IPC Test Methods Manual
印制电路技术规范
印制电路技术规范1．0．前言(Introduction)本章叙述刚性印制板和高密度互连(HDI)层或板的技术要求，标志、包装、运输和贮存的基本原则。
本章提及的印制板通常是指带有镀通孔(即金属化孔)的双面、多层板，带有或不带埋／盲孔的多层板。
美国IPC协会(全称为美国连接电子业协会，Association Connecting Electronics lndustries)是全球印制板行业最有学术成就的组织，基于国内外大多数印制板生产企业和电子装配企业使用的是美国ICP协会的标准，本文说及的技术规范主要参照美国IPC最新版本的相关标准，亦参考使用了部份著名电子公司的企业标准，欧州标准(例如Perfag3c)和国家标准。
1．1 参考标准(Reference Starard)•IPC-6012A．刚性印制板的鉴定和性能规范．(Qualitication and performance specification fOrRigid Printed Boards)．•IPC-A-600F．印制板的可接收性(Acceptability Of Printed Board)•IPC-4101A．刚性和多层印制板基材技术规范(Specification For Base Materials For Rigid andMuhilayer Printed Boards)．•IPC-A-650试验方法手册(Test MethodsManual)•IPC-2615．印制板的尺寸和公差(PrintedBoard Dimensions and Tolerances)•IPC-6016高密度互连(CDI)层或板的鉴定和性能规范(Qualification and Performance Specification For HiSh Density Interconnect CHDI)Layer Or Boards)•ANSI／J-STD-003印制板可焊性试验(Solderabil卸Test For Printed Board)(注：ANSI，American National Standards lnstitude，美国国家标准)•IPC-2220设计标准系列(Design standardsenes)•IPC-SM-840C永久性阻焊膜的鉴别和性能(Qualification and Performance Of Permanent SolderMask)•FERFAG 3C多层板技术规范(欧州标准，1999出版)(Specification For Muhilayer Boards)．•UL-796．印制线路板安全标准(Standard ForSafety Printed Wiring Board)•UL-94．装置及设备中部件用塑料的燃燃性试验。
IPC650-2.5
2.5.33.4
Measurement of Electrical Overstress from Soldering Hand Tools (Shielded Enclosure)
11/98
Volume and Surface Resistivity of Dielectric Materials
12/94
2.5.17.2
Volume Resistivity of Conductive Resistance Used in High Dentisty Interconnection (HDI) and Microvias, Two-Wire Method
3/79
2.5.28.A
Q Resonance, Flexible Printed Wiring Materials
4/88
2.5.30
Balanced and Unbalanced Cable Attenuation Measurements
12/87
2.5.31
Current Leakage (Through Overglaze Films)
3/98
2.5.5.5.1
Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHZ
3/98
2.5.5.6
Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates
Propagation Delay of Flat Cables Using Time Domain Reflectometer (TDR)
IR测试方法(IPC TM 650 2.6.27)
1Scope and Purpose1.1Scope This method shall be used to simulate expo-sure to the thermal conditions of convection reflow assembly.1.2Purpose This method shall be used to replicate the thermodynamic effects of assembly on the test specimen.The use of this method in accordance with the requirements defined herein shall cover those effects that are the result of convection reflow assembly,rework or repair.1.2.1This method shall be used for qualification testing of an applicable test specimen.The evaluation of acceptability for qualification shall be in accordance with the requirements defined in5.3.1.2.2This method may be used for lot acceptance.The evaluation for lot acceptability should be in accordance with the requirements defined in5.3or as agreed upon between user and supplier(AABUS).2Applicable DocumentsIPC-T-50Terms and DefinitionsIPC-A-600Acceptability of Printed BoardsIPC-TM-650Test Methods Manual2.1.1Microsectioning2.1.1.2Microsectioning-Semi or Automatic TechniqueMicrosection Equipment(Alternate)IPC-2221Generic standard on Printed Board DesignIPC-6012Qualification and Performance Specification for Rigid Printed BoardsIPC-6013Qualification and Performance Specification for Flexible Printed BoardsIPC-6016Qualification and Performance Specification for High Density Interconnect(HDI)Layers or BoardsIPC-6018Microwave End Product Board Inspection and Test 3Test Specimen3.1Design/Construction Criteria3.1.1The test specimen shall be the A/B coupon in accor-dance with the requirements of IPC-2221.3.1.2The test specimen shall be constructed with both the largest plated-through holes(PTHs)and the smallest vias con-tained in the printed board(PB)it represents.3.1.2.1The test specimen shall contain the representative ground and power planes of the PB design.3.1.2.2The test specimen shall contain the representative/ applicable blind and/or buried vias of the PB design.3.1.2.3The test specimen shall contain a minimum of four(4)of the smallest vias that represent the via protection strat-egy incorporated in the PB design.3.1.3The test specimen shall allow for microsection evalu-ation of all the applicable,representative PTHs and vias defined in3.1.2after exposure to the conditions of this Test Method.3.1.4Deviations to the test specimen design/construction or use of an alternate test specimen such as the PB or a sec-tion of the PB shall be AABUS.4Apparatus4.1Drying Oven4.1.1The oven shall be capable of maintaining a uniform set temperature within the105to125°C[221to257°F] range.4.2Thermal Excursion Simulator4.2.1The system used to simulate the thermodynamic effects of assembly shall be convection reflow.Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC.This material is advisory onlyand its use or adaptation is entirely voluntary.IPC disclaims all liability of any kind as to the use,application,or adaptation of thisers are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.Page1of84.2.1.1The system shall have adequate environmental controls to maintain the tolerance range and limits in accor-dance with the reflow profile depicted in either Figure5-1or Figure5-2.4.2.1.2The system should accommodate verifiable calibra-tion compliance and reflow profile generation.See note6.1for additional considerations.4.2.1.3The test specimen shall be handled and stored in a controlled environment to minimize moisture ingression.4.2.2Deviations to the equipment requirements and acceptability of the alternative methods shall be AABUS.4.3Microscope4.3.1The magnification used for defect recognition must be in agreement with the inspection requirements/capabilities defined in IPC-A-600and the applicable performance specifi-cation(e.g.,IPC-6012,IPC-6013,IPC-608,etc.).5Procedure5.1Conditioning5.1.1The test specimen shall be conditioned by drying in an oven to remove moisture for a minimum of six(6)hours at 105to125°C[221to257°F].This conditioning process is mandatory if this method is used for qualification purposes.This method shall replicate the assembly process.The requirement for conditioning(bake/drying)shall be in accor-dance with product/process lot acceptance criteria.If condi-tioning of the PB is not part of the normal assembly process, and this method is being used for acceptance testing,then conditioning is not a requirement.5.1.2Test specimens that are thicker or more complex may require longer baking times to achieve acceptable moisture levels.Record the bake times and temperature if different than those stated in5.1.1(see6.2).5.1.3Deviations to the conditioning requirements in5.1.1 such as when used for acceptance criteria and/or any changes to the time and temperature shall be AABUS(see 6.3).5.2Reflow Profile5.2.1Reflow the test specimen in accordance with Table 5-1(default)or Table5-2(low temperature profile).5.2.2The reflow profile shall be in accordance with either Figure5-1or