IC design flow & relevant desing tools(集成电路设计流程与EDA工具经典总结)
详细阐述ic工业设计流程
详细阐述ic工业设计流程英文回答：IC Industrial Design Process.The IC industrial design process is a complex andmulti-disciplinary effort that involves the creation of a new integrated circuit (IC) product. The process typically begins with a market analysis to identify the need for a new IC product. Once the market need has been identified, the design team begins to develop the IC architecture. The architecture defines the basic building blocks of the IC, including the logic gates, memory blocks, and input/output interfaces.Once the architecture has been developed, the design team begins to create the physical layout of the IC. The layout defines the placement of the logic gates, memory blocks, and input/output interfaces on the IC die. The layout must be carefully designed to ensure that the ICmeets its performance requirements and is manufacturable.After the layout has been completed, the design team begins to develop the IC fabrication process. The fabrication process defines the steps that are used to create the IC die. The fabrication process must be carefully controlled to ensure that the IC meets its performance requirements and is manufacturable.Once the fabrication process has been developed, the design team begins to test the IC. The testing process ensures that the IC meets its performance requirements and is free of defects.The IC industrial design process is a complex and time-consuming effort. However, it is essential to the development of new IC products. By following a structured design process, the design team can ensure that the IC meets its performance requirements and is manufacturable.中文回答：IC工业设计流程。
IC设计流程之实现篇 全定制设计
IC设计流程之实现篇——全定制设计要谈IC设计的流程，首先得搞清楚IC和IC设计的分类。
集成电路芯片从用途上可以分为两大类：通用IC（如CPU、DRAM/SRAM、接口芯片等）和专用IC（ASIC）（Application Specific Integrated Circuit），ASIC是特定用途的IC。
从结构上可以分为数字IC、模拟IC和数模混合IC三种，而SOC （System On Chip，从属于数模混合IC）则会成为IC设计的主流。
从实现方法上IC设计又可以分为三种，全定制（full custom）、半定制（Semi-custom）和基于可编程器件的IC设计。
全定制设计方法是指基于晶体管级，所有器件和互连版图都用手工生成的设计方法，这种方法比较适合大批量生产、要求集成度高、速度快、面积小、功耗低的通用IC或ASIC。
基于门阵列（gate-array）和标准单元（standard-cell）的半定制设计由于其成本低、周期短、芯片利用率低而适合于小批量、速度快的芯片。
最后一种IC设计方向，则是基于PLD或FPGA器件的IC 设计模式，是一种“快速原型设计”，因其易用性和可编程性受到对IC制造工艺不甚熟悉的系统集成用户的欢迎，最大的特点就是只需懂得硬件描述语言就可以使用EDA工具写入芯片功能。
从采用的工艺可以分成双极型(bipolar)，MOS和其他的特殊工艺。
硅（Si）基半导体工艺中的双极型器件由于功耗大、集成度相对低，在近年随亚微米深亚微米工艺的的迅速发展，在速度上对MOS管已不具优势，因而很快被集成度高，功耗低、抗干扰能力强的MOS管所替代。
MOSFET工艺又可分为NMOS、PMOS和CMOS三种；其中CMOS工艺发展已经十分成熟，占据IC市场的绝大部分份额。
GaAs器件因为其在高频领域（可以在0.35um下很轻松作到10GHz）如微波IC中的广泛应用，其特殊的工艺也得到了深入研究。
IC设计流程及各阶段典型软件
IC设计流程及各阶段典型软件IC设计流程是指整个集成电路设计的整体过程，包括需求分析、系统设计、电路设计、物理设计、验证与测试等阶段。
每个阶段都有其典型的软件工具用于支持设计与开发工作。
本文将详细介绍IC设计流程的各个阶段及其典型软件。
1.需求分析阶段需求分析阶段是集成电路设计的起点，主要目的是明确设计目标和规格。
在这个阶段，设计团队与客户进行沟通和讨论，确定设计的功能、性能、功耗、面积等要求。
常用软件工具有：- Microsoft Office：包括Word、Excel、PowerPoint等办公软件，用于编写设计需求文档、文档整理和汇报。
2.系统设计阶段系统设计阶段主要是将需求分析阶段得到的设计目标和规格转化为可实现的电路结构和算法设计。
常用软件工具有：- MATLAB/Simulink：用于算法设计和系统级模拟，包括信号处理、通信系统等。
- SystemVerilog：一种硬件描述语言，用于描述电路结构和行为。
- Xilinx ISE/Vivado：用于FPGA设计，进行电路逻辑设计和Verilog/VHDL代码的仿真和综合。
3.电路设计阶段电路设计阶段是将系统级设计转化为电路级设计。
常用软件工具有：- Cadence Virtuoso：用于模拟和布局设计，包括原理图设计、电路模拟和布局与布线。
- Mentor Graphics Calibre：用于DRC（Design Rule Checking）和LVS（Layout vs. Schematic）设计规则检查和布局与原理图的对比。
4.物理设计阶段物理设计阶段主要是将电路级设计转化为版图设计，并进行布局布线。
