IT-180A-I板材说明
技嘉 Triton系列 Triton + Triton 180 简体中文说明书
IEEE 1394接头C
4-4.3
将音源接头插入主板上对应的针脚。
HD AUDIO
Pin 1 2 3 4 5 定义 MIC2_L GND MIC2_R -ACZ_DET LINE2_R Pin 6 7 8 9 10 定义 FSENSE1 FAUDIO_JD LINE2_L FSENSE2 定义 NC NC Line Out(L) NC
将3-pin接头插入主板上对应的系统风扇插座。
4-6 5.25” 前置装置槽的安装
本机箱可容纳最大5 x 5.25” 的前置装置。
需要零件： 无
4-6. 1 4-6.2 4-6.3 4-6.4
拆下前面板(请参见第4页的步骤1-3.2)， 并将网状磁盘挡板从前面板上 拆下。 拆下前方EMI板， 并将前面板装在机箱上。 将5.25” 装置从机箱前方滑入磁盘槽。 用内部卡榫将5.25” 装置固定。
简体中文
3. 规格
Triton 型号 机箱型式 尺寸(宽x高x深) 前面板材质 颜色 侧板 本体材质 净重 5.25吋磁盘槽(外部) 3.5吋磁盘槽(外部) 3.5吋磁盘槽(内部) PCI插槽 主板兼容 系统风扇(前) 系统风扇(后) 多媒体I/O端口 GZ-XX1CA-SNS/SNB 中型机塔 200 x 440x 480 mm 铝 银/黑 Intel CAG1. 1 0. mm SECC 7 8.4kg 5 2 3 7 ATX / Micro ATX / Flex ATX 12cm静音风扇x 1 12cm静音风扇x 1 USB2.0 x 2、 IEEE 1394 x 1、 音源接头x 1 (HD & AC’ 97) Triton 180 GZ-AX1CA-SDS/SDB GZ-AX1CA-SD1/SD2
ICT518FR手册（1）
ICT518FR⼿册（1）第⼀章系統安裝1. 配備表2. 使⽤環境2.1. 使⽤電源2.2. 氣壓2.3. 最⼩⼯作空間2.4. 操作溫度2.5. ⼯作照明2.6. 不斷電系統或穩壓器2.7. ⼀般性注意事項3. 設備安裝3.1. 機械部分組裝3.2. 細部連接3.3. 壓床安裝3.4. 治具安裝3.5. 軟體安裝3.6. 軟體移除3.7. 開機3.8. 關機3.9. 軟體安裝問題排除4. 注意事項4.1. 印表機操作注意事項4.2. 待測電路板注意事項4.3. ⾃動放電功能使⽤環境4.4. ⽇常保養事項5. 系統規格5.1. 測試點數5.2. 測試步驟5.3. 測試時間5.4. 量測範圍5.5. 隔離點電路5.6. IC 開路測試5.7. 可測電路板尺⼨5.8. 主控制電腦5.9. 監視器5.10. 週邊配備5.11. 印表機5.12. 治具型式5.13. 氣壓零件5.14. ⼯作氣壓5.15. 供應電壓5.16. 尺⼨重量5.17. 溫度及溼度5.18. 其他選購配備1. 配備表TR-518FR的標準配備包括下列各項，如因貴客⼾在採購時另有需求，則以送貨單為準。
項⽬品名數量1.使⽤⼿冊 12.TR-518FR Windows95 版軟體 113.電腦主機附 TR-518FR DIGITAL I/O Card(for Windows95)4.14" 彩⾊監視器 15.TR-518FR 測試主機附測試桌 16.壓床 17.40-COLUMN 印表機 18.旋轉臂 19.64-Pin 排線 410.34-Pin 排線 111.D-Type 15-Pin 信號線 112.探棒 113壓棒 6014.內六⾓板⼿ 115. 5 × 20 mm 螺絲 616.印表機⾊帶 117.印表機紙捲 218.PVC 桌墊 119.防塵套 120.壓縮空氣管 12. 使⽤環境適宜的⼯作環境可確保 TR-518FR 之使⽤壽命及⼯作效率。
