BOM process introduction
汽车常用语英文缩写解释 (1)
新產品開發設計名詞解釋4M Man,Machine,Material, Method 人員,機械,材料,手法AIAG Automotive Industry Action Group 汽車工業活動團體APQP Advanced Product Quality Planning 先期產品管制計劃Certif. Certification 證明DOE Design Of Experiments 設計實驗DFMEA Design Failure mode and effects analysis設計不良模式影響分析DQA Design Quality Assurance 設計品質保證DV Design Validation / Verification 設計確認DVT Design Verification Test 設計確認檢驗EVT Engineering Verification Test 工程確認檢驗FMEA Failure Mode and Effects Analysis 不良模式影響分析JDM Joint Design Manufacturing 連接設計製造KPC Key Product / Process Characteristics 關鍵特性MFG. Manufacturing 製造業MQA Manufacturing Quality assurance 製造品質保證MVT Manufacturing Verification Test 製造確認檢驗MSE Measurement System Evaluation 量測系統評估MSA Measurement System Analysis 量測系統分析NPD New Product Development 新產品開發NPI New Product Introduction 新產品介紹OBM Own Branding Manufacturing 自己設計且有品牌ODM Original Design Manufacturing 自己設計OEM Origin Equipment Manufacturing 客戶設計只做代工PDCA Plan Do Check Action 查驗活動計劃PFMEA Process Failure Mode and Effects Analysis 產品不良模式影響分析PPAP Production Parts Approval Process 產品認可程序SPC Statistical Process Control 製程統計控制Tech. Technology 技術TPM Total Productive Management / Maintenance 全面生產管理制度先行解释一下制造和工程方面的专有名词：PE: Production Engineer 产品工程师.TE: Test Engineer 测试工程师.IE: Industry Engineer 工业工程师.AE: Automatic Engineer 自动化工程师.R&D: Research Development Engineer 研发设计工程师.MFG: Manufacturing. 制造部.QE: Quality Engineer 品保工程师.Pilot Run: 试量产.SPC: Statistic Process Control. 统计制程控制.R&D: Research & Development 研发ps:后面上传时,我会在该单词后备注之VQA:Vender Quality Assurance 厂商品质管理QA :Quality Assurance 品质保证MIS :Management Information System 管理信息系统OQC :Output Quality Control 出货质量保证IQC :Ining Quality Control 来料品质保证IPQC :In Process Quality Control 制程中的品质管制人员ME :Mechanical Engineer 机构工程师RMA: Return Material Authorization 销货不良回厂修理的产品品质的历程：检验出来→制造出来→设计出来→预估出来→习惯出来的, 这个历程说明了什幺呢，早期产品品质是靠品管检查出来的，后来发现都是生产过程中制造得以控制的，再来生产得以控制但还是有不良发生，哦，是设计不好造成的，后来设计者也在完善电路和layout，但是新产品推到市场上的lead time太长，因为要等pilot run后才能完善其电气性能，这样又推出了，品质是预估出来的，是的，吃一堑长一智嘛，在研发阶段就作同步工程，以大大缩短lead time．可是最近，很多成型的公司，推广了 TQM，通过了ISO 认证，还进展了FMEA(失败模式与效益分析)以与six sigma等一系列品质活动后，发现，process〔制程〕的重要性,原来品质是每个员工"习惯"出来的.个人认为：在半成品测试站〔初调〕，最好是ALL FUNCTION TEST。
品质英语缩写
IQC incoming quality controlRD research development centerIPQC in process quality controlRD HQ research development center head quarter FQC final quality controlQA quality assuranceBOM bill of materialPVT product verification testOQC outgoing quality controlPRP phase review processQE quality engineeringPM project managementDCC document center controlPJE project engineerECN engineering change noticePE product engineerECR engineering change requestNPI new product introductionMRB material review bomMP mass productionCAR corrective action requestMFG manufacturingFPC flexible printed circuit boardME mechanical engineerNCR non conforming reportKBD keyboardOBE out of box evaluationIFR instant failure rateIQA internal quality auditIFIR instant failure incident ratePCR process change requestHW hardwareIPO internal purchase officeN/A No ActionIE industrial engineeringESD electrostatic dischargeQPA quality process auditEOL end of lifeQSA quality system auditEN engineering noticeATE automatic test equipmentEMI electromagnetic interferenceAOI automatic optical inspectionEMC electromagnetic compatibilityPCBA print circuit board assemblyEE electronic engineer(ing)TTL technology transfer listEDC electronic data centerSQA