YAGEO贴片电容规格书

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贴片电阻电容的规格、封装、尺寸

E96 1.00 1.02 1.05 1.07 1.10 1.13 1.15 1.18 1.21 1.24 1.27 1.30 1.33 1.37 1.40 1.43 1.47 1.50 1.54 1.58 1.62 1.65 1.69 1 1.78 1.82 1.87 1.91 1.96 2.00 2.05 2.10 2.15 2.21 2.26 2.32 2.37 2.43 2.49 2.55 2.61 2.67 2.74 2.80 2.87 2.94 3.01 3 3.16 3.24 3.32 3.40 3.48 3.57 3.65 3.74 3.83 3.92 4.02 4.12 4.22 4.32 4.42 4.53 4.64 4.75 4.87 4.99 5.11 5.23 5.36 5 5.62 5.76 5.90 6.04 6.19 6.34 6.49 6.65 6.81 6.98 7.15 7.32 7.50 7.68 7.87 8.06 8.25 8.45 8.66 8.87 9.09 9.31 9.53 9
1.78 1.80 1.82 1.84 1.87 1.89 1.91 1.93 1.96 1.98 2.00 2.03 2.05 2.08 2.10 2.13 2.15 2.18 2.21 2.23 2.26 2.29 2.32 2
2.37 2.40 2.43 2.46 2.49 2.52 2.55 2.58 2.61 2.64 2.67 2.71 2.74 2.77 2.80 2.84 2.87 2.91 2.94 2.98 3.01 3.05 3.09 3
简述基本结构分类规格、封装、尺寸额定功率及工作电压阻值,标准阻值标识规格书、生产厂家命名方法价格、报价
贴片电阻规格、封装、尺寸 ChipR Dimensions 、Footprint

通用型贴片电容规格书(选型手册)