高频高速材料介绍
導體表面粗糙度
訊號頻率愈高，肌膚效應(Skin effect)愈明顯，因此訊 號傳輸導體表面愈平坦愈好
2013/7/17
εeff : 介質常數 (effective dielectric constant) tanδ : 散逸因子 (dissipation factor) f : 頻率 (frequency) c : 光速 (light speed)
2013/7/17 BoardTek 15
無鉛組裝的影響 – 熱衝擊加大
Dicy板材耐熱性不足
爆板率由 100 ppm 拉高至 10,000 ppm 以上
降低孔銅的可靠度
溫度提高， Z 軸的膨漲程度加大，孔銅承受的應力加大， 孔銅斷裂的風險提高 成品板厚愈厚者，風險愈高
2013/7/17
2013/7/17
BoardTek
23
無鹵板材
耐燃性
無鹵耐燃劑雖可達 94V-0 等級，但表現仍不如 TPPBA 添加 Fillers 以補強 Fillers 一般以 SiO2、Mg(OH)3、Al(OH)3為主
特性
Td 高 Z 軸 CTE 低 樹脂 Df 低 耐熱性佳 CAF 佳 Dk 較高低 Dk 需求時調整 Fillers
2013/7/17
BoardTek
8
散逸因子 : Df
對交流電在功能上損失的一種度量 絕緣材料 (樹脂) 的一種特性 與所見到的電功損失成正比 與週期頻率（f），電位梯度的平方（E2），及單 位體積成反比 其數學關係為
Dissipation Factor=
Power loss （E2）*（f）*（Volume × Constant）
IT8511使用手册
IT8500 用户手册
认证与质量保证
IT8500 系列电子负载完全达到手册中所标称的各项技术指标。
保固服务
ITECH 公司对本产品的材料及制造，自出货日期起提供一年的质量保固服务（保 固服务除以下保固限制内容） 。 本产品若需保固服务或修理，请将产品送回 ITECH 公司指定的维修单位。 若需要送回 ITECH 公司作保固服务的产品，顾客须预付寄送到 ITECH 维修 部的单程运费，ITECH 公司将负责支付回程运费。 若从其它国家送回 ITECH 公司做保固服务，则所有运费、关税及其它税赋均 须由顾客负担。
声明
© Itech Electronics, Co., Ltd. 2015 根据国际版权法， 未经 Itech Electronics, I Co., Ltd. 事先允许和书面同意，不得以 任何形式（包括电子存储和检索或翻译为 其他国家或地区语言）复制本手册中的任 何内容。
担保
本文档中包含的材料 “ 按现状 ” 提 供，在将来版本中如有更改，恕不另 行通知。此外，在适用法律允许的最 大范围内， ITECH 不承诺与本手册 及其包含的任何信息相关的任何明 示或暗含的保证，包括但不限于对适 销和适用于某种特定用途的暗含保 证。 ITECH 对提供、使用或应用本 文档及其包含的任何信息所引起的 错误或偶发或间接损失概不负责。如 ITECH 与用户之间存在其他书面协 议含有与本文档材料中所包含条款 冲突的保证条款，以其他书面协议中 的条款为准。
安全声明
手册部件号
IT8500-402212
版本
第1版， 2015年 03月 20 日 发布 Itech Electronics, Co., Ltd.
