CC3200模块资料

PRODUCT SPECIFICATIONIEEE 802.11 b/g/n 2.4GHz Internet-of-Things WiFi ModuleShenzhen AiDian Smart technology co., LTD.WFM-320(Ti CC3200) Single ModuleData Sheet V1.0(2014/12/09)Table of Contents1. Product Overview------------------------------------------------------------51.1 Extended Application-------------------------------------------------------72. Module Parameter-----------------------------------------------------------8 2.1 Basic Parameter------------------------------------------------------------8 2.2 Current Consumption------------------------------------------------------8 2.3 Receiver Characteristics----------------------------------------------------92.4 Transmitter Characteristics------------------------------------------------103. DVT Report-----------------------------------------------------------------114. Block Diagram--------------------------------------------------------------125. Pin Assignment on module------------------------------------------------126. Interface Specifications----------------------------------------------------147. Reference Circuit-----------------------------------------------------------168. Layout Guide---------------------------------------------------------------20 8.1 RF Section-----------------------------------------------------------------20 8.2 Antenna Placement and Routing-----------------------------------------208.3 Transmission Line---------------------------------------------------------229. Furnace temperature curve------------------------------------------------23Document HistoryRevision Date Description V1.0 2014/12/09 Initial version1. Product OverviewCC3200 SimpleLink Wi-Fi—Consists of Applications Microcontroller, Wi-Fi Network Processor, and Power-Management SubsystemsApplications Microcontroller SubsystemARM® Cortex®-M4 Core at 80 MHzEmbedded MemoryRAM (Up to 256KB)External Serial Flash Bootloader, and Peripheral Drivers in ROM 32-Channel Direct Memory Access (µDMA)Hardware Crypto Engine for Advanced Fast Security, Including AES, DES, and 3DESSHA2 and MD5CRC and Checksum8-Bit Parallel Camera Interface1 Multichannel Audio Serial Port (McASP) Interface with Support forTwo I2S Channels1 SD/MMC Interface2 Universal Asynchronous Receivers and Transmitters (UARTs)1 Serial Peripheral Interface (SPI)1 Inter-Integrated Circuit (I2C)4 General-Purpose Timers with 16-Bit Pulse- Width Modulation1 Watchdog Timer4-Channel 12-Bit Analog-to-Digital Converters (ADCs)Up to 27 Individually Programmable, Multiplexed GPIO PinsWi-Fi Network Processor SubsystemFeaturing Wi-Fi Internet-On-a-Chip™Dedicated ARM MCUCompletely Offloads Wi-Fi and Internet Protocols from theApplication MicrocontrollerWi-Fi and Internet Protocols in ROM802.11 b/g/n Radio, Baseband, Medium Access Control (MAC), Wi-Fi Driver, and SupplicantTCP/IP StackIndustry-Standard BSD Socket Application ProgrammingInterfaces (APIs)8 Simultaneous TCP or UDP Sockets2 Simultaneous TLS and SSL SocketsPowerful Crypto Engine for Fast, Secure Wi-Fi and Internet Connections with 256-Bit AES Encryption for TLS and SSLConnectionsStation, AP, and Wi-Fi Direct® ModesWPA2 Personal and Enterprise SecuritySimpleLink Connection Manager for Autonomous and Fast Wi-Fi ConnectionsSmartConfig™ Technology, AP Mode, and WPS2 for Easy and Flexible Wi-Fi ProvisioningTX Power18.0 dBm @ 1 DSSS14.5 dBm @ 54 OFDMRX Sensitivity–95.7 dBm @ 1 DSSS–74.0 dBm @ 54 OFDMPower-Management SubsystemIntegrated DC-DC Supports