BTF020开发评估板使用说明书
TDK-Lambda PFH500F 系列评估板使用说明书
PFH05W Evaluation Board Instruction Manual for PFH500F AC-DC Power ModulesBEFORE USING THE POWER SUPPLY UNITBe sure to read and understand this instruction manual thoroughly before using this product. Pay attention to all cautions and warnings before using this product. Incorrect usage could lead to an electrical shock, damage to the unit or a fire hazard.DANGERNever use this product in locations where flammable gas or ignitable substances are present. There are potential risks of igniting these substances caused by arcing.WARNING•Do not touch this product or its internal components while circuit is live, or shortly after shut down. There may be high voltage or high temperature present and you may receive an electric shock or burn.•While this product is operating, keep your hands and face away from it as you may be injured by an unexpected situation.•Do not make unauthorized changes to this product, otherwise you may receive an electric shock. It will also void the product warranty.•Do not drop or insert anything into the product. It might lead to a failure, fire or electric shock.•Do not use this product if abnormal conditions such as emission of smoke and/or abnormal smell, etc… are present. It might lead to fire and/or electric shock. In such cases, please contact TDK-Lambda. Do not attempt to repair by yourself, as it is dangerous for the user.•Do not operate these products in the presence of condensation. It might lead to fire or electric shock.CAUTION•This power supply is designed and manufactured for use within an end product such that it is accessible only to trained SERVICE ENGINEERS.•Confirm that the connections to input/output terminals, and signal terminals are correct as specified in this instruction manual before turning on the power.•Input voltage, Output current, Output power, ambient temperature, case temperature, and ambient humidity should be kept within the specifications, otherwise the product may be damaged.•Do not operate or store this product in an environment where condensation can occur. Waterproof treatment or special storage and handling is necessary.•The equipment has been evaluated for use in a Pollution Degree 2 environment.•Do not use this product in environment with a strong electromagnetic field, corrosive gas or conductive substances.•For applications, which require very high reliability, such as nuclear related equipment, medical equipment, traffic control equipment, etc., it is necessary to provide a fail-safe mechanism in the end equipment.•Do not inject abnormal voltages into the output terminals or signal terminals of this product. The injection of reverse voltage or over voltage exceeding nominal output voltage into these terminals can damage the internal components of the product.•Never operate the product under over-current or short circuit conditions. Failure or other damage may occur.•The output voltage of this power supply unit is considered to be a hazardous energy level (The voltage is 2V or more and the electric power is 240W or more). It must not be made accessible to users. Protection must be provided for Service Engineers against indirect contact with the output terminals and/or to prevent tools being dropped across them. While working on this product, the AC input power must be switched off, and the input, output, +VBus, and -VBus terminal voltages should be at a safe level. •The application circuits and their parameters are for reference only. Be sure to verify effectiveness of these circuits and their parameters before finalizing the circuit design.•Use a Fast-Blow external fuse to each module to ensure safe operation and compliance with the safety standards to which it is approved. The recommended input fuse rating within the instructions is as follows: 10A, 250V fast acting fuse. The breaking capacity and voltage rating of this fuse may be subject to the end use application.PFH Evaluation Kit with PFH05W Evaluation Test BoardReference Documents:1.) PFH Instruction Manual2.) PFH PMBus Specification Customer Release3.)PFH500F-## Evaluation Report (## - denotes output voltage of PFH500F AC-DC module: “28” = 28 Vdc) 4.)PFH GUI InterfaceCAUTION• This information in this document is subject to change without prior notice. Please refer to the latest version of the data sheet, etc., for the most up-to date specifications of the product.• No part of this document may be copied or reproduced in any form without prior written consent TDK-Lambda.Table of ContentsBEFORE USING THE POWER SUPPLY UNIT (1)1.0 Ordering Information (4)1.1 Evaluation Kit Description (4)2.0 Getting Started (5)2.1 Test Equipment (5)2.2 Test Setup (6)2.3 Test Points (8)2.4 PMBus and Remote On/Off Functions (9)2.5 Setting the PMBus Address (10)2.6 Turning PFH Module On/Off (11)3.0 Electrical Schematic Drawing (12)4.0 Bill of Material (13)5.0 Board Files (14)1.0 Ordering InformationPFH05W ## - 1*0 - EVK - S112V 28V 48V 100 – Non Droop1D0 – Droop Mode forCurrent ShareSingle1.1 Evaluation Kit DescriptionPFH05W12-100-EVK-S1 PFH500F-12-100-R85-265Vac50/60 Hz 12 42.0 NoPFH05W12-1D0-EVK-S1 PFH500F-12-1D0-R12 42.0 Yes PFH05W28-100-EVK-S1 PFH500F-28-100-R28 18.0 No PFH05W28-1D0-EVK-S1 PFH500F-28-1D0-R28 18.0 Yes PFH05W48-100-EVK-S1 PFH500F-48-100-R 48 10.5 No PFH05W48-1D0-EVK-S1 PFH500F-48-1D0-R 48 10.5 Yes* Consult sales for Evaluation Kits that offer 400Hz input line frequency operation.** For simplified paralleling to support higher power or redundant applications, use Droop Mode.2.0 Getting StartedPFH05W##-100-EVK-S1 & PFH05W##-1D0-EVK-S1 Evaluation BoardsNOTE: ## - Denotes output voltage of PFH modules (e.g. “28” for 28Vdc)2.1 Test Equipment1.) AC Voltage Source: Capable of single-phase output, AC voltage range 85 V AC - 265 V AC, 47 Hz - 63 Hz,adjustable. AC Source should be adequately sized to support the PFH module’s operation.2.) DC Multimeter: Capable of 0V to 500V input range.3.) Output Load: DC load capable of 60 V DC or greater, DC Load current up to 42A or greater (12V/42A, 28V/18A, or48V/10.5A), and 500 W or greater, with display such as load current and load power.4.) Fan: Some airflow is required to be directed across the mounted heatsink of the PFH module.2.2 Test Setup1.) Electrical Input Connections: CONN1: LINE, Input Line ConnectionCONN2: NEUT, Input Neutral ConnectionCONN3: EGND, Earth Ground ConnectionNOTE: Refer to the PFH Datasheet for specific module’s AC Input Current requirement when sizing wire gauge and cable length.2.) Electrical Output Connection: CONN5+Vout, Output Load Connections(Red Cable)CONN4-Vout, Output Load Return Connections(Black Cable)WARNINGMake sure ALL input and output cables are de-energized before making electrical connections to the Evaluation TestBoard2.3Test Points1.) Secondary Test Points: TP201 Vout+, Monitor Output VoltageTP204 Vout(-), Monitor Output Voltage returnTP202 RS(+), Output Remote Sense (+) connectionTP203 TRIM, Trim Test connectionWARNING HAZARDOUS VOLTAGE2.) Primary Test Points: TP103 +BUS, Monitor 400VdcTP104 -BUS, Monitor 400Vdc returnTP101 LINE, Monitor AC Line InputTP102 NEUT, Monitor AC Neutral Input2.4PMBus and Remote On/Off Functions1.) PMBus Connections (J301)NOTE:1. 