radiated EMI performance
摩恩孙 RS485 隔离传输器模块 TD301D485 TD501D485 系列说明书

single RS485isolation transceiver moduleFEATURES●Two-terminal isolation (input and output are mutually isolated)●Integrated Isolated DC/DC converter ●Bus protection●Isolation voltage :2.5KVDC●Operating temperature range:-40℃~+85℃●Baud rate 9600bps●Connect up to 32nodes on one busTD301D485/TD501D485series are transceiver isolation module with integrated duplex power isolation,electrical isolation,and RS485interface bus protector ;Products can be easily embedded in the user equipment,achieve function of RS485network connection.The isolation RS485circuits of using a piece of power isolation module,three light couplings and RS485transceivers and device are only need to adopt a RS485isolation module now.Simplify the customers on the isolation requirements of the design.Selection GuidePart No.Power Supply input (VDC)TD301D485 3.17~3.45TD501D4854.75~5.25Input SpecificationsItemOperating ConditionsValueInput Power SupplyStatic current Products energized,no communication TD501D485≤30mA,TD301D485≤40mA Send current 9600bps Square wave communicationTD501D485≤40mA,TD301D485≤60mAInputSerial interface TD301D485compatible with +3.3V UART interface TD501D485compatible with +5V UART interfacePin currentI TXD ≤5mA;I RXD ≤3mA;I CON ≤5mABus InterfaceItem Operating ConditionsValueOutputRS485bus interfaceStandard interface RS485,pull-up and pull-down resistor,whose value is 4.7K,have been set to A/B line.Transmission SpecificationsItem Operating ConditionsValueData Rate9600bps (max.)Transceiver Switching Delay The delay time from the receiving data switch to the send data :30μs(min.),100μs(max.).The Number of Nodes Connect up to 32nodes on one busTransceiver ControlContrary to common RS485transceiver control levelTruth TableSending StatusControlInput Output CON TXD A B Line state 0110Normal 0001NormalReceiving StatusControl Input Output CON A-B RXD 1≥0.2V 11≤-0.2VGeneral SpecificationsItem Operating Conditions ValueElectric Isolation Two-terminal isolation(input and output are mutually isolated) Degree of Isolation testing for1minute,leakagecurrent<5mA,humidity<95%2.5KVDCOperating Temperature-40℃~+85℃Transportation and StorageTemperature-50℃~+105℃Operating Humidity10%~90%Temperature rising Ta=25℃25℃(Typ.)Application Environment The presence of dust,fierce vibration,impulsion and corrosivegas may cause damage to the productPhysical SpecificationsCasing Material Black flame-retardant heat-proof plastic(UL94-V0)Package DIP10Weight About10gCooling Method Free air convectionEMC SpecificationsEMI Conducted Disturbance CISPR22/EN55022CLASS A(see2-②for recommended circuit) Radiated Emission CISPR22/EN55022CLASS A(see2-②for recommended circuit)EMS Electrostatic Discharge IEC/EN61000-4-2Contact±4KV perf.Criteria B EFTIEC/EN61000-4-4Power supply port±2KV(see2-①for recommended circuit)perf.Criteria BIEC/EN61000-4-4Signal port±1KV(see2-③for recommended circuit)perf.Criteria B Surge Immunity IEC/EN61000-4-5Power supply port±1KV(see2-①for recommended circuit)perf.Criteria BSignal port±0.25KV/±0.5KV(see2-③for recommended circuit)perf.Criteria BSignal port±0.5KV/±1KV(see2-③for recommended circuit)perf.Criteria BSignal port±1KV/±2KV(see2-③for recommended circuit)perf.Criteria BSignal port±2KV/±4KV(see2-③for recommended circuit)perf.Criteria BSignal port±4KV/±6KV(see2-③for recommended circuit)perf.Criteria BApplication Precautions1.Please read the technical manual carefully before use;contact our technical support if you have any problem.2.Do not use the product in hazardous areas.e DC power supply for the product and220V AC power supply is prohibited.4.Do not dismount and assemble the product without permission to avoid failure or malfunction of equipment.After-sales