supplier quality assuranceECO engineering change orderORT ongoing reliability testingDVT design verification testQM quality manualDOA dead on arrivalSW softwareCAD/ID computer aided design /industrial designSOW standard of workBIOS basic input /output systemSCSI small computer system interfaceAP application programSA software applicationAFR annual failure rateSO sales orderNTF no trouble foundMRP material requirement planningCND can not duplicateAVL approved vendor listDPPM defect parts per millionFAI first article inspectionFMEA failure mode effect analysisCLCA closed loop corrective actionLRR line reject rate measured by DPPMMQR monthly quality reviewMTQ manufacturing ,test and qualityRCA root cause analysisPFMEA process failure mode effect analysisSFIS Shop Floor Information SystemQEM Quality engineering measurementBGA Ball Grid ArrayIC Integrated CircuitQFP Quad Flat PackEOS Elwctrical Over StressTNB terminal notebook businessSMT Surface Mount Technology品質人員名稱類QC quality control 品質管理人員FQC final quality control 終點品質管制人員IPQC in process quality control 制程中的品質管制人員OQC output quality control 最終出貨品質管制人員IQC incoming quality control 進料品質管制人員TQC total quality control 全面質量管理POC passage quality control 段檢人員QA quality assurance 質量保證人員OQA output quality assurance 出貨質量保證人員QE quality engineering 品質工程人員品質保證類FAI first article inspection 新品首件檢查FAA first article assurance 首件確認CP capability index 能力指數CPK capability process index 模具製程能力參數SSQA standardized supplier quality audit 合格供應商品質評估FMEA failure model effectiveness analysis 失效模式分析FQC運作類AQL Acceptable Quality Level 運作類允收品質水準S/S Sample size 抽樣檢驗樣本大小ACC Accept 允收REE Reject 拒收CR Critical 極嚴重的MAJ Major 主要的MIN Minor 輕微的Q/R/S Quality/Reliability/Service 品質/可靠度/服務P/N Part Number 料號L/N Lot Number 批號AOD Accept On Deviation 特采UAI Use As It 特采FPIR First Piece Inspection Report 首件檢查報告PPM Percent Per Million 百萬分之一制程統計品管專類SPC Statistical Process Control 統計製程管制SQC Statistical Quality Control 統計品質管制GRR Gauge Reproductiveness & Repeatability 量具之再制性及重測性判斷量可靠與否DIM Dimension 尺寸DIA Diameter 直徑N Number 樣品數其它品質術語類QIT Quality Improvement Team 品質改善小組ZD Zero Defect 零缺點QI Quality Improvement 品質改善QP Quality Policy 目標方針TQM Total Quality Management 全面品質管理RMA Return Material Audit 退料認可7QCTools 7 Quality Control Tools 品管七大手法通用之件類ECN Engineering Change Notice 工程變更通知(供應商) ECO Engineering Change Order 工程改動要求(客戶) PCN Process Change Notice 工序改動通知PMP Product Management Plan 生產管制計劃SIP Standard Inspection Procedure 製程檢驗標準程序SOP Standard Operation Procedure 製造作業規範IS Inspection Specification 成品檢驗規範BOM Bill Of Material 物料清單PS Package Specification 包裝規範SPEC Specification 規格DWG Drawing 圖面系統文件類ES Engineering Standard 工程標準CGOO China General PCE龍華廠文件IWS International Workman Standard 工藝標準ISO International Standard Organization 國際標準化組織GS General Specification 一般規格部類PMC Production & Material Control 生產和物料控制PCC Product control center 生產管制中心PPC Production Plan Control 生產計劃控制MC Material Control 物料控制DC Document Center 資料中心QE Quality Engineering 品質工程(部)QA Quality Assurance 品質保證(處)QC Quality Control 品質管制(課)PD Product Department 生產部LAB Laboratory 實驗室IE Industrial Engineering 工業工程R&D Research & Design 設計開發部生產類PCs Pieces 個(根,塊等)PRS Pairs 雙(對等)CTN Carton 卡通箱PAL Pallet/skid 棧板PO Purchasing Order 采購訂單MO Manufacture Order 生產單D/C Date Code 生產日期碼ID/C Identification Code (供應商)識別碼SWR Special Work Request 特殊工作需求L/N Lot Number 批號P/N Part Number 料號OEM Original Equipment Manufacture 