常用软件工具有：- Cadence Encounter：用于逻辑综合、布局和布线。
- Cadence Innovus：用于布局布线和时钟树设计。
- Mentor Graphics Calibre：用于DRC和LVS设计规则检查和验证。
IC Design(IC 设计)
WELL + Diffusion Poly
WELL + Diffusion + Poly Metal + CONT
About Frontend Design & Backend Design
Frontend Design
Chip architecture design Module design Digital design - write RTL code, logic simulation and synthesis Analog design - draw schematics, analog simulation Chip level design Pre-layout and post-layout simulations
Design methodology is “stable” Experience is very important
Digital Circuit Design Flow
Digital design : RTL to GDSII
RTL Coding verification
Fully supported by EDA tools
Example: RTL code in Verilog module inverter (Y, A); output Y; input A; assign Y = ~A; endmodule
What is Layout?
A set of overlapped geometric drawing Represent physical design (corresponding to mask layers) Database format for Layout: GDSII Example: Inverter (cell INVX1)
简述进行ic设计的方法和设计流程
简述进行ic设计的方法和设计流程英文回答：IC Design Methodology.The design of an integrated circuit (IC) is a complex process that requires a team of engineers to work togetherto create a functional product. The design process begins with the specification of the IC, which defines the functionality, performance, and other requirements of the chip.Once the specification is complete, the design team can begin to create the circuit schematic. The schematic is a graphical representation of the circuit, showing the connections between the different components. The schematic is then used to create the circuit layout, which is a physical representation of the circuit on the silicon wafer.The circuit layout is then sent to the fabricationfacility, where the chip is manufactured. Once the chip is fabricated, it is tested to ensure that it meets the specifications. If the chip meets the specifications, it is then packaged and shipped to the customer.IC Design Flow.The IC design flow is a set of steps that are followed to create an IC. The flow typically includes the following steps:1. Specification: The IC design process begins with the specification of the IC. The specification defines the functionality, performance, and other requirements of the chip.2. Schematic capture: The circuit schematic is created using a schematic capture tool. The schematic is a graphical representation of the circuit, showing the connections between the different components.3. Simulation: The circuit schematic is simulated toverify that it meets the specifications. Simulation is a process of running the circuit through a series of tests to check its functionality.4. Layout: The circuit layout is created using a layout tool. The layout is a physical representation of thecircuit on the silicon wafer.5. Verification: The circuit layout is verified to ensure that it meets the specifications. Verification is a process of checking the layout for errors and ensuring that it will function properly.6. Fabrication: The circuit layout is sent to the fabrication facility, where the chip is manufactured.7. Test: The chip is tested to ensure that it meets the specifications. If the chip meets the specifications, it is then packaged and shipped to the customer.中文回答：IC设计方法。
IC设计flow简介