service1.Ex-factory inspection and quality control have been strictly conducted for the product;if there occurs abnormal operation or possibilityof failure of internal module,please contact the local representative or our technical support.2.The warranty period for the product is3years as calculated from the date of delivery.If any quality problem occurs under normal usewithin the warranty period,the product can be repaired or changed for free.Applied circuitSee Application Notes for Isolated Transmitter for details.Design Reference1.Typical application0.1UFDC/DCVCC TXDCONRXD MCUDIDE RE RORS485EENGNDA B VCC+5V6N1376N1376N137+5VConventional CircuitRXD TXD GND VCC A B RGND1098RXD TXD1234MCUVCC485 BusCONCON5New CircuitFig.12.Recommended EMC circuitGND +TXD L1RXD CONRGN DA B123451098TVS1C1C2C3①②R4TVS2R5TVS3TVS4GDT1R1C4③VCC C5C6A1B1R2R3GDT2GDT3④Fig.2Recommended external circuit parameters:Model TD301D485/TD501D485±0.25KV/±0.5KV±0.5KV/±1KV±1KV/±2KV±2KV/±4KV±4KV/±6KVC1220uF/10V(Electrolytic capacitor)220uF/10V(Electrolytic capacitor)TVS1SMCJ5.0A (TD301D485)/SMCJ6.5A(TD501D485)C2/C31uF/50V 1uF/50V L110μH 10μH C5/C6100pF/100V 100pF/100V C41nF/2KV 1nF/2KV R11M Ω1M ΩTVS2/TVS3/TVS4SMBJ15CA SMBJ15CA R4/R5----10Ω/2W(Wire-wound resistor)10Ω/2W(Wire-wound resistor)10Ω/2W(Wire-wound resistor)R2/R310Ω/1W(Wire-wound resistor)10Ω/2W(Wire-wound resistor)------GDT1/GDT2/GDT3----G30-A90XS30-A90XS50-A90XNotes:1GDT1,GDT2and GDT3be used instead of a three terminal gas discharge tube.Such as GDT1,GDT2and GDT3three two-terminal device available gas discharge tube instead of a three-terminal at "±4KV /±6KV"hierarchy,as B3D090L-C.2It is not needed the component when parameter with the symbol of "--".3.For more information please find the application notes on Dimensions and Recommended LayoutNotes:1.Packing Information please refer to'Product Packing Information'.Packing bag number:58040012;2.Unless otherwise specified,data in this datasheet should be tested under the conditions of Ta=25℃,humidity<75%when inputtingnominal voltage and outputting rated load;3.All index testing methods in this datasheet are based on our Company’s corporate standards;4.The performance indexes of the product models listed in this datasheet are as above,but some indexes of non-standard modelproducts will exceed the above-mentioned requirements,and please directly contact our technician for specific information;5.We can provide product customization service;6.Specifications of this product are subject to changes without prior notice.Mornsun Guangzhou Science&Technology Co.,Ltd.Address:No.5,Kehui St.1,Kehui Development Center,Science Ave.,Guangzhou Science City,Luogang District,Guangzhou,P.R.China Tel:86-20-38601850-8801Fax:86-20-38601272E-mail:***************。
EMC、EMI、EMS、CE电气干扰领域

什么叫EMI、EMS和EMC在电气干扰领域有许多英文缩写。
EMI(Electro Magnetic Interference)直译是电磁干扰。
这是合成词,我们应该分别考虑"电磁"和"干扰"。
所谓"干扰",指设备受到干扰后性能降低以及对设备产生干扰的干扰源这二层意思。
第一层意思如雷电使收音机产生杂音,摩托车在附近行驶后电视画面出现雪花,拿起电话后听到无线电声音等,这些可以简称其为与"BC I""TV I""Tel I",这些缩写中都有相同的"I"(干扰)(BC:广播)那么EMI标准和EMI检测是EMI的哪部分呢?理所当然是第二层含义,即干扰源,也包括受到干扰之前的电磁能量。
其次是"电磁"。
电荷如果静止,称为静电。
当不同的电位向一致移动时,便发生了静电放电,产生电流,电流周围产生磁场。
如果电流的方向和大小持续不断变化就产生了电磁波。
电以各种状态存在,我们把这些所有状态统称为电磁。
所以EMI标准和EMI 检测是确定所处理的电的状态,决定如何检测,如何评价。
EMS(Electro Magnetic Susceptibility)直译是"电磁敏感度"。
其意是指由于电磁能量造成性能下降的容易程度。
为通俗易懂,我们将电子设备比喻为人,将电磁能量比做感冒病毒,敏感度就是是否易患感冒。
如果不易患感冒,说明免疫力强,也就是英语单词Immunity,即抗电磁干扰性强。
EMC(Electro Magnetic Compatibility)直译是"电磁兼容性"。
意指设备所产生的电磁能量既不对其它设备产生干扰,也不受其它设备的电磁能量干扰的能力。
EMC这个术语有其非常广的含义。
如同盲人摸象,你摸到的与实际还有很大区别。
特别是与设计意图相反的电磁现象,都应看成是EMC问题。
MVAD065系列65W 2英寸x4英寸 AC-DC 电源转换器说明书

MVAD065-48
48V
Load Current
0 to 11A 0 to 5.0A 0 to 3.34A 0 to 2.71A 0 to 1.36A
Load Capacitance
0 to 2200μF 0 to 1000µF 0 to 680μF 0 to 560µF 0 to 330µF
Line, Load, Cross Regulation ± 2% ± 2% ± 2% ± 2% ± 2%
Min.