原設備製造PC Personal Computer 個人電腦CPU Central Processing Unit 中央處理器A.S.A.P As Soon As Possible 盡可能快的E-MAIL Electrical-Mail 電子郵件N/A Not Applicable 不適用QTY Quantity 數量I/O input/output 輸入/輸出NG Not Good 不行,不合格C=0 Critical=0 極嚴重不允許APP Approve 核準,認可,承認CHK Check 確認ASS'Y Assembly 裝配,組裝T/P True Position 真位度5WIH When, Where, Who, What, Why, How to6M Man, Machine, Material, Method, Measurement, Message4MTH Man, Material, Money, Method, Time, How 人力,物力,財務,技術,時間(資源) SQA Strategy Quality Assurance 策略品質保證DQA Design Quality Assurance 設計品質保證MQA Manufacture Quality Assurance 製造品質保證SSQA Sales and service Quality Assurance 銷售及服務品質保證LRR Lot Reject Rate 批退率SPS Switching power supply 電源箱DT Desk Top 臥式(機箱)MT Mini-Tower 立式(機箱)DVD Digital Video DiskVCD Video Compact DiskLCD Liquid Crystal DisplayCAD Computer Aided DesignCAM Computer Aided ManufacturingCAE Computer Aided EngineeringPCB Printed Circuit Board 印刷電路板CAR Correction Action Report 改善報告NG Not Good 不良WDR Weekly Delivery Requirement 周出貨要求PPM Percent Per Million 百萬分之一TPM Total Production Maintenance 全面生產保養MRP Material Requirement Planning 物料需計劃OS Operation System 作業系統TBA To Be Assured 待定,定缺MSA: Measurement System Analysis 量测系统分析LCL: Lower Control limit 管制下限Control plan 管制计划Correction 纠正Cost down 降低成本CS: customer Sevice 客户中心Data 数据Data Collection 数据收集Description 描述Device 装置Digital 数字Do 执行DOE: Design of Experiments 实验设计Environmental 环境Equipment 设备FMEA: Failure Mode and Effect analysis 失效模式与效果分析FA: Failure Analysis 坏品分析FQA: Final Quality Assurance 最终品质保证FQC: Final Quality control 最终品质控制Gauge system 量测系统Grade 等级Inductance 电感Improvement 改善Inspection 检验IPQC: In Process Quality Control 制程品质控制IQC: Incoming Quality Control 来料品质控制ISO: International Organization for Standardization 国际标准组织LQC: Line Quality Control 生产线品质控制LSL: Lower Size Limit 规格下限Materials 物料Measurement 量测Occurrence 发生率Operation Instruction 作业指导书Organization 组织Parameter 参数Parts 零件Pulse 脉冲Policy 方针Procedure 流程Process 过程Product 产品Production 生产Program 方案Projects 项目QA: Quality Assurance 品质保证QC: Quality Control 品质控制QE: Quality Engineering 品质工程QFD: Quality Function Design 品质机能展开Quality 质量Quality manual 品质手册Quality policy 品质政策Range 全距Record 记录Reflow 回流Reject 拒收Repair 返修Repeatability 再现性Reproducibility 再生性Requirement 要求Residual 误差Response 响应Responsibilities 职责Review 评审Rework 返工Rolled yield 直通率sample 抽样,样本Scrap 报废SOP: Standard Operation Procedure 标准作业书SPC: Statistical Process Control 统计制程管制Specification 规格SQA: Source(Supplier) Quality Assurance 供应商品质保证Taguchi-method 田口方法TQC: Total Quality Control 全面品质控制TQM: Total Quality Management 全面品质管理Traceability 追溯UCL: Upper Control Limit 管制上限USL: Upper Size Limit 规格上限Validation 确认Variable 计量值Verification 验证Version 版本QCC Quality Control Circle 品质圈/QC小组PDCA Plan Do Check Action 计划执行检查总结Consumer electronics 消费性电子产品Communication 通讯类产品Core value （核心价值）Love 爱心Confidence 信心Decision 决心Corporate culture (公司文化)Integration 融合Responsibility 责任Progress 进步QC quality control 品质管理人员FQC final quality control 终点品质管制人员IPQC in process quality control 制程中的品质管制人员OQC output quality control 最终出货品质管制人员IQC incoming quality control 进料品质管制人员TQC total quality control 全面质量管理POC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员QE quality engineering 品质工程人员FAI first article inspection 新品首件检查FAA first article assurance 首件确认CP capability index 能力指数SSQA standardized supplier quality audit 合格供应商品质评估FMEA failure model effectiveness analysis 失效模式分析AQL Acceptable Quality