【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORCOG/COHCOG, ,-55125,030ppm/060ppm/0805CG101J500NT(PF) ( 0402 0.04 0603 0.06 0805 0.08 1206 0.12 ) 0.02 0.03 0.05 0.06 1.00 1.60 2.00 3.20 ( ) 0.50 0.80 1.25 1.60 CG CH COG NPO COH 100 101 102 10 100 1J G C B D5.00% 2.00% 0.25PF 0.10PF 0.50PF10 10 10 1026R3 100 250 5006.3V 10V 25V 50VS C N / / T BWBWTL mm L 0402 0603 0805 1206 1005 1608 2012 3216 1.00 1.60 2.00 3.20 0.05 0.10 0.20 0.30 W 0.50 0.80 1.25 1.60 0.05 0.50 0.10 0.80 0.20 0.80 1.00 1.25 0.20 0.80 1.00 1.25 T WB 0.05 0.25 0.10 0.30 0.20 0.50 0.20 0.20 0.20 0.60 0.20 0.20 0.10 0.10 0.20 0.3015【南京南山半导体有限公司 — 贴片电容选型资料】0.80 0.20 1.00 0.20 0.50 0.80 0.20 1.00 0.20 0.600.20 0.30【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORCOG/COH 0402 0603 0805 12066.3V 10V 16V 25V 50V 6.3V 10V 16V 25V 50V 6.3V 10V 16V 25V 50V 6.3V 10V 16V 25V 50V0.5PF 1PF 2PF 3PF 4PF 5PF 6PF 7PF 10PF 22PF 33PF 47PF 68PF 100PF 120PF 150PF 180PF 220PF 330PF 470PF 560PF 680PF 1000PF 2200PF 2700PF 3300PF 4700PF 5600PF 6800PF 10nF 12nF 15nF 22nF 47nF 68nF 100nF17【南京南山半导体有限公司 — 贴片电容选型资料】04020603080512066.3V 10V 16V 25V 50V 6.3V 10V 16V 25V 50V 6.3V 10V 16V 25V 50V 6.3V 10V 16V 25V 50VCapacitance0.5PF 1PF 2PF 3PF 4PF 5PF 6PF 7PF 10PF 22PF 33PF 47PF 68PF 100PF 120PF 150PF 180PF 220PF 330PF 470PF 560PF 680PF 1000PF 2200PF 2700PF 3300PF 4700PF 5600PF 6800PF 10nF 12nF 15nF 22nF 47nF 68nF 100nF【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORCOG COHPH~SLCOG PH SH SL TH RH UJCOH1-55125-55851. 2. 3. 2 4. 5. , , , , , 103 4 Cr 5PF 0.56% -4 5PF Cr 50PF 1.5 [(150/Cr)+7] 10 Cr 50PF 0.15% C C 10nF Ri 10nF Ri 5 10 Cr 500s 3 50mA 150+0/-10 8 25 9 75 235 5 2 0.5 25 60 265 10 1 25 : 1 2 100 170 120 200 1 1 2.5mm/ 24 2 5 5 5 2.5mm/ 245 24 -55 125 2 -55 85 60 510:HP4278A 1. 2. 3. (D.F.) :1.0 C : : (HP4284 25 5 0.2V 0.1MHz; 0.1KHZ ) 1000PF,1.0 :SF2511 , 60 60 1 5 :30% 75%5:C<1000PF,1.06I.R.7>3x150+0/-10 5% 0.5PF D.F. 10 I.R. 24 245【南京南山半导体有限公司 — 贴片电容选型资料】General COGCOHPHSL MLCC reliability test methodStandard Number Item COG COH MLCC for General-use -55 125 PH, RH, SH, TH, UJ, SL MLCC for General-use -55 85 Check by using microscope 10 . Test Method1Operating Temperature RangeAppearance21.Good ceramic body color continuity. 2.The chips have no visual damages and must be very smooth. 3.No exposed inner- electrode, no cracks or holes. 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of that of the termination width.3 4 5Dimensions Capacitance Dissipation Factor (DF)Within the specified dimensions Within the specified tolerance Cr 5PF 0.56% 5PF Cr 50PF 1.5 [(150/Cr)+7] 10-4 Cr 50PF 0.15% C C 10nF Ri 10nF Ri 5 1010 Cr 500sUsing micrometer or vernier calipers Measuring Equipments:HP4278 capacitance meter,HP4284 capacitance, Measuring Conditions: 1.Measuring Temperature:25 5 .Humidity: 30% 75%. 2.Measuring Voltage:1.0 0.2V. 3.Measuring Frequency:C<1000PF 1.0 0.1MHz C 1000PF 1.0 0.1KHz Measuring Equipment:Insulation resistance meter (such as Sf2511 insulation resistance). Measuring Method:Must measure at rated voltage, and measure the IR within 60 5 seconds. Must measure at 3 times rated voltage, dwell time: 60 1 seconds, no short and the changing/discharging current less than 50mA. First, pre-heat: heat treat 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Measure the capacitance at -55 125 or -55 85 , the capacitance change ratio comparing to that of 25 must be within the specified range. Dip the capacitor into ethanol or colophony solution, and then dip it into 235 5 ( or 245 5 leadless eutedtic solder solution ) eutectic solder solution hanving lead for 2 0.5 seconds. Dipping speed: 25 2.5mm/second. First pre-heat: heat treat for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Then pre-heat the capacitance according to the following chart. Dip the capacitor into 265 5 eutectic solder solution for 10 1 seconds. Then set it for 24 2 hours at room temperature, then measure. Dipping speed: 25 2.5mm/second. Preheat conditions: Stage 1 2 Temperature 100 170 120 200 Time 1minute 1minute6Insulation Resistance7Withstanding Voltage Capacitance Temperature Characteristic>3x rated continuous working voltage Must meet the capacitor character temperature coefficient requirements within the operating temperature range. Tin coverage should be 75% of the outer electrode Appearance Cap. Change ratio DF No defects visible 5%or 0.5PF (whichever is larger)89SolderabilityResistance to Soldering10Same as original spec Same as original specIR46【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR1 10N11 10N,10 1 :1.0mm/ 11.5mm 10 D.F. 12 55Hz 210 55Hz 10Hz 6 123 420 mm mmmm13mmmmmmmm150+0/-10 14 24 2 24 260 547【南京南山半导体有限公司 — 贴片电容选型资料】NumberItems Adhesive Strength of TerminationStandard No removal of the terminations or other defect shall occurTest Method Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.1 using a eutectic solder.Then apply a 10N force inthe direction shown as the arrowhead.The aoldering shall be done either with an iron or using the reflow method and shall be conducted with care so that an iron or using the refow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock,etc. 10N,10 1s Speed:1.0mm/s Glss epoxy resinboard11Fig.1 Vibration Resistance Appearance Capacitance No defects or abnormities Within the specified tolerance range Same as original spec12DFSolder the capacitor to the test jig (glass epoxy resin board). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz, shall be traversed (from 10 Hz to 55 Hz then 10 Hz again) in approximately 1 minute.This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total is 6 hours).Same i standarFif.2 Bending Resistance No cracks or other defects shall occur Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.3 using a eutectic solder. Then apply a 10N force in the direction shown as Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as mm heat shock, etc.mm13mm mm mm14Temperature CycleAppearance No defects or abnormitiesPre-treatment: Heat-treat the capacitor for 60 5minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Perform five cycles according to the four heat treatments listed in the following table. Set it for 24 2 hours at room temperature, then measure.48mm【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR2.5% 0.25PF, 1 10000M 2 3 4 2 3 30 3 2 3 30 3 2 314D.F. I.R.40 290 95 24 2500+24/-05% 0.5PF, 15 ( ) D.F. I.R. 10000M40 2 500+24/-0 5% 0.5PF, 16 D.F. I.R. 10000M90 95 24 22 50mA 5% 0.5PF, 17 D.F. I.R. 10000M1000 12 24 249【南京南山半导体有限公司 — 贴片电容选型资料】NumberItem Temperature CycleStandard Cap. Change ratio D.F. I.R. 2.5% or 0.25 PF (whichever is larger) Same as original spec More than 10000M Heat-treatment:Test Method14stage temperature 1 lowest opeating temperature 3 2 normal temperature 3 high operating temperature 2 4 normal temperaturetime min. 30 3 2 3 30 3 2 3Humidity Steady StateAppearance Cap. Change ratio D.F. I.R.No defects or abnormities 5% or 0.5 PF (whichever is larger) Same as original spec More than 10000MSet the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Then remove and set it for 24 2 hours at room temperature, then measure.15Humidity LoadAppearance Cap. Change ratioNo defects or abnormities 5% or 0.5 PF (whichever is larger) Same as original spec More than 10000MApply rated voltage to the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Remove and set it for 24 2 hours at room temperature, then measure.16D.F. I.R.Life TestAppearance Cap. Change ratioNo defects or abnormities 5% or 0.5 PF (whichever is larger) Same as original spec More than 10000MApply two times rated voltage to the capacitor for 1000 12 hours at the upper temperature limits, the charging current should be less than 50mA. Remove and set it for 24 2 hours at room temperature, then measure.17D.F. I.R.5057-10%-5%0%5%10%COG 50VX7R 50V Z5U 50V Y5V50V010********-100%-80%-60%-40%-20%0%20%40%[Vdc]COG :1MHZ X7R,Z5U,Y5V:1KHZZ5U 50VY5V 50V X7R 50VC0G 50V0123-20%0%+20%+40%+60%^+80%COG PH RH SH TH UHCOG X7R Y5V,Z5U05010010001000010%0%-10%-20%-30%-40%[Hr]X7R20%0%[Vr ms ]COG :1MHZ X7R,Z5U,Y5V:1KHZMULTILAYER CHIP CERAMIC CAPACITOR58-5%0%5%10%-100%-80%-60%-40%-20%0%20%40%Z5U 50VY5V 50V X7R 50VC0G 50V0123-20%0%+20%+40%+60%^+80%COG X7R Y5V,Z5U05010010001000010%0%-10%-20%-30%-40%0%GENEREL-USE MLCC CHARCCTER PROFILESCapacitance change ratio DC Voltage[Vdc]Measuring condition COG :1MHzX7R,Z5U,Y5V:1KHzCOG and PHRH SH TH UH siriestemperature coefficentDC Capacitance-AC VoltageCharactericsCapacitance change_agingTime[Hr]X7R tempreture characteristicsZ5U [Vr ms ]Capacitance change ratioCapacitance change ratio Capacitance change ratio Capacitance change ratio。

