SC7731 客户驱动配置介绍
萤石 智能照明-调光驱动器 CS-HAL-WD1C-1C40G 使用说明书
产品简介安装设备WD1C是一款新型无线LED控制装置（以下简称“设备”），将设备关联到萤石网关并添加到“萤石云视频”客户端，配合教室灯和黑板灯一起使用，可以实现亮度调节、联动控制和能耗统计功能。
***RESET按键长按5秒：设备重置并进入添加模式装箱清单*指示灯蓝色快闪：进入添加模式蓝色慢闪：设备离线蓝色常亮：添加超时/退出添加模式下载“萤石云视频”设备添加本设备须搭配萤石Zigbee智能网关（以下简称“网关”）使用。
请先将网关添加至“萤石云视频”客户端，详情参见网关用户指南；然后将设备添加到网关。
方式一：扫描二维码添加登录“萤石云视频”客户端，选择添加设备，进入扫描二维码界面。
231确认您的手机处于联网状态（请确认您购买的网关已成功添加至“萤石云视频”客户端。
方式二：通过网关本地添加如果添加失败了怎么办？白光设置页场景设置页根据网关用户指南操作，使网关进入添加模式。
1添加完成后，网关会有语音提示。
3登录“萤石云视频”客户端。
21扫描下面的二维码，下载并安装。
手机扫描二维码下载“萤石云视频”客户端用户指南×1背胶×2调光控制器×1连线示意图完成示意图长按设备的RESET键5秒，使设备进入添加模式。
2长按设备的RESET键5秒，使设备进入添加模式。
输入口接线柱拨码开关RESET按键指示灯输出口接线柱设备和网关的直线空旷距离为150米，建议中间不超过两堵墙。
设备的安装位置需要有零线；当环境有多个零线回路时，需保证它和所控制的灯处于同一零线回路中。
请勿在潮湿、污染、腐蚀的环境中使用。
请专业人员按照电工规范和产品说明书要求进行安装、调试。
产品需要配件中的背胶贴在灯具外部。
安装时务必关闭总闸，开启总闸前请确认是否安装正确，避免发生危险。
.. . ...接灯负极接灯正极接零线接火线LRESET按键RESET按键扫描手册封面或者设备侧面的二维码，根据提示将设备添加到网关。
4螺丝配件×1如果添加失败，可以长按RESET键5秒或者连续开关灯8次（每次开关灯的间隔不超过2秒），当设备重置并进入添加模式后，按照本章节的步骤再尝试添加。
cs7721
CS7721 马达驱动系列
一、 概述
CS7721是采用CMOS 技术设计的一款专用IC ﹐可应用于小电流单/双马达驱动。
二、 特点
◆ 可调整驱动电流值（修改mask ）
◆ 可实现两路独立的INVERTER 功能（修改mask ） ◆ 单颗IC 可以封装成SOT23-6或者SO-8
◆ 两颗IC 一起可以封装成SSOP-10或者SOP-14
三、 PAD 脚位图
IC 衬底接GND 。
四、 引脚描述
IN2 GND OUT2
IN1
VDD
OUT1
五、功能真值表
六、电气参数表
(所有电压参考地, VDD = 3V，环境温度为25℃)
七、额定最大值
八、应用声明：
1、以上信息如有更新﹐将不另作通知，请用户在使用前先确定手中的数据是否为最新版本。
2、对于客户错误的应用我们产品所产生的任何后果，我公司不承担责任。
伺服驱动器CMMT-AS-C7 12-11A-P3-S1操作说明书
, HEIDENHAIN®, Hiperface®,是商标持有人在相关国家注册的1关于本文件1.1目标人群该文件面向安装及运行该产品的人员。
此外也面向受委托在安全相关系统内规划和应用该产品的人员（符合 EN61508 标准的安全手册）。
1.2适用文件产品的用户文档包含以下文件：1.3产品版本本文件基于以下版本：–R01 及以上版本的伺服驱动控制器 CMMT-AS-...-S1，请参阅产品标识1.4产品标签•请注意产品上的说明。
产品标签位于设备右侧。
产品标签用于识别产品，显示如下信息：位于产品正面的警告标志产品上的警告提示在设备右侧有以下警告提示：1.5指定标准2安全2.1安全注意事项一般安全注意事项–仅允许由具备资质的专业人员进行装配和安装。
–请仅在技术状态完好的情况下使用本产品。
–仅在原装状态下使用产品，请勿擅自进行改动。
–不允许对本产品进行维修。
若产品损坏，则立即更换。
–请注意产品上的各种标识。
–请注意使用场所的环境条件。
不遵守环境条件和连接条件可能造成功能故障并导致安全功能丧失。
–本产品可能产生高频干扰，在居住环境内可能需要采取抗干扰措施。
–在运输和装配拆卸重型规格的产品时，请穿戴规定的个人防护装备。
–禁止在带电的情况下插拔插头。
–只允许松开产品上的以下螺钉：–散热器上用于固定电源侧地线接地的螺丝–壳体正面屏蔽夹的固定螺丝–仅限在 IT 电网中使用时：用于连接内置电源滤波器和保护接地的螺丝–将产品安装到适合的控制柜中。
控制柜的防护等级必须至少为 IP54。
–只有当所有要求的保护措施都到位的时候 ( è EN60204-1)，才可以运行本产品。
–将产品上的导电电缆完全绝缘。
对于电源连接，建议使用带有塑料套管的芯线套管。
接线时请注意必要的剥线长度。
–关于剥线长度的信息 è 手动 装配 ， 安装 。
–注意正确接地和屏蔽连接。
–调试前请确保，连接的执行机构产生的运动不会伤害到人员。
SC7731 客户驱动配置介绍
},
[1] = { .start = IRQ_I2C0_INT, .end = IRQ_I2C0_INT, .flags = IORESOURCE_IRQ, } };
I2c 配置
struct platform_device sprd_i2c_device0 = { .name = "sprd-i2c",
.3
NAND/eMMC配置
.4
eMCP如何修改配置
• 以配置成16Gb+2Gb为例说明 1. chipram/include/configs/sp7731gea.h (1). DDR类型配置 //---these three macro below,only one can be open //#define DDR_LPDDR1 #define DDR_LPDDR2 //#define DDR_DDR3 (2). #define DDR_TYPE DRAM_LPDDR2_1CS_4G_X32 ---> #define DDR_TYPE DRAM_LPDDR2_1CS_2G_X32
I2C_BOARD_INFO(FOCALTECH_TS_NAME, FOCALTECH_TS_ADDR),
.platform_data = &ft5x0x_ts_info, #endif },
};
. 21
I2c 配置
2. 添加I2C资源 kernel/arch/arm/mach-sc/devices-sc8830.c
. 10
Memory验证处理流程
1. 先确认该flash我们平台是否已验证过？ 2. 验证认证过，出patch； 3. 未验证，提供物料申请验证后出patch。
. 11
Microchip HV98101 230VAC 离线式 LED 驱动器 评估板 用户指南说明书
HV98101 230V AC离线式LED驱动器评估板用户指南2017 Microchip Technology Inc.DS50002544A_CN请注意以下有关Microchip器件代码保护功能的要点：•Microchip的产品均达到Microchip数据手册中所述的技术指标。
•Microchip确信：在正常使用的情况下，Microchip系列产品是当今市场上同类产品中最安全的产品之一。
•目前，仍存在着恶意、甚至是非法破坏代码保护功能的行为。
就我们所知，所有这些行为都不是以Microchip数据手册中规定的操作规范来使用Microchip产品的。
这样做的人极可能侵犯了知识产权。
•Microchip愿与那些注重代码完整性的客户合作。
•Microchip或任何其他半导体厂商均无法保证其代码的安全性。
代码保护并不意味着我们保证产品是“牢不可破”的。
代码保护功能处于持续发展中。
Microchip承诺将不断改进产品的代码保护功能。
任何试图破坏Microchip代码保护功能的行为均可视为违反了《数字器件千年版权法案（Digital Millennium Copyright Act）》。
如果这种行为导致他人在未经授权的情况下，能访问您的软件或其他受版权保护的成果，您有权依据该法案提起诉讼，从而制止这种行为。