Level 运作类允收品质水准S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的Q/R/S Quality/Reliability/Service 品质/可靠度/服务P/N Part Number 料号L/N Lot Number 批号AOD Accept On Deviation 特采UAI Use As It 特采FPIR First Piece Inspection Report 首件检查报告PPM Percent Per Million 百万分之一SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计品质管制GRR Gauge Reproducibility & Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸DIA Diameter 直径QIT Quality Improvement Team 品质改善小组ZD Zero Defect 零缺点QI Quality Improvement 品质改善QP Quality Policy 目标方针TQM Total Quality Management 全面品质管理RMA Return Material Audit 退料认可7QCTools 7 Quality Control Tools 品管七大手法通用之件类ECN Engineering Change Notice 工程变更通知(供应商)ECO Engineering Change Order 工程改动要求(客户)PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Standard Inspection Procedure 制程检验标准程序SOP Standard Operation Procedure 制造作业规范IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification 包装规范SPEC Specification 规格DWG Drawing 图面系统文件类ES Engineering Standard 工程标准IWS International Workman Standard 工艺标准ISO International Standardization Organization 国际标准化组织GS General Specification 一般规格部类PMC Production & Material Control 生产和物料控制PCC Product control center 生产管制中心PPC Production Plan Control 生产计划控制MC Material Control 物料控制DCC Document Control Center 资料控制中心QE Quality Engineering 品质工程(部)QA Quality Assurance 品质保证处QC Quality Control 品质管制(课)PD Product Department 生产部LAB Laboratory 实验室IE Industrial Engineering 工业工程R&D Research & Design 设计开发部。
生产流程介绍(SMT,BL,FATP)
2Hale Waihona Puke 0 100120 140 170 185 196 204 220
210 65 40
0
1 2 3 4 5 6 7 8 9 10 11 12
数量
SMT Introduction
❖AOI (Automatic Optics Inspection )：自动光学检测 机
一.目的：检查PCBA经回 焊之后是否有缺陷。
较小 非管制料
较多 较快 卷尺状
较大 管制料 较少 较慢 盘状
接料工具,材 料
SMT Introduction
(Reflow)
❖回焊：通过熔融锡膏，将PCB与组件连接在一起。
1.Profile的设定 2.温度的量测(120—270度) 3.监控系统KIC 4/7
温度
回焊炉温度对应表
炉温温度
300
270 265
(ICT)
电路特性是否正常。
一.原理：使用许多探针对 PCB板施加小电流，测试各通 路是否导通。
测试项目: 1, Discharge 2, open 3, Short 4, IC open 5, Parts 6,clamp Diode 7, On Power
TS(维修)
•目的:将产线上发 现的外观 (如反 白,反向,立碑,偏 移,虚焊,空焊,漏 件,错件…….)不 良品,利用维修工 具热风枪,镊子, 万用表等,及时的 维修成良品,涉及 到电性方面的不 良转到FAE维修.
料件分类
机构件(外观件) 大发料(螺丝) 本体(HDD/ODD/LCD) 板类(主机板)
组装段介绍-产线型态
组装段
测试段
包装段
包装段
人员编制状况
日产量: 600---1000PCS/10.5H
企业生产经营相关英文及缩写
企业生产经营相关英文及缩写之(1)--供应链/物料控制Supply Chain 供应链/ Material Control 物料控制APS Advanced Planning Scheduling 先进规划与排期ATO Assembly To Order 装配式生产COM Customer Order Management 客户订单管理CRP Capacity Requirement Planning 产量需求计划EMS Equipment Management System / Electronic Management System 设备管理系统/ 电子管理系统ERP Enterprise Resource Planning 企业资源规划I/T Inventory Turn 存货周转率JIT Just In Time 刚好及时- 实施零库存管理MBP Master Build Plan 大日程计划-主要的生产排期MES Management Execution System 管理执行系统MFL Material Follow-up List 物料跟进清单MMS Material Management System 物料管理系统MPS Master Production Scheduling 大日程计划-主要的生产排期MRP Material Requirement Planning 物料需求计划MS Master Scheduling 大日程计划-主要的生产排期MTO Make To Order 订单式生产MTS Make To Stock 计划式生产OHI On Hand Inventory 在手库存量PSS Production Scheduling System 生产排期系统SML Shortage Material List 缺料物料单VMI Vendor Managed Inventory 供应商管理的库存货UML Urgent Material List 急需物料单企业生产经营相关英文及缩写之(2)--生产/货仓Production 生产/ Store 货仓CS Customer Sample 客户样品EOL End-of-Life 停止生产的产品EPP Engineering Pre-production 量产前的工程样品试做ES Engineering Sample 工程样品FIFO First-In-First-Out 先进先出的物料管理方法FG Finished Goods 制成品FGS Finished Goods Store 存放成品的货仓GS Golden Sample 金样板(检测使用的参考样板)LIFO Last-In-First-Out 后进先出的物料管理方法MAT'L Material 物料MP Mass Production 量产MR Material Requisition 