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微斯米微波式芯片公司2014年产品说明书

1FeaturesInputs/Outputs •Accepts differential or single-ended input •LVPECL, LVDS, CML, HCSL, LVCMOS •On-chip input termination resistors and biasing for AC coupled inputs•Six precision LVPECL outputs •Operating frequency up to 750 MHzPower •Options for 2.5 V or 3.3 V power supply •Core current consumption of 110 mA•On-chip Low Drop Out (LDO) Regulator for superior power supply rejectionPerformance •Ultra low additive jitter of 36 fs RMSApplications•General purpose clock distribution •Low jitter clock trees •Logic translation•Clock and data signal restoration•Wired communications: OTN, SONET/SDH, GE,10 GE, FC and 10G FC•PCI Express generation 1/2/3 clock distribution •Wireless communications•High performance microprocessor clock distributionApril 2014Figure 1 - Functional Block DiagramZL40205Precision 1:6 LVPECL Fanout Bufferwith On-Chip Input TerminationData SheetOrdering InformationZL40205LDG1 32 Pin QFN TraysZL40205LDF132 Pin QFNTape and ReelMatte TinPackage Size: 5 x 5 mm-40o C to +85o CTable of ContentsFeatures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Inputs/Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Change Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41.0 Package Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52.0 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63.0 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73.1 Clock Inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73.2 Clock Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .123.3 Device Additive Jitter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .153.4 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163.4.1 Sensitivity to power supply noise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163.4.2 Power supply filtering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163.4.3 PCB layout considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .164.0 AC and DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .175.0 Performance Characterization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .206.0 Typical Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .217.0 Package Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .238.0 Mechanical Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24List of FiguresFigure 1 - Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Figure 2 - Pin Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 3 - Simplified Diagram of Input Stage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 4 - Clock Input - LVPECL - DC Coupled. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 5 - Clock Input - LVPECL - AC Coupled. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 6 - Clock Input - LVDS - DC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 7 - Clock Input - LVDS - AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 8 - Clock Input - CML- AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 9 - Clock Input - HCSL- AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 10 - Clock Input - AC-coupled Single-Ended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 11 - Clock Input - DC-coupled 3.3V CMOS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 12 - Simplified Output Driver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 13 - LVPECL Basic Output Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 14 - LVPECL Parallel Output Termination. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 15 - LVPECL Parallel Thevenin-Equivalent Output Termination. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 16 - LVPECL AC Output Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 17 - LVPECL AC Output Termination for CML Inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 18 - Additive Jitter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 19 - Decoupling Connections for Power Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 20 - Differential and Single-Ended Output Voltages Parameter Definitions . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 21 - Input To Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Change SummaryPage Item Change1Applications Added PCI Express clock distribution.6Pin Description Added exposed pad to Pin Description.8Figure 4 and Figure 5Removed 22 ohm series resistors from Figure 4 and 5. These resistor are not required; however there is no impact to performance if the resistors are included.16Power supply filtering 18Figure 20Clarification of V ID and V OD .Below are the changes from the February 2013 issue to the April 2014 issue:Page Item Change8Figure 4Changed text to indicate the circuit is not recommended for VDD_driver=2.5V.Below are the changes from the November 2012 issue to the February 2013 issue:Corrected typo of 0.3 Ohm to 0.15 Ohm.1.0 Package DescriptionThe device is packaged in a 32 pin QFNFigure 2 - Pin Connections2.0 Pin DescriptionPin # Name Description3, 6clk_p, clk_n,Differential Input (Analog Input). Differential (or single ended) input signals.For all input configurations see “Clock Inputs” on page 728, 27, 26, 25, 24, 23, 18, 17, 16, 15, 14, 13out0_p, out0_nout1_p, out1_nout2_p, out2_nout3_p, out3_nout4_p, out4_nout5_p, out5_nDifferential Output (Analog Output). Differential outputs.9, 19,22, 32vdd Positive Supply Voltage. 2.5 V DC or 3.3 V DC nominal.1, 8vdd_core Positive Supply Voltage. 2.5 V DC or 3.3 V DC nominal.2, 7,20, 21gnd Ground. 0 V.4vt On-Chip Input Termination Node (Analog). Center tap between internal 50 Ohmtermination resistors.The use of this pin is detailed in section 3.1, “Clock Inputs“, for various input signal types.5ctrl Digital Control for On-Chip Input Termination (Input). Selects differential input mode;0: DC coupled LVPECL or LVDS modes1: AC coupled differential modesThis pin are internally pulled down to GND. The use of this pin is detailed in section 3.1,“Clock Inputs“, for various input signal types.10, 11,12, 29,30, 31NC No Connection. Leave unconnected.Exposed Pad Device GND.3.0 Functional DescriptionThe ZL40205 is an LVPECL clock fan out buffer with six output clock drivers capable of operating at frequencies up to 750MHz.The ZL40205 provides an internal input termination network for DC and AC coupled inputs; optional input biasing for AC coupled inputs is also provided. The ZL40205 can accept DC or AC coupled LVPECL and LVDS input signals, AC coupled CML or HCSL input signals, and single ended signals. A pin compatible device with external termination is also available.The ZL40205 is designed to fan out low-jitter reference clocks for wired or optical communications applications while adding minimal jitter to the clock signal. An internal linear power supply regulator and bulk capacitors minimize additive jitter due to power supply noise. The device operates from 2.5V+/-5% or 3.3V+/-5% supply. Its operation is guaranteed over the industrial temperature range -40°C to +85°C.The device block diagram is shown in Figure 1; its operation is described in the following sections.3.1 Clock InputsThe device has a differential input equipped with two on-chip 50 Ohm termination resistors arranged in series with a center tap. The input can accept many differential and single-ended signals with AC or DC coupling as appropriate. A control pin is available to enable internal biasing for AC coupled inputs. A block diagram of the input stage is in Figure 3.Receiverclk_n 50clk_pVt 50BiasctrlFigure 3 - Simplified Diagram of Input StageThis following figures give the components values and configuration for the various circuits compatible with the input stage and the use of the Vt and ctrl pins in each case.In the following diagrams where the ctrl pin is logically one and the Vt pin is not connected, the Vt pin can be instead connected to VDD with a capacitor. A capacitor can also help in Figure 4 between Vt and VDD. This capacitor will minimize the noise at the point between the two internal termination resistors and improve the overall performance of the device.Figure 4 - Clock Input - LVPECL - DC CoupledFigure 5 - Clock Input - LVPECL - AC CoupledFigure 6 - Clock Input - LVDS - DC CoupledFigure 7 - Clock Input - LVDS - AC CoupledFigure 8 - Clock Input - CML- AC CoupledFigure 9 - Clock Input - HCSL- AC CoupledFigure 10 - Clock Input - AC-coupled Single-EndedFigure 11 - Clock Input - DC-coupled 3.3V CMOS3.2 Clock OutputsLVPECL has a very low output impedance and a differential signal swing between 1V and 1.6 V. A simplified diagram for the output stage is shown in Figure 12.The LVPECL to LVDS output termination is not shown since there is a different device with the same inputs and LVDS outputs.out_pout_nFigure 12 - Simplified Output DriverThe methods to terminate the ZL40205 LVPECL drivers are shown in the following figures.Figure 15 - LVPECL Parallel Thevenin-Equivalent Output TerminationFigure 16 - LVPECL AC Output TerminationFigure 17 - LVPECL AC Output Termination for CML Inputs3.3 Device Additive JitterThe ZL40205 clock fanout buffer is not intended to filter clock jitter. The jitter performance of this type of device is characterized by its additive jitter. Additive jitter is the jitter the device would add to a hypothetical jitter-free clock as it passes through the device. The additive jitter of the ZL40205 is random and as such it is not correlated to the jitter of the input clock signal.The square of the resultant random RMS jitter at the output of the ZL40205 is equal to the sum of the squares of the various random RMS jitter sources including: input clock jitter; additive jitter of the buffer; and additive random jitter due to power supply noise. There may be additional deterministic jitter sources, but they are not shown in Figure 18.Figure 18 - Additive Jitter3.4 Power SupplyThis device operates employing either a 2.5V supply or 3.3V supply.3.4.1 Sensitivity to power supply noisePower supply noise from sources such as switching power supplies and high-power digital components such as FPGAs can induce additive jitter on clock buffer outputs. The ZL40205 is equipped with a low drop out (LDO) regulator and on-chip bulk capacitors to minimize additive jitter due to power supply noise. The on-chip regulation, recommended power supply filtering, and good PCB layout all work together to minimize the additive jitter from power supply noise.3.4.2 Power supply filteringJitter levels may increase when noise is present on the power pins. For optimal jitter performance, the device should be isolated from the power planes connected to its power supply pins as shown in Figure 19. •10 µF capacitors should be size 0603 or size 0805 X5R or X7R ceramic, 6.3 V minimum rating •0.1 µF capacitors should be size 0402 X5R ceramic, 6.3 V minimum rating •Capacitors should be placed next to the connected device power pins •A 0.15 Ohm resistor is recommended3.4.3 PCB layout considerationsThe power nets in Figure 19 can be implemented either as a plane island or routed power topology without changing the overall jitter performance of the device.ZL402051891922320.1 µF 0.1 µFvdd_core10 µF 0.1 µF0.15 Ωvdd0.1 µF 10 µFFigure 19 - Decoupling Connections for Power PinsAbsolute Maximum Ratings*Parameter Sym.Min.Max.Units 1Supply voltage V DD_R-0.5 4.6V 2Voltage on any digital pin V PIN-0.5VDD V 4LVPECL output current I out30mA 5Soldering temperature T260 °C 6Storage temperature T ST-55125 °C 7Junction temperature T j125 °C 8Voltage on input pin V input VDD V 9Input capacitance each pin C p500fF 4.0 AC and DC Electrical Characteristics* Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied.* Voltages are with respect to ground (GND) unless otherwise statedRecommended Operating Conditions*Characteristics Sym.Min.Typ.Max.Units1Supply voltage 2.5 V mode V DD25 2.375 2.5 2.625V2Supply voltage 3.3 V mode V DD33 3.135 3.3 3.465V3Operating temperature T A-402585°C* Voltages are with respect to ground (GND) unless otherwise statedDC Electrical Characteristics - Current ConsumptionCharacteristics Sym.Min.Typ.Max.Units Notes 1Supply current LVPECL drivers -unloadedI dd_unload110mA Unloaded2Supply current LVPECL drivers - loaded (all outputs are active)I dd_load209mA Including powerto R L = 50DC Electrical Characteristics - Inputs and Outputs - for 3.3 V SupplyCharacteristics Sym.Min.Typ.Max.Units Notes1CMOS control logic high-level inputvoltageV CIH0.7*V DD V2CMOS control logic low-level inputvoltageV CIL0.3*V DD V3CMOS control logic Input leakagecurrentI IL1µA V I = V DD or 0 V4Differential input common modevoltageV CM 1.1 2.0V5Differential input voltage difference V ID0.251V6Differential input resistance V IR80100120ohm* This parameter was measured from 125 MHz to 750 MHz.* This parameter was measured from 125 MHz to 750 MHz.Figure 20 - Differential and Single-Ended Output Voltages Parameter Definitions7LVPECL output high voltage V OH V DD -1.40V 8LVPECL output low voltage V OL V DD - 1.62V 9LVPECL output differential voltage*V OD0.50.9VDC Electrical Characteristics - Inputs and Outputs - for 2.5 V SupplyCharacteristicsSym.Min.Typ.Max.Units Notes1Differential input common mode voltageV CM 1.1 1.6V 2Differential input voltage difference V ID 0.251V 3Differential input resistance V IR 80100120ohm 4LVPECL output high voltage V OH V DD -1.40V 5LVPECL output low voltage V OL V DD - 1.62V 6LVPECL output differential voltage*V OD0.40.9VDC Electrical Characteristics - Inputs and Outputs - for 3.3 V SupplyCharacteristicsSym.Min.Typ.Max.Units NotesAC Electrical Characteristics* - Inputs and Outputs (see Figure 21) - for 2.5/3.3 V supply.Characteristics Sym.Min.Typ.Max.Units Notes 1Maximum Operating Frequency1/t p750MHz2Input to output clock propagation delay t pd012ns3Output to output skew t out2out50100ps4Part to part output skew t part2part80300ps5Output clock Duty Cycle degradation t PWH/ t PWL-202Percent6LVPECL Output clock slew rate r SL0.75 1.2V/ns* Supply voltage and operating temperature are as per Recommended Operating ConditionsInputt Pt PWL t pdt PWHOutputFigure 21 - Input To Output TimingAdditive Jitter at 2.5 V*Output Frequency (MHz)Jitter MeasurementFilterTypical RMS (fs)Notes112512 kHz - 20 MHz 1392212.512 kHz - 20 MHz 1093311.0412 kHz - 20 MHz 85442512 kHz - 20 MHz 57550012 kHz - 20 MHz 506622.0812 kHz - 20 MHz 40775012 kHz - 20 MHz36Additive Jitter at 3.3 V*Output Frequency (MHz)Jitter MeasurementFilterTypical RMS (fs)Notes112512 kHz - 20 MHz 1152212.512 kHz - 20 MHz 853311.0412 kHz - 20 MHz 72442512 kHz - 20 MHz 55550012 kHz - 20 MHz 486622.0812 kHz - 20 MHz 41775012 kHz - 20 MHz395.0 Performance Characterization*The values in this table were taken with an approximate slew rate of 0.8 V/ns.*The values in this table were taken with an approximate slew rate of 0.8 V/ns.Additive Jitter from a Power Supply Tone*Carrier frequencyParameterTypicalUnitsNotes125MHz 25 mV at 100 kHz 115fs RMS 750MHz25 mV at 100 kHz59fs RMS* The values in this table are the additive periodic jitter caused by an interfering tone typically caused by a switching power supply. For this test, measurements were taken over the full temperature and voltage range for V DD = 2.5 V. The magnitude of the interfering tone is measured at the DUT.6.0 Typical BehaviorTypical Phase Noise at 622.08 MHzTypical Waveformat 155.52 MHzV OD versus FrequencyPropagation Delay versus TemperatureNote:This is for a single device. For more details see thePower Supply Tone Frequency (at 25 mV) versus PSRR at 125 MHz Power Supply Tone Frequency (at 25 mV) versus Additive Jitter at 125 MHzPower Supply Tone Magnitude (at 100 kHz) versus PSRR at 125 MHz Power Supply Tone Magnitude (at 100 kHz) versus Additive Jitter at 125 MHz7.0 Package CharacteristicsThermal DataParameter Symbol Test Condition Value UnitJunction to Ambient Thermal Resistance ΘJA Still Air1 m/s2 m/s 37.433.131.5o C/WJunction to Case Thermal Resistance ΘJC24.4o C/W Junction to Board Thermal Resistance ΘJB19.5o C/W Maximum Junction Temperature*T jmax125o C Maximum Ambient Temperature T A85o C© 2014 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners.Microsemi Corporation (NASDAQ: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense and security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif. and has approximately 3,400 employees globally. Learn more at .Microsemi Corporate Headquarters One One Enterprise, Aliso Viejo CA 92656 USA Within the USA: +1 (800) 713-4113Outside the USA: +1 (949) 380-6100Sales: +1 (949) 380-6136Fax: +1 (949) 215-4996E-mail: ***************************Information relating to products and services furnished herein by Microsemi Corporation or its subsidiaries (collectively “Microsemi”) is believed to be reliable. However, Microsemi assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Microsemi or licensed from third parties by Microsemi, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Microsemi, or non-Microsemi furnished goods or services may infringe patents or other intellectual property rights owned by Microsemi.This publication is issued to provide information only and (unless agreed by Microsemi in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Microsemi without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical and other products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Microsemi’s conditions of sale which are available on request.For more information about all Microsemi productsvisit our website at TECHNICAL DOCUMENTATION – NOT FOR RESALE。

