PCB专业用语综合词汇
PCB专业术语大汇集
PCBJargon(PCB专业术语) AAbsorption 吸收、吸入Accelerated Test（Aging）加速实验、加速老化Accelerator 加速剂、速化剂Accept/Acceptance 允收Acceptable Quality Level（AQL）允收品质水准Accuracy 准确度ACF：Adhesive copper foil 有胶铜箔Activator 活化剂、添加剂比称为ActivatorActive parts（Devices）主动零件，指积体电路或电晶体Addition Agent 添加剂Additive Process 加成法、分全加成、半加成及部份加成Adhesion 附著力Adhesive 胶类或接著剂Aging 老化Air Knife 风刀Ambient Temperature 环境温度Ampere 安培Amp-Hour 安培小时Annular Ring 孔环Anode 阳极Anode Bag 阳极带ANSI: American National Standard Institute 美国规范协会Anti-Forming Agent 消泡剂AOI: Automatic Optical Inspection 自动光学检验Aperture 开口APQP: Advanced Product Quality PlanArray 排列、阵列Artwork 底片ASIC: Application Specific Integrated Circuit 特定用途的积体电路器Aspect Ratio 纵横比、板厚与孔径之比值Assembly 装配、组装ATE: Automatic Testing Equipment 自动电测设备AVL: Approved Vender List 合格供应商BBack Light（Back Lighting）背光法Back-UP 垫板Backpanels/Backplanes 背板、支持板，厚度较厚，Ball Grid Array（BGA）球脚车列（封装）Barrel 孔壁Base Material 基材Batch 批（同时间发料某一数量的板子）Bevelling 切斜边Binder 黏结剂Black oxide 黑氧化层，另有棕氧化（Brown Oxide）Blind Via Hole 盲导孔Blister 局部性分层或起泡Blockout 封网，网板之空网处以水溶胶涂满Blow Hole 吹孔，PTH孔壁有破洞（void）所造成Boiler (Water Tube Boiler/ Fire Tube Boiler)BOM: Bill of Material 用料表Bond Strength 结合强度Bonding Sheet(Layer) 接合片、接著层，指PPBonding Wire 结合线，IC之晶片与PCB之引线Bow 板弯Break-away Panel 可断开板或者说Break Away TabBreak Point 出像点、影像点Break-Out 破出（钻孔破出开成断环情形）Bridging 搭桥、桥接Brightener 光泽剂Brush Plating 刷镀BTU/British Thermal Unit 英制热量单位Bump 突块Buried Via Hole 埋导孔Burn-in 高温加速老化实验Burning 烧焦Burr 毛头Buy-off 认可CCAD: Computer Aided Design 电脑辅助设计CAM: Computer Aided Manufacturing 电脑辅助制造CAT: Computer Aided Testing 电脑辅助测试Capacitance 电容Carbide 碳化物、碳化钨钻头CAR: Corrective Action Report 改善报告Carbon Treatment 活性碳处理Card 卡板Carrier 载体Cartridge 滤芯Cathode 阴极CCL: Copper Clad Laminates 铜箔基板Ceramics 陶瓷Certificate 证明书CFC 氟氯碳化物 Chloro-Fluoro-CarbonChamfer 倒角、去掉直角Characteristic Impedance 特性阻抗Cheek list 检察清单Chip 晶粒、晶片Chip On Board 晶片黏著板Clean Room 无尘室 (Class 100)Cleanliness 清洁度Clearance 余隙、余环COB（Chip on Board）晶片在板上直接组装COC（Certificate of Compliance）出货合格书COF（Chip on Flexible PCB）COG（Chip glass）Coefficient of Thermal Expansion 热膨胀系数（CTE）Cold Solder Joint 冷焊点Component Hole 零件孔Component Side 组件面、零件面Conditioning 整孔Conductivity 导电度Connector 连接器Continuity Test 连通性实验Copper Foil 铜箔、铜皮Copper Ball 铜球Corner Crack 镀通孔转角断角Cp: Capability of Process 制程能力指数Crack 裂痕Crazing 白斑（基板外观上的缺点）Crosstalk 杂讯、串讯Cure/Curing 硬化、热化Current Density （C.D.）电流密度（1 ASD=9.1 ASF）Curtain Coating 液涂法Datum 基准点Deburring 去毛头Defect 不良缺点Degreasing 脱脂Delamination 分层、爆板Dent 凹陷、缓和均匀的下陷Desmearing 除胶渣Developer 显像液Deviation 偏差Device 电子元件Dewetting 缩锡DFM: Design for Manufacturing/Dirty foreign Materials 异物、杂质Die 冲模Dielectric 介质Dielectric Constant 介质常数Dimensional Stability 尺度安定性DIP（Dual Inline Package）双排脚封装体Direct Plating 直接电镀DI Water 纯水 (De-Ionize Water)DOE/Design of Experiment 实验计划法DPPM（Defect Parts Per Million）Drilling 钻孔Drill Bit 钻针Dry Film 干膜Dummy 假镀EECN: Engineering Change Notice 工程变更通知Elongation 延伸性EMI 电磁干扰 Electromagnetic InterferenceENIG: Electroless Nickel Immersion Gold 化镍浸金Entek 有机护铜处理Entry Material 盖板E.T/Electric Test 电测、电气测试Epoxy Resin 环氧树脂ESD: Electro-Static Discharge 静电流量Etching 蚀刻Etchback 加蚀Etch Factor 蚀刻函数Etching Resist 抗蚀阻剂Expose Copper 漏铜Exposure 曝光Eyelet 铆钉 RivetFAAR（First Article Approval Report）Failure 故障、损坏Fault 缺陷、瑕疵FCC/Federal Communication Commission 美国联邦通讯委员会Fiber Exposure 玻织显露Fiducial Mark 基准记号、光学点Film 底片Filter 过滤器Fine Line 细线Finger 手指Finishing 制成品在外观上的最后处理First Article 试产的首件或首批小量产品First Pass-Yield 初检良品率Fixture 夹具、治具 (Rig and Fixture)Flame Resistant 耐燃性（分HB、VO、V1及V2等四级）Flux 助焊剂Foil Burr 铜箔毛边Foot Pint（Land Pattern）脚垫Foreign Material 外来物、异物FR4/Flame Resistant Laminates 耐燃性积层板材Frequency 频率GGauge 量规Gel Time 胶化时间Gerber Data/Gerber File 格搏档案Glass Fiber 玻璃纤维Glass Fiber Protrusion 玻纤突出Glass Transition Temperature/Tg 玻璃态转化温度Golden Board 测试用规范板Grid 规范格Ground Plane 接地层Guide Pin 导针HHaloing 白圈、白边（在钻孔、开槽等机械动作一旦过猛时将造成内部树脂之破碎或微小分层裂开的现象）Hardener 硬化剂Hardness 硬度Heat Dissipation 散热Hertz（Hz）赫芝HEPA/High Efficiency Particulate Air Filter 高效空气尘粒过滤机Hipot Test 高压电测 High Potential TestHit 擎Holding Time 停区时间Hole Block 孔塞Hole Breakout 孔位破出，简称BreakoutHole counter 数孔机Hole Density 孔数密度Hole Pull Strength 孔壁强度Hole Void 破洞Hot Air Levelling 喷锡 HASL/HALTHE(High Temperature Elongation) 高温延伸性II.C.Socket 积体电路插座Image Transfer 影像转移IMC: Inter-metallic compound 介面合金共化物Immersion Plating 浸镀Impedance 阻抗In-Circuit Testing 组装板电测，ICTIndexing Hole 基准孔Infrared(IR) 红外线Ink 油墨Inner Layer 内层Input/Output 输入、输出Insert/Insertion 插接、插装Insulation Resistance 绝缘电阻Integrated Circuit (IC) 积体电路器Interconnection互连Intermatallic Compound(IMC) 介面合金共化物Internal Stress 内应力Ion Cleanliness 离子清洁度Ionic Contamination 离子污染IPC: The Institute for Interconnecting and Packaging Electronic Circuits 美国印刷电路板协会ISO: International Organization for Standardization 国际规范组织Isolation 隔离性JJPCA/Japan Print Circuit Association 日本印刷电路工业会Just-In-Time(JIT) 适时供应KKeyboard 键盘Kraft Paper 牛皮纸LLaminate(s) 基板、积层板Laminator 压膜机Land 孔环焊垫、独立点Landless Hole 无环通孔Laser Direct Imaging/LDI 雷射直接成像Laser Photoplotter 雷射曝光机、绘图机Lay Out 布线、布局 (configuration, general arrangement) Lay Up 叠合Lead Frame 脚架Lead 引脚、接脚Legend 文字标记Levelling 整平Light Intensity 光强度LMW: License Manufacturing Warehouse 保税厂Lot Size 批量LRR(Lot Reject Rate)MMajor Defect 严重缺点、主要缺点Marking 标记Mask 阻剂Mass Lamination 大型压板MCM/Multi-Chip Module 多晶片模组Measling 白点Membrane Switch 薄膜开关Microctching 微蚀Microsectioning 微切片法Migration迁移Mil 英丝0.001 inmisregistration 对不准、对不准度MLB/Multi-Layer Board 多层板Modem 调变及解调器、数据机Modification 修改、改变Module 模组Mother Board 主机板NNail Head 钉头N.C.数值控制（Numerical Control）Negative 负片Negative etch-back 反回蚀Nick 缺口Node 节点Nodule 瘤Non-Conformance 不合格品Non-flammable 非燃性Non-wetting 不沾锡Normal Distribution 常态分配NPI：New project introduction)NRE Charge-Non-Recurring Engineering Charge 不会重收的工程费用OOhm 欧姆Omega Meter 离子污染检测仪Open Circuits 断线Optical Density 光密度Optical Inspection 光学检验Organic Solderability Preservatives(OSP) 有机保焊剂Outgassing 出气、吹气Output 产出、输出Overflow 溢流Oxidation氧化Ozone Depletion 臭氧层耗损PPackaging 封装、购装Packing 包装Pad 配圈、孔环焊垫Panel Plating 全板镀铜Passive Parts 被动零件，如电阻、电容Past 膏（锡膏Solder Paste）Pattern Plating 线路电镀PCB/Printed Circuit Board 印刷电路板Peel Strength 抗撕强度Peripheral 周边附属设备Phototool 底片（一般指偶氮棕片 Diazo Film）Pin Grid Array(PGA) 矩阵式针脚封装Pinhole 针孔Pin 接脚、插梢、插针Pink Ring 粉红圈Pits 凹点（小面积下陷）Pitch 脚距、垫距、线距Plasma 电浆Plated through Hole/PTH 镀通孔Plug 插脚、塞孔Polarization 分极、极化Polyimide(PI) 聚亚酸胺Popcorn Effect 爆M花效应Post Cure 疏孔度实验Power Plane 后续硬化、后烤Power Supply 电源层PPM/Parts Per Million 百万分之几Preheat 预热Prepreg 胶片、树脂片Press Plate 压合钢板Press-Fit Contact 挤入式接触Printing 印刷Probe 探针Profile 轮廓、部面图、升温曲线图积线Punch 横切、冲床QQIT(Quality improvement Team) 品质改善小组Qualified Products List 合格产品（供应者）名单RRadiometer 辐射计、光度计Radius 尺角、半径Reference Dimension 参考尺度、参考尺寸Reflow Soldering 重熔焊接、熔焊Registration 对准度Reject 剔退、拒收Reliability 可靠度、信赖度Repair 修理Resin Content 胶含量、树脂含量Resin Flow 胶流量、树脂流量Resist 阻剂、阻膜Resistor 电阻器、电阻Resolution 解像、解像度、解读度Resolving Power 解读力、解像力（分辨力）Rework(ing) 重工、再加工Ring 套环Roller Cutter 混切机（俗称锯板机）Roller Coating 滚动涂布法Routing 切外型、捞外型RRM: Revolutions per Minute 转速（每分钟）Run-out 偏转、绕转、累积距差SSCAR(Supplier CA Request) 供应商改善报告SCM: Supply chain Management 供应商经管系统Scratch 刮痕Screen Printing 网版印刷Scrubber 磨刷机、磨刷器Selective Plating 选择性电镀SEM/Scanning Electron Microscope 扫瞄式电子显微镜Semi-Conductor 半导体Shearing 剪、裁切Short 短路SIR(Surface Insulation Resistance) 表面绝缘电阻Side Wall 侧壁Sigma(Standard Deviation) 规范差Signal 讯号Silicon 矽Silk Screen 网版印刷、丝网印刷Skin Effect 集肤效应Skip Printing 漏印Slot 槽孔Smear 胶渣SMT/Surface Mount Technology 表面黏装技术Solder 焊锡Solderability 焊锡性Solder Ball 锡球Solder Bridging 锡桥Solder Bump 焊锡凸块Solder Dam 