Figure5-2.Figure5-1represents the default reflow profile.Figure5-2represents the low temperature pro-file.The attachment of thermocouples to the sample test specimen shall be such that the reflow profile is calibrated to the surface temperature of the test specimen.5.2.3The test specimen shall be subjected to six(6)com-plete reflow cycles.5.2.4The cool down rate shall be in accordance with Table 5-1.The cool down is complete when the test specimen reaches30°C.The test specimen shall achieve a thermal equilibrium of30°C or less prior to starting the next reflow cycle.If the time it takes to achieve thermal equilibrium can-not be determined,then a five(5)minute dwell between reflow cycles shall be required.5.2.5Deviations to the reflow profile or number of cycles shall be AABUS.5.3Evaluation5.3.1Microsection After the test specimen has been con-ditioned and reflowed in accordance with the requirements of 5.1and5.2,microsection the test specimen in accordance with the requirements defined in IPC-TM-650,Method2.1.1 or Method2.1.1.2and evaluate for compliance to the appli-cable performance specification.5.3.2Deviations to the stated requirements or additional requirements defined here shall be AABUS.Revision Page2of8Table5-1260°C Reflow Profile Specifications(Default)RevisionPage3of8RevisionFigure5-1260°C Reflow Profile Chart(Default) Page4of8Table5-2230°C Reflow Profile Specifications(Low TemperatureProfile)RevisionPage5of8RevisionFigure5-2230°C Reflow Profile Chart(Low Temperature Profile) Page6of86Notes6.1The design of the convection reflow system should be flexible enough to facilitate the creation of the reflow profiles depicted in Figure5-1and Figure5-2for all the applicable test specimen designs encountered.Some issues to consider are as follows:•Thermal mass compensation capability(energy vs.time)•Environmental control capability(heating and cooling)•Reproducibility of parameters•Preheat•Conveyor speed(if applicable)•Heating ramp rate•Cool down rate•Programming capability•Profile memory The IPC-TM-650website provides a non-comprehensive list-ing of providers of convection reflow systems suitable for meeting the reflow profiles within this test method.6.2Deviations to the time and temperature specified in5.1.1 should take into consideration maintaining the solderability of the surface finish being utilized.6.3As this method addresses assembly issues with PBs,it is recommended that the user of the PB establish a drawing note in the procurement documentation to provide the PB fabricator with guidance relative to the intended application of the PB.An example of such a drawing note is provided as fol-lows:‘‘TEST COUPONS SHALL BE SUBJECTED X TIMES TO IPC-TM-650,METHOD2.6.27REFLOW PROFILES PER TABLE 5-Y AFTER PRECONDITIONING FOR XX HOURS AT Z°C.’’RevisionPage7of8RevisionThis Page Intentionally Left Blank Page8of8。
印制板规范
印制电路技术规范一、前言1．美国IPC协会（全称为“美国电子电路互连与封装协会”，The Institute For Interconnecting and Packaging Electronic Circuits）是全球印制板行业最有学术成就的组织，基于国内外大多数印制板生产企业使用的是美国IPC协会的标准。
2．引用标准IPC—6012A刚性印制板的签定和性能规范（Qualification and Performance Specification for Rigid Printed Boards）IPC—A—600F印制板的可接收性（Acceptability of Printed Board）IPC—A—650试验方法手册（Test Methods Manual）IPC—D—300G印制板的尺寸和公差（Printed Board Dimensions and Tolerances）IPC—SM—840C印制板永久性阻焊膜的签别和性能（Qualification and Performance of permanent Polymer Coating(solder Mask)for Printed Boards）IPC—4101刚性和多层印制板基材技术规范（Specification for Base Materials for Rigid and Multilayer Printed Boards）UL796，印制线路板安全标准（Standard for Safety Printed Wiring Board）UL94装置及设备中部件用塑料的燃烧性实验3．产品分类按其功能可靠性和性能要求，对印制板分为下列三个通用等级1级—一般电子产品。
包括消费类产品，某些计算机及其外围产品和一般性的军品。
用于这些产品的印制板对外观缺陷并不重要，其主要要求是印制板的功能。
2级—专用电子产品。
包括通讯设备、复杂的商用机器、仪器和军用装备等。
IPC-TM-650 Section 2.4.28.1D-Adhesion, Solder Resist (Mask), Tape Test Method
1Scope This test method defines the procedure for deter-mining the adhesion of solder resists (masks)used over melt-ing metals,(such as solder plated and reflowed solder printed boards both prior to and after soldering),non-melting metals,and printed board substrates.2Applicable Documents J-STD-003Solderability Test Methods for Printed Boards.IPC-2221Design Standard for Rigid Printed Boards.3Test Specimens The test specimen used shall be thetest coupon shown in Figure 1,which has the plated metal surface that is applicable,and coated with solder resist.4Apparatus or Material4.1Tape A roll of pressure sensitive tape 3M Brand 6001/2inch wide.The shelf life of the tape is one year.5Procedure 5.1Preparation5.1.1For qualification testing,test specimens are to be pre-pared by processing 34.0µm [1,339µin],double clad epoxy glass laminate through the standard plating process for the metal coatings that are applicable.For production testing,the coupons shall be representative of the board.5.1.2For preproduction qualification,test specimens are tobe cleaned using cleaning methods as recommended by the solder resist manufacturer and standard production methods for comparison purposes prior to solder resist application.5.1.3Test specimens are to be coated and cured by thestandard production method.IPC-24281-1Figure 1Test Coupon G of IPC-2221,mm[in]Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC.This material is advisory only and its use or adaptation is entirely voluntary.IPC disclaims all liability of any kind as to the use,application,or adaptation of this ers are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.Page 1of 25.1.4Testing is to be conducted on specimens before and after soldering in accordance with J-STD-003,Methods A,B, C,or D with no accelerated aging.5.2Test5.2.1Press a strip of pressure sensitive tape,50mm [1.97in]minimum in length,firmly across the surface of the test area removing all air entrapment.The time between appli-cation and removal of tape shall be less than one minute. Remove the tape by a rapid pull force applied approximately perpendicular(right angle)to the test area.An unused strip of tape must be used for each test.5.3Evaluation5.3.1Visually examine the tape and test area for evidence of any portion of the material tested having been removed from the specimen.5.3.2The report should note any evidence of material removed by this test.6Notes6.1Figure1illustrates the coupon that is used for testing. The black squares indicate metal.The white squares indicate the base material.Solder mask is applied over the entire con-ductor pattern.6.2If foreign material(oil,grease,etc.)is present on the test surface the results may be affected.6.3Certification of3M Brand6001/2inch tape to CID-A-A-113is not required.The3M Brand6001/2inch tape is avail-able through most office supply stores.IPC-TM-650Number 2.4.28.1SubjectAdhesion,Solder Resist(Mask),Tape Test MethodDate05/04RevisionDPage2of2。
IPC