2017 Microchip Technology Inc.DS50002544A_CN 第3页EU Declaration of ConformityThis declaration of conformity is issued by the manufacturer.The development/evaluation tool is designed to be used for research and development in a laboratory environment. Thisdevelopment/evaluation tool is not a Finished Appliance, nor is it intended for incorporation into Finished Appliances that are made commercially available as single functional units to end users under EU EMC Directive 2004/108/EC and as supported by the European Commission's Guide for the EMC Directive 2004/108/EC (8th February 2010). This development/evaluation tool complies with EU RoHS2 Directive 2011/65/EU.This development/evaluation tool, when incorporating wireless and radio-telecom functionality, is in compliance with the essential requirement and other relevant provisions of the R&TTE Directive 1999/5/EC and the FCC rules as stated in the declaration of conformity provided in the module datasheet and the module product page available at . For information regarding the exclusive, limited warranties applicable to Microchip products, please see Microchip’s standard terms and conditions of sale, which are printed on our sales documentation and available at .Signed for and on behalf of Microchip Technology Inc. at Chandler, Arizona, USA.申明对象：HV98101 230V AC 离线式LED 驱动器评估板HV98101 230V AC 离线式LED驱动器评估板用户指南注：DS50002544A_CN第4页 2017 Microchip Technology Inc.HV98101 230V AC 离线式LED驱动器评估板用户指南2017 Microchip Technology Inc.DS50002544A_CN 第5页目录前言 (7)简介.......................................................................................................................7文档编排................................................................................................................7本指南使用约定.....................................................................................................8推荐读物................................................................................................................9Microchip 网站.......................................................................................................9客户支持................................................................................................................9文档版本历史 (9)第1章 产品概述1.1 简介...............................................................................................................111.2 HV98101器件概述. (11)1.2.1 HV98101器件主要特性 (11)1.3 HV98101 230V AC 离线式LED 驱动器评估板 (12)1.3.1 评估板技术规范 (12)1.4 HV98101 230V AC 离线式LED 驱动器评估板用户指南的内容 (12)第2章 安装和操作2.1 入门 (13)2.1.1 操作所需的其他工具 (13)2.2 设置过程........................................................................................................132.3 HV98101 230V AC 离线式LED 驱动器评估板工作原理 (14)2.4 测试评估板....................................................................................................142.5 典型波形........................................................................................................152.6 典型测量.. (19)附录A 原理图和布线图A.1 简介...............................................................................................................23A.2 评估板——原理图.........................................................................................24A.3 评估板——顶层覆铜和焊盘...........................................................................25A.4 评估板——顶层覆铜、焊盘和丝印................................................................25A.5 评估板——顶层丝印和焊盘...........................................................................26A.6 评估板——底层覆铜和焊盘 (26)附录B 物料清单（BOM ）全球销售及服务网点 (29)HV98101 230V AC离线式LED驱动器评估板用户指南注：DS50002544A_CN第6页 2017 Microchip Technology Inc.HV98101 230V AC 离线式LED驱动器评估板用户指南前言所有文档均会过时，本文档也不例外。
R7731A PWM 控制器商品说明书