物料申请MTC Material Transfer Chit 物料调拔单或物料移交单MTF Material Transfer Form 物料调拔单或物料移交单PP Pre-production 量产前的试做(试产)PROD Production 生产PS Production Sample 量产时做的样品RWK Rework 不良品返工SFC Shop Floor Control 制造过程现场车间管理WIP Work In Progress 正在生产当中的半成品或物料WS Working Sample 可操作的样品KPI Key Performance Indicator 关键绩效评估指计企业生产经营相关英文及缩写之(3)--工程/工序(制程)Engineering 工程/ Process 工序(制程)4M&1E Man, Machine, Method, Material, Environment 人,机器,方法,物料,环境- 可能导致或造成问题的根本原因AI Automatic Insertion 自动插机ASSY Assembly 制品装配ATE Automatic Test Equipment 自动测试设备BL Baseline 参照点BM Benchmark 参照点BOM Bill of Material 生产产品所用的物料清单C&ED/CAED Cause and Effect Diagram 原因和效果图CA Corrective Action 解决问题所采取的措施CAD Computer-aided Design 电脑辅助设计.用于制图和设计3维物体的软件CCB Change Control Board 对文件的要求进行评审,批准,和更改的小组CI Continuous Improvement 依照短期和长期改善的重要性来做持续改善COB Chip on Board 邦定-线焊芯片到PCB板的装配方法.CT Cycle Time 完成任务所须的时间DFM Design for Manufacturability 产品的设计对装配的适合性DFMEA Design Failure Mode and Effect Analysis 设计失效模式与后果分析--在设计阶段预测问题的发生的可能性并且对之采取措施DFSS Design for Six Sigma 六西格玛(6-Sigma)设计-- 设计阶段预测问题的发生的可能性并且对之采取措施并提高设计对装配的适合性DFT Design for Test 产品的设计对测试的适合性DOE Design of Experiment 实验设计-- 用于证明某种情况是真实的DPPM Defective Part Per Million 根据一百万件所生产的产品来计算不良品的标准DV Design Verification / Design Validation 设计确认ECN Engineering Change Notice 客户要求的工程更改或内部所发出的工程更改文件ECO Engineering Change Order 客户要求的工程更改ESD Electrostatic Discharge 静电发放-由两种不导电的物品一起摩擦而产生的静电可以破坏ICs和电子设备FI Final Inspection 在生产线上或操作中由生产操作员对产品作最后检查F/T Functional Test 测试产品的功能是否与所设计的一样FA First Article / Failure Analysis 首件产品或首件样板/ 产品不良分析FCT Functional Test 功能测试-检查产品的功能是否与所设计的一样FFF Fit Form Function 符合产品的装配,形状和外观及功能要求FFT Final Functional Test 包装之前,在生产线上最后的功能测试FMEA Failure Mode and Effect Analysis 失效模式与后果分析-- 预测问题的发生可能性并且对之采取措施FPY First Pass Yield 首次检查合格率FTY First Test Yield 首次测试合格率FW Firmware 韧体(软件硬化)-控制产品功能的软件HL Handload在波峰焊接之前,将PTH元件用手贴装到PCB上,和手插机相同I/O Input / Output 输入/ 输出iBOM Indented Bill of Material 内部发出的BOM(依照客户的BOM)ICT In-circuit Test 线路测试-- 用电气和电子测试来检查PCBA短路,开路,少件,多件和错件等等不良IFF Information Feedback Form 情报联络书-反馈信息所使用的一种表格IR Infra-red 红外线KPIV Key Process Input Variable 主要制程输入可变因素-在加工过程中,所有输入的参数/元素,将影响制成品的质量的可变因素KPOV Key Process Output Variable 主要制程输出可变因素-在加工过程中,所有输出的结果,所呈现的产品品质特征。
电子厂英文释义
ISO 国际标准化组织（ISO,International Organization for Stan-dardization缩写）。
OEM是英文Original Equipment Manufacturer的缩写，意思是原设备制造商R&D (research&design) 研发ODM，即Original design manufacture(原始设计商)的缩写。
IQC incoming quality controlRD research development centerIPQC in process quality controlRD HQ research development center head quarterFQC final quality controlQA quality assuranceBOM bill of materialPVT product verification testOQC outgoing quality controlPRP phase review processQE quality engineeringPM project managementDCC document center controlPJE project engineerECN engineering change noticePE product engineerECR engineering change requestNPI new product introductionMRB material review bomMP mass productionCAR corrective action requestMFG manufacturingFPC flexible printed circuit boardME mechanical engineerNCR non conforming reportKBD keyboardOBE out of box evaluationIFR instant failure rateIQA internal quality auditIFIR instant failure incident ratePCR process change requestHW hardwareIPO internal purchase officeN/A No ActionIE industrial engineeringESD electrostatic dischargeQPA quality process auditEOL end of lifeQSA quality system auditEN engineering noticeATE automatic test equipmentEMI electromagnetic