Typ.
Max.
Units
1500 Vac
4000
500
Vdc
300
350
µA
100
Standard IEC/EN 61000-3-2 IEC/EN 61000-3-3 EN 55022 FCC Part 15 IEC/EN 61000-4-2 IEC/EN 61000-4-3 IEC/EN 61000-4-4 IEC/EN 61000-4-5 IEC/EN 61000-4-6 IEC/EN 61000-4-8 IEC/EN 61000-4-11
MVAD065 Series
65W 2" x 4" AC-DC Power Supply Converter
Conditions
Min.
Typ.
Max.
-40
85
See thermal derating curves
-10
70
Start up
-20
Non-condensing
1.4
A
At 264Vac, at 25°C cold start
75 60
Apk
OUTPUT CHARACTERISTICS
何谓EMC

何谓EMC何谓EMCEMC是Electromagnetic Compatibility(电磁兼容性)的缩写,在日语中多用“电磁两立性”或“电磁适合性”等字样来表达,可能还有其他一些表述方式。
意为“不对其他设备产生电磁干扰,即使受到来自其他设备的电磁干扰仍保持原有的性能”,因需要兼备两种性能而被称为“电磁兼容性”。
“不对其他设备产生电磁干扰”是指如果不有意识地确保这一性能就会给其他设备带来电磁干扰。
EMI(Electromagnetic Interference)是表示电磁干扰(电磁干涉、电磁妨碍)的术语。
由于发射电磁波会导致干扰,所以经常与Emission(辐射、发射)这一术语成对使用。
从开关电源方面讲,是指因开/关工作而产生开关噪声。
与之相反的“即使受到来自其他设备的电磁干扰”相关的术语是EMS(Electromagnetic Susceptibility)-电磁敏感性。
EMS多与Immunity(耐受性、抗扰度、排除能力)成对使用。
要求具备“即使受到EMI,也不会引起误动作等问题”的耐受能力。
EMI分为传导噪声(Conducted Emission)和辐射噪声(Radiated Emission)两种。
这两个术语在日文中用日语表达多于用英语缩写表达。
传导噪声是指经由线体或PCB板布线传导的噪声。
辐射噪声是指排放(辐射)到环境中的噪声。
对于这些噪声,EMS中分别都有抗扰度要求。
它们的关系如下。
图片以上即相关术语解释及关系。
简而言之,即EMC是EMI和EMS是否满足标准规范的关键。
将上述解说汇总如下。
关键要点:EMC(电磁兼容性)是指兼备EMI和EMS两方面的性能。
EMI(电磁干扰)是指因辐射/排放(Emission)电磁波而对环境产生的干扰。
EMS(电磁敏感性)是指对电磁波干扰(EMI)的耐受性/抗扰度(Immunity)。
EMI简介

EMI 簡介Switching Power supply -EMI史金強第一節電磁干擾的概念第二節EMC與EMI第三節EMI 防制觀念的建立第四節電磁干擾的檢驗第五節電磁干擾相關規範電磁干擾的形成電子設備產品在使用時,往往會產生一些有用或無用的電磁能量。
而這些電磁能量會以電場、磁場或電磁波的方式來影響到其它電子設備的工作,從而形成所謂電磁干擾的問題。
電磁干擾的種類系統內干擾*源自於所欲處理之系統內部所產生的干擾 系統間干擾*源自於系統之外的外部雜訊干擾第一節電磁干擾的概念電磁干擾的傳送型態傳導干擾*電子裝置內雜訊經由金屬路徑傳導(包括如變壓器、電容器等)輻射干擾*非經金屬的傳輸特性(包括如輻射場、電磁感應等)電磁干擾的傳送型態RadiatedConducted輻射干擾傳導干擾電磁干擾形成三要素電磁干擾源:是指產生電磁波的電氣、電子設備或雷電等自然現象對電磁干擾源敏感的接收裝置電磁耦合途徑:電磁干擾能量的傳播通道或媒介第一節電磁干擾的概念第一節電磁干擾的概念電磁干擾問題的解決要解決好電磁干擾問題,必需從電磁波的產生(干擾源)和接收(防護)兩方面來採取措施,擬制定傳導干擾和輻射干擾,增強抗干擾能力,使電氣、電子設備既不是電磁干擾源,又具有一定的防護能力,達到EMC的理想狀態。