a Wide Range of Supply Voltage: V BAT Wide-Voltage Mode: 2.1 to 3.6 VPreregulated 1.85-V ModeAdvanced Low-Power ModesHibernate: 4 µALow-Power Deep Sleep (LPDS): 120 µARX Traffic (MCU Active): 59 mA @ 54 OFDMTX Traffic (MCU Active): 229 mA @ 54 OFDM, Maximum PowerIdle Connected (MCU in LPDS): 695 µA @ DTIM = 1 Clock Source40.0-MHz Crystal with Internal Oscillator32.768-kHz Crystal or External RTC Clock1.1 Extended ApplicationFor Internet-of-Things applications, such as:Cloud ConnectivityHome AutomationHome AppliancesAccess ControlSecurity SystemsSmart EnergyInternet GatewayIndustrial ControlSmart Plug and MeteringWireless AudioIP Network Sensor Nodes2. Module Parameter2.1 Basic ParameterFeatureDetailed DescriptionAntenna Type N/A Main chip CC3200Frequency range 2.412GHz-2.484GHz CPU clock80MHzMemory capacity64kB of Flash, 256kB of SRAMFlash size 8MB SPI Flash PCB stack4 layers Operating Voltage DC 3.3VForm factor Half size Mini-Card 25X23X1mm Other InterfaceUSB, UART, JTAG, I2S, I2C2.2 Current ConsumptionTA = +25°C, VBAT = 3.6 VPARAMETERTEST CONDITIONS MIN TYP MAX UNIT TX power level = 0278 1 DSSS TX power level = 4194 TX power level = 0254 6 OFDM TX power level = 4 185 TX power level = 0 229 TX 54 OFDM TX power level = 4166 1 DSSS 59 NWP ACTIVERX54 OFDM 59 MCU ACTIVENWP idle connected (3)15.3 mA TX power level = 0 27.5 1 DSSS TX power level = 4 191 TX power level = 0 251 6 OFDM TX power level = 4 182 TX power level = 0 226 TX54 OFDM TX power level = 4 163 1 DSSS 56 NWP ACTIVERX54 OFDM56 MCU SLEEPNWP idle connected (3)12.2mATX power level = 0 272 1 DSSS TX power level = 4 188 TX power level = 0 248 6 OFDM TX power level = 4 179 TX power level = 0 223 TX54 OFDM TX power level = 4160 1 DSSS 53 NWP activeRX54 OFDM53 NWP LPDS (4)0.12 MCU LPDSNWP idle connected (3)0.695 mAMCU hibernateNWP hibernate (5)4 µA VBAT = 3.3 V 450 VBAT = 2.1 V 670 Peak calibration current (6)VBAT = 1.85 V700mA(1) TX power level = 0 implies maximum power. TX power level = 4 implies output power backed off approximately 4 dB.(2) The CC3200 system is a constant power-source system. The active current numbers scale based on the VBAT voltage supplied. (3) DTIM = 1(4) LPDS current does not include the external serial flash. The LPDS number reported is with retention of 64KB MCU SRAM. The CC3200 device can be configured to retain 0KB, 64KB, 128KB, 192KB or 256KB SRAM in LPDS. Each 64KB retained increases LPDS current by 4 µA. (5) Serial flash current consumption in power-down mode during hibernate is not included. (6) The complete calibration can take up to 17 mJ of energy from the battery over a time of 24 ms . Calibration is performed sparingly, typically when coming out of Hibernate and only if temperature has changed by more than 20°C or the time elapsed from prior calibration is greater than 24 hours.2.3 Receiver CharacteristicsTA = +25°C, VBAT = 2.1 to 3.6 V. Parameters measured at SoC pin on channel 7 (2442 MHz)ParameterCondition (Mbps) Min Typ Max Units 1 DSSS –95.7 2 DSSS –93.6 11 CCK –88.0 6 OFDM –90.0 9 OFDM –89.0 Sensitivity (8% PER for 11b rates, 10% PER for 11g/11n rates)(10% PER)(1)18 OFDM–86.036 OFDM –80.554 OFDM –74.0MCS0 (GF)(2)–89.0MCS7 (GF)(2)–71.0802.11b –4.0Maximum input level (10% PER)802.11g –10.01 DSSS 18.02 DSSS 18.011 CCK 18.36 OFDM 17.39 OFDM 17.318 OFDM 17.036 OFDM 16.054 OFDM 14.5Maximum RMS output power measured at 1 dB fromIEEE spectral mask or EVMMCS7 (MM) 13.0dBmTransmit center frequency accuracy –2525 ppm(1) Sensitivity is 1-dB worse on channel 13 (2472 MHz).