国巨_贴片电容_规格说明UPY-GP_NP0_16V-to-50V_16

P r o d u c t S p e c i f i c a t i o n –M a r c h 7, 2017 V .16DATA SHEETSURFACE-MOUNT CERAMIC MULTILAYER CAPACITORSGeneral purposeClass 1, NP016 V TO 50 V0.22 pF to 100 nFRoHS compliant & Halogen FreeSCOPEThis specification describes NP0 series chip capacitors with lead-free terminations. APPLICATIONS●Consumer electronics for example-Tuners-Television receivers-All types of cameras●Telecommunications●Data processing FEATURES●Supplied in tape on reel●Nickel-barrier end termination ●RoHS compliant●Halogen Free compliant ORDERING INFORMATION - GLOBAL PART NUMBER, PHYCOMP CTC & 12NCAll part numbers are identified by the series, size, tolerance, TC material, packing style, voltage, process code, termination and capacitance value.Y A G E O B R A N D o r d e r i n g c o d eGLOBAL PART NUMBER(PREFERRED)CC XXXX X X NPO X BN XXX(1) (2) (3) (4) (5)(1) SIZE – INCH BASED (METRIC)0201 (0603)0402 (1005)0603 (1608)0805 (2012)1206 (3216)1210 (3225)1812 (4532)(2) TOLERANCEB= ±0.1 pFC= ±0.25 pFD= ±0.5 pFF= ±1%G= ±2%J= ±5%K= ±10%(3) PACKING STYLER= Paper/PE taping reel; Reel 7 inchK= Blister taping reel; Reel 7 inchP= Paper/PE taping reel; Reel 13 inchF= Blister taping reel; Reel 13 inchC= Bulk case(4) RATED VOLTAGE7= 16 V8= 25 V9= 50 V(5) CAPACITANCE VALUE2 significant digits+number of zerosThe 3rd digit signifies the multiplying factor, and letter R is decimal pointExample: 121 = 12 x 101 = 120 pF0.6 ±0.03 0.3 ±0.03 Refer to table 2 to 50.10 0.20 0.20 0402 1.0 ±0.05 0.5 ±0.05 0.20 0.30 0.40 0603 1.6 ±0.10 0.8 ±0.10 0.200.60 0.40 0805 2.0 ±0.10 (1) 1.25 ±0.10 (1) 0.25 0.75 0.70 2.0 ±0.20 (2) 1.25 ±0.20 (2) 1206 3.2 ±0.15 (1) 1.6 ±0.15 (1) 0.25 0.75 1.40 3.2 ±0.30 (2) 1.6 ±0.20 (2) 1210 3.2 ±0.20 2.5 ±0.20 0.25 0.75 1.40 18124.5 ±0.203.2 ±0.200.250.752.20NOTE1. Dimension for size 0805 and 1206, C ≤ 1 nF2. Dimension for size 0805 and 1206, C > 1 nFDIMENSIONO U T L I N E SFig. 2 Surfacemounted multilayer ceramic c apacitor dimension CONSTRUCTION The capacitor consists of a rectangular block of ceramic dielectric in which a number of interleaved metal electrodes are contained. This structure gives rise to a high capacitance per unit volume.The inner electrodesare connected to the two end terminationsand finally covered with a layer of plated tin (NiSn). The terminations are lead-free.A cross section of the structure is shown in Fig.1.Surface mounted multilayer ceramic capacitor constructionC APACITANCE RANGE & THICKNESS FOR NP0CAPACITANCE RANGE & THICKNESS FOR NP0T able 3Sizes from 0201 to 0603 (continued)CAP.020*********25 V50 V16 V25 V50 V16 V25 V50 VNOTE1.Values in shaded cells indicate thickness class in mm2.Capacitance value of non E-12 series is on requestCAPACITANCE RANGE & THICKNESS FOR NP0T able 4Sizes from 0805 to 1812CAP.080512061210181216 V25 V50 V16 V25 V50 V25 V50 V 50 VNOTE1.Values in shaded cells indicate thickness class in mm2.Capacitance value of non E-12 series is on requestCAPACITANCE RANGE & THICKNESS FOR NP0T able 5Sizes from 0805 to 1812 (continued)CAP.080512061210181216 V25 V50 V16 V25 V50 V25 V50 V50 VNOTE1.Values in shaded cells indicate thickness class in mm2.Capacitance value of non E-12 series is on requestTHICKNESS CLASSES AND PACKING QUANTITYELECTRICAL CHARACTERISTICSN P0D I E L E C T R I C C A P A C I T O R S;N I S N T E R M I N A T I O N SUnless otherwise stated all electrical values apply at an ambient temperature of 20±1 °C, an atmospheric pressure of 86 to 106 kPa, and a relative humidity of 63 to 67%.DESCRIPTION VALUE Capacitance range 0.22 pF to 100 nF Capacitance toleranceC < 10 pF ±0.1 pF, ±0.25 pF, ±0.5 pFC ≥ 10 pF±1%, ±2%, ±5%, ±10% Dissipation factor (D.F.)C < 30 pF≤ 1 / ( 400 + 20C )C ≥ 30 pF≤ 0.1 % Insulation resistance after 1 minute at U r (DC) Rins≥ 10 GΩ or R ins × C r≥ 500 seconds whichever is less Maximum capacitance change as a function of temperature(temperature characteristic/coefficient):±30 ppm/°COperating temperature range: –55 °C to +125 °C T able 7Fig. 4 Typical capacitance change with respect tothe capacitance at 1 V as a function of DC voltage Fig. 3 Typical temperature coefficient as a function oftemperatureSample limits (broken lines).Requirement levels (dotted lines)Fig. 5 Typical tan δ as a function of temperature SOLDERING RECOMMENDATIONT able 8SOLDERING METHOD SIZE02010402060308051206≥ 1210Reflow Reflow only≥ 0.1 µF≥ 1.0 µF≥ 2.2 µF≥ 4.7 µF Reflow only Reflow/Wave--- < 0.1 µF< 1.0 µF< 2.2 µF< 4.7 µF---TESTS AND REQUIREMENTST able 9Test procedures and requirementsTEST TEST METHOD PROCEDURE REQUIREMENTSMounting IEC 60384-21/22 4.3The capacitors may be mounted on printed-circuit boardsor ceramic substratesNo visible damageVisualinspectionand dimension check4.4 Any applicable method using × 10 magnification In accordance with specificationCapacitance 4.5.1 Class 1:f = 1 MHz for C ≤ 1 nF, measuring at voltage 1 V rms at 20 °Cf = 1 KHz for C > 1 nF, measuring at voltage 1 V rms at 20 °CWithin specified toleranceDissipation factor (D.F.) 4.5.2 Class 1:f = 1 MHz for C ≤ 1 nF , measuring at voltage 1 V rms at 20 °Cf = 1 KHz for C > 1 nF, measuring at voltage 1 V rms at 20 °CIn accordance with specificationInsulationresistance4.5.3 At U r (DC) for 1 minute In accordance with specificationTemperature coefficient 4.6 Capacitance shall be measured by the steps shown in thefollowing table.The capacitance change should be measured