第二節EMC 與EMI EMC的技術分類EMCInterference 干擾Susceptibility 敏感EMI EMSCE RE RSCSEMC的技術分類EMC : Electromagnetic Compatibility EMI : Electrommanetic Interference EMS : Electromagnetic Susceptibility CE : Conducted EmissionRE : Radiated EmissionCS : Conducted SusceptibilityRS : Radiated SusceptibilityEMC的技術分類何謂EMC(電磁相容)?*一個電子裝置或系統與其它電子裝置或系統同在工作狀態情況下,不會因為EMI問題,而使功能性有受到影響的情況發生。
EMI 测试基本知识介绍

技术文件技术文件名称:EMI测试基本知识介绍技术文件编号:版本:V1.0文件质量等级:共17 页(包括封面)拟制审核会签标准化批准深圳市中兴通讯股份有限公司修改记录目录1EMI干扰 (5)1.1EMI分类 (5)1.2差模和共模干扰 (5)2测量系统的架构 (7)2.1EMI测量系统 (7)2.2EMS测量系统 (7)3测试仪器 (7)3.1EMI测试接收机EMI Test Receiver (7)3.2阻抗稳定网络ISN (8)3.3耦合-去耦网络CDN(Couple and Decouple networks) (9)3.4干扰分离器的方法原理 (10)4可靠性室EMI测试 (14)4.1相关测试设备介绍 (14)4.2传导骚扰测试框图 (16)4.3传导抗扰度试验 (17)5参考文献 (17)摘要:主要介绍EMI相关的基本概念、测试系统的组成、测试仪器的基本原理、可靠性室相关的测试仪器和测试方法。
关键词:EMI Electromagnetic InterferenceISN Impedance Stabilization NetworkCDN Couple and Decouple networksAMN Artificial Mains NetworkDM Differential modeCM Common modeEMI测试基本知识介绍1EMI干扰1.1EMI分类根据传导模式的不同EMI主要分为:辐射性骚扰(Radiated Emission)和传导性骚扰(Conducted Emission)。
辐射性EMI通过设备外壳的缝隙、开孔或其他缺口泄漏直接由空间传播,无须任何传输介质;主要为电路通电后,由于电磁感应效应所产生的电磁辐射发射所形成的电磁干扰,集中表现在频率的高端;一般用屏蔽(Shielding)、接地(Grounding)等方式解决。
对辐射传导EMI解决方式归纳为以下几种:在干扰源加LC滤波回路;在I/O端加上去耦电容到地;用屏蔽隔离(Shielding)的方式把电磁波围覆在屏蔽罩内;尽量将PCB的地面积扩张;产品内部尽量少使用排线或实体线;产品内部的实体线尽量做成绞线以抑制杂讯幅射,同时在排线的I/O端加上去耦电容;在差模信号线的始端或末端加上共模滤波器(Common Mode Filter);遵循一定的模拟和数字电路布线原则。
浅显易懂,整体地讲清楚,什么是电磁兼容(EMC)
浅显易懂,整体地讲清楚,什么是电磁兼容(EMC)EMC概述(1)什么是电磁兼容性(EMC)?“电磁兼容性(EMC)”主要分为两种,一种是设备本身的电磁噪声对其他设备或人体带来的影响(电磁干扰,EMI:Electromagnetic Interference, Emission),另一种是设备是否会因来自外部的电磁干扰而发生误动作(电磁敏感性EMS:Electromagnetic Susceptibility, Immunity),之所称为“电磁兼容性”,是由于为了避免发生故障,这两方面都要兼顾。
以文字的形式写成“定义”是这样的,理解起来有点难是吧。
下面我将浅显易懂地、直观地解释一下。
我将以大家熟悉的半导体集成电路(LSI、IC)为主角进行解说。
首先是电磁干扰(EMI或电磁发射)。
如今,已经开发出并且在售的LSI和IC种类繁多。
为了便于说明,大致分类如下:①老式三端电源(7805和7905等)和低饱和电源(LDO)等直流电源相关产品。
这些产品要处理的信号是直流(DC)的。
②差分运算放大器(运算放大器)、电压比较器(比较器)、语音信号处理等相关的产品。
要处理的信号是基于正弦波的模拟信号和线性信号。
③微控制器、存储器、逻辑等相关的产品。
要处理的信号是数字信号。
④最近常用的开关电源和电荷泵电源等电源相关的产品;LED驱动器、LCD驱动器等显示相关的产品;PWM电机驱动器等驱动相关的产品。
这些LSI和IC是涉及到开关技术的产品。
其中①和②不产生电磁干扰(EMI),③和④产生电磁干扰(EMI)。
可以简单的理解为模拟LSI和线性LSI不会产生电磁噪声,而数字LSI和开关LSI会产生电磁噪声,这样说可能更直观更易懂。