R7731A-10 August 2011General DescriptionThe R7731A is a high-performance, low cost, low start-up current and current mode PWM controller with burst triple mode to support green mode power saving operation. The R7731A integrates functions of soft start, Under Voltage LockOut (UVLO), Leading Edge Blanking (LEB), Over Temperature Protection (OTP) and internal slope compensation. It provides the users a superior AC/DC power application of higher efficiency, low external component counts and lower cost solution.To protect the external power MOSFET from being damaged by supply over voltage, the R7731A output driver is clamped at 12V. Furthermore, R7731A features fruitful protections like Over Load Protection (OLP) and Over Voltage Protection (OVP) to eliminate the external protection circuits and provide reliable operation. R7731A is available in SOT-23-6 and DIP-8 packages.Burst Triple Mode PWM Flyback ControllerFeaturesz Very Low Start-up Current (<30μA)z 10/14V UVLOz Soft Start Function z Current Mode Controlz Jittering Switching Frequency z Internal Leading Edge Blanking z Built-in Slope Compensationz Burst Triple Mode PWM for Green-Mode z Cycle-by-Cycle Current Limit z Feedback Open Protection z Over Voltage Protectionz Over Temperature Protection z Over Load Protectionz Soft Driving for Reducing EMI z Driver Capability ±200mA z High Noise ImmunityzOpto-Coupler Short ProtectionzRoHS Compliant and Halogen FreeApplicationsz Adaptor and Battery Charger z ATX Standby Power z Set-Top Box (STB)z DVD and CD(R)z TV/Monitor Standby Power zPC PeripheralsOrdering InformationR7731AG : Green (Halogen Free and Pb Free)Note :Richtek products are :` RoHS compliant and compatible with the current require-ments of IPC/JEDEC J-STD-020.` Suitable for use in SnPb or Pb-free soldering processes.Marking InformationIDP= : Product Code W : Date CodeR7731AGN : Product Number YMDNN : Date CodeR7731AGERichTek R7731A GNYMDNNPin Configurations(TOP VIEW)SOT-23-6DIP-8GATE VDD NC CSRTNCCOMP GND VO+VO-* : See Application InformationR7731A-10 August 2011Function Block DiagramVDDRTGATEGNDAbsolute Maximum Ratings(Note 1)z Supply Input Voltage, V DD-------------------------------------------------------------------------------------------------−0.3V to 30V z GATE Pin----------------------------------------------------------------------------------------------------------------------−0.3V to 20V z RT, COMP, CS Pin----------------------------------------------------------------------------------------------------------−0.3V to 6.5V z I DD-------------------------------------------------------------------------------------------------------------------------------10mAz Power Dissipation, P D @ T A = 25°CSOT-23-6----------------------------------------------------------------------------------------------------------------------0.4WDIP-8---------------------------------------------------------------------------------------------------------------------------0.714Wz Package Thermal Resistance (Note 2)SOT-23-6, θJA-----------------------------------------------------------------------------------------------------------------250°C/WDIP-8, θJA----------------------------------------------------------------------------------------------------------------------140°C/Wz Junction T emperature-------------------------------------------------------------------------------------------------------150°Cz Lead Temperature (Soldering, 10 sec.)