Ultra-Broadband Photodetector for the Visible to TeraHertz

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海康威视 DS-2DF8C825IXS-AELW(T5) 8MP 25× 网络IR速度球机摄像头商品

海康威视 DS-2DF8C825IXS-AELW(T5) 8MP 25× 网络IR速度球机摄像头商品

DS-2DF8C825IXS-AEL(T5)8 MP 25× Network IR Speed DomeHikvision DS-2DF8C825IXS-AELW(T5) 8MP 25× Network IR Speed Dome adopts 1/1.2" progressive scan CMOS chip. With the 25× optical zoom lens, the camera offers more details over expansive areas. This series of cameras can be widely used for wide ranges of high-definition, such as the rivers, forests, roads, railways, airports, ports, squares, parks, scenic spots, stations and large venues, etc.⏹1/1.2" progressive scan CMOS⏹High quality imaging with 8 MP resolution⏹Excellent low-light performance with DarkFighter technology⏹25× optical zoom and 16× digital zoom provide close up views over expansive areas⏹Expansive night view with up to 500 m IR distance⏹Water and dust resistant (IP67) and vandal resistant (IK10) excluding glass window⏹Supports face capture to detect, capture, grade, and select faces in motion⏹Supports road traffic to detect vehicles⏹DORIThe DORI (detect, observe, recognize, identify) distance gives the general idea of the camera ability to distinguish persons or objects within its field of view.It is calculated based on the camera sensor specification and the criteria given by EN 62676-4: 2015.DORI Detect Observe Recognize IdentifyDefinition25 px/m63 px/m125 px/m250 px/m Distance (Tele) 3750 m (12303.1 ft.) 1488.1 m (4882.2 ft.) 750 m (2460.6 ft.) 375 m (1230.3 ft.)⏹SpecificationCameraImage Sensor 1/1.2" progressive scan CMOSMin. Illumination Color: 0.002 Lux @(F1.6, AGC ON), B/W: 0.0002 Lux @(F1.6, AGC ON), 0 Lux with IR Shutter Speed 1/1 s to 1/30,000 sSlow Shutter YesDay & Night IR cut filterZoom 25x optical, 16x digitalMax. Resolution 3840 × 2160LensFocus Auto, semi-auto, manual, rapid focusFocal Length 7.5mm to 187.5mmZoom Speed Approx. 6.8 sFOV Horizontal field of view: 60.4° to 3.7° (wide-tele), Vertical field of view: 36.2° to 2.1° (wide-tele), Diagonal field of view: 67.8° to 4.3° (wide-tele)Aperture Max. F1.6IlluminatorSupplement Light Type IRSupplement Light Range Up to 500 mSmart Supplement Light YesPTZMovement Range (Pan) 360°Movement Range (Tilt) -20° to 90° (auto flip)Pan Speed Pan speed: configurable from 0.1° to 210°/s; preset speed: 280°/s Tilt Speed Tilt speed: configurable from 0.1° to 150°/s, preset speed 250°/s Proportional Pan YesPresets 300Patrol Scan 8 patrols, up to 32 presets for each patrolPattern Scan 4 pattern scans, record time over 10 minutes for each scan Power-off Memory YesPark Action Preset, pattern scan, patrol scan, auto scan, tilt scan, random scan, frame scan, panorama scan3D Positioning Yes PTZ Status Display Yes Preset Freezing YesScheduled Task Preset, pattern scan, patrol scan, auto scan, tilt scan, random scan, frame scan, panorama scan, dome reboot, dome adjust, aux outputVideoMain Stream 50 Hz: 25 fps (3840 × 2160, 2560 × 1440, 1920 × 1080, 1280 × 960, 1280 × 720);60 Hz: 24 fps (3840 × 2160, 2560 × 1440, 1920 × 1080, 1280 × 960, 1280 × 720)Sub-Stream 50 Hz: 25 fps (704 × 576, 640 × 480, 352 × 288) 60 Hz: 24 fps (704 × 480, 640 × 480, 352 × 240)Third Stream 50 Hz: 25 fps (1920 × 1080, 1280 × 960, 1280 × 720, 704 × 576, 640 × 480, 352 × 288) 60 Hz: 24 fps (1920 × 1080, 1280 × 960, 1280 × 720, 704 × 480, 640 × 480, 352 × 240)Video Compression Main stream: H.265+/H.265/H.264+/H.264 Sub-stream: H.265/H.264/MJPEGThird stream: H.265/H.264/MJPEGVideo Bit Rate 32 Kbps to 16384 KbpsH.264 Type Baseline Profile/Main Profile/High ProfileH.265 Type Main ProfileScalable Video Coding (SVC) H.264 and H.265 encodingRegion of Interest (ROI) 8 fixed regions for each streamAudioAudio Compression G.711alaw, G.711ulaw, G.722.1, G.726, MP2L2, PCMAudio Bit Rate 64 Kbps (G.711)/16 Kbps (G.722.1)/16 Kbps (G.726)/32 to 192 Kbps (MP2L2) NetworkNetwork Storage NAS (NFS, SMB/ CIFS), ANRProtocols IPv4/IPv6, HTTP, HTTPS, 802.1x, QoS, FTP, SMTP, UPnP, SNMP, DNS, DDNS, NTP, RTSP, RTCP, RTP, TCP/IP, UDP, IGMP, ICMP, DHCP, PPPoE, BonjourAPI ISUP, ISAPI, Hikvision SDK, Open Network Video Interface (Profile S, Profile G, Profile T) Simultaneous Live View Up to 20 channelsUser/Host Up to 32 users 3 user levels: administrator, operator, and userSecurity Password protection, complicated password, HTTPS encryption, 802.1X authentication (EAP-TLS, EAP-LEAP, EAP-MD5), watermark, IP address filter, basic and digest authentication for HTTP/HTTPS, RTP/RTSP over HTTPS, control timeout settings, security audit log, TLS 1.3, host authentication (MAC address)Client HikCentral, iVMS-4200, Hik-ConnectWeb Browser IE11, Chrome 57.0+, Firefox 52.0+, Safari 11+ ImageDay/Night Switch Day, night, auto, scheduled-switchImage Enhancement BLC, HLC, 3D DNRWide Dynamic Range (WDR) 140 dBDefog Optical defogImage Stabilization EIS (Built-in gyroscope to improve EIS performance) Regional Exposure YesRegional Focus YesImage Settings Saturation, brightness, contrast, sharpness, gain, and white balance adjustable by client software or web browserImage Parameters Switch YesPrivacy Mask Up to 24 masks, mosaic mask, mask color configurable, rectangle regionSNR ≥ 52 dBInterfaceEthernet Interface 1 RJ45 10M/100M self-adaptive Ethernet portOn-board Storage Built-in memory card slot, support microSD/microSDHC/microSDXC cards, up to 256 GBAlarm 7 inputs, 2 outputsAudio 1 input (line in), max. input amplitude: 2-2.4 vpp, input impedance: 1 KΩ ± 10%; 1 output (line out), line level, output impedance: 600 ΩVideo Output 1.0 V[p-p]/75 Ω, PAL, NTSC, BNC connectorRS-485 Half duplex, HIKVISION, Pelco-P, Pelco-D, self-adaptive EventBasic Event Audio exception, motion detection, video tampering alarm, alarm input, alarm output, exceptionSmart Event Line crossing detection, region entrance detection, unattended baggage detection, object removal detection, intrusion detection, region exiting detection, vandal-proof alarm, audio exception detectionSmart Tracking Manual tracking, auto-trackingAlarm Linkage Preset, patrol scan, pattern scan, memory card video recording, alarm output, sending email, notify surveillance center, upload to FTP, NAS video recordingDeep Learning FunctionFace Capture Support detecting up to 30 faces at the same time. Support detecting, tracking, capturing, grading, selecting of face in motion, and output the best face picture of the faceFace Comparison YesPerimeter Protection Line crossing, intrusion, region entrance, region exitingSupport alarm triggering by specified target types (human and vehicle)Road Traffic and Vehicle DetectionRoad Traffic Support vehicle detection (license plate number, vehicle model, and vehicle color recognition)GeneralOperating Condition Temperature: -40°C to 70°C (-40°F to 158°F), Humidity: ≤ 95%Language 33 languages: English, Russian, Estonian, Bulgarian, Hungarian, Greek, German, Italian, Czech, Slovak, French, Polish, Dutch, Portuguese, Spanish, Romanian, Danish, Swedish, Norwegian, Finnish, Croatian, Slovenian, Serbian, Turkish, Korean, Traditional Chinese, Thai, Vietnamese, Japanese, Latvian, Lithuanian, Portuguese (Brazil), UkrainianPower Consumption and Current 24 VAC (Max. 62 W, including max. 12 W for IR and max. 8 W for heater), PoE 802.3 bt (Max. 51 W, including max. 12 W for IR and max. 8 W for heater)Dimension Ø 267 mm × 430 mm (Ø 10.51" × 16.93") Weight Approx. 9.6 kg (21.16 lb.)ApprovalEMC FCC SDoC (47 CFR Part 15, Subpart B);CE-EMC (EN 55032: 2015, EN 61000-3-2: 2019, EN 61000-3-3: 2013+A1:2019, EN 50130-4: 2011 +A1: 2014);RCM (AS/NZS CISPR 32: 2015);IC VoC (ICES-003: Issue 7);KC (KN 32: 2015, KN 35: 2015)SafetyUL (UL 62368-1)CB (IEC 62368-1:2014+A11);CE-LVD (EN 62368-1:2014+A11:2017), BIS (IS 13252(Part 1):2010/ IEC 60950-1: 2005); LOA (IEC/EN 60950-1)Environment CE-RoHS (2011/65/EU); WEEE (2012/19/EU); Reach (Regulation (EC) No 1907/2006)ProtectionIP67 (IEC 60529-2013), IK10 (IEC 62262:2002), 6000V Lightning Protection, Surge Protection and Voltage Transient Protection⏹Typical ApplicationHikvision products are classified into three levels according to their anti-corrosion performance. Refer to the following description to choose for your using environment.This model has NO SPECIFIC PROTECTION.LevelDescriptionTop-level protectionHikvision products at this level are equipped for use in areas where professional anti-corrosion protection is a must. Typical application scenarios include coastlines, docks, chemical plants, and more.Moderate protectionHikvision products at this level are equipped for use in areas with moderate anti-corrosion demands. Typical application scenarios include coastal areas about 2 kilometers (1.24 miles) away from coastlines, as well as areas affected by acid rain.No specific protectionHikvision products at this level are equipped for use in areas where no specific anti-corrosion protection is needed.⏹Dimension⏹Available Model DS-2DF8C825IXS-AEL (T5)⏹Accessory ⏹OptionalDS-1603ZJ-P Wall Mount DS-1603ZJ-pole-PPole MountDS-1661ZJ-PPendant Mount。

通信英语(第四版)课后习题名词解释答案加翻译句子

通信英语(第四版)课后习题名词解释答案加翻译句子

1.PCM原理抽样量化与编码:sampling,quantizing and coding话路:speech channel幅值: amplitude value抽样频率: sampling frequency抽样速率: sampling rate脉冲流: stream of pulses重复率: repetition rate编码过程: coding process模拟信号: analog signal传输质量: transmission quality数字通信: digital communication数字传输: digital transmission含噪声的环境: noisy environment传输路由: transmission path信噪比 :signal-to-noise ratio信号电平 :signal levels噪声功率: noise power地面系统: terrestrial system二进制传输: binary transmission反向操作: reverse operation8-位码序列: 8-digit sequence接受端: receiving terminal帧格式 :frame format同步字 :synchronization word实现这三项功能的方案 :the schemes for performing these three functions一串幅值: a series of amplitude values电话质量的话路 a speech channel of telephone quality一个8位二进制码的序列: a sequence of 8-binary digits理论上的最小抽样频率 :a minimum theoretical sampling frequency占据着300Hz到3.4kHz频率范围的话路: a voice channel occupying the range 300Hz to 3.4kHz 每个样值8-位码: 8-digits per sample value汽车点火系统的打火: the sparking of a car ignition system重复率为64kHz的脉冲流: the stream of the pulses with a repetition rate of 64kHz真实信号与噪声信号的关系: relationship of the true signal to the noise signal由卫星上接受到的信号 :the signal received from a satellite一条特定消息中的全部信息 :the complete informatian about a particular message被传信号的波形 :the shape of the transmitted signal由传输路由引入的衰减: the attenuation introduced by transmission path将抽样的幅值转换成一串脉冲的单元 :the unit that converts sampled amplitude value to a set of pulses涉及到第一路,第二路及其他各路的序列: a sequence relating to channel 1,2 and so on被称为同步字的独特码序列: a unique sequence of pulses called synchronization word地面系统 :terrestrial system脉冲的“有”或“无” : the presence or absence of the pulses高速的电子开关: a high-speed electronic switch时分多路复用器 :the time division multiplexer时分多路复用 :Time Division Multiplexer2.异步串行数据传输串行接口 serial interface显示终端 CRT terminal发送器与接收器 transmitter and receiver数据传输 data transmission数据流 data stream闲置状态 the idle state传号电平 mark level空号电位 space level起始位 start bit停止位 stop bitT秒的持续时间 duration of T seconds奇偶校检位 parity bit错误标志 error flag传输错误 transmission error下降沿 fallinf edge符号间的空格 intersymbol space接收机的定时 receiver timing本地时钟 local clock磁带 magnetic tape控制比特 control bit逻辑1电平 logical 1 level二进制数据 binary data明显的缺点 obvious disadvantage异步串行数据传输 asynchronous serial data transmission最为流行的串行接口 the most popular serial interface所传送的数据 the transmitted data发送器与接收器的时钟 the clocks at the transmitter and receiver电传机的时代 the era of teleprinter一个字符的点和划 the dots and dashs of a character符号间空格持续时间的三倍 three times the duration of intersymbol space被称为字符的比特组 the group of bits called characters由7或8个比特的信息组成的固定单元 the invariable units comprising 7 or 8 bits of information 由接收机本地产生的时钟 a clock generated locally by the receiver在字符后所收到的奇偶校检位 the received parity bit following the character起始位的下降沿 the falling edge of the start bit数据链路面向字符的特性 the character-oriented nature of the data link3.数据通信地下电缆 underground cable通信卫星 communication satellite微波设备 microwave facilities调制器与解调器 modulator and demodulator缓冲器 buffer定时信号 timing signals同步脉冲 synchronization pulses时隙 time slot移位寄存器 shift register传输媒体 transmission medium线形衰弱 linear attenuation信息安全 information security键盘 keyboard数据终端 data terminals某种类型的数据转换设备 some type of data conversion equipment视频显示终端 visual display terminal称为数据调制解调器的双向数据发送接收机 two-way data transmistter-receiver called a data modem 全双工的数据传输系统 full-duplex data trandmission system由数据处理器的运算速率所决定的速率 the rate determined by the operating speed of the data processor由接口部件来的定时信号 timing signals from the interface assembly磁心存储器 magnetic core memories线性衰减和时延特性 linear attenuation and delay characteristics传输损伤 transmission impairments语音中的冗余特性 the redundant nature of speech在数据发送器中的编码过程 coding process in the data transmitter二进制的不归零信号 binary nonreturn-to-zero signal4.互联网网络资源:network resource信息服务:information services远程终端:remote terminals互联的系统:interconnected systems命令:command电子邮件:electronic mail主机:host无线信道:wireless channels搜索工具:searching tools用户界面:user interface存取:access文本信息:textual messages协议:protocol超文本协议:hypertext protocol分布在全世界的计算机的巨大网络:gaint network of computers located all over the world主干系统:backbone system全国范围的网络:nationwild network电子会议:electronic conferences实时对话:live conversation最大的信息库the largest repository of the computers on the net网络设备资源:network facilities resources在网上的绝大多数计算机:the vast majority of the computer on the netUNIX操作系统:the UNIX operating system在因特网和你的PC机之间传送数据的方法:a way to move data between the internet and your PC 方便的搜索工具:the convenient searching tools联网的超文本协议:the network hypertext protocol5.光纤通信介绍光纤通信:optical fiber communications光源:light source波长:wavelength激光器:laser色散:dispersion传输介质:transmission medium多模光纤:multi-mode fiber长途干线:long-houl trunks单模光纤:singer-mode fiber带宽:bandwidth带宽用户:wideband subscriber纤维光学:fiber-optics商用技术:commercial technologe门限电流:threshod current光检测器:photodetector波分复用:wavelength multiplexing纤维光网络:fiber-optic network视频带宽:video bandwidth长途传输:long distance transmission中继距离:repeater spacing已装光纤的总长度:the total length of installed fiber长途通信系统:long-haul telecommunication system低衰减的石英纤维:the low-loss silica fiber衰减接近瑞利极限的光纤:fibers with losses approaching the Rayleigh limit室温下的门限电流:room temperature threshold currents较长波长区:the longer wavelength region用户接入工程:subscriber access project部件性能和可靠性的改进:improvements in component performance and reliability已安装的光纤系统的数据速率:data rates for installed fibre optic system每秒吉比特:gigabit per second range波分复用:wavelength multiplexing带宽用户环路系统:widebend subscriber loop system多纤连接器:multifibre connectors设计寿命:projected lifetime光源:light source单模光纤:single-mode fibre分布反馈式激光器:distributed-feedback laser信息容量:information capacity交换体系:switching hierarchy带宽业务:broadband services9.蜂窝式移动电话系统蜂窝式移动电话:cellular mobile telephone服务性能:services performance频谱:frequency spectrum频带:frequency band微处理器:microprocessor移动手机:mobile unit广播业务:broadcast servise天线:antenna子系统:subsystems移动用户:mobile subscriber服务能力:service capability利用率:utilization带宽:bandwidth单边带:single-sideband扩频:spread spectrum大规模集成电路:large scale integrated circuits蜂窝点:cellular site蜂窝交换机:cellular switch无线机架:radio cabinet呼叫处理:call processing频谱利用率:frequency spectrum utilization有限的指定频带:the limited assigend ferquency band 服务区:servise area复杂的特性和功能:complicated features and functions大规模集成电路技术:large-scale integraesd circuit technology试验性的蜂窝系统:developmental cellular system中央协调单元:central coordinating element蜂窝管理:cellular administration传统移动电话的运行限制:operational limitiation of conventional mobile telephone system 有限的服务能力:limitied service capability无线通信行业:radio communcation industry可用的无线电频谱:available radio frequency spectrum所分配的频带:the allocated frequency band移动收发信机:mobile transceiver技术上的可行性:techological feasibility严格的频谱限制:severe spectrum limitations调频广播业务:FM broadcasting services传播路径衰耗:propagration path loss多径衰耗:multipath fading电话公司地方局:telephone company zone offices10.全球移动通信系统个人通信 personal communcation通信标准 communcation standrads固定电话业务 fixed telephone services网络容量 network capability移动交换中心 mobile switching center国际漫游 international roaming宽带业务 broadband services接口转换 interface conversion频谱分配 frequency allocation模拟方式 analogue mode蜂窝通信原理 cellular communcation principe拥塞 jamming蜂窝裂变 cellular splitting基站 base station寄存器 register收费功能 billing function接入方法 access method突发脉冲传输方式 brusty transimission mode开销信息 overhead information切换算法 handover algorithms短消息服务 short message services技术规范 technical specificationtotal access communcation system 全接入的通信系统global mobile communcation system 全球移动通信系统time division multiple access 时分多址facsimile and short message services 传真和短消息服务fixed communcation networks 固定通信网络a more personalized system 更加个性化的系统the cost and quality of the link 链路的价格和质量market growth 市场的发展fixed telephone service 固定电话服务coxial cable 同轴电缆interface convision 接口转换cellular communcation priciple 蜂窝通信原则frequency reuse and cell splitting 频率复用和蜂窝裂变cochannel interference 共信道干扰theoretical spectual capability 理论上的频谱容量micro-cellular system 微蜂窝系统base station transceiver 基站收发信机subscriber register 用户寄存器burst transmission mode 突发脉冲传输模式overhead information 开销信息advanced handover algorithms 先进的切换算法facsimile and short message services 传真和短消息服务the GSM technique specications GSM技术规范说明一1 . 研究二进制的传输可见, 只要简单地去判别脉冲的“有”和“无”, 我们就获得了一条消息的全部信息。