3.3Vdc is supplies by the interface moduleTo communicate with the PFH module via PMBus, use the Texas Instruments Interface Adapter EVM (P/N#: USB-TO-GPIO). This adapter is available through normal distribution channels.Pin #: Description: 1 Not Used 2 Not Used 3 Not Used 4 Not Used 5 USB 3.3Vdc 1 6 SGND 7 Not Used 8 PMBus Alert 9 PMBus Clock 10PMBus DataWARNING When AC voltage is applied to the Evaluation Test Board the 450V bulk capacitors ARE energized at ALL time2.) Remote On/Off (SW200) SW200, Will either turn the module On or put it into Standby3.) Auxiliary Voltage (DS301) DS301, The LED will Turn-On when the 450Vdc bulk capacitorsare energized above 70Vdc4.) Power Good (DS300) DS300, The LED will Turn-On once the module’s output hasbeen Turned-On5.) Test Points TP301 Monitor Auxiliary VoltageTP302 Monitor Power Good Signal2.5 Setting the PMBus Address•The PMBus address setting on the Evaluation Test Board comes with the Factory default setting, Address: 0x19 (Hex) (R318 is not populated & R319 is populated with 1.00K)2.6 Turning PFH Module On/Off1.) Before applying AC voltage to the module make sure,a.The surface under the test fixture is a non-conductive surfaceb.Securely connect Input and Output cables to the test boardc.Securely connect all monitoring devices to test boardWARNING When AC voltage is applied to the Evaluation Test Board the 450V bulk capacitors ARE energized at ALL time2.) Apply AC input voltage to test fixturea.AC input voltage range 100Vac – 265Vacb.AC input voltage range < 100Vac, output load is de-rated 6.7W/Vc.Once AC input voltage is applied, Auxiliary Voltage LED (DS301) will Turn-On3.) Turning On PFH module can be accomplished 1 of 2 ways,i. Remote On/Offii. PMBusa.The method chosen to turn On PFH has to be the SAME method to turn Off PFHi.Example: If Remote On/Off turns On PFH, then PMBus cannot turn it Off, only Remote On/Offcan turn Off PFH.b.Method 1: Toggle Remote On/Off,I. Remote On/Off switch (SW200) On – Will turn PFH OnII. Remote On/Off switch (SW200) Off – Will turn PFH Off.c.Method 2: PMBus,I.Write CMD 0x01, Byte 0x80 – Turns PFH OnII.Write CMD 0x01, Byte 0x00 – Turn PFH Offd.Once PFH is turned On, Power Good LED (DS300) will turn One.When PFH is turned Off, Power Good LED (DS300) will turn Off3.0 Electrical Schematic Drawingsnr4.0 Bill of MaterialPart Reference Mfr Part Number1 Value Description Voltage Mfr1 BMPR1 BMPR2BMPR3 BMPR4BMPR5 BMPR6 SJ-5027 (BLACK) RubberBumper Bumper, Rubber, 0.63" Dia x 0.31" 3MC100 C103 B32923C3105M2040 1uF Film Capacitor,305V, X2 Cap 250V TDKC101 C102 CS45-E2GA332M-NKA 3.3nF Film Capacitor,305V, Y2 Cap 250V TDKC104 B32923C3225M1040 2.2uF Film Capacitor,305V, X2 Cap 250V TDKC105 C106C213 C214 CS45-B2GA471K-NKA 470pF Film Capacitor,305V, Y2 Cap 250V TDKC107 C108 B43508B5477M007 470uF Electrolytic Capacitor, 450V, 35X40 450V TDKC2001 C2011 EEUFC2A471 470uF Electrolytic Capacitor, 100V, 16X40 100V Panasonic C2002 C2012 EEUFC1E152S 1500uF Electrolytic Capacitor, 25V, 16X40 25V Panasonic C202 C203C204 C205C206 C207C208 C209 C3225X7S2A475K200AB 4.7uF Ceramic Capacitor, 100V, 1210, 4.7uF 100V TDKC212 C221 C2012X7R2A104K125AA 0.1uF Ceramic Capacitor, 100V, 0805 100V TDKC222 C223 C3216X7R2A105MT 1.0uF Ceramic Capacitor,100V, 1206, 1.0uF 100V TDKC301 C2012X7R1E105KT 1.0uF Ceramic Capacitor, 25V, 0805 25V TDKCM1013 PFH500F-##-1*0-R AC/DC Module, 504W TDK CONN1 CONN2CONN3 CONN4CONN5 8196 PC Screw TerminalCR100 CRH01 CRH01 PN Diode, Single Package, SMT TOSHIBADS300 DS301 5381H5 5381H5 LED, Green, Thru Hole Chicago Miniature LampF100 F101 1A1907-03 1A1907-03 Fuse, Fuse holder, PWB BUSSMANN F102 312010 312010 Fuse, 10A Fuse, Fast-Blow LittlefuseJ301 N2510-60XX TI_USB_PMBUS .100" x .100" Four-Wall Header 3mK100 JVN1A-12V-F JVN1A-12V-F RELAY SPST PanasonicL100 L102 ARA00499 6.3mH Com Ind, 6325uH, Thru Hole TDK-Lambda PWB100 ZB00511 ZB00511 PWB, (n) oz. Cu, .062"R100 A5MC-220J 22.0 Res,22.0,1.6W 250V UCHIHASHI R102 R103R104 SPR2C474J 470K Res,470K,2.0W 250V KOA SPEER R200 RK73Z2ATTE 0 Res,0,2.0A,70C,0805 N/A KOA SPEER R300 R301 RK73H2ATTE1001F 1.00K Res,1.00K,0.125W,100ppm,70C,0805 150V KOA SPEER R311 R312R313 RK73H2ATTE1501F 1.50K Res,1.50K,0.125W,100ppm,70C,0805 150V KOA SPEER R315 R316R317 RK73H2ATTE30R1F 30.1 Res,30.1,0.125W,100ppm,70C,0805 150V KOA SPEER R318 N/A Omit Res,Omit,0805 N/A N/AR319 RK73H2ATTE1001F 1.00K Res,1.00K, 0.125W,100ppm,70C,0805 150V KOA SPEER SW200 T101SHCQE SPDT SPDT two position switch vertical (On None On) C&KTP101 TP102TP104 TP204 5011 5011 Test Point, Black, Thru Hole Keystone ElectronicsTP103 TP201TP202 5010 5010 Test Point, Red, Thru Hole Keystone ElectronicsTP203 TP301TP302 5014 5014 Test Point, Yellow, Thru Hole Keystone ElectronicsNOTE:1.Output capacitors used on PFH05W28-100-EVK-S1 & PFH05W48-100-EVK-S12.Output capacitors used on PFH05W12-100-EVK-S13.## - Denotes output voltage of (e.g. “28” for 28Vdc) and * denotes either Droop (1D0) or Non-Droop (100)5.0 Board FilesFIGURE 1 Top side Component PlacementFIGURE 6 Bottom side Component PlacementFIGURE 7 Circuit OutlineFor additional information, please visit https:///en/power/。
BM23蓝牙评估板用户指南说明书
BM23 Bluetooth®Evaluation Board User’s GuideIndex Preface (4)1 OVERVIEW (6)1.1 INTRODUCTION (6)1.2 BM23 EVALUATION BOARD FEATURES (7)1.3 BM23 EVALUATION BOARD CONTENTS (8)1.4 BM23 EVB KIT CONTENTS (10)2. Getting Started (11)2.1 INTRODUCTION (11)2.2 HARDWARE REQUIREMENTS (11)2.2.1 Hardware Setup (11)2.2.2 Using Evaluation Board (11)2.3 APPLICATION DEMONSTRATION (11)2.3.1 AUDIO DEMONSTRATION (A2DP) (11)2.3.2 HSP/HFP DEMONSTRATION (13)2.4SOFTWARE CUSTOMIZATION (14)2.4.1 UI Tool (14)2.4.2 DSP TOOL (19)2.4.4 EEPROM Parameters Update (27)2.5 MODULE CONFIGURATION (29)APPENDIX A. BM23 AUDIO EVALUATION BOARD SCHEMATICS (30)Abbreviations List:AVRCP: Audio Video Remote Control Profile A2DP: Advanced Audio Distribution Profile HFP: Hands-free ProfileHSP: Headset ProfileNFC: Near Field CommunicationSPP: Serial Port ProfilePrefaceINTRODUCTIONThis chapter contains general information that will be useful to know before using theBM23. Items discussed in this chapter include:●Document Layout●Recommended Reading●The Microchip Web Site●Customer Support●Document Revision HistoryDOCUMENT LAYOUTThis user’s guide describes how to use the BM23 Bluetooth Evaluation Board. The document is organized as follows:●Chapter 1. “Overview” – This chapter introduces the BM23 Bluetooth Evaluation Board and provides anoverview of various features.●Chapter 2. “Getting Started” – This chapter describesThe hardware components and setup of the BM23 Bluetooth Evaluation Board.The application demonstrations of the BM23 Bluetooth Evaluation Board.Software/Utility Requirements of the BM23 Bluetooth Evaluation Board.