1ScopeThis test measures changes in resistance ofplated-through hole barrels and internal layer connections as holes are subjected to thermal cycling.Thermal cycling is pro-duced by the application of a current through a specific cou-pon configuration.In this technique,the test coupon is resistance heated by passing DC current through the internal layer connection to the barrel for three minutes to bring the temperature of the copper to a designated temperature.Switching the current on and off creates thermal cycles between room temperature and the designated temperature within the sample.This ther-mal cycling induces cyclic fatigue strain in the plated-through hole barrels and internal layer interconnects and accelerates any latent defects.The number of cycles achieved permits a quantitative assess-ment of the performance of the entire interconnect.Detailed information regarding the test is found in Section 6.2Applicable Documents IPC-TM-650Test Methods Manual2.1.1Microsectioning2.1.1.2Microsectioning -Semi or Automatic Technique3Test SpecimensA typical daisy chain test coupon isshown in Figure 1.3.1IST Coupon Certain design rules must be applied toachieve thermal uniformity.Electronic design files for coupon construction are available from the IST test system provider.The coupon resistance should measure between 150millio-hms and 2.0ohms when measured at elevated temperatures.Two resistance values (voltage drops)for each coupon are monitored independently,using a four wire measurement technique.The test coupon(s)is incorporated on the panel to monitor or qualify design,materials or processes and provide risk assessment of product and/or reliability assurance.4Apparatus or Material 4.1Interconnect Stress Test System (IST)or equivalent.IST SYSTEM DETAILSThis equipment is available from:PWB Interconnect Solutions Inc.195Stafford Rd W Unit 105Nepean,Ontario Canada K2H 9C1(613)-596-4244URL:4.2Two (2)four-pin,2.54mm [0.1in]pitch male connectors (MOLEX 2241-4042or equivalent)4.3Sn60Pb40or Sn63Pb37Solder 4.4Solder Flux 4.5Soldering Iron 4.6Multimeter -optional4.7Thermal Imaging equipment -optional5Procedure5.1Sample preparation5.1.1Solder two four-pin male connectors in the 1.02mm[0.040in]holes at left and right edges of side one (1).A sol-der fillet must be apparent on both sides of the coupon.5.1.2Allow coupons to come to room temperature (approxi-mately 10minutes),prior to installation onto IST system.5.2IST Procedure5.2.1Position coupons at each test head by attaching maleto female connectors.Figure1Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC.This material is advisory only and its use or adaptation is entirely voluntary.IPC disclaims all liability of any kind as to the use,application,or adaptation of this ers are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.Page 1of 35.2.2Provide system software with specific test conditions. The available ranges and typical conditions are as follows:Conditions IST Range DefaultNo.of samples1-66Test Temp50°C to250°C[122°F to422°F]150°C (302°F]Max.Res.Chng1-100%10%Max.No.Cycles1-4000250(1day) Data Coll.Freq.1-100cycles10cycles Cooling Ratio0.5-2X heat time0.66Table Selection system/custom system5.2.3Pre-Cycling Test Sequence The following para-graphs detail the sequence for a single coupon,however this sequence is done at all test heads simultaneously.The ambi-ent resistance,target temperature resistance,rejection resis-tance and current is calculated for each coupon and displayed on the PC monitor.CAUTION:Handling the coupons will raise the temperature of the coupon and may affect the ambient resistance calculation during the pre-cycling sequence.If the ambient temperature of the coupons is in question,cool the coupons with the fans on the IST equipment for one to two minutes.5.2.3.1Ambient Resistance The auto ranging multimeter measures the ambient resistance(voltage drop)of the cou-pon.This is the circuit that heats the coupon with DC current.5.2.3.2Target Temperature Resistance The system software calculates and displays the required‘‘target’’resis-tance(temperature).The available stress testing range is from 50°C-250°C[122°F-422°F].The equation used to calculate the target resistance is as follows:Target Resistance=Rrm (1+αT[Th-Trm])where:αT=Estimated thermal coefficient of resistance for the inter-connectRrm=Resistance of coupon at room temp(approximately25°C[77°F])Th=Specified temperature to be achieved.Trm=Room Temperature5.2.3.3Rejection Resistance The rejection resistance is calculated and displayed.This is adjustable from a1%to a 100%increase.If10%is selected,10%of the target resis-tance is calculated and added to the original resistance to establish the rejection criteria.5.2.3.4Current The system selects an initial current based on the ambient resistance of the coupon and the current table.The current tables are derived from software libraries on the IST equipment.During the pre-cycling sequence,the ini-tial current is adjusted for each coupon to assure the test temperature resistance is achieved in three minutes±three seconds(see paragraph5.2.3.5).NOTE:Additional equations/algorithms used by IST that establish the initial current selection for pre-cycling,relative to the relationship of coupon interconnect resistanceαT,coupon construction and stress test temperature to be achieved are considered proprietary at this time.5.2.3.5Pre-cycling is initiated by the application of the selected current to the coupon,the computer monitors and records the coupon’s performance throughout this first cycle. If at the end of the first pre-cycle,the coupon achieves the specified resistance level in three minutes±three seconds,it will be accepted for subsequent stress testing.If the resis-tance level was not achieved in this time frame,the coupon will automatically be pre-cycled again with a revised or com-pensated current.The system will re-test using revised condi-tions until all coupons are accepted or rejected for stress test-ing.NOTE:The equation/algorithms used by IST to compensate the DC current is considered proprietary at this time.5.2.3.6Forced air cooling is commenced after each pre-cycle to cool the coupons.