---------------------------------------------------------------------------------260°Cz Storage T emperature Range----------------------------------------------------------------------------------------------−65°C to 150°C z ESD Susceptibility (Note 3)HBM (Human Body Mode)------------------------------------------------------------------------------------------------4kVMM (Machine Mode)--------------------------------------------------------------------------------------------------------250V Recommended Operating Conditions (Note 4)z Supply Input Voltage, V DD-------------------------------------------------------------------------------------------------12V to 25Vz Operating Frequency-------------------------------------------------------------------------------------------------------50k to 130kHz z Junction T emperature Range----------------------------------------------------------------------------------------------−40°C to 125°C z Ambient T emperature Range----------------------------------------------------------------------------------------------−40°C to 85°CElectrical CharacteristicsTo be continuedNote 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability.Note 2. θJA is measured in the natural convection at T A = 25°C on a low effective single layer thermal conductivity test board of JEDEC 51-3 thermal measurement standard.Note 3. Devices are ESD sensitive. Handling precaution is recommended.Note 4. The device is not guaranteed to function outside its operating conditions.Note 5. Guaranteed by design.R7731A-10 August D MAX vs. Temperature7071727374757677787980-40-2020406080100120Temperature (°C)D M A X (%)Typical Operating CharacteristicsV TH vs. Temperature9101112131415-40-25-105203550658095110125Temperature (°C)V D D (V )I DD_ST vs. Temperature10121416182022242628-40-1510356085110135Temperature (°C)I D D _S T (µA)I DD_OP vs. Temperature1.251.301.351.401.451.501.55-40-1510356085110135Temperature (°C)I D D _O P (m A )f OSC vs. Temperature57585960616263-40-1510356085110135Temperature (°C)f O S C (k H z )V COMP vs. Temperature5.405.445.485.525.565.60-40-2020406080100120Temperature (°C)V C O M PR7731A-10 August 2011V CLAMP vs. V DD78910111213111213141516171819202122V DD (V)V C L A M P (V)V GATE_OFF vs. V DD400425450475500525550575600111213141516171819202122V DD (V)V G A T E _O F F (m V)I SUPPLY vs. Temperature0.300.350.400.450.50-40-2020406080100120Temperature (°C)I S U P P L Y (m A)I SUPPLY vs. V DD0.4080.4100.4120.4140.4160.4180.4200.4220.4240.426111213141516171819202122V DD (V)I S U P P L Y (m A)V CLAMP vs. Temperature10.010.511.011.512.012.513.0-40-1510356085110135Temperature (°C)V C L A M P (V)GATE vs. Temperature50100150200250300350-40-25-105203550658095110125Temperature (°C)G A T E (n s )V CSTH vs. Temperature0.8000.8150.8300.8450.8600.8750.890-40-25-105203550658095110125Temperature (°C)V C S T H (V )R7731A-10 August 2011Application InformationUVLOUnder Voltage LockOut (UVLO) block is to ensure V DD has reached proper operation voltage before we enable the whole IC blocks. To provide better temperature coefficient and precise UVLO threshold voltage, the reference voltage of hysteresis voltage (10V / 14V) is from band-gap block directly. By this way, R7731A can operate more reliable in different environments.The maximum start-up current (30μA) is only for leakage current of IC at UVLO(on)-0.1V. The external al-capacitor on VDD may have 5 to 6μA extra leakage current. So designed start-up current of the system should exceed 36μA or more and IC can start up normally. In addition,designed start-up current of system should be less than 380μA, and IC can work normally at hiccup mode.Jittering OscillatorFor better EMI performance, R7731A will operate the system with ±6% frequency