●Appendix A. “BM23 Audio Evaluation Board Schematics” – This appendix includes a schematic of theBM23 Bluetooth Evaluation Board.RECOMMENDED READINGThis user’s guide describes how to use the BM23 Bluetooth Evaluation Board. Other useful documents are listed below. The following Microchip documents are available and recommended as supplemental reference resources:STEREO Module Data Sheet (BM20/23 Data Sheet)MICROCHIP WEBSITEMicrochip provides online support via our web site at . This website is used as a means to make files and information easily available to the customers. Accessible by using your favorite Internet browser, the website contains the following information:●Product Support – Data sheets and errata, application notes and sample programs, design resources,user’s guides and hardware support documents, latest software releases and archived software●General Technical Support – Frequently Asked Questions (FAQs), technical support requests, onlinediscussion groups, Microchip consultant programmer listing●Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing ofseminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORTUsers of Microchip products can receive assistance through several channels:●Distributor or Representative●Local Sales Office●Field Application Engineer (FAE)●Technical SupportCustomers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the website at:DOCUMENT REVISION HISTORYRevision A (Aug 2015)This is the initial released version of this document.Revision 1.0 : Added details of V4 EVB1 OVERVIEW1.1 INTRODUCTIONThis user’s guide describes the hardware and software setup for the BM23 Bluetooth® Evaluation Board. This board contains the hardware needed to evaluate the BM23 Bluetooth module. The BM23 module is mounted to an evaluation board that demonstrates the module’s key features. The evaluation board contains:●PIC18 MCU and YAMAHA YDA174 DSP on board●12 push buttons to control audio playback●Status LEDs●The BM23 supports the following Bluetooth profiles: A2DP, AVRCP, and HFP/HSP●A2DP stereo audio (Sink mode support for Sub-Band Coding (SBC)),●AVRCP media player remote control●HFP/HSP for accepting a phone call support.For data sheet and other details related to BM23 module, refer to the Microchip website at/bm23.This chapter discusses the following topics:●BM23 Evaluation Board Features●BM23 Evaluation Board Contents and Part DetailsThe BM23 Evaluation Board has the following features:●It includes a Bluetooth module (BM23), MCU (PIC18) and DSP (YDA174) on the board for easyfunction and feature demonstration.●BM23 module is a fully qualified Bluetooth version 4.1, fully compatible with Bluetooth version 3.0, 2.0,1.2.●Embedded BM23 module with postage-stamp size form factor of 15 x 29 x 2.5 mm (include shieldingcase)●Embedded Bluetooth stack profiles: A2DP, AVRCP, and HFP/HSP, Bluetooth SIG certified.●System gets power from 15V / 3A DC adapter for speaker application.●Environmentally friendly, RoHS compliant●Keypad matrix on board and controlled by MCU, easy for playback control (play/pause, Vol Up/Down,forward/rewind, Next/previous track etc.).BM23 Evaluation Board contains the following components as shown in Figure 1-1 which describes the evaluation board’s interfaces and connectors. Table 1-1 describes the various components of the evaluation board.FIGURE 1-1: BM23 EVALUATION BOARDMIC (JP23) ICSP (J5)123456TABLE 1-1:BM23 EVALUATION BOARD HARDWARE1.4 BM23 EVB KIT CONTENTSBM23 EVB kit include: BM23 EVB board, 15V adapter, micro USB cable and 2 speaker cables as shown in Figure 1-2.FIGURE 1-2: BM23 EVB KIT1) 15V adapter: main power source of the whole system.2) USB cable: micro USB cable can connect to P3 of BM23 EVB board to do firmware update onBM23.3) Speaker cable: connect speaker to BM23 EVB J6 and J7.2. Getting Started2.1 INTRODUCTIONThis chapter describes how the BM23 Evaluation Board works. Certain hardware and utilities are essential to support the evaluation/development of demo applications. This chapter discusses the following topics:●Hardware Requirements●Software/Utility Requirements●Module Configuration2.2 HARDWARE REQUIREMENTS2.2.1 Hardware SetupTo setup the evaluation hardware, perform the following steps:1. Make sure pin 1 / 2 / 3 of “SW9” in “Off / Off / On” to make system in application mode.2. Connect the speaker line to the amplifier output connector (J6 / 7).2.2.2 Using Evaluation Board1. Connect 15V adapter P2.2. Connect speaker to J6 and J7.3. Long press MFB button (SW24) to turn-on and enter pairing mode. The status LEDs will blink.4. Press and hold Pairing button (SW34). Blue and Red LED will flash alternately. Release the Pairingbutton. Now the BM23 Evaluation board is discoverable.5. Turn on Bluetooth device manager on a host device (PC or smartphone), the host device willdisplay a list of discoverable Bluetooth devices. Select the BM23-002 EVB and connect with it.6. If the pairing with the device is successful, BM23 evaluation board is connect to the host device.Once connected, BM23 evaluation board enables Advanced Audio Distribution Profile (A2DP) for audio playback and Audio Video Remote Control Profile (AVRCP) for player control.7. Play music and the host device and listen the music on the speaker. This will demonstrate A2DP.8. If host device is cell phone, call you cell phone from another phone. Accept the incoming phone callon your paired and connected cell phone. This will demonstrate HFP.2.3 APPLICATION DEMONSTRATION2.3.1 AUDIO DEMONSTRATION (A2DP)In this demonstration, user can play an audio stream on both BM23 evaluation boards using a computer or smartphone. The following are the steps to perform the demonstration.1. Connect BM23 evaluation board to a host device (PC or smartphone) that has an audio source.2. Connect speakers to BM23 evaluation board J6 / 7.Media Player, iTunes, and Android).4. Start the audio stream on the media player.When BM23 evaluation board is connected to an audio source compatible with Bluetooth AVRCP, the following audio control buttons can be used:●Control the volume of audio output (Vol+ (SW27), Vol- (SW28)).●Go to the previous track(SW23)●Go to the next track(SW45)●Start / stop playing the current track (SW31).FIGURE 1-2: BM23 EVALUATION BOARD AUDIO CONTROL BUTTONS2.3.2 HSP/HFP DEMONSTRATIONIn this demonstration, user can explore the hands-free profile setting to receive an incoming voice call from a paired smartphone. This demonstration requires a microphone. It would be good to use a PCheadset/microphone (with two-plugs). The following are the steps to perform the demonstration.1. Connect the speakers / microphone to BM23 evaluation board’s audio out connector (J6/7) and MICinput (P6) respectively.2. Connect BM23 evaluation board to a smartphone that supports the A2DP and HFP/HSP Bluetoothprofiles.3. From another one phone, initiate a call to the smartphone that is paired with BM23 evaluation board. TheA2DP stream pauses and the ringtone plays on the speakers.4. Click butto n “MFB” on BM23 evaluation board to accept the incoming call.5. Once phone call is terminated, A2DP stream resumes.2.4 SOFTWARE CUSTOMIZATIONUser can customized UI and DSP settings according to their requirements. These settings can then be merged along with patch code to create IISC patch file (*.ipf). This patch file then programmed into EEPROM. Process of patch file creation is given below.Tools needed for customizationUI Tool: user can use this tool to create customize Bluetooth behavior like button functionality, Bluetooth name etc.DSP Tool: user can use this tool to modify audio parameter.MPET Tool: user can use this tool to merge UI, DSP and patch code. Details about Patch code will be provided latter section.EEPROM Tool: user can use this tool to upgrade the merged parameter into EEPROM of BM23.All these tools can be obtained from /bm23 or through FAE.2.4.1 UI ToolStep1. Open UI toolStep2. Load appropriate default UI setting (included in UI tool package) or previous saved file.Step3.Click “Edit” to modify the settings.Step4. In the main settings, profile can be enabled/disabled by checking/unchecking the box as shown below.Click “Next” for other setting.Step5. You can do system and functional setting in these pages.Click “Help” you can get more detail information.Step6. After finish parameter selection, click “Finish” button and a message will remind you check EEPROM size on your system.Step7.Click “Save” button to save these UI parameter s as a “.txt” file2.4.2 DSP TOOLStep1. Open DSP toolStep2. Select IC version ““IS2020_XXX_SHS” (XXX is the version of chip, e.g. IS2023S-002)Step3.You can setup all voice and audio function in these pages.Step4. Click “Save” button to save these DSP parameters as a “.txt” file after finish all DSP setting.2.4.3 MERGE TOOLStep1.Open MPET tool, click “Next” to set up.Step2.Select “UI Patch Only” to use full EEPROM table to merge UI and DSP parameter.Step3.Select the bin file (full EEPROM table) and click “Next”Step4. If the bin file includes UI/DSP/patch code, you can see them as shown in the above figure. If you want to keep any one of them in your customization, you can select that and use “pull down” button (2) to add them to merge list. For adding customized parameters, you can use add button (+) (3) to add new parameters (e.g. UI/DSP parameters), into tool to merge with EEPROM table.Step5. Select output path and choose a file name for the merged EEPROM table.Step6.Click “Next” and choose Merge Default Bin to Patch (Patch File, *.ipf) as shown in the following picture and then Click “Next”. “Generate” button to generate the new EEPROM table.Step7. Click Generate buttonStep8.Select all as shown below and then click Next.Step9. Now you have a merged patch file (*.ipf file).2.4.4 EEPROM Parameters UpdateStep1. Make sure SW9 in “ROM TEST” mode. Mode switch (1/2/3 – on/off/on)Step2. Connect EVB “P1” port and PC by USB cable. LED1 & LED2 on EVB will keep lighting. Step3. Run the E2PROM_tool.exe program and a window will be come up as belowStep4. Specify the COM Port (1). Click IC/Module (2) Identify to know IC version of BM23. This is useful to prevent IC version mismatch.Step5. Press ”Browse” (3) to choose the *.ipf file (created in section 2.4.3) and click Write(4)Step6. After data update is completed, remove USB cable and make SW9 to “ROM APP”(mode Switch 1/2/3 off/off/on) mode and power cycle.EVB will be using new setting from EEPROM. Follow section 2.0 to see the effect of parameter customization.2.5 MODULE CONFIGURATION 2.5.1 Mode SettingsSetting in Mode Switch:APPENDIX A. BM23 AUDIO EVALUATION BOARD SCHEMATICS EVB block diagramKey Button Matrix:BM23 BLUETOOTHEVALUTATION BOARD USER ’S GUIDE2K2_02_43_0C 510u /1C O D S Y S _P W R R S T _NC 54.7u /P C B 1J P 11J P 1x 2C I _T XD C I _R X D F 2F o o t i n g 1F 4F o o t i n g1F 3F o o t i n g 1F 1F o o t i n g 1M A I N C I R C U I T4.0B M 23 E V BB48T h u r s d a y , O c t o b e r 01, 201503605F , N o .5, I n d u s t r y E . R d . V I I , H s i n c h u S c i e n c e P a r k ,H s i n c h u C i t y 30078, T a i w a n T E L . 886-3-5778385U 7G 691L 293G N D1R S T 2V C C 3R S T _N S W 10T S 08M -P F21C UP 1P 2P 3P 4P 5T P 6T P 7T P 8T P 9T P 1T P 1T P 1D S P /M C U I N TE RF A C E U 17314u /16V P(15V )S P K O U T0.1u /50VC 106I 2S I N T E R F A C ER 1733R 11833R 1833R 1933B o a r d N a m eS i z e T i t l eR e v D a t e :S h e e t o f P /N D S P _Y D A 1744.0B M 23 E V BB68W e d n e s d a y , J u l y 22, 201503605F , N o .5, I n d u s t r y E . R d . V I I , H s i n c h u S c i e n c e P a r k ,H s i n c h u C i t y 30078, T a i w a n T E L . 886-3-5778385R F S 0S C L K T F S 0D R 0D T 0A M PS P _M U T E S P _S L E E P S P _I C _N S P _P 1_2S P _P 1_3S P _P R O T _N S P _I R Q _N 0.1u /50VC 10513300u /50VR 12R 110V3R 377C U _P 71B U T T O NC U _P 70R 1R 0R 2C U _P 72S W 34T S 08M -P FS W 35T S 08M -P FS W 38T S 08M -P FB o a r d N a m eS i z e T i t l eR e v D a t e :S h e e t o f P /N M C U _B U T T O N4.0B M 23 E V BA88M o n d a y , J u l y 27, 201503605F , N o .5, I n d u s t r y E . R d . V I I , H s i n c h u S c i e n c e P a r k ,H s i n c h u C i t y 30078, T a i w a n T E L . 886-3-5778385Worldwide Sales and ServiceAMERICAS Corporate Office2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200Fax: 480-792-7277 Technical Support:/ supportWeb Address: AtlantaDuluth, GATel: 678-957-9614Fax: 678-957-1455 Austin, TXTel: 512-257-3370 BostonWestborough, MATel: 774-760-0087Fax: 774-760-0088 ChicagoItasca, ILTel: 630-285-0071Fax: 630-285-0075 Cleveland Independence, OHTel: 216-447-0464Fax: 216-447-0643 DallasAddison, TXTel: 972-818-7423Fax: 972-818-2924 DetroitNovi, MITel: 248-848-4000 Houston, TXTel: 281-894-5983 Indianapolis Noblesville, INTel: 317-773-8323Fax: 317-773-5453Los AngelesMission Viejo, CATel: 949-462-9523Fax: 949-462-9608New York, NYTel: 631-435-6000San Jose, CATel: 408-735-9110 Canada - TorontoTel: 905-673-0699Fax: 905-673-6509 ASIA/PACIFICAsia Pacific OfficeSuites 3707-14, 37th FloorTower 6, The GatewayHarbour City, KowloonHong KongTel: 852-2943-5100Fax: 852-2401-3431Australia - SydneyTel: 61-2-9868-6733Fax: 61-2-9868-6755China - BeijingTel: 86-10-8569-7000Fax: 86-10-8528-2104China - ChengduTel: 86-28-8665-5511Fax: 86-28-8665-7889China - ChongqingTel: 86-23-8980-9588Fax: 86-23-8980-9500China - HangzhouTel: 86-571-8792-8115Fax: 86-571-8792-8116China - Hong Kong SARTel: 852-2943-5100Fax: 852-2401-3431China - NanjingTel: 86-25-8473-2460Fax: 86-25-8473-2470China - QingdaoTel: 86-532-8502-7355Fax: 86-532-8502-7205China - ShanghaiTel: 86-21-5407-5533Fax: 86-21-5407-5066China - ShenyangTel: 86-24-2334-2829Fax: 86-24-2334-2393China - ShenzhenTel: 86-755-8864-2200Fax: 86-755-8203-1760China - WuhanTel: 86-27-5980-5300Fax: 86-27-5980-5118China - XianTel: 86-29-8833-7252Fax: 86-29-8833-7256China - XiamenTel: 86-592-2388138Fax: 86-592-2388130China - ZhuhaiT el: 86-756-3210040Fax: 86-756-3210049ASIA/PACIFICIndia - BangaloreTel: 91-80-3090-4444Fax: 91-80-3090-4123India - New DelhiTel: 91-11-4160-8631Fax: 91-11-4160-8632India - PuneTel: 91-20-3019-1500Japan - OsakaTel: 81-6-6152-7160Fax: 81-6-6152-9310Japan - TokyoTel: 81-3-6880- 3770Fax: 81-3-6880-3771Korea - DaeguTel: 82-53-744-4301Fax: 82-53-744-4302Korea - SeoulTel: 82-2-554-7200Fax: 82-2-558-5932 or82-2-558-5934Malaysia - Kuala LumpurTel: 60-3-6201-9857Fax: 60-3-6201-9859Malaysia - PenangTel: 60-4-227-8870Fax: 60-4-227-4068Philippines - ManilaTel: 63-2-634-9065Fax: 63-2-634-9069SingaporeTel: 65-6334-8870Fax: 65-6334-8850Taiwan - Hsin ChuTel: 886-3-5778-366Fax: 886-3-5770-955Taiwan - KaohsiungTel: 886-7-213-7830Taiwan - TaipeiTel: 886-2-2508-8600Fax: 886-2-2508-0102Thailand - BangkokTel: 66-2-694-1351Fax: 66-2-694-1350EUROPEAustria - WelsTel: 43-7242-2244-39Fax: 43-7242-2244-393Denmark - CopenhagenTel: 45-4450-2828Fax: 45-4485-2829France - ParisTel: 33-1-69-53-63-20Fax: 33-1-69-30-90-79Germany - DusseldorfTel: 49-2129-3766400Germany - MunichTel: 49-89-627-144-0Fax: 49-89-627-144-44Germany - PforzheimTel: 49-7231-424750Italy - MilanTel: 39-0331-742611Fax: 39-0331-466781Italy - VeniceTel: 39-049-7625286Netherlands - DrunenTel: 31-416-690399Fax: 31-416-690340Poland - WarsawTel: 48-22-3325737Spain - MadridTel: 34-91-708-08-90Fax: 34-91-708-08-91Sweden - StockholmTel: 46-8-5090-4654UK - WokinghamTel: 44-118-921-5800Fax: 44-118-921-5820。
开发评估板使用说明
这种应用可以用在简易 GW （无需显示、按键等）以及对 SD-II 的直接配置上。也可以 对模块进行读写、配置、网络 通信测试，了解模块性能。
SM10XB 开发、评估板使用说明
4．SM10XB 与 CPU 对接
用短路插将 JP7、JP8、JP9、 JP10 跳针座按右图短接起来， SM10XB 的异步串口 1 便和 CPU U5 的一个异步串口（串口 1） 连接，RS232 驱动芯片 U1 与 CPU U5 的另一个异步串口 （串口 2）连接。这样,SM10XB 与 CPU 对接通信， 速率为 400kbps。通过 JP1 接口， PC 机串口与 CPU 通信，速率为 115.2kbps。
_U1RXIF=0;
_U1RXIE=1;
}
void T1Init(void) { /* 定时器*/ T1CON=0x8020; PR1 = 124; _T1IE=1; }
/* 定时 1ms*/