由于直流电压本身没有基波和谐波分量,正弦波中的高次谐波分量(基波的N倍频分量)很少,因此不易产生电磁噪声。
而数字LSI 和开关LSI是处理矩形波(脉冲波)的产品,因此会产生比如在1GHz (千兆赫兹)左右的高次谐波分量(主要是奇次谐波)。
EMC及浪涌相关测试测试简介
EMC基本定义
电磁兼容性(Electro-Magnetic Compatibility,简称:EMC) 装置、整组设备或整套系统,在它本身的电磁环境中,能圆满地动作,而 且不会产生让其它在此环境中的设备难以忍受的电磁干扰。 EMC测试目的是检测电器产品所产生的电磁辐射对人体、公共电网以及 其他正常工作之电器产品的影响。 EMC包含两大项:EMI(干扰)和 EMS(敏感度,抗干扰)
辐射骚扰测试(RE)
辐射骚扰测试(Radiated disturbance,简称RE),包含空间辐射和磁场辐射 测试。辐射骚扰主要是指能量以电磁波的形式由产品发射到空中,或能量 以电磁波形式在空间传播对周边产品的影响。 辐射骚扰超标的产品可能引起周围装置、设备或系统性能降低,干扰信 息技术设备或其他电子产品的正常工作,并对人体造成一定危害。 电磁辐射分两个级别,其中工频段的单位是μT,如果辐射在0.4μ T以上 属于较强辐射,对人体有一定危害,长期接触易患白血病。如果辐射在 0.4μT以下,相对安全。而射频电磁波的单位是μW/㎝ 2。
电快速瞬变脉冲群抗扰度测试(EFT)
电快速瞬变脉冲群抗扰度测试(Electrical fast transient/burst Immunity test, 简 称EFT),测试波形为5/50nS电压波。又称快速脉冲测试. 电快速瞬变脉冲群是由电 路中来自切换瞬态过程(切断感性负载、继电器触点弹掉等)产生的能量,电 快速瞬变脉冲群抗扰度测试主要是模拟上述能量通过连接线缆(电源线等)对 电子产品产生的干扰. 电快速瞬变脉冲群抗扰度测试不通过的电子产品在实际使用中可能会死机, 复位,发生故障或烧毁等.电快速瞬变脉冲群抗扰度测试使用的基础标准为 IEC/EN 61000-4-4. 目的:考察单个设备或系统抗快速瞬变干扰的能力
FCC-EMC简介
FCC:EMC测试是针对进入欧洲的带有辐射干扰的产品所进行的测试主要有:EMI(干扰)和EMS(抗干扰)测试项目:ESD-静电抗干扰测试EFT-快速脉冲群测试SURGE-测雷击抗传导干扰掉电测试谐波电流电压闪烁传导干扰辐射干扰磁场辐射功率辐射相关测试标准就要看是哪类产品:A:家电类产品:EN55014-1,EN55014-2,EN61000-3-2,EN61000-3-3 B:IT类产品:EN55022,EN55024,EN61000-3-2,EN61000-3-3C:灯具类产品:EN55015,EN61547,EN61000-3-2,EN61000-3-3D:AV类产品:EN55013,EN55020,EN61000-3-2,EN61000-3-3至于FCC测试是美国的主要是针对无线电产品的一个认证与测试它主要是测EMI就是干扰,美国人的思想就是大家都不要干扰别人就没有干扰了这是跟EMC的区别,FCC的测试标准更简单:FCC part15和FCC part18FCC认证,又称为美国联邦通信认证,FCC(Federal Communications Commission)是美国联邦通信委员会于1934年由COMMUNICATIONACT建立是美国政府的一个独立机构,直接对国会负责。
FCC通过控制无线电广播、电视、电信、卫星和电缆来协调国内和国际的通信。
涉及美国50多个州、哥伦比亚以及美国所属地区,为确保与生命财产有关的无线电和电线通信产品的安全性,FCC的工程技术部(Office of Engineering and Technology)负责委员会的技术支持,同时负责设备认可方面的事务。
许多无线电应用产品、通讯产品和数字产品要进入美国市场,都要求FCC的认可。
联邦通讯委员会(FCC)--管理进口和使用无线电频率装置,包括电脑、传真机、电子装置、无线电接收和传输设备、无线电遥控玩具、电话、个人电脑以及其他可能伤害人身安全的产品。
开关电源专业词汇解释
辅助电源/AUX(Auxiliary power supply):在有些AC/DC电源和DC/DC变换器中,有一个辅助的电源,一般加上输入电压以后就会有输出(少数辅助电源,例如,给风扇的电源也有受控的),它主要用作控制信号的电源。
“砖”/Brick:DC/DC变换器中,“Brick”是用来表示模块大小的“单位”,有所谓的全砖、半砖、1/4砖、1/8砖、1/16砖等,例如,密封的半砖模块,其大小为2.40×2.30×0.50(单位为英寸),而开架结构半砖模块的大小为2.40×2.28×0.30(单位为英寸)(高度还有0.34英寸等不同的数值)。