deviation around setting frequency.To guarantee precise frequency, it is trimmed to 5%tolerance. It also generates slope compensation saw-tooth,75% maximum duty cycle pulse and overload protection slope. By adjusting resistor of RT pin according to the following formula :Figure 1. CompetitorV CSV OUTV CS(500mV/Div)V OUT (2V/Div))(k R 6500(kHz)f T OSCΩ=It can typically operate between 50kHz to 130kHz. Note that RT pin can 't be short or open otherwise oscillator will not operate.Built-in Slope CompensationTo reduce component counts, slope compensation is implemented by internal built-in saw-tooth. Since it 's built-in, it 's compromised between loop gain and sub-harmonic reduction. In general design, it can cancel sub-harmonic to 90Vac.Leading Edge Blanking (LEB)MOSFET C OSS , secondary rectifier reverse recovery current and gate driver sourcing current comprise initial current spike. The spike will seriously disturb current mode operation especially at light load and high line. R7731A provides built-in 420ns LEB to guarantee proper operation in diverse design.Noise ImmunityCurrent mode controller is very sensitive to noise. R7731A takes the advantages of Richtek long term experience in designing high noise immunity current mode circuit and layout. Also, we amplify current sense signal to compare with feedback signal instead of dividing feedback signal.All the effort is to provide clean and reliable current mode operation.Soft-StartDuring initial power on, especially at high line, current spike is kind of unlimited by current limit. Therefore,besides cycle-by-cycle current limiting, R7731A still provides soft-start function. It effectively suppresses the start-up current spike. As shown in the Figure 1 and Figure 2, the start-up V CS is about 0.3V lower than competitor. The typical soft-start duration is 4ms (R T =100k Ω). Again, this will provide more reliable operation and possibility to use smaller current rating power MOSFET .Gate DriverA totem pole gate driver is fine tuned to meet both EMI and efficiency requirement in low power application. An internal pull low circuit is activated after pretty low V DD to prevent external MOSFET from accidentally turning on during UVLO.Burst Triple ModeTo fulfill green mode requirement, there are 3 operation modes in R7731A. Please also refer to Figure 3 for details.`PWM ModeFor most of load condition, the circuit will run at traditional PWM current mode.`Burst ModeDuring light load, switching loss will dominate the power efficien cy calculation. This mode is to cut switching loss. As shown in Figure 3, when the output load gets light, feedback signal drops and touches V BURL (Typical value is 1.75V). Clock signal will be blanked and system ceases to switching. After V OUT drops and feedback signal goes back to V BURH (1.8V, typically), switching will be resumed. Burst mode so far is widely used in low power application because it 's simple, reliable and will not have any patent infringement issue.`VDD Holdup ModeWhen the V DD drops down to V DD turn off threshold voltage, the system will be shut down. During shut down period, controller does nothing to any load change and might cause V OUT down. To avoid this, when V DD drops to a setting threshold, 11V, the hysteresis comparator will bypass PWM and burst mode loop and force switching at a very lo w level to supply energy to VDD pin. The designed value is 11.25V with 0.5V hysteresis band.Furthermore, VDD holdup mode is only designed to prevent V DD from touching turn off threshold voltage under light load or load transient