基于TDOA_的UWB_定位系统精度验证

基于TDOA_的UWB_定位系统精度验证

第14期2023年7月无线互联科技Wireless Internet TechnologyNo.14July,2023作者简介:陈妍妍(1984 ),女,河南信阳人,学士;研究方向:uwb 系统定位㊂基于TDOA 的UWB 定位系统精度验证陈妍妍(郑州联睿电子科技有限公司,河南郑州450000)摘要:随着移动物联时代的发展,无线网络的位置服务越来越重要㊂相对于传统的WiFi 定位㊁手机定位㊁蓝牙定位等几种常见的定位技术㊂以UWB 作为传输技术的定位系统,定位精度高,系统结构简单,传输距离远,抗多径干扰能力强,功耗低㊂因此基于UWB 的定位具有传统定位方式无法比拟的优势㊂文章在介绍UWB 的TDOA 定位算法和误差分析的基础上,重点测试验证了空旷环境下TDOA 算法的系统定位精度,定位区域内和定位区域外的精度差异㊂对实际定位场景应用有一定的参考价值㊂关键词:超宽带;无线通信;室内定位;定位精度中图分类号:TP311㊀㊀文献标志码:A0㊀引言㊀㊀随着无线通信技术的发展,社会进入移动物联时代,基于无线网络的位置服务(Location -Based Service,LBS)已经在人类生活的各方面扮演着不可或缺的重要角色[1]㊂自2021年苹果公司发布基于UWB 技术的AirTag,UWB 室内定位技术越来越被大众熟悉㊂UWB 定位技术成为无线定位技术的热点㊂1㊀基于TDOA 的双曲线定位算法㊀㊀双曲线定位也称为到达时间差(TDOA)定位,根据K 个参考节点到第Ai 个参考节点的到达时间差来决定Ai 的位置[2]㊂本研究假定K 个参考点分享一个共同的参考时钟,与参考时钟相比节点Ai 处的时间被延时了δ㊂这里关键是来自不同参考节点的时间通过相减后去掉了时延δ㊂观察参考节点中的一对(An ,A (n -1)),有:R ni -R (n -1)i =c (τni +δ)-c (τ(n -1)i +δ)=c (τni -τ(n -1)i )(1)一个TDOA 值可以定义为一条以接收机为焦点的竖曲线,目标辐射源就位于双曲线上[3]㊂由于一组双曲线无法确定标签的位置,因此至少需要3个基站才能够对标签进行定位,双曲线的交点即为标签的位置㊂TDOA 算法的位置计算公式如下:(x -x 2)2+(y -y 2)2-(x -x 1)2+(y -y 1)2=R 21(2)(x -x 3)2+(y -y 3)2-(x -x 1)2+(y -y 1)2=R 31(3)R 21=c (τ2-τ1)(4)R 31=c (τ3-τ1)(5)式(4)㊁式(5)中:c 为光速,τi 为第i 个基站收到定位信息的时间㊂各基站的位置信息是已知的,利用上述公式即可得到标签的位置信息,双曲线定位需要在参考节点间有一个精确的共同参考时钟,但并不要求基站和标签间准确同步㊂因为电磁波的传感速率很高,微小的同步误差会在算法中放大,从而降低定位系统的精度㊂2㊀基于TDOA 双曲线定位的误差分析㊀㊀基于UWB 的定位系统通常用于GNSS 信号接收不到或接收较差的室内复杂环境,不同定位场景的误差源不尽相同㊂常见的误差源主要有信号的同步误差㊁多径干扰误差㊁NLOS(非视距)误差等㊂不同的定位算法也对定位精度有一定的影响㊂2.1㊀信号同步误差㊀㊀同步误差在TDOA 定位的过程中,是一个非常重要的参数㊂在定位中,信号时间延迟的精度与各基站间的同步程度密切相关㊂室内环境下,特别是多径的传播环境下,接收到的信号峰值越接近实际的峰值点,定位精度将会越高㊂所以在定位计算中,如何获得优质的峰值点非常重要㊂2.2㊀多径误差㊀㊀定位场景中的许多物体,如地面,玻璃㊁桌子等都会对信号进行反射和衍射,这种信号从发射端经过物体反射和衍射到达接收机的现象就是多径传播㊂信号经过多径传播后,可能跟原来的信号在相位㊁幅度和延迟上都发生了变化㊂但接收机端并不能区分收到的信号是发射端直接发射过来的,还是经过物体反射衍射后收到的㊂而定位解算的误差程度是由这些信号经过多径的偏差程度来决定的㊂2.3㊀NLOS误差㊀㊀常见的定位场景中,信号的发射端和接收端经常存在各种遮挡,导致信号从发射端到接收端没有直达路径㊂这种信号经过衍射后同样也可以到达接收机,但接收机接收到的衍射信号经历了更多的延迟㊂这种衍射信号给定位带来的误差就是NLOS误差㊂2.4㊀环境及其他误差㊀㊀环境中影响电磁波的因素很多,水对电磁波的吸收就会造成湿度较大的天气下定位系统测试精度低于湿度低的天气下的测试精度㊂除了自然环境因素外,同频段的电子设备也会对UWB定位有干扰,高压电所产生的磁场也对定位系统精度有影响㊂2.5㊀定位算法精度的影响㊀㊀在TDOA定位算法中,初始值的选定为基站三角形的几何中心点㊂在得到TDOA测量值后,用迭代最小二乘法计算位置估计点的修正值,来逐步修正位置估计点㊂经过若干次迭代,使估计点与实际位置点的偏差逐步缩小㊂若修正值逐步收敛,并最终小于门限值,即为定位收敛成功;若修正值发散,或迭代超过最大迭代次数仍大于门限值,则视为定位收敛失败㊂定位系统的实时性和定位精度是可以根据需要动态调整㊂门限值和最大迭代次数的调整,可以在牺牲部分实时性的同时,一定程度上增加系统的定位精度㊂当精度下降一部分的时候,解算系统定位所需要的时间也会相应减少㊂3㊀基于TDOA定位系统的构建㊀㊀一个典型的TDOA二维定位单元,包含四个定位基站,一个定位标签㊂主基站发送信号确保参与定位基站的时钟同步㊂定位标签发送信号,定位基站接收信号并将数据传至引擎,引擎根据基站的准确位置坐标计算出定位标签的位置㊂4㊀基于TDOA的定位系统测试㊀㊀测试同步误差和同步标准差的时间单位为15.65ps,按照电磁波的传播速度c=3ˑ108m/s,不同时间误差条件下的理论距离误差如下:1ns对应的距离误差为30cm(1ns=10-9s,1ns约等于64个计数单位)㊂同步误差主要受上层基站距离的精度影响较大,在基站坐标测量比较准确的情况下,同步误差理论上会很小㊂4.1㊀空旷环境动态测试验证㊀㊀布设环境:20mˑ20m㊂室外空旷环境下同步标准差为20~30个单位㊂测试验证室外空旷环境下,二维定位区域内动态定位精度㊂测试环境空旷无遮挡,基站坐标的测量会存在一定的误差㊂动态测试选取平行于Y轴上的一条直线和区域内半径为1m的圆周运动2种方式㊂因考虑数据量的问题,直线运动沿直线往返2次,圆周运动沿圆周行走2周㊂动态定位精度如图1 2所示㊂图1㊀直线往返运动定位图2㊀圆周运动定位室外动态测试结果表明,室外空旷环境下,TDOA二维定位区域内的动态精度可以达到20cm以内㊂4.2㊀空旷环境二维区域外定位精度测试验证㊀㊀测试场景同动态定位场景,环境空旷无遮挡,地面为水泥路面㊂同步标准差为20~30个单位㊂基站坐标测量存在一定的误差㊂布设环境:20mˑ20m㊂区域内㊁外测试结果分别如表1 2所示㊂表1㊀区域内测试结果真实坐标定位均方根误差/cm 均值标准差(0,1000) 6.540.64 (500,500)15.010.64 (500,1500)11.110.77 (1000,0)15.030.94 (1000,1000) 6.210.67 (1000,2000)31.19 1.70 (1500,500)33.720.81 (1500,1500) 5.80 1.15 (2000,1000)30.18 1.61表2㊀区域外测试结果真实坐标定位均方根误差/cm均值标准差(-100,1000)256.85 1.76 (1000,-100)42.530.56 (1000,2100)28.49 2.06 (2100,1000)38.89 1.33从测试结果看,区域内精度基本满足30cm,区域外精度各边界表现不尽相同,最差精度大于1m㊂5 结语㊀㊀本文主要对UWB基于TDOA的定位算法和误差进行全面分析,进行了室外空旷环境的定位精度测试验证,对比相同环境下TDOA区域内和区域外的定位精度㊂测试结果表明,综合考虑测量误差,区域内实际测试精度基本都可以满足20cm内,定位稳定㊂区域边界精度略差,测试最大误差30~40cm㊂TDOA算法区域外定位的准确度和稳定度都不能保证,无法满足厘米级定位㊂参考文献[1]孙锦中.基于UWB技术的无线定位系统的研究与测试[J].上海电力学院学报,2011(4):333-336. [2]张媛,缪相林,王梅,等.UWB测距室内定位算法误差分析[J].导航定位学报,2020(6):132-136. [3]田增山,申文求,郑毅.无线定位系统的误差分析[J].电信科学,2005(6):5-8.(编辑㊀姚㊀鑫)TDOA-based UWB positioning system accuracy verificationChen YanyanZhengzhou Lianrui Electronic Technology Co. Ltd. Zhengzhou450000 ChinaAbstract Since AIRTAG entered the field of vision in2021 UWB technology in AIRTAG has been watched by the public and consumer-level markets and UWB-based interior positioning technology is also well known and used in life.With the development of the mobile phone era the location services of wireless networks are becoming more and more important and the research and development and application scenarios of ultra-broadband wireless communication technology are also increasing.Several traditional positioning technologies such as satellite positioning Bluetooth positioning WiFi positioning mobile phone positioning etc.Various positioning methods have different limitations.The communication network with UWB as transmission technology has many advantages with simple structure strong anti-multi-diameter interference ability low power consumption long transmission distance and high positioning accuracy.Therefore the positioning of UWB-based positioning has the advantages that cannot be compared with traditional positioning methods.On the basis of UWB s TDOA positioning algorithm and error analysis this thesis focuses on the test accuracy of TDOA in different environments and the accuracy differences in the positioning area and outside the positioning area.It has a certain reference value for the actual positioning scenario application.Key words ultra-broadband wireless communication indoor positioning positioning accuracy。