interferenceAOI automatic optical inspectionEMC electromagnetic compatibilityPCBA print circuit board assemblyEE electronic engineer(ing)TTL technology transfer listEDC electronic data centerSQA supplier quality assuranceECO engineering change orderORT ongoing reliability testingDVT design verification testQM quality manualDOA dead on arrivalSW softwareCAD/ID computer aided design /industrial design SOW standard of workBIOS basic input /output systemSCSI small computer system interfaceAP application programSA software applicationAFR annual failure rateSO sales orderNTF no trouble foundMRP material requirement planningCND can not duplicateAVL approved vendor listDPPM defect parts per millionFAI first article inspectionFMEA failure mode effect analysisCLCA closed loop corrective actionLRR line reject rate measured by DPPMMQR monthly quality reviewMTQ manufacturing ,test and qualityRCA root cause analysisPFMEA process failure mode effect analysis SFIS Shop Floor Information SystemQEM Quality engineering measurementBGA Ball Grid ArrayIC Integrated CircuitQFP Quad Flat PackEOS Elwctrical Over StressTNB terminal notebook businessSMT Surface Mount Technology品质人员名称类QC quality control 品质管理人员FQC final quality control 终点品质管制人员IPQC in process quality control 制程中的品质管制人员OQC output quality control 最终出货品质管制人员IQC incoming quality control 进料品质管制人员TQC total quality control 全面质量管理POC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员QE quality engineering 品质工程人员品质保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认CP capability index 能力指数CPK capability process index 模具制程能力参数SSQA standardized supplier quality audit 合格供应商品质评估FMEA failure model effectiveness analysis 失效模式分析FQC运作类AQL Acceptable Quality Level 运作类允收品质水准S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的Q/R/S Quality/Reliability/Service 品质/可靠度/服务P/N Part Number 料号L/N Lot Number 批号AOD Accept On Deviation 特采UAI Use As It 特采FPIR First Piece Inspection Report 首件检查报告PPM Percent Per Million 百万分之一制程统计品管专类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计品质管制GRR Gauge Reproductiveness & Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸DIA Diameter 直径N Number 样品数其它品质术语类QIT Quality Improvement Team 品质改善小组ZD Zero Defect 零缺点QI Quality Improvement 品质改善QP Quality Policy 目标方针TQM Total Quality Management 全面品质管理RMA Return Material Audit 退料认可7QCTools 7 Quality Control Tools 品管七大手法通用之件类ECN Engineering Change Notice 工程变更通知(供应商) ECO Engineering Change Order 工程改动要求(客户) PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Standard Inspection Procedure 制程检验标准程序SOP Standard Operation Procedure 制造作业规范IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification 包装规范SPEC Specification 规格DWG Drawing 图面系统文件类ES Engineering Standard 工程标准CGOO China General PCE龙华厂文件IWS International Workman Standard 工艺标准ISO International Standard Organization 国际标准化组织GS General Specification 一般规格部类PMC Production & Material Control 生产和物料控制PCC Product control center 生产管制中心PPC Production Plan Control 生产计划控制MC Material Control 物料控制DC Document Center 资料中心QE Quality Engineering 品质工程(部)QA Quality Assurance 品质保证(处)QC Quality Control 品质管制(课)PD Product Department 生产部LAB Laboratory 实验室IE Industrial Engineering 工业工程R&D Research & Design 设计开发部生产类PCs Pieces 个(根,块等)PRS Pairs 双(对等)CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单MO Manufacture Order 生产单D/C Date Code 生产日期码ID/C Identification Code (供应商)识别码SWR Special Work Request 特殊工作需求L/N Lot Number 批号P/N