moment. Relative to burst mode, switching loss will increase on the system at VDD holdup mode, so it is highly recommended that the system should avoid operating at this mode during light load or no load condition, normally.Figure 3. Burst Triple ModeFigure 2. R7731AV CSV OUTV CS(500mV/Div)V OUT (2V/Div)V V V V V V VR7731A-10 August 2011ProtectionR7731A provides fruitful protection functions that intend to protect system from being damaged. All the protection functions can be listed as below :`Cycle-by-Cycle Current LimitThis is a basic but very useful function and it can be implemented easily in current mode controller.`Over Load ProtectionLong time cycle-by-cycle current limit will lead to system thermal stress. To further protect system, system will be shut down after about 4096 clock cycles. it 's about 60ms delay in 67kHz operation. After shutdown, system will resume and behave as hiccup. By proper start-up resistor design, thermal will be averaged to an acceptable level over the ON/OFF cycle of IC. This will last until fault is removed. #It's highly recommended to add a resistor in parallel with the opto-coupler. T o provide sufficient bias current to make TL-431 regulate properly,1.2k Ω resistor is suggested.`Brownout ProtectionDuring heavy load, this will trigger 60ms protection and shut down the system. If it 's in light load condition,system will be shut down after V DD is running low and triggers UVLO.` OVPOutput voltage can be roughly sensed by VDD pin.If the sensed voltage reaches 27V threshold, system will be shut down after 20μs deglitch delay.`Feedback Open and Opto-Coupler ShortThis will trigger OVP or 60ms delay protection. It depends on which one occurs first.`OTPInternal OTP function will protect the controller itself from suffering thermal stress and permanent damage. It stops the system from switching until the temperature is under threshold level. Meanwhile, if V DD reaches V DD turn off threshold voltage, system will hiccup till over temperature condition is gone.Figure 4. R-C Filter on CS PinNegative Voltage Spike on Each PinNegative voltage (< −0.3V) on each pin will cause substrate injection. It leads to controller damage or circuit false trigger. Generally, it happens at CS pin due to negative spike because of improper layout or inductive current sense resistor. Therefore, it is highly recommended to add a R-C filter to avoid CS pin damage, as shown in Figure 4. Proper layout and careful circuit design should be done to guarantee yield rate in mass production.Auxiliary Ground (c)ICGround (d)MOSFET Ground (b)Figure 5. PCB Layout GuideLayout ConsiderationA proper PCB layout can abate unknown noise interference and EMI issue in the switching power supply. Please refer to the guidelines when you want to design PCB layout for switching power supply:The current path (1) from bulk capacitor, transformer,MOSFET, Rcs return to bulk capacitor is a huge high frequency current loop. It must be as short as possible to decrease noise coupling and kept a space to other low voltage traces, such as IC control circuit paths, especially.Besides, the path (2) from RCD snubber circuit to MOSFET is also a high switching loop, too. So keep it as small as possible.It is good for reducing noise, output ripple and EMI issue to separate ground traces of bulk capacitor (a), MOSFET (b), auxiliary winding (c) and IC control circuit (d). Finally,connect them together on bulk capacitor ground (a). The areas of these ground traces should be kept large.Placing bypass capacitor for abating noise on IC is highly recommended. The bypass