after 5 min at eachspecified temperature stage.Temperature Coefficient shall be calculated from the formula asbelowTemp, Coefficient =610TxC1C1-C2Δ[ppm/℃]C1: Capacitance at step cC2: Capacitance at 125℃∆T: 100℃(=125℃-25℃)(2) Class IICapacitance Change shall be calculated from the formula asbelow∆C =C1C1-C2x 100%C1: Capacitance at step cC2: Capacitance at step b or d<General purpose series>Class1:∆ C/C: ±30ppmClass2:X7R: ∆ C/C: ±15%Y5V: ∆ C/C: 22~-82%<High Capacitance series>Class2:X7R/X5R: ∆ C/C: ±15%Y5V: ∆ C/C: 22~-82%TEST TEST METHOD PROCEDURE REQUIREMENTS4.7 A force applied for 10 seconds to the line joining theterminations and in a plane parallel to the substrate Forcesize ≥ 0603: 5N size = 0402: 2.5N size = 0201: 1NBond strength of plating on end face 4.8 Mounting in accordance with IEC 60384-22 paragraph 4.3 No visible damageConditions: bending 1 mm at a rate of 1 mm/s, radius jig 5mm<General purpose series>∆C/CClass 1:NP0: within ±1% or 0.5 pFwhichever is greaterResistance to soldering heat IEC 60384-21/224.9Precondition: 150 +0/–10 °C for 1 hour, then keep for 24±1 hours at room temperaturePreheating: for size ≤ 1206: 120 °C to 150 °C for 1 minutePreheating: for size >1206: 100 °C to 120 °C for 1 minuteand 170 °C to 200 °C for 1 minuteSolder bath temperature: 260 ±5 °CDipping time: 10 ±0.5 secondsRecovery time: 24 ±2 hoursDissolution of the end face plating shallnot exceed 25% of the length of theedge concerned<General purpose series>∆C/CClass 1:NP0: within ±0.5% or 0.5 pFwhichever is greaterD.F. within initial specified valueR ins within initial specified valueSolderability 4.10Preheated the temperature of 80 °C to 140 °Cand maintained for 30 seconds to 60 seconds.1. Temperature: 235±5°C / Dipping time: 2 ±0.5 s2. Temperature: 245±5°C / Dipping time: 3 ±0.5 s(lead free)Depth of immersion: 10mm The solder should cover over 95% of the critical area of each terminationRapid change of temperature 4.11Preconditioning;150 +0/–10 °C for 1 hour, then keep for24 ±1 hours at room temperature5 cycles with following detail:30 minutes at lower category temperature30 minutes at upper category temperatureRecovery time 24 ±2 hoursNo visual damage<General purpose series>∆C/CClass 1:NP0: within ±1% or 1 pFwhichever is greaterD.F. meet initial specified valueR ins meet initial specified valueTEST TEST METHOD PROCEDURE REQUIREMENTSDamp heat with U r load IEC 60384-21/224.13 1.Preconditioning, class 2 only:150 +0/-10 °C /1 hour, then keep for24 ±1 hour at room temp2.Initial measure:Spec: refer to initial spec C, D, IR3.Damp heat test:500 ±12 hours at 40 ±2 °C;90 to 95% R.H. 1.0 U r applied4.Recovery:Class 1: 6 to 24 hours5.Final measure: C, D, IRP.S. If the capacitance value is less than the minimum valuepermitted, then after the other measurements have beenmade the capacitor shall be preconditioned according to“IEC 60384 4.1” and then the requirement shall be met.No visual damage after recovery<General purpose series>∆C/CClass 1:NP0: within ±2% or 1 pFwhichever is greaterD.F.Class 1:NP0: ≤ 2 x specified valueR insClass 1:NP0: ≥ 2,500 MΩ or R ins x C r≥ 25swhichever is lessEndurance 4.14 1.Preconditioning, class 2 only:150 +0/-10 °C /1 hour, then keep for24 ±1 hour at room temp2.Initial measure:Spec: refer to initial spec C, D, IR3.Endurance test:Temperature: NP0: 125 °CSpecified stress voltage applied for 1,000 hours:Applied 2.0 x U r for general product.4.Recovery time: 24 ±2 hours5.Final measure: C, D, IRP.S. If the capacitance value is less than the minimum valuepermitted, then after the other measurements have beenmade the capacitor shall be preconditioned according to“IEC 60384 4.1” and then the requirement shall be met.No visual damage<General purpose series>∆C/CClass1:NP0: within ±2% or 1 pF whichever is greaterD.F.Class1:NP0: ≤ 2 x specified valueR insClass1:NP0: ≥ 4,000 MΩ or R ins x C r≥ 40s whichever is lessVoltage proof IEC 60384-1 4.6Specified stress voltage applied for 1 minuteU r≤ 100 V: se ries applied 2.5 U r100 V < U r≤ 200 V series applied (1.5 U r + 100)200 V < U r≤ 500 V series applied (1.3 U r + 100)U r > 500 V: 1.3 U rI: 7.5 mANo breakdown or flashoverREVISION HISTORYREVISION DATE CHANGENOTIFICATIONDESCRIPTIONVersion 16 Mar. 7, 2017 - - 0805 L4 spec updatedVersion 15 Nov. 21, 2016 - - Product range updatedVersion 14 Jul. 22, 2016 - - Add 0805/8.2nF and 10nF/ 16V to 50V, T=1.25mm Version 13 May. 16, 2016 - - Product range updatedVersion 12Feb. 16, 2016- - Product range updatedVersion 11Sep. 11, 2014- - Product range updatedVersion 10Feb. 18, 2014- - Product range updatedVersion 9Jun. 17, 2013- - Product range updatedVersion 8Aug 05, 2011- - Dimension updatedVersion 7Jun 14, 2011- - Size1210 T=1.0mm SPQ added - Dimension updatedVersion 6Jan 06, 2011- - Dimension updatedVersion 5Dec 29, 2010- - Dimension updatedVersion 4Nov 23, 2010- - Dimension updatedVersion 3Apr 20, 2010- - The statement of "Halogen Free" on the cover added- Dimension updatedVersion 2Oct 26, 2009- - Typo updatedVersion 1Jun 02, 2009- - 12NC code updatedVersion 0Apr 15, 2009- - New datasheet for general purpose NP0 series with RoHS compliant- Replace the "16V to 50V" part of pdf files: NP0_16V_7, NP0_16V-to-100V_6, NP0_25V_7, NP0_50-to-500V_11- Combine 0201 from pdf files: UP-NP0X5RX7RY5V_0201_6.3-to-50V_2and UY-NPOX5RX7RY5V_0201_6.3-to-50V_2- Define global part number- Description of "Halogen Free compliant" added。