锡堤（IC脚间的防焊）Solder Levelling 喷锡、热风整平Solder Mask(S/M) 绿漆、防焊膜Solder Paste 锡膏Solder Plug 锡塞、锡柱Solder Pot 锡炉Solder Side 焊锡面Soldering Fluid/Soldering Oil 助焊液、护焊汕Solid Content 固体含量SOP(Standard Operation Procedure) 规范作业程序Spacing 间距SPC/Statistical Process Control 统计制程管制Specific Gravity SG比重Specification(Spec) 规范、规格Specimen 样品、试样Spindle 钻轴Spray Coating 喷著涂装Stencil 版膜、网版Storage condition 储存条件Stress Relief 消除应力Substrate 底材Surface Insulation Resistance(SIR) 表面绝缘电阻Surface Tenting 表面张力Surface-Mount Device 表面黏装零件Swelling Agents/Sweller 膨胀剂SWR(Special Working Request) 试产前之“特殊工作要求”TTab 接点、金手指Tape 撕胶带实验Teflon 铁氟龙Temperature Profile 温度曲线Template 模板Tensile Strength 抗拉强度Tenting 盖孔法Terminal 端子Thermal Stress 热应力Thermal Shock 热冲击Thin Copper Foil 薄铜箔Then film Technology 薄膜技术Throwing Power 分布力Tolerance 公差Touch Up 检修（简单的工具在手操作下即可进行的小规范的检修，称之Touch Up或Rewok 有些类似）Trace 线路、导线Traceability 追溯性、可溯性Transistor 电晶体Transmission Line 传输线Twist 板翘、板扭UUL 保险业实验 Underwriters Laboratories/INCUltra Violet Curing(UV Curing) 紫外线硬化Ultrasonic Cleaning 超音波清洗Undercut/Undercutting 侧蚀Universal Tester 万用型电测机VVacuum Lamination 真空压合Vacuum Packing 真空包装Viscosity 黏滞度、黏度Vision Systems 视觉系统Visual Examination(Inspection) 目视检查Voltage 电压WWafer 晶圆Warp/Warpage 板弯Warp and Twist 板弯翘Washer 垫圈Waste Treatment 废弃处理Water Absorption 吸水性Water Break 水膜破散、水破Watermark 水印Wave Soldering 波焊Weave Exposure 织纹显露Weave Texture 织纹隐现Welding 熔接Wet Process 湿式制程Wetting Balance 沾锡、沾湿White Spot 白点Wicking effect 灯芯效应Wire Bonding 打线结合WIP(Working Piece in Process) 在制品XX Axis X轴X-Ray X光YY-Axis Y轴Yield 良品率、良率、产率ZZ-Axis X轴OtherHDI-High Density inter-connect 高密度内连接SWOT Strengths Weaknesses Opportunities ThreatsCD: Compact DiscCPU: Central Process UnitLaser, YAG Laser)DLD: Direct Laser Drilling (CO2DVD: Digital Versatile DiscEEPROM: Electrically Erasable Programmable Read Only Memory EMS: Electronics Manufacturing ServiceGPS: Global Positioning ServiceHDD: Hard Disk DriveHDTV: High Density TVLCD: Liquid Crystal DisplayLED: Light Emitting DiodeVCD: Video Compact DiskQuality System Requirements QS-9000(質量體系要求)Advanced Product Quality Planning and Control Plan APQP(產品質量先期策劃和控制計劃)Measurement Systems Analysis MSA(測量系統分析)Potential Failure Mode and Effects Analysis FMEA(潜在失效模式與後果分析) Production Part Approval Process PPAP (生產件批准程序)Statistical Process Control SPC (統計過程控制)IPC-A-600Classification 分级Acceptance Criteria 允收规格Applicable Documents 参考资料Dimensions And Tolerances 尺度与公差Terms And Definitions 术语及定义Workmanship 工艺水准Externally Observable Characteristics 外观特性Board Edges 板边Burrs 看头、毛刺Nonmetallic Burrs 非金属性毛头Metallic Burrs 金属毛头Nicks 缺口Haloing 白边Base Material 基材Weave Exposure 织纹显露Weave Texture 织纹隐现Exposed/Disrupted Fibers 玻织曝露/扰乱Pits and Voids 凹点与凹坑Base Material Subsurface 基材次表面Measling白点Crazing白斑Delamination/Blister分层/起泡Foreign Inclusions外来夹杂物Solder Coatings and Fused Tin Lead喷锡板或熔锡板Nonwetting拒锡（不沾锡）Dewetting缩锡Holes-Plated-Through-General镀通孔概要Nodules/Burrs镀瘤/毛头Pink Ring粉红圈Voids-Copper Plating镀铜层破洞Voids-Finished Coating完工皮膜之镀层破洞Lifted Lands-(Visual)孔环浮离（目检）Holes-Unsupported未镀孔Haloing白圈Printed Contacts板边接触金手指Surface Plating-General表面镀层通则Surface Plating-Wire Bond Pads打线承垫之表面Burrs on Edge-Board Contacts板边接点之毛头Adhesion of Overplate表面镀层之附着力Marking标记Etched Marking蚀刻标记Screened or Ink Stamped Marking纲印或盖印之标记Solder Resist(Solder Mask)防焊绿漆Coverage Over Conductors (Skip Coverage)边线表面之覆盖性（覆盖不全、跳印）Registration to Holes (All Finishes)对孔之套准度（各种表处理层）Registration to Other Conductive Patterns其他防焊的对准性Ball Grid Array (Solder Resist-Defined Lands)球脚格列体之焊垫（绿漆设限之焊垫）Ball Grid Array (Copper-Defined Lands)球脚格列体（铜面设限之焊垫）Ball Grid Array (Solder Dam)球脚格列体（防焊堤）Blisters/Delamination起泡/分层Adhesion(Flaking or Peeling)附著力（破片或剥落）Waves/Wrinkles/Ripples起浪/起皱/纹路Tenting(Via Holes)盖孔（导通孔、过孔）Pattern Definition-Dimensional圆形尺度特性Conductor Width and Spacing线宽与间距Conductor Width线宽Conductor Spacing导线间距External Annular Ring-Measurement孔环测量External Annular Ring-Supported Holes有孔壁支援的外孔环External Annular Ring-Unsupported Holes无孔壁支援的外孔环Flatness平坦度Internally Observable Characteristics可观察到的内在特性Dielectric Materials介质材料Laminate Voids(Outside Thermal Zone)压板空洞（或热区之外）Registration/Conductors to Holes导体与通孔之间的对准度Clearance Hole/Unsupported/to Power/Ground Planes针对电源层或接地层具隔环之非镀通孔Delamination/Blister分层/起泡Etchback回蚀Negative Etchback反回蚀Smear Removal除胶渣Dielectric Material/Clearance/Metal Plane for Supported Holes 金属层与通孔壁之介质隔距Layer-to-Layer Spacing层与层之间距Resin Recession树脂缩陷Conductive Patterns-General导线概论Etching Characteristics蚀刻特性Print and Etch印后即蚀刻（指正片法）Surface Conductor Thickness(Foil Plus Plating)表导体厚度（铜箔加电镀铜）Foil Thickness-Internal Layers内层箔厚Plated-Through Holes-General镀通孔概论Annular Ring-Internal Layers各内层之孔环Lifted Lands-(Cross-Sections)焊环浮起（切片上所见）Foil Crack-(Internal Foil)“C”Crack内层铜箔之裂纹Foil Crack-(External Foil)镀层破裂Plating Crack-(Barrel)“E”Crack孔壁镀层破裂Plating Crack-(Corner)“F”Crack孔角镀层破裂Plating Nodules镀层长瘤Copper Plating Thickness-Hole Wall孔壁镀铜厚度Plating Voids镀层破洞Solder Coating Thickness (Only When Specified)焊锡皮膜厚度（当已规定检查者）Solder Resist Thickness绿漆厚度Wicking灯芯效应（指玻织束渗入化学铜）Wicking/Clearance Holes隔离孔之渗铜Innerlayer Separation-Vertical (Axial) Microsection内层（环）分离-垂直（纵断面）微切片Innerlayer Separation-Horizontal (Transverse) Microsection内层（环）分离-水平（横断面）微切片Material Fill of Blind and Buried Vias盲孔与埋孔之填充材料钻孔式镀通孔Plated-Through Holes-Drilled钻孔式镀通孔Burrs毛头Nailheading钉头Plated-Through Holes-Punched冲孔式镀通孔Roughness and Nodules粗糙与镀瘤Flare喇叭口Miscellaneous其他离顶Flexible And Rigid-Flex Printed Wiring软性及软硬合板Metal Core Printed Boards金属平心电路板Type Classifications型式分类Spacing Laminated Type间距压合板Insulation Thickness/Insulated Metal Substrate已绝缘金属底材之绝缘厚度Insulation Material Fill/Laminated Type Metal Core压合型金属平心之绝缘填料Cracks in Insulation Material Fill/Laminated Type压合型绝缘填充料之裂纹Core Bond to Plated-Through Hole Wall平心层与镀通孔之间的固著Flush Printed Boards表面全平板Flushness of Surface Conductor表面导线之平坦性Cleanliness Testing清洁度实验Solderability Testing焊锡性实验Plated-Through Holes镀通孔Electrical Integrity电性之完整。
PCB专业用语中英文对照
!一、综合词汇.eda365.& m% D" Z4 O0 _6 l/ y1 }( C4 R41、印制电路：printed circuit2、印制线路：printed wiring PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计. p& Q6 n: g- S e2 C3、印制板：printed board4、印制板电路：printed circuit board (pcb).eda365.2 a* Z0 H8 t6 q5、印制线路板：printed wiring board(pwb)EDA365高速PCB论坛]. M5 I3 *, v8 O6、印制元件：printed ponent7 I f6 j! A6 C5 J7、印制接点：printed contact8、印制板装配：printed board assembly EDA365高速PCB论坛* [2 a& {0 J$ R9 M; l9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board.eda365.* "% G; n' g6 G0 k!14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计: i1 I; z5 }$ z* L18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：fle*ible multilayer printed board PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计$ Y* V$ y- f, S1 R: h* *% T20、挠性印制板：fle*ible printed board21、挠性单面印制板：fle*ible single-sided printed board.eda365. Z* ", y/ z8 e J/ a+ s* M22、挠性双面印制板：fle*ible double-sided printed board5 j' E, H% r4 G- M* G. R* z23、挠性印制电路：fle*ible printed circuit (fpc)24、挠性印制线路：fle*ible printed wiring EDA365高速PCB论坛2 n& L7 [5 T- S6 _7 U) j5 I+ r25、刚性印制板：fle*-rigid printed board, rigid-fle* printed * Q, r7 O* r/ P5 W+ *9 p9 ]9 k: Iboard EDA365高速PCB论坛0 f! ~1 Q: Q* k( H8 V26、刚性双面印制板：fle*-rigid double-sided printed board, PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计6 J3 Y B* T" d4 B( F*rigid-fle* double-sided printed PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计' f* i5 I8 m- P* A0 C27、刚性多层印制板：fle*-rigid multilayer printed board, PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计" t- }9 F* y' b* B/ f& d4 ~rigid-fle* multilayer printed board PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计9 {1 ~9 v2 u1 m28、齐平印制板：flush printed board PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计; `- O, $ E" h$ "* f29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计5 \9 \( S2 ~0 _+ D3 c* H8 l* w! c31、多重布线印制板：mulit-wiring printed board% M: q8 O% B6 Y/ H" F5 b!32、瓷印制板：ceramic substrate printed board PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计& Z! T2 p0 S0 g' y$ g: q+ ]33、导电胶印制板：electroconductive paste printed board PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计8 R( [: H6 F- V+ L34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board.eda365., h! ' g" F/ ]8 Q5 w7 i, Q4 j- \6 c36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up fle*ible printed board.eda365.