均流端/ CB (Current Balance):为了增加输出功率,把多个具有相同输出电压和输出功率的电源并联使用,把它们的“CB”端连接在一起,以达到各个模块的输出电流大致相等,以免由于不均流而导致个别电流太大的模块损坏,均流端也有用“PC”,“SWP”,“ C Share”等表示。
立方英尺/分钟和英尺/分钟/CFM(Cube feet minute)、LFM(Line feet minute):风冷的流量单位,CFM=LFM×面积S。
风速的另一个单位为米/秒。
共模噪声/Common Mode Noise :指两导体对某个基准点具有大小基本相等,方向相同的噪声,通常指交流输入L线和N线对地的噪声,可通过共模电感和Y电容来抑制它们。
降额/Derating当环境温度较高时(例如50℃以上),有的电源必须要降低使用的输出功率,另外,有些电源在规定的输入电压范围的低端,不能满足所有的输出参数(例如:电压可调范围或功率),要降额使用。
动态响应/Dynamic Response :当负载出现突变时,电源的输出电压会出现瞬间的过冲,然后回到正常输出状态,动态响应关心的是过冲幅度的大小和响应时间的长短。
电磁兼容/EMC(Electromagnetic compatibility) :指电源在工作中产生的电磁发射要限制在一定的范围内,另外它本身也要有一定的抗干扰能力。
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Application Note Number 8Astec Standard Power EuropeAstec House, Waterfront BusinessPark, Merry Hill, Dudley DY5 1LX, UKTel: 01384 842211Fax: 01384 843355
Product: MVP RangeApplication Overview: Installation of MVP power supplies for optimum radiated EMC performance
Originator:B. Lewis Location: Stourbridge, UK Date: 14/10/97
Astec Germany GmbHRobert-Heil-Str. 836251 Bad HersfeldTel: 06621-5057-0Fax: 06621-5057-20
Astec FranceLes Arcades424, la Closerie Mont d’Est93194 Noisy Le GrandTel: (1) 43 05 86 80Fax: (1) 43 04 60 33
SchematicNonconductivetable, 1.5 x 1m
12
3
80cm toGround Plane
45
67
145
26
3Page 1 of 3
1. Interconnecting cables between output and load aretwisted together for each output and then all outputinterconnections bundled together forming a bundle 1mlong.2. Resistive load elements mounted on an electricallyconductive plate.3. The load plate is electrically bonded to the PSUchassis.4. The rear of all components of the system under testshall be located flush with the rear of the table.5. No vertical conducting wall used.6. Power cords drape to the floor and are routed over toreceptacle.7. If LISNs are kept in the test set-up for radiatedemissions, it is preferred that they be installed under theground plane with the receptacle flush with the groundplane.
