品质管理英语词汇分类大全精品文档23页

品质管理英语词汇大全Cosmetic Defect TermsPlastic Parts2. Metal PartsCable PartsManuals, Packages, Printed Information and Type LablesProcess Defect Terms1. Soldering QualityOperational Defect TermsICT Fail Cause and Repair ActionsTools, Jigs, and EquipmentSafety and EMCQA Test六. Abbreviation1.缺件（MISSING PARTS）2.错件（WRONG PARTS）3.多件（EXCESSIVE PARTS）4.短路（SHORT）5.断路（OPEN）6.线短（WIRE SHORT）7.线长（WIRE LONG）8.拐线（WIRE POOR DDRESS）9.冷焊（COLD SOLDER）10.包焊（EXCESS SOLDER）11.空焊（MISSING SOLDER）12.锡尖（SOLDER ICICLE）13.锡渣（SOLDER SPLASH）14.锡裂（SODER CRACK）15.锡洞（PIN HOLE）16.锡球（SOLDER BALL）17.锡桥（SOLDER BRIDGE）18.滑牙（SCREW LOOSE）19.氧化（RUST）20.异物（FOREIGNER MATERIAL）21.溢胶（EXCESSIVE GLUE）22.锡短路（SOLDER BRIDGE）23.锡不足（SOLDER INSUFFICIENT）24.极性反（WRONG POLARITY）25.脚未入（PIN UNSEATED）26.脚未出（PIN UNVISIBLE）27.脚未剪（PIN NO CUT）28.脚未弯（PIN NOT BENT）29.缺盖章（MISSING STAMP）30.缺标签（MISSING LABEL）31.缺序号（MISSING S/N）32.序号错（WRONG S/N）33.标签错（WRONG LABEL）34.标示错（WRONG MARK）35.脚太短（PIN SHORT）36.J1不洁（J1 DIRTY）37.锡凹陷（SOLDER SCOOPED）38.线序错（W/L OF WIRE）39.未测试（NO TEST）40.VR变形（VR DEFORMED）41.PCB翘皮（PCB PEELING）42.PCB弯曲（PCB TWIST）43.零件沾胶（GLUE ON PARTS）44.零件脚长（PARTS PIN LONG）45.浮件（PARTS LIFT）46.零件歪斜（PARTS TILT）47.零件相触（PARTS TOUCH）48.零件变形（PARTS DEFORMED）49.零件损坏（PARTS DAMAGED）50.零件脚脏（PIN DIRTY）51.零件多装（PARTS EXCESS）52.零件沾锡（SOLDER ON PARTS）53.零件偏移（PARTS SHIFT）54.包装错误（WRONG PACKING）55.印章错误（WRONG STAMPS）56.尺寸错误（DIMENSION WRONG）57.二极管坏（DIODE NG）58.晶体管坏（TRANSISTOR NG）59.振荡器坏（X'TL NG）60.管装错误（TUBES WRONG）61.阻值错误（IMPEDANCE WRONG）62.版本错误（REV WRONG）63.电测不良（TEST FAILURE）64.版本未标（NON REV LEBEL）65.包装损坏（PACKING DAMAGED）66.印章模糊（STAMPS DEFECTIVE）67.标签歪斜（LABEL TILT）68.外箱损坏（CARTON DAMAGED）69.点胶不良（POOR GLUE）70.IC座氧化（SOCKET RUST）71.缺UL标签（MISSING UL LABEL）72.线材不良（WIRE FAILURE）73.零件脚损坏（PIN DAMAGED）74.金手指沾锡（SOLDER ON GOLDEN FINGERS）75.包装文件错（RACKING DOC WRONG）76.包装数量错（PACKING Q'TY WRONG）77.零件未定位（PARTS UNSEATED）78.金手指沾胶（GLUE ON GOLDEN FINGERS）79.垫片安装不良（WASHER UNSEATED）80.线材安装不良（WIRE UNSEATED）81.立碑（TOMBSTONE）SMT 不良描述中英文对照1 露底材 Base material expose2 偏位 Shift3 短路/连锡 Short4 少锡 Insufficient solder5 多锡/包焊 Excess solder6 漏印 Missing print7 反白 Upside down8 少件 Missing component9 反向 Wrong orientation10 错件 Wrong component11 多件/残件 Extra component12 破损 Damaged13 空焊 No solder14 立碑 Tombstoning15 锡珠 Solder balls16 侧立 Side termination17 零件氧化 Parts oxidation18 锡尖 Solder projection19 浮高 Float20 翘脚 Lifted lead21 PAD不上锡 PAD discoloration22 针洞 Pinholes23 压件 Cover component24 残异物 Residues25 助焊剂残留 Flux residues26 少胶 Insufficient glue27 溢胶 Overflow glue28 误判 No Fail29 其它 Other30 印刷不良 Print Defect31 上盖脱落/断裂 Top cover