+ q) b6 z; v1 ^6 n42、外表层合电路板：surface laminar circuit (slc)PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计; I" U% p! z6 l% `3 h/ p5 ^43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)EDA365高速PCB论坛o. T$ $ 1 K2 J8 E) {- U45、层间全导通多层印制板：alivh multilayer printed board PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计- N% `: q, R9 h! f5 l% _46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane EDA365高速PCB论坛+ K3 ^, s+ O8 J* P1 V( P$ [51、裸板：bare board PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计O5 _/ F% t$ V( ~5 i- d/ N3 D( i52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic fle* board PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计6 o) v. [' |8 T' a9 |54、静态挠性板：static fle* board55、可断拼板：break-away planel56、电缆：cable3 e+ t% [" n. T t7 o5 n7 N57、挠性扁平电缆：fle*ible flat cable (ffc)PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计* q M9 V F- F/ O$ W5 H* O4 [7 H% H58、薄膜开关：membrane switch59、混合电路：hybrid circuit.eda365.+ _% ]/ h$ [. [0 A' n60、厚膜：thick film PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计% A: ]: O6 C5 O2 N1 m3 o61、厚膜电路：thick film circuit4 v _! c8 |9 _9 O7 J: u, J" m62、薄膜：thin film EDA365高速PCB论坛) F/ ], P; w *' k63、薄膜混合电路：thin film hybrid circuit PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计- T* K& m& f- Y$ ") A264、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计8 O, i) u" *! |; J. S* A67、传输线：transmission line EDA365高速PCB论坛9 *4 I, h, a& "% d. h, F" [68、跨交：crossover PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计w! }: o& M% |6 }5 N69、板边插头：edge-board contact EDA365高速PCB论坛*$ _5 G; " W. A( C* P70、增强板：stiffener PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计& v/ E+ f* Z" H* *. C71、基底：substrate PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计- C* h; *- L' _6 r72、基板面：real estate PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计*/ }2 z! B3 R( `/ O73、导线面：conductor side PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计6 ~1 M \$ e) G- H74、元件面：ponent side75、焊接面：solder side76、印制：printing PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计c: q( f5 `- {; g' B)77、网格：grid PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计, z* F+ f: G5 H+ H6 U; _78、图形：pattern.eda365.7 l& r1 y' z8 h( b. *3 H* i% w79、导电图形：conductive pattern PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计) ** C, A. Z+ j c;80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计6 j7 }- E* Y- n5 R$ u5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate EDA365高速PCB论坛6 ~4 Y0 R6 p. `5 Z( q9 o* J: A7、复合层压板：posite laminate PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计: g1 ^; W7 e8 ]- n+ h' U! h8、薄层压板：thin laminate.eda365.8 y3 g$ [! Z; f* h9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计E7 q k5 \! Y-11、挠性覆铜箔绝缘薄膜：fle*ible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计; K; [% {) A7 u* U- W( K15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epo*y glass substrate PCB设计论坛，PCB layou设计，高速PCB设计，高速仿真设计8 Y$ u6 "- J7 M- Z/ |:17、加成法用层压板：laminate for additive process.eda365.$ u' W V' o/ ^2 g18、预制层覆箔板：mass lamination panel PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计. e% I* u3 E% w19、层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计* D+ o2 ^* D( \" M1 L! n/ W21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计7 h! V4 ^7 C6 g$24、粘结膜：film adhesive PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计) "& Q9 W( v+ O/ S8 R7 T3 w0 W25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film EDA365高速PCB论坛0 D- P2 I: E5 M2 i* n27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计; A2 s _7 M( W0 c2 i)32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish 2 q; n1 F7 b! d* z$ k, v36、纵向：length wise direction PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计3 M& U& }! l' [/ R37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad 6 "& B, I: t2 p8 k* slaminates(phenolic/paper ccl)PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计7 q6 H t+ _7 P9 |40、环氧纸质覆铜箔板：epo*ide cellulose paper copper-cladlaminates (epo*y/paper ccl)41、环氧玻璃布基覆铜箔板：epo*ide woven glass fabric copper-clad PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计, o: t+ i4 M2 P" g/ Z3 ~ laminates42、环氧玻璃布纸复合覆铜箔板：epo*ide cellulose paper core, glass PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计& A* W- q: Z4 B& o6 v4 |4 L6 o! v cloth surfaces copper-clad laminates7 b, W5 h" P,43、环氧玻璃布玻璃纤维复合覆铜箔板：epo*ide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates.eda365." C% C Y. D4 B! I" y45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad 8 w5 Z$ "4 N) N: C0 ~9 H' K2 j laminates: V( *: O! v* z5 }46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epo*ide woven glass fabric copper-clad lamimates PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计, B9 W) "7 w2 s: y47、环氧合成纤维布覆铜箔板：epo*ide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计6 ^2 \$ b {) u- B4 S5 E6 h( l49、超薄型层压板：ultra thin laminate50、瓷基覆铜箔板：ceramics base copper-clad laminates5 R" ". d* *& { o$ L2 \1 v51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料, `( `* I% H8 _" g+ H1、a阶树脂：a-stage resin.eda365.4 r* K; C. t: R! K; b2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epo*y resin PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计8 Q, w5 N0 i; I" "* `. e% D5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin1 l; E! |" k0 ^4 E7、聚酰亚胺树脂：polyimide resin: D) _2 k& o, i$ k5 n7 *$ o8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计 J' P3 `. F+ F6 Y: d2 e+ d- d* ^! k10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epo*y resin12、溴化环氧树脂：brominated epo*y resin13、环氧酚醛：epo*y novolac14、氟树脂：fluroresin PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计2 E2 f0 A: S6 *1 }$ j& T15、硅树脂：silicone resin16、硅烷：silane PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计* k4 ^' t2 [% ~( O17、聚合物：polymer18、无定形聚合物：amorphous polymer EDA365高速PCB论坛1 H6 w7 m* P8 Y19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin.eda365.) H0 d V$ g* T425、感光性树脂：photosensitive resin PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计1 \. o3 S* c+ \9 O0 `4 E7 J26、环氧当量：weight per epo*y equivalent (wpe)PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计1 K. m! *& ]3 P8 *. ~* h7 d' P27、环氧值：epo*y value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive% n2 S- k' H( \5 i31、固化剂：curing agent32、阻燃剂：flame retardant PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计7 a5 B* g2 C* w" K33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计8 j- A" ]" L' z536、聚酯薄膜：polyester/ i A6 P v8 _6 F6 j37、聚酰亚胺薄膜：polyimide film (pi)EDA365高速PCB论坛/ ^) ", E5 ]6 Z, * j8 "- Q38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber.eda365.' s" ^3 *% B5 L$ i w* `42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats7 d3 D3 *6 f0 J6 N- |5 \48、纱线：yarn49、单丝：filament50、绞股：strand4 _! I" \* r) t; O. Y51、纬纱：weft