嘉立创可贴片元器件清单

C1857 C1871 C5378 C8031 C12656 C13585 C13967 C14663 C14853 C14857 C14858 C15195 C15849 C15850 C16149 C16772 C19666 C19702 C21117 C21120 C21895 C22397 C23630 C23733 C23969 C28260 C28262 C28323 C29823 C31106 C31658 C32949 C35216 C37474 C38523 C39148 C45783 C46219 C47339 C49217 C49678 C53134 C53172 C53175 C53987 C57112 C59461 C1600 C1615 C1788 C1800 C1803 C1820 C67560 C1832 C1792
阻值(Ω)/容值电压 (uF) 0.0010000000 50.00 0.1000000000 16.00 0.0022000000 50.00 0.0004700000 50.00 0.0001000000 50.00 0.0000120000 50.00 0.0000150000 50.00 0.0000180000 50.00 0.0000015000 50.00 0.0000220000 50.00 0.0000022000 50.00 0.0000330000 50.00 0.0010000000 50.00 0.0001500000 50.00 0.0015000000 50.00 0.0002200000 50.00 0.0022000000 50.00 0.0220000000 50.00 0.0033000000 50.00 0.0004700000 50.00 0.0470000000 50.00 0.4700000000 25.00 0.0006800000 50.00 0.0068000000 50.00 0.0000100000 50.00 0.0000015000 50.00 0.0000180000 50.00 0.0000200000 50.00 0.0000220000 50.00 0.0000270000 50.00 0.0000330000 50.00 0.0003300000 50.00 0.0000047000 50.00 0.0000470000 50.00 0.0000068000 50.00 0.0010000000 50.00 0.0100000000 50.00 0.0220000000 50.00 0.0330000000 50.00 0.3300000000 50.00 0.0004700000 50.00 0.0047000000 50.00 4.7000000000 25.00 0.0000100000 50.00 0.0001000000 50.00 0.0000150000 50.00 0.0000180000 50.00 0.0000200000 50.00 0.0000220000 50.00 0.0000300000 50.00 0.0000330000 50.00 0.0100000000 50.00 0.1000000000 50.00 1.0000000000 50.00 0.0002200000 50.00