1. Architectural and electrical specification.2. RTL(Register Transfer Level) coding in HDL(Hardware Description Language).3. DFT(Design For Test) memory BIST(Built In Self Test) insertion, for designs containing memory elements.4. Exhaustive dynamic simulation of the design, in order to verify the functionality of the design.5. Design environment setting. This includes the technology library to be used, along with other environmental attributes.6. Constraining and synthesizing the design with scan insertion (and optional JTAG) using Design Compiler.7. Block level static timing analysis, using Design Compiler’s built-in static timing analysis engine.8. Formal verification of the design. RTL compared against the synthesized netlist, using Formality.9. Pre-layout static timing analysis on the full design through PrimeTime.10. Forward annotation of timing constraints to the layout tool.11. Initial floorplanning with timing driven placement of cells, clock tree insertion and global routing12. Transfer of clock tree to the original design (netlist) residing in Design Compiler.13. In-place optimization of the design in Design Compiler.14. Formal verification between the synthesized netlist and clock tree inserted netlist, using Formality.15. Extraction of estimated timing delays from the layout after the global routing step (step 11).16. Back annotation of estimated timing data from the global routed design, to PrimeTime.17. Static timing analysis in PrimeTime, using the estimated delays extracted after performing global route.18. Detailed routing of the design.19. Extraction of real timing delays from the detailed routed design.20. Back annotation of the real extracted timing data to PrimeTime.21. Post-layout static timing analysis using PrimeTime.22. Functional gate-level simulation of the design with post-layout timing (if desired).23. Tape out after LVS(Layout Versus Schematic) and DRC(Design Rule Checking) verification.。
ic设计流程
ic设计流程
IC设计（Integrated Circuit Design）是指将电子元器件和电路集成到单个芯片上的过程。
它经历了几个主要的流程，包括前端设计、物理设计和后端设计。
以下是每个流程的详细介绍：
前端设计流程：
前端设计流程是指在编写RTL代码后，将其转换为物理设计中的网表（Netlist）的过程。
这是芯片设计过程中的第一步。
此流程包括各种步骤，如功能验证、RTL设计、综合、时序分析和设计约束。
物理设计流程：
物理设计流程是指将RTL代码（硬件描述语言）转换为芯片的物理结构的过程。
这涉及到的主要任务包括物理验证、布局设计、时钟设计、布线和静态时序分析等。
后端设计流程：
后端设计流程是指在芯片物理结构设计后，进行后续的电路细节设计、验证和优化的过程。
该过程包括各种步骤，如电路模拟、电路提取、电路优化、时序确认和信号完整性验证等。
综上所述，IC设计流程是一个复杂的过程，需要经过多个阶段的设计和验证。
仔细规划和执行这些流程，可以确保芯片能够满足性能和可靠性方面的要求，同时也可以提高设计效率和降低开发成本。
集成电路(IC)设计完整流程详解及各个阶段工具简介
IC设计完整流程及工具IC的设计过程可分为两个部分，分别为：前端设计（也称逻辑设计）和后端设计（也称物理设计），这两个部分并没有统一严格的界限，凡涉及到与工艺有关的设计可称为后端设计。
前端设计的主要流程：1、规格制定芯片规格，也就像功能列表一样，是客户向芯片设计公司（称为Fabless，无晶圆设计公司）提出的设计要求，包括芯片需要达到的具体功能和性能方面的要求。
2、详细设计Fabless根据客户提出的规格要求，拿出设计解决方案和具体实现架构，划分模块功能。
3、HDL编码使用硬件描述语言（VHDL，Verilog HDL，业界公司一般都是使用后者）将模块功能以代码来描述实现，也就是将实际的硬件电路功能通过HDL语言描述出来，形成RTL（寄存器传输级）代码。
4、仿真验证仿真验证就是检验编码设计的正确性，检验的标准就是第一步制定的规格。
看设计是否精确地满足了规格中的所有要求。
规格是设计正确与否的黄金标准，一切违反，不符合规格要求的，就需要重新修改设计和编码。
设计和仿真验证是反复迭代的过程，直到验证结果显示完全符合规格标准。
仿真验证工具Mentor 公司的Modelsim，Synopsys的VCS，还有Cadence的NC-Verilog均可以对RTL 级的代码进行设计验证，该部分个人一般使用第一个-Modelsim。
该部分称为前仿真，接下来逻辑部分综合之后再一次进行的仿真可称为后仿真。
5、逻辑综合――Design Compiler仿真验证通过，进行逻辑综合。
逻辑综合的结果就是把设计实现的HDL代码翻译成门级网表netlist。
综合需要设定约束条件，就是你希望综合出来的电路在面积，时序等目标参数上达到的标准。
逻辑综合需要基于特定的综合库，不同的库中，门电路基本标准单元（standard cell）的面积，时序参数是不一样的。
所以，选用的综合库不一样，综合出来的电路在时序，面积上是有差异的。
一般来说，综合完成后需要再次做仿真验证（这个也称为后仿真，之前的称为前仿真）逻辑综合工具Synopsys的Design Compiler，仿真工具选择上面的三种仿真工具均可。