努力电子EA-AMP-HYB-2D系列双通道电竞扬声器Amplifier快速启动指南说明书

page | 2INTRODUCTIONThank you for purchasing an Episode® amplifier. To get started, follow these instructions. For detailed specifications and configuration recommendations, see the product manual posted on our website.This two-channel amplifier (70V or 8 ohm selectable on each) is designed for applications requiring two-channel stereo audio or two mono zones of audio with different sources or levels. Channels can also be bridged to increase output power and send a singular mono signal.SOURCE CONNECTIONSBalanced and unbalanced connections are available as shown below. Line out connections may be used to send audio signals to other equipment.SPEAKER CONNECTIONSUse 14- or 16-gauge stranded two-conductor speaker wire. Connect the appropriate conductor to each screw terminal, observing correct polarity. Bridged markings are also shown below. Use burial-rated wire, as necessary, for outdoorapplications.SPEAKER OUTCALCULATING AMPLIFIER POWERThe number of satellites or subwoofers that can be connected is determined by the amplifier’s power. As the number of speakers increases, the power that is available to each decreases. Plan the system so that each speaker can receive the highest level of wattage available.NOTE: Only satellite speakers with 70V tap settings need to be calculated. 8Ωsatellite speakers and subwoofers do not require calculation.DIGITAL Support 866.838.5052page | 3© 2020 Episode®As with any 70V installation, we recommend leaving 20% of headroom, using only 80% of the rated power of the amplifier. For the EA-AMP-HYB-2D-1000 this is 400W/channel, and for the EA-AMP-HYB-2D-2000 this is 800W/channel.SPEAKER WIRING8Ω WiringBurial-rated wire is recommended for all installations. Maximum performance can be achieved using the following recommendations:• For wire runs up to 30 meters (100 feet), 16-gauge wire or large.• For wire runs up to 60 meters (200 feet), 14-gauge wire or larger.• For wire runs up to 90 meters (300 feet), 12-gauge wire or larger.NOTE: Smaller wire gauges may be used, but overall performance will be reduced depending on the wire gauge used. The chart below shows the wire length and theamount of signal loss that you can expect on a typical run.70V WiringBurial-rated wire is recommended for all outdoor installations.An advantage of 70V systems is that a smaller wire gauge can be used. A 20ga cable can be used for up to 1,147 feet with only an 11% power loss. An 18ga cable can be used for up to 2,029 feet and a 16ga up to 2,783 feet.page | 4IP/OVRC CONTROLConnect the amplifier to a LAN with internet access to activate an OvrC connection.Create a new account at , or log in to an existing account. Select Adda Device and enter the device’s MAC address and serial number (this informationcan be found next to the service tag on the product). If OvrC locates the device, directions to continue setup will be displayed. The local UI can be accessed without OvrC by entering the IP address into a web browser. Default login information is shown below:• Username: episode• Password: episodeThe following settings can be changed in the web interface:• System Status• Power On (Button, 12V Trigger, Audio Sense)• Input/Output Configuration• Audio Routing Configuration• Network IP and Clock Settings• EQ Presets for Episode Speaker Configurations• Custom DSP ControlPopular Control System and RS-232 drivers can be found via the ProductSupport tab.NOTE:The Hybrid amplifier’s default IP address is 192.168.100.118, ifyou do not connect it to the LAN.INPUT GAINThe Episode Hybrid amplifier is optimized for peak performance when the input voltage of the source is 1.4V. To help you achieve that number, the Hybrid amp includes a pre-amplified stage to modify the input source voltage. If the input voltage from the source is less than 1.4V, maximum power output from the amplifier cannot be achieved and the speakers may sound under powered, or quieter than expected. Adjust the Input Gain to get your source’s output voltage as close to 1.4V as possible.Use the Input Gain slider to boost the input voltage of your source and watch the Output Level to make sure it does not clip, or the level turn red. It important to determine how volume is being controlled for the zone in which the hybrid amplifier is being used. There are two common use cases for this amplifier.• Using the amplifiers output gain for volume control: This is therecommended configuration. Fix the volume of the source and usethe amplifier’s controls for volume adjustment. This allows for optimalperformance and a more granular adjustment to the zones volume. The goalis to make sure your Output Level doesn’t clip when your amplifier is at peakvolume. Support 866.838.5052page | 5© 2020 Episode®• Using the Source output for volume control: By using this method you are dynamically changing the source’s output voltage being input to the amplifier. With this setup, the scale and granularity of volume control is dependent on the source being used. The goal is to make sure your Output Level doesn’t clip when your source is at peak volume.NOTE: The output volume of the amplifier must be fixed for this configuration.See the EA-AMP-HYB Amplifier Source Output Chart to help you determine necessary adjustments.SPEAKER PRESETSAmplifiers come with a preloaded bank of presets noted in the table below. This includes full system presets and DSP settings for any landscape speaker when used in combination with ES-LS-BSUB-12 or ES-LS-HSUB-10.Using Presets in the Web Interface1. Click the Preset button at the top of the page.2. Select the preset from the Select Preset drop-down list.3. Click Load Preset .Using Presets with the Local Display1. Press the Menu button on the front of the amplifier.2. Turn the Adjust/Set knob until you see Menu Preset , then press the knob.3. Turn the Adjust/Set knob until you see the desired preset on the display panel,then press the knob. The preset name will appear with LOAD underneath. 4. Press the Adjust/Set knob once more, and the amplifier loads the presetfrom its memory.Preset charts are on the next page.page | 6 Support 866.838.5052page | 7NOTE: More preset files are available on the product page, if you can’t find a default preset that matches your system design. Refer to themanual for more instructions on loading those files into your Episode Hybrid amplifier.© 2020 Episode®page | 8WARRANTY2-Year Limited WarrantyEpisode® Amplifiers have a 2-Year Limited Warranty. This warranty includes parts and labor repairs on all components found to be defective in material or workmanship under normal conditions of use. This warranty shall not apply to products that have been abused, modified or disassembled. Products to be repaired under this warranty must be returned to a designated service center with an assigned return authorization (RA) number. Contact technical support at *************************************.CONTACTING TECHNICAL SUPPORT866.838.5052************************WARNING: This product can expose you to chemicals including Cadmium,which is known to the State of California to cause cancer and Reproductiveharm. For more information go to .Lithium Battery Caution:1. Danger of explosion if battery is incorrectly replaced. Replace only with the sameor equivalent type recommended by the manufacturer. Dispose of used batteriesaccording to the manufacturer’s instructions.2. Do not remove cover, no user serviceable components inside. Take unit to servicecenter for repairs and servicing.Batterie au lithium Attention :1. Danger d’explosion si la batterie est remplacée de manière incorrecte. Remplacezuniquement par le même type ou un type équivalent recommandé par le fabricant.Débarrassez-vous des piles usagées conformément aux instructions du fabricant.2. Ne retirez pas le couvercle, aucun composant interne réparable par l’utilisateur.Apportez l’appareil au centre de réparation pour réparation et entretien. Support 866.838.5052© 2020 Episode®Rev: 200715-1006。

115,PESD5V0U5BV,115,PESD5V0U5BV,115,PESD5V0U5BF,115,PESD5V0U5BF,115, 规格书,Datasheet 资料

1.Product proﬁle1.1General descriptionUltra low capacitance bidirectional ﬁvefold ElectroStatic Discharge (ESD) protectionarrays in ultra small Surface-Mounted Device (SMD)plastic packages designed to protect up to ﬁve signal lines from the damage caused by ESD and other transients.1.2Features1.3ApplicationsPESD5V0U5BF; PESD5V0U5BVUltra low capacitance bidirectional ﬁvefold ESD protection arraysRev. 01 — 15 August 2008Product data sheetTable 1.Product overviewType numberPackage Package conﬁgurationNXPJEDEC PESD5V0U5BF SOT886MO-252leadless ultra small PESD5V0U5BVSOT666-ultra small and ﬂat lead I Bidirectional ESD protection of up to ﬁve linesI ESD protection up to 10kV I Ultra low diode capacitance:C d =2.9pF I IEC 61000-4-2; level 4 (ESD)I Ultra low leakage current: I RM =5nA I AEC-Q101 qualiﬁedI Computers and peripherals I Portable electronicsI Audio and video equipment I Subscriber Identity Module (SIM) card protection I Cellular handsets and accessories I FireWireI 10/100/1000Mbit/s Ethernet I High-speed data linesI Communication systems1.4Quick reference data2.Pinning information3.Ordering informationTable 2.Quick reference dataT amb =25°C unless otherwise speciﬁed.Symbol ParameterConditionsMinTypMaxUnitPer diode V RWM reverse standoff voltage --5V C ddiode capacitancef =1MHz; V R =0V- 2.93.5pFTable 3.Pinning Pin Description Simpliﬁed outline Graphic symbolPESD5V0U5BF1cathode (diode 1)2common cathode 3cathode (diode 2)4cathode (diode 3)5cathode (diode 4)6cathode (diode 5)PESD5V0U5BV 1cathode (diode 1)2common cathode 3cathode (diode 2)4cathode (diode 3)5cathode (diode 4)6cathode (diode 5)bottom view321456006aab346132564123456006aab346132564Table 4.Ordering informationType numberPackage NameDescriptionVersionPESD5V0U5BF XSON6plastic extremely thin small outline package;no leads;6terminals; body 1×1.45×0.5 mm SOT886PESD5V0U5BV-plastic surface-mounted package; 6leadsSOT6664.Marking5.Limiting values[1]Device stressed with ten non-repetitive ESD pulses.[2]Measured from pin 1,3,4, 5or 6 to pin 2.Table 5.Marking codesType number Marking code PESD5V0U5BF B2PESD5V0U5BVG7Table 6.Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol ParameterConditionsMinMaxUnitPer device T j junction temperature -150°C T amb ambient temperature −55+150°C T stgstorage temperature−65+150°CTable 7.ESD maximum ratingsT amb =25°C unless otherwise speciﬁed.Symbol Parameter Conditions Min Max UnitPer diode V ESDelectrostatic discharge voltage[1][2]IEC 61000-4-2(contact discharge)-10kV MIL-STD-883(human body model)-8kVTable 8.ESD standards complianceStandard ConditionsPer diodeIEC 61000-4-2; level 4 (ESD)>15kV (air); >8kV (contact)MIL-STD-883; class 3 (human body model)>4kVFig 1.ESD pulse waveform according to IEC 61000-4-2001aaa631I PP 100 %90 %t30 ns60 ns10 %t r = 0.7 ns to 1 ns6.CharacteristicsTable 9.CharacteristicsT amb =25°C unless otherwise speciﬁed.Symbol Parameter ConditionsMinTypMaxUnitPer diode V RWM reverse standoff voltage--5V I RM reverse leakage current V RWM =5V -5100nA V BR breakdown voltage I R =5mA 5.56.59.5VC ddiode capacitancef =1MHz V R =0V - 2.9 3.5pF V R =5V- 1.9-pF r difdifferential resistanceI R =1mA--100Ωf =1MHz; T amb =25°CFig 2.Diode capacitance as a function of reverse voltage; typical valuesFig 3.V-I characteristics for a bidirectional ESD protection diodeV R (V)054231006aab0362.22.63.0C d (pF)1.8006aaa676−V CL −V BR −V RWMV CLV BR V RWM −I RM I RM−I RI R −I PPI PP−+Fig 4.ESD clamping test setup and waveforms006aab03750 ΩR ZC ZDUT (DEVICE UNDER TEST)GNDGND450 ΩRG 223/U 50 Ω coaxESD TESTERIEC 61000-4-2 network C Z = 150 pF; R Z = 330 Ω4 GHz DIGITAL OSCILLOSCOPE10×ATTENUATORGNDGNDunclamped +8 kV ESD pulse waveform (IEC 61000-4-2 network)clamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) pin 1 to 2unclamped −8 kV ESD pulse waveform (IEC 61000-4-2 network)clamped −8 kV ESD pulse waveform (IEC 61000-4-2 network) pin 1 to 2vertical scale = 10 A/div horizontal scale = 15 ns/divvertical scale = 10 A/div horizontal scale = 15 ns/div vertical scale = 10 V/divhorizontal scale = 100 ns/divvertical scale = 10 V/divhorizontal scale = 100 ns/div7.Application informationThe PESD5V0U5BF and the PESD5V0U5BV are designed for the protection of up to ﬁve bidirectional data or signal lines from the damage caused by ESD and surge pulses. The devices may be used on lines where the signal polarities are both, positive and negative with respect to ground.Circuit board layout and protection device placementCircuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)and surge transients. The following guidelines are recommended:1.Place the device as close to the input terminal or connector as possible.2.The path length between the device and the protected line should be minimized.3.Keep parallel signal paths to a minimum.4.Avoid running protected conductors in parallel with unprotected conductors.5.Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops.6.Minimize the length of the transient return path to ground.7.Avoid using shared transient return paths to a common ground point.8.Ground planes should be used whenever possible. For multilayer PCBs, use ground vias.8.Test information8.1Quality informationThis product has been qualiﬁed in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualiﬁcation for discrete semiconductors , and is suitable for use in automotive applications.Fig 5.Application diagram006aab347data- or transmission linesDUT1235469.Package outline10.Packing information[1]For further information and the availability of packing methods, see Section 14.