小心标志表示有危险。它要求在 执行操作步骤时必须加以注意， 如果不正确地执行或不遵守操作 步骤，则可能导致产品损坏或重 要数据丢失。在没有完全理解指 定的条件且不满足这些条件的情 况下，请勿继续执行小心标志所 指示的任何不当操作。
艾伦塔斯电气绝缘漆型号说明
艾伦塔斯电气绝缘漆型号说明产品分类浸渍绝缘漆和树脂混合物漆包线漆产品浸渍绝缘漆和树脂混合物浸渍&滴浸不饱和聚酯树脂品牌产品应用Pedigree50VT-170变压器, VPI/浸渍Pedigree4000SW12,?ü·aμ??úoí?￡òyμ??ú,VPI/?t×?Pedigree600 HI Bondμ??ú,VPI/1??tPedigree70VT Pre-Cat电机和线圈,VPI/浸渍Pedigree6183 SW电枢, 滴浸/滚浸Pedigree8183 SW电枢, 滴浸/滚浸RanVar2003AK共聚物,大电机,VPI/浸渍Sterling075-0015电枢和定子, 滴浸/滚浸/浸渍Sterling075-1775高压无规绕制线圈和模绕线圈,VPI/浸渍Sterling075-3489定子/变压器/线圈,浸渍,可提供红色产品. Sterling075-3798电枢和定子, 滴浸/滚浸/浸渍,高弹性Sterling075-2715包封胶,电枢,刚性的,快速固化Sterling075-3715包封胶,电枢,刚性的,较长的凝胶时间Sterling075-4715包封胶,电枢,柔软的Pedigree6180μ??ú,VPI/1??t水性树脂&绝缘漆品牌产品应用Guardian GRC 59-10密封电机,浸渍, 高粘结力,低挥发性有机化合物含量Guardian GRC 59-42密封电机,浸渍, 高粘结力,低挥发性有机化合物含量Guardian GRC 59-50密封电机,浸渍, 高粘结力,低挥发性有机化合物含量Pedigree1000-70电机定子,浸渍Pedigree2500-30M电机定子,浸渍,低挥发性有机化合物含量Pedigree2500-25MUV电机定子,浸渍,低挥发性有机化合物含量Isonel ISOPOXY 771B浸渍,高粘结力,耐冷冻剂,定子/高速转子.Isonel ISOPOXY 800P浸渍,高粘结力,耐冷冻剂,定子/高速转子.浸渍&滴浸环氧树脂&绝缘漆品牌产品应用Ripley E 468-2FXT变压器, VPI/浸渍Ripley E 468-2变压器, VPI/浸渍Ripley E 468-2FC变压器, VPI/浸渍Ripley E 468-2-7FC变压器, VPI/浸渍Sterling006-0841高达13.8KV的电机和变压器, VPI, 单组分环氧树脂Sterling006-3222牵引电机, VPI, 单组分环氧树脂Sterling E 300发电机,湿法绕线Sterling E 300-20发电机,湿法绕线Ripley E 478 THIXO VPI电机,VPI/浸渍Guardian GRC20-32.5 REV 3变压器, VPI/浸渍浇注&灌封树脂品牌产品应用Pedigree200 & 65 hardener浇注/浸渍,电气和电子部件Pedigree E 57 Red & 226 hardener浇注/灌封,应用于机械或电气方面.. Pedigree E88&C89浇注/灌封高压线圈或回扫线圈Pedigree300 series,浇注/灌封变压器表面漆&浸渍绝缘漆品牌产品应用Sterling009-0008气干漆,线圈/变压器, 浸/喷/刷Sterling003-1980电机/线圈/变压器,浸渍&烘烤,醇酸树脂漆Isonel885电机/线圈/变压器,浸渍&烘烤,醇酸树脂漆Pedigree434-66气干漆,线圈/变压器, 浸/喷/刷Sterling003-1981电机/线圈/变压器,浸渍&烘烤,醇酸树脂漆, 快速固化Sterling003-1010浸渍&烘烤,醇酸树脂漆, 电机修补Sterling77X-010气干漆,浸/喷/刷Viking V1630 FS Clear气干漆,浸/喷/刷,不含苯系溶剂.Sterling Y-210浸渍&烘烤,工业标准,优异的槽稳定性其它产品品牌产品应用漆包线漆产品聚氨酯漆产品注释Tongsold 215/24??? ? ? ? ??,? ? ? ????? , UL ? ? ? ?¤Tongsold 215/30高速漆,无针孔, UL 认证Tongsold 215/35高速漆,无针孔, UL 认证Tongsold 215/28S高速漆,无针孔, UL 认证赛克改性聚酯亚胺漆产品注释Tongvar 355/19表面和柔性好,UL认证Tongvar 355/27表面和柔性好,UL认证Tongvar 355/30表面和柔性好,UL认证Tongvar 355/33表面和柔性好,UL认证T ongvar 355/38表面和柔性好,UL认证Tongvar 355/41表面和柔性好,UL认证Tongvar 355/40G更适合高速机TerebecR MT 533-39通用赛克改性聚酯漆产品注释TeresterC 966-27HVS通用,高速,极好的卷绕性TeresterC 966-36HVS通用,高速,极好的卷绕性TeresterC 966-40HVS通用,高速,极好的卷绕性TeresterC 966-45HVS通用,高速,极好的卷绕性聚酰胺酰亚胺漆产品注释Tongmid 595/20MB通用型T ongmid 595/25MB通用型Tongmid 595/28MB通用型Tongmid 595/34MB通用型Tongmid595/36MB通用型尼龙漆产品注释Tongslip 602/05自润滑,高熔点T ongslip 602/05自润滑,高熔点聚酰胺自粘漆产品注释Tongbond 6304/07在140-170oC粘结,可焊,抗湿,高粘结力Tongbond 6304/12在140-170oC粘结,可焊,抗湿,高粘结力Tongbond 6304/14在140-170oC粘结,可焊,抗湿,高粘结力Tongbond 6304/18M在140-170oC粘结,可焊,抗湿,高粘结力漆包线漆稀释剂产品注释Thinner 100聚氨酯漆稀释剂, 供应线表面润滑剂Thinner 300聚酯漆和聚酯亚胺漆稀释剂, 供应线表面润滑剂Thinner 500聚酰胺酰亚胺漆稀释剂, 供应线表面润滑剂Washing Solvent 500清洗漆包模和其它工具, 供应线表面润滑剂。
T180控制箱说明书
T180 控 制 箱使 用 说 明 书小原(南京)机电有限公司为了安全地使用本产品，使用前，务必熟读安全注意事项，并在充分理解的基础上使用本产品。
阅读后，请将本手册保管在规定的场所。
目录Ⅱ.控制箱部分1.使用注意事项------------------------------------------------------------------------------------ 32.主要特点------------------------------------------------------------------------------------------ 43.主要技术规格------------------------------------------------------------------------------------ 54.安装------------------------------------------------------------------------------------------------ 65.操作------------------------------------------------------------------------------------------------ 116.维护------------------------------------------------------------------------------------------------ 237.参考资料------------------------------------------------------------------------------------------ 288.附录----------------------------------------------------------------------------------------------- 441.安全注意事项为避免人身伤害、防止本产品及与本产品相连接的其它产品受到损坏，使用前请阅读以下安全注意事项。
