3.2 A Fast On-Chip Profiler Memory
关于芯片的说明文英语作文

关于芯片的说明文英语作文A chip, also known as an integrated circuit, is a small piece of silicon that contains thousands or millions oftiny electronic components. These components work together to perform various functions, such as processing data, storing information, and controlling electronic devices.Chips are used in a wide range of electronic devices, including computers, smartphones, and digital cameras. They are essential for the operation of these devices, as they provide the processing power and memory needed to run software and perform tasks.The development of chips has played a crucial role in the advancement of technology. Over the years, chips have become smaller, faster, and more powerful, allowing for the creation of more advanced and efficient electronic devices.One of the key benefits of chips is their ability to perform complex tasks in a small and lightweight package.This has enabled the development of portable and wearable devices that can be easily carried and used on the go.In addition to consumer electronics, chips are alsoused in industrial and commercial applications, such as in the automotive, healthcare, and aerospace industries. They are used to control and monitor complex systems, such as engine management systems in cars, medical imaging equipment, and navigation systems in aircraft.As technology continues to advance, the demand forchips is expected to grow. This will drive furtherinnovation in chip design and manufacturing, leading toeven smaller, faster, and more powerful chips in the future.。
MEMORY存储芯片STM8S003F3P6中文规格书

This is information on a product in full production.August 2018DS7147 Rev 10Value line, 16-MHz STM8S 8-bit MCU, 8-Kbyte Flash memory, 128-byte data EEPROM, 10-bit ADC, 3 timers, UART, SPI, I²CDatasheet - production dataFeaturesCore•16 MHz advanced STM8 core with Harvard architecture and 3-stage pipeline •Extended instruction setMemories•Program memory: 8 Kbyte Flash memory; data retention 20 years at 55 °C after 100 cycles •RAM: 1 Kbyte•Data memory: 128 bytes true data EEPROM;endurance up to 100 k write/erase cyclesClock, reset and supply management• 2.95 V to 5.5 V operating voltage•Flexible clock control, 4 master clock sources –Low-power crystal resonator oscillator –External clock input–Internal, user-trimmable 16 MHz RC –Internal low-power 128 kHz RC •Clock security system with clock monitor •Power management–Low-power modes (wait, active-halt, halt)–Switch-off peripheral clocks individually –Permanently active, low-consumption power-on and power-down resetInterrupt management•Nested interrupt controller with 32 interrupts •Up to 27 external interrupts on 6 vectorsTimers•Advanced control timer: 16-bit, 4 CAPCOM channels, 3 complementary outputs, dead-time insertion and flexible synchronization •16-bit general purpose timer, with 3 CAPCOM channels (IC, OC or PWM)•8-bit basic timer with 8-bit prescaler •Auto wakeup timer•Window and independent watchdog timersCommunications interfaces•UART with clock output for synchronousoperation, SmartCard, IrDA, LIN master mode •SPI interface up to 8 Mbit/s •I 2C interface up to 400 Kbit/sAnalog to digital converter (ADC)•10-bit ADC, ± 1 LSB ADC with up to 5multiplexed channels, scan mode and analog watchdogI/Os•Up to 28 I/Os on a 32-pin package including 21high-sink outputs •Highly robust I/O design, immune against current injectionDevelopment support•Embedded single-wire interface module(SWIM) for fast on-chip programming and non-intrusive debuggingDescription STM8S003F3 STM8S003K3DS7147 Rev 102 DescriptionThe STM8S003F3/K3 value line 8-bit microcontrollers offer 8 Kbytes of Flash programmemory, plus integrated true data EEPROM. They are referred to as low-density devices in the STM8S microcontroller family reference manual (RM0016).The STM8S003F3/K3 value line devices provide the following benefits: performance, robustness and reduced system cost.Device performance and robustness are ensured by true data EEPROM supporting up to 100000 write/erase cycles, advanced core and peripherals made in a state-of-the-arttechnology at 16 MHz clock frequency, robust I/Os, independent watchdogs with separate clock source, and a clock security system.The system cost is reduced thanks to a high system integration level with internal clock oscillators, watchdog, and brown-out reset.Full documentation is offered as well as a wide choice of development tools.Table 1. STM8S003F3/K3 value line featuresFeaturesSTM8S003K3STM8S003F3Pin count3220Max. number of GPIOs (I/O)2816External interrupt pins 2716Timer CAPCOM channels 77Timer complementary outputs 32A/D converter channels 45High-sink I/Os2112Low-density Flash program memory (byte)8 K 8 K RAM (byte)1 K 1 K True data EEPROM (byte)128(1)1.Without read-while-write capability.128(1)Peripheral setMulti purpose timer (TIM1), SPI, I2C, UART, Window WDG, independent WDG, ADC, PWM timer (TIM2), 8-bit timer (TIM4)DS7147 Rev 10STM8S003F3 STM8S003K3Block diagram3 Block diagramFigure 1. STM8S003F3/K3 value line block diagramXTAL 1-16 MHzRC int. 16 MHzRC int. 128 kHzSTM8 coreDebug/SWIMUART1I2CSPIAWU timerReset blockResetPORBORClock controllerDetectorClock to peripherals and core400Kbit/s8Mbit/sup to 5A d d r e s s a n d d a t a b u sWindow WDG8 Kbyte 128 byte 1 Kbyte RAMADC1ResetSingle wiredebug interfaceprogram Flashdata EEPROM16-bit general purpose16-bit advanced controltimer (TIM1)timer (TIM2)8-bit basic timer(TIM4)Beeper1/2/4 kHz beepIndependent WDG4 CAPCOM channels Up to 3 CAPCOM channelsUp to + 3 complementaryoutputsLIN master channelsSPI emul.STM8S003F3 STM8S003K3Product overviewDS7147 Rev 10Product overview STM8S003F3 STM8S003K3DS7147 Rev 104.12 TIM4 - 8-bit basic timer•8-bit autoreload, adjustable prescaler ratio to any power of 2 from 1 to 128•Clock source: CPU clock•Interrupt source: 1 x overflow/update4.13 Analog-to-digital converter (ADC1)STM8S003F3/K3 value line products contain a 10-bit successive approximation A/Dconverter (ADC1) with up to 5 external multiplexed input channels and the following main features: •Input voltage range: 0 to V DDA •Conversion time: 14 clock cycles•Single and continuous, buffered continuous conversion modes •Buffer