yarn52、经纱：warp yarn EDA365高速PCB论坛) l$ l0 W) n6 ^4 b `0 D9 {' |53、但尼尔：denier PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计7 U* z: V U+ B c54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计4 t) L% G2 H8 D$ F+ H9 e57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric% N4 V! f* I6 *8 p- e2 g& h6 _60、稀松织物：woven scrim) W, * y! *2 H, p( R61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计n% e% r2 k0 "% C!65、折痕：crease66、云织：waviness PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计6 q: I1 *5 Y( s. R! p! `3 J* m! R& o67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark PCB设计论坛，CB layout设计，高速PCB设计，高速SI仿真设计6 *' H2 y2 [770、裂缝：split PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计. o; M/ s2 n% e,71、捻度：twist of yarn* A4 t- y$ _& R- z- f* ~72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level+ r" G. F6 P: f: h2 y75、浸润剂：size EDA365高速PCB论坛; }! P+ d( s! m" I* F1 D2 Z" *4 L8 r76、偶联剂：couplint agent PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计' v9 S* G4 d: `1 t8 L6 v77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计/ b( y6 "6 |0 J, h+ o& i1 o) M80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper.eda365.0 f6 & t2 n% H% F% Z( ^5 m82、断裂长：breaking length PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计 C9 P0 _0 `+ H* + v/ P83、吸水高度：height of capillary rise84、湿强度保存率：wet strength retention.eda365., w/ m1 y( O% ** n; [2 m2 i& N185、白度：whitenness) S6 F. ** m2 S* \9 m)86、瓷：ceramics PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计2 h3 D, E' J7 M- v87、导电箔：conductive foil88、铜箔：copper foil PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计/ "9 |* u" e- y2 N$ I9 s: R89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil.eda365. ~! *& A1 M1 O6 O2 W92、压延退火铜箔：rolled annealed copper foil (ra copper foil) L* V" ~+ K/ k9 b; \. y93、薄铜箔：thin copper foil .eda365.: Y, q; C- "6 S/ o94、涂胶铜箔：adhesive coated foil EDA365高速PCB论坛$ K* R% \! k! T( q3 t% G+ [4 P) v95、涂胶脂铜箔：resin coated copper foil (rcc)EDA365高速PCB论坛* T Q, o0 k2 o5 */ O"96、复合金属箔：posite metallic material.eda365." E5 t/ r4 w/ N& c" F0 Z97、载体箔：carrier foil.eda365.$ H. o; s) }' \0 P: G98、殷瓦：invar99、箔〔剖面〕轮廓：foil profile100、光面：shiny side PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计 d3 \+ s" H5 C. *6 s7 {101、粗糙面：matte side PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计0 e7 n9 h0 M/ A* I, f* ^*102、处理面：treated side PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计: Z, R, g+ c* s6 f+ \103、防锈处理：stain proofing104、双面处理铜箔：double treated foil EDA365高速PCB论坛+ E8 Z& A J5 m7 j四、设计1、原理图：shematic diagram2、逻辑图：logic diagram PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计/ I9 q+ S' V: ]$ j3、印制线路布设：printed wire layout4、布设总图：master drawing PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计8 y0 K/ [* E' P5、可制造性设计：design-for-manufacturability PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计0 _. v5 Y/ ** B- `' k6、计算机辅助设计：puter-aided design.(cad)7、计算机辅助制造：puter-aided manufacturing.(cam)8、计算机集成制造：puter integrat manufacturing.(cim).eda365.- b9 ^8 *- q1 L9 h j9 *, S9、计算机辅助工程：puter-aided engineering.(cae).eda365.$ m* H* u3 t B; a9 Q& g*10、计算机辅助测试：puter-aided test.(cat): a: \2 {% M% |! *4 ~2 n/ j6 O11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)& K* Z: Z! B" M. q J0 ]$ |14、计算机辅助制图：puter aided drawing PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计* s; k7 q0 R( W7 R/ V2 ^: F15、计算机控制显示：puter controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation7 v& ~* g7 P& w* f0 R; ^22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计* r2 h9 K% y! k25、布线完成率：layout effeciency PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计 j0 c2 d7 ]9 T526、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin EDA365高速PCB论坛1 w- s* C: } j& l30、优化〔设计〕：optimization (design)PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计0 _3 e3 |. Q n( V. Q" V$ O2 Z0 J31、供设计优化坐标轴：predominant a*is32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file.eda365.: y+ W0 L8 *7 V* ] `" D35、中间文件：intermediate file/ F3 `$ H7 G H) I+ D36、制造文件：manufacturing documentation PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计" b* p6 U' g% R* H$ e( k$ ^37、队列支撑数据库：queue support database- ^: y( "+ Y* q0 O5 z( C38、元件安置：ponent positioning39、图形显示：graphics dispaly EDA365高速PCB论坛2 ( Y' W! C7 `40、比例因子：scaling factor EDA365高速PCB论坛N+ G9 ~; c7 g! * \41、扫描填充：scan filling PCB设计论坛，PCB layou设计，高速PCB设计，高速仿真设计- r2 R% *2 F2 N3 G4 "4 e0 E$ D42、矩形填充：rectangle filling.eda365.$ }) t3 V- s, |4 v2 F& {; v+ t43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计2 j% o* R2 q. ]4 G4 M* o7 a+ Q48、自顶向下设计：top-down design! W8 r8 T) ". G; W' }49、自底向上设计：bottom-up design EDA365高速PCB论坛3 L+ D$ E2 }9 c50、线网：net51、数字化：digitzing EDA365高速PCB论坛* l Q8 _) T2 f52、设计规那么检查：design rule checking PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计/ I- O/ p) R9 R53、走〔布〕线器：router (cad)54、网络表：net list PC设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计; R8 z6 u9 ]. k8 I, v* r55、计算机辅助电路分析：puter-aided circuit analysis56、子线网：subnet PC设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计' v4 v/ o% E"57、目标函数：objective function PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计* u4 o; G8 c+ N! "* S+ j"58、设计后处理：post design processing (pdp)' ) ^4 e" B, o) }) A& "* M59、交互式制图设计：interactive drawing design PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计3 a9 }: A$ o" h% h' R8 b* M7 l60、费用矩阵：cost metri*PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计" j! D: p) "* g4 I+ P61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：ponent density65、巡回售货员问题：traveling salesman problem.eda365./ M/ R% h2 u! B' |66、自由度：degrees freedom PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计9 q9 p3 }; g) O0 ") }8 G* F% p2 v67、入度：out going degree EDA365高速PCB论坛: l! a3 7 K% w% D8 t* Y68、出度：ining degree PCB设计论坛，PCB layou设计，高速PCB设计，高速仿真设计- `1 n6 i' l4 Y% ~ b* D* M }69、曼哈顿距离：manhatton distance" U- r7 r Z0 V5 l: "7 a70、欧几里德距离：euclidean distance PCB设计论坛，PCB layou设计，高速PCB设计，高速仿真设计1 c1 a5 S* Q' F, e0 B2 G71、网络：network72、阵列：array73、段：segment EDA365高速PCB论坛c6 B0 [& n- O; U74、逻辑：logic75、逻辑设计自动化：logic design automation .eda365.7 v O' S: Q8 q0 N) `( `: j76、分线：separated time PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计9 Y& A. a1 G6 G/ R* o77、分层：separated layer EDA365高速PCB论坛5 M4 y) O- d2 `& p8 Q/ N% }+ [(78、定顺序：definite sequence EDA365高速PCB论坛& o) o4 R7 E( t6 V: *五、形状与尺寸：EDA365高速PCB论坛B1 H* d0 ]8 r1、导线〔通道〕：conduction (track)PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计; d2 |; l; _3 p4 ^2 y8 B72、导线〔体〕宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space$ *2 s. D1 M2 _" T6 h6 T6、第一导线层：conductor layer no.1PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计E! b3 h. E3 ** P*7、圆形盘：round pad8、方形盘：square pad7 E0 S* A* *1 q3 h9、菱形盘：diamond pad.eda365. ~9 O+ O7 r0 _8 n( E10、长方形焊盘：oblong pad EDA365高速PCB论坛! ^0 Y' h3 O/ C6 F5 n" Z11、子弹形盘：bullet pad PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计5 n, u7 r" N! D! ".12、泪滴盘：teardrop pad4 G. h' s- "" g! ~13、雪人盘：snowman pad14、v形盘：v-shaped pad& |1 U. n. ~& T( *; *- K) I; N'15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹〔背〕裸盘：back-bard land PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计+ K: R6 *7 k f/ ] N; b21、盘址：anchoring spaur22、连接盘图形：land pattern.eda365.% c& V* }6 O" K! E) N: R4 d23、连接盘网格阵列：land grid array.eda365.8 z) D- }' j) t h7 g. .24、孔环：annular ring PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计+ \1 u5 S, r5 n2 \$ k- i4 b25、元件孔：ponent hole EDA365高速PCB论坛; {/ ^* n! i; z26、安装孔：mounting hole EDA365高速PCB论坛$ _+ u) A- 5 J( W7 ]27、支撑孔：supported hole28、非支撑孔：unsupported hole PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计/ }4 K$ `7 w, n; ~9 a0 N" `;29、导通孔：via30、镀通孔：plated through hole (pth)* d9 n: q! W( |6 |& A* ^8 p31、余隙孔：access hole32、盲孔：blind via (hole).eda365." M- g6 ]0 w* h8 W( Z0 I: A4 "33、埋孔：buried via hole PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计1 U+ Q( M$ u, [34、埋/盲孔：buried /blind via PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计& l0 h' n+ I5 p$ * s, H,35、任意层部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole.eda365." ) J* a3 O1 r41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准外表间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole.eda365.. O: y& V6 p! C0 Z45、在连接盘中导通孔：via-in-pad.eda365.% f* h" \* h/46、孔位：hole location( \1 b" A3 P$ |/ T5 A) H47、孔密度：hole density PCB设计论坛，PCB layou设计，高速PCB设计，高速仿真设计9 p2 p( R; h/ ~ a* m$ D% g0 Q48、孔图：hole pattern- D2 h9 F$ y! {5 t- a* i49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance. ! .。