void U2Init(void) { /* 串口 U2_IO*/ __builtin_write_OSCCONL(OSCCON & 0xbf); RPINR19bits.U2RXR = 0; RPOR0bits.RP1R = 5;
if (!SMInit_flag) return;
/* 若是 PC 机与模块直接通信，跳过*/
spidermesh@
8
SpiderMesh 无线传感器网络
SM10XB 开发、评估板使用说明
/* 串口速率调整准备*/ SMDI1 = 0; SMDI1_TRIS = 0; SMDI2 = 1; SMDI2_TRIS = 0;
void U1Init(void)
LM5020评估板用户指南说明书
User's GuideSNVA082B–March2004–Revised May2013AN-1314LM5020Evaluation Board1IntroductionThe LM5020evaluation board is designed to provide the design engineer with a fully functional non-isolated flyback power converter to evaluate the LM5020controller.The performance of the evaluation board is as follows:•Input range:30V to75V(100V peak)•Output voltage:3.3V•Output current:0.2to4.5A•Measured efficiency:85%at1.5A,83%at4.5A•Board size:1.25×2.5×0.5inches•Load Regulation:1.5%•Line Regulation:0.1%•Line UVLO,Current LimitThe printed circuit board consists of2layers of2ounce copper on FR4material with a total thickness of0.050inches.Soldermask has been omitted from some areas to facilitate cooling.The unit is designed forcontinuous operation at rated load at<40°C with normal convection cooling.2Theory of OperationThe flyback converter is an inductive based converter in which inductive energy is stored by applying a voltage across an inductor in a similar manner to that of a boost converter.Here the similarity ends.Asecond coupled winding of the inductor transfers the energy to a secondary side rectifier after the voltage has been removed from the first winding.This allows the converter input and output grounds to beconfigured either isolated or non-isolated.There is also a voltage/current ratio change possible by altering the winding ratio between the first winding and the second winding.A semi-regulated auxiliary winding can also be provided.The flyback transformer is actually a coupled inductor with multiple windings wound on a single core.For simplification,we will refer to the first,driven winding,as the primary and the main output winding as the secondary winding of the flyback transformer.The transformer’s primary inductance is typically made as large as is practical.However,the airgapnecessary to store the cycle energy lowers the obtainable inductance.The higher the primary inductance, the less input ripple current will be generated and the less input filtering will be required.As shown,the LM5020directly drives a MOSFET switch to apply voltage across the primary.When the switch turns off,the secondary applies a forward current to the output rectifier and charges the outputcapacitor.In applications where the input voltage is considerably higher than the output voltage,the turns ratio between primary and secondary will reflect the input/output voltage ratio and the duty cycle.The LM5020is a full-featured controller providing an internal start-up regulator,soft start,over-current and under-voltage lockout.All trademarks are the property of their respective owners.1 SNVA082B–March2004–Revised May2013AN-1314LM5020Evaluation Board Submit Documentation FeedbackCopyright©2004–2013,Texas Instruments IncorporatedPowering and Loading Considerations Figure1.Simplified Flyback Converter3Powering and Loading ConsiderationsWhen applying power to the LM5020evaluation board certain precautions should be followed.TheLM5020evaluation board is quite forgiving of load and input power variations.The possibility of shipping damage or infant failure is always a concern at first power-up.4Proper ConnectionsBe sure to choose the correct wire size when attaching the source supply and the load.Monitor thecurrent into and out of the UUT.Monitor the voltages in and out directly at the terminals of the UUT.The voltage drop across the connecting wires will yield inaccurate measurements.For accurate efficiencymeasurements,these precautions are especially important.5Source PowerAt low input line voltage(30V)the input current will be approximately0.63A,while at high input linevoltage the input current will be approximately0.23.Therefore to fully test the LM5020evaluation board a DC power supply capable of at least75V and1A is required.The power supply must have adjustments for both voltage and current.An accurate readout of output current is desirable since the current is not subject to loss in the cables as voltage is.The power supply and cabling must present a low impedance to the UUT.Insufficient cabling or a high impedance power supply will cause droop during power supply application with the UUT inrush current.If large enough,this droop will cause a chattering condition upon power up.This chattering condition is an interaction with the UUT undervoltage lockout,the cabling impedance and the inrush current.6LoadingAn appropriate electronic load specified for operation down to2.0V is desirable.The maximum loadcurrent is specified as4.5A.Minimum load is specified at5%or0.23A.The resistance of a maximum load is0.73Ω(including cables).The resistance of a minimum load is14.4Ω.2AN-1314LM5020Evaluation Board SNVA082B–March2004–Revised May2013Submit Documentation FeedbackCopyright©2004–2013,Texas Instruments Incorporated Powering Up7Powering UpUsing the shutdown feature provided on the UUT will allow powering up the source supply initially with a low current level.It is suggested that the load be kept reasonably low during the first power up.Set the current limit of the source supply to provide about 1½times the wattage of the load.As you remove the connection from the shutdown pin to ground,immediately check for 3.3volts at the output.If more than a couple of seconds pass without seeing an output voltage,remove input power.A quick efficiency check is the best way to confirm that the UUT is operating properly.If something is amiss you can be reasonably sure that it will affect the efficiency adversely.Few parameters can beincorrect in a switching power supply without creating additional losses and potentially damaging heat.An efficiency above 80%is expected.After the unit is verified operationally,it can be powered up without use of the shutdown pin.8Typical Evaluation SetupFigure 2.Typical Evaluation Setup9Performance Characteristics 9.1Turn-on WaveformsWhen applying power to the LM5020evaluation board a certain sequence of events must occur.The soft-start feature allows for a minimal output voltage for a short time until the feedback loop can stabilize without overshoot.Figure 3,Figure 4,and Figure 5show typical turn-on waveforms at no load,5%load,and at full load.Input voltage,output voltage and output current are shown.Figure 6shows the initial ramp-up of the Vcc pin to 7.7volts through the internal regulator.The auxiliary winding starts to supply a higher voltage as the output voltage rises.The resulting second ramp is shown following the soft-start delay.This sequence is nearly identical for all loads and input voltages.Trace 1:Input Voltage,at 30VDC.Volts/div =20.0V Trace 2:Trace 1:Input Voltage,at 30VDC.Volts/div =20.0V Trace 2:Output Voltage,no load.Volts/div =2.0V Trace 3:Output Output Voltage,at 5%load.Volts/div =2.0V Trace 3:Output Current,no load.Amps/div =100mA Horizontal Resolution =Current,at 5%load.Amps/div =100mA Horizontal 1.0ms/div Resolution =1.0ms/divFigure 3.Typical Turn-on Waveforms at No LoadFigure 4.Typical Turn-on Waveforms at 5%Load3SNVA082B–March 2004–Revised May 2013AN-1314LM5020Evaluation BoardSubmit Documentation FeedbackCopyright ©2004–2013,Texas Instruments IncorporatedPerformance Characteristics Trace 