capacitor should be placed as close to controller as possible.To minimize reflected trace inductance and EMI minimize the area of the loop connecting the secondary winding,the output diode, and the output filter capacitor. In addition,provide sufficient copper area at the anode and cathode terminal of the diode for heatsinking. Provide a larger area at the quiet cathode terminal. A large anode area can increase high-frequency radiated EMI.R7731A-10 August 2011Outline DimensionA1HSOT-23-6 Surface Mount PackageRichtek Technology CorporationHeadquarter5F, No. 20, Taiyuen Street, Chupei City Hsinchu, Taiwan, R.O.C.Tel: (8863)5526789 Fax: (8863)5526611Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit design,specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.Richtek Technology CorporationTaipei Office (Marketing)5F, No. 95, Minchiuan Road, Hsintien City Taipei County, Taiwan, R.O.C.Tel: (8862)86672399 Fax: (8862)86672377Email:*********************8-Lead DIP Plastic Package。
SC8810_FM驱动介绍
SC8810 FM驱动介绍
上海·北京· 深圳· 圣迭戈· 韩国· 印度 人力资源部－培训发展组
.1
Innovation changes the future
课程名称： SC8810 FM 驱动介绍 课程类别： 客户培训课程
课程目标： 1. FM 硬件模块 2. 代码结构 3. 模块流程 4. 客户化配置
编译和调试 添加新驱动后，第一次需要全编一次: ./mk sp8810ga new ，这样会在system/lib/modules目录创建一个链接文件 bk1080_fm_ctrl.ko链接文件，并指向system/sps/BK1080/bk1080_fm_ctrl.ko，烧录boot.img, system.img 之后每次调试只要编译ko文件： ./mk sp8810ga u ko 3rdparty/fm/BK1080/ #编译ko 然后用adb工具把ko push到手机中，并重新启动手机调试： adb push out/target/product/hsdroid/system/sps/BK1080/bk1080_fm_ctrl.ko /system/sps/BK1080/ adb reboot
对象：客户 讲师：驱动软件工程师
课时数：2H 教学法：面授
2
主要内容
Innovation changes the future
SC8810 FM 硬件接口介绍
SC8810 FM 驱动代码结构
SC8810 FM 上层代码结构
SC8810 FM 模块整体工作流程
SC8810 FM 模块客户化配置
10
SC8810 FM 模块整体工作流程
以open fm为例，流程如下图所示，其他如tune，search，close等操作都类似。
SC1000 激光切割数控系统用户手册说明书
前言概述本文档主要针对激光切割数控系统应用软件SC1000(以下简称SC1000)的整体外观，功能，使用方法等方面做了描述，如果需要了解系统安装及调试方面问题，可以参考《激光切割数控系统快速安装指南》。
在使用本系统及相关的设备之前，请您详细阅读本手册。
这将有助于您更好地使用它。
由于产品功能的不断更新，您所收到的产品在某些方面可能与本手册的陈述有所出入。
在此谨表歉意。
读者对象本手册主要适用于以下工作人员：●安装/调试工程师●维护工程师●操作人员符号约定在本文中可能出现下列标志，他们代表的含义如下。
禁止表示有高度潜在危险，甚至人员伤害。
警告表示有中度或低度潜在危险，轻微或中等伤害。
注意表示有潜在风险，如果忽视这些文本，可能导致设备损坏、数据丢失、设备性能降低或不可预知的结果。
表示能帮助您解决某个问题或节省您的时间。
窍门表示是正文的附加信息，是对正文的强调和补充。
说明修改记录修改记录累积了每次文档更新的说明。
最新版本的文档包含以前所有文档版本的更新内容。
文档版本V1.00（2016-2）目录前言 (2)概述 (2)读者对象 (2)符号约定 (2)修改记录 (3)目录 (4)1 概述 (6)1.1产品概述 (6)1.2用户界面及说明 (7)2 快速操作 (8)2.1软件快速操作 (8)2.1.1软件操作流程图 (8)2.1.2导入/绘制图形 (8)2.1.3图形处理 (9)2.1.4刀路规划 (10)2.1.5工艺设置 (11)2.1.6加工前检查 (12)2.1.7加工 (13)3 功能说明 (15)3.1 标题栏 (15)3.2工具栏 (15)3.2.1 开始 (15)3.2.1.1文件 (15)3.2.1.2 初始化 (15)3.2.1.3 帮助 (16)3.2.2 图形设计 (17)3.2.2.1 视图 (17)3.2.2.2 绘制 (17)3.2.2.3 图形变换 (18)3.2.2.4 高级变换 (19)3.2.2.5 基础工艺 (20)3.2.2.6 高级工艺 (23)3.2.2.7 辅助 (24)3.2.3 系统分析 (24)3.2.3.1 部件监控 (25)3.2.3.2 运行状态 (26)3.2.3.3 系统诊断 (26)3.2.4 高级 (27)3.2.4.1硬件 (27)3.2.4.2软件 (31)3.3视图区 (31)3.4加工控制栏 (32)3.4.1 加工控制 (32)3.4.2 运行参数 (33)3.5消息栏 (34)3.6图层属性栏 (35)3.7状态栏 (38)4 告警及异常处理 (39)4.1系统告警及说明 (39)4.2常见异常及处理 (41)4.2.1系统通讯异常 (41)4.2.2回原异常 (43)4.2.3 脉冲当量设置 (43)4.2.4飞行切割调试 (43)1概述1.1产品概述SC1000是一套应用于平面激光切割的数控系统软件。
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
.3
NAND/eMMC以配置成16Gb+2Gb为例说明 1. chipram/include/configs/sp7731gea.h (1). DDR类型配置 //---these three macro below,only one can be open //#define DDR_LPDDR1 #define DDR_LPDDR2 //#define DDR_DDR3 (2). #define DDR_TYPE DRAM_LPDDR2_1CS_4G_X32 ---> #define DDR_TYPE DRAM_LPDDR2_1CS_2G_X32
I2C_BOARD_INFO(FOCALTECH_TS_NAME, FOCALTECH_TS_ADDR),
.platform_data = &ft5x0x_ts_info, #endif },
};
. 21
I2c 配置
2. 添加I2C资源 kernel/arch/arm/mach-sc/devices-sc8830.c