[2]T1: normal taping[3]T4: 90° rotated reverse tapingFig 6.Package outline PESD5V0U5BF (SOT886)Fig 7.Package outline PESD5V0U5BV (SOT666)04-07-22Dimensions in mm0.250.170.400.320.350.270.50.61.050.951.5 1.40.50.50max0.04max321456Dimensions in mm04-11-081.71.51.71.51.31.110.180.080.270.170.5pin 1 index1234560.60.50.30.1Table 10.Packing methodsThe indicated -xxx are the last three digits of the 12NC ordering code.[1]Type number Package Description Packing quantity 400050008000PESD5V0U5BF SOT8864mm pitch, 8mm tape and reel; T1[2]--115-4mm pitch, 8mm tape and reel; T4[3]--132-PESD5V0U5BVSOT6662mm pitch, 8mm tape and reel ---3154mm pitch, 8mm tape and reel-115--11.SolderingReﬂow soldering is the only recommended soldering method.Fig 8.Reﬂow soldering footprint PESD5V0U5BF (SOT886)Reﬂow soldering is the only recommended soldering method.Fig 9.Reﬂow soldering footprint PESD5V0U5BV (SOT666)sot886_frsolder lands occupied areasolder paste Dimensions in mm0.425(6×)1.2500.6751.7000.325(6×)0.270(6×)0.370(6×)0.5000.500solder landsplacement area occupied areasolder paste sot666_fr2.752.452.11.60.4(6×)0.55(2×)0.25(2×)0.6(2×)0.65(2×)0.3(2×)0.325(4×)0.45(4×)0.5(4×)0.375(4×)1.72 1.71.0750.538Dimensions in mm12.Revision historyTable 11.Revision historyDocument ID Release date Data sheet status Change notice Supersedes PESD5V0U5BF_PESD5V0U5BV_120080815Product data sheet--PESD5V0U5BF_PESD5V0U5BV_1© NXP B.V . 2008. All rights reserved.Product data sheet Rev. 01 — 15 August 200811 of 1213.Legal information13.1Data sheet status[1]Please consult the most recently issued document before initiating or completing a design.[2]The term ‘short data sheet’ is explained in section “Deﬁnitions”.[3]The product status of device(s)described in this document may have changed since this document was published and may differ in case of multiple devices.The latest product status information is available on the Internet at URL .13.2DeﬁnitionsDraft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modiﬁcations or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequences of use of such information.Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s)and title.A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the full data sheet shall prevail.13.3DisclaimersGeneral —Information in this document is believed to be accurate andreliable.However,NXP Semiconductors does not give any representations or warranties,expressed or implied,as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including withoutlimitation speciﬁcations and product descriptions, at any time and without notice.This document supersedes and replaces all information supplied prior to the publication hereof.Suitability for use —NXP Semiconductors products are not designed,authorized or warranted to be suitable for use in medical, military, aircraft,space or life support equipment, nor in applications where failure ormalfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmentaldamage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the speciﬁed use without further testing or modiﬁcation.Limiting values —Stress above one or more limiting values (as deﬁned in the Absolute Maximum Ratings System of IEC 60134)may cause permanent damage to the device.Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in theCharacteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.Terms and conditions of sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale,as published at /proﬁle/terms , including those pertaining to warranty,intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conﬂict between information in this document and such terms and conditions, the latter will prevail.No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant,conveyance or implication of any license under any copyrights,patents or other industrial or intellectual property rights.Quick reference data —The Quick reference data is an extract of theproduct data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.ESD protection devices —These products are only intended for protection against ElectroStatic Discharge (ESD) pulses and are not intended for any other usage including,without limitation,voltage regulation applications.NXP Semiconductors accepts no liability for use in such applications and therefore such use is at the customer’s own risk.13.4TrademarksNotice:All referenced brands,product names,service names and trademarks are the property of their respective owners.14.Contact informationFor more information, please visit:For sales ofﬁce addresses, please send an email to:salesaddresses@Document status [1][2]Product status [3]DeﬁnitionObjective [short] data sheet Development This document contains data from the objective speciﬁcation for product development.Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation.Product [short] data sheetProductionThis document contains the product speciﬁcation.芯天下--/15.Contents1Product proﬁle. . . . . . . . . . . . . . . . . . . . . . . . . . 11.1General description. . . . . . . . . . . . . . . . . . . . . . 11.2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.3Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.4Quick reference data. . . . . . . . . . . . . . . . . . . . . 22Pinning information. . . . . . . . . . . . . . . . . . . . . . 23Ordering information. . . . . . . . . . . . . . . . . . . . . 24Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 36Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 57Application information. . . . . . . . . . . . . . . . . . . 78Test information. . . . . . . . . . . . . . . . . . . . . . . . . 78.1Quality information . . . . . . . . . . . . . . . . . . . . . . 79Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 810Packing information. . . . . . . . . . . . . . . . . . . . . . 811Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 912Revision history. . . . . . . . . . . . . . . . . . . . . . . . 1013Legal information. . . . . . . . . . . . . . . . . . . . . . . 1113.1Data sheet status . . . . . . . . . . . . . . . . . . . . . . 1113.2Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1113.3Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 1113.4T rademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 1114Contact information. . . . . . . . . . . . . . . . . . . . . 1115Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Please be aware that important notices concerning this document and the product(s)described herein, have been included in section ‘Legal information’.© NXP B.V.2008.All rights reserved.For more information, please visit: For sales office addresses, please send an email to: salesaddresses@Date of release: 15 August 2008Document identifier: PESD5V0U5BF_PESD5V0U5BV_1芯天下--/。

LM621中文资料

TL H 8679LM621 Brushless Motor CommutatorAugust1992LM621Brushless Motor CommutatorGeneral DescriptionThe LM621is a bipolar IC designed for commutation ofbrushless DC motors The part is compatible with boththree-and four-phase motors It can directly drive the powerswitching devices used to drive the motor The LM621pro-vides an adjustable dead-time circuit to eliminate‘‘shoot-through’’current spiking in the power switching circuitryOperation is from a5V supply but output swings of up to40V are accommodated The part is packaged in an18-pindual-in-line packageFeaturesY Adjustable dead-time feature eliminates current spikingY On-chip clock oscillator for dead-time featureY Outputs drive bipolar power devices(up to35mA basecurrent)or MOSFET power devicesY Compatible with three-and four-phase motorsBipolar drive to delta-or Y-wound motorsUnipolar drive to center-tapped Y-wound motorsSupports30-and60-degree shaft position sensorplacements for three-phase motorsSupports90-degree sensor placement for four-phasemotorsY Directly interfaces to pulse-width modulator output(s)via OUTPUT INHIBIT(PWM magnitude)and DIREC-TION(PWM sign)inputsY Direct interface to Hall sensorsY Outputs are current limitedY Undervoltage lockoutConnection DiagramTL H 8679–1Order Number LM621NSee NS Package Number N18AC1995National Semiconductor Corporation RRD-B30M115 Printed in U S AAbsolute Maximum Ratings(See Notes)If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications V CC1a7V V CC2a45V Logic Inputs(Note1)V CC1a0 5V b0 5V Logic Input Clamp Current20mA Output Voltages a45V b0 5V Output Currents Internally current limited Operating Ambient Temperature RangeLM621b40 C to a85 C Storage Temperature Range b65 C to a150 C Junction Temperature150 C ESD Susceptibility(Note10)2000V Lead Temperature N pkg(Soldering 4sec )260 CElectrical Characteristics(See Notes)Parameter Conditions Typ Tested DesignUnits Limits LimitsDECODER SECTIONHigh Level Input VoltageHS1 HS2 HS3 2 02 0V min 30 60SELECT 2 02 0V minHigh Level Input CurrentHS1 HS2 HS3 V IH e V CC1100200m A max 30 60SELECT V IH e V CC1120240m A maxLow Level Input VoltageHS1 HS3and HS230 60e5V0 60 4V max HS1 HS3and HS230 60e0V0 60 4V max 30 60Select H SI e H S3e5V0 60 4V maxLow Level Input CurrentHS1and HS3 V IL e0 35V b400b600m A max HS2 V IL e0 4V b100b200m A max 30 60SELECT V IL e0 0V b700b1000m A maxInput Clamp Voltage I in e1mA(V CC1a0 7)V (Pins2 3 5 6 7 8 17)I in e b1mA(b0 6)VOutput Leakage Current Outputs OffSinking Outputs V CC2e40V 0 21 0m AV OUT e40VSourcing Outputs V OUT e0V b0 2b1 0m AShort-Circuit Current V CC2e10V 5035mA min Sinking Outputs V OUT e10VSourcing Outputs V OUT e0V b50b35mA minV sat(sinking)I e20mA0 831 00V max V drop(sourcing)e(V CC2b V OUT)I e b20mA1 72 00V maxOutput Rise Time(sourcing)50nsC L k10pFOutput Fall Time(sinking)50nsC L s10pFPropagation Delay Dead-Time Off200ns (Hall Input to Output)2Electrical Characteristics(See Notes)(Continued)Parameter Conditions Typ Tested DesignUnits Limits LimitsDEAD-TIME SECTIONHigh Level Input VoltageDIRECTION Pin3e0V2 02 0V min OUTPUT INHIBIT 2 02 0V min DEAD-TIME ENABLE Pin17e0V2 02 0V minHigh Level Input Current V in e5VDIRECTION Pin3e0V100150m A max OUTPUT INHIBIT 60100m A max DEAD-TIME ENABLE 200300m A maxLow Level Input VoltageDIRECTION Pin3e0V0 60 4V max OUTPUT INHIBIT 0 60 4V max DEAD-TIME ENABLE 0 30 2V maxLow Level Input CurrentDIRECTION V in e0 6V b100b150m A max OUTPUT INHIBIT V in e0 6V b60b100m A max DEAD-TIME ENABLE V in e0V b200b300m A maxPropagation Delays Dead-Time Off(Inputs to Outputs)(Pin3e0V)OUTPUT INHIBIT200ns DIRECTION200nsMinimum Clock Period R e11k X R1e1k1 8m sT CLK(Notes3 11)C e200pFClock Accuracy R e30k R1e1kg3%f e100kHz(Note11)C e420pFMinimum Dead-Time Dead-Time Off15ns Minimum Dead-Time Dead-Time On2T CLK COMPLETE CIRCUITTotal Current Drains Outputs OffI CC110mA minI CC1152230mA maxI CC2V CC2e40V2mA minI CC2369mA maxUndervoltage Lockout3 63 0V MAXV CC1Note1 Unless otherwise noted ambient temperature(T A)e25 CNote2 Unless otherwise noted V CC1e a5 0V ‘‘recommended operating range V CC e4 5V to5 5V’’V CC2e a10 0V ambient temperature e25 CNote3 The clock period is typically T CLK e(0 756c10b3)(R a1)C where T CLK is in m s R is in k X and C is pF Also see selection graph in Typical Characteristics for determining values of R and C Note that the value of R should be no less than11k X and C no less than200pFNote4 Tested limits are guaranteed and100%production testedNote5 Design limits are guaranteed(but not100%production tested)at the indicated temperature and supply voltages These limits are not used to calculate outgoing quality levelsNote6 Specifications in boldface apply over junction temperature range of b40 C to a85 CNote7 Typical Thermal Resistances O JA(see Note8)N pkg board mounted110 C WN pkg socketed118 C WNote8 Package thermal resistance indicates the ability of the package to dissipate heat generated on the die Given ambient temperature and power dissipation the thermal resistance parameter can be used to determine the approximate operating junction temperature Operating junction temperature directly effects product performance and reliabilityNote9 This part specifically does not have thermal shutdown protection to avoid safety problems related to an unintentional restart due to thermal time constant variations Care should be taken to prevent excessive power dissipation on the dieNote10 Human body model 100pF discharged through a1500X resistorNote11 R1e0for C t620pF3Typical Performance Characteristicsfor R and CSelection Graph vs TemperatureSupply Currents vs TemperatureSupply Currents V sat vs Temperature V drop vs Temperature( T A e 25 C)Typ V drop vs I out source Typ V sat vs I out sinkTL H 8679–2Description of Inputs and OutputsPin 1 V CC1(a 5V) The logic and clock power supply pin Pin 2 DIRECTION This input determines the direction of rotation of the motor ie clockwise vs counterclockwise See truth tablePin 3 DEAD-TIME ENABLE This input enables or disables the dead-time feature Connecting a 5V to pin 3enables dead-time and grounding pin 3disables it Pin 3should not be allowed to floatPin 4 CLOCK TIMING An RC network connected between this pin and ground sets the period of the clock oscillator which determines the amount of dead-time See Figure 2and textPins 5thru 7 HS1 HS2 and HS3(Hall-sensor inputs) These inputs receive the rotor-position sensor inputs from the motor Three-phase motors provide all three signals four phase motors provide only two one of which is con-nected to both HS2and HS3Pin 8 30 60SELECT This input is used to select the re-quired decoding for three-phase motors ie either ‘‘30-de-gree’’(a 5V)or ‘‘60-degree’’(ground) Connect pin 8to a 5V when using a four-phase motorPin 9 LOGIC GROUND Ground for the logic power supplyPin 10 POWER GROUND Ground for the output buffer supplyPins 11thru 13 SOURCE OUTPUTS The three current-sourcing outputs which drive the external power devices that drive the motorPins 14thru 16 SINK OUTPUTS The three current-sinking outputs which drive the external power devices that drive the motorPin 17 OUTPUT INHIBIT This input disables the LM621outputs It is typically driven by the magnitude signal from an external sign magnitude PWM generator Pin 17e a 5V e outputs offPin 18 V CC2(a 5to a 40V) This is the supply for the collectors of the three current-sourcing outputs (pins 11thru 13) When driving MOSFET power devices pin 18may be connected to a voltage source of up to a 40V to achieve sufficient output swing for the gate When driving bipolar power devices pin 18should be connected to a 5V to mini-mize on-chip power dissipation Undervoltage lockout auto-matically shuts down all outputs if the V CC1supply is too low All outputs will be off if V CC1falls below the undervol-tage lockout voltage4Functional DescriptionThe commutation decoder receives Hall-sensor inputs HS1 HS2 and HS3and a30 60SELECT input This block de-codes the gray-code sequence to the required motor-drive sequenceThe dead-time generator monitors the DIRECTION input and inhibits the outputs(pins11thru16)for a time sufficient to prevent current-spiking in the external power switches when the direction is reversedThe six chip outputs drive external power switching devices which drive the motor Three outputs source current the remaining three sink current The output transistors provide up to50mA outputs for driving devices or up to40V output swings for driving MOSFETs The LM621logic is powered from5VThe undervoltage lockout section monitors the V CC supply and if the voltage is not sufficient to permit reliable logic operation the outputs are shutdownThree-Phase Motor Commutation There are two popular conventions