HP Color LaserJet Enterprise MFP M776用户指南说明书

HP Color LaserJet Enterprise MFP M776用户指南说明书

Legal informationCopyright and License© Copyright 2019 HP Development Company, L.P.Reproduction, adaptation, or translation without prior written permission is prohibited, except as allowedunder the copyright laws.The information contained herein is subject to change without notice.The only warranties for HP products and services are set forth in the express warranty statementsaccompanying such products and services. Nothing herein should be construed as constituting anadditional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.Edition 1, 10/2019Trademark CreditsAdobe®, Adobe Photoshop®, Acrobat®, and PostScript® are trademarks of Adobe Systems Incorporated.Apple and the Apple logo are trademarks of Apple Inc., registered in the U.S. and other countries.macOS is a trademark of Apple Inc., registered in the U.S. and other countries.AirPrint is a trademark of Apple Inc., registered in the U.S. and other countries.Google™ is a trademark of Google Inc.Microsoft®, Windows®, Windows® XP, and Windows Vista® are U.S. registered trademarks of MicrosoftCorporation.UNIX® is a registered trademark of The Open Group.iiiT able of contents1 Printer overview (1)Warning icons (1)Potential shock hazard (2)Printer views (2)Printer front view (2)Printer back view (4)Interface ports (4)Control-panel view (5)How to use the touchscreen control panel (7)Printer specifications (8)T echnical specifications (8)Supported operating systems (11)Mobile printing solutions (12)Printer dimensions (13)Power consumption, electrical specifications, and acoustic emissions (15)Operating-environment range (15)Printer hardware setup and software installation (16)2 Paper trays (17)Introduction (17)Load paper to Tray 1 (multipurpose tray) (17)Load Tray 1 (multipurpose tray) (18)Tray 1 paper orientation (19)Use alternative letterhead mode (24)Enable Alternative Letterhead Mode by using the printer control-panel menus (24)Load paper to Tray 2 (24)Load Tray 2 (24)Tray 2 paper orientation (26)Use alternative letterhead mode (29)Enable Alternative Letterhead Mode by using the printer control-panel menus (29)Load paper to the 550-sheet paper tray (30)Load paper to the 550-sheet paper tray (30)550-sheet paper tray paper orientation (32)Use alternative letterhead mode (35)Enable Alternative Letterhead Mode by using the printer control-panel menus (35)ivLoad paper to the 2 x 550-sheet paper trays (36)Load paper to the 2 x 550-sheet paper trays (36)2 x 550-sheet paper tray paper orientation (38)Use alternative letterhead mode (41)Enable Alternative Letterhead Mode by using the printer control-panel menus (41)Load paper to the 2,700-sheet high-capacity input paper trays (41)Load paper to the 2,700-sheet high-capacity input paper trays (41)2,700-sheet HCI paper tray paper orientation (43)Use alternative letterhead mode (45)Enable Alternative Letterhead Mode by using the printer control-panel menus (45)Load and print envelopes (46)Print envelopes (46)Envelope orientation (46)Load and print labels (47)Manually feed labels (47)Label orientation (48)3 Supplies, accessories, and parts (49)Order supplies, accessories, and parts (49)Ordering (49)Supplies and accessories (50)Maintenance/long-life consumables (51)Customer self-repair parts (51)Dynamic security (52)Configure the HP toner-cartridge-protection supply settings (53)Introduction (53)Enable or disable the Cartridge Policy feature (53)Use the printer control panel to enable the Cartridge Policy feature (54)Use the printer control panel to disable the Cartridge Policy feature (54)Use the HP Embedded Web Server (EWS) to enable the Cartridge Policy feature (54)Use the HP Embedded Web Server (EWS) to disable the Cartridge Policy feature (55)Troubleshoot Cartridge Policy control panel error messages (55)Enable or disable the Cartridge Protection feature (55)Use the printer control panel to enable the Cartridge Protection feature (56)Use the printer control panel to disable the Cartridge Protection feature (56)Use the HP Embedded Web Server (EWS) to enable the Cartridge Protection feature (56)Use the HP Embedded Web Server (EWS) to disable the Cartridge Protection feature (57)Troubleshoot Cartridge Protection control panel error messages (57)Replace the toner cartridges (58)T oner-cartridge information (58)Remove and replace the cartridges (59)Replace the imaging drums (62)Imaging drum information (62)Remove and replace the imaging drums (63)Replace the toner-collection unit (66)T oner-collection unit information (66)vRemove and replace the toner-collection unit (67)Replace the staple cartridge (M776zs model only) (70)Staple cartridge information (70)Remove and replace the staple cartridge (71)4 Print (73)Print tasks (Windows) (73)How to print (Windows) (73)Automatically print on both sides (Windows) (74)Manually print on both sides (Windows) (74)Print multiple pages per sheet (Windows) (75)Select the paper type (Windows) (75)Additional print tasks (76)Print tasks (macOS) (77)How to print (macOS) (77)Automatically print on both sides (macOS) (77)Manually print on both sides (macOS) (77)Print multiple pages per sheet (macOS) (78)Select the paper type (macOS) (78)Additional print tasks (79)Store print jobs on the printer to print later or print privately (79)Introduction (79)Create a stored job (Windows) (79)Create a stored job (macOS) (80)Print a stored job (81)Delete a stored job (81)Delete a job that is stored on the printer (81)Change the job storage limit (82)Information sent to printer for Job Accounting purposes (82)Mobile printing (82)Introduction (82)Wi-Fi, Wi-Fi Direct Print, NFC, and BLE printing (82)Enable wireless printing (83)Change the Wi-Fi Direct name (83)HP ePrint via email (83)AirPrint (84)Android embedded printing (85)Print from a USB flash drive (85)Enable the USB port for printing (85)Method one: Enable the USB port from the printer control panel (85)Method two: Enable the USB port from the HP Embedded Web Server (network-connectedprinters only) (85)Print USB documents (86)Print using high-speed USB 2.0 port (wired) (86)Method one: Enable the high-speed USB 2.0 port from the printer control panel menus (86)Method two: Enable the high-speed USB 2.0 port from the HP Embedded Web Server (network-connected printers only) (87)vi5 Copy (88)Make a copy (88)Copy on both sides (duplex) (90)Additional copy tasks (92)6 Scan (93)Set up Scan to Email (93)Introduction (93)Before you begin (93)Step one: Access the HP Embedded Web Server (EWS) (94)Step two: Configure the Network Identification settings (95)Step three: Configure the Send to Email feature (96)Method one: Basic configuration using the Email Setup Wizard (96)Method two: Advanced configuration using the Email Setup (100)Step four: Configure the Quick Sets (optional) (104)Step five: Set up Send to Email to use Office 365 Outlook (optional) (105)Introduction (105)Configure the outgoing email server (SMTP) to send an email from an Office 365 Outlookaccount (105)Set up Scan to Network Folder (108)Introduction (108)Before you begin (108)Step one: Access the HP Embedded Web Server (EWS) (108)Step two: Set up Scan to Network Folder (109)Method one: Use the Scan to Network Folder Wizard (109)Method two: Use Scan to Network Folder Setup (110)Step one: Begin the configuration (110)Step two: Configure the Scan to Network Folder settings (111)Step three: Complete the configuration (118)Set up Scan to SharePoint (118)Introduction (118)Before you begin (118)Step one: Access the HP Embedded Web Server (EWS) (118)Step two: Enable Scan to SharePoint and create a Scan to SharePoint Quick Set (119)Scan a file directly to a SharePoint site (121)Quick Set scan settings and options for Scan to SharePoint (122)Set up Scan to USB Drive (123)Introduction (124)Step one: Access the HP Embedded Web Server (EWS) (124)Step two: Enable Scan to USB Drive (124)Step three: Configure the Quick Sets (optional) (125)Default scan settings for Scan to USB Drive setup (126)Default file settings for Save to USB setup (126)Scan to email (127)Introduction (127)Scan to email (127)Scan to job storage (129)viiIntroduction (129)Scan to job storage on the printer (130)Print from job storage on the printer (132)Scan to network folder (132)Introduction (132)Scan to network folder (132)Scan to SharePoint (134)Introduction (134)Scan to SharePoint (134)Scan to USB drive (136)Introduction (136)Scan to USB drive (136)Use HP JetAdvantage business 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(158)Link speed and duplex settings (159)Printer security features (160)Introduction (160)Security statements (160)Assign an administrator password (160)Use the HP Embedded Web Server (EWS) to set the password (160)Provide user access credentials at the printer control panel (161)IP Security (161)Encryption support: HP High Performance Secure Hard Disks (161)Lock the formatter (161)Energy-conservation settings (161)Set the sleep timer and configure the printer to use 1 watt or less of power (161)Set the sleep schedule (162)Set the idle settings (162)HP Web Jetadmin (163)Software and firmware updates (163)9 Solve problems (164)Customer support (164)Control panel help system (165)Reset factory settings (165)Introduction (165)Method one: Reset factory settings from the printer control panel (165)Method two: Reset factory settings from the HP Embedded Web Server (network-connectedprinters only) (166)A “Cartridge is low” or “Cartridge is very low” message displays on the printer control panel (166)Change the “Very Low” settings (166)Change the “Very Low” settings at the control panel (166)For printers with fax capability (167)Order supplies (167)Printer does not pick up paper or misfeeds (167)Introduction (167)The printer does not pick up paper (167)The printer picks up multiple sheets of paper (171)The document feeder jams, skews, or picks up multiple sheets of paper (174)Clear paper jams (174)Introduction (174)Paper jam locations (174)Auto-navigation for clearing paper jams (175)Experiencing frequent or recurring paper jams? (175)Clear paper jams in the document feeder - 31.13.yz (176)Clear paper jams in Tray 1 (13.A1) (177)Clear paper jams in Tray 2 (13.A2) (182)Clear paper jams in the fuser (13.B9, 13.B2, 13.FF) (188)ixClear paper jams in the duplex area (13.D3) (194)Clear paper jams in the 550-sheet trays (13.A3, 13.A4) (199)Clear paper jams in the 2 x 550 paper trays (13.A4, 13.A5) (206)Clear paper jams in the 2,700-sheet high-capacity input paper trays (13.A3, 13.A4, 13.A5, 13.A7) (213)Resolving color print quality problems (220)Introduction (220)Troubleshoot print quality (221)Update the printer firmware (221)Print from a different software program (221)Check the paper-type setting for the print job (221)Check the paper type setting on the printer (221)Check the paper type setting (Windows) (221)Check the paper type setting (macOS) (222)Check toner-cartridge status (222)Step one: Print the Supplies Status Page (222)Step two: Check supplies status (222)Print a cleaning page (222)Visually inspect the toner cartridge or cartridges (223)Check paper and the printing environment (223)Step one: Use paper that meets HP specifications (223)Step two: Check the environment (223)Step three: Set the individual tray alignment (224)Try a different print driver (224)Troubleshoot color quality (225)Calibrate the printer to align the colors (225)Troubleshoot image defects (225)Improve copy image quality (233)Check the scanner glass for dirt and smudges (233)Calibrate the scanner (234)Check the paper settings (235)Check the paper selection options (235)Check the image-adjustment settings (235)Optimize copy quality for text or pictures (236)Edge-to-edge copying (236)Improve scan image quality (236)Check the scanner glass for dirt and smudges (237)Check the resolution settings (238)Check the color settings (238)Check the image-adjustment settings (239)Optimize scan quality for text or pictures (239)Check the output-quality settings (240)Improve fax image quality (240)Check the scanner glass for dirt and smudges (240)Check the send-fax resolution settings (242)Check the image-adjustment settings (242)Optimize fax quality for text or pictures (242)Check the error-correction setting (243)xSend to a different fax machine (243)Check the sender's fax machine (243)Solve wired network problems (244)Introduction (244)Poor physical connection (244)The computer is unable to communicate with the printer (244)The printer is using incorrect link and duplex settings for the network (245)New software programs might be causing compatibility problems (245)The computer or workstation might be set up incorrectly (245)The printer is disabled, or other network settings are incorrect (245)Solve wireless network problems (245)Introduction (245)Wireless connectivity checklist (245)The printer does not print after the wireless configuration completes (246)The printer does not print, and the computer has a third-party firewall installed (246)The wireless connection does not work after moving the wireless router or printer (247)Cannot connect more computers to the wireless printer (247)The wireless printer loses communication when connected to a VPN (247)The network does not appear in the wireless networks list (247)The wireless network is not functioning (247)Reduce interference on a wireless network (248)Solve fax problems (248)Checklist for solving fax problems (248)What type of phone line are you using? (249)Are you using a surge-protection device? (249)Are you using a phone company voice-messaging service or an answering machine? (249)Does your phone line have a call-waiting feature? (249)Check fax accessory status (249)General fax problems (250)The fax failed to send (250)No fax address book button displays (250)Not able to locate the Fax settings in HP Web Jetadmin (250)The header is appended to the top of the page when the overlay option is enabled (251)A mix of names and numbers is in the recipients box (251)A one-page fax prints as two pages (251)A document stops in the document feeder in the middle of faxing (251)The volume for sounds coming from the fax accessory is too high or too low (251)Index (252)xiPrinter overview1Review the location of features on the printer, the physical and technical specifications of the printer,and where to locate setup information.For video assistance, see /videos/LaserJet.The following information is correct at the time of publication. For current information, see /support/colorljM776MFP.For more information:HP's all-inclusive help for the printer includes the following information:●Install and configure●Learn and use●Solve problems●Download software and firmware updates●Join support forums●Find warranty and regulatory informationWarning iconsUse caution if you see a warning icon on your HP printer, as indicated in the icon definitions.●Caution: Electric shock●Caution: Hot surface●Caution: Keep body parts away from moving partsPrinter overview1●Caution: Sharp edge in close proximity●WarningPotential shock hazardReview this important safety information.●Read and understand these safety statements to avoid an electrical shock hazard.●Always follow basic safety precautions when using this product to reduce risk of injury from fire orelectric shock.●Read and understand all instructions in the user guide.●Observe all warnings and instructions marked on the product.●Use only a grounded electrical outlet when connecting the product to a power source. If you do notknow whether the outlet is grounded, check with a qualified electrician.●Do not touch the contacts on any of the sockets on the product. Replace damaged cordsimmediately.●Unplug this product from wall outlets before cleaning.●Do not install or use this product near water or when you are wet.●Install the product securely on a stable surface.●Install the product in a protected location where no one can step on or trip over the power cord.Printer viewsIdentify certain parts of the printer and the control panel.Printer front viewLocate features on the front of the printer.2Chapter 1 Printer overviewPrinter front view3Printer back viewLocate features on the back of the printer.Interface portsLocate the interface ports on the printer formatter. 4Chapter 1 Printer overviewControl-panel viewThe control panel provides access to the printer features and indicates the current status of the printer.NOTE:Tilt the control panel for easier viewing.The Home screen provides access to the printer features and indicates the current status of the printer.screens.NOTE:The features that appear on the Home screen can vary, depending on the printerconfiguration.Control-panel view5Figure 1-1Control-panel view?i 12:42 PM6Chapter 1 Printer overviewHow to use the touchscreen control panelPerform the following actions to use the printer touchscreen control panel.T ouchT ouch an item on the screen to select that item or open that menu. Also, when scrolling T ouch the Settings icon to open the Settings app.How to use the touchscreen control panel 7SwipeT ouch the screen and then move your finger horizontally to scroll the screen sideways.Swipe until the Settings app displays.Printer specificationsDetermine the specifications for your printer model.IMPORTANT:The following specifications are correct at the time of publication, but they are subject to change. For current information, see /support/colorljM776MFP .T echnical specificationsReview the printer technical specifications.Product numbers for each model ●M776dn - #T3U55A ●Flow M776z - #3WT91A ●Flow M776zs - #T3U56APaper handling specificationsPaper handling features Tray 1 (100-sheet capacity)Included Included Included Tray 2 (550-sheet capacity)IncludedIncludedIncluded8Chapter 1 Printer overview550-sheet paper trayOptional Included Not included NOTE:The M776dn models accept one optional550-sheet tray.Optional Included Included2 x 550-sheet paper tray and standNOTE:The M776dn models accept one optional550-sheet tray that may be installed on top of thestand.Optional Not included Not included2,700-sheet high-capacity input (HCI) paper trayand standNOTE:The M776dn models accept one optional550-sheet tray that may be installed on top of theoptional printer stand.Printer standOptional Not included Not included NOTE:The M776dn models accept one optional550-sheet tray that may be installed on top of theoptional printer stand.Inner finisher accessory Not included Not included Included Automatic duplex printing Included IncludedIncludedIncluded Included Included10/100/1000 Ethernet LAN connection with IPv4and IPv6Hi-Speed USB 2.0Included Included IncludedIncluded Included IncludedEasy-access USB port for printing from a USBflash drive or upgrading the firmwareIncluded Included Included Hardware Integration Pocket for connectingaccessory and third-party devicesHP Internal USB Ports Optional Optional OptionalOptional Optional OptionalHP Jetdirect 2900nw Print Server accessory forWi-Fi connectivity and an additional Ethernet portOptional IncludedIncludedHP Jetdirect 3100w accessory for Wi-Fi, BLE, NFC,and proximity badge readingPrints 45 pages per minute (ppm) on Letter-sizepaper and 46 ppm on A4-size paperEasy-access USB printing for printing from a USBIncluded Included Includedflash driveT echnical specifications9Included Included Included Store jobs in the printer memory to print later orprint privatelyScans 100 pages per minute (ppm) on A4 andIncluded Included Included letter-size paper one-sidedIncluded Included Included 200-page document feeder with dual-headscanning for single-pass duplex copying andscanningNot included Included Included HP EveryPage T echnologies including ultrasonicmulti-feed detectionNot included Included Included Embedded optical character recognition (OCR)provides the ability to convert printed pages intotext that can be edited or searched using acomputerIncluded Included Included SMART Label feature provides paper-edgedetection for automatic page croppingIncluded Included Included Automatic page orientation for pages that haveat least 100 characters of textIncluded Automatic tone adjustment sets contrast,Included Includedbrightness, and background removal for eachpageIncluded Included Includedfolders on a networkIncludedSend documents to SharePoint®Included IncludedIncluded Included Included NOTE:Memory reported on the configurationpage will change from 2.5 GB to 3 GB with theoptional 1 GB SODIMM installed.Mass storage: 500 GB hard disk drive Included Included IncludedSecurity: HP Trusted Platform Module (TPM)Included Included IncludedT ouchscreen control panel Included Included IncludedRetractable keyboard Not included Included Included 10Chapter 1 Printer overviewFax Optional Included IncludedSupported operating systemsUse the following information to ensure printer compatibility with your computer operating system.Linux: For information and print drivers for Linux, go to /go/linuxprinting.UNIX: For information and print drivers for UNIX®, go to /go/unixmodelscripts.The following information applies to the printer-specific Windows HP PCL 6 print drivers, HP print driversfor macOS, and to the software installer.Windows: Download HP Easy Start from /LaserJet to install the HP print driver. Or, go tothe printer-support website for this printer: /support/colorljM776MFP to download the printdriver or the software installer to install the HP print driver.macOS: Mac computers are supported with this printer. Download HP Easy Start either from /LaserJet or from the Printer Support page, and then use HP Easy Start to install the HP print driver.1.Go to /LaserJet.2.Follow the steps provided to download the printer software.Windows 7, 32-bit and 64-bit The “HP PCL 6” printer-specific print driver is installed for this operating system aspart of the software installation.Windows 8.1, 32-bit and 64-bit The “HP PCL-6” V4 printer-specific print driver is installed for this operating systemas part of the software installation.Windows 10, 32-bit and 64-bit The “HP PCL-6” V4 printer-specific print driver is installed for this operating systemas part of the software installation.Windows Server 2008 R2, SP 1, 64-bit The PCL 6 printer-specific print driver is available for download from the printer-support website. Download the driver, and then use the Microsoft Add Printer tool toinstall it.Windows Server 2012, 64-bit The PCL 6 printer-specific print driver is available for download from the printer-support website. Download the driver, and then use the Microsoft Add Printer tool toinstall it.Windows Server 2012 R2, 64-bit The PCL 6 printer-specific print driver is available for download from the printer-support website. Download the driver, and then use the Microsoft Add Printer tool toinstall it.Windows Server 2016, 64-bit The PCL 6 printer-specific print driver is available for download from the printer-support website. Download the driver, and then use the Microsoft Add Printer tool toinstall it.Windows Server 2019, 64-bit The PCL 6 printer-specific print driver is available for download from the printer-support website. Download the driver, and then use the Microsoft Add Printer tool toinstall it.Supported operating systems11macOS 10.13 High Sierra, macOS 10.14 MojaveDownload HP Easy Start from /LaserJet , and then use it to install the print driver.NOTE:Supported operating systems can change.NOTE:For a current list of supported operating systems and HP’s all-inclusive help for the printer, go to /support/colorljM776MFP .NOTE:For details on client and server operating systems and for HP UPD driver support for this printer, go to /go/upd . Under Additional information , click Specifications .●Internet connection●Dedicated USB 1.1 or 2.0 connection or a network connection● 2 GB of available hard-disk space ●1 GB RAM (32-bit) or2 GB RAM (64-bit)●Internet connection●Dedicated USB 1.1 or 2.0 connection or a network connection●1.5 GB of available hard-disk spaceNOTE:The Windows software installer installs the HP Smart Device Agent Base service. The file size is less than 100 kb. Its only function is to check for printers connected via USB hourly. No data is collected. If a USB printer is found, it then tries to locate a JetAdvantage Management Connector (JAMc) instance on the network. If a JAMc is found, the HP Smart Device Agent Base is securelyupgraded to a full Smart Device Agent from JAMc, which will then allow printed pages to be accounted for in a Managed Print Services (MPS) account. The driver-only web packs downloaded from for the printer and installed through the Add Printer wizard do not install this service.T o uninstall the service, open the Control Panel , select Programs or Programs and Features , and then select Add/Remove Programs or Uninstall a Programto remove the service. The file name isHPSmartDeviceAgentBase.Mobile printing solutionsHP offers multiple mobile printing solutions to enable easy printing to an HP printer from a laptop, tablet, smartphone, or other mobile device.T o see the full list and to determine the best choice, go to /go/MobilePrinting .NOTE:Update the printer firmware to ensure all mobile printing capabilities are supported.●Wi-Fi Direct (wireless models only, with HP Jetdirect 3100w BLE/NFC/Wireless accessory installed)●HP ePrint via email (Requires HP Web Services to be enabled and the printer to be registered with HP Connected)●HP Smart app ●Google Cloud Print12Chapter 1 Printer overview。