size (10 x 10 bits)•Scan mode for single and continuous conversion of a sequence of channels •Analog watchdog capability with programmable upper and lower thresholds •Analog watchdog interrupt •External trigger input •Trigger from TIM1 TRGO •End of conversion (EOC) interruptNote:Additional AIN12 analog input is not selectable in ADC scan mode or with analog watchdog. Values converted from AIN12 are stored only into the ADC_DRH/ADC_DRL registers.4.14 Communication interfacesThe following communication interfaces are implemented:•UART1: full feature UART, synchronous mode, SPI master mode, SmartCard mode,IrDA mode, LIN2.1 master capability •SPI: full and half-duplex, 8 Mbit/s •I²C: up to 400 Kbit/sTable 3. TIM timer featuresTimerCounter size (bits)PrescalerCounting mode CAPCOM channels Complem. outputs Ext. trigger Timersynchr-onization/ chainingTIM1 16Any integer from 1 to 65536Up/down 43Yes NoTIM2 16Any power of 2 from 1 to 32768Up 30No TIM48Any power of 2 from 1 to 128UpNo。
MEMORY存储芯片MAX13487EESA+T中文规格书

Half-Duplex RS-485-/RS-422-Compatible Transceiver with AutoDirection Control MAX13487E/MAX13488E General DescriptionThe MAX13487E/MAX13488E +5V, half-duplex, ±15kV ESD-protected RS-485/RS-422-compatible transceivers feature one driver and one receiver. The MAX13487E/MAX13488E include a hot-swap capability to eliminate false transitions on the bus during power-up or live insertion.The MAX13487E/MAX13488E feature Maxim’s propri-etary AutoDirection control. This architecture makes the devices ideal for applications, such as isolated RS-485 ports, where the driver input is used in conjunction with the driver-enable signal to drive the differential bus.The MAX13487E features reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing error-free trans-mission up to 500kbps. The MAX13488E driver slew rate is not limited, allowing transmit speeds up to 16Mbps.The MAX13487E/MAX13488E feature a 1/4-unit load receiver input impedance, allowing up to 128 trans-ceivers on the bus. These devices are intended for half-duplex communications. All driver outputs are protected to ±15kV ESD using the Human Body Model. The MAX13487E/MAX13488E are available in an 8-pin SO package. The devices operate over the extended -40°C to +85°C temperature range.Applications Isolated RS-485 InterfacesUtility MetersIndustrial ControlsIndustrial Motor DrivesAutomated HVAC SystemsBenefits and Features •AutoDirection Saves Space and BOM Cost •AutoDirection Enables Driver Automatically on Transmission, Eliminating an Opto or Other Discrete Means of Isolation •8-Pin SO Package •Robust Protection Features for Telecom, Industrial,and Isolated Applications •Hot-Swap Capability to Eliminate False Transitions on the Bus During Power-Up or Live Insertion •Extended ESD Protection for RS-485 I/O Pins (±15kV Human Body Model)•Options Optimize Designs for Speed or Errorless Data Transmission •Enhanced Slew-Rate Limiting Facilitates Error-Free Data Transmission (MAX13487E)•High-Speed Version (MAX13488E) Allows for Transmission Speeds Up to 16Mbps •1/4-Unit Load, Allowing Up to 128 Transceivers on the Bus Ordering Information/Selector Guide+Note:All devices operate over the -40°C to +85°C temperature range.Pin Configuration/Typical Application Circuit appear at end of data sheet.Functional Diagram 19-0740; Rev 1; 2/15找MEMORY 、二三极管上美光存储MAX13487E/MAX13488E Half-Duplex RS-485-/RS-422-Compatible Transceiver with AutoDirection Control Integrated | 7Typical Operating Characteristics (continued)(V CC = +5.0V, T A = +25°C, unless otherwise noted.)RECEIVER PROPAGATION vs. TEMPERATURE(MAX13488E)TEMPERATURE (°C)R E C E I VE R P R O P A G A T I O N (n s )603510-1510203040-4085DRIVER PROPAGATION (500kbps)(MAX13487E)M A X 13487E t o c 17DI 2V/div A-B5V/div400ns/div DRIVER PROPAGATION (16Mbps)(MAX13488E)DI 2V/div A-B 5V/div 10ns/div RECEIVER PROPAGATION (16Mbps)(MAX13488E)MA X 13487E t o c 19B 2V/div RO 2V/div A2V/div10ns/div DRIVING 16nF (19.2kbps)(MAX13487E)M A X 13487E t o c 20DI2V/divA-B 5V/div10μs/div DRIVING 16nF (19.2kbps)(MAX13488E)M A X 13487E t o c 21DI2V/div A-B5V/div 10μs/div DRIVING 16nF (750kbps)(MAX13488E)M A X 13487E t o c 22DI 2V/div A-B 5V/div400ns/div。
MEMORY存储芯片N25Q032A13ESC40F中文规格书

Table 11: DDR2 I DD Specifications and Conditions (Die Revision M) (Continued)Notes: 1.I DD specifications are tested after the device is properly initialized. 0°C ≤ T C ≤ +85°C.2.V DD = +1.8V ±0.1V, V DDQ = +1.8V ±0.1V, V DDL = +1.8V ±0.1V, V REF = V DDQ/2.3.I DD parameters are specified with ODT disabled.4.Data bus consists of DQ, DM, DQS, DQS#, RDQS, RDQS#, LDQS, LDQS#, UDQS, andUDQS#. I DD values must be met with all combinations of EMR bits 10 and 11.5.Definitions for I DD conditions:LOW V IN≤ V IL(AC)maxHIGH V IN≥ V IH(AC)minStable Inputs stable at a HIGH or LOW levelFloating Inputs at V REF = V DDQ/2Switching Inputs changing between HIGH and LOW every other clock cycle (once pertwo clocks) for address and control signalsSwitching Inputs changing between HIGH and LOW every other data transfer (onceper clock) for DQ signals, not including masks or strobes6.I DD1, I DD4R, and I DD7 require A12 in EMR to be enabled during testing.7.The following I DD values must be derated (I DD limits increase) on IT-option and AT-optiondevices when operated outside of the range 0°C ≤ T C ≤ 85°C:WhenT C≤ 0°C (IT)I DD2P and I DD3P(SLOW) must be derated by 4%; I DD4R and I DD5W must be de-rated by 2%; and I DD6 and I DD7 must be derated by 7%AC and DC Operating ConditionsTable 13: Recommended DC Operating Conditions (SSTL_18)Input Electrical Characteristics and Operating ConditionsTable 15: Input DC Logic LevelsNote:1.V DDQ + 300mV allowed provided 1.9V is not exceeded.Table 16: Input AC Logic LevelsNote:1.Refer to AC Overshoot/Undershoot Specification (page 58).Figure 13: Single-Ended Input Signal Levels650mV775mV864mV882mV 900mV 918mV 936mV 1,025mV1,150mVNote: 1.Numbers in diagram reflect nominal DDR2-400/DDR2-533 values.Preliminary1Gb: x4, x8, x16 DDR2 SDRAMInput Electrical Characteristics and Operating Conditions。
飞思卡尔KE02系列简介