for establishing the rela-tive phasing of rotor-position signals for three-phase mo-tors While usually referred to as30-degree and60-degree sensor placements this terminology refers to mechanical degrees of sensor placement not electrical degrees The electrical angular resolution is the required60degrees in both cases The phasing differences can be noted by com-paring the sequences of HS1through HS3entries in Table I LM621Commutation Decoder Truth Table which shows both the30-and60-degree phasings(and the90-degree phasing for four-phase motors)and their required decoder logic truth tables respectively Table I shows the phasing (or codes)of the Hall-effect sensors for each60-degree (electrical)position range of the rotor and correlates these data to the commutator sink and source outputs required to drive the power switches These phasings are common to several motor manufacturers The60-degree phasing is pre-ferred to30-degree phasing because the all-zeros and all-ones codes are not generated The60-degree phasing is more failsafe because the all-zeros and all-ones codes could be inadvertently generated by things like disconnect-ed or shorted sensorsBecause the above terminology is not used consistently among all motor manufacturers Table II Alternative Sen-sor-phasing Names will hopefully clarify some of the differ-ences Table II shows a different60-degree phasing and 120- 240- and300-degree phasings Comparison with Ta-ble I will show that these four phasings are essentially shift-ed and or reversed-order versions of those used with the LM621Figure1shows the waveforms associated with the commu-tation decoder logic for a motor which has60-degree rotor-position phasing along with the generated motor-drive waveforms As can be seen in the drawing Hall-effect sen-sor signals HS1through HS3are separated by60electrical degrees which is the required angular resolution for three-phase motorsTL H 8679–6FIGURE1 Commutation Waveforms for60-degree Phasing5Three-Phase Motor Commutation(Continued)TABLE I LM621Commutation Decoder Truth TableSensor Position Sensor Inputs Sink Outputs Source Outputs Phasing Range HS1HS2HS31231230–60000ON off off off ON off60–120001ON off off off off ON 30deg120–180011off ON off off off ON 180–240111off ON off ON off off240–300110off off ON ON off off300–360100off off ON off ON off0–60101ON off off off ON off60–120100ON off off off off ON 60deg120–180110off ON off off off ON 180–240010off ON off ON off off240–300011off off ON ON off off300–360001off off ON off ON off0–9001HS2off na off off na ON 90deg90–18000HS2ON na off off na off 180–27010HS2off na ON off na off270–36011HS2off na off ON na off Pin Numbers 567161514131211 Note1 The above outputs are generated when the Direction input pin2 is logic high For reverse rotation(pin2logic low) the above sink and source output states become exchangedNote2 For four-phase motors sink and source outputs number two(pins15and12)are not used hense the‘‘na’’(not applicable)in the appropriate columns above Figure6shows how the required sink and source outputs for four-phase motors are derivedTABLE II Alternative Sensor-Phasing NamesAlternate Position Sensor Inputs Corresponding LM621Position Phasing Range HS1HS2HS3Range and or Comments0–60000Same as30-degree phasing but in reverse60–120100order i e only change is relative direction‘‘60deg’’120–180110180–240111240–300011300–3600010–60001Same as60-degree phasing but with shifted60–120101order of position ranges i e only change is‘‘120deg’’120–180100relative phasing of sensor signals180–240110240–300010300–3600110–60010Same comment as above for‘‘120deg’’60–120110phasing‘‘240deg’’120–180100180–240101240–300001300–3600110–60011Same as30-degree phasing but with shifted60–120111order of position ranges i e only change is‘‘300deg’’120–180110relative phasing of sensor signals180–240100240–300000300–360001Four-Phase Motor CommutationFour-phase motors use a90-degree(quadrature)rotor-posi-tion sensor phasing This phasing scheme is also shown in Table I LM621Commutation Decoder Truth Table As shown in Table I the90-degree phasing has only two rotor-position-sensor signals HS1and HS2 When using the LM621to run a four-phase motor the HS2signal is connect-ed to both the HS2and HS3chip inputs6Dead-Time FeatureThe DEAD-TIME ENABLE input is used to enable this fea-ture (by connecting a 5V to pin 3) The reason for providing this feature is that the external power switches are usually totem-pole structures Since these structures switch heavy currents if either totem-pole device is not completely turned off when its complementary device turns on heavy ‘‘shoot-through’’current spiking will occur This situation occurs when the motor DIRECTION input changes (when all output drive polarities reverse) at which time device turn-off delay can cause the undesired current spikingFigure 2shows the logic of the dead-time generator The dead-time generator includes an RC oscillator to generate a required clock Pin 4(CLOCK TIMING)is used to connect an external RC network to set the frequency of this oscilla-tor The clock frequency should be adjusted so that two periods of oscillation just slightly exceed the worst-case turn-off time of the power switching devices As shown bythe graph in Typical Peformance Characteristics the time ofone clock period (in m s)is approximately (0 756c 10b3)(R a 1)C where R is in k X and C is in pF the period can be measured with an oscilloscope at pin 4 The dead-time generator function monitors the DIRECTION input for changes synchronizes the direction changes with the inter-nal clock and inhibits the chip outputs for two clock periods Flip-flops FF1through FF3form a three-bit shift-register delay line the input of which is the DIRECTION input The flip-flops are the only elements clocked by the internal clock generator The shift register outputs must all have the same state in order to enable gate G1or G2 one of which must be enabled to enable the chip outputs As soon as a direc-tion change input is sensed at the output of FF1 gates G1and G2will be disabled thereby disabling the drive to the power switches for a time equal to two clock periodsFIGURE 2 Dead-Time Generator Logic DiagramTL H 8679–7TL H 8679–8FIGURE 3 Dead-Time Generator Waveforms7Dead-Time Feature(Continued)Dead-time is defined as the time the outputs are blanked off (to prevent shoot-through currents)after a direction change input See Figure3 It can be seen that the dead-time is two clock periods Since the dead-time scheme introduces de-lay into the system feedback control loop which could im-pact system performance or stability it is important that the dead-time be kept to a minimum From Figure3it can be seen that the time between a direction change signal and the initiation of output blanking can vary up to one clock period due to asynchronous nature of the clock and the direction signalTypical ApplicationsTHREE-PHASE EXAMPLESFigure4is a typical LM621application This circuitry is for use with a three-phase motor having30-degree sensor phasing as indicated by connection of the30 60SELECT input pin8 to a logic‘‘1’’(a5V) The same connection of the DEAD-TIME ENABLE input pin3 enables this feature Typical power switches and a simple implementation of an overcurrent sensing circuit are also detailed in Figure4 This application example assumes a device turn-off time of about 4 8m s maximum as evidenced by the choice of R and C See Typical Performance Characteristics The choice of RC should be made such that two periods are at least equal to the maximum device turn-off timeThe choice of the value for R limit(the resistors which couple the LM621outputs to the power switches)depends on the input current requirements of the power switching devices These resistors should be chosen to provide only the amount of current needed by the device inputs up to50mA (typical) The resistors minimize the dissipation incurred by the LM621 Although Figure4shows the5–40V supply(pin 18)connected to the motor supply voltage this was done only to emphasize the ability of the part to provide up to40V output swings For the bipolar power switches shown con-necting pin18to a5V supply would reduce on-chip power dissipation Driving FET power switches however may re-quire connecting pin18to a higher voltage Figure5is the three-phase application built with MOSFET power-switching components Note that since the output V drop(sourcing)is at least1 5V V CC2can be chosen to avoid overdriving the MOSFET gatesTL H 8679–9FIGURE4 Commutation of Three-Phase Motor(Bipolar Switches)8Typical Applications(Continued)TL H 8679–10 FIGURE5 Commutation of Three-Phase Motor(MOSFET Switches)9Typical Applications(Continued)FOUR-PHASE EXAMPLEFigure6is typical of the circuitry used to commutate a four-phase motor using the LM621 This application is seen to differ from the three-phase application example in that the LM621outputs are utilized differently Four-phase motors require four-phase power switches which in turn require the commutator to provide four current-sinking outputs and four current sourcing outputs The18-pin package of the LM621 facilitates only three sinking and three sourcing outputs The schematic shows the30 60SELECT input in the30-degree select state(pin8high)and rotor-position sensor inputs HS2and HS3connected together This connection trun-cates the number of possible rotor-position input states to four which is consistent with the90-degree quadrature ro-tor-position signals provided by four-phase motors With the LM621outputs connected as shown this approach pro-vides the needed power-switch drive signals for a four-phase motor Note that only four of the six LM621outputs (SINK 1and 3 and SOURCE 1and 3)are used directly and that these are also inverted to form the remain-ing four SINK 2and SOURCE 2outputs are not used HALF-WAVE DRIVE EXAMPLEThe previous applications examples involved delta-config-ured motor windings and full-wave operation of the motor The application shown in Figure7differs in that it features half-wave operation of a motor with the windings in a Y-con-figuration This approach is suitable for automotive and oth-er applications where only low-voltage power supplies are conveniently available The advantage of this power-switch-ing scheme is that there is only one switch-voltage drop in series with the motor winding thereby conserving more of the available voltage for application to the motor winding Half-wave operation provides only unidirectional current to the windings in contrast to the bidirectional currents applied by the previous full-wave examplesTL H 8679–11FIGURE6 Commutation of Four-Phase Motor10Typical Applications(Continued)TL H 8679–12FIGURE7 Half-Wave Drive of Y-Configured Motor11L M 621B r u s h l e s s M o t o r C o m m u t a t o r Physical Dimensions inches (millimeters)Lit 107155Molded Dual-in-Line Package (N)Order Number LM621NNS Package Number N18ALIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein1 Life support devices or systems are devices or2 A critical component is any component of a life systems which (a)are intended for surgical implantsupport device or system whose failure to perform can into the body or (b)support or sustain life and whosebe reasonably expected to cause the failure of the life failure to perform when properly used in accordancesupport device or system or to affect its safety or with instructions for use provided in the labeling caneffectiveness be reasonably expected to result in a significant injuryto the userNational SemiconductorNational Semiconductor National Semiconductor National Semiconductor CorporationEurope Hong Kong Ltd Japan Ltd 1111West Bardin Road Fax (a 49)0-180-530858613th Floor Straight Block Tel 81-043-299-2309。

National Semiconductor

LMC555CMOS TimerGeneral DescriptionThe LMC555is a CMOS version of the industry standard 555series general purpose timers.In addition to the stan-dard package (SOIC,MSOP ,and MDIP)the LMC555is also available in a chip sized package (8Bump micro SMD)using National’s micro SMD package technology.The LMC555of-fers the same capability of generating accurate time delays and frequencies as the LM555but with much lower power dissipation and supply current spikes.When operated as a one-shot,the time delay is precisely controlled by a single external resistor and capacitor.In the stable mode the oscil-lation frequency and duty cycle are accurately set by two ex-ternal resistors and one capacitor.The use of National Semi-conductor’s LMCMOS ™process extends both the frequency range and low supply capability.Featuresn Less than 1mW typical power dissipation at 5V supply n 3MHz astable frequency capabilityn 1.5V supply operating voltage guaranteedn Output fully compatible with TTL and CMOS logic at 5V supplyn Tested to −10mA,+50mA output current levelsn Reduced supply current spikes during output transitions n Extremely low reset,trigger,and threshold currents n Excellent temperature stabilityn Pin-for-pin compatible with 555series of timersnAvailable in 8pin MSOP Package and 8-Bump micro SMD packageBlock and Connection DiagramsLMCMOS ™is a trademark of National Semiconductor Corp.8-Pin SOIC,MSOP ,and MDIP PackagesDS008669-1Top View8-Bump micro SMDDS008669-9Top View(bump side down)February 2000LMC555CMOS Timer©2000National Semiconductor Corporation 查询LMC555供应商Ordering InformationPackageTemperature Range Package MarkingTransport MediaNSC DrawingIndustrial −40˚C to +85˚C8-LeadSmall Outline (SO)LMC555CM LMC555CM RailsM08A LMC555CMX LMC555CM2.5k Units Tape and Reel 8-Lead Mini Small Outline (MSOP)LMC555CMM ZC51k Units Tape and Reel MUA08A LMC555CMMX ZC53.5k Units Tape and Reel8-Lead Molded Dip (MDIP)LMC555CN LMC555CNRailsN08E 8-Bump micro SMD LMC555CBP F1250Units Tape and Reel BPA08EFBLMC555CBPX F13k Units Tape and ReelMetronome CircuitLMC555CBPEVALN/AN/AN/Amicro SMD Marking OrientationTop ViewDS008669-23Bumps are numbered counter-clockwiseL M C 555 2Absolute Maximum Ratings(Notes2,3) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.Supply Voltage,V+15V Input Voltages,V TRIG,V RES,V CTRL,V THRESH−0.3V to V S+0.3V Output Voltages,V O,V DIS15V Output Current I O,I DIS100mA Storage Temperature Range−65˚C to+150˚C Soldering InformationMDIP Soldering(10seconds)260˚C SOIC,MSOP Vapor Phase(60sec)215˚C SOIC,MSOP Infrared(15sec)220˚C Note:See AN-450“Surface Mounting Methods and Their Effect on Product Reliability”for other methods of soldering surface mount devices.Operating Ratings(Notes2,3)Termperature Range−40˚C to+85˚C Thermal Resistance(θJA)(Note2)SO,8-lead Small Outline169˚C/W MSOP,8-lead Mini SmallOutline225˚C/W MDIP,8-lead Molded Dip111˚C/W 8-Bump micro SMD220˚C/W Maximum Allowable PowerDissipation@25˚CMDIP-81126mW SO-8740mW MSOP-8555mW 8Bump micro SMD568mWElectrical Characteristics(Notes1,2)Test Circuit,T=25˚C,all switches open,RESET to V S unless otherwise notedSymbol Parameter Conditions Min Typ Max Units(Limits)I S Supply Current V S=1.5VV S=5VV S=12V50100150150250400µAV CTRL Control Voltage V S=1.5VV S=5VV S=12V 0.82.97.41.03.38.01.23.88.6VV DIS Discharge SaturationVoltage V S=1.5V,I DIS=1mAV S=5V,I DIS=10mA75150150300mVV OL Output Voltage(Low)V S=1.5V,I O=1mAV S=5V,I O=8mAV S=12V,I O=50mA 0.20.31.00.40.62.0VV OH Output Voltage(High)V S=1.5V,I O=−0.25mAV S=5V,I O=−2mAV S=12V,I O=−10mA1.04.410.51.254.711.3VV TRIG Trigger Voltage V S=1.5VV S=12V 0.43.70.54.00.64.3VI TRIG Trigger Current V S=5V10pAV RES Reset Voltage V S=1.5V(Note4)V S=12V 0.40.40.70.751.01.1VI RES Reset Current V S=5V10pA I THRESH Threshold Current V S=5V10pA I DIS Discharge Leakage V S=12V 1.0100nA t Timing Accuracy SW2,4ClosedV S=1.5V V S=5V V S=12V 0.91.01.01.11.11.11.251.201.25ms∆t/∆V S Timing Shift with Supply V S=5V±1V0.3%/V∆t/∆T Timing Shift withTemperature V S=5V−40˚C≤T≤+85˚C75ppm/˚Cf A Astable Frequency SW1,3Closed,V S=12V 4.0 4.8 5.6kHz f MAX Maximum Frequency Max.Freq.Test Circuit,V S=5V 3.0MHzt R,t F Output Rise andFall Times Max.Freq.Test CircuitV S=5V,C L=10pF15nsLMC5553Electrical Characteristics(Notes 1,2)Test Circuit,T =25˚C,all switches open,RESET to V S unless otherwise noted (Continued)Symbol ParameterConditionsMinTypMaxUnits (Limits)t PDTrigger Propagation DelayV S =5V,Measure Delay from Trigger to Output100nsNote 1:All voltages are measured with respect to the ground pin,unless otherwise specified.Note 2:Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.Operating Ratings indicate conditions for which the device is func-tional,but do not guarantee specific performance limits.Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guar-antee specific performance limits.This assumes that the device is within the Operating Ratings.Specifications are not guaranteed for parameters where no limit is given,however,the typical value is a good indication of device performance.Note 3:See AN-450for other methods of soldering surface mount devices,and also AN-1112for micro SMD considerations.Note 4:If the RESET pin is to be used at temperatures of −20˚C and below V S is required to be 2.0V or greater.Note 5:For device pinout please refer to table 1TABLE 1.Package Pinout Names vs.Pin FunctionPin FunctionPackage Pin numbers8-Pin SO,MSOP,and MDIP8-Bump micro SMDGND 17Trigger 26Output 35Reset44Control Voltage 53Threshold 62Discharge 71V+88Test Circuit (Note 5)DS008669-2Maximum Frequency Test Circuit (Note 5)DS008669-3L M C 555 4Application InfoMONOSTABLE OPERATIONIn this mode of operation,the timer functions as a one-shot (Figure1).The external capacitor is initially held discharged by internal circuitry.Upon application of a negative trigger pulse of less than1/3V S to the Trigger terminal,the flip-flop is set which both releases the short circuit across the capaci-tor and drives the output high.The voltage across the capacitor then increases exponen-tially for a period of t H=1.1R A C,which is also the time that the output stays high,at the end of which time the voltage equals2/3V S.The comparator then resets the flip-flop which in turn discharges the capacitor and drives the output to its low state.Figure2shows the waveforms generated in this mode of operation.Since the charge and the threshold level of the comparator are both directly proportional to supply voltage,the timing internal is independent of supply.Reset overrides Trigger,which can override threshold. Therefore the trigger pulse must be shorter than the desired t H.The minimum pulse width for the Trigger is20ns,and it is 400ns for the Reset.During the timing cycle when the output is high,the further application of a trigger pulse will not effect the circuit so long as the trigger input is returned high at least 10µs before the end of the timing interval.However the cir-cuit can be reset during this time by the application of a negative pulse to the reset terminal.The output will then re-main in the low state until a trigger pulse is again applied.When the reset function is not use,it is recommended that it be connected to V+to avoid any possibility of false triggering. Figure3is a nomograph for easy determination of RC values for various time delays.Note:In monstable operation,the trigger should be driven high before the end of timing cycle.ASTABLE OPERATIONIf the circuit is connected as shown in Figure4(Trigger and Threshold terminals connected together)it will trigger itself and free run as a multivibrator.The external capacitor charges through R A+R B and discharges through R B.Thus the duty cycle may be precisely set by the ratio of these two resistors.In this mode of operation,the capacitor charges and dis-charges between1/3V S and2/3V S.As in the triggered mode,the charge and discharge times,and therefore the fre-quency are independent of the supply voltage.Figure5shows the waveform generated in this mode of operation.DS008669-4 FIGURE1.Monostable(One-Shot)DS008669-10V CC=5V Top Trace:Input5V/Div.TIME=0.1ms/Div.Middle Trace:Output5V/Div.R A=9.1kΩBottom Trace:Capacitor Voltage2V/Div.C=0.01µFFIGURE2.Monostable WaveformsDS008669-11FIGURE3.Time DelayDS008669-5 FIGURE4.Astable(Variable Duty Cycle Oscillator)LMC5555Application Info(Continued)The charge time (output high)is given byt 1=Ln2(R A +R B )C And the discharge time (output low)by:t 2=Ln2(R B )C Thus the total period is:T =t 1+t 2=Ln2(R A +R B )CThe frequency of oscillation is:Figure 6may be used for quick determination of these RC Values.The duty cycle,as a fraction of total period that the output is low,is:FREQUENCY DIVIDERThe monostable circuit of Figure 1can be used as a fre-quency divider by adjusting the length of the timing cycle.Figure 7shows the waveforms generated in a divide by three circuit.PULSE WIDTH MODULATORWhen the timer is connected in the monostable mode and triggered with a continuous pulse train,the output pulse width can be modulated by a signal applied to the Control Voltage Terminal.Figure 8shows the circuit,and in Figure 9are some waveform examples.PULSE POSITION MODULATORThis application uses the timer connected for astable opera-tion,as in Figure 10,with a modulating signal again applied to the control voltage terminal.The pulse position varies withDS008669-12V CC =5VTop Trace:Output 5V/Div.TIME =20µs/Div.Bottom Trace:Capacitor Voltage 1V/Div.R A =3.9k ΩR B =9k ΩC =0.01µFFIGURE 5.Astable WaveformsDS008669-13FIGURE 6.Free Running FrequencyDS008669-14V CC =5V Top Trace:Input 4V/Div.TIME =20µs/Div.Middle Trace:Output 2V/Div.R A =9.1k ΩBottom Trace:Capacitor 2V/Div.C =0.01µFFIGURE 7.Frequency Divider WaveformsDS008669-20FIGURE 8.Pulse Width ModulatorDS008669-15V CC =5V Top Trace:Modulation 1V/Div.TIME =0.2ms/Div.Bottom Trace:Output Voltage 2V/Div.R A =9.1k ΩC =0.01µFFIGURE 9.Pulse Width Modulator Waveforms L M C 555 6Application Info(Continued)the modulating signal,since the threshold voltage and hence the time delay is varied.Figure 11shows the waveforms generated for a triangle wave modulation signal.50%DUTY CYCLE OSCILLATOR The frequency of oscillation isf =1/(1.4R C C)DS008669-21FIGURE 10.Pulse Position ModulatorDS008669-16V CC =5VTop Trace:Modulation Input 1V/Div.TIME =0.1ms/Div.Bottom Trace:Output Voltage 2V/Div.R A =3.9k ΩR B =3k ΩC =0.01µFFIGURE 11.Pulse Position Modulator Waveforms DS008669-6FIGURE 12.50%Duty Cycle OscillatorLMC5557Physical Dimensionsinches (millimeters)unless otherwise notedMolded Small Outline (SO)Package (M)NS Package Number M08AL M C 555 8LMC555 Physical Dimensions inches(millimeters)unless otherwise noted(Continued)8-Lead(0.118”Wide)Molded Mini Small Outline PackageNS Package Number MUA08A9Physical Dimensionsinches (millimeters)unless otherwise noted (Continued)Molded Dual-in-line Package (N)NS Package Number N08EL M C 555 10LMC555 Physical Dimensions inches(millimeters)unless otherwise noted(Continued)NOTES:UNLESS OTHERWISE SPECIFIED1.EPOXY COATING2.63Sn/37Pb EUTECTIC BUMP3.RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.4.PIN1IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION.REMAINING PINS ARE NUMBERED COUNTERCLOCKWISE.5.XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1IS PACKAGE WIDTH,X2IS PACK-AGE LENGTH AND X3IS PACKAGE HEIGHT.6.REFERENCE JEDEC REGISTRATION MO-211,VARIATION BC.micro SMD PackageNS Package Number BPA08EFBX1=1.387X2=1.412X3=0.85011NotesLIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION.As used herein:1.Life support devices or systems are devices or systems which,(a)are intended for surgical implant into the body,or (b)support or sustain life,and whose failure to perform when properly used in accordance with instructions for use provided in the labeling,can be reasonably expected to result in a significant injury to the user.2.A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system,or to affect its safety or effectiveness.National Semiconductor Corporation AmericasTel:1-800-272-9959Fax:1-800-737-7018Email:***************National Semiconductor EuropeFax:+49(0)180-5308586Email:**********************Deutsch Tel:+49(0)6995086208English Tel:+44(0)8702402171Français Tel:+33(0)141918790National Semiconductor Asia Pacific Customer Response Group Tel:65-2544466Fax:65-2504466Email:******************National Semiconductor Japan Ltd.Tel:81-3-5639-7560Fax:81-3-5639-7507L M C 555C M O S T i m e rNational does not assume any responsibility for use of any circuitry described,no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.。

SMBUS_BIOS_Interface_Specification

Smart Battery System Specifications System Management Bus BIOS InterfaceSpecificationRevision 1.0February 15, 1995Copyright© 1996, Benchmarq Microelectronics Inc., Duracell Inc., Energizer Power Systems, Intel Corporation, Linear Technology Corporation, Maxim Integrated Products, Mitsubishi Electric Corporation,National Semiconductor Corporation, Toshiba Battery Co.,Varta Batterie AG, All rights reserved.Questions and comments regarding thisspecification may be forwarded to:Intel CorporationIntel Architecture Labs Technical SupportPHONE: (8am-5pm PST) (800) 628-8686FAX: (916) 356-6100INTERNATIONAL (916) 356-3551Email: IAL_Support@THIS SPECIFICATION IS PROVIDED “AS IS”, WITH NO WARRANTIES WHATSOEVER, WHETHER EXPRESS, IMPLIED OR STATUTORY, INCLUDING, BUT NOT LIMITED TO ANY WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE.IN NO EVENT WILL ANY SPECIFICATION CO-OWNER BE LIABLE TO ANY OTHER PARTY FOR ANY LOSS OF PROFITS, LOSS OF USE, INCIDENTAL, CONSEQUENTIAL, INDIRECT OR SPECIAL DAMAGES ARISING OUT OF THIS AGREEMENT, WHETHER OR NOT SUCH PARTY HAD ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES. FURTHER, NO WARRANTY OR REPRESENTATION IS MADE OR IMPLIED RELATIVE TO FREEDOM FROM INFRINGEMENT OF ANY THIRD PARTY PATENTS WHEN PRACTICING THE SPECIFICATION.Table of Contents1. INTRODUCTION1 1.1 Scope11.2 Audience12. REFERENCES23. DEFINITIONS34. SMBUS BIOS INTERFACE4 4.1 SMBus Driver Connection and Calling Interface44.1.1 SMBus Installation Check (01H)54.1.2 SMBus Real Mode Connect (02H)64.1.3 SMBus 16-Bit Connect (03H)74.1.4 SMBus 32-Bit Connect (04H)94.1.5 SMBus Disconnect (05H)114.1.6 SMBus Device Address (06H)124.1.7 SMBus Critical Messages (07H)13 4.2 SMBus Device Command Protocols144.2.1 SMBus Request (10H)144.2.2 SMBus Request Continuation (11H)154.2.3 SMBus Request Abort (12H)164.2.4 SMBus Request Data and Status (13H)174.2.5 SMBus Protocol Codes184.2.6 SMBus Request - Protocol Register Requirements184.2.7 SMBus Request Continuation - Protocol Register Requirements184.2.8 SMBus Request Abort - Protocol Register Requirements194.2.9 SMBus Request Data and Status - Protocol Register Requirements19 4.3 SMBus Device-to-SMBus Host20 4.4 SMBus Error Detection and Signaling204.4.1 SMBus Device Address Not Acknowledged Error204.4.2 SMBus Device Signals An Error204.4.3 SMBus Controller Detected Error204.4.4 SMB-BIOS Detected Error20 APPENDIX A - SMB EXTENSION FUNCTION SUMMARY21 APPENDIX B - FIRMWARE ERROR CODES22 SMB Error Descriptions22 (00H or 80H) SMBus OK22(01H) Real Mode Connection Already Established22 (02H) 16-bit Protected Mode Connection Already Established22 (03H) 32-bit Protected Mode Connection Already Established22 (04H) SMBus Not Connected22 (05H) SMBus Int 15H Disabled22 (06H) SMBus Address Request Out Of Range22 (07H) SMBus Unknown Failure22 (08H) SMBus Message List Empty22 (09H) SMBus Message List Overflow22 (0AH) SMBus Invalid Signature23 (10H) SMBus Device Address Not Acknowledged23 (11H) SMBus Device Error Detected23 (12H) SMBus Device Command Access Denied23 (13H) SMBus Unknown Error23 (14H) SMBus Transaction Pending23 (15H) SMBus No Transaction Pending23 (16H) SMBus Request does not Match Pending Transaction23 (17H) SMBus Device Access Denied23 (18H) SMBus Timeout23 (19H) SMBus Host Unsupported Protocol24 (1AH) SMBus Busy24 (1BH) SMBus SMI Detected24 (86H) SMBus BIOS Interface Not Supported24SMB Error Code Groupings25SMB Specific Errors25SMB Specific Errors (cont)26 APPENDIX C - EXAMPLE CODE FRAGMENTS27SMBus Installation Check27Real Mode Connect27SMBus 16-Bit Connect28SMBus 32-Bit Connect29SMBus ReadWord/WriteWord (SB AtRate function)30SMBus BlockRead (SB ManufacturerName function)32SMBus BlockWrite33SMBus Disconnect34SMBus Device Address (Get a list of the SMBus devices present)34REVISION HISTORYRevision Number Date Notes1.02/15/95General ReleaseDO WE NEED THIS BLANK PAGE ?1.IntroductionThe System Management Bus BIOS Interface Specification presents a standardized BIOSinterface to devices on the SMBus. It exposes the SMBus to device drivers and applicationprograms. In some instances, detailed information can be retrieved directly from a device likethe Smart Battery, but in others, such as a Power Plane Controller (a device that selectively turns on and off power to devices on the system board), the BIOS may deny direct access.The drawing below illustrates a typical SMBus system featuring an SMBus Host, Smart Battery, Smart Battery Charger and other SMBus devices such as an LCD Backlight Controller, PowerPlane Controller etc.SMBus Interface1.1ScopeThis BIOS specification is designed to abstract the hardware implementation of the SMBus and expose the SMBus in a standardized way to higher layers of software. Software will not need to directly manipulate bits and bytes on the SMBus and is effectively isolated from needing to know about that process. System implementation of the SMBus and how the BIOS communicates with that implementation are NOT described by this specification. BIOS interaction with devices on the bus are also outside the scope of this document.1.2AudienceThe audience for this document includes:•Implementors of SMBus BIOS interface•Designers of device drivers for SMBus devices such as Smart Batteries, Smart Battery Chargers, Smart Battery Selectors and other SMBus devices•Designers of power management systems for portable electronic equipment powered by Smart Batteries and other SMBus Devices• Application Programmers2.References•Advanced Power Management BIOS Interface Specification v1.1, IntelCorporation/Microsoft Corporation, September 1993•Smart Battery Data Specification Revision v1.0, Duracell Inc./Intel Corporation, February, 1995•System Management Bus Specification Revision v1.0, Intel Corporation, February, 19953.Definitions•APM: Advanced Power Management. A BIOS interface defined to coordinate system-wide power management control via software.•Smart Battery: A battery equipped with specialized hardware that can provide present state, calculated, and predicted information about the battery to an SMBus Host under softwarecontrol. The access methodology to this data is described by this specification. The datacontent and protocol are defined in the Smart Battery Data Specification and the SystemManagement Bus Specification.•Smart Battery Charger: A battery charger that is designed to periodically communicate with and charge a Smart Battery. It is capable of dynamically adjusting its chargingcharacteristics in response to the information provided by the Smart Battery.•Smart Battery Selector: A SMBus device that selects which battery is connected to the charger, which battery is powering the system, and which battery is communicating with theSMBus host.