missing/crack32 掉件/撞件 Drop component33 内PIN翘起（缺PIN/短PIN/翘PIN） Lifted inside-pin34 版本混装 Mixed edition35 线路偏移 Circuit shift36 错位 Error position37 脚歪/变形 Lead deformed/deformation38 混料 Mixed material39 胶未固化 Glue not be solidified40 烫伤 Scald41 堵孔 Obstacle on via42 PCB白化/分层 PCB Delamination43 漏洞 Exposed copper44 无极性 Missing polarity45 压伤 Crush46 漏点胶 Missing glue47 气泡 Air bubble48 屏蔽架变形 Shield Deformation49 屏蔽架毛刺 Shield Burr50 刮伤 Scraped51 弹片翘起 Spring lifted52 弹片失效 Spring failure53 弹片无法复位Spring can’t replace54 零件沾锡 Solder on parts序号汉语意义英文翻译焊锡质量类1 冷焊coldsolder2 零件偏移 component shifted3 污损contamination4 坏件 damaged component5 锡多excessive solder6 装插不良 improper insertion7 绝缘不良 insulation damaged 8 线脚长 lead protrusion out of spec9 漏点胶missing glue10 漏标示 missing marking11 近似短路near short 1 2 无线尾 no lead protruded13 翘皮peeling off14 极性反 polarity reversed15 成型不良poor preforming 16 锡桥solder bridge17 锡裂solder crack18 锡尖 solder icicle19 锡少solder insufficient20 防焊漆胶落 solder mask peeling off21 锡渣solder spatter22 锡洞 solder void23 错件 wrong partICT Fail Cause and Repair Actions1 短路Short2 零件插反 Backward Part3 板丢失Board Lost4 板修复 Board Repaired5 板报废Board Scrapped6 板送去分析 Board Sent For Analysis7 零件损坏Broken Part 8 零件缺陷 Defective Part9 掉件Missing part10 加零件 Part Added11 零件修复Part Repaired 12 换零件Part Replaced13 PCB缺陷PCB Defect 14 PCB 开路 PCB Open15 加锡Solder Added16 桥焊 Solder Bridge17 去锡 Solder RemovedSolding quality1 空焊Empty Solder2 包焊 Excess Solder3 浮焊Floating Solder4 冰柱 Icing5 虚焊Inveracious Soldering6 掉件，漏件 Missing Component7 开路Open8 漏焊 Open Solder9 锡桥SolderBridge10 锡尖突出 Solder Tip11 锡裂 Split SolderOperational defect terms1 零件插反Backward Part2 零件损坏 Broken Part3 碰伤Bumps4 异物 Foreign Part5 零件错位Misaligned Part6 漏件Missing Parts (component)7 粘胶Paint Adhesion8 刮伤 Scratches9 错件 Wrong PartOthers1 不正常Abnormal2 附件 Accessory3 外观Apperance4 装配 Assembling5 附着，贴附Attached6 弯曲 Bent7 束线Bind8 翘皮 Blister/peeling9 接Bridge10 破损 Broken11 毛边Burrs12 裂纹 Chip / crack13 夹住Clip14 污染 Contamination15 腐蚀Corrosion16 交叉 Cross17 损坏Damage18 减少 Decrease19 深刮伤Deep Scratch20 缺点 Defect21 变形Deformed22 凹痕 Dent23 偏差Deviation24 尺寸 Dimension25 变色(白化) Discoloration26 化状箱 Display box27 双重Double28 脱落 Drop , Tall off29 超过Excess30 假焊 False Solder (Cold)31 频率Fequency32 塞住 Fill Up33 浮Float34 异物 Foreign Material35 碎片塞Fragement36 胶 Glue37 溢胶Glue overflow38 重 Heavy39 不清楚illegible40 不完全 Incomplete41 增加Increase42 确认 Indentify43 指示灯Indicate Lamp44 不合治具 Ingagued45 未固定Insecurely46 插配 Insertion47 内部Inside48 干扰 Interference49 间断，不安定Intermittent 50 杂物Junk51 纠缠Kink52 布置，配置 Layout53 线脚Lead54 浅音 Leakage Sound55 翘起Lifted56 轻 