1Kinetis E seriesKinetis E series provide the highly scalable portfolio ofARM ® Cortex ®-M0+ MCUs in the industry. With 2.7–5.5 V supply and focus on exceptional EMC/ESD robustness,Kinetis E series devices are well suited to a wide range of applications in electrical harsh environments, and is optimized for cost-sensitive applications offering low pin-count option.The Kinetis E series offers a broad range of memory,peripherals, and package options. They share common peripherals and pin counts allowing developers to migrate easily within an MCU family or among the MCU families to take advantage of more memory or feature integration. This scalability allows developers to standardize on the Kinetis E series for their end product platforms, maximising hardware and software reuse and reducing time-to-market.Following are the general features of the Kinetis E series MCUs.•32-bit ARM Cortex-M0+ core•Scalable memory footprints from 8 KB flash / 1 KB SRAM to 128 KB flash / 16 KB SRAM•Precision mixed-signal capability with on chip analog comparator and 12-bit ADC•Powerful timers for a broad range of applications including motor control•Serial communication interfaces such as UART, SPI,I 2C, and others.•High security and safety with internal watchdog andprogrammable CRC moduleProduct BriefRev 3, 07/2013KE02 Product BriefSupports all KE02 devices© 2013 Freescale Semiconductor, Inc.Contents1Kinetis E series..........................................................12KE02 sub-family introduction..................................23Block diagram...........................................................34Features.....................................................................45Power modes.. (136)Revision history (14)•Single power supply (2.7–5.5 V) with full functional flash program/erase/read operations•Ambient operation temperature range: –40 °C ~ 105 °CKinetis E series MCU families are supported by a market-leading enablement bundle from Freescale and numerous ARM third-party ecosystem partners. The KE02 sub-family is the entry-point to the Kinetis E series and is pin-compatible within E series and with the Freescale's 8-bit S08P family.2KE02 sub-family introductionThis sub-family includes a powerful array of analog, communication, and timing and control peripherals with specific flash memory size and the pin count.•Core and architecture:•ARM Cortex-M0+ core running up to 20 MHz with zero wait state execution from memories•Single-cycle access to I/O: Up to 50 percent faster than standard I/O, improves reaction time to externalevents allowing bit manipulation and software protocol emulation•Two-stage pipeline: Reduced number of cycles per instruction (CPI), enabling faster branch instruction andISR entry, and reducing power consumption•Excellent code density in comparison to 8-bit and 16-bit MCUs: Reduced flash size, system cost, andpower consumption•Optimized access to program memory: Accesses on alternate cycles reduces power consumption•100 percent compatible with ARM Cortex-M0 and a subset ARM Cortex-M3/M4: Reuse existingcompilers and debug tools•Simplified architecture: 56 instructions and 17 registers enable easy programming and efficient packagingof 8/16/32-bit data in memory•Linear 4 GB address space removes the need for paging/banking, reducing software complexity•ARM third-party ecosystem support: Software and tools to help minimize development time/cost •Bus clock running up to 20 MHz•BME: Bit manipulation engine reduces code size and cycles for bit-oriented operations to peripheral registerseliminating traditional methods where the core would need to perform read-modify-write operations.•Power-saving:•Low-power ARM Cortex-M0+ core with excellent energy efficiency•Supports three power modes: Run, Wait and Stop•Supports clock gating for unused modules, and specific peripherals remain working in Stop mode •Memory:•Up to 64 KB program flash, 256 B EEPROM, 4 KB SRAM•Embedded 32 B flash cache for optimizing bus bandwidth and flash execution performance •Mixed-signal analog:•Up to 16 channels of 12-bit analog-to-digital conversion (ADC) with 2.5 µs conversion time, 1.7 mV/°Ctemperature sensor, internal bandgap reference channel, supporting automatic compare, optional hardwaretrigger, and operating in Stop mode•Up to two analog comparators (ACMP) with both positive and negative inputs, separately selectable interrupt onrising and falling comparator output•Human-machine interface (HMI):•Up to two keyboard interrupt modules (KBI)•Connectivity and communications:•Up to three serial communications interface (UART) modules with optional 13-bit break, full duplex non-returnto zero (NRZ) and LIN extension support•Up to two serial peripheral interface (SPI) modules with full-duplex or single-wire bidirectional and master orslave mode•One Inter-integrated circuit ( I2C) module with bit rate up to 100 kbit/s, support system management bus •Reliability, safety and security:•Internal watchdog with independent clock source•Cyclic redundancy check (CRC) with programmable 16- or 32-bit polynomial generator•FlexTimer module (FTM) including one 6-channel FTM with deadtime insertion and fault detection, and up totwo 2-channel FTMs backward compatible with TPM modules. Each channel can be configured for inputcapture, output compare, edge- or center-aligned PWM mode.•Periodic interrupt timer (PIT) for RTOS task scheduler time base or trigger source for ADC conversion and timer modules•16-bit real timer counter (RTC)•I/O and package:•Up to 57 GPIO pins with interrupt functionality•Up to 2 true open-drain output pins•Up to 8 ultra high current sink pins supporting 20 mA source/sink current•Multiple package options from 32-pin to 64-pinThe family acts as a low-power, high-robustness, and cost-effective microcontroller to provide developers an appropriate entry-level 32-bit solution. The family is next generation MCU solution with enhanced ESD/EMC performance for cost-sensitive, high-reliability devices applications used in high electrical noise environments.3Block diagramThe following figure shows a superset block diagram of the device. Other devices within the family have a subset of the features.Kinetis KE02 FamilyFigure 1. KE02 family block diagramFeatures4.1Feature summaryAll devices within the KE02 sub-family have a minimum of the following features.44.2Memory and