(2) Sensitivity for mixed mode is 1-dB worse.2.4 Transmitter CharacteristicsTA = +25°C, VBAT = 2.1 to 3.6 V. Parameters measured at SoC pin on channel 7 (2442 MHz).(1)Parameter Condition Min Typ Max Units1 DSSS 18.02 DSSS 18.011 CCK 18.36 OFDM 17.39 OFDM 17.318 OFDM 17.036 OFDM 16.054 OFDM 14.5Maximum RMS output power measured at 1 dB fromIEEE spectral mask or EVMMCS7 (MM) 13.0dBmTransmit center frequency accuracy –25 25 ppm (1) Channel-to-channel variation is up to 2 dB. The edge channels (2412 and 2472 MHz) have reduced TX power to meet FCC emission limits.(2) In preregulated 1.85-V mode, maximum TX power is 0.25 to 0.75 dB lower for modulations higher than 18 OFDM.WFM-3203. DVT ReportMode：Channel Radio Tool(Power) Output Power(dBm) EVM(%) EVM(dBm) Freq. Offset(ppm)11b1 0 2.22Transceiver：A2 0 2.23 3 0 2.33 4 0 2.28 5 0 2.22 6 0Bandwidth： 20MHz7 0 2.43 8 0 2.17 9 0 2.29 10 0 2.27 11 0 2.29Data Rate：11Mbps12 0 2.39 13 0 2.34 14 X X X ±25 ppm Crt16.08 16.03 16.51 16.54 16.56 18.07 17.46 17.96 15.26 15.19 15.09 14.41 14.44 2.12X <18.3 dBm-33.09 -33.01 -32.64 -32.84 -33.06 -33.46 -32.28 -33.29 -32.79 -32.88 -32.8 -32.42 -32.63 X -6.48 -6.82 -6.99 -6.44 -6.18 -6.56 -6.04 -6.3 -6.63 -6.35 -6.55 -6.62 -5.95Mode： 11gChannel Radio Tool(Power) Output Power(dBm) EVM(%) EVM(dBm) Freq. Offset(ppm) 1 4 8.57 3.49Transceiver：A2 4 8.42 2.89 3 4 9.02 3.61 4 4 8.91 2.92 5 4 8.68 3.08Bandwidth： 20MHz6 4 9.71 5.53 7 4 9.37 3.28 8 4 9.48 4.04 9 4 8.33 3.22 10 4 8.22 2.92Data Rate：54Mbps11 4 8.36 2.64 12 4 7.35 2.81 13 4 7.39 2.96 14 X X X ±25 ppm CrtX <14.5 dBm-29.15 -30.77 -28.84 -30.69 -30.24 -25.14 -29.68 -27.88 -29.75 -30.69 -31.58 -31.02 -30.56 X -5.18 -5.48 -5.6 -5.54 -5.51 -5.32 -5.34 -5.52 -5.65 -5.47 -5.74 -5.97 -5.72Mode： 11n-HTChannel Radio Tool(Power) Output Power(dBm) EVM(%) EVM(dBm) Freq. Offset(ppm) 1 0 3.51Transceiver：A2 0 3.36 3 0 3.24 4 0 3.43 5 0 2.5 6 0 2.9Bandwidth： 20MHz7 0 3.03 8 0 3.02 9 0 2.76 10 0 2.41 11 0 2.98Data Rate：MSC712 0 2.74 13 0 8.94 2.82 -5.21 14 X X X X ±25 ppm Crt10.27 10.11 10.7 10.64 10.53 11.48 11.3 11.27 10.19 10.25 10.11 9.43X <13 dBm-29.1 -29.48 -29.79 -29.29 -32.03 -30.75 -30.37 -30.39 -31.19 -32.37 -30.51 -31.26 -31 -5.48 -5.45 5.58 -5.46 -5.81 -5.7 -5.48 -5.61 -5.83 -5.5 -5.52 -5.511WFM-3204. Block DiagramUARTJTAGI2C5. Pin Assignment on module123.3VI2SWFM-320Abbreviations in used:I: Input AI: Analog Input O: Output AO: Analog Output IO: Bi-Directional Input/Output P: Digital Power G: Digital Ground AI/O: Analog Bi-Directional Input/OutputPIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 GNDNAMETYPE G I/O I/O I/O I/O I/O I/O I/O I/O P G P I/O I/O I/O I/O I/O I/O I/O I/O I/O I/OPIN 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 GNDNAMETYPE G I/O I/O I/O I I I I/O I/O I/O G I/O I/O I/O I/O I/O G RF G G I/O GCC_GPIO_07/CC_NWP_UART_TX CC_GPIO_06/CC_UART1_CTS CC_GPIO_05/CC_WL_UART_TX CC_GPIO_04/CC_WLR232_RX CC_GPIO_01/CC_UART1_TX CC_GPIO_00/CC_UART1_RTS CC_GPIO_30 CC_GPIO_31 VBAT_CC GND VCC_DCDC_3V3 CC_GPIO_02/CC_UART1_RX CC_GPIO_03/CC_WLR232_TX CC_GPIO_08/TEST_63 CC_GPIO_09/TEST_64 CC_GPIO_10 CC_GPIO_11/CC_nHIB CC_GPIO_12/TEST_03 CC_GPIO_13/FPRCE_AP CC_GPIO_14/CC_SPI_CLK CC_GPIO_15/CC_SPI_DINCC_GPIO_16/CC_SPI_DOUT CC_GPIO_17/CC_SPI_CS CC_GPIO_22/CC_IRQ SOP0 SOP1 SOP2 CC_GPIO_28/TEST_18 LP_GPIO BRD_JTAG_1 GND BRD_JTAG_2 BRD_JTAG_4 BRD_JTAG_3 CC_GPIO_26/TEST_29 CC_GPIO_27/TEST_30 GND ANT GND GND CC_nRESET