(Requires three minutes.)5.2.3.7The system automatically records and saves all information regarding conditions for subsequent stress test-ing.5.2.4When the pre-cycle sequence is complete,the IST system begins the thermal cycling of the coupons.The IST system continuously monitors the coupons and records the relative changes in resistance of both the barrel and the inter-nal layer connections.Data is compiled for each coupon’s performance throughout IST stress testing.The system soft-ware provides a download file to graph the coupon’s perfor-mance.Data is compiled to create graphs of each coupon’s performance throughout IST stress testing.Revision Page2of35.3Microsection Evaluation-Optional If detailed failure analysis is desired to determine exact location of separations and/or cracks,then a multimeter or a thermal imaging system can aid in identifying the failure location.Microsection of failed coupons shall be performed in accordance with IPC-TM-650, Method2.1.1or2.1.1.2.6Notes6.1Stress Cycle Test Sequence6.1.2The stress test is initiated by re-applying the same DC current level established for each individual coupon during the pre-cycle operation.Three minutes of heating is followed by two to three minutes of cooling.Cooling time is a function of overall thickness and construction of the coupon.6.1.3Individual coupons are continually recycled using their customized heating and cooling conditions until one of the rejection criteria is achieved or the maximum number of cycles is completed.6.1.4The coupon’s resistance‘‘delta’’(variance from initial calculated resistance)increases(positively)as failure inception occurs.The rate of change in the delta is indicative of the mechanical change(failure)within the interconnects.6.1.5When each coupon delta reaches the maximum resis-tance rejection criteria,IST stress testing is stopped.The rejection criteria prevents thermal runaway(burnout)plus allows for early intervention for failure analysis to be completed effectively.6.2Graphing and Data Analysis6.2.1The IST system continuously monitors the two inde-pendent circuits of each coupon,recording multiple points of each cycle until the coupon exceeds one of the rejection cri-teria.The data is compiled to create graphs of each or all coupon’s performance throughout IST stress testing.Figures 2,3and4are typical graphs.6.3The Test Methods Subcommittee is aware of other test systems that operate on principles similar to those used by IST.The subcommittee encourages their submission along with relevant test data.This test method will be revised as necessary to include these test systems as this information becomes available.Figure2ResistanceDegradationinMilliohmsResistance Degradation of the PTH InterconnectBarrelCrack PropagationInnerlayer InterconnectStrain ReliefIST CyclesBarrel Crack InitiationAnnealingFatigue2626-3 Figure3BarrelPTHInnerlayer InterconnectIST CyclesResistanceDegradationinMilliohms2626-4 Figure4BarrelInnerlayer InterconnectIST CyclesResistanceDegradationinMilliohmsRevisionPage3of3。
IPC检验说明-全英文
IPC-TM-650 英语
1Scope This test is used to determine the total ionic con-tent extractable from on,and absorbed within,the surface of printed wiring boards(PWBs),for the purposes of process control.The conductivity of the extract solution is measured and the results are expressed as sodium chloride equivalence per unit area.2Applicable DocumentsIPC-TM-650Test Method2.3.25,Detection and Measure-ment of Ionizable Surface Contaminants by Resistivity of Sol-vent Extract(ROSE)3Test SpecimensThe test specimen may be any unpopulated PWB.The num-ber of specimens depends on the process control plan or product drawings/prints.4Apparatus or Material•An automated Resistivity of Solvent Extract(ROSE)tester•Conductivity dip probe with appropriate meter with tem-perature compensation•Hydrometer(0.800-0.900)for ROSE tester calibration •Thermometer for ROSE tester calibration•Clean room(non-ionic)gloves or forceps•KAPAK™plastic bags or equivalents(see6.9)•Bag sealing equipment•Water bath,capable of sustaining an80°C±2°C[176°F±3.6°F]temperature•Second water bath capable of sustaining a25°C±1°C [77°F±1.8°F]temperature•Precision solvent measurement equipment,such as class A pipettes•Volumetric glassware•Plastic ware-high density polyethylene,polymethylpentene (polypentene)or equivalent.•Extract solution:25%v/v deionized water(18MΩ-cm nomi-nal resistivity),75%v/v2-propanol(electronic or HPLC grade).No alternative solution or composition is allowed.•Sodium chloride-reagent grade•Analytical balance accurate to0.0001gramsWARNING:2-propanol is a flammable material.The2-propanol/ water mixture is also flammable.Exercise caution when using this solution.5Procedure5.1ExtractionNOTE:Throughout this procedure,do not touch the sample boards with bare e the clean room gloves specified or use clean forceps.5.1.1Calculate the surface area of the PWB using: Area(in cm2)=Length x Width x25.1.2Prepare a volume of extract solution specified in4. 5.1.3Using clean room gloves or clean forceps,place thePWB into virgin KAPAK™bags.Choose the bag size to give at least an additional2.5cm[1.0in]on each side of the board to minimize the amount of extract solution used.Allow at least an additional5cm[2.0in]above the board top.5.1.4Using a pipette or graduated cylinder,add a volume of the extract solution into the bag.The amount will depend on the area of the board surface.This usually varies from0.8 mL/cm2[5.2mL/in2]up to about3mL/cm2[19mL/in2].For example,a10cm x11.5cm[3.94in x4.53in]board would require about100mL of solution.The amount of solution should just cover the board completely when most of the air is forced out of the bag.5.1.5Force most of the air from the bag and heat seal the bag.This involves contact with a hot metal bar.Take reason-able precautions to keep extract solution from contacting the hot bar.Alternatively,the top of the bag may be folded over and clipped shut.5.1.6Place the bag(s)vertically in a water bath which has stabilized at80°C[176°F].Make sure that the boards do not float above the water line.Do not allow the water from the bath to enter the bag or for extract solution to leak out of the bag.Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC.This material is advisory onlyand its use or adaptation is entirely voluntary.IPC disclaims all liability of any kind as to the use,application,or adaptation of thisers are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.Page1of45.1.7Allow the boards to extract in this manner for a period of time of60±5minutes.5.1.8Following the extraction of 5.1.7,remove the bags from the water bath and allow the extract solution to cool for at least30minutes,with the specimen still in the bag.5.1.9Using clean tongs or forceps,remove the PWB from the bag.5.2Measurement–DIP Probe Method5.2.1Calibration of Bridge This is essential in this method because there can be no correlation between resistivity/ conductivity readings and NaCl equivalents without calibra-tion.5.2.1.1Prepare a standard NaCl solution from a weight ofdry reagent grade NaCl salt dissolved in deionized water to produce a final diluted concentration of0.06g/liter NaCl(5mL equals300µg NaCl).5.2.1.2Place1liter of the2-propanol water solution(at the calibration temperature of the bridge in use)in a plastic bea-ker.NOTE:The75%v/v2-propanol solution must be used in this calibration.Water cannot be used since it is not the test solu-tion used in the procedure.The test solution used in this cali-bration can be recleaned by