package optionsThe following table summarizes the memory and package options for the KE02 family. All devices which share a common package are pin-for-pin compatible.4.3Part numbers and packagingQ KE## A FFF T PP CC (N)Qualification statusFamily Flash sizeTemperature range (°C)Speed (MHz)Package identifierTape and Reel (T&R)Key attributeFigure 2. Part numbers diagrams4.4KE02 family featuresThe following sections list the differences among the various devices available within the KE02 family.The features listed below each part number specify the maximum configuration available on that device. The signal multiplexing configuration determines which modules can be used simultaneously.4.4.1KE02 family features (20 MHz performance)4.5Module-by-module feature listThe following sections describe the high-level module features for the family's superset device. See KE02 family features (20 MHz performance) for differences among the subset devices.Core modules4.5.1.1ARM Cortex-M0+ core•Up to 20 MHz core frequency from 2.7 V to 5.5 V across temperature range of –40 °C to 105 °C •Supports up to 32 interrupt request sources•2-stage pipeline microarchitecture for reduced power consumption and improved architectural performance (cycles per instruction)•Binary compatible instruction set architecture with the Cortex-M0 core •Thumb instruction set combines high code density with 32-bit performance •Serial wire debug (SWD) reduces the number of pins required for debugging •Single cycle 32 bits by 32 bits multiply4.5.1.2Nested Vectored Interrupt Controller (NVIC)Following are the features of the NVIC module.•Up to 32 interrupt sources•Includes a single non-maskable interrupt4.5.1.3Asynchronous Wake-up Interrupt Controller (AWIC)The features of the AWIC module are given below.•Supports interrupt handling when system clocking is disabled in low-power modes•Takes over and emulates the NVIC behavior when correctly primed by the NVIC on entry to very deep sleep mode.• A rudimentary interrupt masking system with no prioritization logic signals for wake-up as soon as a non-masked interrupt is detected•Contains no programmer’s model visible state and is therefore invisible to end users of the device other than through the benefits of reduced power consumption while sleeping4.5.1.4Debug controller•2-pin serial wire debug (SWD) provides external debugger interfaceSystem modules4.5.2.1Power Management Control (PMC) unitThe features of the PMC module are listed below.•Separate digital (regulated) and analog (referenced to digital) supply outputs •Programmable power saving modes•No output supply decoupling capacitors required•Available wake-up from power saving modes via RTC and external inputs •Integrated power-on-reset (POR)•Integrated low voltage detect (LVD) with reset (brownout) capability •Selectable LVD trip points•Programmable low-voltage warning (LVW) interrupt capability •Buffered bandgap reference voltage output4.5.14.5.2•Factory programmed trim for bandgap and LVD • 1 kHz low-power oscillator (LPO)4.5.2.2Watchdog (WDOG) moduleThe features of the Watchdog module are described as follows.•Independent clock source input (independent from CPU/bus clock)•Choice between clock sources• 1 kHz internal low-power oscillator (LPOCLK)•Internal 32 kHz reference clock (ICSIRCLK)•External clock (OSCERCLK)•Bus clock4.5.2.3System clocksThe following clock sources can be used as system clocks.•System oscillator (OSC)—Loop-control pierce oscillator; crystal or ceramic resonator range of 31.25 to 39.0625 kHz (low-range mode) or 4-20 MHz (high-range mode)•Internal clock source (ICS)•Frequency-locked loop (FLL) controlled by internal or external reference•16 MHz~20 MHz FLL output•Internal reference clocks—Can be used as a clock source for the other on-chip peripherals•On-chip RC oscillator range of 31.25 to 39.0625 kHz oscillator with ±1% deviation across temperature range of 0 °C to 70 °C and ±1.5% deviation across across full temperature rangeMemories and memory interfaces4.5.3.1On-chip memory•20 MHz performance devices•Up to 64 KB flash memory •Up to 256 B EEPROM memory •Up to 4 KB SRAM•Security circuitry to prevent unauthorized access to RAM and flash contentsAnalog4.5.4.1Analog-to-Digital Converter (ADC)The features of the ADC module are given below.•Linear successive approximation algorithm with 8-, 10-, or 12-bit resolution•Up to 16 external analog inputs, external pin inputs, and 5 internal analog inputs including internal bandgap,temperature sensor, and references•Output formatted in 8-, 10-, or 12-bit right-justified unsigned format•Single or continuous conversion (automatic return to idle after single conversion)•Supports up to eight result FIFO with selectable FIFO depth 4.5.34.5.4•Conversion complete flag and interrupt•Input clock selectable from up to four sources•Operation in Wait or Stop modes for lower noise operation •Asynchronous clock source for lower noise operation •Selectable asynchronous hardware conversion trigger•Automatic compare with interrupt for less-than, or greater-than or equal-to, programmable value4.5.4.2Analog Comparator (ACMP)The ACMP module has the following features.•Operational over the whole supply range of 2.7–5.5 V•On-chip 6-bit resolution DAC with selectable reference voltage from V DD or internal bandgap •Configurable hysteresis•Selectable interrupt on rising-edge, falling-edge, or both rising or falling edges of the comparator output •Selectable inversion on comparator output•Up to four selectable comparator inputs; one of these is fixed and connected to built-in DAC output while the others are externally mapped on pinouts.•Operational in Stop modeTimer4.5.5.1FlexTimers (FTM)The FlexTimer module exhibits the following features.•Selectable FTM source clock •Programmable prescaler•16-bit counter supporting free-running or initial/final value, and counting is up or up-down •Input capture, output compare, and edge-aligned and center-aligned PWM modes •Input capture and output compare modes•Operation of FTM channels as pairs with equal outputs, pairs with complimentary outputs, or independent channels with independent outputs•Deadtime insertion is available for each complementary pair •Generation of hardware triggers •Software control of PWM outputs•Up to four fault inputs for global fault control •Configurable channel polarity•Programmable interrupt on input capture, reference compare, overflowed counter, or detected fault condition4.5.5.2Periodic Interrupt Timer (PIT)The features of the PIT module are given below.