PCB专业术语大汇集
PCB专业术语大汇集PCB专业术语大汇集PCB是Printed Circuit Board的缩写，即印制电路板。
作为现代电子制造中不可或缺的一个组成部分，PCB技术已经成为电子制造的核心技术之一。
如果你在PCB制造领域工作或学习，那么理解并熟练掌握一些常见的PCB专业术语是非常重要的。
在这篇文章中，我们将罗列一些重要的PCB专业术语和技术名词，以帮助大家更好地理解PCB的制造和设计。
一、PCB制造基础1. PAD:焊盘，指印制电路板上用于焊接元器件的金属区域。
2. VIA:通孔，指在印制电路板上打开的金属通孔，连接不同层之间的电路。
3. Solder mask:焊膜，是一种覆盖在PCB表面的保护层，用于防止无意中的短路和腐蚀。
4. Silk screen:丝印，是印刷在印制电路板上的文字和图像，用于标记焊点、元器件和引脚等信息。
5. Cooper:铜箔，是一种用于制造PCB的材料。
6. Substrate:衬底，指PCB中负责固定和支撑电路的材料。
7. Copper weight:铜厚度，指PCB上铜箔的厚度，单位是oz。
8. Panel:板子，指PCB制造中一组连续的PCB，通常需要在单个板子上打印多个电路。
9. Plating:镀，指将金属材料沉积在印制电路板表面或内部的过程。
10. Tolerance:公差，指PCB制造和设计中可以接受的误差范围。
二、PCB设计技术1. Trace:走线，指印制电路板上的导线，用于连接不同的元器件和电路板上的不同部分。
2. Clearance:间隙，指PCB上不同元器件或电路之间的距离。
3. Net:网络，指一个电路的连接点集合，通常用来描述PCB上的一组连通电路。
4. Gerber:杰伯，是一种文件格式，通常用于将PCB设计转化为PCB生产所需的制造文件。
5. Footprint:插件，指印制电路板上元器件焊盘的设计，用于确保元器件和焊盘正确对齐和正确连接。
PCB电路板词汇与术语总整理
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn 49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance电路板术语总整理*****A*****Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS树脂.Absorption吸收(入).Ac Impedance交流阻抗.Accelerated Test(Aging)加速老化(试验). Acceleration速化反应.Accelerator 加速剂,速化剂.Acceptability,Acceptance 允收性,允收.Access Hole露出孔,穿露孔.Accuracy准确度.Acid Number (Acid V alue)酸值.Acoustic Microscope (AM)感音成像显微镜. Acrylic压克力(聚丙烯酸树脂).Actinic Light (or Intensity, or Radiation)有效光. Activation活化.Activator活化剂.Active Carbon活性炭.Active Parts(Devices)主动零件.Acutance解像锐利度.Addition Agent添加剂.Additive Process加成法.Adhesion附着力.Adhesion Promotor附着力促进剂.Adhesive胶类或接着剂.Admittance导纳(阻抗的倒数).Aerosol喷雾剂,气熔胶,气悬体.Aging老化.Air Inclusion气泡夹杂.Air Knife风刀.Algorithm算法.Aliphatic Solvent脂肪族溶剂.Aluminium Nitride(AlN)氮化铝.Ambient Tamp环境温度.Amorphous无定形,非晶形.Amp-Hour安培小时.Analog Circuit/Analog Signal模拟电路/模拟讯号. Anchoring Spurs着力爪.Angle of Contack接触角.Angle of Attack攻角.Anion阴离子.Anisotropic异向性,单向的.Anneal 韧化(退火).Annular Ring孔环.Anode阳极.Anode Sludge阳极泥.Anodizing阳极化.ANSI美国标准协会.Anti-Foaming Agent消泡剂.Anti-pit Agent抗凹剂.AOI自动光学检验.Apertures开口,钢版开口.AQL品质允收水准.AQL(Acceptable Quality Level)允收品质水准.Aramid Fiber聚醯胺纤维.Arc Resistance耐电弧性.Array排列.Artwork底片.ASIC特定用途绩体电路器.Aspect Ratio纵横比.Assembly组装装配.A-stage A阶段.ATE自动电测设备.Attenuation讯号衰减.Autoclave压力锅.Axial-lead轴心引脚.Azeotrope共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper反锥斜角.Backpanels, Backplanes支撑板.Back-up 垫板.Balanced Transmission Lines平衡式传输线.Ball Grid Array球脚数组(封装).Bandability弯曲性.Banking Agent护岸剂.Bare Chip Assembly裸体芯片组装.Barrel孔壁,滚镀.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液体比重比水重则Be=145-(145÷Sp.Gr) 凡液体比重比水轻则Be=140÷(Sp.Gr-130)*Sp.Gr 为比重即同体绩物质对"纯水"1g/cm的比值). Beam lead光芒式的平行密集引脚.Bed-of-Nail Testing针床测试.Bellows Conact弹片式接触.Beta Ray Backscatter贝他射线反弹散射. Bevelling切斜边.Bias斜张纲布,斜纤法.Bi-Level Stencil]双阶式钢板.Binder粘结剂.Bits头(Drill Bits).Black Oxide黑氧化层.Blanking冲空断开.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分层或起泡.Block Diagram电路系统块图. Blockout封纲.Blotting干印.Blotting Paper吸水纸.Blow Hole吹孔.Blue Plaque蓝纹(锡面钝化层).Blur Edge (Circle)模糊边带(圈).Bomb Sight弹标.Bond Strength结合强度.Bondability结合性.Bonding Layer结合层接着层.Bonding Sheet(Layer)接合片.Bonding Wire结合线.Bow, Bowing板弯.Braid编线.Brazing硬焊(用含银的铜锌合金焊条). 在425℃~870℃下进行熔接的方式). Break Point显像点.Break-away Panel可断开板. Breakdown Voltage崩溃电压.Break-out破出.Bridging搭桥.Bright Dip光泽浸渍处理.Brightener光泽剂.Brown Oxide棕氧化.Brush Plating刷镀.B-stageB阶段.Build Up Process增层法制程.Build-up堆积.Bulge鼓起.Bump 突块.Bumping Process凸块制程.Buoyancy浮力.Buried Via Hole埋导孔.Burn-in高温加速老化试验.Burning烧焦.Burr毛头.Bus Bar汇电杆.Butter Coat 外表树脂层.*****C*****C4 Chip JointC4芯片焊接.Cable电缆.CAD计算机辅助设计.Calendered Fabric轧平式纲布.Cap Lamination帽式压合法.Capacitance电容.Capacitive Coupling电容耦合.Capillary Action毛细作用.Carbide碳化物.Carbon Arc Lamp碳弧灯.Carbon Treatment, Active活化炭处理.Card卡板.Card Cages/Card Racks电路板构装箱. Carlson Pin卡氏定位稍.Carrier载体.Cartridge滤心.Castallation堡型绩体电路器.Catalyzed Board, Catalyzed Substrate催化板材. Catalyzing催化.Cathode阴极.Cation阴向离子, 阳离子.Caul Plate隔板.Cavitation空泡化半真空.Center-to-Center Spacing中心间距. Ceramics陶瓷.Cermet陶金粉.Certificate证明书.CFC氟氢碳化物.Chamfer倒角.Characteristic Impedance特性阻抗.Chase纲框.Check List检查清单.Chelate螯合.Chemical Milling化学研磨.Chemical Resistance抗化性.Chemisorption化学吸附.Chip芯片(粒).Chip Interconnection芯片互连.Chip on Board芯片粘着板.Chip On Glass晶玻接装(COG).Chisel钻针的尖部.Chlorinated Solvent含氯溶剂,氯化溶剂. Circumferential Separation环状断孔.Clad/Cladding披覆.Clean Room无尘室.Cleanliness清洁度.Clearance余地,余环.Clinched Lead Terminal紧箝式引脚.Clinched-wire Through Connection通孔弯线连接法. Clip Terminal绕线端接.Coat, Coating皮膜表层.Coaxial Cable同轴缆线.Coefficient of Thermal Expansion热膨胀系数.Co-Firing共绕.Cold Flow冷流.Cold Solder Joint冷焊点.Collimated Light平行光.Colloid胶体.Columnar Structure柱状组织.Comb Pattern梳型电路.Complex Ion错离子.Component Hole零件孔.Component Orientation零件方向.Component Side组件面.Composites,(CEM-1,CEM-3)复合板材. Condensation Soldering凝热焊接,液化放热焊接. Conditioning整孔.Conductance导电.Conductive Salt导电盐.Conductivity导电度.Conductor Spacing导体间距.Conformal Coating贴护层.Conformity吻合性, 服贴性.Connector连接器.Contact Angle接触角.Contact Area接触区.Contact Resistance接触电阻.Continuity连通性.Contract Service协力厂,分包厂.Controlled Depth Drilling定深钻孔. Conversion Coating 转化皮膜. Coplanarity共面性.Copolymer共聚物.Copper Foil铜皮.Copper Mirror Test铜镜试验.Copper Paste铜膏.Copper-Invar-Copper (CIC)综合夹心板. Core Material内层板材,核材.Corner Crack 通孔断角.Corner Mark板角标记. Counterboring方型扩孔. Countersinking锥型扩孔.Coupling Agent 偶合剂.Coupon, Test Coupon板边试样. Coverlay/Covercoat表护层.Crack裂痕.Crazing白斑.Crease皱折.Creep潜变.Crossection Area截面积. Crosshatch Testing十字割痕试验. Crosshatching十字交叉区. Crosslinking, Crosslinkage交联,架桥. Crossover越交,搭交.Crosstalk噪声, 串讯.Crystalline Melting Point晶体熔点.C-Stage C阶段.Cure硬化,熟化.Current Density电流密度.Current-Carrying Capability载流能力. Curtain Coating濂涂法.*****D*****Daisy Chained Design菊瓣设计. Datum Reference基准参考. Daughter Board子板.Debris碎屑,残材.Deburring去毛头.Declination Angle斜射角.Definition边缘逼真度.Degradation 劣化.Degrasing脱脂.Deionized Water去离子水. Delamination分离.Dendritic Growth 枝状生长.Denier丹尼尔(是编织纺织所用各种纱类直径单位,定义9000米纱束所具有的重量(以克米计)).Densitomer透光度计.Dent凹陷.Deposition 皮膜处理.Desiccator干燥器.Desmearing去胶渣.Desoldering解焊.Developer显像液,显像机.Developing显像.Deviation偏差.Device电子组件.Dewetting缩锡.D-glassD玻璃.Diaze Film偶氮棕片.Dichromate重铬酸盐.Dicing芯片分割.Dicyandiamide(Dicy)双氰胺.Die 冲模.Die Attach晶粒安装.Die Bonding晶粒接着.Die Stamping冲压.Dielectric 介质.Dielectric Breakdown Voltage介质崩溃电压.Dielectric Constant介质常数.Dielectric Strength介质强度.Differential Scanning Calorimetry(DSC)微差扫瞄热卡分析法. Diffusion Layer扩散层.Digitizing数字化.Dihedral Angle双反斜角.Dimensional Stability尺度安定性.Diode二极管.Dip Coating浸涂法.Dip Soldering浸焊法.DIP(Dual Inline Package)双排脚封装体.Dipole偶极,双极.Direct / Indirect Stencil直接/间接版膜.Direct Emulsion直接乳胶.Direct Plating直接电镀.Discrete Compenent散装零件.Discrete Wiring Board散线电路板,复线板.Dish Down碟型下陷.Dispersant分散剂.Dissipation Factor散失因素.Disspation Factor散逸因子.Disturbed Joint受扰焊点.Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping掺杂.Double Layer双电层.Double Treated Foil双面处理铜箔.Drag In / Drag Out带[进/带出.Drag Soldering拖焊.Drawbridging吊桥效应.Drift漂移.Drill Facet钻尖切削面.Drill Pointer钻针重磨机.Drilled Blank已钻孔的裸板.Dross浮渣.Drum Side铜箔光面.Dry Film干膜.Dual Wave Soldering 双波焊接.Ductility展性.Dummy Land假焊垫.Dummy, Dummying假镀(片).Durometer橡胶硬度计.DYCOstrate电浆蚀孔增层法.Dynamic Flex(FPC)动态软板.*****E*****E-Beam (Electron Beam)电子束.Eddy Current涡电流.Edge Spacing板边空地.Edge-Board Connector板边(金手指)承接器.Edge-Board Contact板边金手指.Edge-Dip Solderability Test板边焊锡性测试. EDTA乙二胺四乙酸.Effluent排放物.E-glass电子级玻璃.Elastomer弹性体.Electric Strength(耐)电性强度. Electrodeposition电镀.Electro-deposition Photoresist电着光阻, 电泳光阻. Electroforming电铸.Electroless-Deposition无电镀.Electrolytic Tough Pitch电解铜..Electrolytic-Cleaning电解清洗.Electro-migration电迁移.Electro-phoresis电泳动, 电渗.Electro-tinning镀锡.Electro-Winning电解冶炼.Elongation 延伸性, 延伸率.Embossing凸出性压花.EMF(Electromotive Force)电动势.EMI(Electromagnetic Interference)电磁干扰. Emulsion乳化.Emulsion Side药膜面.Encapsulating胶囊.Encroachment沾污,侵犯.End Tap封头.Entek有机护铜处理.Entrapment夹杂物.Entry Material盖板.Epoxy Resin环氧树脂.Etch Factor蚀刻因子.Etchant蚀刻剂(液).Etchback回蚀.Etching Indicator蚀刻指针.Etching Resist蚀刻阻剂.Eutetic Composition共融组成.Exotherm放热(曲线).Exposure曝光.Eyelet铆眼.*****F*****Fabric纲布.Face Bonding反面朝下结合.Failure故障.Fan Out Wiring/Fan In Wiring扇出布线/扇入布线. Farad 法拉.Farady法拉第.Fatigue Strength抗疲劳强度.Fault缺陷.Fault Plane断层面.Feed Through Hole导通孔.Feeder 进料器.Fiber Exposure玻纤显露.Fiducial Mark基准记号.Filament纤丝.Fill纬向.Filler填充料.Fillet内圆填角.Film底片.Film Adhesive接着膜,粘合膜.Filter过滤器.Fine Line细线.Fine Pitch密脚距,密线距,密垫距. Fineness粒度, 纯度.Finger手指.Finishing终修(饰).Finite Element Method有限要素分析法. First Article首产品.First Pass-Yield初检良品率.Fixture夹具.Flair刃角变形.Flame Point自燃点.Flame Resistant耐燃性.Flammability Rate燃性等级.Flare扇形崩口.Flash Plating闪镀.Flashover闪络.Flat Cable扁平排线.Flat Pack扁平封装(之零件).Flatness平坦度.Flexible Printed Circuit (FPC)软板.Flexural Failure挠曲损坏.Flexural Module弯曲模数, 抗挠性模数. Flexural Strength抗挠强度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨冲程印刷.Flow Soldering (Wave Soldering)流焊. Fluorescence荧光.Flurocarbon Resin碳氟树脂.Flush Conductor嵌入式线路, 贴平式导体. Flush Point闪火点.Flute退屑槽.Flux助焊剂.Foil Burr铜箔毛边.Foil Lamination铜箔压板法.Foot残足(干膜残余物).Foot Print (Land Pattern)脚垫.Foreign Material 外来物,异物.Form-to-List布线说明清单.Four Point Twisting四点扭曲法.Free Radical自由基.Freeboard干舷.Frequency频率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔锡层.Fusing熔合.Fusing Fluid助熔液.*****G*****G-10由连续玻纤所织成的玻纤布与环氧树脂粘结剂所复合成的材料.Gage, Gauge量规.Gallium Arsenide (GaAs)砷化镓.Galvanic Corrosion贾凡尼式腐蚀(电解式腐蚀).Galvanic Series贾凡尼次序(电动次序).Galvanizing镀锌.GAP第一面分离,长刃断开.Gate Array闸列,闸极数组.Gel Time胶化时间.Gelation Particle胶凝点.Gerber Data ,Gerber File格博档案(是美商Gerber公司专为PCB面线路图形与孔位,所发展一系列完整的软件档案).Ghost Image阴影.Gilding镀金(现为:Glod Plating).Glass Fiber玻纤.Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破.Glass Transition Temperature, Tg玻璃态转化温度.Glaze釉面,釉料.Glob Top圆顶封装体.Glouble Test球状测试法.Glycol (Ethylene Glycol)乙二醇.Golden Board测试用标准板.Grain Size结晶粒度.Grass Leak 大漏.Grid标准格.Ground Plane /Earth Plane接地层.Ground Plane Clearance接地空环.Guide Pin导针.Gull /Wing Lead鸥翼引脚.*****H*****Halation环晕.Half Angle半角.Halide卤化物.Haloing白圈,白边.Halon海龙,是CFC"氟碳化物"的一种商品名.Hard Anodizing硬阳极化.Hard Chrome Plating镀硬铬.Hard Soldering硬焊.Hardener (Curing Agent)硬化剂(或Curing Agent).Hardness硬度.Haring-Blum Cell海固槽.Harness电缆组合.Hay Wire跳线.Heat Cleaning烧洁.Heat Dissipation散热.Heat Distortion Point (Temp)热变形点(温度).Heat Sealing热封.Heat Sink Plane散热层.Heat Transfer Paste导热膏.Heatsink Tool散热工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter (HEPA)高效空气尘粒过泸机. Hipot Test 高压电测.Hi-Rel高度靠度.Hit 击(钻孔时钻针每一次"刺下"的动作).Holding Time停置时间.Hole Breakout孔位破出.Hole Counter数孔机.Hole Density孔数密度.Hole Preparation通孔准备.Hole Pull Strength孔壁强度.Hole Void破洞.Hook 切削刀缘外凸.Hot Air Levelling喷锡.Hot Bar Soldering热把焊接.Hot Gas Soldering热风手焊.HTE(High Temperature Elongation)高温延伸性.Hull Cell哈氏槽.Hybrid Integrated Circuit混成电路.Hydraulic Bulge Test液压鼓起试验.Hydrogen Embrittlement氢脆.Hydrogen Overvoltage氢过(超)电压.Hydrolysis水解.Hydrophilic亲水性.Hygroscopic吸湿性.Hypersorption超吸咐.*****I*****I.C. Socket绩体电路器插座.Icicle锡尖.Illuminance照度.Image Transfer影像转移.Immersion Plating浸镀.Impedance阻抗.Impedance Match阻抗匹配.Impregnate含浸.In-Circuit Testing组装板电测.Inclusion异物,夹杂物.Indexing Hole基准孔.Inductance(L)电感.Infrared(IR)红外线.Input/Output输入/输出.Insert, Insertion插接.Inspection Overlay套检底片.Insulation Resistance绝缘电阻.Integrated Circuit(IC)绩体电路器.Inter Face接口.Interconnection互连.Intermetallic Compound (IMC)接口共化物.Internal Stress内应力.Interposer互边导电物.Interstitial Via-Hole(IVH)局部层间导通孔.Invar殷钢(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness离子清洁度.Ion Exchange Resins离子交换树脂.Ion Migration离子迁移.Ionizable (Ionic) Contaimination离子性污染.Ionization游离,电离.Ionization Voltage (Corona Level)电离化电压(电缆内部狭缝空气中,引起其电离所施加之最小电压).IPC美国印刷电路板协会.Isolation隔离性,隔绝性.*****J*****JEDEC(Joint Electronic Device 联合电子组件工程委员会.Engineering Council)J-LeadJ型接脚.Job Shop专业工厂.Joule焦耳.Jumper Wire跳线.Junction接(合)面,接头.Just-In-Time(JIT)适时供应,及时出现.*****K*****Kapton聚亚醯胺软板.Karat克拉(1克拉(钻石)=0.2g 纯金则24k金为100%的钝金.Kauri-Butanol Value考立丁醇值(简称K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纤维.Key电键Key Board键盘.Kiss Pressure吻压, 低压.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好芯片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮纸.*****L*****Lamda Wave延伸平波.Laminar Flow平流.Laminar Structure片状结构.Laminate Void板材空洞.Laminate(s)基板.Lamination V oid压合空洞.Laminator压膜机.Land孔环焊垫,表面焊垫.Landless Hole无环通孔.Laser Direct Imaging (LDI)雷射直接成像.Laser Maching雷射加工法.Laser Photogenerator(LPG), Laser Photoplotter雷射曝光机. Laser Soldering雷射焊接法.Lay Back 刃角磨损.Lay Out布线,布局.Lay Up 叠合.Layer to Layer Spacing层间距离Leaching焊散漂出,熔出.Lead 引脚.Lead Frame脚架.Lead Pitch脚距.Leakage Current漏电电流.Legend文字标记.Leveling整平.Lifted Land孔环(焊垫)浮起.Ligand错离子附属体.Light Emitting Diodes (LED)发光二极管.Light Integrator光能累积器.Light Intensity光强度.Limiting Current Density极限电流密度.Liquid Crystal Display (LCD)液晶显示器.Liquid Dielectrics液态介质.Liquid Photoimagible Solder Mask, (LPSM)液态感光防焊绿漆. Local Area Network区域性网络.Logic 逻辑.Logic Circuit 逻辑电路.Loss Factor损失因素.Loss Tangent (TanδDK)损失正切.Lot Size批量.Luminance发光强度.Lyophilic亲水性胶体.*****M*****Macro-Throwing Power巨观分布力.Major Defect主要(严重)缺点.Major Weave Direction主要织向.Margin刃带(钻头尖部).Marking标记.Mask阻剂.Mass Finishing大量整面(拋光).Mass Lamination大型压板.Mass Transport质量输送.Master Drawing主图.Mat席(用于CEM-3(Composite Epoxy Material)的复合材料.)Matte Side毛面(电镀铜皮(ED Foil)之粗糙面).Mealing泡点.Mean Time To Failure (MTTF)故障前可用之平均时数. Measling白点.Mechanical Stretcher机械式张网机.Mechanical Warp机械式缠绕.Mechanism机理.Membrane Switch薄膜开关.Meniscograph Test弧面状沾锡试验.Meniscus弯月面.Mercury Vaper Lamp汞气灯.Mesh Count纲目数.Metal Halide Lamp 金属卤素灯.Metallization金属化.Metallized Fabric金属化纲布.Micelle微胞.Micro Wire Board微封线板.Micro-electronios微电子.Microetching微蚀.Microsectioning微切片法.Microstrip 微条.Microstrip Line微条线,微带线.Microthrowing Power微分布力.Microwave微波.Migration迁移.Migration Rate迁移率.Mil英丝.Minimum Annular Ring孔环下限.Minimum Electrical Spacing电性间距下限.Minor Weave Direction次要织向.Misregistration 对不准度.Mixed Componmt Mounting Technology混合零件之组装技术. Modem调变及解调器.Modification修改.Module模块.Modulus of Elasticity弹性系数.Moisture and Insulation Resistance Test湿气与绝缘电阻试验. Mold Release 脱模剂,离型剂.Mole摩尔.Monofilament单丝.Mother Board主机板,母板.Moulded Circuit模造立体电路机.Mounting Hole安装孔.Mounting Hole组装孔,机装孔.Mouse Bite鼠齿(蚀刻后线路边缘出现不规则缺口).Multi-Chip-Module(MCM)多芯片芯片模块.Multiwiring Board (or Discrete Wiring Board)复线板.*****N*****N.C.数值控制.Nail Head钉头.Near IR近红外线.Negative负片,钻尖的第一面外缘变窄.Negative Etch-back反回蚀.Negative Stencil负性感光膜.Negative-Acting Resist负性作用之阻剂.Network纲状元件.Newton牛顿.Newton Ring 牛顿环.Newtonian Liquid牛顿流体.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氢哔咯.Noble Metal Paste贵金属印膏.Node节点.Nodule节瘤.Nomencleature标示文字符号.Nominal Cured Thickness标示厚度.Non-Circular Land非圆形孔环焊垫.Non-flammable非燃性.Non-wetting不沾锡.Normal Concentration (Strength)标准浓度,当量浓度. Normal Distribution常态分布.Novolac酯醛树脂.Nucleation , Nucleating核化.Numerical Control数值控制.Nylon尼龙.*****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(Oxyen Free High Conductivity)无氧高导电铜. Ohm欧姆.Oilcanning盖板弹动.OLB(Outer Lead Bond)外引脚结合.Oligomer寡聚物.Omega Meter离子污染检测仪.Omega Wave振荡波.On-Contact Printing密贴式印刷.Opaquer不透明剂,遮光剂.Open Circuits断线.Optical Comparater光学对比器(光学放大器.) Optical Density光密度.Optical Inspection光学检验.Optical Instrument光学仪器.Organic Solderability Preservatives (OSP)有机保焊剂. Osmosis渗透.Outgassing出气,吹气.Outgrowth悬出,横出,侧出.Output产出,输出.Overflow溢流.Overhang总悬空.Overlap 钻尖点分离.Overpotantial(Over voltage)过电位,过电压. Oxidation氧化.Oxygen Inhibitor氧化抑制剂.Ozone Depletion臭氧层耗损.*****P*****Packaging封装,构装.Pad焊垫,圆垫.Pad Master圆垫底片.。