#if(defined(CONFIG_INPUT_LIS3DH_I2C)||defined(CONFIG_INPUT_LIS3DH_I2C_MO DULE)) { I2C_BOARD_INFO(LIS3DH_ACC_I2C_NAME, LIS3DH_ACC_I2C_ADDR), .platform_data = &lis3dh_plat_data, }, #endif ……………………… #if(defined(CONFIG_SENSORS_AK8975)||defined(CONFIG_SENSORS_AK8975_MOD ULE)) { I2C_BOARD_INFO(AKM8975_I2C_NAME, AKM8975_I2C_ADDR), .platform_data = &akm8975_platform_d, }, #endif }
T-shark芯片 提供了六组 i2c 口,如下：
I2c 配置
1. 在文件kernel/arch/arm/mach-sc/board-sp7731gea.c中按照如下步骤配置 确定设备使用那组i2c并添加配置，例如：
static struct i2c_board_info i2c2_boardinfo[] = {
device/sprd/scx35/sci-keypad.kl key键值 key 116 key 114 key 115 key 9 key 102 key_name POWER VOLUME_DOWN VOLUME_UP CAMERA HOME WAKE 权限 WAKE WAKE WAKE
I2c 配置
.id
.resource };
= 0,
= sprd_i2c_resources0,
.num_resources = ARRAY_SIZE(sprd_i2c_resources0),
LCD配置 LCD配置(u-boot)
1. 增加驱动文件 ./u-boot/drivers/video/sprdfb/lcd/lcd_nt35516_mipi.c 2. 增加编译规则 ./u-boot/drivers/video/sprdfb/lcd/Makefile
.5
eMCP如何修改配置
2. u-boot/include/configs/sp7731gea.h (1). 定义内存大小 #define CONFIG_RAM512M ---> #define CONFIG_RAM256M (2). #ifdef CONFIG_RAM512M #define MEM_INIT_PARA "mem=512M" #elif defined(CONFIG_RAM256M) #define MEM_INIT_PARA "mem=256M“ ...... #endif #define CONFIG_BOOTARGS MEM_INIT_PARA" loglevel=1 console=ttyS1,115200n8 init=/init " MTDPARTS_DEFAULT
.8
eMCP如何修改配置
4. 在device/sprd/ scx35_sp7731gea/system.prop修改, ro.board_ram_size=mid ---> ro.board_ram_size=low
.9
eMCP如何修改配置
5. emmc 大小调整 (1). emmc大小变化不需关心, 由硬件emmc自动计算出来,如emmc大小减到16G bit，一般 影响的就是userdata分区, 即data分区减少，分区表物理分区是自适应的，编译镜像需要 缩小； (2). 在device/sprd/scx35_sp7731gea/BoardConfig.mk修改定义USERDATA镜像大小 BOARD_USERDATAIMAGE_PARTITION_SIZE 的值减去 2,000,000,000（比如原来是4GB，现 在是2GB，因为EMMC容量少了将近2GB，全部要从data分区裁掉）
},
[1] = { .start = IRQ_I2C0_INT, .end = IRQ_I2C0_INT, .flags = IORESOURCE_IRQ, } };
I2c 配置
struct platform_device sprd_i2c_device0 = { .name = "sprd-i2c",
LCD配置 LCD配置(u-boot)
4. 关联到内核 在./u-boot/drivers/video/sprdfb/sprdfb_panel.c文件中 extern struct panel_spec lcd_nt35516_mipi_spec;; static struct panel_cfg panel_cfg[] = {
//0x01, KEY_HOME,//CAM
//0x10, KEY_MENU,//UP 0x10, KEY_VOLUMEUP, // 此处是与硬件配置有关的 0x01, KEY_HOME,
0x00, KEY_VOLUMEDOWN,
#endif };
Keypad 配置
6. 最后还需注意Key的layout如何处理。
KEY(0, 1, KEY_HOME),
};
Keypad 配置
3. 将board_keymap加到customize_keymap[]添加配置项
4. 将customize_keymap在sci_keypad_data[]添加配置项
Keypad 配置
5.按键值与硬件配对的地方
u-boot/board/spreadtrum/sp7731gea/key_map.h static unsigned char board_key_map[]={ #if 0 0x27, KEY_HOME, 0x42, KEY_BACK, 0x41, KEY_VOLUMEUP, #else //0x00, KEY_BACK,//DOWN
在文件kernel/arch/arm/mach-sc/board-sp7731gea.c中按照如下步骤 配置Keypad
1. 用如下两个宏来定义Keypad的行列值
2. 用宏KEY 在board_keymap[]添加配置项
static const unsigned int board_keymap[] = { KEY(0, 0, KEY_VOLUMEDOWN), KEY(1, 0, KEY_VOLUMEUP),
1. 在u-boot/include/configs/ sp7731gea.h和chipram/include/configs/ sp7731gea.h #ifndef CONFIG_EMMC_BOOTNAND #ifdef CONFIG_EMMC_BOOTEMMC 2. 在客置化配置的时候就需要重点关注NAND/EMMC相关的宏定义，这些宏定义会控具体其 他配置参加编译。
static struct resource sprd_i2c_resources0[] = {
[0] = {
.start = SPRD_I2C0_BASE, .end = SPRD_I2C0_BASE + SPRD_I2C0_SIZE -1, .name = "i2c0_res", .flags = IORESOURCE_MEM,
.6
eMCP如何修改配置
(3). #define SPRD_SYSDUMP_MAGIC ((PHYS_OFFSET_ADDR & (~(SZ_512M - 1))) + SZ_512M SZ_1M) ---> #define SPRD_SYSDUMP_MAGIC ((PHYS_OFFSET_ADDR & (~(SZ_256M - 1))) + SZ_256M - SZ_1M)
COBJS-$(CONFIG_FB_LCD_NT35516_MIPI) += lcd_nt35516_mipi.o
3. 配置LCD编译选项及LCD尺寸 ./u-boot/include/configs/sp7731gea.h #ifdef CONFIG_LCD //#define CONFIG_LCD_HVGA 1 //#define CONFIG_LCD_WVGA 1 #define CONFIG_LCD_QHD 1 #define CONFIG_FB_LCD_NT35516_MIPI #endif // CONFIG_LCD
#ifdef CONFIG_FB_LCD_NT35516_MIPI
{ .lcd_id = 0x16, .panel = &lcd_nt35516_mipi_spec, }, #endif ………….. }; static struct panel_spec *adapt_panel_from_readid(struct sprdfb_device *dev)