1:Input Voltage,at 30VDC.Volts/div =20.0V Trace 2:Trace 1:VCC pin with VIN =30VDC,Load =4.5A Volts/div Output Voltage,at full load.Volts/div =2.0V Trace 3:Output =5.0V Trace 2:VIN approaching 30VDC Volts/div =20.0V Current,at full load.Amps/div =2.0A Horizontal Resolution Horizontal Resolution =2.0ms/div=1.0ms/divFigure 5.Typical Turn-on Waveforms at Full LoadFigure 6.Initial Ramp-up of the Vcc Pin to 7.7VThrough the Internal Regulator9.2Load Step ResponseFigure 7shows the load step response at Vin =30VDC for an instantaneous load change from 5%to full load.The input voltage,output voltage and output current are shown.9.3Ripple Voltage and Ripple CurrentFigure 8shows the output ripple voltage,the output ripple current and the input ripple current relative to the LM5020gate drive.Trace 1:Input Voltage,at 30VDC Volts/div =20.0V Trace 2:Trace 1:Q1gate drive at Vin =48VDC Volts/div =20.0V Output Voltage,at 3.3VDC Volts/div =2.0V Trace 3:Load Trace 2:Output ripple voltage Volts/div =100mV Trace 3:changing from 0.23A to 4.5A instantaneously Amps/div =Output ripple current Amps/div =20.0mA Trace 4:Input 2.0A Horizontal Resolution =1.0ms/divripple current Amps/div =100mA Horizontal Resolution =2.0µs/divFigure 7.Load Step Response at Vin =30VDC for an Figure 8.Output Ripple Voltage,Output RippleInstantaneous Load Change from 5%to Full Load Current,and Input Ripple Current4AN-1314LM5020Evaluation BoardSNVA082B–March 2004–Revised May 2013Submit Documentation FeedbackCopyright ©2004–2013,Texas Instruments Incorporated Performance Characteristics 9.4Transformer WaveformsFigure9,Figure10,and Figure11show typical waveforms at the junction of Q1MOSFET and thetransformer primary winding.Also shown are typical waveforms at the junction of the transformersecondary and the output rectifier,D3.Figure9reflects an input voltage of30VDC and a load of4.5A.Figure10reflects an input voltage of50VDC with the same load.Figure11reflects an input voltage of 75VDC,also at full load.Trace1:Drain of Q1at Vin=30VDC;Volts/div=50.0VTrace2:Anode of D3;Volts/div=10.0VHorizontal Resolution=0.5µs/divFigure9.Typical WaveformsTrace1:Drain of Q1at Vin=50VDC;Volts/div=50.0VTrace2:Anode of D3;Volts/div=10.0VHorizontal Resolution=0.5µs/divFigure10.Typical WaveformsTrace1:Drain of Q1at Vin=75VDC;Volts/div=50.0VTrace2:Anode of D3;Volts/div=10.0VHorizontal Resolution=0.5µs/divFigure11.Typical Waveforms5 SNVA082B–March2004–Revised May2013AN-1314LM5020Evaluation Board Submit Documentation FeedbackCopyright©2004–2013,Texas Instruments IncorporatedBill of Materials 10Bill of MaterialsThe Bill of Materials is listed in Table1and includes the manufacturer and part number.Table1.Bill of MaterialsDesignator Description Manufacturer Part Number C1 2.2µF,100V,CER,X7R,1812TDK C4532X7R2A225MC2 2.2µF,100V,CER,X7R,1812TDK C4532X7R2A225MC30.01µF,50V,CER,X7R,0805TDK C2012X7R1H103KC40.1µF,100V,CER,X7R,1206TDK C3216X7R2A104KC50.01µF,50V,CER,X7R,0805TDK C2012X7R1H103KC6220pF,50V,CER,COG,0805TDK C2012COG1H221JC73300pF,50V,CER,COG,0805TDK C2012COG1H332KC8100pF,50V,CER,COG,0805TDK C2012COG1H101JC90.1µF,50V,CER,X7R,0805TDK C2012X7R1H104KC10 4.7µF,16V,CER,X7R,1206TDK C3216X7R1C475KC111000pF,50V,CER,COG,0805TDK C2012COG1H102JC12470pF,50V,CER,COG,0805TDK C2012COG1H471JC13100µF,4V,CER,X7S,1812TDK C4532X7S0G107MC14100µF,4V,CER,X7S,1812TDK C4532X7S0G107MC15270µF,4V,ALUM ORG,3018PKG KEMET A700X277M0004ATD1DUAL,SIGNAL,COM CATH,SOT-23CENTRAL SEMICONDUCTOR CMPD2838E-NSAD2DUAL,SIGNAL,COM CATH,SOT-23CENTRAL SEMICONDUCTOR CMPD2838E-NSAD3SCHOTTKY RECT,8A,35V,D2PAK ON SEMICONDUCTOR MBRD835LJ1TERMINAL BLOCK,SCREW,2POS PHOENIX CONTACT MKDS½-3.81J2TERMINAL BLOCK,SCREW,2POS PHOENIX CONTACT MKDS½-3.81Q1MOSFET,N-CH,150V,85mΩ,PWR SO8VISHAY/SILICONIX Si7898DPR110.0Ω,1%,THICK FILM,1206VISHAY CRCW120610R0JR261.9K,1%,THICK FILM,1206VISHAY CRCW12066192FR3 2.87K,1%,THICK FILM,0805VISHAY CRCW08052871FR4 1.00K,1%,THICK FILM,0805VISHAY CRCW08051001FR515.0K,1%,THICK FILM,0805VISHAY CRCW08051502FR612.4K,1%,THICK FILM,0805VISHAY CRCW08051242FR7100Ω,1%,THICK FILM,0805VISHAY CRCW08051000FR80.47Ω,1%,THICK FILM,1206VISHAY CRCW12060R47FR90.47Ω,1%,THICK FILM,1206VISHAY CRCW12060R47FR1010.0Ω,1%,1W,THICK FILM,2512VISHAY CRCW251210R0JR11 2.43K,1%,THICK FILM,0805VISHAY CRCW08052431FR12 1.47K,1%,THICK FILM,0805VISHAY CRCW08051471FR1320.0Ω,1%,THICK FILM,0805VISHAY CRCW080520R0FSD TERMINAL,SMALL TEST POINT KEYSTONE5002SYNC TERMINAL,SMALL TEST POINT KEYSTONE5002T1TRANSFORMER,FLYBACK,EFD20COILCRAFT B0695-AOR T1TRANSFORMER,FLYBACK,EFD20PULSE PA0751U1CONTROLLER,SINGLE OUT,PWM,VSSOP-10TEXAS INSTRUMENTS LM5020Z1ZENER,30V,SMB PKG.ON SEMICONDUCTOR1SMB5936B6AN-1314LM5020Evaluation Board SNVA082B–March2004–Revised May2013Submit Documentation FeedbackCopyright©2004–2013,Texas Instruments Incorporated PCB Layouts 11PCB LayoutsThe layers of the printed circuit board are shown in top down order.View is from the top down.Scale is approximately X2.0.The printed circuit board consists of2layers of2ounce copper on FR4material witha total thickness of0.050inches.7 SNVA082B–March2004–Revised May2013AN-1314LM5020Evaluation Board Submit Documentation FeedbackCopyright©2004–2013,Texas Instruments IncorporatedPCB Layouts 8AN-1314LM5020Evaluation Board SNVA082B–March2004–Revised May2013Submit Documentation FeedbackCopyright©2004–2013,Texas Instruments Incorporated PCB Layouts9 SNVA082B–March2004–Revised May2013AN-1314LM5020Evaluation Board Submit Documentation FeedbackCopyright©2004–2013,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46,latest issue,and to discontinue any product or service per JESD48,latest issue.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949requirements,mainly for automotive use.In any case of use of non-designated products,TI will not be responsible for any failure to meet ISO/TS16949.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Applications Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2013,Texas Instruments Incorporated。
ZSB101A-EVB评估板用户手册说明书
ZSB101A-EVB 用户手册ZSB101A-EVB评估板UM01010101 1.0.03 Date:2023/7/4类别内容关键词ZSB101A-EVB、快速入门摘要介绍开发板特性、硬件说明及使用方法©2023 Guangzhou ZHIYUAN Micro Electronics Co., Ltd修订历史版本日期原因V1.0.00 2023/02/10 创建文档V1.0.01 2023/06/02 更正通信距离参数V1.0.02 2023/06/02 更正文档文字和表格格式V1.0.03 2023/07/03 更正错别字目录1. ZSB101A-EVB 评估板 (1)1.1ZSB101A芯片简介 (1)1.1.1芯片概述 (1)1.1.2芯片特性 (1)1.1.3芯片工作条件 (1)1.2ZSB101A-EVB (2)1.2.1系统电源电路 (2)1.2.2USB转TTL电路 (3)1.2.3板载外设说明 (3)1.2.4其他功能使用说明 (5)1.3ZSB101A-EVB电气特性 (7)1.3.1电源电气特性 (7)1.3.2I/O电气特性 (7)2. 评估板测试使用 (8)2.1硬件连接 (8)2.2开发环境搭建 (8)2.2.1IDE (8)2.2.2打开Keil工程 (8)2.2.3导入pack (8)2.3编译和烧录固件 (9)2.3.1配置调试烧录选项 (9)2.3.2编译烧录 (12)3. 免责声明 (14)1. ZSB101A-EVB 评估板1.1 ZSB101A芯片简介1.1.1 芯片概述ZSB101A是一款高集成度的低功耗蓝牙芯片，支持蓝牙5.1协议高速率通信。
该芯片集成Arm® Cortex®-M4内核、蓝牙收发器、天线及高低频时钟，支持多种电源供电方式配置，出厂默认自带数传协议，尺寸为8*8mm，采用LGA封装，可选外接天线，简便的贴装工艺，省去用户对射频电路及数传协议的开发，可满足产品快速上市的需求。
TB67B008FNG评估板使用说明书
M
-
L
レ
Forced commutation frequency 1.6 Hz
Please change when adjusting forced commutation frequency setting at startup.
Pin name VST FPWM LA
TSTEP TIP
TRE RS ADJ0/1/2
VM Power source of VM: 4 to 22V GND
3
Operation sequence
【Startup sequence】 1. Connect a motor to evaluation board 2. Confirm the each conditions. And perform reconfiguration according to
Pin name SEL_ADJ
FST
H/L Initial settings Description
H
-
M
-
Input duty and output duty are set to same settings. When uses ADJ terminal, please set it.
L
レ
H
-
Approximately, 1s is set. When adjusts DC resolution term at startup, please change this value.