•Two general-purpose interrupt timers•One interrupt timer for triggering ADC conversions •32-bit counter resolution•Clocked by bus clock frequency4.5.5.3Real-Time Clock (RTC)Following are the features of the real-time clock.4.5.5•16-bit up-counter•16-bit modulo match limit•Software controllable periodic interrupt on match•Software selectable clock sources for input to prescaler with programmable 16 bit prescaler•OSC 32.678 kHz nominal •LPO (~1 kHz)•Bus clock•Internal reference clock (32 kHz)Communication interfaces4.5.6.1Inter-Integrated Circuit (I 2C)The features of the I 2C module are as follows.•Compatible with I 2C bus standard•Up to 100 kbit/s with maximum bus loading •Multimaster operation•Software programmable for one of 64 different serial clock frequencies •Programmable slave address and glitch input filter •Interrupt-driven byte-by-byte data transfer•Arbitration lost interrupt with automatic mode switching from master to slave •Calling address identification interrupt•Bus busy detection broadcast and 10-bit address extension•Address matching causes wake-up when processor is in low-power mode.4.5.6.2Universal Asynchronous Receiver/Transmitter (UART)The UART module has the following features.•Full-duplex, standard non-return-to-zero (NRZ) format•Double-buffered transmitter and receiver with separate enables •Programmable baud rates (13-bit modulo divider)•Interrupt-driven or polled operation:•Transmit data register empty and transmission complete •Receive data register full•Receive overrun, parity error, framing error, and noise error •Idle receiver detect•Active edge on receive pin •Break detect supporting LIN•Hardware parity generation and checking •Programmable 8-bit or 9-bit character length •Programmable 1-bit or 2-bit stop bits•Receiver wake-up by idle-line or address-mark•Optional 13-bit break character generation / 11-bit break character detection •Selectable transmitter output polarity4.5.6.3Serial Peripheral Interface (SPI)The features of the SPI module are listed below.•Master and slave mode•Full-duplex, three-wire synchronous transfers4.5.6•Programmable transmit bit rate•Double-buffered transmit and receive data registers •Serial clock phase and polarity options •Slave select output•Mode fault error flag with CPU interrupt capability •Control of SPI operation during Wait mode •Selectable MSB-first or LSB-first shifting •Receive data buffer hardware match featureHuman machine interface4.5.7.1General-Purpose Input/Output (GPIO)The features of the GPIO module are listed below.•Hysteresis and configurable pull up device on all input pins •Configurable drive strength on some output pins•Independent pin value register to read logic level on digital pin4.5.7.2Keyboard Interrupts (KBI)The KBI features include:•Up to eight keyboard interrupt pins with individual pin enable bits •Each keyboard interrupt pin is programmable as:•falling-edge sensitivity only •rising-edge sensitivity only•both falling-edge and low-level sensitivity •both rising-edge and high-level sensitivity •One software-enabled keyboard interrupt •Exit from low-power modes5Power modesThe power management controller (PMC) provides the user with multiple power options. The different modes of operation are supported to allow the user to optimize power consumption for the level of functionality needed.The device supports Run, Wait, and Stop modes which are easy to use for customers both from different power consumption level and functional requirement. I/O states are held in all the modes.•Run mode—CPU clocks can be run at full speed and the internal supply is fully regulated.•Wait mode—CPU shuts down to conserve power; system clocks and bus clock are running and full regulation is maintained.•Stop mode—LVD optional enabled, and voltage regulator is in standby.The three modes of operation are Run, Wait, and Stop. The WFI instruction invokes both Wait and Stop modes for the chip.4.5.76Revision historyThe following table provides a revision history for this document.How to Reach Us: Home Page: Web Support: /support Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein.Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages.“Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer's technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: /SalesTermsandConditions. Freescale, the Freescale logo, and Kinetis are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. ARM and Cortex-M0+ are the registered trademarks of ARM Limited.©2013 Freescale Semiconductor, Inc.Document Number KE02PBRevision 3, 07/2013。
Silicon Laboratories AN678 精确32 si32FlashUtility 命

Rev. 0.1 3/12Copyright © 2012 by Silicon LaboratoriesAN678P ROGRAMMER U SER ’S G UIDE1. IntroductionThe Precision32™ si32FlashUtility Command-Line Programmer is a simple program to enable productionprogramming capability using the Silicon Labs 32-bit USB Debug Adapter. This utility can also program and eraselock bytes.Figure 1 shows an invocation of the command-line utility.Figure 1.Precision32 si32FlashUtility Command-Line Programmer2. Relevant DocumentationPrecision32 Application Notes are listed on the following website: /32bit-appnotes.⏹ AN667: Getting Started with the Silicon Labs Precision32™ IDE⏹AN669: Integrating Silicon Labs SiM3xxxx Devices into the Keil µVision® IDEAN6783. Programming OptionsThe si32FlashUtlility has a command-line form of:si32FlashUtility [-options] [drive:][path]imageThese options consist of the following:⏹ -v: Verify the image after downloading to Flash.⏹ -i: Display additional information during the programming process (i.e., verbose mode).⏹ -e {0,1,2}: Erase Flash with three mode options.⏹ -p {0,1,2}: Debug port selection with three mode options.⏹ -r {0,1,2}: Reset during programming with three mode options.⏹ -l: List the available USB Debug Adapters (UDAs).