Part Number 料号OEM Original Equipment Manufacture 原设备制造PC Personal Computer 个人电脑CPU Central Processing Unit 中央处理器A.S.A.P As Soon As Possible 尽可能快的E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用QTY Quantity 数量I/O input/output 输入/输出NG Not Good 不行,不合格C=0 Critical=0 极严重不允许APP Approve 核准,认可,承认CHK Check 确认ASS'Y Assembly 装配,组装T/P True Position 真位度5WIH When, Where, Who, What, Why, How to6M Man, Machine, Material, Method, Measurement, Message4MTH Man, Material, Money, Method, Time, How 人力,物力,财务,技术,时间(资源)SQA Strategy Quality Assurance 策略品质保证DQA Design Quality Assurance 设计品质保证MQA Manufacture Quality Assurance 制造品质保证SSQA Sales and service Quality Assurance 销售及服务品质保证LRR Lot Reject Rate 批退率SPS Switching power supply 电源箱DT Desk Top 卧式(机箱)MT Mini-Tower 立式(机箱)DVD Digital Video DiskVCD Video Compact DiskLCD Liquid Crystal DisplayCAD Computer Aided DesignCAM Computer Aided ManufacturingCAE Computer Aided EngineeringPCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告NG Not Good 不良WDR Weekly Delivery Requirement 周出货要求PPM Percent Per Million 百万分之一TPM Total Production Maintenance 全面生产保养MRP Material Requirement Planning 物料需计划OS Operation System 作业系统TBA To Be Assured 待定,定缺。
质量体系中英文缩写与含义
质量管理体系中英文缩写与其解释Abbreviations and their explanations 缩写与其解释Engineering 工程/ Process 工序（制程）4M&1E Man, Machine, Method, Material, Environment 人，机器，方法，物料，环境- 可能导致或造成问题的根本原因AI Automatic Insertion 自动插机ASSY Assembly 制品装配ATE Automatic Test Equipment 自动测试设备BL Baseline 参照点BM Benchmark 参照点BOM Bill of Material 生产产品所用的物料清单C&ED/CAED Cause and Effect Diagram 原因和效果图CA Corrective Action 解决问题所采取的措施CAD Computer-aided Design 电脑辅助设计.用于制图和设计3维物体的软件CCB Change Control Board 对文件的要求进行评审，批准，和更改的小组CI Continuous Improvement 依照短期和长期改善的重要性来做持续改善COB Chip on Board 邦定-线焊芯片到PCB板的装配方法.CT Cycle Time 完成任务所须的时间DFM Design for Manufacturability 产品的设计对装配的适合性DFMEA Design Failure Mode and Effect Analysis 设计失效模式与后果分析--在设计阶段预测问题的发生的可能性并且对之采取措施DFSS Design for Six Sigma 六西格玛(6-Sigma)设计-- 设计阶段预测问题的发生的可能性并且对之采取措施并提高设计对装配的适合性DFT Design for Test 产品的设计对测试的适合性DOE Design of Experiment 实验设计-- 用于证明某种情况是真实的DPPM Defective Part Per Million 根据一百万件所生产的产品来计算不良品的标准DV Design Verification / Design Validation 设计确认ECN Engineering Change Notice 客户要求的工程更改或内部所发出的工程更改文件ECO Engineering Change Order 客户要求的工程更改ESD Electrostatic Discharge 静电发放-由两种不导电的物品一起摩擦而产生的静电可以破坏ICs和电子设备FI Final Inspection 在生产线上或操作中由生产操作员对产品作最后检查F/T Functional Test 测试产品的功能是否与所设计的一样FA First Article / Failure Analysis 首件产品或首件样板/ 产品不良分析FCT Functional Test 功能测试-检查产品的功能是否与所设计的一样FFF Fit Form Function 符合产品的装配，形状和外观及功能要求FFT Final Functional Test 包装之前，在生产线上最后的功能测试FMEA Failure Mode and Effect Analysis 失效模式与后果分析-- 预测问题的发生可能性并且对之采取措施FPY First Pass Yield 首次检查合格率FTY First Test Yield 首次测试合格率FW Firmware 韧体（软件硬化）-控制产品功能的软件HL Handload 在波峰焊接之前，将PTH元件用手贴装到PCB上，和手插机相同I/O Input / Output 输入/ 输出iBOM Indented Bill of Material 内部发出的BOM（依照客户的BOM）ICT In-circuit Test 线路测试-- 用电气和电子测试来检查PCBA短路，开路，少件，多件和错件等等不良IFF Information Feedback Form 情报联络书-反馈信息所使用的一种表格IR Infra-red 红外线KPIV Key Process Input Variable 主要制程输入可变因素-在加工过程中，所有输入的参数/元素，将影响制成品的质量的可变因素KPOV Key Process Output Variable 主要制程输出可变因素-在加工过程中，所有输出的结果，所呈现的产品品质特征。
企业常用英文简写