•SMBus Device: An electronic device or module that communicates via the SMBus with an SMBus Host and/or other SMBus Devices. For example, an LCD Backlight Controller in anotebook computer can be implemented as a SMBus Device.•SMBus: The System Management Bus is a specific implementation of an I²C bus. The SMBus specification (see references) describes the data protocols, device addresses, andelectrical requirements that are superimposed on the I²C bus specification. The SMBus isused to physically transport commands and information between the Smart Battery, SMBusHost, Smart Battery Charger, and other SMBus Devices.•SMBus Host: A system that communicates with SMBus devices. It usually will embody some or all of a system's power management control. To accomplish this, it communicateswith the Smart Battery and uses that information in executing its power management policy.4.SMBus BIOS InterfaceThe SMBus BIOS interface provides a mechanism for device drivers, the OS, and applicationsoftware to access some or all of the SMBus devices and in particular, the Smart Battery System.Exactly which devices are exposed and the extent of that exposure falls in the domain of thesystem BIOS designer and is beyond the scope of this specification.4.1SMBus Driver Connection and Calling InterfaceThe SMBus BIOS Interface provides both real and protected mode calling interfaces.A real mode (Int 15H) SMBus BIOS Interface is required for all implementations. This defaultor not-connected interface uses the SMBus Access command code (53B0H) and the existing 15H BIOS interface. The SMBus BIOS Int 15H interface must operate in either real mode or virtual-86 mode on 80386 and later processors. Note: this document will refer to the real mode Int 15Hinterface as simply Int 15H. The Int 15H interface will be disabled except as noted whenever any connection exists.It is required that support for 16-bit protect mode and 32-bit protect mode be provided; supportfor the real mode connection is optional. The SMBus BIOS interface, when connected, isaccessed by calling through the real mode or protected mode entry points returned by the SMBus Real Mode Connect, 16-Bit Connect, and SMBus 32-Bit Connect calls. Note: this document will refer to the connected modes collectively as the Connected Mode.Note: The contents of the resisters used by BOTH the successful and unsuccessful return may be altered. The contents of the registers used to call a function may also be altered. The contents of all other registers will remain unaltered.This call allows the SMBus caller to determine if a system's BIOS supports the SMBus BIOS Interface and if so, which version of the specification it supports. The values passed in BL and CX are required to uniquely identify a legitimate caller to the SMBus BIOS Interface and, if not present, will result in an SMBus invalid signature error.The version number returned by this call is the highest level of SMBus BIOS Interface specification supported by the SMBus BIOS.The vendor-specified hardware code may be optionally used to identify the SMBus host hardware. If this feature is not used, it must return zero. This return code may be used by operating systems that do not want to use the BIOS services, but rather want to identify and communicate directly with the hardware.Call WithAX=53B0H SMBus AccessBH=01H SMBus Installation CheckBL=72HCH=61HCL=64HReturnsIf function successful:Carry=0SMBus is supported by BIOSAH=01H SMBus BIOS Interface Specification majorversion number (in BCD format)AL=00H SMBus BIOS Interface Specification minorversion number (in BCD format)BL=Number of SMBus Devices PresentCH=ASCII "i" character (69H)CL=ASCII "A" character (41H)DX=Vendor Specified SMBus Hardware Code0000H indicates undefined hardwareIf function unsuccessful:Carry=1AH=Error code0AH SMBus invalid signature86H SMBus not supportedSupportedmodesInt 15H only (this function is always available)This call allows an SMBus caller to connect to the SMBus BIOS Interface in real mode. This function returns the appropriate entry points into the SMBus BIOS.The SMBus BIOS rejects an interface connect request if a connection already exists. When the SMBus BIOS interface is connected in any mode, the default Int 15H interface will be disabled.Call WithAX=53B0H SMBus AccessBH=02H SMBus Real Mode ConnectCH=ASCII "i" character (69H)CL=ASCII "A" character (41H)ReturnsIf function successful:Carry=0AX=SMBus 16-bit code segment (real mode segmentbase address)BX=Offset of entry point into the SMBus BIOSInterfaceCX=SMBus 16-bit data segment (real mode segmentbase address)If function unsuccessful:Carry=1AH=Error code01H SMBus connect failed02H SMBus already connected0AH SMBus invalid signature86H SMBus not supportedAL=If Error Code = 02H01H Real mode connect already established02H 16-bit connect already established03H 32-bit connect already established SupportedmodesInt 15H only (this function is always available)4.1.3SMBus 16-Bit Connect (03H)This call allows an SMBus caller to connect to the SMBus BIOS Interface in 16-bit protect mode.This function returns the appropriate entry points into the SMBus BIOS.The SMBus BIOS rejects an interface connect request if a connection already exists. The default SMBus BIOS Interface Int 15H real mode interface will be disabled when a protected modeconnection is established.Call WithAX=53B0H SMBus AccessBH=03H SMBus 16-bit ConnectCH=ASCII "i" character (69H)CL=ASCII "A" character (41H)ReturnsIf function successful:Carry=0AX=SMBus 16-bit code segment (real mode segmentbase address)BX=Offset of entry point into the SMBus BIOSInterfaceCX=SMBus 16-bit data segment (real mode segmentbase address)SI=CSeg length in bytesDI=DSeg length in bytesIf function unsuccessful:Carry=1AH=Error code01H SMBus connect failed02H SMBus already connected0AH SMBus invalid signature86H SMBus not supportedAL=If Error Code = 02H01H Real mode connect already established02H 16-bit connect already established03H 32-bit connect already establishedSupportedmodesInt 15H only (this function is always available)Comments:To use the SMBus BIOS 16-bit protected mode interface after the connection is in effect requires the caller to set up two selector descriptor entries in either the GDT or LDT. These selectors must be in consecutive order and must come in the sequence: 16-bit code segment, then data segment. The calling code must build the descriptors using the corresponding segment base and segment length information returned from this call. At the time the SMBus BIOS is called, these descriptors must be valid and CPL=0. The code descriptors must also specify a ring-0 privilege level.The caller builds a far pointer to the SMBus BIOS 16-bit entry point using the 16-bit code selector and the offset returned in BX from this call. Subsequent calls to the SMBus BIOS are performed by loading the appropriate registers and doing a far call to this constructed 16-bit entry point. The calling software must provide a 16-bit stack that is large enough to handle any use by the BIOS plus handle any possible interrupts that occur.4.1.4SMBus 32-Bit Connect (04H)This call allows an SMBus caller to connect to the SMBus BIOS Interface in 32-bit protected mode. This function returns the appropriate entry points into the SMBus BIOS.The SMBus BIOS rejects an interface connect request if any real or protected mode connection already exists. The default SMBus BIOS Interface Int 15H real mode interface will be disabled when a protected mode connection is established.Call WithAX=53B0H SMBus AccessBH=04H SMBus 32-bit ConnectCH=ASCII "i" character (69H)CL=ASCII "A" character (41H)ReturnsIf function successful:Carry=0AX=SMBus 32-bit code segment (real mode segmentbase address)EBX=Offset of the 32-bit code entry point into theSMBus BIOSCX=SMBus 16-bit code segment (real mode segmentbase address)DX=SMBus data segment (real mode segment baseaddress)SI=32-bit CSeg length in bytesDI=DSeg length in bytesIf function unsuccessful:Carry=1AH=Error code01H SMBus connect failed02H SMBus already connected0AH SMBus invalid signature86H SMBus not supportedAL=If Error Code = 02H01H Real mode connect already established02H 16-bit connect already established03H 32-bit connect already establishedSupportedmodesInt 15H only (this function is always available)Comments:To use the SMBus BIOS 32-bit protected mode interface after the connection is in effect requires the caller to set up three selector descriptor entries in either the GDT or LDT. These selectors must be in consecutive order and must come in the sequence: 32-bit code, 16-bit code, then data segment. The calling code must build the descriptors using the corresponding segment base and segment length information returned from this call. At the time the SMBus BIOS is called, these descriptors must be valid and CPL=0. The code descriptors must also specify ring-0 privilege level. A 16-bit code segment is also given, so that the SMBus BIOS may call 16-bit code from the 32-bit interface if required.The caller builds a far pointer to the SMBus BIOS 32-bit entry point using the 32-bit code selector and the offset returned in EBX from this call. Subsequent calls to the SMBus BIOS are performed by loading the appropriate registers and doing a far call to this constructed 32-bit entry point. The calling software must provide a 32-bit stack that is large enough to handle any use by the BIOS plus handle any possible interrupts that occur.4.1.5SMBus Disconnect (05H)This call allows the connected SMBus caller to disconnect from the SMBus BIOS Interface. The connection may be disconnected only by the connected driver calling with these defined values into the SMBus BIOS interface. The default SMBus BIOS Int 15H real mode interface will be re-enabled when the connection is terminated.Call WithAX=53B0H SMBus AccessBH=05H SMBus DisconnectCH=ASCII “i” character (69H)CL=ASCII “A” character (41H)ReturnsIf function successful:Carry=0AH=00H SMBus OKIf function unsuccessful:Carry=1AH=Error code04H SMBus not connected05H SMBus Int 15H Disabled0AH SMBus invalid signature86H SMBus not supportedSupportedmodesConnected Mode onlyThis call allows the SMBus caller to create a complete list of the SMBus device addresses present in the system. This call does NOT return the reserved SMBus device addresses. It will return the addresses of all SMBus devices, including those that the BIOS restricts access to. This call is used repetitively until the caller gets the addresses of all the SMBus devices that are present in the system. Note: This call will only return the one address per device. The least significant bit of the address is a read/write bit; so for example, if 0x16 is returned, then the device may respond at both addresses 0x16 AND 0x17.This function may be used by systems that share a common I2C controller for both the SMBus and ACCESS.bus. Since ACCESS.bus dynamically assigns addresses, it needs to know which addresses are already in use. This function provides the ACCESS.bus host a list of addresses to pre-load its "address-in-use" table.Call WithAX=53B0H SMBus AccessBH=06H SMBus Device ListBL=xxH Address at position (0...n-1)CH=ASCII “i” character (69H)CL=ASCII “A” character (41H)ReturnsIf function successful:Carry=0AH=00H SMBus OKBH=Number of SMBus DevicesBL=SMBus Device Address at list position xxHIf function unsuccessful:Carry=1AH=Error code06H SMBus device address request out of range0AH SMBus invalid signature86H SMBus not supportedSupportedmodesInt 15H (this function is always available) and Connected ModeThis call allows the SMBus caller to retrieve SMBus device-to-SMBus host messages. These messages are stored in a queue that is at least five (three-byte) messages long. Each successful invocation of this call returns and removes the oldest remaining message from the message queue.If the message queue overflows, the oldest message will be lost and the call will return a Message List Overflow error. The caller still needs to retrieve the remaining messages.Call WithAX=53B0H SMBus AccessBH=07H SMBus Critical MessagesCH=ASCII “i” character (69H)CL=ASCII “A” character (41H)ReturnsIf function successful:Carry=0AH=00H SMBus OKAL=SMBus Device AddressBX=SMBus Device MessageIf function unsuccessful:Carry=1AH=Error code05H SMBus Int 15H Disabled07H SMBus unknown failure08H SMBus message list empty09H SMBus message list overflow0AH SMBus invalid signature86H SMBus not supportedSupportedmodesInt 15H and Connected Mode4.2SMBus Device Command ProtocolsThe following are commands that are used to read data from or write data to SMBus devices.The SMBus Host acts as a master and the target SMBus Device as a slave.Note: In the following descriptions, xxH means a value is required when calling the SMBusBIOS and nnH means the BIOS returns a value.The SMBus BIOS access is a two-phase process. Separating the request from the response allows drivers access to the relatively slow SMBus devices without seriously impacting systemperformance. For example, a Smart Battery may take over 30 ms to respond to a command.Waiting for a BIOS return during this time might seriously impact system performance.4.2.1SMBus Request (10H)This command requests access to a device on the SMBus. This command, in conjunction withthe SMBus Request Continuation command, is used to request access to the SMBus for allSMBus protocols. The SMBus Command Complete call is (repeatedly) used to determine if and when the SMBus command has been completed and to gather the results of the pending SMBustransaction. Note: for the SMBus protocol BlockWrite, DH (MSB) will contain the block length and DL (LSB) will contain the first byte in the block. Refer to tables 4.2.5 and 4.2.6.Call WithAX=53B0H SMBus AccessBH=10H SMBus Request CommandBL=xxH SMBus ProtocolCH=xxH SMBus Device AddressCL=xxH SMBus Device CommandDH=xxH MSB dataDL=xxH LSB dataReturnsIf function successful:Carry=0AH=00H, 80H SMBus OK - the high bit set indicates apreviously unreported SMI has taken place.If function unsuccessful:Carry=1AH=Error code05H SMBus Int 15H Disabled10H SMBus Device Address Not Acknowledged11H SMBus Device Error Detected12H SMBus Device Command Access Denied13H SMBus Unknown Error14H SMBus Transaction Pending17H SMBus Device Access Denied19H SMBus Protocol not Supported1AH SMBus Busy86H SMBus not supportedSupportedmodesInt 15H and Connected Mode4.2.2SMBus Request Continuation (11H)This command is used to continue requesting access to the SMBus for the SMBus write blockprotocol. Refer to tables 4.2.5 and 4.2.7 for specific values. See the examples in Appendix C for more details.Call WithAX=53B0H SMBus AccessBH=11H SMBus Request Continuation CommandBL=xxH SMBus ProtocolCH=xxH SMBus Device AddressCL=xxH number of valid bytes in DX (1 or 2)DH=xxH MSB data(CL = 1 or 2)DL=xxH LSB data(CL = 2)ReturnsIf function successful:Carry=0AH=00H SMBus OKCL=00H SMBus Hardware not ready for more data01H SMBus Hardware ready for 2 more data bytesIf function unsuccessful:Carry=1AH=Error code05H SMBus Int 15H Disabled11H SMBus Device Error Detected13H SMBus Unknown Error15H SMBus No Transaction Pending16H SMBus Request does not Match Pending Transaction18H SMBus Timeout1BH SMBus SMI detected86H SMBus not supportedSupportedmodesInt 15H and Connected Mode4.2.3SMBus Request Abort (12H)This command stops the current SMBus request. This command is used normally to terminate a pending request after an SMBus SMI Detected error (1BH) is noted. However, it may be used to terminate any pending request. Refer to tables 4.2.5 and 4.2.8 for specific values. See theexamples in Appendix C for more details.Call WithAX=53B0H SMBus AccessBH=12H SMBus Request Abort CommandBL=xxH SMBus ProtocolCH=xxH SMBus Device AddressCL=xxH SMBus Device CommandReturnsIf function successful:Carry=0AH=00H SMBus OKIf function unsuccessful:Carry=1AH=Error code05H SMBus Int 15H Disabled13H SMBus Unknown Error15H SMBus No Transaction Pending16H SMBus Request does not Match Pending Transaction86H SMBus not supportedSupportedmodesInt 15H and Connected Mode4.2.4SMBus Request Data and Status (13H)The SMBus Request Data and Status call is used to determine if and when a SMBus transaction has been completed. When this call is made, the BIOS will go out to the hardware and if anydata is available, gather it one or two bytes at a time from the SMBus interface device beforereturning. This command will be repeated until all the data available is retrieved or an errordetected. Note: for all SMBus protocols except BlockRead, the data is atomic and must bereturned in one call. (For example, a ReadWord command must return both bytes in the samecall.) For the BlockRead protocol, the first call to this service will return the block length in DH and the first byte of the block in DL, if CL=2. For subsequent calls the next most significant data byte will be returned in DH and least significant data byte in DL (if CL = 2). Refer to tables4.2.5 and 4.2.9 for specific values. See the examples in Appendix C for more details.Call WithAX=53B0H SMBus AccessBH=13H SMBus Request Complete CommandBL=xxH SMBus ProtocolCH=xxH SMBus Device AddressCL=xxH SMBus Device CommandReturnsIf function successful:Carry=0AH=00H SMBus OKCH=nnH00H No data pending, transaction complete01H No data pending, transaction continues02H Data pendingCL=nnH Number of valid bytes in DX (0 ... 