IT-180A Process Guideline rev 06-11 联茂 板材 报告
IT-180ABS/IT-180ATCHigh Tg, Low CTE, Multifunctional Filled Epoxy Resin and Phenolic-Cured Laminate & Prepreg---------------------------------------------------------------------------------------------------------------------------------------------- Process GuidelineThese process guidelines are the ITEQ interior test experience. We believed that should have helps for the PCB manufacturer. Especially, for those print circuit board manufacturers who first time apply this material. But these experiences will be unable to cover all rank of designs and applications, as well as print circuit board fabrication equipments, chemicals and technologies. The suggestions must pass through initial trial run to set up the process, and then the basis actual test results carried on the working condition and the revision.1. Material Handling & Storage(1) Shelf life is at least three months when prepreg stored in a cool dry environment (Temperatureless than 20℃and Humidity less than 50%RH). Six months shelf life under 5℃.(2) Prepreg should exposed to well humidity and temperature controlled environment.(3) Prepreg should be stored in controlled environment for 12 hours before to use.(4) Prepreg supplied in rolls or panels should be stored horizontally. To avoid damage, no stacking isrecommended.(5) Laminates should be stored in a dry environment.(6) Laminate should always be stored flat.2. Inner Layer & Copper Treatment(1)Scaling factors may performer differently by laminate thickness, as well as the ration of remnantcopper. First article must be run before mass production to determine suitable compensation factor.(2) The inner layers should be put in a temperature and humidity controlled room for 8 hours beforepunching guide hole and AOI. That attribute to better dimension stability and registrationpurpose.(3) Inner layers should be baked for 40 minutes at 120℃at least after black or brown oxidestreatment.(4) We strongly suggest to re-new fresh rinse water of DES lines and brown/black oxide lines, thatwould help to against CAF(Conductive Anode Filament) problem. An abundant of metallic ions and other pollution remain in the tanks, that maybe cause CAF failure.3. Lamination Overview(1)Stacks must be prepared in a temperature and humidity controlled lay-up room to avoid moistureabsorption.(2) It is recommended to apply vacuum for 10-30 minutes before temperature ramping up. Vacuumhydraulic machine is recommended for lamination process. The heating raise by thermal couple is 1.5~2.0℃/min from 80℃ to 140℃ and keep the temperature at 185℃ above for more than 60 minutes is necessary. Full pressure is 300-400 psi. Cooling rate below 3℃/min is recommended as shown in Figure 1.Figure 1. Recommended press cycle(3) For those PCB manufacturers who use hot start (more than 180℃), lowering 25-50 psi is proper.However, for some of PCB manufactures may be proper to get pressure drop for 100 psi that is also workable. Provide full pressure at 90-120℃ by product temperature (not platen temperature) is recommended.