企业常⽤英⽂简写Abbreviations and their explanations 缩写与其解释Engineering ⼯程 / Process ⼯序（制程）4M&1E Man, Machine, Method, Material, Environment⼈，机器，⽅法，物料，环境- 可能导致或造成问题的根本原因AI Automatic Insertion⾃动插机ASSY Assembly制品装配ATE Automatic Test Equipment⾃动测试设备BL Baseline参照点BM Benchmark参照点BOM Bill of Material⽣产产品所⽤的物料清单C&ED/CAED Cause and Effect Diagram原因和效果图CA Corrective Action解决问题所采取的措施CAD Computer-aided Design电脑辅助设计.⽤于制图和设计3维物体的软件CCB Change Control Board对⽂件的要求进⾏评审，批准，和更改的⼩组CI Continuous Improvement依照短期和长期改善的重要性来做持续改善COB Chip on Board邦定-线焊芯⽚到PCB板的装配⽅法.CT Cycle Time完成任务所须的时间DFM Design for Manufacturability产品的设计对装配的适合性DFMEA Design Failure Mode and Effect Analysis设计失效模式与后果分析--在设计阶段预测问题的发⽣的可能性并且对之采取措施DFSS Design for Six Sigma六西格玛(6-Sigma)设计 -- 设计阶段预测问题的发⽣的可能性并且对之采取措施并提⾼设计对装配的适合性DFT Design for Test产品的设计对测试的适合性DOE Design of Experiment实验设计-- ⽤于证明某种情况是真实的DPPM Defective Part Per Million根据⼀百万件所⽣产的产品来计算不良品的标准DV Design Verification / Design Validation设计确认ECN Engineering Change Notice客户要求的⼯程更改或内部所发出的⼯程更改⽂件ECO Engineering Change Order客户要求的⼯程更改ESD Electrostatic Discharge静电发放-由两种不导电的物品⼀起摩擦⽽产⽣的静电可以破坏ICs和电⼦设备FI Final Inspection 在⽣产线上或操作中由⽣产操作员对产品作最后检查F/T Functional Test测试产品的功能是否与所设计的⼀样FA First Article / Failure Analysis⾸件产品或⾸件样板/ 产品不良分析FCT Functional Test功能测试-检查产品的功能是否与所设计的⼀样FFF Fit Form Function符合产品的装配，形状和外观及功能要求FFT Final Functional Test包装之前，在⽣产线上最后的功能测试FMEA Failure Mode and Effect Analysis失效模式与后果分析-- 预测问题的发⽣可能性并且对之采取措施FPY First Pass Yield⾸次检查合格率FTY First Test Yield⾸次测试合格率FW Firmware韧体（软件硬化）-控制产品功能的软件HL Handload在波峰焊接之前，将PTH元件⽤⼿贴装到PCB上，和⼿插机相同I/O Input / Output输⼊ / 输出iBOM Indented Bill of Material内部发出的BOM（依照客户的BOM）ICT In-circuit Test线路测试-- ⽤电⽓和电⼦测试来检查PCBA短路，开路，少件，多件和错件等等不良IFF Information Feedback Form情报联络书-反馈信息所使⽤的⼀种表格IR Infra-red红外线KPIV Key Process Input Variable主要制程输⼊可变因素-在加⼯过程中，所有输⼊的参数/元素，将影响制成品的质量的可变因素KPOV Key Process Output Variable主要制程输出可变因素-在加⼯过程中，所有输出的结果，所呈现的产品品质特征。
设备管理中常用的英文简写
设备管理中常用的英文简写代表的意思Abbreviations and their explanations 缩写与其解释Engineering 工程/ Process 工序（制程）4M＆1EMan, Machine，Method，Material, Environment人，机器，方法，物料，环境- 可能导致或造成问题的根本原因AIAutomatic Insertion自动插机ASSYAssembly制品装配ATEAutomatic Test Equipment自动测试设备BLBaseline参照点BMBenchmark参照点BOMBill of Material生产产品所用的物料清单C&ED/CAEDCause and Effect Diagram原因和效果图CACorrective Action解决问题所采取的措施CADComputer—aided Design电脑辅助设计。
用于制图和设计3维物体的软件CCBChange Control Board对文件的要求进行评审，批准,和更改的小组CIContinuous Improvement依照短期和长期改善的重要性来做持续改善COBChip on Board邦定-线焊芯片到PCB板的装配方法。
CTCycle Time完成任务所须的时间DFMDesign for Manufacturability产品的设计对装配的适合性DFMEADesign Failure Mode and Effect Analysis设计失效模式与后果分析—-在设计阶段预测问题的发生的可能性并且对之采取措施DFSSDesign for Six Sigma六西格玛（6-Sigma）设计—- 设计阶段预测问题的发生的可能性并且对之采取措施并提高设计对装配的适合性DFTDesign for Test产品的设计对测试的适合性DOEDesign of Experiment实验设计-- 用于证明某种情况是真实的DPPMDefective Part Per Million根据一百万件所生产的产品来计算不良品的标准DVDesign Verification / Design Validation设计确认ECNEngineering Change Notice客户要求的工程更改或内部所发出的工程更改文件ECOEngineering Change Order客户要求的工程更改ESDElectrostatic Discharge静电发放—由两种不导电的物品一起摩擦而产生的静电可以破坏ICs和电子设备FIFinal Inspection在生产线上或操作中由生产操作员对产品作最后检查F/TFunctional Test测试产品的功能是否与所设计的一样FAFirst Article / Failure Analysis首件产品或首件样板/ 产品不良分析FCTFunctional Test功能测试-检查产品的功能是否与所设计的一样FFFFit Form Function符合产品的装配,形状和外观及功能要求FFTFinal Functional Test包装之前，在生产线上最后的功能测试FMEAFailure Mode and Effect Analysis失效模式与后果分析—- 预测问题的发生可能性并且对之采取措施FPYFirst Pass Yield首次检查合格率FTYFirst Test Yield首次测试合格率FWFirmware韧体（软件硬化）—控制产品功能的软件HLHandload在波峰焊接之前，将PTH元件用手贴装到PCB上,和手插机相同I/OInput / Output输入/ 输出iBOMIndented Bill of Material内部发出的BOM（依照客户的BOM）ICTIn—circuit Test线路测试—- 用电气和电子测试来检查PCBA短路，开路，少件,多件和错件等等不良IFFInformation Feedback Form情报联络书—反馈信息所使用的一种表格IRInfra—red红外线KPIVKey Process Input Variable主要制程输入可变因素—在加工过程中，所有输入的参数/元素，将影响制成品的质量的可变因素KPOVKey Process Output Variable主要制程输出可变因素-在加工过程中，所有输出的结果，所呈现的产品品质特征。