =-500mA ,I B =-50mA)V CE(sat)——-1VBase-Emitter Saturation V oltage基极发射极饱和压降(I C =-500mA ,I B =-50mA)V BE(sat)——-1V Base-Emitter On Voltage基极发射极导通电压(V CE =-5V ,I C =-500mA)V BE(on)——-1V Transition Frequency特征频率(V CE =-5V ,I C =-10mA)f T—120—MH ZOutput Capacitance输出电容(V CB =-10V ,I E =0,f=1MH Z )C ob—30—pFANHUI FOSAN SEMICONDUCTOR TECHNOLOGY CO.,LTD.2SA1201■Typical Characteristic Curve典型特性曲线ANHUI FOSAN SEMICONDUCTOR TECHNOLOGY CO.,LTD.2SA1201■Dimension外形封装尺寸。
2SK2081-01资料

2SK2081-01N-channel MOS-FETFAP-IIA Series 500V 0,6Ω 12A 125W>-High Speed Switching -Low On-Resistance-No Secondary Breakdown -Low Driving Power -High Voltage-V GS = ± 30V Guarantee -Avalanche Proof>Applications-Switching Regulators -UPS-DC-DC converters-General Purpose Power Amplifier>Maximum Ratings and Characteristics > Equivalent Circuit-Absolute Maximum Ratings (T C =25°C), unless otherwise specifiedItem Symbol Rating Unit Drain-Source-Voltage V DS 500 V Drain-Gate-Voltage (R GS =20K Ω) V DGR 500 V Continous Drain Current I D 12 A Pulsed Drain Current I D(puls) 48 A Gate-Source-Voltage V GS ±30 V Max. Power Dissipation P D 125 W Operating and Storage Temperature Range T ch 150 °CT stg -55 ~ +150 °C-Electrical Characteristics (T C =25°C), unless otherwise specifiedItem Symbol Test conditions Min. Typ. Max. Unit Drain-Source Breakdown-Voltage V (BR)DSS I D =1mA V GS =0V 500 V Gate Threshhold Voltage V GS(th) I D =1mA V DS=V GS 2,5 3,0 3,5 V Zero Gate Voltage Drain Current I DSS V DS =500V T ch =25°C 10 500 µAV GS =0V T ch =125°C 0,2 1,0 mAGate Source Leakage Current I GSS V GS =±30V V DS =0V 10 100 nA Drain Source On-State Resistance R DS(on) I D =6A V GS =10V 0,45 0,6 ΩForward Transconductance g fs I D =6A V DS =25V 5 10 S Input Capacitance C iss V DS =25V 2200 3300 pF Output Capacitance C oss V GS =0V 230 345 pF Reverse Transfer Capacitance C rss f=1MHz 55 85 pF Turn-On-Time t on (t on =t d(on)+t r ) t d(on)V CC =300V 25 40 nst r I D =12A 55 85 nsTurn-Off-Time t off (t on =t d(off)+t f ) t d(off)V GS =10V 110 165 nst f R GS =10 Ω 60 90 nsAvalanche Capability I AV L = 100µH T ch =25°C 12 A Continous Reverse Drain Current I DR 12 A Pulsed Reverse Drain Current I DRM 48 A Diode Forward On-Voltage V SD I F =2xI DR V GS =0V T ch =25°C 1,3 1,95 V Reverse Recovery Time t rr I F =I DR V GS =0V 400 ns Reverse Recovery Charge Q rr -dI F /dt=100A/µs T ch =25°C 3 µC- Thermal CharacteristicsItem Symbol Test conditions Min. Typ. Max. Unit Thermal Resistance R th(ch-a) channel to air 35 °C/WR th(ch-c) channel to case 1,0 °C/WCollmer Semiconductor - P.O. Box 702708 - Dallas TX - 75370 - 972.233.1589 - 972.233.0481 Fax - - 11/98元器件交易网N-channel MOS-FET2SK2081-01500V0,6Ω12A 125WFAP-IIA Series> CharacteristicsTypical Output CharacteristicsDrain-Source-On-State Resistance vs. T chTypical Transfer Characteristics↑1↑2↑3I D [A ]R D S (O N ) [Ω]I D [A ]V DS [V]→T ch [°C]→V GS [V]→Typical Drain-Source-On-State-Resistance vs. I D Typical Forward Transconductance vs. I D Gate Threshold Voltage vs. T ch↑44↑5↑6R D S (O N ) [Ω]g f s [S ]V G S (t h ) [V ]I D [A]→I D [A]→T ch [°C]→Typical Capacitance vs. V DS Typical Input Charge Forward Characteristics of Reverse Diode↑7↑8↑↑9C [n F ]V D S [V ]V G S [V ]I F [A ]V DS [V]→Q g [nC]→V SD [V]→Allowable Power Dissipation vs. T C Safe operation area↑Z t h (c h -c ) [K /W ]Transient Thermal impedance↑10↑1211P D [W ]I D [A ]T c [°C]→V DS [V]→t [s]→This specification is subject to change without notice!元器件交易网。
Z23S2407N中文资料(AEROVOX)中文数据手册「EasyDatasheet - 矽搜」

芯片中文手册,看全文,戳
Aerovox公司 ®
SuperMet & ZeMax TM 技术指标
特征
Aerovox路线SuperMet和ZEMAX
TM 电容器
•可根据金属外壳(铝合金外壳
利用最先进金属化聚丙烯薄膜技术状态.这款最新设
请求 - 请联系工厂)SuperMet
计材料结合领先设计技术,具有40多年电容经验.