Light57 位置Location58 松 Loose59 方向不对Misorientation 60 未镀表层 Misplating61 欠缺Missing62 混 Mix63 多重Multiple64 不良 No Good (NG)65 偏心Off center66 振荡 Oscillation67 外部Outsid68 脱漆 Paint drop69 部分70 铜箔 Pattem (PAD）71 太差Poor72 凸 Protrude73 残留物Residue74 粗糙 Roughness75 生锈Rust76 LED 数字分节 Segment77 陷Sink78 滑动 Slide79 脱落Slip80 锡珠 Solder Ball81 流锡Solder Flow 82 分开，分隔 Sparation83 污点Stain84 粘 Stick85 薄86 紧 Tight87 透明Transparent88 不平 Uneven89 不顺Unsmooth90 上下颠倒 Upside down91 漆Varnish Paint92 缺洞 Void (Holes)93 弱 WeakSMT中英文对照1. Fundamentals of Solders and Soldering（焊料及焊接基础知识）Soldering Theory（焊接理论）Microstructure and Soldering（显微结构及焊接）Effect of Elemental Constituents on Wetting（焊料成分对润湿的影响）Effect of Impurities on Soldering（杂质对焊接的影响）2. Solder Paste Technology（焊膏工艺）Solder Powder ( 锡粉)Solder Paste Rheology（锡膏流变学）Solder Paste Composition & Manufacturing（锡膏成分和制造）3. SMT Problems Occurred Prior to Reflow（回流前SMT问题）Flux Separation（助焊剂分离)Paste Hardening（焊膏硬化）Poor Stencil Life（网板寿命问题)Poor Print Thickness（印刷厚度不理想）Poor Paste Release From Squeegee（锡膏脱离刮刀问题）Smear（印锡模糊）Insufficiency（印锡不足）Needle Clogging（针孔堵塞）Slump（塌落）Low Tack（低粘性）Short Tack Time （粘性时间短）4. SMT Problems Occurred During Reflow（回流过程中的SMT问题）Cold Joints（冷焊）Nonwetting（不润湿）Dewetting（反润湿）Leaching（浸析）Intermetallics（金属互化物）Tombstoning（立碑）Skewing（歪斜）Wicking（焊料上吸）Bridging（桥连）Voiding（空洞）Opening（开路）Solder Balling(锡球)Solder Beading（锡珠）Spattering（飞溅）5. SMT Problems Occurred at Post Reflow Stage（回流后问题）White Residue（白色残留物）Charred Residue（炭化残留物）Poor Probing Contact（探针测接问题）Surface Insulation Resistance or Electrochemical Migration Failure （表面绝缘阻抗或电化迁移缺陷）Delamination/Voiding/Non-curing Of Conformal Coating/Encapsulants （分层 / 空洞 / 敷形涂覆或包封的固化问题）6. Challenges at BGA and CSP Assembly and Rework Stage（BGA、CSP组装和翻修的挑战）Starved Solder Joint（少锡焊点）Poor Self-Alignment（自对位问题）Poor Wetting（润湿不良）Voiding（空洞）Bridging（桥连）Uneven Joint Height（焊点高度不均）Open（开路）Popcorn and Delamination（爆米花和分层）Solder Webbing（锡网）Solder Balling（锡球）7. Problems Occurred at Flip Chip Reflow Attachment（倒装晶片回流期间发生的问题）Misalignment（位置不准）Poor Wetting（润湿不良）Solder Voiding（空洞）Underfill Voiding（底部填充空洞）Bridging（桥连）Open（开路）Underfill Crack（底部填充裂缝）Delamination（分层）Filler Segregation（填充分离）Insufficient Underfilling（底部填充不充分）8. Optimizing Reflow Profile via Defect Mechanisms Analysis（回流曲线优化与缺陷机理分析）Flux Reaction（助焊剂反应）Peak Temperature（峰值温度）Cooling Stage（冷却阶段）Heating Stage（加热阶段）Timing Considerations（时间研究）Optimization of Profile（曲线优化）Comparison with Conventional Profiles（与传统曲线的比较）Discussion（讨论）Implementing Linear Ramp Up Profile(斜坡式曲线)希望以上资料对你有所帮助，附励志名3条：1、积金遗于子孙，子孙未必能守；积书于子孙，子孙未必能读。