(4) The resin flow properties of this material would help to filled resin for heavy copper application,thus we suggest setup even higher level than above recommended press cycle, and please making cross section to check if the glass fiber sticks on the inner layer copper, especially for more than 2oz inner layer. 5um butter core at least or more is recommended and it will enhance thermal reliability.(5) For the construction of multi-plies ultra heavy glass (7628) and with ultra high resin content, weestimate that have more resin flow of the board edge, but doesn’t influence the reliability,however, we suggest to use bigger copper foil or to move the full pressure down, that could be avoid resin to stick steel platen.(6) The dynamic viscosity at 1.5-3℃/min (Figure 2.) are shown as below for user’s reference.(7) Each single press will possibly have different temperature rise curve. Therefore, to trace heat riseand Tg in middle and outer laminates with thermal couple as well as cross section which can confirm the results are reliable.Figure 2. Dynamic viscosity at 1.5-3℃/min4. Drill Process(1) We suggest to use undercut drill bit for the hole size less than 1.2mm hole size. The hit countsfor hole size less than 0.5mm (20mil) would be around 500-1000 hits. Hole size larger than0.5mm can be up to 800-1500 hits.(2) Standard Aluminum entry board and backup board work well.(3) Heavy copper (inner layer copper thickness > =3oz), higher layer boards, thick boards ormulti-plies ultra heavy glass fiber (7628), we suggest to use lubricate Aluminum entry board would help for reduce heat in the hole. The parameters that are with lower speed and lower infeed and retract would be helpful for hole wall quality.(4) Please make sure the dirt and dust are drawn into a vacuum suction. It would be helpful toagainst gouging in the holes.(5) Baking at 120~140°C for 2 hours after drilling process to soften the smear maybe helpful forsmear removal. (Some one bake the boards before plasma or desmear that looks good for higher layer and thick boards)(6) Stack height is according to the board construction and overall thickness and aspect ratio.(7) Below table lists the series parameters are just for user’s reference, we assume the boardthickness is around 0.080 inch. It needs to be fine tune for different tools, board constructions, board thickness, layers and copper weights.(8) After drilling process, using air guns blow the boards to avoid hole plug.(9) According to internal tests, if occurs the perpendicular resin crack happened after thermal stress,use higher chiploads for this material maybe can improve resin crack issue.(10) For higher layers, thick or heavy copper boards, peak drilling (two to three steps) maybenecessary to drive to high quality drilling performance, including roughness, nail head, smear, even attribute to IP/ICD problem.Table 1. Drill parameter for reference.Drill Size Spindle Surface Speed Infeed Chipload Retract inch mm KRPM SFPM SMPM in/min m/min mil/rev um/rev in/min m/min 0.0098 0.25 100 258 79 63 1.6 0.63 16 591 15 0.0118 0.3 95 294 90 63 1.6 0.66 17 787 20 0.0138 0.35 85 307 93 63 1.6 0.74 19 984 25 0.0157 0.4 85 350 107 63 1.6 0.74 19 984 25 0.0177 0.45 80 371 113 63 1.6 0.79 20 984 25 0.0197 0.5 80 412 126 79 2.0 0.98 25 984 25 0.0217 0.55 80 454 138 79 2.0 0.98 25 984 25 0.0236 0.6 80 495 151 79 