2)DH=nnH MSB dataDL=nnH LSB dataIf function unsuccessful:Carry=1AH=Error code05H SMBus Int 15H Disabled10H SMBus Device Address Not Acknowledged11H SMBus Device Error Detected13H SMBus Unknown Error14H SMBus Transaction Pending15H SMBus No Transaction Pending16H SMBus Request does not Match Pending Transaction18H SMBus Timeout1BH SMBus SMI detected86H SMBus Not SupportedSupportedmodesInt 15H and Connected Mode4.2.5SMBus Protocol CodesThe following table lists the valid SMBus protocol codes:SMBus Protocol CodeQuick Command00HSend Byte01HReceive Byte02HWrite Byte03HRead Byte04HWrite Word05HRead Word06HBlock Write07HBlock Read08HProcess Call09Hreserved0AH ...FFH4.2.6SMBus Request - Protocol Register RequirementsThe following table lists the registers used by an SMBus Request call for each SMBus protocol:SMBus Protocol AX BH BL CH CL DH DL Quick Command53B0H10H00H Addr n/a n/a n/a Send Byte53B0H10H01H Addr n/a n/a data Receive Byte53B0H10H02H Addr n/a n/a n/a Write Byte53B0H10H03H Addr Cmd n/a data Read Byte53B0H10H04H Addr Cmd n/a n/a Write Word53B0H10H05H Addr Cmd MSB LSB Read Word53B0H10H06H Addr Cmd n/a n/a Block Write53B0H10H07H Addr Cmd len db1 Block Read53B0H10H08H Addr Cmd n/a n/a Process Call53B0H10H09H Addr Cmd MSB LSB 4.2.7SMBus Request Continuation - Protocol Register RequirementsThe following table lists the registers used by an SMBus Request Continuation for each SMBusprotocol call:SMBus Protocol AX BH BL CH CL DH DL Quick Command n/a n/a n/a n/a n/a n/a n/a Send Byte n/a n/a n/a n/a n/a n/a n/a Receive Byte n/a n/a n/a n/a n/a n/a n/a Write Byte n/a n/a n/a n/a n/a n/a n/a Read Byte n/a n/a n/a n/a n/a n/a n/a Write Word n/a n/a n/a n/a n/a n/a n/a Read Word n/a n/a n/a n/a n/a n/a n/a Block Write53B0H11H07H Addr 1 or 2db n db n+1 Block Read n/a n/a n/a n/a n/a n/a n/a Process Call n/a n/a n/a n/a n/a n/a n/a。

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SPIE-法国

Media PartnerPhotonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 4747 12 Photonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 4747SPIE Europe thanks the following sponsorsfor their generous supportAttendee Pens Stand #511www.micos.wsCoffee Breaks Stand #420www.klastech.deConference Bags Stand #Exhibitor Lounge Stand #Lanyards Stand #Pastries Stand #511www.micos.wsVertical Banner Stand #231www.hamamatsu.frExhibitor list as of 3 March 2008.AMA Association for Sensor Technology. . . . #209A.T. Wall Company. . . . . . . . . . . . . . . . . . . . . #224AFOP - French Optics and PhotonicsManufacturers Association . . . . . . . . . . . . #124AHF analysentechnik AG . . . . . . . . . . . . . . . . #316Alcatel Thales III V Lab. . . . . . . . . . . . . . . . . . #329AT -Fachverlag GmbH. . . . . . . . . . . . . . . . . . . #534Avantes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #232Becker & Hickl GmbH . . . . . . . . . . . . . . . . . . #405Bookham . . . . . . . . . . . . . . . . . . . . . . . . . . . . #317Breault Research Organization. . . . . . . . . . . . #117Brush Ceramic Products . . . . . . . . . . . . . . . . #104Carl Hanser Verlag . . . . . . . . . . . . . . . . . . . . . #530Cedrat Technologies. . . . . . . . . . . . . . . . . . . . #118CEIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #323CILAS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #416Conerefringent Optics SL. . . . . . . . . . . . . . . . #508Crystal Fibre. . . . . . . . . . . . . . . . . . . . . . . . . . #306CST - Computer Simulation Technology . . . . #226CVI Melles Griot Ltd. . . . . . . . . . . . . . . . . . . . #507Draka . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #230EDP Sciences. . . . . . . . . . . . . . . . . . . . . . . . . #532EKSPLA Co.. . . . . . . . . . . . . . . . . . . . . . . . . . #330Electro Optics Magazine . . . . . . . . . . . . . . . . #430Consortium. . . . . . . . . . . . . . . . . . . . . . . . . . . #331ePIXnet. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #431Epner Technology, Inc.. . . . . . . . . . . . . . . . . . #423EQ Photonics GmbH . . . . . . . . . . . . . . . . . . . #223ET Enterprises Ltd . . . . . . . . . . . . . . . . . . . . . #328European Optical Society. . . . . . . . . . . . . . . . #536EuroPhotonics . . . . . . . . . . . . . . . . . . . . . . . . #100Fibercore Ltd.. . . . . . . . . . . . . . . . . . . . . . . . . #515Fibercryst . . . . . . . . . . . . . . . . . . . . . . . . . . . . #426FiberTech Optica Inc.. . . . . . . . . . . . . . . . . . . #415Fischer Connectors . . . . . . . . . . . . . . . . . . . . #122Flexible Optical BV. . . . . . . . . . . . . . . . . . . . . #514FRAMOS GmbH. . . . . . . . . . . . . . . . . . . . . . . #106Frank Optic Products GmbH . . . . . . . . . . . . . #105Fraunhofer Heinrich Hertz Institut . . . . . . . . . #321Fujian CASTECH Crystals, Inc. . . . . . . . . . . . #501Gorman-Rupp Industries . . . . . . . . . . . . . . . . #413GWU-Lasertechnik GmbH . . . . . . . . . . . . . . . #501Hamamatsu . . . . . . . . . . . . . . . . . . . . . . . . . . #231HC Photonics Corp . . . . . . . . . . . . . . . . . . . . #501Heptagon . . . . . . . . . . . . . . . . . . . . . . . . . . . . #521HOLOEYE Photonics AG . . . . . . . . . . . . . . . . #309HORIBA Jobin Yvon SAS. . . . . . . . . . . . . . . . #327id Quantique SA. . . . . . . . . . . . . . . . . . . . . . . #405Impex HighTech GmbH . . . . . . . . . . . . . . . . . #411Innolume GmbH. . . . . . . . . . . . . . . . . . . . . . . #115Institut d’Optique Graduate School . . . . . . . . #437International Society for Stereology. . . . . . . . #529iXFiber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #126KERDRY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . #120Kimoga Material Technology Co., Ltd.. . . . . . #520KLASTECH. . . . . . . . . . . . . . . . . . . . . . . . . . . #420Laser Components GmbH. . . . . . . . . . . . . . . #220Laser Focus World . . . . . . . . . . . . . . . . . . . . . #414Laser Zentrum Hannover e.V . (LZH). . . . . . . . #505LEONI Fiber Optics GmbH. . . . . . . . . . . . . . . #406Leukos . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #123LINOS Photonics France . . . . . . . . . . . . . . . . #307Lovalite. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #121Lumera Laser GmbH . . . . . . . . . . . . . . . . . . . #310Lumerical Solutions, Inc. . . . . . . . . . . . . . . . . #121M.C.S.E.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . #128Mad City Labs, Inc. . . . . . . . . . . . . . . . . . . . . #214Materials Today . . . . . . . . . . . . . . . . . . . . . . . #435Menlo Systems GmbH. . . . . . . . . . . . . . . . . . #517Exhibitor ListPhotonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 47473T Advertiser Index Alcatel Thales III-V Lab. . . . . . . . . . . . . . . . . . . . . . . . . . . p. 11CVI Melles Griot Ltd. . . . . . . . . . . . . . . . . . . . . . . . . . . Cover 4ET Enterprises Ltd.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . p. 23EPIC—European Photonics Industry Consortium . . . . . . p. 13KLASTECH—Karpushko Laser Technologies . . . . . . . . . p. 19LINOS Photonics France . . . . . . . . . . . . . . . . . . . . . . . . . p. 17Photoniques. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . p. 5RSoft Design Group. . . . . . . . . . . . . . . . . . . . . . . . . . . Cover 2Space Light srl . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . p. 21Exhibition Floor PlanMesse Stuttgart . . . . . . . . . . . . . . . . . . . . . . . #524MICOS GmbH . . . . . . . . . . . . . . . . . . . . . . . . #511Nature Publishing Group . . . . . . . . . . . . . . . . #208NEMO (Network of Excellence onMicro-Optics). . . . . . . . . . . . . . . . . . . . . . . #217New Focus, Inc. . . . . . . . . . . . . . . . . . . . . . . . #317Newport Spectra-Physics . . . . . . . . . . . . . . . #205NEYCO. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #212NIL Technology. . . . . . . . . . . . . . . . . . . . . . . . #125NP Photonics . . . . . . . . . . . . . . . . . . . . . . . . . #501Nufern. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #428NuSil Technology . . . . . . . . . . . . . . . . . . . . . . #525Ocean Optics . . . . . . . . . . . . . . . . . . . . . . . . #110OLLA Project . . . . . . . . . . . . . . . . . . . . . . . . . #429Omega Optical, Inc.. . . . . . . . . . . . . . . . . . . . #107OpTIC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #333Optics & Laser Europe . . . . . . . . . . . . . . . . . . #312Optics Pages . . . . . . . . . . . . . . . . . . . . . . . . . #527OptiGrate . . . . . . . . . . . . . . . . . . . . . . . . . . . . #510Optima Research . . . . . . . . . . . . . . . . . . . . . . #131OptoIndex. . . . . . . . . . . . . . . . . . . . . . . . . . . . #531Opton Laser International. . . . . . . . . . . . . . . . #130Optronis GmbH . . . . . . . . . . . . . . . . . . . . . . . #216OXXIUS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #304Phoenix BV. . . . . . . . . . . . . . . . . . . . . . . . . . . #315Photon Design . . . . . . . . . . . . . . . . . . . . . . . . #204Photonex 2008. . . . . . . . . . . . . . . . . . . . . . . . #527Photonic Cleaning Technologies . . . . . . . . . . #421Photonics 4 Life - Network of Excellence . . . #427Photonics Spectra - Laurin Publishing. . . . . . #100Photonik Zentrum Hessen in Wetzlar AG. . . . #222Physik Instrumente (PI) GmbH & Co.. . . . . . . #308Point Source. . . . . . . . . . . . . . . . . . . . . . . . . . #113Quantel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #305Raicol Crystals Ltd. . . . . . . . . . . . . . . . . . . . . #206Rhenaphotonics Alsace . . . . . #533, 535, 537, 539Royal Society of Chemistry . . . . . . . . . . . . . . #541RSoft Design Group. . . . . . . . . . . . . . . . . . . . #320RSP Technology BV . . . . . . . . . . . . . . . . . . . . #424Santec Europe Ltd.. . . . . . . . . . . . . . . . . . . . . #409Scientec . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #412SEDI Fibres Optiques. . . . . . . . . . . . . . . . . . . #313SEMELAB PLC. . . . . . . . . . . . . . . . . . . . . . . . #109Sill Optics GmbH & Co., KG. . . . . . . . . . . . . . #221SIOF-Italian Society of Optics and Photonics #516Space Light srl . . . . . . . . . . . . . . . . . . . . . . . . #518Spectroscopy Magazine. . . . . . . . . . . . . . . . . #433SphereOptics GmbH . . . . . . . . . . . . . . . . . . . #504Spiricon GmbH. . . . . . . . . . . . . . . . . . . . . . . . #419Springer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #211Stanford Computer Optics GmbH . . . . . . . . #114bTaylor & Francis - Contemporary Physics . . . #528Taylor & Francis - Fiber and Integrated Optics #528Taylor & Francis - Informa UK Ltd.. . . . . . . . . #528Taylor & Francis - International Journal ofOptomechatronics. . . . . . . . . . . . . . . . . . . #528Taylor & Francis - Journal of Modern Optics . #528THALES Laser . . . . . . . . . . . . . . . . . . . . . . . . #506The Institution of Engineering andTechnology (IET) . . . . . . . . . . . . . . . . . . . . #425Thorlabs GmbH . . . . . . . . . . . . . . . . . . . . . . . #517TSP Diffusion . . . . . . . . . . . . . . . . . . . . . . . . . #417UCM AG. . . . . . . . . . . . . . . . . . . . . . . . . . . . . #116Unice E-O Services Inc.. . . . . . . . . . . . . . . . . #422Universal Photonics, Inc. . . . . . . . . . . . . . . . . #207VTT Technical Research Centre of Finland. . . #129Wiley-VCH GmbH & Co. KGaA . . . . . . . . . . . #523Xiton Photonics GmbH. . . . . . . . . . . . . . . . . . #501XLITH GmbH . . . . . . . . . . . . . . . . . . . . . . . . . #432Yole Développement . . . . . . . . . . . . . . . . . . . #225ZODIAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #322Photonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 4747 5The French magazine specializing in Optics-Photonics Photoniques :the magazine of theFrench Optical CommunityPhotoniques,magazine of the French OpticalSociety,establishes links and partnerships betweenall the entities working in Optics-Photonics :at national level with AFOP (French ManufacturersAssociation in Optics and Photonics)and in eachregion of France.Photoniques :The source of information for all the professionals in thefield of Optics-Photonics in France.In each issue :industry news,technical articles written by specialists,new products…A useful and efficient circulation :7500copiesAfter 7years of existence,cooperation and networking withthe specialists of the optic world in France,Photoniques hasbuilt a large qualified database of potential users :researchers,technicians,engineers and managers,fromindustry such as communications,industrial vision,lasers,test and measurements,imaging/displays…Are you interested in the French optics and photonics markets?Photoniques is your partner!How to keep you informed about Optics-Photonics in France?Become a Photoniques reader!123For additionnal information,contact:Olga Sortais :+33134042144o.sortais@ to request an issue of Photoniques and a media kit6 Photonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 4747As a new addition to Photonics Europe, the Industry PerspectivesProgramme will provide a series of executive brieﬁ ngs coveringkey technologies and sectors.Come hear key members of Europe’s photonics industrydiscuss their successes, future plans and the way in which theyintend to maximize their market penetration and growth. Hearreviews of the European Innovation landscape highlightinggeographical areas of strengths in areas such as business R&D,knowledge transfer and demonstrate the outcomes from recentsuccessful European-funded industry programmes.Industry Perspectives Programme Included with Conference registration.Individual Sessions can be purchased at the