国巨贴片电容X7R规格书——日科

Table 4 Size 1206 CAP.
100 pF 150 pF 220 pF 330 pF 470 pF 680 pF 1.0 nF 1.5 nF 2.2 nF 3.3 nF 4.7 nF 6.8 nF 10 nF 15 nF 22 nF 33 nF 47 nF 68 nF 100 nF 150 nF 220 nF 330 nF 470 nF 680 nF 1.0 µF 2.2 µF 4.7 µF 10 µF 22 µF 47 µF
May. 26, 2015 V.12
Product specification
4
19
Surface-Mount Ceramic Multilayer Capacitors
General Purpose & High Cap.
X7R
6.3 V to 50 V
CAPACITANCE RANGE & THICKNESS FOR X7R
terminations
electrodes
MLB457
ceramic material
Fig. 1 Surface mounted multilayer ceramic capacitor construction
DIMENSION
Table 1 For outlines see fig. 2 TYPE 0201 0402 0603 0805 1206 1210 1812
0.85±0.1
1.25±0.2 0.8±0.15 1.25±0.2 1.25±0.2 1.25±0.2 1.25±0.2
1. Values in shaded cells indicate thickness class in mm 2. Capacitance value of non E-6 series is on request 3. For product with 5% tolerance, please contact local sales force before ordering

国网单相载波通道模块使用说明书V1.2

国网单相载波通道模块说明书V1.2青岛鼎信通讯有限公司青岛鼎信通讯有限公司目录1 概述 (1)2 主要功能与特点 (1)2.1 上电自动读取表号 (1)2.2 支持自动登录 (2)2.3 支持事件上报 (2)2.4 支持DL/T645-1997/2007和数据透明传输 (3)2.5 支持主发模式 (3)2.6 支持从节点中继、从节点侦听功能 (3)3 主要参数与其使用网络负载测试 (3)3.1 主要参数 (3)3.2 国网单相载波通道模块使用网络负载测试的环境与记录 (4)4 工作原理 (5)4.1 外接接口定义与说明 (5)4.2 工作原理框图 (6)4.3 国网单相载波通道模块典型应用电路 (6)5 国网单相载波通道模块的检测 (8)5.1 检测设备与测试环境 (8)5.2 不良现象及处理方法 (8)6 载波通道模块生产与使用时的注意事项 (8)6.1 ESD与电路防护 (8)6.2 质量控制 (9)6.3 生产工艺 (9)7 国网单相载波通道模块的布线特点 (9)7.1 EMC防护 (9)7.2 芯片散热 (9)7.3 载波接收电路 (9)附录 A (11)A.1 国网单相载波通道模块各管脚实测波形 (11)A.2 国网单相载波通道模块尺寸图 (14)A.3 器件选型 (15)1 概述国网单相载波通道模块是鼎信公司应用载波通道芯片TCC081C 实现载波通信功能的一款产品。

其核心技术是利用正交码进行数据扩展频谱传输，使用电力线过零分时得到最利于传输的3.3ms 微分时段同步传输，比单纯使用扩频方式的通信能力和稳定性都有巨大的提高；内置DSP 数字信号处理模块保证载波通信计算需求，使用AD 采样方式进行扩频计数，抗干扰能力大大增加。

该模块主要用于自动抄表领域，为电力行业或其它公共事业部门提供了一种优秀的自动抄表系统解决方案。

2 主要功能与特点2.1 上电自动读取表号载波模块上电2s 后，芯片TCC081C 会向从节点发送读取地址命令，能够自适应的选择使用四种通信速率、三种读地址命令。

贴片电容的精度规格书

容量与误差：实际电容量和标称电容量允许的最大偏差范围。

一般分为3级：I级±5%,11级±10%,111级±20%.在有些情况下，还有0级，误差为土20%.精密电容器的允许误差较小，而电解电容器的误差较大，它们采用不同的误差等级。

常用的电容器其精度等级和电阻器的表示方法相同。

用字母表示：D--005级--±0.5%;F--01级--±1%;G--02级--±2%;J--I级--±5%;K--II级--±10%;M--III级--±20%.一、电容的型号命名1）我们常见的电容品牌有三环电容、YAGEO电容、MURATA电容、风华电容、SAMSUNG电容、AVX电容等。