一种基于n-ZnSp-CuSCN 纳米薄膜的高开关比和稳定性紫外光电探测器

一种基于n-ZnSp-CuSCN 纳米薄膜的高开关比和稳定性紫外光电探测器

第43卷第6期2022年6月Vol.43No.6June,2022发光学报CHINESE JOURNAL OF LUMINESCENCEA Stable UV Photodetector Based on n-ZnS/p-CuSCNNanofilm with High On/Off RatioWEI Yao-qi,QUAN Jia-le,ZHAO Qing-qiang,ZHOU Ming-chen,HAN San-can*(College of Materials and Chemistry,University of Shanghai for Science and Technology,Shanghai200093,China)*Corresponding Author,E-mail:mickey3can@Abstract:Herein,We fabricated a CuSCN nanofilm ultraviolet(UV)photodetector(PD)using an in situ growth method.When the bias is-1V and the incident light is350nm,the on/off ratio of the CuSCN PD is~94,and the rise/decay time is~1.41s/1.44s.However,such a device still cannot be called a high-performance photodetector.To improve the optoelectronic properties of CuSCN nanofilm further,we fabricated a UV photodetector based on n-ZnS/p-CuSCN composite nanofilm and analyzed its morphology,composition,and properties.The photocurrent and dark current of the ZnS/CuSCN UV photodetectors are1.22×10-5A and4.8×10-9A,respectively(at-1V,350nm).The ZnS/CuSCN nanofilms on/off ratio of~2542and rise/decay time is0.47s/0.48s.Besides,the n-ZnS/p-CuSCN nanofilm UV PDs have the best responsivity and detectivity at350nm with5.17mA/W and1.32×1011Jones,re‑spectively.In addition,the n-ZnS/p-CuSCN composite film is stable at room temperature,which indicates its great potential as a high-performance UV photodetector.Key words:photodetector;p-n junction;ZnS/CuSCN;on/off ratioCLC number:TN23Document code:A DOI:10.37188/CJL.20220069一种基于n-ZnS/p-CuSCN纳米薄膜的高开关比和稳定性紫外光电探测器魏瑶琪,全家乐,赵庆强,邹明琛,韩三灿*(上海理工大学材料与化学学院,上海200093)摘要:通过原位生长法制备了一种CuSCN纳米薄膜紫外光电探测器,在-1V偏压下,入射光为350nm时,CuSCN紫外光电探测器的开关比~94,响应/恢复时间~1.41s/1.44s。

诺基亚7950XRS扩展路由系统数据表说明书

诺基亚7950XRS扩展路由系统数据表说明书

Nokia 7950 Extensible Routing System Release 15.1The Nokia 7950 XRS is a next-generation core routing platform that delivers the scale, efficiency and versatility needed to stay ahead of evolving service demands driven by the cloud, 5G and the Internet of Things.Scale, efficiency and versatility are critical successfactors for network operators in order to sustainprofitable growth in a fiercely competitive marketwhere the only constant is change.Proven innovations lie at the heart of the 7950XRS family, from its silicon to its software and itsintegration capabilities. It allows building a corenetwork with headroom to meet capacity demandswell into the next decade while covering the fullrange of capabilities to cost-effectively addressyour IP routing, Internet peering, multiprotocollabel switching (MPLS) and infrastructure servicerequirements on a common core platform.Powered by FP4, Nokia’s industry-leading 2.4Tb/srouting silicon, the 7950 XRS achieves tremendousscale and efficiency without compromisingversatility. FP4 silicon offers 6 times the scaleand double the efficiency of FP3. FP4 hardwareis backwards compatible with FP3 features andadds enhanced packet intelligence and controlcapabilities. This enables network operators torethink existing restrictions and conventions, andbuild a capable and converged core network thatcan scale in a smart way, with superior return oninvestment.The 7950 XRS is deployed globally by telecom,cable, mobile, utility and private network operatorsof any size as well as major webscale operators andinternet exchange providers.A standards-based GMPLS user-network interface (UNI) enables IP/optical control plane integration,allowing the 7950 XRS to efficiently coordinateIP routing and transport requirements across administrative boundaries and to dynamically set up optical segments and end-to-end transportconnections.Cross-domain management The 7950 XRS is managed by the Nokia NetworkServices Platform (NSP), supporting integratedelement and network management with end-to-endorchestration of network resource provisioning andassurance operations. Operational tools, includingthe Nokia 5650 Control Plane Assurance Manager (CPAM), provide additional visibility and flexibility in monitoring and troubleshooting IP controlplane issues.Carrier SDN integration and automation The 7950 XRS and SR OS enable multivendor SDNcontrol integration through OpenFlow, PCEP andNETCONF/YANG. Network operators can leverage the 7950 XRS in combination with the NSP to introduce scalable and integrated carrier SDN control across IP , MPLS, Ethernet and opticaltransport layers.The NSP supports unified service automation and network optimization with comprehensive path computation capabilities to enable source-based routing and traffic steering with segment routing support, online traffic engineering and resource optimization, and elastic bandwidth services for dynamic cloud applications. The NSP is further assisted by Nokia Deepfield analytics to support insight-driven automation of network and flow optimization as well as DDoS attack mitigation.Common elements and attributesThe 7950 XRS core router family sharesfundamental attributes that ensure consistency, operational ease of use and investment protection for network operators.7950 XRS family overviewThe 7950 XRS family is designed to meet the needs of global, national, regional and private networkoperators of all sizes.It offers a common platform that addresses thefull spectrum of networking needs for public and private internet backbones and peering points, metropolitan and regional aggregation hubs aswell as cloud, data center and mobile coreinfrastructure. This will enable network operatorsto deliver the immersive ultra-broadband serviceexperiences that consumers aspire to today andwill expect tomorrow.One platform for all servicesThe 7950 XRS addresses the full range of corerouting requirements using common hardware that is powered by Nokia’s FP4 and/or FP3 routing silicon and runs the proven, resilient and feature-rich Nokia Service Router Operating System (SR OS).A flexible, pay-as-you-go software licensing model allows you to build a versatile, reliable and converged core network that evolves with your needs while protecting your hardware investments. Scale with superior economicsA modular and extensible hardware design ensures granular and economical scaling of switching capacity and port density. A single 7950 XRS-20e chassis equipped with FP4 hardware delivers up to 96 Tb/s half duplex switching capacity, with port densities of up to 480 100GE or 4,800 10GE interface ports, and flexible 10GE and 40GE breakout options provided by universal QSFP28 ports. A single chassis equipped with 6-port CFP8 XMAs supports up to 120 400GE clear channel interfaces with SR, LR or FR optics.IP/optical integrationTunable 10G and integrated 100G coherent PM-QPSK tunable DWDM optics enable the 7950 XRS to directly interface with the photonic transport layer without requiring optical transponders.Routing siliconThe 7950 XRS leverages Nokia’s industry-leading FP4 NPU routing silicon to ensure optimal performance and scaling of a rich and complete Layer 2 and Layer 3 feature set that addressesall core deployment scenarios. The 2.4 Tb/s FP4 chipset is Nokia’s fourth-generation NPU leveraging state-of-the-art 16nm 2.5/3D FinFET Plus silicon technology. It is the industry’s first multiterabit routing silicon, and provides the perfect geometry for high-density 100 and 400G interface modules, with support for 1TE line rates as standards become available. It offers deterministic forwarding performance with enhanced packet intelligence and control capabilities for advanced traffic management and granular DDoS filtering policies. These silicon innovations drive the high level of flexibility and performance needed for converged backbone and metro core deployments,including IP routing and peering, MPLS switching, VPN infrastructure services and data center interconnection applications.Interface modulesThe Nokia 7950 XRS uses a pair of complementary modules to support current and future interfaces. XMA Control Modules (XCMs) contain a slot-level control plane subsystem and switch fabric interface. Expandable Media Adapters (XMAs) contain the forwarding complex and provide a wide range of GE, 10GE, 40GE, 100GE and 400G interface options.A flexible software licensing scheme allows for customizing XMAs for diverse core router applications, with configurable quality of service (QoS) granularity. This enables operators to consolidate core routing systems on a single platform, and to rapidly respond to evolving requirements with minimal impact and maximum investment protection.Operating systemThe 7950 XRS family is based on the proven SR OS, carrying forward over a decade of experience in the IP networks of more than 750 network operators worldwide. With a single common OS across the Nokia routing portfolio, network operators benefit from an extensive track record of reliability in the field and a full suite of features to enable resiliency, high availability and in-service software upgrades (ISSUs).Power and cooling efficiencyThe 7950 XRS system design incorporates intelligent power management capabilitiesto monitor power consumption of individual components, assure power safety thresholds,and manage power-up and power-down priorities in the event of degraded power availability. Other key enhancements include clock gating techniques that dynamically reduce power to system components not in use.Redundant, modular fan trays that are linearly modulated provide appropriate and efficient cooling with reduced noise levels. The 7950 XRS-20 uses two linear, 1+1 redundant fan trays in a stacked configuration for primary system cooling while the XRS-20e uses three impeller fan trays in a side-by-side configuration.A “pull” airflow design, in combination with impedance panels and air guides, ensures an even distribution of air to every section of the system. Hot air exhaust through the back of the chassis ensures a clean separation between the hot and cold aisles. An optional top plenum accessory is available for the 7950 XRS-20 to enable hot air exhaust at the top of the chassis for additional cooling efficiency.7950 XRS-20The Nokia 7950 XRS-20 provides up to 64 Tb/s half duplex routing capacity in a single 19-in rack.Each XRS-20 system offers 20 slots, each capable of 1.6 Tb/s full duplex aggregate interface capacity. Fully equipped with FP4 hardware, it offers up to 320 100GE, 80 400GE or 3,200 10GE ports in a single rack.The 7950 XRS-20 supports a mix of FP4- and FP3-based XCMs and XMAs in the same chassis by exchanging the SFM cards for FP4 variants. All other hardware components, including CPM, CCM, fans and APEQs, can be reused to maximize investment protection.7950 XRS-20eThe Nokia 7950 XRS-20e delivers up to 96 Tb/s half duplex routing capacity in a single 19-in rack. The XRS-20e offers 20 slots with enhanced power and cooling capacity to support 2.4 Tb/s full duplex aggregate interface capacity. Fully equipped with FP4 hardware, it offers up to 480 100GE, 120 400GE or 4,800 10GE wire rateports in a single rack, with additional 10 and 40G breakout options.The XRS-20e comes in two chassis variants: a universal variant supporting all AC and DC power options, and an AC/HVDC variant. The XRS-20e is functionally compatible with the XRS-20. All hardware components except the fan trays and XMA Control Modules are common andinterchangeable.Control Processor Modules (CPMs)CPMs provide the management, security and control plane processing for the Nokia 7950 XRS. Redundant CPMs operate in a hitless, stateful, failover mode, and support system upgrades from FP3 to FP4 hardware. Central processing and memory are intentionally separated from the forwarding function on the interface modules to ensure utmost system resiliency. Each CPM contains a full FP3 complex to protect the control plane against denial of service attacks.Expandable Media Adapters (XMAs)XMAs provide the interface options for the 7950 XRS, including high-density GE, 10GE, 40GE, 100GE and 400GE interfaces. They contain an FP3- or FP4-based forwarding complex that performs typical functions such as packet lookups, traffic classification, processing and forwarding, service enablement and QoS. Each XMA also providesspecific interface ports, physical media and optical functions. The broad range of universal interface modules and slot capacities can accommodate multiple networking roles and evolving deployment needs while protecting their 7950 XRS hardware investments.XRS Control Modules (XCMs)XMAs are equipped in an appropriate XCM. The XCMs contain a slot-level control planesubsystem and fabric interface to interconnect to the switch fabric modules (SFMs) via the chassis mid-plane. The XRS-20 and 20e each use dedicated XCM variants but share the same XMAs. The FP3-based XCM variants each deliver 800 Gb/s fullduplex slot capacity to a pair of 400G XMAs or 200G C-XMAs. The FP4-based XCM2 variant for the XRS-20 delivers 3.2 Tb/s full duplex capacity, while the XRS-20e variant delivers 4.8 Tb/s to a pair of FP4 XMAs. The flexibility and modularity of XCMs and XMAs allow network operators to granularlyconfigure each chassis with its desired mix of interface ports to meet the demands of growing core networks.Hardware overviewAll common equipment components are redundant and field replaceable to maximize system uptime.Chassis Control Modules (CCMs)Redundant CCMs support operator access to the Nokia 7950 XRS control and management interfaces. The CCMs are located at the top, and each CCM has an LCD touch-screen display and supports interfaces for timing, management, alarms and memory expansions.Advanced Power Equalization Modules (APEQs)APEQs provide power for the 7950 XRS and include built-in intelligence to monitor and communicate available power budget versus actual consumed power. The low-voltage DC APEQs deliver up to 4725W each. The high-voltage DC APEQs take 260-400 V and provide 3,000W each. AC APEQs take 200-240 V single phase and deliver 3,000W each. APEQs support cost-effective modular expansion as required.Fan traysFan trays provide system cooling for the 7950 XRS. Redundant fans can be controlled independently and fan speed is linearly modulated to allow for the optimal balancing of cooling, power and noise. The 7950 XRS-20 supports two stacked horizontal fan trays with 1+1 redundancy. The XRS-20e chassis variants support three side-by-side impeller fan trays with 2+1 redundancy.Switch Fabric Modules (SFMs)SFMs enable the line-rate connectivity between all slots of a 7950 XRS chassis. The fabric cards are N+1 redundant with active redundancy and graceful capacity degradation in case multiple SFMs fail. The FP4-based SFM2 supports both FP4 and FP3 XCMs and XMAs, enabling a simple and cost-efficient upgrade path for existing FP3 configuration by simply replacing the existing FP3-SFM cards. The initial SFM2 variant allows standalone system operation of the 7950 XRS-20 and XRS-20e.Technical specificationsTable 1. Technical specifications for the Nokia 7950 XRS familySystem capacity (half duplex)16 Tb/s (FP3)/96 Tb/s (FP4)16Tb/s (FP3)/64 Tb/s (FP4) System design Mid-plane Mid-planeInterface slots2020Number of XMAs20 per system20 per systemCommon equipment redundancy CPM (1+1), CCM (1+1),DC APEQ (N+1), AC APEC (N+N),SFM (7+1), fan trays (2+1),power termination (1+1)CPM (1+1), CCM (1+1),DC APEQ (N+1), AC APEC (N+N), SFM (7+1), fan trays (1+1), power termination (1+1)Hot-swappable modules CPM, CCM, XCM, XMA, C-XMA, APEQ, SFM, PIM, PCM, fans CPM, CCM, XCM, XMA, C-XMA, APEQ, SFM, fansDimensions 1 standard 19-in rack44 RU• Height: 195.6 cm (77 in)• Width: 44.5 cm (17.5 in)• Depth: 106.3 cm (41.9 in)1 standard 19-in rack39 RU (44 RU with top plenum)• Height: 173 cm (68.25 in)• Width: 44.5 cm (17.5 in)• Depth: 91 cm (36 in)Weight* (max)612.35 (1,350 lb)535.2 kg (1,180 lb)Power• -48 V DC (12 60A/80A inputs)• 260-400 V DC (12 inputs)• 200-240 V AC (12 inputs)• -48 V DC (12 60A/80A inputs)• 260-400 V DC (12 inputs)• 200-240 V AC (12 inputs)Cooling Front/bottom to back Front/bottom to top/back* Weights and dimensions are approximate and subject to change.Refer to the appropriate installation guide for the current weights and dimensions.Table 2. Nokia 7950 XRS XMA/C-XMA support per chassis type1GBASE (200G C-XMA)36/72SFP/CSFP720/1,440720/1,440 10GBASE (200G C-XMA)20SFP+40040010GBASE (400G XMA)40SFP+80080040GBASE (200G C-XMA)6QSFP+120120100GBASE (200G C-XMA)2CFP4040100GBASE (400G XMA)4CXP, CFP28080100G DWDM (200G XMA)2LC (OTU4)4040Measurement Protocol (TWAMP), Bi-Directional Fault Detection (BFD), and a full suite of MPLS OAM tools, including GMPLS UNI• Intelligent packet classification, queue servicing, policing and buffer management • Industry-leading high availability, including nonstop routing, nonstop services, ISSU, fast reroute, pseudowire redundancy, ITU-T G.8031 and G.8032, weighted mixed-speed link aggregation • Management via CLI, SNMP MIBs, NETCONF/YANG and service assurance agent (SAA) with comprehensive support through the Nokia NSP • Multivendor SDN control integration through OpenFlow, PCEP and BGP-LS interface supportEnvironmental specifications• Operating temperature: 5°C to 40°C (41°F to 104°F)• Operating relative humidity: 5% to 85%• Operating altitude: Up to 4000 m (13,123 ft) at 30°C (86°F)Safety standards and compliance agency certifications • IEC/EN/UL/CSA60950-1• FDA CDRH 21-CFR 1040• IEC/EN 60825-1 (applies to optical receivers)• IEC/EN 60825-2 (applies to optical receivers)EMC emission• ICES-003 Class A (with EMI/Protection panel)• FCC Part 15, Subpart B, Class A (with EMI/Protection panel)• EN 55032 Class A • CISPR 32 Class A • AS/NZS CISPR 32 Class A • VCCI Class A • KN 32 Class A • EN 61000-3-2Feature and protocol support highlightsProtocol support within the 7950 XRS family includes (but is not limited to):• Intermediate System-to-Intermediate System (IS-IS), Open Shortest Path First (OSPF), and Multiprotocol Border Gateway Protocol (MBGP)IPv4 and IPv6 unicast routing • Internet Group Management Protocol (IGMP), Multicast Listener Discovery (MLD), Protocol Independent Multicast (PIM), and Multicast Source Discovery Protocol (MSDP) IPv4 and IPv6 multicast routing • MPLS Label Edge Router (LER) and LabelSwitching Router (LSR) functions, with support for seamless MPLS designs • Label Distribution Protocol (LDP) and Resource Reservation Protocol (RSVP) for MPLS Signaling and Traffic Engineering with Segment Routing support, Point-to-Point (P2P) and Point-to-Multipoint (P2MP) Label Switched Paths (LSPs) with Multicast LDP (MLDP) and P2MP RSVP , weighted Equal-Cost Multi-path (ECMP), Inter-AS Multicast VPN (MVPN) and Next Generation Multicast VPN (NG-MVPN) • P2P Ethernet virtual leased lines (VLLs), Ethernet VPNs (EVPNs), EVPN-MLDP , EVPN-VPWS, Virtual Extensible LAN (VXLAN), EVPN-VXLAN to VPLS/ EVPN-VPLS gateway functions • Multipoint Ethernet VPLS and IP VPNs for use in delivering core infrastructure services • Ethernet port expansion through remote Nokia 7210 Service Access Switch (SAS) Ethernet satellites, each offering 24/48GE ports over a 4 x 10GE Link Aggregation Group (LAG) under 7950 XRS control • Unicast Reverse Path Forwarding (uRPF), RADIUS/TACACS+, and comprehensive control plane protection features for security • Extensive OAM features, including Cflowd,Ethernet Connectivity Fault Management (CFM) (IEEE 802.1ag, ITU-T Y.1731), Ethernet in the First Mile (EFM) (IEEE 802.3ah), Two-Way ActiveAbout NokiaWe create the technology to connect the world. Powered by the research and innovation of Nokia Bell Labs, we serve communications service providers, governments, large enterprises and consumers, with the industry’s most complete, end-to-end portfolio of products, services and licensing.From the enabling infrastructure for 5G and the Internet of Things, to emerging applications in digital health, we are shaping the future of technology to transform the human experience. Nokia operates a policy of ongoing development and has made all reasonable efforts to ensure that the content of this document is adequate and free of material errors and omissions. Nokia assumes no responsibility for any inaccuracies in this document and reserves the right to change, modify, transfer, or otherwise revise this publication without notice.Nokia is a registered trademark of Nokia Corporation. Other product and company names mentioned herein may be trademarks or trade names of their respective owners.© 2019 NokiaNokia Oyj Karaportti 3• ETSI EN 300 019-2-3 Operational Tests, Class 3.2• ETSI EN 300 019-2-4, pr A 1 Seismic• ETSI EN 300 132-2 DC Power Supply Interface • ETSI EN 300 132-3-1 HVDC Power Supply Interface • WEEE • RoHS • China CRoHSNetwork Equipment Building System (NEBS)• GR-1089-CORE • GR-63-CORE • RBOC requirements –ATIS-0600015.03 –ATT-TP-76200 –VZ-TPR-9205 –VZ-TPR-9305MEF certifications• CE 2.0–Certified (on E-LAN, E-Line, E-Tree and E-Access MEF service types) –100G Certified (on E-Line and E-Access MEF service types)• CE 1.0 (MEF 9 and MEF 14) certified• EN 61000-3-3• EN 61000-6-4, Class A • ETSI EN 300 386, Class A EMC immunity• ETSI EN 300 386• EN 55024• KN 35• CISPR 24• BT GS7• EN 61000-6-2 Immunity for industrial environments • EN 61000-4-2 Electric Static Discharge • EN 61000-4-3 Radiated, RF, EM field immunity • EN 61000-4-4 Electrical Fast Transients • EN 61000-4-5 Surge Immunity • EN 61000-4-6 Immunity to conducted disturbances • EN 61000-4-11 Voltage dips & short interruptionsEnvironmental• ETSI EN 300 019-2-1 Storage Tests, Class 1.2• ETSI EN 300 019-2-2 Transportation Tests, Class 2.3* The system design intent is per the specification and standards listing.Refer to product documentation for detailed compliance status and protocol standards support.。