⏹ -s SERIAL: Specify the USB Debug Adapter serial string.This section discusses each of these programming options in more detail.3.1. Download VerificationUsing the -v option flag causes the si32FlashUtility to verify the Flash contents after the download. The command-line utility will output a Download complete and verified message if the Flash contents match the HEX image. 3.2. Verbose FeedbackWith the -i option flag, the si32FlashUtility programmer will report feedback about each step of the programming process, as shown in Figure2.Figure2.Verbose Mode OutputAN6783.3. Flash EraseThe -e option flag has three modes: merge, sector, and full. The default option is sector (-e 1) if no option is specified.The merge option is selected with -e 0 and causes the programmer to read the current contents of the Flash page selected by the HEX file address, copy any contents that are not written in the HEX image, erase the page, and write the merged image back to Flash. This option allows developers to maintain any calibration or code constants in Flash when updating code.When using the -e 1 sector erase option, the programmer will first erase the page selected by the HEX image address before programming the contents of the HEX image.The final option, -e 2, causes the programmer to erase the entire Flash before programming the HEX image.3.4. Debug PortThis option selects the debug port of the device. The -p 0 selection is for any devices with JTAG debug pins. The -p 1 option is for devices with Serial Wire debug pins only (SW-DP). The -p 2 option uses the Serial Wire protocol and is for devices with both JTAG and Serial Wire debug pins (SWJ-DP), like the SiM3U1xx device family. The default option is -p 2 if no option is specified.The JTAG selection (-p 0) does not have provisions for JTAG chaining.3.5. Reset OptionsThe utility supports three different reset options: none, before, and during. The default option is none (-r 0) if no option is specified.The none option (-r 0) prevents the utility from toggling the reset pin at any point during the programming process. The before option (-r 1) allows the si32FlashUtility to toggle reset immediately before programming. This option is useful for SiM3U1xx or SiM3C1xx devices that may be unresponsive due to switching to a non-existent clock. Using this option along with the recommended reset delay in the startup code ensures the USB Debug Adapter will be able to communicate with the device.For the during option (-r 2), the utility asserts the reset pin while attempting to halt the core. Once the core is halted, the utility deasserts the reset pin and starts programming. This option ensures the Debug Adapter can always communicate with a device without the reset delay in the startup code for devices that support this feature.Note:The -r 2 option is unavailable for SiM3U1xx and SiM3C1xx devices.3.6. USB Debug Adapter OptionsThe -l option flag lists the available USB Debug Adapters connected to the PC or system. The -s SERIAL option flag can then specify the USB Debug Adapter the utility should use for programming.AN6784. Creating HEX Files with the Precision32 IDEThe si32FlashUtility programmer expects HEX files as its input, and the Precision32 IDE includes a utility that can convert the GCC AXF file output to HEX files. This objcopy utility can be found in the ..\Precision32_vx.y\IDE\precision32\Tools\arm-none-eabi\bin path after installing the Precision32 software package from /32bit-software.More information on the usage of this utility can be found on the CodeRed website: /CodeRedWiki/OutputFormats.4.1. Using the Objcopy Utility from the IDETo use the objcopy utility from the IDE:1. Hold the Ctrl button and left-click on the project name in the IDE footer as shown in Figure3. This willopen a command prompt in the project directory with the proper paths to use the utility.Figure3.Opening a Project Command Prompt2. Type cd build_directory, where build_directory is Debug by default.3. Invoke the utility: arm-none-eabi-objcopy -O ihex project_name.axf project_name.hex. In the case ofthis example, which uses the sim3u1xx_Blinky project: arm-none-eabi-objcopy -O ihexsim3u1xx_Blinky.axf sim3u1xx_Blinky.hex.Rev. 0.1AN678Rev. 0.1Figure 4.Invoking the Objcopy Utility4.2. Setting the IDE Project to Automatically Generate a HEX FileTo configure the Precision32 IDE project to automatically generate a HEX file after a build:1. Right-click on the project_name in the Project Explorer view.2. Select Properties .3. In the C/C++ Build →Settings →Build Steps tab, type the following in the Post-build steps →Commandbox: arm-none-eabi-objcopy -O ihex ${BuildArtifactFileName} ${BuildArtifactFileBaseName}.hexFigure 5.Automatically Generating a HEX File on Project BuildAN6785. Examples To verify the download of the sim3u1xx_Blinky.hex file:si32FlashUtility -v sim3u1xx_Blinky.hex This example is shown in Figure6.Figure 6.Example with Flash VerificationTo verify the download of the sim3u1xx_Blinky.hex file, use verbose mode, erase the device before the download,and reset before:si32FlashUtility -v -i -e 2 -r 1 sim3u1xx_Blinky.hexFigure 7 shows an example of this call to the si32FlashUtility programmer.Figure 7.Example with Flash Verification, Verbose Mode, Full Device Erase, and Reset BeforeOptions Silicon Laboratories Inc.400 West Cesar Chavez Austin, TX 78701USASimplicity StudioOne-click access to MCU andwireless tools, documentation,software, source code libraries &more. Available for Windows,Mac and Linux!IoT Portfolio /IoT SW/HW /simplicity Quality /quality Support and CommunityDisclaimer Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.Trademark Information Silicon Laboratories Inc.® , Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, Clockbuilder®, CMEMS®, DSPLL®, EFM®, EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®, Gecko®, ISOmodem®, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress® and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders.。
MEMORY存储芯片N25Q032A13EF640F中文规格书