passing through the DI column until the required resistivity/conductivity is obtained.5.2.1.3From a50mL burette,add to the liter of test solu-tion,5mL of the standard0.06g/liter NaCl solution.Stir and measure resistivity/conductivity.5.2.1.4From a50mL burette,add to the liter of test solu-tion,20additional mL of the standard0.06g/liter NaCl solu-tion,for a total of25mL.Stir and measure resistivity/ conductivity.5.2.1.5From a50mL burette,add to the liter of test solu-tion,25additional mL of the standard0.06g/liter NaCl solu-tion,for a total of50mL.Stir and measure resistivity/ conductivity.5.2.1.6Plot a three point nomogram of Conductivity vs. Solution Concentration(inµg/liter NaCl).See Figure1for example.You should get a linear e a best fit line obtained with a piecewise linear method.5.2.2Test Procedure-DIP ProbeNOTE:If desired,this test can be run at other temperatures; however,the calibration process must be repeated for the alternative temperature.This calibration process need only be done once,providing the conductivity cell has not been exposed to harsh chemicals which would alter the cell con-stants.If the conductivity cell is routinely used on harsh chemical solutions(e.g.,plating baths),then the calibration should be repeated before every test run.5.2.2.1Place the Kapak™bags containing the extract solu-tions into the25°C[77°F]water bath and allow the extract solutions to reach25°C[77°F].5.2.2.2Insert the conductivity probe into the Kapak™bag containing the room-temperature extract solution.It is impor-tant that the extract solution be measured at the same tem-perature used for the calibration solutions.Immerse the probe to a suitable depth.NOTE:A‘‘suitable depth’’is one which covers the cell elec-trodes,but not an immersion which covers the wiring.Many cells are marked with a scribed line which indicates the proper immersion depth.5.2.2.3Gently agitate the solution.Read the conductivity of the solution.The time between immersion of the cell and tak-ing the reading should be the same as used for the calibration curve.Sufficient time should be allowed for the reading to come to equilibrium(no change for two minutes).Figure1Nomogram of Conductivity vs.Solution ConcentrationRevision Page2of4NOTE:Between measurements,rinse the cell with deionized water and leave the cell soaking in virgin extract solution. Never use a dry cell as this is bad technique.5.2.2.4Using the linear relationship formed in 5.2.1.6, determine the concentration of sodium chloride correspond-ing to the conductivity e the equation given below to determine the total micrograms of sodium chloride equiva-lence per square centimeter(µg NaCl Eq./cm2)Using the nomogram:Conductivity of Unknown→Concentration of UnknownConcentration Volume of Extract Solution(µg/liter)x(liter)Extracted Surface Area(cm2)=µg NaCl Eq./cm25.2.2.5If the conductivity of the unknown solution is outside of the bounds represented on the existing nomogram,then continue the technique used to generate the nomogram(see 5.2.1)until the bounds contain the conductivity of the unknown solution.5.3Measurement–Static ROSE Tester Method NOTE:This section was developed using an Omegameter 600SMD with a10,000mL cell.Make appropriate changes to the procedure to accommodate other static ROSE testers. 5.3.1Perform a system verification check.5.3.2Set the instrument to an appropriate amount of sol-vent volume.A target solution level should be1.5mL for one cm2of board surface.It is not necessary to cover the sprayjets(if applicable).If the lid is on the test cell,the CO2mixing is minimized.5.3.3Enter the appropriate surface area into the instrument.5.3.4To allow for the volume of solvent that is to be added, the instrument setup volume will be set at the minimum vol-ume(e.g.,2300mL)plus the volume of solution in the extrac-tion bag(e.g.,100mL).Dwell time or run time:2minutesPass/Fail Value:NoneBegin the test and follow the test prompts.Remove the cell cover.5.3.5Carefully open the test bag and quickly pour the extract solution into the test cell.To minimize CO2absorption, the addition should be made as quickly as possible and the cell cover quickly replaced.5.3.6The instrument should very quickly reach equilibrium (10-15seconds)and then should remain essentially unchanged for the remainder of the two minute run.5.3.7Log the reading in totalµg of sodium chloride equiva-lence per cm2.5.3.8Static ROSE Calculation Example:Testing a bare board,10cm x20cm[3.9in x7.9in] Surface area is10cm x20cm x2=400cm2[62in2]Bag size should be about15cm x30cm[5.9in x12in]or largerExtract solution would be about620mLROSE volume input to4620mL(4000mL to cover sprays and620mL from extraction)ROSE tester cell volume set to4000mL.Run time-2minutes5.4Measurement–Dynamic ROSE Tester Method5.4.1Perform a system verification check.5.4.2Program the instrument with the appropriate surface area of the board.5.4.3Cycle the instrument to the beginning cleanliness point.5.4.4Carefully open the test bag and quickly pour theextract solution into the test cell.To minimize CO2absorption, the addition should be made as quickly as possible and the cell cover quickly replaced.5.4.5When the instrument completes the test,log the read-ing in totalµg of sodium chloride equivalence per cm2.6Notes6.1The background for this test method may be found in technical papers:‘‘Rationale and Methodology for a Modified Resistivity of Sol-vent Extract Test Method,’’Philip W.Wittmer,IPC1995Fall Meeting Proceedings,S13-4.RevisionPage3of4‘‘Ionic Cleanliness of LPISM Circuit Boards,’’Hank Sanftle-ben,IPC1995Fall Meeting Proceedings,S13-3.6.2IPC-HDBK-001‘‘Handbook and Guide to the Require-ments for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001’’is another source for under-standing ROSE testing in general.6.3This method may also be known as the modified-ROSE test.This test,due to its longer extraction time and higher extraction temperature,has demonstrated better correlation with the total ion determination by ion chromatography than IPC-TM-650,Test Method2.3.25,Detection and Measure-ment of Ionizable Surface Contaminants by Resistivity of Sol-vent Extract(ROSE)Method.However,as a bulk contamina-tion measurement method,it cannot distinguish individual ion species.6.4From an analytical standpoint,the dip probe method is preferred as more repeatable than the automated ROSE testers and avoids many of the test inaccuracies(e.g.,CO2 absorption from spray agitation)inherent in those instruments. It should be stressed that the dip probe method is an electro-lytic conductivity measurement and must be temperature-compensated.6.5The dip probe calibrations can be run at multiple tem-peratures and a family of curves generated,widening the test window for use with this method.Higher temperatures,how-ever,will lead to a faster2-propanol