DS_Technicolor_TG789vn汤姆逊,猫路由,一体机(学习资料)

DS_Technicolor_TG789vn汤姆逊,猫路由,一体机(学习资料)

On January 27th 2010, Thomson changed its company name to T echnicolor. All product data sheets, including those for products which still carry the Thomson name, now refl ect our new T echnicolor brand.Features at a Glance■Integrated VDSL2 modem■1 GE WAN port with AutoWAN sensing™ ■4 FE LAN ports to connect multiple devices, such asPCs, laptops, set-top boxes...■Wireless networking on-board: 802.11b/g/n (2.4 GHz) ■Wi-Fi Protected Setup ■1 FXO analog port ■2 FXS ports■Media sharing: UPnP A/V and DLNA ■2 USB 2.0 masters■Remotely manageable: TR-069, TR-104, TR-098, TR-111 ■Innovative easy-customizable design ■Future-proof hardware and software ■IPv6 readyInnovation at its BestThe TG789vn is a unique future-proof triple-play service gateway allowing VDSL2 connectivity while providing V oice over IP functions for residential and business users.A dedicated Gigabit Ethernet WAN port and AutoWAN sensing make the TG789vn the ideal service gateway for deployment in fiber-based access networks.In addition to its four Fast Ethernet LAN ports, the TG789vn offers an IEEE 802.11b/g/n wireless access point for Local Area Network (LAN) access.Future-proof DesignBeing a high-end service memory platform, the TG789vn is future-proof thanks to its scalable hardware and software architecture. The most advanced features can easily be integrated, including demanding third-party applications such as home monitoring and helpdesk interaction.The innovative housing design of the TG789vn makes customization very easy: for example operators can add their own brands and colors.AVthe Ultimate in Ultra BroadbandThe accelerating growth of WAN and LAN traffic is pushing operators to look to higher-speed network technologies to solve the bandwidth crunch.VDSL2 combined with Gigabit Ethernet enables extremely high bandwidth and guarantees superior quality in voice, data and video. The latest wireless n technology ensures robust in-home wireless distribution which reduces wiring complexity and provides true mobility without sacrificing Quality of Service (QoS) and Quality of Experience (QoE) or transfer speeds.Home Networking with easy InstallationLike all T echnicolor gateways, the TG789vn interoperates seamlessly with the T echnicolor Gateway Setup wizard, making the setup of a wireless home network as easy as clicking a button. No more helpdesk calls are needed, just click and you are ready to go. The T echnicolor Gateway Setup wizard performs comprehensive system checks before and during the installation and setup process, and validates all user inputs to guarantee the end user a secured wireless connection to the Internet.Furthermore, thanks to the Flexiport feature, the TG789vn automatically detects the Ethernet port to which a set-top box is connected. This simplifies the installation process of Internet Protocol T eleVision (IPTV) for end users.media SharingThe T echnicolor TG789vn acts as a central hub for distribution of all content from any device to any device in the home. Y ou can stream music, data, pictures and video from your gateway to devices connected to your wired or wireless home network.V oice over IPThe T echnicolor TG789vn offers POTS phone connectors to accommodate phones and faxes. Once the gateway is registered with a VoIP service, regular phone calls can be conducted over the Internet with all the benefits of IP telephony.On top of a wide range of advanced voice services like caller ID, CLIR, call waiting, call forwarding, 3-way conference and message waiting notification, the TG789vn boasts some unique telephony features such as home phone assistance (an automatic service that informs users about their voice services) and voice to email (email alert when a voice message is left).Highest SecurityThe T echnicolor embedded firewall guarantees users the ultimate level in network security. Through integration with NAT, the firewall leverages all the Application Level Gateways (ALGs) provided in the NAT context to minimize undesired service impact. The firewall provides Stateful Packet Inspection (SPI), and an integrated Intrusion Detection and Prevention System (IDS) engine monitors a wide range of attack patterns, and logs potential security breaches to a local cache or remote server.The TG789vn also supports powerful wireless security mechanisms, such as Wi-Fi Protected Access (WPA2) together with a secure and user-friendly connection mechanism for wireless clients (WPS).The support of multiple SSIDs in the gateway enables support for up to four independent wireless access networks. These additional wireless networks allow other wireless users to enjoy the high performance access without compromising the integrity of the basic network, thus keeping the original network access limited and secure.Ipv6 ReadyWith the approaching IPv4 address pool depletion, our products need to be ready for IPv6. Internet Protocol version 6 is the next generation of Internet technologies aiming to effectively support the ever-expanding Internet usage and functionality, and also to address security concerns that exist in an IPv4 environment.In this context, the TG789vn has successfully passed the Gold standard IPv6 Ready accreditation.T echnicolor aims to introduce IPv6 as smoothly as possible in customer networks. By providing in-depth knowledge of the networking stack, we guide our customers in their transition from IPv4 to IPv6.ecoT echnicolor offers its customers environmentally-friendly products. In addition to carefully selected plastics and packaging to minimize the ecological footprint, the TG789vn benefits from a unique combination of hardware and software features that reduce power consumption substantially. For instance, a button allows the user to disable/enable the wireless access point when its function is not required.Professional ServicesT echnicolor offers a wide array of services:■Hardware: Optimize warranty and hardware operations such as repair, logistics, dedicated inventories, recycling, refurbishing, …■Support & M aintenance contracts providing a technical support line, software support, updates, upgrades, on-site support, training. Dedicated response time can be tailored to fit your organization with BRONZE, SILVER and GOLD agreements.■Develop specific software functions, features and GUIs to create and deploy innovative subscriber services in your market.■T echnicolor proposes Integration Services on technologies, products, third-party software to accelerate your project whilst optimizing your time to market. We can also provide resources for project management, engineering, planning, and assist your team with device interoperability tests, Proof Of Concept (POC) and trials.■M issions to optimize your T otal Cost of Ownership (TCO) by analyzing your hotline calls and proposing relevant actions to reduce your OPEX budgets.■Leveraging its many years of expertise in creating gateway and set-top box products - with over 200 million devices delivered to diverse markets all around the world - T echnicolor has built an experienced and dedicated design team able to propose a great variety of new, innovative design services, ranging from unique product aesthetics to product content.t echnical SpecificationsHardware Specifications■Interfaces WAN RJ-11 DSL line port1 Ethernet WAN 10/100/1000 Base-T port1 Full FXO port■Interfaces LAN 4-port autosensing 10/100Base-T auto-MDI/MDI-X Ethernet LAN switch2 FXS POTS ports2 USB 2.0 hosts/mastersWi-Fi IEEE 802.11b/g/n on board■Extras WPS buttonECO buttonPower buttonReset button■Dimensions 195 x 60 x 230 mm (9 x 2.4 x 9.7 in.)■AC V oltage 100-240 VAC (switched mode power supply)■T emperature 0° - 40° C (32° - 104° F)■Humidity 20% to 80%DSl modem Specifications■Supports multi mode standard■ADSL compliance ANSI T1.413 Issue 2,ITU-T G.992.1 Annex A, B (G.dmt),ITU-T G.992.2 Annex A, B (G.lite),ITU-T G.994.1 (G.hs)Maximum rate: 8 Mbps for downstreamand 1 Mbps for upstream■ADSL2 compliance ITU-T G.992.3 Annex A, B, L, M(G.dmt.bis),ITU-T G.992.4 Annex A, B, L, M(G.lite.bis)Maximum rate: 12 Mbps for downstreamand 1.5 Mbps for upstream■ADSL2+ compliance ITU-T G.992.5 Annex A, BMaximum rate: 24 Mbps for downstreamand 3 Mbps upstream■VDSL2 compliance Up to 17 MHz profiles (POTS/ISDN) management■Customizable user-friendly GUI via HTTP and HTTPS■GUI-embedded Easy Setup wizard■On-demand remote GUI assistance (helpdesk)■Web-browsing intercept (install / diagnostics)■PC (wireless) T echnicolor Gateway Setup wizard■TR-069 CPE WAN Management ProtocolTR-098 Internet Gateway Device ManagementTR-111 home network device managementTR-104 voice service provisioning■TR-064 LAN side configuration■Zero-touch autoprovisioning Services■Printer sharing■Content sharing Samba / FATNTFS (optional)HFS (optional)EXT2/EXT3 (optional)UPnP™ media serverDLNA® DMSMetadata support■Remote HDD file access■URL- and content-based website filtering (optional)■Open architecture for 3rd party application development Wireless Performance and Security■Wi-Fi IEEE 802.11b/g/n access point Wi-Fi CERTIFIED®■WPA(2)™-Personal, WEP™■Wi-Fi Multimedia (WMM®)■Wi-Fi Protected Setup (WPS™)■Up to 4 BSSIDs (virtual AP) support■Security and service segregation per SSID■Dynamic rates switching for optimal wireless rates■RX/TX switched diversity■Manual/auto radio channel selectionSecurity■Stateful Packet Inspection Firewall (SPIF)■Customizable firewall security levels■Intrusion detection and prevention (DoS, SYN Flood, Ping of Death, Fraggle, LAND, T eardrop, etc.)■DeMilitarized Zone (DMZ)■Multi-level Access PolicyNetworking■Symmetrical NAT with application helpers (ALGs)■Game and application sharing NAT Portmaps■DHCP conditional serving & relay, DNS server & relay■IGMPv3 proxy■IGMP snooping■DHCP spoofing■Flexiport (automatic selection of Ethernet port bridged IPTV)■IEEE 802.1q VLAN bridging, multiple bridge instances■IPv6 readyQuality of Service (QoS)■ATM QoS UBR, VBR-nrt, VBR-rt, CBR shaping, queuing andschedulingCLP tagging■IP QoS Flexible classification (ALG aided)IP rate limiting (two-rate remarking/dropping)DSCP (re) markingTCP ACK optimizationDynamic link fragmentationPer service class connection/resource reservation ■Ethernet QoS Priority or C-VLAN/S-VLAN taggingSwitch port queuing and scheduling■Wireless QoS WMM (BE, BK, VI, VO access categories)queuing and schedulingTECHNICOLOR WORLDWIDE HEADQUARTERS 1, rue Jeanne d’A rc92443 Issy-les-Moulineaux FranceT el. : 33 (0) 1 41 86 50 00 - Fax : 33 (0) 1 41 86 58 59 SALES CONTACTFor more information please get in touch with yourusual sales representative or use the following email:********************************************************************************************************************************© Copyright 2011 T echnicolor. All rights reserved.Photos and specifications are subject to change withoutnotice. All trade names referenced are service marks,trademarks, or registered trademarks of their respectivecompanies.E-DOC-DAT-20100930-0007 v3.0DS-037-v04-1111t echnical SpecificationsVoice over IP Features■V oice functionality Signalling: SIP, MGCP (optional), H.323 (optional)Codecs: G.711, G.726, G.729, Wideband (G.722),T.38Echo cancellation: G.168 compliantComfort Noise Generator (CNG), flexibletelephone number per FXS, including commonnumbersInteropable with main market softswitches■FXO Fully flexible dial plan for PSTN/V oIP outgoingcallsPrefix for PSTN/V oIP switchLifeline backup:manual and automatic PSTN/V oIPIncoming call detection on PSTN■Supplementary and advanced servicesCall waiting (on call basis)Caller identificationCall forwarding (no answer/busy/unconditional)Call transferringCall hold, call returnCalling Line Identification Presentation (CLIP)Calling Line Identification Restriction (CLIR)Calling Name Identifiation Presentation (CNIP)Calling Name Identifiation Restriction (CNIR)Fax transparency3-way conferenceMessage Waiting Indicator(MWI)Missed call emailClick to dialWarm lineCall completion to busy subscriberForced FXOAbbreviated numberCommon number in/outgoing callAnonymous Call Rejection (ACR)Distinctive ringingV oice Mail on No Reply (VMNR)Support for secondary outbound proxyDNS NAPTR, DNS SRV content of the Box■Wireless n V oIP Ultra Broadband Gateway■DSL cable (RJ-11)■2 Ethernet cables (RJ-45)■Power supply unit■Setup CD and leaflet■Filter or splitter (optional)t echnicolor tG789vn back panel。

