QQ-S-571 REV F

by a letter
or combination
Flux
types
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Solid metal (no flux) Rosin flux Mildly activated rosin flux Activated rosin or resin flux Organic, water soluble flux (WSF-O) ; does not contain pol yglycol (s) A31 other organic water soluble fluxes; -Y cOntain p01y91yc01 (s) Low residue fluxes; this type has a low solids content and is intended to minimize the residue which remains after soldering operations Non-zosin or non-resin flux ~j
cored
Condition symbol D --------P --------Percentage symbol <1 -------1 --------2 --------3 --------4 --------6~/-------
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Nominal 0.6 1.1 2.2 3.3 4.5 6.0
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QQ-s-571F May 18, 1994 SUPERSEDING QQ-S-571E May 5, 1972 FEDERAL SPECIFICATION SOLDER, ELECTRONIC (96 TO 485”C) specification was This approved by the Commissioner, Federal Supply Service, General Services Administration, for the use of all Federal agencies. 1. SCOPE AND CLASSIFICATION
AUSC N/A DISTRIBUTION unlimited.
STATEMENT
A.
Approved
for
public
release;
FSC distribution
3439 is
QQ-S-571F
Solid Sn63Pb37 z Composition (1.2.1.1)
solder
(no flux)
I AC I
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&/ Type etc.
Ac includes and
acids,
Qrganic to Type
chloride,
inoxganic B-32.
chloride,
is equivalent
“IS” per ASTM
lo
I I I I I t I I I b I I 1
only to flux 1.2.1.4 Core condition and flux percentage lapplicable and flux percentage are solders except as noted) . The core condition identified by a single letter and number, in accordance with table III. TAOLE III. Core condition and flux percentage Condition Dry powder Pl;siic Flux percentage t4i nimum 0.4 0.8 >1.5 >2.6 >3.9 >5.0
1 .2.2 Class designation. Solder alloys covered by this shall be identified by the fallowing application classes:
specification
1.2. 2.1 Class 1 - General app lications. Class 1 soldering applications are equipments where continued performance is critical, where downtime cannot be tolerated, and/or where the equipment is a life support item. Military electronic hardware falls into this class. 1 .2.2.2 Class 2 - High purity app lications Class 2 soldering
1 .2.1.1
Cmnpositio”.
with
TABLE symbol B I P R s w
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Form I Fo KM LI f3a r Ingot Paste Ribbon Special Wire
---------------------”----------------------------------------------------------------------------------------------------------
___l__!_ Fo rrn (1.2.1.2)
Flux type (1.2.1.3)
Flux-cored Sn63Pb37 _!_l Composition (1.2.1.1) Form (1.2.1..21
solder
L Flux type (1.2.1.3) Core condition and flux percentage (1.2.1.4) -
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The type designation shall be in one of the 1.2.1 TyP e designation. following forms, and as specified (see 6. 6) . The Sn63Pb37 alloy is shown for example only. The exact alloy to be specified shall be selected in accordance with 3.2.
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This specification covers fluxed and non-fluxed solders in 1.1 2sQk?s(preforms) for use the form of bars, ingots, ribbon, wire, paste, and special General and High Purity in two classes of electronic product applications, (see 1.2.2). 1.2 Classification
3
QQ-S-571 F
TABLE Size
IV.
Powder I
mesh
size
and
flux percentage~i mesh size
symbol
Powder
A------f3 ------c-----Percentage symbol 1 2 3 4 5 6 7 - ----------------------------------------------
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100 200 325 Flux percentage Maximum Minimum 1.0 <s >5 <10 >10 .515 >15 <z o >20 <2 s >25 S30 over 30 based on agreement between the
Al Other mesh sizes may be used buyer and the seller.
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~~ See 6.7 to 6.7.2 inclusive, ~f i“cl”des pellets, preforms,
as applicable. etc. (see 6.61 .
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I I 1 aa-s.571F
1.2. 1.3 of letters,
The flux type is indicated Flux type. in accordance with table II. TABLE symbol s R P+lA PJ+ WSF-O WS F- 1 LR II. Flux types
2.
APPLICABLE
DOCUMENTS of the issue in effect on date of invitation form a part of this specification to the
2.1 The following documents, for bids or request for proposal, extent specified herein. Federal Specifications: -
Maximum 0.8 $1.5 s2.6 S3.9 S5.O S7.O
1.2 .1.5 Powder mesh size and flux percentage (applicable only to solder The powder mesh size and flux percentage is identified by a single w. letter and a number, in accordance with table IV.