evaporation rate.The test can also be run with more dilute concentrations,prepared by series dilution.6.6Conductivity cells have a‘‘constant’’value.Measured readings must be multiplied by this constant.Exposure to harsh chemicals may alter the constant,making a re-calibration necessary.Do not allow the probe used for this procedure to contact sticky,oily,or resinous liquids(e.g.,flux).6.7This procedure is intended to be a process control aid and as such,no pass-fail criteria is stated.It is expected that the fabricator/assembler will determine,with their customer, the necessary pass-fail criteria for their product by this method.6.8This method is best suited for monitoring and control ofa previously optimized process and should not be used to generate acceptance data unless part of a larger correlation study.Values generated with this method should be corre-lated to acceptable electrical performance if used for accep-tance.6.9Kapak™500Series Bags can be obtained from: Kapak Corporation5305Parkdale DriveMinneapolis,MN55416800-527-2557A secondary source of Kapak™or Scotchpak™polyester bags or pouches can be obtained from:VWR International1310Goshen ParkwayWest Chester,PA19380Orders:1-800-932-5000Web Orders:If an alternative to the Kapak™bag or Scotchpak™is desired,the bag must have the following characteristics:•No extractable ionic material in75%2-propanol/25%DI water at80°C[176°F]for60minutes•0.01cm[0.0039in]wall thickness minimum•Heat sealable or mechanical seal6.10There is some concern regarding ROSE tester cell size. Testing a2cm x2cm[0.79in x0.79in]board in a20,000 mL cell causes such a severe dilution as to cause the signal to be lost in the noise.A recommended cell size is5000mL or less.Smaller cell volumes will allow for a more measurable result.If a smaller cell,or running with a smaller test volume, are not an option,then the number of bare boards can be increased,all extracted separately,and the extract solutions all tested at once.6.11When testing hybrids or microelectronics,be aware that2-propanol stored in glass containers can leach out materials such as sodium,borates,and silica.2-propanol stored in plastic containers does not have such a leaching problem.Revision Page4of4。
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IPC TM-650 Test Methods ManualSECTION 2.1 - VISUAL TEST METHODS2.1.1D Microsectioning - 3/982.1.1.1 Microsectioning, Ceramic Substrate - 12/872.1.1.2 Microsectioning - Semi or Automatic Technique Micro-section Equipment(Alternate) - 7/932.1.2A Pinhole Evaluation, Dye Penetration Method - 3/762.1.3A Plated-Through Hole Structure Evaluation - 8/762.1.5A Surface Examination, Unclad and Metal Clad Material - 12/822.1.6B Thickness of Glass Fabric - 12/942.1.6.1 Weight of Fabric Reinforcements - 12/942.1.7C Thread Count of Glass Fabric - 12/942.1.7.1 Thread Count, Organic Fibers - 12/872.1.8B Workmanship - 12/942.1.9 Surface Scratch Examination Metal Clad Foil - 5/862.1.10A Visual Inspection for Undissolved Dicyandiamide - 12/942.1.13A Inspection for Inclusions and Voids in Flexible Printed WiringMaterials - 5/98SECTION 2.2 - DIMENSIONAL TEST METHODS2.2.1A Mechanical Dimensional Verification - 8/972.2.2B Optical Dimensional Verification - 8/972.2.4C Dimensional Stability, Flexible Dielectric Materials - 5/982.2.5A Dimensional Inspections Using Mircosections - 8/972.2.6A Hole Size Measurement, Drilled - 8/972.2.7A Hole Size Measurement, Plated - 5/862.2.8 Location of Holes - 4/732.2.10A Hole Location and Conductor Location - 12/832.2.12A Thickness of Copper by Weight- 3/762.2.12.1 Overall Thickness and Profile Factor of Copper Foils Treated andUntreated - 9/872.2.12.2 Weight and Thickness of Copper Foils with Releasable Carriers - 7/89 2.2.12.3 Weight and Thickness Determination of Copper Foils With EtchableCarriers - 7/892.2.13.1A Thickness, Plating in Holes, Microhm Method - 1/832.2.14 Solder Powder Particle Size Distribution - Screen Method for Types 1-4- 1/952.2.14.1 Solder Powder Particle Size Distribution - Measuring MicroscopeMethod - 1/952.2.14.2 Solder Powder Particle Size Distribution - Optical Image AnalyzerMethod--1/952.2.14.3 Determination of Maximum Solder Powder Particle Size - 1/952.2.15 Cable Dimensions (Flat Cable) - 6/792.2.16 Artwork Master Evaluation by Use of a Drilled Panel - 12/872.2.16.1 Artwork Master Evaluation by Overlay - 12/872.2.17 Surface Roughness and Profile of Metallic Foils (Contacting StylusTechnique)- 3/902.2.18 Determination of Thickness of Laminates by Mechanical Measurement -12/942.2.18.1 Determination of Thickness of Metallic Clad Laminates,Cross-sectional - 12/942.2.19 Measuring Hole Pattern Location-12/872.2.19.1 Length, Width and Perpendicularity of Laminate and Prepreg Panels- 12/942.2.20 Solder Paste Metal Content by Weight - 1/952.2.21 Planarity of Dielectrics for High Density Interconnection (HDI)Microvia Technology - 11-98SECTION 2.3 - CHEMICAL TEST METHODS2.3.1 Chemical Processing, Suitable Processing Material- 4/732.3.1.1B Chemical Cleaning of Metal Clad Laminates- 5/862.3.2F Chemical Resistance Of Flexible Printed Wiring Materials - 5/982.3.3A Chemical Resistance of Insulating Materials- 2/782.3.4B Chemical Resistance, Marking Paints and Inks - 8/972.3.4.2A Chemical Resistance of Laminates, Prepreg and Coated Foil Products,by Solvent Exposure - 12/942.3.4.3 Chemical Resistance of Core Materials to Methylene Chloride- 5/86 2.3.5B Density, Insulating Material - 8/972.3.6A Etching, Ammonium Persulfate Method - 7/752.3.7A Etching, Ferric Chloride Method - 7/752.3.7.1A Cupric Chloride Etching Method - 12/942.3.7.2A Alkaline Etching Method - 12/942.3.8A Flammability, Flexible Insulating Materials- 12/822.3.8.1 Flammability of Flexible Printed Wiring- 12/882.3.9D Flammability of Prepreg and Thin Laminate - 8/972.3.10B Flammability of Laminate - 12/942.3.10.1 Flammability of Soldermask on Printed Wiring Laminate- 8/982.3.11 Glass Fabric Construction- 4/732.3.13 Determination of Acid Value of Liquid Solder Flux- Potentiometric andVisual Titration Methods- 1/952.3.14 Print, Etch, and Plate Test- 4/732.3.15C Purity, Copper Foil or Plating - 8/972.3.16B Resin Content of Prepreg, by Burn-off - 12/942.3.16.1C Resin Content of Prepeg, by Treated Weight--12/942.3.16.2 Treated Weight of Prepreg - 12/942.3.17D Resin Flow Percent of Prepreg - 8/972.3.17.1B Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films- 5/982.3.17.2B Resin Flow of "No Flow" Prepreg - 8/972.3.18A Gel Time, Prepreg Materials - 4/862.3.19C Volatile Content of Prepreg - 12/942.3.21 Plating Quality, Hull Cell Method - 8/972.3.22 Copper Protective Coating Quality - 2-782.3.23B Cure (Permanency) Thermally Cured Solder Mask - 2/882.3.23.1A Cure (Permanency) UV Initiated Dry Film Solder Mask - 2/882.3.24 Porosity of Gold Plating- 2/782.3.24.1 Porosity