各国电容器的型号命名很不统一，国产电容器的命名由四部分组成：第一部分：用字母表示名称，电容器为C.第二部分：用字母表示材料。

第三部分：用数字表示分类。

第四部分：用数字表示序号。

2）电容的标志方法：（1）直标法：用字母和数字把型号、规格直接标在外壳上。

（2）文字符号法：用数字、文字符号有规律的组合来表示容量。

文字符号表示其电容量的单位：P、N、u、m、F等。

和电阻的表示方法相同。

标称允许偏差也和电阻的表示方法相同。

小于10pE的电容，其允许偏差用字母代替：B--±0.1pF,C--±0.2pFrD--±0.5pF,F--±1pF.（3）色标法：和电阻的表示方法相同，单位一般为pF.小型电解电容器的耐压也有用色标法的，位置靠近正极引出线的根部，所表示的意义如下表所示：（4）进口电容器的标志方法：进口电容器一般有6项组成。

第一项：用字母表示类别：第二项：用两位数字表示其外形、结构、封装方式、引线开始及与轴的关系。

第三项：温度补偿型电容器的温度特性，有用字母的，也有用颜色的，其意义如下表所备注：温度系数的单位10e-6/°C；允许偏差是%.第四项：用数字和字母表示耐压，字母代表有效数值，数字代表被乘数的10的幕。

贴片电容型对照表三星国巨风华选型替代必备

风华高科电容多层片式陶瓷电容0805 CG 104 J 500 N T1 2 3 4 5 6 71、尺寸2、介质种类3、标称电容量（PF）4、误差级别5、工作电压6、端头类别7、包装方式型号英寸毫米代码介质材料表示方法实际值代码误差表示方法实际电压标记端头材料标记包装0402 0.04*0.02 1.00*0.5 CG COG和NPO 100 10*100J ±5% 6R3 6.3V S 纯银T 编带0603 0.06*0.03 1.6*0.8 101 10*101G ±2% 100 10V C 纯铜 B 散装0805 0.08*0.05 2.00*1.25 102 10*102 C ±0.25PF 250 25V N 三层电镀1206 0.12*0.06 3.2*1.6 500 50V三星电容多层片式陶瓷电容CL 10 C 101 J B 8 N N N C1 2 3 4 5 6 7 8 9 10 11CL表示：多层陶瓷贴片电容2、尺寸3介质种类4、标称电容量（PF）5、误差级别6、工作电压7、厚度8端头类别型号英寸毫米代码介质材料表示方法实际值代码误差表示方法实际电压标记尺寸(mm)标记端头材料0402 0.04*0.02 1.00*0.5 CPRSTUL COGP2HR2HS2HT2HU2JS2L100 10*100 J ±5% R 4V 3 0.3 N 三层电镀0603 0.06*0.03 1.6*0.8 101 10*101 G ±2% Q 6.3V 4 0.50805 0.08*0.05 2.00*1.25 102 10*102 C ±0.25PF P 10V 89ACD0.8 0.9 0.650.851.001206 0.12*0.06 3.2*1.6 OALB 16V 25V 35V 50VAB Y F X X5RX7RX7SY5VX6SKMZ±10%±20%+80/-20%CDEFGHIJK100V200V250V350V500V630V1000V2000V3000V国巨（YAGEO）电容多层片式陶瓷电容CC ×××× × ×NPO ×BN ×××1 2 3 4 51、尺寸2、误差精度3、包装形式4、实际电压值5、标称电容量型号英制型号公制代码误差表示方法实际值代码电压代码实际值0201 0603 BCDFGJ±0.1PF±0.25PF±0.5PF±1%±2%±5%R 纸卷盘7inch 7 16V 100 10*1000402 1005 K 吸塑卷盘7inch 8 25V 101 10*101 0603 1608 P 纸卷盘13inch 9 50V 102 10*102 0805 2012 F 吸塑卷盘13inch1206 3216 C 散装1210 32251812 4532TDK贴片电容型号TDK贴片电容的参数识别C 2012 X7R 1H 104 K T系列名称体积材料电压容量误差包装0603=0201 CH 0J=6.3V C=0.25 T=卷带1005=0402 COG 1A=10V D=0.5 B=袋装1608=0603 JB 1C=16V J=5%2012=0805 JF 1E=25V K=10%3216=1206 X7R 1H=50V M=20%3225=1210 X5R 2A=100V Z=+80-20%4532=1812 Y5V 2E=250V5650=2220 2J=630V4520=1808 3A=1KV3D=2KV3F=3KV。