PCB专业用语2828790738
printedboard20、挠性印制板：flexibleprintedboard21、挠性单面印制板：flexiblesingle-side dprintedboard22、挠性双面印制板：flexibledouble-sid edprintedboard23、挠性印制电路：flexibleprintedcircui t(fpc)24、挠性印制线路：flexibleprintedwirin g25、刚性印制板：flex-rigidprintedboard, rigid-flexprintedboard26、刚性双面印制板：flex-rigiddouble-s idedprintedboard,rigid-flexdouble-sidedpri nted27、刚性多层印制板：flex-rigidmultilay erprintedboard,rigid-flexmultilayerprinted board28、齐平印制板：flushprintedboard29、金属芯印制板：metalcoreprintedboa rd30、金属基印制板：metalbaseprintedboa rd31、多重布线印制板：mulit-wiringprint edboard32、陶瓷印制板：ceramicsubstrateprinte dboard33、导电胶印制板：electroconductivepas teprintedboard42、e玻璃纤维：e-glassfibre43、d玻璃纤维：d-glassfibre44、s玻璃纤维：s-glassfibre45、玻璃布：glassfabric46、非织布：non-wovenfabric47、玻璃纤维垫：glassmats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weftyarn52、经纱：warpyarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise,filling-wise56、织物经纬密度：threadcount57、织物组织：weavestructure58、平纹组织：plainstructure59、坏布：greyfabric60、稀松织物：wovenscrim61、弓纬：bowofweave62、断经：endmissing63、缺纬：mis-picks64、纬歪：bias65、折痕：crease66、云织：waviness67、鱼眼：fisheye68、毛圈长：featherlength69、厚薄段：mark70、裂缝：split71、捻度：twistofyarn72、浸润剂含量：sizecontent73、浸润剂残留量：sizeresidue74、处理剂含量：finishlevel75、浸润剂：size76、偶联剂：couplintagent77、处理织物：finishedfabric78、聚酰胺纤维：polyarmidefiber79、聚酯纤维非织布：non-wovenpolyesterfabric80、浸渍尽缘纵纸：impregnatinginsulationpaper81、聚芳酰胺纤维纸：aromaticpolyamidepaper82、断裂长：breakinglength34、模塑电路板：moldedcircuitboard35、模压印制板：stampedprintedwiringb oard36、顺序层压多层印制板：sequentially-laminatedmulitlayer37、散线印制板：discretewiringboard38、微线印制板：microwireboard39、积层印制板：buile-upprintedboard40、积层多层印制板：build-upmulitlaye rprintedboard(bum)41、积层挠印制板：build-upflexibleprint edboard42、外表层合电路板：surfacelaminarcir cuit(slc)43、埋进凸块连印制板：b2itprintedboar d44、多层膜基板：multi-layeredfilmsubst rate(mfs)45、层间全内导通多层印制板：alivhmu ltilayerprintedboard46、载芯片板：chiponboard(cob)47、埋电阻板：buriedresistanceboard48、母板：motherboard49、子板：daughterboard50、背板：backplane51、裸板：bareboard52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamicflexboard83、吸水高度：heightofcapillaryrise84、湿强度保持率：wetstrengthretention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductivefoil88、铜箔：copperfoil89、电解铜箔：electrodepositedcopperfoil(edcopperfoil)90、压延铜箔：rolledcopperfoil91、退火铜箔：annealedcopperfoil92、压延退火铜箔：rolledannealedcopperfoil(racopperfoil)93、薄铜箔：thincopperfoil94、涂胶铜箔：adhesivecoatedfoil95、涂胶脂铜箔：resincoatedcopperfoil(rcc)96、复合金属箔：compositemetallicmaterial97、载体箔：carrierfoil98、殷瓦：invar99、箔〔剖面〕轮廓：foilprofile100、光面：shinyside101、粗糙面：matteside102、处理面：treatedside103、防锈处理：stainproofing 104、双面处理铜箔：doubletreatedfoil四、设计1、原理图：shematicdiagram2、逻辑图：logicdiagram3、印制线路布设：printedwirelayout4、布设总图：masterdrawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aideddesign.(cad)7、计算机辅助制造：computer-aidedmanufacturing.(cam)8、计算机集成制造：computerintegratmanufacturing.(cim)9、计算机辅助工程：computer-aidedengineering.(cae)10、计算机辅助测试：computer-aidedtest.(cat)11、电子设计自动化：electricdesignauto54、静态挠性板：staticflexboard55、可断拼板：break-awayplanel56、电缆：cable57、挠性扁平电缆：flexibleflatcable(ffc)58、薄膜开关：membraneswitch59、混合电路：hybridcircuit60、厚膜：thickfilm61、厚膜电路：thickfilmcircuit62、薄膜：thinfilm63、薄膜混合电路：thinfilmhybridcircui t64、互连：interconnection65、导线：conductortraceline66、齐平导线：flushconductor67、传输线：transmissionline68、跨交：crossover69、板边插头：edge-boardcontact70、增强板：stiffener71、基底：substrate72、基板面：realestate73、导线面：conductorside74、元件面：componentside75、焊接面：solderside76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductivepattern80、非导电图形：non-conductivepattern81、字符：legend mation.(eda)12、工程设计自动化：engineeringdesignautomaton.(eda2)13、组装设计自动化：assemblyaidedarchitecturaldesign.(aaad)14、计算机辅助制图：computeraideddrawing15、计算机操纵显示：computercontrolleddisplay.(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logicsimulation22、电路模拟：circitsimulation23、时序模拟：timingsimulation24、模块化：modularization25、布线完成率：layouteffeciency26、机器描述格式：machinedescriptionmformat.(mdf)27、机器描述格式数据库：mdfdatabse28、设计数据库：designdatabase29、设计原点：designorigin30、优化〔设计〕：optimization(design)31、供设计优化坐标轴：predominantaxis32、表格原点：tableorigin33、镜像：mirroring34、驱动文件：drivefile35、中间文件：intermediatefile36、制造文件：manufacturingdocumentation37、队列支撑数据库：queuesupportdatabase38、元件安置：componentpositioning39、图形显示：graphicsdispaly40、比例因子：scalingfactor41、扫描填充：scanfilling42、矩形填充：rectanglefilling43、填充域：regionfilling44、实体设计：physicaldesign45、逻辑设计：logicdesign46、逻辑电路：logiccircuit82、标志：mark二、基材：1、基材：basematerial2、层压板：laminate3、覆金属箔基材：metal-cladbademateri al4、覆铜箔层压板：copper-cladlaminate(c cl)5、单面覆铜箔层压板：single-sidedcopp er-cladlaminate6、双面覆铜箔层压板：double-sidedcop per-cladlaminate7、复合层压板：compositelaminate8、薄层压板：thinlaminate9、金属芯覆铜箔层压板：metalcorecopp er-cladlaminate10、金属基覆铜层压板：metalbasecoppe r-cladlaminate11、挠性覆铜箔尽缘薄膜：flexiblecoppe r-claddielectricfilm12、基体材料：basismaterial13、预浸材料：prepreg14、粘结片：bondingsheet15、预浸粘结片：preimpregnatedbondin gsheer16、环氧玻璃基板：epoxyglasssubstrate17、加成法用层压板：laminateforadditi veprocess18、预制内层覆箔板：masslaminationpa47、层次设计：hierarchicaldesign48、自顶向下设计：top-downdesign49、自底向上设计：bottom-updesign50、线网：net51、数字化：digitzing52、设计规那么检查：designrulechecking53、走〔布〕线器：router(cad)54、网络表：netlist55、计算机辅助电路分析：computer-aidedcircuitanalysis56、子线网：subnet57、目标函数：objectivefunction58、设计后处理：postdesignprocessing(pdp)59、交互式制图设计：interactivedrawingdesign60、费用矩阵：costmetrix61、工程图：engineeringdrawing62、方块框图：blockdiagram63、迷宫：moze64、元件密度：componentdensity65、巡回售货员咨询题：travelingsalesmanproblem66、自由度：degreesfreedom67、进度：outgoingdegree68、出度：incomingdegree69、曼哈顿距离：manhattondistance70、欧几里德距离：euclideandistance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logicdesignautomation76、分线：separatedtime77、分层：separatedlayer78、定顺序：definitesequence五、外形与尺寸：1、导线〔通道〕：conduction(track)2、导线〔体〕宽度：conductorwidth3、导线距离：conductorspacing4、导线层：conductorlayer5、导线宽度/间距：conductorline/spacenel19、内层芯板：corematerial20、催化板材：catalyzedboard,coatedcat alyzedlaminate21、涂胶催化层压板：adhesive-coatedca talyzedlaminate22、涂胶无催层压板：adhesive-coatedun catalyzedlaminate23、粘结层：bondinglayer24、粘结膜：filmadhesive25、涂胶粘剂尽缘薄膜：adhesivecoated dielectricfilm26、无支撑胶粘剂膜：unsupportedadhes ivefilm27、覆盖层：coverlayer(coverlay)28、增强板材：stiffenermaterial29、铜箔面：copper-cladsurface30、往铜箔面：foilremovalsurface31、层压板面：uncladlaminatesurface32、基膜面：basefilmsurface33、胶粘剂面：adhesivefaec34、原始光洁面：platefinish35、粗面：mattfinish36、纵向：lengthwisedirection37、模向：crosswisedirection38、剪切板：cuttosizepanel39、酚醛纸质覆铜箔板：phenoliccellulo sepapercopper-cladlaminates(phenolic/pap erccl)6、第一导线层：conductorlayerno.17、圆形盘：roundpad8、方形盘：squarepad9、菱形盘：diamondpad10、长方形焊盘：oblongpad11、子弹形盘：bulletpad12、泪滴盘：teardroppad13、雪人盘：snowmanpad14、v形盘：v-shapedpad15、环形盘：annularpad16、非圆形盘：non-circularpad17、隔离盘：isolationpad18、非功能连接盘：monfunctionalpad19、偏置连接盘：offsetland20、腹〔背〕裸盘：back-bardland21、盘址：anchoringspaur22、连接盘图形：landpattern23、连接盘网格阵列：landgridarray24、孔环：annularring25、元件孔：componenthole26、安装孔：mountinghole27、支撑孔：supportedhole28、非支撑孔：unsupportedhole29、导通孔：via30、镀通孔：platedthroughhole(pth)31、余隙孔：accesshole32、盲孔：blindvia(hole)33、埋孔：buriedviahole34、埋/盲孔：buried/blindvia35、任意层内部导通孔：anylayerinnerviahole(alivh)36、全部钻孔：alldrilledhole37、定位孔：toalinghole38、无连接盘孔：landlesshole39、中间孔：interstitialhole40、无连接盘导通孔：landlessviahole41、引导孔：pilothole42、端接全隙孔：terminalclearomeehole43、准外表间镀覆孔：quasi-interfacingplated-throughhole44、准尺寸孔：dimensionedhole45、在连接盘中导通孔：via-in-pad46、孔位：holelocation47、孔密度：holedensity。