Testing of Gold Electrodeposited on a Nickel Plated CopperSubstrate Electrographic Method - 10/852.3.24.2A Porosity of Metallic Coatings on Copper-Based Alloys and Nickel(Nitric Acid Vapor Test) - 8/972.3.25B Detection and Measurement of Ionizable Surface Contaminants -8/97---Supersedes 2.3.26 and 2.3.26.12.3.26A Superseded by Test Method 2.3.252.3.26.1 Superseded by Test Method 2.3.252.3.26.2 Mobile Ion Content of Polymer Films - 7/952.3.27 Cleanliness Test - Residual Rosin - 1/952.3.27.1 Rosin Flux Residue Analysis-HPLC Method - 1/952.3.28 Ionic Analysis of Circuit Boards, Ion Chromatography Method - 1/95 2.3.29 Flammability, Flexible Flat Cable- 11/882.3.30A Solvent pH Determination in Anhydrous Flourocarbon Solvents- 11/81 2.3.31 Relative Degree of Cure of U.V. Curable Material - 2/882.3.32C Flux Induced Corrosion (Copper Mirror Method)- 1/952.3.33C Presence of Halides in Flux, Silver Chromate Method - 1/952.3.34B Solids Content, Flux - 1/952.3.34.1B Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder -1/952.3.35B Halide Content, Quantitative (Chloride and Bromide)- 1/952.3.35.1 Fluorides by Spot Test, Fluxes - Qualitative - 1/952.3.35.2 Flouride Concentration, Fluxes - Quantitative--1/952.3.36 Acid Acceptance of Chlorinated Solvents- 10/852.3.37B Volatile Content of Adhesive Coated Dielectric Films - 5/982.3.38B Surface Organic Contaminant Detection Test - 8/972.3.39B Surface Organic Contaminant Identification Test (Infrared AnalyticalMethod) - 8/972.3.40 Thermal Stability - 7/95SECTION 2.4 - MECHANICAL TEST METHODS2.4.1D Adhesion, Tape Testing--8/972.4.1.1B Adhesion, Marking Paints and Inks--11/882.4.1.2 Adhesion of Conductors on Hybrid Substrates--12/872.4.1.3 Adhesion, Resistors (Hybrid Circuits)--12/872.4.1.4 Adhesion, Overglaze (Hybrid Circuits)--12/872.4.1.5A Determination of Heat Transfer--5/952.4.1.6 Adhesion, Polymer Coating--7/952.4.2A Ductility of Copper Foil--3/762.4.2.1D Flexural Fatigue and Ductility, Foil--3/912.4.3D Flexural Fatigue, Flexible Printed Wiring Materials--5/982.4.3.1C Flexural Fatigue and Ductility, Flexible Printed Wiring--3/912.4.3.2C Flexural Fatigue and Ductility, Flexible Metal-CladDielectrics--3/912.4.4B Flexural Strength of Laminates (at Ambient Temperature)--12/942.4.4.1A Flexural Strength of Laminates (at Elevated Temperature)--12/94 2.4.5 Folding Endurance, Flexible Printed Wiring Materials--4/732.4.6 Hot Oil--4/732.4.7A Machinability, Printed Wiring Materials--7/752.4.8C Peel Strength of Metallic Clad Laminates--12/942.4.8.1 Peel Strength, Metal Foil (Keyhole Method for Thin Laminates)--1/86 2.4.8.2A Peel Strength of Metallic Clad Laminates at Elevated Temperature(Hot Fluid Method)--12/942.4.8.3A Peel Strength of Metallic Clad Laminates at Elevated Temperature(Hot Air Method)--12/942.4.8.4 Carrier Release, Thin Copper--1/902.4.9D Peel Strength, Flexible Dielectric Materials--10/882.4.9.1 Peel Strength of Flexible Circuits - 11/982.4.9.2 Bonding Process - 11/982.4.10 Plating Adhesion--4/732.4.11 Shear Strength Flexible Dielectric Materials--4/732.4.12A Solderability, Edge Dip Method--6/912.4.13F Solder Float Resistance Flexible Printed Wiring Materials--5/982.4.13.1 Thermal Stress of Laminates--12/942.4.14 Solderability of Metallic Surfaces--4/732.4.14.1 Solderability, Wave Solder Method--3/792.4.14.2 Liquid Flux Activity, Wetting Balance Method--1/952.4.15A Surface Finish, Metal Foil--3/762.4.16A Initiation Tear Strength, Flexible Insulating Materials--12/822.4.17 Tear Strength, Propagation--4/732.4.17.1A Propagation, Tear Strength, Flexible Insulating Materials--12/82 2.4.18B Tensile Strength and Elongation, Copper Foil--8/802.4.18.1 Tensile Strength and Elongation, In-House Plating--8/972.4.18.2 Hot Rupture Strength, Foil--7/892.4.18.3 Tensile Strength, Elongation, and Modulus--7/952.4.19C Tensile Strength and Elongation, Flexible Printed WiringMaterials--5/982.4.20 Terminal Bond Strength, Flexible Printed Wiring--4/732.4.21D Land Bond Strength, Unsupported Component Hole--8/972.4.21.1C Bond Strength, Surface Mount Lands Perpendicular Pull Method--5/91 2.4.22C Bow and Twist (Percentage)--6/992.4.22.1C Bow and Twist-Laminate--5/932.4.22.2 Substrate Curvature: Silicon Wafers with DepositedDielectrics--7/952.4.23 Soldering Resistance of Laminate Materials--3/792.4.24C Glass Transition Temperature and Z-Axis Thermal Expansion byTMA--12/942.4.24.1 Time to Delamination (TMA Method)--12/942.4.24.2 Glass Transition Temperature of Organic Films - DMA Method--7/95 2.4.24.3 Glass Transition Temperature of Organic Films - TMA Method--7/95 2.4.24.4 Glass Transition and Modulus of Materials Used in High DensityInterconnection (HDI) and Microvias -DMA Method - 11/982.4.24.5 Glass Transition Temperature and Thermal Expansion of MaterialsUsed In High Density Interconnection (HDI) and Microvias -TMA Method-11/982.4.25C Glass Transition Temperature and Cure Factor by DSC--12/942.4.26 Tape Test for Additive Printed Boards--3/792.4.27.1B Abrasion (Taber Method), Solder Mask and Conformal Coating--1/95 2.4.27.2A Solder Mask Abrasion (Pencil Method)--2/882.4.28B Adhesion, Solder Mask (Non-Melting Metals)--8/972.4.28.1C Adhesion, Solder Resist (Mask), Tape Test Method--3/982.4.29B Adhesion, Solder Mask, Flexible Circuit--2/882.4.30 Impact Resistance, Polymer Film--10/862.4.31A Folding, Flexible Flat Cable--4/862.4.32A Fold Temperature Testing, Flexible Flat Cable--4/862.4.33C Flexural Fatigue and Ductility, Flat Cable--3/912.4.34 Solder Paste Viscosity - T-Bar Spin Spindle Method (applicable for300,000 to 1,600,000 Centipose)--1/952.4.34.1 Solder Paste Viscosity - T-Bar Spindle Method (Applicable at LessThan 300,000 Centipose)--1/952.4.34.2 Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000to 1,600,000 Centipose)--1/952.4.34.3 Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than300,000 Centipose)--1/952.4.34.4 Paste Flux Viscosity - T-Bar Spindle Method--1/952.4.35 Solder Paste - Slump Test--1/952.4.36B Rework Simulation, Plated-Through Holes for Leaded Components--8/97 2.4.37A Evaluation of Hand Soldering Tools for Terminal Connections--7/912.4.37.1A Evaluation of Hand Soldering Tools for Printed Wiring BoardApplications--7/912.4.37.2 Evaluation of Hand Soldering Tools on Heavy Thermal Loads--7/93 2.4.38A Prepeg Scaled Flow Testing--6/912.4.39A Dimensional Stability, Glass Reinforced Thin Laminates--2/862.4.40 Inner Layer Bond Strength of Multilayer Printed Circuit Boards--10/87 2.4.41 Coefficient of Lintear Thermal Expansion of Electrical InsulatingBoards--3/862.4.41.1A Coefficient of Thermal Expansion by the Vitreous Silica (Quartz)Dilatometer Method--8/972.4.41.2 Coefficient of Thermal Expansion - Strain Gage Method--8/972.4.41.3 In-Plane Coefficient of Thermal Expansion, Organic Films--7/95 2.4.41.4 Volumetric Thermal Expansion Polymer Coatings