Cashier. Individual sessions, €100. The sessions will deliver a strategic perspective into each application area, allowing you to uncover and confirm the future prospects for your business. Benchmark your aspirations for your business and technology against some of Europe’s leading companies and engage with them as a potential supplier or partner. You will hear presentations from Philips, Audi, PCO, Coherent Scotland, GlaxoSmithKline, Carl Zeiss, Yole Development, Koheras and Fraunhofer on their successes and strategic priorities. Tuesday 8 April Morning SessionPhotovoltaics10.15 to 10.45 hrs.Photovoltaics - Market and Technology TrendsGaëtan Rull, Market Analyst for New Energy Technologies,Yole Développement 10.45 to 11.15 hrs.High Throughput Manufacturing for BulkHeterojunction PVsMarkus Scharber, Head of Materials Group, Konarka 11.15 to 11.45 hrs.Managing JGrowth in the Production of Thin Films(To be conﬁ rmed.)Dr. Immo Kotschau, Director of Research and Development,Centrotherm GmbH 11.45 to 12.30 hrs.End to End Mass Production of Silicon Thin FilmModulesDetlev Koch, Head of BU Solar Thin Films & Senior Vice President,O C Oerlikon Balzers AG Break – 12.30 to 14.00 hrs.Afternoon SessionMEMS/MOEMS14.00 to 14.30 hrs.Market Trends and Technical Advances in M(O)EMSDr. Eric Mounier, Manager for MEMS & Optoelectronics andMicronews Chief Editor, Yole Développement14.30 to 15.00 hrs.Inorganic/Organic Hybrid Polymers (ORMOCER) forOptical InterconnectsDr. Michael Popall, Head of Microsystems and Portable PowerSupply, Fraunhofer ISC15.00 to 15.30 hrs.Future MOEMS and Photonic MicrosystemsDr. Thomas Hessler, Director Axetris, Leister Process Technologies15.30 to 16.15 hrs.Innovations in MOEMS product developmentProf. Hubert Karl, Director, Fraunhofer IPMSWednesday 9 AprilMorning Session Multimedia, Displays and Lighting 10.15 to 10.45 hrs.Plasmonics for Photonics: Challenges and Opportunities Ross Stanley, Section Head: MOEMS & Nanophotonics, CSEM 10.45 to 11.15 hrs.Photonic Microsystems for Displays Edward Buckley, VP Business Development, Light Blue Optics Ltd.11.15 to 11.45 hrs.Matrix-Beam – the antiglaring LED-high beam Benjamin Hummel, Research for Concept Lighting T echnologies, Audi 11.45 to 12.30 hrs.High Brightness OLEDs for Next Generation LightingPeter Visser, Project Manager, OLLA Project, The Netherlands Break –12.30 to 14.00 hrs.Photonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 4747 7Thursday 10 AprilMorning SessionImaging10.15 to 10.45 hrs.High Resolution Imaging detectors for invisiblelight –Development and IndustrialisationHans Hentzell, CEO, Acreo10.45 to 11.15 hrs.(Presentation to be conﬁ rmed.)11.15 to 11.45 hrs.Raman Spectroscopy, Raman Imaging and FutureTrendsSopie Morel, Sales Manager, Molecular & Microanalysis Division,HORIBA Jobin Yvon 11.45 to 12.30 hrs.World Markets for Lasers and Their Application Steve Anderson, Associate Publisher/Editor-in-Chief,Laser Focus World Break – 12.30 to 14.00 hrs. Afternoon SessionBiomedical and Healthcare Photonics 14.00 to 14.30 hrs.Photonic Systems for Biotechnology Research Karin Schuetze, Director of R&D, Carl Zeiss Microimaging 14.30 to 15.00 hrs.Photonics 4 Life Prof. Jeürgen Popp, Director, IPHT Germany 15.00 to 15.30 ser System Development for Biophotonics Chris Dorman, Managing Director, Coherent Scotland15.30 to 16.15 hrs.Supercontinuum Light - a paradigm shift in lasersources for biophotonicsJakob Dahlgren Skov, CEO, Koheras Husain Imam, Business Development Manager, Koheras Industrial Perspectives ProgrammeWednesday 9 April Afternoon Session OPERA 2015: European Photonics - Corporate and Research Landscape 13.30 to 13.45 hrs.Optics and Photonics in the 7th Framework ProgrammeGustav Kalbe, Head of Sector - Photonics, Information Society andMedia, Directorate General, European Commission 13.45 to 14.00 hrs.OPERA 2015: Aims, Results and link to Photonics 21Markus Wilkens, VDI 14.00 to 14.20 hrs.European Photonics Industry Landscape Bart Snijders, TNO 14.20 to 14.40 hrs.European Photonics Research Landscape Marie-Joëlle Antoine, Optics Valley 14.40 to 15.00 hrs.Resources for Photonics Development Peter Van Daele, IMEC Break – 15.00 to 15.15 hrs. 15.15 to 15.35 hrs.Towards the Future on Optics and Photonics ResearchDr. Eugene Arthurs, SPIE Europe (UK)15.35 to 16.15 hrs.Strategic Opportunities for R&D in EuropeMike Wale, Bookham, UK16.15 to 16.45 hrs.A Sustainable Business Model for Optics andPhotonicsDavid Pointer, Managing Director, Point Source (Pending)16.45 to 17.15 hrs.Final Open DiscussionChaired by: Gustav Kalbe, Head of Sector - Photonics, InformationSociety and Media, Directorate General, European Commission8Photonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 4747Photonics Innovation Village Tuesday to Thursday during Exhibition HoursThe Photonics Innovation Village will showcase the latest projects and breakthroughs from optics-photonics researchers at universities, research centres and start-up companies. This is a great opportunity to see how EU R&D and project funds are being used by some of the great young innovators in Europe.A window on creative products developed by universities and research centres. Under the patronage of the European Commission, ﬁ fteen entrants from across Europe complete to win categories ranging from Best Marketability to Best Design, Best Technology, and Best Overall Product.Low power remote sensing system Y. A. Polkanov, Russia (Individual work)New approach is based on use of a low-power radiation source with speciﬁ ed gating, when time of source radiation interruption is equal to a pulse duration of ordinary lidar. We propose to reconstruct the average values of these characteristics over the parts commensurable with the sounding path length. As scanning systems is offered with speed of circular scanning is determined by time of small linear moving of a laser beam. It allows to predict a reduction of the meteorological situation stability from an anticipatory change of the revealed structure character of optical heterogeneities of a atmosphere ground layer atmosphere.Point of care sensor for non-invasive multi-parameter diagnostics of blood biochemistry Belarusian State University, Belarus; Ruhr-Universität-Bochum, Germany; Second Clinical Hospital, Belarus Compact ﬁ bre optical and thermal sensor for noninvasive measurement of blood biochemistry including glucose, hemoglobin and its derivatives concentrations is developed as a prototype of the point-of-care diagnosticdevices for cardiologic, tumour and diabetic patients. Integrated platform for data acquisition, data processing and communication to remote networks has been developed on the pocket PC.Polarization-holographic gratings and devices on their basisLaboratory of Holographic Recording & Processing of Information, Institute of Cybernetics, GeorgiaWe have developed the technology of obtaining of polarization-holographic gratings that have anisotropic proﬁ le continuously changing within each spatial period and also the technology of obtaining of polarization-holographic elements on the basis of such gratings. Special highly effective polarization-sensitive materials developed by us are used for obtaining such gratings and elements. We can present samples of gratings and elements and give a demonstration of their work.Ultra-miniature omni-view camera moduleImage Sensing group of the Photonics Division of CSEM (Centre Suisse d’Electronique et de Microtechnique), SwitzerlandA live demonstration with a working prototype of a highly integrated ultra-miniature camera module with omni-directional view dedicated to autonomous micro ﬂ ying devices is presented.Femtosecond-pulse ﬁ bre laser for microsurgery and marking applicationsMultitel, BelgiumMultitel presents a new prototype of an all-ﬁ bred femtosecond ampliﬁ ed laser. The device has been speciﬁ cally developed for micromachining and microsurgery applications and operates at 1.55µm, which corresponds to a high absorption peak of water (molecule contained in large quantity in living tissue and cells). Since no free-space optics is used for pulse compression or ampliﬁ cation the prototype is compact and very stable. Moreover, the seed laser source has a high repetition rate therefore enabling multiphoton absorption applications and use in multi-pulse and burst modes.Flexible artiﬁ cial optical robotic skinsDepartment of Applied Physics and Photonics (VUB-TONA) and Robotics & Multibody Mechanics Research Group (VUB-R&MM) of the Vrije Universiteit Brussel, Belgium; Thin Film Components Group (UG-TFCG) and Polymer Chemistry & Biomaterials Research Group (UG-PBM) of the Universiteit Gent, BelgiumWe will present a paradigm shifting application for optical ﬁ bre sensors in the domain of robotics. We propose ﬁ bre B ragg gratings (FB Gs) written in highly-birefringent microstructured optical ﬁ bres integrated in a ﬂ exible skin-like foil to provide a touch capability to a social pet-type robot for hospitalized children named “Probo”. The touch information is complementary to vision analysis and audio analysis and will be used to detect where Probo is being touched and to differentiate between different types of affective touches such as tickling, poking, slapping, petting, etc.Co-Sponsored by: Location: Galleri de Marbre Under the patronage of the European Commission, Photonics Unit Join us for the Photonics Innovation Village Awards 2008 which will take place on Wednesday, 9th April 2008, from 17.00 hrs. in the Galerie de Marbre.3D tomographic microscopeLauer Technologies, FranceThe 3D tomographic microscope generates 3D high-resolution images of non-marked samples. The demonstration will show 3D manipulation of images obtained with this microscope.Polar nephelometerInstitute of Atmospheric Optics of Tomsk, RussiaMaterial comprising a matrix, apatite and at least one europium composite compound with particle medium sizes more 4-5 micron. The composition for the production of the material comprises (wt. %) apatite 0.01-10.0; composite compound. 0.01-10.0, and the balance is a matrix-forming agent, such as a polymer, a ﬁbre, a glass-forming composition, or lacquer/adhesive-forming substance.High speed Stokes portable polarimeterMIPS Laboratory of the Haute Alsace University, FranceThe implementation of an imaging polarimeter able to capture dynamic scenes is presented. Our prototype is designed to work at visible wavelengths and to operate at high-speed (a 360 Hz framerate was obtained), contrary to commercial or laboratory liquid crystal polarimeters previously reported. It has been used in the laboratory as well as in a natural environment with natural light. The device consists of commercial components whose cost is moderate. The polarizing element is based on a ferroelectric liquid crystal modulator which acts as a half-wave plate at its design wavelength.Diffractive/refractive endoscopic UV-imaging system Institut für Technische Optik (ITO) of the University of Stuttgart, GermanyWe present a new optical system with an outstanding high performance despite of demanding boundary conditions of endoscopic imaging to enable minimal invasive laser-based measurement techniques. For this purpose the system provides a high lens speed of about 10 times the value of a conventional UV-endoscope, a multiple broad band chromatic correction and small-diameter but wide-angle access optics. This was realized with a new design concept including unconventional, i.e. diffractive components. An application are UV-LIF-measurements on close-to-production engines to speed up the optimization of the combustion and produce aggregates with less fuel consumption and exhaust gases like CO2.Light-converting materials and composition: polyethylene ﬁ lm for greenhouses, masterbatch, textile, sunscreen and aerosolUsefulsun Oy, Finland; Institute Theoretical and Experimental Biophysics Russian Academy of Sciences, RussiaThe composition for the production of the material comprises (wt. % ) composite compound (inorganic photoluminophore particles with sizes 10-800nm) -0.01-10.0; coordination compound of metal E (the product of transformation of europium, samarium, terbium or gadolinium ) - 0,0-10,0 and the balance is a matrix-forming agent, such as, a polymer, a ﬁ ber, a glass-forming composition or gel, aerosol, lacquer/adhesive-forming substance. The present invention relates to composite materials, in particular to light-converting materials used in agriculture, medicine, biotechnology and light industry.HIPOLAS - a compact and robust laser sourceCTR AG (Carinthian Tech Research AG), AustriaThe prototype covers a robust, compact and powerful laser ignition source for reciprocating gas and petrol engines that could be mounted directly on the cylinder.We have developed a diode pumped solid-state laser with a monolithic Neodymium YAG resonator core. A ring of 12 high power laser diodes pumps the resonator. Due to the adjustment-free design, the laser is intrinsically robust to environmental vibrations and temperature conditions. With overall dimensions of Æ 50 x 70 mm the laser head is small enough to be ﬁ tted at the standard spark plug location on the cylinder head. The dimensions can be reduced for future prototypes. OLLA OLED lighting tile demonstratorOLLA project-consortiumOLED technology is not only a display technology but also suited for lighting purposes. The OLLA project has the goal to demonstrate viability of OLED technology for general lighting applications. The demonstrator tile shown here combines the current results of the project : a large sized (15x15cm2) white OLED stack with high efﬁ cacy (up to 50 lm/W), combined with long lifetime (>10.000 hours).During Photonics Europe, we will show several OLEDs tiles in different colors. The demonstrators are made by the OLLA project-consortium members. The large OLED demonstrator tile was fabricated on the inline tool at Fraunhofer IPMS in Dresden.Analyze-IQNanoscale Biophotonics Laboratory, School of Chemistry,and Machine Learning / Data Mining Group, Department ofInformation Technology, National University of Ireland, Galway, IrelandAnalyze-IQ is the next generation spectral analysis software tool for optical and molecular spectroscopies such as Raman, Mid-IR, NIR, and Fluorescence. The Analyze-IQ software is based on patented machine-learning algorithms and a model based approach in which the software learns to recognise the relevant information in complex mixtures from sample spectra. It then uses these models to rapidly and accurately identify or quantify unknown materials such as narcotics and explosives, in complex mixtures commonly found in law-enforcement and industrial applications.Micro-optical detection unit for lab-on-a-chipDepartment of Applied Physics and Photonics (VUB-TONA) of the Vrije Universiteit Brussel, BelgiumWe present a detection unit for ﬂ uorescence and UV-VIS absorbance analysis in capillaries, which can be used for chromatography. By usinga micro-fabrication technology (Deep Proton Writing) the optics aredirectly aligned onto the micro-ﬂ uidic channel. This integration enables the development of portable and ultimately disposable lab-on-a-chip systems for point-of-care diagnosis. We will explain the working principle of our detection system in a proof-of-concept demonstration set-up while focusing on some speciﬁ c applications of micro-ﬂ uidics in low-cost lab-on-a-chip systems.Photonics Innovation Village。

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