Micron Serial NOR Flash Memory 3V, Multiple I/O, 4KB Sector EraseN25Q032AFeatures•SPI-compatible serial bus interface•108 MHz (MAX) clock frequency•2.7–3.6V single supply voltage•Dual/quad I/O instruction provides increased throughput up to 432 MHz•Supported protocols–Extended SPI, dual I/O, and quad I/O •Execute-in-place (XIP) mode for all three protocols –Configurable via volatile or nonvolatile registers –Enables memory to work in XIP mode directly af-ter power-on•PROGRAM/ERASE SUSPEND operations •Continuous read of entire memory via a single com-mand–FAST READ–QUAD or DUAL OUTPUT FAST READ–QUAD or DUAL I/O FAST READ•Flexible to fit application–Configurable number of dummy cycles–Configurable output buffer–RESET function available upon customer request •64-byte, user-lockable, one-time programmable (OTP) dedicated area•Erase capability–Subsector erase 4KB uniform granularity blocks –Sector erase 64KB uniform granularity blocks–Full-chip erase •Write protection–Software write protection applicable to every 64KB sector via volatile lock bit–Hardware write protection: protected area size defined by four nonvolatile bits (BP0, BP1, BP2,and TB)–Additional smart protections, available upon re-quest•Electronic signature–JEDEC-standard, 2-byte signature (BA16h)–Unique ID code: 17 read-only bytes, including:•Two additional extended device ID bytes toidentify device factory options•Customized factory data (14 bytes)•Minimum 100,000 ERASE cycles per sector •More than 20 years data retention•Packages (JEDEC-standard, RoHS compliant)–F4 = U-PDFN-8 4mm x 3mm (MLP8)–F6 = V-PDFN-8 6mm x 5mm (MLP8)–F8 = V-PDFN-8 8mm x 6mm (MLP8)–12 = T-PBGA-24b05 6mm x 8mm–SC = SOP2-8 150 mils body width (SO8N)–SF = SOP2-16 300 mils body width (SO16W)–SE = SOP2-8 208 mils body width (SO8W)CCMTD-1725822587-8448n25q_32mb_3v_65nm.pdf - Rev. K 05/18 EN 1Micron Technology, Inc. reserves the right to change products or specifications without notice.© 2011 Micron Technology, Inc. All rights reserved.Products and specifications discussed herein are subject to change by Micron without notice.Signal AssignmentsFigure 2: 8-Pin, VDFPN8 – MLP8 and SOP2 – SO8W (Top View)12348765S#DQ1W#/V PP /DQ2V SSV CC HOLD#/DQ3C DQ0Notes: 1.On the underside of the MLP8 package, there is an exposed central pad that is pulledinternally to V SS and must not be connected to any other voltage or signal line on the PCB.2.Reset functionality is available in devices with a dedicated part number. See Part Num-ber Ordering Information for complete package names and details.Figure 3: 16-Pin, Plastic Small Outline – SO16 (Top View)12345678161514131211109C DQ0DNU DNU DNU DNU V SS W#/V PP /DQ2HOLD#/DQ3V CCDNUDNUDNUDNUS#DQ1Note: 1.Reset functionality is available in devices with a dedicated part number. See Part Num-ber Ordering Information for complete package names and details.32Mb, 3V , Multiple I/O Serial Flash Memory Signal AssignmentsCCMTD-1725822587-8448n25q_32mb_3v_65nm.pdf - Rev. K 05/18 EN 9Micron Technology, Inc. reserves the right to change products or specifications without notice.© 2011 Micron Technology, Inc. All rights reserved.Memory OrganizationMemory Configuration and Block DiagramEach page of memory can be individually programmed. Bits are programmed from one through zero. The device is subsector, sector, or bulk-erasable, but not page-erasable.Bits are erased from zero through one. The memory is configured as 4,194,304 bytes (8bits each); 64 sectors (64KB each); 1024 subsectors (4KB each); and 16,384 pages (256bytes each); and 64 OTP bytes are located outside the main memory array.Figure 5: Block DiagramHOLD#S#W#/VCDQ0DQ132Mb, 3V , Multiple I/O Serial Flash Memory Memory OrganizationCCMTD-1725822587-8448n25q_32mb_3v_65nm.pdf - Rev. K 05/18 EN 13Micron Technology, Inc. reserves the right to change products or specifications without notice.© 2011 Micron Technology, Inc. All rights reserved.Table 15: Flag Status Register Bit Definitions (Continued)Notes: 1.Register bits are read by READ FLAG STATUS REGISTER command. All bits are volatile.2.These program/erase controller settings apply only to PROGRAM or ERASE command cy-cles in progress, or to the specific WRITE command cycles in progress as shown here.3.Status bits are reset automatically.4.Error bits must be reset by CLEAR FLAG STATUS REGISTER command.5.Typical errors include operation failures and protection errors caused by issuing a com-mand before the error bit has been reset to 0.32Mb, 3V , Multiple I/O Serial Flash Memory Nonvolatile and Volatile RegistersCCMTD-1725822587-8448n25q_32mb_3v_65nm.pdf - Rev. K 05/18 EN 26Micron Technology, Inc. reserves the right to change products or specifications without notice.© 2011 Micron Technology, Inc. All rights reserved.。
MEMORY存储芯片N25Q032A13ESF40F中文规格书

Table 137: Basic I DD , I PP , and I DDQ Measurement Conditions (Continued)8Gb: x4, x8, x16 DDR4 SDRAM Current Specifications – Measurement ConditionsCAS WRITE LatencyCAS WRITE latency (CWL) is defined by MR2[5:3] as shown in the MR2 Register Defini-tion table. CWL is the delay, in clock cycles, between the internal WRITE command and the availability of the first bit of input data. The device does not support any half-clock latencies. The overall WRITE latency (WL) is defined as additive latency (AL) + parity la-tency (PL) + CAS WRITE latency (CWL): WL = AL +PL + CWL.Low-Power Auto Self RefreshLow-power auto self refresh (LPASR) is supported in the device. Applications requiring SELF REFRESH operation over different temperature ranges can use this feature to opti-mize the I DD6 current for a given temperature range as specified in the MR2 Register Definition table.Dynamic ODTIn certain applications and to further enhance signal integrity on the data bus, it is de-sirable to change the termination strength of the device without issuing an MRS com-mand. This may be done by configuring the dynamic ODT (R TT(WR)) settings in MR2[11:9]. In write leveling mode, only R TT(NOM) is available.Write Cyclic Redundancy Check Data BusThe write cyclic redundancy check (CRC) data bus feature during writes has been added to the device. When enabled via the mode register, the data transfer size goes from the normal 8-bit (BL8) frame to a larger 10-bit UI frame, and the extra two UIs are used for the CRC information.8Gb: x4, x8, x16 DDR4 SDRAM Mode Register 2。
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Categories and Subject Descriptors
B.3.0 [Memory Structures]: General.