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CC 0805 K K X7R 9 B N 104
Code 1~2 Series Name CC = Multi-layer chip cap. CA = Cap. Array CL=Low. Inductance Code 3~6 Size Code inches (mm)
0402 0603 0805 1206 1210 1808 1812 2220
Rins > 10GΩ or RinsxC≥500s, whichever is less. No breakdown
Rins > 10GΩ or RinsxC≥500s, Whichever is less.
Rins > 10GΩ or RinsxC≥100s, whichever is less.
PCB Layout for Reliability test:
Solder resist
-3-
YAGEO CORPORATION
Aging Rate
Aging Curve ∆C/C (%) 10
0
-10
NPO X7R Y5V
-20
-30 1 10 100 1000 Hours
-4-
YAGEO CORPORATION
Reflow Profile
Temp
℃
245 225 235±10
183 150
Dielectric withstanding Voltage
At 2.5Ur (for Ur ≤ 100V) 1.5Ur + 100V (for Ur > 100V) 1.5Ur,Ur=1000V 1.2Ur,Ur>1000V for 5Second
-2-
YAGEO CORPORATION
4. DIMENSION (mm)
Y5V ∆C/C ≤ 20% -10% ≤ ∆C/C ≤ 20%
∆C/C: ≤ 20%
-40% ≤ ∆C/C ≤ 30% Tanδ: ≤ 7%, 12.5%, 15% IR: 1000MΩ or RxC ≥ 25s Whichever is less
-40% ≤ ∆C/C ≤ 30% Tan δ: ≤ 7%, 12.5%, 15% IR: 2000MΩ or RxC ≥ 50s Whichever is less
(1005) (1608) (2012) (3216) (3225) (4520) (4532) (5750)
Code 15~17 Capacitance Value (2 significant digits + No. of Zeros) The 3rd digit: 0=×1 3 = × 103 1 = × 10 4 = × 104 2 5 = × 105 2 = × 10 6 = × 106 Letter R is decimal point Code 14 Series N = Non BME B = BME
-5-
YAGEO CORPORATION
5. TESTS AND REQUIREMENTS
IEC 384-10 4.9 4.10 4.11 4.12
4.14
4.15
Requirements NPO X7R ∆C/C ≤ 10% Bending Bending rate 1mm/s, jig. Radius ∆C/C ≤ 1% 340mm Resistance to 260±5°C for 10±0.5s in static ∆C/C ≤ 0.5% or 0.5pF, -5% ≤ ∆C/C ≤ 10% soldering heat solder bath whichever is greater 235±5°C for 2±0.5 s in a static 75% minimum coverage of metallic area Solderability solder bath ∆C/C: ≤ 15% Rapid change NPO/X7R:-55°C to +125°C, ∆C/C ≤ 1% or 1pF, of temperature 5 cycles whichever is greater Y5V: -25°C to +85°C, 5 cycles Damp heat, At 40°C, 90 to 95% RH and Ur ∆C/C:2% or 1pF ∆C/C: ≤ 15% steady state applied (max. 500V, for 56 days whichever is greater (500 hours for Y5V) Tan δ: ≤ 7% Class 2 only 56 days at 40°C, Tan δ: ≤ 2xspecified 90 to 95% RH, No voltage(for IR: 1000MΩ or Value Ur ≥1kV) RxC ≥ 25s Precondition for Class 2 Ur ≤ Whichever is less IR: 2500MΩ or 16V RxC ≥ 25s whichever is less Endurance At upper category temperature, ∆C/C:2% or 1pF ∆C/C: ≤ 20% 2xUr applied (1.5Ur for whichever is greater Ur>50V,1.2Ur for Ur ≥ 1KV) for Tan δ: ≤ 7% 1000hours Tan δ: ≤ 2xspecified Class 2 only 1000 hours, At Value IR: 2000MΩ or upper category temperature, No RxC ≥ 50s voltage (for Ur ≥ 1KV) IR: 4000MΩ or Whichever is less Precondition for Class 2 Ur ≤ RxC ≥ 40s 16V whichever is less Test items Conditions
120-180 Sec.
60-100 Sec.
Time (seconds)
Profile Parameters 參數
1-2℃/Sec ramp 溫昇 ℃ Preheat 150-183℃： ℃：2-3 minutes ℃： Time above 183℃： ℃：60-100 seconds ℃： Peak Temperature：230±10℃ ： ± ℃ Module should only be in oven for 5.5-6 minute
NPO X7R Z5U Y5V
Code 13 Termination B = Ni-barrier A = PdAg
Code 12 Rated voltage 5 = 6.3V 6 = 10V 7 = 16V 8 = 25V 9 = 50V 0 = 100V A= 200V B = 500V C= 1000V D= 2000V E= 3000V Y= 250V Z= 63V
T MAX. 0.55 0.90 1.35 1.3L2 MIN. MAX. 0.15 0.30 0.20 0.60 0.25 0.75 0.25 0.75 0.25 0.75 0.25 0.75 0.25 0.75
L3 Min. 0.40 0.40 0.55 1.40 1.40 2.20 2.20
W T L1 L3
L
L2
Style CC0402 CC0603 CC0805 CC1206 CC1210 CC1812 CC2220 Unit: mm
L 1.0±0.05 1.6±0.10 2.0±0.10 3.2±0.15 3.2±0.20 4.5±0.20 5.7±0.20
W 0.5±0.05 0.8±0.10 1.25±0.10 1.6±0.15 2.5±0.20 3.2±0.20 5.0±0.20 MIN. 0.45 0.70 0.50 0.50 0.50 0.50 0.50
YAGEO CORPORATION
1. SUBJECT: This specification applies on the chip capacitor made by Yageo Corporation. 2. PART NUMBER: Part number of the chip capacitor is identified by the size, tolerance, packing, material and capacitor value. Example:
Code 7 Capacitance tolerance A = ±0.05pF G = ±2% B = ±0.1pF J = ±5% C = ±0.25pF K = ±10% D = ±0.5pF M = ±20% F = ±1% Z = -20/+80% Code 8 Packing style R = Paper tape reel ϕ 7 inch P = Paper tape reel ϕ 13 inch K = Embossed plastic tape reel ϕ 7 inch. F = Embossed plastic tape reel ϕ 13 inch. B = Bulk Bag C = Bulk Cassette Code 9~11 Material
Dissipation factor (Tan δ)
Tanδ≤ 9% or ≤12.5%, Tan δ ≤ 9%, 16V 16V depending on capacitance value Tan δ ≤ 12.5%, 10V
Insulation resistance(IR)
At Ur(rated voltage) for 1 minute Ur>500V,at 500V(DC) for 1minute