咨询厂家
电气特性
应用
• 窗式空调 • 单元式空调 • 电动汽车 • 风扇与鼓风机 • Pumps • 洗衣房设备 • 除湿机 • 压缩机 •炉
• 温度范围:-40〜+ 70℃. • 电容范围3至80μF. • 电容公差±10%. • 电压范围240至440 VAC,60赫兹. • 损耗因数0.1%以下@ 60赫兹和25℃. • 绝缘电阻1000MΩ每μF.
芯片中文手册,看全文,戳
Aerovox公司 ®
交流电动机运行电容器
ZeMax TM - 铝合金外壳
AEROMET II - 塑料盒
美国制造
SuperMet - 金属外壳
芯片中文手册,看全文,戳
Aerovox公司 ®
目录
AEROMET II规格(系列M型).......................................... .................................... 3 SuperMet & ZeMax TM 规格(系列Z型)............................................ .................. 4 部分编号系统.............................................................................................................五 AEROMET II评分表(单台容量)系列M型....................................... ........... 6 AEROMET II评分表(双功能)系列型号M ....................................... ............. 8 SuperMet评分表(单台容量)系列Z型........................................ ............... 9 SuperMet评分表(双容量)系列Z型........................................ .............. 11 ZeMax TM 评分表(单台容量)系列Z型......................................... ........... 13 AEROMET II机械尺寸.............................................. .......................................... 15 SuperMet机械尺寸............................................... ........................................... 16 ZeMax TM 机械Dimensions............................................................................................17 附件 - 安装硬件.............................................. ............................................ 18
2SA系列(PNP型)三极管全参数表

2SA1031C
HITACHI
硅PNP三极管,高频低噪声放大,配对管2SC458/2SC2310
300m
-100m
-30
-30
200M
100-500
3CK14F
2SA1031D
HITACHI
硅PNP三极管,高频低噪声放大,配对管2SC458/2SC2310
300m
-100m
-30
-30
硅PNP三极管,功率放大,功率开关,配对管2SC2655
900m
-2
-50
-50
100M
40-240
CK77B
2SA1020A
TRANSYS
硅PNP三极管,功率放大,功率开关,配对管2SC2655
900m
-2
-50
-50
100M
70-240
CK77B
2SA1020P
PANASONIC
硅PNP三极管,功率放大,功率开关,配对管2SC2655
-25
200M
50-340
CK77A
2SA0684
PANASONIC
硅PNP三极管,低频功率放大和驱动,配对管2SC1384
1
-1.5
-60
-50
200M
50-340
CK77A
2SA0794
PANASONIC
硅PNP三极管,低频功率放大和驱动,配对管2SC1567
1.2
-500m
-100
-100
120M
TOSHIBA
硅PNP三极管,TO-92,放大
900m
-1
-160
-160
15M
ADUM1201ARZ-RL7中文资料

3 ns maximum channel-to-channel matching High common-mode transient immunity: > 25 kV/µs Safety and regulatory approvals
UL recognition 2500 V rms for 1 minute per UL 1577
APPLICATIONS
The ADuM120x isolators provide two independent isolation channels in a variety of channel configurations and data rates (see the Ordering Guide). Both parts operate with the supply voltage on either side ranging from 2.7 V to 5.5 V, providing compatibility with lower voltage systems as well as enabling a voltage translation functionality across the isolation barrier. In addition, the ADuM120x provide low pulse-width distortion (< 3 ns for CR grade) and tight channel-to-channel matching (< 3 ns for CR grade). Unlike other optocoupler alternatives, the ADuM120x isolators have a patented refresh feature that ensures dc correctness in the absence of input logic transitions