Approximately, 1s is set. When adjusts recovery time at abnormal detection, please change this value. Limit value of output current＝0.25V/0.2Ω＝1.25A
MY-ZB010C-E 评估板快速使用手册说明书
MY-ZB010C-E 评估板快速使用手册V1.0版本记录目录第1 章产品概述 (2)1.1产品简介 (2)1.2产品预览 (2)第2 章硬件接口 (3)第3 章使用步骤 (4)3.1安装配置软件 (4)3.2配置串口 (6)3.3测试准备 (7)3.4读取配置信息 (8)3.5功能测试 (9)3.5.1通信端口测试 (9)3.5.2加入路由节点 (10)3.5.3扫描 (11)3.5.4IO输入/输出 (11)3.5.5AD采集 (12)3.5.6PWM控制 (13)3.5.7导入/导出配置 (14)第4 章附录一售后服务与技术支持 (16)第 1 章产品概述1.1 产品简介MY-ZB010C-E是针对MY-ZB010C-S/P模块功能评测而开发的一款评估板。
评估板提供丰富的扩展接口，包括电源、通信、外设等，结合板上LED灯、可调电位器、蜂鸣器等硬件资源，可用于MY-ZB010C-S/P模块的初期调试、通讯测试、功能评估等。
ZBAssistX是米尔科技开发的ZigBee模块配置软件，可用于设置、查询MY-ZB010C-S/P模块的配置参数；同时具有控制台、网络扫描、配置导入/导出等功能。
1.2 产品预览图1-1注：标准功率模块和高功率模块的引脚兼容。
第 2 章硬件接口图2-1注：标准功率模块和高功率模块的引脚兼容。
第 3 章使用步骤3.1 安装配置软件从米尔科技官网（）下载ZBAssistX_Setup.exe配置软件，双击开始安装，界面如下：图3-1点击“下一步”，出现如下界面：图3-2点击“我接受”出现选择安装位置界面：图3-3点击“安装”，安装完成后，出现如下界面：图3-4点击完成，运行ZBAssistX 1.0配置软件：图3-53.2 配置串口模块默认的波特率是115200，数据位为8，校验位为None，停止位为1，配置软件的串口设置如下：图3-63.3 测试准备1. 连接串口。
如果使用的是RS232电平，则需插上JP12的跳线帽；2. 打开配置软件，设置串口参数为115200-8-N-1；3. 连接3.3V电源，注意电源的正负极；4. 上电后，红色的电源灯常亮，蓝色网络信号慢闪，同时配置软件接收到“+AT_MODE:\r\n”如下图所示：图3-73.4 读取配置信息点击“读取”按钮，获取设备配置信息，如下图所示：图3-8根据读取的结果，可看出此节点是路由节点，如果节点都是路由节点，需要配置其中一个为协调器节点，从设备类型中选择Coor，然后点击“写入”按钮，将当前的配置写入模块，图示如下：图3-9更改“设备类型”配置，需重启模块才能生效，点击“复位”按钮或者重新上电，复位模块。
EBSGCN、EKSGCN评估板使用手册说明书
EVALUATION BOARD MANUALEBSGCN SeriesEVALUATION KIT MANUALEKSGCN Seriesfor EYSGCN series BluetoothⓇlow energy ModuleIntroductionThis evaluation board is applicable for Taiyo Yuden’s Bluetooth ® 4.2 low energy module, EYSGCN Series.Mounted moduleEYSGCN (9.6mm x 12.9mm x 2.0mm_MAX)Nordic nRF51822 / ARM® Cortex™-M0 32 bit processor 49-pin Land Grid Array / 29GPIOs / SWD - Basic Module - Taiyo Yuden writes firmware for S120 (EYSGCNZWY) SoftDevice to this product. The user can develop unique application for the module.Serial UART interface and power supply are possible with one USB cable. And this board has the SWD connector terminal for software development. EBSGCN Series USBEvaluation board circuit schematic Evaluation board layout1)All pin headers are 2.54mm pitch. And distance between CN3and CN4 is 15.24mm.2) CN3-CN6, C4, C6, L1, JP3, JP4, SB1-5, TP1-4 are not mounted (N.M.).3) D1 (LED): USB VBUS 5V LED Indicator4) D2 (LED): UART TX Indicator5) D3 (LED): UART RX Indicator6) SW1 (Push button): Module Reset (active low)U2EYSGCNSilkscreen PrintingPin DescriptionsHow to useIt is very easy just to tie this board to the PC with a USB cable. It is not necessary to change the setting of the board. The power supply of the module supplies by default 3.3V from 3V3OUT of FT232RQ.For software development Nordic-DK and Use caseNordic-DK/eng/Products/nRF51-DKminiUSBSWDEBSGCN SeriesCN1 supports the connection of the 10 pin Nordic-nRF51DK NordicMaster control panel etc. nRF51-DongleMEMO1) Current measurmentTo measure the current, please cut the shorting 1pin and 2 pin of CN6. And connect an ampere-meter between the pins of connector CN6 to monitor the current directly.2) About the power supply of the moduleWhen you use external power supply, please supply power from 9pin and 10pin of CN3. On this configuration, you cut short circuit 1pin and 2pin of CN5 and should separate 3V3OUT of FT232RQ.3) USB to serial UART interfaceIt needs to install driver of FT232RQ to use USB for UART interface. The drivers are available on FTDI website./Drivers/D2XX.htmIn addition, by the application development, please assign GPIO as follows.92 24) Size and Coordinate informationImportant notesThe evaluation board included with the Nordic Development Kit uses a 16MHz clock. Therefore the sample code from Nordic is designed to be used with a 16MHz clock. On the other hand, the EYSGCN series module uses a 32MHz system clock, making it incompatible with the Nordic sample code (i.e. sample code does not configure HFCLK: XTALFREQ register for 32MHz). To fix this issue, we need to write the value 0xFFFFFF00 to the UICR (User Information Configuration Register) at address 0x10001008. Please note that the UICR is erased whenever you download a SoftDevice.The UICR can be written by using the debug tools:nrfjprog.exe --snr <your_jlink_debugger_serial_number> --memwr 0x10001008 --val 0xFFFFFF00 Or the following code can be added to the SystemInit function in the system_nRF51.c file, right before launching the TASK_HFCLKSTART task:if (*(uint32_t *)0x10001008 == 0xFFFFFFFF){NRF_NVMC->CONFIG = NVMC_CONFIG_WEN_Wen << NVMC_CONFIG_WEN_Pos;while (NRF_NVMC->READY == NVMC_READY_READY_Busy){}*(uint32_t *)0x10001008 = 0xFFFFFF00;NRF_NVMC->CONFIG = NVMC_CONFIG_WEN_Ren << NVMC_CONFIG_WEN_Pos;while (NRF_NVMC->READY == NVMC_READY_READY_Busy){}NVIC_SystemReset();while (true){}}TY ’s App or TY’s App Lite Installation modelTY’s App (Taiyo Yuden Standard Application for BLE) BLE Embedded SoftwareEYSGCNA Series. (9.6mm x 12.9mm x 2.0mm_MAX)TY’s App and TY’s App LiteTY’s AppNordic nRF51822 / ARM® Cortex™-M0 32 bit processor TY’s App is installed. Development of the application software in the module is unnecessary.EBSGCNAWY-1X EBSGCNAWY-WX TY’s AppSlave EBSGCNAWY-1X EBSGCNAWY-WX TY’s AppMaster Peripheral Side Central SideUARTUARTUART UART。