物理学专业英语

物理学专业英语

华中师范大学物理学院物理学专业英语仅供内部学习参考!2014一、课程的任务和教学目的通过学习《物理学专业英语》,学生将掌握物理学领域使用频率较高的专业词汇和表达方法,进而具备基本的阅读理解物理学专业文献的能力。

通过分析《物理学专业英语》课程教材中的范文,学生还将从英语角度理解物理学中个学科的研究内容和主要思想,提高学生的专业英语能力和了解物理学研究前沿的能力。

培养专业英语阅读能力,了解科技英语的特点,提高专业外语的阅读质量和阅读速度;掌握一定量的本专业英文词汇,基本达到能够独立完成一般性本专业外文资料的阅读;达到一定的笔译水平。

要求译文通顺、准确和专业化。

要求译文通顺、准确和专业化。

二、课程内容课程内容包括以下章节:物理学、经典力学、热力学、电磁学、光学、原子物理、统计力学、量子力学和狭义相对论三、基本要求1.充分利用课内时间保证充足的阅读量(约1200~1500词/学时),要求正确理解原文。

2.泛读适量课外相关英文读物,要求基本理解原文主要内容。

3.掌握基本专业词汇(不少于200词)。

4.应具有流利阅读、翻译及赏析专业英语文献,并能简单地进行写作的能力。

四、参考书目录1 Physics 物理学 (1)Introduction to physics (1)Classical and modern physics (2)Research fields (4)V ocabulary (7)2 Classical mechanics 经典力学 (10)Introduction (10)Description of classical mechanics (10)Momentum and collisions (14)Angular momentum (15)V ocabulary (16)3 Thermodynamics 热力学 (18)Introduction (18)Laws of thermodynamics (21)System models (22)Thermodynamic processes (27)Scope of thermodynamics (29)V ocabulary (30)4 Electromagnetism 电磁学 (33)Introduction (33)Electrostatics (33)Magnetostatics (35)Electromagnetic induction (40)V ocabulary (43)5 Optics 光学 (45)Introduction (45)Geometrical optics (45)Physical optics (47)Polarization (50)V ocabulary (51)6 Atomic physics 原子物理 (52)Introduction (52)Electronic configuration (52)Excitation and ionization (56)V ocabulary (59)7 Statistical mechanics 统计力学 (60)Overview (60)Fundamentals (60)Statistical ensembles (63)V ocabulary (65)8 Quantum mechanics 量子力学 (67)Introduction (67)Mathematical formulations (68)Quantization (71)Wave-particle duality (72)Quantum entanglement (75)V ocabulary (77)9 Special relativity 狭义相对论 (79)Introduction (79)Relativity of simultaneity (80)Lorentz transformations (80)Time dilation and length contraction (81)Mass-energy equivalence (82)Relativistic energy-momentum relation (86)V ocabulary (89)正文标记说明:蓝色Arial字体(例如energy):已知的专业词汇蓝色Arial字体加下划线(例如electromagnetism):新学的专业词汇黑色Times New Roman字体加下划线(例如postulate):新学的普通词汇1 Physics 物理学1 Physics 物理学Introduction to physicsPhysics is a part of natural philosophy and a natural science that involves the study of matter and its motion through space and time, along with related concepts such as energy and force. More broadly, it is the general analysis of nature, conducted in order to understand how the universe behaves.Physics is one of the oldest academic disciplines, perhaps the oldest through its inclusion of astronomy. Over the last two millennia, physics was a part of natural philosophy along with chemistry, certain branches of mathematics, and biology, but during the Scientific Revolution in the 17th century, the natural sciences emerged as unique research programs in their own right. Physics intersects with many interdisciplinary areas of research, such as biophysics and quantum chemistry,and the boundaries of physics are not rigidly defined. New ideas in physics often explain the fundamental mechanisms of other sciences, while opening new avenues of research in areas such as mathematics and philosophy.Physics also makes significant contributions through advances in new technologies that arise from theoretical breakthroughs. For example, advances in the understanding of electromagnetism or nuclear physics led directly to the development of new products which have dramatically transformed modern-day society, such as television, computers, domestic appliances, and nuclear weapons; advances in thermodynamics led to the development of industrialization; and advances in mechanics inspired the development of calculus.Core theoriesThough physics deals with a wide variety of systems, certain theories are used by all physicists. Each of these theories were experimentally tested numerous times and found correct as an approximation of nature (within a certain domain of validity).For instance, the theory of classical mechanics accurately describes the motion of objects, provided they are much larger than atoms and moving at much less than the speed of light. These theories continue to be areas of active research, and a remarkable aspect of classical mechanics known as chaos was discovered in the 20th century, three centuries after the original formulation of classical mechanics by Isaac Newton (1642–1727) 【艾萨克·牛顿】.University PhysicsThese central theories are important tools for research into more specialized topics, and any physicist, regardless of his or her specialization, is expected to be literate in them. These include classical mechanics, quantum mechanics, thermodynamics and statistical mechanics, electromagnetism, and special relativity.Classical and modern physicsClassical mechanicsClassical physics includes the traditional branches and topics that were recognized and well-developed before the beginning of the 20th century—classical mechanics, acoustics, optics, thermodynamics, and electromagnetism.Classical mechanics is concerned with bodies acted on by forces and bodies in motion and may be divided into statics (study of the forces on a body or bodies at rest), kinematics (study of motion without regard to its causes), and dynamics (study of motion and the forces that affect it); mechanics may also be divided into solid mechanics and fluid mechanics (known together as continuum mechanics), the latter including such branches as hydrostatics, hydrodynamics, aerodynamics, and pneumatics.Acoustics is the study of how sound is produced, controlled, transmitted and received. Important modern branches of acoustics include ultrasonics, the study of sound waves of very high frequency beyond the range of human hearing; bioacoustics the physics of animal calls and hearing, and electroacoustics, the manipulation of audible sound waves using electronics.Optics, the study of light, is concerned not only with visible light but also with infrared and ultraviolet radiation, which exhibit all of the phenomena of visible light except visibility, e.g., reflection, refraction, interference, diffraction, dispersion, and polarization of light.Heat is a form of energy, the internal energy possessed by the particles of which a substance is composed; thermodynamics deals with the relationships between heat and other forms of energy.Electricity and magnetism have been studied as a single branch of physics since the intimate connection between them was discovered in the early 19th century; an electric current gives rise to a magnetic field and a changing magnetic field induces an electric current. Electrostatics deals with electric charges at rest, electrodynamics with moving charges, and magnetostatics with magnetic poles at rest.Modern PhysicsClassical physics is generally concerned with matter and energy on the normal scale of1 Physics 物理学observation, while much of modern physics is concerned with the behavior of matter and energy under extreme conditions or on the very large or very small scale.For example, atomic and nuclear physics studies matter on the smallest scale at which chemical elements can be identified.The physics of elementary particles is on an even smaller scale, as it is concerned with the most basic units of matter; this branch of physics is also known as high-energy physics because of the extremely high energies necessary to produce many types of particles in large particle accelerators. On this scale, ordinary, commonsense notions of space, time, matter, and energy are no longer valid.The two chief theories of modern physics present a different picture of the concepts of space, time, and matter from that presented by classical physics.Quantum theory is concerned with the discrete, rather than continuous, nature of many phenomena at the atomic and subatomic level, and with the complementary aspects of particles and waves in the description of such phenomena.The theory of relativity is concerned with the description of phenomena that take place in a frame of reference that is in motion with respect to an observer; the special theory of relativity is concerned with relative uniform motion in a straight line and the general theory of relativity with accelerated motion and its connection with gravitation.Both quantum theory and the theory of relativity find applications in all areas of modern physics.Difference between classical and modern physicsWhile physics aims to discover universal laws, its theories lie in explicit domains of applicability. Loosely speaking, the laws of classical physics accurately describe systems whose important length scales are greater than the atomic scale and whose motions are much slower than the speed of light. Outside of this domain, observations do not match their predictions.Albert Einstein【阿尔伯特·爱因斯坦】contributed the framework of special relativity, which replaced notions of absolute time and space with space-time and allowed an accurate description of systems whose components have speeds approaching the speed of light.Max Planck【普朗克】, Erwin Schrödinger【薛定谔】, and others introduced quantum mechanics, a probabilistic notion of particles and interactions that allowed an accurate description of atomic and subatomic scales.Later, quantum field theory unified quantum mechanics and special relativity.General relativity allowed for a dynamical, curved space-time, with which highly massiveUniversity Physicssystems and the large-scale structure of the universe can be well-described. General relativity has not yet been unified with the other fundamental descriptions; several candidate theories of quantum gravity are being developed.Research fieldsContemporary research in physics can be broadly divided into condensed matter physics; atomic, molecular, and optical physics; particle physics; astrophysics; geophysics and biophysics. Some physics departments also support research in Physics education.Since the 20th century, the individual fields of physics have become increasingly specialized, and today most physicists work in a single field for their entire careers. "Universalists" such as Albert Einstein (1879–1955) and Lev Landau (1908–1968)【列夫·朗道】, who worked in multiple fields of physics, are now very rare.Condensed matter physicsCondensed matter physics is the field of physics that deals with the macroscopic physical properties of matter. In particular, it is concerned with the "condensed" phases that appear whenever the number of particles in a system is extremely large and the interactions between them are strong.The most familiar examples of condensed phases are solids and liquids, which arise from the bonding by way of the electromagnetic force between atoms. More exotic condensed phases include the super-fluid and the Bose–Einstein condensate found in certain atomic systems at very low temperature, the superconducting phase exhibited by conduction electrons in certain materials,and the ferromagnetic and antiferromagnetic phases of spins on atomic lattices.Condensed matter physics is by far the largest field of contemporary physics.Historically, condensed matter physics grew out of solid-state physics, which is now considered one of its main subfields. The term condensed matter physics was apparently coined by Philip Anderson when he renamed his research group—previously solid-state theory—in 1967. In 1978, the Division of Solid State Physics of the American Physical Society was renamed as the Division of Condensed Matter Physics.Condensed matter physics has a large overlap with chemistry, materials science, nanotechnology and engineering.Atomic, molecular and optical physicsAtomic, molecular, and optical physics (AMO) is the study of matter–matter and light–matter interactions on the scale of single atoms and molecules.1 Physics 物理学The three areas are grouped together because of their interrelationships, the similarity of methods used, and the commonality of the energy scales that are relevant. All three areas include both classical, semi-classical and quantum treatments; they can treat their subject from a microscopic view (in contrast to a macroscopic view).Atomic physics studies the electron shells of atoms. Current research focuses on activities in quantum control, cooling and trapping of atoms and ions, low-temperature collision dynamics and the effects of electron correlation on structure and dynamics. Atomic physics is influenced by the nucleus (see, e.g., hyperfine splitting), but intra-nuclear phenomena such as fission and fusion are considered part of high-energy physics.Molecular physics focuses on multi-atomic structures and their internal and external interactions with matter and light.Optical physics is distinct from optics in that it tends to focus not on the control of classical light fields by macroscopic objects, but on the fundamental properties of optical fields and their interactions with matter in the microscopic realm.High-energy physics (particle physics) and nuclear physicsParticle physics is the study of the elementary constituents of matter and energy, and the interactions between them.In addition, particle physicists design and develop the high energy accelerators,detectors, and computer programs necessary for this research. The field is also called "high-energy physics" because many elementary particles do not occur naturally, but are created only during high-energy collisions of other particles.Currently, the interactions of elementary particles and fields are described by the Standard Model.●The model accounts for the 12 known particles of matter (quarks and leptons) thatinteract via the strong, weak, and electromagnetic fundamental forces.●Dynamics are described in terms of matter particles exchanging gauge bosons (gluons,W and Z bosons, and photons, respectively).●The Standard Model also predicts a particle known as the Higgs boson. In July 2012CERN, the European laboratory for particle physics, announced the detection of a particle consistent with the Higgs boson.Nuclear Physics is the field of physics that studies the constituents and interactions of atomic nuclei. The most commonly known applications of nuclear physics are nuclear power generation and nuclear weapons technology, but the research has provided application in many fields, including those in nuclear medicine and magnetic resonance imaging, ion implantation in materials engineering, and radiocarbon dating in geology and archaeology.University PhysicsAstrophysics and Physical CosmologyAstrophysics and astronomy are the application of the theories and methods of physics to the study of stellar structure, stellar evolution, the origin of the solar system, and related problems of cosmology. Because astrophysics is a broad subject, astrophysicists typically apply many disciplines of physics, including mechanics, electromagnetism, statistical mechanics, thermodynamics, quantum mechanics, relativity, nuclear and particle physics, and atomic and molecular physics.The discovery by Karl Jansky in 1931 that radio signals were emitted by celestial bodies initiated the science of radio astronomy. Most recently, the frontiers of astronomy have been expanded by space exploration. Perturbations and interference from the earth's atmosphere make space-based observations necessary for infrared, ultraviolet, gamma-ray, and X-ray astronomy.Physical cosmology is the study of the formation and evolution of the universe on its largest scales. Albert Einstein's theory of relativity plays a central role in all modern cosmological theories. In the early 20th century, Hubble's discovery that the universe was expanding, as shown by the Hubble diagram, prompted rival explanations known as the steady state universe and the Big Bang.The Big Bang was confirmed by the success of Big Bang nucleo-synthesis and the discovery of the cosmic microwave background in 1964. The Big Bang model rests on two theoretical pillars: Albert Einstein's general relativity and the cosmological principle (On a sufficiently large scale, the properties of the Universe are the same for all observers). Cosmologists have recently established the ΛCDM model (the standard model of Big Bang cosmology) of the evolution of the universe, which includes cosmic inflation, dark energy and dark matter.Current research frontiersIn condensed matter physics, an important unsolved theoretical problem is that of high-temperature superconductivity. Many condensed matter experiments are aiming to fabricate workable spintronics and quantum computers.In particle physics, the first pieces of experimental evidence for physics beyond the Standard Model have begun to appear. Foremost among these are indications that neutrinos have non-zero mass. These experimental results appear to have solved the long-standing solar neutrino problem, and the physics of massive neutrinos remains an area of active theoretical and experimental research. Particle accelerators have begun probing energy scales in the TeV range, in which experimentalists are hoping to find evidence for the super-symmetric particles, after discovery of the Higgs boson.Theoretical attempts to unify quantum mechanics and general relativity into a single theory1 Physics 物理学of quantum gravity, a program ongoing for over half a century, have not yet been decisively resolved. The current leading candidates are M-theory, superstring theory and loop quantum gravity.Many astronomical and cosmological phenomena have yet to be satisfactorily explained, including the existence of ultra-high energy cosmic rays, the baryon asymmetry, the acceleration of the universe and the anomalous rotation rates of galaxies.Although much progress has been made in high-energy, quantum, and astronomical physics, many everyday phenomena involving complexity, chaos, or turbulence are still poorly understood. Complex problems that seem like they could be solved by a clever application of dynamics and mechanics remain unsolved; examples include the formation of sand-piles, nodes in trickling water, the shape of water droplets, mechanisms of surface tension catastrophes, and self-sorting in shaken heterogeneous collections.These complex phenomena have received growing attention since the 1970s for several reasons, including the availability of modern mathematical methods and computers, which enabled complex systems to be modeled in new ways. Complex physics has become part of increasingly interdisciplinary research, as exemplified by the study of turbulence in aerodynamics and the observation of pattern formation in biological systems.Vocabulary★natural science 自然科学academic disciplines 学科astronomy 天文学in their own right 凭他们本身的实力intersects相交,交叉interdisciplinary交叉学科的,跨学科的★quantum 量子的theoretical breakthroughs 理论突破★electromagnetism 电磁学dramatically显著地★thermodynamics热力学★calculus微积分validity★classical mechanics 经典力学chaos 混沌literate 学者★quantum mechanics量子力学★thermodynamics and statistical mechanics热力学与统计物理★special relativity狭义相对论is concerned with 关注,讨论,考虑acoustics 声学★optics 光学statics静力学at rest 静息kinematics运动学★dynamics动力学ultrasonics超声学manipulation 操作,处理,使用University Physicsinfrared红外ultraviolet紫外radiation辐射reflection 反射refraction 折射★interference 干涉★diffraction 衍射dispersion散射★polarization 极化,偏振internal energy 内能Electricity电性Magnetism 磁性intimate 亲密的induces 诱导,感应scale尺度★elementary particles基本粒子★high-energy physics 高能物理particle accelerators 粒子加速器valid 有效的,正当的★discrete离散的continuous 连续的complementary 互补的★frame of reference 参照系★the special theory of relativity 狭义相对论★general theory of relativity 广义相对论gravitation 重力,万有引力explicit 详细的,清楚的★quantum field theory 量子场论★condensed matter physics凝聚态物理astrophysics天体物理geophysics地球物理Universalist博学多才者★Macroscopic宏观Exotic奇异的★Superconducting 超导Ferromagnetic铁磁质Antiferromagnetic 反铁磁质★Spin自旋Lattice 晶格,点阵,网格★Society社会,学会★microscopic微观的hyperfine splitting超精细分裂fission分裂,裂变fusion熔合,聚变constituents成分,组分accelerators加速器detectors 检测器★quarks夸克lepton 轻子gauge bosons规范玻色子gluons胶子★Higgs boson希格斯玻色子CERN欧洲核子研究中心★Magnetic Resonance Imaging磁共振成像,核磁共振ion implantation 离子注入radiocarbon dating放射性碳年代测定法geology地质学archaeology考古学stellar 恒星cosmology宇宙论celestial bodies 天体Hubble diagram 哈勃图Rival竞争的★Big Bang大爆炸nucleo-synthesis核聚合,核合成pillar支柱cosmological principle宇宙学原理ΛCDM modelΛ-冷暗物质模型cosmic inflation宇宙膨胀1 Physics 物理学fabricate制造,建造spintronics自旋电子元件,自旋电子学★neutrinos 中微子superstring 超弦baryon重子turbulence湍流,扰动,骚动catastrophes突变,灾变,灾难heterogeneous collections异质性集合pattern formation模式形成University Physics2 Classical mechanics 经典力学IntroductionIn physics, classical mechanics is one of the two major sub-fields of mechanics, which is concerned with the set of physical laws describing the motion of bodies under the action of a system of forces. The study of the motion of bodies is an ancient one, making classical mechanics one of the oldest and largest subjects in science, engineering and technology.Classical mechanics describes the motion of macroscopic objects, from projectiles to parts of machinery, as well as astronomical objects, such as spacecraft, planets, stars, and galaxies. Besides this, many specializations within the subject deal with gases, liquids, solids, and other specific sub-topics.Classical mechanics provides extremely accurate results as long as the domain of study is restricted to large objects and the speeds involved do not approach the speed of light. When the objects being dealt with become sufficiently small, it becomes necessary to introduce the other major sub-field of mechanics, quantum mechanics, which reconciles the macroscopic laws of physics with the atomic nature of matter and handles the wave–particle duality of atoms and molecules. In the case of high velocity objects approaching the speed of light, classical mechanics is enhanced by special relativity. General relativity unifies special relativity with Newton's law of universal gravitation, allowing physicists to handle gravitation at a deeper level.The initial stage in the development of classical mechanics is often referred to as Newtonian mechanics, and is associated with the physical concepts employed by and the mathematical methods invented by Newton himself, in parallel with Leibniz【莱布尼兹】, and others.Later, more abstract and general methods were developed, leading to reformulations of classical mechanics known as Lagrangian mechanics and Hamiltonian mechanics. These advances were largely made in the 18th and 19th centuries, and they extend substantially beyond Newton's work, particularly through their use of analytical mechanics. Ultimately, the mathematics developed for these were central to the creation of quantum mechanics.Description of classical mechanicsThe following introduces the basic concepts of classical mechanics. For simplicity, it often2 Classical mechanics 经典力学models real-world objects as point particles, objects with negligible size. The motion of a point particle is characterized by a small number of parameters: its position, mass, and the forces applied to it.In reality, the kind of objects that classical mechanics can describe always have a non-zero size. (The physics of very small particles, such as the electron, is more accurately described by quantum mechanics). Objects with non-zero size have more complicated behavior than hypothetical point particles, because of the additional degrees of freedom—for example, a baseball can spin while it is moving. However, the results for point particles can be used to study such objects by treating them as composite objects, made up of a large number of interacting point particles. The center of mass of a composite object behaves like a point particle.Classical mechanics uses common-sense notions of how matter and forces exist and interact. It assumes that matter and energy have definite, knowable attributes such as where an object is in space and its speed. It also assumes that objects may be directly influenced only by their immediate surroundings, known as the principle of locality.In quantum mechanics objects may have unknowable position or velocity, or instantaneously interact with other objects at a distance.Position and its derivativesThe position of a point particle is defined with respect to an arbitrary fixed reference point, O, in space, usually accompanied by a coordinate system, with the reference point located at the origin of the coordinate system. It is defined as the vector r from O to the particle.In general, the point particle need not be stationary relative to O, so r is a function of t, the time elapsed since an arbitrary initial time.In pre-Einstein relativity (known as Galilean relativity), time is considered an absolute, i.e., the time interval between any given pair of events is the same for all observers. In addition to relying on absolute time, classical mechanics assumes Euclidean geometry for the structure of space.Velocity and speedThe velocity, or the rate of change of position with time, is defined as the derivative of the position with respect to time. In classical mechanics, velocities are directly additive and subtractive as vector quantities; they must be dealt with using vector analysis.When both objects are moving in the same direction, the difference can be given in terms of speed only by ignoring direction.University PhysicsAccelerationThe acceleration , or rate of change of velocity, is the derivative of the velocity with respect to time (the second derivative of the position with respect to time).Acceleration can arise from a change with time of the magnitude of the velocity or of the direction of the velocity or both . If only the magnitude v of the velocity decreases, this is sometimes referred to as deceleration , but generally any change in the velocity with time, including deceleration, is simply referred to as acceleration.Inertial frames of referenceWhile the position and velocity and acceleration of a particle can be referred to any observer in any state of motion, classical mechanics assumes the existence of a special family of reference frames in terms of which the mechanical laws of nature take a comparatively simple form. These special reference frames are called inertial frames .An inertial frame is such that when an object without any force interactions (an idealized situation) is viewed from it, it appears either to be at rest or in a state of uniform motion in a straight line. This is the fundamental definition of an inertial frame. They are characterized by the requirement that all forces entering the observer's physical laws originate in identifiable sources (charges, gravitational bodies, and so forth).A non-inertial reference frame is one accelerating with respect to an inertial one, and in such a non-inertial frame a particle is subject to acceleration by fictitious forces that enter the equations of motion solely as a result of its accelerated motion, and do not originate in identifiable sources. These fictitious forces are in addition to the real forces recognized in an inertial frame.A key concept of inertial frames is the method for identifying them. For practical purposes, reference frames that are un-accelerated with respect to the distant stars are regarded as good approximations to inertial frames.Forces; Newton's second lawNewton was the first to mathematically express the relationship between force and momentum . Some physicists interpret Newton's second law of motion as a definition of force and mass, while others consider it a fundamental postulate, a law of nature. Either interpretation has the same mathematical consequences, historically known as "Newton's Second Law":a m t v m t p F ===d )(d d dThe quantity m v is called the (canonical ) momentum . The net force on a particle is thus equal to rate of change of momentum of the particle with time.So long as the force acting on a particle is known, Newton's second law is sufficient to。