on InorganicSubstrates--7/952.4.42 Torsional Strength of Chip Adhesives--2/882.4.42.1 High Tempreature Mechanical Strength Retention of Adhesives--3/88 2.4.42.2 Die Shear Strength--2/982.4.42.3 Wire Bond Pull Strength--2/982.4.43 Solder Paste - Solder Ball Test--1/952.4.44 Solder Paste - Tack Test--3/982.4.45 Solder Paste - Wetting Test--1/952.4.46 Spread Test, Liquid or Extracted Solder Flux, Solder Paste andExtracted Cored Wires or Preforms--1/952.4.47 Flux Residue Dryness--1/952.4.48 Spitting of Flux-Cored Wire Solder--1/952.4.49 Solder Pool Test--1/952.4.50 Thermal Conductivity, Polymer Films--7/952.4.51 Self Shimming Thermally Conductive Adhesives--1/95SECTION 2.5 - ELECTRICAL TEST METHODS2.5.1B Arc Resistance of Printed Wiring Materials--5/862.5.2A Capacitance of Insulating Materials--7/752.5.3B Current Breakdown, Plated Through Holes--8/972.5.4 Current Carrying Capacity, Multilayer Printed Wring--4/732.5.4.1A Conductor Temperature Rise Due to Current Changes inConductors--8/972.5.5A Dielectric Constant of Printed Wiring Materials--7/752.5.5.1B Permittivity (Dielectric Constant) and Loss Tangent (DissipationFactor) of Insulating Material at 100MHz (Contacting ElectrodeSystems)--5/862.5.5.2A Dielectric Constant and Dissipation Factor of Printed Wiring BoardMaterial--Clip Method--12/872.5.5.3C Permittivity (Dielectric Constant) and Loss Tangent (DissipationFactor) of Materials (Two Fluid Cell Method)--12/872.5.5.4 Dielectric Constant and Dissipation Factor of Printed Wiring BoardMaterial--Micrometer Method--10/852.5.5.5C Stripline Test for Permittivity and Loss Tangent (DielectricConstant and Dissipation Factor) at X-Band--3/982.5.5.5.1 Stripline Test for Complex Relative Permittivity of Circuit BoardMaterials to 14 GHZ--3/982.5.5.6 Non-Destructive Full Sheet Resonance Test for Permittivity of CladLaminates--5/892.5.5.7 Characteristic Impedance and Time Delay of Lines on Printed Boards byTDR--11/922.5.5.8 Low Frequency Dielectric Constant and Loss Tangent, PolymerFilms--7/952.5.5.9 Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz--11/98 2.5.6B Dielectric Breakdown of Rigid Printed Wiring Material--5/862.5.6.1A Dielectric Strength, Polymer Solder Mask and/or ConformalCoatings--2/882.5.6.2A Electric Strength of Printed Wiring Material--8/972.5.6.3 Dielectric Breakdown Voltage and Dielectric Strength--10/862.5.7C Dielectric Withstanding Voltage, PWB--8/972.5.8A Dissipation Factor of Flexible Printed Wiring Material--7/752.5.10A Insulation Resistance, Multilayer Printed Wiring (BetweenLayers)--12/872.5.10.1 Insulation Resistivity for Adhesive Interconnection Bonds--11/98 2.5.11 Insulation Resistance, Multilayer Printed Wiring (Within aLayer)--4/732.5.12 Interconnection Resistance, Multilayer Printed Wiring--4/732.5.13A Resistance of Copper Foil--3/762.5.14A Resistivity of Copper Foil--8/762.5.15A Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable--10/86 2.5.16A Shorts, Internal on Multilayer Printed Wiring--11/882.5.17E Volume Resistivity and Surface Resistance of Printed WiringMaterials--5/982.5.17.1A Volume and Surface Resistivity of Dielectric Materials--12/942.5.17.2 Volume Resistivity of Conductive Resistance Used in High DentistyInterconnection (HDI) and Microvias, Two-Wire Method--11/982.5.18B Characteristic Impedance Flat Cables (Unbalanced)--7/842.5.19A Propagation Delay of Flat Cables Using Time Domain Reflectometer--7/84 2.5.19.1A Propagation Delay of Flat Cables Using Time Domain Reflectometer(TDR)--7/842.5.21A Digital Unbalanced Crosstalk, Flat Cable--3/842.5.24 Conductor Resistance, Flexible Flat Cable--6/792.5.25A Dielectric Withstand Voltage Flexible Fat Cable--11/852.5.26A Insulation Resistance Flexible Flat Cable--11/852.5.27 Surface Insulation Resistance of Raw Printed Wiring BoardMaterial--3/792.5.28AQ Resonance, Flexible Printed Wiring Materials--4/882.5.30 Balanced and Unbalanced Cable Attenuation Measurements--12/872.5.31 Current Leakage (Through Overglaze Films)--12/872.5.32 Resistance Test, Plated Through-Holes--12/872.5.33 Measurement of Electrical Overstress from Soldering Hand Tools--11/98 2.5.33.1 Measurement of Electrical Overstress from Soldering Hand Tools(Ground Measurements)--11/982.5.33.2 Measurement of Electrical Overstress from Soldering Hand Tools(Transient Measurements)--11/982.5.33.3 Measurement of Electrical Overstress from Soldering Hand Tools(Current Leakage Measurements)--11/982.5.33.4 Measurement of Electrical Overstress from Soldering Hand Tools(Shielded Enclosure)--11/98SECTION 2.6 - ENVIRONMENTAL TEST METHODS2.6.1E Fungus Resistance Printed Wiring Materials--8/972.6.2C Water Absorption, Flexible Printed Wiring--5/982.6.2.1A Water Absorption, Metal Clad Plastic Laminates--5/862.6.3E Moisture and Insulation Resistance, Printed Boards--8/972.6.3.1C Moisture and Insulation Resistance-Polymeric Solder Masks andConformal Coatings--11/982.6.3.2B Moisture and Insulation Resistance, Flexible Base Dielectric--5/88 2.6.3.3A Surface Insulation Resistance, Fluxes--1/952.6.4A Outgassing, Printed Boards--8/972.6.5C Physical Shock, Multilayer Printed Wiring--8/972.6.6B Temperature Cycling, Printed Wiring Board--12/872.6.7A Thermal Shock and Continuity, Printed Board--8/972.6.7.1 Thermal Shock--Polymer Solder Mask Coatings--2/882.6.7.2A Thermal Shock, Continuity and Microsection, Printed Board--8/97 2.6.8D Thermal Stress, Plated Through-Holes--3/982.6.8.1 Thermal Stress, Laminate--9/912.6.9A Vibration, Rigid Printed Wiring--8/972.6.9.1 Test to Determine Sensitivity of Electronic Assemblies to UltrasonicEnergy--1/952.6.9.2 Test to Determine Sensitivity of Electronic Components to UltrasonicEnergy--1/952.6.10A X-Ray (Radiography), Multilayer Printed Wiring Board TestMethods--8/972.6.11B Hydrolytic Stability Solder Mask and/or Conformal Coating--11/88 2.6.12 Temperature Testing, Flexible Flat Cable--6/792.6.13 Assessment of Susceptibility to Metallic Dendritic Growth: UncoatedPrinted Wiring--10/852.6.14A Resistance to Electrochemical Migration, Polymer Solder Mask--8/87 2.6.15B Corrosion, Flux--1/952.6.16 Pressure Vessel Method for Glass Epoxy Laminate Integrity--7/852.6.16.1 Moisture Resistance of HDIS Under High Temperature and Pressure(Pressure Vessel)--8/982.6.17 Hydrolitic Stability, Flexible Printed Wiring Material--12/822.6.18A Low Temperature Flexibility, Flexible Printed Wiring Materials--7/85 2.6.19 Environmental and Insulation Resistance Test of Hybrid CeramicMultilayer Substrate Boards--12/872.6.20A Assessment of Plastic Encapsulated Electronic Components forSusceptibility to Moisture/Reflow Induced Damage--1/952.6.21 Service Temperature of Flexible Printed Wiring--12/882.6.22 Superseded by J-STD-035 (.pdf file)2.6.23 Test Procedure for Steam Ager Temperature Repeatability--7/932.6.24 Junction Stability Under Environmental Conditions。