PCB专业用语 中英文对照
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board(pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit(fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board,rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board(bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit(slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board(cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable(ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate(ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer(cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core,glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent(wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film(pi)38、聚四氟乙烯：polytetrafluoetylene(ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film(fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise,filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil(ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil(ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil(rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation.(eda)12、工程设计自动化：engineering design automaton.(eda2)13、组装设计自动化：assembly aided architectural design.(aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display.(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format.(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization(design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router(cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing(pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction(track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole(pth)31、余隙孔：access hole32、盲孔：blind via(hole)33、埋孔：buried via hole34、埋/盲孔：buried/blind via35、任意层内部导通孔：any layer inner via hole(alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance整理自快点PCB学院。
常用PCB专业用语综合词汇
常用PCB专业用语综合词汇综合词汇：1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated multilayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark。
PCB常用专用名词英-汉对照
PCB常用专用名词英－汉对照一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (PCB)5、印制线路板：printed wiring board(PWB)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(SSB)11、双面印制板：double-sided printed board(DSB)12、多层印制板：mulitlayer printed board(MLB)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (FPC)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (BUM)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (SLC)43、埋入凸块连印制板：B2it printed board44、多层膜基板：multi-layered film substrate(MFS)45、层间全内导通多层印制板：ALIVH multilayer printed board46、载芯片板：chip on board (COB)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (FFC)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (CCL)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforcedcopper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glassfabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates三、基材的材料1、A阶树脂：A-stage resin2、B阶树脂：B-stage resin3、C阶树脂：C-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (WPE)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (PI)38、聚四氟乙烯：polytetrafluoetylene (PTFE)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、E玻璃纤维：E-glass fibre43、D玻璃纤维：D-glass fibre44、S玻璃纤维：S-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ED copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (RA copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (RCC)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(CAD)7、计算机辅助制造：computer-aided manufacturing.(CAM)8、计算机集成制造：computer integrat manufacturing.(CIM)9、计算机辅助工程：computer-aided engineering.(CAE)10、计算机辅助测试：computer-aided test.(CAT)11、电子设计自动化：electric design automation .(EDA)12、工程设计自动化：engineering design automaton .(EDA2)13、组装设计自动化：assembly aided architectural design. (AAAD)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(CCD)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(MDF)27、机器描述格式数据库：MDF databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (CAD)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (PDP)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer No.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、V形盘：V-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (PTH)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (ALIVH)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referan。
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综合词汇：
1、印制电路：printed circuit
2、印制线路：printed wiring
3、印制板：printed board
4、印制板电路：printed circuit board (pcb)
5、印制线路板：printed wiring board(pwb)
6、印制元件：printed component
7、印制接点：printed contact
8、印制板装配：printed board assembly
9、板：board
10、单面印制板：single-sided printed board(ssb)
11、双面印制板：double-sided printed board(dsb)
12、多层印制板：mulitlayer printed board(mlb)
13、多层印制电路板：mulitlayer printed circuit board
14、多层印制线路板：mulitlayer prited wiring board
15、刚性印制板：rigid printed board
16、刚性单面印制板：rigid single-sided printed borad
17、刚性双面印制板：rigid double-sided printed borad
18、刚性多层印制板：rigid multilayer printed board
19、挠性多层印制板：flexible multilayer printed board
20、挠性印制板：flexible printed board
21、挠性单面印制板：flexible single-sided printed board
22、挠性双面印制板：flexible double-sided printed board
23、挠性印制电路：flexible printed circuit (fpc)
24、挠性印制线路：flexible printed wiring
25、刚性印制板：flex-rigid printed board, rigid-flex printed board
26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
28、齐平印制板：flush printed board
29、金属芯印制板：metal core printed board
30、金属基印制板：metal base printed board
31、多重布线印制板：mulit-wiring printed board
32、陶瓷印制板：ceramic substrate printed board
33、导电胶印制板：electroconductive paste printed board
34、模塑电路板：molded circuit board
35、模压印制板：stamped printed wiring board
36、顺序层压多层印制板：sequentially-laminated multilayer
37、散线印制板：discrete wiring board
38、微线印制板：micro wire board
39、积层印制板：buile-up printed board
40、积层多层印制板：build-up mulitlayer printed board (bum)
41、积层挠印制板：build-up flexible printed board
42、表面层合电路板：surface laminar circuit (slc)
43、埋入凸块连印制板：b2it printed board
44、多层膜基板：multi-layered film substrate(mfs)
45、层间全内导通多层印制板：alivh multilayer printed board
46、载芯片板：chip on board (cob)
47、埋电阻板：buried resistance board
48、母板：mother board49、子板：daughter board
50、背板：backplane
51、裸板：bare board
52、键盘板夹心板：copper-invar-copper board
53、动态挠性板：dynamic flex board
54、静态挠性板：static flex board
55、可断拼板：break-away planel
56、电缆：cable
57、挠性扁平电缆：flexible flat cable (ffc)
58、薄膜开关：membrane switch
59、混合电路：hybrid circuit
60、厚膜：thick film
61、厚膜电路：thick film circuit
62、薄膜：thin film
63、薄膜混合电路：thin film hybrid circuit
64、互连：interconnection
65、导线：conductor trace line
66、齐平导线：flush conductor
67、传输线：transmission line
68、跨交：crossover
69、板边插头：edge-board contact
70、增强板：stiffener
71、基底：substrate
72、基板面：real estate
73、导线面：conductor side
74、元件面：component side
75、焊接面：solder side
76、印制：printing
77、网格：grid
78、图形：pattern
79、导电图形：conductive pattern
80、非导电图形：non-conductive pattern
81、字符：legend
82、标志：mark。