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
新华龙电子有限公司美国SILABS 公司MCU 产品——中国区代理BT F020 开发评估板使用说明书Version: 1.0目录一二三四BT F020 开发评估板功能简介 (2)BT F020 开发评估板测试程序详细说明 (4)Silicon Laboratories IDE 安装配置 (7)BT F020 开发评估板使用方法 (8)1新华龙电子有限公司美国SILABS 公司MCU 产品——中国区代理一．BT F020 开发评估板功能简介1．产品简介BT F020 是新华龙电子有限公司在推出NCD-CIP51F020-A、B 两款实验机后，为方便用户使用、学习C8051F020 单片机而设计制造的一款开发评估板。
BT F020 开发评估板具有以下特点：●主MCU 是完全集成的混合信号系统级芯片（SoC）。
●低价位、多功能的开发主板。
●根据应用系统设计需要，通过输入输出插座附加扩展电路，用户无须设计整个应用系统，即可以在BT F020 评估板上轻松地开始应用软件的开发工作，缩短开发周期。
●附带的光盘提供完整的演示程序，有利于用户更快、更全面的学习和了解C8051F 系列单片机的各种功能。
2. C8051F 单片机简介C8051F 单片机是完全集成的混合信号系统级芯片（SoC），具有与8051 单片机兼容的高速的CIP-51 内核，与MCS-51 指令集完全兼容，片内集成了数据采集和控制系统中常用的模拟、数字外设及其他功能部件；内置FLASH 程序存储器、内部RAM，大部分器件内部存在XRAM。
C8051F 单片机具有片内调试电路，通过 4 脚的JTAG 接口可以进行非侵入式、全速的在线调试。
3．板上资源● MCU:C8051F020,片内64K FLASH，4K XRAM；●片外：8M 位FLASH，1M SRAM，256 字节的EEPROM；● 2×16 字符LCD 显示器；● 4 个按键；● JTAG 调试接口；● 2 通道RS232 接口；● SPI 接口；● I2C/SMBUS 接口；● 12 位的ADC0、8 位的ADC1 输入接口，2 路DAC 输出接口；2新华龙电子有限公司● USB 接口；美国SILABS 公司MCU 产品——中国区代理4. 开发板组成● BT F020 评估开发板一块●一条USB 线●一个220V 变9V 直流电源●软件光盘一张5．开发板图片图16．BT F020 评估板的跳线说明J1/J1-1 J2/J2-2 J3/J3-3 J4/J4-4 I/O 口I/O 口I/O 口I/O 口J5 J6 J7 1 脚为CP0+,2 脚为CP0-,3 脚为CP1+,4 脚为CP1-。
1 脚为外部2.5V 基准电压源，2 脚为E_VREF。
1 脚为NC，3、5、7 脚为外部2.5V 基准电压源，2 脚为内部基准输出，4 脚为3新华龙电子有限公司美国SILABS 公司MCU 产品——中国区代理VREFD，6 脚为VREF0，8 脚为VREF1。
J8 J9 J101 脚为AIN0.0，2、3 脚为AGND，4 脚为AIN0.1。
6—1 脚分别为模拟输入AIN0.2～AIN0.7JTAG 口J11 1 脚为DAC0 输出 2 脚DAC1 输出J12 J13 J14 J15 J16 J17 J18 J19 1—8 脚AIN1.0～AIN1.7 或作为频率输出、高速输出等UART0 输出口UART1 输出口MONEN 引脚RS232/USB（1-2 为：RS232；2-3 为：USB）跳线RS232/USB（1-2 为：RS232；2-3 为：USB）跳线+5V(LCD 电源跳线)USB 接口二．BT F020 开发评估板测试程序详细说明1．2.3.本公司提供的测试程序可以应用Silicon Laboratories IDE 软件编译通过。
IDE 配置方案参考“三.Silicon Laboratories IDE 安装配置”内容。
晶振的选择：系统时钟初始化后应用外部22.1184M晶振，如果不进行系统时钟初始化，系统将使用内部晶振，默认值为2M，也可以通过设置OSCICN 寄存器改变内部晶振的大小（可选值为2M、4M、8M、16M）测试程序说明所有测试程序在附带光盘的… \SOFTWARE目录下，（1）模拟量（电压）的采样（例程：ADC1_TEMP）摘要：本程序主要实现对模拟量（电压）的采样、AD转换、LCD显示并通过UART0发送到PC机。
实验时把ADC的工作基准VREF0同2.5V基准电压源相连（J7_5和J7_6或J7_2和J7_6）且将LCD电源跳线（J18_1和J18_2）联接好。
（2）温度测量程序(例程: ADC0_TEMP)4新华龙电子有限公司美国SILABS 公司MCU 产品——中国区代理摘要：本程序使用C8051F020芯片的片内温度传感器，实现对芯片表面温度进行测量，测量值通过LCD显示且从UART0发送至PC机，使用外部22.1184MHz晶振。
注：LMV324 只对AIN0.0、AIN0.1 这两个通道的信号进行调整，做ADC0 应用实验时一定要注意以下问题：<1>. 在信号调理的输入端J8-1脚（J8的第1脚）可以输入+6/-6 的电压经过LMV324调理后进行采样，也就是AIN0.0能对调理后的+6/-6V的电压信号进行采样。
<2>. 在信号调整的输入端J8-4（J8的第4脚）可以输入4～20毫安的电流经过电压跟随器输入到芯片的AIN0.1脚进行采样。
（特别强调：该通道不能输入+6/-6V的电压，虽然LMV324进行了信号的调整，但LMV324组成的电路仅是一个电压跟随器，在J8-4脚输入多大的电压或电流都是直接加到芯片的AIN0.1脚。
如果用户不按该原则做实验，而损坏芯片本公司概不负责。
）（3）数模转换输出（例程：DAC0_DTMF1）摘要: 本程序是DA测试实验程序，使用外部22.1184MHz晶振。
功能: 将数字量转化成模拟信号输出，由T4定时控制DAC0输出DTMF信号。
（4）比较器（例程：CP1）摘要: CP1-接VREF，用电位器从3.3V分压输出至CP1+，使用外部22.1184MHz晶振。
实验时用跳线将CP-和VREF进行连接，并外接一个用来输出0—3.3V电压的电路。
功能: 由CP的CP+、CP-的高低来控制红色LED灯亮/灭（CP+ > CP-则LED亮,相反灭）。
可在中断程序中设断点观察。
（5）外扩SRAM(例程: IS62LV1024test)摘要: 本程序是外扩存储器的测试程序,实现对STC62WV1024的读写.使用外部22.1184MHz晶振。
功能: 实现外部存储器IS62LV1024的数据读写操作，采用非复用地址方式，128K分块操作。
（6）LCD显示(例程: LCD1602A)摘要：本程序是LCD测试程序。
用四位数据线驱动LCD，使用外部22.1184MHz晶振。
功能：运行程序，显示两行字符“BT F020 V1.0”和“”5新华龙电子有限公司美国SILABS 公司MCU 产品——中国区代理（7）SPI(例程: at45db081test)摘要：本程序是串行外设接口总线测试程序，对AT45db081进行读写操作,同时了解串行外设接口（SPI）的读写操作方法。
（8）I2C/SMBUS(例程: 24c02test、I2C目录下)摘要：本程序是I2C总线/SMBUS读写程序，实现AT24C02、16、64 的读写操作。
使用外部22.1184MHz晶振。
（9）8位PWM(例程: PCApwm8)摘要：PCA工作在8位脉宽调制器工作方式，由P0.0输出一个占空比为0>>0xfe>>0的PWM 信号且重复输出，可用示波器观察占空比变化。
使用外部22.1184MHz晶振。
（10）PCA捕捉（例程: PCA_PZ_test）摘要：PCA模块2工作在边沿触发的捕捉方式下,T3控制P2.4输出脉冲信号，将脉冲信号连接到P0.2(PCA模块2的入口)。
在PCA中断程序中设断点观察,P2.4的上、下沿变化时都会产生PCA中断。
实验时短接P2.4和P2.0引脚.（11）键盘扫描（例程: key）摘要：这个程序扫描KEY1—KEY4。
有按键按下后，返回相应按键的字符：…1‟，…2‟，…3‟，…4‟，并在LCD上显示出来(注:J18要短接，给LCD 供电), 使用外部22.1184MHz晶振。
（12）UART0程序（例程: uart0）摘要：本程序实现由片内温度传感器测量MCU温度，温度值由UART0发送至上位机同时接收一个来自上位机的字符数据并在LCD显示。
实验时把ADC0的工作基准VREF0同2.5V基准电压源相连（J7_5和J7_6或J7_2和J7_6）且将LCD电源跳线（J18_1和J18_2）联接好。
交叉开关配置P0.0 P0.1 为UART0。
使用外部22.1184MHz晶振。
（13）USB与RS232转换实验（例程:uart0_usb）摘要：本实验是利用RS232与USB转换芯片（CP2102），转换出一个USB接口，同上位机通讯。
(J16：2-3联接；J17：2-3联接)功能: 测量芯片温度，通过LCD显示，并通过UART0和CP2102芯片经USB线发送到上位6新华龙电子有限公司美国 SILABS 公司 MCU 产品——中国区代理机,使用串口调试工具进行通讯。
三． Silicon Laboratories IDE 安装配置1． 2．3．IDE 安装：自动运行附带光盘，点击“安装 Silabs IDE ”,按提示进行安装即可。
CP210X 驱动的安装：仅在选用 U_EC2 时需要安装此驱动程序。
自动运行附带光盘，点击“安装 CP210X 驱动”，按提示进行安装即可安装结束，打开 IDE 集成开发环境，在新建或打开原有的项目后，点击主菜单“Options ” 选择“Connection Options..”选项（如图 2 所示），进入图 3 界面。
图 2（1）若调试器使用 U_EC3/ U_EC5，选择与图 3 相同选项， 点击 OK 即可进行连接、程序下载和在线调试。
（2）若调试器使用 U_EC2，图 3 中“Serial Adapter ”框 选“RS232 Serial Adapter ….”一项。
其中，“COMPORT ”的选 择要参照“设备管理器”的端口选项（图 4 中红色圆圈）。
已知 红色圆圈内容后，点击“COMPORT ”复选框，选择“Other COM ” 项，输入与“设备管理器”中相同的 COM 口值（如“3”），则 “COMPORT ”复选框的内容为“COM3”。