adaptive architectures, low power, embedded CAD, binary tree, memory design, embedded systems. Profiling an application executing on a microprocessor is a technique needed to solve a wide variety of optimization problems. In the domain of computing, profiling generally means to determine the relative frequency of code regions of interest as a program executes, ranging from fine-grained items like individual statements or basic blocks, to coarser-grained items such as loops or subroutines. The term has also been used to refer to determining the relative frequencies of values that a variable takes on during program execution. Profiling appears as part of the solution for a tremendous variety of program and hardware optimization and design automation problems. For example, profiling has long been used to find the most frequently executed subroutines of an application, so that a programmer might focus on optimizing those subroutines [10]. Profiling has been used in compilers to map frequently executed code and data to non-interfering cache regions [15] to improve performance. The approach in [8] proposes using
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*Also with the Center for Embedded Computer Systemofiling an application executing on a microprocessor is part of the solution to numerous software and hardware optimization and design automation problems. Most current profiling techniques suffer from runtime overhead, inaccuracy, or slowness, and the traditional non-intrusive method of using a logic analyzer doesn’t work for today’s system-on-a-chip having embedded cores. We introduce a novel on-chip memory architecture that overcomes these limitations. The architecture, which we call ProMem, is based on a pipelined binary tree structure. It achieves single-cycle throughput, so it can keep up with today’s fastest pipelined processors. It can also be laid out efficiently and scales very well, becoming more efficient the larger it gets. The memory can be used in a wide-variety of common profiling situations, such as instruction profiling, value profiling, and network traffic profiling, which in turn can be used to guide numerous design automation tasks.
3.2
A Fast On-Chip Profiler Memory
Roman Lysecky, Susan Cotterell, Frank Vahid*
Department of Computer Science and Engineering University of California, Riverside {rlysecky, susanc, vahid}@, /~vahid
General Terms: Performance, Design. Keywords: Profiling, system-on-a-chip, platform tuning, 1. INTRODUCTION
profiling to generate alternate subroutine versions for common cases, with the program then using run-time profiling to pick the best version. Likewise, the approach in [14] uses profiling information to synthesize hardware optimized to the most common situations. Dynamic binary translation methods profile in order to store the translation results of frequent code regions, for improved performance as well as power [13], while dynamic optimization methods search for the hottest blocks for runtime recompilation [3]. The approaches in [4][9] use profiling to detect frequent loops to map to a special address region that an architecture would then map to a small low-power loop cache, while the approach in [12] compresses those regions to reduce memory traffic and hence power. The approach in [6] profiles values of variables or subroutine parameters to detect pseudo-constants that can aid a compiler in optimizing for performance, or even for reduced energy [7]. Most previous profiling approaches, being intended for desktop computing systems, introduce runtime overhead. In particular, either they insert additional code into the application binary, or they interrupt the processor at particular intervals to sample the processor’s registers. However, for embedded systems, runtime overhead is often not acceptable, since very tight real-time constraints must be met. Thus, embedded system designers in the past relied on logic analyzers to non-intrusively profile an executing application – though even this was cumbersome and hence not a common feature in design automation techniques. The trend of increasing chip transistor capacity has led to systems-on-a-chip (SOCs). While providing tremendous advantages in terms of cost, size, performance and power, SOCs have the drawback of low accessibility to the internal components. Thus, logic analyzer probes cannot be connected to arbitrary buses inside the SOC to achieve profiling. Although SOCs typically come with means for accessing internal registers through external pins (e.g., using the JTAG standard [11]), such access is accomplished by stopping normal application execution and then serially scanning the register contents in or out. This access approach incurs large runtime overhead, being intended for test and debug purposes rather than profiling. Fortunately, the same transistor capacity trend that has led to SOCs has enabled hardware-based approaches to profiling. While on-chip profiling hardware in the past has been limited to highvolume high-performance microprocessors, such hardware can today be added to embedded system prototyping platforms. Platforms [16][18] are predesigned SOCs targeted to particular application domains, like set-top boxes, network switches, digital cameras, etc. While some platforms are oriented towards implementation in actual products, others are intended specifically for prototyping. These prototype-oriented platforms are intentionally designed larger than necessary, to accommodate the widest possible range of applications. Thus, adding a relatively small amount of hardware would likely not be an issue, especially since such platforms are specifically designed for use during the design stage, when profiling would be most needed.