2.0 0.98 25 984 25 0.0256 0.65 80 536 163 79 2.0 0.98 25 984 25 0.0276 0.7 68 491 150 79 2.0 1.16 29 984 25 0.0295 0.75 68 526 160 71 1.8 1.04 26 984 25 0.0315 0.8 68 561 171 71 1.8 1.04 26 984 25 0.0335 0.85 58 508 155 71 1.8 1.22 31 984 25 0.0354 0.9 58 538 164 63 1.6 1.09 28 984 25 0.0374 0.95 58 568 173 63 1.6 1.09 28 984 25 0.0394 1 58 598 182 63 1.6 1.09 28 984 25 0.0413 1.05 47 509 155 63 1.6 1.34 34 984 25 0.0433 1.1 47 533 162 51 1.3 1.09 28 984 25 0.0453 1.15 47 557 170 51 1.3 1.09 28 984 25 0.0472 1.2 47 581 177 51 1.3 1.09 28 984 25 0.0492 1.25 47 606 185 39 1.0 0.84 21 984 255. Desmear Process(1) The desmear condition is very close to conventional high Tg phenoic cured materials. RegularVertical or horizontal permanganate desmear equipment and chemical all work well for this material. But please pay attention to the throwing power capability of your machine andchemical. To do cross sections and SEM to check glass fiber and resin clean before/afterdesmear in the drilled through holes is necessary. Etching back of 0.1-0.3mil with three point interconnect would be helpful for reliability.(2) Plasma for this material is not necessary, except for higher layer, thick and heavy copper boards.When users use plasma to enhance the throwing power, please adjust the dwell time ofpermanganate desmear (if necessary) to prevent too much roughness though it maybe not affects the reliability.(3) Baking at 120~140°C for 2 hours after drill or de-burr process (before permanganate desmear )would be helpful for cleaning the smear at hole wall and inner layer coppers.(4) The following vertical desmear parameter as shown in (Table 2.) is for reference only. Users canconsult with the chemical supplier for more information.Table 2. Permanganate desmear for referenceComposition Concentration Temperature Dwell TimeSweller 20-30% 75-80℃7-10 minutesMn+7100g/L 75-80℃10-12 minutesOH-0.9-1.1N -- --6. Safety and HealthAs the edges of laminates may be sharp, be careful handling prepregs and laminates. Prepregs and laminate may create the dusts in the mechanical processes. If there is any unexpected affair, please refer to MSDS (Material Safety Data Sheets). When the mouse, nose and eyes are stained with pollution, please use a great deal of water to clean. Anyway, it is recommended that operators wearing glove, mask and goggles during operating.The data shown above, are based on our interior test results that offer print circuit board manufacturers and designers initial period information. ITEQ believed that these experiences are useful and cover most of major PCB processes. However, ITEQ retains the right to update and renew the information for user’s needs.。
应对无铅制程之覆铜板介绍
0 200 400 600 800 1000 1200 1400 1600 1800 2000
Resistance change(%)
IT-140 IT-180
IT-180A
Thermal cycles Test condition: IPC-TM-650 2.6.7.2 Test Condition D (FR-4) - 55℃*15min.←→125℃*15min.,transfer time ≤2 minutes Test samples: PCB 6 layers, thickness 2.0mm, hole diameter: 0.4mm,pitch:1.2mm.
▲以TMA法將基材加熱至特定溫度，能抵抗Z軸熱脹不致裂開的時間，亦為基材能否通 過無鉛焊接的重要指標。
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3、Td（裂解溫度）：乃以「熱重分析法」（Thermal Gravity Analysis）將樹脂加熱中失 重 5％（Weight Loss）之溫度點定義為Td。Td可判斷板材之耐熱性，作為是否可能 產生爆板的間接指標。IPC新規範建議因應無鉛焊接，一般Tg之Td ＞310℃，Mid Tg 之Td＞325℃，High Tg之Td＞340℃。
汽車
4層
Pass
Pass
I (回流焊測試)
國防航空
4層 2 層, H/H 25mil, L/L 8mil
Pass
Pass
J (絕緣電阻)
汽車
Pass 1000 hours
Pass 1000 hours