Fig. 1. Perspective view of radiated emissions test set-up for MVP. Reference has been made to ANSI C63.4-1992
1. Increased attenuation of the radiated emissions canbe achieved by careful design of the apparatusenclosure.2. Apparatus enclosure securely bonded to supplyearth connection.3. Mains supply wiring routed as far away as possiblefrom PSU load wiring and active electronic circuitry.4. PSU load wiring twisted together for each outputand all output wiring bundled together as far aspossible between the PSU and the load equipment.5. Case of the PSU securely bonded to the apparatusenclosure. This can be achieved via the PSU mountingfixings.6. Power supply tracking on backplanes and otherequipment printed circuit boards form current loops withminimum length and enclosed area. Local capacitivesupply decoupling used on boards incorporating highfrequency circuits.
Fig. 2. Example installation of MVP PSU illustrating recommendations for optimisation of radiated EMC.Application Note Number 8DescriptionGreat care has been taken during the design of the MVP range to ensure that the EMC performance is of thehighest standard. This is illustrated by the fact that line conducted emissions are well below the Curve B limits ofEN55022 as shown in Fig. 3. Furthermore, tests of the MVP in isolation have yielded excellent radiated emissionresults as shown in Fig.4.In terms of the radiated emissions, it must be borne in mind that whilst the MVP range is constructed in anelectrically conductive chassis, it is, in effect, an open frame Power Supply Unit. The Installation and Operatinginstructions which are supplied with every MVP model state that the MVP “...is intended for use as a component part ofother equipment.” This is partly related to safety requirements but also in recognition of the fact that the radiatedemissions from the power supply system will be substantially dependant on the nature of the installation. For example,the orientation of the supply and load wiring can have a substantial impact on the emissions.
The principles of good EMC design are illustrated in Fig 2 and can be summarised as follows:1.Build in good EMC from the outset and eliminate poor EMC at source.The principles of good EMC have been incorporated in the MVP design, as can be seen from the resultspresented in this application note. Using a PSU which performs well in it’s own right, such as Astec’s MVP range, willgreatly reduce the challenges to be met in achieving good system EMC.
2.Take care with grounding and earthing.It is important to take care with the earthing of system elements to avoid setting up high frequency currentloops which will, in turn, cause emissions from the system.
3.Minimise length and area of high frequency current loops.In addition to the possibility of earth loops, it must be recognised that the load connections from the PSU are, ineffect, high frequency current loops. Keeping these connections short and tightly coupled will minimise the radiatingeffect of these loops and also minimise the coupling effect highlighted in point 4.
4.Minimise coupling of HF circuits to potential external radiators.For example, the mains input wiring can be viewed as an antenna. Any HF signals coupled to it within theapparatus enclosure will be radiated outside the apparatus enclosure. Good practice, therefore, would be to keep themains input wiring physically isolated from any circuits carrying high frequency signals, including load connections fromthe PSU. Where this is not possible, screening of the mains input wiring will have a substantially beneficial effect onminimising the pick-up. This principle will equally apply to any signal connection intended to pass beyond the apparatusenclosure boundary.