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Ultra-Broadband Photodetector for the Visible to Terahertz Range by Self-Assembling Reduced Graphene Oxide-Silicon Nanowire Array HeterojunctionsY ang C ao ,J iayi Z hu ,J ia X u ,J unhui H e ,*J ia-Lin S un ,*Y ingxin W ang ,a nd Z iran Z hao graphene could extend the working spectrum of graphene photodetectors to the far-infrared (FIR) region, and even asfar as the terahertz (THz) region.[ 9,10 ] Band structure engi-neering of graphene has been widely investigated. A bandgap can be created in graphene by patterning graphene nanor-ibbon, nanomesh and quantum dot-like arrays structures bymethods including electron-beam lithography,[ 11 ]nanowire shadow mask etching,[ 12 ] block copolymer lithography, [ 13 ] unzipping of carbon nanotubes[ 14,15 ] and Titanium sacrifi -cial layer etching.[ 16 ] However, the fabrication processes for bandgap creation are complex. Recent studies indicate that the reduced graphene oxide (RGO ) obtained by chemical exfoliation from graphite has a natural energy gap withoutthose complex fabrication processes.[ 17 ] This natural energy gap can be tuned by controlling the degree of RGO reduc-tion. The apparent energy gap ranged from 10 to 50 meV (corresponding to the energy of 124–24.8 µm electromag-netic waves) and approached zero with extensive reduc-tion. The naturally narrow energy gap in RGO is suitable for detection of mid-infrared (MIR) (2.5–30 µm) or even THz (30–3000 µm) waves. Recently, Chitara et al. reported NIR (1.55 µm) photodetectors based on extensively reducedRGO.[ 18 ] However, few studies have addressed the develop-ment of RGO MIR/THz photodetectors. There are still some obstacles to the realization of high performance ultra-broad-band photodetectors. The limited optical absorbance of RGO is not conducive to achieving a high photodetector response, and the RGO energy gap of tens of meV is inappropriate for VIS and NIR light detection. However, Si nanowire (SiNW) arrays have two unique advantages that can compensate to an extent for the RGO defi ciencies. O ne is the Si bandgap of ∼1.12 eV , which makes SiNW arrays suitable for photo-detection in the VIS to NIR range. The other is the aligned nanowire array structure that can intensively suppress light refl ection over a wide spectral range from VIS to NIR. This can signifi cantly improve the light harvesting of SiNW arraybased devices.[ 19 ] Introducing SiNW arrays to RGO devices can not only enhance the device light harvesting properties, but can also enhance the photoresponse to light from the VIS to NIR range.T hus, here we integrated the advantages of RGO and SiNW arrays into a single photodetector by forming RGO -SiNW array heterojunctions through a simple, low-cost drop casting method followed by heat treatment. A broad photo-response from VIS (532 nm) up to the terahertz regionSilicon NanowiresDOI: 10.1002/smll.201303339Y . Cao, J. Zhu, J. HeF unctional Nanomaterials Laboratory and Key Laboratory of Photochemical Conversion and Optoelectronic MaterialsTechnical Institute of Physics and ChemistryC hinese Academy of Sciences (CAS) Z hongguancundonglu 29 ,H aidianqu ,B eijing 100190 ,C hina E-mail: j hhe@ J . XuB eijing Key Laboratory of Low-grade Energy Multiphase Flow and Heat Transfer, School of Renewable EnergyN orth China Electric Power University B eijing 102206 ,C hina J .-L.SunS tate Key Laboratory of Low-Dimensional Quantum Physics Department of Physics T singhua University B eijing 100084 ,C hina E-mail:j lsun@ J .-L.SunC ollaborative Innovation Center of Quantum Matter B eijing ,C hinaY . Wang, Z. ZhaoK ey Laboratory of Particle & Radiation Imaging (Tsinghua University) Ministry of EducationDepartment of Engineering Physics T singhua University B eijing 100084 ,C hinaH igh-performance broadband photodetectors have recently attracted signifi cant interest[ 1–5 ] because of their impor-tance to a variety of applications, including imaging, remote sensing, environmental monitoring, astronomical detection, photometers and analytical applications. Graphene is a prom-ising material for broadband photodetection applications because of its ability to absorb incident light over a wide wavelength range, from at least the visible (VIS) spectrum tothe infrared.[ 6] Recent works have demonstrated that zero-bandgap single- or few-layer graphene-based photodetec-tors based on a fi eld-effect transistor (FET) structure could operate in the near-infrared (NIR) and VIS parts of theelectromagnetic spectrum.[ 7,8 ] However, no working spectra have been demonstrated for these zero-bandgap graphene photodetectors in longer wavelength ranges. Theoretical cal-culations indicated that opening and varying the bandgap ofY. Cao et al. communications(2.52 THz, or a wavelength of 118.8 µm) was thus realized in a single RGO-based photodetector at room temperature.T he SiNW array and graphene oxide (GO) nanosheets were prepared by metal-assisted chemical etching [ 20 ]and an improved Hummers’ method, [ 21 ]respectively. The details are given in the Supporting Information. As Figure S1 shows, the SiNW array was hydrophobic, but had good ethanol wettability. The RGO-SiNW array heterojunction was thus fabricated by drop-casting an ethanol suspension of GO nanosheets on top of the SiNW array, which is favorable for GO nanosheets to be uniformly spread over the SiNW array surface during direct drop casting of the GO suspen-sion on top of the SiNW array. The heterojunction was then subjected to heat treatment at 550 °C in an Ar (95%)-H 2 (5%) atmosphere for 3 h. This heat treatment implemented reduction of the GO nanosheets to a degree while simulta-neously improving the contact between the SiNW array and the RGO nanosheets. Scanning electron microscopy (SEM) observation of the heterojunction ( F igure1)revealed three important features. First, the SiNW array, which was about 5 µm long, was oriented vertically to the wafer surface (Figure 1a). The high density and the uniformity of the array suggested excellent SiNW quality (Figure 1b). Second, a good heterojunction was formed by the SiNW array and the RGO nanosheet (Figure 1c). Although cracks (pointed by arrows in Figure 1d) existed in some RGO layers, the multilayer struc-ture of RGO sheets that overlapped and interconnected with each other (Figure 1d) ensured an electrically-conducting pathway. The multilayer structure of RGO nanosheets has similar transmittances of 22−25% for all the lights from the VIS (532 nm) up to the terahertz region (2.52 THz) (see Figure S2 and Table S1), indicating insignifi cant wavelength selectivity of light transmission by RGO nanosheets. Third, most RGO nanosheets on the SiNW array were spread out, and the existence of wrinkles and folds (pointed by arrows in Figure S3) showed that the two-dimensional nanosheetF igure 1. C ross-sectional-view (a) and top-view (b) SEM images of the SiNW array. Cross-sectional-view (c) and top-view (d) SEM images of the RGO-SiNW array heterojunction produced by heat-treatment at 550 °C. (e) Schematic illustration of the device confi guration. Inset: a digital photograph of the device.Ultra-Broadband Photodetector for the Visible to Terahertz Range by Self-Assembling Reducedwas fl exible (Figure S3). Figure 1 e shows a schematic of the fabricated RGO -SiNW array heterojunction photodetector in a two-pole structure, and the inset shows a digital photo-graph of the device. The device fabrication is described in the Experimental Section. All measurements were carried out at room temperature under ambient conditions. The forward bias is defi ned as a positive voltage applied to the RGO nanosheets. F igure 2 a , c, e and g show typical current–voltage ( I –V )characteristics of the RGO-SiNW array heterojunction photo-detector in the dark and under irradiation by 532 nm (VIS), 1064 nm (NIR), 10.6 µm (MIR), and 118.8 µm (2.52 THz)P h o t o c u r r e n t (m A )Time (s)P h o t o c u r r e n t (m A )Time (s)P h o t o c u r r e n t (m A )Time (s)P h o t o c u r r e n t (m A )Time (s)C u r r e n t (m A )Voltage (V)C u r r e n t (m A )Voltage (V)C u r r e n t (m A )Voltage (V)C u r r e n t (m A )Voltage (V)(c)(a) (b)(d)(e)(f)(g)F igure 2. P hotoelectrical properties of the RGO-SiNW array heterojunction photodetector produced by heat-treatment at 550 °C. (a, c, e and g) I –V characterizations, (b, d, f and h) photoresponses under illumination by (a, b) 532 nm (VIS), (c, d) 1064 nm (NIR), (e, f) 10.6 µm (MIR) and (g, h) 118.8 µm (THz) lasers. The insets in (a, c, e and g) show their respective I –V characteristics in detail around the origin.Y. Cao et al. communicationslasers, respectively. The dark I-V curve showed rectifying char-acteristics and confirmed that the RGO nanosheet formed a Schottky-like junction with the SiNW array. [ 22 ]Equilib-rium energy band diagram of the RGO/n-Si heterojunction in the dark is shown in Figure S4(a). In all four irradiation cases, from VIS to THz, the RGO-SiNW array heterojunc-tion yielded a significant photocurrent I ph, which is defi ned as the difference between the current under irradiation and the dark current. One phenomenon of note is that under irra-diation with both VIS and NIR lasers, approximately equiva-lent photocurrents can be found under both forward bias and reverse bias, whereas, under irradiation with MIR and THz lasers, the photocurrents under forward bias are much larger than those under reverse bias. A recent study on gapless gra-phene−silicon wafer heterojunctions showed I ph at reverse bias by illumination with visible light, because the photoex-citation only took place in Si and the graphene only worked as carrier collector. [ 23 ]When the current RGO-SiNW array heterojunction was irradiated with VIS or NIR lasers, how-ever, photoexcitation resides in both of SiNW array and RGO which has a minor bandgap, due to the higher photoenergies of VIS (∼2.33 eV) and NIR (∼1.17 eV) than the bandgaps of Si (∼1.12 eV) and RGO (tens of meV). The photoexcitation of SiNW array mainly contributed to the generation of photo-current at reverse bias, while that of the RGO predominantly contributed to the generation of photocurrent at forward bias (Figure 2a and c). The energy band diagram under a reverse bias, V r bias,is schematically shown in Figure S4(b), in which V r bias lifts the Fermi level of RGO (E f(RGO)) to a higher value than its original position in the dark. Thus, the Dirac cone of RGO opens up a large number of accessible states for injection of photo-induced holes from Si and allowing a com-plete collection of the injected holes. [ 23 ]In contrast, when the RGO-SiNW array heterojunction was irradiated with MIR and THz lasers, I ph was only attributed to the photoexcita-tion of RGO because the photoenergies of MIR (∼0.117 eV) and 2.52 THz (∼0.01 eV) are both lower than the bandgap of Si. Figure 2e and g again confi rm that the I ph ascribed to the photo e xcited carriers in RGO mainly occurred at forward bias. Figure S4(c) schematically represents the situation under a forward bias, V f bias. The photo-induced holes by MIR and THz lasers transfer from RGO to Si.T he insets in Figure 2a, c, e and g show their respective I–V characteristics in detail near the origin, and further prove the above explanation. From comparison of the insets, an open-circuit voltage ( V oc)of ∼0.15 V and a short-circuit cur-rent ( I sc)of ∼10 µA are found under irradiation with VIS and NIR lasers (see the insets in Figure 2a and c), which can be attributed to photoexcitation of the SiNW array. [ 22 ]However, for the cases of MIR and THz irradiation, V oc and I sc are absent because there is no photoexcitation inside the SiNW array (see the insets in Figure 2e and g). Thus, under MIR and THz irradiations, photogenerated currents in the device only come from the RGO.I n addition, as shown in Figure 2a and c, under irradia-tion with VIS and NIR lasers, the photocurrents at biases of 1 V and −1 V are approximately equivalent, but much lower dark currents at a bias of −1 V render a much higher O N/ OFF ratio (the ratio of current during irradiation to the dark current) than at a bias of 1 V. In the VIS irradiation case, the ON/OFF ratios at −1 V and at 1 V are 7.09 and 1.37, respec-tively; in the NIR irradiation case, the ON/OFF ratios at −1 V and 1 V are 11.27 and 1.57, respectively. Thus, for photodetec-tion of VIS and NIR light, −1 V should be used as the device’s working bias. For photodetection of MIR and THz light, as a result of relatively higher photocurrents under forward bias than under reverse