GND13WFM-3206. Interface Specifications14WFM-32015WFM-3207. Reference CircuitPower SupplyJTAG & UART16WFM-32017WFM-320Infrared Thermopile Sensortriaxial acceleration sensor18WFM-320LED Circuit19WFM-3208. Layout Guide8.1 RF SectionBeing a wireless device, the RF section gets the top priority in terms of layout. It is very important for the RF section to be laid out correctly in order to get the optimum performance from the device. A poor layout can cause performance degradation for the output power, the error vector magnitude (EVM), the sensitivity, and the spectral mask.8.2 Antenna Placement and RoutingThe antenna is the element used to convert the guided waves on the PCB traces to the free-space electromagnetic radiation. The placement and layout of the antenna is key to increased range and data rates. The guidelines in Table 1 need to be observed for the antenna. Table 1. Antenna Guidelines Sr No 1 2 3 Guidelines Place the antenna on an edge or corner of the PCB. Make sure that no signals are routed across the antenna elements on all the layers of the PCB. Most antennas, including the chip antenna used on the BoosterPack, require ground clearance on all the layers of the PCB. Ensure that the ground is cleared on inner layers as well. 4 Ensure that there is provision to place matching components for the antenna. These need to be tuned for best return loss once the complete board is assembled. Any plastics or casing should also be mounted while tuning the antenna as this can impact the impedance. 5 Ensure that the antenna impedance is 50 Ω as the device is rated to20work only with a 50 Ω system.6 In case of printed antenna, ensure that the simulation is performedwith the solder mask in consideration.7 Ensure that the antenna has a near omni-directional pattern.8 The return loss measured at the filter out (looking into the device)should be better than -10dB. To ease the FCC, CE, andETSI certification, the antenna used should be of the same gain orlesser.Table 2. Recommended ComponentsChoice Part Number Manufacturer Notes1 AH316M245001-TTaiyo Yuden Can be placed on the edge of the PCBand uses less PCB space2 RFANT5220110A2TWalsim Needs to be placed on the corner ofthe PCBTable 3. Characteristic of Recommended AntennaParameter SpecFrequency Bandwidth 2.4G to 2.5GTypical Peak Gain +1.9dBiAverage Gain at OMNI plane 0dBiEfficiency (Typical) -1.3dB (73%)VSWR 38.3 Transmission LineThe RF signal from the device is routed to the antenna using a coplanar waveguide with ground (CPW-G) structure. This structure offers the maximum isolation across filter gap and the best possible shielding to the RF lines. In addition to the ground on the L1 layer, placing GND vias along the line also provides additional shielding.The recommended values for the PCB are provided in Table 4.Table 4. Recommended Values for the PCBParameter Value UnitsW 18 milsS 15 milsH 10 milsEr 3.9Er is assumed to be of an FR-4 substrate.9. Furnace temperature curveReflow profile requirementsParameter Specification Reference SpecificationAverage temperature gradient in preheating 1~2.5°C/s to 175°C equilibrium. Soak time T soak120~180 secondsTime above 217°C (T1) t145~90 secondsPeak temperature in reflow T2250°C (0/+5°C)Time at peak temperature t2 6 secondsTemperature gradient in cooling 6°C/second1Contact usShenzhen AiDian Smart technology co., LTD.Addr 703-701,Lankun Building,Mingkang Road,Minzhi,Shenzhen,China.Tel:+86-755-29368092Fax:+86-755-29369435。