MJ120-07A型使用手册

MJ120-07A型多业务数字交叉连接设备使用手册南京普天通信股份有限公司有线系统部POSTEL前言本手册介绍了本公司研制、生产的MJ120-07A型多业务数字交叉连接设备的基本结构、安装、使用和维护方法。
本手册主要供工程施工人员及维护人员参考使用,应仔细阅读各章节。
使用本手册请注意下列事项:1.禁止复制或转载本手册的任何部分;2.本手册保留升级更新之权利,恕不另行通知;3.错误之处,在所难免,欢迎对本手册提出任何修正意见。
安全使用要则1.不得用手触摸印制板上的元器件、布线及插头座中的金属导体。
维修盘必须触及时,应采取静电防护措施。
2.V.35和V.24数据业务接口的插头座在和用户终端设备连接时,不允许带电插拔。
3.强功率激光对人体特别对眼睛有危害,不得将发送器的尾纤端面或其上面的活动连接器的端面对着眼睛。
4.注意不得将光纤产生折弯,必须弯曲光纤时,曲率半径不得小于37.5mm。
5.设备中的光纤活动连接器不得随意打开,维修设备必须打开时,需采取保护措施,以免连接器的端面被污染。
6.数据业务接口的用户电缆不得在室外传输,光纤通信设备须注意对强电和雷电的防护,尤其应注意光缆在设备终端时,必须采取有效措施,以免将强电或雷电引入设备,损坏接口电路和用户终端设备。
7.设备安装时,应可靠保护接地。
8.网络管理用的计算机是专用设备,不得挪作它用。
特别不得使用来历不明的软盘,以免病毒的侵害。
9.在安装和设置前,仔细阅读本手册。
目录第一章产品综述 (1)1 产品概述 (1)2 系统说明 (1)2.1 设备配置 (1)2.2 系统功能 (1)2.2.1 系统组成 (1)2.2.2 系统功能框图 (2)2.2.3 系统配置 (2)3 系统特点 (3)4 技术指标 (3)4.1 环境要求 (3)4.2 电源 (3)4.3 E1接口指标 (3)4.4 光接口 (3)4.5 以太网接口 (3)4.6 用户环路接口/热线接口 (4)4.7 音频接口 (4)4.8 V.24接口 (4)4.9 V.35接口 (4)4.10 64K同向型接口 (4)5 机械结构 (4)第二章设备使用说明 (5)1 主处理盘(MPU-MS) (5)1.1 功能 (5)1.2 单盘外形图及面板说明 (5)2 数字中继盘(DTK-1) (6)2.1 功能 (6)2.2 面板说明 (6)2.3 E1接口阻抗 (6)3 电源盘(PWRC/PWRB) (7)3.1 功能 (7)3.2 面板说明 (7)4 环路接口盘 (7)4.1 环路接口盘应用方式 (7)4.2 局端环路接口盘(SLC) (8)4.2.1 功能 (8)4.2.2 面板说明 (8)4.3 远端环路接口盘(SLR) (8)4.3.2 面板说明 (8)5 热线接口盘(HOT)和磁石接口盘(MAG) (8)5.1 应用方式 (8)5.2 面板说明 (8)6 EM/音频接口盘(EM/VF) (8)6.1 EM/音频接口盘应用方式 (8)6.2 面板说明 (9)6.3 EM/VF接口盘(6路)单盘设置 (9)6.3.1 印制板NJA7.822.1131/1131B (9)6.3.2 印制板NJA7.822.1131A (10)6.4 EM/VF接口盘(12路)单盘设置 (11)7 V.35接口盘(N×64KⅣ、V.35) (13)7.1 V.35接口的应用 (13)7.2 N×64KⅣ盘说明 (13)7.2.1 印制板说明 (13)7.2.2 单盘外形及面板说明 (13)7.2.3 数据接口收发数据沿的约定 (14)7.2.4 设置说明 (14)7.3 V.35盘说明 (15)8 V.24接口盘(V24-1) (15)8.1 V.24接口应用方式 (15)8.2 V.24接口盘(6路)说明 (15)8.2.1 印制板说明 (15)8.2.2 单盘外形及面板说明 (15)8.2.3 设置说明 (16)8.3 V.24接口盘(16路)说明 (16)9 以太网接口盘(E-NET、E-NET-1、E-NET-1_8) (16)9.1 概述 (16)9.2 E-NET盘说明 (16)9.2.1 单盘外形及面板说明 (16)9.2.2 设置说明 (17)9.3 E-NET-1盘说明 (17)9.3.1 单盘外形及面板说明 (17)9.3.2 网口连接说明 (17)9.4 E-NET-1_8盘说明 (17)10 64K同向型接口盘(64KCD) (17)11 光盘(06J) (18)11.1 功能描述和应用 (18)11.2 开关设置 (18)11.3 光口及E1口连线 (18)12 光盘(08J) (19)12.1 功能描述和应用 (19)12.2 开关设置 (19)13 背板使用说明(背板布置、各部分的功能) (20)13.1 背板平面示意图 (20)13.2 背板接线说明 (21)13.2.1 电源输入插座 CK (21)13.2.2 电源输入熔丝 FU1和FU2 (21)13.2.3 馈电熔丝FU3 (21)13.2.4 网管接口RS232、IP (21)13.2.5 段号、站号设置开关ADDR (21)13.2.6 接口业务的出线JK1~JK10 (22)13.2.7 E1接口出线 (22)第三章应用 (23)1 树状网应用 (23)2 链型网应用 (23)3 星型网应用 (24)第四章设备安装 (25)1 开箱及检查 (25)2 备附件 (25)3 安装固定 (25)4 电源及地的连接 (26)5 E1接口的连接 (26)6 网管监控接口的连接 (26)7 段号和站号的设置 (27)8 用户电缆的连接 (27)9 上电 (29)第五章设备设置 (30)1 时钟的设置 (30)1.1 时钟类型定义 (30)1.2 不同网络的时钟选择原则 (30)2 段号、站号的设置 (30)第六章日常维护 (31)附录1 设备的MAC地址、IP地址、掩码、网关以及SOCKET端口号的设置 (32)1.1IP地址、掩码、网关设置 (32)附图1 2M同轴接头的装焊方法 (33)附图2 网络线的做法 (34)第一章产品综述1产品概述MJ120-07A型多业务数字交叉连接设备是一种模块化的多业务接入设备。