bias, 1 V is chosen as the photodetector’s working bias.T he respective photoresponses to the VIS/NIR lasers at a bias of −1 V and to the MIR/THz lasers at a bias of 1 V are shown in Figure 2b, d, f and h. Signifi cant photocurrent response was observed for all the VIS, NIR, MIR and THz irradiations. Good photoresponse repeatability was observed in the cases of MIR and THz irradiation, but for the VIS and NIR irradiations, the photoresponse repeatability was weakened, as reflected in the increase of photocurrent with light-on and off cycles. This is mainly attributed to the thermal effect of Si. However, it is noted that the photore-sponse time remained constant in the light-on and off cycles. Thus, the RGO-SiNW array heterojunction photodetector can effectively perform ultra-broadband detection of light from VIS to THz. To the best of our knowledge, this is the broadest range reported to date for a single graphene-based photodetector device. For VIS and NIR irradiation, when the irradiation was ‘O N’ or ‘O FF’, the device produced a quick response (indicated by the green arrows in Figure 2b and d). For example, when NIR irradiation was “ON”, the photocur-rent increased to 65% of the maximum within 70 ms (the time interval between two collected data points). The rise time t r and decay time t d of the photodetector were calculated for the four irradiation cases according to the method in the literature, [ 24 ]and are summarized in Table S2. Clearly, under both VIS and NIR irradiation, the device shows shorter t r and t d values than under both MIR and THz irradiation, where both t r and t d are reduced by approximately 50%. This sug-gests that photoexcitation of the SiNW array can signifi cantly improve the photodetector response speed. For MIR and THz irradiation, the device response, i.e. the increase in the current, should only come from photoexcitation within the RGO, and thermal effects can be excluded because graphene heating by IR laser absorption is known to reduce graphene conductivity. [ 25–28 ]W e also investigated the effects of reduction degree of RGO nanosheets on the photodetector performance. Because the RGO reduction degree increases with increasing heat treatment temperature, the GO-SiNW array heterojunction was also heat-treated at 1000 °C for comparison. The Raman spectra of RGO-SiNW-1000 °C and RGO-SiNW-550 °C ( F igure3a) show two strong characteristic bands at 1358 cm −1 and 1597 cm −1, which are assigned to a D band corresponding to the structural disorder of the sp 2bonded carbon domain, and a G band corresponding to the C-C stretching in the graphitic lattice, respectively. The intensity ratio of the two bands ( I D/I G) decreases from 1.15 to 0.97 with an increase in the heat-treatment temperature from 550 °C to 1000 °C, indicating that the higher temperature heat-treatment caused more restoration of electronic conjugation within the RGO nanosheets and increase in the cluster size of nanographiteUltra-Broadband Photodetector for the Visible to Terahertz Range by Self-Assembling Reducedcrystallites. This would in turn enhance the RGO nanosheetconductivity.[ 29 ] Figure 3 b shows the I -V characteristics of the RGO -SiNW-1000 °C and RGO -SiNW-550 °C devices in the dark. Clearly, under the same bias, the dark current of the RGO-SiNW-1000 °C device is much higher than that of the RGO-SiNW-550 °C device. This can mainly be attrib-uted to the enhanced conductivity of the RGO nanosheets after heat-treatment at 1000 °C. The higher temperature treatment should also be benefi cial for enhanced contact between the SiNW array and the RGO nanosheet, which would enhance the charge transport.T o eliminate the photocurrent interference generated by the SiNW array, we selected the irradiation cases with MIR and THz lasers, which can only excite RGO, to investigate the effects of the reduction degree of RGO on the photodetector performance. Figure 3 c and d show the photoresponses of the RGO-SiNW-1000 °C device and the RGO-SiNW-550 °C device, respectively, measured under the same conditions upon MIR and THz irradiation. It is shown that the RGO -SiNW-1000 °C photodetector exhibited the same stability and reproducibility as the RGO -SiNW-550 °C. Under both MIR and THz irradiation, the steady-state photocurrent of the RGO -SiNW-1000 °C device is, however, much larger than that of the RGO -SiNW-550 °C device. The photocur-rents of the RGO -SiNW-1000 °C device are 5.45 times and 5.68 times as high as those of the RGO-SiNW-550 °C device under the MIR and THz irradiations, respectively. This means that the responsivities (defi ned as the photocurrent gener-ated per unit power of incident light on a photoconductor[ 30 ])of the RGO-SiNW-1000 °C photodetector are 5.45 times and5.68 times as high as those of the RGO-SiNW-550 °C photo-detector under the MIR and THz irradiations, respectively(see Table S3). According to the above methods, t r and t dof the RGO -SiNW-1000 °C photodetectors under the MIR and THz irradiations were calculated from the curves in Figure 3 c and d, and they are approximately equal to those of the RGO -SiNW-550 °C photodetector (see Table S3). Thus, the heat-treatment temperature only had a decisive effect on the responsivity of RGO -SiNW array heterojunc-tion photodetectors. These results suggest that the photode-tector responsivity can be signifi cantly affected by the degree of reduction of RGO.F rom Table S2, it is noted that the photodetector has the highest responsivity for MIR (10.6 µm) among the four irra-diation cases. Because the 8–14 µm MIR wave band is the widest infrared atmospheric window and it mainly stem from the thermal radiation of the object itself, the detection of 8–14 µm MIR is particularly important in medical, industrial and military applications, including detection of cancer or infection, thermal infrared remote sensing and night vision. Therefore, we studied the MIR (10.6 µm) detection perfor-mance of the RGO-SiNW-1000 °C device in detail. Figure S5a shows the photoresponses of the device when irradiated by lasers of different powers. Clearly, the RGO -SiNW-1000 °C photodetector exhibits excellent stability and reproducibility under different irradiation powers. Figure S5b, which shows the photocurrent versus the irradiation power for the photo-detector, indicates that the photocurrent increases linearly9001200150018002100RGO-SiNW-550o C I D /I G = ca. 1.15RGO-SiNW-1000o C I D /I G = ca. 0.97I n t e n s i t y ( A r b . U . )Raman Shift (cm -1)-1.0-0.8-0.6-0.4-0.20.00.20.40.60.8 1.0-11234RGO-SiNW-550°CRGO-SiNW-1000°CC u r r e n t (m A )Voltage (V)In darkP h o t o c u r r e n t (m A )Time (s)P h o t o c u r r e n t (m A )Time (s)(a)(b)(c)(d)F igure 3. C omparison of properties of RGO-SiNW array heterojunctions after heat-treatment at 550 °C (blue) and 1000 °C (red), respectively. (a) Raman spectra. (b) I –V characterizations in the dark. (c) and (d) show their photoresponses at a bias voltage of 1 V upon MIR (10.6 µm) irradiation at 354 mW and upon 2.52 THz (118.8 µm) irradiation at 98 mW, respectively.Y. Cao et al.communicationswith increasing irradiation power. The photodetector respon-sivity was calculated to be 9.0 mA W−1 at a bias voltage of 1 V .I t is well known that human body infrared radiation is in the MIR region, with a peak wavelength of approximately 9–10 µm. O ur RGO -SiNW-1000 °C photodetector showed high MIR (10.6 µm) radiation sensitivity and thus might be suitable for high sensitivity infrared radiation detection of the human body. Figure S6 shows that at the bias voltage of 1 V , when a human hand was close to the device, the RGO-SiNW-1000 °C photodetector could produce an average photo c urrent (ph ) of up to 0.18 mA. The RGO-SiNW array heterojunction photodetector would thus be potentially useful as human infrared sensors.I n summary, we integrated the advantages of RGO and SiNW array in a single photodetector by forming an RGO -SiNW array heterojunction via simple drop-casting of the suspension of GO nanosheets on top of the SiNW array fol-lowed by heat-treatment. The photodetector is photorespon-sive to the VIS (532 nm), NIR (1064 nm), MIR (10.6 µm), and 2.52 THz (118.8 µm) irradiations at room temperature. To our best knowledge, such a photoactivity range from visible (532 nm) up to terahertz (118.8 µm) is the broadest reported to date for graphene-based photodetectors. Upon VIS and NIR irradiations, photoresponse occurs from photo-excitation in both the SiNW array and the RGO , and the photoexcitation of the SiNW array can enhance the photo-detector response speed by 50%. Upon MIR and THz irra-diations, photoresponse occurrs from photoexcitation only in the RGO. Among the four irradiations, the RGO -SiNW array heterojunction photodetector demonstrates the highestresponsivity of 9 mA W−1 to MIR irradiation. The photode-tector can achieve high sensitivity detection of the infrared radiation from the human body, and thus would be poten-tially useful as human infrared sensors. In addition, The photo d etector responsivity can be signifi cantly affected by the reduction degree of RGO nanosheets. These results indi-cate that the RGO -SiNW array heterojunction has great potential for ultra-broadband photodetection applications, especially in the MIR region.E xperimental Section R GO-SiNW Array Heterojunction Fabrication and Characteri-zation : Preparations of GO and SiNW array see the Supporting Information. To fabricate the RGO-SiNW array heterojunction, the as-prepared SiNW array was washed with 5% HF to remove the oxide layer, and was then cleaned with deionized water and dried by an N 2 fl ow. A GO suspension (0.7 mg mL −1 ) was prepared by sonication (1 h) of GO nanosheets in ethanol to produce a reason-ably stable light-brown GO suspension. The GO suspension was then directly drop-casted on top of the SiNW array. The heterojunc-tion was dried in air at 60°C and subjected to further heat-treat-ment in an Ar (95%)-H 2 (5%) atmosphere at 550 or 1000 °C for 3 h. The heterojunction morphology was characterized by a SEM(S-4800, Hitachi, Japan). Transmittances of the RGO nanosheets for all incident wavelengths were measured by drop-casting theRGO nanosheets on a quartz substrate (VIS and NIR) or a single crystal silicon wafer substrate (MIR and THz) followed by 550 °Cheat treatment using UV-Vis-NIR spectrophotometer (Varian Cary 5000), Fourier transform infrared spectrometer (Varian 3100 FT-IR) and pyroelectric detector (SENSOR-und L ASERTECHNIK THz20), respectively. Raman spectra were obtained on a Raman spec-trometer (inVia-Refl ex, Renishaw, U.K.) with 532 nm wavelength incident laser light. The contact angles (CAs) on the SiNW array surface were measured at ambient temperature using a JC contact angle/interface system (Shanghai Zhongchen Digital Technique Apparatus Co., China).D evice Fabrication : The front contact, designed as a circular shape, was produced by depositing an Au ring with 3 mm inner diameter (larger than the light spot diameter) and 7 mm outer diameter using a mask on top of the RGO-SiNW array heterojunc-tion. The back ohmic contact was then formed by coating eutecticGa:In on the back side of the n-Si substrate. [ 31 ]P hotoresponse Measurement : VIS, NIR, MIR and THz irra-diations were achieved using a 532 nm semiconductor laser (218 mW; spot diameter: ∼2.00 mm), a 1064 nm laser (317 mW; spot diameter: ∼3.00 mm), a 10.6 µm CO 2 laser (the laser power can be adjusted continuously; spot diameter: ∼3.00 mm) and a 2.52 THz gas laser (∼100 mW; spot diameter: ∼3.00 mm; FIRL 100, Edinburgh Instruments Ltd.), respectively. The electrical character-istics were collected using a Keithley 2400 SourceMeter.S upporting Inf ormation Supporting Information is available from the Wiley Online Library or from the author.A cknowledgements This work was supported by National Natural Science Founda-tion of China (Grants No. 11104283, 21271177, 11174172, and 11004054), the National Basic Research Program of China (Grant No. 2010CB934103), the National High Technology Research and Development Program (“863” Program) of China(Grant no. 2011AA050525), the CAEP THz Science and Technology Founda-tion (Grant No. CAEPTHZ201211), National Science and TechnologySupport Program of China (Grant No. 2013BAK14B03) and Open Research Fund Program of the State Key Laboratory of Low-Dimen-sional Quantum Physics (Grant No. KF201207). [1]S .N anot ,A .W.C ummings ,C .L.P int ,A .I keuchi ,T .A kiho ,K .S ueoka ,R .H.H auge ,F .L éonard ,J .K ono ,S ci. 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