PCB术语中英文对照表

Adhesion附着力

Annular Ring孔环

AOI（automatic optical inspection）自动光学检测

AQL（acceptable quality level）可接受的质量等级

B²it(buried bump interconnection technology)埋入凸块焊点互连技术BBH(buried blind hole)埋盲孔

BGA(ball grid array)球栅阵列

Blister起泡

Board Edges板边

Burr毛头/毛刺

BUM(Build-up multilayer)积层式多层板

BVH（buried/blind via hole）埋/盲导通孔

CAD(computer aided design)计算机辅助设计

CAM(computer aided manufacturing)计算机辅助制造

Carbon oil碳油

CEM(composite epoxy material)环氧树脂复合板材

chamfer倒角

Characteristic impedance特性阻抗

CNC（computerized numerical control）计算机化数字控制

Conductor Crack导体破裂

Conductor Spacing导线间距

connector连接器

Copper foil铜箔（皮）

Crazing微裂纹(白斑)

Delamination分层

Dewetting半润湿(缩锡)

DFM（design for manufacturing）可制造性设计

DIP(dual in-line package)双列直插式组件

Dk（dielectric constant）介电常数

DRC(design rule checking)设计规则检查

drawing图纸

ECN(engineering change notice)工程更改通知

ECO(engineering change order)工程更改指令

E glass电子级玻璃

entek OSP处理

Epoxy resin环氧树脂

ESD(electrostatic discharge)静电释放

Etched Marking蚀刻标记

Flatness翘曲度

Foreign Inclusion外来夹杂物

Flame resistant阻燃性

FR-2(flame-retardant2)

耐燃酚醛纸基板

FR-3(flame-retardant3)耐燃环氧纸基板

FR-4(flame-retardant4)耐燃环氧玻璃布基板

FR-5(flame-retardant5)耐燃多功能环氧玻璃布基板

ground地面（层）

Haloing晕圈

HDI(high density interconnection)高密度互连技术

HASL(hot air solder leveling)热风焊料整平（整平）

IC(integrated circuits)集成电路

Ink Stamped Marking盖印标记

Insulation resistance绝缘电阻

Ion cleanliness离子清洁度

IPC(the institute for interconnecting and packaging of electronic circuits)印制电路互连与封装协会

ISO(International organization for standardization)国际标准化组织

Laminate Voids压合空洞

laser激光

LDI(laser direct imaging)激光直接成像

legend文字标记、符号

Lifted Lands焊盘浮起

logo标志

LPI(liquid photoimageable)液态感光成像

LPISM(liquid photoimageable solder mask)液态感光阻焊膜

marking标记

Measling白斑

Microvoids微坑

mil密耳（千分之一英寸）

MIL-STD(military standard)美国军用标准

Negative Etchback欠蚀

Nicks缺口

Nodules镀镏

Nonwetting不润湿(拒锡)

open开路

OSP(organic solderability preservatives)表面抗氧化

oxides氧化物

pad焊盘

panel拼板

pattern板面图形

PCB(printed circuit board)印制电路板

Pcs(pieces)件、片、只

Peeling剥落

pinhole针孔

Pink Ring粉红圈

Pits凹坑

pitch中心距

Plating Voids镀层破洞

plug塞

Positive Etchback过蚀

power电源层

prepreg半固化片

PTFE(polytetrafluoroethylene)聚四氟乙烯

PTH(plated through-hole)金属化孔

PWB(printed-wiring board)印制线路板

Registration对准

QA(quality assurance)质量保证

QC(quality control)质量控制

QE(quality engineering)质量工程

QFP(quad flat package)方形扁平组件

repair修理

RCC(resin coated copper)已涂覆树脂的铜箔Reference dimension参考尺寸

registration对准度

resin树脂

rejection拒收

revision修订版

RF(radio frequency)射频

Ripples纹路

rout外形铣

scratch划伤

Screened Marking纲印标记

scoring刻槽

short短路

signal信号

Silk screen丝网

Skip Coverage漏印

slot开槽

SMD(surface mount device)表面安装器件

SMOBC(solder mask over bare copper)裸铜覆盖阻焊膜SMT(surface mount technology)表面安装技术

smear毛刺

solder焊锡

S/M(solder mask)绿油

solderability可焊性

Soda Strawing(汽水)吸管式浮空

SPC（statistical process control）统计过程控制spacing间距

Tape test胶带实验

TCE（thermal coefficient of expansion）热胀系数