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TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT process)2SA1201Voltage Amplifier Applications Power Amplifier Applications• High voltage: V CEO = −120 V• High transition frequency: f T = 120 MHz (typ.) • Small flat package• P C = 1 to 2 W (mounted on a ceramic substrate) • Complementary to 2SC2881Absolute Maximum Ratings (Ta = 25°C)Characteristics Symbol Rating UnitCollector-base voltage V CBO −120 V Collector-emitter voltage V CEO −120 V Emitter-base voltage V EBO −5 V Collector current I C −800 mABase currentI B −160 mA P C500 Collector power dissipationP C (Note 1)1000mWJunction temperature T j 150 °C Storage temperature rangeT stg−55 to 150°CNote 1: Mounted on a ceramic substrate (250 mm 2 × 0.8 t)Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).Unit: mmPW-MINI JEDEC ―JEITA SC-62 TOSHIBA 2-5K1AWeight: 0.05 g (typ.)Electrical Characteristics (Ta = 25°C)Characteristics Symbol TestCondition MinTyp.Max UnitCollector cut-off current I CBO V CB = −120 V, I E = 0――−0.1μAEmitter cut-off current I EBO V EB = −5 V, I C = 0 ――−0.1μA Collector-emitter breakdown voltage V (BR) CEO I C = −10 mA, I B = 0 −120 ―― V Emitter-base breakdown voltage V (BR) EBO I E = −1 mA, I C = 0 −5 ―― VDC current gain h FE(Note 3)V CE = −5 V, I C = −100 mA 80 ―240Collector-emitter saturation voltage V CE (sat)I C = −500 mA, I B = −50 mA ――−1.0V Base-emitter voltage V BE V CE = −5 V, I C = −500 mA ――−1.0V Transition frequency f T V CE = −5 V, I C = −100 mA ― 120 ― MHz Collector output capacitance C ob V CB = −10 V, I E = 0, f = 1 MHz ―― 30 pF Note 3: h FE classification O: 80 to 160, Y: 120 to 240Markinglead (Pb)-free finish.Collector-emitter voltage V CE (V)I C – V CEC o ll e c to r c u r r e n t IC (m A )Base-emitter voltage V BE (V)I C – V BEC o l l e ct o r c u r r e n t I C (A )Safe Operating AreaC o lle c t o r c ur r e n t I C (m A )Collector-emitter voltage V CE (V)Collector current I C (mA)h FE – I CD C c u r r e n t g a i nh F ECollector current I C (mA)V CE (sat) – I CC o l l e c t o r -e m i t t e r s a t u r a t i onv ol t a g eV C E (s a t ) (V )Ambient temperature Ta (°C)P C – TaC o l l e c t o r p o w e r d i s s i p a t i o n P C (W )−3−30−1000−10−100 −300−−−−−3−−−−−−−−−−−−−−−−−−−−−−120 80100 406020140 160RESTRICTIONS ON PRODUCT USE20070701-EN •The information contained herein is subject to change without notice.•TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property.In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk.•The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.• The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties.• Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.。